Rotating polishing device
The compact rotating polishing device addresses the bulkiness and disassembly issues of existing devices by using a rotation unit with actuators and hinge joints, enabling efficient polishing and easy insertion into die cutters.
Patent Information
- Application Number
- PCT/DK2024/050161
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-07-30
- Filing Date
- 2024-07-03
- Publication Date
- 2025-02-06
AI Technical Summary
Existing rotating polishing devices are bulky and require partial disassembly of machines like die cutters to insert them into the gap between top and bottom platens, making the process time-consuming and requiring trained staff.
A compact rotating polishing device with a rotation unit featuring a top and bottom member, equipped with first and second actuators and hinge joints, allowing the polishing disk to rotate efficiently and be easily inserted into tight spaces without disassembly.
The device provides a reliable and efficient polishing action with high torque, especially at end positions, and allows for easy insertion into die cutters without disassembly, reducing operational time and staff requirements.
Smart Images
Figure DK2024050161_06022025_PF_FP_ABST
Abstract
Description
[0001] Rotating Polishing Device
[0002] Field of invention
[0003] The present invention relates to a rotating polishing device for polishing a surface, said polishing device comprising a rotation unit configured to receive and rotate the polishing disk, wherein the rotation unit and has a top member and a parallel bottom member. In one embodiment, the rotating polishing device is configured for polishing a first surface being spaced from a second surface by using a polishing disk. The rotating polishing device can by way of example be used for polishing surfaces that extend parallel to each other.
[0004] Prior art
[0005] It is known to apply rotating polishing device for polishing surfaces of various machines such as die cutting machines with platen, in which the rotating polishing device is required to be placed in a gap between two surfaces to be by polished.
[0006] The prior art solutions take up much space (are thick). Accordingly, many machines including die cutters must be partly disassembled in order to allow insertion of a polishing device into the gap between the top platen and the bottom platen.
[0007] This procedure is time consuming and requires trained staff. Accordingly, it would be desirable to have an alternative solution.
[0008] US 2017 / 0014870 Al discloses a device for cleaning a platen of a platen press having a lower and an upper platen of which at least one is movable towards the other. The device includes a frame having a base defining a base plane substantially parallel to a surface on which the frame is positioned, a lift member arranged to the frame to allow that a relative movement can be executed between the frame and the lift member in a direction substantially perpendicular to the base plane. The device comprises a pneumatic lifting device for moving the frame relative to the lift member. The device comprises a rotating element arranged on the lift member and configured to rotate around an axis substantially parallel to the direction of relative movement between the frame and the lift member. It would, however, be an advantage to be able to reduce the height (thickness) of the device to achieve a more compact design.
[0009] Thus, there is a need for a rotating polishing device which reduces or even eliminates the above mentioned disadvantages of the prior art.
[0010] It is an objective of the invention to provide a rotating polishing device that can be inserted into a flatbed die cutter without being partly disassembled in advance to allow insertion of a polishing device into the gap between the top platen and the bottom platen.
[0011] Summary of the invention
[0012] The object of the present invention can be achieved by a rotating polishing device as defined in claim 1. Preferred embodiments are defined in the dependent subclaims, explained in the following description and illustrated in the accompanying drawings.
[0013] The rotating polishing device according to the invention is a rotating polishing device for polishing a first surface by using a polishing disk, said polishing device comprising: a rotation unit configured to receive and rotate the polishing disk, wherein the rotation unit has a top member and a bottom member extending along a longitudinal axis of the polishing device and a lateral axis of the polishing device, wherein the rotation unit comprises:
[0014] - a first actuator extending parallel to the top member, a first hinge joint connected to the first actuator, wherein the first actuator is arranged and configured to: a) rotate the polishing disk in a first direction when being extended and b) rotate the polishing disk in the opposite direction when being re- tracted,
[0015] - a second actuator and a second hinge joint connected to the second actuator, wherein the second actuator is arranged and configured to:
[0016] - rotate the polishing disk in the opposite direction when being extended and
[0017] - rotate the polishing disk in the first direction when being retracted, wherein the first hinge joint is attached to the second hinge joint, wherein a distal end of the first hinge joint is slidably connected to a guide structure configured to move the distal end of the first hinge joint along a section of a circle, wherein a second hinge joint connected to the second actuator, a distal end of the second hinge joint is slidably connected to the guide structure, wherein the distal end of the first hinge joint and the distal end of the second hinge joint is connected to the same attachment structure that is slidably attached to a groove structure in the guide structure.
[0018] Hereby it is possible to reduce the height (thickness) of the polishing device and hereby provide a more compact design. It is in particular possible to provide a rotating polishing device that can be inserted into a flatbed die cutter without being partly disassembled in advance to allow insertion of a polishing device into the gap between the top platen and the bottom platen.
[0019] The polishing device is capable of providing a very large torque when the polishing disk is in its end positions, in which the speed of the polishing disk is zero. Accordingly, the polishing device provides a reliable rotation of the polishing disk.
[0020] In an embodiment, the rotating polishing device is designed for polishing a first surface being spaced from a second surface by using a polishing disk. The rotating polishing device can be used to polish a first surface of a die cutter extending parallel and being spaced from a second surface of the die cutter. The polishing device is configured to polish both a bottom platen and a top platen. This can be done by: a) initially polishing the bottom platen, b) turning the polishing device upside down and hereby arrange the polishing device to polish the top platen and then polishing the top platen.
[0021] When applying prior art polishing devices, this will typically require, that the polishing device is disassembled, turned upside down og then assembled. The invention, however, solves this problem by providing a rotating polishing device that can be inserted into a flatbed die cutter without being partly disassembled in advance to allow insertion of a polishing device into the gap between the top platen and the bottom platen.
[0022] The rotation unit configured to receive and rotate the polishing disk. The rotation unit may be provided with fixation elements arranged and configured to engage with and hereby allow corresponding fixation elements of the polishing disk to provide a detachably attachment of the polishing disk to the rotation unit. Hereby, the polishing disk can be detachably attached to the rotation unit. The polishing disk can easily be detached from the rotation unit and be replaced with another (e.g. if the polishing disk is worn or damaged).
[0023] The rotation unit has a top member. The top member would typically constitute the top of the rotation unit.
[0024] The rotation unit has a bottom member and a top member. In an embodiment, the bottom member extends parallel or basically parallel to the top member.
[0025] The top member and the bottom member extend along a longitudinal axis of the polishing device and a lateral axis of the polishing device, wherein the longitudinal axis extends perpendicular to the lateral axis. In an embodiment, the rotation unit comprises no connection structure. In this embodiment, a load (providing a downward directed force) is placed on the top of the rotation unit in order to provide a higher polishing pressure.
[0026] In an embodiment, the rotation unit comprises a centrally arranged rotating member which is arranged and configured to detachably receive a plate of the rotating polishing device, wherein the plate is configured to receive and rotate the polishing disk, and wherein the plate is fixed to the slidable attachment structure.
[0027] In an embodiment, the rotation unit comprises a connection structure configured to bear against and apply a polishing pressure towards the second surface while being moved along the second surface. Hereby, the connection structure ensures that the polishing disk is kept in contact with the surface to be polished. Moreover, the connection structure ensures that the polishing disk is pressed towards the surface to be polished with a sufficiently large pressure. In an embodiment, the connection structure is configured to ensure that the polishing disk is pressed towards the surface to be polished with a pressure exceeding a predefined pressure level.
[0028] In the embodiment, in which the rotation unit and the connection structure are detachably attached to each other, it is possible to insert them into the gap between the first surface and the second surface one by one. This is a major advantage and makes it possible to insert the polishing device into die cutters without disassembling structures that are required to disassemble when using the in the prior art polishing device polishing device.
[0029] In an embodiment, the rotating polishing device is configured for polishing the first surface being spaced from a second surface by using a polishing disk, said polishing device comprising: a connection structure configured to bear against the second surface while being moved along the second surface, wherein the rotation unit and the connection structure are detachably attached to each other.
[0030] It is an advantage that the polishing device comprises a first actuator and a second actuator, wherein the first actuator and the second actuator extend parallel to the top member.
[0031] The first actuator is arranged and configured to rotate the polishing disk in a first direction when the first actuator is extended. The second actuator is arranged and configured to rotate the polishing disk in the opposite direction when the second actuator is extended. When the first actuator is extended the first actuator will push while the second actuator is retracted and pulls.
[0032] In an embodiment, the first actuator and the second actuator are angled relative to each other with an angle in the range 4-45 degrees.
[0033] In an embodiment, the first actuator and the second actuator are angled relative to each other with an angle in the range 5-30 degrees.
[0034] In an embodiment, the first actuator and the second actuator are angled relative to each other with an angle in the range 5-20 degrees.
[0035] In an embodiment, the first actuator and the second actuator are angled relative to each other with an angle in the range 7-15 degrees.
[0036] In an embodiment, the first actuator and the second actuator are typically spaced from each other.
[0037] The first actuator is arranged and configured to: a) rotate the polishing disk in a first direction when being extended and b) rotate the polishing disk in the opposite direction when being re- tracted.
[0038] In an embodiment, the polishing device comprises an arm connected to and extending from the rotation unit. The arm may be referred to as a rod member.
[0039] In an embodiment, the polishing device comprises an arm connected to and extending from the connection structure.
[0040] In an embodiment, the rotation unit is box-shaped.
[0041] It is an advantage that the rotation unit comprises a second actuator and a second hinge joint connected to the second actuator, wherein the second actuator is arranged and configured to: a) rotate the polishing disk in the opposite direction when being extended and b) rotate the polishing disk in the first direction when being retracted.
[0042] It is beneficial that the first hinge joint is attached to the second hinge joint).
[0043] In an embodiment, a rotating member is arranged centrally in the rotation unit.
[0044] In an embodiment, the rotating member is arranged between the first actuator and the second actuator.
[0045] In an embodiment, the rotating member comprises: a) a centrally arranged inner cylinder having a circular cross section and b) an outer cylinder having a circular cross section c) inner annular member of rotatably mounted balls.
[0046] In an embodiment, the rotating member comprises a radial plain bearing. In an embodiment, the rotating member comprises a thrust bearing (axial bearing) designed to withstand an axial load (thrust load). In an embodiment, thrust bearing is a thrust ball bearing comprising bearing balls supported in a ring.
[0047] In an embodiment, the ring is arranged and configured to function as a radial plain bearing.
[0048] In an embodiment, the inner annular member is surrounded by an outer annular member of rotatably mounted balls.
[0049] The polishing disk is intended to be fixed to an attachment structure (typically a plate) provided with attachment elements. These attachment elements may be provided as holes. In another embodiment, however, the attachment elements are formed as pins.
[0050] In an embodiment, the rotation unit comprises an outer ring provided with a plurality of rotatably mounted balls that are distributed along the periphery of the outer ring, wherein each actuator is sandwiched between the top member and the outer ring. The balls are guided by the holes in the outer ring. The outer ring constitutes a radial plain bearing.
[0051] In an embodiment, the rotation unit comprises an outer ring provided with a plurality of rotatably mounted ball that are evenly distributed along the periphery of the outer ring, wherein the at least one actuator is sandwiched between the top member and the outer ring.
[0052] In an embodiment, the outer ring surrounds the rotating member.
[0053] It is an advantage that a distal end of the first hinge joint is slidably connected to a guide structure configured to move the distal end of the first hinge joint along a section of a circle, wherein if the rotation unit comprises a second actuator and a second hinge joint connected to the second actuator, a distal end of the second hinge joint is slidably connected to the guide structure.
[0054] It is an advantage that the distal end of the first hinge joint and the distal end of the second hinge joint are connected to the same attachment structure that is slidably attached to a groove structure in the guide structure.
[0055] In an embodiment, the at least one of the actuators is a pneumatic actuator. In an embodiment, the at least one of the actuators is an electrical actuator. In an embodiment, the at least one of the actuators is a hydraulic actuator.
[0056] In an embodiment, the connection structure is height adjustable.
[0057] Description of the Drawings
[0058] The invention will become more fully understood from the detailed description given herein below. The accompanying drawings are given by way of illustration only, and thus, they are not limitative of the present invention. In the accompanying drawings:
[0059] Fig. 1 shows a perspective bottom view of a polishing device according to the invention;
[0060] Fig. 2 shows some of the components of the polishing device shown in Fig. 1;
[0061] Fig. 3A shows a schematic, cross-sectional view of a polishing device according to the invention arranged in a gap inside a machine to be polished;
[0062] Fig. 3B shows a schematic, cross-sectional view of another polishing device according to the invention arranged in a gap of a machine to be polished;
[0063] Fig. 3C shows a schematic, cross-sectional view of a further polishing device according to the invention arranged on a surface to be polished;
[0064] Fig. 4A shows a perspective bottom view of the polishing device shown in Fig. 1;
[0065] Fig. 4B shows a perspective top view of the polishing device shown in Fig. 4A;
[0066] Fig. 5A shows some of the components of a polishing device according to the invention in a first configuration;
[0067] Fig. 5B shows the polishing device shown in Fig. 5A in another configuration;
[0068] Fig. 6A shows some of the components of a polishing device according to the invention in a first configuration;
[0069] Fig. 6B shows the polishing device shown in Fig. 6A in another configuration;
[0070] Fig. 7A shows a force diagram for a hinge joint of a polishing device according to the invention in a first configuration;
[0071] Fig. 7B shows another force diagram for the hinge joint shown in Fig. 7A;
[0072] Fig. 7C shows a torque diagram for a hinge joint of a polishing device according to the invention;
[0073] Fig. 8A shows the actuators and the hinge joint arms of the polishing device according to the invention in a first configuration in a first configuration, in which the first cylinder is retracted and the second cylinder is extracted;
[0074] Fig. 8B shows the actuators and the hinge joint arms of the polishing device according to the invention in a first configuration in a second intermediate configuration and
[0075] Fig. 8C shows the actuators and the hinge joint arms of the polishing device according to the invention in a first configuration in a third configuration, in which the first cylinder is extracted and the second cylinder is retracted,
[0076] Fig. 9A shows a perspective view of a polishing device according to the invention;
[0077] Fig. 9B shows a close-up view of an attachment structure of the polishing device shown in Fig. 9A;
[0078] Fig. 9C shows a close-up view of rotating member of the polishing device shown in Fig. 9A; Fig. 10A shows essential mechanical structures of a polishing device according to the invention;
[0079] Fig. 10B shows a close-up view of an attachment structure of the polishing device shown in Fig. 10A;
[0080] Fig. 11A shows a cross-sectional view of a rotation unit of a polishing device according to the invention and
[0081] Fig. 11B shows a close-up view of the portion of the rotation unit shown in Fig. 11A.
[0082] Detailed description of the invention
[0083] Referring now in detail to the drawings for the purpose of illustrating preferred embodiments of the present invention, a polishing device 2 of the present invention is illustrated in Fig. 1.
[0084] Fig. 1 illustrates a perspective bottom view of a polishing device 2 according to the invention. The polishing device 2 comprises a rotation unit 6 arranged and configured to rotate a polishing disk 5 constituting an end portion of the polishing device 2. The polishing disk 5 is designed to polish a surface (typically a metal surface) of a machine having a first plate (see Fig. 3A and Fig. 3B) extending parallel to and being spaced from a second plate (see Fig. 3A and Fig. 3B). The rotation unit 6 is mechanically connected to the polishing disk 5 and transfer torque to the polishing disk 5. The rotation unit 6 is configured to rotate the polishing disk 5 a predefined angles clockwise and counterclockwise. In an embodiment the angle range is between 5 and 40 degrees. In an embodiment the angle range is between 10 and 30 degrees. The polishing device 2 comprises a plate 4 configured to receive the polishing disk 5. The plate 4 may be provided with attachment structures (e.g. hook- and-loop fasteners known under the brand Velcro ®).
[0085] The polishing device 2 comprises a connection structure 8 configured to bear against the surface of the first plate while being moved along the second plate as shown in and explained with reference to Fig. 3A. The polishing device 2 comprises an arm (also referred to as a rod member) 10 connected to and extending from the rotation unit 6. In another embodiment, the rod member 10 may be connected to and extend from the connection structure 8.
[0086] The rod member 10 is connected to the rotation unit 6 by using a joint 12.
[0087] The rotation unit 6 and the connection structure 8 are detachably attached to each other. Accordingly, it is possible to: a) place the rotation unit 6 in the gap between the first plate and the second plate (see fig. 3A and Fig. 3B); b) place the connection structure 8 in the gap between the first plate and the second plate (see fig. 3A and Fig. 3B) and c) assemble the rotation unit 6 and the connection structure 8 by detachably attaching the rotation unit 6 and the connection structure 8.
[0088] The rotation unit 6 is box-shaped (the rotation unit 6 may, however, have another shape) and has a top member and a bottom member extending (not shown in Fig. 1) parallel to the top member 90 extending along a longitudinal axis X of the polishing device 2 and a lateral axis Y of the polishing device 2. The transversal axis Z of the polishing device 2 is indicated in Fig. 1. The transversal axis Z extends perpendicular to the longitudinal axis X and the lateral axis Y.
[0089] The rod member 10 extends along the longitudinal axis X of the polishing device 2. In an embodiment, the rod member 10 comprises several segments being attached to each other. Accordingly, the rod member 10 can be assembled and disassembled (during storage and transportation). In another embodiment, the rod member 10 comprises a single segment only.
[0090] Fig. 2 illustrates some of the components of the polishing device 2 shown in Fig. 1. In Fig. 2 the components inside the rotation unit 6 are visible because the bottom member has been removed. The rotation unit 6 comprises a first pneumatic actuator 30 and a second pneumatic actuator 30' arranged on opposite sides of a centrally arranged rotating member 22.
[0091] The polishing device 2 comprises a rod member 10 connected to and extending from the rotation unit 6. The rod member 10 is connected to the rotation unit 6 by using a joint 12.
[0092] The rotating member 22 comprises a centrally arranged inner cylinder (having a circular cross section) 64 and an outer cylinder (having a circular cross section) 64'.
[0093] The rotating member 22 is designed as a radial plain bearing comprising an inner annular member of balls 29 surrounded by an outer annular member of balls 29' guided by holes provided in the rotating member 22 (see Fig. 9A and Fig. 9C). The rotating member 22 is arranged and configured to detachably receive a rotate a polishing disk 5 as the one shown in and explained with reference to Fig. 1. The polishing disk 5 is intended to be fixed to an attachment structure 34 provided with attachment elements 72, 72', 78. In Fig. 2 these attachment elements 72, 72', 78 are provided as holes configured to receive attachment elements formed as pins or bolts.
[0094] The inner cylinder 64 supports and constitutes a basis for mounting the balls 29'. The inner cylinder 64 is designed to axially transferring force towards the polishing disk 5.
[0095] The attachment structure 34 is slidably mounted in a guide structure 36. The attachment structure 34 is designed as a cylindrical pin member. In an embodiment, the guide structure 36 is made of plastic or bronze.
[0096] A better view of the guide structure 36 can be seen in Fig. 5A and in Fig. 5B. The guide structure 36 is configured to guide the attachment structure 34 along a circular arched path constituting the inner portion of the guide structure 36. Accordingly, the attachment structure 34 will be moved along the circular arched path of the guide structure 36.
[0097] The guide structure 36 is provided on a mounting structure 50 (sliding plate) attached to an underlaying structure top member 90 by using several pins 48.
[0098] The attachment structure 34 is rotatably attached to the distal end of a first hinge joint arm 32 that is rotatably attached to the distal end of a first pneumatic actuator 30. A second hinge joint arm 31 is rotatably attached to the distal end of the first pneumatic actuator 30 and to a base member 54 (sliding plate) that is attached to the underlaying structure (a top member and a bottom member) by using one or more bolts or pins 46. The first pneumatic actuator 30 is attached to the underlaying structure by using a bolt or pin 44. The second hinge joint arm 31 (connected to the first actuator 30) is rotatably attached to a first pivot 11. The second hinge joint arm 31' (connected to the second actuator 30') is rotatably attached to a second pivot 11'.
[0099] A first valve member 52 is configured to be connected to the valve connection 18. The second valve member 52' is connected to the valve connection 16. Each valve member 52, 52' is designed as a pneumatic valve that is configured to provide the energy in the form of pressurized air to change the rotational direction of the polishing disk.
[0100] At the same time, the attachment structure 34 is rotatably attached to the distal end of a first hinge joint arm 32' that is rotatably attached to the distal end of a second pneumatic actuator 30'. A second hinge joint arm 31' is rotatably attached to the distal end of the second pneumatic actuator 30' and to a base member 54' that is attached to the underlaying structure by using one or more pins 46'. Like the first pneumatic actuator 30, the second pneumatic actuator 30' is attached to the un- derlaying structure by using a pin 44'.
[0101] The first pneumatic actuator 30 comprises a first port 28 and a second port 26. The ports 26, 28 are arranged and configured to be connected to corresponding valve connections 20, 20'.
[0102] Likewise, the second pneumatic actuator 30' comprises a first port 28' and a second port 26'. The ports 26', 28' are arranged and configured to be connected to corresponding valve connections 20, 20'.
[0103] A valve connection 15 protrudes from the valve housing 14. This connection valve connection 15 is arranged and configured to be connected to a pressurised tube (not shown) of a pressure source. No tubes are shown. In practice, however, tubes should connect some of the valves.
[0104] The actuators 30, 30' may be replaced by electrical actuators or hydraulic actuators if desired.
[0105] The first actuator 30 extends parallel to the bottom member of the rotation unit 6. The arms 31, 32 constitute a first hinge joint 33 that is connected to the first actuator 30.
[0106] The second actuator 30' extends parallel to the bottom member of the rotation unit 6. The arms 31', 32' constitute a second hinge joint 33' that is connected to the second actuator 30.
[0107] The first actuator 30 is arranged and configured to: a) rotate the polishing disk 5 in a first direction when being extended and b) rotate the polishing disk 5 in the opposite direction when being retracted.
[0108] The second actuator 30' is arranged and configured to: a) rotate the polishing disk 5 in the first direction when being retracted and b) rotate the polishing disk 5 in the opposite direction when being extended.
[0109] By constructing the rotation unit 6 in this manner it is possible to minimize the thickness of the rotation unit 6. Thus, the invention makes it possible to provide a polishing device 2 that is thinner than the prior art polishing devices. Even though the polishing device 2 is very thin, it is possible to provide an efficient polishing device. Moreover, it is possible to achieve a uniform polishing torque characteristic.
[0110] Fig. 3A illustrates a schematic, cross-sectional view of a polishing device according to the invention arranged in a gap 60 inside a machine to be polished. The machine comprises a first surface 40 referred to as a bottom plate 40. The machine comprises a second plate referred to as a top platen 40' that extends basically parallel to the bottom platen 40. The machine is configured to polish the bottom platen 40. In the configuration illustrated in Fig. 3A, the polishing device is arranged to polish the bottom platen 40. The machine may be a die cutter, a punching machine or a plywood press by way of example.
[0111] The polishing device comprises a rotation unit 6 comprising a plate 4 that is mechanically connected to a polishing disk 5 and to transfer torque to the polishing disk 5.
[0112] The polishing device comprises a connection structure 8 configured to bear against the surface of the top platen 40' while being moved along the bottom platen 40.
[0113] The rotation unit 6 and the connection structure 8 are configured to be detachably attached to each other. Therefore, the rotation unit 6 can be placed in the gap 60 between the bottom platen 40 and the top platen 40'. In practice one can place the connection structure 8 and the rotation unit 6 one by one in the gap 60 and hereafter assemble the rotation unit 6 and the connection structure 8 by detachably attaching the rotation unit 6 and the connection structure 8. Accordingly, the polishing device can be inserted into the gap 60 in a disassembled configuration even if the polishing device cannot be inserted into the gap 60 in an assembled configuration.
[0114] In an embodiment, the rotation unit 6 is box-shaped (the rotation unit 6 may, however, have another shape) and has a top member and a bottom member extending basically parallel to the top member extending along a longitudinal axis of the polishing device.
[0115] The connection structure 8 comprises several tubular structures 80 protruding from an intermediate member 82 resting on the rotation unit 6. The intermediate member 82 may comprise a plate-shaped section. In an embodiment, the intermediate member 82 comprises receiving structures arranged and configured to receive and maintain a tubular structure 80 in a fixed position. In an embodiment, the tubular structures 80 are designed as pipes (e.g. made of a metal). In an embodiment, the tubular structures 80 are steel tubes or steel rods.
[0116] A contact element 80' may be provided at the distal end of each tubular structure 80. In an embodiment, the contact element 80' is equipped with one or more rotatably mounted contact structures (e.g. one or more rotatably mounted balls) allowing the polishing device to be moved along the surface of the top platen 40'. By having one or more rotatably mounted contact structures the friction between the polishing device and the top platen 40' can be reduced. Accordingly, the polishing device can be moved along the surface of the top platen 40' by the force provided by a human operator handling the polishing device.
[0117] The contact element 80' is configured to bear against the top platen 40' and hereby provide a reaction force directed towards the bottom platen 40. Accordingly, the polishing disk 5 will polish the surface of the bottom platen 40 in an efficient manner.
[0118] In an embodiment, the contact element 80' is configured to be extended or compressed (extracted) and hereby change the length of the contact element 80'.
[0119] In an embodiment, the tubular structure 80 is configured to be extended or compressed (extracted) and hereby change the length of the tubular structure 80.
[0120] In an embodiment, the tubular structure 80 has a fixed length.
[0121] In an embodiment, the contact element 80' has a fixed length.
[0122] Hereby, it is possible to adjust the height of the connection structure 8. Accordingly, the length of the connection structure 8 can be adjusted to ensure that the connection structure 8 bears against the top platen 40'.
[0123] Fig. 3B illustrates a schematic, cross-sectional view of another polishing device according to the invention arranged in a gap 60 of a machine to be polished. The machine comprises a bottom platen 40 and a top plate 40' extending parallel to the bottom platen 40 is configured to polish the bottom platen 40. In the configuration illustrated in Fig. 3B, the polishing device is arranged to polish the bottom platen 40. It is, however, possible to turn the polishing device upside down and hereby arrange the polishing device to polish the top platen 40'. This will typically require, that the polishing device is disassembled, turned upside down og then assembled.
[0124] The polishing device comprises a rotation unit 6 comprising a plate 4 that is mechanically connected to a polishing disk 5 and to transfer torque to the polishing disk 5. The rotation unit 6 may correspond to the one shown in and explained with reference to Fig. 3A. The polishing device comprises a connection structure 8 configured to bear against the surface of the top platen 40' while being moved along the bottom platen 40. The connection structure 8, however, differs from the one shown in Fig. 3A.
[0125] In an embodiment, the contact element 80' comprises balls or rollers arranged in a contact assembly bearing against the top platen 40'. Accordingly, the balls or rollers of the contact assembly enables the connection structure 8 to be easily moved along the top platen 40'.
[0126] The rotation unit 6 and the connection structure 8 are configured to be detachably attached to each other. Therefore, the rotation unit 6 can be placed in the gap 60 between the bottom platen 40 and the top platen 40'.
[0127] The connection structure 8 and the rotation unit 6 can be placed in the gap 60 one by one. Hereafter, connection structure 8 and the rotation unit 6 can be assemble by detachably attaching the rotation unit 6 and the connection structure 8. Accordingly, the polishing device can be inserted into the gap 60 in a disassembled configuration even if the polishing device cannot be inserted into the gap 60 in an assembled configuration.
[0128] In an embodiment, the rotation unit 6 is box-shaped and has a top member and a bottom member extending parallel to the top member extending along a longitudinal axis of the polishing device.
[0129] The connection structure 8 is formed as a scissors mechanism comprising an intermediate member 82 resting on the rotation unit 6. The intermediate member 82 may comprise a plate-shaped section. The scissors mechanism comprises a top connection part 84 that is arranged and configured to bear against the top platen 40'. In an embodiment, the top connection part 84 comprises a plate section. In an embodiment, the top connection part 84 is formed as a plate. In an embodiment, the connection structure is formed as a combination of a scissors mechanism and one or more several tubular structures. The tubular structures protruding from an intermediate member (comprise a plate-shaped section) resting on the rotation unit. The intermediate member may comprise a plate-shaped section.
[0130] In an embodiment, the top connection part 84 is equipped with one or more rotatably mounted contact structures (e.g. one or more rotatably mounted balls) allowing the polishing device to be moved along the surface of the top platen 40'. By having one or more rotatably mounted contact structures the friction between the polishing device and the top platen 40' can be reduced. Accordingly, the polishing device can be moved along the surface of the top platen 40' by the force provided by a human operator handling the polishing device.
[0131] The top connection part 84 is configured to bear against the top platen 40' and hereby provide a reaction force directed towards the bottom platen 40. Accordingly, the polishing disk 5 will polish the surface of the bottom platen 40 in an efficient manner.
[0132] The scissors mechanism is configured to be extended or extracted and hereby change the height of the scissors mechanism.
[0133] Hereby, it is possible to adjust the height of the connection structure 8. Accordingly, the length of the connection structure 8 can be adjusted to ensure that the connection structure 8 bears against the top plate 40'.
[0134] Fig. 3C illustrates a schematic, cross-sectional view of a further polishing device according to the invention arranged on a surface 40 to be polished. The polishing device comprises a rotation unit 6 comprising a plate 4 that is mechanically connected to a polishing disk 5 and to transfer torque to the polishing disk 5. A load 94 is placed on the top of the rotation unit 6 to provide a higher polishing pressure. The load 94 may be replaced with another load if required. In some application, no load is required as the weight of the rotation unit 6 and the polishing disk 5 provides a sufficient polishing pressure.
[0135] Fig. 4A illustrates a perspective bottom view of the polishing device 2 shown in Fig. 1. The polishing device 2 comprises a rotation unit 6 comprising a plate 4 that is arranged and configured to rotate a polishing disk 5 constituting an end portion of the polishing device 2. The polishing disk 5 is designed to polish a surface of a machine having a first platen being spaced from a second platen as shown in Fig. 3A and Fig. 3B. The first platen may extend parallel to the second platen. The plate 4 comprises attachment structures (not shown) e.g. hook-and-loop fasteners known under the brand Velcro ®.
[0136] The rotation unit 6 is mechanically connected to the plate 4 and transfer torque to the polishing disk 5. The rotation unit 6 is configured to rotate the plate 4 about the transversal axis Z of the of the polishing device 2. In an embodiment, the polishing disk 5 is mechanically connected to the plate 4 of the rotation unit 6 by using hook-and-loop fastener (marketed under the registered trademark Velcro ®).
[0137] The rotation unit 6 comprises a top member 90 and a bottom member 92. The orientation of the top member 90 and the bottom member 92 depends on the actual task (if the top platen or the bottom platen is published).
[0138] The rotation unit 6 is configured to rotate the plate 4 and thus the polishing disk 5 a predefined angles clockwise and counterclockwise. In an embodiment the angle range is between 5 and 40 degrees. In an embodiment the angle range is between 10 and 30 degrees.
[0139] The polishing device 2 comprises a connection structure (not shown in Fig. 4) that is configured to bear against the surface of the first plate while being moved along the second plate as shown in and explained with reference to Fig. 3A and Fig. 3B. The polishing device 2 comprises a rod member 10 connected to and extending from the rotation unit 6. In another embodiment, the rod member 10 may be connected to and extend from the connection structure 8. The rod member 10 is connected to the rotation unit 6 by using a joint 12.
[0140] The rod member 10 extends along the longitudinal axis X of the polishing device 2. In an embodiment, the rod member 10 comprises several segments being attached to each other. Accordingly, the rod member 10 can be assembled and disassembled (during storage and transportation). In another embodiment, the rod member 10 comprises a single segment only.
[0141] The rotation unit 6 is basically box-shaped and has a bottom member having a lower surface 62. The plate 4 is rotatably mounted to the rotation unit 6. The plate 4 comprises a centrally arranged circular opening surrounded by the inner cylinder 64 of the rotation unit 6.
[0142] The plate 4 comprises a plurality of grooves 58 that are provided in an annular configuration along the circular opening of the plate 4. The grooves 58 are arranged and configured to receive corresponding rotatably mounted balls 29 (shown in Fig. 2). The outer annular member of balls 29' shown in Fig. 2 are arranged and configured to bear against the plate 4 and hereby facilitate rotation of the plate 4 relative to the fixed part of the rotating member 22.
[0143] The plate disk 4 comprises three holes 72, 72', 74. A first threaded bore 72 is arranged and configured to receive a bolt or pin. Likewise, a second threaded bore 72' is arranged and configured to receive a bolt or pin. A pin or bolt can be inserted into the third hole 74. Accordingly, the plate 4 can be attached to the attachment structure 34 in an easy and reliable manner. Fig. 4B illustrates a perspective top view of the polishing device 2 shown in Fig. 4A. It can be seen that the polishing device 2 comprises a rotatably mounted plate structure 96. This plate structure 96 having a distal end that is slidably arranged in a groove structure 35' of a guide structure 36'. The groove structure 35' ad the guide structure 36' correspond to the ones shown in and explained with reference to Fig. 2, Fig. 5A, Fig. 5B, Fig. 9A, Fig. 9B, Fig. 10 and Fig. 10B.
[0144] The distal part of the plate structure 96 is attached to an attachment structure by using attachment elements inserted through the holes 72, 72', 74.
[0145] Fig. 5A illustrates some of the components of a polishing device 2 according to the invention in a first configuration. Fig. 5B illustrates the polishing device 2 shown in Fig. 5A in another configuration, polishing device 2 basically corresponds to the one shown in and explained with reference to Fig. 2.
[0146] The components inside the rotation unit 6 are visible because the bottom member has been removed. The rotation unit 6 comprises a first pneumatic actuator 30 and a second pneumatic actuator 30' arranged on opposite sides of a centrally arranged rotating member 22.
[0147] The rotating member 22 comprises a centrally arranged inner cylinder and an outer cylinder. The rotating member 22 comprises an inner annular member of balls surrounded by an outer annular member of balls. The rotating member 22 is arranged and configured to detachably receive a rotate a plate 4 as the one shown in and explained with reference to Fig. 1 and Fig. 4. The balls may be mounted in a disk-shaped plate provided with openings designed to receive the balls. The plate 4 is intended to be fixed to the attachment structure 34 that is slidably mounted in a guide structure 36. The guide structure 36 is configured to guide the attachment structure 34 along a circular arched path constituting an inner groove structure 35 of the guide structure 36. Accord- ingly, the attachment structure 34 will be moved along the circular arched groove structure 35 of the guide structure 36.
[0148] The attachment structure 34 is rotatably attached to the distal end of a first hinge joint arm that is rotatably attached to the distal end of a first pneumatic actuator 30. A second hinge joint arm is rotatably attached to the distal end of the first pneumatic actuator 30 and to a base member that is attached to the underlaying structure (the top member). The first pneumatic actuator 30 is attached to the underlaying structure.
[0149] At the same time, the attachment structure 34 is rotatably attached to the distal end of a first hinge joint arm that is rotatably attached to the distal end of a second pneumatic actuator 30'. A second hinge joint arm is rotatably attached to the distal end of the second pneumatic actuator 30' and to a base member that is attached to the underlaying structure. Like the first pneumatic actuator 30, the second pneumatic actuator 30' is attached to the underlaying structure.
[0150] The first pneumatic actuator 30 comprises an air inlet port and an air outlet port that are arranged and configured to be connected to corresponding ports of a housing.
[0151] Likewise, the second pneumatic actuator 30' comprises an air inlet port and an air outlet port arranged and configured to be connected to corresponding ports of the housing.
[0152] A connection valve protrudes from the housing. This connection valve is arranged and configured to be connected to a pressurised tube (not shown) of a pressure source.
[0153] The polishing device 2 comprises a rod member 10 connected to and extending from the rotation unit 6. The rod member 10 is connected to the rotation unit 6 by using a joint 12. The first actuator 30 extend parallel to the bottom member and the top member of the rotation unit 6. The arms that are attached to the first actuator 30 constitute a first hinge joint.
[0154] The second actuator 30' extend parallel to the bottom member of the rotation unit 6. The arms that are attached to the second actuator 30 constitute a second hinge joint.
[0155] The first actuator 30 is arranged and configured to: a) rotate the polishing disk in a first direction when being extended and b) rotate the polishing disk in the opposite direction when being retracted.
[0156] The second actuator 30' is arranged and configured to: a) rotate the polishing disk in the first direction when being retracted and b) rotate the polishing disk in the opposite direction when being extended.
[0157] By constructing the rotation unit 6 in this manner it is possible to minimize the thickness of the rotation unit 6. Thus, the invention makes it possible to provide a polishing device 2 that is thinner than the prior art polishing devices.
[0158] In Fig. 5A, the first actuator 30 is fully retracted while the second actuator 30' is fully extended. Accordingly, the attachment structure 34 is arranged in the leftmost position in the guide structure 36.
[0159] In Fig. 5B, the first actuator 30 is fully extended while the second actuator 30' is fully retracted. Accordingly, the attachment structure 34 is arranged in the rightmost position in the guide structure 36.
[0160] The actuators 30, 30' are arranged and configured to rotate the polishing disk between a first angular position (corresponding to the configu- ration shown in Fig. 5A) and a second angular position (corresponding to the configuration shown in Fig. 5B).
[0161] The distal end of the first actuator 30 is attached to the corresponding hinge by using a pin 66. It is, however, possible to use alternative attachment structures. The distal end of the second actuator 30' is attached to the corresponding hinge by using a pin 66'. It is, however, possible to use alternative attachment structures.
[0162] The rotating unit 6 comprises an outer ring 86 provided with a plurality of balls 88 that are rotatably mounted in mounting grooves provided in the outer ring 86. Accordingly, the polishing disk bears against these rotatably mounted balls 88. This construction facilitates a smooth rotation of the polishing disk relative to the rotation unit 6.
[0163] Fig. 6A illustrates some of the components of a polishing device 2 according to the invention in a first configuration. Fig. 6B illustrates the polishing device 2 shown in Fig. 6A in another configuration. The polishing device 2 basically corresponds to the one shown in and explained with reference to Fig. 5A and Fig. 5B. The outer ring shown in Fig. 5 and Fig. B has, however, been removed.
[0164] The first actuator 30 extend parallel to the bottom member and the top member of the rotation unit 6. The arms 31, 32 that are attached to the first actuator 30 constitute a first hinge joint.
[0165] The second actuator 30' extend parallel to the bottom member of the rotation unit 6. The arms 31', 32' that are attached to the second actuator 30 constitute a second hinge joint.
[0166] The first actuator 30 is arranged and configured to: a) rotate the polishing disk in a first direction when being extended and b) rotate the polishing disk in the opposite direction when being retracted. The second actuator 30' is arranged and configured to: a) rotate the polishing disk in the first direction when being retracted and b) rotate the polishing disk in the opposite direction when being extended.
[0167] Accordingly, the constructing the rotation unit 6 makes it possible to minimize the thickness of the rotation unit 6 and thus provide a polishing device 2 that is thinner than the prior art polishing devices.
[0168] In Fig. 6A, the first actuator 30 is fully extended while the second actuator 30' is fully retracted. Accordingly, the attachment structure 34 is arranged in the rightmost position in the guide structure 36.
[0169] In Fig. 6B, the first actuator 30 is fully retracted while the second actuator 30' is fully extended. Accordingly, the attachment structure 34 is arranged in the leftmost position in the guide structure 36.
[0170] The actuators 30, 30' are arranged and configured to rotate the polishing disk between two predefined angular positions.
[0171] The distal end of the first actuator 30 is attached to the corresponding hinge by using a pin 66, while the distal end of the second actuator 30' is attached to the corresponding hinge by using a pin 66'. It is, however, possible to use alternative attachment structures.
[0172] Fig. 7A illustrates a force diagram for a hinge joint of a polishing device according to the invention in a first configuration. The hinge joint comprises a first hinge joint arm 31 and a second hinge joint arm 32. The angle between the first hinge joint arm 31 and a second hinge joint arm 32 is basically 90 degrees. The force provided by the actuator (30 shown in Fig. 2) is separated into a first force component Fi and a second force component F2. Fig. 7B illustrates another force diagram for the hinge joint shown in Fig. 7A in a configuration, in which the angle between the first hinge joint arm 31 and a second hinge joint arm 32 is basically 150 degrees. It can be seen that the first force component is the same while the second force component F2' increases when the hinge joint is extended.
[0173] Fig. 7C illustrates a torque diagram for a hinge joint of a polishing device according to the invention. The torque T is plotted as function of the hinge joint angle w. It can be seen that the torque T is very large at the hinge joint angle co corresponding to the angle at which the rotational direction of the polishing disk is changed by using a valve member 52, 52' (see Fig. 2). This is a great advantage because it enables the polishing disk to polish in a very efficient manner.
[0174] Fig. 8A illustrates the actuators 30, 30' and the hinge joint arms 31, 31', 32, 32' of the polishing device according to the invention in a first configuration in a first configuration. The second actuator 30' is extended as much as it can be in the actual mechanical setup. The first actuator 30, however, is retracted as much as it can be in the actual mechanical setup. In this configuration both actuators 30, 30' are active, wherein the first actuator 30 provides a force that provides a very large torque and this a powerful rotation. The angle 0i between the neutral axis between the actuators 30, 30' and the direction of the angle made by the hinge joint arms 32, 32' is indicated.
[0175] Fig. 8B illustrates the actuators 30, 30' and the hinge joint arms 31, 31', 32, 32' of the polishing device illustrated in Fig. 8A a second configuration in a second configuration. The first actuator 30 and the second actuator 30' are extended to the same degree and the hinge joint arms 31, 31', 32, 32' are symmetrically arranged. Accordingly, the angle between the neutral axis between the actuators 30, 30' and the direction of the angle made by the hinge joint arms 32, 32' is zero. Fig. 8C illustrates the actuators 30, 30' and the hinge joint arms 31, 31', 32, 32' of the polishing device shown in Fig. 8A and Fig. 8B in a third configuration. The first actuator 30 extended as much as it can be in the actual mechanical setup. The second actuator 30', however, is retracted as much as it can be in the actual mechanical setup. In this configuration both actuators are activated, wherein the second actuator 30' provides a force that provides a very large torque and this a powerful rotation. The angle O2 between the neutral axis between the actuators 30, 30' and the direction of the angle made by the hinge joint arms 32, 32' is indicated. The speed is low (zero) in the end positions. Accordingly, the friction is the static friction, which is rather high. Since the torque is high (see Fig. 7A), the rotating polishing device can overcome the friction.
[0176] In the configuration illustrated in Fig. 8B, the speed is high. Accordingly, then rotation is maintained even though the torque is low (since the friction is the dynamic friction, which is lower than the static friction).
[0177] It can be seen in Fig. 8A, Fig. 8B and Fig. 8C that the design comprising the illustrated hinge joint arms 31, 31', 32, 32' and actuators 30, 30' is configured to provide an exceptionally large torque in the "end point" (Fig. 8A and Fig. 8C). Accordingly, the invention makes it possible to provide a compact polishing device that is very powerful (provides a large torque in the end points).
[0178] Fig. 9A illustrates a perspective view of a polishing device 2 according to the invention. The polishing device 2 comprises a rotation unit 6 arranged and configured to rotate a polishing disk (not shown).
[0179] The rotation unit 6 is configured to rotate the polishing disk about the transversal axis Z of the of the polishing device 2. The rotation unit 6 comprises a rotating member 22 is designed as a radial plain bearing comprising an inner annular member of holes each configured to receive and guide a ball. The inner annular member is surrounded by an outer annular member of balls 29' guided by holes provided in the rotating member 22. A centrally arranged circular opening is surrounded by an inner cylinder 64 of the rotation unit 6. The rotating member 22 is arranged and configured to detachably receive a rotate a polishing disk like shown in and explained with reference to Fig. 1.
[0180] The polishing device 2 comprises a rod member 10 connected to and extending from the rotation unit 6. In another embodiment, the rod member 10 may be connected to and extend from the connection structure 8. The rod member 10 is connected to the rotation unit 6 by using a joint 12.
[0181] The rotation unit 6 is basically box-shaped (but may be shaped differently) and has a bottom member having a lower surface 62.
[0182] The rotating unit 6 comprises an outer ring 86 comprising a plurality of balls 88 that are rotatably mounted in mounting grooves provided in the outer ring 86. The outer ring constitutes a radial plain bearing.
[0183] The rotating unit 6 comprises an attachment structure 34 arranged in a guide structure 36.
[0184] Fig. 9B illustrates a close-up view of the attachment structure 34 and the guide structure 36 of the polishing device 2 shown in Fig. 9A. It can be seen that the guide structure 36 comprises a groove structure 35 and that the attachment structure 34 is slidably arranged in the groove structure 35. The attachment structure 34 comprises an attachment element 78 arranged between two threaded bores 72, 72' each arranged and configured to receive a bolt.
[0185] Fig. 9C illustrates a close-up view of the rotating member 22 of the polishing device shown in Fig. 9A. It can be seen that the inner annular member is surrounded by an outer annular member of balls 29' guided by holes provided in the rotating member 22 and that the centrally ar- ranged circular opening is surrounded by an inner cylinder 64.
[0186] Fig. 10A illustrates essential mechanical structures of a polishing device 2 according to the invention. The polishing device 2 corresponds to the one shown in and explained with reference to Fig. 5A and Fig. 5B.
[0187] Fig. 10B illustrates a close-up view of an attachment structure 34, a first guide structure 36 and a second guide structure 36' of the polishing device 2 shown in Fig. 10A. The guide structure 36 comprises a groove structure 35. The attachment structure 34 is slidably arranged in the groove structure 35. The attachment structure 34 comprises an attachment element 78 arranged between two threaded bores 72, 72' each arranged and configured to receive a bolt. The guide structure 36 is provided on a mounting structure 50.
[0188] A first hinge joint arm 32 and a second hinge joint arm 32' are rotatably connected to each other by using the attachment element 78 arranged between two threaded bores 72, 72'. The first hinge joint arm 32 and a second hinge joint arm 32' are sandwiched between the first guide structure 36 and the second guide structure 36'. The plate structure 96 is attached to the attachment structure 34' by using the attachment element 78 and bolts 72, 72'. By using the plate structure 96, it is possible to provide a very robust construction that can withstand the impacts and forces that the polishing device 2 is exposed to during operation due to the motion of the actuators 30, 30'.
[0189] Fig. 11A illustrates a cross-sectional view of a rotation unit 6 of polishing device according to the invention. Fig. 11B illustrates a close-up view of the portion of the rotation unit shown in Fig. 11A. The polishing device 2 comprises a centrally arranged rotating member 22 corresponding to the one shown in and explained with reference to Fig. 2, Fig. 4A, Fig. 4B, Fig. 5A, Fig. 5B, Fig. 6A, Fig. 6B, Fig. 9A, Fig. 9C and Fig. 10A. The rotating member 22 comprises a stationary outer cylinder 64'. A plurality of balls 29' is rotatably mounted in corresponding cavi- ties provided in the axial surfaces of the outer cylinder 64'.
[0190] The rotating member 22 comprises a rotatable mounted inner cylinder 64. A plate structure 96 placed on the bottom side of the rotation unit 6 is attached to the plate 4 by bolts 76 extending through the inner cylinder 64.
[0191] List of reference numerals
[0192] 2 Polishing device
[0193] 4 Plate
[0194] 5 Polishing disk
[0195] 6 Rotation unit
[0196] 8 Connection structure
[0197] 10 Arm (e.g. rod member)
[0198] 11, 11' Pivot
[0199] 12 Joint
[0200] 14 Valve housing
[0201] 15 Valve connection
[0202] 16, 16' Valve connection
[0203] 18, 18' Valve connection
[0204] 20, 20' Valve connection
[0205] 22 Rotating member
[0206] 24 Ball
[0207] 26, 26' Port
[0208] 28, 28' Port
[0209] 29 Ball
[0210] 29' Ball
[0211] 30 First actuator
[0212] 30' Second actuator
[0213] 31, 31' Hinge joint arm
[0214] 32, 32' Hinge joint arm
[0215] 33, 33' Hinge joint
[0216] 34, 34' Attachment structure
[0217] 35 Groove structure
[0218] 36, 36' Guide structure
[0219] 38, 38' Stop member
[0220] 40 First surface (e.g. a bottom plate)
[0221] 40' Second plate (e.g. top plate)
[0222] 42 First plate
[0223] 42' Second plate
[0224] 44, 44' Pin 46, 46' Pin
[0225] 48 Pin
[0226] 50 Mounting structure
[0227] 52, 52' Stop member
[0228] 54, 54' Base member
[0229] 58 Groove
[0230] 60 Gap
[0231] 62 Lower surface
[0232] 64 Inner cylinder
[0233] 64' Outer cylinder
[0234] 66, 66' Pin
[0235] 68 Pin
[0236] 70, 70' Pin
[0237] 72, 72' Hole
[0238] 74 Hole
[0239] 76 Bolt
[0240] 78 Attachment element
[0241] 80 Tubular structure
[0242] 82 Intermediate member
[0243] 84 Top connection part
[0244] 86 Outer ring
[0245] 88 Ball
[0246] 90 Top member
[0247] 92 Bottom member
[0248] 94 Load
[0249] 96 Plate structure
[0250] X Longitudinal axis
[0251] Y Longitudinal axis
[0252] Z Transversal axis
[0253] Fi, F2Force component
[0254] F2' Force component
[0255] T Torque (e.g. measured in Nm)
[0256] CD, 0i, 02 Angle
Claims
Claims1. Rotating polishing device (2) for polishing a first surface (40) by using a polishing disk (5), said polishing device (2) comprising:- a rotation unit (6) configured to receive and rotate the polishing disk (5), wherein the rotation unit (6) has a top member (90) and a bottom member (92) extending along a longitudinal axis (X) of the polishing device (2) and a lateral axis (Y) of the polishing device (2), characterised that the rotation unit (6) comprises:- a first actuator (30) extending parallel to the top member (90),- a first hinge joint (33) connected to the first actuator (30), wherein the first actuator (30) is arranged and configured to:- rotate the polishing disk (5) in a first direction when being extended and- rotate the polishing disk (5) in the opposite direction when being retracted;- a second actuator (30') and a second hinge joint (33') connected to the second actuator (30'), wherein the second actuator (30') is arranged and configured to:- rotate the polishing disk (5) in the opposite direction when being extended and- rotate the polishing disk (5) in the first direction when being retracted, wherein the first hinge joint (33) is attached to the second hinge joint (33’), wherein a distal end of the first hinge joint (33) is slidably connected to a guide structure (36) configured to move the distal end of the first hinge joint (33) along a section of a circle, wherein a distal end of the second hinge joint (33') is slidably connected to the guide structure (36), wherein the distal end of the first hinge joint (33) and the distal end of the second hinge joint (33') is connected to the same attachment structure (34) that is slidably attached to a groove structure (35) in the guide structure (36).
2. Rotating polishing device (2) according to claim 1, wherein the rotating polishing device (2) is configured for polishing the first surface (40) being spaced from a second surface (40') by using a polishing disk (5), said polishing device (2) comprising: a connection structure (8) configured to bear against the second surface (40') while being moved along the second surface (40'), wherein the rotation unit (6) and the connection structure (8) are detachably attached to each other.
3. Polishing device (2) according to claim 1 or 2, wherein the polishing device (2) comprises an arm (10) connected to and extending from the rotation unit (6) or the connection structure (8).
4. Polishing device (2) according to one of the preceding claims, wherein the rotation unit (6) is box-shaped.
5. Polishing device (2) according to one of the preceding claims, wherein a rotating member (22) is arranged centrally in the rotation unit (6).
6. Polishing device (2) according to claim 5, wherein the rotating member (22) is arranged between the first actuator (30) and the second actuator (30').
7. Polishing device (2) according to claim 5 or 6, wherein the rotating member (22) comprises: a) a centrally arranged inner cylinder (64) having a circular cross section and b) an outer cylinder (64') having a circular cross section c) inner annular member of rotatably mounted balls (29).
8. Polishing device (2) according to claim 7 and 5 or 6, wherein the inner annular member is surrounded by an outer annular member of rotatably mounted balls (29').
9. Polishing device (2) according to one of the preceding claims, wherein the rotation unit (6) comprises an outer ring (86) provided with a plurality of rotatably mounted ball (88) that are evenly distributed along the periphery of the outer ring (86), wherein each actuator (30, 30') is sandwiched between the top member (90) and the outer ring (86).
10. Polishing device (2) according to claim 9 and one of the preceding claims 5-9, wherein the outer ring (86) surrounds the rotating member (22).
11. Polishing device (2) according to one of the preceding claims, wherein at least one of the actuators (30, 30') is a pneumatic actuator (30, 30').
12. Polishing device (2) according to claim 2 one of the preceding claims 3-11, wherein the connection structure (8) is height adjustable.
Citation Information
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