Electronic device comprising non-conductive portion

Abstract

An electronic device according to an embodiment comprises: a first housing including a first plate, a first side frame, and a slider; a second housing including a second plate and a second side frame; a display disposed in the first housing and the second housing and of which the area of a display region changes according to the relative movement of the first housing and the second housing; an antenna formed on the first side frame; and a non-conductive portion disposed on the first side frame or the second side frame.

Description

Electronic devices containing non-conductive parts

[0001] One embodiment of the present disclosure relates to an electronic device, for example, an electronic device including a non-conductive portion.

[0002] Electronic devices are becoming increasingly slimmer and are being developed in various ways to enhance their design while simultaneously differentiating their functional elements. Electronic devices are moving beyond their standard rectangular form factor and evolving into diverse shapes. To enable portability while simultaneously utilizing large displays, electronic devices may incorporate transformable displays (e.g., rollable or foldable displays). Electronic devices are also being developed that incorporate structures that prevent or minimize display damage or deterioration of screen quality during the process of transforming the display (e.g., shrinking or expanding).

[0003] However, the above-described content should not be construed as the applicant's recognition of the content described in this document as prior art, but should only be construed as technology (related art) related to the invention described in this document.

[0004] According to one embodiment, an electronic device comprises a first housing (410) including a first plate (411), a first side frame (412) formed to extend along an edge of the first plate, and a slider (417) connected to the first plate and provided at a position spaced from the first side frame, a second plate (421) provided parallel to the first plate, and a second side frame (422) formed to extend along an edge of the second plate and to accommodate the slider, the second housing (420) being provided to be slidable in a first direction along the first housing, a display (261) disposed in the first housing and the second housing, the area of ​​the display area of ​​which changes according to the relative movement of the first housing and the second housing, an antenna (T) formed in the first side frame, and disposed in the first side frame or the second side frame, the first side frame and the second side frame In the closest proximity, a non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) may be provided between the first side frame and the second side frame.

[0005] According to one embodiment, an electronic device may include a first housing including a first plate, a first side frame formed to extend along a border of the first plate, and a slider connected to the first plate and provided at a position spaced from the first side frame, a second housing including a second plate formed to be parallel to the first plate, and a second side frame formed to extend along a border of the second plate and to receive the slider, the second housing being slidable in a first direction along the first housing, and a non-conductive portion disposed on the first side frame or the second side frame, the first side frame and the second side frame being provided between the first side frame and the second side frame when the first side frame and the second side frame are in maximum proximity.

[0006] According to one embodiment, an electronic device includes a first housing including a first plate, a first side frame formed to extend along an edge of the first plate, and a slider connected to the first plate and provided at a position spaced from the first side frame, a second plate provided parallel to the first plate, and a second side frame formed to extend along an edge of the second plate and to accommodate the slider, the second housing being provided to be slidable in a first direction along the first housing, a display disposed in the first housing and the second housing, the display having an area of ​​a display region that changes according to a relative movement of the first housing and the second housing, an antenna formed in the first side frame, and a display disposed in the first side frame or the second side frame, the first side frame and the second side frame being provided between the first side frame and the second side frame in a state where the first side frame and the second side frame are as close as possible, and between the first side frame and the second side frame. It may include a non-conductive portion that functions as a capacitor and has a dielectric constant different from that of the first side frame.

[0007] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become apparent from the following detailed description with reference to the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0009] FIG. 2A is a front perspective view illustrating a first state of an electronic device according to one embodiment.

[0010] FIG. 2b is a front perspective view illustrating a second state of an electronic device according to one embodiment.

[0011] FIG. 2c is a rear perspective view illustrating a first state of an electronic device according to one embodiment.

[0012] FIG. 2d is a rear perspective view illustrating a second state of an electronic device according to one embodiment.

[0013] FIG. 3A is a rear view schematically illustrating a first housing of an electronic device according to one embodiment.

[0014] FIG. 3b is a graph schematically illustrating that the resonance of a low band antenna is low shifted while the first housing and the second housing of an electronic device according to one embodiment are moved.

[0015] FIG. 4A is a rear view illustrating a first state of an electronic device according to one embodiment.

[0016] Figure 4b is a cross-sectional view taken along the cut line AA of Figure 4a.

[0017] Figure 4c is a cross-sectional view taken along the cut line BB of Figure 4a.

[0018] Figure 4d is a cross-sectional view taken along the cut line CC of Figure 4a.

[0019] FIG. 4e is a rear perspective view illustrating a first state of an electronic device according to one embodiment.

[0020] FIG. 4f is a cross-sectional view illustrating a first state of an electronic device according to one embodiment.

[0021] FIG. 4g is a rear perspective view illustrating a second state of an electronic device according to one embodiment.

[0022] FIG. 4h is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0023] FIG. 5A is a side view of an electronic device according to one embodiment.

[0024] FIG. 5b is a cross-sectional view of an electronic device according to one embodiment.

[0025] FIG. 6A is a side view of an electronic device according to one embodiment.

[0026] FIG. 6b is a cross-sectional view of an electronic device according to one embodiment.

[0027] FIG. 6c is a cross-sectional view illustrating a first state of an electronic device according to one embodiment.

[0028] FIG. 6d is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0029] FIG. 7A is a side view illustrating a first state of an electronic device according to one embodiment.

[0030] FIG. 7b is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0031] FIG. 8A is a side view illustrating a first state of an electronic device according to one embodiment.

[0032] FIG. 8b is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0033] FIG. 9A is a side view illustrating a first state of an electronic device according to one embodiment.

[0034] FIG. 9b is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0035] FIG. 10A is a side view illustrating a first state of an electronic device according to one embodiment.

[0036] FIG. 10b is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0037] FIG. 11A is a side view illustrating a first state of an electronic device according to one embodiment.

[0038] FIG. 11b is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0039] FIG. 12A is a side view illustrating a first state of an electronic device according to one embodiment.

[0040] FIG. 12b is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0041] FIG. 13A is a side view illustrating a first state of an electronic device according to one embodiment.

[0042] FIG. 13b is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0043] FIG. 14A is a side view illustrating a first state of an electronic device according to one embodiment.

[0044] FIG. 14b is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0045] FIG. 15A is a side view illustrating a first state of an electronic device according to one embodiment.

[0046] FIG. 15b is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0047] FIG. 16A is a side view illustrating a first state of an electronic device according to one embodiment.

[0048] FIG. 16b is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0049] FIG. 17A is a side view illustrating a first state of an electronic device according to one embodiment.

[0050] FIG. 17b is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0051] FIG. 18A is a rear view illustrating a second state of an electronic device according to one embodiment.

[0052] FIG. 18b is a cross-sectional view illustrating a first state of an electronic device according to one embodiment.

[0053] FIG. 18c is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0054] FIG. 19 is a rear view illustrating a second state of an electronic device according to one embodiment.

[0055] FIG. 20A is a rear view illustrating a first state of an electronic device according to one embodiment.

[0056] FIG. 20b is a rear view illustrating a second state of an electronic device according to one embodiment.

[0057] FIG. 20c is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0058] FIG. 20d is a cross-sectional view illustrating a first state of an electronic device according to one embodiment.

[0059] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0060] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0061] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0062] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0063] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0064] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0065] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0066] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0067] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0068] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0069] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0070] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0071] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0072] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0073] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0074] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0075] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0076] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0077] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0078] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0079] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0080] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0081] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0082] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0083] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0084] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0085] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0086] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0087] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0088] FIGS. 2A and 2B are front perspective views illustrating a first state and a second state, respectively, of an electronic device (201) according to one embodiment, and FIGS. 2C and 2D are rear perspective views illustrating a first state and a second state, respectively, of an electronic device (201) according to one embodiment.

[0089] Referring to FIGS. 2A to 2D , an electronic device (201) according to one embodiment may include housings (210, 220) that form an exterior and accommodate components therein. In one embodiment, the housings (210, 220) may include a first housing (210) and a second housing (220) that are movably coupled to each other. In one embodiment, the first housing (210) may be slidably connected to the second housing (220). For example, the first housing (210) may be connected to the second housing (220) so as to be movable in a first movement direction (① direction) (e.g., +Y direction) relative to the second housing (220), or so as to be movable in a second movement direction (② direction) (e.g., -Y direction) opposite to the first movement direction (① direction). Hereinafter, in one embodiment disclosed in this document, the first housing (210) is described as moving relative to the second housing (220). However, since this is for describing the relative movement motion between the first housing (210) and the second housing (220), it can also be understood that the second housing (220) moves relative to the first housing (210).

[0090] In one embodiment, the state of the electronic device (201) can change between a first state and a second state depending on the relative movement of the first housing (210) with respect to the second housing (220). In one embodiment, the electronic device (201) can have a collapsed shape in the first state and an expanded shape in the second state. The electronic device (201) can be used in the first state or the second state, or can be used in an intermediate state between the first state and the second state.

[0091] In one embodiment, the first housing (210) has a first side (210A) (e.g., a first front side), a second side (210B) opposite to the first side (210A) (e.g., a first back side), a first side (210C) facing a first lateral direction (e.g., a +Y direction) and positioned between the first side (210A) and the second side (210B), a second side (210D) facing a second lateral direction opposite to the first lateral direction (e.g., a -Y direction) and positioned between the first side (210A) and the second side (210B), a third side (210E) facing a third lateral direction (e.g., a +X direction) intersecting the first lateral direction and positioned between the first side (210A) and the second side (210B), and a third side (210E) facing a third lateral direction (e.g., a +X direction) and positioned between the first side (210A) and the second side (210B). The first housing (210) may include a fourth side (210F) facing in an opposite fourth side direction (e.g., -X direction) and positioned between the first side (210A) and the second side (210B). In one embodiment, the first housing (210) may include a first plate (211) and a first side frame (212) extending substantially in a thickness direction (e.g., Z-axis direction) along a border of the first plate (211). In one embodiment, the first plate (211) may form the second side (210B). For example, the first side frame (212) may form the first side (210C), the second side (210D), the third side (210E), and / or the fourth side (210F). In one embodiment, the first plate (211) and the first side frame (212) may be formed integrally or formed separately and then joined.

[0092] In one embodiment, the second housing (220) has a third side (220A) (e.g., a second front side), a fourth side (220B) opposite to the third side (220A) (e.g., a second rear side), a fifth side (220C) facing a first lateral direction (e.g., +Y direction) and positioned between the third side (220A) and the fourth side (220B), a sixth side (220D) facing a second lateral direction opposite to the first lateral direction (e.g., -Y direction) and positioned between the third side (220A) and the fourth side (220B), a seventh side (220E) facing a third lateral direction (e.g., +X direction) intersecting the first lateral direction and positioned between the third side (220A) and the fourth side (220B), and a seventh side (220E) facing a third lateral direction (e.g., +X direction) and positioned between the third side (220A) and the fourth side (220B). The second housing (220) may include an eighth side surface (220F) facing in an opposite fourth side direction (e.g., -X direction) and positioned between the third side surface (220A) and the fourth side surface (220B). In one embodiment, the second housing (220) may include a second plate (221) and a second side frame (222) extending substantially in the thickness direction (e.g., Z-axis direction) along a perimeter of the second plate (221). In one embodiment, the second plate (221) may form the fourth side surface (220B). For example, the second side frame (222) may form the fifth side surface (220C), the sixth side surface (220D), the seventh side surface (220E), and / or the eighth side surface (220F). In one embodiment, the second plate (221) and the second side frame (222) may be formed integrally or formed separately and then joined.

[0093] In one embodiment, the first housing (210) and the second housing (220) may form a front side (e.g., a side facing the +Z direction) of the electronic device (201) through the first side (210A) and the third side (220A), and may form a back side (e.g., a side facing the -Z direction) of the electronic device (201) through the second side (210B) and the fourth side (220B). In one embodiment, the second housing (220) may include an open portion (220G) in which at least a portion of a fifth side (220C) is open so that the first housing (210) may be partially movably inserted. However, this is just one example, and in another embodiment, the first housing (210) may include an open portion in which at least a portion of the second side (210D) is open, and the second housing (220) may be partially movably inserted into the interior of the first housing (210) through the open portion formed in the second side (210D).

[0094] In one embodiment, the electronic device (201) may include a display (261) (e.g., a flexible display or a rollable display) for displaying visual information. In one embodiment, the display (261) may be exposed to the outside of the electronic device (201) through a display area (2610). In one embodiment, the display area (2610) may include a first area (261A) arranged parallel to the first side (210A) and the third side (220A), a second area (261B) connected to one end of the first area (261A), and a third area (261C) connected to the other end of the first area (261A). The second area (261B) and the third area (261C) may be arranged on opposite sides with respect to the first area (261A). In one embodiment, each of the second region (261B) and the third region (261C) may form a flexibly curved surface. In one embodiment, the display (261) may display a screen through the display region (2610). The display (261) may display a single connected screen through the entire display region (2610) or may display a screen through only a portion of the display region (2610). In another embodiment, the display (261) may display multiple partially distinct screens through the display region (2610). For example, the display (261) may display one screen through the first region (261A) and display a screen different from the first region (261A) through the second region (261B) and / or the third region (261C).

[0095] In one embodiment, the display (261) may include a flat portion (2611) forming at least a portion of a display area (2610), and a rolling portion (2612) (or bending portion) extending from the flat portion (2611). The rolling portion (2612) may be pulled out from the inside of the electronic device (201) to the outside, or pulled in from the outside of the electronic device (201) according to a movement operation of the first housing (210) relative to the second housing (220). The rolling portion (2612) pulled out to the outside of the electronic device (201) may be exposed to the outside of the electronic device (201) and form the display area (2610) together with the flat portion (2611). The area of ​​the display area (2610) may vary depending on the degree of pulling out of the rolling portion (2612).

[0096] In one embodiment, the display (261) may change the area of ​​the display area (2610) (e.g., the first area (261A), the second area (261B), and the third area (261C)) as the state of the electronic device (201) changes. In one embodiment, the display area (2610) of the display (261) may form a first area (e.g., a minimum area) that is minimized in a first state of the electronic device (201) (e.g., a reduced state, as shown in FIG. 2A), and may form a second area (e.g., a maximum area) that is maximized in a second state of the electronic device (201) (e.g., an expanded state, as shown in FIG. 2C). When the electronic device (201) is between the first state and the second state, the display (261) may expand or contract the area of ​​the display area (2610) corresponding to the state of the electronic device (201). For example, in the process of changing from the first state to the second state, if the first housing (210) moves by a certain length (d) in the first movement direction (direction ①) with respect to the second housing (220), the length of the display area (2610) parallel to the first movement direction (direction ①) may change from the first length (d1) to a second length (d2) increased by the certain length (d), thereby expanding the display area (2610). For example, in the process of changing from the second state to the first state, if the first housing (210) moves by a certain length (d) with respect to the second housing (220) in the second movement direction (direction ②), the length of the display area (2610) parallel to the second movement direction (direction ②) may change from the second length (d2) to a first length (d1) decreased by the certain length (d), thereby reducing the display area (2610). Meanwhile, while the electronic device (201) is changing between the first state and the second state, the sizes of each of the second region (261B) and the third region (261C) may be substantially constant.

[0097] In one embodiment, the electronic device (201) may include at least one of an input module (e.g., input module (150) of FIG. 1), an audio output module (e.g., audio output module (155) of FIG. 1), a camera module (280) (e.g., camera module (180) of FIG. 1), and a connector port (208).

[0098] In one embodiment, the input module can receive an input signal according to a user's operation. The input module can be positioned, for example, on the seventh side (220E) or the eighth side (220F) of the second housing (220). It should be noted that the position where the input module is positioned is not limited thereto. For example, the input module can also be positioned on the first housing (210).

[0099] In one embodiment, at least one of the first housing (210) and the second housing (220) may include a hole for radiating sound generated from the sound output module to the outside. For example, the first housing (210) may include a first hole (H1) that is covered by the second housing (220) when the electronic device is in the first state and is exposed to the outside when the electronic device is in the second state. For example, the second housing (220) may include a second hole (H2) formed in at least one of the sixth side (220D), the seventh side (220E), and the eighth side (220F). For example, the first hole (H1) and the second hole (H2) may be arranged to be substantially aligned with each other when the electronic device (201) is in the first state.

[0100] In one embodiment, the electronic device (201) may include at least one antenna (not shown). The at least one antenna may, for example, wirelessly communicate with an external electronic device (e.g., the electronic device (104) of FIG. 1) or wirelessly transmit and receive power required for charging. According to one embodiment, the antenna may include a legacy antenna, a mmWave antenna, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. In one embodiment, if the first housing (210) and the second housing (220) include a conductive portion at least partially formed of metal, at least a portion of the conductive portion may perform a radiator function of the antenna.

[0101] FIG. 3A is a rear view schematically illustrating a first housing of an electronic device according to one embodiment. FIG. 3B is a graph schematically illustrating a low shift in the resonance of a low band antenna while the first housing and the second housing of the electronic device according to one embodiment are moved.

[0102] Referring to FIGS. 3A and 3B, an electronic device (301) (e.g., the electronic device (201) of FIG. 2A) may include a first housing (e.g., the first housing (210) of FIG. 2A). The first housing may include a first side frame (312) and a slider (317). The electronic device (301) may include an antenna (T). For example, at least a portion of the first side frame (312) may be included in a radiator of the antenna (T). A portion of the first side frame (312) may function as the antenna (T). The electronic device (301) may include a ground switch (318) and a power supply part (319) for supplying current to the antenna (T). For example, the first side frame (312) may include a first conductive portion (312a), a second conductive portion (312b), and a third conductive portion (312c). In one embodiment, the first conductive portion (312a) of the first side frame (312) may be included in the radiator of the antenna (T). The first side frame (312) may include a non-conductive portion (312d, 312e) provided between two adjacent conductive portions of the first conductive portion (312a), the second conductive portion (312b), and the third conductive portion (312c). For example, the non-conductive portions (312d, 312e) may include a first non-conductive portion (312d) provided between the first conductive portion (312a) and the second conductive portion (312b), and a second non-conductive portion (312e) provided between the second conductive portion (312b) and the third conductive portion (312c).

[0103] The first housing may be slidable along the second housing (e.g., the second housing (220) of FIG. 2A). While the first housing is sliding, the resonant frequency of the antenna (T) may be low shifted. For example, the resonant value may shift from a to b. The difference in the values ​​of a and b may be approximately 80 MHz.

[0104] The non-conductive portion described below functions as a capacitor between the first housing and the second housing, thereby reducing the magnitude of the low-shifted frequency. The non-conductive portion will now be described in detail.

[0105] FIG. 4A is a rear perspective view illustrating a first state of an electronic device according to one embodiment. FIG. 4B is a cross-sectional view taken along the cut line AA of FIG. 4A. FIG. 4C is a cross-sectional view taken along the cut line BB of FIG. 4A. FIG. 4D is a cross-sectional view taken along the cut line CC of FIG. 4A. FIG. 4E is a rear perspective view illustrating a first state of an electronic device according to one embodiment. FIG. 4F is a cross-sectional view illustrating a first state of an electronic device according to one embodiment. FIG. 4G is a rear perspective view illustrating a second state of an electronic device according to one embodiment. FIG. 4H is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0106] Referring to FIGS. 4A to 4H, an electronic device (401) (e.g., electronic device (101) of FIG. 1, electronic device (201) of FIG. 2A) may include a first housing (410), a second housing (420), a display (e.g., display (261) of FIG. 2A), an antenna (e.g., antenna (T) of FIG. 3A), and a non-conductive portion (470).

[0107] The first housing (410) may be slidable relative to the second housing (420). A portion of the first housing (410) may be inserted into the second housing (420). For example, the first housing (410) may be movable in the Y-axis direction. While the first housing (410) moves in the +y direction, the display area of ​​the display may expand. While the first housing (410) moves away from the second housing (420), the display area of ​​the display may expand. Here, the first housing (410) and the second housing (420) moving away from each other may mean that the first side frame (412) and the second side frame (422) move away from each other. While the first housing (410) moves in the -y direction, the display area of ​​the display may narrow. As the first housing (410) moves in the direction of being inserted into the second housing (420), the display area of ​​the display may narrow. The first housing (410) may include a first plate (411), a first side frame (412), and a slider (417).

[0108] In one embodiment, the slider (417) may be connected to the first side frame (412). For example, the slider (417) may be arranged to be spaced apart from the first plate (411). For example, the slider (417) may be arranged to be distinct from the antenna (T). For example, a slit or opening may be provided between the slider (417) and the first side frame (412). For example, the slit or opening may be filled with a non-conductive material.

[0109] The second housing (420) may be provided to be slidable in a first direction along the first housing (410). Here, the first direction refers to the Y-axis direction. The second housing (420) may accommodate at least a portion of the first housing (410). For example, the second housing (420) may include a second plate (421) provided parallel to the first plate (411), and a second side frame (422) extended along the edge of the second plate (421) and configured to accommodate a slider (417). For example, the second side frame (422) may be provided to correspond to the first side frame (412).

[0110] In this specification, a state in which the first housing (410) is moved away from the second housing (420) is referred to as a slide out state, and a state in which the first housing (410) is moved in a direction in which it is inserted into the second housing (420) is referred to as a slide in state.

[0111] In one embodiment, the non-conductive portion (470) can be disposed in the first side frame (412) (e.g., the first side frame (212) of FIG. 2A) or the second side frame (422). In the drawing, the non-conductive portion (470) is depicted as being disposed in the first side frame (412), but it should be noted that this is not limiting. For example, the non-conductive portion (470) can be positioned between the first side frame (412) and the second side frame (422) when the first side frame (412) and the second side frame (422) are as close as possible. The non-conductive portion (470) can be disposed in the first side frame (412) or the second side frame (422). The non-conductive portion (470) may be disposed on each of the first side frame (412) and the second side frame (422). For example, a part of the non-conductive portion (470) may be disposed on the first side frame (412), and another part may be disposed on the second side frame (422). The non-conductive portions (470) may be separated in the slide-out state, and may be in contact with each other in the slide-in state.

[0112] In one embodiment, the non-conductive portion (470) may be positioned at one end of the antenna. For example, the non-conductive portion (470) may be positioned at an end of a portion of the first side frame (412) that forms the antenna.

[0113] In one embodiment, the non-conductive portion (470) may be arranged to contact the second side frame (422) when the first side frame (412) and the second side frame (422) are in maximum proximity. For example, the non-conductive portion (470) may prevent the second side frame (422) from directly contacting the first side frame (412).

[0114] According to one embodiment, the non-conductive portion (470) can function as a capacitor between the first side frame (412) and the second side frame (422). The non-conductive portion (470) can reduce the amount by which the resonant frequency of the antenna is low-shifted while the first housing (410) is switched from a slide-in state to a slide-out state. Since the non-conductive portion (470) is disposed between two metals, it can be understood as a parallel plate capacitor. The capacitance generated in the portion where the non-conductive portion (470) is provided can be calculated using the following [Mathematical Formula 1]. As the capacitance increases, the bandwidth of the low-band resonance can be reduced while low-shifting in the direction of low frequencies.

[0115]

[0116] Here, ε is the permittivity of the non-conductive portion (470), S represents the cross-sectional area where the non-conductive portion (470) comes into contact with the metal portion, and d represents the width of the non-conductive portion (470).

[0117] In the slide-in state, in the case of the capacitance of the non-conductive portion (470), when calculating S, it can be calculated as the sum of the contact area (S2) of the non-conductive portion (470) and the second side frame (422), and the contact area (S3) of the non-conductive portion (470) and the slider (417). Meanwhile, in the slide-out state, in the case of the capacitance of the non-conductive portion (470), when calculating S, it can be calculated as the contact area (S3) of the non-conductive portion (470) and the slider (417). The contact area (S1) of the non-conductive portion (470) and the first side frame (412) is greater than or equal to the sum of the contact area (S2) of the non-conductive portion (470) and the second side frame (422) and the contact area (S3) of the non-conductive portion (470) and the slider (417), so that the capacitance of the non-conductive portion (470) can be controlled by setting the contact area. For example, since different media may come into contact with the contact area (S1), the contact area (S2), and the contact area (S3), the capacitance can be controlled by controlling the permittivity of the non-conductive portion (470) at each contact area. For example, in the slide-in state, there may be a gap between the non-conductive portion (470) and the second side frame (422).

[0118] FIG. 5A is a side view of an electronic device according to one embodiment. FIG. 5B is a cross-sectional view of an electronic device according to one embodiment.

[0119] Referring to FIGS. 5A and 5B, the electronic device may include a first housing (e.g., the first housing (210) of FIG. 2A) and a plurality of non-conductive portions (519, 570). The first housing may include a first side plate (512) and a slider (517).

[0120] In one embodiment, the plurality of non-conductive portions (519, 570) may include a first non-conductive portion (519) and a second non-conductive portion (570). For example, the permittivity of each of the first non-conductive portion (570) and the second non-conductive portion (519) may be different. For example, the first non-conductive portion (570) and the second non-conductive portion (519) may overlap each other in the Z-axis direction, which is a direction intersecting the Y-axis direction corresponding to the moving direction of the first housing. For example, the second non-conductive portion (519) may be provided at a front edge portion of the first side frame (511).

[0121] FIG. 6A is a side view of an electronic device according to one embodiment. FIG. 6B is a cross-sectional view of the electronic device taken along the cut line EE of FIG. 6A. FIG. 6C is a cross-sectional view illustrating a first state of the electronic device according to one embodiment. FIG. 6D is a cross-sectional view illustrating a second state of the electronic device according to one embodiment.

[0122] Referring to FIGS. 6A to 6D , the electronic device may include a first housing (e.g., the first housing (210) of FIG. 2A ), a second housing (e.g., the second housing (220) of FIG. 2A ), and a plurality of non-conductive portions (619, 670). The first housing may include a first side plate (611) and a slider (617). The second housing may include a second side frame (622).

[0123] According to one embodiment, the plurality of non-conductive portions (619, 670) may include a first non-conductive portion (670) and a second non-conductive portion (619). For example, the permittivity of each of the first non-conductive portion (670) and the second non-conductive portion (619) may be different. The first non-conductive portion (670) and the second non-conductive portion (619) may overlap each other in the Z-axis direction, which is a direction intersecting the Y-axis direction corresponding to the moving direction of the first housing. For example, the second non-conductive portion (619) may be provided at a front edge portion and a lower edge portion of the first side frame (612) (e.g., the first side frame (212) of FIG. 2A). For example, the second non-conductive portion (619) may include a first sub-part (619a) disposed on a front edge portion of the first side frame (612), and a second sub-part (619b) disposed on a lower edge portion of the first side frame (612). For example, the second sub-part (619b) may be provided at a portion where the first side frame (612) and the second side frame (622), which operate as antenna radiators, face each other. The first non-conductive portion (670) may contact the slider (617). The second non-conductive portion (619) is provided to be able to contact the second side frame (622). For example, the second non-conductive portion (619) may contact the second side frame (622).

[0124] For example, the capacitance of the plurality of non-conductive portions (619, 670) can be determined as the sum of the capacitance of the first non-conductive portion (670) and the capacitance of the second non-conductive portion (619).

[0125] The capacitance of the first non-conductive portion (670) can be determined by the contact area (S4) of the first non-conductive portion (670) and the slider (617), the thickness (a) of the first non-conductive portion (670), and the permittivity of the first non-conductive portion (670). For example, the contact area (S4) of the first non-conductive portion (670) and the slider (617) can be approximately equal to the contact area (S2) of the first non-conductive portion (670) and the first side frame (612).

[0126] The capacitance of the second non-conductive portion (619) can be determined by the contact area (S3) of the second non-conductive portion (619) and the second side frame (622), the thickness (b) of the second non-conductive portion (619), and the permittivity of the second non-conductive portion (619). The contact area (S3) of the second non-conductive portion (619) and the second non-conductive portion (619) can be approximately equal to the contact area (S1) of the second non-conductive portion (619) and the first side frame (612).

[0127] FIG. 7A is a side view illustrating a first state of an electronic device according to one embodiment. FIG. 7B is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0128] Referring to FIGS. 7A and 7B, the electronic device may include a first housing (e.g., the first housing (210) of FIG. 2A), a second housing (e.g., the second housing (220) of FIG. 2A), and a plurality of non-conductive portions (770, 719). The first housing may include a first side frame (712) (e.g., the first side frame (212) of FIG. 2A) and a slider (717). The second housing may include a second side frame (722). When comparing the embodiment of FIG. 7 with the embodiment of FIG. 6, the cross-sectional areas are the same, but the capacitance may be changed by changing the thicknesses of the two non-conductive portions.

[0129] The capacitance of the plurality of non-conductive portions (770, 719) may be determined as the sum of the capacitance of the first non-conductive portion (770) and the capacitance of the second non-conductive portion (719). The thickness of the first non-conductive portion (770) may be smaller than the thickness of the second non-conductive portion (719). For example, the second non-conductive portion (719) may be located at the center of the first non-conductive portion (770). The upper edge of the first non-conductive portion (770) may be located lower than the upper edge of the second non-conductive portion (719), on the -Y side. The lower edge of the first non-conductive portion (770) may be located on the +Y side, above the lower edge of the second non-conductive portion (719). The capacitance of the first non-conductive portion (770) may be determined by the contact area (a) of the first non-conductive portion (770) and the slider (717), the thickness (c) of the first non-conductive portion (770), and the permittivity (ε1) of the first non-conductive portion (770). The capacitance of the second non-conductive portion (719) may be determined by the contact area (b) of the second non-conductive portion (719) and the second side frame (722), the thickness (d) of the second non-conductive portion (719), and the permittivity (ε2) of the second non-conductive portion (719). For example, in the slide-in state, the capacitance of the plurality of non-conductive portions (770, 719) can be determined through [Mathematical Formula 2] below. For example, in the slide-out state, the capacitance of the plurality of non-conductive portions (770, 719) can be determined through [Mathematical Formula 3] below.

[0130]

[0131]

[0132] Here, ε1 is the permittivity of the first non-conductive portion (770), c is the thickness of the first non-conductive portion (770), a is the contact area between the first non-conductive portion (770) and the slider (717), ε2 is the permittivity of the second non-conductive portion (719), d is the thickness of the second non-conductive portion (719), and b is the contact area between the second non-conductive portion (719) and the second side frame (722).

[0133] FIG. 8A is a side view illustrating a first state of an electronic device according to one embodiment. FIG. 8B is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0134] Referring to FIGS. 8A and 8B , the electronic device may include a first housing (e.g., the first housing (210) of FIG. 2A ), a second housing (e.g., the second housing (220) of FIG. 2A ), and a plurality of non-conductive portions (870, 819). The first housing may include a first side frame (812) (e.g., the first side frame (212) of FIG. 2A ) and a slider (817). The second housing may include a second side frame (822).

[0135] The capacitance of the plurality of non-conductive portions (870, 819) can be determined as the sum of the capacitance of the first non-conductive portion (870) and the capacitance of the second non-conductive portion (819). The thickness of the first non-conductive portion (870) can be greater than the thickness of the second non-conductive portion (819). For example, the upper surfaces of each of the first non-conductive portion (870) and the second non-conductive portion (819) can be parallel to each other.

[0136] The capacitance of the first non-conductive portion (870) can be determined by the contact area of ​​the first non-conductive portion (870) and the slider (817), the thickness of the first non-conductive portion (870), and the permittivity of the first non-conductive portion (870). The capacitance of the second non-conductive portion (819) can be determined by the contact area of ​​the second non-conductive portion (819) and the second side frame (822), the thickness of the second non-conductive portion (819), and the permittivity of the second non-conductive portion (819). For example, the capacitances of the plurality of non-conductive portions (870, 819) can be determined through the above [Mathematical Expression 2] and [Mathematical Expression 3].

[0137] FIG. 9A is a side view illustrating a first state of an electronic device according to one embodiment. FIG. 9B is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0138] Referring to FIGS. 9A and 9B, the electronic device may include a first housing (e.g., the first housing (210) of FIG. 2A), a second housing (e.g., the second housing (220) of FIG. 2A), and a plurality of non-conductive portions (970, 919). The first housing may include a first side frame (912) (e.g., the first side frame (212) of FIG. 2A) and a slider (917). The second housing may include a second side frame (922).

[0139] The capacitance of the plurality of non-conductive portions (970, 919) can be determined as the sum of the capacitance of the first non-conductive portion (970) and the capacitance of the second non-conductive portion (919). The thickness of the first non-conductive portion (970) can be greater than the thickness of the second non-conductive portion (919). For example, the lower surfaces of each of the first non-conductive portion (970) and the second non-conductive portion (919) can be parallel to each other.

[0140] The capacitance of the first non-conductive portion (970) can be determined by the contact area of ​​the first non-conductive portion (970) and the slider (917), the thickness of the first non-conductive portion (970), and the permittivity of the first non-conductive portion (970). The capacitance of the second non-conductive portion (919) can be determined by the contact area of ​​the second non-conductive portion (919) and the second side frame (922), the thickness of the second non-conductive portion (919), and the permittivity of the second non-conductive portion (919). For example, the capacitances of the plurality of non-conductive portions (970, 919) can be determined through the above [Mathematical Expression 2] and [Mathematical Expression 3].

[0141] FIG. 10A is a side view illustrating a first state of an electronic device according to one embodiment. FIG. 10B is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0142] Referring to FIGS. 10A and 10B , the electronic device may include a first housing (e.g., the first housing (210) of FIG. 2A ), a second housing (e.g., the second housing (220) of FIG. 2A ), and a plurality of non-conductive portions (1070, 1019). The first housing may include a first side frame (1012) (e.g., the first side frame (212) of FIG. 2A ) and a slider (1017). The second housing may include a second side frame (1022).

[0143] The capacitance of the plurality of non-conductive portions (1070, 1019) may be determined as the sum of the capacitance of the first non-conductive portion (1070) and the capacitance of the second non-conductive portion (1019). The thickness of the first non-conductive portion (1070) may be smaller than the thickness of the second non-conductive portion (1019). For example, the upper surfaces of each of the first non-conductive portion (1070) and the second non-conductive portion (1019) may be parallel to each other.

[0144] The capacitance of the first non-conductive portion (1070) can be determined by the contact area of ​​the first non-conductive portion (1070) and the slider (1017), the thickness of the first non-conductive portion (1070), and the permittivity of the first non-conductive portion (1070). The capacitance of the second non-conductive portion (1019) can be determined by the contact area of ​​the second non-conductive portion (1019) and the second side frame (1022), the thickness of the second non-conductive portion (1019), and the permittivity of the second non-conductive portion (1019). For example, the capacitances of the plurality of non-conductive portions (1070, 1019) can be determined through the above [Mathematical Expression 2] and [Mathematical Expression 3]. For example, the upper edge of the first non-conductive portion (1070) may be positioned parallel to the upper edge of the second non-conductive portion (1019). The lower edge of the first non-conductive portion (1170) may be positioned higher than the lower edge of the second non-conductive portion (1119).

[0145] FIG. 11A is a side view illustrating a first state of an electronic device according to one embodiment. FIG. 11B is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0146] Referring to FIGS. 11A and 11B , the electronic device may include a first housing (e.g., the first housing (210) of FIG. 2A ), a second housing (e.g., the second housing (220) of FIG. 2A ), and a plurality of non-conductive portions (1170, 1119). The first housing may include a first side frame (1112) (e.g., the first side frame (212) of FIG. 2A ) and a slider (1117). The second housing may include a second side frame (1122).

[0147] The capacitance of the plurality of non-conductive portions (1170, 1119) may be determined as the sum of the capacitance of the first non-conductive portion (1170) and the capacitance of the second non-conductive portion (1119). The first non-conductive portion (1170) and the second non-conductive portion (1119) may be arranged in an interleaved manner. The first non-conductive portion (1170) may overlap the first side frame (1112) at least partially in the X-axis direction. The second non-conductive portion (1119) may overlap the slider (1117) at least partially in the X-axis direction. For example, the lower edge of the first non-conductive portion (1170) may be positioned lower than the lower edge of the second non-conductive portion (1119). The upper edge of the first non-conductive portion (1170) may be positioned higher than the upper edge of the second non-conductive portion (1119). The lower edge of the first non-conductive portion (1170) may be positioned higher than the lower edge of the second non-conductive portion (1119).

[0148] The capacitance of the first non-conductive portion (1170) can be determined by the contact area of ​​the first non-conductive portion (1170) and the slider (1117), the thickness of the first non-conductive portion (1170), and the permittivity of the first non-conductive portion (1170). The capacitance of the second non-conductive portion (1119) can be determined by the contact area of ​​the second non-conductive portion (1119) and the second side frame (1122), the thickness of the second non-conductive portion (1119), and the permittivity of the second non-conductive portion (1119). For example, the capacitances of the plurality of non-conductive portions (1170, 1119) can be determined through the above [Mathematical Expression 2] and [Mathematical Expression 3].

[0149] FIG. 12A is a side view illustrating a first state of an electronic device according to one embodiment. FIG. 12B is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0150] Referring to FIGS. 12A and 12B, the electronic device may include a first housing (e.g., the first housing (210) of FIG. 2A), a second housing (e.g., the second housing (220) of FIG. 2A), and a plurality of non-conductive portions (1270, 1219). The first housing may include a first side frame (1212) (e.g., the first side frame (212) of FIG. 2A) and a slider (1217). The second housing may include a second side frame (1222).

[0151] The capacitance of the plurality of non-conductive portions (1270, 1219) can be determined as the sum of the capacitance of the first non-conductive portion (1270) and the capacitance of the second non-conductive portion (1219). The first non-conductive portion (1270) can include portions having different thicknesses. For example, the first portion of the first non-conductive portion (1270) can have a thickness d, and the second portion can have a thickness e. For example, the first portion can have a thickness (d) greater than the second portion can have a thickness (e). For example, the first portion can have a thickness (d) that is approximately 1.1 to 1.3 times greater than the thickness (e) of the second portion.

[0152] The capacitance of the first non-conductive portion (1270) can be determined by the contact area of ​​the first non-conductive portion (1270) and the slider (1217), the thickness of the first non-conductive portion (1270), and the permittivity of the first non-conductive portion (1270). The capacitance of the second non-conductive portion (1219) can be determined by the contact area of ​​the second non-conductive portion (1219) and the second side frame (1222), the thickness of the second non-conductive portion (1219), and the permittivity of the second non-conductive portion (1219). For example, in the slide-in state, the capacitance of the plurality of non-conductive portions (1270, 1219) can be determined through the following [Mathematical Formula 4]. For example, in the slide-out state, the capacitance of the plurality of non-conductive portions (1270, 1219) can be determined through [Mathematical Formula 5] below.

[0153]

[0154]

[0155] Here, ε1 is the permittivity of the first non-conductive portion (1270), a is the contact area of ​​the first part of the first non-conductive portion (1270) and the slider (1217), d is the thickness of the first part of the first non-conductive portion (1270), b is the contact area of ​​the second part of the first non-conductive portion (1270) and the slider (1217), e is the thickness of the second part of the first non-conductive portion (1270), ε2 is the permittivity of the second non-conductive portion (1219), c is the contact area of ​​the second non-conductive portion (1219) and the second side frame (1222), and f is the thickness of the second non-conductive portion (1219).

[0156] FIG. 13A is a side view illustrating a first state of an electronic device according to one embodiment. FIG. 13B is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0157] Referring to FIGS. 13A and 13B , the electronic device may include a first housing (e.g., the first housing (210) of FIG. 2A ), a second housing (e.g., the second housing (220) of FIG. 2A ), and a plurality of non-conductive portions (1370, 1319). The first housing may include a first side frame (1312) (e.g., the first side frame (212) of FIG. 2A ) and a slider (1317). The second housing may include a second side frame (1322).

[0158] The capacitance of the plurality of non-conductive portions (1370, 1319) can be determined as the sum of the capacitance of the first non-conductive portion (1370) and the capacitance of the second non-conductive portion (1319). The first non-conductive portion (1370) can include portions having different thicknesses. For example, the first portion of the first non-conductive portion (1370) can have a thickness d, and the second portion can have a thickness e. The thickness (d) of the first portion can be smaller than the thickness (e) of the second portion.

[0159] The capacitance of the first non-conductive portion (1370) can be determined by the contact area of ​​the first non-conductive portion (1370) and the slider (1317), the thickness of the first non-conductive portion (1370), and the permittivity of the first non-conductive portion (1370). The capacitance of the second non-conductive portion (1319) can be determined by the contact area of ​​the second non-conductive portion (1319) and the second side frame (1322), the thickness of the second non-conductive portion (1319), and the permittivity of the second non-conductive portion (1319). For example, in the slide-in state, the capacitance of the plurality of non-conductive portions (1370, 1319) can be determined through the above [Mathematical Formula 4]. For example, in the slide-out state, the capacitance of the plurality of non-conductive portions (1370, 1319) can be determined through the above [Mathematical Formula 5].

[0160] FIG. 14A is a side view illustrating a first state of an electronic device according to one embodiment. FIG. 14B is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0161] Referring to FIGS. 14A and 14B, the electronic device may include a first housing (e.g., the first housing (210) of FIG. 2A), a second housing (e.g., the second housing (220) of FIG. 2A), and a plurality of non-conductive portions (1470, 1419). The first housing may include a first side frame (1412) (e.g., the first side frame (212) of FIG. 2A) and a slider (1417). The second housing may include a second side frame (1422).

[0162] The capacitance of the plurality of non-conductive portions (1470, 1419) can be determined as the sum of the capacitance of the first non-conductive portion (1470) and the capacitance of the second non-conductive portion (1419). The first non-conductive portion (1470) can include portions having different thicknesses. For example, the first portion of the first non-conductive portion (1470) can have a thickness d, and the second portion can have a thickness e. The thickness (d) of the first portion can be greater than the thickness (e) of the second portion. For example, the thickness (d) of the first portion can be approximately 1.8 to 2.2 times the thickness (e) of the second portion.

[0163] The capacitance of the first non-conductive portion (1470) can be determined by the contact area of ​​the first non-conductive portion (1470) and the slider (1417), the thickness of the first non-conductive portion (1470), and the permittivity of the first non-conductive portion (1470). The capacitance of the second non-conductive portion (1419) can be determined by the contact area of ​​the second non-conductive portion (1419) and the second side frame (1422), the thickness of the second non-conductive portion (1419), and the permittivity of the second non-conductive portion (1419). For example, in the slide-in state, the capacitances of the plurality of non-conductive portions (1470, 1419) can be determined through the above [Mathematical Formula 4]. For example, in the slide-out state, the capacitance of the plurality of non-conductive portions (1470, 1419) can be determined through the above [Mathematical Formula 5].

[0164] FIG. 15A is a side view illustrating a first state of an electronic device according to one embodiment. FIG. 15B is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0165] Referring to FIGS. 15A and 15B, the electronic device may include a first housing (e.g., the first housing (210) of FIG. 2A), a second housing (e.g., the second housing (220) of FIG. 2A), and a plurality of non-conductive portions (1570, 1519). The first housing may include a first side frame (1512) (e.g., the first side frame (212) of FIG. 2A) and a slider (1517). The second housing may include a second side frame (1522).

[0166] The capacitance of the plurality of non-conductive portions (1570, 1519) may be determined as the sum of the capacitance of the first non-conductive portion (1570) and the capacitance of the second non-conductive portion (1519). The first non-conductive portion (1570) may include portions having different thicknesses. For example, the first portion of the first non-conductive portion (1570) may have a thickness of d, and the second portion may have a thickness of e. For example, the first portion of the first non-conductive portion (1570) may include an air layer. The permittivity of the first portion of the first non-conductive portion (1570) may be 1.

[0167] The capacitance of the first non-conductive portion (1570) can be determined by the contact area of ​​the first non-conductive portion (1570) and the slider (1517), the thickness of the first non-conductive portion (1570), and the permittivity of the first non-conductive portion (1570). The capacitance of the second non-conductive portion (1519) can be determined by the contact area of ​​the second non-conductive portion (1519) and the second side frame (1522), the thickness of the second non-conductive portion (1519), and the permittivity of the second non-conductive portion (1519). For example, in the slide-in state, the capacitances of the plurality of non-conductive portions (1570, 1519) can be determined through the above [Mathematical Formula 4]. For example, in the slide-out state, the capacitance of the plurality of non-conductive portions (1570, 1519) can be determined through the above [Mathematical Formula 5].

[0168] FIG. 16A is a side view illustrating a first state of an electronic device according to one embodiment. FIG. 16B is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0169] Referring to FIGS. 16A and 16B, the electronic device may include a first housing (e.g., the first housing (210) of FIG. 2A), a second housing (e.g., the second housing (220) of FIG. 2A), and a plurality of non-conductive portions (1670, 1619). The first housing may include a first side frame (1612) (e.g., the first side frame (212) of FIG. 2A) and a slider (1617). The second housing may include a second side frame (1622).

[0170] The capacitance of the plurality of non-conductive portions (1670, 1619) may be determined as the sum of the capacitance of the first non-conductive portion (1670) and the capacitance of the second non-conductive portion (1619). The first non-conductive portion (1670) and the second non-conductive portion (1619) may include portions having different thicknesses. For example, the first portion of the first non-conductive portion (1670) may have a thickness e, and the second portion may have a thickness f. The thickness (e) of the first portion may be greater than the thickness (f) of the second portion. For example, the first portion of the second non-conductive portion (1619) may have a thickness g, and the second portion may have a thickness h. The first portion of the second non-conductive portion (1619) may include an air layer. The permittivity of the first portion of the second non-conductive portion (1619) may be 1.

[0171] The capacitance of the first non-conductive portion (1670) can be determined by the contact area of ​​the first non-conductive portion (1670) and the slider (1617), the thickness of the first non-conductive portion (1670), and the permittivity of the first non-conductive portion (1670). The capacitance of the second non-conductive portion (1619) can be determined by the contact area of ​​the second non-conductive portion (1619) and the second side frame (1622), the thickness of the second non-conductive portion (1619), and the permittivity of the second non-conductive portion (1619). For example, in the slide-in state, the capacitance of the plurality of non-conductive portions (1670, 1619) can be determined through the following [Mathematical Formula 6]. For example, in the slide-out state, the capacitance of the plurality of non-conductive portions (1670, 1619) can be determined through [Mathematical Formula 7] below.

[0172]

[0173]

[0174] Here, ε1 is the permittivity of the first non-conductive portion (1670), a is the contact area of ​​the first part of the first non-conductive portion (1670) and the slider (1617), e is the thickness of the first part of the first non-conductive portion (1670), b is the contact area of ​​the second part of the first non-conductive portion (1670) and the slider (1617), f is the thickness of the second part of the first non-conductive portion (1670), ε2 is the permittivity of the second non-conductive portion (1619), c is the contact area of ​​the first part of the second non-conductive portion (1619) and the second side frame (1622), g is the thickness of the first part of the second non-conductive portion (1619), and d is the thickness of the second non-conductive portion (1619). The contact area of ​​the second part of the portion (1619) and the second side frame (1622) is h, and h is the thickness of the second part of the second non-conductive portion (1619).

[0175] FIG. 17A is a side view illustrating a first state of an electronic device according to one embodiment. FIG. 17B is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0176] Referring to FIGS. 17A and 17B, the electronic device may include a first housing (e.g., the first housing (210) of FIG. 2A), a second housing (e.g., the second housing (220) of FIG. 2A), and a non-conductive portion (1770). The first housing may include a first side frame (1712) (e.g., the first side frame (212) of FIG. 2A) and a slider (1717). The second housing may include a second side frame (1722).

[0177] The capacitance of the plurality of non-conductive portions (1770) may be determined as the sum of the capacitance of the first non-conductive portion (1770) and the capacitance of the second non-conductive portion. The second non-conductive portion may include an air layer. The thickness of the first non-conductive portion (1770) may be greater than the thickness of the second non-conductive portion. For example, the upper surfaces of each of the first non-conductive portion (1770) and the second non-conductive portion may be parallel to each other.

[0178] The capacitance of the first non-conductive portion (1770) can be determined by the contact area of ​​the first non-conductive portion (1770) and the slider (1717), the thickness of the first non-conductive portion (1770), and the permittivity of the first non-conductive portion (1770). The capacitance of the second non-conductive portion can be determined by the contact area of ​​the second non-conductive portion (1719) and the second side frame (1722), the thickness of the second non-conductive portion, and the permittivity of the second non-conductive portion. For example, the capacitance of the plurality of non-conductive portions (1770) can be determined through the above [Mathematical Expression 2] and [Mathematical Expression 3].

[0179] FIG. 18A is a rear view illustrating a second state of an electronic device according to one embodiment. FIG. 18B is a cross-sectional view illustrating a first state of an electronic device according to one embodiment. FIG. 18C is a cross-sectional view illustrating a second state of an electronic device according to one embodiment.

[0180] Referring to FIGS. 18A to 18C, an electronic device (1801) may include a first housing (1810), a second housing (1820), and a plurality of non-conductive portions (1870, 1819). The first housing (1810) may include a first plate (1811), a first side frame (1812) (e.g., the first side frame (212) of FIG. 2A), and a slider (1817). The second housing (1820) may include a second plate (1821) and a second side frame (1822).

[0181] In one embodiment, the first non-conductive portion (1870) can be connected to the first side frame (1812). The second non-conductive portion (1819) can be connected to the second side frame (1822). While the first housing (1810) slides out from the second housing (1820), the first non-conductive portion (1870) can move away from the second non-conductive portion (1819). For example, the second non-conductive portion (1819) can be formed to correspond to one side (e.g., a Y-axis direction side) of the second housing (1820). For example, the second non-conductive portion (1819) can be positioned on the second plate (1821) and the second side frame (1822).

[0182] FIG. 19 is a rear view illustrating a second state of an electronic device according to one embodiment.

[0183] Referring to FIG. 19, an electronic device (1901) may include a first housing (1910), a second housing (1920), and a plurality of non-conductive portions (1970, 1919). The first housing (1910) may include a first plate (1911), a first side frame (1912) (e.g., the first side frame (212) of FIG. 2A), and a slider (1917). The second housing (1920) may include a second plate (1921) and a second side frame (1922).

[0184] In one embodiment, the first non-conductive portion (1970) can be connected to the first side frame (1912). The second non-conductive portion (1919) can be connected to the second side frame (1922). While the first housing (1910) slides out from the second housing (1920), the first non-conductive portion (1970) can move away from the second non-conductive portion (1919). For example, the second non-conductive portion (1919) can be disposed on the second side frame (1922).

[0185] FIG. 20A is a rear view illustrating a first state of an electronic device according to one embodiment. FIG. 20B is a rear view illustrating a second state of an electronic device according to one embodiment. FIG. 20C is a cross-sectional view illustrating a second state of an electronic device according to one embodiment. FIG. 20D is a cross-sectional view illustrating a first state of an electronic device according to one embodiment.

[0186] Referring to FIGS. 20A to 20D, the electronic device (2001) may have a form that can expand and contract in the X-axis direction. The display of the electronic device (2001) may have a display screen that can expand and contract. The electronic device (2001) may include a first housing (2010), a second housing (2020), and a non-conductive portion (2070). The non-conductive portion (2070) may be in contact with a second side frame (2022) of the second housing (2020).

[0187] According to one embodiment, an electronic device comprises a first housing (410) including a first plate (411), a first side frame (412) formed to extend along an edge of the first plate, and a slider (417) connected to the first plate and provided at a position spaced from the first side frame, a second plate (421) provided parallel to the first plate, and a second side frame (422) formed to extend along an edge of the second plate and to accommodate the slider, the second housing (420) being provided to be slidable in a first direction along the first housing, a display (261) disposed in the first housing and the second housing, the area of ​​the display area of ​​which changes according to the relative movement of the first housing and the second housing, an antenna (T) formed in the first side frame, and disposed in the first side frame or the second side frame, the first side frame and the second side frame In the closest proximity, a non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) may be provided between the first side frame and the second side frame.

[0188] In one embodiment, the non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) may be disposed at one end of the antenna.

[0189] In one embodiment, the non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) may be provided in contact with the second side frame, with the first side frame and the second side frame being as close as possible to each other.

[0190] In one embodiment, the non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) is an electronic device that functions as a capacitor between the first side frame and the second side frame.

[0191] In one embodiment, the non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) may be disposed on a surface of the first side frame facing the second side frame.

[0192] In one embodiment, the non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) may have a permittivity different from that of the first side frame.

[0193] In one embodiment, the contact area of ​​the non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) and the first side frame is 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) and the contact area of ​​the second side frame may be greater than or equal to the sum of the contact areas of the non-conductive portion and the slider.

[0194] In one embodiment, the non-conductive portions (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) are provided in multiple numbers, and the multiple non-conductive portions (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) are the first non-conductive portions (570, 670, 770, 870, 970, 1070, 1170, 1270, 1370, 1470, 1570, 1670, 1770, 1870, 2070) and the second non-conductive portions (519, 619, 719, 819, 919, 1019, It may include 1119, 1219, 1319, 1419, 1519, 1619, 1819).

[0195] In one embodiment, the first non-conductive portion (570, 670, 770, 870, 970, 1070, 1170, 1270, 1370, 1470, 1570, 1670, 1770, 1870, 2070) and the second non-conductive portion (519, 619, 719, 819, 919, 1019, 1119, 1219, 1319, 1419, 1519, 1619, 1819) may overlap the non-conductive portion with respect to a second direction orthogonal to the first direction.

[0196] In one embodiment, the second non-conductive portion (519, 619, 719, 819, 919, 1019, 1119, 1219, 1319, 1419, 1519, 1619, 1819) is provided in contact with the slider, and the second non-conductive portion (519, 619, 719, 819, 919, 1019, 1119, 1219, 1319, 1419, 1519, 1619, 1819) can face the second side frame.

[0197] In one embodiment, the second non-conductive portion (519, 619, 719, 819, 919, 1019, 1119, 1219, 1319, 1419, 1519, 1619, 1819) may be provided in contact with the second side frame, with the first side frame and the second side frame being as close as possible.

[0198] In one embodiment, the second non-conductive portion (519, 619, 719, 819, 919, 1019, 1119, 1219, 1319, 1419, 1519, 1619, 1819) may surround an outer surface of the first non-conductive portion.

[0199] In one embodiment, the plurality of non-conductive portions (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) are provided in multiple numbers, and the plurality of non-conductive portions (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) may further include an air layer.

[0200] In one embodiment, at least some of the plurality of non-conductive portions may overlap the first side frame or the second side frame with respect to a second direction intersecting the first direction.

[0201] In one embodiment, the non-conductive portions (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) are provided in multiple numbers, and the multiple non-conductive portions (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) may include parts with different thicknesses.

[0202] According to one embodiment, an electronic device may include a first housing including a first plate, a first side frame formed to extend along a border of the first plate, and a slider connected to the first plate and provided at a position spaced from the first side frame, a second housing including a second plate formed to be parallel to the first plate, and a second side frame formed to extend along a border of the second plate and to receive the slider, the second housing being slidable in a first direction along the first housing, and a non-conductive portion disposed on the first side frame or the second side frame, the first side frame and the second side frame being provided between the first side frame and the second side frame when the first side frame and the second side frame are in maximum proximity.

[0203] In one embodiment, the non-conductive portion may be disposed at one end of the antenna.

[0204] In one embodiment, the non-conductive portion can function as a capacitor between the first side frame and the second side frame.

[0205] In one embodiment, the non-conductive portion may have a dielectric constant different from the dielectric constant of the first side frame.

[0206] According to one embodiment, an electronic device includes a first housing including a first plate, a first side frame formed to extend along an edge of the first plate, and a slider connected to the first plate and provided at a position spaced from the first side frame, a second plate provided parallel to the first plate, and a second side frame formed to extend along an edge of the second plate and to accommodate the slider, the second housing being provided to be slidable in a first direction along the first housing, a display disposed in the first housing and the second housing, the display having an area of ​​a display region that changes according to a relative movement of the first housing and the second housing, an antenna formed in the first side frame, and a display disposed in the first side frame or the second side frame, the first side frame and the second side frame being provided between the first side frame and the second side frame in a state where the first side frame and the second side frame are as close as possible, and between the first side frame and the second side frame. It may include a non-conductive portion that functions as a capacitor and has a dielectric constant different from that of the first side frame.

[0207] The effects of the electronic device according to the embodiments are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description in the specification.

[0208] The embodiments described herein are intended to be illustrative and not restrictive. Various modifications may be made to the details of the present disclosure, including those encompassed by the appended claims and their equivalents. Any of the embodiments described herein may be used in combination with any other embodiment described herein.

Claims

1. A first housing (410) including a first plate (411), a first side frame (412) formed to extend along the edge of the first plate, and a slider (417) connected to the first plate and provided at a position spaced from the first side frame; A second plate (421) provided in parallel with the first plate, and a second side frame (422) formed to extend along the edge of the second plate and to accommodate the slider, the second housing (420) being provided to be able to slide in the first direction along the first housing; A display (261) arranged in the first housing and the second housing, the area of ​​the display area of ​​which changes according to the relative movement of the first housing and the second housing; An antenna (T) formed on the first side frame; and An electronic device comprising a non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) disposed on the first side frame or the second side frame, and provided between the first side frame and the second side frame when the first side frame and the second side frame are in maximum proximity.

2. In paragraph 1, The above non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) is an electronic device arranged at one end of the antenna.

3. In paragraph 1, An electronic device wherein the non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) is provided in contact with the second side frame, with the first side frame and the second side frame being as close as possible to each other.

4. In paragraph 1, An electronic device, wherein the non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) functions as a capacitor between the first side frame and the second side frame.

5. In paragraph 1, An electronic device, wherein the non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) is disposed on a surface of the first side frame facing the second side frame.

6. In paragraph 1, An electronic device, wherein the non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) has a dielectric constant different from that of the first side frame.

7. In paragraph 1, The contact area of ​​the non-conductive portion (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) and the first side frame is An electronic device, wherein the contact area of ​​the second side frame is greater than or equal to the sum of the contact areas of the non-conductive portion and the slider (1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070).

8. In paragraph 1, The above non-conductive portions (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) are provided in multiple numbers, and the above multiple non-conductive portions (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) have different permittivity first non-conductive portions (570, 670, 770, 870, 970, 1070, 1170, 1270, 1370, 1470, 1570, 1670, 1770, 1870, 2070) and second non-conductive portions (519, 619, 719, 819, 919, 1019, An electronic device, including 1119, 1219, 1319, 1419, 1519, 1619, 1819).

9. In paragraph 8, An electronic device wherein the first non-conductive portion (570, 670, 770, 870, 970, 1070, 1170, 1270, 1370, 1470, 1570, 1670, 1770, 1870, 2070) and the second non-conductive portion (519, 619, 719, 819, 919, 1019, 1119, 1219, 1319, 1419, 1519, 1619, 1819) overlap the non-conductive portion with respect to the second direction orthogonal to the first direction.

10. In paragraph 8, An electronic device, wherein the second non-conductive portion (519, 619, 719, 819, 919, 1019, 1119, 1219, 1319, 1419, 1519, 1619, 1819) is provided in contact with the slider, and the second non-conductive portion (519, 619, 719, 819, 919, 1019, 1119, 1219, 1319, 1419, 1519, 1619, 1819) faces the second side frame.

11. In Article 10, An electronic device wherein the second non-conductive portion (519, 619, 719, 819, 919, 1019, 1119, 1219, 1319, 1419, 1519, 1619, 1819) is provided in contact with the second side frame, with the first side frame and the second side frame being as close as possible to each other.

12. In paragraph 10, An electronic device wherein the second non-conductive portion (519, 619, 719, 819, 919, 1019, 1119, 1219, 1319, 1419, 1519, 1619, 1819) surrounds an outer surface of the first non-conductive portion.

13. In paragraph 8, The above-mentioned plurality of non-conductive parts (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) are provided in multiple numbers, and the above-mentioned plurality of non-conductive parts (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) is an electronic device further comprising an air layer.

14. In paragraph 8, An electronic device, wherein at least some of the plurality of non-conductive portions overlap the first side frame or the second side frame with respect to a second direction intersecting the first direction.

15. In paragraph 1, The above non-conductive portions (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) are provided in multiple numbers, and the above multiple non-conductive portions (470, 519, 570, 619, 670, 719, 770, 819, 870, 919, 970, 1019, 1070, 1119, 1170, 1219, 1270, 1319, 1370, 1419, 1470, 1519, 1570, 1619, 1670, 1770, 1819, 1870, 2070) is an electronic device including parts having different thicknesses.

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