Electrical connection device

Abstract

An electrical connection device includes a mother plate and a daughter plate. The mother plate includes a first plate body having at least one groove and a first electrical contact printed on the first plate body. The daughter plate includes a second plate body and a second electrical contact printed on the second plate body. At least one of the daughter plate and the mother plate includes at least one contour feature integrally formed with at least one of the first plate body and the second plate body. When the second plate body is inserted into at least one groove of the first plate body, the second electrical contact is electrically connected to the first electrical contact, and the daughter plate is positioned within the mother plate through the at least one contour feature.

Description

Technical Field

[0001] This disclosure relates to an electrical connection device, and more specifically to an electrical connection device for transmitting electrical signals. Prior Technology

[0002] To meet the trend towards thinner and lighter electronic products, the assembly mechanisms, components, and electrical connectors must be miniaturized. This leads to assembly difficulties and reliability issues such as poor electrical stability and fixation. In existing technologies, when integrating and / or connecting monolithic modules and components to other components, the large size and weight of the pin connectors make it easy for cracks to form between the hard and soft interfaces during cable insertion and removal, causing signal connection failure. Furthermore, after thermoforming, the pitch of signal conductors may deform, causing line misalignment and making it difficult to align the signal connection pins between different components. Therefore, effectively reducing costs and improving assembly efficiency are important considerations in the development of monolithic technology and are also important issues for those skilled in the art. Summary of the Invention

[0003] This disclosure provides an electrical connection device that can effectively reduce costs and improve assembly efficiency, and has better reliability.

[0004] The electrical connection device disclosed in this embodiment includes a mother plate and a daughter plate. The mother plate includes a first plate body having at least one groove and a first electrical contact printed on the first plate body. The daughter plate includes a second plate body and a second electrical contact printed on the second plate body. At least one of the daughter plate and the mother plate includes at least one contour feature. The at least one contour feature is integrally formed with at least one of the first plate body and the second plate body. When the second plate body is inserted into at least one groove of the first plate body, the second electrical contact is electrically connected to the first electrical contact, and the daughter plate is positioned within the mother plate through the at least one contour feature.

[0005] Based on the above, in the design of the electrical connection device of this disclosed embodiment, at least one of the daughter board and the mother board includes at least one contour feature, and this at least one contour feature is integrally formed with at least one of the first board and the second board, thereby reducing material usage and simplifying processes. Therefore, when the second board is inserted into at least one groove of the first board, the second electrical contact can be electrically connected to the first electrical contact, and the daughter board can be positioned in the mother board through the at least one contour feature, which means that the positioning and wiring connection of the daughter board and the mother board can be completed simultaneously. This makes the electrical connection device disclosed in this invention not only cost-saving and improve assembly efficiency, but also more reliable.

[0006] To make this disclosure clearer and easier to understand, specific embodiments are provided below, along with detailed descriptions in conjunction with the accompanying drawings. Simple Explanation of the Diagram

[0007] Figure 1A is a perspective view of an electrical connection device according to an embodiment of the present disclosure. Figure 1B is a cross-sectional view along line II in Figure 1A. Figures 2A to 2G are side views of contour features of various shapes. Figures 3A to 3G are top views corresponding to the contour features of Figures 2A to 2G, respectively. Figures 4A to 4F are schematic diagrams of contour features with different numbers and arrangements. Figure 5 is a schematic cross-sectional view of an electrical connection device according to another embodiment of the present disclosure. Figure 6 is an exploded perspective view of an electrical connection device according to another embodiment of the present disclosure. Figure 7A is a schematic cross-sectional view of an electrical connection device according to another embodiment of the present disclosure. Figure 7B is a top perspective view of the electrical connection device in Figure 7A. Figure 8A is a top perspective view of an electrical connection device according to another embodiment of the present disclosure. Figure 8B is a cross-sectional schematic diagram of the electrical connection device in Figure 8A. Figure 9A is a top perspective view of an electrical connection device according to another embodiment of the present disclosure. Figure 9B is a cross-sectional schematic diagram of the electrical connection device in Figure 9A. Figure 10 is a schematic cross-sectional view of an electrical connection device according to another embodiment of the present disclosure. Implementation

[0008] Figure 1A is a perspective view of an electrical connection device according to an embodiment of the present disclosure. Figure 1B is a cross-sectional view along line II of Figure 1A. Referring to both Figures 1A and 1B, in this embodiment, the electrical connection device 100a includes a mother plate 110a and a daughter plate 120a. The mother plate 110a includes a first plate body 112a having at least one groove (a groove 115a is schematically shown) and a first electrical contact 114a printed on the first plate body 112a. The daughter plate 120a includes a second plate body 122a and a second electrical contact 124a printed on the second plate body 122a. At least one of the daughter plate 120a and the mother plate 110a includes at least one contour feature, and the at least one contour feature is integrally formed with at least one of the first plate body 112a and the second plate body 122a. Herein, the motherboard 110a includes at least one contour feature (a contour feature 117a is schematically shown), and the contour feature 117a is embossed as a protrusion structure, but is not limited thereto. When the second board 122a is inserted into the groove 115a of the first board 112a, the second electrical contact 124a is electrically connected to the first electrical contact 114a, and the daughter board 120a is positioned in the motherboard 110a through the contour feature 117a, that is, the positioning and wiring connection of the daughter board 120a and the motherboard 110a can be completed simultaneously.

[0009] In detail, the electrical connection device 100a of this embodiment can be applied to various electronic products, such as automotive electronics, consumer electronics, white goods, medical electronics, and information and communication technology (ICT) products for internal connections. In one embodiment, the motherboard 110a may be, for example, a central control panel or a home appliance control board, while the daughterboard 120a may be, for example, a USB or a remote control device, but is not limited thereto. The groove 115a of the motherboard 110a has an upper surface U and a bottom surface B opposite to each other, and a first inner surface S1 and a second inner surface S2 connecting the upper surface U and the bottom surface B and opposite to each other. The protrusion structure 117a is located on the first inner surface S1, while the first electrical contact 114a extends from the upper surface U and is disposed on the second inner surface S2. That is, the protrusion structure 117a and the first electrical contact 114a are located on different sides of the inner surface, but are not limited thereto.

[0010] More specifically, the height by which the bump structure 117a of this embodiment protrudes relative to the first inner surface S1 is d, and the width of the groove 115a is W, then 0 < d < (W / 2). That is to say, the height d of the bump structure 117a needs to be less than 1 / 2 of the width W of the groove 115a, which can provide appropriate pressure to be applied to the daughter board 120a, so that the second electrical contact 124a on the daughter board 120a can surely contact the first electrical contact 114a on the mother board 110a, and thus the electrical connection device 100a of this embodiment can have better electrical reliability. In one embodiment, the width W of the groove 115a is, for example, between 0.1 millimeter (mm) and 10 millimeters. In other words, the contour feature (i.e., the bump structure 117a) located within the groove 115a can provide appropriate lateral force application (i.e., component adhesion force), which can avoid problems such as poor flatness of the electrical contact and unstable signal connection.

[0011] Furthermore, the orthographic projection area of the bump structure 117a on the second inner surface S2 is at least greater than 20% of the contact area between the second electrical contact 124a and the first electrical contact 114a, which can ensure electrical signal transmission. In one embodiment, the thickness t1 of the first electrical contact 114a and the thickness t2 range of the second electrical contact 124a are, for example, between 0.002 millimeter and 0.5 millimeter. In one embodiment, the thickness t of the groove 115a is, for example, 0.1 millimeter to 3 millimeters. In one embodiment, the depth D of the groove 115a (i.e., the distance from the upper surface U to the bottom surface B) is, for example, greater than 3 millimeters. In one embodiment, the width W' of the daughter board 120a is, for example, between 0.1 millimeter and 10 millimeters.

[0012] In addition, the length, width, depth, material thickness of different grooves 115a, the height d of the bump structure 117a, position, shape, quantity, and the thickness of different daughter boards 120a will all affect the lateral force application (i.e., component adhesion force), and will affect different stress distributions generated on the first inner surface S1 and the second inner surface S2 of the groove 115a. Generally speaking, the height d of the bump structure 117a is proportional to the lateral pressure. In a simulation experiment, the bump structure 117a is located at the center of the first inner surface S1 of the groove 115a, and the material of the first plate body 112a is, for example, polycarbonate (PC), and its Young's modulus E = 1.5 GPa. The maximum stress value applied by the bump structure 117a to the daughter board 120a is, for example, less than the yield strength of the material of the mother board 110a (such as 30 MPa), and the average contact force between the second electrical contact 124a and the first electrical contact 114a is, for example, greater than 100 gram-force (gf).

[0013] In one embodiment, the materials of the first electrical contact 114a and the second electrical contact 124a are, for example, metallic materials, such as copper. In one embodiment, the first plate 112a and the second plate 122a may be, for example, flexible printed circuit boards (FPCs) or flexible flat cables (FFCs). In one embodiment, the materials of the first plate 112a and the second plate 122a may be, for example, polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), cyclic olefin polymers (COP), polyolefins (PO), cast polypropylene film (CPP), oriented polypropylene film (OPP), silicone film, thermoplastic polyurethane (TPU), polyurethane, or acrylonitrile-butadiene-styrene copolymer (ABS), but are not limited thereto. In one embodiment, the materials of the first plate 112a and the second plate 122a may be the same or different.

[0014] In the manufacturing process, firstly, a first electrical contact 114a is printed on the substrate of the mother component. Printed electronics is the process of creating patterned material on a thin film layer using printing technology for electronic or electrical applications. Printing technology processes include, but are not limited to, inkjet printing, screen printing, gravure printing, letterpress printing, or aerosol jet printing. Next, contour features (i.e., bump structures 117a) are integrally molded onto the substrate of the mother component through, for example, thermoforming, to form a first plate 112a with grooves 115a and contour features (i.e., bump structures 117a), and a mother board 110a with the first electrical contact 114a printed on the first plate 112a. Similarly, a second electrical contact 124a is printed on the substrate of the daughter component to form a daughter board 120a with a second plate 122a and the second electrical contact 124a printed on the second plate 122a. Next, the daughter board 120a and the mother board 110a are assembled, that is, the second board 122a is inserted into the groove 115a of the first board 112a, so that the second electrical contact 124a is electrically connected to the first electrical contact 114a, and the daughter board 120a is positioned in the mother board 110a through the contour feature 117a. After that, a signal connection test is performed. If the test is normal, it can be produced.

[0015] In short, in the design of the electrical connection device 100a in this embodiment, the motherboard 110a includes a contour feature 117a integrally formed with the first board 112a, which can effectively reduce material usage and streamline processes. Furthermore, when the second board 122a is inserted into the groove 115a of the first board 112a, the second electrical contact 124a can be electrically connected to the first electrical contact 114a, and the daughter board 120a can be positioned within the motherboard 110a through the contour feature 117a, thus simultaneously completing the positioning and wiring connection between the daughter board 120a and the motherboard 110a. Therefore, the electrical connection device 100a of this embodiment not only saves costs and improves assembly efficiency but also offers better reliability.

[0016] It should be noted that this embodiment does not limit the shape, number, and arrangement of the contour features 117a. The following will describe different embodiments.

[0017] Figures 2A to 2G are side views of various contour features with different shapes. Figures 3A to 3G are top views of the contour features corresponding to those in Figures 2A to 2G, respectively. Figures 4A to 4F are schematic diagrams of contour features with different numbers and arrangements.

[0018] Please refer to Figures 2A and 3A simultaneously. In one embodiment, the shape of the contour feature 117b1 may be, for example, a semi-circle when viewed from the side, and the shape of the contour feature 117b1 may be, for example, a rectangle when viewed from the top.

[0019] Please refer to Figures 2B and 3B simultaneously. In one embodiment, the shape of the contour feature 117b2 may be, for example, a triangle when viewed from the side, and the shape of the contour feature 117b2 may be, for example, a rectangle when viewed from the top.

[0020] Please refer to Figures 2C and 3C simultaneously. In one embodiment, the shape of the contour feature 117b3 may be, for example, trapezoidal when viewed from the side, and may be, for example, rectangular when viewed from the top.

[0021] Please refer to Figures 2D and 3D simultaneously. In one embodiment, viewed from the side, the shape of the contour feature 117b4 may be, for example, a right triangle, while viewed from the top, the shape of the contour feature 117b4 may be, for example, a rectangle.

[0022] Please refer to Figures 2E and 3E simultaneously. In one embodiment, the shape of the contour feature 117b5 may be, for example, a semi-circle when viewed from the side, and the shape of the contour feature 117b5 may be, for example, a circle when viewed from the top.

[0023] Please refer to Figures 2F and 3F simultaneously. In one embodiment, the shape of the contour feature 117b6 may be, for example, a triangle when viewed from the side, and a circle when viewed from the top.

[0024] Please refer to Figures 2G and 3G simultaneously. In one embodiment, the shape of the contour feature 117b7 may be, for example, trapezoidal when viewed from the side, and the shape of the contour feature 117b7 may be, for example, circular when viewed from the top.

[0025] Next, referring to Figure 4A, in one embodiment, the contour feature 117c1 is a single rectangle arranged horizontally.

[0026] Please refer to Figure 4B. In one embodiment, the contour feature 117c2 is a single rectangle arranged in a straight line.

[0027] Please refer to Figure 4C. In one embodiment, the contour feature 117c3 consists of three rectangular features arranged at horizontal intervals.

[0028] Please refer to Figure 4D. In one embodiment, the contour feature 117c4 consists of three rectangular features arranged in a straight line.

[0029] Please refer to Figure 4E. In one embodiment, there are nine contour features 117c5, which are circular in shape and arranged in a matrix.

[0030] Please refer to Figure 4F. In one embodiment, there are eight contour features 117c6, which are circular in shape and arranged in a circular pattern.

[0031] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals representing the same or similar components, and descriptions of identical technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.

[0032] Figure 5 is a cross-sectional schematic diagram of an electrical connection device according to another embodiment of the present disclosure. Referring simultaneously to Figures 1B and 5, the electrical connection device 100e of this embodiment is similar to the electrical connection device 100a described above, except that the main difference is that in this embodiment, at least one contour feature includes at least one first contour feature and at least one second contour feature. The mother plate 110e includes at least one first contour feature (two first contour features 117e are schematically shown), while the daughter plate 120e includes at least one second contour feature (two second contour features 127e are schematically shown). One of the first contour feature 117e and the second contour feature 127e is a convex structure, and the other of the first contour feature 117e and the second contour feature 127e is a concave structure.

[0033] Here, the first contour feature 117e is, for example, a raised dot structure, and the second contour feature 127e is, for example, a recessed dot structure, but this is not a limitation. In one embodiment, the two first contour features 117e may have the same or different shapes, and this is not a limitation. In one embodiment, the two second contour features 127e may have the same or different shapes, and this is not a limitation. As long as the two corresponding first contour features 117e and second contour features 127e can be matched in shape, they are all within the scope of protection of this disclosure. When the second plate 122e is inserted into the groove 115e of the first plate 112e, the second electrical contact 124e is electrically connected to the first electrical contact 114e, and the daughter plate 120e is positioned in the mother plate 110e through the matching of the first contour feature 117e and the second contour feature 127e, that is, the positioning and circuit connection of the daughter plate 120e and the mother plate 110e can be completed simultaneously. In other words, by having a concave-convex corresponding structure for the first contour feature 117e and the second contour feature 127e on the mother plate 110e and the daughter plate 120e, the daughter plate 120e can be easily aligned with the mother plate 110e, which can improve the alignment accuracy and is also suitable for rapid repeated insertion and removal operations.

[0034] Figure 6 is an exploded perspective view of an electrical connection device according to another embodiment of the present disclosure. Referring simultaneously to Figures 1A and 6, the electrical connection device 100f of this embodiment is similar to the electrical connection device 100a described above, except that in this embodiment, at least one contour feature includes at least one first contour feature and at least one second contour feature. The mother plate 110f includes at least one first contour feature (schematically shown as a first contour feature 117f), while the daughter plate 120f includes at least one second contour feature (schematically shown as a second contour feature 127f). The first contour feature 117f is a strip-shaped groove, while the second contour feature 127f is a bent structure. Here, the extending direction of the strip-shaped groove 117f is parallel to the insertion direction of the daughter plate 120f. Therefore, when the second plate 122f is inserted into the groove 115f of the first plate 112f, the bent structure 127f can be provided corresponding to the strip-shaped groove 117f.

[0035] In this embodiment, the daughter board 120f can be, for example, a flexible printed circuit board (FPC), a flexible flat cable (FFC), or a monolithic film, wherein the thickness of the daughter board 120f can be, for example, less than 2 mm, and its stiffness is less than 20 g·cm. Since the daughter board 120f in this embodiment has a bending structure 127f integrally formed with the second board body 122f, its rigidity is enhanced, preventing deformation when the daughter board 120f is inserted into the mother board 110f. Furthermore, the mother board 110f has a strip groove 117f integrally formed with the first board body 112f, and this strip groove 117f is provided corresponding to the bending structure 127f, which can effectively increase the alignment accuracy between the daughter board 120f and the mother board 110f.

[0036] Furthermore, the daughter board 120f has a first side S3 and a second side S4 opposite to each other. Preferably, the distance D1 from the bent structure 127f to the first side S3 is 51% to 70% of the width W' of the daughter board 120f. The distance D2 from the bent structure 127f to the second side S4 is 30% to 49% of the width W' of the daughter board 120f. That is, the bent structure 127f is not located in the center of the daughter board 120f, but is asymmetrically designed with respect to the first side S3 and the second side S4. Preferably, when the daughter board 120f is inserted into the mother board 110f, the contact area between the second electrical contact 124f and the first electrical contact (not shown) is at least 50% greater than the total contact area to ensure that the electrical signal is transmitted correctly. In other words, when the daughter board 120f is inserted into the mother board 110f, the overlapping area / contact area between the second electrical contact 124f of the daughter board 120f and the first electrical contact of the mother board 110f must overlap by at least half of its width to ensure electrical conductivity quality. Furthermore, the bent structure 127f can be composed of a single straight strip or multiple strips, without limitation.

[0037] Figure 7A is a cross-sectional schematic diagram of an electrical connection device according to another embodiment of the present disclosure. Figure 7B is a top perspective schematic diagram of the electrical connection device of Figure 7A. Referring simultaneously to Figures 6, 7A, and 7B, the electrical connection device 100g of this embodiment is similar to the electrical connection device 100f described above, except that the main difference is that in this embodiment, the mother plate 110g includes two first contour features 117g1 and one first contour feature 117g2. The first contour feature 117g1 is a protrusion structure 117g1, while the first contour feature 117g2 is a strip groove 117g2. The groove 115g has a first inner surface S5 and a second inner surface S6 opposite to each other. The protrusion structure 117g1 is located on the first inner surface S5, while the strip groove 117g2 extends from the second inner surface S6 inward toward the first inner surface S5. When the second plate 122f is inserted into the groove 115g of the first plate 112g, the bending structure 127f of the second plate 122f is set in accordance with the strip groove 117g2, and the sub-plate 120f is positioned in the mother plate 110g through the cooperation of the protrusion structure 117g1, the strip groove 117g2, and the bending structure 127f.

[0038] Because the groove 115g corresponding to the thin sub-plate 120f is prone to uneven thickness or deformation in different areas during molding due to its large aspect ratio, the mother plate 110g is formed with a strip groove 117g2 in the insertion direction of the sub-plate 120f and a protrusion structure 117g1 on the opposite side of the strip groove 117g2. This effectively provides stable pressure to stabilize the first electrical contact 114g and the second electrical contact 124f.

[0039] Figure 8A is a top perspective view of an electrical connection device according to another embodiment of the present disclosure. Figure 8B is a cross-sectional view of the electrical connection device of Figure 8A. Referring simultaneously to Figures 1B, 8A, and 8B, the electrical connection device 100h of this embodiment is similar to the electrical connection device 100a described above, except that the main difference is that in this embodiment, the mother plate 110h further includes at least one first magnetic attractor (schematically shown as a first magnetic attractor 113h), and the daughter plate 120h further includes at least one second magnetic attractor (schematically shown as a second magnetic attractor 123h). The magnetic pole of one of the first magnetic attractor 113h and the second magnetic attractor 123h is the S pole, and the magnetic pole of the other of the first magnetic attractor 113h and the second magnetic attractor 123h is the N pole. Here, the magnetic pole of the first magnetic attractor 113h is, for example, the S pole, and the magnetic pole of the second magnetic attractor 123h is, for example, the N pole, but this is not a limitation.

[0040] When the second plate 122h is inserted into a groove 115h of the first plate 112h, the second magnetic chuck 123h is magnetically attracted to the first magnetic chuck 113h, the second electrical contact 124h is electrically connected to the first electrical contact 114h, and the sub-plate 120h is positioned within the mother plate 110h through the contour feature 117h (such as a raised dot structure). This means that the positioning and wiring connection of the sub-plate 120h and the mother plate 110h can be completed simultaneously. In other words, the electrical connection device 100h of a single groove 115h, through a set of magnetic attraction mechanism components, can not only increase the self-alignment function during assembly, but also improve the adhesion of the electrical connection device 100h and enhance the reliability testing and shock resistance performance of the mobile device product.

[0041] Figure 9A is a top perspective view of an electrical connection device according to another embodiment of the present disclosure. Figure 9B is a cross-sectional view of the electrical connection device of Figure 9A. Referring simultaneously to Figures 1B, 9A, and 9B, the electrical connection device 100i of this embodiment is similar to the electrical connection device 100a described above, except that the main difference is that in this embodiment, the mother plate 110i has two grooves 115i, and each groove 115i has a contour feature 117i (e.g., a raised dot structure) integrally formed with the first plate body 112i. The mother plate 110i also includes at least one first magnetic attractor (two first magnetic attractors 113i are schematically shown), and the daughter plate 120i also includes at least one second magnetic attractor (two second magnetic attractors 123i are schematically shown). The magnetic pole of one of the first magnetic attractors 113i and the second magnetic attractor 123i is the S pole, and the magnetic pole of the other of the first magnetic attractor 113i and the second magnetic attractor 123i is the N pole. Here, the magnetic poles of the two first magnetic attractors 113i are, for example, S pole and N pole, respectively, and the magnetic poles of the two second magnetic attractors 123i corresponding to the two first magnetic attractors 113i are, for example, N pole and S pole, respectively, but not limited thereto.

[0042] When the second plate 122i is inserted into the two grooves 115i of the first plate 112i, the second magnetic member 123i is magnetically attracted to the first magnetic member 113i, the second electrical contact 124i is electrically connected to the first electrical contact 114i, and the daughter plate 120i is positioned within the mother plate 110i through the contour feature 117i (such as a raised structure). This means that the positioning and wiring connection of the daughter plate 120i and the mother plate 110i can be completed simultaneously. Compared to the prior art, which requires a large amount of manpower for wiring and soldering, the electrical connection device 100i of this embodiment combines assembly error prevention with enhanced adsorption, effectively saving production costs and improving efficiency. Furthermore, the inclusion of magnetic components in the integrally formed mother plate 110i and the device requiring multiple insertions and removals not only strengthens the structural design of the electrical connection device 100i but also improves the reliability of component assembly quality.

[0043] Figure 10 is a cross-sectional schematic diagram of an electrical connection device according to another embodiment of the present disclosure. Referring simultaneously to Figures 9B and 10, the electrical connection device 100j of this embodiment is similar to the electrical connection device 100i described above, except that in this embodiment, the motherboard 110j further includes at least one first thermally conductive contact (schematically shown as one first thermally conductive contact 119j), and the daughterboard 120j further includes at least one second thermally conductive contact (schematically shown as two second thermally conductive contacts 129j). In one embodiment, the material of the first thermally conductive contact 119j and the material of the second thermally conductive contact 129j may be the same as or different from the material of the first electrical contact 114j and the second electrical contact 124j, and this is not limited thereto.

[0044] When the second plate 122j is inserted into the two grooves 115j of the first plate 112j, the second magnetic member 123j is magnetically attracted to the first magnetic member 113j, the second electrical contact 124j is electrically connected to the first electrical contact 114j, and the daughter plate 120j is positioned within the mother plate 110j through the contour feature 117j (such as a convex structure), while the second thermally conductive contact 129j is offset from the first thermally conductive contact 119j. In other words, the electrical connection device 100j of this embodiment, in addition to the connection with electrical contacts, also has thermally conductive contacts, and can be used as a heat sink or heater.

[0045] It should be noted that at least one of the sub-plate and the mother plate includes at least one contour feature, and the at least one contour feature is integrally formed with at least one of the first plate and the second plate. In addition, dissimilar magnetic attracting elements are provided on the sub-plate and the mother plate. The above-mentioned structural configuration can exist alone or be used in combination according to the usage requirements, and there is no limitation thereto.

[0046] In summary, in the design of the electrical connection device disclosed herein, at least one of the daughter board and the mother board includes at least one contour feature, and this at least one contour feature is integrally formed with at least one of the first board and the second board, thereby reducing material usage and simplifying processes. Therefore, when the second board is inserted into at least one groove of the first board, the second electrical contact can be electrically connected to the first electrical contact, and the daughter board can be positioned within the mother board through the at least one contour feature. This means that the positioning and wiring connection of the daughter board and the mother board can be completed simultaneously, making the electrical connection device disclosed herein not only cost-saving and improve assembly efficiency, but also more reliable.

[0047] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0048] 100a, 100e, 100f, 100g, 100h, 100i, 100j: Electrical connection devices 110a, 110e, 110f, 110g, 110h, 110i, 110j: Motherboard 112a, 112e, 112f, 112g, 112h, 112i, 112j: First plate body 113h, 113i, 113j: First magnetic component 114a, 114e, 114g, 114h, 114i, 114j: First electrical contacts 115a, 115e, 115f, 115g, 115h, 115i, 115j: Grooves 117a, 117h, 117i, 117j: Contour features / convex structure 117b1, 117b2, 117b3, 117b4, 117b5, 117b6, 117b7, 117c1, 117c2, 117c3, 117c4, 117c5, 117c6: Contour Features 117e: First contour feature 117f: First contour feature / strip groove 117g1: First contour feature / convex structure 117g2: First contour feature / strip groove 119j: First thermal junction 120a, 120e, 120f, 120h, 120i, 120j: Sub-boards 122a, 122e, 122f, 122h, 122i, 122j: Second plate body 123h, 123i, 123j: Second magnetic components 124a, 124e, 124f, 124h, 124i, 124j: Second electrical contacts 127e: Second contour feature 127f: Second contour feature / bending structure 129j: Second thermal junction B: Bottom surface d: height D: Depth D1, D2: Distance S1, S5: First inner surface S2, S6: Second inner surface S3: First side S4: Second side t, t1, t2: thickness U: Upper surface W, W': Width

Claims

1. An electrical connection device, comprising: A motherboard includes a first plate having at least one groove and a first electrical contact printed on the first plate; The system also includes a sub-board, comprising a second board body and a second electrical contact printed on the second board body. At least one of the sub-board and the mother board includes at least one contour feature, which is integrally formed with at least one of the first board body and the second board body. When the second board body is inserted into at least one groove of the first board body, the second electrical contact is electrically connected to the first electrical contact, and the sub-board is positioned within the mother board through the at least one contour feature. The mother board further includes at least one first thermally conductive contact, and the sub-board further includes at least one second thermally conductive contact. When the second board body is inserted into at least one groove of the first board body, the at least one second thermally conductive contact and the at least one first thermally conductive contact are misaligned.

2. The electrical connection device as claimed in claim 1, wherein the mother plate includes the at least one profile feature, and the at least one profile feature includes a protrusion structure, the at least one groove having an upper surface and a bottom surface opposite to each other and a first inner surface and a second inner surface connecting the upper surface and the bottom surface and opposite to each other, the protrusion structure being located on the first inner surface, and the first electrical contact extending from the upper surface and disposed on the second inner surface.

3. The electrical connection device as claimed in claim 2, wherein the height of the protrusion structure relative to the first inner surface is d, and the width of the at least one groove is W, then 0 < d < (W / 2).

4. The electrical connection device as claimed in claim 3, wherein the thickness of the first electrical contact and the thickness of the second electrical contact are respectively between 0.002 mm and 0.5 mm.

5. The electrical connection device as claimed in claim 2, wherein the projected area of ​​the protrusion structure on the second inner surface is at least 20% greater than the contact area between the second electrical contact and the first electrical contact.

6. The electrical connection device as claimed in claim 2, wherein the maximum stress value applied by the protrusion structure to the daughter plate is less than the yield strength of the material of the mother plate.

7. The electrical connection device as claimed in claim 2, wherein the average contact force between the second electrical contact and the first electrical contact is greater than 100 grams.

8. The electrical connection device as claimed in claim 2, wherein, viewed from the side, the shape of the protrusion structure includes a semi-circle, a triangle, or a trapezoid.

9. The electrical connection device as claimed in claim 2, wherein, viewed from above, the shape of the protrusion structure includes a rectangle or a circle.

10. The electrical connection device as claimed in claim 1, wherein the at least one profile feature comprises a plurality of profile features arranged at intervals, in an array, or in a circular arrangement.

11. The electrical connection device as claimed in claim 1, wherein the at least one profile feature includes at least one first profile feature and at least one second profile feature, the mother plate includes the at least one first profile feature, and the daughter plate includes the at least one second profile feature, wherein one of the at least one first profile feature and the at least one second profile feature is at least one protrusion structure, and the other of the at least one first profile feature and the at least one second profile feature is at least one concave structure.

12. The electrical connection device as claimed in claim 1, wherein the at least one profile feature includes at least one first profile feature and at least one second profile feature, the mother plate includes the at least one first profile feature and the daughter plate includes the at least one second profile feature, the at least one first profile feature includes a strip groove and the at least one second profile feature includes a bending structure, wherein the bending structure is provided corresponding to the strip groove when the second plate is inserted into the at least one groove of the first plate.

13. The electrical connection device as claimed in claim 12, wherein the sub-plate has a first side and a second side opposite to each other, the distance of the bending structure to the first side is 51% to 70% of the width of the sub-plate, and the distance of the bending structure to the second side is 30% to 49% of the width of the sub-plate.

14. The electrical connection device as claimed in claim 1, wherein the at least one profile feature includes at least one first profile feature and at least one second profile feature, the mother plate includes the at least one first profile feature, and the daughter plate includes the at least one second profile feature, the at least one first profile feature includes at least one protrusion structure and a strip groove, the at least one groove has a first inner surface and a second inner surface opposite to each other, the protrusion structure is located on the first inner surface, and the strip groove extends from the second inner surface in a direction concave to the first inner surface, the at least one second profile feature includes a bending structure, the bending structure being disposed corresponding to the strip groove when the second plate is inserted into the at least one groove of the first plate, and the daughter plate is positioned within the mother plate through the at least one protrusion structure.

15. The electrical connection device as claimed in claim 1, wherein the mother plate further includes at least one first magnetic member, and the daughter plate further includes at least one second magnetic member, wherein when the second plate is inserted into the at least one groove of the first plate, the at least one second magnetic member is magnetically attracted to the at least one first magnetic member.

16. The electrical connection device as claimed in claim 15, wherein the magnetic pole of one of the at least one first magnetic member and the at least one second magnetic member is the S pole, and the magnetic pole of the other of the at least one first magnetic member and the at least one second magnetic member is the N pole.

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