Display device and manufacturing method thereof

Abstract

This display device may comprise: a lower substrate including at least one LED light source; an upper substrate including at least one quantum dot color filter; and a bonding layer configured to bond the lower substrate and the upper substrate. The upper substrate may include a partition wall structure in which a plurality of sub-rods are repeatedly provided in an edge region of a partition wall layer.

Description

Display device and manufacturing method thereof

[0001] The present disclosure relates to a display device including a color filter and a method for manufacturing the same.

[0002] A display device may be a device that processes image signals and / or image data input from an external source or stored internally through various processes. The display device displays the processed image signals and / or image data as images on a display panel or screen, and may be implemented in various ways, such as a TV, monitor, or portable media player, depending on the method used.

[0003] A display device may include a lower substrate including a plurality of pixels and an upper substrate including a color filter and a color conversion unit to improve display quality. For example, the color conversion unit may convert the wavelength of light provided from the lower substrate. Accordingly, a display device including the color conversion unit may emit light having a different color from the incident light. For example, the color conversion unit may include wavelength conversion particles such as quantum dots.

[0004] Wavelength-converting particles, such as quantum dots, can be degraded by impurities penetrating the display device. If quantum dots degrade, the display device suffers from uneven brightness, resulting in degraded display quality.

[0005] Various embodiments of the present disclosure can provide a display device and a manufacturing method thereof that prevent deterioration of quantum dots by minimizing impurities penetrating into the interior through a partition wall structure.

[0006] Additional aspects will be described in part in the description below, and in part will be apparent from the description or may be learned by practice of the embodiments presented.

[0007] According to one aspect of the present disclosure, a display device may include a lower substrate including at least one LED light source, an upper substrate including at least one quantum dot color filter, and a bonding layer configured to bond the lower substrate and the upper substrate. The upper substrate may include a partition wall structure in which at least two sub-rods are repeatedly provided in an edge region of a partition wall layer.

[0008] In one embodiment, at least one of the plurality of sub-loads can be configured to prevent penetration of impurities including at least one of oxygen or moisture through the edge region.

[0009] In one embodiment, the upper substrate may include a glass substrate configured to output light, a black matrix layer configured to prevent interference of light, a color filter layer including at least one quantum dot color filter, a color conversion layer including at least one color conversion unit, the partition layer including at least one of the plurality of sub-rods, and an inorganic encapsulation layer configured to control reflection of light.

[0010] In one embodiment, the lower substrate may include a base substrate, a buffer layer including an inorganic insulating material, and a light-emitting element layer including the at least one LED light source.

[0011] In one embodiment, the bonding layer may include an optical bonding material configured to transmit light, and may be configured to bond the lower substrate and the upper substrate using the optical bonding material.

[0012] In one embodiment, the partition wall structure may be provided such that the plurality of sub-loads are repeatedly spaced at intervals of between 1 μm and 100 μm.

[0013] In one embodiment, at least one of the plurality of sub-loads of the partition wall structure has a cubic shape and can be formed with a height in the range of 1 μm to 100 μm.

[0014] In one embodiment, the inorganic encapsulating layer may fill a negative region between at least two of the plurality of sub-loads and be formed parallel to the black matrix layer.

[0015] In one embodiment, the upper substrate may further include a functional planarization layer disposed between the color filter layer and the barrier layer. The functional planarization layer may include a low-refractive material.

[0016] In one embodiment, the plurality of sub-loads may be repeatedly provided between the at least two quantum dot color filters.

[0017] According to one aspect of the present disclosure, a method for manufacturing a display device may include the steps of forming a light-emitting substrate including at least one LED light source, forming a color conversion substrate including at least one quantum dot color filter, and forming a bonding layer that bonds the light-emitting substrate and the color conversion substrate. Here, the step of forming the color conversion substrate may form a partition wall structure in which a plurality of sub-rods are repeatedly provided in an edge region of a partition wall layer.

[0018] In one embodiment, at least one of the plurality of sub-loads can be configured to prevent penetration of impurities including at least one of oxygen or moisture through the edge region.

[0019] In one embodiment, the step of forming the color conversion substrate may include the step of forming a glass substrate that outputs light, the step of forming a black matrix layer that prevents interference of light, the step of forming a color filter layer that includes at least one quantum dot color filter, the step of forming a color conversion layer that includes at least one color conversion unit, the step of forming the partition layer that includes at least one of the plurality of sub-rods, and the step of forming an inorganic sealing layer that controls reflection of light.

[0020] In one embodiment, the step of forming the light-emitting substrate may include the step of forming a base substrate, the step of forming a buffer layer including an inorganic insulating material, and the step of forming a light-emitting element layer including the at least one LED light source.

[0021] In one embodiment, the bonding layer includes an optical bonding material that transmits light, and the light-emitting substrate and the color conversion substrate can be bonded using the optical bonding material.

[0022] In one embodiment, the partition wall structure may be provided such that the plurality of sub-loads are repeatedly spaced at intervals of between 1 μm and 100 μm.

[0023] In one embodiment, at least one of the plurality of sub-loads of the partition wall structure has a cubic shape and can be formed with a height in the range of 1 μm to 100 μm.

[0024] In one embodiment, the step of forming the inorganic encapsulating layer may fill a negative region between at least two of the plurality of sub-loads and be formed parallel to the black matrix layer.

[0025] In one embodiment, the step of forming the color conversion substrate may further include the step of forming a functional planarization layer disposed between the color filter layer and the barrier layer, the functional planarization layer including a low-refractive material.

[0026] In one embodiment, the plurality of sub-loads may be repeatedly provided between the at least two quantum dot color filters.

[0027] According to various embodiments of the present disclosure, the display device and its manufacturing method can prevent deterioration of quantum dots by minimizing impurities penetrating into the interior through the partition wall structure. Accordingly, the display device and its manufacturing method of the present disclosure can increase uniformity of luminance and ensure reliability of display quality.

[0028] The effects that can be obtained from the exemplary embodiments of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly derived and understood by those skilled in the art to which the exemplary embodiments of the present disclosure pertain from the following description. In other words, unintended effects resulting from implementing the exemplary embodiments of the present disclosure can also be derived by those skilled in the art from the exemplary embodiments of the present disclosure.

[0029] The foregoing and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the drawings.

[0030] FIG. 1 is an exemplary plan view illustrating a display device according to one or more embodiments.

[0031] FIG. 2 is an exemplary cross-sectional view illustrating a display device according to one or more embodiments.

[0032] FIG. 3 illustrates an exemplary laminated structure of a display device according to one or more embodiments.

[0033] FIG. 4 illustrates an exemplary laminated structure of a lower substrate according to one or more embodiments.

[0034] FIG. 5 illustrates an exemplary laminated structure of an upper substrate according to one or more embodiments.

[0035] FIGS. 6A and 6B illustrate exemplary display devices in which a lower substrate and an upper substrate are bonded by a bonding layer according to one or more embodiments.

[0036] FIG. 7 illustrates an exemplary laminated structure of a display device according to one or more embodiments.

[0037] FIG. 8 illustrates an exemplary laminated structure of a display device according to one or more embodiments.

[0038] FIG. 9 illustrates an exemplary laminated structure of a display device according to one or more embodiments.

[0039] FIG. 10 illustrates an exemplary laminated structure of a display device according to one or more embodiments.

[0040] FIG. 11 illustrates an exemplary laminated structure of a display device according to one or more embodiments.

[0041] FIG. 12 is an exemplary flowchart illustrating a method of manufacturing a display device according to one or more embodiments.

[0042] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0043] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes numerous specific details to aid in understanding the present invention, these should be considered merely exemplary. Accordingly, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0044] The terms and words used in the following description and claims are limited to their bibliographic meanings and have been used by the inventors solely to facilitate a clear and consistent understanding of the present invention. Accordingly, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided for illustrative purposes only and is not intended to limit the present invention as defined by the appended claims and their equivalents.

[0045] In this disclosure, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in this document, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0046] In this disclosure, the term “and / or” includes any combination of a plurality of related described components or any one of a plurality of related described components.

[0047] The operating principle and embodiments of the present invention will be described with reference to the attached drawings below.

[0048] FIG. 1 is an exemplary plan view illustrating a display device (10) according to one or more embodiments, and FIG. 2 is an exemplary cross-sectional view illustrating a display device (10) according to one or more embodiments.

[0049] Referring to FIG. 1, a display device (10) may include a display area where an image is displayed, and an edge area disposed outside the display unit. For example, the edge area may surround the display area on a plane.

[0050] In order to provide a video display function, a display device (10) according to embodiments of the present invention may include a display panel in which a plurality of data lines and a plurality of gate lines are arranged and a plurality of sub-pixels defined by the plurality of data lines and the plurality of gate lines are arranged, a data driving circuit that drives a plurality of data lines, a gate driving circuit that drives a plurality of gate lines, a data driving circuit, and a display controller that controls the operation of the gate driving circuit.

[0051] The data driver circuit, gate driver circuit, and display controller may each be implemented as one or more individual components. In some cases, two or more of the data driver circuit, gate driver circuit, and display controller may be integrated into a single component. For example, the data driver circuit and the display controller may be implemented as a single integrated circuit chip (IC chip).

[0052] Specifically, in order to provide a touch sensing function, a display device (10) according to embodiments of the present invention may include a touch panel (e.g., a touch screen panel) including a plurality of touch electrodes, and a touch sensing circuit that supplies a touch driving signal to the touch panel, detects a touch sensing signal from the touch panel, and determines the presence or absence of a user's touch (e.g., a user's input) and / or a touch location (touch coordinates) on the touch panel based on the detected touch sensing signal.

[0053] For example, the touch sensing circuit may include at least one of a touch driving circuit that supplies a touch driving signal to a touch panel and detects a touch sensing signal from the touch panel, and a touch controller that senses whether a user touches the touch panel and the touch position based on the touch sensing signal detected by the touch driving circuit.

[0054] A touch driving circuit may include a first circuit part that supplies a touch driving signal to a touch panel and a second circuit part that detects a touch sensing signal from the touch panel. The touch driving circuit and the touch controller may be implemented as separate (or independent) components, or in some cases, may be implemented by being integrated into a single component.

[0055] Each of the data driving circuit, the gate driving circuit, and the touch driving circuit can be implemented as one or more integrated circuits, and can be implemented as a COG (Chip On Glass) type, COF (Chip On Film) type, or TCP (Tape Carrier Package) type from the viewpoint of electrical connection with the display panel, and the gate driving circuit can also be implemented as a GIP (Gate In Panel) type.

[0056] Each of the circuit configurations for display driving and the circuit configurations for touch sensing (e.g., detection signal input) may be implemented as one or more individual components. In some cases, one or more of the circuit configurations for display driving and one or more of the circuit configurations for touch sensing may be functionally integrated and implemented as one or more components.

[0057] For example, the data driving circuit and the touch driving circuit may be integrated into one or more integrated circuit chips. When the data driving circuit and the touch driving circuit are integrated into two or more integrated circuit chips, each of the two or more integrated circuit chips may have a data driving function and a touch driving function.

[0058] Referring to FIG. 2, the display device (10) may include a lower substrate (100), an upper substrate (200), and a bonding layer (300). For example, as shown in FIG. 2, a lower surface of the upper substrate (200) may face an upper surface of the lower substrate (100) and may be positioned in a first direction from the lower substrate (100). For example, the first direction may be a front direction of the display device (10) from the lower substrate (100). The bonding layer (300) may bond the lower substrate (100) and the upper substrate (200).

[0059] The lower substrate (100) may include a plurality of LED light sources. The LED light sources may be arranged in a display area of ​​the lower substrate (100). Each of the LED light sources may include a driving element and a light-emitting element. The driving element may include at least one thin film transistor. The light-emitting element may generate light according to a driving signal. For example, the light-emitting element may be an inorganic light-emitting diode or an organic light-emitting diode.

[0060] The upper substrate (200) may include a color conversion unit. The color conversion unit is arranged in the display area and may convert the wavelength of light generated from the light-emitting element of the lower substrate (100). For example, the upper substrate (200) may include a color filter layer (230) that transmits light of a specific color.

[0061] The bonding layer (300) can bond the lower substrate (100) and the upper substrate (200). The bonding layer (300) can be disposed in a bonding area between the lower substrate (100) and the upper substrate (200). For example, the bonding layer (300) can have a planar shape including a bonding material. However, embodiments of the present invention are not limited thereto, and the bonding layer (300) can have various planar shapes depending on the planar shape of the lower substrate (100) or the upper substrate (200). For example, when the lower substrate (100) or the upper substrate (200) has a planar shape such as a triangle, a rhombus, a polygon, a circle, or an oval, the bonding layer (300) can have a planar shape such as a hollow triangle, a hollow rhombus, a hollow polygon, a hollow circle, or a hollow oval.

[0062] In one embodiment, the bonding layer (300) may include a filler. For example, the filler may act as a buffer against external pressure applied to the display device (10). For example, the filler may maintain a gap between the lower substrate (100) and the upper substrate (200).

[0063] The display device (10) of the present disclosure may include a partition wall structure (PWS) to prevent impurities from penetrating into the interior. The display device (10) can prevent deterioration of quantum dots by minimizing impurities penetrating into the interior through the partition wall structure. Accordingly, the display device (10) of the present disclosure can increase uniformity of luminance and ensure reliability of display quality.

[0064] FIG. 3 illustrates an exemplary laminated structure of a display device (10) according to one or more embodiments, FIG. 4 illustrates an exemplary laminated structure of a lower substrate (100) according to one or more embodiments, and FIG. 5 illustrates an exemplary laminated structure of an upper substrate (200) according to one or more embodiments.

[0065] Referring to FIG. 3, the display device (10) may include a lower substrate (100) including at least one LED light source, an upper substrate (200) including at least one quantum dot color filter, and a bonding layer (300) that bonds the lower substrate (100) and the upper substrate (200). For example, the bonding layer (300) may be formed on the lower substrate (100). For example, the upper substrate (200) may be formed on the bonding layer (300).

[0066] In one embodiment, the upper substrate (200) may include a partition wall structure (PWS) in which at least one sub-rod is repeatedly arranged in an edge region of the partition wall layer (250). By including the at least one sub-rod, the partition wall structure (PWS) may prevent the penetration of impurities including at least one of oxygen (O2) and moisture (H2O) through the edge region.

[0067] As shown in Fig. 4, the lower substrate (100) may include a base substrate (110), a buffer layer (120) including an inorganic insulating material, and a light-emitting element layer (130) including at least one LED light source. For example, the lower substrate (100) may be a light-emitting substrate.

[0068] The base substrate (110) may be a substrate forming the basic structure of the lower substrate (100). The base substrate (110) may be an insulating substrate formed of a transparent or opaque material. For example, the base substrate (110) may be at least one of a glass substrate, a plastic substrate, and a silicon substrate. When the base substrate (110) is a glass substrate, the base substrate (110) may be a rigid substrate. When the base substrate (110) is a plastic substrate, the base substrate (110) may be a flexible substrate.

[0069] The buffer layer (120) may include an inorganic insulating material such as a silicon compound or a metal oxide. For example, the buffer layer (120) may include at least one of silicon oxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), silicon oxycarbide (SiOC), silicon carbonitride (SiCN), aluminum oxide (AlO), aluminum nitride (AlN), tantalum oxide (TaO), hafnium oxide (HfO), zirconium oxide (ZrO), and titanium oxide (TiO). The buffer layer (120) may have a single-layer structure or a multi-layer structure including a plurality of insulating layers.

[0070] The light-emitting element layer can generate light from the lower substrate (100). The light-emitting element layer can include at least one LED light source (e.g., LED1, LED2, LED3). For example, the at least one LED light source can include a micro LED that emits different colors (e.g., red, blue, green). For example, the at least one LED light source can include a blue micro LED that emits the same light (e.g., blue). Each of the at least one LED light sources can include a driving element and a light-emitting element. The driving element can include at least one thin film transistor. The light-emitting element can generate light according to a driving signal. For example, the light-emitting element can be an inorganic light-emitting diode or an organic light-emitting diode.

[0071] As shown in Fig. 5, the upper substrate (200) may include a glass substrate (210) that outputs light, a black matrix layer (220) that prevents interference of light, a color filter layer (230) that includes at least one quantum dot color filter, a color conversion layer (240) that includes at least one color conversion unit, the partition layer (250) that includes at least one sub-rod, and an inorganic sealing layer (260) that controls reflection of light. For example, the upper substrate (200) may be a color conversion substrate.

[0072] The glass substrate (210) can output light generated from the lower substrate (100) to the outside. For example, the glass substrate (210) can be formed of a transparent material (e.g., glass).

[0073] The black matrix layer (220) may be formed on the glass substrate (210). For example, the black matrix layer (220) may be formed on the glass substrate (210). The black matrix layer (220) may prevent interference of light generated from the lower substrate (100). For example, the black matrix layer (220) may absorb light to minimize reflection, thereby increasing the brightness of the output light.

[0074] The color filter layer (230) may be formed on the black matrix layer (220). For example, the color filter layer (230) may be formed on the black matrix layer (220). The color filter layer (230) may include at least one quantum dot color filter (e.g., CF1, CF2, CF3). The color filter layer (230) may include at least one of a red color filter (CF1), a green color filter (CF2), and a blue transmission layer (CF3). The red color filter (CF1) may block blue light and transmit red light. The green color filter (CF2) may block blue light and transmit green light. The blue transmission layer (CF3) may transmit input blue light.

[0075] The color conversion layer (240) may be formed on the color filter layer (230). The color conversion layer (240) may include at least one color conversion unit (e.g., CC1, CC2, CC3). At least one color conversion unit may be formed on at least one quantum dot color filter. For example, at least one color conversion unit may be respectively disposed within the openings of the partition layer (250). The color conversion layer (240) may include quantum dots that change the wavelength of incident light. For example, the first color conversion unit (CC1) may include red quantum dots dispersed in a resin. For example, the second color conversion unit (CC2) may include green quantum dots dispersed in a resin. The third color conversion unit (CC3) may include a transparent resin.

[0076] The barrier layer (250) may be formed on the color filter layer (230). For example, the barrier layer (250) may be formed on the color filter layer (230). The barrier layer (250) may minimize light leakage. The barrier layer (250) may include an organic material. In one embodiment, the barrier layer (250) may further include a light-shielding material. For example, at least a portion of the barrier layer (250) may include a light-shielding material such as a black pigment, a dye, carbon black, or the like.

[0077] The partition wall layer (250) may include at least one sub-load in the edge region. By repeatedly forming at least one sub-load at a predetermined interval in the edge region of the partition wall layer (250), the upper substrate (200) may include a partition wall structure.

[0078] The inorganic encapsulating layer (260) may be formed on the barrier layer (250). For example, the inorganic encapsulating layer (260) may be formed on the barrier layer (250). For example, the inorganic encapsulating layer (260) may be formed on the barrier layer (250) by at least one deposition method selected from plasma-enhanced chemical vapor deposition (PECVD) and chemical vapor deposition (CVD). The inorganic encapsulating layer (260) may include an inorganic material. For example, the inorganic encapsulating layer (260) may include an inorganic material such as SiOxNx, SiNx, or SiO. The inorganic encapsulating layer (260) may control the reflection of light, thereby improving the color precision of light output to the outside.

[0079] FIGS. 6A and 6B illustrate an exemplary display device (10) in which a lower substrate (100) and an upper substrate (200) are bonded by a bonding layer (300) according to one or more embodiments.

[0080] Referring to FIGS. 6a and 6b, the bonding layer (300) includes an optical bonding material, and the lower substrate (100) and the upper substrate (200) can be bonded using the optical bonding material.

[0081] For example, the bonding layer (300) may have optical transparency. The bonding layer (300) may preserve the optical properties of light output from the lower substrate (100) by maximizing light transmission and minimizing light reflection.

[0082] For example, the optical bonding material may be filled in the bonding area between the lower substrate (100) and the upper substrate (200). For example, the optical bonding material may include at least one of an epoxy adhesive, an acrylic adhesive, a silicone adhesive, a melamine adhesive, a UV-curable adhesive, a hot melt adhesive, and a polyurethane adhesive.

[0083] As shown in Fig. 6a, the bonding material of the bonding layer (300) can fill the entire bonding area. For example, the bonding material can contact each of the lower substrate (100) and the upper substrate (200), and bond the lower substrate (100) and the upper substrate (200).

[0084] As shown in Fig. 6b, the bonding material of the bonding layer (300) may only fill a portion of the bonding area. For example, the bonding layer (300) may include an air gap that is not filled with the bonding material. The bonding layer (300) may be in contact with the lower substrate (100) and may not be in contact with a portion of the upper substrate (200).

[0085] The display device (10) may include a partition wall structure (PWS) to prevent impurities from penetrating into the interior. The display device (10) can prevent deterioration of quantum dots by minimizing impurities penetrating into the interior through the partition wall structure.

[0086] Specifically, the upper substrate (200) may include a partition wall structure (PWS) in which at least one sub-rod is repeatedly arranged in an edge region of the partition wall layer (250). By including the at least one sub-rod, the partition wall structure may prevent the penetration or inflow of impurities including at least one of oxygen (O2) and moisture (H2O) through the edge region.

[0087] For example, the partition wall structure may have at least two sub-rods repeatedly arranged at intervals of 1 μm to 100 μm. The interval between the at least one sub-rod may be the same. The interval between the at least one sub-rod may be different. The partition wall structure may include a negative region according to the interval between the at least two sub-rods.

[0088] In one embodiment, the at least one sub-rod of the partition wall structure may have a cubic shape and may be formed with a height ranging from 1 μm to 100 μm. For example, the at least one sub-rod may be a hexahedron having a side length ranging from 1 μm to 100 μm. However, the shape and size of the sub-rod included in the display device (10) of the present disclosure are not limited thereto.

[0089] FIG. 7 illustrates an exemplary laminated structure of a display device (10) according to one or more embodiments.

[0090] Referring to FIG. 7, the display device (10) may include an upper substrate (200) including a partition wall structure. The partition wall structure may include a negative area according to the spacing between at least one sub-load.

[0091] In one embodiment, the inorganic encapsulating layer (260) may fill a negative region between at least two of the plurality of sub-loads. For example, the inorganic encapsulating layer (260) may fill the negative region and be formed in a structure parallel to the black matrix layer (220).

[0092] FIG. 8 illustrates an exemplary laminated structure of a display device (10) according to one or more embodiments.

[0093] Referring to FIG. 8, the display device (10) may include an upper substrate (200) including a partition wall structure. The upper substrate (200) may further include a functional planarization layer (270) disposed between the color filter layer (230) and the partition wall layer (250). For example, the display device (10) may further include the functional planarization layer (270) to improve the refractive index of light and increase the brightness of output light.

[0094] The functional planarization layer (270) can reduce or eliminate the step caused by the color filter layer (230). The functional planarization layer (270) may include organic and inorganic materials. For example, the pre-formed planarization layer may include at least one of silicon oxide and silicon nitride.

[0095] The functional planarization layer (270) may include a low-refractive material having a refractive index ranging from 1.0 to 1.6. For example, the functional planarization layer (270) may include hollow particles. For example, the hollow particles may include an inorganic material. The hollow particles may be dispersed in a resin matrix. For example, the hollow particles may include silica (SiO -2), magnesium fluoride (MgF2), and iron oxide (Fe3O4). For example, the resin matrix may include an acrylic resin, a siloxane resin, a urethane resin, an imide resin, etc., and may be selected in consideration of the refractive index and processability.

[0096] FIG. 9 illustrates an exemplary laminated structure of a display device (10) according to one or more embodiments.

[0097] Referring to FIG. 9, the display device (10) may include an upper substrate (200) including a partition wall structure. The partition wall structure may be formed between quantum dot color filters. For example, the upper substrate (200) may include the partition wall structure in which the plurality of sub-rods are repeatedly arranged between at least two quantum dot color filters.

[0098] When a partition wall structure is formed between quantum dot color filters, quantum dot degradation caused by impurities flowing between the quantum dot color filters can be minimized. For example, the sub-rods can be repeatedly arranged at intervals of 1 μm to 100 μm between the quantum dot color filters.

[0099] FIG. 10 illustrates an exemplary laminated structure of a display device (10) according to one or more embodiments.

[0100] Referring to FIG. 10, the display device (10) may include an upper substrate (200) including a partition wall structure. The partition wall structure may be formed in each of an edge area and a display area. For example, the partition wall structure may be formed between each of an edge area of ​​a partition wall layer (250) and a quantum dot color filter.

[0101] When the partition wall structure is formed in each of the edge area and the display area, the partition wall structure can prevent both impurities from flowing into the edge area and impurities from flowing between the quantum dot color filters.

[0102] FIG. 11 illustrates an exemplary laminated structure of a display device (10) according to one or more embodiments. Referring to FIG. 11, the display device (10) may include an upper substrate (200) including a partition wall structure. For example, the partition wall structure may include sub-rods of various shapes and sizes.

[0103] In one embodiment, the sub-rod may have a trapezoidal shape. However, the shape of the sub-rod is not limited to a trapezoidal shape, and the shape of the sub-rod may have various shapes such as circular, triangular, oval, and combinations thereof.

[0104] In addition, as shown in FIG. 11, the weapon bag layer (260) can be formed in a shape corresponding to the shape of the sub-load as the sub-load of the split bulkhead structure has various shapes.

[0105] FIG. 12 is an exemplary flowchart illustrating a method of manufacturing a display device according to one or more embodiments.

[0106] Referring to FIG. 12, a method for manufacturing a display device of the present disclosure may form a light-emitting substrate (e.g., 100) (step 1210), form a color conversion substrate (e.g., 200) (step 1220), and bond the light-emitting substrate (e.g., 100) and the color conversion substrate (e.g., 200) (step 1230). In particular, the method for manufacturing a display device may form a partition wall structure in which at least one sub-rod is repeatedly arranged in an edge region of a partition layer (250). The partition wall structure may prevent the penetration of impurities including at least one of oxygen and moisture through the edge region by including the at least one sub-rod.

[0107] According to an example, in step 1210, a method of manufacturing a display device may form a light-emitting substrate (100) including at least one LED light source.

[0108] Specifically, a method for manufacturing a display device may include a step of forming a base substrate (110), a step of forming a buffer layer (120) including an inorganic insulating material, and a step of forming a light-emitting element layer (130) including at least one LED light source.

[0109] According to one example, in step 1220, the method of manufacturing a display device may form a color conversion substrate (200) including at least one quantum dot color filter.

[0110] Specifically, the method for manufacturing a display device may include a step of forming the color conversion substrate (200), a step of forming a glass substrate (210) that outputs light, a step of forming a black matrix layer (220) that prevents interference of light, a step of forming a color filter layer (230) that includes at least one quantum dot color filter, a step of forming the partition layer (250) that includes at least one sub-rod, and a step of forming an inorganic sealing layer (260) that controls reflection of light.

[0111] For example, the at least one sub-load may be repeatedly arranged at intervals of 1 μm to 100 μm on the partition wall structure. For example, the at least one sub-load may have a cubic shape and may be formed with a height in the range of 1 μm to 100 μm.

[0112] According to an example, in step 1230, the method for manufacturing a display device may form a bonding layer (300) that bonds the light-emitting substrate (100) and the color conversion substrate (200). For example, the bonding layer (300) may include an optical bonding material, and the light-emitting substrate (100) and the color conversion substrate (200) may be bonded using the optical bonding material.

[0113] In this way, the method for manufacturing the display device of the present disclosure can prevent deterioration of quantum dots by minimizing impurities penetrating into the interior through the partition wall structure. Accordingly, the method for manufacturing the display device of the present disclosure can increase luminance uniformity and ensure display quality reliability.

[0114] However, since this has been described above, a duplicate explanation will be omitted.

[0115] The display devices according to the various embodiments disclosed in this document may take various forms. The display devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. The display devices according to the embodiments of this document are not limited to the aforementioned devices.

[0116] The various embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. For example, a component expressed in the singular should be understood to include plural components unless the context clearly indicates only the singular. It should be understood that the term "and / or" used herein encompasses any and all possible combinations of one or more of the listed items. The terms "comprise," "have," "consist of," and the like used herein are intended to specify that a feature, component, part, or combination thereof described in this disclosure exists, and the use of such terms does not exclude the possibility of the presence or addition of one or more other features, components, parts, or combinations thereof. In this document, phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order).

[0117] The term “if” as used in various embodiments of this document may be interpreted to mean “when”, “when”, “in response to determining”, or “in response to detecting”, depending on the context. Similarly, “if it is determined that” or “if ~ is detected” may be interpreted to mean “upon determining”, “in response to determining”, or “upon detecting”, or “in response to detecting”, depending on the context.

Claims

1. In the display device, A lower substrate comprising at least one LED light source; an upper substrate comprising at least one quantum dot color filter; and A bonding layer configured to bond the lower substrate and the upper substrate, The above upper substrate, A partition wall structure comprising a plurality of sub-rods repeatedly provided in the edge area of ​​the partition wall layer. Display device.

2. In paragraph 1, At least one of the above multiple sub-loads, configured to prevent penetration of impurities including at least one of oxygen or moisture through the edge region; Display device.

3. In paragraph 2, The above upper substrate, A glass substrate configured to output light; A black matrix layer configured to prevent interference of light; A color filter layer comprising at least one quantum dot color filter; A color conversion layer comprising at least one color conversion unit; said bulkhead layer comprising at least one of said plurality of sub-loads; and Comprising a weapon encapsulating layer configured to control the reflection of light, Display device.

4. In paragraph 3, The above lower substrate is, base board; a buffer layer comprising an inorganic insulating material; and Comprising a light emitting element layer including at least one LED light source, Display device.

5. In paragraph 3, The above bonding layer is, An optical bonding material configured to transmit light, and configured to bond the lower substrate and the upper substrate using the optical bonding material. Display device.

6. In paragraph 3, The above partition wall structure is, wherein the above multiple sub-loads are repeatedly provided at intervals of 1 μm to 100 μm, Display device.

7. In paragraph 3, At least one of the plurality of sub-loads of the above partition bulkhead structure, It has a hexahedral shape and is formed with a height ranging from 1㎛ to 100㎛. Display device.

8. In paragraph 3, The above weapon bag layer is, Filling the negative area between at least two of the above plurality of sub-loads, and formed parallel to the black matrix layer, Display device.

9. In paragraph 3, The above upper substrate, Further comprising a functional flattening layer disposed between the color filter layer and the barrier layer, The functional flattening layer comprises a low-refractive material. Display device.

10. In paragraph 3, The above multiple sub-loads are, Repeatedly provided between at least two quantum dot color filters, Display device.

11. In a method for manufacturing a display device, A step of forming a light-emitting substrate including at least one LED light source; forming a color conversion substrate including at least one quantum dot color filter; and Comprising a step of forming a bonding layer for bonding the light-emitting substrate and the color conversion substrate, The step of forming the above color conversion substrate is: A partition wall structure is formed in which multiple sub-rods are repeatedly provided in the edge area of ​​the partition wall layer. A method for manufacturing a display device.

12. In paragraph 11, At least one of the above multiple sub-loads, configured to prevent penetration of impurities including at least one of oxygen or moisture through the edge region; A method for manufacturing a display device.

13. In paragraph 12, The step of forming the above color conversion substrate is: A step of forming a glass substrate that outputs light; A step of forming a black matrix layer that prevents light interference; A step of forming a color filter layer including at least one quantum dot color filter; A step of forming a color conversion layer including at least one color conversion unit; forming the bulkhead layer including at least one of the plurality of sub-loads; and Comprising a step of forming a weapon encapsulating layer that controls the reflection of light; A method for manufacturing a display device.

14. In paragraph 13, The step of forming the above light-emitting substrate is: Step of forming a base substrate; A step of forming a buffer layer including an inorganic insulating material; and Comprising a step of forming a light-emitting element layer including at least one LED light source, A method for manufacturing a display device.

15. In paragraph 13, The above bonding layer is, A light-transmitting optical bonding material is included, and the light-emitting substrate and the color conversion substrate are bonded using the optical bonding material. A method for manufacturing a display device.

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