Organic light-emitting display device

Abstract

This organic light-emitting display device may comprise: a first stereoscopic structure on a substrate; a second stereoscopic structure separated on the substrate from the first stereoscopic structure by a separation area along a first direction; first sub-pixels on one side of the first stereoscopic structure; second sub-pixels on one side of the second stereoscopic structure; and third sub-pixels on the separation area. The first sub-pixels may include first organic light-emitting elements, the second sub-pixels may include second organic light-emitting elements, and the third sub-pixels may include third organic light-emitting elements. Each of the first stereoscopic structure and the second stereoscopic structure has a structure separated in units of at least one pixel along a second direction or a structure continuously extending along the second direction, and the one side of the first stereoscopic structure and the one side of the second stereoscopic structure may each be orthogonal to the substrate.

Description

organic light emitting display device

[0001] The embodiment relates to an organic light emitting display device.

[0002] Recently, as society enters the full-fledged information age, interest in information displays capable of processing and displaying massive amounts of information has been growing. Furthermore, the growing demand for portable information media has driven rapid development in the display industry. In response, a variety of lightweight and thin flat panel display devices are gaining traction.

[0003] Among these flat panel displays, Organic Light Emitting Display Devices (OLEDs, hereinafter referred to as OLEDs) are attracting attention. OLEDs are being actively developed for use as display devices in head-mounted displays (HMDs), which are mounted close to the human eye. HMDs can be worn in the form of helmets or glasses, enabling virtual reality (VR) or augmented reality (AR).

[0004] HMDs are equipped with high-resolution, small OLEDs. These small, high-resolution OLEDs are formed using wafer-based semiconductor processes, with organic light-emitting diodes arranged on a driving circuit. Meanwhile, glasses-type HMDs require brighter, clearer images on very small screens. To achieve this, the amount of light from the organic light-emitting diodes and their extraction efficiency must be maximized. Furthermore, inter-pixel light leakage must be suppressed to enhance image quality. Technology that enhances light extraction efficiency, applicable to ultra-high resolutions, is expected to find widespread application in large-screen display industries such as mobile and IT devices.

[0005] Meanwhile, in the past, a fine metal mask (FMM) was used as a deposition pattern mask to form an organic light-emitting layer constituting an organic light-emitting element by depositing it for each subpixel.

[0006] However, when manufacturing high-definition (e.g., 500 PPI or higher) displays or large-area (e.g., 8th generation or higher) displays, it is quite difficult to form an organic light-emitting layer for each subpixel using FMM. Furthermore, when using FMM, there is a limit to further increasing the high-definition. Furthermore, when using FMM, there are problems such as reduced yield and increased manufacturing costs. In addition, when using FMM, there is a problem of reduced product life due to difficulty in optimizing deposition.

[0007] Meanwhile, as the resolution of displays has increased recently, the pixel resolution (ppi) has also increased, and the gap between pixels (or subpixels) has become narrower. In addition, as the efficiency of the light-emitting material for organic light-emitting devices has increased, high brightness can be generated with low current and voltage, which has the advantage of lowering power consumption. However, as the efficiency of the light-emitting material for organic light-emitting devices has increased and light emission is possible with a small amount of current, light emission can be achieved even by a small amount of current leaking from one pixel (or subpixel) to another adjacent pixel (or subpixel). As a result, a phenomenon occurs in which adjacent pixels (or subpixels) that should not emit light emit light. This current leakage is called lateral current leakage.

[0008] When leakage light occurs due to transverse current leakage, problems such as color mixing and color coordinate fluctuations arise. In addition, when leakage light occurs in a low-luminance area, it also increases black luminance.

[0009] To suppress leakage light emission, there are methods such as lowering the efficiency of the light-emitting material or lowering the resolution of the display element. However, in a situation where the demand for low-power, high-resolution products is increasing recently, it is not desirable to solve the problem of leakage light emission due to transverse current leakage by lowering the efficiency of the light-emitting material or lowering the resolution of the display element. Therefore, a technology is needed to suppress leakage light emission due to transverse current leakage without lowering the resolution in a display device that uses a high-efficiency light-emitting material.

[0010] The present invention aims to solve the above-mentioned and other problems.

[0011] Another object of the embodiment is to provide a high-definition and high-resolution organic light-emitting display device.

[0012] Another object of the present invention is to provide an organic light emitting display device that does not use FMM.

[0013] Another object of the embodiment is to provide an organic light emitting display device capable of preventing transverse current leakage between pixels (or subpixels).

[0014] The technical problems of the embodiment are not limited to those described in this article, but include those that can be understood through the description of the invention.

[0015] According to one aspect of the embodiment to achieve the above or other objects, an organic light-emitting display device includes: a first three-dimensional structure on a substrate; a second three-dimensional structure spaced apart from the first three-dimensional structure with a spaced area on the substrate along a first direction; a first subpixel on one side of the first three-dimensional structure; a second subpixel on one side of the second three-dimensional structure; and a third subpixel on the spaced area; wherein the first subpixel includes a first organic light-emitting element, the second subpixel includes a second organic light-emitting element, and the third subpixel includes a third organic light-emitting element, and the first three-dimensional structure and the second three-dimensional structure each have a structure in which at least one or more pixel units are separated along the second direction or a structure in which they are integrally elongated, and one side of the first three-dimensional structure and one side of the second three-dimensional structure can be perpendicular to the substrate, respectively.

[0016] One side of the first three-dimensional structure has a first average wall angle with respect to the substrate, one side of the second three-dimensional structure has a second average wall angle with respect to the substrate, and the first average wall angle and the second average wall angle may be the same.

[0017] The organic light emitting display device may further include another second subpixel on the other side of the first three-dimensional structure; and another first subpixel on the other side of the second three-dimensional structure.

[0018] The first organic light-emitting element may be provided in one or more numbers on one side of the first three-dimensional structure along the second direction, the second organic light-emitting element may be provided in one or more numbers on one side of the second three-dimensional structure along the second direction, and the third organic light-emitting element may be provided in one or more numbers on the third auxiliary electrode along the second direction.

[0019] The organic light-emitting display device may further include a first anode separation structure along a perimeter of the first three-dimensional structure; and a second anode separation structure along a perimeter of the second three-dimensional structure.

[0020] The first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element may include a charge generation layer in common, and the first anode separation structure may disconnect the charge generation layer between the first subpixel and the third subpixel, and the second anode separation structure may disconnect the charge generation layer between the second subpixel and the third subpixel.

[0021] The organic light-emitting display device may further include a first insulating layer on the first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element; a second insulating layer on the first insulating layer between the first three-dimensional structure and the second three-dimensional structure; and a third insulating layer on the second insulating layer.

[0022] The third insulating layer can be in contact with the upper surface of the first three-dimensional structure and the upper surface of the second three-dimensional structure.

[0023] The second insulating layer may include light scattering particles.

[0024] The organic light-emitting display device may further include a lens structure on the third insulating layer between the first three-dimensional structure and the second three-dimensional structure.

[0025] The effects of the organic light-emitting display device according to the embodiment are described as follows.

[0026] According to at least one of the embodiments, subpixels may be arranged on a three-dimensional structure. Accordingly, the light-emitting area of ​​each subpixel may be maintained or expanded, but the occupied area may be reduced, thereby enabling a high-definition and high-resolution display.

[0027] According to at least one of the embodiments, the side surface of the three-dimensional structure may be made to have a large inclination angle or a vertical surface, so that the blue organic light-emitting layer in the blue common structure may not be formed on the side surface of the three-dimensional structure or may be formed with a very thin thickness. Accordingly, the blue organic light-emitting layer may not affect the light emission of each subpixel, thereby preventing defects due to a decrease in color purity or color staining.

[0028] According to at least one of the embodiments, the anode electrode of each subpixel can be naturally disconnected (or separated) by the anode separation structure. Accordingly, a patterning process for separating the anode electrode for each subpixel is not required, thereby preventing defects caused by the patterning process, simplifying the process, and reducing costs.

[0029] According to at least one of the embodiments, the charge generation layer can be isolated (or separated) for each subpixel by the anode separation structure. Accordingly, transverse current leakage between each subpixel can be prevented.

[0030] Further scope of applicability of the embodiments will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of the embodiments will be readily apparent to those skilled in the art, it should be understood that the detailed description and specific embodiments, such as preferred embodiments, are given by way of example only.

[0031] FIG. 1 is a schematic plan view of an organic light-emitting display device according to an embodiment.

[0032] FIG. 2 is a perspective view schematically illustrating an organic light-emitting display device according to an embodiment as a first example.

[0033] FIG. 3 is a perspective view schematically illustrating an organic light-emitting display device according to an embodiment as a second example.

[0034] FIG. 4 is a perspective view schematically illustrating an organic light-emitting display device according to an embodiment as a third example.

[0035] FIG. 5 is a cross-sectional view illustrating an organic light-emitting display device according to the first embodiment.

[0036] Fig. 6 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment.

[0037] Fig. 7 is a cross-sectional view illustrating an organic light-emitting display device according to a third embodiment.

[0038] Fig. 8 is a cross-sectional view illustrating an organic light-emitting display device according to a fourth embodiment.

[0039] Fig. 9a is a cross-sectional view showing a laminated structure for each organic light-emitting element according to the first embodiment.

[0040] Fig. 9b is a cross-sectional view showing a laminated structure for each organic light-emitting element according to the second embodiment.

[0041] Figure 10a illustrates a deposition system according to an embodiment.

[0042] Figure 10b illustrates a blue organic light-emitting layer, a red organic light-emitting layer, and a green organic light-emitting layer being deposited on a substrate.

[0043] Figure 10c is a drawing illustrating a self-aligned deposition (SAD) method of an embodiment.

[0044] Fig. 11 is a flowchart showing a method for manufacturing an organic light-emitting display device according to the first embodiment.

[0045] FIGS. 12A to 12N are cross-sectional views showing a method for manufacturing an organic light-emitting display device according to the first embodiment.

[0046] Fig. 13 is a flowchart showing a method for manufacturing an organic light-emitting display device according to a second embodiment.

[0047] FIGS. 14A to 14D are cross-sectional views showing a method for manufacturing an organic light-emitting display device according to a second embodiment.

[0048] Figure 15 is a cross-sectional view illustrating the X area of ​​Figure 7 in detail.

[0049] Fig. 16 is a flowchart showing a method for manufacturing an organic light-emitting display device according to a third embodiment.

[0050] FIGS. 17A to 17G are cross-sectional views showing a method for manufacturing an organic light-emitting display device according to a third embodiment.

[0051] Figure 18 illustrates the height and depth of the undercut structure in the anode separation structure according to the embodiment.

[0052] Fig. 19 is a cross-sectional view illustrating an organic light-emitting display device according to the fifth embodiment.

[0053] Fig. 20 is a cross-sectional view illustrating an organic light-emitting display device according to the sixth embodiment.

[0054] Figure 21a is a cross-sectional view schematically designing a panel of an AR product.

[0055] Figure 21b is a design data sheet for the panel design of Figure 21a.

[0056] Figure 22 is a plan view schematically designing a panel of an AR product.

[0057] The sizes, shapes, and dimensions of components depicted in the drawings may differ from the actual components. Furthermore, even if the same components are depicted with different sizes, shapes, and dimensions across drawings, this is merely an example within the drawings, and the same components may have the same sizes, shapes, and dimensions across drawings.

[0058] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes 'module' and 'part' used for components in the following description are given or used interchangeably in consideration of the ease of writing the specification, and do not have distinct meanings or roles in themselves. In addition, the attached drawings are intended to make it easier to understand the embodiments disclosed in the present specification, and the technical ideas disclosed in the present specification are not limited by the attached drawings. In addition, when an element such as a layer, region, or substrate is referred to as existing 'on' another element, this includes that it may be directly on the other element or that other intermediate elements may exist therebetween.

[0059] FIG. 1 is a schematic plan view of an organic light-emitting display device according to an embodiment.

[0060] The organic light-emitting display device (100) according to the embodiment may be of a top-emitting type or a bottom-emitting type. The top-emitting type organic light-emitting display device can display an image by emitting light in an upward direction. The bottom-emitting type organic light-emitting display device can display an image by emitting light in a downward direction.

[0061] Referring to FIG. 1, an organic light-emitting display device (100) according to an embodiment may include a plurality of pixels (P) arranged on a substrate (101).

[0062] The substrate (101) can be divided into a display area and a non-display area. A plurality of pixels (P) can be arranged on the display area. A driving device such as a gate driver, a data driver, etc. can be arranged in the non-display area, but is not limited thereto. The plurality of pixels (P) can be arranged in a matrix. The plurality of pixels (P) can be arranged along a first direction (X). The plurality of pixels (P) can be arranged along a second direction (Y).

[0063] Each pixel (P) may include a plurality of subpixels (SPg, SPr, SPb). The plurality of subpixels (SPg, SPr, SPb) may include subpixels of at least three different colors.

[0064] As a first example, the plurality of subpixels (SPg, SPr, SPb) can be separated into pixel (P) units or row-line units along the second direction (Y). For example, the green subpixel (SPg) can be separated into pixel (P) units or row-line units along the second direction (Y), the red subpixel (SPr) can be separated into pixel (P) units or row-line units along the second direction (Y), and the blue subpixel (SPr) can be separated into pixel (P) units or row-line units along the second direction (Y).

[0065] As a second example, the plurality of subpixels (SPg, SPr, SPb) may be arranged in a stripe shape along the second direction (Y). In the stripe shape structure, the plurality of subpixels (SPg, SPr, SPb) may be arranged continuously without being separated along the second direction (Y). For example, green subpixels (SPg) may be arranged continuously along the second direction (Y), red subpixels (SPr) may be arranged continuously along the second direction (Y), and blue subpixels (SPr) may be arranged continuously along the second direction (Y).

[0066] Meanwhile, in the first and second examples, the green subpixels (SPg), the red subpixels (SPr), and the blue subpixels (SPb) may be alternately arranged in units of columns along the first direction (X). That is, in the embodiment, the green subpixels (SPg), the red subpixels (SPr), and the blue subpixels (SPb) having different colors may be arranged in a side-by-side structure along the first direction (X). In the side-by-side structure, it is very important to implement high definition and high resolution without reducing the light-emitting area of ​​each of the plurality of subpixels (SPg, SPr, SPb).

[0067] The green subpixel (SPg) may be named the first subpixel, the red subpixel (SPr) may be named the second subpixel, and the blue subpixel (SPb) may be named the third subpixel.

[0068] FIGS. 2 to 4 illustrate organic light emitting display devices on various three-dimensional structures (130-1, 130-2). That is, FIG. 2 is a perspective view schematically illustrating an organic light emitting display device according to an embodiment as a first example, FIG. 3 is a perspective view schematically illustrating an organic light emitting display device according to an embodiment as a second example, and FIG. 4 is a perspective view schematically illustrating an organic light emitting display device according to an embodiment as a third example. FIGS. 2 to 4 are cross-sectional views taken along line AA' in FIG. 1.

[0069] For convenience of explanation, two three-dimensional structures (130-1, 130-2) are not shown, but a plurality of three-dimensional structures may be arranged on the substrate (100).

[0070] As illustrated in FIGS. 1 to 4, an organic light-emitting display device (100) according to an embodiment may include a three-dimensional structure (130-1, 130-2). The three-dimensional structure (130-1, 130-2) may have at least two side surfaces (130-1a, 130-1b, 130-2a, 130-2b), and at least two subpixels (SPg, SPr) may be arranged on at least two side surfaces (130-1a, 130-1b, 130-2a, 130-2b). With this structure, high definition and high resolution can be implemented without reducing the light-emitting area of ​​each subpixel (SPg, SPr).

[0071] In the drawing, the side surfaces (130-1a, 130-1b, 130-2a, 130-2b) have straight surfaces, but may alternatively have curved or uneven surfaces. The side surfaces (130-1a, 130-1b, 130-2a, 130-2b) may be referred to as wall surfaces. The side surfaces (130-1a, 130-1b, 130-2a, 130-2b) and wall surfaces may be used interchangeably.

[0072] The three-dimensional structures (130-1, 130-2) may have a dot structure. The three-dimensional structures (130-1, 130-2) may be arranged in a matrix along the first direction (X) and the second direction (Y). The three-dimensional structures (130-1, 130-2) may be separated into pixel (P) units or column-line units along the first direction (X). As illustrated in FIGS. 2 and 4, the three-dimensional structures (130-1, 130-2) may be separated into pixel (P) units or row-line units along the second direction (Y). As illustrated in FIG. 3, the three-dimensional structures (130-1, 130-2) may be separated into two or more pixel (P) units or row-line units along the second direction (Y).

[0073] Although not shown, the three-dimensional structures (130-1, 130-2) may be arranged in a continuous stripe shape along the second direction (Y). That is, the three-dimensional structures (130-1, 130-2) may be arranged in a long manner as one piece without being separated along the second direction (Y).

[0074] The side surfaces (130-1a, 130-1b, 130-2a, 130-2b) of the three-dimensional structures (130-1, 130-2) may have inclined surfaces (FIGS. 2 and 3) or vertical surfaces (FIG. 4). Although not shown, the side surfaces (130-1a, 130-1b, 130-2a, 130-2b) of the three-dimensional structures (130-1, 130-2) may be divided into two or more pixel (P) units or row-line units along the second direction (Y) and may also have vertical surfaces.

[0075] A plurality of subpixels (SPg, SPr, SPb) can be driven sequentially or interleavedly (interleaving) for at least one row line by a scan signal. For example, they can be driven interleavedly in the order of a first row line, a third row line, a second row line, and a fourth row line. Through such interleaved driving, leakage current in the second direction (Y) can be reduced.

[0076] Since the three-dimensional structure (130-1, 130-2) is separated into one pixel (P) unit or two or more pixel (P) units along the second direction (Y), the patterning process of the anode electrode is facilitated, and leakage current between pixels (P) or subpixels (SPg, SPr, SPb) along the second direction (Y) can be reduced.

[0077] Depending on the resolution of the organic light-emitting display device (100), the height and width of the three-dimensional structure (130-1, 130-2) can be determined, and the manufacturing method of the three-dimensional structure (130-1, 130-2) can also be determined.

[0078] A first three-dimensional structure (130-1) and a second three-dimensional structure (130-2) may be provided on a substrate (101). The first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may be spaced apart from each other with a separation area (105) therebetween. The second three-dimensional structure (130-2) may be spaced apart from the first three-dimensional structure (130-1) with a separation area (105) along the first direction (X).

[0079] In this case, one pixel (P) can be defined using the first side (130-1a) of the first three-dimensional structure (130-1), the first side (130-2a) of the second three-dimensional structure (130-2), and the separation area (105). The first side (130-1a) of the first three-dimensional structure (130-1) and the first side (130-2a) of the second three-dimensional structure (130-2) can be positioned to face each other with the separation area (105) therebetween. The first side (130-1a) of the first three-dimensional structure (130-1) can be in contact with one side of the separation area (105), and the first side (130-2a) of the second three-dimensional structure (130-2) can be in contact with the other side of the separation area (105).

[0080] For example, a green subpixel (SPg) may be defined on a first side (130-1a) of a first three-dimensional structure (130-1), a red subpixel (SPr) may be defined on a first side (130-2a) of a second three-dimensional structure (30-2), and a blue subpixel (SPb) may be defined on a separation area (105) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). One pixel (P) may be configured by the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb). Therefore, by providing a plurality of three-dimensional structures on the substrate (101), a plurality of pixels may be defined.

[0081] A green organic light-emitting element (140g) may be arranged in a green subpixel (SPg), a red organic light-emitting element (140r) may be arranged in a red subpixel (140r), and a blue organic light-emitting element (140b) may be arranged in a blue subpixel (SPb). The green organic light-emitting element (140g) may be referred to as a first organic light-emitting element, the red organic light-emitting element (140r) may be referred to as a second organic light-emitting element, and the blue organic light-emitting element (140b) may be referred to as a third organic light-emitting element.

[0082] Another red organic light-emitting element (140'r) may be placed in a red subpixel (SPr) on the second side (130-1b) of the first three-dimensional structure (130-1), and another green organic light-emitting element (140'g) may be placed in a green subpixel (SPg) on ​​the second side (130-2b) of the second three-dimensional structure (130-2).

[0083] Accordingly, the red subpixel (SPr), the green subpixel (SPg), the blue subpixel (SPb), the red subpixel (SPr) and the green subpixel (SPg) may be arranged in the order along the first direction (X). Another red organic light-emitting element (140'r), a green organic light-emitting element (140g), a blue organic light-emitting element (140b), a red organic light-emitting element (140r) and another green organic light-emitting element (140'g) may be arranged in the order along the first direction (X).

[0084] The average wall angles (θa1, θa2) can be obtained from the side surfaces (130-1a, 130-1b, 130-2a, 130-2b) of the three-dimensional structures (130-1, 130-2). For example, the average wall angles (θa1, θa2) can be an angle formed by extending the upper and lower ends of the anode electrodes and contacting the surface of the separation region (105) of the substrate (101) at the upper surface (130T) of the three-dimensional structures (130-1, 130-2). When the side surfaces (130-1a, 130-1b, 130-2a, 130-2b) of the three-dimensional structures (130-1, 130-2) have round surfaces, the average wall angles (θa1, θa2) can be obtained using the linear extrapolation method.

[0085] For example, depending on the size of the average wall angle (θa1, θa2), the three-dimensional structure (130-1, 130-2) may have a rhombus column (Figs. 2 and 3) or a square column (Fig. 4) when viewed from the side. That is, the inner diameter or area of ​​the three-dimensional structure (130-1, 130-2) may decrease as it goes upward. In the three-dimensional structure (130-1, 130-2) having a rhombus column (Figs. 2 and 3) or a square column (Fig. 4), the average wall angle (θa1, θa2) may be 60 degrees or more and less than 90 degrees.

[0086] As another example, the average wall angle (θa1, θa2) may be perpendicular to the substrate (101). That is, the average wall angle (θa1, θa2) may be 90 degrees to the substrate (101).

[0087] As another example, the three-dimensional structure (130-1, 130-2) may have a reverse taper shape in which the inner diameter or area increases toward the top. In this case, the average wall angle (θa1, θa2) may be 90 degrees or more with respect to the substrate (101).

[0088] Meanwhile, the closer the average wall angle (θa) is to the vertical, that is, 90 degrees, the more advantageous it is for high resolution. The average wall angle (θa) may be an angle with respect to the ground or the substrate (101). In a blue common structure, a blue organic light-emitting layer (142B) may be commonly arranged in the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb). The closer the average wall angle (θa) is to the vertical, that is, 90 degrees, the more the thickness of the blue organic light-emitting layer (142B) commonly arranged in the green subpixel (SPg) and the red subpixel (SPr) is minimized, so that defects due to deterioration in color purity or color staining can be minimized.

[0089] Meanwhile, as illustrated in FIG. 3, the three-dimensional structures (130-1, 130-2) may be separated into two or more pixel (P) units or row-line units along the second direction (Y). In this case, two or more green organic light-emitting elements (140g) may be provided on the first side (130-1a) of the first three-dimensional structure (130-1) along the second direction (Y). Two or more red organic light-emitting elements (140r) may be provided on the first side (130-2a) of the second three-dimensional structure (130-2) along the second direction (Y). Two or more blue organic light-emitting elements (140b) may be provided on the separation region (105) along the second direction (Y).

[0090] Hereinafter, various organic light-emitting display devices will be described with reference to FIGS. 5 to 8. FIGS. 5 to 8 are cross-sectional views taken along line BB' of FIG. 1, respectively.

[0091] FIG. 5 is a cross-sectional view illustrating an organic light-emitting display device according to the first embodiment.

[0092] The organic light emitting display device (100A) illustrated in FIG. 5 is the organic light emitting display device illustrated in FIG. 2 or FIG. 3, wherein the side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1) and the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2) can be inclined with respect to the substrate (101).

[0093] Referring to FIG. 5, the organic light-emitting display device (100A) according to the first embodiment may include a first three-dimensional structure (130-1), a second three-dimensional structure (130-2), a green organic light-emitting element (140g), a red organic light-emitting element (140r), a blue organic light-emitting element (140b), etc.

[0094] The first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may be placed on a substrate (101). The first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may have square or rhombic columns (FIGS. 2 to 4). The side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1) and the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2) may be inclined with respect to the substrate (101). In this case, the average wall angle (θa) may be 60 degrees or more and less than 90 degrees.

[0095] Meanwhile, the three-dimensional structures (130-1, 130-2) may have a flat or rounded upper surface (130T). For example, when accompanying a photo process, a flat surface is advantageous for thickness control, and when using a printing process, a flat surface is not necessarily required. Although not shown, the three-dimensional structures (130-1, 130-2) may also have a vertex instead of a upper surface (130T).

[0096] Meanwhile, the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may be separated into one pixel (P) unit or two or more pixel (P) units along the second direction (Y), or may have a stripe shape.

[0097] A green subpixel (SPg) may be arranged on a first side (130-1a) of a first three-dimensional structure (130-1), a red subpixel (SPr) may be arranged on a first side (130-2a) of a second three-dimensional structure (130-2), and a blue subpixel (SPb) may be arranged on a separation area (105). The separation area (105) may be an area on a substrate (101) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2).

[0098] The first side (130-1a) of the first three-dimensional structure (130-1) and the first side (130-2a) of the second three-dimensional structure (130-2) can be in contact with both sides of the separation area (105).

[0099] The area of ​​the separation region (105) may vary depending on the separation distance between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). Accordingly, the area of ​​the blue subpixel (SPb) arranged on the separation region (105) may be determined by the area of ​​the separation region (105). As the separation distance increases, the area of ​​the separation region (105) increases, and thus the area of ​​the blue subpixel (SPb) may increase. As the area of ​​the blue subpixel (SPb) increases, the luminance increases, but this may run counter to an increase in resolution. Therefore, the separation distance between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may be determined in consideration of the resolution.

[0100] A green organic light-emitting element (140g) may be placed in a green subpixel (SPg), a red organic light-emitting element (140r) may be placed in a red subpixel (SPr), and a blue organic light-emitting element (140b) may be placed in a blue subpixel (SPb).

[0101] The green organic light-emitting device (140g) may include a first anode electrode (141g), a green organic light-emitting layer (142G), and a cathode electrode (143). The red organic light-emitting device (140r) may include a second anode electrode (141r), a red organic light-emitting layer (142R), and a cathode electrode (143). The blue organic light-emitting device (140b) may include a third anode electrode (141b), a blue organic light-emitting layer (142B), and a cathode electrode (143). The green organic light-emitting device (140g), the red organic light-emitting device (140r), and the blue organic light-emitting device (140b) may include more layers than this.

[0102] The green organic light-emitting layer (142G) may be named a first organic light-emitting layer, the red organic light-emitting layer (142R) may be named a second organic light-emitting layer, and the blue organic light-emitting layer (142B) may be named a third organic light-emitting layer.

[0103] The first anode electrode (141g) and the green organic light-emitting layer (142G) of the green organic light-emitting element (140g) may be arranged in a green subpixel (SPg) on ​​the first side (130-1a) of the first three-dimensional structure (130-1). The second anode electrode (141r) and the red organic light-emitting layer (142R) of the red organic light-emitting element (140r) may be arranged in a red subpixel (SPr) on the first side (130-2a) of the second three-dimensional structure (130-2). The third anode electrode (141b) and the blue organic light-emitting layer (142B) of the blue organic light-emitting element (140b) may be arranged in a blue subpixel (SPb) on the separation region (105).

[0104] The cathode electrode (143) may be commonly arranged in the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb). The cathode electrode (143) may be commonly arranged in the entire area of ​​the substrate (101), for example, in all pixels (P) or all subpixels (SPg, SPr, SPb).

[0105] In an embodiment, the blue organic light-emitting layer (142B) may be disposed not only on the blue subpixel (SPb) but also on the green subpixel (SPg) and the red subpixel (SPr). That is, the blue organic light-emitting layer (142B) may be commonly disposed on the entire area of ​​the substrate (101), for example, on all pixels (P) or all subpixels (SPg, SPr, SPb). This structure may be referred to as a blue common structure. In this blue common structure, the blue organic light-emitting layer (142B) may be disposed on the side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1), the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2), and the separation area (105). The blue organic light-emitting layer (142B) may be disposed between the first anode electrode (141g) and the green organic light-emitting layer (142G) in the green subpixel (SPg). The blue organic light-emitting layer (142B) may be disposed between the second anode electrode (141r) and the red organic light-emitting layer (142R) in the red subpixel (SPr).

[0106] According to an embodiment, a green organic light-emitting layer (142G), a red organic light-emitting layer (142R), and a blue organic light-emitting layer (142B) can be formed in a green subpixel (SPg), a red subpixel (SPr), and a blue subpixel (SPb), respectively, without using an FMM. That is, the green organic light-emitting layer (142G), the red organic light-emitting layer (142R), and the blue organic light-emitting layer (142B) can be formed using a self-aligned deposition (SAD) method and a first three-dimensional structure (130-1) and a second three-dimensional structure (130-2). The SAD method will be described later.

[0107] Meanwhile, the organic light emitting display device (100A) according to the first embodiment may include a substrate (101), a plurality of driving circuits (103), a protective layer (110), a plurality of auxiliary electrodes (120g, 120r, 120b), etc.

[0108] A plurality of driving circuits (103) may be arranged on a substrate (101), a protective layer (110) may be arranged on the plurality of driving circuits (103), and a plurality of auxiliary electrodes (120g, 120r, 120b) may be arranged on the protective layer (110). The auxiliary electrodes may be referred to as pixel electrodes.

[0109] The substrate (101) may be made of a silicon wafer, glass, plastic, ceramic, or the like. The substrate (101) may be made of a transparent or opaque material. The driving circuit (103) may include a plurality of transistors and at least one capacitor. One of the plurality of transistors may be a driving transistor.

[0110] The protective layer (110) may be a single layer composed of an inorganic film or an organic film. The protective layer (110) may be a multilayer of an inorganic film, or a combination of a multilayer of an inorganic film and an organic film. The protective layer (110) may be formed of a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multilayer thereof.

[0111] For example, the protective layer (110) may be composed of a multi-structure of an organic film and an inorganic film. In this case, the organic film may include an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, etc. The inorganic film may include a silicon oxide film (SiOx), a silicon nitride film (SiNx), etc.

[0112] A plurality of auxiliary electrodes (120g, 120r, 120b) may be provided corresponding to a plurality of subpixels (SPg, SPr, SPb). For example, a first auxiliary electrode (120g) may be connected to a green subpixel (SPg), a second auxiliary electrode (120r) may be connected to a red subpixel (SPr), and a third auxiliary electrode (120b) may be connected to a blue subpixel (SPb). For example, a first auxiliary electrode (120g) may be connected to a green organic light-emitting element (140g), a second auxiliary electrode (120r) may be connected to a red organic light-emitting element (140r), and a third auxiliary electrode (120b) may be connected to a blue organic light-emitting element (140b).

[0113] Meanwhile, the first auxiliary electrode (120g), the second auxiliary electrode (120r), and the third auxiliary electrode (120b) can connect the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b) to the corresponding driving circuit (103) through the through hole (114) of the protective layer (110), respectively. The plurality of auxiliary electrodes (120g, 120r, 120b) can be used to apply power or signals to the plurality of subpixels (SPg, SPr, SPb) or as pads or terminals for inspection.

[0114] As described above, the auxiliary electrodes (120g, 120b, 120r) can electrically connect the driving circuit (103) and the anode electrodes (141g, 141r, 141b) of the organic light-emitting element (140g, 140r, 140b). For example, the auxiliary electrodes (120g, 120b, 120r) can be formed as a single layer such as Ti or Mo to improve the characteristics of contact resistance. For example, the auxiliary electrodes (120g, 120b, 120r) can have an oxide film such as ITO or IZO formed on the single layer such as Ti or Mo for processability and reliability. For example, the auxiliary electrodes (120g, 120b, 120r) can have a dual structure of ITO / (Ti or Mo). For example, the auxiliary electrode (120g, 120b, 120r) may have a triple structure of (Ti or Mo) / ITO / (Ti or Mo).

[0115] Meanwhile, in the blue subpixel (SPb), the third auxiliary electrode (120b) may replace the third anode electrode (141b). In this case, the third anode electrode (141b) may be omitted in the blue subpixel (SPb). That is, the third auxiliary electrode (120b) is required to have a low connection resistance with the drain electrode of the driving transistor of the driving circuit (103), excellent reflective performance, or be suitable for the Work Function value (>4.8 eV) of the third anode electrode (141b). In this case, only the first anode electrode (141g) of the green organic light-emitting element (140g) and the second anode electrode (141r) of the red organic light-emitting element (140r) may be formed. For example, after the first anode electrode (141g) of the green organic light-emitting element (140g), the second anode electrode (141r) of the red organic light-emitting element (140r), and the third anode electrode (141b) of the blue organic light-emitting element (140b) are formed, the third anode electrode (141b) can be removed.

[0116] The first three-dimensional structure (130-1) may be disposed on the first auxiliary electrode (120g), and the second three-dimensional structure (130-2) may be disposed on the second auxiliary electrode (120r). A portion of the end of the first auxiliary electrode (120g) may be electrically connected to the first anode electrode (141g) disposed in the green subpixel (SPg) on ​​the first side (130-1a) of the first three-dimensional structure (130-1). A portion of the end of the second auxiliary electrode (120r) may be electrically connected to the second anode electrode (141r) disposed in the red subpixel (SPr) on the first side (130-2a) of the second three-dimensional structure (130-2).

[0117] The first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may be formed of an inorganic film or an organic resin. The first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may also be formed of a double structure of an organic resin on an inorganic film. The organic resin may be a black resin, but is not limited thereto. When a black resin is used as the organic resin, external or internal light is absorbed by the black resin, so the image quality, such as contrast characteristics and color spots due to light leakage, can be improved.

[0118] The selection of these materials may be based on the height of the first three-dimensional structure (130-1) and / or the second three-dimensional structure (130-2) according to the resolution and the width of the lower surface of the first three-dimensional structure (130-1) and / or the second three-dimensional structure (130-2). Materials that are easy to process may be selected.

[0119] Meanwhile, the organic light-emitting display device (100A) according to the first embodiment may include a first insulating layer (150), a second insulating layer (160), a third insulating layer (170), etc. The first insulating layer (150) may be made of an inorganic material, the second insulating layer (160) may be made of an organic material, and the third insulating layer (170) may be made of an inorganic material, but is not limited thereto.

[0120] The first insulating layer (150) may be disposed on the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b). That is, the first insulating layer (150) may be disposed on the side surfaces (130-1a, 130-1b) and the upper surface (130T) of the first three-dimensional structure (130-1), the side surfaces (130-2a, 130-2b) and the upper surface (130T) of the second three-dimensional structure (130-2), and the separation region (105). Since the first insulating layer (150) has a relatively thin thickness, it may be formed to be curved according to the shape of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2).

[0121] The second insulating layer (160) may be disposed on the first insulating layer (150) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). The second insulating layer (160) may be disposed on the upper surfaces (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). That is, the second insulating layer (160) may cover the first insulating layer (150) disposed on the upper surfaces (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). Since the second insulating layer (160) requires a thick thickness, it may be formed of an organic material that is easy to form a thick thickness during the process. The second insulating layer (160) may be a planarizing layer that makes the upper surface (130T) flat so that the formation of the third insulating layer (170) is easy.

[0122] The third insulating layer (170) can be placed on the second insulating layer (160).

[0123] The first insulating layer (150), the second insulating layer (160), and the third insulating layer (170) can serve to prevent the penetration of oxygen, moisture, etc., and to cushion impacts. Since the first insulating layer (150) and the third insulating layer (170) are made of an inorganic material, the penetration of oxygen or moisture can be completely blocked.

[0124] At least one layer may be added on the third insulating layer (170). For example, a planarization layer, an anti-reflection layer, a PSA layer, a cover film, etc. may be placed on the third insulating layer (170).

[0125] The substrate (101) described above may be a silicon substrate on which a plurality of driving circuits (103) are formed using a semiconductor process. Alternatively, a glass substrate or a plastic substrate may be used. In addition, organic light-emitting display devices manufactured using various materials, structures, methods, processes, etc. may be obtained.

[0126] According to an embodiment, a green subpixel (SPg), a red subpixel (SPr), and a blue subpixel (SPb) may be respectively disposed on the side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1), the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2), and the separation area (105) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). Accordingly, the light-emitting area of ​​each of the green subpixel (SPg) and the red subpixel (SPr) may be maintained or expanded, but the occupied area may be reduced, so that a high-definition and high-resolution display may be implemented.

[0127] Fig. 6 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment.

[0128] The second embodiment is identical to the first embodiment (Fig. 5) except that the third insulating layer (170) is in contact with the upper surface (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). In the second embodiment, components having the same structure, shape, and / or function as those of the first embodiment are given the same drawing reference numerals, and a detailed description thereof is omitted.

[0129] The organic light emitting display device illustrated in FIG. 6 is the organic light emitting display device illustrated in FIGS. 2 and 3, wherein the side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1) and the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2) can be inclined with respect to the substrate (101).

[0130] Referring to FIG. 6, the organic light emitting display device (100B) according to the second embodiment may include a substrate (101), a plurality of driving circuits (103), a protective layer (110), a plurality of auxiliary electrodes (120g, 120r, 120b), etc. The organic light emitting display device (100B) according to the second embodiment may include a first three-dimensional structure (130-1), a second three-dimensional structure (130-2), a green organic light emitting element (140g), a red organic light emitting element (140r), a blue organic light emitting element (140b), etc. The organic light emitting display device (100B) according to the second embodiment may include a first insulating layer (150), a second insulating layer (160), a third insulating layer (170), etc.

[0131] The green organic light-emitting element (140g) may be disposed on the first side (130-1a) of the first three-dimensional structure (130-1), and the red organic light-emitting element (140r) may be disposed on the first side (130-2a) of the second three-dimensional structure (130-2). The blue organic light-emitting element (140b) may be disposed on the separation region (105) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). The green organic light-emitting element (140g) may be disposed in the green subpixel (SPg), the red organic light-emitting element (140r) may be disposed in the red subpixel (SPr), and the blue organic light-emitting element (140b) may be disposed in the blue subpixel (SPb). One pixel (P) may be configured by the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb).

[0132] The side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1) and the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2) may be inclined with respect to the substrate (101). For example, the average wall angle (θa) may be 60 degrees or more and less than 90 degrees.

[0133] The third insulating layer (170) can be in contact with the upper surface (130T) of the first three-dimensional structure (130-1). The third insulating layer (170) can be in contact with the upper surface (130T) of the second three-dimensional structure (130-2).

[0134] The second embodiment may be a modified embodiment of the first embodiment (Fig. 5). That is, according to the first embodiment (Fig. 5), a green organic light-emitting layer (142G), a red organic light-emitting layer (142R), a blue organic light-emitting layer (142B), a cathode electrode (143), a first insulating layer (150), and a second insulating layer (160) may be formed on the upper surface (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). Thereafter, the second insulating layer (160), the first insulating layer (150), the cathode electrode (143), the green organic light-emitting layer (142G), the red organic light-emitting layer (142R), and the blue organic light-emitting layer (142B) formed on the upper surfaces (130T) of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may be removed, so that the upper surface (130T) of the first three-dimensional structure (130-1) and the upper surfaces (130T) of the second three-dimensional structure (130-2) may be exposed. Thereafter, a third insulating layer (170) may be formed on the upper surface (130T) of the first three-dimensional structure (130-1), the upper surface (130T) of the first three-dimensional structure (130-1), and the second insulating layer (160) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). Accordingly, as in the second embodiment, the third insulating layer (170) can be in contact with the upper surface (130T) of the first three-dimensional structure (130-1) and the upper surface (130T) of the second three-dimensional structure (130-2).

[0135] Although not shown, a charge generation layer (CGL) common to the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb) may be formed on the upper surface (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). In this case, the charge generation layer (CGL) on the upper surface (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) is removed, thereby disconnecting the charge generation layer (CGL) of the green subpixel (SPg) and the charge generation layer (CGL) of the red subpixel (SPr), thereby preventing lateral current leakage between the respective subpixels.

[0136] Fig. 7 is a cross-sectional view illustrating an organic light-emitting display device according to a third embodiment.

[0137] The third embodiment is identical to the first embodiment (Fig. 5) or the second embodiment (Fig. 6) except that the side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1) and the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2) are perpendicular to the substrate (101). In the third embodiment, components having the same structure, shape, and / or function as those of the first embodiment (Fig. 5) or the second embodiment (Fig. 6) are given the same drawing reference numerals and a detailed description thereof is omitted.

[0138] The organic light-emitting display device illustrated in FIG. 7 is the organic light-emitting display device illustrated in FIG. 4, wherein the side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1) and the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2) can be perpendicular to the substrate (101).

[0139] Referring to FIG. 7, an organic light-emitting display device (100C) according to a third embodiment may include a substrate (101), a plurality of driving circuits (103), a protective layer (110), a plurality of auxiliary electrodes (120g, 120r, 120b), etc. The organic light-emitting display device (100C) according to the third embodiment may include a first three-dimensional structure (130-1), a second three-dimensional structure (130-2), a green organic light-emitting element (140g), a red organic light-emitting element (140r), a blue organic light-emitting element (140b), etc. The organic light-emitting display device (100C) according to the third embodiment may include a first insulating layer (150), a second insulating layer (160), a third insulating layer (170), etc.

[0140] The green organic light-emitting element (140g) may be disposed on the first side (130-1a) of the first three-dimensional structure (130-1), and the red organic light-emitting element (140r) may be disposed on the first side (130-2a) of the second three-dimensional structure (130-2). The blue organic light-emitting element (140b) may be disposed on the separation region (105) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). The green organic light-emitting element (140g) may be disposed in the green subpixel (SPg), the red organic light-emitting element (140r) may be disposed in the red subpixel (SPr), and the blue organic light-emitting element (140b) may be disposed in the blue subpixel (SPb). One pixel (P) may be configured by the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb).

[0141] The side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1) and the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2) may be perpendicular to the substrate (101). For example, the average wall angle (θa) may be 90 degrees. A green organic light-emitting element (140g) may be disposed on the first side surface (130-1a) of the first three-dimensional structure (130-1), and a red organic light-emitting element (140r) may be disposed on the first side surface (130-2a) of the second three-dimensional structure (130-2). Since the side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1) and the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2) are perpendicular to the substrate (101), the occupied area of ​​the green organic light-emitting element (140g) and the occupied area of ​​the red organic light-emitting element (140r) are minimized when viewed from the front, so that an ultra-high-resolution display can be implemented.

[0142] Since the average wall angle (θa) is 90 degrees, in the blue common structure, the blue organic light-emitting layer (142B) may not be formed on the side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1) or the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2), or may be formed with a very thin thickness. Accordingly, the blue organic light-emitting layer (142B), which should not affect the light emission of each of the green subpixel (SPg) and the red subpixel (SPr), may not be formed or may be formed with a minimal thickness, thereby preventing defects due to deterioration in color purity or color staining.

[0143] Fig. 8 is a cross-sectional view illustrating an organic light-emitting display device according to a fourth embodiment.

[0144] The fourth embodiment is identical to the first embodiment (Fig. 5) or the second embodiment (Fig. 6) except that the side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1) and the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2) are perpendicular to the substrate (101). In addition, the fourth embodiment is identical to the third embodiment (Fig. 7) except that the third insulating layer (170) contacts the upper surfaces (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). In the fourth embodiment, components having the same structure, shape, and / or function as those of the first to third embodiments (Figs. 5 to 7) are given the same drawing reference numerals and a detailed description thereof is omitted.

[0145] The organic light-emitting display device illustrated in FIG. 8 is the organic light-emitting display device illustrated in FIG. 4, wherein the side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1) and the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2) can be perpendicular to the substrate (101).

[0146] Referring to FIG. 8, an organic light-emitting display device (100D) according to a fourth embodiment may include a substrate (101), a plurality of driving circuits (103), a protective layer (110), a plurality of auxiliary electrodes (120g, 120r, 120b), etc. The organic light-emitting display device (100D) according to the fourth embodiment may include a first three-dimensional structure (130-1), a second three-dimensional structure (130-2), a green organic light-emitting element (140g), a red organic light-emitting element (140r), a blue organic light-emitting element (140b), etc. The organic light-emitting display device (100D) according to the fourth embodiment may include a first insulating layer (150), a second insulating layer (160), a third insulating layer (170), etc.

[0147] The green organic light-emitting element (140g) may be disposed on the first side (130-1a) of the first three-dimensional structure (130-1), and the red organic light-emitting element (140r) may be disposed on the first side (130-2a) of the second three-dimensional structure (130-2). The blue organic light-emitting element (140b) may be disposed on the separation region (105) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). The green organic light-emitting element (140g) may be disposed in the green subpixel (SPg), the red organic light-emitting element (140r) may be disposed in the red subpixel (SPr), and the blue organic light-emitting element (140b) may be disposed in the blue subpixel (SPb). One pixel (P) may be configured by the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb).

[0148] The third insulating layer (170) can be in contact with the upper surface (130T) of the first three-dimensional structure (130-1). The third insulating layer (170) can be in contact with the upper surface (130T) of the second three-dimensional structure (130-2).

[0149] The fourth embodiment may be a modified embodiment of the third embodiment (Fig. 7). According to the third embodiment (Fig. 7), a green organic light-emitting layer (142G), a red organic light-emitting layer (142R), a blue organic light-emitting layer (142B), a cathode electrode (143), a first insulating layer (150), and a second insulating layer (160) may be formed on the upper surface (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). Thereafter, the second insulating layer (160), the first insulating layer (150), the cathode electrode (143), the green organic light-emitting layer (142G), the red organic light-emitting layer (142R), and the blue organic light-emitting layer (142B) formed on the upper surfaces (130T) of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may be removed, so that the upper surface (130T) of the first three-dimensional structure (130-1) and the upper surface (130T) of the second three-dimensional structure (130-2) may be exposed. Thereafter, a third insulating layer (170) may be formed on the upper surface (130T) of the first three-dimensional structure (130-1), the upper surface (130T) of the first three-dimensional structure (130-1), and the second insulating layer (160) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). Accordingly, as in the second embodiment, the third insulating layer (170) can be in contact with the upper surface (130T) of the first three-dimensional structure (130-1) and the upper surface (130T) of the second three-dimensional structure (130-2).

[0150] Although not shown, a charge generation layer (CGL) common to the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb) may be formed on the upper surface (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). In this case, the charge generation layer (CGL) on the upper surface (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) is removed, thereby disconnecting the charge generation layer (CGL) of the green subpixel (SPg) and the charge generation layer (CGL) of the red subpixel (SPr), thereby preventing lateral current leakage between the respective subpixels.

[0151] Meanwhile, the organic light-emitting display device according to the first to fourth embodiments (FIGS. 5 to 8) may include a first anode separation structure (180-1) and a second anode separation structure (180-2). That is, two anode separation structures (180-1, 18-2) may be provided in one pixel (P).

[0152] The first anode separation structure (180-1) may be provided along the perimeter of the first three-dimensional structure (130-1). The first anode separation structure (180-1) may be positioned between the green subpixel (SPg) and the blue subpixel (SPb). The first anode separation structure (180-1) may be positioned on the lower side of the first three-dimensional structure (130-1) between the green subpixel (SPg) and the red subpixel (SPr). The second anode separation structure (180-2) may be provided along the perimeter of the second three-dimensional structure (130-2). The second anode separation structure (180-2) may be positioned between the red subpixel (SPr) and the blue subpixel (SPb). The second anode separation structure (180-2) may be positioned on the lower side of the second three-dimensional structure (130-2) between the red subpixel (SPr) and the blue subpixel (SPb).

[0153] For example, during a deposition process for forming an anode electrode, the first anode electrode (141g) of the green organic light-emitting element (140g) and the third anode electrode (141b) of the blue organic light-emitting element (140b) may be disconnected by the first anode separation structure (180-1). For example, during a deposition process, the second anode electrode (141r) of the red organic light-emitting element (140r) and the third anode electrode (141b) of the blue organic light-emitting element (140b) may be disconnected by the second anode separation structure (180-2). Accordingly, a separate pattern process is not required to separate the first anode electrode (141g) and the third anode electrode (141b) or to separate the second anode electrode (141r) and the third anode electrode (141b), so that defects due to the pattern process can be prevented, the process can be simplified, and costs can be reduced.

[0154] For example, a green subpixel (SPg), a blue subpixel (SPb), and a red subpixel (SPr) may be arranged in the order of a first direction (X), and a charge generation layer (CGL) may be formed in common on the green subpixel (SPg), the blue subpixel (SPb), and the red subpixel (SPr). In this case, lateral current leakage (LCL) may occur between the green organic light-emitting element (140g) on ​​the green subpixel (SPg), the red organic light-emitting element (140r) on the red subpixel (SPr), and the blue organic light-emitting element (140b) on the blue subpixel (SPb) through the charge generation layer (CGL). However, according to an embodiment, the charge generation layer (CGL) commonly formed in the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb) may be isolated by each of the first anode separation structure (180-1) and the second anode separation structure (180-2). That is, the charge generation layer (CGL) positioned between the green subpixel (SPg) and the blue subpixel (SPb) may be isolated by the first anode separation structure (180-1). The charge generation layer (CGL) positioned between the red subpixel (SPr) and the blue subpixel (SPb) may be isolated by the second anode separation structure (180-2). Therefore, the transverse current leakage between the green organic light-emitting device (140g), the red organic light-emitting device (140r), and the blue organic light-emitting device (140b) can be prevented by the charge generation layer (CGL) commonly formed in the green organic light-emitting device (140g), the red organic light-emitting device (140r), and the blue organic light-emitting device (140b).

[0155] The first anode separation structure (180-1) and the second anode separation structure (180-2) will be described in detail later with reference to FIGS. 15 to 18.

[0156] Meanwhile, in the embodiment, the anode electrode (141g, 141r, 141b) may be formed of a transparent conductive film or a reflective film. The transparent conductive film may be formed to a thickness of less than 50 nanometers using a sputtering method using a transparent conductive material (TCO) that can transmit light, such as ITO or IZO. A metal film may also be formed on the transparent conductive film using electroplating.

[0157] According to an embodiment, the thickness of the transparent conductive film of the anode electrode (141g, 141r, 141b) may be thinly formed to within 50 nanometers, or the anode electrode (141g, 141r, 141b) may be connected to the auxiliary electrode (120g, 120b, 120r) and the side surface (130-1a, 130-1b, 130-2a, 130-2b) of the three-dimensional structure (130-1, 130-2), thereby forming a structure with no steps in the first place. Alternatively, an anode separation structure (180-1, 180-2) may be provided. Accordingly, point defects due to short circuits between the anode electrode (141g, 141r, 141b) and the cathode electrode (143) or leakage current between pixels (P) (or subpixels) can be prevented without forming a bank such as a PDL (Pixel define layer).

[0158] Fig. 9a is a cross-sectional view illustrating a laminated structure for each organic light-emitting element according to the first embodiment. Fig. 9b is a cross-sectional view illustrating a laminated structure for each organic light-emitting element according to the second embodiment.

[0159] The green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b) may be configured as a single stack (Fig. 9a) or as a tandem structure including two stacks (ST1, ST2) (Fig. 9b). Although not shown, they may also be configured as three or more stacks.

[0160] As illustrated in FIG. 9a, the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b) may each be configured as one stack including one green organic light-emitting layer (G-EML), one red organic light-emitting layer (R-EML), and one blue organic light-emitting layer (B-EML).

[0161] The green organic light-emitting element (140g) may include a green organic light-emitting layer (G-EML) between the first anode electrode (141g) and the cathode electrode. The red organic light-emitting element (140r) may include a red organic light-emitting layer (R-EML) between the second anode electrode (141r) and the cathode electrode. The blue organic light-emitting element (140b) may include a blue organic light-emitting layer (B-EML) between the third anode electrode (141b) and the cathode electrode.

[0162] The green organic light-emitting device (140g), the red organic light-emitting device (140r), and the blue organic light-emitting device (140b) may each include a hole injection layer (HIL), a hole transport layer (HTL), an organic light-emitting layer (EML), an electron transport layer (ETL), an electron injection layer, etc. In addition, the green organic light-emitting device (140g), the red organic light-emitting device (140r), and the blue organic light-emitting device (140b) may each include at least one electron blocking layer (EBL). A capping layer (CPL) may be formed on the cathode electrode in each of the green organic light-emitting device (140g), the red organic light-emitting device (140r), and the blue organic light-emitting device (140b). The hole injection layer (HIL), hole transport layer (HTL), electron transport layer (ETL), electron injection layer, cathode electrode, and capping layer (CPL) may also be commonly included in the green organic light-emitting device (140g), the red organic light-emitting device (140r), and the blue organic light-emitting device (140b).

[0163] The cathode electrode can be formed of a transparent conductive film, a semi-transparent film, a reflective film, etc. The semi-transparent film can be formed by depositing an alloy of magnesium (Mg) and silver (Ag) (Mg:Ag) to a thickness of 20 nanometers or less. The semi-transparent film can be composed of two layers. That is, the semi-transparent film can include a first layer including a Mg:Ag alloy and a second layer including a transparent conductive material (TCO) such as ITO or IZO on the first layer. When the cathode electrode is formed only of a transparent film, the transparent film can be formed only of a transparent conductive film including a transparent conductive material (TCO).

[0164] When voltage is applied to the first anode electrode (141g) and cathode electrode of the green organic light-emitting element (140g), holes and electrons move to the green organic light-emitting layer (G-EML) through the hole transport layer (HTL) and the electron transport layer (ETL), and the holes and electrons can combine with each other in the green organic light-emitting layer (G-EML) to emit light. Similarly, the red organic light-emitting element (140r) and the blue organic light-emitting element (140b) can also emit light through the combination of holes and electrons.

[0165] In the blue common structure, the blue organic light-emitting layer (B-EML) can be commonly included not only in the blue organic light-emitting element (140b), but also in the green organic light-emitting element (140g) and the red organic light-emitting element (140r).

[0166] As illustrated in FIG. 9b, the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b) may each be configured with two stacks (ST1, ST2) including two organic light-emitting layers. The green organic light-emitting element (140g) may be configured with two stacks (ST1, ST2) including two green organic light-emitting layers (G-EML1, G-EML2) between the first anode electrode (141g) and the cathode electrode. The red organic light-emitting element (140r) may be configured with two stacks (ST1, ST2) including two red organic light-emitting layers (R-EML1, R-EML2) between the second anode electrode (141r) and the cathode electrode. The blue organic light-emitting element (140b) may be composed of two stacks (ST1, ST2) including two blue organic light-emitting layers (B-EML1, B-EML2) between the third anode electrode (141b) and the cathode electrode.

[0167] The green organic light-emitting device (140g), the red organic light-emitting device (140r), and the blue organic light-emitting device (140b) may each include a hole injection layer (HIL), two hole transport layers (HTL1, HTL2), two electron transport layers (ETL1, ETL2), and two electron blocking layers (EBL1, EBL2), etc. A capping layer (CPL) may be formed on the cathode electrode in each of the green organic light-emitting device (140g), the red organic light-emitting device (140r), and the blue organic light-emitting device (140b). The hole injection layer (HIL), the hole transport layers (HTL1, HTL2), the electron transport layers (ETL1, ETL2), the electron blocking layers (EBL1, EBL2), and the capping layer (CPL) may also be commonly included in the green organic light-emitting device (140g) and the red organic light-emitting device (140r).

[0168] In particular, a charge generation layer may be formed between the first stack (ST1) and the second stack (ST2) in the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b). For example, the charge generation layer may include a first charge generation layer formed adjacent to the first stack (ST1), that is, an n-type charge generation layer (n-CGL), and a second charge generation layer formed between the first charge generation layer and the second stack (ST2), that is, a p-type charge generation layer (p-CGL). The n-type charge generation layer (n-CGL) may inject electrons into the first stack (ST1), and the p-type charge generation layer (p-CGL) may inject holes into the second stack (ST2). The n-type charge generation layer (n-CGL) may be formed of an organic layer doped with an alkali metal such as Li, Yb, Na, K, or Cs, or an alkaline earth metal such as Mg, Sr, Ba, or Ra. The p-type charge generation layer (p-CGL) may be formed by doping a hole transport layer (HTL2) with a dopant.

[0169] As described above, since the charge generation layer is made of a low-resistance material and is formed in common in the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b), transverse current leakage may occur between the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb). As will be described later, by disconnecting the charge generation layer positioned between the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb), transverse current leakage between each subpixel can be prevented.

[0170] Meanwhile, in the blue common structure, two blue organic light-emitting layers (B-EML1, B-EML2) may be commonly included in the green organic light-emitting element (140g) and the red organic light-emitting element (140r). The first blue organic light-emitting layer (B-EML1) may be positioned below the first stack (ST1), and the second blue organic light-emitting layer (B-EML2) may be positioned between the first stack (ST1) and the second stack (ST2).

[0171] Fig. 10a illustrates a deposition system according to an embodiment. Fig. 10b illustrates a blue organic light-emitting layer, a red organic light-emitting layer, and a green organic light-emitting layer being deposited on a substrate.

[0172] Although the top of the three-dimensional structure is depicted as a vertex in FIG. 10b, it may have a top surface as illustrated in FIGS. 5 to 8. Although the drawing shows seven chambers (CH1 to CH7), more chambers may be provided.

[0173] As illustrated in FIGS. 5 to 8, 9a, 10a, and 10b, the deposition system according to the embodiment can operate in an in-line manner. That is, as the substrate (101) passes through the first chamber (CH1) to the seventh chamber (CH7) in one direction, a green organic light-emitting element (140g), a red organic light-emitting element (140r), and a blue organic light-emitting element (140b) can be formed on the substrate (101). That is, as the substrate (101) is transported, the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b) can be deposited on the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb) on the substrate (101).

[0174] The first chamber (CH1) can deposit a hole injection layer (HIL) and / or a hole transport layer (HTL) on the substrate (101). The hole injection layer (HIL) and the hole transport layer (HTL) may each be deposited in separate chambers. The second chamber (CH2) can deposit a blue organic light-emitting layer (B-EML) on the substrate (101). The third chamber (CH3) can deposit a red organic light-emitting layer (R-EML) on the substrate (101). The fourth chamber (CH4) can deposit a green organic light-emitting layer (G-EML) on the substrate (101). The fifth chamber (CH5) can deposit an electron transport layer (ETL) on the substrate (101). The sixth chamber (CH6) can deposit an electron injection layer (EIL) and / or a cathode electrode on the substrate (101). The electron injection layer (EIL) and the cathode electrode can be deposited in separate chambers. The seventh chamber (CH7) can deposit a capping layer (CPL) on the substrate (101).

[0175] As illustrated in FIG. 9b, when the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b) are each configured as two stacks (ST1, ST2), separate chambers, the second chamber (CH2) to the fourth chamber (CH4), may be additionally arranged between the fourth chamber (CH4) and the fifth chamber (CH5). In this case, as the substrate (101) passes through the second chamber (CH2) to the fourth chamber (CH4), the first stack (ST1) including each of the first blue organic light-emitting layer (B-EML1), the first red organic light-emitting layer (R-RML1), and the first green organic light-emitting layer (G-EML1) may be formed on the substrate (101). Thereafter, a charge generation layer (CGL) and a second stack (ST2) may be formed on the first stack by passing through separate chambers, the second chamber (CH2) to the fourth chamber (CH4), in which the substrate (101) is additionally placed. The second stack (ST2) may include a second blue organic light-emitting layer (B-EML1), a second red organic light-emitting layer (R-RML2), and a second green organic light-emitting layer (G-EML2), respectively. Accordingly, each of the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b) may have a tandem structure including the first stack (ST1) and the second stack (ST2). The first blue organic light-emitting layer (B-EML1) and the second blue organic light-emitting layer (B-EML1) can be commonly deposited on the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b), respectively.

[0176] As illustrated in FIGS. 10A and 10B, the substrate (101) can be moved from left to right over the first evaporation source (251), the second evaporation source (252), and the third evaporation source (253). The first evaporation source (251) may be provided in the second chamber (CH2), the second evaporation source (252) may be provided in the third chamber (CH3), and the third evaporation source (253) may be provided in the fourth chamber (CH4). The first evaporation source (251) may discharge a blue organic light-emitting material, the second evaporation source (252) may discharge a red organic light-emitting material, and the third evaporation source (253) may discharge a green organic light-emitting material. The first evaporation source (251) may discharge the blue organic light-emitting material in a vertical direction toward the substrate (101). The second evaporation source (252) can discharge the red organic light-emitting material in a first diagonal direction toward the substrate (101). The third evaporation source (253) can discharge the green organic light-emitting material in a second diagonal direction toward the substrate (101). The first diagonal direction and the second diagonal direction can be symmetrical with respect to the normal direction.

[0177] Meanwhile, a first three-dimensional structure (130-1) and a second three-dimensional structure (130-2) may be provided on the substrate (101). As described above, a separation region (105) may be defined on the substrate (101) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2).

[0178] After the substrate (101) is turned over so that the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) face the first evaporation source (251), the second evaporation source (252), and the third evaporation source (253), the substrate (101) can be transferred to each of the first chamber (CH1), the second chamber (CH2), and the third chamber (CH3).

[0179] When the substrate (101) passes through the first chamber (CH1), the blue organic light-emitting material vertically discharged from the first evaporation source (251) can be deposited on the entire area of ​​the substrate (101). That is, it can be deposited on the side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1), the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2), and the separation area (105). A blue organic light-emitting layer (B-EML) can be formed by the blue organic light-emitting material deposited on the separation area (105).

[0180] When the substrate (101) passes through the second chamber (CH2), the red organic light-emitting material discharged in the first diagonal direction from the second evaporation source (252) can be deposited on the exposed area on the substrate (101). That is, the red organic light-emitting material can be deposited only on the second side (130-1b) of the first three-dimensional structure (130-1) and the first side (130-2a) of the second three-dimensional structure (130-2). A red organic light-emitting layer (R-EML) can be formed by the red organic light-emitting material deposited on each of the second side (130-1b) of the first three-dimensional structure (130-1) and the first side (130-2a) of the second three-dimensional structure (130-2). Since the red organic light-emitting material that has advanced in the first diagonal direction is blocked by the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2), the red organic light-emitting material is not deposited on the first side (130-1a) of the first three-dimensional structure (130-1) and the separation region (105).

[0181] When the substrate (101) passes through the third chamber (CH3), the green organic light-emitting material discharged in the second diagonal direction from the third evaporation source (253) can be deposited on the exposed area on the substrate (101). That is, the green organic light-emitting material can be deposited only on the first side (130-1a) of the first three-dimensional structure (130-1) and the second side (130-2b) of the second three-dimensional structure (130-2). A green organic light-emitting layer (G-EML) can be formed by the green organic light-emitting material deposited on each of the first side (130-1a) of the first three-dimensional structure (130-1) and the second side (130-2b) of the second three-dimensional structure (130-2). Since the green organic light-emitting material that has advanced in the second diagonal direction is blocked by the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2), the green organic light-emitting material is not deposited on the first side (130-2a) of the second three-dimensional structure (130-2) and the separation region (105).

[0182] Accordingly, as the substrate (101) passes through the second chamber (CH2) and the third chamber (CH3), the blue organic light-emitting material can be deposited on the entire area of ​​the substrate (101) including the separation area (105), the red organic light-emitting material can be deposited only on the first side (130-2a) of the second three-dimensional structure (130-2), and the green organic light-emitting material can be deposited only on the first side (130-1a) of the first three-dimensional structure (130-1).

[0183] According to an embodiment, a blue light-emitting organic light-emitting layer (EML), a red organic light-emitting layer (R-EML), and a green organic light-emitting layer (G-EML) can be formed through an in-line deposition system without using a separate deposition pattern mask such as an FMM. Therefore, since a separate deposition pattern mask such as an FMM is not used, a high-definition (e.g., 500 PPI or higher) display or a large-area (e.g., 8th generation or higher) display can be implemented. Since a separate deposition pattern mask such as an FMM is not used, manufacturing costs can be significantly reduced. Since a separate deposition pattern mask such as an FMM is not used, yield can be improved and product life can be extended through optimization of deposition.

[0184] Meanwhile, as shown in FIGS. 5 to 8 and FIG. 10b, the average wall angle (θa) of the substrate (101) and the three-dimensional structure (130-1, 130-2) The size can be determined by the selection of the material of the three-dimensional structure (130-1, 130-2), the equipment for forming the three-dimensional structure (130-1, 130-2), or the process conditions. In order to ensure uniform image quality within the screen and prevent color stains, the shape of the three-dimensional structure (130-1, 130-2) or the manufacturing method or process conditions for uniformly forming the side surfaces (130-1a, 130-1b, 130-2a, 130-2b) of the three-dimensional structure (130-1, 130-2) need to be optimized.

[0185] The angle of the side surfaces (130-1a, 130-1b, 130-2a, 130-2b) of the three-dimensional structure (130-1, 130-2) and the anode electrode (141g, 141r, 141b) relative to the substrate (101) affects the formation of the organic light-emitting element (142G, 142R, 142B) and may affect the final image quality. Therefore, the selection of this angle may be a key success factor (KSF) in the process and product design stages.

[0186] Meanwhile, as illustrated in Fig. 10b, the deposition angle (θe) of the green organic light-emitting material discharged from the third evaporation source (253) can be expressed by mathematical formula 1. The structure of the third evaporation source (253) can vary depending on the design of the deposition angle (θe).

[0187] [Mathematical Formula 1]

[0188]

[0189] The deposition angle (θe) may be an angle for depositing a green organic light-emitting material only on a specific area of ​​the first three-dimensional structure (130-1) or the second three-dimensional structure (130-2) by utilizing the shadow effect of the first three-dimensional structure (130-1) or the second three-dimensional structure (130-2) on the substrate (101).

[0190] TS represents the distance between the substrate (101) and the third evaporation source (253), and Offset may represent the shortest distance at which the green organic light-emitting material discharged from the third evaporation source (253) is deposited on the substrate (101).

[0191] Mathematical expression 1 can also be applied equally to the deposition angle of the red organic light-emitting material discharged from the second evaporation source (252).

[0192] Meanwhile, as illustrated in FIG. 10c, the deposition angle (θe) for accommodating the green organic light-emitting material discharged from the third evaporation source (253) in a specific area of ​​the first three-dimensional structure (130-1) or the second three-dimensional structure (130-2) on the substrate (101) can be expressed by mathematical expression 2. The structure of the pixel (P) on the substrate (101) can vary depending on the design of the deposition angle (θe).

[0193] [Equation 2]

[0194]

[0195] W1 may represent the width of the first three-dimensional structure (130-1) or the second three-dimensional structure (130-2), W2 may represent the width of the separation area (105), and H may represent the height of the first three-dimensional structure (130-1) or the second three-dimensional structure (130-2).

[0196] From mathematical expression 2, the maximum deposition angle (θe) can increase as the height (H) of the first three-dimensional structure (130-1) or the second three-dimensional structure (130-2) increases. From mathematical expression 2, the maximum deposition angle (θe) can increase as the width (W1) of the first three-dimensional structure (130-1) or the second three-dimensional structure (130-2) or the width (W2) of the separation region (105) decreases.

[0197] Mathematical expression 2 can also be applied equally to the deposition angle of the red organic light-emitting material discharged from the second evaporation source (252).

[0198] Meanwhile, as shown in FIG. 10b, a blue organic light-emitting material discharged from the first evaporation source (251) can be deposited on the entire area of ​​the substrate (101), thereby forming a blue organic light-emitting layer (B-EML).

[0199] The thickness of the blue organic light-emitting layer (B-EML) can vary among the blue subpixel (SPb), the green subpixel (SPg), and the red subpixel (SPr). That is, the thickness of the blue organic light-emitting layer (B-EML) can vary among the blue subpixel (SPb), the green subpixel (SPg), and the red subpixel (SPr) depending on the average wall angle (θa).

[0200] Theoretically, when the average wall angle (θa) is 90 degrees, i.e., when the green subpixel (SPg) or the red subpixel (SPr) is perpendicular to the substrate (101), the blue organic light-emitting layer (B-EML) may not be formed on the green subpixel (SPg) or the red subpixel (SPr). In addition, if the blue organic light-emitting material discharged from the first evaporation source (251) moves straight at the same angle, the blue organic light-emitting layer (B-EML) may not be formed on the green subpixel (SPg) or the red subpixel (SPr) that is perpendicular to the substrate (101).

[0201] However, since the blue organic light-emitting material emitted from the first evaporation source (251) travels straight at unequal angles, a blue organic light-emitting layer (B-EML) can be formed on the green subpixel (SPg) or the red subpixel (SPr) even if the green subpixel (SPg) or the red subpixel (SPr) is perpendicular to the substrate (101). The thickness of the blue organic light-emitting layer (B-EML) can be expressed by mathematical expression 3.

[0202] [Equation 3]

[0203] T WS = T BS cos (θa - θb)

[0204] T WS may represent the thickness of a blue organic light-emitting layer (B-EML) formed on a green subpixel (SPg) or a red subpixel (SPr). T BS may represent the thickness of a blue organic light-emitting layer (B-EML) formed on a blue subpixel (SPb). Θa represents an average wall value, and θb may represent a correction angle considering the structure of the first evaporation source (251), particularly the evaporation characteristics.

[0205] The smaller the compensation angle (θb), the thicker the blue organic light-emitting layer (B-EML) formed on the green subpixel (SPg) or red subpixel (SPr) (T WS) can be reduced. For example, when the correction angle (θb) is 0, the thickness (T) of the blue organic light-emitting layer (B-EML) formed on the green subpixel (SPg) or the red subpixel (SPr) WS ) can be 0. This may mean that no blue organic light-emitting layer (B-EML) is formed on the green subpixel (SPg) or the red subpixel (SPr).

[0206] For example, when the green subpixel (SPg) or the red subpixel (SPr) is perpendicular to the substrate (101) and the correction angle (θb) is about 10 degrees, the thickness of the blue organic light-emitting layer (B-EML) formed on the green subpixel (SPg) and / or the red subpixel (SPr) may be 17.4% of the thickness of the blue organic light-emitting layer (B-EML) formed on the blue subpixel (SPb). In this case, when the thickness of the blue organic light-emitting layer (B-EML) formed on the blue subpixel (SPb) is 20 nm, the thickness of the blue organic light-emitting layer (B-EML) formed on the green subpixel (SPg) and / or the red subpixel (SPr) is 3.5 nm, which may be ignored. That is, even if a 3.5 nm blue organic light-emitting layer (B-EML) is formed on a green subpixel (SPg) and / or a red subpixel (SPr), it does not affect the luminance of the green light emitted from the green subpixel (SPg) or the red light emitted from the red subpixel (SPr).

[0207] According to the embodiment, since the blue organic light-emitting layer (EML) is deposited over the entire area of ​​the substrate (101), there is no need to use a deposition pattern mask such as an FMM to deposit it only in a specific area.

[0208] In addition, as described above, by using the SAD method and the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2), only a green organic light-emitting layer (G-EML) can be formed in the green subpixel (SPg) and only a red organic light-emitting layer (R-EML) can be formed in the red subpixel (SPr) without using a deposition pattern mask such as an FMM.

[0209] Fig. 11 is a flowchart showing a method for manufacturing an organic light-emitting display device according to the first embodiment. Figs. 12a to 12n are cross-sectional views showing a method for manufacturing an organic light-emitting display device according to the first embodiment. Using Figs. 11 to 12n, a method for manufacturing an image display device (Figs. 7 and 8) having a first three-dimensional structure (130-1) and a second three-dimensional structure (130-2) having an average wall angle (θa1, θa2) of 90 degrees will be described. However, the manufacturing methods illustrated in Figs. 11 and 12n can also be equally applied to an image display device (Figs. 5 and 6) having a first three-dimensional structure (130-1) and a second three-dimensional structure (130-2) having an average wall angle (θa1, θa2) of less than 90 degrees.

[0210] As shown in Fig. 12a, a plurality of driving circuits (103) can be formed on a substrate (101) (step A1).

[0211] A plurality of driving circuits (103) may be arranged spaced apart from each other. The driving circuits (103) may be formed for each subpixel, but are not limited thereto. The driving circuits (103) may include a plurality of transistors formed using a semiconductor process and at least one capacitor. The transistors may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material.

[0212] As shown in Fig. 12b, after a protective layer (110) is formed on a plurality of driving circuits (103), a through hole (114) can be formed in the protective layer (110) (step A2).

[0213] The protective layer (110) may be formed as a single film or multiple films made of an inorganic material. The protective layer (110) may include a polymer resin layer. A through hole (114) may be formed through the protective layer (110) so that the drain electrode of the driving transistor of the driving circuit (103) is exposed.

[0214] For example, when a polymer resin layer is formed on a plurality of driving circuits (103), a first through-hole may be formed in the polymer resin layer. Thereafter, an inorganic film may be formed on the polymer resin layer, and then a second through-hole having a larger diameter than the first through-hole may be formed in the inorganic film. The second through-hole may be connected to the first through-hole. A through-hole (114) may be formed by the first through-hole and the second through-hole. In this case, the protective layer (110) may be formed by the polymer resin layer and the inorganic film.

[0215] As shown in Fig. 12c, a plurality of auxiliary electrodes (120g, 120r, 120b) can be formed on the protective layer (110) (step A3).

[0216] A plurality of auxiliary electrodes (120g, 120r, 120b) may be formed by being deposited and patterned using a sputtering process. The plurality of auxiliary electrodes (120g, 120r, 120b) may be formed for each subpixel. The width of the third auxiliary electrode (120b) may be larger than the width of the first auxiliary electrode (120g) or the width of the second auxiliary electrode (120r), but is not limited thereto. The plurality of auxiliary electrodes (120g, 120r, 120b) may be arranged to be spaced apart from each other. The plurality of auxiliary electrodes (120g, 120r, 120b) may each vertically overlap the plurality of driving circuits (103). A plurality of auxiliary electrodes (120g, 120r, 120b) can be electrically connected to the drain electrode of each driving transistor of each of the plurality of driving circuits (103) through the through hole (114) of the protective layer (110).

[0217] As illustrated in FIG. 12d, a first three-dimensional structure (130-1) and a second three-dimensional structure (130-2) can be formed on the first auxiliary electrode (120g) and the second auxiliary electrode (120r) (step A4).

[0218] For example, a first three-dimensional structure (130-1) may be formed on a first auxiliary electrode (120g), and a second three-dimensional structure (130-2) may be formed on a second auxiliary electrode (120r). No three-dimensional structure is formed on a third auxiliary electrode (120b). The area on the third auxiliary electrode (120b) may be defined as a separation area (105).

[0219] For example, a green subpixel (SPg) may be defined on a first side (130-1a) of a first three-dimensional structure (130-1), a red subpixel (SPr) may be defined on a first side (130-2a) of a second three-dimensional structure (130-2), and a blue subpixel (SPb) may be defined in a separation region (105). As will be described later, a green organic light-emitting element (140g in FIG. 12k) may be arranged on the green subpixel (SPg), a red organic light-emitting element (140r) may be arranged on the red subpixel (SPr), and a blue organic light-emitting element (140b) may be arranged on the blue subpixel (SPb).

[0220] The first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may be formed of an acrylic or polyimide resin. The first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may also be formed of an inorganic material for a high-resolution product. When the resolution of the product is 300 ppi or less, an organic material may be applied onto a substrate using a printing technique, precisely aligned and transferred onto the substrate, and patterned through a step of ultraviolet or thermal curing. Accordingly, the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may be formed.

[0221] As illustrated in FIG. 12e, a plurality of auxiliary electrodes (120g, 120r, 120b) can be patterned using the three-dimensional structure (130-1, 130-2) as a mask (step A5).

[0222] Depending on the type and structure of the auxiliary electrode (120g, 120b, 120r) or the design of the anode separation structure (180-1, 180-2 in Fig. 12f), patterning can be performed using wet etching, dry etching, or a combination of the two. In addition, an ashing process can be added after patterning.

[0223] When the auxiliary electrodes (120g, 120b, 120r) are formed of multiple metal films and the multiple metal films are patterned, the ends of the multiple metal films may be positioned differently depending on the material or etching characteristics of the multiple metal films. That is, the ends of some of the multiple metal films may protrude further outward than the ends of the other metal films. This will be described in detail with reference to FIGS. 17a and 17b.

[0224] As shown in FIG. 12f, multiple anode separation structures (180-1, 180-2) can be formed (step A6).

[0225] For example, the first anode separation structure (180-1) may be formed along the perimeter of the first three-dimensional structure (130-1), and the second anode separation structure (180-2) may be formed along the perimeter of the second three-dimensional structure (130-2).

[0226] The anode separation structure may mean a plurality of disconnection structures configured to self-align and electrically disconnect the anode electrode or charge generation layer (CGL) by using an undercut structure formed in the protective layer (110), but is not limited thereto.

[0227] Therefore, since the anode electrode is formed in a disconnected manner for each subpixel (SPg, SPr, SPb) without a separate patterning process, the manufacturing process can be simplified and the manufacturing cost can be reduced. In addition, patterning defects of the anode electrode in high definition or high resolution can be fundamentally prevented. In addition, since the charge generation layer (CGL) commonly formed in a plurality of subpixels (SPg, SPr, SPb) is disconnected for each subpixel (SPg, SPr, SPb), lateral current leakage between each subpixel can be prevented.

[0228] The method of forming the anode separation structure will be described in detail later with reference to FIGS. 16 to 17g.

[0229] As illustrated in FIG. 12g, anode electrodes (141g, 141r, 141b) may be formed on a substrate (101) provided with a first three-dimensional structure (130-1) and a second three-dimensional structure (130-2). In this case, the anode electrodes (141g, 141r, 141b) may be separated by subpixels (SPg, SPr, SPb) by a plurality of anode separation structures (180-1, 180-2) (step A7). That is, the anode electrodes (141g, 141r, 141b) are formed only in the corresponding subpixels (SPg, SPr, SPb), and are not formed between the subpixels (SPg, SPr, SPb).

[0230] The anode electrode (141g, 141r, 141b) may include a transparent conductive film, but is not limited thereto. The anode electrode (141g, 141r, 141b) may include a single metal film such as Ni, Au, etc., or a multi-metal film such as Ni / Au. The third auxiliary electrode (120b) on the blue subpixel (SPb) may be formed of a multi-film to secure reflectivity, such as ITO / Ag alloy / Ti.

[0231] Meanwhile, in order to prevent the anode electrodes (141g, 141r, 141b) from being formed on the upper surfaces (130T) of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) respectively, a photoresist pattern may be formed on the upper surfaces (130T) of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) prior to the film formation process, but this is not limited thereto.

[0232] As shown in FIG. 12h, FIG. 12i, and FIG. 12j, a blue organic light-emitting layer (142B), a red organic light-emitting layer (142R), and a green organic light-emitting layer (142G) can be sequentially deposited on a substrate (101) (step A8).

[0233] Specifically, as illustrated in FIG. 12h, the blue organic light-emitting layer (142B) can be deposited on the entire area of ​​the substrate (101) using the first evaporation source (251 in FIG. 10b) of the second chamber (CH2 in FIG. 10a). That is, the blue organic light-emitting layer (142B) can be formed in the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb). The blue organic light-emitting layer (142B) can be formed on the anode electrodes (141g, 141r, 141b) in the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb). In addition, before the blue organic light-emitting layer (142B) is formed, a hole injection layer (HIL) and a hole transport layer (HTL) can be formed on the anode electrode (141g, 141r, 141b) using each evaporation source of the first chamber (CH1).

[0234] Even if the hole injection layer (HIL), the hole transport layer (HTL), and the blue organic light-emitting layer (142B) are deposited over the entire area of ​​the substrate (101), the hole injection layer (HIL), the hole transport layer (HTL), and the blue organic light-emitting layer (142B) can be separated and disconnected between the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb) by the first anode separation structure (180-1) and the second anode separation structure (180-2).

[0235] In order to prevent defects such as color purity and color spots, it is very important to control the thickness of the blue organic light-emitting layer (142B) on the green subpixel (SPg) or the red subpixel (SPr). The green subpixel (SPg) can emit green light, the red subpixel (SPr) can emit red light, and the blue subpixel (SPb) can emit blue light. In this case, the blue organic light-emitting layer (142B) on the green subpixel (SPg) or the red subpixel (SPr) is preferably removed because it interferes with the emission of green or red light.

[0236] However, as shown in mathematical expression 3, even if the side surfaces (130-1a, 130-1b) of the first three-dimensional structure (130-1) or the side surfaces (130-2a, 130-2b) of the second three-dimensional structure (130-2) are perpendicular to the substrate (101), since the blue organic light-emitting material emitted from the first evaporation source (251) travels at unequal angles, the blue organic light-emitting layer (142B) is likely to be formed on the green subpixel (SPg) or the red subpixel (SPr). In the embodiment, by minimizing the correction angle (θb) considering the structure of the first evaporation source (251), particularly the evaporation characteristics, the thickness of the blue organic light-emitting layer (142B) formed on the green subpixel (SPg) or the red subpixel (SPr) can be reduced. Even if a blue organic light-emitting layer (142B) is formed on a green subpixel (SPg) or a red subpixel (SPr), the thickness of the blue organic light-emitting layer (142B) can be managed so as not to affect the brightness of color light emitted from the green subpixel (SPg) or the red subpixel (SPr).

[0237] To this end, the average wall angle (θa) is optimized within a range of 60 to 90 degrees, so that the thickness of the blue organic light-emitting layer (142B) on the green subpixel (SPg) or the red subpixel (SPr) can be managed to be 5% to 60% of the thickness of the blue organic light-emitting layer (142B) formed on the blue subpixel (SPb).

[0238] As illustrated in FIG. 12i, a red organic light-emitting layer (142R) may be deposited on the substrate (101). The red organic light-emitting layer (142R) may be deposited on the first side (130-2a) of the second three-dimensional structure (130-2) using the second evaporation source (252 in FIG. 10b) of the third chamber (CH3 in FIG. 10a). The red organic light-emitting layer (142R) may be deposited on the second side (130-1b) of the first three-dimensional structure (130-1) and the blue organic light-emitting layer (142B) on the first side (130-2a) of the second three-dimensional structure (130-2). At this time, due to the shadow effect in which the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) act as a shield, the red organic light-emitting material is not formed on the first side (130-1a) of the first three-dimensional structure (130-1), the second side (130-2b) of the second three-dimensional structure (130-2), and the separation area (105).

[0239] Therefore, the red organic light-emitting layer (142R) can be selectively deposited on a specific region, i.e., the second side (130-1b) of the first three-dimensional structure (130-1) or the first side (130-2a) of the second three-dimensional structure (130-2), using the SAD method without using a deposition pattern mask such as FMM.

[0240] As illustrated in FIG. 12j, a green organic light-emitting layer (142G) can be deposited on the substrate (101). The green organic light-emitting layer (142G) can be deposited on the first side (130-1a) of the first three-dimensional structure (130-1) using the third evaporation source (253 in FIG. 10b) of the fourth chamber (CH4 in FIG. 10a). The green organic light-emitting layer (142G) can be deposited on the blue organic light-emitting layer (142B) on the first side (130-1a) of the first three-dimensional structure (130-1) and the second side (130-2b) of the second three-dimensional structure (130-2). At this time, due to the shadow effect in which the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) act as a shield, the green organic light-emitting material is not formed on the second side (130-1b) of the first three-dimensional structure (130-1), the first side (130-2a) of the second three-dimensional structure (130-2), and the separation area (105).

[0241] Therefore, the green organic light-emitting layer (142G) can be selectively deposited on a specific region, i.e., the first side (130-1a) of the first three-dimensional structure (130-1) or the second side (130-2b) of the second three-dimensional structure (130-2), using the SAD method without using a deposition pattern mask such as FMM.

[0242] Thereafter, an electron transport layer (ETL) and an electron injection layer (EIL) can be formed using each evaporation source of the fifth chamber (CH5) and the sixth chamber (CH6).

[0243] As illustrated in FIG. 12k, a cathode electrode (143) may be formed on an organic light-emitting layer (142) (step A9). The cathode electrode (143) may be formed by sputtering a transparent conductive film, such as ITO or IZO, using a sputtering process. The cathode electrode (143) may be formed by depositing a metal film, such as magnesium (Mg) or silver (Ag), using a vacuum deposition method.

[0244] The cathode electrode (143) can be commonly connected to a plurality of sub-pixels (SPg, SPr, SPb). The cathode electrode (143) must not be disconnected by the anode separation structure (180-1, 180-2). In the case of a vacuum deposition method, the step coverage for the cathode electrode (143) is not good, so the deposition angle of the evaporation source needs to be optimized so that the cathode electrode (143) is not disconnected by the anode separation structure (180-1, 180-2). In addition, the disconnection of the cathode electrode (143) can be prevented by ensuring that the undercut structure included in the anode separation structure (180-1, 180-2) does not exceed a predetermined height.

[0245] Meanwhile, a green organic light-emitting element (140g), a red organic light-emitting element (140r), and a blue organic light-emitting element (140b) may be formed in each of a green subpixel (SPg), a red subpixel (SPr), and a blue subpixel (SPb) through the deposition process illustrated in FIGS. 12g to 12k. The green organic light-emitting element (140g) may include a green organic light-emitting layer (142G), the red organic light-emitting element (140r) may include a red organic light-emitting layer (142R), and the blue organic light-emitting element (140b) may include a blue organic light-emitting layer (142B). The first anode electrode (141g), the second anode electrode (141r), and the third anode electrode (141b) may be independently included in the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b), respectively, and the cathode electrode (143) may be commonly included in the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b).

[0246] As illustrated in FIG. 12l, a first insulating layer (150) can be formed on a green organic light-emitting element (140g), a red organic light-emitting element (140r), and a blue organic light-emitting element (140b) (step A10).

[0247] A first insulating layer (150) may be formed on the cathode electrode (143) of each of the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b). The first insulating layer (150) may prevent oxygen or moisture from penetrating into the blue organic light-emitting layer (142B), the green organic light-emitting layer (142G), and the blue organic light-emitting layer (142B).

[0248] The first insulating layer (150) may be formed of an inorganic film. For example, a silicon oxide film or a silicon nitride film formed by a PECVD method may be formed as the inorganic film. The first insulating layer (150) may include films formed by an ALD (Atomic Layer Deposition) method (e.g., a SiNx film, a SiOx film, or an Al2O3 film). The first insulating layer (150) may include a double film of a film formed by an ALD method and a film formed by a PECVD method. The first insulating layer (150) may include a double film of a film formed by a PECVD method on films formed by an ALD method.

[0249] As shown in FIG. 12m, a second insulating layer (160) can be formed on the first insulating layer (150) (step A11).

[0250] The second insulating layer (160) may be formed on the first insulating layer (150) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). The second insulating layer (160) may be formed of an organic material that can easily form a thick thickness, but is not limited thereto. The second insulating layer (160) may be formed using an inkjet method, but is not limited thereto.

[0251] As shown in FIG. 12n, a third insulating layer (170) can be formed on the second insulating layer (160) (step A12).

[0252] The third insulating layer (170) may be formed of an inorganic film. The third insulating layer (170) may be formed of the same material as the first insulating layer (150), but is not limited thereto.

[0253] The organic light emitting display device (third embodiment) illustrated in FIG. 7 can be manufactured by the manufacturing method of FIGS. 12a to 12n.

[0254] Fig. 13 is a flowchart showing a method for manufacturing an organic light-emitting display device according to a second embodiment. Figs. 14a to 14d are cross-sectional views showing a method for manufacturing an organic light-emitting display device according to a second embodiment.

[0255] A method for manufacturing an image display device (Figs. 7 and 8) having a first three-dimensional structure (130-1) and a second three-dimensional structure (130-2) having an average wall angle (θa1, θa2) of 90 degrees is described using Figs. 13 to 14d. However, the manufacturing method illustrated in Figs. 13 to 14d can be equally applied to an image display device (Figs. 5 and 6) having a first three-dimensional structure (130-1) and a second three-dimensional structure (130-2) having an average wall angle (θa1, θa2) of less than 90 degrees.

[0256] Steps A1 to A10 in FIG. 13 are the same as steps A1 to A10 illustrated in FIGS. 11 to 12l, so detailed descriptions are omitted.

[0257] As illustrated in Fig. 14a, a first insulating layer (150) can be formed on a green organic light-emitting element (140g), a red organic light-emitting element (140r), and a blue organic light-emitting element (140b) (step A10).

[0258] As shown in Fig. 14b, a second insulating layer (160) can be formed on the first insulating layer (150) (step A11).

[0259] A second insulating layer (160) can be formed on the first insulating layer (150) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2).

[0260] Unlike FIG. 12m, the upper surface of the second insulating layer (160) illustrated in FIG. 14b may be positioned lower than at least the upper surface (130T) of the first three-dimensional structure (130-1) or the second three-dimensional structure (130-2). The upper surface of the second insulating layer (160) may be positioned higher than the upper end of the first anode electrode (141g) on ​​the first side (130-1a) of the first three-dimensional structure (130-1). The upper surface of the second insulating layer (160) may be positioned higher than the upper end of the second anode electrode (141r) on the first side (130-2a) of the second three-dimensional structure (130-2).

[0261] For this purpose, in the case of an inkjet process, the amount of dotting and the amount of shrinkage after vacuum drying may be considered. In addition, a material may be selected that takes into account the surface energy between the first insulating layer (150) and the second insulating layer (160).

[0262] As illustrated in Fig. 14c, the first insulating layer (150), the cathode electrode (143), the green organic light-emitting layer (142G), the red organic light-emitting layer (142R), and the blue organic light-emitting layer (142B) on the upper surface (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) can be removed (step A111).

[0263] In the dry etching process, the amount of ashing and the selection of the gas available for each material are important, and the first to blue organic light-emitting elements (140b) should not be damaged in the dry etching process.

[0264] When removing the first insulating layer (150), cathode electrode (143), etc., the second insulating layer (160) can be used as a stopper. That is, the first insulating layer (150), cathode electrode (143), green organic light-emitting layer (142G), red organic light-emitting layer (142R), and blue organic light-emitting layer (142B) can each be removed up to the upper surface of the second insulating layer.

[0265] By removing the first insulating layer (150), the cathode electrode (143), the green organic light-emitting layer (142G), the red organic light-emitting layer (142R), and the blue organic light-emitting layer (142B) which are higher than the upper surface of the second insulating layer, the upper surface (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) can be exposed. Accordingly, the transverse current leakage between the green subpixel (SPg) on ​​the first side (130-1a) of the first three-dimensional structure (130-1) and the red subpixel (SPr) on the second side (130-1b) can be prevented. The transverse current leakage between the red subpixel (SPr) on the first side (130-2a) of the second three-dimensional structure (130-2) and the green subpixel (SPg) on ​​the second side (130-2b) can be prevented. In particular, in the tandem structure of two stacks, the charge generation layer on the upper surface (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) is removed, thereby preventing transverse current leakage between the green subpixel (SPg) and the red subpixel (SPr) through the charge generation layer.

[0266] At least one of the first insulating layer (150), the cathode electrode (143), the green organic light-emitting layer (142G), the red organic light-emitting layer (142R), and the blue organic light-emitting layer (142B) that has been removed may be positioned lower than the upper surface (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). With this structure, the organic light-emitting layers (142G, 142R, 142B) on adjacent subpixels (SPg, SPr) are completely disconnected, so that lateral current leakage can be more reliably prevented.

[0267] As shown in Fig. 14d, a third insulating layer (170) can be formed on the substrate (101) (step A12).

[0268] A third insulating layer may be formed on the second insulating layer (160) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). A third insulating layer (170) may be formed on the upper surface (130T) of each of the exposed first three-dimensional structure (130-1) and the second three-dimensional structure (130-2).

[0269] Not only is the organic light-emitting layer (EML) between adjacent subpixels (SPg, SPr) on the upper surfaces (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) completely disconnected, but also the third insulating layer (170) is in contact with the upper surfaces (130T) of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2), so that lateral current leakage can be prevented even more completely.

[0270] The organic light-emitting display device (fourth embodiment) illustrated in FIG. 8 can be manufactured by the manufacturing method of FIGS. 14a to 14d.

[0271] Meanwhile, as shown in FIG. 14c, transverse current leakage can be prevented without removing all of the layers on the upper surfaces of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2), such as the second insulating layer (160), the first insulating layer (150), the green organic light-emitting layer (142G), the red organic light-emitting layer (142R), and the blue organic light-emitting layer (142B).

[0272] Specifically, as illustrated in FIG. 12m, a second insulating layer (160) may be formed on the first insulating layer (150). Thereafter, the second insulating layer (160), the first insulating layer (150), the green organic light-emitting layer (142G), the red organic light-emitting layer (142R), and the blue organic light-emitting layer (142B) may be locally removed on the upper surfaces of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2), respectively, so that the upper surfaces of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may be exposed. Accordingly, the second insulating layer (160), the first insulating layer (150), the green organic light-emitting layer (142G), the red organic light-emitting layer (142R), and the blue organic light-emitting layer (142B) on the upper surfaces of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) may have a structure that is separated from each other. Accordingly, the path through which leakage current flows between the green subpixel (SPg) and the red subpixel (SPr) on the upper surfaces of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) is eliminated, thereby preventing lateral current leakage.

[0273] According to an embodiment, since the leakage current path between all subpixels (SPg, SPr, SPb) is blocked by the anode separation structure (180-1, 180-2) and the separation structure on the three-dimensional structure (130-1, 130-2), the transverse leakage current can be completely prevented.

[0274] Thereafter, a third insulating layer (170) may be formed on the second insulating layer (160). In this case, the third insulating layer (170) may be in contact with the etched cross-sections of each of the second insulating layer (160), the first insulating layer (150), the green organic light-emitting layer (142G), the red organic light-emitting layer (142R), and the blue organic light-emitting layer (142B), and may be in contact with the upper surface of the first three-dimensional structure (130-1) and the upper surface of the second three-dimensional structure (130-2). The green organic light-emitting layer (142G), the red organic light-emitting layer (142R), and the blue organic light-emitting layer (142B) may each have a structure in which they are separated by the third insulating layer (170).

[0275] Fig. 15 is a cross-sectional view illustrating the X area of ​​Fig. 7 in detail. Referring to Fig. 15, the first anode separation structure (180-1) and the second anode separation structure (180-2) will be described in detail.

[0276] As illustrated in FIG. 15, a green subpixel (SPg) may be defined on a first side (130-1a) of a first three-dimensional structure (130-1), a red subpixel (SPr) may be defined on a first side (130-2a) of a second three-dimensional structure (130-2), and a blue subpixel (SPb) may be defined on a separation region (105). The green subpixel (SPg) may include a green organic light-emitting element (140g), the red subpixel (SPr) may include a red organic light-emitting element (140r), and the blue subpixel (SPb) may include a blue organic light-emitting element (140b). One pixel (P) may be configured by the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb).

[0277] A first anode separation structure (180-1) may be arranged along the perimeter of the first three-dimensional structure (130-1). The first anode separation structure (180-1) may be arranged on the lower side of the first three-dimensional structure (130-1) between the green subpixel (SPg) and the blue subpixel (SPb). The first anode separation structure (180-1) may be arranged on the lower side of the first three-dimensional structure (130-1) between the green organic light-emitting element (140g) and the blue organic light-emitting element (140b).

[0278] The first anode separation structure (180-1) may include a first undercut structure (1810) and a first disconnection structure (1820).

[0279] The first undercut structure (1810) can be formed such that the end of at least one insulating film (112) among the plurality of insulating films (111 to 113) constituting the protective layer (110) is positioned inward from the first side (130-1a) of the first three-dimensional structure (130-1).

[0280] The first disconnection structure (1820) may disconnect the green subpixel (SPg) and the blue subpixel (SPb) by the first undercut structure (1810). The first disconnection structure (1820) may include a first-first disconnection structure (1821), a first-second disconnection structure (1822), a first-third disconnection structure (1823), etc.

[0281] The first-first disconnection structure (1821) can disconnect the first anode electrode (141g) of the green organic light-emitting element (140g) and the third anode electrode (141b) of the blue organic light-emitting element (140b) between the green subpixel (SPg) and the blue subpixel (SPb). During the anode electrode forming process, at least one metal film can be formed on the substrate (101). In this case, at least one metal film can be disconnected between the green subpixel (SPg) and the blue subpixel (SPb) by the first undercut structure (1810). Accordingly, the first anode electrode (141g) can be formed in the green subpixel (SPg), and the third anode electrode (141b) can be formed in the blue subpixel (SPb).

[0282] Meanwhile, as illustrated in FIGS. 9A and 9B, a common layer may be formed in common for the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b). For example, in FIG. 9A, the common layer may include a hole injection layer (HIL), a hole transport layer (HTL), an electron blocking layer (EBL), a blue organic light-emitting layer (142B), a charge generation layer (CGL), an electron transport layer (ETL), a cathode electrode (143), etc. For example, in FIG. 9B, the common layer may include a hole injection layer (HIL), a hole transport layer (HTL1, HTL2), an electron blocking layer (EBL1, EBL2), a blue organic light-emitting layer (142B), a charge generation layer (CGL), an electron transport layer (ETL1, ETL2), a cathode electrode (143), etc.

[0283] The blue organic light-emitting layer (142B) or the charge generation layer (CGL) must be disconnected between the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb) because it causes lateral current leakage. In contrast, the cathode electrode (143) is electrically connected in common to the green organic light-emitting element (140g), the red organic light-emitting element (140r), and the blue organic light-emitting element (140b), and therefore must not be disconnected between the green subpixel (SPg), the red subpixel (SPr), and the blue subpixel (SPb).

[0284] According to an embodiment, the blue organic light-emitting layer (142B), the charge generation layer (CGL), etc. may be disconnected between the green subpixel (SPg) and the blue subpixel (SPb) by the first undercut structure (1810).

[0285] The first-second disconnection structure (1822) can disconnect the blue organic light-emitting layer (142B) between the green subpixel (SPg) and the blue subpixel (SPb) by the first undercut structure (1810) and / or the gap between the first anode electrode (141g) and the third anode electrode (141b). The first-third disconnection structure (1823) can disconnect the charge generation layer (CGL) between the green subpixel (SPg) and the blue subpixel (SPb) by the first undercut structure (1810), the gap between the first anode electrode (141g) and the third anode electrode (141b) and / or the disconnected blue organic light-emitting layer (142B).

[0286] Accordingly, by disconnecting the blue organic light-emitting layer (142B) or charge generation layer (CGL) between the green subpixel (SPg) and the blue subpixel (SPb) by the first undercut structure (1810), etc., transverse current leakage between each subpixel can be prevented.

[0287] A second anode separation structure (180-2) may be arranged along the periphery of the second three-dimensional structure (130-2). The second anode separation structure (180-2) may be arranged on the lower side of the second three-dimensional structure (130-2) between the red subpixel (SPr) and the blue subpixel (SPb). The second anode separation structure (180-2) may be arranged on the lower side of the second three-dimensional structure (130-2) between the red organic light-emitting element (140r) and the blue organic light-emitting element (140b).

[0288] The second anode separation structure (180-2) may include a second undercut structure (1830) and a second disconnection structure (1840).

[0289] The second undercut structure (1830) can be formed such that the end of at least one insulating film (112) among the plurality of insulating films (111 to 113) constituting the protective layer (110) is positioned inward from the first side (130-2a) of the second three-dimensional structure (130-2).

[0290] The second disconnection structure (1840) may disconnect the red subpixel (SPr) and the blue subpixel (SPb) by the second undercut structure (1830). The second disconnection structure (1840) may include a second-first disconnection structure (1841), a second-second disconnection structure (1842), a second-third disconnection structure (1843), etc.

[0291] The second-first disconnection structure (1841) can disconnect the second anode electrode (141r) of the red organic light-emitting element (140r) and the third anode electrode (141b) of the blue organic light-emitting element (140b) between the red subpixel (SPr) and the blue subpixel (SPb). During the anode electrode forming process, at least one metal film can be formed on the substrate (101). In this case, at least one metal film can be disconnected between the red subpixel (SPr) and the blue subpixel (SPb) by the second undercut structure (1830). Accordingly, the second anode electrode (141r) can be formed in the green subpixel (SPg), and the third anode electrode (141b) can be formed in the blue subpixel (SPb).

[0292] According to an embodiment, a common layer, such as a blue organic light-emitting layer (142B), a charge generation layer (CGL), etc., may be disconnected between a red subpixel (SPr) and a blue subpixel (SPb) by a second undercut structure (1830).

[0293] The second-second disconnection structure (1842) can disconnect the blue organic light-emitting layer (142B) between the red subpixel (SPr) and the blue subpixel (SPb) by the second undercut structure (1830) and / or the gap between the second anode electrode (141r) and the third anode electrode (141b). The second-third disconnection structure (1843) can disconnect the charge generation layer (CGL) between the red subpixel (SPr) and the blue subpixel (SPb) by the second undercut structure (1830), the gap between the second anode electrode (141r) and the third anode electrode (141b) and / or the disconnected blue organic light-emitting layer (142B).

[0294] Accordingly, by disconnecting the blue organic light-emitting layer (142B) or charge generation layer (CGL) between the red subpixel (SPr) and the blue subpixel (SPb) by the second undercut structure (1830), etc., transverse current leakage between each subpixel can be prevented.

[0295] Meanwhile, the first anode separation structure (180-1) may include only the first undercut structure (1810), and the second anode separation structure (180-2) may include only the second undercut structure (1830). That is, the first disconnection structure (1820) may not be included in the first anode separation structure (180-1), and the second disconnection structure (1840) may not be included in the second anode separation structure (180-2).

[0296] Although not shown, a third auxiliary electrode (120b) may be positioned beneath the third anode electrode (141b). The third anode electrode (141b) may be removed, and the third auxiliary electrode (120b) may be brought into contact with the hole injection layer (HIL) in FIGS. 9A and 9B . In this case, the third auxiliary electrode (120b) may function as the third anode electrode (141b).

[0297] Meanwhile, the first auxiliary electrode (120g), the second auxiliary electrode (120r), and the third auxiliary electrode (120b) may each include a plurality of metal films (121a, 121b, 122a, 122b, 123a, 123b).

[0298] For example, the first metal film (121a, 121b) may be made of a metal material having excellent electrical contact characteristics with the driving circuit (103) and being easy to dry etch, such as Ti, Mo, etc. For example, the second metal film (122a, 122b) may be made of a metal material having excellent reflective characteristics and being easy to wet etch, such as Ag, Ag alloy, Al, etc. For example, the third metal film (123a, 123b) may be made of a transparent material having low contact resistance with the anode electrode (141g, 141r, 141b) and excellent process reliability, such as ITO, IZO, etc. For example, the third metal film (123a, 123b) may also be made of Mo, a MoTi alloy, Ti, etc.

[0299] The first auxiliary electrode (120g) may be placed under the first three-dimensional structure (130-1), and the second auxiliary electrode (120r) may be placed under the second three-dimensional structure (130-2).

[0300] At least one metal film (121a) among the plurality of metal films (121a, 122a, 123a) of the first auxiliary electrode (120g) may include a first protruding region (1211) that protrudes outward from the first side surface (130-1a) of the first three-dimensional structure (130-1) and contacts the first anode electrode (141g). In the first protruding region (1211), an end of one metal film (121a) of the first auxiliary electrode (120g) may protrude further outward than an end of the other metal films (122a, 123a).

[0301] At least one metal film (121b) among the plurality of metal films (121b, 122b, 123b) of the second auxiliary electrode (120r) may include a second protruding region (1212) that protrudes outward from the first side (130-2a) of the second three-dimensional structure (130-2) and contacts the second anode electrode (141r). The second protruding region (1212) may be such that an end of one metal film (121b) of the first auxiliary electrode (120g) protrudes further outward than an end of the other metal films (12b, 123b).

[0302] Fig. 16 is a flowchart showing a method for manufacturing an organic light-emitting display device according to a third embodiment. Figs. 17a to 17g are cross-sectional views showing a method for manufacturing an organic light-emitting display device according to a third embodiment. Figs. 17a to 17g illustrate a red subpixel (SPr) and a blue subpixel (SPb) in Fig. 15, but the same can be applied to a green subpixel (SPg).

[0303] Steps A1 to A4 in Fig. 16 are the same as steps A1 to A4 illustrated in Fig. 11, so detailed descriptions are omitted.

[0304] As illustrated in Fig. 17a, an auxiliary electrode (120r) can be patterned using a three-dimensional structure (130-2) (step A5).

[0305] Specifically, a protective layer (110) and an auxiliary electrode (120r) may be formed on a substrate (101), and a three-dimensional structure (130-2) may be formed on the auxiliary electrode (120r). The protective layer (110) may include a plurality of insulating films (111 to 113). The auxiliary electrode may include a plurality of metal films (121b, 122b, 123b).

[0306] Thereafter, the auxiliary electrode (120r) can be patterned using the three-dimensional structure (130-2) as a mask. In this case, the ends of the plurality of metal films (121b, 122b, 123b) can be positioned differently from each other. The third metal film (123b), the second metal film (122b), and the first metal film (121b) can be etched into various cross-sectional shapes depending on the etching characteristics of the materials.

[0307] For example, the third metal film and the second metal film may be etched, while the first metal film may not be. Accordingly, the third metal film and the second metal film may be over-etched under the three-dimensional structure (130-2).

[0308] Step A6 in Fig. 16 is a step of forming an anode separation structure, which is described in detail with reference to Figs. 17b to 17g.

[0309] As illustrated in Fig. 17b, the width or height of the three-dimensional structure (130-2) may be reduced through an ashing process or dry etching (step A61). Accordingly, the over-etched third metal film and the second metal film may be exposed. The first metal film may include a protruding region (1212) that protrudes outward from the side surfaces (130-1a, 130-1b, 130-2a, 130-2b) of the three-dimensional structure (130-2). The protruding region (1212) may protrude within approximately 2 micrometers from the side surfaces (130-1a, 130-1b, 130-2a, 130-2b) of the three-dimensional structure (130-2).

[0310] The etched side surfaces (130-1a, 130-1b, 130-2a, 130-2b) of the third metal film and the second metal film of the auxiliary electrode (120r) can be positioned on the same vertical line within an error range of approximately several hundred nanometers.

[0311] As illustrated in Fig. 17c, a plurality of insulating films (111 to 113) of the protective layer (110) can be patterned (step A62). For example, dry etching can be performed using the first metal film of the auxiliary electrode (120r) as a mask, so that the third insulating film (113) and the second insulating film (112) of the protective layer (110) can be patterned.

[0312] The dry etching characteristics of the first insulating film (111), the second insulating film (112), and the third insulating film (113) may be different. For example, while the dry etching characteristics of the second insulating film (112) and the third insulating film (113) are very excellent, the first insulating film (111) may not be patterned by dry etching. For example, an HF series may be used as the etching solution, but this is not limited thereto.

[0313] For example, the first insulating film (111) and the third insulating film (113) may be silicon nitride films, and the second insulating film (112) may be silicon oxide films, but this is not a limitation. In the film formation step of the first insulating film (111), the second insulating film (112), and the third insulating film (113), the ratio of silicon and nitrogen, the ratio of silicon and oxygen, the density of the film, etc. may be optimized, and in the dry etching step, the type and composition ratio of the dry etching gas may be optimized.

[0314] As illustrated in FIG. 17d, dry etching may be performed continuously so that the second insulating film (112) may be patterned (step A63). By additional dry etching, the first insulating film (111) and the third insulating film (113) may not be patterned, and the second insulating film (112) may be patterned. Accordingly, an undercut structure (1830) may be formed in which the end of the second insulating film (112) is positioned inward from the side surfaces (130-1a, 130-1b, 130-2a, 130-2b) of the three-dimensional structure (130-2).

[0315] Meanwhile, the third insulating film (113) may be omitted, and a double structure of the second insulating film (112) and the first insulating film (111) may be formed. In this case, the first insulating film (111) may include a resin film, and the second insulating film (112) may include an inorganic film such as a silicon nitride film or a silicon oxide film. Accordingly, the undercut structure (1830) can be easily formed by utilizing the high etching selectivity of the resin film and the inorganic film. In the case where the first insulating film (111) is a resin film, the etching selectivity can be further increased by utilizing the fact that the resin film is difficult to etch with a wet etching solution, thereby facilitating structure formation.

[0316] As illustrated in Fig. 17e, an anode electrode (141r, 141b) may be formed on the substrate (101) (step A7). A green anode electrode (142g in Fig. 15) may also be formed on the substrate (101).

[0317] At least one metal film may be formed on the substrate (101). In this case, a second-first disconnection structure (1841) may be formed by the undercut structure (1830). At least one metal film may be disconnected between the red subpixel (SPr) and the blue subpixel (SPb) by the second-first disconnection structure (1841) to separate the red subpixel (SPr) and the blue subpixel (SPb) into a second anode electrode (141r) and a third anode electrode (141b). The second anode electrode (141r) may be formed on the red subpixel (SPr) on the side surface (130-2a) of the three-dimensional structure (130-2), and the third anode electrode (141b) may be formed on the blue subpixel (SPb) on the separation region (105).

[0318] Since the thickness of at least one metal film is very small, less than 50 nm, the height (182) of the undercut structure (1830) is not reduced by the anode electrode (141r, 141b), and the anode electrode (141r, 141b) can be prevented from being connected without being separated.

[0319] According to the embodiment, since anode electrodes (141r, 141b) are formed separately from each other without a separate additional process through FMM, etc., the manufacturing process can be simplified and the manufacturing cost can be reduced.

[0320] Meanwhile, the second anode electrode (141r) may be electrically connected to the protruding region (1212) of the first metal film (121b) of the auxiliary electrode (120r). That is, the second anode electrode (141r) may be in contact with the upper surface and the side surface of the protruding region (1212) and may be in contact with the side surfaces of the second metal film (122b) and the third metal film (123b), respectively. Accordingly, the contact area between the second anode electrode (141r) and the auxiliary electrode (120r) is maximized, so that the voltage or current supply characteristics may be improved, and thus the electrical / optical characteristics may be enhanced.

[0321] The third anode electrode (141b) may be removed, and an auxiliary electrode (not shown) positioned below the third anode electrode (141b) may serve as the third anode electrode (141b).

[0322] As illustrated in FIG. 17f, a red organic light-emitting layer (142R) and a blue organic light-emitting layer (142B) may be deposited on the anode electrodes (141r, 141b) (step A8). Although not illustrated, a green organic light-emitting layer (142G) may also be deposited on the green anode electrode (141g in FIG. 15).

[0323] The organic light-emitting layer (142R) illustrated in FIG. 17f may be an organic light-emitting layer (R-EML1, R-EML2) of a two-stack structure illustrated in FIG. 9b.

[0324] As illustrated in FIG. 9B, the red organic light-emitting layer (142R) and the blue organic light-emitting layer (142B) may each have a tandem structure including a first stack (ST1), a charge generation layer (CGL), and a second stack (ST2).

[0325] For example, a first stack (ST1) of a blue organic light-emitting layer (142B) may be deposited on a red subpixel (SPr) and a blue subpixel (SPb), and a first stack (ST1) of a red organic light-emitting layer (142R) may be deposited on a red subpixel (SPr). Thereafter, a charge generation layer (CGL) may be deposited on the red subpixel (SPr) and the blue subpixel (SPb). Thereafter, a second stack (ST2) of a blue organic light-emitting layer (142B) may be deposited on the red subpixel (SPr) and the blue subpixel (SPb), and a second stack (ST2) of a red organic light-emitting layer (142R) may be deposited on the red subpixel (SPr).

[0326] In this case, a second-second disconnection structure (1842) may be formed in which the first stack (ST1) of the blue organic light-emitting layer (142B) is disconnected between the red subpixel (SPr) and the blue subpixel (SPb) by an undercut structure (1830) or the like. A second-third disconnection structure (1843) may be formed in which the charge generation layer (CGL) is disconnected between the red subpixel (SPr) and the blue subpixel (SPb) by an undercut structure (1830) or the like. A second disconnection structure (1840) may be formed by the second-first disconnection structure (1841), the second-second disconnection structure (1842), and the second-third disconnection structure (1843).

[0327] The disconnection of the second anode electrode (141r) and the third anode electrode (141b), the disconnection of the first stack (ST1) of the blue organic light-emitting layer (142B), and the disconnection of the charge generation layer (CGL) can be made at the same location. That is, these disconnections can be made at a location adjacent to the undercut structure (1830) or diagonally from the undercut structure (1830).

[0328] Meanwhile, the organic deposition films constituting the red organic light-emitting layer (142R) or the blue organic light-emitting layer (142B) do not have good step coverage characteristics. However, the embodiment can take advantage of the poor step coverage characteristics of the organic deposition films. That is, since the step coverage characteristics of the organic deposition films are poor, even if the organic deposition films are deposited, the materials of the organic deposition films do not penetrate into the undercut structure (1830). Accordingly, since the first stack (ST1) or the charge generation layer (CGL) of the blue organic light-emitting layer (142B) is disconnected at the entrance of the undercut structure (1830), the influence of the lateral current leakage on the adjacent subpixels (SPr, SPb) is minimized, so that the picture quality can be clearer and the brightness can be improved.

[0329] As shown in Fig. 17g, a cathode electrode (143) can be formed (step A9).

[0330] Figure 18 illustrates the height and depth of the undercut structure in the anode separation structure according to the embodiment.

[0331] As shown in FIG. 18, in order for the cathode electrode (143) common to all subpixels (SPg, SPr, SPb of FIG. 15) to be disconnected (or separated), the second anode electrode (141r) and the third anode electrode (141b) between the red subpixels (SPr) to be disconnected (or separated), the first blue organic light-emitting layer (B-EML1) to be disconnected (or separated), and the charge generation layer (CGL) to be disconnected (or separated), mathematical expression 4 must be satisfied.

[0332] [Equation 4]

[0333] Thickness (184) of the third anode electrode (141b) + thickness (185) of the first stack (ST1) + thickness (186) of the charge generation layer (CGL) 〈 Height (182) of the undercut structure (1830) 〈 Thickness (184) of the third anode electrode (141b) + total thickness (187) of the blue organic light-emitting layer (142B)

[0334] The height (182) of the undercut structure (1830) may be greater than at least the sum of the thickness (184) of the third anode electrode (141b) (or the second anode electrode (141r)), the thickness (185) of the first stack (ST1), and the thickness (186) of the charge generation layer (CGL). The height (182) of the undercut structure (1830) may be less than the sum of the thickness (184) of the third anode electrode (141b) (or the second anode electrode (141r)) and the total thickness (187) of the blue organic light-emitting layer (142B). The total thickness (187) of the blue organic light-emitting layer (142B) may be the total thickness of all organic light-emitting layers included in the blue organic light-emitting layer (142B) illustrated in FIG. 9B.

[0335] Meanwhile, the depth (183) of the undercut structure (1830) may be more than twice the height (182) of the undercut structure (1830) in consideration of process deviation.

[0336] For example, as illustrated in FIG. 9b, in a structure having a tandem structure of two stacks, the height (182) and depth (183) of the undercut structure (1830) can be calculated as follows.

[0337] - Thickness (184) of the third anode electrode (141b): 50 nanometers

[0338] - Thickness of the first stack (ST1) (185): 150 nanometers

[0339] - Thickness of charge generation layer (CGL) (186): 20 nanometers

[0340] - Total thickness (187) of blue organic light-emitting layer (142B): 450 nanometers

[0341] The height (182) of the undercut structure (1830) can be calculated in the range of 220 nanometers to 500 nanometers, and the depth (183) of the undercut structure (1830) can be calculated in the range of 440 nanometers to 1,000 nanometers.

[0342] Meanwhile, in a structure having a tandem structure of two stacks, the height (182) and depth (183) of the undercut structure (1830) calculated in mathematical formula 4 may change depending on the degree of integration. Mathematical formula 4 may also be applied equally to a structure having a single stack (Fig. 9a).

[0343] Fig. 19 is a cross-sectional view illustrating an organic light-emitting display device according to the fifth embodiment.

[0344] The fifth embodiment is identical to the third embodiment (Fig. 7) except for the light-scattering particle (190). In the fifth embodiment, components having the same structure, shape, and / or function as those in the third embodiment (Fig. 7) are given the same drawing reference numerals, and detailed descriptions are omitted. The fifth embodiment can also be applied to the first, second, and fourth embodiments.

[0345] Referring to FIG. 19, an organic light-emitting display device (100E) according to a fifth embodiment may include a substrate (101), a plurality of driving circuits (103), a protective layer (110), a plurality of auxiliary electrodes (120g, 120r, 120b), etc. The organic light-emitting display device (100E) according to the fifth embodiment may include a first three-dimensional structure (130-1), a second three-dimensional structure (130-2), a green organic light-emitting element (140g), a red organic light-emitting element (140r), a blue organic light-emitting element (140b), etc. The organic light-emitting display device (100E) according to the fifth embodiment may include a first insulating layer (150), a second insulating layer (160), a third insulating layer (170), etc.

[0346] The second insulating layer (160) may include light-scattering particles (190). In the drawing, only the second insulating layer (160) on the leftmost separation region (105) includes light-scattering particles (190), but the second insulating layer (160) on other separation regions (105) may also include light-scattering particles (190).

[0347] Green light emitted from the green organic light-emitting element (140g), red light emitted from the red organic light-emitting element (140r), and blue light emitted from the blue organic light-emitting element (140b) can be transmitted to the second insulating layer (160) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2).

[0348] For example, the first anode electrode (141g), the second anode electrode (141r), and the third anode electrode (141b) may include a reflective film. For example, the cathode electrode (143) may include a semi-transparent film. Green light, red light, and blue light may be reflected by the reflective film or the semi-transparent film and emitted forward. Here, P1 to P4 may represent optical paths. Some light, for example, red light, may be totally reflected upward within the red organic light-emitting element (140r) and emitted forward (P2).

[0349] Meanwhile, some of the light, including the red light, may be scattered by the light-scattering particles (190) and emitted forward (P3). Since more light is extracted to the outside by the light-scattering particles (190), the light brightness may be increased.

[0350] Fig. 20 is a cross-sectional view illustrating an organic light-emitting display device according to the sixth embodiment.

[0351] The sixth embodiment is identical to the fifth embodiment (Fig. 19) except for the lens structure (193). Components in the sixth embodiment having the same structure, shape, and / or function as those in the fifth embodiment (Fig. 19) are given the same drawing reference numerals, and detailed descriptions are omitted. The sixth embodiment can also be applied to the first through fourth embodiments.

[0352] Referring to FIG. 20, an organic light emitting display device (100F) according to a sixth embodiment may include a substrate (101), a plurality of driving circuits (103), a protective layer (110), a plurality of auxiliary electrodes (120g, 120r, 120b), etc. An organic light emitting display device (100F) according to a sixth embodiment may include a first three-dimensional structure (130-1), a second three-dimensional structure (130-2), a green organic light emitting element (140g), a red organic light emitting element (140r), a blue organic light emitting element (140b), etc. An organic light emitting display device (100F) according to a sixth embodiment may include a first insulating layer (150), a second insulating layer (160), a third insulating layer (170), etc.

[0353] A lens structure (193) may be placed on the third insulating layer (170). For example, the lens structure (193) may be placed on the second insulating layer (160) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2).

[0354] The structure of the lens (193) is shown as convex, but it may be concave. After the light passes through the insulating film (170) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2), it is incident on the lens (193), and then is incident on another layer provided on the upper part of the lens (193) and may be emitted. Through this process, the light is not totally reflected at the upper and lower surfaces of the lens (193) but is emitted forward as much as possible, and the lens (193) can be optimized to match the refractive index of each layer through which the light passes.

[0355] Although not shown, the second insulating layer (160) can be patterned into a lens structure to prevent total reflection from occurring at the interface with the third insulating film (170), thereby maximizing light extraction efficiency.

[0356] Green light emitted from the green organic light-emitting element (140g), red light emitted from the red organic light-emitting element (140r), and blue light emitted from the blue organic light-emitting element (140b) can be emitted forward through the second insulating layer (160) between the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2). In this case, the green light, red light, and blue light in the second insulating layer (160) can be focused by the lens structure (193). Each lens structure (193) can be wider than the width of the second insulating layer (160).

[0357] When the second insulating layer (160) includes light-scattering particles (190), the green light, red light, and blue light scattered by the light-scattering particles (190) are focused by the lens structure (193), thereby increasing the light brightness. The light-scattering particles (190) may also be omitted.

[0358] Although the drawing shows one lens structure (193), the lens structure (193) may be arranged on the upper surface of each of the second insulating layers (160) between the plurality of first three-dimensional structures (130-1) and the plurality of second three-dimensional structures (130-2).

[0359] Figure 21a is a cross-sectional view schematically designing a panel of an AR product. Figure 21b is a design data sheet for the panel design of Figure 21a. Figure 22 is a plan view schematically designing a panel of an AR product.

[0360] As mentioned above, the larger the average wall angle (θa), the smaller the pixels (P) (or subpixels) can be designed, which is advantageous for high resolution. Figures 21 and 22 are designed as screens with the highest physically possible integration.

[0361] Referring to FIGS. 21 and 22, the diagonal size of the screen of the target product may be 0.6”, the screen ratio may be 16:9, and the resolution may be QHD (Quad HD).

[0362] In this case, the pixel (P) density of the panel may be 4,900 ppi, and the pixel (P) size may be 5.2 μm.

[0363] Through this design, the theoretical light-emitting area ratio and target deposition angle (θe) were calculated. The light-emitting area ratio may be a value obtained by dividing the total area of ​​each color emitting light in a subpixel by the area of ​​the pixel (P). The target deposition angle (θe) may be an angle that utilizes the shadow effect by the first three-dimensional structure (130-1) to ensure that the desired organic light-emitting material is deposited only on a specific area of ​​the second three-dimensional structure (130-2) and not deposited on other areas, such as the separated area (105).

[0364] As illustrated in Fig. 22, the height of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) can be designed to be 4 μm. The width of the lower surface of each of the first three-dimensional structure (130-1) and the second three-dimensional structure (130-2) in the first direction (X) can be designed to be 2.2 μm, and the width in the second direction (Y) can be designed to be 4.0 μm. The distance between rows of the three-dimensional structures (130-1, 130-2) can be designed to be 1.2 μm. When the vertical margin of each of the red anode electrode and the green anode electrode is designed to be 0.6 μm on the upper side and 1.0 μm on the lower side, and the distance between rows is designed to be 1.0 μm, the total light-emitting area (anode area) can be 22.4 μm2. In this case, the light emitting area ratio, which is the value obtained by dividing the total light emitting area by the pixel (P) area (27 μ㎡), can be calculated as 83%.

[0365] The target deposition angle (θe) is 51 degrees, and the deposition angle margin can be ±6 degrees.

[0366] Compared to the typical 500ppi mobile phone product with a light-emitting area ratio of 20-25%, the structure of the embodiment can manufacture a product with a light-emitting area ratio of 3 times or more even though the pixel (P) density is 5,000ppi, which is more than 10 times higher. In addition, the SAD structure of the embodiment can be seen as a groundbreaking technology that can improve the brightness and lifespan of a product by implementing a side-by-side structure in a product area with a pixel (P) density where the use of FMM is impossible.

[0367] The above detailed description should not be construed as limiting in any respect and should be considered illustrative only. The scope of the embodiments should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalency range of the embodiments are intended to be included within the scope of the embodiments.

Claims

1. A first three-dimensional structure on a substrate; A second three-dimensional structure spaced apart from the first three-dimensional structure, with a spaced area along the first direction on the substrate; A first subpixel on one side of the first three-dimensional structure; A second subpixel on one side of the second three-dimensional structure; a third subpixel on the above-mentioned separation area; The first subpixel includes a first organic light-emitting element, The second subpixel includes a second organic light-emitting element, The third subpixel includes a third organic light-emitting element, The first three-dimensional structure and the second three-dimensional structure each have a structure that is separated into at least one pixel unit along the second direction or a structure that is elongated as one piece, One side of the first three-dimensional structure and one side of the second three-dimensional structure are each perpendicular to the substrate, Organic light emitting display device.

2. In paragraph 1, One side of the first three-dimensional structure has a first average wall angle with respect to the substrate, One side of the second three-dimensional structure has a second average wall angle with respect to the substrate, The first average wall angle and the second average wall angle are the same, Organic light emitting display device.

3. In paragraph 1, another second subpixel on the other side of the first three-dimensional structure; and another first subpixel on the other side of the second three-dimensional structure; Organic light emitting display device.

4. In paragraph 1, The first organic light-emitting element is provided in one or more numbers on one side of the first three-dimensional structure along the second direction, The second organic light-emitting element is provided in one or more numbers on one side of the second three-dimensional structure along the second direction, The third organic light-emitting element is provided one or two times on the third auxiliary electrode along the second direction. Organic light emitting display device.

5. In paragraph 1, a first anode separation structure along the perimeter of the first three-dimensional structure; and Further comprising a second anode separation structure along the periphery of the second three-dimensional structure; Organic light emitting display device.

6. In paragraph 5, The first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element commonly include a charge generation layer, The first anode separation structure disconnects the charge generation layer between the first subpixel and the third subpixel, The second anode separation structure disconnects the charge generation layer between the second subpixel and the third subpixel. Organic light emitting display device.

7. In paragraph 1, A first insulating layer on the first organic light-emitting element, the second organic light-emitting element, and the third organic light-emitting element; A second insulating layer on the first insulating layer between the first three-dimensional structure and the second three-dimensional structure; and Further comprising a third insulating layer on the second insulating layer; Organic light emitting display device.

8. In paragraph 7, The third insulating layer is in contact with the upper surface of the first three-dimensional structure and the upper surface of the second three-dimensional structure. Organic light emitting display device.

9. In paragraph 8, The second insulating layer comprises light scattering particles, Organic light emitting display device.

10. In paragraph 7, Further comprising a lens structure on the third insulating layer between the first three-dimensional structure and the second three-dimensional structure; Organic light emitting display device.

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