Hinge structure and electronic device comprising same
The hinge structure in electronic devices, featuring a strong protrusion and deformable cover, addresses the challenge of miniaturization and damage detection by allowing visible deformation upon impact, ensuring durability and ease of damage assessment in compact, multifunctional devices.
Patent Information
- Application Number
- PCT/KR2024/007908
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-08-24
- Filing Date
- 2024-06-10
- Publication Date
- 2025-01-23
AI Technical Summary
The increasing miniaturization and multifunctionality of electronic devices, particularly mobile communication terminals, require innovative hinge structures to accommodate larger displays while ensuring durability and ease of damage detection post-impact.
A hinge structure comprising a hinge bracket with a protrusion and a loop area, a hinge cover with a deformable portion, and a sheet between the protrusion and cover, where the protrusion's higher yield strength causes deformation of the cover upon impact, allowing for easy damage assessment.
Enables the accommodation of larger displays in compact devices while facilitating the detection of impact damage through visible deformation, maintaining aesthetic integrity and usability.
Smart Images

Figure KR2024007908_23012025_PF_FP_ABST
Abstract
Description
Hinge structure and electronic device including the same
[0001] One embodiment disclosed in this document relates to a hinge structure and an electronic device including the same.
[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.
[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.
[0004] As mobile communication services expand into the realm of multimedia services, the display size of electronic devices may increase to accommodate users' full access to multimedia services beyond voice calls and text messages. Accordingly, a foldable, flexible display may be placed across the entire housing structure, allowing for a separate, foldable structure.
[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.
[0006] An electronic device according to one embodiment of the present disclosure may include a flexible display including a first housing, a second housing, an area corresponding to the first housing and an area corresponding to the second housing, a hinge assembly at least a portion of which is disposed between the first housing and the second housing and rotatably connecting the first housing and the second housing, a hinge bracket in which the hinge assembly is accommodated and which includes a first protrusion formed to protrude in a direction opposite to the flexible display, a hinge cover formed to cover the hinge bracket and including a first portion facing the first protrusion and a second portion formed to surround at least a portion of the first portion; and a sheet disposed between the first protrusion of the hinge bracket and the first portion of the hinge cover.
[0007] A hinge structure of an electronic device according to one embodiment of the present disclosure may include a hinge assembly, a hinge bracket in which the hinge assembly is received, a first protrusion formed to protrude in a first direction, and a loop area formed to surround the first protrusion, a hinge cover formed to cover the hinge bracket, the hinge cover including a first portion protruding in a second direction opposite to the first direction so as to face the first protrusion, and a second portion formed to surround at least a portion of the first portion, and a sheet disposed between the first protrusion of the hinge bracket and the first portion of the hinge cover.
[0008] An electronic device according to one embodiment of the present disclosure may include a first housing, a second housing, a flexible display arranged to include an area corresponding to the first housing and an area corresponding to the second housing, and an electrical component arranged in the electronic device, and a bracket that accommodates the electrical component and includes a first protrusion formed to protrude in an opposite direction from the flexible display and a loop area arranged to surround at least a portion of the first protrusion, a cover formed to cover a portion of the bracket and including a first portion facing the first protrusion and a second portion formed to surround at least a portion of the first portion, and a sheet arranged between the first protrusion of the bracket and the first portion of the cover.
[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.
[0010] FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.
[0011] FIG. 3 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.
[0012] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.
[0013] FIG. 5 is an exploded perspective view showing the coupling relationship of a hinge bracket, a hinge cover, and a seat of an electronic device according to one embodiment of the present disclosure.
[0014] FIG. 6A is a drawing showing one side of a hinge bracket facing a hinge cover of an electronic device according to one embodiment of the present disclosure.
[0015] FIG. 6b is a cross-sectional view showing a portion of the arrangement structure between the hinge bracket and the hinge cover cut along line AA` of FIG. 6a according to one embodiment of the present disclosure.
[0016] FIG. 7A is a drawing showing one side of a hinge cover facing a hinge bracket of an electronic device according to one embodiment of the present disclosure.
[0017] FIG. 7b is a cross-sectional view showing a portion of the structure of a hinge cover cut along line BB` of FIG. 7a according to one embodiment of the present disclosure.
[0018] FIG. 8 is a perspective view of a structure in which a hinge bracket and a hinge cover of an electronic device are combined according to one embodiment of the present disclosure, viewed from one direction.
[0019] FIG. 9 is a cross-sectional view showing a process in which deformation occurs due to an external impact in a structure in which a hinge bracket and a hinge cover of an electronic device are combined according to one embodiment of the present disclosure.
[0020] FIG. 10 is a perspective view showing a hinge cover in which an appearance deformation has occurred according to one embodiment of the present disclosure.
[0021] FIG. 11 is a cross-sectional view showing the connection between a hinge bracket, a hinge cover, and a cover member of a hinge structure of an electronic device according to one embodiment of the present disclosure.
[0022] FIG. 12 is a cross-sectional view showing the connection between a hinge bracket, a hinge cover, a cover member, and a pressure-sensitive member of a hinge structure of an electronic device according to one embodiment of the present disclosure.
[0023] FIG. 13 is a drawing showing the inner side of a camera cover among the structures in which a camera cover and a camera bracket of an electronic device are combined according to one embodiment of the present disclosure.
[0024] FIG. 14 is a drawing showing a camera and a camera bracket among a structure in which a camera cover and a camera bracket of an electronic device are combined according to one embodiment of the present disclosure.
[0025] FIG. 15 is a cross-sectional view of a structure in which a camera cover and a camera bracket of an electronic device are combined according to one embodiment of the present disclosure.
[0026] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.
[0027] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.
[0028] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).
[0029] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.
[0030] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.
[0031] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).
[0032] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.
[0033] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.
[0034] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).
[0035] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).
[0036] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
[0037] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.
[0038] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.
[0039] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).
[0040] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
[0041] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
[0042] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
[0043] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
[0044] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.
[0045] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).
[0046] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
[0047] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).
[0048] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.
[0049] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).
[0050] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.
[0051] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).
[0052] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
[0053] FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.
[0054] FIG. 3 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.
[0055] Referring to FIGS. 2 and 3, the electronic device (101) may include a housing (201), a hinge cover (240) covering a foldable portion of the housing (201), and a display (230) disposed within a space formed by the housing (201). According to one embodiment, a surface on which a screen output from the display (230) is exposed is defined as a front surface of the electronic device (101) (e.g., a first front surface (210a) and a second front surface (220a)). A surface opposite to the front surface is defined as a rear surface of the electronic device (101) (e.g., a first rear surface (210b) and a second rear surface (220b)). In addition, a surface surrounding a space between the front surface and the rear surface is defined as a side surface of the electronic device (101) (e.g., a first side surface (210c) and a second side surface (220c)). The side of the electronic device (101) may be at least one side of the first housing (210) or the second housing (220). The electronic device (101) of FIGS. 2 and 3 may be referred to as a foldable electronic device, a portable electronic device, or a portable foldable electronic device. According to one embodiment, the housing (201) may be referred to as a foldable housing. The display (230) may be referred to as a “flexible display.”
[0056] According to one embodiment, the housing (201) may include a first housing (210), a second housing (220) rotatable with respect to the first housing (210), a first rear cover (280), and a second rear cover (290). The housing (201) of the electronic device (101) is not limited to the shape and combination shown in FIGS. 2 and 3, and may be implemented by other shapes or combinations and / or combinations of parts. For example, in one embodiment, the first housing (210) and the first rear cover (280) may be formed integrally, and the second housing (220) and the second rear cover (290) may be formed integrally.
[0057] According to one embodiment, the first housing (210) is connected to a hinge structure (e.g., the hinge assembly (202) of FIG. 4) and may include a first front surface (210a) facing a first direction and a first rear surface (210b) facing a second direction opposite to the first direction. The second housing (220) is connected to the hinge assembly (202) and includes a second front surface (220a) facing a third direction and a second rear surface (220b) facing a fourth direction opposite to the third direction, and may rotate about the hinge assembly (202) with respect to the first housing (210). Accordingly, the electronic device (101) may be variable between a folded state and an unfolded state. The electronic device (101) may have the first front side (210a) facing the second front side (220a) in a folded state, and the third direction may be the same as the first direction in an unfolded state. In the following, unless otherwise stated, the directions are described based on the unfolded state of the electronic device (101).
[0058] According to one embodiment, the first housing (210) and the second housing (220) are arranged on both sides with respect to the folding axis (A) as the center, and may have an overall symmetrical shape with respect to the folding axis (A). As described below, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the state of the electronic device (101) is in an unfolded state, a folded state, or an intermediate state. According to one embodiment, the second housing (220) additionally includes a sensor area (224) in which sensors (e.g., a front camera) are arranged, but may have a mutually symmetrical shape in other areas.
[0059] According to one embodiment, the folding axis (A) may be a plurality of parallel folding axes (e.g., two). In the present disclosure, the folding axis (A) is provided along the longitudinal direction (Y-axis direction) of the electronic device (101), but the direction of the folding axis (A) is not limited thereto. For example (not shown), the electronic device (101) may include a folding axis (A) extending along the width direction (e.g., X-axis direction).
[0060] According to one embodiment, the electronic device (101) may include a structure into which a digital pen can be attached. For example, the electronic device (101) may include a magnetic body configured to attach the digital pen to a side of the first housing (210) or a side of the second housing (220). According to one embodiment, the electronic device (101) may include a structure into which a digital pen can be inserted. For example, a hole (not shown) into which the digital pen can be inserted may be formed in a side of the first housing (210) or a side of the second housing (220) of the electronic device (101).
[0061] According to one embodiment, at least a portion of the first housing (210) and the second housing (220) may be formed of a metallic or non-metallic material having a rigidity of a size selected to support the display (230). At least a portion formed of the metallic material may provide a ground plane of the electronic device (101) and may be electrically connected to a ground line formed on a printed circuit board (e.g., the board portion (260) of FIG. 4).
[0062] According to one embodiment, the sensor area (224) may be formed to have a predetermined area adjacent to one edge or one corner of the second housing (220). However, the arrangement, shape, and size of the sensor area (224) are not limited to the illustrated example. For example, in another embodiment, the sensor area (224) may be provided in another corner of the second housing (220) or in any area between the upper and lower corners or in the first housing (210). In one embodiment, components for performing various functions built into the electronic device (101) may be exposed to the front of the electronic device (101) through the sensor area (224) or through one or more openings provided in the sensor area (224). In various embodiments, the components may include various types of sensors. The sensor may include, for example, at least one of a front camera, a receiver, or a proximity sensor.
[0063] According to one embodiment, the first rear cover (280) is disposed on one side of the folding axis (A) on the rear surface of the electronic device (101) and may have, for example, a substantially rectangular periphery, and the periphery may be wrapped by the first housing (210). Similarly, the second rear cover (290) is disposed on the other side of the folding axis (A) on the rear surface of the electronic device (101) and may have the periphery wrapped by the second housing (220).
[0064] According to one embodiment, the first rear cover (280) and the second rear cover (290) may have substantially symmetrical shapes with respect to the folding axis (A axis). However, the first rear cover (280) and the second rear cover (290) do not necessarily have mutually symmetrical shapes, and in other embodiments, the electronic device (101) may include the first rear cover (280) and the second rear cover (290) of various shapes.
[0065] According to one embodiment, the first rear cover (280), the second rear cover (290), the first housing (210), and the second housing (220) may form a space in which various components (e.g., a printed circuit board or a battery) of the electronic device (101) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (101). For example, at least a portion of a sub-display (e.g., the sub-display (244) of FIG. 4) may be visually exposed through at least a portion of the first rear cover (280). In another embodiment, one or more components or sensors may be visually exposed through at least a portion of the second rear cover (290). In various embodiments, the sensor may include a proximity sensor and / or a camera module (206) (e.g., a rear camera).
[0066] According to one embodiment, a front camera exposed to the front of the electronic device (101) through one or more openings provided in the sensor area (224) or a camera module (206) exposed through at least a portion of the second rear cover (290) may include one or more lenses, image sensors, and / or image signal processors. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).
[0067] According to one embodiment, the hinge cover (240) may be disposed between the first housing (210) and the second housing (220) to cover internal components (e.g., the hinge assembly (202) of FIG. 4). According to one embodiment, the hinge cover (240) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside, depending on the state of the electronic device (101) (flat state or folded state).
[0068] According to one embodiment, as illustrated in FIG. 2, when the electronic device (101) is in an unfolded state, the hinge cover (240) may be covered by the first housing (210) and the second housing (220) and may not be exposed. As another example, as illustrated in FIG. 3, when the electronic device (101) is in a folded state (e.g., a fully folded state), the hinge cover (240) may be exposed to the outside between the first housing (210) and the second housing (220). As another example, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded at a certain angle, the hinge cover (240) may be partially exposed to the outside between the first housing (210) and the second housing (220). However, in this case, the exposed area may be less than that in the fully folded state. In one embodiment, the hinge cover (240) may include a curved surface.
[0069] According to one embodiment, the display (230) may be placed on a space formed by the housing (201). For example, the display (230) may be mounted on a recess formed by the housing (201) and may constitute most of the front surface of the electronic device (101). Accordingly, the front surface of the electronic device (101) may include the display (230), a portion of the first housing (210) adjacent to the display (230) and a portion of the second housing (220). The rear surface of the electronic device (101) may include a first rear cover (280), a portion of the first housing (210) adjacent to the first rear cover (280), a second rear cover (290), and a portion of the second housing (220) adjacent to the second rear cover (290).
[0070] In one embodiment, the display (230) may include a plurality of displays spaced apart from each other. For example, the display (230) may include a first display area (231) disposed on a first housing (210) and a second display area (232) disposed on a second housing (220). In one embodiment, the first display area (231) and the second display area (232) may rotate about a folding axis (A).
[0071] According to one embodiment, the display (230) may refer to a display in which at least a portion of the display can be transformed into a flat or curved surface. For example, the display (230) may be a foldable or flexible display. According to one embodiment, the display (230) may include a folding area (233), a first display area (231) arranged on one side (e.g., the left side of the folding area (233) illustrated in FIG. 2) with respect to the folding area (233), and a second display area (232) arranged on the other side (e.g., the right side of the folding area (233) illustrated in FIG. 2). However, the division of the areas of the display (230) is exemplary, and the display (230) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the display (230) may be divided into regions by a folding region (233) extending parallel to the Y-axis or a folding axis (A-axis), but in other embodiments, the display (230) may be divided into regions based on other folding regions (e.g., a folding region parallel to the X-axis) or other folding axes (e.g., a folding axis parallel to the X-axis). According to one embodiment, the display (230) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer (not shown) configured to detect a magnetic field-type stylus pen.
[0072] According to one embodiment, the first display area (231) and the second display area (232) may have an overall symmetrical shape centered on the folding area (233). According to one embodiment (not shown), the second display area (232), unlike the first display area (231), may include a cut notch depending on the presence of the sensor area (224), but may have a shape symmetrical with respect to the first display area (231) in other areas. In other words, the first display area (231) and the second display area (232) may include a portion having a symmetrical shape and a portion having an asymmetrical shape.
[0073] Hereinafter, the operation of the first housing (210) and the second housing (220) and each area of the display (230) according to the state of the electronic device (101) (e.g., flat state or unfolded state and folded state) will be described.
[0074] According to one embodiment, when the electronic device (101) is in a flat state (e.g., FIG. 2), the first housing (210) and the second housing (220) may be arranged to face the same direction at a substantially 180-degree angle. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form a 180-degree angle with each other and face the same direction (e.g., toward the front of the electronic device). The folding area (233) may form the same plane as the first display area (231) and the second display area (232).
[0075] According to one embodiment, when the electronic device (101) is in a folded state (e.g., FIG. 3), the first housing (210) and the second housing (220) may be arranged to face each other. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form a narrow angle (e.g., between 0 and 10 degrees) with each other and may face each other. The folding area (233) may be formed as a curved surface having at least a portion of a predetermined curvature.
[0076] According to one embodiment, when the electronic device (101) is in an intermediate state (not shown), the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form an angle that is greater than the angle in the folded state and less than the angle in the unfolded state. The folding area (233) may be formed as a curved surface having at least a certain curvature, and the curvature at this time may be less than that in the folded state.
[0077] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.
[0078] Referring to FIG. 4, the electronic device (101) may include a housing (201), a display (230), a hinge assembly (202), a battery (250), and a substrate (260). The housing (201) may include a first housing (210), a second housing (220), a first rear cover (280), and a second rear cover (290). The configurations of the first housing (210), the second housing (220), the hinge cover (240), the first rear cover (280), and the second rear cover (290) of FIG. 4 may be all or part of the same as the configurations of the first housing (210), the second housing (220), the hinge cover (240), the first rear cover (280), and the second rear cover (290) of FIG. 2 and / or FIG. 3.
[0079] According to one embodiment, the first housing (210) and the second housing (220) can be assembled to each other so as to be coupled to both sides of the hinge assembly (202). According to one embodiment, the first housing (210) can include a first support area (212) capable of supporting a component of the electronic device (101) (e.g., the first circuit board (262) and / or the first battery (252)) and a first side wall (211) surrounding at least a portion of the first support area (212). The first side wall (211) can include a first side surface of the electronic device (101) (e.g., the first side surface (210c) of FIG. 2). According to one embodiment, the second housing (220) may include a second support area (222) capable of supporting a component of the electronic device (101) (e.g., a second circuit board (264) and / or a second battery (254)) and a second side wall (221) surrounding at least a portion of the second support area (222). The second side wall (221) may include a second side surface of the electronic device (101) (e.g., the second side surface (220c) of FIG. 2).
[0080] According to one embodiment, the display (230) may include a first display area (231), a second display area (232), a folding area (233), and a sub-display (244). The configuration of the first display area (231), the second display area (232), and the folding area (233) of FIG. 3 may be all or part of the same as the configuration of the first display area (231), the second display area (232), and the folding area (233) of FIG. 1 and / or FIG. 2.
[0081] According to one embodiment, the sub-display (244) can display a screen in a different direction from the display areas (231, 232). For example, the sub-display (234) can output a screen in a direction opposite to the first display area (231). According to one embodiment, the sub-display (234) can be disposed on the first rear cover (280).
[0082] In one embodiment, the battery (250) may include a first battery (252) disposed within the first housing (210) and a second battery (254) disposed within the second housing (220). In one embodiment, the first battery (252) may be connected to the first circuit board (262), and the second battery (254) may be connected to the second circuit board (264). In one embodiment, the battery (250) may supply power to at least one component of the electronic device (101). In one embodiment, the battery (250) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
[0083] In one embodiment, the substrate (260) may include a first circuit board (262) disposed within a first housing (210) and a second circuit board (264) disposed within a second housing (220). In one embodiment, the first circuit board (262) and the second circuit board (264) may be electrically connected by at least one flexible circuit board (266). In one embodiment, at least a portion of the flexible circuit board (266) may be disposed across the hinge assembly (202). In one embodiment, the first circuit board (262) and the second circuit board (264) may be disposed within a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). Components for implementing various functions of the electronic device (101) can be placed on the first circuit board (262) and the second circuit board (264).
[0084] According to one embodiment, the electronic device (101) may include speakers (208a, 208b). According to one embodiment, the speakers (208a, 208b) may convert electrical signals into sound. According to one embodiment, the speakers (208a, 208b) may be disposed within a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). According to one embodiment, the speakers (208a, 208b) may include an upper speaker (208a) positioned at the top (+Y direction) of the electronic device (101) and a lower speaker (208b) positioned at the bottom (-Y direction) of the electronic device (101). In the present disclosure, the speakers (208a, 208b) are illustrated as being positioned within one housing (e.g., the first housing (210) of FIG. 4), but this is an optional structure. For example, the speakers (208a, 208b) may be located within at least one of the first housing (210) or the second housing (220). The configuration of the speakers (208a, 208b) of FIG. 4 may be all or part of the same as the configuration of the sound output module (155) of FIG. 1.
[0085] In one embodiment, the electronic device (101) may include a rear member (270) (or rear case). In one embodiment, the rear member (270) may be disposed within a housing (201) (e.g., a second housing (220)). In one embodiment, the rear member (270) may accommodate at least one antenna (275).
[0086] According to one embodiment, the electronic device (101) may include an antenna (275). The antennas (275a, 275b) may include, for example, an ultra wide band (UWB) antenna (275a), a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna (275b). The antenna (275) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.
[0087] In one embodiment, an antenna structure may be formed by a portion or a combination of the housing (201). For example, the antenna (275) may include a communication antenna (275c) that is at least partially exposed to the exterior of the electronic device (101) and forms at least a portion of the exterior of the electronic device (101). The communication antenna (275c) may be used for communication with an external electronic device (e.g., Wi-Fi). The communication antenna (275c) may be connected to the upper portion (271a) or the lower portion (271b) of the rear member (270).
[0088] In the detailed description below, a configuration in which a pair of housings (or, "housings") are rotatably coupled by a hinge structure (or, "hinge structure") may be exemplified. However, it should be noted that this embodiment does not limit the electronic device according to various embodiments disclosed in the present document. For example, the electronic device according to various embodiments disclosed in the present document may include three or more housings, and "a pair of housings" in the embodiments disclosed below may mean "two housings rotatably coupled to each other among the three or more housings."
[0089] Below, the hinge structure is described in detail.
[0090] FIG. 5 is an exploded perspective view showing the coupling relationship of a hinge bracket, a hinge cover, and a seat of an electronic device according to one embodiment of the present disclosure.
[0091] FIG. 6A is a drawing showing one side of a hinge bracket facing a hinge cover of an electronic device according to one embodiment of the present disclosure.
[0092] FIG. 6b is a cross-sectional view showing a portion of the arrangement structure between the hinge bracket and the hinge cover cut along line AA` of FIG. 6a according to one embodiment of the present disclosure.
[0093] FIG. 7A is a drawing showing one side of a hinge cover facing a hinge bracket of an electronic device according to one embodiment of the present disclosure.
[0094] FIG. 7b is a cross-sectional view showing a portion of the structure of a hinge cover cut along line BB` of FIG. 7a according to one embodiment of the present disclosure.
[0095] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 4) may include a first housing (e.g., first housing (210) of FIG. 4), a second housing (e.g., second housing (220) of FIG. 4), a flexible display (e.g., flexible display (230) of FIG. 4), and a hinge structure (e.g., hinge assembly (202) and hinge cover (240) of FIG. 4) that rotatably connects the first housing and the second housing.
[0096] According to one embodiment, a hinge structure of an electronic device (e.g., an electronic device (101) of FIG. 4) may include at least one hinge (e.g., three hinges), a hinge bracket (300) for arranging the at least one hinge, and a hinge cover (240) covering the hinge bracket (300).
[0097] The configuration of the hinge bracket (300) and the hinge cover (240) of FIGS. 5, 6a, 6b, 7a, and 7b may be partially or completely identical to the configuration of the hinge assembly (202) of FIG. 4 and the hinge cover (240) of FIGS. 2 to 4. The embodiments of FIGS. 5, 6a, 6b, 7a, and 7b may be partially combined with the embodiments of FIGS. 1 to 4, or the embodiments of FIGS. 8 to 15.
[0098] According to one embodiment, the hinge bracket (300) may include a first region (S1) for receiving a hinge, a second region (S2) rotatably connected to a first housing (e.g., the first housing (210) of FIG. 4) and / or a second housing (e.g., the second housing (220) of FIG. 4), and a third region (S3) having a protrusion formed to protrude toward the hinge cover (240).
[0099] According to one embodiment, a plurality of hinge brackets (300) may be arranged between a first housing (e.g., a first housing (210) of FIG. 4) and a second housing (e.g., a second housing (220) of FIG. 4), depending on the position of the hinge. For example, the hinge brackets (300) may be arranged at the upper and lower portions, respectively, along the longitudinal direction (e.g., Y-axis direction) of the first housing (210) and / or the second housing (220). For example, the hinge brackets (300) may be arranged at the upper, lower, and middle portions (e.g., between the upper and lower portions) along the longitudinal direction (Y-axis direction) of the first housing (210) and / or the second housing (220). However, the configuration of the hinge bracket (300) is not limited thereto, and the design may be changed in various ways so that a plurality of hinges may be arranged within one hinge bracket (300).
[0100] According to one embodiment, the hinge bracket (300) may include a first surface (300a) facing the opposite direction of the hinge cover (240) and a second surface (300b) facing the hinge cover (240). A first area (S1) for placing the hinge may be located on the first surface (300a) of the hinge cover (240). A portion of the hinge may be located within an opening penetrating the hinge bracket (300). A second area (S2) for connecting with the first and second housings (210, 220) may be located on the first surface (300a) of the hinge cover (240). The second area (S2) may be an edge of the hinge bracket (300). The second region (S2) may include at least a portion of a curved shape for smooth connection corresponding to rotation between the first and second housings (210, 220).
[0101] According to one embodiment, the third area (S3) for arranging the first protrusion (310) may be located on the second surface (300b) of the hinge bracket (300). For example, the first protrusion (310) may protrude in a direction toward the hinge cover (240) (e.g., in a direction toward the -Z axis). The first protrusion (310) may be formed to face or contact the first part (410) of the hinge cover (240) so as to pressurize the first part (410) of the hinge cover (240) when an external impact occurs.
[0102] According to one embodiment, the third region (S3) of the hinge bracket (300) may include a first protrusion (310) and a loop area (320) arranged to surround the first protrusion (310). For example, the loop area (320) may have a grooved shape (e.g., a grooved shape) in the +Z-axis direction compared to other regions facing the second face (300b) of the hinge bracket (300) adjacent to the loop area (320) and the first protrusion (310). The loop area (320) may have a closed loop shape arranged to completely surround the first protrusion (310), or an open loop shape arranged to partially surround the first protrusion (310).
[0103] According to one embodiment, the first protrusion (310) may have a shape that protrudes in the -Z-axis direction more than the loop region (320). According to one embodiment, the first protrusion (310) may have a shape that forms a surface of the same height or protrudes more in the -Z-axis direction compared to another area facing the second surface (300b) of the hinge bracket (300) adjacent to the loop region (320). The loop region (320) may be disposed to face and be spaced apart from at least a portion of the second portion (420) of the hinge bracket (300).
[0104] According to one embodiment, the first protrusion (310) may be circular when the second surface (300b) of the hinge bracket (300) is viewed in the +Z-axis direction. For example, the circular first protrusion (310) may provide deformation of the hinge cover (240) when it collides with the hinge cover (240) due to an impact. The circular first protrusion (310) may be advantageous in deriving deformation results of the hinge cover (240) from various angles. However, the shape of the first protrusion (310) is not limited thereto, and the design may be changed to various shapes to confirm deformation of the hinge cover (240) from various angles.
[0105] According to one embodiment, the first protrusion (310) may have a shape whose size varies along the -Z-axis direction. For example, the size (e.g., circumference) of the first protrusion (310) may sequentially (or gradually) decrease along the -Z-direction. For example, the outer surface of the first protrusion (310) may form a sloped surface with a specified slope with respect to the loop region (320) adjacent to the first protrusion (310).
[0106] According to one embodiment, the sizes of the lower side (e.g., the side facing the -Z direction) of the first protrusion (310) and the upper side (e.g., the side facing the +Z direction) connected to the loop area (320) may be different. The diameter of the lower side (e.g., the side facing the -Z direction) of the first protrusion (310) may be smaller than the diameter of the upper side (e.g., the side facing the +Z direction) connected to the loop area (320). The first protrusion (310) that is sharp in the -Z direction may provide a strong force to the hinge cover (240). According to one embodiment, the cross-section of the first protrusion (310) may have a trapezoidal shape. However, the shape of the first protrusion (310) is not limited thereto, and may be designed and changed into various structures for applying deformation to the hinge cover (240), such as a cylindrical shape, a square pillar shape, or a polygonal pillar shape.
[0107] According to one embodiment, the hinge cover (240) may be disposed between a first housing (e.g., the first housing (210) of FIG. 4) and a second housing (e.g., the second housing (220) of FIG. 4) to cover internal components (e.g., the hinge bracket (300) and the hinge assembly (202) of FIG. 4) from being exposed to the outside. According to one embodiment, the hinge cover (240) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside depending on the state of the electronic device (101) (e.g., the folded state (or flat state) or the folded state).
[0108] According to one embodiment, the hinge cover (240) may include an inner side (400a) facing the hinge bracket (300) (e.g., a side facing the +Z axis) and an outer side (400b) facing the opposite direction of the hinge bracket (300) (e.g., a side facing the -Z axis). The hinge cover (240) may include a first portion (410) for providing an indicator function and a second portion (420) formed to surround at least a portion of the first portion (410).
[0109] According to one embodiment, the first part (410) of the hinge cover (240) may be positioned to face the first protrusion (310) of the hinge bracket (300). The first part (410) of the hinge cover (240) may be positioned on the inner surface (400a) of the hinge cover (240). For example, the first part (410) may protrude in a direction toward the hinge bracket (300) (e.g., in a direction toward the +Z axis). When an external impact occurs, the first protrusion (310) of the hinge cover (240) presses the first part (410) of the hinge cover (240), and the pressed force is transmitted to the outer surface (400b) of the hinge cover (240) (e.g., the outer surface area facing the first part (410)), thereby deforming the hinge cover (240). For example, a part of the outer surface (400b) of the hinge cover (240) may protrude.
[0110] According to one embodiment, the first protrusion (310) of the hinge bracket (300) may have a greater strength than the first portion (410) of the hinge cover (240). For example, the yield strength of the first protrusion (310) of the hinge bracket (300) may be greater than the yield strength of the first portion (410) of the hinge cover (240). For example, the yield strength of the first protrusion (310) of the hinge bracket (300) may be approximately 670 MPa to 800 MPa, and the yield strength of the first portion (410) of the hinge cover (240) may be approximately 419 MPa to 510 MPa. For example, the yield strength of the first protrusion (310) of the hinge bracket (300) may be approximately 730 Mpa, and the yield strength of the first part (410) of the hinge cover (240) may be approximately 469 Mpa. According to one embodiment, since the hinge bracket (300) is manufactured as a single piece of material, the yield strength may be the same as that of the first protrusion (310), and since the hinge cover (240) is also manufactured as a single piece of material, the yield strength may be the same as that of the first part (410). According to one embodiment, the hinge bracket (300) may be manufactured as a SUS (steel use stainless) material (e.g., SUS630), and the hinge cover (240) may be manufactured as a material including aluminum (e.g., AL 7N03). Since the first protrusion (310) of the hinge bracket (300) is relatively stronger than the first part (410) of the hinge cover (240), the force applied from the hinge bracket (300) can facilitate deformation of the hinge cover (240).
[0111] According to one embodiment, the second portion (420) of the hinge cover (240) may have a fine shape (e.g., a groove shape) in the -Z-axis direction compared to other areas of the hinge cover (240) adjacent to the second portion (420) and the first portion (410). The second portion (420) of the hinge cover (240) may be referred to as a recess, a groove, or an opening. The second portion (420) may have a closed loop shape arranged to completely surround the first portion (410), or an open loop shape arranged to partially surround the first portion (410).
[0112] According to one embodiment, the size of the second part (420) of the hinge cover (240) may be larger than the first protrusion (310) of the hinge bracket (300). For example, when the second part (420) and the first protrusion (310) have a circular shape, the outer diameter of the second part (420) may be larger than the outer diameter of the first protrusion (310). For example, the outer diameter of the first protrusion (310) may be larger than the outer diameter of the first part (410) and smaller than the outer diameter of the second part (420).
[0113] According to one embodiment, the first portion (410) may have a shape that protrudes more in the +Z-axis direction than the second portion (420). According to one embodiment, the first portion (410) may have a shape that forms a surface of the same height or protrudes more in the +Z-axis direction compared to another area facing the inner surface (400a) of the hinge cover (240) adjacent to the second portion (420).
[0114] According to one embodiment, the first part (410) may have a shape corresponding to the first protrusion (310). The first part (410) may be circular when the inner surface (400a) of the hinge cover (240) is viewed in the -Z-axis direction. For example, when the circular first part (410) provides deformation to the outer surface (400b) of the hinge cover (240) due to an impact, the outer surface (400b) of the hinge cover (240) is also deformed into a circle, which may be advantageous in deriving the deformation result from various angles. However, the shape of the first part (410) is not limited thereto, and may be designed and changed to various shapes to confirm the shape of the first protrusion (310) and the deformation of the hinge cover (240) from various angles.
[0115] According to one embodiment, the size of the first part (410) of the hinge cover (240) may be larger than the first protrusion (310) of the hinge bracket (300). For example, when the first part (410) and the first protrusion (310) have a circular shape, the outer diameter of the first part (410) may be larger than the outer diameter of the first protrusion (310).
[0116] According to one embodiment (e.g., see FIG. 7b), the ratio between the width (e.g., diameter (d1)) of the first portion (410) of the hinge cover (240) and the width (e.g., length (d2) from the outside of the first portion (410) to the outside of the second portion (420)) of the second portion (420) surrounding the first portion (410) may be approximately 5:3 (e.g., approximately 12:5 to 8:7). For example, the width (d1) of the first portion (410) of the hinge cover (240) may be at least 1.0 mm or more in consideration of an area for arranging the sheet (470). The width (d2) of the second portion (420) arranged to surround the first portion (410) may have a length of approximately 0.6 mm or more on both sides of the first portion (410). However, this can be designed in various ways taking into account the size and weight of the terminal.
[0117] According to one embodiment, the design of the hinge cover (240) considering deformation due to external pressure (e.g., impact) may take into account the weight of the hinge cover (240) and the thickness of the hinge cover (240) according to the weight. The thickness of the hinge cover (240) may be defined as a portion that can be easily deformed due to external pressure, for example, as a length (d3) from one side (e.g., one side facing the +Z axis) of the second portion (420) to the outer surface (400b).
[0118] Weight of hinge cover (g) 100 ~ 200 200 ~ 300 300 ~ 500 Thickness of hinge cover (mm) 0.25 or less 0.3 or less 0.35 or less
[0119] Referring to [Table 1], when the weight (g) of the hinge cover (240) is approximately 100 g or more and less than 200 g, the thickness (d3) of the hinge cover (240) may be 0.25 mm or less. When the weight (g) of the hinge cover (240) is approximately 200 g or more and less than 300 g (e.g., 250 g), the thickness (d3) of the hinge cover (240) may be 0.3 mm or less. When the weight (g) of the hinge cover (240) is approximately 300 g or more and less than 500 g, the thickness (d3) of the hinge cover (240) may be 0.35 mm or less.
[0120] According to one embodiment, a gap of a predetermined amount or greater may be formed between the hinge bracket (300) and the hinge cover (240). For example, a peripheral area of the loop area (320) of the hinge bracket (300) and a peripheral area of the second part (420) of the hinge cover (240) may be spaced apart from each other, thereby forming a gap of a predetermined amount or greater. For example, a gap may be formed between the second surface (300b) of the hinge bracket (300) and the inner surface (400a) of the hinge cover (240) facing it. According to one embodiment, the gap may be a minimum space for forward / backward movement (e.g., movement in the +Z-axis / -Z-axis direction) between the hinge bracket (300) and the hinge cover (240) due to an external impact. For example, the gap may be approximately 0.05 mm or greater.
[0121] According to one embodiment, a hinge structure of an electronic device (e.g., an electronic device (101) of FIG. 4) may include at least one hinge (e.g., three hinges), a hinge bracket (300) on which the at least one hinge is arranged, a hinge cover (240) covering the hinge bracket (300), and a sheet (470) arranged between the hinge bracket (300) and the hinge cover (240).
[0122] According to one embodiment, the hinge structure may be arranged such that the first protrusion (310) of the hinge bracket (300) and the first part (410) of the hinge cover (240) are in contact with each other.
[0123] According to one embodiment, the sheet (470) may be disposed between the first protrusion (310) of the hinge bracket (300) and the first part (410) of the hinge cover (240). The sheet (470) may be referred to as a buffer member that provides a buffering role between the hinge bracket (300) and the hinge cover (240). The sheet (470) may include a flexible material. For example, the sheet (470) may include at least one of materials that provide elasticity, such as rubber, polycarbonate (PC), polyethylene terephthalate (PET), or foam.
[0124] According to one embodiment, the sheet (470) may be bonded to the first protrusion (310) of the hinge bracket (300) and the first portion (410) of the hinge cover (240) to maintain alignment between the first protrusion (310) of the hinge bracket (300) and the first portion (410) of the hinge cover, regardless of the presence or absence of an impact. When an impact occurs, the sheet (470) may be flexibly deformed so that the force generated at the first protrusion (310) can be sufficiently transmitted to the first portion (410). The elastic force of the sheet (470) may be greater than the elastic force of the hinge bracket (300) or the hinge cover (240).
[0125] According to one embodiment, the sheet (470) may have a size (e.g., diameter) corresponding to the first portion (410) of the hinge cover (240) and / or the first protrusion (310) of the hinge bracket (300). For example, when the first portion (410) of the hinge cover (240) has a circular shape, the sheet (470) may be a circular sheet. For example, the sheet (470) may have a size (e.g., diameter) that is less than or equal to the size (e.g., diameter) of the first portion (410) of the hinge cover (240).
[0126] In one embodiment, the hinge cover (240) may have a greater strength than the hinge bracket (300). Since the hinge bracket (300) is manufactured as a single piece of material, the yield strength may be the same as that of the first protrusion (310), and since the hinge cover (240) is also manufactured as a single piece of material, the yield strength may be the same as that of the first portion (410). For example, the yield strength of the first portion (410) of the hinge cover (240) may be greater than the yield strength of the first protrusion (310) of the hinge bracket (300). Since the first part (410) of the hinge cover (240) is relatively stronger than the first protrusion (310) of the hinge bracket (300), the force applied from the first part (410) of the hinge cover (240) can facilitate deformation of the hinge bracket (300). Since the deformation of the hinge bracket (300) is not exposed by the hinge cover (240), the beauty of the device can be maintained regardless of external impact. Whether or not the hinge bracket (300) is deformed by external impact and / or the shape of the deformation can be confirmed after removing the hinge cover (240) during reassembly or repair.
[0127] FIG. 8 is a perspective view of a structure in which a hinge bracket and a hinge cover of an electronic device are combined according to one embodiment of the present disclosure, viewed from one direction.
[0128] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 4) may include a first housing (e.g., first housing (210) of FIG. 4), a second housing (e.g., second housing (220) of FIG. 4), a flexible display (e.g., flexible display (230) of FIG. 4), and a hinge structure (e.g., hinge assembly (202) and hinge cover (240) of FIG. 4) that rotatably connects the first housing and the second housing.
[0129] According to one embodiment, a hinge structure of an electronic device (e.g., an electronic device (101) of FIG. 4) may include at least one hinge (e.g., three hinges), a hinge bracket (300) for arranging the at least one hinge, and a hinge cover (240) covering the hinge bracket (300).
[0130] The configuration of the hinge bracket (300) and the hinge cover (240) of FIG. 8 may be partially or entirely identical to the configuration of the hinge bracket (300) and the hinge cover (240) of FIGS. 5, 6a, 6b, 7a, and 7b. The embodiments of FIG. 8 may be partially combined with the embodiments of FIGS. 1 to 7b, or the embodiments of FIGS. 9 to 15.
[0131] According to one embodiment, the hinge bracket (300) may include a first protrusion (310) and a loop region (320) arranged to surround the first protrusion (310). The first protrusion (310) may have a shape that protrudes toward the hinge cover (240) more than the loop region (320).
[0132] According to one embodiment, the hinge cover (240) may include a first portion (410) facing the first protrusion (310), and a second portion (420) formed to surround at least a portion of the first portion (410). The first portion (410) may have a shape that protrudes toward the hinge bracket (300) more than the second portion (420).
[0133] According to one embodiment, the hinge bracket (300) may include side edges (350a) (e.g., left side edge and right side edge) formed along the longitudinal direction (e.g., Y-axis direction) of the first housing (e.g., first housing (210) of FIG. 4) and / or the second housing (e.g., second housing (220) of FIG. 4)) and upper edges (350b) and lower edges formed along the direction perpendicular to the side edges (e.g., X-axis direction). The side edges (350a) (e.g., left side edge and right side edge) may be defined as longer side edges than the upper edges (350b) (and / or lower edges).
[0134] According to one embodiment, the first protrusion (310) of the hinge bracket (300) may be disposed adjacent to the upper edge (350b) or the lower edge of the hinge bracket (300). According to one embodiment, when there are a plurality of hinge brackets (300) and they are disposed to overlap the upper and lower sides of the hinge cover (240), the first protrusion (310) of one hinge bracket (300) may be disposed adjacent to the upper edge (350a) of the hinge bracket (300), and the first protrusion (310) of another hinge bracket (300) may be disposed adjacent to the lower edge of the hinge bracket (300).
[0135] According to one embodiment, when looking toward the outer surface of the hinge bracket (300) and / or the hinge cover (240) (e.g., when looking at the hinge cover (240) from the outside in the -Z direction), the first protrusion (310) of the hinge bracket (300) may be positioned at or adjacent to the center of the hinge bracket (300) (or the hinge cover (240)) with respect to the upper edge (350b) of the hinge bracket (300) (or the hinge cover (240)) (e.g., with respect to the width direction (X-axis direction)).
[0136] According to one embodiment, the hinge cover (240) may include side edges (450a) (e.g., left side edge and right side edge) formed along the longitudinal direction (e.g., Y-axis direction) of the first housing (e.g., first housing (210) of FIG. 4) and / or second housing (e.g., second housing (220) of FIG. 4)) and upper edges (450b) and lower edges formed along the direction perpendicular to the side edges (e.g., X-axis direction). The side edges (450a) (e.g., left side edge and right side edge) may be defined as longer side edges than the upper edges (450b) (and / or lower edges).
[0137] According to one embodiment, the first part (410) (or the first protrusion (310)) of the hinge cover (240) may be disposed adjacent to the upper edge (450b) or the lower edge of the hinge cover (240). According to one embodiment, when there are a plurality of hinge brackets (300) and they are disposed to overlap the upper and lower sides of the hinge cover (240), the first part (410) facing the first protrusion (310) of the upper edge (350b) of the hinge bracket (300) may be disposed adjacent to the upper edge (450b) of the hinge cover (240), and the first part (410) facing the first protrusion (310) of the lower edge of the hinge bracket (300) may be disposed adjacent to the lower edge of the hinge cover (240).
[0138] According to one embodiment, when viewed toward the outer surface of the hinge cover (240) (e.g., when viewed from the outside, toward the -Z direction at the hinge cover (240), the first portion (410) (or the first protrusion (310)) of the hinge cover (240) may be positioned at or adjacent to the center of the hinge cover (240) with respect to the upper edge (450b) of the hinge cover (240) (e.g., with respect to the width direction (X-axis direction)).
[0139] According to one embodiment, the first part (410) of the hinge cover (240) and the first protrusion (310) of the hinge bracket (300) may be positioned within a predetermined distance (d4) from the upper edge (450b) of the hinge cover (240). For example, the first part (410) of the hinge cover (240) and the first protrusion (310) of the hinge bracket (300) may be positioned approximately 5 mm or less from the upper edge (450b) of the hinge cover (240).
[0140] According to one embodiment, the first part (410) of the hinge cover (240) and the first protrusion (310) of the hinge bracket (300) may be positioned within a predetermined distance (d5) from the center (L) of the hinge cover (240) or the center based on the upper edge (450b) of the hinge cover (240) (e.g., based on the width direction (X-axis direction)). For example, the first part (410) of the hinge cover (240) and the first protrusion (310) of the hinge bracket (300) may be positioned approximately 1 mm to the left or right from the center (L) or the center of the hinge cover (240) based on the upper edge (450b) of the hinge cover (240) (e.g., based on the width direction (X-axis direction)).
[0141] When an electronic device's hinge structure is damaged and partially deformed due to an impact such as a drop, there is a high probability that the upper edge (450b, 350b) (and / or the lower edge) of the hinge cover (240) or the hinge bracket (300) will collide closely with the floor (e.g., the ground). Since the first protrusion (310) of the hinge bracket (300) is arranged adjacent to the upper edge (350b) (and / or the lower edge) of the hinge bracket (300), or the first part (410) of the hinge cover (240) is arranged adjacent to the upper edge (450b) (and / or the lower edge) of the hinge cover (240), the impact caused by the collision can be easily absorbed and transmitted.
[0142] In addition, when the hinge structure of the electronic device is damaged and partially deformed by an impact such as a drop, since the hinge cover (240) has a convex curved shape in the outward direction, there is a high probability that a collision occurs close to the floor (e.g., the ground) with the center (or the area adjacent to the center) of the hinge cover (240) or the hinge bracket (300) based on the upper edge (450b, 350b) of the hinge cover (240) or the hinge bracket (300). Since the first protrusion (310) of the hinge bracket (300) is arranged adjacent to the center (L) (or the area adjacent to the center) of the hinge bracket (300) or the first part (410) of the hinge cover (240) is arranged adjacent to the center (L) (or the area adjacent to the center) of the hinge cover (240), the impact caused by the collision can be easily absorbed and transmitted.
[0143] FIG. 9 is a cross-sectional view showing a process in which deformation occurs due to an external impact in a structure in which a hinge bracket and a hinge cover of an electronic device are combined according to one embodiment of the present disclosure.
[0144] FIG. 10 is a perspective view showing a hinge cover in which an appearance deformation has occurred according to one embodiment of the present disclosure.
[0145] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 4) may include a first housing (e.g., first housing (210) of FIG. 4), a second housing (e.g., second housing (220) of FIG. 4), a flexible display (e.g., flexible display (230) of FIG. 4), and a hinge structure (e.g., hinge assembly (202) and hinge cover (240) of FIG. 4) that rotatably connects the first housing and the second housing.
[0146] According to one embodiment, a hinge structure of an electronic device (e.g., an electronic device (101) of FIG. 4) may include at least one hinge (e.g., three hinges), a hinge bracket (300) for arranging the at least one hinge, and a hinge cover (240) covering the hinge bracket (300).
[0147] The configuration of the hinge bracket (300) and the hinge cover (240) of FIGS. 9 and 10 may be partially or entirely identical to the configuration of the hinge bracket (300) and the hinge cover (240) of FIGS. 5, 6a, 6b, 7a, 7b, and 8. The embodiments of FIGS. 9 and 10 may be partially combined with the embodiments of FIGS. 1 to 8, or the embodiments of FIGS. 11 to 15.
[0148] According to one embodiment, the hinge bracket (300) may include a first protrusion (310) and a loop area (320) arranged to surround the first protrusion (310). The first protrusion (310) may have a shape that protrudes in the direction of the hinge cover (240) (e.g., in the -Z-axis direction) more than the loop area (320).
[0149] According to one embodiment, the hinge cover (240) may include a first portion (410) facing the first protrusion (310), and a second portion (420) formed to surround at least a portion of the first portion (410). The first portion (410) may have a shape that protrudes further in the direction of the hinge bracket (300) (e.g., in the +Z-axis direction) than the second portion (420).
[0150] Referring to (a) of Fig. 9, when the hinge structure of the electronic device receives an external impact (P), the impact direction may be in the +Z-axis direction. For example, when the electronic device is dropped and the outer surface of the hinge cover (240) collides with the floor (e.g., the ground), the impact (P) may be applied to the outer surface of the hinge cover (240).
[0151] Referring to (b) of Fig. 9, when the impact applied to the hinge cover (240) is an external force greater than a certain level, the first part (410) of the hinge cover (240) and the first protrusion (310) of the hinge bracket (300) may collide with each other. The hinge cover (240) may be pushed in the +Z-axis direction as a whole, and a concentration of force may occur on the first part (410) of the hinge cover (240) and the first protrusion (310) of the hinge bracket (300) that protrude while facing each other. As the yield strength of the hinge bracket (300) is relatively greater than the yield strength of the hinge cover (240), the first protrusion (310) of the hinge bracket (300) presses the first part (410) of the hinge cover (240), and a part of the hinge cover (240) may be deformed.
[0152] Referring to (c) of FIG. 9 and FIG. 10, the first protrusion (310) of the hinge bracket (300) presses the first part (410) of the hinge cover (240), and the first part (410) of the hinge cover (240) is pushed in the -Z-axis direction, so that a protruding part (400c) may be formed on the outer surface (400b) of the hinge cover (240). The protruding part (400c) formed on the outer surface (400b) of the hinge cover (240) may have a shape corresponding to that of the first part (410) of the hinge cover (240). For example, the protruding part (400c) may have a circular shape when the first part (410) of the hinge cover (240) is a circular protrusion. The circular protruding portion (400c) may protrude more or less depending on the direction and location of the impact.
[0153] FIG. 11 is a cross-sectional view showing the connection between a hinge bracket, a hinge cover, and a cover member of a hinge structure of an electronic device according to one embodiment of the present disclosure.
[0154] FIG. 12 is a cross-sectional view showing the connection between a hinge bracket, a hinge cover, a cover member, and a pressure-sensitive member of a hinge structure of an electronic device according to one embodiment of the present disclosure.
[0155] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 4) may include a first housing (e.g., first housing (210) of FIG. 4), a second housing (e.g., second housing (220) of FIG. 4), a flexible display (e.g., flexible display (230) of FIG. 4), and a hinge structure (e.g., hinge assembly (202) and hinge cover (240) of FIG. 4) that rotatably connects the first housing and the second housing.
[0156] According to one embodiment, a hinge structure of an electronic device (e.g., electronic device (101) of FIG. 4) may include at least one hinge, a hinge bracket (300) for arranging the at least one hinge, and a hinge cover (240) covering the hinge bracket (300).
[0157] The configuration of the hinge bracket (300) and the hinge cover (240) of FIGS. 11 and 12 may be partially or entirely identical to the configuration of the hinge bracket (300) and the hinge cover (240) of FIGS. 5, 6a, 6b, 7a, 7b, 8, 9, and 10. The embodiments of FIGS. 11 and 12 may be partially combined with the embodiments of FIGS. 1 to 10, or the embodiments of FIGS. 13 to 15.
[0158] Referring to FIGS. 11 and 12, the hinge structure may include a hinge bracket (300), a hinge cover (240), and a cover member (510) that covers a portion of the hinge cover (240) so that it is not exposed.
[0159] According to one embodiment, the hinge bracket (300) may include a first protrusion (310) and a loop area (320) arranged to surround the first protrusion (310). The first protrusion (310) may have a shape that protrudes in the direction of the hinge cover (240) (e.g., in the -Z-axis direction) more than the loop area (320).
[0160] According to one embodiment, the hinge cover (240) may include a first portion (410) facing the first protrusion (310), and a second portion (420) formed to surround at least a portion of the first portion (410). The first portion (410) may have a shape that protrudes further in the direction of the hinge bracket (300) (e.g., in the +Z-axis direction) than the second portion (420).
[0161] According to one embodiment, a sheet (470) may be placed between the first protrusion (310) of the hinge bracket (300) and the first part (410) of the hinge cover (240).
[0162] According to one embodiment, the hinge cover (240) includes a deformable portion (430) having a first portion (410) and a second portion (420) formed thereon, and the deformable portion (430) may include a surface facing the +Z axis and a surface facing the -Z axis. The surface facing the +Z axis may be a region (430a) that is recessed compared to a surrounding region on which the first portion (410) and the second portion (420) are formed, and the surface facing the -Z axis may be a region (430a) that is recessed compared to a surrounding region. The recessed region (430a) of the deformable portion (430) may have a fine shape in the +Z axis direction.
[0163] According to one embodiment, a cover member (510) may be disposed within a space formed by a recessed area (430a) of a hinge cover (240). When the hinge structure is subjected to an external impact, an outer surface of the hinge cover (240) (e.g., a surface facing in the opposite direction to the first portion (410)) may be deformable to protrude in the -Z-axis direction. The cover member (510) may cover the deformable portion (430) so that the deformable portion of the hinge cover (240) is not exposed to the outside. For example, a surface of the cover member (510) facing the +Z-axis may be disposed to face the deformable portion (430), and a surface facing the -Z-axis may be disposed to be exposed to the outside.
[0164] According to one embodiment, the cover member (510) facing the recessed area (430a) of the hinge cover (240) may be arranged to form a predetermined gap in consideration of the variability of the deformable portion (430). For example, a gap may be formed between the cover member (510) and a surface facing the opposite direction from the first portion (410). According to one embodiment, the cover member (510) may be formed in a sheet type to facilitate subsequent separation and assembly.
[0165] According to one embodiment, the surface of the cover member (510) facing the -Z axis can be formed with the same color or the same material so as not to be distinguished from the surrounding hinge cover (240) portion. The surface of the cover member (510) facing the -Z axis can be seamlessly connected to the surrounding hinge cover (240) portion. The surface of the cover member (510) facing the -Z axis can form a curved surface with the same curvature as the surrounding hinge cover (240) portion when the surrounding hinge cover (240) portion is a curved surface.
[0166] According to one embodiment, the hinge structure may include an adhesive member (520) for bonding the cover member (510) to the recessed area (430a) of the hinge cover (240). The adhesive member (520) may be positioned at an edge of the cover member (510) in consideration of the variability of the deformable portion (430). The adhesive member (520) may be formed by tape or bonding.
[0167] According to one embodiment, since the outer surface of the hinge cover (240) is not exposed to the outside due to impact, the aesthetics of the electronic device can be maintained. When the cover member (510) is removed during disassembly and assembly for repair, the protruding portion of the deformable portion (430) can be checked to determine whether there is damage and / or the cause of the damage (e.g., dropping or intentional hitting).
[0168] Referring to FIG. 12, the hinge structure may include a pressure sensitive member (530) disposed between the deformable portion (430) of the hinge cover (240) and the cover member (510). The pressure sensitive member (530) may be advantageous in confirming the change of the deformable portion (430). The pressure sensitive member (530) is a member formed to sense pressure and may be in a sheet type shape (e.g., carbonless duplicating paper).
[0169] According to one embodiment, the cover member (510) and the pressure-sensitive member (530) positioned in the recessed area (430a) of the hinge cover (240) may be positioned to form a predetermined gap in consideration of the variability of the deformable portion (430). For example, a gap may be formed between the surface facing the opposite direction of the first portion (410) and the pressure-sensitive member (530).
[0170] According to one embodiment, since the outer surface of the hinge cover (240) is not exposed to the outside due to impact, the aesthetics of the electronic device can be maintained. When the cover member (510) is removed during disassembly and assembly for repair, the protruding portion of the deformable portion (430) and the portion indicated on the pressure-sensitive member (530) can be checked to determine whether there is damage and / or the cause of the damage (e.g., dropping or intentional hitting).
[0171] FIG. 13 is a drawing showing the inner side of a camera cover among the structures in which a camera cover and a camera bracket of an electronic device are combined according to one embodiment of the present disclosure.
[0172] FIG. 14 is a drawing showing a camera and a camera bracket among a structure in which a camera cover and a camera bracket of an electronic device are combined according to one embodiment of the present disclosure.
[0173] FIG. 15 is a cross-sectional view of a structure in which a camera cover and a camera bracket of an electronic device are combined according to one embodiment of the present disclosure.
[0174] Fig. 15 is a cross-sectional view taken in the direction of CC` of Fig. 3.
[0175] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 4) may include a first housing (e.g., first housing (210) of FIG. 4), a second housing (e.g., second housing (220) of FIG. 4), a flexible display (flexible display (230) of FIG. 4), and a camera structure.
[0176] According to one embodiment, at least a portion of a camera structure (e.g., a camera module) of an electronic device (e.g., an electronic device (101) of FIG. 4) may be exposed through a rear cover (290) of the electronic device.
[0177] The configuration of the camera structure of FIGS. 13, 14, and 15 may be partially or completely identical to the configuration of the camera module (180) of FIG. 1 and the camera module (206) of FIGS. 2 and 3. The embodiments of FIGS. 13 and 14 may be partially combined with the embodiments of FIGS. 1 to 12. For example, the configuration of the camera bracket (700), the camera cover (600), and the sheet (770) among the embodiments of FIGS. 13, 14, and 15 may be partially combined with the configuration of the hinge bracket (300) (e.g., the first protrusion (310) and the loop region (320)), the configuration of the hinge cover (240) (e.g., the first part (410) and the second part (420)), and the sheet (470) disclosed in the previous embodiments (FIGS. 5 to 12).
[0178] In one embodiment, the camera structure may include a camera module (206). The camera module (206) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, the camera structure may include at least one camera module (e.g., three camera modules), a camera bracket (700) for arranging the at least one camera module (206), and a camera cover (600) that covers the camera bracket (700) and forms a back surface of the electronic device together with the back surface cover (290).
[0179] In one embodiment, the camera bracket (700) may include a first side (700a) facing the opposite direction of the camera cover (600) and a second side (700b) facing the camera cover (600). An area for arranging the camera module (206) may be located on the first side (700a) of the camera bracket (700). A portion of the camera module (206) (e.g., a lens) may be located within an opening penetrating the camera bracket (700).
[0180] According to one embodiment, the camera bracket (700) may include a first protrusion (710) and a loop area (720) arranged to surround a portion of the first protrusion (710). The first protrusion (710) may have a shape that protrudes toward the camera cover (600) more than the loop area (720). The area where the first protrusion (710) of the camera bracket (700) is arranged may be located on the second surface (700b) of the camera bracket (700). For example, the first protrusion (710) may protrude in a direction toward the camera cover (600) (e.g., a direction toward the -Z axis). The first protrusion (710) may be a portion that faces the first part (510) of the camera cover (600) and may be designed to pressurize the first part (510) of the camera cover (600) when an external impact occurs.
[0181] According to one embodiment, the first protrusion (710) may be circular when the second surface (700b) of the camera bracket (700) is viewed in the +Z-axis direction. For example, the circular first protrusion (710) may cause deformation of the camera cover (600) when it collides with the camera cover (600) due to an impact. The circular first protrusion (710) may be advantageous in deriving deformation results of the camera cover (600) from various angles. However, the shape of the first protrusion (710) is not limited thereto, and the design may be changed to various shapes to confirm deformation of the camera cover (600) from various angles.
[0182] According to one embodiment, the camera cover (600) is configured to protect the camera module (206) placed on the camera bracket (700), and can cover components of the camera module (206) other than the lens so that they are not exposed to the outside. The camera cover (600) may be called a camera protection member or a camera decoration.
[0183] According to one embodiment, the camera cover (600) may include an inner side (600a) facing the camera bracket (700) (e.g., a side facing the +Z axis) and an outer side (600b) facing the opposite direction of the camera bracket (700) (e.g., a side facing the -Z axis). The camera cover (600) may include a first portion (610) for providing an indicator function and a second portion (620) formed to surround at least a portion of the first portion (610).
[0184] According to one embodiment, the first part (610) of the camera cover (600) may be positioned to face the first protrusion (710) of the camera bracket (700). The first part (610) of the camera cover (600) may be positioned on the inner surface (600a) of the camera cover (600). For example, the first part (610) may protrude in a direction toward the camera bracket (700) (e.g., a direction toward the +Z axis). The lens of the camera module (206) of the electronic device and the camera cover (600) protecting the same may be damaged first when an external impact (e.g., dropping) occurs due to the protruding structure. When the above external impact (e.g., dropping) occurs, the first protrusion (710) of the camera cover (600) presses the first part (610) of the camera cover (600), and the pressed force is transmitted to the outer surface (600b) of the camera cover (600) (e.g., the outer surface area facing the first part (610)), thereby deforming the camera cover (600). For example, a part of the outer surface (600b) of the camera cover (600) may protrude.
[0185] In one embodiment, the first protrusion (710) of the camera bracket (700) may have a greater strength than the first portion (610) of the camera cover (600). For example, the yield strength of the first protrusion (710) of the camera bracket (700) may be greater than the yield strength of the first portion (610) of the camera cover (600). Since the first protrusion (710) of the camera bracket (700) is relatively stronger than the first portion (610) of the camera cover (600), a force applied from the camera bracket (700) may facilitate deformation of the camera cover (600).
[0186] According to one embodiment, the second portion (620) of the camera cover (600) may have a recessed shape (e.g., a grooved shape) in the -Z direction compared to other areas of the camera cover (600) adjacent to the second portion (620) and the first portion (610). The second portion (620) of the camera cover (600) may be referred to as a recess, a groove, or an opening. The second portion (620) may have a closed loop shape arranged to completely surround the first portion (610), or an open loop shape arranged to partially surround the first portion (610).
[0187] According to one embodiment, a gap greater than a predetermined amount may be formed between the camera bracket (700) and the camera cover (600). For example, a peripheral area of a roof area (720) of the camera bracket (700) and a peripheral area of a second portion (620) of the camera cover (600) may be spaced apart from each other to form a gap greater than a predetermined amount. For example, a gap may be formed between the second surface (700b) of the camera bracket (700) and the inner surface (600a) of the camera cover (600) facing it. According to one embodiment, the gap may be a minimum space for forward / backward movement (e.g., movement in the +Z-axis / -Z-axis direction) between the camera bracket (700) and the camera cover (600) due to an external impact. For example, the gap may be approximately 0.05 mm or greater.
[0188] According to one embodiment, the camera structure may include at least one camera module (e.g., three camera modules), a camera bracket (700) on which the at least one camera module (206) is arranged, a camera cover (600) that covers the camera bracket (700) and forms a rear surface of the electronic device together with the rear cover (290), and a sheet (770) arranged between the camera bracket (700) and the camera cover (600).
[0189] According to one embodiment, the camera structure may be arranged such that the first protrusion (710) of the camera bracket (700) and the first part (610) of the camera cover (600) are in contact with each other.
[0190] According to one embodiment, the sheet (770) may be disposed between the first protrusion (710) of the camera bracket (700) and the first part (610) of the camera cover (600). The sheet (770) may be referred to as a buffer member that provides a buffering function between the hinge bracket (300) and the hinge cover (240). The sheet (470) may include a flexible material. For example, the sheet (770) may include at least one material that provides elasticity, such as rubber, polycarbonate (PC), polyethylene terephthalate (PET), or foam. The sheet (770) may be adhered to the first protrusion (710) of the camera bracket (700) and the first part (610) of the camera cover (600), respectively, to maintain alignment between the first protrusion (710) of the camera bracket (700) and the first part (610) of the camera cover (600), regardless of impact. When an impact occurs, the sheet (770) can be flexibly deformed so that the force of the first protrusion (710) can be sufficiently transmitted to the first portion (610).
[0191] In one embodiment, the sheet (770) may have a size (e.g., diameter) corresponding to the first portion (610) of the camera cover (600) and / or the first protrusion (710) of the camera bracket (700). For example, if the first portion (610) of the camera cover (600) has a circular shape, the sheet (770) may be a circular sheet. For example, the sheet (770) may have a size (e.g., diameter) that is less than or equal to the size (e.g., diameter) of the first portion (610) of the camera cover (600).
[0192] A foldable electronic device may include a foldable flexible display and a plurality of housings for supporting the flexible display. Various components may be arranged and / or mounted in each of the plurality of housings of the foldable electronic device. The foldable electronic device may include a hinge structure for easily folding or unfolding the flexible display.
[0193] When a foldable electronic device experiences an external impact, such as a drop, the hinge structure and / or the partially protruding camera structure located at the edge of the electronic device may deform the device's appearance upon impact with the ground (e.g., the ground). However, since it is difficult to distinguish between the intended impact shape and the impact caused by a drop on the electronic device's exterior, a method for distinguishing between these two may be necessary.
[0194] According to one embodiment of the present disclosure, in an electronic device, a structure for an indicator capable of detecting an external impact, such as a drop, is formed within a hinge structure and / or a camera structure, so that damage caused by the external impact can be conveniently detected.
[0195] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.
[0196] According to one embodiment of the present disclosure, in a hinge structure of a foldable electronic device, a structure can be provided in which a protrusion shape of a hinge bracket and a shape of a hinge cover corresponding to the protrusion shape are arranged facing each other. When an external impact occurs, the protrusion shape of the hinge bracket can press the hinge cover to change a portion of its shape, thereby allowing a consumer and / or a repairer to easily check for damage caused by the impact of a drop.
[0197] According to one embodiment of the present disclosure, in a camera structure of an electronic device, a structure can be provided in which a protrusion shape of a camera bracket and a shape of a camera cover corresponding to the protrusion shape are arranged facing each other. When an external impact occurs, the protrusion shape of the camera bracket can press the camera cover to change a portion of its shape, allowing consumers and / or repairers to easily check for damage caused by the impact of a drop.
[0198] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.
[0199] An electronic device (e.g., an electronic device (101) of FIGS. 1 to 4) according to one embodiment of the present disclosure comprises: a first housing (210), a second housing (220), a flexible display (230) including an area corresponding to the first housing and an area corresponding to the second housing, a hinge assembly (202) at least a portion of which is disposed between the first housing and the second housing and rotatably connects the first housing and the second housing, a hinge bracket (300) in which the hinge assembly is received and which includes a first protrusion (310) formed to protrude in a direction opposite to the flexible display, a hinge cover (240) including a first portion (410) formed to cover the hinge bracket and facing the first protrusion, and a second portion (420) formed to surround at least a portion of the first portion; And it may include a sheet (470) arranged between the first protrusion of the hinge bracket and the first part of the hinge cover.
[0200] In one embodiment, the yield strength of the first protrusion of the hinge bracket may be greater than the yield strength of the first portion of the hinge cover.
[0201] According to one embodiment, a gap may be formed between the hinge bracket and the second portion of the hinge cover.
[0202] According to one embodiment, when an external force greater than a specified size is applied from the outside of the hinge cover, the first protrusion of the hinge bracket presses the first portion of the hinge cover so that at least a portion of the hinge cover can be moved in a direction opposite to the hinge bracket.
[0203] According to one embodiment, the size of the surface area of the first protrusion of the hinge bracket may be less than or equal to the size of the outer surface of the first portion of the hinge cover.
[0204] According to one embodiment, the size of the surface area of the sheet may be less than or equal to the size of the outer surface of the first protrusion of the hinge bracket.
[0205] In one embodiment, the elastic force of the sheet may be greater than the elastic force of the hinge bracket or the hinge cover.
[0206] According to one embodiment, the first protrusion may be positioned adjacent to a top side edge or a lower side edge of the hinge cover.
[0207] According to one embodiment, when viewed in a vertical direction on the outer surface of the hinge cover, the first protrusion of the hinge bracket may be positioned at or adjacent to the center of the hinge cover with respect to a top side edge of the hinge cover.
[0208] According to one embodiment, the first portion of the hinge cover may protrude in an opposite direction of the hinge bracket than the second portion.
[0209] According to one embodiment, the first protrusion of the hinge bracket may have a circular shape, and the first part of the hinge cover may have a shape corresponding to the first protrusion.
[0210] According to one embodiment, the hinge bracket includes a loop area (320) arranged to surround the first protrusion (310), wherein the loop area can be arranged to face and be spaced apart from at least a portion of the second portion of the hinge bracket.
[0211] According to one embodiment, the outer surface of the first protrusion of the hinge bracket may form a sloped surface having a specified slope with respect to the loop area.
[0212] According to one embodiment, the hinge cover includes a deformable portion (430), and the deformable portion may include a first portion facing the hinge bracket, a second portion, and a recessed area (430a) opposite to the first and second portions.
[0213] According to one embodiment, the electronic device may include a cover member (510) facing the recessed area and positioned so that the deformable portion of the hinge cover is not exposed to the outside.
[0214] According to one embodiment, the electronic device may include an adhesive member (520) disposed at an edge of the cover member and bonding the cover member to the deformable portion of the hinge cover.
[0215] According to one embodiment, the electronic device may include a pressure-sensitive member (530) disposed between the deformable portion of the hinge cover and the cover member.
[0216] A hinge structure of an electronic device (e.g., an electronic device (101) of FIGS. 1 to 4) according to one embodiment of the present disclosure may include a hinge assembly (202), a hinge bracket (300) in which the hinge assembly is received, a first protrusion (310) formed to protrude in a first direction, and a loop area (320) formed to surround the first protrusion, a hinge cover (240) formed to cover the hinge bracket, a first portion (410) formed to face the first protrusion and protrude in a second direction opposite to the first direction, and a second portion (420) formed to surround at least a portion of the first portion, and a sheet (470) disposed between the first protrusion of the hinge bracket and the first portion of the hinge cover.
[0217] In one embodiment, the yield strength of the first protrusion of the hinge bracket may be greater than the yield strength of the first portion of the hinge cover.
[0218] According to one embodiment, the first protrusion may be positioned adjacent to a top side edge or a lower side edge of the hinge bracket.
[0219] An electronic device according to one embodiment of the present disclosure (e.g., the electronic device (101) of FIGS. 1 to 4), a first housing (210), a second housing (220), a flexible display (230) arranged including an area corresponding to the first housing and an area corresponding to the second housing, and an electrical component arranged in the electronic device, and a bracket (300; 700) that accommodates the electrical component and includes a first protrusion (310; 710) formed to protrude in an opposite direction from the flexible display and a loop area (320; 720) arranged to surround at least a portion of the first protrusion, a cover (240; 600) formed to cover a portion of the bracket and including a first portion (410; 610) facing the first protrusion, and a second portion (420; 620) formed to surround at least a portion of the first portion, and a cover (240; 600) arranged between the first protrusion of the bracket and the first portion of the cover It may include sheets (470; 770).
[0220] In one embodiment, the yield strength of the first protrusion of the bracket may be greater than the yield strength of the first portion of the cover.
Claims
1. In an electronic device (101), First housing (210); Second housing (220); A flexible display (230) including an area corresponding to the first housing and an area corresponding to the second housing; A hinge assembly (202) at least partially disposed between the first housing and the second housing and rotatably connecting the first housing and the second housing; A hinge bracket (300) in which the above hinge assembly is received and which includes a first protrusion (310) formed to protrude in a direction opposite to the flexible display; and An electronic device comprising a hinge cover (240) formed to cover the hinge bracket and including a first portion (410) facing the first protrusion, and a second portion (420) formed to surround at least a portion of the first portion.
2. In paragraph 1, An electronic device wherein the yield strength of the first protrusion of the hinge bracket is greater than the yield strength of the first portion of the hinge cover.
3. In paragraph 1 or 2, An electronic device in which a gap is formed between the hinge bracket and the second portion of the hinge cover.
4. In any one of paragraphs 1 to 3, An electronic device in which, when an external force greater than a specified size is applied from the outside of the hinge cover, the first protrusion of the hinge bracket presses the first portion of the hinge cover so that at least a portion of the hinge cover moves in a direction opposite to the hinge bracket.
5. In any one of paragraphs 1 to 4, An electronic device wherein the size of the outer surface (surface area) of the first protrusion of the hinge bracket is smaller than or equal to the size of the outer surface of the first portion of the hinge cover.
6. In any one of paragraphs 1 to 4, Further comprising a sheet (470) arranged between the first projection of the hinge bracket and the first part of the hinge cover, The size of the outer surface area of the above sheet is smaller than or equal to the size of the outer surface of the first protrusion of the hinge bracket, An electronic device wherein the elasticity of the above sheet is greater than the elasticity of the hinge bracket or the hinge cover.
7. In any one of paragraphs 1 to 6, An electronic device wherein the first protrusion is positioned adjacent to a top side edge or a lower edge of the hinge cover.
8. In any one of paragraphs 1 to 7, An electronic device in which, when viewed in a vertical direction from the outer surface of the hinge cover, the first protrusion of the hinge bracket is positioned at or adjacent to the center of the hinge cover with respect to the top side edge of the hinge cover.
9. In any one of paragraphs 1 to 8, An electronic device in which the first portion of the hinge cover protrudes in an opposite direction of the hinge bracket than the second portion.
10. In any one of paragraphs 1 to 9, An electronic device in which the hinge bracket includes a loop area (320) arranged to surround the first protrusion (310), the loop area facing and spaced apart from at least a portion of the second portion of the hinge bracket.
11. In Article 10, An electronic device in which the outer surface of the first protrusion of the hinge bracket forms an inclined surface having a specified incline with respect to the loop area.
12. In any one of paragraphs 1 to 9, The hinge cover includes a deformable portion (430), and the deformable portion includes a first portion facing the hinge bracket, a second portion, and a recessed area (430a) opposite to the first and second portions. The electronic device further includes a cover member (510) facing the recessed area and positioned so that the deformable portion of the hinge cover is not exposed to the outside.
13. In paragraph 12, An electronic device further comprising an adhesive member (520) disposed on an edge of the cover member and bonding the cover member to the deformable portion of the hinge cover.
14. In paragraph 13, An electronic device further comprising a pressure-sensitive member (530) disposed between the deformable portion of the hinge cover and the cover member.
15. In any one of paragraphs 1 to 14, A camera module (206) arranged within the above electronic device; A camera bracket (700) having the camera module disposed thereon, the second protrusion (710) protruding in the opposite direction to the flexible display, and a loop area (720) disposed to surround at least a portion of the second protrusion; and An electronic device further comprising a camera cover (600) including a third portion (610) formed to cover a portion of the camera bracket and facing the second protrusion, and a fourth portion (620) formed to surround at least a portion of the third portion.
Citation Information
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