Orthosis

Abstract

The invention relates to an orthosis (100) comprising a support zone (112) which is designed to be in contact with a body part (120), wherein the orthosis (100) comprises a deformable memory element (116) which defines a shape and / or dimension of the support zone (112), and wherein the orthosis (100) and / or the memory element (116) comprises an adjusting device (118) which is designed to adjust the shape of the memory element (116).

Description

[0001] Orthosis

[0002] The invention relates to an orthosis.

[0003] Orthoses are often used to stabilize and / or support body parts. For example, orthoses can stabilize or immobilize extremities such as hands, feet, arms, or legs, or joints such as knees, elbows, or wrists.

[0004] For example, an orthosis may be medically prescribed after a fracture or may be necessary to ensure the fixation of a broken bone so that the fracture can heal properly. Likewise, an orthosis may be prescribed or necessary to correct or prevent misalignments.

[0005] Corresponding orthoses are well known.

[0006] However, during or during the healing and / or correction of a misalignment, a corresponding body part may change, particularly due to movement or as a result of the healing or correction. For example, a bone or muscle may be positioned or aligned differently than before the beginning of the healing or correction, for example, it may be displaced or twisted.

[0007] This can lead to a reduction in healing or correction, as other forces can now act on the body part.

[0008] Depending on the body part, healing or correction, it may also be necessary to avoid even the smallest movements, which can affect the comfort and quality of life of the user of the orthosis.

[0009] It is the object of the present invention to overcome these disadvantages.

[0010] This object is achieved by an orthosis having the features of claim 1. The subclaims each relate to advantageous embodiments.

[0011] The invention relates to an orthosis comprising a support zone configured to contact a body part, wherein the orthosis comprises a deformable memory element defining a shape and / or dimension of the support zone, wherein the orthosis and / or the memory element comprises an adjustment device configured to adjust the shape of the memory element.

[0012] By adjusting the shape of the memory element, in particular a shape and / or dimension of the support zone can be adjusted and / or varied.

[0013] The support zone can be arranged such that, when the orthosis is in use, it contacts a predetermined location and / or at least one predetermined point of a body part. The support zone can be configured to support, stabilize, and / or fix the body part at the predetermined location and / or at least at the predetermined point. The support zone can be configured to exert a force and / or pressure on the body part at the predetermined location and / or at least at the predetermined point.

[0014] In addition to any medically necessary joint relief, the adaptability of the musculoskeletal system can be utilized to provide counterforces for misalignments that would otherwise occur or have already occurred with the orthosis and / or support zone. The memory element can be deformed and / or adjusted in such a way that the support zone can exert a corresponding counterforce on the body part when the support zone comes into contact with the body part.

[0015] The orthosis can provide targeted support and correction, for example to maintain the health and functionality of joints and tissues in the long term and / or to regenerate damaged material within physiological limits.

[0016] In some embodiments, the orthosis may, for example, be configured or used to correct or at least mitigate malpositions, e.g., foot malpositions.

[0017] Because the shape is adjustable, the force and / or pressure exerted on the body part can be adjusted during the course of correction and / or healing, which can result in an improved healing effect or correction.

[0018] The forces exerted on the body part can also be adjusted or varied dynamically and / or over time. In some embodiments, the adjustment can be made so quickly that at least small movements of the body part can be enabled without limiting the effectiveness of the orthosis.

[0019] The orthosis also enables improved wearing comfort.

[0020] The orthosis may have a receptacle for receiving a body part. The receptacle may include the support zone. It may be provided that when a body part is received in the receptacle, the support zone can contact the body part.

[0021] The orthosis and / or the holder can, for example, be attached to a thigh, lower leg, a leg, a foot, an arm, an upper arm, a forearm of a hand, or the like and / or can accommodate a corresponding body part.

[0022] By "wherein the memory element defines a shape and / or dimension of the support zone" it can be meant that the shape of the memory element can influence the shape and / or dimension of the support zone, and / or can characterize the shape and / or dimension of the support zone. The shape and / or dimension of the support zone can depend on the shape of the memory element. If the shape of the memory element is or becomes adjusted, changed, and / or varied, the shape and / or dimension of the support zone can be adjusted, changed, and / or varied, and / or result from or due to the shape of the memory element.

[0023] The dimension of the support zone may be or include a dimension, a length, height, width, depth, thickness, cross-section, curvature, bulge, or the like.

[0024] The support zone may be deformable and / or able to change its shape and / or dimensions.

[0025] The orthosis and / or the support zone may contain a plastic material. The plastic may have cushioning and / or spring properties.

[0026] At least a part or section of the support zone can be formed by the memory element. Alternatively or additionally, at least a part or section of the support zone can be or comprise the memory element.

[0027] In some embodiments, it may also be provided that at least a part or section of the receptacle and / or support zone can be formed by the memory element. Alternatively or additionally, at least a part or section of the receptacle can be or comprise the memory element.

[0028] In some embodiments, the receptacle may have two support zones, and the memory element may be or comprise an element connecting the two support zones.

[0029] The orthosis can be configured so that the support zone can be stretched or extended when the memory element is deformed. In some embodiments, the orthosis can be configured so that the support can be stretched or extended when the memory element is deformed.

[0030] The orthosis can be configured so that, when the support zone contacts a body part, the support zone can exert a force on the body part due to the deformation of the memory element. In some embodiments, the orthosis can be configured so that, when a body part is received in the receptacle, the support zone can exert a force on the body part due to the deformation of the memory element.

[0031] The orthosis can have a motion sensor. The motion sensor can be configured to detect movement of the body part when the support zone contacts a body part. It can be provided that the motion sensor can be configured to detect movement of the body part when a body part is included in the receptacle.

[0032] The motion sensor can be arranged such that when the support zone contacts a body part, the motion sensor can be arranged on the body part. For example, the motion sensor can be arranged on a foot. For example, the motion sensor can be arranged on or near a joint.

[0033] The adaptation device can be configured to deform the memory element depending on the detected movement of the body part.

[0034] For example, the orthosis can be configured to dynamically adjust a relief effect and / or relief force to a required resistance value during or during a movement of the body part, e.g., when walking. The orthosis can thus, for example, ensure the maintenance of the functionality of muscles, tendons, ligaments, bones, or cartilage of the body part. The adjustment device can be integrated into the memory element. It can be provided that the adjustment device can be arranged in the memory element and / or can extend in or through the memory element.

[0035] The support zone may comprise a foam or be at least partially made of a foam. The memory element may comprise a foam or be at least partially made of a foam.

[0036] The memory material may be or comprise a thermal memory element. The thermal memory element may be configured to assume a basic shape at a temperature equal to and / or greater than a limit temperature. In some embodiments, the limit temperature may correspond to a body temperature, for example, a normal temperature of a human body. Alternatively or additionally, in some embodiments, the limit temperature may be between 35°C and 43°C, for example, at 37°C. 0 C, lie.

[0037] The adjustment device may comprise a spring element. In some embodiments, the spring element may be a layer, for example, an elastic polymer layer. Alternatively or additionally, the spring element may be or comprise a wire, rod, or coil, or be shaped accordingly. The spring element may comprise a metal and / or be made of metal. The metal may comprise a shape memory metal and / or a shape memory alloy.

[0038] The memory element can have a first layer and a second layer. The first layer can be or can include the spring element. Provision can be made for the first layer and / or the spring element to comprise an elastic polymer. The second layer can be configured to cure at a temperature lower than the limit temperature. Provision can be made for the second layer to comprise wax.

[0039] In some embodiments, the orthosis, the memory element, and / or the adjustment device may include a heating unit. The heating unit may be configured to adjust a temperature of the memory element, the adjustment device, and / or the spring element. The heating unit may be configured to heat and / or cool the adjustment device and / or the spring element.

[0040] The memory material can be or comprise an optical memory element. The optical memory element can comprise a polymer material. The optical memory element can be configured to deform under the influence of light. The optical memory element can be configured to deform under UV light.

[0041] The adjustment device may comprise an illumination device configured to illuminate the memory element. The illumination device may comprise a light source configured to generate light with a variable property, for example, variable wavelength, intensity, phase, and / or brightness. The illumination device and / or the light source may be configured to generate and / or emit UV light.

[0042] The lighting device may comprise a light-conducting fiber. The light-conducting fiber may be configured to emit a different amount of light depending on the shape and / or dimensions of the support zone. Alternatively or additionally, the light-conducting fiber may be configured to emit light with different properties depending on the shape and / or dimensions of the support zone. The property of the light may include, for example, intensity, brightness, phase, and / or wavelength.

[0043] In some embodiments, the optical fiber can be configured to emit a different amount of light depending on the shape and / or dimensions of the receptacle. The optical fiber can be configured to emit light with different properties depending on the shape and / or dimensions of the receptacle.

[0044] The memory element may comprise at least two layers, and the illumination device and / or the light-conducting fiber may extend and / or be arranged between two layers of the memory element.

[0045] The memory element can be configured to deform under the influence of an electromagnetic wave. It can be provided that the adaptation device can be configured to apply an electromagnetic wave to the memory element.

[0046] The orthosis can have a control unit. The control unit can be configured to control the adjustment device such that the memory element is or becomes deformed. The adjustment device can be configured to deform the memory element such that it can essentially have a predetermined deformation. The orthosis can have at least one further deformable memory element and at least one respective further adjustment device for adjusting the shape of a respective further memory element. It can be provided that the orthosis can have at least one further support zone, and at least one of the further memory elements can be arranged on, near or in at least one of the further support zones. Alternatively or additionally, a further support zone can have or be a further memory element.

[0047] The shape of the memory element and the shapes of each of the other memory elements can be adjusted independently of each other. The shape of the support zone and the shapes of each of the other support zones can be adjusted independently of each other.

[0048] The adjustment device can be configured to check the deformation of the memory element for deviations from a predetermined deformation. It can be provided that the adjustment device can check the deformation of the memory element repeatedly and / or regularly for deviations from a predetermined deformation.

[0049] Alternatively or additionally, the control unit can be configured to check the deformation of the support zone for deviations from a predetermined deformation. It can be provided that the control unit can check the deformation of the support zone repeatedly and / or regularly for deviations from a predetermined deformation.

[0050] The adjustment device can be configured to repeatedly and / or regularly adjust the deformation of the memory element. Alternatively or additionally, the control unit can be configured to repeatedly and / or regularly adjust the deformation of the support zone.

[0051] The orthosis and / or the support zone can have a pressure sensor. The pressure sensor can be configured to detect a load on the support zone. For example, the pressure sensor can be configured to detect pressure on or at the support zone.

[0052] The pressure sensor can be arranged such that, when the support zone contacts a body part, it can be arranged, for example, on a foot or heel area. The adjustment device can be configured to adjust the deformation of the memory element depending on a load on the support zone. Alternatively or additionally, the control unit can be configured to adjust the deformation of the memory element depending on a load on the support zone.

[0053] The memory element can comprise a strain gauge. Alternatively or additionally, a strain gauge can be arranged on or in the support zone. In some embodiments, alternatively or additionally, a strain gauge can be arranged on or in the receptacle. The control unit can be configured to adapt the deformation of the memory element depending on a measured value detected by the strain gauge.

[0054] The orthosis may have a data transmission unit. The data transmission unit may be configured to receive data from an external device and / or transmit it to an external device. The data may include, for example, control commands and / or control data. The data may include, for example, data relating to the deformation, in particular geometric data of the deformation. It may be provided that the data may include a force exerted or to be exerted by the support zone and / or a pressure exerted or to be exerted by the support zone.

[0055] In some embodiments, it may be provided that the control unit can generate control commands for the adjustment device based on the data transmitted from the external device to the control unit, and / or can control the adjustment device. Thus, a force exerted or to be exerted by the support zone and / or a pressure exerted or to be exerted by the support zone can be controlled and / or specified by the external device.

[0056] It may be provided that a force exerted or to be exerted by the support zone and / or a pressure exerted or to be exerted by the support zone may vary over time.

[0057] The orthosis may have an energy storage device configured to supply the adjustment device with energy. The energy storage device may be configured to supply the control unit and / or sensors with energy. The energy may be or comprise electrical energy. The energy storage device may be or comprise a battery, a secondary battery, or an accumulator. The orthosis may have a light sensor. The light sensor may be arranged and / or accommodated on, in, or near the memory element and / or the support zone. The light sensor may extend in or through the memory element and / or the support zone.

[0058] The light sensor can comprise a light-conducting sensor fiber. The light-conducting sensor fiber can be configured to conduct light with different properties depending on the shape and / or dimensions of the support zone. Alternatively or additionally, the light-conducting sensor fiber can be configured to conduct light with different properties depending on the load on the support zone. The property of the light can include a phase, wavelength, intensity, or the like.

[0059] The light-conducting sensor fiber can be or comprise a glass fiber and / or a plastic fiber. In some embodiments, the light-conducting sensor fiber can be configured to conduct light with different properties depending on the shape and / or dimensions of the receptacle. It can be provided that the property of the light-conducting sensor fiber can change depending on the deformation of the light-conducting sensor fiber. The light-conducting sensor fiber can be or become deformed depending on a deformation of its surroundings, for example, depending on the deformation of a memory element and / or support element.

[0060] The orthosis may include a detection unit. The detection unit may be configured to detect light detected by the light sensor and / or the light guided by the light-conducting fiber. In some embodiments, the detection unit may comprise a CMOS chip.

[0061] The orthosis and / or the memory element may comprise at least two layers, and the light sensor and / or the light-conducting sensor fiber may be arranged and / or run between two of the layers.

[0062] The orthosis can be configured to be glued to a body part. The orthosis can have an adhesive element that can be glued to the body part. The support zone 112 and / or the adhesive element can be arranged such that when the orthosis is glued to or onto a body part, the support zone contacts the body part.

[0063] The receptacle can have two support zones, and the memory element can be or comprise an element connecting the two support zones. The receptacle can be suspended from a suspension and / or movably connected to the suspension using a parallel kinematics machine. The parallel kinematics machine can be or comprise a hexapod. The suspension can be formed by a further receptacle for a body part and / or a further support zone. The parallel kinematics machine can be configured such that the receptacle and / or the support zone can be movable relative to the suspension with at least three degrees of freedom. In some embodiments, the parallel kinematics machine can be configured such that the receptacle and / or the support zone can be movable relative to the suspension with at least six degrees of freedom. One degree of freedom can comprise a translational and / or axial movement.A degree of freedom can include rotational movement and / or rotation.

[0064] The orthosis may include a guide element. The guide element may guide a movement of the support and / or the support zone. For example, the guide element may guide a rotational movement of the support zone. Alternatively or additionally, the guide element may be telescopic.

[0065] The orthosis may have multiple interconnected supports. Alternatively or additionally, the orthosis may have multiple interconnected support zones.

[0066] At least two of the receptacles can be spaced apart by a recess. At least two of the support zones can be spaced apart by a recess.

[0067] At least two of the receptacles and / or at least two of the support zones can be movable relative to one another. At least two of the receptacles can be rotatable relative to one another. Alternatively or additionally, at least two of the support zones can be movable relative to one another. At least two of the support zones can be rotatable relative to one another.

[0068] The orthosis may comprise an energy-generating device. The energy-generating device may be configured to convert mechanical energy into electrical energy. The mechanical energy may be provided by a movement of the receptacle, for example, a movement of the receptacle relative to the energy-generating device. The energy-generating device may comprise a magnet and a coil, wherein, upon movement of the receptacle, the magnet may be movable relative to the coil. It may be provided that a current is or can be induced by a relative movement of the magnet to the coil.

[0069] The orthosis can have an activation unit. The activation unit can be configured to transmit an impulse to a nerve of the body part when the support zone contacts a body part. The impulse can be transmitted by means of an electric current and / or can be or comprise an electric current.

[0070] Alternatively or additionally, the activation unit can be configured to activate a muscle of the body part when the support zone contacts it. For example, the activation unit can activate the muscle using an electric current.

[0071] The orthosis may have an output unit for outputting a signal or message. The signal may, for example, be or include an acoustic signal.

[0072] The invention is further explained with reference to the following figures. They show:

[0073] Fig. 1: an exemplary embodiment of an orthosis according to the invention;

[0074] Fig. 2: another exemplary embodiment of an orthosis according to the invention;

[0075] Fig. 3: yet another exemplary embodiment of an inventive

[0076] orthosis;

[0077] Fig. 4: yet another exemplary embodiment of an inventive

[0078] orthosis;

[0079] Fig. 5: yet another exemplary embodiment of an inventive

[0080] Orthosis.

[0081] Figures 1 to 5 show exemplary embodiments of orthoses according to the invention. The embodiments shown and / or described in the figures may have at least one or more common features and / or advantages.

[0082] Identical reference symbols in the figures may denote or reference identical features, parts, elements, devices, or units. The exemplary embodiments shown in the figures may have additional features and / or properties not shown in the figures. The illustrations shown in the figures are not necessarily to scale.

[0083] Figure 1 shows an embodiment of an orthosis 100 according to the invention. The embodiment shown in Figure 1 may have one, several or all features and / or advantages of one or more of the embodiments shown or described in Figures 2, 3, 4 and / or 5.

[0084] The orthosis 100 has a support zone 112 configured to contact a body part 120. The orthosis 100 has a deformable memory element 116. The memory element 116 defines a shape and / or dimension of the support zone 112. The orthosis has an adjustment device 118. The adjustment device 118 is configured to adjust the shape of the memory element 116.

[0085] The body part 120 can be or comprise, for example, an extremity of a human body. The body part 120 can be or comprise, for example, a foot, a lower leg, and / or a thigh. The body part 120 can be or comprise a back or part of a back. The body part 120 can be or comprise a neck, or comprise a neck region. The body part 120 can be or comprise a knee joint, an elbow, or a wrist. The body part 120 can be or comprise a head, or can be or comprise a head region. The body part 120 can be or comprise a jaw joint.

[0086] The orthosis 100 may include a receptacle 110. The receptacle 110 may be designed to receive a body part 120. The receptacle 110 may include the support zone 112. The support zone 112 may be a part and / or a section of the receptacle 110.

[0087] The orthosis 100 and / or the receptacle 112 can, for example, be attached to a thigh, lower leg, a leg, a foot, an arm, an upper arm, a forearm of a hand, or the like and / or accommodate a corresponding body part 120.

[0088] It can be provided that the orthosis 100 can be or can be glued onto or to a body part 120. For example, the orthosis 100 can have an adhesive element. The sliding element can be an adhesive strip, for example. It can be provided that when the orthosis 100 is glued onto a body part 120, a support zone 112 can contact the body part 120. The support zone 112 can be arranged such that, when the orthosis 100 is used or attached, it contacts a predetermined location and / or at least one predetermined point of a body part 120. The support zone 112 can be configured to support, stabilize, and / or fix the body part 112 at the predetermined location and / or at least at the predetermined point. The support zone 112 can be configured to exert a force and / or pressure on the body part 120 at the predetermined location and / or at least at the predetermined point.The force and / or pressure exerted at the specified location and / or at least at the specified point may be adjustable and / or variable.

[0089] For example, the orthosis 100 can be configured to dynamically adapt a relief effect and / or relief force to a required resistance value during or during a movement of the body part, e.g., during walking. The orthosis 100 can thus, for example, ensure the maintenance of the functionality of muscles, tendons, ligaments, bones, or cartilage of the body part. The relief effect can be adjusted and / or varied by adjusting the shape of the memory element 116 and / or the support zone 112. The relief effect can result from adjusting the force exerted on the body part 120 and / or the pressure exerted on the body part.

[0090] In some embodiments, at least a part or a section of the support zone 112 may be formed by the memory element 116. For example, the support zone 112 may include the memory element 116. It may be provided that the support zone 112 and the memory element 116 may be formed as a single piece.

[0091] When the memory element 116 is deformed, the support zone 112 may deform. For example, when the memory element 116 is deformed, the memory element 116 and / or the support zone 112 may be or become stretched, compressed, distorted, arched, bent, and / or expanded.

[0092] It can be provided that the support zone 112 can have several layers and / or can be multi-layered. The support zone 112, and / or at least one layer of the support zone 112, can be or comprise a plastic material. The support zone 112, and / or at least one layer of the support zone 112, can be or comprise a knitted or warp-knitted fabric. The support zone 112, and / or at least one layer of the support zone 112, can be or comprise a fabric, for example comprising a plastic fiber and / or a natural fiber. The support zone 112, and / or at least one layer of the support zone 112, can be elastic and / or deformable.

[0093] The support zone 112, and / or at least one layer of the support zone 112, may be or include a memory element 116.

[0094] The support zone 112 can be configured to stabilize and / or fix a body part 120. The support zone 112 can exert a force on the body part and / or press on the body part 120. The support zone 112 can provide a counterforce for misalignments that would otherwise occur or have already occurred. The force exerted by the support zone 112 and / or the pressure exerted by the support zone 112 can be adjusted depending on the shape of the memory element 116 and / or the support zone 112.

[0095] The orthosis 100 and / or the support zone 112 can, for example, enable or become capable of providing targeted support and correction, for example in order to maintain the health and functionality of joints and tissues in the long term and / or to regenerate damaged material within physiologically given limits.

[0096] In some embodiments, the orthosis 100 and / or the support zone 112 may, for example, be configured or used to correct or at least mitigate malpositions, e.g., foot malpositions.

[0097] It can be provided that the shape of the memory element 116 and / or the support zone 112 can be adjusted such that it can correspond to, or at least substantially correspond to, a predetermined shape. The predetermined shape can be a shape that can enable targeted support and / or correction and / or can exert a predetermined force or pressure on the body part 120.

[0098] In some embodiments, the memory element 116 can be arranged on or near the support zone 112. It can be provided that the memory element 116 can be arranged and / or accommodated in the support zone 112. Alternatively or additionally, the memory element 116 can be connected to the support zone 112.

[0099] In some embodiments, the orthosis 100 may have more than one support zone 112. For example, a receptacle 110 may have two or more support zones 112. Alternatively or additionally, two or more support zones 112 may be associated with different receptacles 110, and / or at least parts or sections may be different receptacles 110. In some embodiments, the orthosis 100 may have more than one receptacle 110.

[0100] In some embodiments, the orthosis 100 may have more than one memory element 116. The orthosis 100 may have more than one adjustment device 118. In some embodiments, at least one adjustment device 118 may be assigned to each memory element 116. In some embodiments, it may be provided that an adjustment device 118 can deform more than one memory element 116 and / or adjust the shape of more than one memory element 116. In some embodiments, one adjustment device 118 may be provided for each memory element 116. A corresponding respective memory element 116 can be or can be deformed by a corresponding respective adjustment device 118. A corresponding respective adjustment device 118 may be configured to adjust the shape of a respective corresponding memory element 116.

[0101] In some embodiments, a support zone 112 may include more than one memory element 116, and / or more than one memory element 116 may be disposed on, in, or near a support zone 112.

[0102] It can be provided that the memory element 116 can be shaped such that when the support zone 112 contacts a body part 120 and / or a body part 120 is received in a receptacle 110, the support zone 112 can be pressed against the body part 120 and / or can exert pressure on the body part 120.

[0103] It may be provided that at least two, several, or all of the memory elements 116 and / or support zones 112 can be adjusted independently of one another. It may be provided that the respective shape of at least two, several, or all of the memory elements 116 and / or support zones 112 can be adjusted independently of one another.

[0104] This allows for flexible and / or precise adjustment of the forces and / or pressures acting on the body part 120. It can be provided that different forces and / or pressures can be exerted at different locations on the body part 120 through corresponding support zones.

[0105] It can be provided that the force exerted by a support zone 112 and / or the pressure exerted by a support zone 112 can vary and / or be adjustable locally along the support zone 112 and / or a contact surface of the support zone 112, for example via or by means of at least two or more memory elements 116.

[0106] The orthosis 100 and / or the support zone 112 may comprise a plastic. The plastic may have damping and / or spring properties. Alternatively or additionally, the support zone and / or a contact surface of the support zone may comprise a foam.

[0107] In some embodiments, the memory element 116 may be or include a band or a band-shaped element. In some embodiments, the memory element 116 may be or include a sheet-like element. In some embodiments, the memory element 116 may connect two support zones 112. In some embodiments, the memory element 116 may connect two receptacles 110 to each other.

[0108] The memory element 116 may comprise a memory material. The memory element 116 may be at least partially made of a memory material. The memory element 116 may be or include a shape memory element. The memory material may be or include a shape memory material.

[0109] The memory element 116 may be configured to have a basic shape to which it can return or assume after, during, or under deformation.

[0110] In some embodiments, the memory element 116 can be or comprise a thermal memory element. The thermal memory element can be configured to assume a predetermined shape, for example, a basic shape, when a limit temperature is exceeded. The thermal memory element can be configured to be deformable at a temperature greater than the limit temperature. The thermal memory element can be configured to be dimensionally stable and / or non-deformable at a temperature lower than the limit temperature.

[0111] In some embodiments, the memory element 116 can have a spring element. The spring element can be configured to return the memory material and / or the memory element 116 to a predefined or predetermined shape, e.g., a basic shape. The spring element can be configured to exert a restoring force in the event of deviations from a predefined shape, e.g., a basic shape. In some embodiments, the thermal memory element can have a first layer, which can comprise the spring element. For example, the spring element can be formed as an elastic plastic, e.g., an elastic polymer. For example, the spring element and / or the first layer can be or have an elastic layer.

[0112] The thermal memory element can have a second layer. The second layer can be arranged on or near the first layer and / or connected to the first layer. It can be provided that the second layer can be deformable at a temperature greater than the limit temperature. At a temperature lower than the limit temperature, the second layer shape can be dimensionally stable and / or non-deformable.

[0113] It may be provided that when the temperature of the memory element 116, the memory material, and / or the second layer is lower than the threshold temperature, the second layer can counteract a restoring force exerted by the first layer, so that the memory element 116 can be dimensionally stable. At a temperature greater than the threshold temperature, in some embodiments, the restoring force can deform the second layer such that the memory element 116 and / or the memory material can assume its predetermined shape and / or the basic shape.

[0114] For example, the second layer may be configured to cure and / or be hard at a temperature lower than the threshold temperature. In some embodiments, the second layer may comprise, for example, wax or a wax material.

[0115] In some embodiments, the adjustment device and / or the spring element can alternatively or additionally be rod-shaped and / or have a spiral shape. The spring element can be wire-shaped and / or comprise a wire. The adjustment device and / or the spring element can consist of a metal or comprise a metal that can be deformable at a temperature lower than the limit temperature and can assume a specific shape at a temperature higher than the limit temperature. The metal can be or comprise a shape memory alloy and / or a shape memory metal.

[0116] In some embodiments, the spring element can be arranged, integrated, and / or accommodated in a layer of the memory element 116. In some embodiments, the spring element can be arranged, integrated, and / or accommodated between two layers of the memory element 116. In some embodiments, the limit temperature can be or correspond to a usual and / or average temperature of a human body, for example, a normal temperature of a human body or body part 120. The limit temperature can be 37°C. The limit temperature can be a temperature between 35°C and 43°C. It can be provided that, when a body part 120 is accommodated in the orthosis 100 and / or is contacted by the support zone 100, the memory element 116 can be or be heated to the limit temperature. In some embodiments, however, a different limit temperature can also be provided.

[0117] In some embodiments, it can be provided that the adjustment device 118 can comprise a heating unit. The heating unit can be configured to set and / or vary a temperature of the memory element 116 and / or the spring element. It can be provided that the heating unit can be or be controlled in such a way that the shape of the memory element is or will be set and / or varied. For example, it can be provided that a temperature is or will be set by the heating unit that can be greater or less than a limit temperature. The heating unit can be configured to heat and / or cool the memory element 116, the adjustment device 118 and / or the spring element.

[0118] The heating unit can, for example, be arranged on or near the memory element 116 and / or the spring element. In some embodiments, the heating unit can be arranged and / or integrated into the memory element 116, for example, in one or more layers. In some embodiments, the heating unit can comprise a heating wire or the like.

[0119] In some embodiments, it can be provided that the memory element 116 and / or the spring element can have more than one limit temperature. It can be provided that a temperature window or temperature interval can exist between two limit temperatures. In some embodiments, if the memory element 116 and / or the spring element has a temperature within a temperature window or temperature interval, it can assume a specific shape. Different temperature windows and / or temperature intervals can be assigned specific shapes of the memory element 116. For example, if the memory element 116 and / or the spring element has a temperature that lies within a first temperature window or temperature interval, the memory element 116 can have a first shape and / or be set to a first shape.For example, if the memory element 116 and / or the spring element has a temperature that lies within a second temperature window or second temperature interval, the memory element 116 may have a second shape and / or be set to a second shape. The first shape may be different from the second shape. The memory element 116 may be shaped differently in the first shape compared to the second shape.

[0120] Alternatively or additionally, the memory element 116 can be or comprise an optical memory element. The optical memory element can be configured to deform under the influence of light. The optical memory element can comprise a correspondingly suitable memory material or consist of a correspondingly suitable memory material. For example, the optical memory element and / or the memory material can be or comprise a suitable polymer material. In some embodiments, the optical memory element can be configured to deform under UV light. For example, depending on the properties of the light, for example the wavelength, a different deformation of the memory material and / or the memory element 116 can result.

[0121] The adjustment device 118 may include an illumination device 150. The illumination device 150 may be configured to illuminate the memory material and / or the memory element 116. The illumination may be adjusted and / or controlled such that the memory material and / or the memory element 116 can assume a predetermined and / or specific shape.

[0122] It can be provided that the shape of the memory element 116 and / or the memory material can be adjusted by illuminating it with different light.

[0123] In some embodiments, the memory material can crosslink under UV light at a specific wavelength, and the crosslinking can be dissolved upon irradiation with a different wavelength. In some embodiments, the memory material can comprise, for example, a suitable butyl acrylate.

[0124] In some embodiments, the memory material can be arranged on one side of the memory element 116, and a dimensionally stable material can be arranged on the other side. Irradiation of the memory material on one side can result in a change in shape, for example, through appropriate crosslinking. In some embodiments, the memory element 116 can, for example, have an irradiable first layer, which can comprise the memory material and / or consist of the memory material, and a second dimensionally stable layer, which can be connected and / or arranged on, at, or with the first layer.

[0125] In some embodiments, the illumination device may include a light source 154. The illumination device may have a light-conducting fiber 152. The light-conducting fiber 152 may be or include a glass fiber and / or a plastic fiber. It may be provided that the light source 154 can couple and / or feed light into the light-conducting fiber. The light source 154 may be configured to generate and / or emit light with different properties, for example, light with different wavelengths, phases, intensities, or brightness.

[0126] The optical fiber 152 may be configured to guide light and / or emit light.

[0127] It can be provided that the optical fiber 152 can be integrated into the memory element 116 and / or memory material. It can be provided that the optical fiber 152 can be arranged and / or run within the memory element 116, for example, a layer of the memory element 116. It can be provided that the optical fiber 152 can be arranged and / or run between two layers of the memory element 116.

[0128] It may be provided that the optical fiber 152 can be integrated into a support zone 112 or the support zone 112. It may be provided that the optical fiber 152 can be arranged and / or run in the support zone 112. It may be provided that the optical fiber 152 can be arranged and / or run between two layers of the support zone 112.

[0129] Alternatively or additionally, the memory element 116 can be configured to deform under the influence of an electromagnetic wave. It can be provided that the adaptation device 118 can be configured to apply an electromagnetic wave to the memory element 116.

[0130] Alternatively or additionally, the memory element 116 and / or the adaptation device 118 can comprise a gel. For example, the gel can harden or be liquid depending on its temperature, and / or change its phase. The memory element 116 and / or the adaptation device 118 can be configured to assume different shapes depending on the temperature of the gel and / or the phase of the gel, so that the shape of the memory element 116 can be adjustable.

[0131] In some embodiments, when the memory element 116 is arranged and / or received on, at or in the support zone 112, the support zone 112 can change its shape and / or dimension and / or be or become deformed by a deformation of the memory element 116.

[0132] In some embodiments, when the memory element 116 is connected to the support zone 102, the memory element 116 can exert a force on the support zone 112 upon deformation, by means of which the support zone 112 can change its shape and / or dimension, and / or can be or become deformed.

[0133] In some embodiments, as shown in Figure 1, for example, a memory element 116 can connect two support zones 112 of a receptacle 110. When the memory element 116 is deformed, the support zones 112 can be pulled, for example, toward one another, and thus change their shape and / or dimensions. For example, the memory element 116 can be or become deformed in such a way that the receptacle 110 can change, for example, become narrower or wider. If the support zone 112 contacts a body part 120 and / or a body part 120 is received in the receptacle 110, the support zone 112 can exert a force on the body part 120.

[0134] The orthosis 100 may include a connecting element 113. The connecting element 113 may be configured to attach a support zone 112 to a body part 120. The coupling element 113 may alternatively or additionally connect two support zones 112 to each other. The connecting element 113 may alternatively or additionally connect two receptacles 110 to each other.

[0135] The orthosis 100 can have a recess 114. A recess 114 can, for example, be formed and / or arranged between two receptacles 110. In some embodiments, the connecting element 113 can form and / or have the recess 114. The wearing comfort of the orthosis 100 can be or become increased by the recess 114. The recess 114 can make it easier for interconnected receptacles 110 to move relative to one another. The recess 114 can increase the flexibility of the orthosis 110. In some embodiments, the connecting element 113 can be annular and / or have a ring. In some embodiments, the connecting element 113 can be band-shaped and / or have or include a band.

[0136] In some embodiments, it may be provided that the connecting element 113 may comprise a memory element 116. Alternatively or additionally, the memory element 116 may be or comprise a connecting element 113.

[0137] The orthosis 100 may include one or more motion sensors 130. A motion sensor 130 may be configured to detect a movement of the body part 120 when the body part 120 is received in a receptacle 110 and / or when the body part 120 is contacted by a support zone 112.

[0138] The orthosis 100 may include one or more pressure sensors 132. A pressure sensor 132 may, for example, be arranged on, near, or in a support zone 112. The pressure sensor 132 may be configured to detect a pressure acting from a body part 120 on the support zone 112 and / or a pressure acting from the support zone 112 on a body part 120.

[0139] A pressure sensor 132 can alternatively or additionally be arranged, for example, on, near, or in a receptacle 110. A pressure sensor 132 can, for example, be arranged on, near, or in a connecting element 113.

[0140] The orthosis 100 may include one or more strain gauges 134. A strain gauge 134 may be arranged and / or attached on, near, or in a support zone 112, and / or a support zone 112 may include a strain gauge 134. A strain gauge 134 may be connected to a support zone 112. Alternatively or additionally, a strain gauge 134 may be arranged on, near, or in a connecting element 113, and / or a connecting element 113 may include a strain gauge 134.

[0141] The orthosis 100 may include a control unit 160. The control unit 160 may be configured to control the adjustment device 118. The control unit 160 may be configured to control and / or specify a deformation of the memory element 116.

[0142] The control unit 160 may be connected to one, several, or all of the motion sensors 130. The control unit 160 may be connected to one, several, or all of the pressure sensors 102. The control unit 160 may be connected to one, several, or all of the strain gauges 134.

[0143] The control unit 160 may be or include a computer unit, a processor, a microprocessor, an FPGA, an integrated circuit, a logic circuit, a programmable logic circuit, and / or a microcontroller.

[0144] The orthosis 100 may include a guide element 182. The guide element 182 may guide a movement of the receptacle 110 and / or the support zone 112. For example, the guide element 182 may guide a rotational movement of the support zone 112. The guide element 182 may connect two or more receptacles 110 to each other. The guide element 182 may connect two or more support zones 112 to each other.

[0145] For example, a receptacle 110 can be rotatable relative to another receptacle 110, and the rotation can be guided and / or supported by the guide element 182. For example, a support zone 112 can be rotatable relative to another support zone 112, and the rotation can be guided and / or supported by the guide element 182. In some embodiments, the guide element can define a maximum angle of rotation and / or block rotation beyond a predetermined angle.

[0146] Alternatively or additionally, the guide element 182 can be telescopic and / or have a linear guide. For example, a receptacle 110 can be translationally and / or linearly adjustable relative to another receptacle 110, and the translational and / or linear adjustment can be guided and / or supported by the guide element 182. For example, a support zone 112 can be translationally and / or linearly adjustable relative to another support zone 112, and the translational and / or linear adjustment can be guided and / or supported by the guide element 182. In some embodiments, the guide element can define a maximum translational and / or linear adjustment path and / or block adjustment beyond a predetermined translation.

[0147] Figure 2 shows a further embodiment of an orthosis 100 according to the invention. The embodiment shown in Figure 2 can have one, several or all features and / or advantages of one or more of the embodiments shown or described in Figures 1, 3, 4 and / or 5. In some embodiments, as shown in Figure 2, for example, a memory element 116 can be integrated into a support zone 112 and / or arranged in a support zone 112. Furthermore, it can be provided that an adjustment device 118 can be integrated into the support zone 112 and / or the memory element 116 and / or can be arranged in a support zone 112 and / or the memory element 116. The adjustment device 118 can be or have a metal element. The adjustment device 118 can be or have a wire, pin, coil and / or rod. The adjustment device 118 can be or have a spring element.

[0148] In some embodiments, a receptacle 110 and / or a support zone 112 can be suspended or attached to a suspension 181, and / or suspended on or with the suspension 181. The suspension 181 can be or become formed by a further receptacle 110 for a body part 120 and / or a further support zone 112. The receptacle 110 and / or the support zone 112 can be connected to the suspension 181 via a parallel kinematic machine 180. The parallel kinematic machine 180 can be or comprise a hexapod. The parallel kinematic machine 180 can be configured such that the receptacle 110 and / or the support zone 112 can be movable relative to the suspension 181 with at least three degrees of freedom. In some embodiments, the parallel kinematic machine 180 may be configured so that the receptacle 110 and / or the support zone 112 can be movable relative to the suspension 181 with at least six degrees of freedom.A degree of freedom can include translational and / or axial movement. A degree of freedom can include rotational movement and / or rotation.

[0149] The parallel kinematic machine 180 may include one or more leg elements 184. In some embodiments, the parallel kinematic machine 180 may include at least three leg elements 184. In some embodiments, the parallel kinematic machine may include six leg elements 184. The receptacle 110 and / or the support zone 112 may be connected to the suspension 181 via the leg elements 184.

[0150] In some embodiments, the orthosis 100, a leg element 184, and / or a connecting element 113, can have a height adjustment 186. The height adjustment 186 can be configured so that a distance between a receptacle 110 and / or a support zone 112 and another receptacle 112 and / or another support zone 112 can be adjustable. In some embodiments, the height adjustment 186 can be configured so that the distance along an extension of a body part 120, for example, an extremity, can be adjustable. The height adjustment 186 can include a dental splint 188. The dental splint 188 can be configured to releasably latch and / or lock, so that the distance can be adjusted.

[0151] The orthosis 100 can have an energy generating device 170. The energy generating device 170 can be configured to convert mechanical energy into electrical energy. In some embodiments, the mechanical energy can be provided by a movement of the body part 120 when the body part 120 is received in a receptacle 10 and / or when the body part 120 is contacted by a support zone 112. For example, the mechanical energy can be provided by a movement of one receptacle 110 relative to another receptacle 110. Alternatively or additionally, the mechanical energy can be provided by a movement of one support zone 112 relative to another support zone 112. The movement can, for example, comprise a translational movement and / or axial movement. In some embodiments, the movement can alternatively or additionally comprise a rotation and / or twist.

[0152] The energy generation device 170 can include a magnet 174 and a coil 176. It can be provided that the magnet 174 can be or be moved relative to the coil 176 by the mechanical energy and / or movement. Upon movement of the magnet 174 relative to the coil 176, an electric current can be or be induced in the coil 176.

[0153] In some embodiments, the magnet 174 and / or the coil 176 may be arranged on, at or in a leg element 184 and / or a guide element 182.

[0154] Figure 3 shows yet another exemplary embodiment of an orthosis 100 according to the invention. The embodiment shown in Figure 2 may have one, several or all features and / or advantages of one or more of the embodiments shown or described in Figures 1, 2, 4 and / or 5.

[0155] In some embodiments, the support zone 112 may be annular and / or comprise a ring. The support zone 112 may include a recess 114.

[0156] In some embodiments, a magnet 174, in particular a magnet of an energy generation device 170, may be annular and / or comprise a ring. It may be provided that a support zone 112 may comprise a magnet 174.

[0157] A strain gauge 134 can be arranged on, in, or near a support zone 112. It can be provided that a deformation of the support zone 112 can be detected by the strain gauge 134.

[0158] In some embodiments, as shown, for example, in Figure 3, the orthosis 100 may include a data transmission unit 162. The data transmission unit 162 may be configured to exchange data with an external device 168. The data transmission unit 162 may be or include a radio interface. The data transmission unit 162 may be configured to exchange data wirelessly. For example, the data transmission unit 162 may be configured to transmit data via NFC, Bluetooth, WLAN, ZigBee, Ant+, LTE, narrowband IOT, or GSM. In some embodiments, the data transmission unit 162 may be or include a transponder.

[0159] Figure 4 shows a further embodiment of an orthosis 100 according to the invention. The embodiment shown in Figure 4 may have one, several or all features and / or advantages of one or more of the embodiments shown or described in Figures 1, 2, 3 and / or 5.

[0160] The body part 120 may have nerves 122, as shown by way of example in Figure 4.

[0161] The orthosis 100 can have one or more activation units 164. An activation unit 164 can be arranged such that, when the support zone 112 contacts the body part 120 and / or the body part 120 is received in a receptacle 110, it can be arranged on or near a nerve 122 and / or a nerve ending.

[0162] The activation unit 164 may be configured to output an electrical current and / or a pulse.

[0163] The activation unit 164 can be configured to transmit an impulse to a nerve 122 of the body part 120. For example, the impulse can be transmitted by means of an electrical current. In some embodiments, the impulse can comprise an electrical current. Alternatively or additionally, the activation unit 164 can be configured to activate a muscle of the body part 120 when the support zone 112 contacts a body part 120 and / or a body part 120 is received in a receptacle 110. The activation can be performed, for example, by means of an electrical current.

[0164] It may be provided that the activation unit 164 may be connected to the control unit 160. In some embodiments, the control unit 160 may control the activation unit 164.

[0165] Figure 5 shows yet another embodiment of an orthosis 100 according to the invention. The embodiment shown in Figure 5 may have one, several or all features and / or advantages of one or more of the embodiments shown or described in Figures 1, 2, 3 and / or 4.

[0166] The orthosis 100 may include a control unit 160, as shown, for example, in Figure 5.

[0167] The orthosis 100 and / or the control unit 160 can have a data memory 161. The data memory 161 can be configured to exchange data with the control unit 160, to receive data from the control unit 160, and / or to transmit data to the control unit 160. The data can include geometry data of the memory element 116 and / or the support zone 112. The data can include control data and / or control commands of the adjustment device 118. It can be provided that the data can be provided with a time stamp.

[0168] The control unit 160 can be connected to a data transmission unit 162. The control unit 160 can exchange data with an external device 168 via the data transmission unit 162. The external device 168 can be or include, for example, a computer device, a server, a cloud server, or the like.

[0169] The data can, for example, include data relating to the deformation, in particular geometric data of the deformation. It can be provided that the data can include a force exerted or to be exerted by the support zone 112 and / or a pressure exerted or to be exerted by the support zone 112. In some embodiments, it can be provided that the control unit 160 can generate control commands for the adaptation device and / or control the adaptation device based on the data transmitted from the external device 168 to the control unit 160. In some embodiments, the control unit 160 can receive control data and / or control commands for controlling the adaptation device 118 from the external device 168. Alternatively or additionally, the control unit 160 can obtain and / or receive geometric data of the memory element 116 and / or the support zone 112 from the external device 168.It may be provided that the control unit 160 can create and / or generate control commands and / or control data based on the received or obtained data. The control unit 160 can control the adaptation device 118 such that the memory element 116 and / or the support zone 112 can have a shape and / or dimension that substantially corresponds to the geometric data.

[0170] Thus, a force exerted or to be exerted by the support zone 112, and / or a pressure exerted or to be exerted by the support zone, can be controlled and / or predetermined by the external device 168.

[0171] It may be provided that a force exerted or to be exerted by the support zone 112 and / or a pressure exerted or to be exerted by the support zone 112 may vary over time.

[0172] In some embodiments, the control unit 160 can transmit data, for example a time profile, of force and / or pressure exerted by a support zone 112, and / or of control commands, geometry data, data of the shape of the support point 112 and / or the memory element 116, sensor data, control data or other data to the external device 160.

[0173] The control unit 160 can be connected to the motion sensor(s) 130. It can be provided that the control unit 160 can receive sensor data detected by a motion sensor 130. In some embodiments, the control unit 160 can determine a movement of a support zone 112, a receptacle 110, and / or the orthosis 100 based on the data received from the motion sensor 130. It can be provided that the control unit 160 can create and / or generate control commands and / or control data based on the data received or obtained from the motion sensor 130 and / or based on the movement determined by the control unit 160. The control unit 160 can control the adaptation device 118 based on the control commands and / or control data.

[0174] The control unit 160 can be connected to the pressure sensor(s) 132. It can be provided that the control unit 160 can receive sensor data acquired by a pressure sensor 132. In some embodiments, the control unit 160 can determine a pressure and / or a load of a support zone 112 based on the data received from the pressure sensor 132. It can be provided that the control unit 160 can create and / or generate control commands and / or control data based on the data received or obtained from the pressure sensor 132 and / or based on the load and / or the pressure determined by the control unit 160. The control unit 160 can control the adaptation device 118 based on the control commands and / or control data.

[0175] The control unit 160 can be connected to the strain gauge(s) 134. It can be provided that the control unit 160 can receive sensor data acquired by a strain gauge 134. In some embodiments, the control unit 160 can determine a deformation, e.g., an extension or compression, of a strain gauge 134, a receptacle 110, and / or a support zone 112 based on the data received from the strain gauge 134. It can be provided that the control unit 160 can create and / or generate control commands and / or control data based on the data received or obtained from the strain gauge 134 and / or based on the deformation, extension, and / or compression determined by the control unit 160. The control unit 160 can control the adaptation device 118 based on the control commands and / or control data.

[0176] The orthosis 100 may include a light sensor 136. The orthosis 100 and / or the light sensor 136 may include a light-conducting sensor fiber 138. The light-conducting sensor fiber 138 may be or include a glass fiber and / or a plastic fiber.

[0177] When the optical sensor fiber 138 is deformed, a property of the light guided by the optical sensor fiber 138 can be or become changed. The change in the property can depend on a deformation of the optical sensor fiber 138 and / or a deformation of an area surrounding the optical sensor fiber 138, for example, a memory element 116, memory material, and / or a support zone 112, and / or represent or depict a corresponding deformation. For example, in some embodiments, a wavelength and / or phase of the guided light can be or become changed when the optical sensor fiber 138 is deformed.

[0178] The orthosis 100 and / or the light sensor 136 may include a detection unit 140. The detection unit 140 may be connected to the light-conducting sensor fiber 138. The detection unit 140 may be configured to detect light guided by the light-conducting sensor fiber 138.

[0179] In some embodiments, the detection unit 140 may comprise an active pixel sensor. The active pixel sensor may be or include a CMOS chip. The detection unit 140 and / or the active pixel sensor may be configured to receive and evaluate light guided by the light-conducting sensor fiber 136. The detection unit 140 and / or the active pixel sensor may include one or more pixels. The received light may be or be evaluated for each pixel.

[0180] In some embodiments, the detection unit 140 may include an evaluation unit 146. The active pixel sensor and / or the evaluation unit 146 may, for example, generate an image, for example a grayscale image, from the light guided by the optical sensor fiber. The evaluation unit 146 may evaluate and / or analyze the generated image. The evaluation unit 146 may compare an actual property 142 of the light guided by the optical sensor fiber, and / or of the light evaluated by the active pixel sensor and / or of the generated image, with a reference property 144 of the light.

[0181] The control unit 160 can be connected to the light sensor(s) 136. In some embodiments, the control unit 160 can include the evaluation unit 146 and / or be configured to evaluate and / or analyze the light, data, or measured values ​​detected by the light sensor 136. It can be provided that the control unit 160 can evaluate and / or analyze the light, data, or measured values ​​detected by the detection unit 140.

[0182] It may be provided that, based on the data, evaluations, or measured values ​​received or obtained by light sensor 136, and / or based on the evaluation and / or analysis performed by control unit 160, control unit 160 can create and / or generate control commands and / or control data. Control unit 160 can control adaptation device 118 based on the control commands and / or control data.

[0183] It can be provided that the control unit 160 can receive sensor data acquired by a strain gauge 134. In some embodiments, the control unit 160 can determine a deformation, e.g., an extension or compression, of a strain gauge 134, a receptacle 110, and / or a support zone 112 based on the data received from the strain gauge 134. It can be provided that the control unit 160 can create and / or generate control commands and / or control data based on the data received or obtained from the strain gauge 134 and / or based on the deformation, extension, and / or compression determined by the control unit 160. The control unit 160 can control the adaptation device 118 based on the control commands and / or control data.

[0184] In some embodiments, the adjustment device 118 can be configured to illuminate the memory element 116 and / or the memory material. The adjustment device 118 can include an illumination device 150. The adjustment device 118 and / or the illumination device 150 can include a light-conducting fiber 152 and a light source 154. The light-conducting fiber 152 can be connected to the light source 164. The light source 164 can couple, emit, and / or feed light into the light-conducting fiber 153. The light-conducting fiber 152 can guide light and / or emit or radiate light. The light-conducting fiber 152 can illuminate the memory element 116 and / or the memory material.

[0185] The light, in particular the light generated by the light source 164 and / or guided by the light-conducting fiber 152, can be variable and / or adjustable. It can be provided that the light source 164 can generate light with adjustable and / or variable properties. For example, the property can include a wavelength, intensity, brightness, and / or phase of the light. The light can be or include UV light.

[0186] It can be provided that the memory material and / or the memory element 116 can be or become deformed differently depending on the different properties of the light. It can be provided that by adjusting and / or varying the light, the memory material and / or the memory element 116 can be or become deformed in an adjustable and / or variably manner.

[0187] The adjustment device 118 can be configured to check the deformation of the memory element 116 and / or the support zone 112 for deviations from a predetermined deformation. It can be provided that the adjustment device 118 can repeatedly and / or regularly check the deformation of the memory element 116 for deviations from a predetermined deformation. The adjustment device 118 can be configured to repeatedly and / or regularly adjust the deformation of the memory element 116. Alternatively or additionally, the control unit 160 can be configured to check the deformation of the support zone 112 and / or the memory element 116 for deviations from a predetermined deformation. It can be provided that the control unit 160 can repeatedly and / or regularly check the deformation of the memory element 116 for deviations from a predetermined deformation.Alternatively or additionally, the control unit 160 may be configured to repeatedly and / or regularly adjust the deformation of the support zone 112.

[0188] The control unit 160 can be configured to control the adaptation device 118 dynamically and / or in a time-variable manner.

[0189] The control device 160 can be configured to control the activation unit 164. It can be provided that the control device 160 can control the activation unit 164 based on the deformation and / or shape of the memory element 116 and / or the support zone 112. It can be provided that the control device 160 can control the activation unit 164 based on a sensor, for example, the motion sensor 130, the pressure sensor 132, the strain gauge 134, and / or the light sensor 136. In some embodiments, the control device 160 can receive commands for controlling the activation unit 164 from the external device 168.

[0190] In some embodiments, a predetermined shape, or the predetermined shape, and / or geometry data of the predetermined shape can be or will be stored in the data memory 161. In some embodiments, data, for example a temporal progression of the force and / or pressure exerted by a support zone 112, and / or of control commands, geometry data, data of the shape of the support point 112 and / or the memory element 116, control data, sensor data, or other data, can be or will be stored in the data memory 161.

[0191] The orthosis 100 can have an energy storage device 172. The energy storage device 172 can be configured to supply the adaptation device 118 with energy. The energy storage device 172 can be configured to supply the control unit 160 and / or sensors with energy. The energy can be or comprise electrical energy. The energy storage device 172 can be or comprise a battery, a secondary battery, or an accumulator. The energy storage device 172 can be connected to the energy generation device 170, so that energy generated by the energy generation device 170, in particular electrical energy, can be or be stored in the energy storage device 172.

[0192] The orthosis 100 can have an output unit 166. The output unit 166 can be configured to output a signal or a message. The signal can be or include an acoustic signal, for example. The output unit 166 can be connected to the control unit 160. The control unit 160 can control the output unit 166 such that a specific signal and / or a specific message can be output.

[0193] In some embodiments, the output unit 166 may include a speaker. In some embodiments, the output unit 166 may include an LED. In some embodiments, the output unit 166 may include a display.

[0194] The output unit 166 can be used to communicate a state of the orthosis 100, the support zone 112, the memory element 116, a sensor, or the like to a user of the orthosis 100 and / or, for example, medical personnel. The output unit 166 can be used to communicate a state of a body part 120 to a user of the orthosis 100 and / or, for example, medical personnel. The message can include, for example, a force and / or pressure exerted by a support zone 112.

[0195] Alternatively or additionally, the output unit 166 can be used to communicate a technical error message or a maintenance message to a user of the orthosis 100 and / or, for example, medical personnel, for example, a component or part of the orthosis 100.

[0196] The features disclosed in the claims, the description, and / or the figures may be essential for the realization of the invention, individually or in any combination. List of reference symbols

[0197] 100 orthosis

[0198] 110 recording

[0199] 112 Support Zone

[0200] 113 Connecting element

[0201] 114 recess

[0202] 116 Memory element

[0203] 118 Adjustment device

[0204] 120 body part

[0205] 122 Nerv

[0206] 130 motion sensor

[0207] 132 pressure sensor

[0208] 134 strain gauges

[0209] 136 Light sensor

[0210] 138 optical sensor fibers

[0211] 140 recording unit

[0212] 142 Actual property

[0213] 144 Reference property

[0214] 146 Evaluation unit

[0215] 150 lighting device

[0216] 152 optical fibers

[0217] 154 Light source i6o control unit

[0218] 161 data storage

[0219] 162 Data transmission unit

[0220] 164 activation unit

[0221] 166 Output unit

[0222] 168 external device

[0223] 170 energy generating device

[0224] 172 Energy storage Magnet Coil Parallel kinematic machine Suspension Guide element Leg element Height adjustment Toothed rail

Claims

Claims:

1. An orthosis (100) comprising a support zone (112) configured to contact a body part (120), wherein the orthosis (100) comprises a deformable memory element (116) defining a shape and / or dimension of the support zone (112), and wherein the orthosis (100) and / or the memory element (116) comprises an adjustment device (118) configured to adjust the shape of the memory element (116).

2. Orthosis (100) according to claim 1, wherein at least a part or section of the support zone (112) is formed by the memory element (116), and / or wherein at least a part or section of the support zone (112) is or comprises the memory element (116).

3. Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) is designed such that the support zone (112) is stretched or extended upon deformation of the memory element (116).

4. Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) is configured such that when the support zone (112) contacts a body part (120), the support zone (112) exerts a force on the body part (120) due to the deformation of the memory element (116).

5. Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) comprises a motion sensor (130) configured to detect a movement of the body part (120) when the support zone (112) contacts a body part (120).

6. Orthosis (100) according to claim 5, wherein the adjustment device (118) is configured to deform the memory element (116) and / or adjust the shape of the memory element (116) depending on the detected movement of the body part (120).

7. Orthosis (100) according to one of the preceding claims, wherein the adjustment device (118) is integrated into the memory element (116).

8. Orthosis (100) according to one of the preceding claims, wherein the memory element (116) comprises a thermal memory element which is designed to assume a basic shape at a temperature equal to and / or greater than a limit temperature, and / or wherein the adaptation device (118) comprises a spring element.

9. Orthosis (100) according to claim 8, wherein the memory element (116) comprises a first layer and a second layer, wherein the first layer is or comprises the spring element, wherein preferably the first layer and / or the spring element comprises an elastic polymer, and wherein the second layer is adapted to cure at a temperature lower than the limit temperature.

10. Orthosis (100) according to one of the preceding claims, wherein the memory element (116) comprises an optical memory element, preferably a polymer material, which is designed to deform under the influence of light, preferably under UV light.

11. Orthosis (100) according to one of the preceding claims, wherein the adjustment device (118) comprises a lighting device (150) which is configured to illuminate the memory element (116).

12. Orthosis (100) according to claim 11, wherein the illumination device (150) comprises a light-conducting fiber (152, 153) which is configured to emit a different amount of light depending on the shape and / or dimension of the support zone (112), and / or to emit light with a different property, preferably with a different brightness, phase and / or wavelength, depending on the shape and / or dimension of the support zone.

13. Orthosis (100) according to claim 11 or 12, wherein the memory element (116) comprises at least two layers, and the illumination device (150) and / or the light-conducting fiber (152, 153) runs and / or is arranged between two layers of the memory element (116).

14. Orthosis (100) according to one of the preceding claims, wherein the memory element (116) is configured to deform under the influence of an electromagnetic wave, wherein preferably the adaptation device (118) is configured to apply an electromagnetic wave to the memory element (116). 15- Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) has a control unit (160) which is configured to control the adaptation device (118) in such a way that the memory element (116) is or becomes deformed.

16. Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) has at least one further deformable memory element (116) and at least one respective further adjustment device (118) for adjusting the shape of a respective further memory element (116), wherein preferably the orthosis (100) has at least one further support zone (112) and at least one of the further memory elements is arranged on, at or in at least one of the further support zones (112).

17. An orthosis (100) according to claim 16, wherein the shape of the memory element (116) and the shapes of each of the further memory elements are adjustable independently of one another.

18. Orthosis (100) according to one of the preceding claims, wherein the adjustment device (118) and / or the control unit (160) is configured to check the deformation of the memory element (116) for deviations from a or the predetermined deformation, preferably to check it repeatedly and / or regularly, and / or wherein the adjustment device (118) and / or the control unit (160) is configured to repeatedly and / or regularly adjust the deformation of the memory element (116).

19. Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) and / or the support zone (112) has a pressure sensor (132) which is configured to detect a load on the support zone (112), preferably to detect a pressure on or at the support zone (112), and / or wherein the adaptation unit (118) and / or the control unit (160) is configured to adapt the deformation of the memory element (116) as a function of a load on the support zone (112).

20. Orthosis (100) according to one of the preceding claims, wherein the memory element (116) comprises a strain gauge (134) and / or wherein a strain gauge (134) is arranged on or in the support zone (112), wherein preferably the adjustment unit (118) and / or the control unit (160) are configured to is arranged to adapt the deformation of the memory element (116) as a function of one or more measured values ​​detected by the strain gauge (134).

21. Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) has a data transmission unit (162) which is configured to receive data from an external device (168) and / or to transmit it to an external device (168), wherein the data preferably comprise data relating to the basic shape, in particular geometric data of the deformation.

22. Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) has an energy storage device (172) which is configured to supply the adjustment unit (118) with energy.

23. Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) comprises a light sensor (136).

24. Orthosis (100) according to one of the preceding claims, wherein the light sensor (136) comprises a light-conducting sensor fiber (138) which is configured to conduct light with different properties depending on the shape and / or dimension of the support zone, and / or wherein the light-conducting sensor fiber (138) is configured to conduct light with different properties depending on a load on the support zone.

25. Orthosis (100) according to claim 23 or 24, wherein the orthosis (100) has a detection unit (140) which is configured to detect light detected by the light sensor (136) and / or the light guided by the light-conducting fiber (152, 153), wherein the detection unit (140) preferably comprises a CMOS chip.

26. Orthosis (100) according to one of the preceding claims 23 to 25, wherein the orthosis (100) and / or the memory element (116) comprises at least two layers, and the light sensor (136) and / or the light-conducting sensor fiber (138) is arranged and / or runs between two of the layers.

27. Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) is adapted to be glued to a body part (120).

28. Orthosis (100) according to one of the preceding claims, comprising a receptacle (110) for a body part (120), wherein the receptacle (110) defines the support zone (112) so that when the body part (120) is received in the receptacle (110), the support zone (112) contacts the body part (120).

29. Orthosis (100) according to claim 28, wherein the receptacle (110) has two support zones (112) and the memory element (116) is or comprises an element connecting the two support zones (112).

30. Orthosis (100) according to one of the preceding claims 28 to 29, wherein the receptacle (110) is suspended from a suspension (181) by a parallel kinematic machine (180), preferably a hexapod, and / or is movably connected to the suspension (181).

31. Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) has a guide element (182) which guides a movement of the support zone (112) and / or of one or the receptacle (110), preferably a rotational movement of the support zone (112), and / or which is telescopic.

32. Orthosis (100) according to one of the preceding claims, orthosis (100) which has a plurality of interconnected receptacles (110) and / or interconnected support zones (112).

33. Orthosis (100) according to claim 32, wherein at least two of the receptacles (110) and / or at least two of the support zones (112) are spaced apart from one another by a recess (114).

34. Orthosis (100) according to claim 32 or 33, wherein at least two of the receptacles (110) and / or at least two of the support zones (112) are movable relative to one another, preferably rotatable relative to one another.

35. Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) comprises an energy generating device (170) configured to convert mechanical energy into electrical energy.

36. An orthosis (100) according to claim 34 with further reference to any one of claims 28 to 33, wherein the mechanical energy is provided by a movement of the receptacle (110), preferably a movement of the receptacle (110) relative to the energy generating device (170). 37- Orthosis (100) according to one of the preceding claims 35 to 36, wherein the energy generating device (170) comprises a magnet (174) and a coil (176), wherein upon movement of the receptacle (110) the magnet (174) is movable relative to the coil (176).

38. Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) has an activation unit (164) which is configured to transmit an impulse, preferably by means of an electric current, to a nerve of the body part (120) when the support zone (112) contacts a body part (120), and / or which is configured to activate a muscle of the body part (120), preferably by means of an electric current, when the support zone (112) contacts a body part (120).

39. Orthosis (100) according to one of the preceding claims, wherein the orthosis (100) has an output unit (166) for outputting a signal or a message.

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