Method for manufacturing pixel definition layer

Abstract

The objective of the present invention is to integrate two patterning processes into one so as to implement, on an electrode substrate, a stepped coloring pattern, thereby exhibiting vivid color and increasing display reliability and lifespan. That is, a pixel separation layer and a metal mask support layer are formed at the same time after exposure and development processes so as to reduce processing time and minimize panel damage caused by additional development processes and post-heat-treatment processes, and prevent pixel shrinkage, thereby minimizing a decrease in luminance and lifespan.

Description

Method for manufacturing pixel definition layer

[0001] The present invention relates to a method for manufacturing a pixel definition layer of a light-emitting display device using a photosensitive composition.

[0002] Liquid crystal display devices (LCDs) and organic light-emitting display devices (OLEDs) are widely used in flat panel displays. Among these, OLEDs offer advantages such as low power consumption, fast response times, high color reproducibility, high brightness, and wide viewing angles.

[0003] In the case of the above organic light-emitting display device, a polarizing film is used to block light reflected from the panel when external light is incident, but there is a disadvantage in that the polarizing film is not suitable for application to a flexible device due to its insufficient bending characteristics.

[0004] To address the above issues, methods have been proposed, including color filters, black matrices, and methods for forming an inorganic film on the upper substrate to block light. However, these methods have limitations in achieving the desired level of anti-reflection effect, and no specific method for replacing polarizing films has been proposed.

[0005] Meanwhile, the coloring pattern is being used as red, green, and blue color filters not only in liquid crystal displays but also in organic light-emitting displays.

[0006] In manufacturing the above-mentioned coloring pattern, various types of organic pigments as well as carbon black and inorganic pigments are used as coloring agents, and the pigment dispersion liquid in which these are dispersed is mixed with other compositions to form a pattern, and before the organic light-emitting layer is deposited, a photolithography process is added to support a metal mask for deposition, and then the deposition process is performed.

[0007] Organic light-emitting displays made with these pixels can display more vivid colors. However, the formation of another support layer on top of the coloring pattern increases the process time (Tack time), and the additional coating, exposure, development, and thermal curing processes can cause damage to the panel, resulting in problems such as outgassing, pixel shrinkage, dark spots, and electrode oxidation, which reduce the lifespan and brightness of the organic light-emitting display.

[0008] In order to solve the problems of the above-mentioned prior art, one embodiment of the present invention integrates the process for making two layers into one process to reduce damage to the panel, thereby implementing a coloring pattern with a short process time on an electrode substrate, thereby not only making the color vivid but also increasing the reliability and lifespan of the display.

[0009] That is, by lowering the transmittance of some sections of a negative type photomask that hardens by transmitting light and varying the irradiance, the degree of hardening according to the irradiance after development is different, forming a step in the pattern, and the purpose is to implement two layers in one process.

[0010] Another embodiment provides an organic light-emitting display device including a pixel definition layer manufactured by the above method.

[0011] Another embodiment is to provide an electronic device including the organic light-emitting display device.

[0012] The method for manufacturing a pixel definition layer according to the present invention comprises the steps of applying and coating a photosensitive composition; prebaking; exposure; and development, wherein the photomask transmittance is divided into three sections of 0% (non-exposed area), 20 to 50% (half-tone), and 100% (full-tone), and the development step is performed at a temperature of 19 to 27°C for a time of 30 to 100 seconds, and it is preferable to create one or more layers with one exposure and development process.

[0013] It is preferable that the hot plate temperature of the above prebaking step be 80°C to 150°C.

[0014] It is more preferable that the hot plate temperature of the above prebaking step be 90°C to 120°C.

[0015] It is preferable that the above prebaking step be performed for 60 to 180 seconds.

[0016] It is more preferable that the above pre-bake step is performed for 100 to 150 seconds.

[0017] 70mJ / cm in the above exposure step 2 ~ 140mJ / cm 2 It is desirable to investigate the active line.

[0018] 80 to 110 mJ / cm in the above exposure step 2 It is more desirable to investigate the active line.

[0019] It is preferable that the above phenomenon step be performed for a time of 30 to 90 seconds.

[0020] It is more preferable that the above phenomenon step be performed for a time of 35 to 60 seconds.

[0021] It is preferable that the half-tone thickness after the above development step is 1.25㎛ to 2.20㎛.

[0022] It is preferable that the half-tone thickness of the pattern after the above development step is 1.40 to 2.00 ㎛.

[0023] It is desirable that the thickness of the full-tone after the above development step is 3.20㎛ to 3.42㎛.

[0024] It is preferable that the full-tone thickness of the pattern after the above development step is 3.25 to 3.35 μm.

[0025] In addition, as a method for manufacturing a pixel definition layer, which additionally includes post-exposure and post-heat treatment steps after the above-mentioned developing step, it is preferable that the post-exposure step performs full-surface exposure without a mask.

[0026] 50 to 1,000 mJ / cm in the above post-exposure step 2 It is desirable to investigate the active line.

[0027] 100 to 900 mJ / cm in the above post-exposure step 2 It is more desirable to investigate the active line.

[0028] It is preferable that the temperature in the above post-heat treatment step be 200 to 300°C.

[0029] It is more preferable that the temperature in the above post-heat treatment step be 230 to 270°C.

[0030] It is preferable that the taper angle of the lower pattern after the above post-heat treatment is 10 to 70° and the taper angle of the upper pattern is 5 to 50°.

[0031] It is more preferable that the taper angle of the lower pattern after the above post-heat treatment is 15 to 65° and the taper angle of the upper pattern is 10 to 40°.

[0032] It is preferable that the half-tone thickness of the pattern after the above post-heat treatment step is 1.00 to 1.90 ㎛.

[0033] It is preferable that the half-tone thickness of the pattern after the above post-heat treatment step is 1.20 to 1.80 ㎛.

[0034] It is preferable that the full-tone thickness of the pattern after the above post-heat treatment step is 2.80 to 3.20 ㎛.

[0035] It is preferable that the full-tone thickness of the pattern after the above post-heat treatment step is 2.90 to 3.10 ㎛.

[0036] It is preferable that the above photosensitive composition contains a coloring agent.

[0037] It is preferable that the above coloring agent includes at least one of an inorganic dye, an organic dye, an inorganic pigment, and an organic pigment.

[0038] It is preferable that the above colorant is included in an amount of 1 to 40 wt% based on the total amount of the photosensitive composition.

[0039] It is preferable that the above colorant be pretreated using a dispersant; or a water-soluble inorganic salt and a wetting agent.

[0040] It is preferable that the average particle diameter of the above colorant is 20 nm to 110 nm.

[0041] It is preferable that the above photosensitive composition include a patterning resin including an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0042] It is preferable that the above-mentioned cardo-based binder resin contains a repeating structure represented by the following chemical formula 1.

[0043] <Chemical Formula 1>

[0044]

[0045] In the above chemical formula 1,

[0046] 1) R 1 and R 2 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0047] 2) R 1 and R 2 can form rings between neighboring groups,

[0048] 3) m or n are integers from 0 to 4, independently of each other,

[0049] 4) A1 and A2 are independently of each other the following chemical formula 2 or chemical formula 3,

[0050] <Chemical Formula 2>

[0051]

[0052] <Chemical Formula 3>

[0053]

[0054] In the above chemical formulas 2 and 3,

[0055] 4-1) * indicates the connection part,

[0056] 4-2) R 3 ~ R 6 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30is an alkoxycarbonyl group,

[0057] 4-3) R 3 ~ R 6 can form rings between neighboring groups,

[0058] 4-4) Y 1 and Y 2 are independently of each other the chemical formula 6 or chemical formula 7,

[0059] <Chemical Formula 6>

[0060]

[0061] <Chemical Formula 7>

[0062]

[0063] In the above chemical formulas 6 and 7,

[0064] 4-4-1) * indicates the bonding position,

[0065] 4-4-2) R 9 is hydrogen or methyl,

[0066] 4-4-3) R 10 ~ R 13 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0067] 4-4-4) L 1 ~ L 3 are independently single bonds; fluorenylene group; C2~C 30alkylene; C6~C 30 Arylene of; C2~C 30 Heterocyclic ring of; C1~C 30 Alkoxylene of; C2~C 30 alkyleneoxy; C6~C 30 Aryloxy group of; C2~C 30 is the polyethyleneoxy group,

[0068] 4-4-5) q and r are independent integers from 0 to 3; provided that q+r=3,

[0069] 5) The ratio of A1 and A2 in the polymer chain of the resin containing the repeating unit represented by the chemical formula 1 is 9:1 to 1:9,

[0070] 6) X 1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; or is the following chemical formula 4; or chemical formula 5,

[0071] 6-1) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0072] 6-2) R' and R" can form a ring between adjacent groups,

[0073] <Chemical Formula 4>

[0074]

[0075] <Chemical Formula 5>

[0076]

[0077] In the above chemical formulas 4 and 5,

[0078] 6-3) * indicates the binding position,

[0079] 6-4) R 7 ~ R 8 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0080] 6-5) o and p are integers from 0 to 4, independently of each other.

[0081] 7) X 2 Silver C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 aryloxy group; or a combination thereof,

[0082] 8) The above R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R13 are respectively deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and may be further substituted with one or more substituents selected from the group consisting of arylalkenyl groups, and adjacent substituents may form a ring.

[0083] It is preferable that the weight average molecular weight of the above-mentioned cardo-based resin is 1,000 to 100,000 g / mol.

[0084] It is preferable that the above-mentioned cardo-based resin is included in an amount of 1 to 30 wt% based on the total amount of the photosensitive composition.

[0085] It is preferable that the above photosensitive composition contains 1 to 40 wt% of a reactive unsaturated compound based on the total amount thereof.

[0086] It is preferable that the above photosensitive composition contains a photoinitiator in an amount of 0.01 to 10 wt% based on the total amount.

[0087] As another specific example, it is preferable that the present invention provide a pixel definition layer manufactured according to the above manufacturing method.

[0088] As another specific example, it is preferable that the present invention provide an organic light-emitting display device including the pixel definition layer.

[0089] As another specific example, the present invention preferably provides an electronic device including the display device and a control unit for driving the display device.

[0090] The present invention integrates two patterning processes into one to implement a colored pattern forming a step on an electrode substrate, thereby enhancing not only vivid colors but also display reliability and lifespan. That is, by forming a pixel separation layer and a metal mask support layer simultaneously after exposure and development processes, the process time is shortened, damage to the panel caused by additional development and post-heat treatment processes is minimized, and pixel shrinkage is prevented, thereby minimizing reduction in brightness and lifespan.

[0091] Figures 1 and 2 schematically illustrate cross-sections of pixel definition layers of examples and comparative examples taken using a scanning electron microscope.

[0092] The method for manufacturing a pixel definition layer according to the present invention comprises the steps of applying and coating a photosensitive composition; prebaking; exposure; and development, wherein the photomask transmittance is divided into three sections of 0% (non-exposed area), 20 to 50% (Half-tone), and 100% (Full-tone), and the development step is performed at a temperature of 19 to 27°C for a time of 30 to 100 seconds, and it is preferable to create one or more layers with one exposure and development process.

[0093] The present invention is susceptible to various modifications and takes various forms. Specific embodiments are illustrated in the drawings and described in detail herein. However, this is not intended to limit the present invention to specific disclosed forms, but rather to encompass all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present invention.

[0094] Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. When assigning reference numerals to components in each drawing, identical components may be assigned the same numerals, as much as possible, even if they are shown in different drawings.

[0095] When describing the present invention, detailed descriptions of related known components or functions may be omitted if they are deemed to obscure the gist of the present invention. When "includes," "has," and "consists of" are used in this specification, other parts may be added, unless "only" is used. When a component is expressed in the singular, it may also include plurals, unless otherwise explicitly stated.

[0096] Additionally, terms such as first, second, A, B, (a), (b), etc. may be used to describe components of the present invention. These terms are only intended to distinguish the components from other components, and the nature, order, sequence, or number of the components are not limited by these terms.

[0097] In a description of the positional relationship of components, when it is described that two or more components are "connected," "combined," or "connected," it should be understood that the two or more components may be directly "connected," "combined," or "connected," but that the two or more components may also be further "interposed" with another component to be "connected," "combined," or "connected." Here, the other component may be included in one or more of the two or more components that are "connected," "combined," or "connected" to each other.

[0098] Furthermore, when a component such as a layer, membrane, region, or plate is said to be "on" or "over" another component, it should be understood that this includes not only the case where it is "directly on" the other component, but also the case where there are other components in between. Conversely, when a component is said to be "directly on" another part, it should be understood that there are no other components in between.

[0099] In the description of the temporal flow relationship related to components, operation methods, or manufacturing methods, for example, when the temporal or flow relationship is described as “after”, “following”, “next to”, “before”, etc., it may also include cases where it is not continuous, unless “immediately” or “directly” is used.

[0100] Meanwhile, when numerical values ​​or corresponding information for components are mentioned, even without separate explicit description, the numerical values ​​or corresponding information may be interpreted as including an error range that may occur due to various factors (e.g., process factors, internal or external impact, noise, etc.).

[0101] The terms used in this specification and the appended claims have the following meanings, unless otherwise stated, without departing from the spirit of the present invention.

[0102] The term “halo” or “halogen” as used in this application includes fluorine (F), chlorine (Cl), bromine (Br), and iodine (I) unless otherwise stated.

[0103] The term "alkyl" or "alkyl group" as used in this application, unless otherwise stated, means a radical of a saturated aliphatic functional group having 1 to 30 carbon atoms connected by a single bond, including a straight-chain alkyl group, a branched-chain alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, and a cycloalkyl-substituted alkyl group.

[0104] The term “haloalkyl group” or “halogenalkyl group” as used in this application means an alkyl group substituted with a halogen, unless otherwise stated.

[0105] The term "alkenyl" or "alkynyl" as used in this application, unless otherwise stated, refers to a group having a double bond or a triple bond, including a straight or branched chain group, and having 2 to 30 carbon atoms, but is not limited thereto.

[0106] The term "cycloalkyl" as used in this application means, but is not limited to, an alkyl group forming a ring having 3 to 30 carbon atoms, unless otherwise stated.

[0107] The term “alkoxy group” or “alkyloxy group” used in this application means an alkyl group to which an oxygen radical is bonded, and unless otherwise stated, has 1 to 30 carbon atoms, but is not limited thereto.

[0108] The term “alkenoxyl group,” “alkenoxy group,” “alkenyloxy group,” or “alkenyloxy group” used in this application means an alkenyl group having an oxygen radical attached thereto, and unless otherwise stated, has, but is not limited to, 2 to 30 carbon atoms.

[0109] The terms "aryl group" and "arylene group" used in this application, unless otherwise stated, each have 6 to 30 carbon atoms, but are not limited thereto. The aryl group or arylene group in this application includes a single ring, a ring aggregate, a fused multiple ring compound, etc. For example, the aryl group may include a phenyl group, a monovalent functional group of biphenyl, a monovalent functional group of naphthalene, a fluorenyl group, a substituted fluorenyl group, and the arylene group may include a fluorenylene group, a substituted fluorenylene group.

[0110] The term "ring assemblies" as used herein means two or more ring systems (single ring or fused ring systems) directly connected to each other via single or double bonds, wherein the number of such direct links between rings is one less than the total number of ring systems in the compound. Ring assemblies may be formed by the same or different ring systems being directly connected to each other via single or double bonds.

[0111] In the present application, since the aryl group includes a ring aggregate, the aryl group includes biphenyl and terphenyl in which a single aromatic ring, a benzene ring, is connected by a single bond. In addition, the aryl group also includes a compound in which an aromatic single ring and an aromatic ring system fused together are connected by a single bond, and thus, for example, the aryl group also includes a compound in which an aromatic single ring, a benzene ring, and an aromatic ring system fused together, a fluorene ring, are connected by a single bond.

[0112] The term "fused multiple ring system" as used in this application means a fused ring structure sharing at least two atoms, and includes a structure in which two or more hydrocarbon ring systems are fused, and a structure in which at least one heterocyclic system containing at least one heteroatom is fused, etc. Such fused multiple ring systems may be aromatic rings, heteroaromatic rings, aliphatic rings, or a combination of these rings. For example, in the case of an aryl group, it may be a naphthalenyl group, a phenanthrenyl group, a fluorenyl group, etc., but is not limited thereto.

[0113] The term "spiro compound" used in this application has a "spiro union," which means a connection formed by two rings sharing only one atom. In this case, the atom shared between the two rings is called a "spiro atom," and depending on the number of spiro atoms contained in a compound, these are called "monospiro-," "dicepiro-," and "trispiro-" compounds, respectively.

[0114] As used herein, the terms "fluorenyl group", "fluorenylene group", and "fluorenetriyl group" mean, unless otherwise stated, a monovalent, divalent, or trivalent functional group in which R, R', R", and R'" in the following structures are all hydrogen, and a "substituted fluorenyl group", a "substituted fluorenylene group", or a "substituted fluorenetriyl group" means that at least one of the substituents R, R', R", and R'" is a substituent other than hydrogen, and includes a case where R and R' are bonded to each other to form a spiro compound together with the carbon to which they are bonded. In the present specification, regardless of the valence such as monovalent, divalent, or trivalent, a fluorenyl group, a fluorenylene group, and a fluorenetriyl group may all be referred to as a fluorene group.

[0115]

[0116] In addition, the R, R', R" and R'" can each independently be an alkyl group having 1 to 30 carbon atoms, an alkenyl group having 2 to 30 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a heterocyclic group having 2 to 30 carbon atoms, for example, the aryl group can be phenyl, biphenyl, naphthalene, anthracene or phenanthrene, and the heterocyclic group can be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidine, pyridazine, pyrazine, triazine, indole, benzofuran, quinazoline or quinoxaline. For example, the substituted fluorenyl group and fluorenylene group may be a monovalent functional group or a divalent functional group of 9,9-dimethylfluorene, 9,9-diphenylfluorene, and 9,9'-spirobi[9H-fluorene], respectively.

[0117] The term "heterocyclic group" used in this application includes not only aromatic rings such as "heteroaryl group" or "heteroarylene group" but also non-aromatic rings, and unless otherwise stated means a ring having 2 to 60 carbon atoms each containing one or more heteroatoms, but is not limited thereto. The term "heteroatom" used in this application represents N, O, S, P or Si unless otherwise stated, and the heterocyclic group means a monocyclic ring, ring aggregate, fused multiple ring system, spiro compound, etc. containing a heteroatom.

[0118] For example, “heterocyclic group” may also include compounds that contain heteroatom groups such as SO2, P=O, etc. instead of ring-forming carbon, such as the compounds below.

[0119]

[0120] The term "ring" as used in this application includes monocyclic and polycyclic rings, and includes hydrocarbon rings as well as heterocyclic rings containing at least one heteroatom, and includes aromatic and non-aromatic rings.

[0121] The term "polycyclic" as used in this application includes ring assemblies such as biphenyls, terphenyls, etc., fused multiple ring systems and spiro compounds, including aromatic as well as non-aromatic, and including hydrocarbon rings as well as heterocycles containing at least one heteroatom.

[0122] The term "aliphatic ring" used in this application refers to a cyclic hydrocarbon other than an aromatic hydrocarbon, and includes a single ring, a ring aggregate, a fused multiple ring system, a spiro compound, etc., and unless otherwise specified, refers to a ring having 3 to 30 carbon atoms, but is not limited thereto. For example, even if an aromatic ring, benzene, and a non-aromatic ring, cyclohexane, are fused, it is considered an aliphatic ring.

[0123] Also, when prefixes are named consecutively, it means that the substituents are listed in the order they were first written. For example, in the case of an arylalkoxy group, it means an alkoxy group substituted with an aryl group, in the case of an alkoxycarbonyl group, it means a carbonyl group substituted with an alkoxy group, and in the case of an arylcarbonylalkenyl group, it means an alkenyl group substituted with an arylcarbonyl group, where the arylcarbonyl group is a carbonyl group substituted with an aryl group.

[0124] Also, unless explicitly stated otherwise, the term "substituted" in the term "substituted or unsubstituted" used in this application means deuterium, halogen, amino group, nitrile group, nitro group, C1~C 30 Alkyl group of C1~C 30 Alkoxy group, C1~C 30 Alkylamine group of C1~C 30 Alkylthiophene group, C6~C 30 Arylthiophene group, C2~C 30 Alkenyl group, C2~C 30 Alkyne group, C3~C 30 Cycloalkyl group, C6~C 30 Aryl group of C6~C substituted with deuterium 30 Aryl group of C8~C30 C2~C containing at least one heteroatom selected from the group consisting of arylalkenyl group, silane group, boron group, germanium group, and O, N, S, Si and P 30 It means that it is substituted with one or more substituents selected from the group consisting of heterocyclic groups, but is not limited to these substituents.

[0125] In this application, the 'functional group name' corresponding to the aryl group, arylene group, heterocyclic group, etc., which are exemplified as examples of each symbol and its substituent, may be described as the 'name of the functional group reflecting the valence', but may also be described as the 'name of the parent compound'. For example, in the case of 'phenanthrene', which is a type of aryl group, the name of the group may be described by distinguishing the valence, such as 'phenanthryl (group)' for the monovalent 'group' and 'phenantrylene (group)' for the divalent group, but the name of the parent compound, 'phenanthrene', may also be described regardless of the valence.

[0126] Similarly, in the case of pyrimidine, regardless of the valence, it can be written as 'pyrimidine', or in the case of monovalent, it can be written as pyrimidinyl (group), in the case of divalent, it can be written as the 'group name' of the corresponding valence, such as pyrimidinylene (group). Accordingly, in the present application, when the type of substituent is written as the name of the parent compound, it can mean an n-valent 'group' formed by the elimination of a hydrogen atom bonded to a carbon atom and / or heteroatom of the parent compound.

[0127] In addition, in this specification, numbers or alphabets indicating positions may be omitted when describing compound names or substituent names. For example, pyrido[4,3-d]pyrimidine may be described as pyridopyrimidine, benzofuro[2,3-d]pyrimidine as benzofuropyrimidine, 9,9-dimethyl-9H-fluorene as dimethylfluorene, etc. Accordingly, both benzo[g]quinoxaline and benzo[f]quinoxaline may be described as benzoquinoxaline.

[0128] Additionally, unless explicitly stated otherwise, the chemical formulas used in this application are applied in the same manner as the substituent definitions by the index definitions of the chemical formulas below.

[0129]

[0130] Here, if a is an integer of 0, the substituent R 1 means that it is absent, that is, when a is 0, it means that all the carbons forming the benzene ring are bonded with hydrogen, and in this case, the indication of hydrogen bonded to carbon can be omitted and the chemical formula or compound can be described. In addition, when a is an integer of 1, one substituent R 1 It binds to one of the carbons forming the benzene ring, and when a is an integer of 2 or 3, it can bind as follows, for example, and when a is an integer of 4 to 6, it binds to the carbon of the benzene ring in a similar manner, and when a is an integer of 2 or more, R 1 may be the same or different.

[0131]

[0132] Unless otherwise stated in this application, forming a ring means that adjacent groups are bonded to each other to form a single ring or a fused multiple ring, and the single ring and the formed fused multiple ring include a hydrocarbon ring as well as a heterocycle containing at least one heteroatom, and may include aromatic and non-aromatic rings.

[0133] Additionally, unless otherwise stated herein, when indicating a condensed ring, the number in the expression "number-condensed ring" indicates the number of condensed rings. For example, a form in which three rings are condensed together, such as anthracene, phenanthrene, and benzoquinazoline, can be expressed as a 3-condensed ring.

[0134] Meanwhile, the term "bridged bicyclic compound" used in this application, unless otherwise specified, refers to a compound in which two rings share three or more atoms to form a ring. The shared atoms may include carbon or heteroatoms.

[0135] In the present application, the organic electric element may mean a component(s) between an anode and a cathode, or may mean an organic light-emitting diode including an anode and a cathode and a component(s) positioned therebetween.

[0136] In addition, in some cases, the display device in the present application may mean an organic electroluminescent element, an organic light-emitting diode, and a panel including the same, or may mean an electronic device including a panel and a circuit. Here, for example, the electronic device may include a lighting device, a solar cell, a portable or mobile terminal (e.g., a smart phone, a tablet, a PDA, an electronic dictionary, a PMP, etc.), a navigation terminal, a game machine, various TVs, various computer monitors, etc., and is not limited thereto, and may be any type of device as long as it includes the above-mentioned component(s).

[0137] Hereinafter, embodiments of the present invention will be described in detail. However, these are presented as examples and are not intended to limit the present invention. The present invention is defined solely by the scope of the claims set forth below.

[0138] A composition comprising a colorant according to one embodiment of the present invention can be used to manufacture a red pattern, a green pattern, a blue pattern, or a black matrix, a pixel definition layer (PDL).

[0139] A black pixel definition layer (PDL) according to one embodiment of the present invention may further include an organic black pigment or black dye as an additional coloring agent other than the coloring agent included in the aforementioned coloring agent. For example, an organic pigment may be used alone, or an organic pigment and a coloring pigment may be mixed and used. In this case, since a coloring pigment with insufficient light-blocking properties is mixed, there is an advantage in that the strength of the film (layer) or the adhesion to the substrate is not reduced even if the amount of the coloring agent is relatively increased. A negative pixel definition layer (PDL) according to one embodiment of the present invention may include a black pigment or black dye as an additional coloring agent instead of the coloring agent included in the aforementioned coloring agent.

[0140] Each component is described in detail below.

[0141] 1. The manufacturing process of the negative pixel definition layer is as follows.

[0142] (1) Application and coating stage

[0143] The photosensitive composition is a low-viscosity liquid sample, and a spin coater or slit coater is used to coat the substrate to a certain thickness after application. The spin coater has the advantage of reducing the thickness as the rotation speed increases, but the flatness deviation in the area is reduced, and a slit coater is preferable to a spin coater for coating a large-area substrate. The solvent remaining after coating causes the surface to be fluid, which has the disadvantage of deteriorating flatness. To overcome this, VCD (vacuum chamber dry) is used to remove some of the solvent, thereby reducing the fluidity on the surface.

[0144] (2) Prebaking stage

[0145] This process involves heating the coated substrate at a specified temperature and time using a hot plate or oven to remove some of the solvent contained in the coating film. If the surface or deep portion of the coating film does not dry, photomask contamination may occur during exposure in the next process, and curing may not occur properly in the exposed area when exposed to UV light. Due to this lack of curing, the pattern is not formed and is removed during the development process.

[0146] (3) Exposure stage

[0147] After the above pre-baking process is completed, this is the process of curing the formed film by irradiating the photomask with an active line (ultraviolet rays) on which a pattern has been formed. The types of lamps that generate the active line include LED lamps and metal (mercury) lamps, and the wavelengths include g-line (436 nm), h-line (405 nm), i-line (365 nm), and deep UV (<260 nm), and they can be used individually or in combination.

[0148] (4) Phenomenon stage

[0149] In the above exposure step, when the active line is irradiated, the exposed part and the non-exposed part are divided by the photomask. In the case of the positive type, the exposed part is dissolved by the developer, and the non-exposed part resists the developer and a pattern remains. In the case of the negative type, the exposed part is hardened and has resistance to the developer, and the non-exposed part is developed. The black pixel definition layer (Black PDL) manufactured with the composition including the coloring agent of the present invention is divided into an exposed part (hardened) and a non-exposed part (developed) in the negative type, and a pattern is formed.

[0150] (5) Post-exposure stage

[0151] After the above development process is completed, the substrate on which the pattern has been formed is irradiated with an activation line (ultraviolet light) once more to further harden the formed film. The types of lamps that generate activation lines include LED lamps and metal (mercury) lamps, and the wavelengths include g-line (436 nm), h-line (405 nm), i-line (365 nm), and deep UV (<260 nm), and they can be used individually or in combination.

[0152] (6) Post-heat treatment stage

[0153] This process involves heating the substrate to a high temperature of 200 to 300°C to remove any remaining solvent and fumes. Failure to completely remove the solvent and fumes during this process will result in outgassing during the post-heat treatment process, which will affect the device and result in dark spots or pixel shrinkage.

[0154] 2. The composition forming the negative pixel definition layer including the coloring agent is as follows.

[0155] (1) Resin for patterning

[0156] The patterning resin according to one embodiment of the present invention may include an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0157] The above acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin containing one or more acrylic repeating units.

[0158] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing at least one carboxyl group, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof. The first ethylenically unsaturated monomer may be included in an amount of 5 wt% to 50 wt%, for example, 10 wt% to 40 wt%, based on the total amount of the acrylic binder resin.

[0159] The second ethylenically unsaturated monomer is an aromatic vinyl compound such as styrene, α-methylstyrene, vinyltoluene, vinylbenzylmethylether, etc.; an unsaturated carboxylic acid ester compound such as methyl(meth)acrylate, ethyl(meth)acrylate, butyl(meth)acrylate, 2-hydroxyethyl(meth)acrylate, 2-hydroxybutyl(meth)acrylate, benzyl(meth)acrylate, cyclohexyl(meth)acrylate, phenyl(meth)acrylate, etc.; an unsaturated carboxylic acid aminoalkyl ester compound such as 2-aminoethyl(meth)acrylate, 2-dimethylaminoethyl(meth)acrylate, etc.; a carboxylic acid vinyl ester compound such as vinyl acetate, etc.; an unsaturated carboxylic acid glycidyl ester compound such as glycidyl(meth)acrylate, etc. Examples include cyanide vinyl compounds such as (meth)acrylonitrile; unsaturated amide compounds such as (meth)acrylamide; etc., and these may be used alone or in combination of two or more.

[0160] Specific examples of the acrylic binder resin include, but are not limited to, (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc. These may be used alone or in combination of two or more. The weight average molecular weight of the acrylic binder resin may be 3,000 g / mol to 150,000 g / mol, for example, 5,000 g / mol to 50,000 g / mol, for example, 20,000 g / mol to 30,000 g / mol.

[0161] The cardo resin contains a repeating structure as shown in the following chemical formula 1.

[0162] <Chemical Formula 1>

[0163]

[0164] In the above chemical formula 1,

[0165] 1) R 1 and R 2 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 is an alkoxycarbonyl group,

[0166] 2) R 1 and R 2 can form rings between neighboring groups,

[0167] 3) m or n are integers from 0 to 4, independently of each other,

[0168] 4) A1 and A2 are independently of each other the following chemical formula 2 or chemical formula 3,

[0169] <Chemical Formula 2>

[0170]

[0171] <Chemical Formula 3>

[0172]

[0173] In the above chemical formulas 2 and 3,

[0174] 4-1) * indicates the connection part,

[0175] 4-2) R 3 ~ R 6 are independently hydrogen; deuterium; halogen; C6~C 30Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0176] 4-3) R 3 ~ R 6 can form rings between neighboring groups,

[0177] 4-4) Y 1 and Y 2 are independently of each other the chemical formula 6 or chemical formula 7,

[0178] <Chemical Formula 6>

[0179]

[0180] <Chemical Formula 7>

[0181]

[0182] In the above chemical formulas 6 and 7,

[0183] 4-4-1) * indicates the bonding position,

[0184] 4-4-2) R 9 is hydrogen or methyl,

[0185] 4-4-3) R 10 ~ R 13 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0186] 4-4-4) L 1 ~ L 3 are independently single bonds; fluorenylene group; C2~C 30 alkylene; C6~C 30 Arylene of; C2~C 30 Heterocyclic ring of; C1~C 30 Alkoxylene of; C2~C 30 alkyleneoxy; C6~C 30 Aryloxy group of; C2~C 30 is the polyethyleneoxy group,

[0187] 4-4-5) q and r are independent integers from 0 to 3; provided that q+r=3,

[0188] 5) The ratio of A1 and A2 in the polymer chain of the resin containing the repeating unit represented by the chemical formula 1 is 9:1 to 1:9,

[0189] 6) X 1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; or is the following chemical formula 4; or chemical formula 5,

[0190] 6-1) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0191] 6-2) R' and R" can form a ring between adjacent groups,

[0192] <Chemical Formula 4>

[0193]

[0194] <Chemical Formula 5>

[0195]

[0196] In the above chemical formulas 4 and 5,

[0197] 6-3) * indicates the binding position,

[0198] 6-4) R 7 ~ R 8 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0199] 6-5) o and p are integers from 0 to 4, independently of each other.

[0200] 7) X 2 Silver C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 aryloxy group; or a combination thereof,

[0201] 8) The above R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 are respectively deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and may be further substituted with one or more substituents selected from the group consisting of arylalkenyl groups, and adjacent substituents may form a ring.

[0202] Above R', R", X 2 , L 1 ~L 3 , R 1 ~ R 8 and R 10 ~R 13If it is an aryl group, preferably C6~C 30 Aryl group of, more preferably C6~C 18 The aryl group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, etc.

[0203] Above R', R", X 2 , L 1 ~L 3 , R 1 ~ R 8 and R 10 ~R 13 In this case, it is preferably C2~C 30 A heterocyclic group, more preferably C2~C 18 The heterocyclic group may be, for example, dibenzofuran, dibenzothiophene, naphthobenzothiophene, naphthobenzofuran, etc.

[0204] The above R', R", R 1 ~ R 8 and R 10 ~R 13 When it is a fluorenyl group, it may preferably be 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl, 9,9'-spirobifluorene, etc.

[0205] Above L 1 ~ L 3 If it is an arylene group, preferably C6~C 30 Arylene group, more preferably C6~C 18 It may be an arylene group, such as phenyl, biphenyl, naphthyl, terphenyl, etc.

[0206] Above R', R", X 2 , R 1 ~ R 8 and R 10 ~R 13 If it is an alkyl group, C1~C 30 Alkyl group or C1~C 20 An alkyl group of or preferably C1~C 10 It can be an alkyl group, for example, methyl, t-butyl, etc.

[0207] Above R', R", X 2 , R 1 ~ R 8 and R 10 ~R 13 If it is an alkoxyl group, preferably C1~C 20 Alkoxyl group of, more preferably C1~C 10 It may be an alkoxyl group, such as methoxy, t-butoxy, etc.

[0208] Above R', R", X 2 , L 1 ~L 3 , R 1 ~ R 8 and R 10 ~R 13 The ring formed by the bonding of adjacent groups is C6~C 60 Aromatic ring group; Fluorenyl group; C2~C containing at least one heteroatom among O, N, S, Si and P 60 Heterocyclic group of; or C3~C 60 It may be an aliphatic ring group, for example, when adjacent groups are bonded to each other to form an aromatic ring, preferably C6~C 20 An aromatic ring, more preferably C6~C 14 It can form aromatic rings such as benzene, naphthalene, phenanthrene, etc.

[0209] The above cardo resin may be, for example, a fluorene-containing compound such as 9,9-bis(4-oxiranylmethoxyphenyl)fluorene; anhydride compounds such as benzenetetracarboxylic acid dianhydride, naphthalenetetracarboxylic acid dianhydride, biphenyltetracarboxylic acid dianhydride, benzophenonetetracarboxylic acid dianhydride, pyromellitic dianhydride, cyclobutanetetracarboxylic acid dianhydride, perylenetetracarboxylic acid dianhydride, tetrahydrofurantetracarboxylic acid dianhydride, and tetrahydrophthalic acid anhydride; a glycol compound such as ethylene glycol, propylene glycol, and polyethylene glycol; an alcohol compound such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; a solvent compound such as propylene glycol methyl ethyl acetate, and N-methylpyrrolidone; a phosphorus compound such as triphenylphosphine; And it can be prepared by mixing two or more of amine or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylamine, triethylamine, tributylamine, and benzyltriethylammonium chloride.

[0210] The weight average molecular weight of the above-mentioned cardo resin may be 1,000 to 100,000 g / mol, preferably 1,000 to 50,000 g / mol, and more preferably 1,000 to 30,000 g / mol. When the weight average molecular weight of the above-mentioned resin is within the above range, a pattern is formed well without residue when producing a light-shielding layer, and there is no loss of film thickness during development, and a good pattern can be obtained.

[0211] The above resin may be included in an amount of 1 to 30 wt%, more preferably 3 to 20 wt%, based on the total amount of the photosensitive resin composition. When the above resin is included within the above range, excellent sensitivity, developability, and adhesiveness (adhesion) can be obtained.

[0212] The photosensitive resin composition may further include an acrylic resin in addition to the resin. The acrylic resin may be a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and may be a resin including one or more acrylic repeating units.

[0213] The above acrylic resin may be a copolymer containing at least one repeating unit of the following chemical formulas 24 to 26.

[0214] [Chemical Formula 24]

[0215]

[0216] In chemical formula 24, R 19 can be a hydrogen atom, a deuterium atom or a methyl group, and R 20 is a hydrogen atom, substituted or unsubstituted C1 to C 30 Alkyl group, substituted or unsubstituted ring-forming aryl group having 6 to 30 carbon atoms, substituted or unsubstituted ring-forming C3 to C 30 of It may be a cycloalkyl group, a substituted or unsubstituted bis or tricycloalkyl group having 7 to 30 ring-forming carbon atoms, or a substituted or unsubstituted bis or tricycloaryl group having 7 to 30 ring-forming carbon atoms. In one embodiment, when the acrylic resin contains two or more repeating units of chemical formula 7, at least one R 20 may be hydrogen.

[0217] [Chemical Formula 25]

[0218]

[0219] In chemical formula 25, R 21 Silver C1 to C 30 A substituted or unsubstituted alkyl group, a substituted or unsubstituted ring forming C6 to C 30 Aryl group of, or substituted or unsubstituted ring-forming C6 to C 30 It may be a cycloalkyl group.

[0220] [Chemical Formula 26]

[0221]

[0222] In chemical formula 26, R 22 may be a methyl group, a sulfonic acid group, a nitro group, a substituted or unsubstituted amino group, or a hydroxy group, and q may be an integer from 0 to 5.

[0223] The weight average molecular weight of the above acrylic resin is 3,000 to 50,000 g / mol, for example, 5,000 to 30,000 g / mol, and specifically, 7,000 to 20,000 g / mol. When the weight average molecular weight of the above acrylic resin is within the above range, a pattern can be formed well without tearing or residue during the manufacture of a pixel defining layer (PDL).

[0224] In one embodiment, the acrylic resin may be included in an amount ranging from 0 to 10 wt% based on the total weight of the photosensitive resin composition. In the present invention, by adjusting the amount of the acrylic resin to the above range, the development speed and taper angle can be controlled.

[0225] The above polyimide binder is configured to control solubility by copolymerizing polyimide, which is the main structure of the polymer, to prevent over-dissolution of polyamide acid, which is a polyimide precursor, in an alkaline aqueous solution, thereby obtaining an appropriate difference in solubility between the exposed and non-exposed areas during a patterning process, thereby enabling the implementation of a black pixel barrier layer with excellent heat resistance and pattern formation properties.

[0226] For example, the polyamic acid-polyimide copolymer includes a polyamic acid repeating unit and a polyimide repeating unit, and the polyamic acid repeating unit and the polyimide repeating unit can be included in a molar ratio of 5:5 to 9:1, for example, a molar ratio of 2:8 to 8:2. When the polyamic acid repeating unit and the polyimide repeating unit are included in a molar ratio within the above range, solubility in a solvent used in the composition can be secured, and suitable developability can be exhibited in a patterning process. The polyimide-polyamic acid copolymer that can be used has a structure as shown in Chemical Formula 27 below.

[0227] [Chemical Formula 27]

[0228]

[0229] Hereinafter, the chemical formula 27 is described.

[0230] X2 to X4 are each independently selected from the group consisting of a substituted or unsubstituted tetravalent alicyclic organic group; and a substituted or unsubstituted tetravalent aromatic organic group;

[0231] L3 to L6 are each independently a single bond; substituted or unsubstituted C1-C 10 alkylene group; substituted or unsubstituted C3-C 10 Cycloalkylene group; and substituted or unsubstituted C6-C 20 Arylene group; is selected from the group consisting of;

[0232] R 15 and R 16 are each independently selected from the group consisting of hydrogen; and a substituted or unsubstituted norbornene group.

[0233] o and p are, each independently, integers from 1 to 10,000.

[0234] In the case of the above aryl group, C6~C 30 Aryl group of, more preferably C6~C 18 The aryl group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, etc.

[0235] In the case of the above heterocyclic group, C2~C 30 A heterocyclic group, more preferably C2~C 20 The heterocyclic group may be, for example, dibenzofuran, dibenzothiophene, naphthobenzothiophene, naphthobenzofuran, etc.

[0236] In the case of the above fluorenyl group, it may preferably be 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl, 9,9'-spirobifluorene, etc.

[0237] In the case of the above arylene group, preferably C6~C 30 Arylene group, more preferably C6~C 18 It may be an arylene group, such as phenylene, biphenylene, naphthylene, terphenylene, phenanthrylene, etc.

[0238] In the case of the above alkyl group, C1~C 30 Alkyl group or C1~C 20 An alkyl group of or preferably C1~C 10 It can be an alkyl group, for example, methyl, t-butyl, etc.

[0239] In the case of the above alkenyl group, C2~C 30 Alkenyl group, preferably C2~C 20 It can be an alkenyl group, and examples thereof include an ethenyl group, a propenyl group, a butenyl group, and a pentenyl group.

[0240] In the case of the above alkoxyl group, C1~C 30 an alkoxy group or preferably C1~C 20 Alkoxyl group of, more preferably C1~C 10 It may be an alkoxyl group, such as methoxy, t-butoxy, etc.

[0241] The ring formed by the above-mentioned adjacent groups bonding to each other is C6~C 60 Aromatic ring group; Fluorenyl group; C2~C containing at least one heteroatom among O, N, S, Si and P 60Heterocyclic group of; or C3~C 60 It may be an aliphatic ring group, for example, when adjacent groups are bonded to each other to form an aromatic ring, preferably C6~C 20 An aromatic ring, more preferably C6~C 14 It can form aromatic rings such as benzene, naphthalene, phenanthrene, etc.

[0242] In one embodiment, the alkali-soluble resin may comprise a cardo-based resin, an acrylic resin, a polyester-based resin, a polyurethane-based resin, a polysiloxane resin, a polycyclic side chain-containing resin, or an acid-modified epoxy resin, alone or in combination of two or more resins selected from among these.

[0243] (2) Reactive unsaturated compounds

[0244] The reactive unsaturated compound, which is essential for the negative pattern, has an ethylenically unsaturated double bond, and thus can sufficiently polymerize upon exposure to light in the pattern formation process, thereby forming a pattern with excellent heat resistance, light resistance, and chemical resistance.

[0245] Specific examples of the above reactive unsaturated compounds include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxyacrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, tripentaerythritol octaacrylate, and the like.

[0246] Examples of commercially available products of the above reactive unsaturated compounds are as follows.

[0247] Examples of the bifunctional ester of the above (meth)acrylic acid include Aronix M-210, M-240, M-6200, etc. from Toagosei Chemical Industry Co., Ltd.; KAYARAD HDDA, HX-220, R-604, etc. from Nihon Kayaku Industry Co., Ltd.; and V-260, V-312, V-335 HP, etc. from Osaka Yuki Chemical Industry Co., Ltd.

[0248] Examples of the trifunctional ester of the above (meth)acrylic acid include Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc. from Toagosei Chemical Industry Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120, etc. from Nihon Kayaku Industry Co., Ltd.; and V-295, V-300, V-360, etc. from Osaka Yuki Kayaku Industry Co., Ltd.

[0249] The above products can be used alone or in combination of two or more.

[0250] The above reactive unsaturated compound may be used after being treated with an acid anhydride to provide better developability. The reactive unsaturated compound may be included in an amount of 1 to 40 wt%, for example, 1 to 20 wt%, based on the total amount of the photosensitive resin composition. When the reactive unsaturated compound is included within the above range, sufficient curing occurs upon exposure in the pattern forming process, resulting in excellent reliability. The pattern has excellent heat resistance, light resistance, and chemical resistance, and also excellent resolution and adhesion.

[0251] (3) Photoinitiator

[0252] In order to implement a negative pattern using photolithography, a photoradical initiator must be used. The photoinitiator has a molar absorption coefficient of 10,000 (L / mol·cm) or more in the range of 330 to 380 nm, and a 5 wt% weight loss occurs at 270°C or less. Here, the molar absorption coefficient can be calculated by the Beer-Lambert Law. In addition, the weight loss was measured using a TGA in a nitrogen atmosphere while heating at a rate of 5°C / min up to 300°C.

[0253] The above photopolymerization initiator is an initiator generally used in a photosensitive resin composition, and examples thereof include acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, and triazine-based compounds.

[0254] Examples of the above acetophenone compounds include 2,2'-diethoxy acetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloro acetophenone, pt-butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.

[0255] Examples of the above benzophenone compounds include benzophenone, benzoyl benzoate, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

[0256] Examples of the above thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2-chlorothioxanthone, etc.

[0257] Examples of the above benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyldimethyl ketal, etc.

[0258] Examples of the above triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, Examples include 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-s(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperonyl)-6-triazine, and 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine.

[0259] In addition to the above compound, the above photoinitiator may also include a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a biimidazole compound, etc.

[0260] The above photoinitiator may be a radical polymerization initiator, such as a peroxide-based compound or an azobis-based compound.

[0261] Examples of the above peroxide compounds include ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide, and acetylacetone peroxide; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, and bis-3,5,5-trimethylhexanoyl peroxide; hydroperoxides such as 2,4,4,-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide; Examples thereof include dialkyl peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 1,3-bis(t-butyloxyisopropyl)benzene, and t-butylperoxyvaleric acid n-butyl ester; alkyl peresters such as 2,4,4-trimethylpentyl peroxyphenoxyacetate, α-cumyl peroxyneodecanoate, t-butyl peroxybenzoate, and di-t-butyl peroxytrimethyl adipate; and percarbonates such as di-3-methoxybutyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, bis-4-t-butylcyclohexyl peroxydicarbonate, diisopropyl peroxydicarbonate, acetylcyclohexylsulfonyl peroxide, and t-butyl peroxyarylcarbonate.

[0262] Examples of the above azobis compounds include 1,1'-azobiscyclohexane-1-carbonitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2, -azobis(methylisobutyrate), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutylnitrile), and 4,4'-azobis(4-cyanovaleic acid).

[0263] The above photoinitiator may also be used together with a photosensitizer that causes a chemical reaction by absorbing light, becoming excited, and then transferring the energy. Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, and dipentaerythritol tetrakis-3-mercaptopropionate.

[0264] The photoinitiator may be included in an amount of 0.01 to 10 wt%, for example, 0.1 to 5 wt%, based on the total amount of the photosensitive composition. When the photoinitiator is included within the above range, sufficient curing occurs upon exposure in the pattern forming process, thereby obtaining excellent reliability, and the pattern has excellent heat resistance, light resistance, and chemical resistance, and also excellent resolution and adhesion, and can prevent a decrease in transmittance due to unreacted initiator.

[0265] (4) Colorant

[0266] Both organic pigments and inorganic pigments and dyes can be used as the above colorants.

[0267] As the above coloring agent, red pigment, green pigment, blue pigment, yellow pigment, black pigment, etc. can be used.

[0268] Examples of the above red pigments include CI Red Pigment 254, CI Red Pigment 255, CI Red Pigment 264, CI Red Pigment 270, CI Red Pigment 272, CI Red Pigment 177, CI Red Pigment 89, etc.

[0269] Examples of the above green pigments include halogen-substituted copper phthalocyanine pigments such as CI Green Pigment 36, CI Green Pigment 7, etc.

[0270] Examples of the above blue pigments include copper phthalocyanine pigments such as CI Blue Pigment 15:6, CI Blue Pigment 15, CI Blue Pigment 15:1, CI Blue Pigment 15:2, CI Blue Pigment 15:3, CI Blue Pigment 15:4, CI Blue Pigment 15:5, CI Blue Pigment 16, and the like.

[0271] Examples of the above yellow pigments include isoindoline pigments such as CI Yellow Pigment 139, quinophthalone pigments such as CI Yellow Pigment 138, and nickel complex pigments such as CI Yellow Pigment 150.

[0272] Examples of the above black pigments include lactam black, aniline black, perylene black, titanium black, carbon black, etc.

[0273] Additionally, the colorant in the photosensitive resin composition according to the embodiment may include a pigment, a dye, or a combination thereof. For example, the dye may include a phthalocyanine-based compound.

[0274] The above pigments and dyes may be used alone or in combination of two or more thereof, and are not limited to these examples.

[0275] Among these, the black pigment may be used to effectively block light in the light-blocking layer. When using the black pigment, it may also be used together with a color corrector such as an anthraquinone pigment, a perylene pigment, a phthalocyanine pigment, or an azo pigment.

[0276] A dispersant may be used together with the photosensitive resin composition to disperse the pigment. Specifically, the pigment may be used by pre-surface-treating it with a dispersant, or the dispersant may be added together with the pigment during the preparation of the photosensitive resin composition.

[0277] Nonionic dispersants, anionic dispersants, cationic dispersants, etc. can be used as the above dispersant. Specific examples of the above dispersant include polyalkylene glycol and its esters, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylic acid esters, carboxylates, alkylamide alkylene oxide adducts, alkylamines, etc., and these can be used alone or in combination of two or more.

[0278] Examples of commercially available products of the above dispersant include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001 from BYK; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450 from EFKA Chemical; Zeneka's Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc.; or Ajinomoto's PB711, PB821, etc.

[0279] The dispersant may be included in an amount of 0.1 to 15 wt% based on the total weight of the photosensitive resin composition. When the dispersant is included within the above range, the composition has excellent dispersibility, resulting in excellent stability, developability, and patternability during the manufacture of the light-shielding layer.

[0280] The above pigment may be used after pretreatment using a water-soluble inorganic salt and a wetting agent. When the pigment is used after the above pretreatment, the average particle size of the pigment can be refined.

[0281] The above pretreatment can be performed through a step of kneading the pigment together with a water-soluble inorganic salt and a wetting agent, and a step of filtering and washing the pigment obtained in the kneading step.

[0282] The above-mentioned kneading can be performed at a temperature of 40°C to 100°C, and the above-mentioned filtration and washing can be performed by washing away the inorganic salt using water or the like and then filtering.

[0283] Examples of the above water-soluble inorganic salts include, but are not limited to, sodium chloride and potassium chloride.

[0284] The above wetting agent acts as a medium that allows the pigment and the water-soluble inorganic salt to be uniformly mixed and the pigment to be easily pulverized, and examples thereof include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and diethylene glycol monomethyl ether; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycol; and these may be used alone or in combination of two or more.

[0285] The pigment that has undergone the above-described kneading step may have an average particle diameter of 20 nm to 110 nm. When the average particle diameter of the pigment is within the above range, it can effectively form fine patterns while exhibiting excellent heat and light resistance.

[0286] The above pigment may be included in an amount of 1 to 40 wt%, more specifically 2 to 30 wt%, based on the total amount of the photosensitive resin composition. When the pigment is included within the above range, the color reproducibility is excellent, and the pattern has excellent curability and adhesion.

[0287] (5) Solvent

[0288] The solvent may be a material that is compatible with the cardo resin, the reactive unsaturated compound, the pigment, the cardo compound, and the initiator, but does not react with them.

[0289] Examples of the solvent include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, and tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methylethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methylethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone; Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; Lactic acid esters such as methyl lactate and ethyl lactate; Oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; Alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate;2-oxy-2-methyl propionic acid esters such as methyl 2-oxy-2-methyl propionic acid, ethyl 2-oxy-2-methyl propionic acid, etc.; monooxy monocarboxylic acid alkyl esters of 2-alkoxy-2-methyl propionic acid alkyls such as methyl 2-methoxy-2-methyl propionic acid, ethyl 2-ethoxy-2-methyl propionic acid; esters such as ethyl 2-hydroxypropionic acid, ethyl 2-hydroxy-2-methyl propionic acid, ethyl hydroxyacetate, methyl 2-hydroxy-3-methyl butanoate; ketone acid esters such as ethyl pyruvate, etc.;

[0290] In addition, high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate can also be used.

[0291] Among the above solvents, taking compatibility and reactivity into consideration, glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as 2-hydroxypropionate ethyl; carbitols such as diethylene glycol monomethyl ether; and propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate can be used.

[0292] The solvent may be included as a remainder based on the total amount of the photosensitive resin composition, and specifically, may be included at 40 to 90 wt%. When the solvent is included within the above range, the photosensitive resin composition has an appropriate viscosity, thereby providing excellent processability in the manufacture of a pattern layer.

[0293] (6) Other additives

[0294] The above photosensitive composition may further include additives such as malonic acid; 3-amino-1,2-propanediol; a silane coupling agent containing a vinyl group or a (meth)acryloxy group; a silane and fluorine-based leveling agent; a silane and fluorine-based surfactant; a fluorine-based surfactant; and a radical polymerization initiator to prevent stains or spots during application, improve leveling performance, and prevent the formation of residues due to non-development.

[0295] For example, the photosensitive resin composition may further include a silane coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, or an epoxy group to improve adhesion to a substrate, etc.

[0296] Examples of the above silane coupling agent include trimethoxysilyl benzoic acid, γ-methacryl oxypropyl trimethoxysilane, vinyl triacetoxysilane, vinyl trimethoxysilane, γ-isocyanate propyl triethoxysilane, γ-glycidoxy propyl trimethoxy silane, β-epoxy cyclohexyl ethyl trimethoxysilane, etc., and these may be used alone or in combination of two or more.

[0297] The above silane coupling agent may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is included within the above range, adhesion, storability, etc. are excellent.

[0298] In addition, the photosensitive resin composition may further include a surfactant, such as a fluorinated surfactant, to improve coating properties and prevent defects, if necessary.

[0299] Examples of the above fluorinated surfactants include BM Chemie's BM-1000®, BM-1100®, etc.; Dai Nippon Inki Kagaku Kogyo Co., Ltd.'s Meka Pack F 142D®, Dong F 172®, Dong F 173®, Dong F 183®, etc.; Sumitomo 3M Co., Ltd.'s Prorad FC-135®, Dong FC-170C®, Dong FC-430®, Dong FC-431®, etc.; Asahi Glass Co., Ltd.'s Saffron S-112®, Dong S-113®, Dong S-131®, Dong S-141®, Dong S145®, etc.; Fluorinated surfactants sold under the names SH-28PA®, Dong-190®, Dong-193®, SZ-6032®, and SF-8428® by Toray Silicone Co., Ltd. can be used.

[0300] The above silicone-based surfactants include DIC's S-101, S-104, S-106, S-109, S-120, S-121, S-134, S-135, S-201, S-203, S-204, S-210, S-220, S-301, S-302, S-303, S-314, S-317, S-318, S-326, S-329, S-333, S-349, S-355, S-358, S-359, S-362, S-601, S-701, S-801 RS-55, RS-56, etc.; You can use silicone-based surfactants sold under the names BYK-378, BYK-3550, BYK-3751, and BYK-3754.

[0301] The above surfactant may be used in an amount of 0.001 to 5 parts by weight per 100 parts by weight of the photosensitive resin composition. When the surfactant is included within the above range, coating uniformity is ensured, staining does not occur, and wetting on a glass substrate is excellent. In addition, other additives such as antioxidants and stabilizers may be added in a certain amount to the photosensitive resin composition within a range that does not impair the physical properties.

[0302] Another embodiment of the present invention provides a light-blocking layer (or light-shielding layer) manufactured using the aforementioned photosensitive resin composition. Specifically, the light-blocking layer may refer to a pattern state manufactured by applying and coating the aforementioned photosensitive resin composition, followed by post-processing through exposure and development steps. In addition, the light-blocking layer of the present invention also includes a state in which the photosensitive resin composition obtained by drying the aforementioned photosensitive resin composition is photocured or thermoset.

[0303] The method for applying the photosensitive resin composition is not particularly limited, and for example, a spraying method, a roll coating method, a rotary coating method, a slit coating method, an extrusion coating method, a curtain coating method, a die coating method, a wire bar coating method, or a knife coating method can be used. The drying of the photosensitive resin composition varies depending on the type and content ratio of each component or organic solvent, but can be performed, for example, at 60 to 100°C for 30 seconds to 15 minutes. However, this is merely an example, and the drying conditions of the photosensitive resin composition of the present invention are not limited thereto.

[0304] At this time, the light-blocking layer may also be used as one of a color filter for a display panel, a colored light-blocking layer for a display panel, a base film of a substrate for a display device, an insulating layer of a substrate for a display device, an interlayer insulating film for a display panel, a pixel definition film or bank layer for a display panel, a solder resist for a display panel, a black matrix for a display panel, a protective film for a circuit board, a base film of a circuit board, an insulating layer of a circuit board, an interlayer insulating film of a semiconductor, or a solder resist.

[0305] The pattern layer, which is the pixel definition film described above, has an opening, and the inclined portion connecting the opening and the non-opening portion has an inclined angle.

[0306] Meanwhile, according to another embodiment of the present invention, an electronic device is provided, including a liquid crystal display device including the aforementioned light blocking layer or a display device including the aforementioned light blocking layer and an organic electric element, and including a control unit for driving the display devices. The aforementioned light blocking layer is exemplarily described as being used as a colored light blocking layer or a black light blocking layer to prevent color interference between red, green, and blue color filters in an electronic device to improve image quality, but the present invention is not limited thereto.

[0307] In addition, the light-blocking layer used as a pixel definition film for a display panel means a light-blocking layer or a processed product of the light-blocking layer, for example, a processed product laminated to a certain substrate or a photoreactive material, etc.

[0308] The above light-blocking layer can be pre-laminated on the formation surface of the display panel at a temperature of 20 to 50°C by a method such as flat pressing or roll pressing, and then vacuum lamination can be performed at 60 to 90°C to form a photosensitive film.

[0309] In addition, the above-mentioned light-blocking layer can be patterned by exposing it using a photomask to form a microstructure or micro-width line. The exposure dose can be appropriately adjusted depending on the type of light source used for UV exposure and the thickness of the film film, and can be, for example, 100 to 1200 m / cm2, and more specifically, 100 to 500 m / cm2, but is not limited thereto.

[0310] Available active light sources include electron beams, ultraviolet rays, and X-rays, with ultraviolet rays being preferred. Available light sources include high-pressure mercury lamps, low-pressure mercury lamps, and halogen lamps.

[0311] In the post-exposure development, a spray method is generally used, and the photosensitive resin composition is developed using an alkaline aqueous solution such as an aqueous sodium carbonate solution, and then washed with water. Thereafter, through a heat treatment process, when the polyamic acid is converted into polyimide according to the pattern obtained by the development, the heat treatment temperature may be 100 to 250°C, which is required for imidization. At this time, it is effective to continuously increase the heating temperature in 2 to 4 steps with an appropriate temperature profile, but in some cases, curing may be performed at a constant temperature. Through the above-described steps, a pixel definition film for a display panel, etc. can be obtained.

[0312] Another embodiment of the present invention can provide an organic light-emitting display device. Hereinafter, referring to FIG. 1, the organic light-emitting display device according to the embodiment of the present invention includes a substrate (1), a TFT layer (2) on the substrate, a flattening layer (3) on the TFT layer, an organic light-emitting element layer on the flattening layer, a sealing layer (8) disposed on the organic light-emitting element layer, a touch panel (9) disposed on the sealing layer, and a color filter disposed on the touch panel, wherein at least one of the flattening layer, the organic light-emitting element layer, the sealing layer, the touch panel, and the color filter includes a pattern or film formed with the photosensitive composition of the present invention.

[0313] The above pattern or film is formed of a photosensitive composition containing as essential components a resin represented by the above chemical formula (20) and an acrylic compound having at least three ethylenically unsaturated double bond groups in the molecule and having a viscosity of 200 mPa·s to 280 mPa·s at 40°C.

[0314] The above substrate (1) may be a flexible substrate. The substrate may be made of a plastic having excellent heat resistance and durability, such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphtalate (PEN), polycarbonate (PC), polyarylate (PAR), polyetherimide (PEI), and polyethersulfone (PES). However, the present invention is not limited thereto, and various flexible materials, such as metal foil or thin glass, may be used.

[0315] Meanwhile, the substrate may be a rigid substrate, and in this case, the substrate may be made of a glass material having SiO2 as a main component. In the case of a bottom emission type in which an image is implemented in the direction of the substrate, the substrate must be formed of a transparent material. However, in the case of a top emission type in which an image is implemented in the opposite direction of the substrate, the substrate does not necessarily need to be formed of a transparent material. In this case, the substrate may be formed of a metal. In the case of forming the substrate of a metal, the substrate may include, but is not limited to, one or more selected from the group consisting of carbon, iron, chromium, manganese, nickel, titanium, molybdenum, and stainless steel (SUS).

[0316] A TFT layer (2) may be arranged on the above substrate. The term TFT layer mentioned in this specification refers to a thin film transistor (TFT) array for driving an organic light-emitting element, and means a driving part for displaying an image. In Fig. 1, only an organic light-emitting element and a driving thin film transistor for driving the organic light-emitting element are illustrated, but this is only for the convenience of explanation, and the present invention is not limited to what is illustrated, and it is obvious to those skilled in the art that a plurality of thin film transistors, storage capacitors, and various types of wiring may be further included.

[0317] The TFT layer may be covered and protected by a planarization layer (3). The planarization layer may include an inorganic insulating film and / or an organic insulating film. Examples of inorganic insulating films that may be used in the planarization layer include silicon oxide (SiO2), silicon nitride (SiN). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zirconium oxide (ZrO2), barium strontium titanate (BST), lead zirconate-titanate (PZT), etc. In addition, examples of organic insulating films that can be used in the planarization layer may include general-purpose polymers (PMMA, PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, p-xylene polymers, vinyl alcohol polymers, and blends thereof.

[0318] Meanwhile, the flattening layer may have a composite laminated structure of an inorganic insulating film and an organic insulating film. Furthermore, the flattening layer may include the photosensitive composition of the present invention. Details regarding the photosensitive composition of the present invention are identical to those described in the aforementioned embodiment of the present invention, and therefore will be omitted.

[0319] When forming a flat layer using the photosensitive composition of the present invention, the photosensitivity of the photosensitive composition is improved by the cardo compound included in the photosensitive composition of the present invention, so that a high-resolution flat layer pattern can be formed, and the reliability of the pattern is improved because the effect of reducing outgassing is advantageous.

[0320] An organic light-emitting element layer may be formed on the above-described flat layer. The organic light-emitting element layer may include a pixel electrode (4) formed on the flat layer, a counter electrode (7) positioned opposite the pixel electrode, and an organic layer (6) interposed therebetween. When a voltage is applied between the pixel electrode and the counter electrode, the organic layer may emit light. The organic layer may emit red light, green light, blue light, or white light.

[0321] When the organic layer emits white light, in order to express a color image, or when the organic layer emits red light, green light, or blue light, in order to increase color purity and light efficiency, the organic light-emitting display device may further include blue, green, and red color filters. The organic light-emitting display device can be classified into a bottom emission type, a top emission type, and a dual emission type depending on the light-emitting direction. In the bottom emission type organic light-emitting display device, the pixel electrode is provided as a light-transmitting electrode, and the opposite electrode is provided as a reflective electrode. In the top emission type organic light-emitting display device, the pixel electrode is provided as a reflective electrode, and the opposite electrode is provided as a semi-transmissive electrode.

[0322] In the present invention, a top-emitting type organic light-emitting device is described based on the light-emitting structure in which light is emitted in the direction of a sealing layer. The pixel electrode may be a reflective electrode. The pixel electrode may include a laminated structure of a reflective layer and a transparent or translucent electrode layer having a high work function. The reflective layer may include Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or an alloy thereof. The transparent or translucent electrode layer may include at least one material selected from transparent conductive oxide materials such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and aluminum zinc oxide (AZO).

[0323] The pixel electrode may be patterned and formed in an island shape corresponding to each pixel. In addition, the pixel electrode may function as an anode electrode. Meanwhile, a pixel definition film (5) including a predetermined opening that covers an edge of the pixel electrode and exposes a central portion of the pixel electrode may be disposed on the pixel electrode. An organic layer including an organic light-emitting layer that emits light may be disposed on an area defined by the opening. The area where the organic layer is disposed may be defined as a light-emitting area.

[0324] Meanwhile, when forming a light-emitting region within the opening of the pixel-defining film, a region protruding by the pixel-defining film is arranged between the light-emitting regions, and since no organic light-emitting layer is formed in this protruding region, it can be defined as a non-light-emitting region. The pixel-defining film may include the photosensitive composition of the present invention. Since the details regarding the photosensitive composition of the present invention are the same as those according to the above-described embodiment of the present invention, they will be omitted.

[0325] When a pixel defining film is formed with the photosensitive composition of the present invention, the photosensitivity of the photosensitive composition is improved by the cardo compound included in the photosensitive composition of the present invention, so that a high-resolution pixel defining film pattern can be formed, and since the generation of outgas is reduced, the reliability of the pattern is improved, which is preferable. In addition, the photosensitive composition of the present invention may include a black pigment or dye, and when a pixel defining film is formed with the photosensitive composition of the present invention including a black pigment or dye, there is an effect of improving the visibility of the organic light-emitting display device by absorbing light incident from the outside. The counter electrode may be formed as a transmissive electrode.

[0326] The counter electrode may be a semi-permeable film formed thinly of a metal such as Li, Ca, LiF / Ca, LiF / Al, Al, Mg, Ag, etc., which has a low work function. To compensate for the high resistance problem of the thin metal semi-permeable film, a transparent conductive film made of a transparent conductive oxide may be laminated on the metal semi-permeable film. The counter electrode may be formed over the entire surface of the substrate in the form of a common electrode. In addition, such a counter electrode may function as a cathode electrode. The polarities of the pixel electrode and the counter electrode may be opposite to each other. The organic layer includes an organic light-emitting layer that emits light, and the organic light-emitting layer may use a low-molecular organic material or a high-molecular organic material.

[0327] In the case where the organic light-emitting layer is a low-molecular organic layer formed of a low-molecular organic material, a hole transport layer (HTL) and a hole injection layer (HIL) may be disposed in the direction of the pixel electrode centered on the organic light-emitting layer, and an electron transport layer (ETL) and an electron injection layer (EIL) may be disposed in the direction of the counter electrode. Of course, other functional layers may be laminated in addition to the hole injection layer, hole transport layer, electron transport layer, and electron injection layer. A sealing layer (8) may be disposed on the organic light-emitting element layer to cover the organic light-emitting element layer. The organic light-emitting element included in the organic light-emitting element layer is composed of an organic material and may be easily deteriorated by external moisture or oxygen. Therefore, the organic light-emitting element layer must be sealed in order to protect the organic light-emitting element. The sealing layer may have a structure in which a plurality of inorganic films and a plurality of organic films are alternately laminated as a means for sealing the organic light-emitting element layer.

[0328] In the organic light-emitting display device of the present embodiment, it is preferable to form a sealing layer using a thin film in which a plurality of inorganic films and a plurality of organic films are alternately laminated, rather than a sealing substrate. By using a thin film as a sealing means, flexibility and thinning of the organic light-emitting display device can be easily implemented. The sealing layer may include a plurality of inorganic films and a plurality of organic films. The inorganic films and the organic films may be alternately laminated with each other. The inorganic films may be formed of a metal oxide, a metal nitride, a metal carbide, or a combination thereof. For example, the inorganic films may be formed of aluminum oxide, silicon oxide, or silicon nitride. According to another example, the inorganic films may include a laminated structure of a plurality of inorganic insulating layers. The inorganic films may perform a function of inhibiting external moisture and / or oxygen, etc. from penetrating into the organic light-emitting element layer.

[0329] The organic films may be polymeric organic compounds. For example, the organic films may include any one of epoxy, acrylate, or urethane acrylate. The organic films may relieve internal stress of the inorganic films, or perform functions of compensating for defects in the inorganic films and planarizing them. The stacking order of the inorganic films and organic films constituting the sealing layer is not limited, and an organic film or an inorganic film may be stacked on an organic light-emitting element layer, and the uppermost layer of the sealing layer may also be an organic film or an inorganic film. A touch panel (9) may be formed on the sealing layer.

[0330] The touch panel may include a first touch electrode formed on the sealing layer, a second touch electrode positioned opposite the first touch electrode, and an insulating layer interposed therebetween. The first touch electrode and the second touch electrode may be formed in a grid pattern or a specific pattern. The first touch electrode may be formed in contact with the upper portion of the sealing layer, and an inorganic layer may be additionally provided between the sealing layer and the first touch electrode. The first touch electrode and the second touch electrode may be formed of ITO or a metal mesh, and is preferably formed of a metal mesh. The metal mesh is an electrode manufactured by printing an opaque metal (copper, silver, gold, aluminum, etc.) in a grid shape with a thickness of 1 to 7 ㎛. Since it uses a highly conductive metal, it has a very low resistance value, which allows for a fast touch response speed, facilitates implementation of a large screen, and has the advantage of being cheaper than an ITO film. In addition, the metal mesh electrode has superior durability against repeated bending compared to the ITO electrode, and is therefore suitable for use as a touch panel electrode for a foldable display.

[0331] The above insulating layer can be formed with the photosensitive composition of the present invention. Since the details regarding the photosensitive composition of the present invention are the same as those according to the above-described embodiment of the present invention, they will be omitted. When forming an insulating layer with the photosensitive composition of the present invention, the photosensitivity of the photosensitive composition is improved by the cardo compound included in the photosensitive composition of the present invention, so that a high-resolution insulating layer pattern can be formed, and since the generation of outgas is reduced, the reliability of the pattern is improved, which is preferable. In addition, since the photosensitive composition of the present invention has high photosensitivity, even if the post-heat treatment process during the photopatterning process is performed at 100°C or lower, the pattern is sufficiently cured, so that the heat resistance and chemical resistance of the insulating layer pattern are secured, so that the insulating layer of the touch panel can be formed without causing heat-induced damage to the organic material layer of the organic light-emitting element layer.

[0332] The above touch panel is preferably a capacitive touch panel that recognizes a part where the amount of current has changed by utilizing the capacitance of a human body when a user touches it, calculates the size, and detects the location. It is obvious to those skilled in the art that the organic light-emitting display device of the present invention is not limited to what is illustrated, and may further include a Control IC that converts an analog signal transmitted from the touch panel into a digital signal and controls coordinate values ​​necessary for determining the coordinates of a touch area, an optically transparent adhesive, a flexible printed circuit board (FPCB) on which conductive and signal line patterns are formed to transmit various signals to electronic components, and other various electronic components and various wirings. A color filter may be formed on the touch panel. The color filter may be manufactured in advance and provided in the organic light-emitting display device, or a process of forming the color filter directly on the touch panel may be performed.

[0333] The color filter may be positioned on the upper portion of the touch panel and may include a color portion (10) aligned vertically with the light-emitting region of the organic light-emitting element layer and a color separation portion (11) aligned vertically with the non-light-emitting region and separating the color portion. The photosensitive composition of the present invention may be included in the color portion to narrow the wavelength range of light emitted from the light-emitting region, thereby improving the color purity of the organic light-emitting display device. In addition, the photosensitive composition of the present invention may be included in the color separation portion to absorb and block external light incident on the organic light-emitting display device, thereby improving outdoor visibility. The photosensitive composition of the present invention may include a red pigment or a red dye to form a red color portion aligned vertically with the red light-emitting region.

[0334] The photosensitive composition of the present invention can form a green color portion aligned vertically with a green light-emitting region by including a green pigment or a green dye. The photosensitive composition of the present invention can form a blue color portion aligned vertically with a blue light-emitting region by including a blue pigment or a blue dye.

[0335] The photosensitive composition of the present invention can form a color separation portion vertically aligned with the pixel defining film by including a black pigment or a black dye. When the photosensitive composition of the present invention is used to form a color portion or a color separation portion of a color filter, the photosensitivity of the photosensitive composition is improved by the cardo compound included in the photosensitive composition of the present invention, so that a color portion or a color separation portion pattern with high resolution can be formed. In addition, the reliability of the pattern is improved because the photosensitive composition has the effect of reducing outgassing, which is preferable.

[0336] In addition, since the photosensitive composition of the present invention has high photosensitivity, even if the post-heat treatment process during the photopatterning process is performed at 100°C or lower, the pattern is sufficiently cured, thereby ensuring heat resistance and chemical resistance of the color portion or color separation portion pattern, so that a color filter can be formed without causing heat damage to the organic material layer of the organic light-emitting element layer. It is obvious to those skilled in the art that the position of each layer in the structure of the organic light-emitting display device described above is not limited, and that multiple functional layers having specific purposes and functions can be additionally arranged between each layer, and the organic light-emitting display device of the present invention is not limited to the structure and drawings described above.

[0337] Hereinafter, synthetic examples and examples according to the present invention are specifically described, but the synthetic examples and examples of the present invention are not limited thereto.

[0338] (Preparation of black photosensitive composition)

[0339] Synthesis Example 1: (Preparation of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene of Chemical Formula 8)

[0340] 20 g of 9,9'-bisphenol fluorene (Sigma Aldrich), 8.67 g of glycidyl chloride (Sigma Aldrich), and 30 g of anhydrous potassium carbonate were placed in a 300 ml 3-neck round-bottom flask equipped with a distillation column and 100 ml of dimethylformamide, and the mixture was heated to 80°C and reacted for 4 hours. The temperature was lowered to 25°C, the reaction solution was filtered, and the filtrate was added dropwise to 1000 ml of water with stirring. The precipitated powder was filtered, washed with water, and dried under reduced pressure at 40°C to obtain 25 g of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene of the following chemical formula 8. The obtained powder showed a purity of 98% as a result of HPLC purity analysis.

[0341] <Chemical Formula 8>

[0342]

[0343] Synthesis Example 2: Preparation of Cardo-based Binder Resin

[0344] 25 g (54 mmol) of compound 1 obtained in Synthesis Example 1, 8 g of acrylic acid (Daejung Chemicals & Metals Co., Ltd.), 0.2 g of benzyl triethyl ammonium chloride (Daejung Chemicals & Metals Co., Ltd.), and 0.2 g of hydroquinone (Daejung Chemicals & Metals Co., Ltd.) were placed together with 52 g of propylene glycol methyl ether acetate (Sigma Aldrich Co., Ltd.) in a 300 ml 3-neck round-bottom flask equipped with a distillation column, and stirred at 110°C for 6 hours. After completion of the reaction, 8 g of biphenyl tetracarboxylic dianhydride (Mitsubishi Gas Co., Ltd.) and 1.8 g of tetrahydrophthalic acid (Sigma Aldrich Co., Ltd.) were added, and stirred again at 110°C for 6 hours. After completion of the reaction, the reaction solution was recovered, and the analysis results showed that a cardo-based binder resin having a molecular weight of 4,580 and a solid content of 45% was obtained.

[0345] Manufacturing Example 1: Manufacturing of black pigment dispersion

[0346] A dispersion was obtained by dispersing 15 g of Irgaphor Black S 100 CF (black pigment / BASF), 8.5 g of Disperbyk 163 (BYK), and 6.5 g of SR-3613 (SMS) together with 70 g of propylene glycol methyl ether acetate and 100 g of zirconia beads with a diameter of 0.5 mm (Toray) using a paint shaker (Asada) for 10 hours.

[0347] A photosensitive composition was prepared with the composition shown in Table 1 below.

[0348] Specifically, after dissolving the initiator in a solvent, the mixture was stirred at room temperature. Then, a binder resin and a polymerizable compound were added and stirred at room temperature. Next, a colorant and other additives were added to the resulting reactant, which was stirred at room temperature. The resulting product was then filtered three times to remove impurities, thereby producing a photosensitive resin composition.

[0349] Composition ratio (%) Black pigment dispersion (manufacturing example 1) 23 Cardo binder (synthesis example 2) 15 Miraemer M600 (Miwon Specialty Chemical) 12.5 PBG-304 (Trony) 0.5 Propylene glycol methyl ether acetate 49

[0350] A method for manufacturing a negative pixel definition layer (negative PDL) using the above photosensitive composition is as follows.

[0351] (1) Application and coating stage

[0352] A photosensitive composition is applied to a 10cm*10cm metal-deposited substrate using a spin coater to a certain thickness, and then a VCD (vacuum chamber dry) is used to remove some of the solvent to form a film. The coating thickness of the photosensitive composition is 3.5 micrometers to 3.3 micrometers after VCD to form a film.

[0353] (2) Prebaking stage

[0354] In order to remove the solvent contained in the obtained film, it is heated on a hot plate at 80°C to 150°C, preferably 90°C to 120°C, for 60 to 180 seconds, preferably 100 to 150 seconds. By removing a certain amount of the solvent in this process, pixel-shaped mask contamination can be reduced in the next process (exposure) step, and a clean pattern can be created.

[0355] (3) Exposure stage

[0356] After interposing a pixel-shaped mask to form the required pattern and obtain a certain thickness on the obtained film, a pattern can be formed by irradiating a light source of a metal or LED lamp having an active line of 190 nm to 600 nm, preferably a ghi-line, through an exposure device. The exposure dose irradiated for pattern formation is 20 to 150 mJ / cm 2 , preferably 70mJ / cm 2 ~ 140mJ / cm2 and more preferably 80mJ / cm 2 ~ 110mJ / cm 2 The transmittance of the photomask used during exposure was 0% (non-exposed area), 20 to 50% (Half-tone), and 100% (Full-tone), and the pattern was formed with a transmittance of three sections.

[0357] (4) Phenomenon stage

[0358] Following the above exposure step, the film is developed by dipping at 23±2°C for a certain period of time (minutes) using a 2.38 wt% TMAH (tetramethylammonium hydroxide) developer for 30 to 100 seconds, preferably 35 to 60 seconds, and then washed with deionized water (DI water), so that the unexposed portion is dissolved and removed, leaving only the exposed portion to form an image pattern. The thickness of the film is 1.25 to 2.20 μm for half-tone and 3.20 to 3.45 μm for full-tone.

[0359] (5) Post-exposure stage

[0360] Following the above development step, in order to prevent the pattern from collapsing after post-heat treatment, the strength of the film can be increased by irradiating the entire area with a light source of a metal or LED lamp having an active line of 190 nm to 600 nm, preferably a ghi-line, through a photomask without a photo mask. The exposure dose irradiated to increase the strength is 50 to 1,000 mJ / cm 2 , preferably 100mJ / cm 2 ~ 900mJ / cm 2 am.

[0361] (6) Post-heat treatment stage

[0362] In order to obtain the image pattern obtained by the above post-exposure treatment, post-baking is performed in an oven at 200 to 300°C, preferably 230 to 270°C, for 30 to 120 minutes to completely remove the solvent, harden the pattern to form a film, and then measurement is performed using a scanning electron microscope.

[0363] (7) Pattern and taper angle analysis

[0364] In order to confirm the image pattern and thickness obtained by the above phenomenon, the shape, thickness, and taper angle of the pattern cross-section were measured using a scanning electron microscope (JEOL), and the thickness, lower taper angle, and upper taper angle were confirmed according to the exposure amount and development time.

[0365] It is preferable that the taper angle of the lower pattern after the above post-heat treatment is 10 to 70° and the taper angle of the upper pattern is 5 to 50°.

[0366] It is more preferable that the taper angle of the lower pattern after the above post-heat treatment is 15 to 65° and the taper angle of the upper pattern is 10 to 45°.

[0367] It is preferable that the half-tone thickness of the pattern after the above post-heat treatment step is 1.00 to 1.90 ㎛ and the full-tone thickness is 2.80 to 3.20 ㎛.

[0368] It is more preferable that the half-tone thickness of the pattern after the above post-heat treatment step is 1.20 to 1.80 ㎛ and the full-tone thickness is 2.90 to 3.10 ㎛.

[0369] Exposure dose (mJ / cm) 2 )Developing time (sec)Half-tone thickness (㎛)Full-tone thickness (㎛)Example 1 100 30 1.94 3.40Example 2 55 1.72 3.35Example 3 80 1.49 3.31Example 4 100 1.37 3.22Comparative example 1 102 68 3.46Comparative example 2 202 47 3.41Comparative example 3 1 101 19 3.13Comparative example 4 1 200 79 3.00

[0370] Exposure amount (mJ / cm 2 ) Development time (seconds) Exposure amount after development (mJ / cm 2 ) Post heat treatment (°C) Thickness H / T after post heat treatment (1) & F / T (2) (μm) Angle H / T after post heat treatment (1) & F / T (2) (°) Example 585304002 50 1.65 / 3.08 32 / 23 Example 6 60 1.50 / 2.94 27 / 22 Comparative Example 5 20 2.13 / 3.49 40 / 10 Comparative Example 6 70 0.94 / 2.85 23 / 20

[0371] Looking at Table 2 above, after irradiating the same exposure energy, the Half-tone thickness (μm) and Full-tone thickness (μm) were measured and compared for the substrates obtained for each development time. Referring to Comparative Examples 3 to 4 in Table 2, it was confirmed that when development was carried out for 100 seconds or more, the Half-tone thickness was 1.30 μm or less and the Full-tone thickness was 3.20 μm, showing a decrease in thickness. Thus, it was confirmed that the maximum development time required for Half-tone formation should be 100 seconds or less. When the development time was 30 seconds or less, it was confirmed that although the Full-tone thickness was satisfied due to insufficient development, the thickness in the Half-tone area was 2.47 μm. Thus, by adjusting with the development time under sufficient curing conditions, a step difference between the Full-tone and Half-tone can be created. When the step difference between these two areas decreases, the boundary between the deposition mask and the PDL layer disappears, and scratches may occur due to the mask.

[0372] Referring to Table 3 above, the thickness and taper angle of the lower and upper pattern cross-sections were measured and compared for the substrates obtained after 1 hour of post-exposure and 250°C post-heat treatment at different developing times. Referring to Comparative Example 1 in Table 2 above, it was confirmed that the half-tone thickness was somewhat high at 2.13 μm due to the short developing time. Referring to Comparative Example 2 above, it was confirmed that the opposite trend to Comparative Example 1 was observed as the developing time increased, and it was confirmed that the half-tone thickness of the half-tone was 0.94 μm lower due to over-development.

[0373] If the thickness of the half-tone PDL is less than 1.00㎛, it does not completely block the light reflected from the lower TFT electrode in terms of light blocking, which causes color interference or reduced brightness. Therefore, it is necessary to maintain a thickness of at least 1.00㎛.

[0374] Referring to the above Examples 5 and 6, it was confirmed that even after heat treatment at a high temperature of 250°C with post-exposure energy after development, the lower taper angle was maintained at 15 to 65°, and the upper taper angle was also maintained at 5 to 50°. The lower pattern portion formed in this way becomes a PDL (Pixel Define Layer) layer, and the upper portion serves to support a metal mask.

[0375] The above description is merely an example of the present invention, and those skilled in the art will appreciate that various modifications may be made without departing from the essential characteristics of the present invention.

[0376] Accordingly, the embodiments disclosed herein are intended to illustrate, rather than limit, the present invention, and the spirit and scope of the present invention are not limited by these embodiments. The scope of protection of the present invention should be interpreted by the claims, and all techniques within the scope equivalent thereto should be interpreted as being included within the scope of the present invention.

[0377] The present invention relates to a method for manufacturing a pixel definition layer of a light-emitting display device using a photosensitive composition.

Claims

1. A method for manufacturing a pixel definition layer including the steps of applying and coating a photosensitive composition; prebaking; exposure; and development, wherein the photomask transmittance is divided into three sections of 0% (non-exposed area), 20 to 50% (Half-tone), and 100% (Full-tone), and the development step is performed at a temperature of 19 to 27°C for a time of 30 to 100 seconds, and a method for manufacturing a pixel definition layer characterized in that one or more layers are formed through a single exposure and development process.

2. A method for manufacturing a pixel definition layer, characterized in that the hot plate temperature of the prebaking step in the first paragraph is 80°C to 150°C.

3. A method for manufacturing a pixel definition layer, characterized in that the prebaking step in claim 1 is performed for 60 to 180 seconds.

4. In the first paragraph, 70 mJ / cm in the exposure step 2 ~ 140mJ / cm 2 A method for manufacturing a pixel definition layer, characterized by examining the active line.

5. A method for manufacturing a pixel definition layer, characterized in that the half-tone thickness of the pattern after the developing step is 1.25 to 2.20 ㎛ in the first paragraph.

6. A method for manufacturing a pixel definition layer, characterized in that the full-tone thickness of the pattern after the developing step is 3.20 to 3.42 ㎛ in the first paragraph.

7. A method for manufacturing a pixel-defining layer, comprising additional post-exposure and post-heat treatment steps after the developing step in the first paragraph, characterized in that the post-exposure step performs full-surface exposure without a mask.

8. In the 7th paragraph, 50 mJ / cm in the post-exposure step 2 ~ 1000mJ / cm 2 A method for manufacturing a pixel definition layer, characterized by examining the active line.

9. A method for manufacturing a pixel definition layer, characterized in that the post-heat treatment step in paragraph 7 is performed at 200 to 300°C.

10. A method for manufacturing a pixel definition layer, characterized in that, in the 7th paragraph, the taper angle of the lower pattern after the post-heat treatment is 10 to 70° and the taper angle of the upper pattern is 5 to 50°.

11. A method for manufacturing a pixel definition layer, characterized in that the half-tone thickness of the pattern after the post-heat treatment step is 1.00 to 1.90 ㎛ in accordance with claim 7.

12. A method for manufacturing a pixel definition layer, characterized in that the full-tone thickness of the pattern after the post-heat treatment step is 2.80 to 3.20 ㎛ in accordance with claim 7.

13. A method for manufacturing a pixel definition layer, characterized in that the photosensitive composition in claim 1 contains a coloring agent.

14. A method for manufacturing a pixel definition layer according to claim 1, characterized in that the photosensitive composition comprises a patterning resin including an acrylic binder resin, a cardo binder resin, or a combination thereof.

15. A pixel definition layer manufactured according to paragraph 1.

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