Display module and display device

Abstract

The present invention relates to the technical field of display, and provides a display module and a display device. The display module comprises: a display panel, wherein the display panel comprises a light exit side and a backlight side arranged opposite to each other; a near-field communication module, wherein the near-field communication module is located on the backlight side of the display panel; and an electrostatic shielding layer, wherein the electrostatic shielding layer is located on the backlight side of the display panel, the electrostatic shielding layer is provided with a first hollowed-out area, and the orthographic projection of the first hollowed-out area on the display panel at least partially overlaps that of the near-field communication module on the display panel. On the premise of ensuring the normal operation of the near-field communication module, poor display such as screen flickering and mura is relieved.

Description

Display module and display device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on July 24, 2023, with application number 202310913590.6, and invention name “Display Module and Display Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0003] Some display devices are equipped with Near Field Communication (NFC) modules, which enable functions such as mobile payment, electronic ticketing, access control, and mobile identity verification. During use, display devices equipped with NFC modules are prone to display defects such as screen flickering and ripples.

[0004] Summary of the Invention

[0005] Embodiments of the present disclosure provide a display module and a display device, which improve display defects such as screen flickering and water ripples while ensuring the normal operation of a near-field communication module.

[0006] To achieve the above objectives, the embodiments of the present disclosure adopt the following technical solutions:

[0007] On the one hand, a display module is provided, comprising: a display panel, the display panel including a light-emitting side and a backlight side arranged opposite to each other; a near-field communication module, the near-field communication module being located on the backlight side of the display panel; an electrostatic shielding layer, the electrostatic shielding layer being located on the backlight side of the display panel, and the electrostatic shielding layer being provided with a first hollow area, the first hollow area and the orthographic projection of the near-field communication module on the display panel at least partially overlapping.

[0008] In some embodiments, the electrostatic shielding layer further includes an electrostatic shielding area surrounding the first hollow area, and the orthographic projection of the near-field communication module on the display panel is located within the orthographic projection range of the first hollow area on the display panel.

[0009] In some embodiments, the display panel includes a central area and an edge area surrounding the central area, and the orthographic projection of the electrostatic shielding area on the display panel at least partially covers the edge area.

[0010] In some embodiments, the display module further includes a heat dissipation layer connected to a backlight side of the display panel, and the electrostatic shielding layer is connected to a side of the heat dissipation layer away from the display panel.

[0011] In some embodiments, the heat dissipation layer is provided with a groove, the groove is arranged opposite to the first hollow area, and the groove and the first hollow area form a receiving groove, and at least part of the structure of the near field communication module is located in the receiving groove.

[0012] In some embodiments, a depth of the accommodating groove perpendicular to the display panel is greater than or equal to a thickness of the near field communication module perpendicular to the display panel.

[0013] In some embodiments, the electrostatic shielding layer is located on a side of the near field communication module away from the display panel.

[0014] In some embodiments, along a direction away from the display panel, the heat dissipation layer includes a thermal conductive layer and an adhesive layer stacked in sequence, the adhesive layer is provided with a second hollow area, and the second hollow area and the thermal conductive layer form the groove.

[0015] In some embodiments, the display module further includes a control board, which is located on a side of the near-field communication module away from the display panel, and the near-field communication module is fixedly connected to the control board.

[0016] In some embodiments, a side of the control board facing the display panel contacts the electrostatic shielding layer.

[0017] In some embodiments, a buffer layer is provided between the near field communication module and the control board, and the buffer layer is bonded to the near field communication module and the control board.

[0018] In some embodiments, the display panel is a flexible display panel, which includes a flat portion, a bending portion, and a binding portion connected in sequence, the binding portion is bent to the backlight side of the flat portion through the bending portion, the heat dissipation layer is connected to the backlight side of the flat portion, and the electrostatic shielding layer is connected to the side of the heat dissipation layer away from the flat portion; the display module also includes a pad, which is located between the binding portion and the electrostatic shielding layer.

[0019] In some embodiments, the display module further includes a driving chip and a conductive layer. The driving chip is bound to a side of the binding portion away from the flat portion, and the conductive layer covers the driving chip.

[0020] On the other hand, a display module is provided, comprising: a display panel, the display panel comprising a light-emitting side and a backlight side arranged opposite to each other; a heat dissipation layer, the heat dissipation layer being connected to the backlight side of the display panel, the heat dissipation layer comprising a first area and a second area surrounding the first area; an electrostatic shielding layer, the electrostatic shielding layer being located on a side of the heat dissipation layer away from the display panel, and the orthographic projection of the electrostatic shielding layer on the heat dissipation layer being located in the second area; and a near-field communication module, at least a portion of the orthographic projection of the heat dissipation layer of the near-field communication module being located in the first area.

[0021] On the other hand, a display device is provided, comprising the display module.

[0022] The display module and display device provided by the embodiments of the present disclosure are provided with an electrostatic shielding layer and a near-field communication module on the backlight side of the display panel, and the electrostatic shielding layer is provided with a first hollow area, and the first hollow area and the near-field communication module at least partially overlap in their orthographic projection on the display panel. Since the conductive material in the first hollow area is removed, the first hollow area will not interfere with or shield the radio frequency field, so that the radio frequency field can pass through the first hollow area and then be received by the near-field communication module. In addition, the electrostatic shielding layer can absorb static charges, thereby preventing static charges from entering the interior of the display panel from the edge of the display panel, thereby improving display defects such as flickering of the display panel. When the display device is wirelessly charged through a wireless charging coil, the electrostatic shielding layer can shield the electromagnetic field generated by the wireless charging coil, thereby preventing the display panel from generating water ripples and other display defects. That is, the display module and display device of the embodiments of the present disclosure improve display defects such as flickering and water ripples while ensuring normal communication of the near-field communication module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] FIG1 schematically shows a front view structure of a display device;

[0025] FIG2 schematically shows a front view of a display module;

[0026] FIG3 schematically shows a rear view of a display module;

[0027] FIG4 schematically shows a partial structural exploded view of a display module;

[0028] FIG5 schematically shows a scene diagram of a display device performing near field communication;

[0029] FIG6 schematically shows a rear view of a near field communication module;

[0030] FIG7 schematically shows a cross-sectional view of a near field communication module coil;

[0031] FIG8 schematically shows a rear view of an electrostatic shielding layer;

[0032] FIG9 schematically shows a partial rear view of the structure of a display module;

[0033] FIG10 schematically shows a rear view of another electrostatic shielding layer and a near field communication module;

[0034] FIG11 schematically shows a rear view of another electrostatic shielding layer and a near field communication module;

[0035] FIG12 schematically shows a partial structural cross-sectional view of a display module;

[0036] FIG13 is a cross-sectional rotation diagram about AA in FIG3;

[0037] FIG14 schematically shows a structural diagram of a control panel;

[0038] FIG15 schematically shows a partial structural cross-sectional view of another display module;

[0039] FIG16 schematically shows a rear view of a heat dissipation layer;

[0040] FIG17 schematically shows a rear view of a display panel.

[0041] Reference numerals: 100 - display module; 200 - housing; 300 - strap; 110 - cover plate; 120 - display panel; 130 - heat dissipation layer; 140 - conductive layer; 150 - electrostatic shielding layer; 160 - near-field communication module; 170 - pad; 180 - driver chip; 190 - control board; 121 - flat portion; 122 - bent portion; 123 - binding portion; 120a - central area; 120b - edge area; 101 - optical adhesive layer; 102 - polarizer; 104 - protective film; 131 - heat-conducting layer; 132 - adhesive layer; 133 - groove; 130a - first area; 130b - second area; 161 - connecting portion; 162 - antenna; 151 - electrostatic shielding area; 152 - first hollow area; 191-connector; 192-binding end; 193-connection end. Specific embodiments

[0042] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present disclosure.

[0043] In the embodiments of the present disclosure, words such as "first", "second", "third", and "fourth" are used to distinguish between identical or similar items with substantially the same functions and effects. This is only for the purpose of clearly describing the technical solutions of the embodiments of the present disclosure, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0044] In the embodiments of the present disclosure, “a plurality of” means two or more, and “at least one” means one or more, unless otherwise clearly and specifically defined.

[0045] In the embodiments of the present disclosure, the orientations or positional relationships indicated by terms such as “upper” and “lower” are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present disclosure and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present disclosure.

[0046] FIG1 schematically illustrates a front view of a display device. As shown in FIG1 , some embodiments of the present disclosure provide a display device, which can be any device that displays either motion (e.g., video) or fixed (e.g., still images) and whether text or images. More specifically, it is expected that the embodiments described can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, video cameras, game consoles, watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, car displays (e.g., odometer displays, etc.), navigators, cockpit controls and / or displays, camera view displays (e.g., displays for rearview cameras in vehicles), electronic photos, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays for images of a piece of jewelry), etc. FIG1 illustrates an example in which the display device is a smartwatch. It is understood that in addition to smartwatches, the display device can also be other wearable devices with a display module.

[0047] For example, with continued reference to FIG1 , the display device may include a display module 100, a housing 200, and a strap 300. The display module 100 is mounted in the housing 200, and the strap 300 is connected to the housing 200. When in use, the strap 300 and the housing 200 are connected to form a ring to be worn on the user's wrist.

[0048] For example, the housing 200 also includes a mainboard and a battery. The mainboard is electrically connected to the display module 100 to provide image signals to the display module 100, and the battery is electrically connected to the mainboard to provide power to the mainboard and display module 100. In actual applications, the display device may also include other modules based on actual usage needs. For example, the housing 200 may also include a wireless charging coil, which is electrically connected to the mainboard and is used to cooperate with a wireless charging base to wirelessly charge the battery.

[0049] Figure 2 schematically shows a front view of a display module, Figure 3 schematically shows a rear view of a display module, and Figure 4 schematically shows a partial exploded view of the structure of a display module. The front view shows the structure of the light-emitting side of the display module 100, while the rear view shows the structure of the backlight side of the display module 100.

[0050] As shown in Figure 4, the display module 100 includes a display panel 120. The display panel 120 can be a liquid crystal display panel (Liquid Crystal Display, LCD for short); the display panel 120 can also be an electroluminescent display panel or a photoluminescent display panel. In the case where the display panel 120 is an electroluminescent display panel, the electroluminescent display panel can be an organic light-emitting diode (OLED) display panel or a quantum dot light-emitting diode (QLED) display panel or a micro light-emitting diode (Micro LED for short), etc. In the case where the display panel 120 is a photoluminescent display panel, the photoluminescent display device can be a quantum dot photoluminescent display panel. Some embodiments of the present disclosure are described by taking the display panel 120 as an organic light-emitting diode (OLED) display panel as an example.

[0051] The display panel 120 includes a light-emitting side and a backlight side, which are disposed opposite each other. The light-emitting side refers to the side of the display panel 120 that emits light, i.e., the side facing the user when the user is viewing the display panel 120. The backlight side refers to the side of the display panel 120 that is opposite to the light-emitting side, i.e., the side facing away from the user when the user is viewing the display panel 120.

[0052] Continuing with Figures 2 to 4 , the display module 100 may also be provided with a cover plate 110. The cover plate 110 is located on the light-emitting side of the display panel 120 and is used to protect the display panel 120 from scratches. The cover plate 110 may be a rigid cover plate or a flexible cover plate, and may have a single-layer structure or a multi-layer structure formed by stacking multiple film layers. If the display module 100 is a flexible display module 100, the cover plate 110 is a flexible cover plate. For example, when the cover plate 110 is a single-layer structure, the cover plate 110 can be a glass cover plate with a relatively thin thickness, or the cover plate 110 can be a single-layer transparent polymer layer such as a single-layer PI (Polyimide) or a single-layer PET (Polyethylene Terephthalate); when the cover plate 110 is a multi-layer structure, in the direction away from the display panel 120, the cover plate 110 includes a first organic layer, an ultra-thin glass layer and a second organic layer stacked in sequence, wherein the adjacent two layers are optically bonded, and the first organic layer and the second organic layer are transparent organic materials.

[0053] Continuing with FIG4 , a protective film 104 may be provided on the side of the cover plate 110 away from the display panel 120. The protective film 104 is affixed to the surface of the cover plate 110 to protect the cover plate 110 from scratches during assembly of the display module 100 into the display device. After assembly of the display device is complete, the protective film 104 may be removed. For example, the protective film 104 may be made of an organic material with good light transmittance (e.g., acrylic).

[0054] A polarizer 102 may be further provided between the cover plate 110 and the display panel 120. For example, the polarizer 102 is a circular polarizer that can filter out light waves perpendicular to the display panel 120, thereby improving the clarity of the display panel 120.

[0055] An optical adhesive layer 101 may be further provided between the polarizer 102 and the cover plate 110, and the optical adhesive layer 101 may bond the cover plate 110 to the polarizer 102. For example, the optical adhesive layer 101 is made of optical resin adhesive (T-OCA) with good light transmittance.

[0056] Continuing to refer to Figures 3 and 4, the display module 100 also includes a near-field communication module 160 located on the backlight side of the display panel 120. The near-field communication module 160 refers to a module capable of near-field communication. Near-field communication is a short-range, high-frequency radio communication technology. For example, the communication distance of near-field communication is within 10 cm, the frequency is 13.56 MHz, and the transmission speed is 106 Kbit / s, 212 Kbit / s, or 424 Kbit / s. The working modes of near-field communication include passive mode and active mode. In passive mode: the master device provides a radio frequency field, the slave device receives the radio frequency field, and converts the radio frequency field into an electrical signal, thereby completing the data transmission between the master device and the slave device. In active mode: the master device provides a radio frequency field, the slave device receives the radio frequency field, and converts the radio frequency field into an electrical signal, thereby completing the data transmission between the master device and the slave device; at the same time, the slave device provides a radio frequency field, the master device receives the radio frequency field, and converts the radio frequency field into an electrical signal, thereby completing the data transmission between the slave device and the master device.

[0057] In the disclosed embodiment, the operating mode of the near-field communication module 160 can be either a passive mode or an active mode, i.e., the display device can act as either a master device or a slave device in near-field communication. FIG5 schematically illustrates a scenario of a display device performing near-field communication. As shown in FIG5 , the display device acts as a slave device in near-field communication, receiving the radio frequency field from the master device RFID.

[0058] Figure 5 illustrates a scenario in which the light-emitting side of the display module 100 faces a host device during near-field communication, where the host device is a radio frequency identification (RFID) device. In actual applications, the backlight side of the display module 100 may also face the host RFID device, but this is not a limitation in the present embodiment. For ease of description, the following is a schematic illustration using the example of the light-emitting side of the display module 100 facing the host RFID device during near-field communication.

[0059] Figure 6 schematically illustrates a rear view of a near-field communication module. As shown in Figure 6, near-field communication module 160 may include an antenna 162 and a connector 161. Antenna 162 includes multiple conductive coils that can receive radio frequency fields and convert the received radio frequency fields into electrical signals. Connector 161 is used to electrically connect antenna 162 to an external circuit (e.g., control board 190) to transmit the electrical signals generated by antenna 162 to the external circuit.

[0060] Figure 7 schematically shows a cross-sectional view of a near-field communication module coil. For example, as shown in Figure 7, the near-field communication module 160 includes an adhesive layer 1, a first mask layer 2, a first routing layer 3, a substrate layer 4, a second routing layer 5, a second mask layer 6, and a barrier layer 7. The adhesive layer 1 is used to bond the near-field communication module 160 to other structures or film layers of the display module 100 to achieve the fixation of the near-field communication module 160. The substrate layer 4 is used to support and connect the first routing layer 3 and the second routing layer 5. The material of the substrate layer 4 can be PI. The first routing layer 3 and the second routing layer 5 are used to form a plurality of conductive coils. The first routing layer 3 and the second routing layer 5 can be patterned copper films. The first mask layer 2 and the second mask layer 6 are masks for wiring. The barrier layer 7 can be made of an anti-oxidation magnetic isolation material such as ferrous salt.

[0061] It is understandable that the shape and cross-sectional structure of the near field communication module 160 in FIG. 6 and FIG. 7 are merely schematic illustrations, and the embodiment of the present disclosure does not limit the structure and shape of the near field communication module 160 .

[0062] Existing display devices equipped with near-field communication modules often experience display defects during use. For example, when a display device is equipped with a wireless charging coil and is wirelessly charged via the wireless charging coil, it is prone to display defects such as water ripples. Another example is that after an electrostatic test, the display device is prone to display defects such as flickering.

[0063] After research, the inventors discovered that the aforementioned display defects in prior art display devices are caused by the removal of copper foil. Specifically, prior art display devices remove the copper foil to prevent it from interfering with and shielding the signals from the near-field communication module. Without the copper foil, static charge accumulates within the display device and enters the interior of the display panel along its edges, causing the characteristics of the transistors within the display panel to shift, resulting in flickering display defects. Furthermore, without the copper foil, the electromagnetic field generated by the display device during wireless charging cannot be shielded, causing interference from the electromagnetic field and resulting in ripple-like display defects.

[0064] In view of this, the display module 100 of the embodiment of the present disclosure includes an electrostatic shielding layer 150. The electrostatic shielding layer 150 absorbs static charge, thereby preventing it from entering the interior of the display panel 120 from the edges, thereby improving display defects such as flickering on the display panel 120. Furthermore, when the display device is wirelessly charged via a wireless charging coil, the electrostatic shielding layer 150 shields the electromagnetic field generated by the wireless charging coil, preventing display defects such as ripples on the display panel 120.

[0065] The electrostatic shielding layer 150 may be made of a conductive material (eg, metal). For example, the electrostatic shielding layer 150 is a copper foil with a thickness of 35 μm.

[0066] The electrostatic shielding layer 150 can be arranged parallel to the light-emitting surface of the display panel 120, and the electrostatic shielding layer 150 is located on the backlight side of the display panel 120. The electrostatic shielding layer 150 can be located between the near-field communication module 160 and the display panel 120, or on the side of the near-field communication module 160 away from the display panel 120. For example, when the main device providing the radio frequency field is located on the light-emitting side of the display panel 120, the electrostatic shielding layer 150 is arranged on the side of the near-field communication module 160 away from the display panel 120; when the main device providing the radio frequency field is located on the backlight side of the display panel 120, the electrostatic shielding layer 150 is arranged between the near-field communication module 160 and the display panel 120.

[0067] FIG8 schematically shows a rear view of an electrostatic shielding layer. As shown in FIG8 , the electrostatic shielding layer 150 is provided with a first hollow area 152. The first hollow area 152 is a portion of the electrostatic shielding layer 150, and the conductive material in the first hollow area 152 is removed. The first hollow area 152 and the orthographic projection of the near-field communication module 160 on the display panel 120 at least partially overlap, that is, at least a portion of the first hollow area 152 is arranged opposite the near-field communication module 160. Since the conductive material in the first hollow area 152 is removed, there is no conductive material in at least a portion of the electrostatic shielding layer 150 that is opposite the near-field communication module 160, which will not interfere with or shield the radio frequency field, so that the radio frequency field can pass through the first hollow area 152 and then be received by the near-field communication module 160.

[0068] The orthographic projections of the first hollow area 152 and the near-field communication module 160 on the display panel 120 may partially overlap or completely overlap. When the first hollow area 152 and the orthographic projections of the near-field communication module 160 on the display panel 120 completely overlap, the orthographic projection of the near-field communication module 160 on the display panel 120 may be located within the orthographic projection range of the first hollow area 152 on the display panel 120, thereby further reducing interference and shielding between the electrostatic shielding layer 150 and the radio frequency field.

[0069] In the display module 100 provided by the embodiment of the present disclosure, an electrostatic shielding layer 150 and a near-field communication module 160 are provided on the backlight side of the display panel 120. The electrostatic shielding layer 150 is provided with a first hollow area 152, and the orthographic projections of the first hollow area 152 and the near-field communication module 160 on the display panel 120 at least partially overlap. Since the conductive material in the first hollow area 152 is removed, the first hollow area 152 will not interfere with or shield the radio frequency field, so that the radio frequency field can pass through the first hollow area 152 and then be received by the near-field communication module 160. In addition, the electrostatic shielding layer 150 can absorb static electricity, thereby preventing static electricity from entering the interior of the display panel 120 from the edge of the display panel 120, thereby improving display defects such as screen flickering of the display panel 120. When the display device is wirelessly charged through a wireless charging coil, the electrostatic shielding layer 150 can shield the electromagnetic field generated by the wireless charging coil, preventing the display panel 120 from generating water ripples and other display defects. That is, the display module 100 of the embodiment of the present disclosure improves display defects such as screen flickering and water ripples while ensuring normal communication of the near field communication module 160.

[0070] Continuing with FIG8 , the electrostatic shielding layer 150 further includes an electrostatic shielding region 151 surrounding the first hollow region 152 . The orthographic projection of the near-field communication module 160 on the display panel 120 is located within the orthographic projection of the first hollow region 152 on the display panel 120 . The electrostatic shielding region 151 is a portion of the electrostatic shielding layer 150 . Conductive material is provided within the electrostatic shielding region 151 , enabling the electrostatic shielding region 151 to absorb static charge and shield at least some electromagnetic interference. For example, when the electrostatic shielding layer 150 is copper foil, the hollowed-out region of the copper foil is the first hollow region 152 , and the unhollowed-out region of the copper foil is the electrostatic shielding region 151 .

[0071] Figure 9 schematically illustrates a partial rear view of a display module. For example, as shown in Figure 9, the shape of first hollowed-out region 152 can be the same as or similar to that of near-field communication module 160. This reduces interference and shielding effects of electrostatic shielding layer 150 on radio frequency fields while increasing the area of ​​electrostatic shielding region 151, thereby improving electrostatic shielding layer 150's electrostatic charge absorption and electromagnetic interference shielding capabilities.

[0072] Figure 10 schematically shows a rear view of another electrostatic shielding layer and a near-field communication module, and Figure 11 schematically shows a rear view of another electrostatic shielding layer and a near-field communication module. For example, as shown in Figures 10 and 11, the first hollow area 152 is circular, the electrostatic shielding area 151 is annular, and the electrostatic shielding area 151 is arranged on the outside of the first hollow area 152. In this way, the area of ​​the first hollow area 152 can be increased, thereby reducing the interference and shielding of the electrostatic shielding layer 150 to the radio frequency field. In addition, after increasing the area of ​​the first hollow area 152, the display module 100 can be compatible with near-field communication modules 160 of other shapes and sizes.

[0073] The electrostatic shielding region 151 may extend along the periphery of the display panel 120. For example, the periphery of the electrostatic shielding region 151 is flush with the periphery of the display panel 120. Alternatively, the periphery of the electrostatic shielding region 151 may be retracted a certain distance from the periphery of the display panel 120, or the periphery of the electrostatic shielding region 151 may protrude a certain distance from the periphery of the display panel 120.

[0074] Figure 17 schematically shows a rear view of a display panel. As shown in Figure 17, the display panel 120 includes a central area 120a and an edge area 120b surrounding the central area 120a. The orthographic projection of the electrostatic shielding area 151 on the display panel 120 at least partially covers the edge area 120b.

[0075] Exemplarily, the orthographic projection of the electrostatic shielding region 151 on the display panel 120 completely covers the edge region 120 b .

[0076] Since static charge can easily enter the interior of the display panel 120 from the periphery of the display panel 120, when the electrostatic shielding area 151 extends along the periphery of the display panel 120, the electrostatic shielding area 151 can absorb the static charge near the periphery of the display panel 120, thereby preventing static charge from entering the interior of the display panel 120 along the edge of the display panel 120.

[0077] Of course, the structure of the electrostatic shielding layer 150 is not limited to the above structure. For example, in the rear view direction, the electrostatic shielding layer 150 can also be C-shaped.

[0078] Continuing with FIG4 , the display module 100 further includes a heat dissipation layer 130 , which is connected to the backlight side of the display panel 120 and is configured to absorb heat generated during operation of the display panel 120 , thereby reducing the temperature of the display panel 120 . Furthermore, the heat dissipation layer 130 also serves to protect the backlight side of the display panel 120 .

[0079] Figure 12 schematically illustrates a partial cross-sectional view of the structure of a display module. As shown in Figure 12 , the heat dissipation layer 130 may include a heat-conducting layer 131 and an adhesive layer 132 . The heat-conducting layer 131 is connected to the backlight side of the display panel 120 , and the adhesive layer 132 is connected to the side of the heat-conducting layer 131 away from the display panel 120 .

[0080] Exemplarily, the material of the heat-conducting layer 131 is PET. For example, the heat-conducting layer 131 is a PET foam layer, and the thickness of the heat-conducting layer 131 is 60 μm.

[0081] Exemplarily, the adhesive layer 132 includes a foam adhesive (Foam) layer and an Embo adhesive (Embo) layer. The Embo adhesive layer is adhered to the heat conducting layer 131 , and the foam adhesive layer is adhered to a side of the mesh adhesive layer away from the heat conducting layer 131 .

[0082] In related art, the heat dissipation layer 130 is easily squeezed by other modules in the display device, resulting in a thinner thickness in the squeezed portions and a thicker thickness in the unsqueezed portions. In other words, the thickness of the heat dissipation layer 130 varies across different regions. When viewing the display module 100 from its light-emitting side, mold marks are easily visible, impacting the user experience.

[0083] Continuing with Figure 12 , the electrostatic shielding layer 150 can be connected to the side of the heat dissipation layer 130 that is away from the display panel 120. When the electrostatic shielding layer 150 is squeezed by other modules in the display device, the electrostatic shielding layer 150 can distribute the squeeze force and transfer it to the heat dissipation layer 130, making the force more evenly distributed across the heat dissipation layer 130. This improves the uneven thickness of the heat dissipation layer 130, thereby reducing the embossing effect. Furthermore, when the electrostatic shielding layer 150 is made of a metal material, the metal material is generally harder than the heat dissipation layer 130 and is less susceptible to deformation, further reducing the embossing effect.

[0084] Figure 16 schematically shows a rear view of a heat dissipation layer. As shown in Figure 16, the heat dissipation layer 130 may include a first region 130a and a second region 130b surrounding the first region 130a. The first region 130a and the second region 130b are both regions demarcated on the heat dissipation layer 130. For example, the first region 130a is a circular region located in the middle of the heat dissipation layer 130, and the second region 130b is a circular region surrounding the first region 130a. Of course, the embodiments of the present disclosure do not limit the shapes of the first region 130a and the second region 130b. The first region 130a may also be a polygon such as a rectangle or a triangle, or other irregular shapes.

[0085] The orthographic projection of the electrostatic shielding layer 150 on the heat dissipation layer 130 is located in the second area 130b. At least part of the orthographic projection of the near-field communication module 160 on the heat dissipation layer 130 is located in the first area 130a. Since the electrostatic shielding layer 150 is not provided in the first area 130a, the first area 130a will not interfere with or shield the radio frequency field, so that the radio frequency field can pass through the first area 130a and then be received by the near-field communication module 160. In addition, the electrostatic shielding layer 150 can absorb static charges, thereby preventing static charges from entering the interior of the display panel 120 from the edge of the display panel 120, thereby improving display defects such as flickering of the display panel 120. When the display device is wirelessly charged through a wireless charging coil, the electrostatic shielding layer 150 can shield the electromagnetic field generated by the wireless charging coil, thereby preventing the display panel 120 from generating display defects such as water ripples. That is, the display module 100 of the embodiment of the present disclosure improves display defects such as flickering and water ripples while ensuring normal communication of the near-field communication module 160.

[0086] Figure 13 is a cross-sectional view along line AA in Figure 3. As shown in Figure 13, the heat dissipation layer 130 has a groove 133, which is disposed opposite to the first hollow area 152, and the groove 133 and the first hollow area 152 form a receiving groove C.

[0087] The groove 133 is provided on the side of the heat dissipation layer 130 facing the electrostatic shielding layer 150. When the heat dissipation layer 130 includes the thermally conductive layer 131 and the adhesive layer 132, the depth of the groove 133 may be less than the thickness of the adhesive layer 132, the depth of the groove 133 may be equal to the thickness of the adhesive layer 132, or the depth of the groove 133 may be greater than the thickness of the adhesive layer 132. The depth of the groove 133 refers to the dimension of the groove 133 in a direction perpendicular to the display panel 120, while the thickness of the adhesive layer 132 refers to the dimension of the adhesive layer 132 in a direction perpendicular to the display panel 120.

[0088] When the depth of the groove 133 is less than the thickness of the adhesive layer 132, for example, the groove 133 can be formed by thinning a portion of the adhesive layer 132. For example, the adhesive layer 132 includes a foam adhesive layer and a mesh adhesive layer, with a portion of the foam adhesive layer hollowed out, and the hollowed-out portion and the mesh adhesive layer enclose the groove 133.

[0089] When the depth of the groove 133 is equal to the thickness of the adhesive layer 132. Exemplarily, the adhesive layer 132 is provided with a second hollow area, the second hollow area is arranged opposite to the first hollow area 152, and the second hollow area and the thermal conductive layer 131 enclose the groove 133. The second hollow area is a portion of the adhesive layer 132, and the adhesive layer 132 in the second hollow area is completely removed. For example, the adhesive layer 132 includes a foam adhesive layer and a mesh adhesive layer, a portion of the foam adhesive layer is hollowed out, a portion of the mesh adhesive layer is hollowed out, and the hollow area of ​​the foam adhesive layer is opposite to the hollow area of ​​the mesh adhesive layer, and the hollow area of ​​the foam adhesive layer and the hollow area of ​​the mesh adhesive layer enclose the second hollow area.

[0090] When the depth of the groove 133 is less than or equal to the thickness of the adhesive layer 132 , the heat conducting layer 131 is not provided with a hollow area or is not thinned, so as to prevent the heat conducting layer 131 from becoming thinner and affecting the heat dissipation effect.

[0091] When the depth of the groove 133 is greater than the thickness of the adhesive layer 132, for example, the adhesive layer 132 has a second hollow region, and the thermal conductive layer 131 includes a thinned region opposite the second hollow region. The thermal conductive layer 131 is thinner in the thinned region. The second hollow region and the thinned region together form the groove 133.

[0092] At least part of the structure of the near-field communication module 160 can be located within the accommodating groove C. On the one hand, the accommodating groove C can limit the position of the near-field communication module 160 in a direction parallel to the display panel 120; on the other hand, the location of part or all of the structure of the near-field communication module 160 within the accommodating groove C can reduce the thickness of the display module 100.

[0093] The depth h of the accommodating groove C perpendicular to the display panel 120 can be greater than or equal to the thickness d of the near-field communication module 160 perpendicular to the display panel 120. In this way, the near-field communication module 160 can be completely accommodated in the accommodating groove C, thereby further reducing the thickness of the display module 100.

[0094] Exemplarily, the difference between the depth h of the accommodation groove C and the thickness d of the near field communication module 160 is 0.05 mm to 0.15 mm.

[0095] Of course, the depth h of the accommodating groove C perpendicular to the display panel 120 may also be less than the thickness d of the NFC module 160 perpendicular to the display panel 120. In this case, part of the NFC module 160 protrudes from the accommodating groove C perpendicular to the display panel 120.

[0096] In actual application, the adhesive layer 1 of the near field communication module 160 may be adhered to the heat conductive layer 131 to fix the near field communication module 160 .

[0097] Continuing to refer to Figures 3, 4 and 13, the display module 100 may further include a control board 190. The control board 190 is electrically connected to the display panel 120 to provide an image signal to the display panel 120. The control board 190 may also be electrically connected to the near field communication module 160 to receive an electrical signal from the near field communication module 160. The control board 190 may be a main flexible printed circuit (MFPC) including one or more layers of flexible circuit boards. For example, the control board 190 includes two layers of flexible circuit boards, or the control board 190 includes five layers of flexible circuit boards. The control board 190 in the embodiment of the present disclosure is illustrated using a two-layer flexible circuit board as an example.

[0098] Figure 14 schematically illustrates the structure of a control board. As shown in Figure 14 , control board 190 may include a connector 191 that connects to the display device's mainboard to electrically connect the two devices. Control board 190 may also include a binding terminal 192 that binds to the display panel 120 to electrically connect the two devices. Control board 190 may also include a connection terminal 193 that electrically connects to the near-field communication module 160.

[0099] The control board 190 may be located on a side of the near field communication module 160 away from the display panel 120 .

[0100] Exemplarily, the orthographic projections of the control board 190 and the near-field communication module 160 on the display panel 120 at least partially overlap. That is, the control board 190 and the receiving groove C enclose a space within which the near-field communication module 160 is confined, thereby preventing the near-field communication module 160 from shifting and escaping from the receiving groove C when subjected to vibration. For example, the near-field communication module 160 is located between the heat-conducting layer 131 and the control board 190, so that the heat-conducting layer 131 and the control board 190 cooperate to define the position of the near-field communication module 160 in a direction perpendicular to the display panel 120.

[0101] The near-field communication module 160 can be fixedly connected to the control board 190. On the one hand, the control board 190 can limit the position of the near-field communication module 160, preventing the near-field communication module 160 from being disconnected from the control board 190 when it is subjected to vibration. On the other hand, because the near-field communication module 160 and the control board 190 are fixedly connected, when assembling the display module 100, the near-field communication module 160 and the control board 190 can be assembled as a whole and connected to the display panel 120. Compared with connecting the near-field communication module 160 and the control board 190 to the display panel 120 separately, the number of assembly steps is reduced and the assembly difficulty is lowered.

[0102] For example, the connection portion 161 of the NFC module 160 is welded to the connection end 193 of the control board 190. For example, the connection portion 161 of the NFC module 160 and the connection end 193 of the control board 190 are welded together in advance to form an integrated structure before entering the assembly process of the display module 100. In other words, the NFC module 160 and the control board 190 are integrated.

[0103] A side of the control board 190 facing the display panel 120 may be in contact with the electrostatic shielding layer 150 , so that static charges absorbed by the electrostatic shielding layer 150 may be discharged through the control board 190 .

[0104] Exemplarily, a partial area of ​​the control board 190's orthographic projection on the electrostatic shielding layer 150 is located within the electrostatic shielding area 151, so that the control board 190 contacts the electrostatic shielding area 151, and a partial area of ​​the control board 190's orthographic projection on the electrostatic shielding layer 150 is located within the first hollow area 152, so that the control board 190 limits the position of the near-field communication module 160.

[0105] A gap may exist between the near-field communication module 160 and the control board 190 in a direction perpendicular to the display panel 120. When the near-field communication module 160 is subjected to vibration, it is susceptible to relative displacement from the control board 190, which may disconnect the near-field communication module 160 from the control board 190 and cause the near-field communication module 160 to fail. To improve the display device's shock resistance, a buffer layer may be provided between the near-field communication module 160 and the control board 190. The buffer layer is bonded to the near-field communication module 160 and the control board 190, connecting the near-field communication module 160, the buffer layer, and the control board 190 into a single, integrated unit, making relative displacement less likely.

[0106] Exemplarily, the buffer layer is adhesive and is filled between the near field communication module 160 and the control board 190 .

[0107] 13 , which shows a partial cross-sectional view of the display module 100 when the display panel 120 is a flexible display panel 120. When the display panel 120 is a flexible display panel 120, the display panel 120 may include a flat portion 121, a bent portion 122, and a binding portion 123 connected in sequence.

[0108] The flat portion 121 may include a display area and a non-display area. The display area may be provided with a plurality of sub-pixels, a plurality of data lines, and a plurality of gate lines. The non-display area may be provided with a scan driver circuit electrically connected to the gate lines. The binding portion 123 is provided with a binding terminal 192, so that the binding terminal 192 of the control board 190 is bound to the binding portion 123 via the binding terminal 192. The bent portion 122 connects the flat portion 121 and the binding portion 123, and the binding portion 123 is bent to the backlight side of the flat portion 121 via the bent portion 122 to reduce the bezel width of the display device.

[0109] The heat dissipation layer 130 and the electrostatic shielding layer 150 are located between the flat portion 121 and the binding portion 123 . The heat dissipation layer 130 is connected to the backlight side of the flat portion 121 , and the electrostatic shielding layer 150 is connected to the side of the heat dissipation layer 130 away from the flat portion 121 .

[0110] The display module 100 may further include a pad 170, which is located between the binding portion 123 and the electrostatic shielding layer 150. One side of the pad 170 is connected to the binding portion 123, and the other side of the pad 170 is connected to the electrostatic shielding layer 150 to fix the binding portion 123 and prevent the binding portion 123 from rebounding through the bending portion 122.

[0111] For example, adhesive is provided on both sides of the spacer 170, and the spacer 170 is bonded to the binding portion 123 and the electrostatic shielding layer 150 through the adhesive. The thickness of the adhesive may be 10 μm.

[0112] Exemplarily, the material of the spacer 170 is PET. For example, the spacer 170 is PET foam, and the thickness of the spacer 170 can be 50 μm.

[0113] Figure 15 schematically illustrates a partial cross-sectional view of another display module. As shown in Figure 15 , the display panel 120 can also be a rigid display panel 120. In this case, the display module 100 also includes a flexible printed circuit board (FPC). One end of the FPC is bonded to the display panel 120, and the other end is bent to the backlight side of the display panel 120 and electrically connected to the control board 190. One side of the spacer 170 is connected to the FPC, and the other side of the spacer 170 is connected to the electrostatic shielding layer 150.

[0114] Continuing with reference to Figures 13 and 15, the display module 100 further includes a driver chip 180. The driver chip 180 can be electrically connected to the data lines and the scan drive circuit to provide data signals to the data lines and scan signals to the scan drive circuit. When the display panel 120 is a flexible display panel 120, the driver chip 180 can be bound to the side of the binding portion 123 away from the flat portion 121; when the display panel 120 is a rigid display panel 120, the driver chip 180 can be bound to a flexible circuit board (FPC) (COF packaging) or to the display panel 120 (COG packaging).

[0115] Continuing with Figures 13 and 15 , the display module 100 may further include a conductive layer 140 , which covers the driver chip 180 . The conductive layer 140 may be made of a ductile conductive material. For example, the conductive layer 140 may be conductive cloth, copper foil, gold foil, lithium, or the like. When the conductive layer 140 is conductive cloth, the thickness of the conductive cloth may be 60 μm.

[0116] The conductive layer 140 covers the driving chip 180 to prevent the driving chip 180 from being interfered by static electricity, and isolates the driving chip 180 from the external environment to prevent the driving chip 180 from being corroded.

[0117] For example, the conductive layer 140 may also cover the side of the control board 190 away from the display panel 120 to prevent the control board 190 from being interfered with by static electricity, isolate the control board 190 from the external environment, and prevent the driving chip 180 from being corroded.

[0118] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display module, characterized in that: include: A display panel, the display panel comprising a light emitting side and a backlight side arranged opposite to each other; A near field communication module, wherein the near field communication module is located on the backlight side of the display panel; An electrostatic shielding layer is located on the backlight side of the display panel, and the electrostatic shielding layer is provided with a first hollow area, and the first hollow area and the orthographic projection of the near field communication module on the display panel at least partially overlap.

2. The display module according to claim 1, characterized in that: The electrostatic shielding layer further includes an electrostatic shielding area surrounding the first hollow area, and the orthographic projection of the near field communication module on the display panel is located within the orthographic projection range of the first hollow area on the display panel.

3. The display module according to claim 2, characterized in that: The display panel includes a central area and an edge area surrounding the central area, and the orthographic projection of the electrostatic shielding area on the display panel at least partially covers the edge area.

4. The display module according to any one of claims 1 to 3, characterized in that: The display module further comprises a heat dissipation layer, wherein the heat dissipation layer is connected to the backlight side of the display panel, and the electrostatic shielding layer is connected to a side of the heat dissipation layer away from the display panel.

5. The display module according to claim 4, characterized in that: The heat dissipation layer is provided with a groove, the groove is arranged opposite to the first hollow area, and the groove and the first hollow area form a receiving groove, and at least a part of the structure of the near field communication module is located in the receiving groove.

6. The display module according to claim 5, characterized in that: The depth of the accommodating groove perpendicular to the display panel is greater than or equal to the thickness of the near field communication module perpendicular to the display panel.

7. The display module according to claim 6, characterized in that: The electrostatic shielding layer is located at a side of the near field communication module away from the display panel.

8. The display module according to claim 5, characterized in that: Along the direction away from the display panel, the heat dissipation layer includes a heat conductive layer and an adhesive layer which are stacked in sequence, the adhesive layer is provided with a second hollow area, and the second hollow area and the heat conductive layer form the groove.

9. The display module according to any one of claims 1 to 3, characterized in that: The display module further includes a control board, which is located at a side of the near field communication module away from the display panel, and the near field communication module is fixedly connected to the control board.

10. The display module according to claim 9, characterized in that: A side of the control board facing the display panel contacts the electrostatic shielding layer.

11. The display module according to claim 9, characterized in that: A buffer layer is provided between the near field communication module and the control board, and the buffer layer is bonded to the near field communication module and the control board.

12. The display module according to claim 4, characterized in that: The display panel is a flexible display panel, comprising a flat portion, a bent portion and a binding portion connected in sequence, the binding portion being bent to the backlight side of the flat portion through the bent portion, the heat dissipation layer being connected to the backlight side of the flat portion, and the electrostatic shielding layer being connected to a side of the heat dissipation layer away from the flat portion; The display module further includes a pad, and the pad is located between the binding portion and the electrostatic shielding layer.

13. The display module according to claim 12, characterized in that: The display module further includes a driving chip and a conductive layer. The driving chip is bound to a side of the binding portion away from the flat portion, and the conductive layer covers the driving chip.

14. A display module, characterized in that: include: A display panel, the display panel comprising a light emitting side and a backlight side arranged opposite to each other; A heat dissipation layer, the heat dissipation layer is connected to the backlight side of the display panel, the heat dissipation layer comprises a first area and a second area surrounding the first area; an electrostatic shielding layer, wherein the electrostatic shielding layer is located on a side of the heat dissipation layer away from the display panel, and an orthographic projection of the electrostatic shielding layer on the heat dissipation layer is located in the second region; A near field communication module, wherein at least a portion of an orthographic projection of the heat dissipation layer is located within the first area.

15. A display device, characterized in that: Comprising the display module as claimed in any one of claims 1 to 14.

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