Component inspection device

Abstract

The present invention accurately measures a load applied to an electronic component by reducing a disturbance value measured instead of a true load value due to device vibration or the like.　This component inspection device inspects an electronic component while transporting the electronic component, classifies the electronic component as either a satisfactory product or an unsatisfactory product, and accommodates the electronic component in an accommodation member. The component inspection device comprises: a sheet-holding unit that holds a sheet having an obverse surface and a reverse surface, the sheet having an electronic component affixed to the obverse surface thereof; a component-holding unit that faces the obverse surface of the sheet held by the sheet-holding unit and holds the electronic component; a push-up member that faces a pushed-up position on the reverse surface of the sheet held by the sheet-holding unit; a drive unit that moves the push-up member along a prescribed direction so as to move toward the component-holding unit; a stage that suctions a region around the pushed-up position on the reverse surface of the sheet held by the sheet-holding unit; a load detection unit that detects the load applied to the push-up member; and a position detection unit that detects the position of the push-up member in the prescribed direction.　

Description

Parts Inspection Equipment

[0001] The present disclosure relates to a component inspection device.

[0002] Japanese Patent Application Laid-Open No. 2003-144999 discloses an electronic component delivery device that adsorbs electronic components attached to a wafer sheet onto a collet.

[0003] JP 2019-41007 A

[0004] The present disclosure provides a component inspection device that, when measuring the load applied to an electronic component using a load sensor, can measure the load applied to the electronic component with high accuracy by reducing disturbance values ​​that are measured as values ​​other than the true load value due to device vibration, etc.

[0005] A component inspection device according to one aspect of the present disclosure inspects electronic components while transporting them, classifies them into non-defective and defective components, and stores the electronic components in a storage member. The component inspection device includes a sheet holding unit that holds a sheet having a front surface and a back surface and having electronic components affixed to the front surface, a component holding unit that faces the front surface of the sheet held in the sheet holding unit and holds the electronic components, a push-up member that faces a push-up position on the back surface of the sheet held in the sheet holding unit, a drive unit that moves the push-up member in a predetermined direction toward the component holding unit, a stage that attracts an area around the push-up position on the back surface of the sheet held in the sheet holding unit, a load detection unit that detects a load applied to the push-up member, and a position detection unit that detects the position of the push-up member in the predetermined direction.

[0006] According to the present disclosure, when measuring the load applied to an electronic component using a load sensor, a component inspection device is provided that can measure the load applied to the electronic component with high accuracy by reducing disturbance values ​​that are measured as values ​​other than the true load value due to device vibration, etc.

[0007] FIG. 1 is a side view schematically showing an example of a part inspection apparatus. FIG. 2 is a block diagram showing an example of the functional configuration of a controller. FIG. 3 is a block diagram showing an example of the hardware configuration of the controller. FIG. 4 is a flowchart showing an example of a series of processes executed by the controller. FIGS. 5A and 5B are schematic diagrams showing an example of operations during push-up. FIGS. 6A and 6B are schematic diagrams showing an example of operations during push-up. FIG. 7 is a schematic diagram showing an example of operations during push-up. FIG. 8 is a flowchart showing an example of a series of processes executed by the controller. FIG. 9 is a flowchart showing an example of a series of processes executed by the controller. FIGS. 10A and 10B are schematic diagrams showing an example of operations during push-up. FIG. 11 is a graph showing an example of detected values ​​of position and load. FIGS. 12A, 12B, and 12C are schematic diagrams showing an example of operations during push-up. FIG. 13 is a flowchart showing an example of a series of processes executed by the controller.

[0008] An embodiment will be described below with reference to the drawings. In the description, the same elements or elements having the same functions are designated by the same reference numerals, and redundant description will be omitted.

[0009] [Component Inspection Apparatus] Fig. 1 is a side view that schematically illustrates a component inspection apparatus according to one embodiment. The component inspection apparatus 1 illustrated in Fig. 1 is a die sorter that inspects electronic components W while conveying them, classifies them into non-defective and defective components, and then accommodates the electronic components W in a container. The component inspection apparatus 1 may accommodate electronic components W that have been determined to be non-defective through inspection in the container. The component inspection apparatus 1 may also accommodate electronic components W in the container in a removable state. For example, after being accommodated in the container by the component inspection apparatus 1, the electronic components W are removed from the container and processed in a device separate from the component inspection apparatus 1.

[0010] Inspections performed by the component inspection apparatus 1 include, for example, visual inspection or electrical characteristic inspection. In addition to inspecting the electronic components W, the component inspection apparatus 1 may also perform marking. The container that contains the electronic components W after inspection by the component inspection apparatus 1 is, for example, a carrier tape, a tray, or a wafer sheet. The electronic components W to be inspected by the component inspection apparatus 1 may be components that have been formed in the pre-processing of semiconductor manufacturing and then separated by dicing or the like. The component inspection apparatus 1, which is a die sorter, operates at a higher speed than a mounter or bonder that mounts electronic components on a printed circuit board. In other words, the component inspection apparatus 1 processes a larger number of components per unit time than a mounter or bonder.

[0011] The component inspection device 1 includes, for example, an inspection unit 10, a supply unit 20, and a controller 100. The inspection unit 10 may have a function of transporting electronic components W, a function of inspecting the electronic components W, and a function of storing electronic components W that have been determined to be non-defective based on the inspection results of the electronic components W in a storage member.

[0012] The inspection unit 10 receives electronic components W from the supply unit 20 and transports the electronic components W along a circular orbit around a predetermined central axis. The inspection unit 10 transports a plurality of electronic components W along the circular orbit. The central axis of the circular orbit may be a vertical axis. In FIG. 1 , the Z-axis direction corresponds to the vertical direction. The electronic components W to be transported include main surfaces Wa and Wb that face opposite to each other.

[0013] The inspection unit 10 has a support part 12 and a plurality of component holding parts 14. FIG. 1 shows one component holding part 14. The support part 12 supports the plurality of component holding parts 14 so that they are positioned on the circular orbit and is rotated by a drive part around a vertical axis. Each of the plurality of component holding parts 14 holds an electronic component W. The support part 12 may rotate intermittently, repeatedly rotating and stopping. The support part 12 rotates intermittently so that each of the plurality of component holding parts 14 stops at a predetermined stopping position on the circular orbit. As a result, the electronic components W held by each of the plurality of component holding parts 14 are transported while repeatedly moving and stopping.

[0014] Each of the multiple component holders 14 stops in turn at one of the stopping positions on the circular orbit. Each time a component holder 14 is positioned at a predetermined stopping position on the circular orbit, that component holder 14 receives an electronic component W from the supply unit 20. Hereinafter, the stopping position at which the inspection unit 10 receives an electronic component W from the supply unit 20 will be referred to as the "supply position." The inspection unit 10 may inspect the electronic component W at a stopping position located downstream of the supply position on the circular orbit. The inspection unit 10 may store the electronic component W determined (classified) as a non-defective product by inspection in a storage member at a stopping position located downstream of the stopping position at which the inspection of the electronic component W is performed on the circular orbit.

[0015] (Supply Unit) The supply unit 20 is a unit that sequentially supplies each of the multiple electronic components W to the inspection unit 10 (at different times). The supply unit 20 is disposed, for example, below the support portion 12. The supply unit 20 may include a pickup portion 30 and a component supply portion 50.

[0016] The pickup unit 30 is a so-called rotary pickup. The pickup unit 30 is configured to transport the electronic components W along a circular orbit (hereinafter referred to as "circular orbit CR2") different from the circular orbit along which the electronic components W are transported by the inspection unit 10, and to deliver the electronic components W to the component holder 14 of the inspection unit 10. The pickup unit 30 includes, for example, a support unit 32, a plurality of component holders 34, a rotation drive unit 36, and a rotation position detection unit 38.

[0017] The support portion 32 supports the component holders 34 so that they are positioned on the circular orbit CR2. The component holders 34, supported by the support portion 32, are positioned on the circular orbit CR2. The support portion 32 is rotatable about a central axis Ax2 of the circular orbit CR2. The central axis Ax2 of the circular orbit CR2 may be a horizontal axis. In the example shown in FIG. 1 , the central axis Ax2 of the circular orbit CR2 extends in a direction perpendicular to the plane of the page. The component holders 34 may be fixed (attached) to the support portion 32 so as to be arranged at equal intervals along a circumference around the central axis Ax2.

[0018] Each of the multiple component holding units 34 holds an electronic component W. Each of the multiple component holding units 34 receives an electronic component W from the component supply unit 50 and holds the received electronic component W. The component holding units 34 may hold the electronic component W in any manner. Specific examples of the manner of holding the electronic component W include vacuum suction, electrostatic suction, and gripping. The component holding units 34 hold the electronic component W while facing the electronic component W along the radial direction of the circular orbit CR2. The component holding units 34 may hold one of the main surfaces Wa and Wb facing outward from the circular orbit CR2, and hold the other of the main surfaces Wa and Wb by suction.

[0019] The component holding unit 34 includes, for example, a suction unit 42, a holder 44, and a spring 46. The suction unit 42 (component holding unit) holds the electronic component W by suctioning either the main surface Wa or the main surface Wb of the electronic component W. The suction unit 42 is, for example, a suction rod formed to extend along the radial direction of the circular orbit CR2, and suctions the main surface Wa of the electronic component W at an end facing outward from the circular orbit CR2. When the suction unit 42 holds the main surface Wa by suction, the main surface Wa of the electronic component W faces inward from the circular orbit CR2 (the central axis Ax2), and the main surface Wb of the electronic component W faces outward from the circular orbit CR2.

[0020] The holder 44 is fixed to the outer periphery of the support portion 32 and holds the suction portion 42 movably along the radial direction of the circular orbit CR2. The spring 46 is configured to resist the movement of the suction portion 42 along the radial direction. The spring 46 may be a coil spring. When a force toward the inside of the circular orbit CR2 is applied to the suction portion 42, the spring 46 applies a reaction force to the suction portion 42 that moves outward from the circular orbit CR2.

[0021] The supply unit 20 may have a suction unit 48 that generates a suction force for suctioning the electronic components W. The suction unit 48 includes, for example, a suction path that connects a space formed inside the suction unit 42 with a suction pump (vacuum pump). The suction unit 48 switches the suction state of the suction unit 42 between an on state and an off state using an opening / closing member such as an electromagnetic valve. The opening / closing state of the opening / closing member of the suction unit 48 is switched in response to an operation command from the controller 100. The supply unit 20 may have multiple suction units 48 corresponding to the multiple suction units 42, respectively. In FIG. 1 , one suction unit 48 is shown, and the other suction units 48 are omitted.

[0022] The rotational drive unit 36 ​​rotates the support unit 32 around the central axis Ax2 (central axis) of the circular orbit CR2 so as to move the component holders 34 along the circular orbit CR2. The rotational drive unit 36 ​​includes a power source such as an electric motor. The rotational drive unit 36 ​​may include a servo motor, a direct drive motor (DD motor), or an induction motor. The rotation of the support unit 32 by the rotational drive unit 36 ​​moves the component holders 34 (the suction units 42) along the circular orbit CR2. As a result, the electronic components W held by the component holders 34 (suction units 42) are transported along the circular orbit CR2.

[0023] The rotation drive unit 36 ​​is controlled to repeatedly rotate and stop the support unit 32 at an angular pitch (angular pitch around the central axis Ax2) between adjacent component holders 34 on the circular orbit CR2. Hereinafter, the multiple positions at which the multiple component holders 34 (more specifically, the multiple suction units 42) are positioned when the rotation drive unit 36 ​​stops the support unit 32 will be referred to as "multiple stop positions."

[0024] Of the multiple stop positions, the component holder 34 (suction unit 42) located at the stop position closest to the component supply unit 50 receives the electronic component W from the component supply unit 50. Here, an area that includes the stop position closest to the component supply unit 50 and in which the component holder 34 located at that stop position receives the electronic component W is defined as a "transfer area TA" (see FIG. 5A). The circular orbit CR2 is set to pass through the transfer area TA.

[0025] Each of the multiple component holders 34 receives an electronic component W in the transfer area TA (receiving the electronic component W in turn at different times). Each of the multiple suction units 42 is arranged in turn in the transfer area TA. Each time a suction unit 42 is arranged in the transfer area TA, that suction unit 42 receives an electronic component W. Of the multiple stop positions, the component holder 34 (suction unit 42) arranged at the stop position closest to the support unit 12 hands over the electronic component W to the component holder 14 of the inspection unit 10.

[0026] The rotational position detection unit 38 is a sensor that detects the rotational position of the support part 32 in the circumferential direction around the central axis Ax2 of the circular orbit CR2 (hereinafter simply referred to as the "circumferential direction"). The rotational position detection unit 38 detects, for example, information representing the position of the support part 32 in the circumferential direction from a reference position as the rotational position. The rotational position detection unit 38 may be provided inside the rotation drive unit 36 ​​that rotates the support part 32. The rotational position detection unit 38 may be any sensor that can detect the rotational position, and is, for example, a rotary encoder. The rotational position detection unit 38 may also be a slit sensor.

[0027] The rotational position detection unit 38 may be provided to detect the rotation angle of a shaft member arranged along the central axis Ax2 of the support unit 32 (pickup unit 30) instead of inside the rotation drive unit 36. The rotational position detection unit 38 may be provided directly on the shaft member, or may be provided at a position away from the shaft member (central axis Ax2). For example, the rotational position detection unit 38 may be provided on a transmission member connected to the shaft member and including a belt and a pulley.

[0028] The component supply unit 50 sequentially (at different times) supplies the plurality of electronic components W attached to the wafer sheet WS to the pickup unit 30. The component supply unit 50 may be arranged so as to be aligned in one direction horizontally with the pickup unit 30. A semiconductor wafer diced into a plurality of electronic components W is attached to one surface of the wafer sheet WS. Hereinafter, the surface of the wafer sheet WS to which the plurality of electronic components W are attached will be referred to as the "front surface WSa," and the surface of the wafer sheet WS opposite the front surface WSa will be referred to as the "back surface WSb." In other words, the wafer sheet WS has a front surface WSa and a back surface WSb, and one or more electronic components W are attached to the front surface WSa.

[0029] The main surfaces Wb of a plurality of electronic components W may be attached to the front surface WSa of the wafer sheet WS (see the enlarged view of FIG. 1). When viewing the front surface WSa of the wafer sheet WS, the plurality of electronic components W may be arranged in a matrix so as to be aligned both vertically and horizontally. The gap between adjacent electronic components W on the front surface WSa of the wafer sheet WS may be several tens of μm to several hundreds of μm. The component supply unit 50 includes, for example, a sheet holding unit 52, a sheet driving unit 56, a push-up member 60, a push-up driving unit 70, a stage 80, and a push-up driving unit 90.

[0030] The sheet holding unit 52 is configured to hold a wafer sheet WS (sheet). The sheet holding unit 52 holds the wafer sheet WS so that the surface WSa to which the plurality of electronic components W are affixed faces the pickup unit 30. The sheet holding unit 52 holds the wafer sheet WS so that the main surface Wa of the electronic component W to be supplied, among the plurality of electronic components W, faces the suction surface of the suction unit 42 of the component holding unit 34 arranged in the transfer area TA. The component holding unit 34 (suction unit 42) stopped at a stop position included in the transfer area TA faces the surface WSa of the wafer sheet WS held by the sheet holding unit 52.

[0031] The sheet holding unit 52 may hold the wafer sheet WS in a vertical position. The sheet holding unit 52 may hold the wafer sheet WS so that multiple electronic components W are two-dimensionally arranged in the vertical and horizontal directions. In the example shown in FIG. 1 , the suction surfaces of the suction units 42 in the transfer area TA and the main surfaces Wa of the electronic components W to be supplied face each other along the X-axis direction. The peripheral edge of the wafer sheet WS may be held by a ring holder 54. The ring holder 54 may hold the wafer sheet WS in an expanded state so as to increase the spacing between the multiple electronic components W. The sheet holding unit 52 may hold the wafer sheet WS via the ring holder 54.

[0032] The sheet driver 56 moves the sheet holder 52 in a direction along the front surface WSa of the wafer sheet WS. As the sheet driver 56 moves the sheet holder 52, the position of the wafer sheet WS held by the sheet holder 52 changes. As the position of the wafer sheet WS changes, the positions of the electronic components W on the wafer sheet WS relative to the pickup unit 30 (transfer area TA) change. The sheet driver 56 moves the sheet holder 52 in each of the two directions in which the multiple electronic components W on the wafer sheet WS are arranged.

[0033] The sheet driving unit 56 includes, for example, a driving unit that moves the sheet holding unit 52 in a direction parallel to the central axis Ax2, and a driving unit that moves the sheet holding unit 52 in the Z-axis direction (vertical). As the sheet driving unit 56 moves the wafer sheet WS, one of the multiple electronic components W on the wafer sheet WS is positioned as the electronic component W to be supplied at a position facing the suction unit 42 located in the delivery area TA along the X-axis direction. Hereinafter, the position where the electronic component W to be supplied is positioned and facing the suction unit 42 located in the delivery area TA along the X-axis direction is defined as a "supply position P1."

[0034] The supply position P1 is set, for example, at the intersection of a virtual line passing through the central axis Ax2 and the center of the transfer area TA on a plane including the circular orbit CR2 and the surface WSa of the wafer sheet WS held by the sheet holding unit 52. The supply position P1 does not change even if the wafer sheet WS moves. The sheet driving unit 56 moves the sheet holding unit 52 so that each of the multiple electronic components W on the wafer sheet WS is sequentially placed at the supply position P1. The sheet driving unit 56 may move the sheet holding unit 52 by the distance (pitch) between the centers of adjacent electronic components W when sequentially placing each of the multiple electronic components W arranged in a row on the wafer sheet WS at the supply position P1.

[0035] The push-up member 60 faces a push-up position P2 on the back surface WSb of the wafer sheet WS held by the sheet holding unit 52. The push-up position P2 is a position on the back surface WSb of the wafer sheet WS that corresponds to the supply position P1 (the electronic component W to be supplied) when a certain electronic component W is placed at the supply position P1. The push-up position P2 corresponds to a portion of the back surface WSb of the wafer sheet WS that overlaps with the supply position P1 (e.g., the center of the electronic component W to be supplied) when a certain electronic component W is placed at the supply position P1, as viewed from a direction perpendicular to the wafer sheet WS. As the wafer sheet WS moves, the push-up position P2 changes on the back surface WSb of the wafer sheet WS.

[0036] The push-up member 60 is formed to extend along the X-axis direction, along which the delivery area TA and the supply position P1 are aligned. The push-up member 60 may be a pin member (needle-shaped member). The push-up member 60 may be composed of one or more needles. The tip of the push-up member 60 is formed to be able to push the back surface WSb of the wafer sheet WS to the push-up position P2 toward the suction unit 42 located in the delivery area TA. When the push-up member 60 pushes the wafer sheet WS, the area where the tip of the push-up member 60 contacts the wafer sheet WS may be smaller than the area of ​​the main surface Wb. The push-up member 60 may be held by a holder member. The push-up member 60, the wafer sheet WS, the electronic component W to be supplied, and the suction unit 42 located in the delivery area TA are arranged in this order along the X-axis direction.

[0037] The push-up drive unit 70 (drive unit) moves the push-up member 60 in a predetermined direction toward the component holder 34. The push-up drive unit 70 moves the push-up member 60 toward the suction unit 42 arranged in the delivery area TA, and moves the push-up member 60 away from the suction unit 42 arranged in the delivery area TA. In this disclosure, movement toward the delivery area TA (the suction unit 42 arranged in the delivery area TA) is referred to as "advancement," and movement away from the delivery area TA (the suction unit 42 arranged in the delivery area TA) is referred to as "retreat." Furthermore, advancement and retreat may be collectively referred to as "advancement and retreat."

[0038] The push-up drive unit 70 is a drive unit that advances or retreats the push-up member 60 along the X-axis direction (a predetermined direction). By advancing the push-up member 60, the push-up drive unit 70 can cause the push-up member 60 to protrude a push-up position P2 on the back surface WSb of the wafer sheet WS toward the suction unit 42. The push-up drive unit 70 includes, for example, a motor 72 and an advancing / retracting rod 74. The motor 72 generates a driving force for driving the push-up member 60 and transmits the driving force to the advancing / retracting rod 74. The advancing / retracting rod 74 is connected, for example, to a holder member that holds the push-up member 60. The advancing / retracting rod 74 advances and retreats along the X-axis direction due to the driving force of the motor 72, causing the push-up member 60 to advance and retreat along the X-axis direction.

[0039] The stage 80 is configured to suck an area around the push-up position P2 on the back surface WSb of the wafer sheet WS held by the sheet holding unit 52. The area sucked by the stage 80 corresponds to the electronic component W to be supplied that is arranged at the supply position P1 and at least a portion of each of one or more electronic components W located around the electronic component W to be supplied. The one or more electronic components W located around the electronic component W to be supplied include electronic components W adjacent to the electronic component W to be supplied in the vertical direction, horizontal direction, or diagonal direction.

[0040] The stage 80 may be formed in a tubular (e.g., cylindrical) shape extending parallel to the advance / retract direction of the push-up member 60. The stage 80 may be provided to be movable along the advance / retract direction of the push-up member 60. In this case, the stage 80 is formed so that it can adsorb the area around the push-up position P2 on the back surface WSb of the wafer sheet WS and then protrude that area toward the suction portion 42 located in the transfer area TA. The stage 80 includes, for example, a main body 82 and a cover member 84. The main body 82 is a tubular member having an internal space and is open at one end close to the wafer sheet WS in the advance / retract direction. The cover member 84 is provided at the open end of the main body 82 and, together with the main body 82, forms an internal space of the stage 80. The push-up member 60 is housed in the internal space of the stage 80.

[0041] The cover member 84 includes a tip surface that can come into surface contact with the back surface WSb of the wafer sheet WS. As viewed in the X-axis direction, the size of the cover member 84 is larger than the size of one electronic component W. The cover member 84 is provided with a plurality of suction holes 86 for applying a suction force to the back surface WSb of the wafer sheet WS. Each of the plurality of suction holes 86 is formed to penetrate the cover member 84 along the X-axis direction. As viewed in the X-axis direction, one suction hole 86 is provided at a position corresponding to the push-up member 60, and the suction hole 86 has a size that allows the push-up member 60 to pass through. At least some of the other suction holes 86 located around the suction hole 86 through which the push-up member 60 passes are formed at positions that overlap with electronic components W located around the electronic component W to be supplied, as viewed in the X-axis direction.

[0042] The component supply unit 50 has a suction unit 88. The suction unit 88 sucks gas from inside the stage 80 so as to create a negative pressure in the internal space of the stage 80. The suction unit 88 includes, for example, a flow path connecting the internal space of the stage 80 to a suction pump (vacuum pump) and an opening / closing member such as an electromagnetic valve that opens and closes the flow path. The suction unit 88 switches the suction state of the stage 80 between an on state and an off state using, for example, the opening / closing member such as an electromagnetic valve. The open / close state of the opening / closing member of the suction unit 88 is switched in response to an operation command from the controller 100.

[0043] The stage 80 may be held by a holder member 89. The holder member 89 and the advancing / retracting rod 74 of the push-up drive unit 70 are configured so as not to interfere with each other. Even if the advancing / retracting rod 74 moves forward and backward when the push-up member 60 is driven, the holder member 89 does not move.

[0044] The push-up drive unit 90 (second drive unit) moves the stage 80 in the above-mentioned predetermined direction (the direction in which the push-up drive unit 70 moves the push-up member 60) toward the component holder 34. The push-up drive unit 90 advances the stage 80 toward the suction unit 42 arranged in the delivery area TA, and retracts the push-up member 60 away from the suction unit 42 arranged in the delivery area TA. The push-up drive unit 90 is a drive unit that moves the stage 80 forward and backward along the X-axis direction. Even when the stage 80 is driven by the push-up drive unit 90, the push-up member 60 does not move. As described above, the push-up drive unit 90 moves the stage 80 independently of the drive by the push-up drive unit 70 (driving the push-up member 60).

[0045] The push-up drive unit 90 advances the stage 80, thereby enabling the area of ​​the back surface WSb of the wafer sheet WS with which the cover member 84 (the tip surface of the cover member 84) makes surface contact to be protruded toward the suction unit 42. The push-up drive unit 90 includes, for example, a motor 92 and an advance / retract rod 94. The motor 92 generates a driving force for driving the stage 80 and transmits the driving force to the advance / retract rod 94. The advance / retract rod 94 is connected, for example, to a holder member 89 that holds the stage 80. The advance / retract rod 94 advances and retracts along the X-axis direction due to the driving force of the motor 92, causing the stage 80 to advance and retract along the X-axis direction.

[0046] (Load Detection Unit) The component inspection device 1 includes a load detection unit 22. The load detection unit 22 is a sensor that detects a load applied to the push-up member 60. The load detection unit 22 can detect the load applied to the push-up member 60 when the push-up member 60 contacts the back surface WSb of the wafer sheet WS and pushes out the push-up position P2 toward the suction unit 42. The load detection unit 22 may be provided in the push-up drive unit 70 (advance / retract rod 74). The load detection unit 22 may detect the load using any method. The load detection unit 22 may be a mechanical sensor that detects changes in electrical resistance, such as a strain gauge, or may be a load cell.

[0047] When the push-up member 60 pushes up the push-up position P2 and the electronic component W to be supplied is in contact with the suction portion 42, the push-up member 60 is subjected to a reaction force from the wafer sheet WS and a reaction force that the electronic component W receives from the suction portion 42. The value detected by the load detection portion 22 reflects the load applied to the electronic component W when pushed up by the push-up member 60. The load detection portion 22 may repeatedly detect the load acting on the push-up member 60 at a predetermined sampling period. The load detection portion 22 outputs information indicating the load applied to the push-up member 60 to the controller 100.

[0048] (Advance / Retraction Position Detection Unit) The part inspection device 1 is equipped with an advance / retraction position detection unit 26 (position detection unit). The advance / retraction position detection unit 26 is a sensor that detects the position of the push-up member 60 in the predetermined direction. The advance / retraction position detection unit 26 may detect the position in the X-axis direction (predetermined direction) of any part of the push-up member 60 and any part that is connected to the push-up member 60 and driven together. The advance / retraction position detection unit 26 detects, for example, the position in the X-axis direction of the tip of the push-up member 60. Even if the position of a part other than the tip of the push-up member 60 is detected, the position of the tip of the push-up member 60 in the X-axis direction can be obtained from the positional relationship between that part and the tip of the push-up member 60.

[0049] The advance / retract position detection unit 26 may use any method to detect the position of the push-up member 60. The advance / retract position detection unit 26 is, for example, an encoder installed in the motor 72 (e.g., a servo motor) of the push-up drive unit 70. The advance / retract position detection unit 26 may be a linear encoder installed somewhere in the push-up drive unit 70 instead of in the motor 72.

[0050] The advance / retract position detection unit 26 detects the position of the push-up member 60 in the X-axis direction at least during the period in which the push-up member 60 is driven by the push-up drive unit 70. The advance / retract position detection unit 26 may repeat detection of the position of the push-up member 60 in the X-axis direction at a predetermined sampling period. The advance / retract position detection unit 26 outputs information indicating the position of the push-up member 60 in the X-axis direction to the controller 100.

[0051] The component inspection apparatus 1 may also include an advance / retract position detection unit 28 (second position detection unit). The advance / retract position detection unit 28 is a sensor that detects the position of the stage 80 in the predetermined direction. The advance / retract position detection unit 28 may detect the position in the X-axis direction (predetermined direction) of any location of the stage 80 and any part connected to the stage 80 and driven together. The advance / retract position detection unit 28 detects, for example, the position of the tip of the stage 80 in the X-axis direction. The tip of the stage 80 corresponds to the surface of the cover member 84 that contacts the wafer sheet WS. Even if the position of a location other than the tip of the stage 80 is detected, the position of the tip of the stage 80 in the X-axis direction can be obtained from the positional relationship between that location and the tip of the stage 80.

[0052] The advance / retract position detection unit 28 may use any method to detect the position of the stage 80. The advance / retract position detection unit 28 is, for example, an encoder installed in the motor 92 (e.g., a servo motor) of the thrust-up drive unit 90. The advance / retract position detection unit 28 may be a linear encoder installed somewhere in the thrust-up drive unit 90 instead of in the motor 92.

[0053] The advance / retract position detection unit 28 detects the position of the stage 80 in the X-axis direction at least during the period in which the stage 80 is driven by the thrust drive unit 90. The advance / retract position detection unit 28 may repeat detection of the position of the stage 80 in the X-axis direction at a predetermined sampling period. The advance / retract position detection unit 28 outputs information indicating the position of the stage 80 in the X-axis direction to the controller 100.

[0054] The detection results of the advance / retract position detection unit 26 and the advance / retract position detection unit 28 are transmitted to the controller 100, thereby enabling the controller 100 to grasp the positional relationship between the push-up member 60 and the stage 80. As will be described in detail later, the controller 100 detects an abnormality in the load applied to the electronic component W to be supplied based on the detection results of the load detection unit 22, the advance / retract position detection unit 26, and the advance / retract position detection unit 28.

[0055] (Controller) The controller 100 is configured by one or more control computers. The controller 100 controls the inspection unit 10, the supply unit 20, the load detection unit 22, the advance / retract position detection unit 26, and the advance / retract position detection unit 28 in accordance with a predetermined control procedure so that predetermined processes are sequentially performed on the plurality of electronic components W.

[0056] 2, the controller 100 has, as its functional configuration (hereinafter referred to as "functional modules"), a transport control unit 102, a holding control unit 104, a sheet position control unit 106, a first thrust control unit 108, a second thrust control unit 110, a load data acquisition unit 112, a threshold setting unit 114, and an abnormality detection unit 116. The processes executed by these functional modules correspond to the processes executed by the controller 100.

[0057] The transport control unit 102 causes the rotation drive unit 36 ​​to intermittently rotate the support unit 32 so that the multiple suction units 42 are sequentially positioned at multiple stop positions on the circular orbit CR2. As a result, the support unit 32 rotates around the central axis Ax2, repeatedly rotating and stopping. The transport control unit 102 causes the rotation drive unit 36 ​​to intermittently rotate the support unit 32 at the same angular pitch as the angular pitch between adjacent suction units 42 on the circular orbit CR2. As a result, one of the suction units 42 is sequentially positioned in the transfer area TA. The transport control unit 102 may control the rotation drive unit 36 ​​based on the detection result of the rotational position of the support unit 12 obtained from the rotation position detection unit 38.

[0058] The holding control unit 104 controls the suction units 48 so that the suction units 42 hold the electronic components W to be held. For example, after a suction unit 42 not holding an electronic component W is placed in the transfer area TA, the holding control unit 104 switches the suction state of the suction unit 42 to the on state by the corresponding suction unit 48 when the suction unit 42 receives the electronic component W to be supplied from the wafer sheet WS. The holding control unit 104 may identify the individual suction unit 42 placed in the transfer area TA based on the detection result of the rotational position of the support unit 12 obtained from the rotational position detection unit 38. Then, the holding control unit 104 may control the suction unit 48 corresponding to the identified suction unit 42.

[0059] Each time any of the suction units 42 is positioned in the transfer area TA, the sheet position control unit 106 controls the sheet drive unit 56 so that one electronic component W on the wafer sheet WS is positioned at the supply position P1. For example, the sheet position control unit 106 performs the following control while a plurality of electronic components W arranged in a row on the wafer sheet WS are sequentially supplied to the pickup unit 30. After one electronic component W is supplied to the pickup unit 30, the sheet position control unit 106 may move the sheet holding unit 52 by the distance (pitch) between the centers of adjacent electronic components W so that the next electronic component W to be supplied is positioned at the supply position P1.

[0060] The first thrust-up control unit 108 controls the thrust-up drive unit 70 to advance and retreat the thrust-up member 60 along the X-axis direction, so that the thrust-up member 60 moves toward the suction unit 42 arranged in the transfer area TA. The first thrust-up control unit 108 controls the thrust-up drive unit 70 to advance the thrust-up member 60 from the origin position until the thrust-up member 60 reaches a predetermined displacement amount. The first thrust-up control unit 108 controls the thrust-up drive unit 70 to retreat from the advanced position where the predetermined displacement amount has been reached to the origin position.

[0061] When the push-up member 60 is disposed in the above-described forward position, the push-up member 60 is in a state in which it can push up the push-up position P2 on the back surface WSb of the wafer sheet WS toward the suction portion 42. When the push-up member 60 is disposed in the origin position, the push-up member 60 is not in a state in which it can push up the push-up position P2 on the back surface WSb of the wafer sheet WS. The origin position of the push-up member 60 may be set so that the tip of the push-up member 60 is spaced apart from the wafer sheet WS in a state in which it is held by the sheet holding portion 52 and is not being pushed up by any member.

[0062] The second thrust-up control unit 110 controls the thrust-up drive unit 90 to advance and retreat the stage 80 along the X-axis direction, so that the stage 80 moves toward the suction unit 42 arranged in the transfer area TA. The second thrust-up control unit 110 controls the thrust-up drive unit 90 to advance the stage 80 from the origin position until it reaches a predetermined displacement amount. The second thrust-up control unit 110 controls the thrust-up drive unit 90 to retreat from the advanced position where the predetermined displacement amount has been reached to the origin position. The second thrust-up control unit 110 may control the suction unit 88 to bring the stage 80 into a state where it can suction a portion of the back surface WSb of the wafer sheet WS during the thrust-up operation by the stage 80.

[0063] When the stage 80 is positioned in the forward position, the stage 80 is in a state in which it can push up the area around the push-up position P2 on the back surface WSb of the wafer sheet WS toward the suction portion 42. When the stage 80 is positioned in the origin position, the stage 80 is not in a state in which it can push up the area around the push-up position P2 on the back surface WSb of the wafer sheet WS. The origin position of the stage 80 may be set so that the tip of the stage 80 (the tip surface that comes into surface contact with the cover member 84) does not come into contact with the wafer sheet WS that is held by the sheet holding portion 52 and is not pushed up by any member.

[0064] The load data acquisition unit 112 acquires information indicating the load acting on the push-up member 60 from the load detection unit 22 at least during the period when the push-up member 60 is performing the push-up operation. The load data acquisition unit 112 may continue to acquire information indicating the load from the load detection unit 22 while the part inspection device 1 is operating.

[0065] The threshold setting unit 114 sets (changes) a threshold for detecting an abnormality in the load applied to the electronic component W depending on the individual suction unit 42 arranged in the delivery area TA. The springs 46 that apply a reaction force to the suction unit 42 also vary from one to another. Therefore, when the electronic component W to be supplied is sandwiched between the suction unit 42 and the push-up member 60 and the push-up member 60 further presses the electronic component W, the reaction force that the suction unit 42 receives from the spring 46 may vary depending on the individual suction unit 42 and the spring 46.

[0066] In view of the individual differences described above, when detecting load abnormalities by comparing the load applied to the electronic component W to be supplied with a threshold, if the same threshold is used, an allowable load value may be determined to be an abnormality, and an unallowable load value may be determined to be normal. This possibility increases particularly when load management is performed with small values. The threshold setting unit 114 may identify an individual suction unit 42 arranged in the transfer area TA based on the detection result of the rotational position of the support unit 12 obtained from the rotational position detection unit 38. The threshold setting unit 114 may then set a threshold corresponding to the identified suction unit 42. The controller 100 may pre-store thresholds set for each of the multiple suction units 42.

[0067] Furthermore, individual differences in the suction portions 42 (component holding portions 34) also result in individual differences in the length of the suction portions 42. If the lengths of the suction portions 42 differ between individuals, the timing at which the electronic component W begins to be sandwiched between the push-up member 60 and the suction portion 42 when the push-up member 60 protrudes will differ. The controller 100 may pre-store information indicating the length of the suction portion 42 (e.g., a correction value from a reference) for each of the multiple suction portions 42.

[0068] The abnormality detection unit 116 detects an abnormality in the load applied to the electronic component W to be supplied. The abnormality detection unit 116 acquires the position (relative position) of the push-up member 60 with respect to the stage 80, for example, based on the detection result by the advance / retract position detection unit 26. The abnormality detection unit 116 may acquire the position of the push-up member 60 with respect to the stage 80 by calculating the position of the push-up member 60 with respect to the stage 80 based on the detection result by the advance / retract position detection unit 26 and the detection result by the advance / retract position detection unit 28. The abnormality detection unit 116 may determine whether or not there is an abnormality in the load applied to the electronic component W, based on information indicating the load acting on the push-up member 60 and the acquired result of the position of the push-up member 60 with respect to the stage 80.

[0069] The abnormality detection unit 116 may evaluate a period during which the tip of the push-up member 60 protrudes beyond the tip of the stage 80 based on the acquired position of the push-up member 60 relative to the stage 80, and may compare the detection result of the load detection unit 22 with a threshold value (e.g., a threshold value set by the threshold setting unit 114) while excluding periods other than the period. The abnormality detection unit 116 may determine that the load applied to the electronic component W is abnormal if the load acting on the push-up member 60 exceeds the threshold value during the evaluation period during which the tip of the push-up member 60 protrudes beyond the tip of the stage 80. The abnormality detection unit 116 may set the start point of the evaluation period to the time point at which the clamping of the electronic component W starts, which is specified from information indicating the length stored for each individual suction unit 42 (e.g., the correction value) and the acquired position of the push-up member 60 relative to the stage 80.

[0070] When an abnormality is detected by the abnormality detection unit 116, the controller 100 may perform processing to reject the electronic component W that was supplied when the abnormality was detected. In addition to or instead of determining an abnormality based on the detection value by the load detection unit 22, the controller 100 may record the detection value detected by the load detection unit 22 while the component inspection apparatus 1 is operating.

[0071] 3, the controller 100 includes a circuit 150. The circuit 150 includes one or more processors 152, a memory 154, a storage 156, an input / output port 158, and a timer 159. The storage 156 includes a computer-readable storage medium, such as a non-volatile semiconductor memory. The storage 156 stores a program for causing the controller 100 to control the inspection unit 10, the supply unit 20, the load detection unit 22, the advance / retract position detection unit 26, and the advance / retract position detection unit 28 in accordance with a preset control procedure. For example, the storage 156 stores a program for configuring each of the above-mentioned functional modules.

[0072] The memory 154 temporarily stores programs loaded from a storage medium in the storage 156 and calculation results by the processor 152. The processor 152 executes the programs in cooperation with the memory 154 to configure each functional module of the controller 100. The input / output port 158 ​​inputs and outputs electrical signals between the rotation drive unit 36, the seat drive unit 56, the push-up drive unit 70, the push-up drive unit 90, the load detection unit 22, the suction unit 48, the advance / retract position detection unit 26, and the advance / retract position detection unit 28, etc., in accordance with instructions from the processor 152. The timer 159 measures elapsed time, for example, by counting reference pulses at a constant interval. Note that the circuit 150 is not necessarily limited to one that configures each function using a program. For example, at least some of the functions of the circuit 150 may be configured using a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) that integrates such a dedicated logic circuit.

[0073] [Control Method] Next, as an example of a control method, a series of processes executed by the controller 100 will be described. Fig. 4 is a flowchart showing a series of processes executed by the controller 100 when one electronic component W is supplied from the component supply unit 50 to the pickup unit 30. While this series of processes is being executed, the load data acquisition unit 112 continues to acquire load values ​​from the load detection unit 22, and the controller 100 continues to acquire position detection results from the advance / retract position detection unit 26 and the advance / retract position detection unit 28.

[0074] The controller 100 executes step S11 before an electronic component W to be supplied is placed at the supply position P1. In step S11, for example, the sheet position control unit 106 controls the sheet drive unit 56 so that one electronic component W to be supplied is placed at the supply position P1. In conjunction with the execution of step S11, the transport control unit 102 controls the rotation drive unit 36 ​​so that one suction unit 42 scheduled to receive the electronic component W to be supplied is placed in the transfer area TA. After the suction unit 42 is placed in the transfer area TA, the holding control unit 104 may control the suction unit 48 so that the suction unit 42 is ready to suck the electronic component W.

[0075] 5A schematically shows the state after step S11 has been performed. When step S11 is performed, the push-up member 60 and the stage 80 are each positioned at their origin positions. The tip of the push-up member 60 positioned at the origin position does not protrude beyond the tip surface (the surface that contacts the wafer sheet WS) of the cover member 84 of the stage 80 positioned at the origin position. The tip of the push-up member 60 and its vicinity may be positioned within the suction hole 86 formed in the cover member 84 of the stage 80. When the push-up member 60 and the stage 80 are each positioned at their origin positions, no part (area) of the wafer sheet WS is pushed up, and the position in the X-axis direction where the entire wafer sheet WS is located at this time is indicated by "xs."

[0076] Next, the controller 100 executes step S12. In step S12, for example, the first push-up control unit 108 controls the push-up drive unit 70 to start advancing the push-up member 60. Furthermore, the second push-up control unit 110 controls the push-up drive unit 90 to start advancing the stage 80. The second push-up control unit 110 may control the suction unit 88 to cause the stage 80 to suck the area around the push-up position P2 of the wafer sheet WS, and then cause the push-up drive unit 90 to start advancing the stage 80.

[0077] The first push-up control unit 108 and the second push-up control unit 110 control the push-up drive units 70 and 90, respectively, so as to maintain a state in which the tip of the push-up member 60 does not protrude beyond the tip surface of the cover member 84 of the stage 80. By executing step S12, the push-up member 60 and the stage 80 each begin to move toward the suction unit 42 arranged in the transfer area TA. After executing step S12, the stage 80 moves forward so as to protrude the area around the push-up position P2 of the wafer sheet WS toward the suction unit 42 while sucking the area.

[0078] Next, the controller 100 executes steps S13 and S14. In step S13, for example, the second thrust control unit 110 waits until the stage 80 advances by the set value of the displacement amount. In step S14, for example, the second thrust control unit 110 controls the thrust drive unit 90 to stop the stage 80. By executing steps S13 and S14, the stage 80 advances by the set value of the displacement amount. The set value of the displacement amount for the stage 80 is set to a value that prevents the electronic component W to be supplied from contacting the suction unit 42 arranged in the delivery area TA. In other words, after the stage 80 has advanced by the set value of the displacement amount, the electronic component W to be supplied does not contact the suction unit 42 arranged in the delivery area TA.

[0079] 5B shows how the wafer sheet WS is pushed up by the advancement of the stage 80, and how the stage 80 stops before the electronic component W to be supplied comes into contact with the suction portion 42. While steps S12 to S14 are being performed, the tip of the push-up member 60 does not come into contact with the push-up position P2 on the back surface WSb of the wafer sheet WS. Furthermore, because the electronic component W to be supplied does not come into contact with the suction portion 42, no load is applied to the electronic component W due to the push-up of the wafer sheet WS unless an abnormality occurs. Even when step S14 is performed, the advancement of the push-up member 60 continues. As the stage 80 stops and the advancement of the push-up member 60 continues, the tip of the push-up member 60 protrudes beyond the front surface of the stage 80, and the tip of the push-up member 60 comes into contact with the push-up position P2 on the back surface WSb of the wafer sheet WS.

[0080] Next, the controller 100 executes steps S15 and S16. In step S15, for example, the first thrust control unit 108 waits until the thrust member 60 advances by the set value of the displacement amount. In step S16, for example, the first thrust control unit 108 controls the thrust drive unit 70 to stop the thrust member 60. By executing steps S12 to S16, the thrust member 60 advances by the set value of the displacement amount.

[0081] 6A shows a state in which the stage 80 is stopped while the push-up member 60 continues to advance. The push-up member 60 protrudes beyond the tip surface of the stopped stage 80, and the electronic component W to be supplied comes into contact with the suction unit 42 arranged in the transfer area TA. The set value of the displacement amount of the push-up member 60 is set to a value at which the tip of the push-up member 60 comes into contact with the push-up position P2 and the electronic component W to be supplied receives force (contact force) from both the suction unit 42 and the push-up member 60. The set value of the displacement amount of the push-up member 60 may also be set so that an excessive load is not applied to the electronic component W to be supplied, and a load is applied that does not cause any problems during the transfer of the electronic component W to be supplied.

[0082] In step S16, for example, the first push-up control unit 108 controls the push-up drive unit 90 so that the stage 80 starts to move backward in synchronization with the stop of the push-up member 60. When the push-up member 60 contacts the push-up position P2, the detection value of the load detection unit 22 reflects the reaction force acting from the suction unit 42 on the electronic component W to be supplied, which is caused by the push-up of the push-up member 60. Furthermore, when the push-up member 60 continues to move forward after contacting the push-up position P2, the detection value of the load detection unit 22 also reflects the reaction force that the suction unit 42 arranged in the delivery area TA receives from the spring 46.

[0083] When the push-up member 60 stops and pushes up the wafer sheet WS at the push-up position P2 toward the suction portion 42, the stage 80, which is sucking the area around the push-up position P2, retracts, causing a portion of the electronic component W to begin peeling off from the wafer sheet WS. If the push-up position P2 is set to be located approximately at the center of the electronic component W to be supplied, the electronic component W begins to peel off from, for example, the peripheral region of the main surface Wb of the electronic component W (the electronic component W is released from its attachment to the wafer sheet WS). Figure 6B illustrates an example of a portion of the electronic component W to be supplied peeling off from the wafer sheet WS.

[0084] Next, the controller 100 executes step S17. In step S17, for example, the controller 100 waits until a predetermined waiting time has elapsed since execution of step S16. The waiting time is set in advance by an operator or the like, and is set, for example, to a time period during which the retreating stage 80 does not reach the origin position. Note that, in order to clearly show the state in which the wafer sheet WS is peeled off, FIG. 6B illustrates a state in which the push-up member 60 stops in the pushing-up state and the stage 80 is retreated to the origin position.

[0085] Next, the controller 100 executes step S18. In step S18, for example, the first push-up control unit 108 controls the push-up drive unit 70 so that the push-up member 60 starts to retract. At the start of execution of step S18, the stage 80 is retracting. By executing step S18, a portion of the wafer sheet WS that had been pushed up toward the suction unit 42 from position xs begins to return to position xs. Because the suction unit 42 is adsorbing the electronic component W to be supplied, the entire main surface Wb of the electronic component W is peeled off from the front surface WSa of the wafer sheet WS. Because the retraction of the stage 80 was initiated and continued before execution of step S18, a portion of the main surface Wa of the electronic component W to be supplied has already been peeled off from the front surface WSa of the wafer sheet WS, making it easier for the entire main surface Wb of the electronic component W to be peeled off from the front surface WSa of the wafer sheet WS.

[0086] Next, the controller 100 executes step S19. In step S19, for example, the first push-up control unit 108 waits until the push-up member 60 retreats to the origin position. When the push-up member 60 reaches the origin position, the first push-up control unit 108 controls the push-up drive unit 70 to stop the push-up member 60. During the wait in step S19, the stage 80 reaches the origin position first, and the second push-up control unit 110 controls the push-up drive unit 90 to stop the stage 80. By executing step S19, as shown in FIG. 7 , the push-up member 60 (stage 80 and push-up member 60) moves to the origin position, the wafer sheet WS is no longer pushed up, and the electronic component W is delivered to the suction unit 42.

[0087] Next, the controller 100 executes step S20. In step S20, for example, the abnormality detection unit 116 determines whether the detection value of the load detection unit 22 exceeds a threshold value. The abnormality detection unit 116 may calculate (acquire) the relative position of the push-up member 60 with respect to the stage 80 from the detection results of the advance / retract position detection unit 26 and the advance / retract position detection unit 28, and identify a target period during which the tip of the push-up member 60 protrudes beyond the tip of the stage 80, among the periods during which the series of processes of steps S11 to S19 is performed. The abnormality detection unit 116 may determine whether the detection value of the load detection unit 22 exceeds the threshold value during the target period, without taking into account the detection value of the load detection unit 22 during periods other than the target period. In this case, the threshold value used for the determination may be set by the threshold setting unit 114 according to the suction unit 42 identified based on the detection result by the rotational position detection unit 38.

[0088] This completes the series of processes executed when supplying one electronic component W to the pickup unit 30. After completing this series of processes, the controller 100 may continue the series of processes of steps S11 to S20 with another electronic component W, which is a different individual, as the supply target. The controller 100 may control the pickup unit 30 and the inspection unit 10 so that the electronic component W supplied to the pickup unit 30 is supplied from the pickup unit 30 to the inspection unit 10. The controller 100 may control the inspection unit 10 so that the electronic component W supplied to the inspection unit 10 is transported, inspected, and placed in a container. When performing these processes, the controller 100 may determine whether the electronic component W is pass-quality based on the inspection results, and then place the electronic component W determined to be pass-quality by the inspection unit 10 in the container, and eject or place the electronic component W determined to be pass-quality by the inspection unit 10 in a container other than the container.

[0089] [Modifications] The above-described series of processes shown in FIG. 4 is an example and can be modified as appropriate. In the above-described series of processes, the controller 100 may execute one step and the next step in parallel, or may execute the steps in an order different from that of the above-described example. The controller 100 may execute processing of any step with content different from that of the above-described example. In steps S17 and S18, the controller 100 may control the push-up driver 70 to start retracting the push-up member 60 after the retraction of the stage 80 is completed.

[0090] The controller 100 may execute a series of processes shown in Figures 8 and 9. In this series of processes, the controller 100 first executes steps S31 and S32, similar to steps S11 and S12 shown in Figure 4 (see Figure 8).

[0091] Next, the controller 100 executes steps S33 and S34. In step S33, for example, the second push-up control unit 110 waits until the push-up member 60 and the stage 80 advance by a first set amount from the origin position. The first set amount is preset to a value that prevents the electronic components W to be supplied from contacting the suction unit 42 even when the stage 80 pushes up the wafer sheet WS. In step S34, for example, the first push-up control unit 108 controls the push-up drive unit 70 to stop the push-up member 60, and the second push-up control unit 110 controls the push-up drive unit 90 to stop the stage 80.

[0092] Next, the controller 100 executes step S35. In step S35, for example, the controller 100 waits until a predetermined set time has elapsed since the completion of step S34. This set time is, for example, predetermined by an operator. When the thrust-up drive unit 70 starts to operate to start advancing the thrust member 60, a disturbance component may be generated in the detection value of the load detection unit 22 due to the influence of various components included in the thrust-up drive unit 70. The set time is set to a degree that can reduce the disturbance component associated with the start of operation of the thrust-up drive unit 70. In one example, the set time is several milliseconds to several tens of milliseconds.

[0093] Next, the controller 100 executes steps S36 and S37. In step S36, for example, the first push-up control unit 108 controls the push-up drive unit 70 to resume the advancement of the push-up member 60, and the second push-up control unit 110 controls the push-up drive unit 90 to resume the advancement of the stage 80. In step S37, for example, the second push-up control unit 110 waits until the stage 80 advances a second set amount from the origin position. Alternatively, the first push-up control unit 108 may wait until the push-up member 60 advances an amount corresponding to the second set amount. The second set amount is set to a value at which the electronic component W to be supplied contacts the suction unit 42. FIG. 10A schematically illustrates a state in which the electronic component W to be supplied contacts the suction unit 42 arranged in the delivery area TA due to the push-up by the stage 80.

[0094] Next, the controller 100 executes steps S38 and S39. In step S38, for example, the first thrust control unit 108 controls the thrust drive unit 70 to stop the thrust member 60, and the second thrust control unit 110 controls the thrust drive unit 90 to stop the stage 80. In step S39, for example, the controller 100 waits until a predetermined set time has elapsed since the completion of step S38. This set time is, for example, set in advance by an operator and is, for example, several milliseconds to several tens of milliseconds.

[0095] Next, the controller 100 executes step S40. In step S40, for example, the first thrust control unit 108 controls the thrust driving unit 70 to resume the forward movement of the thrust member 60. At the time of execution of step S40, the stage 80 continues to be stopped.

[0096] Next, as shown in FIG. 9 , the controller 100 executes steps S41 and S42. In step S41, for example, the first push-up control unit 108 waits until the push-up member 60 advances a third set amount from the origin position. The third set amount is set, for example, so that the push-up member 60 contacts the back surface WSb (push-up position P2) of the wafer sheet WS when the push-up member 60 has moved that set amount. In step S42, for example, the first push-up control unit 108 controls the push-up drive unit 70 to stop the push-up member 60. At the time step S42 is executed, the stage 80 remains stopped.

[0097] Next, the controller 100 executes steps S43 and S44. In step S43, for example, the controller 100 waits until a predetermined set time has elapsed since the completion of step S42. This set time is, for example, predetermined by an operator and is, for example, several milliseconds to several tens of milliseconds. In step S44, for example, the second thrust control unit 110 controls the thrust drive unit 90 to start retracting the stage 80. At the time step S44 is executed, the thrust member 60 remains stopped. As the stage 80 starts to retract, the thrust member 60 transitions to a state in which it protrudes beyond the stage 80, as shown in FIG. 10B .

[0098] Next, the controller 100 executes step S45. In step S45, for example, the controller 100 waits until a predetermined set time has elapsed since the completion of step S44. This set time is, for example, predetermined by an operator and is, for example, several milliseconds to several tens of milliseconds. During this time, the push-up member 60 stops and the stage 80 retracts, causing a portion of the main surface Wb of the electronic component W (for example, the peripheral region) to peel off from the wafer sheet WS.

[0099] Next, the controller 100 executes step S46. In step S46, for example, the first thrust control unit 108 controls the thrust drive unit 70 to start retracting the thrust member 60. At the time step S46 is executed, the stage 80 continues to retract. Then, when the stage 80 reaches the origin position, the controller 100 executes step S47. In step S47, for example, the second thrust control unit 110 controls the thrust drive unit 90 to stop the stage 80. Thereafter, when the thrust member 60 reaches the origin position, the controller 100 executes step S48. In step S48, for example, the first thrust control unit 108 controls the thrust drive unit 70 to stop the thrust member 60.

[0100] Next, the controller 100 executes step S49. In step S49, for example, the abnormality detection unit 116 determines whether or not the detection value detected by the load detection unit 22 exceeds a threshold value during the target period. For example, based on the detection results of the advance / retract position detection unit 26 and the advance / retract position detection unit 28, the abnormality detection unit 116 sets the target period to a period during which the push-up member 60 protrudes beyond the stage 80 and the electronic component W is sandwiched between the push-up member 60 and the suction unit 42.

[0101] 11 shows a schematic example of the detection results of the advance / retract positions and load values ​​of each member while the series of processes shown in Fig. 8 and Fig. 9 are being performed by the controller 100. The upper half of Fig. 11 shows a graph representing the change over time in the detection results (encoder values) of the positions of the push-up member 60 and the stage 80 in the X-axis direction. The lower half of Fig. 11 shows a graph representing the change over time in the detection results of the load acting on the push-up member 60 (values ​​detected by the load detection unit 22).

[0102] In the portion indicated by "a" on the graph showing the position detection results, the push-up member 60 and the stage 80 are each advancing. In the portion indicated by "b" on the graph, the push-up member 60 and the stage 80 are temporarily stopped before the electronic component W to be supplied comes into contact with the suction portion 42. As the push-up member 60 and the stage 80 temporarily stop, vibrations and the like caused by contact between the mechanical components within these members are stabilized. In the portion indicated by "c" on the graph, the electronic component W to be supplied comes into contact with the suction portion 42, and the advancement of the stage 80 is stopped. As the advancement of the push-up member 60 continues, the positions of the tip of the push-up member 60 and the tip of the stage 80 in the X-axis direction approximately coincide with each other, and the push-up member 60 is stopped.

[0103] In the portion indicated by "d" on the graph showing the position detection results, as the stage 80 starts to move backward, the tip of the push-up member 60 protrudes from the upper surface of the stage 80, and the push-up member 60 comes into contact with the wafer sheet WS and pushes it up. As a result, the electronic component W (more specifically, the electronic component W and the wafer sheet WS) becomes sandwiched between the push-up member 60 and the suction portion 42. In the portion indicated by "e" on the graph, the push-up member 60 and the stage 80 are both moving backward.

[0104] In the portion indicated by "A" on the graph showing the change in load value over time, a change in load value that appears to vibrate is observed due to the effect of contact between mechanical parts within the thrust drive unit 70 when the thrust member 60 starts to operate. A change in load value that appears to vibrate can also be observed in a time period prior to the portion indicated by "A." In the portion indicated by "C" on the graph, the effect of vibration of the mechanical parts within the thrust member 60 or the thrust drive unit 70 when the thrust member 60 is stopped is observed.

[0105] In the graph shown in FIG. 11 , the target period (target period) for determining whether or not there is an abnormality in the load applied to the electronic component W is indicated by "Te." The start of the target period Te is set, for example, at the time when the tip of the push-up member 60 protrudes beyond the tip of the stage 80 as the stage 80 starts to retract (the time when the protruding state begins). The end of the target period Te is set, for example, at the time when the tip of the push-up member 60 reaches a position where the electronic component W is pushed up by the push-up member 60 after the push-up member 60 starts to retract and the push-up member 60 is assumed to remain in contact with the wafer sheet WS. Note that the end of the target period Te may also be set at a time a predetermined time after the push-up member 60 starts to retract. In either case, the target period Te is set after the tip of the push-up member 60 protrudes beyond the tip of the stage 80.

[0106] In the graph of the load value, "Fth" represents a threshold value used to determine whether or not an abnormality exists. The threshold value Fth may be set for each individual suction unit 42 by the threshold setting unit 114. The abnormality detection unit 116 may determine whether or not the detected value by the load detection unit 22 exceeds the threshold value Fth during the target period Te. The abnormality detection unit 116 may determine that the load acting on the electronic component W to be supplied is abnormal if the detected value by the load detection unit 22 exceeds the threshold value Fth during the target period Te, and may determine that the load acting on the electronic component W to be supplied is not abnormal if the detected value by the load detection unit 22 does not exceed the threshold value Fth during the target period Te. In this case, the abnormality detection unit 116 determines whether or not an abnormality exists using the detected value of the load only during the target period Te, even if the detected value by the load detection unit 22 exceeds the threshold value Fth during periods other than the target period Te. In the example shown in FIG. 11 , the load value does not exceed the threshold value Fth in the portion indicated by "B," and therefore, it is determined that no abnormality exists.

[0107] 8 and 9, the controller 100 may omit steps S33 to S36. In other words, the controller 100 does not need to execute control to temporarily stop the push-up member 60 and the stage 80 while they are moving forward and before the electronic component W to be supplied comes into contact with the suction portion 42.

[0108] The component inspection apparatus 1 may include a load detection unit 24 in addition to the load detection unit 22 (see FIG. 10A or 10B ). The load detection unit 24 (second load detection unit) is a sensor that detects a load applied to the stage 80. The load detection unit 24 can detect a load applied to the stage 80 when the stage 80 advances and protrudes the area around the push-up position P2 on the back surface WSb of the wafer sheet WS toward the suction unit 42. The load detection unit 24 may be provided in the push-up drive unit 90 (advance / retract rod 94). The load detection unit 24 may be a sensor that detects a load using any method. The load detection unit 24 may be a mechanical sensor that detects changes in electrical resistance, such as a strain gauge, or a load cell. The load detection unit 24 may repeatedly detect the load acting on the stage 80 at a predetermined sampling period. The load detection unit 24 outputs information indicating the load applied to the stage 80 to the controller 100.

[0109] The load data acquisition unit 112 continues to acquire load values ​​from the load detection unit 24 in addition to the load detection unit 22. The load data acquisition unit 112 acquires information indicating the load acting on the stage 80 from the load detection unit 24 at least during the period when the stage 80 is performing the push-up operation. The load data acquisition unit 112 may continue to acquire information indicating the load from the load detection unit 24 while the part inspection apparatus 1 is operating.

[0110] Even in a component inspection apparatus 1 equipped with a load detection unit 24, the controller 100 may execute the series of processes of steps S11 to S20 described above, or may execute the series of processes of steps S31 to S39 described above. The abnormality detection unit 116 may detect an abnormality acting on the electronic component W based on information indicating the load acting on the stage 80. In the series of processes described above, before the stage 80 pushes up the wafer sheet WS and the electronic component W to be supplied contacts the suction unit 42, the load acting on the electronic component W is not reflected in the detection value of the load detection unit 24, but rather the reaction force acting from the wafer sheet WS on the stage 80 is reflected in the detection value. However, if for some reason the electronic component W to be supplied contacts the suction unit 42 while the stage 80 is pushing up the wafer sheet WS, the load associated with that contact (abnormal contact) may be reflected in the detection value of the load detection unit 24.

[0111] The abnormality detection unit 116 may determine that the load applied to the electronic component W is abnormal (that the electronic component W has made abnormal contact) when the load acting on the stage 80 exceeds a predetermined threshold. The abnormality detection unit 116 may determine that an abnormal load may have acted on the electronic component W when the detection value of the load detection unit 22 exceeds the threshold Fth or when the detection value of the load detection unit 24 exceeds a predetermined threshold during the target period Te. Different thresholds may be used for the abnormality determination based on the detection value of the load detection unit 22 and the abnormality determination based on the detection value of the load detection unit 24.

[0112] 8 and 9 are executed, the controller 100 may determine whether or not there is an abnormality using the detection value of the load detection unit 24 obtained after execution of step S36. In this case, the influence of disturbance components reflected in the detection value of the load detection unit 24 when the push-up drive unit 90 starts operating can be reduced to perform the determination. This improves the accuracy of determining whether or not there is an abnormality. Examples of causes of disturbance components that may be included in the detection value of the load detection unit 24 include contact between members included in the push-up drive unit 90, sliding resistance of movable parts included in the push-up drive unit 90, and vibration of springs or the like included in the push-up drive unit 90.

[0113] In the above example, the stage 80 is provided to be movable in the X-axis direction, but the stage 80 may also be fixed in a predetermined position. For example, as shown in FIG. 12A , the component supply unit 50 may have a sheet holding unit 52, a sheet driving unit 56, a push-up member 60, a push-up driving unit 70, and a stage 80, but may not have a push-up driving unit 90. FIG. 13 shows an example of a series of processes executed by the controller 100 when the stage 80 is not provided to be movable. In this series of processes, the controller 100 first executes step S51, similar to step S11 shown in FIG. 4 .

[0114] Next, the controller 100 executes step S52. In step S52, for example, the first push-up control unit 108 controls the push-up drive unit 70 to start advancing the push-up member 60. When starting the advancement of the push-up member 60, the controller 100 may control the suction unit 88 to start a state in which the stage 80 sucks the area around the push-up position P2 of the wafer sheet WS. After execution of step S52, the state in which the stage 80 sucks the area around the wafer sheet WS continues.

[0115] Next, the controller 100 executes steps S53 and S54. In step S53, for example, the first thrust control unit 108 waits until the thrust member 60 advances by the set value of the displacement amount. In step S54, for example, the first thrust control unit 108 controls the thrust drive unit 70 to stop the thrust member 60. By executing steps S52 to S54, the thrust member 60 advances by the set value of the displacement amount. Figure 12B illustrates a state in which the thrust member 60 has advanced by the set value.

[0116] Because the stage 80 is fixed, as the push-up member 60 continues to advance, the tip of the push-up member 60 protrudes beyond the tip of the stage 80 and comes into contact with the push-up position P2. Even after the tip of the push-up member 60 comes into contact with the push-up position P2, the push-up member 60 continues to advance, and the push-up position P2 is pushed toward the suction unit 42 arranged in the delivery area TA. At this time, because suction by the stage 80 continues, a portion of the electronic component W to be supplied (e.g., a peripheral region of the main surface Wb) peels off from the wafer sheet WS. The set value of the displacement amount of the push-up member 60 is set to a value at which the tip of the push-up member 60 comes into contact with the push-up position P2 and the electronic component W to be supplied receives force (contact force) from both the suction unit 42 and the push-up member 60. In addition, the set value of the displacement amount of the push-up member 60 may be set so that an excessive load is not applied to the electronic component W to be supplied, and so that a load is applied that does not cause any problems during the transfer of the electronic component W to be supplied.

[0117] Next, the controller 100 executes steps S55 and S56. In step S55, for example, the controller 100 waits until a predetermined waiting time has elapsed since execution of step S54. The waiting time is preset by an operator or the like. In step S56, for example, the first push-up control unit 108 controls the push-up drive unit 70 so that the push-up member 60 begins to retreat. By executing step S56, a portion of the wafer sheet WS that had been pushed up toward the suction unit 42 from position xs begins to return to position xs. Because the suction unit 42 is suctioning the electronic component W to be supplied, the entire main surface Wb of the electronic component W is peeled off from the front surface WSa of the wafer sheet WS. Because a portion of the main surface Wa of the electronic component W to be supplied has already been peeled off from the front surface WSa of the wafer sheet WS before execution of step S56, the entire main surface Wb of the electronic component W is likely to be peeled off from the front surface WSa of the wafer sheet WS.

[0118] Next, the controller 100 executes steps S57 and S58. In step S57, for example, the first push-up control unit 108 waits until the push-up member 60 retreats to the origin position. In step S58, for example, the first push-up control unit 108 controls the push-up drive unit 70 to stop the push-up member 60. By executing steps S57 and S58, as shown in FIG. 12C , the push-up member 60 moves to the origin position, the wafer sheet WS is no longer pushed up, and the electronic component W is delivered to the suction unit 42.

[0119] Next, the controller 100 executes step S59. In step S59, for example, the abnormality detection unit 116 determines whether the load applied to the electronic component W to be supplied is abnormal. In one example, the abnormality detection unit 116 acquires the position of the push-up member 60 relative to the stage 80 by acquiring the detection result by the advance / retract position detection unit 26. In this case, the abnormality detection unit 116 may calculate the relative position of the push-up member 60 relative to the stage 80. Since the stage 80 is fixed, the detection result by the advance / retract position detection unit 26 may be acquired as the relative position. Then, from the acquired result of the relative position of the push-up member 60 relative to the stage 80, the abnormality detection unit 116 may identify a target period during which the tip of the push-up member 60 protrudes beyond the tip of the stage 80, among the periods during which the series of processes of steps S51 to S58 was executed. The abnormality detection unit 116 may determine whether the detection value of the load detection unit 22 exceeded a threshold during the target period, without considering the detection value of the load detection unit 22 during periods other than the target period. In this case, the threshold value used for the determination may be set by the threshold value setting unit 114 in accordance with the suction portion 42 identified based on the detection result by the rotational position detection unit 38 .

[0120] The component inspection device 1 may have a single component holding unit instead of the pickup unit 30 (rotary pickup), and may be provided with a pickup unit configured to receive electronic components W from the supply unit 20 and deliver them to the component holding unit 14 of the inspection unit 10. In the various examples described above, at least a portion of the matters described in one example may be applied to other examples.

[0121] [Summary of the present disclosure] [1] A component inspection device 1 that inspects electronic components W while conveying them, classifies them into non-defective and defective products, and then stores the electronic components W in a storage member, the component inspection device 1 including a sheet holding unit 52 that holds a wafer sheet WS having a front surface WSa and a back surface WSb, with electronic components W affixed to the front surface WSa, and a plurality of component holding units 34 (suction units 42) that each face the front surface WSa of the wafer sheet WS held by the sheet holding unit 52 and hold the electronic components W, and The component inspection device 1 includes a push-up member 60 facing a push-up position P2 on the back surface WSb of the wafer sheet WS, a push-up drive unit 70 that moves the push-up member 60 in a predetermined direction toward the component holding unit 34 (suction unit 42), a stage 80 that adsorbs an area around the push-up position P2 on the back surface WSb of the wafer sheet WS held by the sheet holding unit 52, a load detection unit 22 that detects a load applied to the push-up member 60, and an advance / retract position detection unit 26 that detects the position of the push-up member 60 in the X-axis direction. Since the component inspection device 1 is provided with the load detection unit 22 (load sensor), it is possible to detect an abnormality in the load applied to the electronic component W due to the push-up by the push-up member 60. Meanwhile, as described above, the component inspection device 1 operates at high speed, and therefore the push-up member 60 is driven by the push-up drive unit 70 to repeatedly advance and retract at short intervals. As a result, even when the tip of the push-up member 60 does not protrude beyond the stage 80 and is not in contact with the wafer sheet WS, disturbances may occur in the detection value of the load detection unit 22 due to various vibrations and the like generated within the push-up drive unit 70 that drives the push-up member 60. Therefore, it has been discovered that simply determining the presence or absence of an abnormality using the detection value from the load detection unit 22 may result in an erroneous determination due to the disturbances. In contrast, the component inspection device 1 can identify a state in which the tip of the push-up member 60 protrudes beyond the stage 80 and is in contact with the wafer sheet WS based on the detection result from the advance / retract position detection unit 26, and can determine whether the load is abnormal by focusing on the time period when the electronic component W is sandwiched between the push-up member 60 and the component holding unit 34 (suction unit 42) using the detection value from the load detection unit 22.As a result, even if the push-up member 60 operates periodically at high speed, erroneous determinations due to the disturbances can be avoided and abnormalities can be detected with high accuracy. Therefore, in the component inspection device 1, when the load applied to an electronic component is measured by a load sensor, disturbance values ​​other than the true load value due to device vibrations and the like can be reduced, and the load applied to the electronic component can be measured with high accuracy.

[0122] [2] The component inspection device 1 described in [1] above further includes a plurality of component holding units 34 (plurality of suction units 42) including a component holding unit 34 (plurality of suction units 42), a support unit 32 that supports the plurality of component holding units 34 (plurality of suction units 42) so as to be positioned on a circular orbit CR2 that passes through a delivery area TA for receiving electronic components W from a wafer sheet WS, a rotational drive unit 36 ​​that rotates the support unit 32 to move the plurality of component holding units 34 (plurality of suction units 42) along the circular orbit CR2, and a rotational position detection unit 38 that is provided on the rotational drive unit 36 ​​or the support unit 32 and detects information representing the rotational position of the support unit 32 in the circumferential direction about the central axis (central axis line Ax2) of the circular orbit CR2 and that represents the rotational angle of the support unit 32, wherein each of the plurality of component holding units 34 (plurality of suction units 42) is configured to receive electronic components W from the wafer sheet WS in the delivery area TA. In this case, anomalies can be detected more accurately. The above configuration is even more useful when more strict control of the load applied to the electronic component W is required. For example, as described above, the reaction force acting from the spring 46 on the suction portion 42 may differ between the individual suction portion 42 and spring 46 (component holder 34) while the electronic component W is sandwiched between the push-up member 60 and the suction portion 42. The reaction force acting from the spring 46 on the suction portion 42 is reflected in the detection value by the load detection unit 22. The component inspection device 1 can identify which suction portion 42 is located in the transfer area TA based on the detection result by the rotational position detection unit 38. Therefore, by determining an abnormality using the detection value by the load detection unit 22 under conditions corresponding to the identified suction portion 42, the possibility of an erroneous determination can be reduced. In addition to or instead of the individual differences in the reaction force acting on the suction portions 42, as described above, the lengths of the individual suction portions 42 differ, and the timing (hereinafter referred to as "start timing") at which the state in which the electronic component W is sandwiched between the push-up member 60 and the suction portion 42 starts differs. By identifying which suction portion 42 is arranged in the transfer area TA, the start timing can be determined for each suction portion 42, even if there are individual differences, based on the information indicating the length corresponding to that suction portion 42 and the detection result of the advance / retract position detection portion 26.Then, by determining whether or not there is an abnormality using the detection value of the load detection unit 22 obtained after the start timing, it is possible to make a determination with high accuracy without being affected by external disturbances.

[0123] [3] The component inspection apparatus 1 according to [1] or [2] above, wherein the stage 80 is movable in the X-axis direction, and the component inspection apparatus 1 further includes a push-up drive unit 90 that moves the stage 80 along the X-axis direction toward the component holder 34 (suction unit 42), and an advance / retract position detector 28 that detects the position of the stage 80 in the X-axis direction. In this configuration, the advance / retract position detector 28 that detects the position of the stage 80 is provided, so that even if the stage 80 is movable, it is possible to identify a state in which the push-up member 60 protrudes beyond the stage 80 and is in contact with the wafer sheet WS. As a result, it is possible to move the stage 80 to more reliably perform the delivery operation of the electronic component W, while detecting the load applied to the electronic component with high accuracy.

[0124] [4] The component inspection apparatus 1 according to any one of [1] to [3] above, further comprising a load detection unit 24 that detects a load applied to the stage 80. In this case, if an electronic component W comes into contact with the component holding unit 34 (suction unit 42) while the stage 80 is pushing up the wafer sheet WS, the load applied to the electronic component W is reflected in the value detected by the load detection unit 24. This makes it possible to manage the load applied to the electronic component W not only during the period when the push-up member 60 is pushing up the wafer sheet WS, but also during the period when the stage 80 is pushing up the wafer sheet WS. This is therefore useful for improving the reliability of the electronic component W.

[0125] Note that, from the viewpoint of being able to manage the load applied to the electronic components W even while the stage 80 is pushing up the wafer sheet WS, the component inspection device according to the present disclosure may be configured as follows: [4A] A component inspection device that inspects electronic components W while transporting them, classifies them into non-defective and defective products, and then stores the electronic components W in a storage member, the component inspection device including: a sheet holding unit 52 that holds a wafer sheet WS having a front surface WSa and a back surface WSb and having electronic components W affixed to the front surface WSa; a component holding unit 34 (suction unit 42) that faces the front surface WSa of the wafer sheet WS held by the sheet holding unit 52 and holds the electronic components W; and a component holding unit 34 that faces a push-up position P2 of the back surface WSb of the wafer sheet WS held by the sheet holding unit 52. A component inspection device comprising: a push-up member 60; a push-up drive unit 70 that moves the push-up member 60 toward the component holding unit 34 (suction unit 42); a stage 80 that adsorbs the area around the push-up position P2 on the back surface WSb of a wafer sheet WS held by the sheet holding unit 52; a push-up drive unit 90 that moves the stage 80 toward the component holding unit 34 (suction unit 42); a load detection unit 22 that detects the load applied to the push-up member 60; and a load detection unit 24 that detects the load applied to the stage 80.

[0126] [5] The component inspection device 1 according to any one of [1] to [4], further comprising a controller 100 that acquires the position of the push-up member 60 relative to the stage 80 based on the detection result by the advance / retreat position detection unit 26. In this case, the state in which the tip of the push-up member 60 protrudes beyond the stage 80 can be identified from the position acquisition result. Therefore, it is possible to determine whether or not there is an abnormality in the load applied to the electronic component W by the controller 100, excluding the period in which the tip of the push-up member 60 is not in contact with the wafer sheet WS.

[0127] 1...component inspection device, W...electronic component, 10...inspection unit, 20...supply unit, 30...pickup section, 34...component holding section, 42...suction section, TA...delivery area, CR2...circular orbit, 50...component supply section, 52...sheet holding section, WS...wafer sheet, WSa...front surface, WSb...back surface, 60...push-up member, 70...push-up drive section, 80...stage, 90...push-up drive section, P2...push-up position, 22, 24...load detection section, 26, 28...advance / retreat position detection section, 100...controller.

Claims

1. A component inspection device which inspects electronic components as it is transported, classifies them into good and bad components, and then stores the electronic components in a storage member, comprising: a sheet holding section which holds a sheet having a front and a back surface, with the electronic components affixed to the front surface; a plurality of component holding sections, each of which faces the front surface of the sheet held in the sheet holding section and holds an electronic component; a push-up member which faces a push-up position on the back surface of the sheet held in the sheet holding section; a drive section which moves the push-up member along a predetermined direction toward one of the plurality of component holding sections; a stage which adsorbs an area surrounding the push-up position on the back surface of the sheet held in the sheet holding section; a load detection section which detects a load applied to the push-up member; a position detection section which detects the position of the push-up member in the predetermined direction; a support section which supports the plurality of component holding sections so as to be positioned on a circular orbit which passes through a transfer area for receiving the electronic components from the sheet; and a rotation drive section which rotates the support section so as to move the plurality of component holding sections along the circular orbit. a rotational position detection unit provided on the rotation drive unit or the support unit to detect information representing the rotational position of the support unit in the circumferential direction around the central axis of the circular orbit, the information representing the rotational angle of the support unit; and each of the plurality of component holding units is configured to receive the electronic component from the sheet in the delivery area.

2. A component inspection device which inspects electronic components as it is transported, classifies them into good and bad components, and then stores the electronic components in a storage member, comprising: a sheet holding unit which holds a sheet having a front and a back surface, with the electronic components affixed to the front surface; a component holding unit which faces the front surface of the sheet held in the sheet holding unit and holds the electronic components; a push-up member which faces a push-up position on the back surface of the sheet held in the sheet holding unit; a drive unit which moves the push-up member along a predetermined direction toward the component holding unit; a stage which adsorbs an area surrounding the push-up position on the back surface of the sheet held in the sheet holding unit and is arranged to be movable in the predetermined direction; a load detection unit which detects a load applied to the push-up member; a position detection unit which detects the position of the push-up member in the predetermined direction; a second drive unit which moves the stage along the predetermined direction toward the component holding unit; and a second position detection unit which detects the position of the stage in the predetermined direction.

3. The component inspection device according to claim 2, further comprising a second load detection unit that detects a load applied to the stage.

4. A component inspection device according to any one of claims 1 to 3, further comprising a controller that acquires the position of said push-up member relative to said stage based on the detection result by said position detection unit.

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