Method for improving screen distortion in display and electronic device therefor

Abstract

An embodiment of the present disclosure provides a method for improving screen distortion (for example, moiré phenomenon) of a display, and an electronic device supporting same. According to an embodiment, the electronic device may comprise a panel and a window formed on the panel. According to an embodiment, the window may comprise a front surface, a side surface, and a chamfer portion connecting the front surface and the side surface. According to an embodiment, the window may be diagonally processed such that a vertical straight section of the side surface of the window, which is perpendicular to the panel, extends from the chamfer portion and has a designated slope. According to an embodiment, the window may be processed such that the side surface of the window and / or the chamfer portion of the window have a designated shape on the basis of a refractive index of the window, and may be formed so as to prevent screen distortion on the basis of the designated shape A window processing method according to an embodiment may comprise: a first setting process of setting the refractive index with regard to each material of a window; a second setting process of setting a designated processing scheme; a third setting process of setting a chamfer processing value corresponding to the refractive index in the designated processing scheme; and a processing process of processing a side surface and / or a chamfer portion of the window on the basis of the designated processing scheme and the chamfer processing value.

Description

Method for improving screen distortion in displays and their electronic devices

[0001] Embodiments of the present disclosure provide a method for improving screen distortion (e.g., moire phenomenon) of a display and an electronic device supporting the same.

[0002] With the advancement of digital technology, various types of electronic devices, such as smartphones, digital cameras, and / or wearable devices, are becoming widely used. The hardware and / or software components of these electronic devices are continuously being developed to support and enhance their functionality.

[0003] Electronic devices can now be equipped with a variety of functions. These devices include touchscreen-based displays that allow users to easily access various functions, and can display screens for various applications.

[0004] With recent technological advancements, electronic devices are increasingly evolving beyond their standard rectangular form into diverse shapes. For example, electronic devices may include wearable electronic devices, which can be worn on certain parts of the body, to enhance user convenience.

[0005] Wearable electronic devices are miniaturized and lightweight, and can be worn on the user's body. Their portability can enhance user convenience. Furthermore, their close proximity to the user's body allows them to be utilized for a variety of purposes.

[0006] A wearable electronic device (e.g., a wearable electronic device such as a watch type) may include a structure in which a panel and a window (or plate) for protecting the panel are joined, and the shape of the window may be largely determined according to the design of the wearable electronic device.

[0007] Wearable electronic devices may experience screen distortion (e.g., moire or light interference) (hereinafter referred to as the "moire phenomenon") depending on the shape of the window. For example, the moire phenomenon may include a phenomenon that occurs when incident light and reflected light of the same wavelength are generated on a panel (e.g., a display), and two lights of the same wavelength (e.g., incident light and reflected light) interfere with each other.

[0008] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0009] In one embodiment of the present disclosure, a method for improving screen distortion (e.g., moire phenomenon) in an electronic device including a display and an electronic device thereof are provided.

[0010] In one embodiment of the present disclosure, a method and an electronic device thereof are provided that can reduce moire phenomenon (or screen distortion) by controlling reflected light of a panel (e.g., a display) in an electronic device.

[0011] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0012] An electronic device according to one embodiment of the present disclosure may include a panel and a window formed on the panel. According to one embodiment, the window may include a front surface, a side surface, and a chamfered portion connecting the front surface and the side surface. According to one embodiment, the window may be processed diagonally so that a vertical straight section of the side surface of the window, which is perpendicular to the panel, extends from the chamfered portion and has a slope.

[0013] A method for processing a window of an electronic device according to one embodiment of the present disclosure may include a first setting process for setting a refractive index according to a material of the window. According to one embodiment, the window processing method may include a second setting process for setting a designated processing method. According to one embodiment, the window processing method may include a third setting process for setting a chamfer processing value corresponding to the refractive index in the designated processing method. According to one embodiment, the window processing method may include a processing process for processing a side surface and / or a chamfer portion of the window based on the designated processing method and the chamfer processing value.

[0014] In order to solve the above-described problem, various embodiments of the present disclosure may include a computer-readable recording medium having recorded thereon a program for executing the method on a processor.

[0015] According to one embodiment, a non-transitory computer-readable recording medium (or storage medium or computer program product) storing one or more programs is described. According to one embodiment, the one or more programs may include commands (or instructions) for performing a first setting process for setting a refractive index according to a material of a window, a second setting process for setting a designated processing method, a third setting process for setting a chamfer processing value corresponding to the refractive index in the designated processing method, and a processing process for processing a side surface and / or a chamfer portion of the window based on the designated processing method and the chamfer processing value.

[0016] Further scope of the applicability of the present disclosure will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present disclosure will readily become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present disclosure, are given by way of example only.

[0017] According to an electronic device, an operating method thereof, and a recording medium according to one embodiment of the present disclosure, screen distortion that may occur when using the electronic device can be eliminated, thereby improving the user's visibility when using the electronic device. According to one embodiment, in an electronic device including a display, interference between incident light and reflected light by the display can be reduced, thereby improving screen distortion (e.g., moire phenomenon) due to reflected light. According to one embodiment, the moire phenomenon (or screen distortion) can be reduced by adjusting the reflected light of a panel (e.g., display) in the electronic device. According to one embodiment, there is an effect of improving display quality by eliminating the moire phenomenon. According to one embodiment, the moire phenomenon can be eliminated or improved by changing the window structure according to the window material, regardless of the material (or materials) of the window. According to one embodiment, the moire phenomenon can be further improved even in a window made of a specified material (e.g., sapphire glass).

[0018] In one embodiment, regardless of the design of the electronic device, the moire phenomenon can be eliminated by processing the shape of the window. In one embodiment, the moire phenomenon can be eliminated by processing the shape of the window such that the side surfaces are inclined to have an optimal slope depending on the window material, or by processing the chamfer portion to a total reflection angle range where the moire phenomenon occurs depending on the window material.

[0019] In addition, various effects may be directly or indirectly realized through this document. The effects obtained through this disclosure are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains, based on the description below.

[0020] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0021] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0022] FIG. 2 is a perspective view of the front of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 3 is a perspective view of the rear surface of an electronic device according to one embodiment of the present disclosure.

[0024] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 5 is a diagram illustrating an example of an electronic device according to one embodiment of the present disclosure.

[0026] FIG. 6 is a diagram illustrating an example of a window of an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 7 is an exemplary diagram illustrating an example in which a moire phenomenon occurs in a window of an electronic device according to one embodiment.

[0028] FIG. 8 is an exemplary diagram illustrating an example in which a moire phenomenon occurs in a window of an electronic device according to one embodiment.

[0029] FIG. 9 is an exemplary diagram illustrating an example of improving the moire phenomenon in an electronic device according to one embodiment of the present disclosure.

[0030] FIG. 10 is an exemplary diagram illustrating an example of processing a window of an electronic device according to one embodiment of the present disclosure.

[0031] FIG. 11a is a drawing illustrating an example of window processing according to one embodiment of the present disclosure.

[0032] FIG. 11b is a drawing illustrating an example of window processing according to one embodiment of the present disclosure.

[0033] FIG. 12 is a drawing illustrating an example of window processing according to one embodiment of the present disclosure.

[0034] FIG. 13 is a drawing illustrating an example of window processing according to one embodiment of the present disclosure.

[0035] FIG. 14 is a drawing showing an example of a window mounted in an electronic device according to one embodiment of the present disclosure.

[0036] FIG. 15 is a drawing showing an example of a window mounted in an electronic device according to one embodiment of the present disclosure.

[0037] FIG. 16 is a flowchart illustrating an example of a method for processing a window of an electronic device according to one embodiment of the present disclosure.

[0038] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0039] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0040] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0041] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in the volatile memory (132), process the commands or data stored in the volatile memory (132), and store the resulting data in the non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor (123) (e.g., a graphic processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0042] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0043] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0044] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (OS) (142), middleware (144), or an application (146).

[0045] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0046] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0047] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0048] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0049] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0050] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0051] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0052] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0053] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0054] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0055] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0056] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network (LAN) or a wide area network (WAN))). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0057] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB, enhanced mobile broadband), minimizing terminal power and connecting multiple terminals (mMTC, massive machine type communications), or high reliability and low latency communications (URLLC, ultra-reliable and low-latency communications). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0058] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0059] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0060] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0061] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0062] Before describing various embodiments of the present disclosure, an electronic device (101) to which an embodiment of the present disclosure can be applied will be described.

[0063] FIG. 2 is a perspective view of the front of an electronic device according to one embodiment of the present disclosure.

[0064] FIG. 3 is a perspective view of the rear surface of an electronic device according to one embodiment of the present disclosure.

[0065] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0066] The electronic device (101) of FIGS. 2 to 4 may be at least partially similar to the electronic device (101) of FIG. 1, may include the electronic device (101) of FIG. 1, or may further include other embodiments of the electronic device (101). For example, the electronic device (101) may include a wearable electronic device that can be worn on a part of the human body.

[0067] Referring to FIGS. 2 and 3, an electronic device (101) (e.g., a wearable electronic device, a wearable watch) according to one embodiment may include a housing (210) including a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B), and a fastening member (250, 260) connected to at least a portion of the housing (210) and configured to detachably fasten the electronic device (101) to a body part (e.g., a wrist or an ankle) of a user.

[0068] In one embodiment, the fastening member (250, 260) may be, for example, a strap that wraps around the user's wrist to secure the electronic device (101). The fastening member (250, 260) may be formed of various materials and shapes. For example, the fastening member may be formed of a woven material, leather, rubber, synthetic resin, metal, ceramic, or a combination of at least two of the above materials, such that the integral and multiple unit links can be formed to be mutually movable.

[0069] In one embodiment, the housing may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C) of the electronic device (101).

[0070] According to one embodiment, the first side (210A) may be formed by a front plate (201) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a back plate (207). The back plate (207) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum (Al), stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials (or materials). The side surface (210C) may be formed by a side bezel structure (or “side member”) (206) that may be joined to the front plate (201) and the back plate (207) and includes a metal and / or a polymer. In one embodiment, the back plate (207) and the side bezel structure (206) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0071] According to one embodiment, the electronic device (101) may include at least one of a display (e.g., the display module (160) of FIG. 1 and / or the display (220) of FIG. 4), an audio module (205, 208) (e.g., the audio module (170) of FIG. 1), a sensor module (211) (e.g., the sensor module (176) of FIG. 1), a key input device (202, 203, 204) (e.g., the input module (150) of FIG. 1), and a connector hole (209) (e.g., the connection terminal (176) of FIG. 1). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (202, 203, 204), the connector hole (209), or the sensor module (211)) or may additionally include other components. In one embodiment, the components are not limited to the parts illustrated in FIGS. 2 to 4.

[0072] The display (220) may be visually exposed, for example, through a significant portion of the front plate (201). For example, a user may check at least one content displayed on the display (220) through the front plate (201). The shape of the display (220) may correspond to the shape of the front plate (201), and may be one of a circle, an oval, a square, and / or a polygon. The display (220) may be at least partially coupled to, or disposed adjacent to, a touch detection circuit, a pressure sensor capable of measuring the intensity (e.g., pressure) of a touch, and / or a fingerprint sensor.

[0073] The audio module (205, 208) may include a microphone hole (205) and a speaker hole (208). The microphone hole (205) may have a microphone positioned therein for acquiring external sounds. In one embodiment, the microphone may include multiple microphones positioned so as to detect the direction of sounds. The speaker hole (208) may be used as an external speaker and a receiver for calls. In one embodiment, the speaker hole (208) and the microphone hole (205) may be implemented as a single hole, or a speaker (e.g., a piezo speaker) may be included without the speaker hole (208).

[0074] The sensor module (211) can generate an electrical signal or data value corresponding to the internal operating state of the electronic device (101) or the external environmental state. The sensor module (211) can include, for example, a biometric sensor module (e.g., a biometric sensor, a heart rate monitor (HRM) sensor, an oxygen saturation sensor, and / or a blood sugar sensor) arranged toward the second surface (210B) of the housing (210). When the electronic device (101) is worn on a part of the human body (e.g., a wrist), the sensor module (211) can be arranged in a form that at least partially contacts the human body. The electronic device (101) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometer sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor (e.g., a red, green, blue (RGB) sensor), an infrared (IR) sensor, a temperature sensor, a humidity sensor, and / or an illuminance sensor (e.g., an ambient light sensor (ALS)).

[0075] The key input devices (202, 203, 204) may include a wheel key (202) arranged corresponding to a first side (210A) of the housing (210) and rotatable along at least one direction (e.g., clockwise, counterclockwise), and / or a side key button (203, 204) arranged on a side surface (210C) of the housing (210). The wheel key (202) may have a shape corresponding to the shape of the front plate (201). According to one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (202, 203, 204), and the key input devices (202, 203, 204) that are not included may be implemented in the form of soft keys and / or touch keys on the display (220).

[0076] The connector hole (209) can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (102, 104) of FIG. 1). The electronic device (101) may further include, for example, a connector cover (not shown) that covers at least a portion of the connector hole (209) and blocks the inflow of external foreign substances into the connector hole (209).

[0077] The fastening member (250, 260) can be detachably fastened to at least a portion of the housing (210) using a locking member (251, 261). The fastening member (250, 260) can include at least one of a fixing member (252), a fixing member fastening hole (253), a band guide member (254), and a band fastening ring (255). According to one embodiment, the electronic device (101) can maintain a state in which it is at least partially fastened to a part of the human body (e.g., a wrist) using the fastening member (250, 260).

[0078] The fixing member (252) can be at least partially coupled with the fixing member fastening hole (253) so that the housing (210) and the fastening member (250, 260) are fixed to a part of the user's body (e.g., wrist, ankle). The band guide member (254) is configured to limit the range of movement of the fixing member (252) when the fixing member (252) is fastened to the fixing member fastening hole (253), thereby allowing the electronic device (101) to be fastened to a part of the user's body while the fastening member (250, 260) is in close contact with the part of the user's body. The band fixing ring (255) can limit the range of movement of the fastening member (250, 260) when the fixing member (252) and the fastening member fastening hole (253) are fastened.

[0079] Referring to FIG. 4, the electronic device (101) may include a side bezel structure (206), a wheel key (202), a front plate (201), a display (220), a fixing member (460) (e.g., a support member), a battery (470), a printed circuit board (480), a sealing member (490), and fastening members (250, 260). For example, the fixing member (460) may be disposed inside the electronic device (101) and at least partially coupled with the side bezel structure (206) or may be formed integrally with the side bezel structure (206). The fixing member (460) may be formed of a metallic material and / or a non-metallic (e.g., a polymer) material. The fixing member (460) may have a display (220) coupled to one surface and a printed circuit board (480) coupled to the other surface. According to one embodiment, a battery (470) may be placed between a fixing member (460) and a printed circuit board (480), and the fixing member (460) and the printed circuit board (480) may be electrically connected. The fixing member (460) and the printed circuit board (480) may be electrically connected using a conductive member (e.g., a screw, a metallic material).

[0080] According to one embodiment, the printed circuit board (480) may be equipped with a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). The processor (120) may include, for example, at least one of a central processing unit (CPU), an application processor (AP), a graphic processing unit (GPU), a sensor processor, or a communication processor (CP).

[0081] According to one embodiment, the processor (120) may perform an application layer processing function requested by a user of the electronic device (101). According to one embodiment, the processor (120) may provide control and commands of functions for various components of the electronic device (101). According to one embodiment, the processor (120) may perform operations or data processing related to control and / or communication of each component of the electronic device (101). For example, the processor (120) may include at least some of the configurations and / or functions of the processor (120) of FIG. 1. According to one embodiment, the processor (120) may be operatively connected to the components of the electronic device (101). According to one embodiment, the processor (120) may load commands or data received from other components of the electronic device (101) into the memory (130), process the commands or data stored in the memory (130), and store result data in the memory (130).

[0082] According to one embodiment, the processor (120) may include at least one processor including processing circuitry and / or executable program elements. According to one embodiment, the processor (120) may control (or process) the overall operation related to processing a window processing operation (or process) based on the processing circuitry and / or executable program elements.

[0083] According to one embodiment, the processor (120) may be a system semiconductor that is responsible for the computation and multimedia driving functions of the electronic device (101). According to one embodiment, the processor (120) may be configured in the form of a system-on-chip (SoC), and may include a technology-intensive semiconductor chip that integrates multiple semiconductor technologies into one and implements system blocks into a single chip.

[0084] In one embodiment, the processor (120) may include an application processor (AP). In one embodiment, the processor (120) may include components such as a graphics processing unit (GPU), an image signal processor (ISP), a central processing unit (CPU), a neural processing unit (NPU), a digital signal processor (DSP), a modem, connectivity, and / or security. In one embodiment, the processor (120) may operate individually and / or collectively.

[0085] According to one embodiment, the operations performed by the processor (120) may be implemented by executing instructions stored in a recording medium (or a computer program product or storage medium). For example, the recording medium may include a non-transitory computer-readable recording medium having recorded thereon a program for executing various operations performed by the processor (120).

[0086] The embodiments described in the present disclosure may be implemented in a computer-readable recording medium using software, hardware, or a combination thereof. In a hardware implementation, the operations described in one embodiment may be implemented using at least one of application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, micro-controllers, microprocessors, and / or other electrical units for performing functions.

[0087] In one embodiment, a computer-readable recording medium (or storage medium or computer program product) is provided, which records a program for causing an electronic device (101) to perform (or execute) various operations.

[0088] The above operations may include an operation for setting the refractive index of the material of the window (600) (e.g., a first setting process), an operation for setting a designated processing method (e.g., a second setting process), an operation for setting a chamfer processing value corresponding to the refractive index in the designated processing method (e.g., a third setting process), and an operation for processing a side surface and / or a chamfer portion of the window (600) based on the designated processing method and chamfer processing value (e.g., a processing process).

[0089] The memory (130) may include, for example, volatile memory or non-volatile memory. The interface (or connector) may electrically or physically connect, for example, the electronic device (101) and an external electronic device, and may include at least one of a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card / multi-media card (MMC) interface, and / or an audio interface.

[0090] According to one embodiment, the memory (130) may store instructions that cause the electronic device (101) to perform operations when individually and / or collectively executed by at least one processor (e.g., processor (120) of FIG. 1).

[0091] According to one embodiment, the instructions, when executed by at least one processor, may cause the electronic device (101) to set a refractive index for each material of the window (600). According to one embodiment, the instructions, when executed by at least one processor, may cause the electronic device (101) to set a specified processing method. According to one embodiment, the instructions, when executed by at least one processor, may cause the electronic device (101) to set a chamfer processing value corresponding to the refractive index in the specified processing method. According to one embodiment, the instructions, when executed by at least one processor, may cause the electronic device (101) to process a side surface and / or a chamfer portion of the window (600) based on the specified processing method and the chamfer processing value.

[0092] A battery (470) (e.g., battery (189) of FIG. 1) is a device for supplying power to at least one component of an electronic device (101), and may include, for example, at least one of a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (470) may be disposed substantially on the same plane as, for example, a printed circuit board (480). The battery (470) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0093] The printed circuit board (480) may include (e.g., mount) at least one antenna (e.g., antenna module, chip antenna). For example, the at least one antenna may include at least one of a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The at least one antenna may perform short-range communication with an external device, wirelessly transmit and receive power required for charging, and transmit a magnetic-based signal including a short-range communication signal or payment data. According to one embodiment, the antenna structure may be formed by at least a portion of the side bezel structure (206), the front plate (201), and / or the fixing member (460), or a combination thereof. According to one embodiment, the fixing member (460) and the printed circuit board (480) may be electrically connected, and an electric field (E-field, electronic field) may be formed based on the fixing member (460) and the printed circuit board (480). The electronic device (101) can transmit and receive communication signals based on the formed electric field (E-field), and can utilize at least a part of the fixed member (460) as an antenna.

[0094] A sealing member (490) may be positioned between the side bezel structure (206) and the rear plate (207). The sealing member (490) may be configured to block moisture and foreign substances from entering the space surrounded by the side bezel structure (206) and the rear plate (207) from the outside.

[0095] A sensor module (211) (e.g., a biometric sensor) may be disposed adjacent to the rear plate (207). For example, when the electronic device (101) is worn on a body part of the wearer (e.g., a wrist), the rear plate (207) may be disposed in a state of at least partial contact with the body part. The sensor module (211) may be disposed in a form directed toward the body part (e.g., a wrist, skin). The sensor module (211) may transmit signals of various wavelength bands to the body part of the wearer. The electronic device (101) may obtain various biometric information (e.g., information related to heartbeat, information related to blood sugar, and / or oxygen saturation) based on signals of the wavelength bands reflected, scattered, and / or absorbed from the body part of the wearer. According to one embodiment, the rear plate (207) may be implemented in a form in which a rear window (207a) is at least partially coupled so that the above-described signals are transmitted.

[0096] FIG. 5 is a diagram illustrating an example of an electronic device according to one embodiment of the present disclosure.

[0097] FIG. 6 is a diagram illustrating an example of a window of an electronic device according to one embodiment of the present disclosure.

[0098] In one embodiment, the electronic device (101) of FIG. 5 may be at least partially similar to the electronic device (101) of FIGS. 1 to 4, or may include the electronic device (101) of FIGS. 1 to 4. For example, the electronic device (101) may include a wearable electronic device (e.g., a wearable watch) that can be worn on a part of the human body. According to one embodiment, the electronic device (101) may include at least some of the components of FIGS. 1 to 4, or may be implemented by additionally including other components.

[0099] In one embodiment, the electronic device (101) may include a display (220) (e.g., the display module (160) of FIG. 1 or the display (220) of FIGS. 2 to 4) on a front surface (510) (e.g., the first surface (210A) of FIGS. 2 to 4). The electronic device (101) may be a wearable electronic device (e.g., a wearable watch) that can be worn by a user in the shape of a watch. The electronic device (101) may display an interface (520) related to the watch on at least a portion of the display (220).

[0100] In one embodiment, the electronic device (101) may include a case (530) (e.g., housing (210) of FIGS. 2-4) and a band (or strap) (540) (e.g., fastening member (250, 260) of FIGS. 2-4).

[0101] In one embodiment, the case (530) may include a bezel (550) (e.g., a side bezel structure (206) of FIGS. 2 to 4), a crown (560) (e.g., an input module (150) of FIG. 1 or side key buttons (203, 204) of FIGS. 2 to 4) and a display (220) on the outside. The case (530) may include a processor (120) of FIG. 1, a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), and / or an antenna module (197) on the inside or the outside.

[0102] In one embodiment, a display (220) is disposed on the front side (510) of the case (530), and at least a portion (e.g., a biometric sensor module) of a sensor circuit (e.g., a sensor module (211) of FIGS. 2 to 4) may be exposed to the outside on the back side (e.g., the second side (210B) of FIGS. 2 to 4).

[0103] In one embodiment, the back of the case (530) may be at least partially in contact with the user when the electronic device (101) is worn on the user via the band (540).

[0104] In one embodiment, the bezel (550) may be ring-shaped, concentric with the circular display (220). The inner radius of the bezel (550) may be the same as the radius of the display (220). The bezel (550) may be positioned at a portion of the edge of the case (530) to protect the display (220) from external impact.

[0105] In one embodiment, the bezel (550) can rotate in at least one direction, either clockwise or counterclockwise. The bezel (550) can serve as an input device of the electronic device (101). When the bezel (550) rotates, the electronic device (101) can determine the speed and / or direction of rotation of the bezel (550) as a user input and control the function of the electronic device (101) based on the user input.

[0106] In one embodiment, the crown (560) may be positioned to protrude from at least a portion of the case (530). The crown (560) may have one of the shapes of a cylinder, an elliptical cylinder, a square cylinder, or a polygonal cylinder. The crown (560) may be connected to the case (530) and rotate around a rotational axis. The crown (560) may be connected to the case (530) and rotate by a stem that provides the rotational axis. Without being limited thereto, the crown (560) may be in the form of a key button (e.g., side key buttons (203, 240) of FIGS. 2 to 4).

[0107] In one embodiment, the crown (560) may function as an input device of the electronic device (101). When the crown (560) rotates, the electronic device (101) determines the speed and direction of rotation of the crown (560) as user input, and controls the function of the electronic device (101) according to the user input. In one embodiment, when the crown (560) is in the form of a key button, when the crown (560) is pressed, the number of times the crown (560) is pressed or the time for which it is pressed may be determined as user input, and the function of the electronic device (101) may be controlled according to the user input.

[0108] In one embodiment, a band (540) may allow the electronic device (101) to be worn on a user's wrist. The band (540) may be composed of various materials, such as metal, rubber, or leather. The band (540) is connected to one end of the case (530), and the band (540) connected to the case (530) may be replaceable.

[0109] Although not shown, according to one embodiment, the electronic device (101) may include at least one of an input device (e.g., a microphone), an audio output device, a sensor module, a camera device, a key input device, a communication circuit, and / or a connector port within the electronic device (101).

[0110] According to one embodiment, the electronic device (101) may include a window (600) (e.g., the front plate (201) of FIGS. 2 to 4). An example of the shape of the window (600) according to one embodiment is illustrated in FIG. 6.

[0111] Referring to FIGS. 5 and 6, the window (600) (e.g., the front plate (201) of FIGS. 2 to 4) may include a glass plate or a polymer plate including various coating layers. In one embodiment, the window (600) may be coupled to the case (530). In one embodiment, the display (220) may be visually exposed through a significant portion of the window (600). For example, a user may check at least one content (e.g., an interface (520)) displayed on the display (220) through the window (600). The shape of the display (220) may correspond to the shape of the window (600).

[0112] In one embodiment, the window (600) may include an upper portion (600A) and a lower portion (600B). In one embodiment, the lower portion (600B) may have a larger area than the upper portion (600A). For example, the diameter of the lower portion (600B) may be larger than the diameter of the upper portion (600A). According to one embodiment, referring to the cross-section along the A-A' direction, the upper portion (600A) may include a chamfered portion (or chamfer (C-cut) section) (610) (e.g., a corner diagonal cut section of the upper portion (600A) of the window (600), a straight section (620), and a curved section (or R section) (630). According to one embodiment, referring to the cross-section along the A-A' direction, the lower portion (600B) may include a flange section (640). In one embodiment, the lower portion (600B) may be a flange for reinforcing or joining the upper portion (600A) of the window (600).

[0113] According to one embodiment, the electronic device (101) may experience screen distortion (e.g., moire phenomenon (e.g., screen distortion phenomenon due to light interference)) depending on the shape of the window (600). For example, in the case of the window (600), the moire phenomenon may occur on the front surface of the window (600). For example, the moire phenomenon may occur on the outer border of the front surface of the window (600) (e.g., the edge area (500) of the window (600)), such as the hatching area illustrated in FIG. 5. According to one embodiment, the occurrence of the moire phenomenon will be described with reference to FIGS. 7 and 8.

[0114] FIG. 7 is an exemplary diagram illustrating an example in which a moire phenomenon occurs in a window of an electronic device according to one embodiment.

[0115] FIG. 8 is an exemplary diagram illustrating an example in which a moire phenomenon occurs in a window of an electronic device according to one embodiment.

[0116] Referring to FIGS. 7 and 8, the moire phenomenon may include a phenomenon in which incident light (701) and reflected light (703) are generated from a panel (700) (e.g., a display (220) of FIGS. 2 to 5), and two lights of the same wavelength (e.g., incident light (701) and reflected light (703)) interfere with each other in front of a window (600), as shown in the illustration of element 750. In one embodiment, the moire may include water ripples moire or scan line moire. For example, when the moire phenomenon occurs, a screen distortion such as a moire pattern due to a straight grid or a moire pattern due to a circular grid may appear at the outer border of the window (600), as in the edge area (500) of FIG. 5.

[0117] In one embodiment, the incident light (701) may represent light that reaches the front surface of the window (600) without reflection (or refraction), as in the direction of the arrow of element 701 in FIG. 7. For example, the incident light (701) may represent light that is output from the panel (700) and is directly incident on the front surface of the window (600). In one embodiment, the reflected light (703) may represent light that reaches the front surface of the window (600) by being reflected (or refracted) from the side surface of the window (600) (e.g., the straight section (620) in FIG. 6) (e.g., the total reflection area of ​​the side surface) of the panel (700), as in the direction of the arrow of element 703 in FIG. 7. For example, the reflected light (703) may include light that is output from the panel (700) and is reflected from the side surface of the window (600) and reaches the front surface of the window (600) (e.g., the front surface of the window (600)).

[0118] According to one embodiment, the moire phenomenon in the window (600) may appear differently depending on the material forming the window (600). For example, the window (600) may be formed of various materials, such as a window of a first material (e.g., gorilla glass) or a window of a second material (e.g., sapphire glass). According to one embodiment, the window (600) may have a different refractive index (or index of refraction) depending on the material. In one embodiment, the refractive index may be, for example, the value obtained by dividing the speed of a wave in a first medium (or internal medium) (e.g., transparent glass such as the first or second material of the window (600)) by the speed of a wave passing through a second medium (or external medium) (e.g., air outside the window (600)), and the refractive index of the second medium with respect to the first medium may be referred to as the refractive index of the second medium.

[0119] For example, the refractive index can indicate the degree to which a wave is bent when passing through a boundary surface between different media. In one embodiment, the boundary surface can represent a surface where the properties of a material change significantly, causing a significant change in the direction or speed of propagation of a wave, such as light.

[0120] According to one embodiment, in the case of a window of a second material (e.g., sapphire glass) that is recently applied to an electronic device (101), the refractive index may be greater than that of a window of a first material (e.g., gorilla glass). Therefore, in the case of the window (600), a difference in refractive index may be present depending on the material, and in a window of a material with a high refractive index (e.g., a window of a second material), a lot of total reflection may occur on the side surface (e.g., a straight section (620) of FIG. 6 or 8) (e.g., a total reflection angle (θ) region) of the window (600), which may increase the amount of light interference. In FIG. 8, “θ” may represent an angle (e.g., a total reflection angle (θ)) at which reflected light (703) is totally reflected on the side surface (e.g., a straight section (620) of FIG. 6 or 8) of the window (600). For example, in a window made of a material with a high refractive index, a moire phenomenon may occur relatively frequently on the outer edge, and screen distortion of the display (220) may become severe.

[0121] According to one embodiment, the electronic device (101) may have a window (600) bonded on a panel (700) (e.g., a display (220)). According to one embodiment, the window (600) may include a front surface, a side surface, and a chamfer connecting the front surface and the side surface. According to one embodiment, total reflection (or total internal reflection) may occur on a side surface where the side shape of the window (600) is perpendicular to the panel (700) (e.g., a straight section (620) of FIG. 6 or 8), and a moire phenomenon may appear on the front surface of the window (600) (e.g., an edge region (e.g., a moire generation region (750) of FIG. 7 or 8) of the upper portion (600A) of the window (600)) where reflected light reflected in a section (e.g., a side) perpendicular to the panel (700) interferes with incident light.

[0122] In one embodiment of the present disclosure, the moire phenomenon can be improved by controlling the reflected light of the panel (700). In one embodiment of the present disclosure, based on the results of an optical simulation, the design of a side surface of a window (600) (e.g., a straight section (620) in FIG. 6 or FIG. 8) capable of suppressing reflected light that causes the moire phenomenon and / or the shape design of a window chamfer (e.g., a chamfer (610) (or a C-cut section) in FIG. 6) are provided. For example, in the present disclosure, the reflected light that causes the moire phenomenon can be suppressed by changing the design (or processing) of at least a portion of the window (600).

[0123] FIG. 9 is an exemplary diagram illustrating an example of improving the moire phenomenon in an electronic device according to one embodiment of the present disclosure.

[0124] Referring to FIG. 9, “θ” in FIG. 9 may represent an angle (e.g., total reflection angle) at which the reflected light is totally reflected on the side (or side boundary) (900) of the window (600) (e.g., the straight section (620) of FIG. 6 or FIG. 8). According to one embodiment, the critical angle (θ) according to the total reflection angle (θ) c )(e.g., the critical angle for total reflection) can be calculated as in <Mathematical Formula 1> below. In one embodiment, the critical angle may represent the minimum incident angle at which total reflection occurs.

[0125]

[0126] In <Mathematical Formula 1>, n1 and n2 may represent the refractive indices of the two media (e.g., the internal medium and the external medium) based on the side (900) of the window (600), respectively. For example, n1 may represent the refractive index of the internal medium (e.g., transparent glass such as the first material or the second material) of the window (600), and n2 may represent the refractive index of the external medium (e.g., air) of the window (600). For example, the refractive index of the glass may be about 1.5 (e.g., n1 = about 1.5), and the refractive index of the air may be about 1 (e.g., n2 = about 1).

[0127] In general, the section of the side surface (900) of the window (600) bonded on the panel (700) that is perpendicular to the panel (700) (e.g., the straight section (620) perpendicular to the panel (700) in FIG. 6 or FIG. 8) can play a decisive role in the moire phenomenon, and the length (x) that affects the moire phenomenon (e.g., the length that affects the total reflection among the entire length of the panel (700) (e.g., the length formed from the outside to the inside of the panel (700))) may be different depending on the position and size of the actual panel (700). For example, the area (e.g., length) of the panel (700) that affects the side surface total reflection of the window (600) can be assumed as “x”, and the length (e.g., height) that affects the moire phenomenon at the side surface (900) can be assumed as “y”. According to one embodiment, the area “x” of the panel (700) that affects the side total reflection can be defined as in <Mathematical Expression 2> below, and the straight section (e.g., length “y”) (e.g., total reflection angle area) of the side (900) that affects the actual moire phenomenon can be calculated using <Mathematical Expression 2> below.

[0128]

[0129] According to one embodiment, the total reflection angle (θ) may vary depending on the refractive index of the material (or substance) of the window (600), and this may be used to calculate the length of a straight section (e.g., “y” length) that affects the moire phenomenon. According to one embodiment, in order to remove the moire phenomenon, in a region (L) where the moire phenomenon occurs on the front surface of the window (600) (e.g., moire generation region (750) of FIG. 7 or 8), among the entire straight section of the side surface (900) of the window (600) (e.g., straight section (620) of FIG. 6 or 8), the side surface (900) may be processed (e.g., chamfered) based on the “y” length (e.g., total reflection angle region) to improve (e.g., remove) the moire phenomenon. An example of this is illustrated in FIG. 10.

[0130] FIG. 10 is an exemplary diagram illustrating an example of processing a window of an electronic device according to one embodiment of the present disclosure.

[0131] According to one embodiment, FIG. 10 may show an example of a test result for improvement of a moire phenomenon according to chamfering processing for a chamfer portion of a window (600) (e.g., chamfer portion (610) of FIG. 6).

[0132] Referring to FIG. 10, elements 1010, 1020, 1030, 1040, and 1050 may represent examples of portions corresponding to the chamfered portion of the window (600). Elements 1015, 1025, 1035, 1045, and 1055 may represent examples of test results for chamfering processing of the window (600) (e.g., a moire phenomenon appearing in the edge area (500) of the window (600) of FIG. 5). For example, element 1010 may represent an example of a window (600) having a chamfered portion (e.g., a chamfered portion without chamfering) according to a basic design (or existing design), and element 1015 may represent an example of a moire phenomenon seen in an outer border (e.g., an edge area (500) of a window (600) of FIG. 5) of a window (600) having a chamfered portion according to a basic design.

[0133] According to one embodiment, when chamfering a chamfer portion of a window (600), the width (w) (or horizontal length or width) of the chamfer portion is fixed, and the depth (A) (or vertical length or height) of the chamfer portion can be changed to change the shape of the chamfer portion. For example, in a straight section (e.g., a straight section (620) perpendicular to the panel (700) in FIG. 6 or 8) of the upper portion (600A) of the window (600), the length (e.g., “y” length) of a straight section (e.g., a total reflection angle area) that affects the moire phenomenon can be calculated, and the shape of the chamfer portion can be processed so that the depth (A) of the chamfer portion matches the calculated “y” length. For example, the length (or size) of an equilateral portion (e.g., a diagonal surface of a corner) of the chamfer portion can vary depending on the difference in the depth (A) of the chamfer portion according to the “y” length. For example, the width (w) of the chamfered portion may be fixed, and the depth (A) of the chamfered portion at which the moire phenomenon is eliminated may be derived to form the chamfered portion. In one embodiment, the “y” length may be determined according to the refractive index of the material of the window (600), and the depth (A) of the chamfered portion may be determined according to the “y” length.

[0134] As illustrated in FIG. 10, it can be seen that the shorter the length of the side surface (e.g., “y” length) where total reflection occurs, which causes the moire phenomenon, is, the less the moire phenomenon is. For example, it can be seen that the moire phenomenon is reduced as the design depth of the chamfer (e.g., A-1, A-2, A-3, or A-4) is greater than the basic design depth of the chamfer (e.g., A) (e.g., the larger the C-CUT amount of the chamfer or the larger the length of the equilateral portion). For example, in FIG. 10, the size of the depth (e.g., vertical length or height) of the chamfer may be A<A-1<A-2<A-3<A-4, and it can be seen that the moire phenomenon (e.g., see element 1055) appears to be the smallest at the depth A-4 of the chamfer.

[0135] As illustrated in FIG. 10, in order to control (or suppress) the reflected light of the panel (700) that causes the moire phenomenon (e.g., minimize the area where total reflection occurs), the shape of the chamfer portion is designed such that the width (w) of the chamfer portion is fixed and the depth (A) of the chamfer portion is designed to be deep (long), thereby improving the moire phenomenon.

[0136] As illustrated in FIG. 10, the chamfer portion of the window (600) can be chamfered to increase the area of ​​the chamfer portion by extending a specified length (e.g., design depth or vertical length) in the vertical straight section of the side of the window (600) while having a width (w) indicated in the horizontal direction of the chamfer portion.

[0137] According to one embodiment, the example of FIG. 10 may be designed to design the shape of the chamfer by diagonally machining the chamfer of the window (600) to the depth of the chamfer (e.g., A-4). The embodiment of the present disclosure is not limited thereto. According to one embodiment, in order to improve the moire phenomenon, the shape of the chamfer may be designed by machining the corner portion of the window (600) to have a specified curvature (R) up to the length of the chamfer (e.g., A-4). According to one embodiment, in order to minimize the area where total reflection occurs, the side vertical straight section of the window (600) (e.g., the straight section (620) of FIG. 6 or FIG. 8) may be changed into a diagonal shape inclined at a certain angle, independently or in parallel with the chamfering process, to more effectively improve the moire phenomenon. Examples thereof are illustrated in FIGS. 11A to 15.

[0138] FIGS. 11a, 11b, 12, and 13 are drawings illustrating examples of window processing according to one embodiment of the present disclosure.

[0139] According to one embodiment, FIGS. 11A and 11B may illustrate an example of machining a shape of a chamfer (1110) of a basic design in a window (600) to have a specified curvature (R) (e.g., forming a chamfer (1120) having a curved shape based on at least one specified curvature (R) of a surface (e.g., an equilateral portion) of the chamfer (1110). For example, the curvature (R) may vary depending on a width (w) of the chamfer (1120) and a depth (A) of the chamfer (1120).

[0140] In one embodiment, the curvature (R) may be the same as (e.g., see FIG. 11A) or different from (e.g., see FIG. 11B) the first curvature (R1) of the first portion (or first surface) of the window (600) (e.g., the surface corresponding to (or close to) the front side of the window (600) based on the reference line (1150)) and the second curvature (R2) of the second portion (or second surface) of the window (600) (e.g., the surface corresponding to (or close to) the side surface of the window (600) based on the reference line (1150)) depending on the width (w) of the chamfer (1120) and the depth (A) of the chamfer (1120).

[0141] For example, when the length according to the width (w) of the chamfered portion (1120) and the length according to the depth (A) of the chamfered portion (1120) are the same (e.g., w = A), the chamfered portion (1120) can be formed with a single curvature (R) in which the first curvature (R1) and the second curvature (R2) are the same, as illustrated in FIG. 11A. For example, according to the example of FIG. 11A, the first curvature (R1) and the second curvature (R2) can have the same curvature value (or radius of curvature). For example, when the length according to the width (w) of the chamfer portion (1120) and the length according to the depth (A) of the chamfer portion (1120) are different (e.g., w < A), the chamfer portion (1120) may be formed with different curvatures, such as the first curvature (R1) and the second curvature (R2), as illustrated in FIG. 11b. For example, according to the example of FIG. 11b, the first curvature (R1) and the second curvature (R2) may have different curvature values ​​(or curvature radii).

[0142] In one embodiment, as illustrated in FIG. 11b, the first curvature (R1) and the second curvature (R2) may be implemented differently. According to one embodiment, when the width (w) of the chamfer portion increases, the chamfer portion (e.g., the curved surface of the chamfer portion) may be more visible to the user's gaze looking at the front of the window (600). According to one embodiment, as illustrated in FIG. 10, the width (w) of the chamfer portion is fixed, and only the second curvature (R2) according to the depth (A) of the chamfer portion is variably applied, thereby reducing the degree to which the chamfer portion is exposed to the user's gaze.

[0143] According to one embodiment, as illustrated in FIG. 11a or FIG. 11b, the size of the chamfer portion (e.g., the size of the equilateral portion of the chamfer portion) in the window (600) can be increased by processing the surface (e.g., the equilateral portion) of the chamfer portion with a specified curvature, thereby improving the moire phenomenon.

[0144] According to one embodiment, as illustrated in FIG. 11A or FIG. 11B, the window (600) may be formed in a curved shape with a chamfered portion (1120) having a specified curvature (R) to reduce the total reflection amount according to the refractive index of the window (600) from the side, and the side may extend from the curved surface of the chamfered portion (1120). According to one embodiment, the vertical straight section of the side may be formed to extend from the curved surface of the chamfered portion (1120) to be vertical or have a specified slope.

[0145] As illustrated in FIGS. 11A and 11B, the chamfer portion of the window (600) can be formed into a curved shape having a width (w) indicated in the horizontal direction of the chamfer portion and a specified curvature that extends a specified length (e.g., a design depth or vertical length) in a vertical straight section of the side of the window (600) to increase the area of ​​the chamfer portion.

[0146] According to one embodiment, FIG. 12 may illustrate an example of machining a shape of a chamfered portion (1210) of a basic design in a window (600) so that a surface (e.g., an equilateral portion) of the chamfered portion has a specified length (or size) (e.g., forming a chamfered portion (1220) having a specified length (or size or area)). For example, the specified length forming the surface of the chamfered portion may vary depending on a width (w) of the chamfered portion and a depth (A) of the chamfered portion. In one embodiment, the width (w) of the chamfered portion and the depth (A) of the chamfered portion may be formed to have the same or different lengths. In one embodiment, when the length according to the width (w) of the chamfered portion and the length according to the depth (A) of the chamfered portion are the same (e.g., w = A), the surface of the chamfered portion may have an inclination (or angle) of about 45 degrees.

[0147] According to one embodiment, when the width (w) of the chamfer portion increases, the chamfer portion may be more visible to the user's gaze looking at the front of the window (600). According to one embodiment, as in the example of FIG. 10, by fixing the width (w) of the chamfer portion and only varying the depth (A) of the chamfer portion, the degree to which the chamfer portion is exposed to the user's gaze may be reduced.

[0148] According to one embodiment, as illustrated in FIG. 12, the window (600) may be formed with a shape in which the equilateral portion of the chamfered portion (1220) has a specified size to reduce the total reflection amount according to the refractive index of the window (600) from the side, and the side may extend from the equilateral portion of the chamfered portion (1220). According to one embodiment, the vertical straight section of the side may be formed to extend from the equilateral portion of the chamfered portion (1220) to be vertical or have a specified slope.

[0149] According to one embodiment, FIG. 13 may illustrate an example of slanting (or slanting) a side surface (1310) (e.g., a straight section of FIG. 2 or FIG. 8) of a window (600) that is perpendicular to the panel (700) to have a designated inclination (e.g., a diagonal angle) while maintaining the shape of the chamfer portion of the basic design in the window (600) (e.g., forming the window (600) with a side surface (1320) that is not perpendicular to the panel (700). According to one embodiment, as illustrated in FIG. 13, the window (600) may be slanted so that the vertical straight section of the side surface (1310) of the window (600) that is perpendicular to the panel (700) extends from the chamfer portion (1120, 1220) to have a designated inclination.

[0150] As illustrated in FIG. 11a, FIG. 11b, FIG. 12 or FIG. 13, according to one embodiment of the present disclosure, the moire phenomenon can be reduced by changing the shape of the chamfer portion and / or the straight section (e.g., side) perpendicular to the panel (700) so as to deviate from the total reflection angle of the reflected light of the panel (700) in the window (600). According to various embodiments, the moire phenomenon can be improved in the window (600) of the electronic device (101) based on various design structures, as illustrated in FIG. 11a, FIG. 11b, FIG. 12 or FIG. 13.

[0151] As illustrated in FIG. 11a, FIG. 11b, FIG. 12 or FIG. 13, the moire phenomenon can be improved by changing the structure of the chamfer portion of the window (600) and / or changing the structure of the side surface of the window (600) in an electronic device (101) according to one embodiment. According to one embodiment, the structure for improving the moire phenomenon may include, for example, a structure having a variable curvature (R) (e.g., a radius of curvature) (e.g., a first structure in FIG. 11a or 11b), a structure for changing the size of an equilateral portion (e.g., a C-CUT amount) of a chamfered portion (e.g., a C-CUT section) (e.g., a second structure in FIG. 12), and / or a structure for slanting a side (e.g., a straight section perpendicular to the panel (700) (e.g., a straight section (620) in FIG. 6 or 8)) (e.g., a third structure in FIG. 13). According to one embodiment, the structure for improving the moire phenomenon may follow a design structure such as the first structure, the second structure, or the third structure. According to one embodiment, the electronic device (101) may include a combined structure of the first structure and the third structure (e.g., a fourth structure) or a combined structure of the second structure and the third structure (e.g., a fifth structure) depending on the design structure of the window (600). (structure) may be included.

[0152] In one embodiment, to improve the moire phenomenon, the window (600) may be formed based on the side slope method of the third structure, such as the example of FIG. 13. An example thereof is illustrated in FIG. 14. In one embodiment, to improve the moire phenomenon, the window (600) may be formed based on a chamfering processing method that changes the size of the equilateral portion of the chamfer portion of the first structure or the third structure, such as the examples of FIG. 11a, FIG. 11b, or FIG. 12. An example thereof is illustrated in FIG. 15.

[0153] FIG. 14 is a drawing showing an example of a window mounted in an electronic device according to one embodiment of the present disclosure.

[0154] FIG. 15 is a drawing showing an example of a window mounted in an electronic device according to one embodiment of the present disclosure.

[0155] According to one embodiment, the electronic device (101) of FIG. 14 or FIG. 15 may be implemented by including at least some of the components described in the electronic device (101) of FIGS. 1 to 4, or by additionally including other components.

[0156] According to one embodiment, referring to FIG. 14 or FIG. 15, the electronic device (101) may include a wheel (1410) (e.g., a wheel key (202) of FIG. 4), a wheel decoration (1420), a front (1430) (e.g., a side bezel structure (206) of FIG. 4), a waterproof ring (1440) (e.g., a sealing member (490) of FIG. 4), a window (600) (e.g., a front plate (201) of FIGS. 2 to 5), and a panel (700) (e.g., a display module (160) of FIG. 1 or a display (220) of FIG. 4).

[0157] According to one embodiment, as illustrated in FIG. 14 or FIG. 15, the front surface (e.g., the first surface (210A) of FIGS. 2 to 5 ) of the electronic device (101) may be formed by a window (600) (e.g., the front plate (201) of FIGS. 2 to 5 ) that is at least partially transparent. The back surface (e.g., the second surface (210B) of FIGS. 2 to 5 ) of the electronic device (101) may be formed by a back plate (e.g., the back plate (207) of FIGS. 2 to 4 ). According to one embodiment, the electronic device (101) may have a panel (700) (e.g., the display module (160) of FIG. 1 or the display (220) of FIG. 4 ) disposed below the window (600). The panel (700) may be visually exposed through a significant portion of the window (600). For example, a user can check at least one content displayed on a panel (700) through a window (600).

[0158] According to one embodiment, the window (600) may be formed of various materials, such as a window of a first material (e.g., gorilla glass) or a window of a second material (e.g., sapphire glass). According to one embodiment, the window (600) may have a moire phenomenon in an edge region of the front surface. In one embodiment of the present disclosure, the moire phenomenon occurring in the window (600) may be improved by controlling the reflected light of the panel (700) through processing of the side surface of the window (600) and / or the chamfer portion of the window (600). For example, in the present disclosure, the reflected light that causes the moire phenomenon may be suppressed through a design change (or processing) of at least a portion of the window (600), as in the example of FIG. 14 or FIG. 15. According to one embodiment, the moire phenomenon may be eliminated or improved through a design change for a total reflection angle region where the moire phenomenon occurs on the side surface of the window (600).

[0159] According to one embodiment, referring to FIG. 14, FIG. 14 may illustrate an example of forming a window (600) by changing a side vertical straight section (1450) from a chamfer portion into an inclined (e.g., diagonal) shape (e.g., machining by about 7 degrees) (e.g., the third structure of FIG. 13).

[0160] According to one embodiment, as illustrated in the dotted square area (1400) in FIG. 14, the side surface (1450) of the window (600) (e.g., the straight section perpendicular to the panel (700) (e.g., the straight section (620) of FIG. 6 or FIG. 8)) may be angled at a specified inclination (or angle of inclination) (e.g., about n degrees) to remove reflected light, thereby eliminating the moire phenomenon in the window (600). For example, the side surface (1450) of the window (600) may be angled to reduce the total reflection amount by considering the refractive index of the window material (e.g., sapphire glass) used in the electronic device (101). According to one embodiment, the specified inclination (e.g., angle of inclination) of the side surface (1450) may be calculated differently depending on the material of the window (600), as illustrated in the example of below.

[0161] Window refractive index Total reflection angle (deg) Slope Window of the first material approx. 1.517 approx. 41.2 approx. n1 degrees Window of the second material approx. 1.76 approx. 34.6 approx. n2 degrees

[0162] Referring to , according to one embodiment, assuming that the refractive index of the window of the first material is about 1.517 and the total reflection angle is about 41.2, the moire phenomenon can be improved by diagonally processing the side surface (1450) of the window (600) at about n1 degrees. According to one embodiment, assuming that the refractive index of the window of the second material is about 1.76 and the total reflection angle is about 34.6, the moire phenomenon can be improved by diagonally processing the side surface (1450) of the window (600) at about n2 degrees. As in the example of , in the case of diagonally processing the side surface (1450) of the window (600), the slope can be designed to be larger as the material has a relatively high refractive index. For example, in the example of , the value can be greater than about n2 degrees rather than about n1 degrees.

[0163] According to one embodiment, referring to FIG. 15, FIG. 15 may illustrate an example of forming a window (600) by changing the size of the equilateral portion (e.g., C-CUT amount) of the chamfer portion (e.g., increasing the C-CUT amount) in the first structure (e.g., variable R method) of FIG. 11a or FIG. 11b or the second structure (e.g., composite C method) of FIG. 12.

[0164] According to one embodiment, as illustrated in the dotted square area (1500) in FIG. 15, the chamfer (1550) of the window (600) may be processed into a curvature shape having a designated curvature R to have a designated size capable of removing reflected light, or may be processed into a shape having a designated C-CUT size, thereby removing the moire phenomenon from the window (600). For example, the size of the chamfer (1550) (e.g., the size of the equilateral portion of the chamfer (1550)) may be processed to reduce the total reflection amount according to the refractive index of the window (600) through an asymmetrical curvature shape on the front and side surfaces of the chamfer (1550), such as front R of about 0.35 + side R of about 0.2. According to one embodiment, the curvature shape may also be processed into a symmetrical curvature shape on the front and side surfaces, such as front R of about 0.2 + side R of about 0.2. For example, the size of the chamfer (1550) may be processed to reduce the total reflection amount according to the refractive index of the window (600) by asymmetrically cutting the front and / or side of the chamfer (1550), such as front C approximately 0.35 + side C approximately 0.2. According to one embodiment, the cutting of the chamfer (1550) may also be performed by symmetrically cutting the front and side, such as front C approximately 0.2 + side C approximately 0.2. According to one embodiment, the size of the chamfer (1550) (e.g., C-CUT section) may be processed to reduce the total reflection amount by considering the refractive index according to the material (e.g., sapphire glass) of the window (600) used in the electronic device (101).

[0165] According to various embodiments of the present disclosure, there is an effect of improving display quality by eliminating the moire phenomenon. According to one embodiment of the present disclosure, the moire phenomenon can be eliminated or improved by changing the window structure to suit the window material, regardless of the material (or materials) of the window. According to one embodiment, the electronic device can eliminate the moire phenomenon by processing the shape of the window glass, regardless of the design. According to one embodiment, the moire phenomenon can be eliminated by processing the shape of the glass by slanting the side surface to have an optimal slope according to the window material, or by processing the chamfer portion to a total reflection angle region where moire occurs according to the window material. According to one embodiment, the machining of the chamfer portion can be performed by increasing the size (or C-CUT amount) of the chamfer portion through symmetrical or asymmetrical cutting of the front and side surfaces of the chamfer portion, thereby eliminating the moire phenomenon.

[0166] An electronic device (101) (e.g., a wearable electronic device) according to one embodiment of the present disclosure may include a panel (700) and a window (600) formed on the panel (700). According to one embodiment, the window (600) may include a front surface, a side surface, and a chamfer portion connecting the front surface and the side surface. According to one embodiment, the window (600) may be diagonally processed so that a vertical straight section of the side surface of the window (600) that is perpendicular to the panel (700) extends from the chamfer portion and has a specified incline.

[0167] According to one embodiment, the window (600) may have different refractive indices formed on the side surface depending on the material forming the window (600).

[0168] According to one embodiment, the window (600) may have the specified slope determined based on the total reflection angle according to the refractive index of the window (600).

[0169] According to one embodiment, the window (600) may be formed of a first material or a second material.

[0170] According to one embodiment, the window (600) may be processed so that the side surface has a specified slope and / or the chamfer portion has a specified size or curvature, depending on the first material or the second material.

[0171] According to one embodiment, the window (600) may include a window of a first material or a window of a second material.

[0172] According to one embodiment, the refractive index of the window of the first material and the refractive index of the window of the second material may be different from each other.

[0173] According to one embodiment, the window (600) and the panel (700) may be arranged substantially parallel to each other.

[0174] According to one embodiment, the vertical straight section of the side surface can be formed to have a length calculated based on the total reflection angle.

[0175] According to one embodiment, the chamfered portion may be chamfered to have a width specified in the horizontal direction of the chamfered portion and to extend by the length in the vertical straight section of the side surface to increase the area of ​​the chamfered portion.

[0176] According to one embodiment, the window (600) may be formed into a curved shape with a chamfered portion having a specified curvature so as to reduce the total reflection amount according to the refractive index of the window (600) from the side.

[0177] According to one embodiment, the chamfered portion may be formed as a curved shape having a specified width in the horizontal direction of the chamfered portion and a specified curvature that increases the area of ​​the chamfered portion by extending the specified length in the vertical straight section of the side.

[0178] According to one embodiment, the window (600) may be formed in a shape in which the equilateral portion of the chamfer portion has a specified size to reduce the total reflection amount according to the refractive index of the window (600) from the side.

[0179] According to one embodiment, the chamfered portion may be formed to extend by a length calculated based on the total reflection angle in the vertical straight section, thereby increasing the designated size of the equilateral portion of the chamfered portion.

[0180] According to one embodiment, the window (600) may be formed in a shape in which the side surface has a specified slope so as to reduce the total reflection amount according to the refractive index of the window (600) on the side surface.

[0181] According to one embodiment, the window (600) may be formed in a curved shape with a chamfered portion having a specified curvature to reduce the total reflection amount according to the refractive index of the window (600) on the side surface, and the side surface may be formed in a shape extending from the curved surface of the chamfered portion and having a specified slope.

[0182] According to one embodiment, the window (600) may be formed such that the chamfered portion is formed in a curved shape having a specified curvature, and the vertical straight section of the side surface may be formed such that it extends from the curved surface of the chamfered portion and has a specified slope.

[0183] According to one embodiment, the window (600) may be formed in a shape in which the equilateral portion of the chamfer portion has a specified size to reduce the total reflection amount according to the refractive index of the window (600) on the side, and the side may be formed in a shape in which the equilateral portion of the chamfer portion extends and has a specified slope.

[0184] According to one embodiment, the window (600) may be formed so that the equilateral portion of the chamfer portion has a designated size according to a length calculated based on a total reflection angle, and the vertical straight section of the side may be formed so as to extend from the equilateral portion of the chamfer portion and have a designated slope.

[0185] According to one embodiment, the window (600) may be formed into a structure having a total reflection angle region that minimizes the total reflection amount by considering the refractive index according to the material of the window (600).

[0186] According to one embodiment, the window (600) may be formed with a structure that removes a total reflection section from a vertical straight section of the side.

[0187] According to one embodiment, the window (600) can be processed using a chamfer processing value set for the diagonal processing of the side and / or the chamfering processing of the chamfer portion.

[0188] In one embodiment, the chamfer machining value may include an inclination of the side surface.

[0189] In one embodiment, the chamfer machining value may include a symmetrical / asymmetrical curvature for a curved surface or a length for an equilateral portion based on the shape of the chamfer portion formed between the front surface and the side surface.

[0190] Hereinafter, a method for processing a window of an electronic device (101) according to various embodiments will be described. Operations (e.g., window processing operations) performed in an electronic device (101) according to various embodiments may be executed by a processor (120) including various processing circuitry and / or executable program elements of the electronic device (101). According to one embodiment, the operations performed in the electronic device (101) may be stored as instructions in a memory (130) and individually and / or collectively performed by the processor (120).

[0191] FIG. 16 is a flowchart illustrating an example of a method for processing a window of an electronic device according to one embodiment of the present disclosure.

[0192] A method for processing a window (600) for an electronic device (101) according to one embodiment of the present disclosure may proceed, for example, in the order of the flowchart illustrated in FIG. 16. The flowchart illustrated in FIG. 16 is an example according to one embodiment of a method for processing a window (600), and the order of at least some operations may be changed or performed in parallel, performed as independent operations, or at least some other operations may be performed complementarily to at least some operations.

[0193] Referring to FIG. 16, a window processing method according to one embodiment may be performed in the following order: a first setting process (1610), a second setting process (1620), a third setting process (1630), and a window (600) processing process (1640).

[0194] In one embodiment, the first setting process (1610) may include a process of setting the refractive index according to the material of the window (600). According to one embodiment, the refractive index corresponding to the material (e.g., the first material or the second material) of the window (600) mounted on the electronic device (101) may be set. For example, the window (600) may be formed of various materials, and the refractive index of the window (600) may differ depending on the material. In one embodiment, information regarding the refractive index according to the material of the window (600) may be preset in a design system for the window (600).

[0195] In one embodiment, the second setting process (1620) may include a process for setting a designated processing method. According to one embodiment, the second setting process (1620) may be a process for setting a processing method for forming the structure of the window (600). For example, the second setting process (1620) may be a process for determining a processing method corresponding to a structural change of a side surface of the window (600) and / or a structural change of a chamfer portion of the window (600). According to one embodiment, the processing method for forming the structure of the window (600) may include a processing method for processing the side surface and / or the chamfer portion of the window (600) so as to reduce the total reflection amount according to the refractive index of the window (600) at the side surface of the window (600).

[0196] According to one embodiment, the processing method for forming the structure of the window (600) may include, for example, a first processing method for processing the chamfer portion of the window (600) into a structure having a variable R (e.g., a radius of curvature) (e.g., the first structure of FIG. 11A or FIG. 11B), a second processing method for processing the chamfer portion of the window (600) into a structure having an increased amount of C-CUT (e.g., the second structure of FIG. 12), and / or a third processing method for processing the side surface of the window (600) into an inclined structure having a specified inclination (or slant angle) (e.g., the third structure of FIG. 13).

[0197] According to one embodiment, the processing method for forming the structure of the window (600) may follow a design structure such as the first structure, the second structure, or the third structure. According to one embodiment, the processing method for forming the structure of the window (600) may include a fourth processing method for processing into a combined structure of the first structure and the third structure (e.g., the fourth structure) or a fifth processing method for processing into a combined structure of the second structure and the third structure (e.g., the fifth structure), depending on the design structure for forming the window (600). According to one embodiment, the designated processing method of the window (600) may be set as an appropriate processing method for forming the design of the electronic device (101) by taking into consideration the design of the electronic device (101). According to one embodiment, the designated processing method of the window (600) may be set as a processing method of a structure capable of minimizing the total reflection amount by taking into consideration the refractive index according to the material of the window (600).

[0198] In one embodiment, the third setting process (1630) may include a process of setting a chamfer machining value corresponding to a refractive index in a designated processing method. According to one embodiment, the third setting process (1630) may be a process of setting a chamfer machining value to be used for machining the side surface and / or the chamfer portion of the window (600) in a designated processing method determined through the second setting process (1620). For example, the chamfer machining value may include an inclination of the side surface (e.g., an oblique angle) and / or a radius of curvature (e.g., R) or length of symmetry / asymmetry for the front and back surfaces of the chamfer portion (e.g., a w length of the front surface and / or a y length of the side surface).

[0199] In one embodiment, the machining process (1640) may include machining a side surface and / or a chamfer portion of the window (600) based on a specified machining method and chamfering value. For example, the machining process (1640) may be a process performed by diagonally machining a side surface of the window (600) and / or by chamfering (e.g., C-CUT) the chamfer portion of the window (600).

[0200] According to an embodiment of the present disclosure, the moire phenomenon can be improved by minimizing the total reflection amount in the window (600) through a process of processing the side and / or chamfer portion of the window (600) in a designated processing manner.

[0201] A method for processing a window (600) of an electronic device (101) (e.g., a wearable electronic device) according to one embodiment of the present disclosure may include an operation of setting a refractive index according to a material of the window (600) (e.g., a first setting process (1610)). According to one embodiment, the method may include an operation of setting a designated processing method (e.g., a second setting process (1620)). According to one embodiment, the method may include an operation of setting a chamfer processing value corresponding to the refractive index in the designated processing method (e.g., a third setting process (1630)). According to one embodiment, the method may include an operation of processing a side surface and / or a chamfer portion of the window (600) based on the designated processing method and the chamfer processing value (e.g., a processing process (1640)).

[0202] According to one embodiment, the window (600) may be formed of a first material or a second material.

[0203] According to one embodiment, the window processing method can perform the first setting process using a refractive index for the window (600) corresponding to the first material or the second material.

[0204] According to one embodiment, the window (600) is formed of a first material or a second material, and different refractive indices are formed on the side of the window (600) depending on the material forming the window (600), and the first setting process can be performed using a total reflection angle according to the refractive index of the window (600).

[0205] According to one embodiment, the first setting process may include calculating a length of a vertical straight section of the side surface based on the total reflection angle.

[0206] According to one embodiment, the refractive index of the window of the first material and the refractive index of the window of the second material may be different from each other.

[0207] According to one embodiment, the second setting process can be performed using a processing method corresponding to a structural change of the side surface of the window (600) and / or a structural change of the chamfer portion of the window (600).

[0208] According to one embodiment, the specified processing method may include a processing method for processing a side surface and / or a chamfer portion of the window (600) to reduce the total reflection amount according to the refractive index of the window (600) at the side surface of the window (600).

[0209] According to one embodiment, the specified processing method may include a diagonal processing method in which the vertical straight section of the side of the window (600) is processed to have a specified incline by extending from the chamfered portion, and / or a chamfering processing method in which the chamfered portion has a specified width in the horizontal direction and is processed to increase the area of ​​the chamfered portion by extending by the length from the vertical straight section of the side.

[0210] According to one embodiment, the specified processing method may include a first processing method in which the chamfer portion of the window (600) is processed into a first structure having a specified curvature according to the length.

[0211] According to one embodiment, the specified processing method may include a second processing method for processing the chamfer portion of the window (600) into a second structure having a size of an equilateral portion having a specified size according to the length.

[0212] According to one embodiment, the specified processing method may include a third processing method in which the side surface of the window (600) is processed into a third structure extending from the chamfer portion and having a specified slope.

[0213] According to one embodiment, the specified processing method may include a fourth processing method for processing a fourth structure by combining the first structure and the third structure.

[0214] According to one embodiment, the specified processing method may include a fifth processing method for processing a fifth structure by combining the second structure and the third structure.

[0215] According to one embodiment, the second setting process can be performed using a processing method of a structure capable of minimizing the total reflection amount by considering the refractive index according to the material of the window (600).

[0216] According to one embodiment, the third setting process may be performed using chamfer machining values ​​to be used in machining the side and / or chamfer portion of the window (600).

[0217] In one embodiment, the chamfer machining value may include an inclination of the side surface.

[0218] In one embodiment, the chamfer machining value may include a symmetrical / asymmetrical curvature for a curved surface or a length for an equilateral portion based on the shape of the chamfer portion formed between the front surface and the side surface.

[0219] According to one embodiment, the machining process may be performed using diagonal machining of the side surface of the window (600) and / or chamfering of the chamfer portion of the window (600).

[0220] A non-transitory computer-readable medium storing instructions that, when executed by a processor (120) of an electronic device (101) according to one embodiment of the present disclosure, cause the processor (120) to perform operations, the instructions may include a recording medium that, when executed by the processor (120), causes the electronic device (101) to perform an operation of setting a refractive index for each material of a window (600) (e.g., a first setting process), an operation of setting a designated processing method (e.g., a second setting process), an operation of setting a chamfer processing value corresponding to the refractive index in the designated processing method (e.g., a third setting process), and an operation of processing a side surface and / or a chamfer portion of the window (600) based on the designated processing method and the chamfer processing value (e.g., a processing process).

[0221] It will be appreciated that the above-described embodiments and their technical features may be combined with each other in any and all combinations, as long as there is no potential conflict between the two embodiments or features. For example, any and all combinations of two or more of the above-described embodiments may be envisioned and incorporated within the present disclosure. One or more features from any embodiment may be incorporated into any other embodiment, providing a corresponding advantage or advantages.

[0222] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0223] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the components from other corresponding components and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another component (e.g., a second) with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0224] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0225] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0226] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0227] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0228] The various embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples to facilitate easy explanation of the technical content of the present disclosure and aid understanding of the present disclosure, and are not intended to limit the scope of the present disclosure. Therefore, the scope of the present disclosure should be interpreted to include all modifications or variations derived based on the technical concepts of the present disclosure, in addition to the embodiments disclosed herein.

Claims

1. In an electronic device (101), panel (700); and Including a window (600) formed on top of the above panel (700), The above window (600) is, It comprises a front surface, a side surface, and a chamfer portion connecting the front surface and the side surface, An electronic device characterized in that the vertical straight section of the side of the window (600) that is perpendicular to the panel (700) is diagonally processed to have a designated incline by extending from the chamfer portion.

2. In paragraph 1, The above window (600) has different refractive indices formed on the side surface depending on the material forming the window (600). The specified slope is determined based on the total reflection angle according to the refractive index of the above window (600). An electronic device characterized in that the vertical straight section of the above side is formed to have a length calculated based on the total reflection angle.

3. In paragraph 2, An electronic device characterized in that the chamfered portion has a width specified in the horizontal direction of the chamfered portion and is chamfered so as to increase the area of ​​the chamfered portion by extending by the length in the vertical straight section of the side surface.

4. In paragraph 2, An electronic device characterized in that the chamfered portion is formed as a curved shape having a specified curvature that increases the area of ​​the chamfered portion by extending the length in the vertical straight section of the side while having a specified width in the horizontal direction of the chamfered portion.

5. In paragraph 2, An electronic device characterized in that the chamfered portion is formed to increase the designated size of the equilateral portion of the chamfered portion by extending by a length calculated based on the total reflection angle in the vertical straight section.

6. In paragraph 1, The above window (600) is an electronic device characterized in that the chamfered portion is formed in a curved shape having a specified curvature, and the vertical straight section of the side is formed to extend from the curved surface of the chamfered portion and have a specified slope.

7. In paragraph 1, An electronic device characterized in that the above window (600) is formed so that the equilateral portion of the chamfer portion has a designated size according to a length calculated based on a total reflection angle, and the vertical straight section of the side is formed so as to extend from the equilateral portion of the chamfer portion and have a designated slope.

8. In paragraph 1, An electronic device characterized in that the above window (600) is formed with a structure that removes a total reflection section from a vertical straight section of the side.

9. In paragraph 1, An electronic device characterized in that the above window (600) is processed using a chamfer processing value set for the diagonal processing of the side and / or the chamfering processing of the chamfer portion.

10. In paragraph 9, The above chamfer machining value includes the inclination of the side surface, and / or An electronic device characterized in that the chamfer machining value includes a symmetrical / asymmetrical curvature for a curved surface or a length for an equilateral portion based on the shape of the chamfer portion formed between the front surface and the side surface.

11. A method for processing a window (600) of an electronic device (101), A first setting process (1610) for setting the refractive index for each material of the above window (600); A second setting process (1620) for setting a specified processing method; A third setting process (1630) for setting a chamfer processing value corresponding to the refractive index in the above-mentioned specified processing method; and A window processing method including a processing process (1640) for processing a side surface and / or a chamfer portion of the window (600) based on the above-mentioned specified processing method and the chamfer processing value.

12. In paragraph 11, The above window (600) is formed of a first material or a second material, and a different refractive index is formed on the side of the window (600) depending on the material forming the window (600). A window processing method characterized in that the first setting process is performed using the total reflection angle according to the refractive index of the window (600).

13. In the 12th paragraph, the first setting process, Including calculating the length of the vertical straight section of the side surface based on the total reflection angle, The above second setting process is, Including performing the process using a processing method corresponding to a structural change of the side surface of the above window (600) and / or a structural change of the chamfer portion of the above window (600). The above third setting process is, Including performing the machining using chamfer machining values ​​to be used for machining the side surface and / or the chamfer portion of the above window (600), wherein the chamfer machining values ​​include a symmetrical / asymmetrical curvature for the curved surface or a length for an equilateral portion based on the inclination of the side surface and / or the shape of the chamfer portion formed between the front surface and the side surface, The above processing process is, A window processing method characterized by including performing diagonal processing of a side surface of the window (600) and / or chamfering processing of a chamfer portion of the window (600).

14. In paragraph 13, the specified processing method is, A window processing method characterized by including a diagonal processing method in which a vertical straight section of the side surface of the window (600) is processed to have a designated incline by extending from the chamfer portion, and / or a chamfering processing method in which the chamfer portion has a designated width in the horizontal direction and is processed to increase the area of ​​the chamfer portion by extending by the length from the vertical straight section of the side surface.

15. A non-transitory computer-readable medium storing instructions that, when executed by a processor of an electronic device, cause the processor to perform operations, The above instructions, when executed by the processor, cause the electronic device to: Action to set the refractive index for each material of the window. Action to set a specified processing method, An operation for setting a chamfer processing value corresponding to a refractive index in the above-mentioned processing method, and A recording medium that causes an operation of machining a side surface and / or a chamfer portion of the window based on the above-mentioned specified machining method and the above-mentioned chamfer machining value.

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