New magnetic vehicle-mounted wireless charging module combining air cooling with semiconductor heat dissipation

Abstract

A magnetic vehicle-mounted wireless charging module combining air cooling with semiconductor heat dissipation, the wireless charging module comprising an upper cover and a base, wherein a heat dissipation plate is provided between the upper cover and the base and is provided with a semiconductor refrigeration piece, a magnetic charging assembly covers the semiconductor refrigeration piece, an elastic member is provided between an outward flange structure provided at the bottom of the magnetic charging assembly and the heat dissipation plate, a stepped hole for the magnetic charging assembly to pass therethrough is provided in the upper cover and positioned corresponding to the magnetic charging assembly, and the bottom of the stepped hole abuts against the outward flange to seal the stepped hole; and a left side portion of the heat dissipation plate is provided with a ventilation hole, a fan assembly is mounted at the bottom of the ventilation hole, and the heat dissipation plate fits with and is connected to the upper cover to form a communication cavity between the fan assembly and the magnetic charging assembly. In the wireless charging module, by providing the elastic member, the upper cover fits with the magnetic charging assembly to form a hidden air outlet, so that it is possible to prevent foreign matter from entering the wireless charging module, and prevent liquid and foreign matter from damaging the apparatus; and the wireless charging module has a compact and clever structure.

Description

A new magnetic car wireless charging module with air cooling and semiconductor heat dissipation Technical Field

[0001] The utility model relates to the field of wireless charging, and specifically to a novel magnetic vehicle-mounted wireless charging module that combines air cooling with semiconductor heat dissipation. Background Art

[0002] Wireless charging is not only convenient but also safe. Without a cable, the charger completely avoids safety hazards such as leakage. Therefore, more and more mobile device products designed by companies are joining the ranks of wireless charging technology and already have wireless charging functions.

[0003] With the increase in wireless charging power from 50W to 80W, the heat dissipation required by the wireless charging module and the device being charged will increase exponentially. For mobile devices with high-power wireless charging capabilities, overheating during charging has become a pressing issue. Excessive temperatures can seriously impact the safety of electronic devices. At the very least, they can trigger the device's temperature protection system, reducing charging efficiency and ensuring device safety, but significantly compromising the user experience. Existing wireless charging heat dissipation methods primarily rely on semiconductor cooling combined with active fan cooling. This requires ventilation holes on the vehicle's wireless charging surface to direct airflow to the side of the device being charged, dissipating heat. However, during use, debris such as water, beverages, and biscuit crumbs can easily enter the wireless charging module through the vents, creating a risk of short circuits and being difficult to clean. Debris can damage the fan, causing the wireless charging module to malfunction, requiring time-consuming and labor-intensive replacement at a specialized location. Furthermore, the vents are located on the interior trim, impacting the aesthetics. Utility Model Content

[0004] The utility model provides a novel magnetic vehicle-mounted wireless charging module that combines air cooling with semiconductor heat dissipation. The utility model can prevent foreign matter from entering the wireless charging module, prevent liquids and foreign matter from damaging the device, and has a compact and ingenious structure.

[0005] In order to achieve the above objectives, the following technical solutions are adopted.

[0006] The utility model discloses a novel magnetic vehicle-mounted wireless charging module with air cooling combined with semiconductor heat dissipation, comprising an upper cover and a base, a heat sink is provided between the upper cover and the base, a semiconductor refrigeration sheet is provided on the heat sink, a magnetic charging assembly is covered on the semiconductor refrigeration sheet, and the magnetic charging assembly comprises a heat-conducting shell, an outward folding edge is provided at the bottom of the outer circumference of the heat-conducting shell, an elastic member is provided between the bottom edge of the heat-conducting shell and the heat dissipation plate, a step hole for the magnetic charging assembly to pass through is provided at a position corresponding to the upper cover and the heat-conducting shell, the bottom of the step hole abuts against the outward folding edge to close the step hole; a ventilation hole is provided on the left side of the heat dissipation plate, a fan assembly is installed at the bottom of the ventilation hole, and the heat dissipation plate is matched with the upper cover to form a connecting cavity between the fan assembly and the magnetic charging assembly.

[0007] In the above technical solution, the heat sink has the heat dissipation function of conducting heat to the circumferential side, and is also provided between the upper cover and the base as a fixed frame with a supporting function. A semiconductor refrigeration sheet is provided on the surface of the heat sink, and the upper surface of the semiconductor refrigeration sheet contacts the magnetic charging component for cooling. The cooling reduces the temperature of the magnetic charging component and the device to be charged placed on the magnetic charging component, and then the heat generated inside the semiconductor refrigeration sheet during the cooling process is dissipated through the contact between the lower surface of the semiconductor refrigeration sheet and the heat sink. The bottom surface of the left side of the heat sink is connected to the fan assembly, and the fan assembly The component provides a flowing air source for the wireless charging device, and the flowing air source takes away the heat of the heat sink and internal components. The device to be charged is placed on the heat-conducting shell of the magnetic charging component. Due to the effect of gravity, the elastic member between the outward-turned folded edge and the heat sink is contracted by gravity until the device to be charged compresses the elastic member to the point where the surface of the heat-conducting shell and the upper cover are in the same plane and the heat-conducting shell is balanced. At this time, the heat-conducting shell is displaced downward by the length of the previously extended step hole, so that the outward-turned folded edge is separated from the step hole, so that the circumference of the contact between the device to be charged and the magnetic charging component and the internal space form a connecting cavity. The fan component The wind source can take away the heat of the device to be charged through the connecting cavity, so that the device to be charged can dissipate heat synchronously through the fan assembly and the semiconductor refrigeration sheet during the wireless charging process; in this solution, the device to be charged is placed in front of the magnetic charging assembly, and the magnetic charging assembly is subjected to the elastic force of the bottom elastic member to make the outward folded edge contact and connect with the step hole, so that the surface of the wireless charging device is in a closed state with the outside world, and then the device to be charged is placed on the magnetic charging assembly. Under the action of gravity, the connecting cavity opens to form an annular air outlet around the device to be charged, and the fan assembly dissipates heat to the device to be charged through the annular air outlet The heat is dissipated around the device to be charged. After the device to be charged is removed, the air vent is reset and closed under the action of the elastic part, which can prevent foreign matter from entering the wireless charging module and prevent liquid and foreign matter from damaging the wireless charging module. In addition, the setting of the elastic part can make the heat-conducting shell in close contact with the back of the device to be charged, reducing thermal resistance and condensation water generation, and increasing the friction between the device to be charged and the magnetic charging component, so that the device to be charged without magnetic suction function can also be stably attached to the magnetic charging component, reducing the occurrence of disconnection or falling of the device to be charged due to the shaking of the car, thereby improving charging efficiency and user experience.

[0008] Furthermore, the heat dissipation plate is provided with a first stop wall outside the vent, and the upper cover is provided with a second stop wall at a position corresponding to the first stop wall, and the first stop wall and the second stop wall are connected in cooperation to form a connecting cavity.

[0009] In the above technical solution, a connecting cavity is formed between the magnetic charging component and the vent through the coordinated connection of the first stop wall and the second stop wall, so that the wind source generated by the fan component when it is working directly acts on the equipment to be charged and the semiconductor refrigeration plate at the upper and lower ends of the magnetic charging component, thereby improving the mechanical efficiency of the fan component's air cooling.

[0010] Furthermore, the base is provided with an air suction port, and the fan assembly is located above the air suction port.

[0011] In the above technical solution, the air suction port is located below the fan assembly. When the fan assembly is working, the air source is convected through the air suction port, further driving the air flow near the main heat source of the device to be charged, greatly improving the air convection heat transfer coefficient, and combining the air suction for air cooling and the semiconductor refrigeration plate for cooling, the charging temperature rise of the device to be charged is effectively reduced, ensuring efficiency and safety of use.

[0012] Furthermore, the heat sink is a rectangular structure consisting of a left side and a right side. Both the left side and the right side of the heat sink are provided with heat sink positioning buckles, and the sides of the base are provided with heat sink positioning holes corresponding to the heat sink positioning buckles.

[0013] In the above technical solution, the fan assembly is located on the left side of the heat sink, and the right side of the heat sink is connected to the semiconductor refrigeration plate. The left side of the heat sink can provide air supply and heat dissipation for the device to be charged, and the right side of the heat sink can provide heat conduction and heat dissipation for the device to be charged. Heat dissipation positioning buckles are provided on the left and right sides of the heat sink, and the heat dissipation positioning buckles are buckled with the base through the heat dissipation positioning holes, so that the heat sink is limited and positioned on the base, ensuring the stability and reliability of the connection between the heat sink and the base.

[0014] Furthermore, a plurality of heat dissipation fins are provided at the bottom of the right side of the heat dissipation plate.

[0015] In the above technical solution, the heat dissipation fins can improve the heat dissipation efficiency of the heat sink. The upper right side of the heat sink is the charging area of ​​the device to be charged, which will generate more heat. By setting the heat dissipation fins, the high-temperature area of ​​the heat sink can be assisted to dissipate heat faster.

[0016] Furthermore, a PCBA circuit board is provided below the heat dissipation fins, and the PCBA circuit board is connected to the bottom of one side of the fan assembly.

[0017] In the above technical solution, a PCBA circuit board installed on the fan assembly is provided under the heat dissipation fins. By setting a horizontal air outlet on one side of the fan assembly, the heat dissipation plate and the PCBA circuit board can be cooled simultaneously. The structural design is compact and ingenious. Compared with the natural heat dissipation method of the traditional vehicle-mounted wireless charging module PCBA circuit board, the active heat dissipation method can greatly reduce the temperature of components, extend the service life and stability of wireless charging equipment, and lay the foundation for the subsequent high-power 80W wireless charging module heat dissipation solution.

[0018] Furthermore, a lateral air outlet is provided on the side of the fan assembly above the connection with the PCBA circuit board.

[0019] In the above technical solution, the setting of the horizontal air outlet enables most of the air volume to be sent out from the horizontal air outlet when the fan assembly is working, thereby taking away the heat generated by the PCBA circuit board below the horizontal air outlet when working, and improving the heat dissipation efficiency of the fan assembly.

[0020] Furthermore, the semiconductor refrigeration plate is located on the upper surface of the right side of the heat sink at a position corresponding to the position above the heat sink fins.

[0021] In the above technical solution, the bottom of the semiconductor refrigeration plate is in contact with the heat sink and is located above the heat sink fins. The upper surface of the semiconductor refrigeration plate is used for cooling to cool the device to be charged. The heat generated by the semiconductor refrigeration plate and the heat conducted from the device to be charged are abutted against the heat sink by the lower surface of the semiconductor refrigeration plate, and auxiliary heat dissipation is performed through the heat sink fins.

[0022] Furthermore, a heat dissipation channel is formed between the PCBA circuit board and the heat dissipation plate, and a heat dissipation port is provided on the side of the heat dissipation channel away from the fan assembly.

[0023] In the above technical solution, the fan assembly works to blow out cold air through the horizontal air outlet. The cold air source enters the heat dissipation channel between the PCBA circuit board and the heat sink, and discharges the heat from the heat dissipation channel through the heat dissipation outlet. The cold air source flowing in the heat dissipation channel cools the PCBA circuit board and the heat sink, greatly improving the heat dissipation effect of the heat sink and greatly reducing the temperature of the PCBA circuit board, extending the service life of the wireless charging device and improving the charging efficiency of the device to be charged.

[0024] Furthermore, a plurality of elastic members are provided at the bottom of the outward-turned folded edge along the circumferential direction.

[0025] In the above technical solution, multiple elastic parts are arranged along the circumferential direction of the bottom of the outward-turned folded edge, so that several elastic parts are evenly distributed on the bottom of the outward-turned folded edge structure. The elastic parts have a certain mutual constraint in other directions, providing stable supporting elastic force for the magnetic charging component, and pushing the magnetic charging component to be tightly attached to the device to be charged, increasing the friction between the device to be charged and the magnetic charging component, so that the non-magnetic device to be charged can also be stably attached to the magnetic charging component, thereby avoiding the possibility of charging interruption of the device to be charged. At the same time, it can also reduce thermal resistance and reduce the generation of condensation water, making the charging efficiency higher.

[0026] Furthermore, a guide column is provided at the bottom of the outward-folded edge in the elastic member, and a guide hole is provided at a position corresponding to the outward-folded edge guide column on the heat dissipation plate. The guide column is slidably connected in the guide hole, and the elastic member abuts against the heat dissipation plate outside the guide hole.

[0027] In the above technical solution, the guide holes on the heat dissipation plate cooperate with the guide columns at the bottom of the outward-folded edge to prevent the elastic member from shifting when it contracts downward, thereby making the structure of the wireless charging device more stable and allowing a stable annular air outlet for heat dissipation to appear when the magnetic charging assembly is placed on the device to be charged.

[0028] Furthermore, a magnetic coil assembly and a bottom cover are provided in the magnetic charging assembly, the bottom cover is covered on the bottom of the heat-conducting outer shell, and the surface and bottom surface of the magnetic coil assembly are respectively connected to the heat-conducting outer shell and the bottom cover.

[0029] In the above technical solution, the heat-conductive shell and the bottom cover are both made of materials with good thermal conductivity. The magnetic coil assembly is connected to the heat-conductive shell and the bottom cover, so as to transfer the heat of the device to be charged on the magnetic charging assembly from the high-heat area to the low-heat area for heat dissipation.

[0030] Furthermore, the magnetic coil assembly includes a magnetic ring and a coil, and a magnetic ring groove and a coil groove are provided on the bottom cover. The magnetic ring is installed in the magnetic ring groove through a metal retaining ring, and the coil is installed in the coil groove through a magnetic isolation sheet.

[0031] In the above technical solution, the magnetic ring provides a magnetic attraction function, which secures the device to be charged with a magnetic attraction function on the magnetic charging assembly. Good contact can reduce the contact thermal resistance and fully improve the utilization rate of the cooling capacity provided by the semiconductor refrigeration plate below; the coil realizes the wireless charging function through magneto-electric conversion; the metal retaining ring has a protective and supporting effect on the magnetic ring, and the magnetic isolation plate can reduce the magnetic field loss generated by the coil, and transmit the magnetic field as much as possible toward the device to be charged, thereby improving the PING efficiency and stability; by installing the magnetic coil assembly on the bottom cover and dissipating heat through contact with the bottom cover.

[0032] Furthermore, a heat-conducting component is provided inside the magnetic charging component, and the heat-conducting component includes a first heat-conducting silicone and a second heat-conducting silicone. The first heat-conducting silicone is located inside the coil and installed on the magnetic isolation sheet. The bottom surface of the second heat-conducting silicone abuts against the surface of the first heat-conducting silicone and the surface of the coil, and the surface of the second heat-conducting silicone abuts against the inside of the heat-conducting shell.

[0033] In the above technical solution, the heat-conducting component has good thermal conductivity. The bottom surface of the first heat-conducting silicone rubber contacts the second heat-conducting silicone rubber and the coil, and the surface of the first heat-conducting silicone rubber contacts the bottom surface of the inner part of the heat-conducting shell. The heat-conducting component is used to contact and connect the inside of the magnetic re-assembly, so that the heat transfer and transfer inside is more efficient and faster.

[0034] Furthermore, a positioning slot is provided on a side of the upper cover, and a base buckle is provided on a side of the base that matches the positioning slot.

[0035] In the above technical solution, the positioning slot can be extended into the base buckle for mating connection, and the base buckle is limited in the positioning slot to achieve mating positioning of the base and the upper cover, thereby ensuring the stability and reliability of the shell connection of the wireless charging module.

[0036] Compared with the existing technology, the novel magnetic vehicle-mounted wireless charging module with air cooling combined with semiconductor heat dissipation has the following beneficial effects:

[0037] The utility model discloses a novel magnetic vehicle-mounted wireless charging module with air cooling combined with semiconductor heat dissipation, by providing an elastic part to connect the magnetic charging component and the heat dissipation plate, the magnetic charging component is abutted against the step hole provided in the upper cover under the action of elastic force to form a hidden air outlet, the device to be charged is placed on the magnetic charging component, the device to be charged causes the magnetic charging component to move downward under the action of gravity, and then the air outlet is opened, and the fan component can dissipate heat from the device to be charged through the air outlet, thereby reducing the battery temperature and prolonging the service life of the device; after the device to be charged is removed, the magnetic charging component moves upward and resets under the action of the elastic part, so that the air outlet is closed, which can prevent foreign matter from entering the wireless charging module and prevent liquid and foreign matter from damaging the wireless charging module; and the provision of the elastic part can make the magnetic charging component in close contact with the back of the device to be charged, so that the device to be charged without magnetism can also be stably attached to the magnetic charging component, thereby increasing the friction between the device to be charged and the wireless charging module, reducing the situation of charging interruption caused by the shaking of the device to be charged, and at the same time reducing thermal resistance and the generation of condensation water on the charging surface, thereby improving charging efficiency and user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] FIG1 is an exploded view of a novel magnetic vehicle-mounted wireless charging module that combines air cooling with semiconductor heat dissipation according to the present invention;

[0039] Figure 2 is an exploded view of the magnetic charging assembly of the present invention;

[0040] FIG3 is a top view of a novel magnetic vehicle-mounted wireless charging module that combines air cooling with semiconductor heat dissipation according to the present invention;

[0041] FIG4 is a top view of the combination of the utility model and the device to be charged;

[0042] FIG5 is a cross-sectional view taken along line AA of FIG3 ;

[0043] FIG6 is a sectional view taken along line BB of FIG4 ;

[0044] FIG7 is an enlarged view of portion C of FIG5 ;

[0045] FIG8 is an enlarged view of portion D of FIG6 .

[0046] Explanation of the accompanying numbers: 1-top cover; 2-base; 3-heat sink; 4-fan assembly; 5-semiconductor refrigeration chip; 6-magnetic charging assembly; 7-PCBA circuit board; 8-device to be charged; 9-annular air outlet; 10-connecting cavity; 11-step hole; 12-second stop wall; 13-positioning card slot; 21-air inlet; 22-heat dissipation outlet; 23-base buckle; 24-heat dissipation positioning hole; 31-guide hole; 32-ventilation hole; 33- Heat dissipation channel; 34-heat dissipation fins; 35-first retaining wall; 36-heat dissipation positioning buckle; 41-horizontal air outlet; 61-thermal conductive shell; 611-outward folding edge; 612-elastic member; 613-guide column; 62-thermal conductive component; 621-first thermal conductive silicone rubber; 622-second thermal conductive silicone rubber; 63-magnetic ring; 64-metal retaining ring; 65-coil; 66-magnetic isolation sheet; 67-bottom cover; 671-magnetic ring groove; 672-coil groove. DETAILED DESCRIPTION

[0047] The following is a further detailed description of a novel magnetic vehicle-mounted wireless charging module that combines air cooling with semiconductor heat dissipation in conjunction with specific embodiments and drawings.

[0048] 1 to 8 , a non-limiting embodiment of the present invention is a novel magnetic vehicle-mounted wireless charging module that combines air cooling with semiconductor heat dissipation, comprising an upper cover 1 and a base 2, a heat sink 3 being provided between the upper cover 1 and the base 2, a semiconductor refrigeration sheet 5 being provided on the heat sink 3, a magnetic charging assembly 6 being closed on the semiconductor refrigeration sheet 5 and the upper cover 1, the magnetic charging assembly 6 comprising a heat-conducting shell 61, an outward folding edge 611 being provided at the bottom of the outer circumference of the heat-conducting shell 61, an elastic member 612 being provided between the bottom edge of the heat-conducting shell 61 and the heat sink 3, a step hole 11 for the magnetic charging assembly 6 to pass through being provided at a position corresponding to the upper cover 1 and the heat-conducting shell 61, the bottom of the step hole 11 abutting against the outward folding edge 611 to close the step hole 11; a ventilation hole 32 is provided on the left side of the heat sink 3, a fan assembly 4 is installed at the bottom of the ventilation hole 32, the heat sink 3 is cooperatively connected to the upper cover 1 to form a connecting cavity 10 between the fan assembly 4 and the magnetic charging assembly 6.In the above technical solution, the heat sink 3 has the heat dissipation function of conducting heat to the circumferential side, and is also provided between the upper cover 1 and the base 2 as a fixed frame with a supporting function. A semiconductor refrigeration sheet 5 is provided on the surface of the heat sink 3. The upper surface of the semiconductor refrigeration sheet 5 contacts the magnetic charging component 6 for cooling. The cooling reduces the temperature of the magnetic charging component 6 and the device to be charged 8 placed on the magnetic charging component 6. Then, the lower surface of the semiconductor refrigeration sheet 5 contacts the heat sink 3 to dissipate the heat generated inside the semiconductor refrigeration sheet 5 during the cooling process. The bottom surface of the left side of the heat sink 3 is connected to the fan component 4, and the fan component 4 is a wireless charging The device provides a flowing wind source, which takes away the heat from the heat sink 3 and the internal components. The device to be charged 8 is placed on the heat-conducting shell 61 of the magnetic charging component 6. Due to the effect of gravity, the elastic member 612 between the outward-turned folded edge 611 and the heat sink 3 shrinks under gravity until the device to be charged 8 compresses the elastic member 612 to the point where the surface of the heat-conducting shell 61 and the upper cover 1 are in the same plane. At this time, the heat-conducting shell 61 moves downward by the length of the previously extended step hole 11, so that the outward-turned folded edge 611 is separated from the step hole 11, so that the contact circle between the device to be charged 8 and the magnetic charging component 6 forms a connecting cavity 10 with the internal space. The wind source of the fan assembly 4 can take away the heat of the device to be charged 8 through the connecting cavity 10, so that the device to be charged 8 can dissipate heat synchronously through the fan assembly 4 and the semiconductor refrigeration plate 5 during the wireless charging process; in this solution, the device to be charged 8 is placed in front of the magnetic charging assembly 6, and the magnetic charging assembly 6 is subjected to the elastic force of the bottom elastic member 612 so that the outward folded edge 611 is in contact and connected with the step hole 11, so that the surface of the wireless charging device is in a closed state with the outside world, and then the device to be charged 8 is placed on the magnetic charging assembly 6. Under the action of gravity, the connecting cavity 10 opens to form an annular air outlet 9 around the device to be charged 8, and the fan assembly 4 passes through the annular air outlet 9 dissipates heat around the device to be charged 8. After the device to be charged 8 is removed, the air vent is reset and closed under the action of the elastic member 612, which can prevent foreign matter from entering the wireless charging module and prevent liquid and foreign matter from damaging the wireless charging module. In addition, the setting of the elastic member 612 can make the heat-conducting shell 61 closely contact with the back of the device to be charged 8, reduce thermal resistance and condensation, increase the friction between the device to be charged 8 and the magnetic charging component 6, so that the device to be charged 8 without magnetic attraction can also be stably attached to the magnetic charging component 6, reduce the occurrence of disconnection or falling of the device to be charged 8 due to the shaking of the car, and improve charging efficiency and user experience.

[0049] Referring to Figures 1 to 8, a non-limiting embodiment of the present invention is provided. The heat sink 3 is provided with a first stop wall 35 on the outside of the vent, and the upper cover 1 is provided with a second stop wall 12 at a position corresponding to the first stop wall 35. The first stop wall 35 and the second stop wall 12 cooperate to form a connecting cavity 10. In the above technical solution, the connecting cavity 10 is formed between the magnetic charging assembly 6 and the vent by the cooperation of the first stop wall 35 and the second stop wall 12, so that the wind source generated by the fan assembly 4 when it is working directly acts on the charging device 8 and the semiconductor refrigeration plate 5 at the upper and lower ends of the magnetic charging assembly 6, thereby improving the mechanical efficiency of the fan assembly 4 in air cooling. In this embodiment, the first stop wall 35 and the second stop wall 12 are both U-shaped stop walls, and the two stop walls cooperate with each other to form a U-shaped channel leading to the magnetic charging assembly 6.

[0050] Referring to Figures 1 to 8, a non-limiting embodiment of the present invention is shown in which the base 2 is provided with an air intake 21, and the fan assembly 4 is located above the air intake 21. In the above technical solution, the air intake 21 is located below the fan assembly 4. When the fan assembly 4 is in operation, the air source is convected through the air intake 21, further driving the air flow near the main heat source of the device to be charged 8, greatly improving the air convection heat transfer coefficient. Combined with the air cooling by suction and the cooling by the semiconductor refrigeration plate 5, the charging temperature rise of the device to be charged 8 is effectively reduced, ensuring efficiency and safety.

[0051] 1 to 8 , a non-limiting embodiment of the present invention is shown, in which the heat sink 3 is a rectangular structure consisting of a left side and a right side. Both the left and right sides of the heat sink 3 are provided with heat dissipation positioning buckles 36, and the sides of the base 2 are provided with heat dissipation positioning holes 24 corresponding to the heat dissipation positioning buckles 36. In the above technical solution, the fan assembly 4 is located on the left side of the heat sink 3, and the right side of the heat sink 3 is connected to the semiconductor refrigeration plate 5. The left side of the heat sink 3 can be used for air supply and heat dissipation of the device to be charged 8, and the right side of the heat sink 3 can be used for heat conduction and heat dissipation of the device to be charged 8. By providing heat dissipation positioning buckles 36 on the left and right sides of the heat sink 3, the heat dissipation positioning buckles 36 are buckled with the base 2 through the heat dissipation positioning holes 24, so that the heat sink 3 is limited and positioned on the base 2, ensuring the stability and reliability of the connection between the heat sink 3 and the base 2.

[0052] Referring to Figures 1 to 8 , a non-limiting embodiment of the present invention includes a plurality of heat dissipation fins 34 disposed on the bottom right side of the heat sink 3. In this embodiment, the heat dissipation fins 34 improve the heat dissipation efficiency of the heat sink 3. The area above the right side of the heat sink 3 is where the charging device 8 is charged, generating considerable heat. The provision of the heat dissipation fins 34 facilitates faster heat dissipation in this high-heat area of ​​the heat sink 3.

[0053] Referring to Figures 1 to 8 , a non-limiting embodiment of the present invention is shown. A PCBA circuit board 7 is provided below the heat dissipation fins 34, and the PCBA circuit board 7 is connected to the bottom of one side of the fan assembly 4. In the above technical solution, a PCBA circuit board 7 mounted on the fan assembly 4 is provided below the heat dissipation fins 34. By providing a horizontal air outlet 41 on one side of the fan assembly 4, the heat dissipation plate 3 and the PCBA circuit board 7 can be simultaneously cooled by air. This compact and ingenious structural design significantly reduces component temperature compared to the natural heat dissipation of the PCBA circuit board 7 in conventional in-vehicle wireless charging modules, extending the service life and stability of wireless charging equipment and laying the foundation for subsequent high-power 80W wireless charging module heat dissipation solutions.

[0054] Referring to Figures 1 to 8 , a non-limiting embodiment of the present invention includes a horizontal air outlet 41 formed on the side of the fan assembly 4 above the connection to the PCBA circuit board 7. In the above technical solution, the provision of the horizontal air outlet 41 allows the majority of the airflow from the fan assembly 4 to be discharged through the horizontal air outlet 41 during operation, thereby removing heat generated by the PCBA circuit board 7 below the horizontal air outlet 41 and improving the heat dissipation efficiency of the fan assembly 4.

[0055] Referring to Figures 1 to 8 , in a non-limiting embodiment of the present invention, the semiconductor cooling fin 5 is located on the upper surface of the right side of the heat sink 3, corresponding to a position above the heat dissipation fins 34. In the above technical solution, the bottom of the semiconductor cooling fin 5 abuts the heat sink 3 and is located above the heat dissipation fins 34. The upper surface of the semiconductor cooling fin 5 cools the device 8 to be charged. The heat generated by the semiconductor cooling fin 5 and the heat conducted from the device 8 to be charged are dissipated through the lower surface of the semiconductor cooling fin 5 abutting the heat sink 3 and the heat dissipated by the heat dissipation fins 34.

[0056] Referring to Figures 1 to 8 , a non-limiting embodiment of the present invention is shown. A heat dissipation channel 33 is formed between the PCBA circuit board 7 and the heat sink 3. The base 2 is provided with a heat dissipation port 22 on the side of the heat dissipation channel 33 away from the fan assembly 4. In the above technical solution, the fan assembly 4 blows cool air through the transverse air outlet 41 during operation. This cool air source enters the heat dissipation channel 33 between the PCBA circuit board 7 and the heat sink 3, and discharges heat from the heat dissipation channel 33 through the heat dissipation port 22. The cool air source flowing through the heat dissipation channel 33 cools the PCBA circuit board 7 and the heat sink 3, significantly improving the heat dissipation function of the heat sink 3 and significantly reducing the temperature of the PCBA circuit board 7, thereby extending the service life of the wireless charging device and improving the charging efficiency of the device to be charged 8.

[0057] Referring to Figures 1 to 8, a non-limiting embodiment of the present invention is provided with a plurality of elastic members 612 along the circumferential direction of the bottom of the outward-turned fold 611. In the above technical solution, a plurality of elastic members 612 are provided along the circumferential direction of the bottom of the outward-turned fold 611, so that the plurality of elastic members 612 are evenly distributed at the bottom of the outward-turned fold 611 structure. The elastic members 612 have a certain mutual restraint effect in other directions, providing a stable supporting elastic force for the magnetic charging component 6, and pushing the magnetic charging component 6 to be tightly attached to the device to be charged 8, increasing the friction between the device to be charged 8 and the magnetic charging component 6, so that the non-magnetic device to be charged 8 can also be stably attached to the magnetic charging component 6, thereby avoiding the possibility of the device to be charged 8 being disconnected from charging. At the same time, it can also reduce thermal resistance and reduce the generation of condensed water, making the charging efficiency higher.

[0058] Referring to Figures 1 to 8, a non-limiting embodiment of the present invention is shown in which a guide post 613 is provided at the bottom of the outward-turned fold 611 within an elastic member 612. A guide hole 31 is provided on the heat sink 3 at a position corresponding to the guide post 613 of the outward-turned fold 611. The guide post 613 is slidably connected within the guide hole 31, and the elastic member 612 abuts the heat sink 3 outside the guide hole 31. In the above technical solution, the guiding cooperation between the guide hole 31 on the heat sink 3 and the guide post 613 at the bottom of the outward-turned fold 611 prevents the elastic member 612 from deflecting when it contracts downward, thereby making the structure of the wireless charging device more stable and ensuring that the annular air vent 9 for heat dissipation is stably present when the magnetic charging assembly 6 is placed on the device to be charged 8.

[0059] Referring to Figures 1 to 8, a non-limiting embodiment of the present invention is shown. The magnetic charging assembly 6 includes a magnetic coil 65 assembly and a bottom cover 67. The bottom cover 67 covers the bottom of the thermally conductive housing 61. The surface and bottom surfaces of the magnetic coil 65 assembly are connected to the thermally conductive housing 61 and the bottom cover 67, respectively. In the above technical solution, the thermally conductive housing 61 and the bottom cover 67 are both made of materials with good thermal conductivity. The magnetic coil 65 assembly, through contact and connection with the thermally conductive housing 61 and the bottom cover 67, is able to transfer heat from the device to be charged 8 on the magnetic charging assembly 6 from a high-heat area to a low-heat area for heat dissipation.

[0060] Referring to Figures 1 to 8, a non-limiting embodiment of the present invention, the magnetic coil 65 assembly includes a magnetic ring 63 and a coil 65. The bottom cover 67 is provided with a magnetic ring groove 671 and a coil groove 672. The magnetic ring 63 is mounted in the magnetic ring groove 671 via a metal retaining ring 64, and the coil 65 is mounted in the coil groove 672 via a magnetic isolation plate 66. In the above technical solution, the magnetic ring 63 provides a magnetic attraction function, which secures the device to be charged 8 with a magnetic attraction function on the magnetic charging assembly 6. Good contact can reduce contact thermal resistance and fully improve the utilization rate of the cooling energy provided by the semiconductor cooling plate 5 below. The coil 65 realizes wireless charging function through magneto-electric conversion. The metal retaining ring 64 provides protection and support for the magnetic ring 63. The magnetic isolation plate 66 can reduce the magnetic field loss generated by the coil 65 and transmit the magnetic field as much as possible toward the device to be charged 8, thereby improving PING efficiency and stability. The magnetic coil 65 assembly is mounted on the bottom cover 67 and dissipates heat through contact with the bottom cover 67.

[0061] Referring to Figures 1 to 8, a non-limiting embodiment of the present invention, a heat-conducting component 62 is further provided inside the magnetic charging component 6. The heat-conducting component 62 includes a first heat-conducting silicone rubber 621 and a second heat-conducting silicone rubber 622. The first heat-conducting silicone rubber 621 is located inside the coil 65 and is mounted on the magnetic isolation sheet 66. The bottom surface of the second heat-conducting silicone rubber 622 abuts against the surface of the first heat-conducting silicone rubber 621 and the surface of the coil 65, and the surface of the second heat-conducting silicone rubber 622 abuts against the interior of the heat-conducting housing 61. In the above technical solution, the heat-conducting component 62 has excellent thermal conductivity. The bottom surface of the first heat-conducting silicone rubber 621 contacts the second heat-conducting silicone rubber 622 and the coil 65, and the surface of the first heat-conducting silicone rubber 621 contacts the bottom surface of the heat-conducting housing 61. The heat-conducting component 62 connects the interior of the magnetic charging component, making the internal heat transfer more efficient and rapid.

[0062] Referring to Figures 1 to 8 , a non-limiting embodiment of the present invention is shown. A positioning slot 13 is provided on the side of the upper cover 1, and a base buckle 23 is provided on the side of the base 2 to engage with the positioning slot 13. In this technical solution, the positioning slot 13 can be inserted into the base buckle 23 for mating connection. The base buckle 23 is retained within the positioning slot 13, achieving mating and positioning between the base 2 and the upper cover 1, thereby ensuring the stability and reliability of the housing connection of the wireless charging module.

[0063] 1 to 8 , the working principle of a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is as follows:

[0064] The device to be charged 8 is placed on the magnetic charging device for charging. Under the action of the gravity of the device to be charged 8, the magnetic charging device moves downward a certain distance and contacts the semiconductor refrigeration plate 5 below. The semiconductor refrigeration plate 5 cools the magnetic charging device and the device to be charged 8 through the cooling surface, and then the semiconductor refrigeration plate 5 transfers the heat to the heat sink 3 at the bottom; the magnetic charging component 6 moves downward under the action of the gravity of the device to be charged 8 and disengages from the step hole 11 of the upper cover 1, and a connecting cavity 10 is formed between the device to be charged 8 and the fan component 4. Through the operation of the fan component 4, the fan component 4 synchronously cools the device to be charged 8, the semiconductor refrigeration plate 5 and the heat sink 3 and PCBA circuit board 7 located on the side of the fan component through the flowing wind source.

[0065] In the description of the present invention, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0066] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0067] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0068] The above embodiments are merely specific embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art will be able to make various modifications and improvements without departing from the scope of the present invention, and these obvious alternatives are all within the scope of protection of the present invention.

Claims

1. A novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation, comprising an upper cover (1) and a base (2), a heat dissipation plate (3) being provided between the upper cover (1) and the base (2), and a semiconductor cooling sheet (5) being provided on the heat dissipation plate (3), characterized in that: The semiconductor cooling plate (5) upper cover (1) is provided with a magnetic charging component (6), the magnetic charging component (6) comprising a heat-conducting outer shell (61), the outer circumferential bottom of the heat-conducting outer shell (61) is provided with an outward folding edge (611), an elastic member (612) is provided between the bottom edge of the heat-conducting outer shell (61) and the heat dissipation plate (3), a step hole (11) for the magnetic charging component (6) to pass through is provided at a position corresponding to the heat-conducting outer shell (61), the bottom of the step hole (11) abuts against the outward folding edge (611) to close the step hole (11); a ventilation hole (32) is provided on the left side of the heat dissipation plate (3), a fan component (4) is installed at the bottom of the ventilation hole (32), and the heat dissipation plate (3) and the upper cover (1) are connected to form a connecting cavity (10) between the fan component (4) and the magnetic charging component (6).

2. According to claim 1, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: The heat dissipation plate (3) is provided with a first stop wall (35) located outside the ventilation opening, the upper cover (1) is provided with a second stop wall (12) at a position corresponding to the first stop wall (35), and the first stop wall (35) and the second stop wall (12) are connected in cooperation to form a connecting cavity (10).

3. According to claim 2, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: The base (2) is provided with an air suction port (21), and the fan assembly (4) is located above the air suction port (21).

4. According to claim 3, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: The heat sink (3) is a rectangular structure consisting of a left side portion and a right side portion, and both the left side portion and the right side portion of the heat sink (3) are provided with heat sink positioning buckles (36), and the side edge of the base (2) is provided with heat sink positioning holes (24) corresponding to the heat sink positioning buckles (36).

5. According to claim 4, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: A plurality of heat dissipation fins (34) are provided at the bottom of the right side of the heat dissipation plate (3).

6. According to claim 5, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: A PCBA circuit board (7) is provided below the heat dissipation fin (34), and the PCBA circuit board (7) is connected to the bottom of one side of the fan assembly (4).

7. According to claim 6, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: A lateral air outlet (41) is provided on the side of the fan assembly (4) above the area connected to the PCBA circuit board (7).

8. According to claim 7, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: The semiconductor cooling sheet (5) is located on the upper surface of the right side of the heat dissipation plate (3) at a position corresponding to the position above the heat dissipation fins (34).

9. According to claim 8, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: A heat dissipation channel (33) is formed between the PCBA circuit board (7) and the heat dissipation plate (3), and a heat dissipation port (22) is provided on the side of the base (2) located away from the fan assembly (4) and away from the heat dissipation channel (33).

10. According to claim 1, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: A plurality of elastic parts (612) are provided at the bottom of the outwardly turned folded edge (611) along the circumferential direction.

11. According to claim 10, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: A guide column (613) is provided at the bottom of the outward-turned folded edge (611) and is located inside the elastic member (612); a guide hole (31) is provided on the heat dissipation plate (3) at a position corresponding to the guide column (613) of the outward-turned folded edge (611); the guide column (613) is slidably connected inside the guide hole (31); and the elastic member (612) abuts against the heat dissipation plate (3) outside the guide hole (31).

12. According to claim 11, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: The magnetic charging component (6) is provided with a magnetic coil (65) component and a bottom cover (67), the bottom cover (67) covers the bottom of the heat-conducting outer shell (61), and the surface and bottom surface of the magnetic coil (65) component are respectively connected to the heat-conducting outer shell (61) and the bottom cover (67).

13. According to claim 12, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: The magnetic coil (65) assembly comprises a magnetic ring (63) and a coil (65); a magnetic ring groove (671) and a coil groove (672) are provided on the bottom cover (67); the magnetic ring (63) is installed in the magnetic ring groove (671) via a metal retaining ring (64); and the coil (65) is installed in the coil groove (672) via a magnetic isolation sheet 66.

14. According to claim 13, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: A heat-conducting component (62) is also provided inside the magnetic charging component (6), and the heat-conducting component (62) comprises a first heat-conducting silicone rubber (621) and a second heat-conducting silicone rubber (622), wherein the first heat-conducting silicone rubber (621) is located inside the coil (65) and is mounted on the magnetic isolation sheet 66, the bottom surface of the second heat-conducting silicone rubber (622) abuts against the surface of the first heat-conducting silicone rubber (621) and the surface of the coil (65), and the surface of the second heat-conducting silicone rubber (622) abuts against the inside of the heat-conducting outer shell (61).

15. According to claim 1, a novel magnetic vehicle-mounted wireless charging module combining air cooling and semiconductor heat dissipation is characterized in that: The upper cover (1) is provided with a positioning slot (13) on the side, and the base (2) is provided with a base buckle (23) matching the positioning slot (13) on the side.

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