Electronic device comprising antenna

Abstract

An electronic device comprising an antenna is provided. The electronic device comprises: an outer housing comprising the side surface of the electronic device; a display device of which at least a portion is exposed through a first surface of the outer housing, the display device including a plurality of layers, which includes a flexible printed circuit board (FPCB) layer, the FPCB layer including a first portion and a second portion divided from the first portion, and the second portion including a conductive member formed in a partial area of an edge of the FPCB layer; a printed circuit board disposed between a second surface of the outer housing and the display device; a feeding line for connecting a communication circuit on the printed circuit board to the outer housing to feed power to the outer housing; and a ground line for connecting the conductive member to the printed circuit board.

Description

Electronic device including an antenna

[0001] The present disclosure relates to an electronic device including an antenna.

[0002] Electronic devices, such as smartphones, tablet PCs, or wearable devices, can perform a variety of functions. Equipped with communication capabilities, these devices can perform a variety of functions, such as voice calls, message checks, or wireless payments. Electronic devices can be manufactured to be small and lightweight for easy mounting on body parts, such as the wrist, and may have limited mounting space. Within this limited mounting space, electronic devices can accommodate various components, such as devices, modules, or antennas. Furthermore, with the advancement of communication technology, the demand for frequencies for wearable devices, including smartwatches, has increased. Consequently, the number of antennas mounted on electronic devices and the bandwidth of each antenna's required frequency have also increased.

[0003] One embodiment of the present disclosure may provide an electronic device including an outer housing (220) including a first side facing a first direction, a second side facing a second direction opposite to the first direction, and a side surface surrounding a space between the first side and the second side; a display device (210) at least partially exposed through the first side of the outer housing, the display device including a plurality of layers including a flexible printed circuit board (FPCB) layer (215), the FPCB layer including a first portion (40a) and a second portion (40b) divided from the first portion, the second portion including a conductive member formed in a portion of an edge of the FPCB layer; a printed circuit board (260) disposed between the second side of the outer housing and the display device; a power supply line (44) connecting a communication circuit on the printed circuit board and the outer housing to supply power to the outer housing; and a ground line (41) connecting the conductive member and the printed circuit board. Additionally, the ground line may be included in a connector (43) connecting the printed circuit board and the display device.

[0004] In addition, one embodiment of the present disclosure may provide an electronic device including an outer housing (220) including a conductive structure formed in an area including a side surface of an electronic device; a display device (210) at least partially exposed through a first surface of the outer housing, the display device including a flexible printed circuit board (FPCB) layer (215), the FPCB layer including a first portion (40a) and a second portion (40b) divided from the first portion, the second portion being formed in a portion of an edge area of ​​the FPCB layer and including a conductive member (40); a printed circuit board (260) disposed between a second surface of the outer housing opposite to the first surface and the display device; and a ground line (41) connecting the conductive member and the printed circuit board. In addition, the ground line may be included in a connector (43) connecting the printed circuit board and the display device.

[0005] FIG. 1 is a block diagram of an electronic device within a network environment (100) according to various embodiments.

[0006] FIG. 2 is a perspective view of an electronic device according to one embodiment.

[0007] Figure 3 is a development diagram of an electronic device according to one embodiment.

[0008] Figure 4 is a cross-sectional view of an electronic device according to one embodiment.

[0009] FIG. 5 is a cross-sectional view of a display device according to one embodiment.

[0010] FIG. 6 is a drawing showing a divided first part and a second part of an FPCB according to one embodiment.

[0011] FIG. 7 is a diagram illustrating an example in which the electrical length of an antenna radiator including an external housing and at least a portion of a display device is adjusted as the external housing is powered according to one embodiment.

[0012] FIG. 8 is a drawing for explaining the length and width of a conductive member formed in a second portion of an FPCB according to one embodiment.

[0013] FIG. 9 is a drawing showing the radiation performance of an antenna radiator according to the length of a conductive member formed in a second portion of an FPCB according to one embodiment.

[0014] FIG. 10 is a drawing showing the radiation performance of an antenna radiator according to the width of a conductive member formed in a second portion of an FPCB according to one embodiment.

[0015] FIG. 11 is a drawing showing an example in which a conductive member formed in a second portion of an FPCB according to one embodiment and a matching circuit of a printed circuit board are connected by a switch.

[0016] FIG. 12 is a diagram showing wiring connections between a display device and a printed circuit board according to one embodiment.

[0017] FIG. 13 is a drawing showing wiring connections between a conductive member disposed below a display device, a display device, and a printed circuit board according to one embodiment.

[0018] FIG. 14 is a drawing showing wiring connections between a conductive member disposed below a display device, a display device, and a printed circuit board according to one embodiment.

[0019] FIG. 15 is a drawing showing an example of the arrangement locations of a power supply point, a ground point, and a switch of an electronic device according to one embodiment.

[0020] FIG. 16 is a drawing showing an example of a conductive member formed in a second portion of an FPCB according to one embodiment being powered.

[0021] FIG. 17 is a drawing showing the performance of an antenna radiator when power is supplied to a conductive member formed in a second portion of an FPCB according to one embodiment.

[0022] FIG. 18 is a block diagram (1800) of an electronic device (101) for supporting legacy network communication and 5G network communication according to various embodiments.

[0023] Below, embodiments of the present disclosure are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In addition, for the purpose of clearly explaining the present disclosure in the drawings, parts irrelevant to the description are omitted, and similar parts are designated with similar reference numerals throughout the specification.

[0024] The terms used in this disclosure are described as currently common terms, taking into account the functions mentioned herein. However, these terms may mean various other terms depending on the intentions of those skilled in the art, precedents, the emergence of new technologies, etc. Therefore, the terms used in this disclosure should not be interpreted solely based on their names, but rather based on the meanings of the terms and the overall content of this disclosure.

[0025] Additionally, while terms such as first, second, etc. may be used to describe various components, the components should not be limited by these terms. These terms are used to distinguish one component from another.

[0026] Throughout the specification, when a part is said to be "connected" to another part, this includes not only the cases where the parts are "directly connected" but also the cases where the parts are "electrically connected" with other elements intervening. Furthermore, when a part is said to "include" a component, this does not exclude other components, but rather includes other components, unless otherwise stated.

[0027] The phrases “in one embodiment” and the like appearing in various places throughout this disclosure do not necessarily all refer to the same embodiment.

[0028] An embodiment of the present disclosure may be represented by functional block configurations and various processing steps. Some or all of these functional blocks may be implemented by various hardware and / or software configurations that perform specific functions. For example, the functional blocks of the present disclosure may be implemented by one or more microprocessors or by circuit configurations for a given function. Furthermore, for example, the functional blocks of the present disclosure may be implemented in various programming or scripting languages. The functional blocks may be implemented by algorithms that execute on one or more processors. Furthermore, the present disclosure may employ conventional techniques for electronic configuration, signal processing, and / or data processing. Terms such as "mechanism," "element," "means," and "configuration" may be used broadly and are not limited to mechanical and physical configurations.

[0029] Additionally, the connecting lines or connecting members between components depicted in the drawings are merely exemplary representations of functional connections and / or physical or circuit connections. In an actual device, connections between components may be represented by various functional connections, physical connections, or circuit connections that may be replaced or added.

[0030] The present disclosure will be described in detail with reference to the attached drawings below.

[0031] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with the electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0032] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0033] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0034] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0035] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0036] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0037] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0038] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0039] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0040] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0041] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0042] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0043] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0044] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0045] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0046] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0047] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0048] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0049] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0050] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0051] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0052] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0053] FIG. 2 is a perspective view of an electronic device according to one embodiment.

[0054] In FIG. 2, an example is shown in which the electronic device (201) is a wearable electronic device in the form of a watch, but the present invention is not limited thereto.

[0055] In one embodiment, the electronic device (201) may be the electronic device (101) of FIG. 1. Referring to FIG. 2, the electronic device (201) may include an outer housing (220), a display device (210), and a rear cover (270).

[0056] An outer housing (220) according to one embodiment may include a first surface (hereinafter, referred to as a front surface) facing a first direction, a second surface (hereinafter, referred to as a rear surface) facing a second direction opposite to the first direction, and a side surface surrounding a space between the first surface and the second surface. The outer housing (220) may have a through hole of a specified size arranged in the center of the front surface to form an opening. For example, the size of the through hole may determine the size at which the display device (210) is exposed. As another example, the outer housing (220) may include a peripheral portion forming the through hole and a side wall that surrounds the through hole while being perpendicular to the peripheral portion or at a predetermined angle. As another example, the outer housing (220) may protect various components (e.g., a display device, a battery, a printed circuit board, etc.) arranged inside. In FIG. 2, a case where the through hole is circular is illustrated as an example, but is not limited thereto.

[0057] According to one embodiment, the outer housing (220) may be coupled with a rear cover (270). In one embodiment, a button or a crown may be additionally arranged on one side of the outer housing (220), and a fastening structure (not shown) configured to be detachably attached to a part of the user's body may be further included. The fastening structure may be implemented, for example, in the form of two bands connected to each of the two opposite edges of the outer housing (220).

[0058] According to one embodiment, at least a portion of the outer housing (220) may be implemented with a conductive material (e.g., metal). In this case, at least a portion of the outer housing (220) (hereinafter, referred to as the first conductive structure) may be used as an antenna radiator for transmitting and receiving data with an external device. For example, the first conductive structure may be used as an antenna of a mobile communication module such as a 2G, 3G, or 4G module. Alternatively, the first conductive structure may be used as an antenna of a GPS communication module, a WiFi communication module, an NFC communication module, or a Bluetooth communication module.

[0059] According to one embodiment, the first conductive structure may be formed over the entire outer housing (220) or may be formed over a portion thereof. For example, the first conductive structure may be formed around a periphery of a through hole through which the display device (210) is exposed. In another example, the first conductive structure may be formed on a side wall of the outer housing (220).

[0060] According to one embodiment, the first conductive structure may include a power supply connection and various ground connections. For example, the power supply connection and various ground connections may be connected to a printed circuit board or various conductive structures within the electronic device (201). The manner in which the antenna radiator including the first conductive structure of the external housing (220) operates will be described in more detail below with reference to FIGS. 2 to 17.

[0061] According to one embodiment, at least a portion of the display device (210) may be exposed to the outside through a through-hole of an external housing (220). The exposed display device (210) may have a shape corresponding to the shape of the through-hole (e.g., circular). For example, the display device (210) may include a region exposed through the through-hole and a region mounted inside the external housing (220). For example, a separate glass may be attached to the region exposed through the through-hole. As another example, the display device (210) may include a display panel (e.g., LCD or OLED) for displaying images or text, a panel (e.g., touch panel) for receiving a user's input, etc. In one embodiment, the display device (210) may be implemented as an OCTA (One Cell TSP AMOLED) in which a touch panel and an AMOLED panel are integrally combined.

[0062] According to one embodiment, the display device (210) may include a second conductive structure implemented with a conductive material (e.g., metal). For example, the second conductive structure may be formed on a flexible printed circuit board (FPCB) included in the display device (210), or may be formed on a separate shielding layer or heat dissipation layer.

[0063] According to one embodiment, the second conductive structure may be electrically connected to the first conductive structure or a printed circuit board (e.g., PCB) included in the external housing (220) and may be utilized as a part of the antenna. In one embodiment, the second conductive structure may include a plurality of conductive plates.

[0064] A rear cover (270) according to one embodiment can be combined with the outer housing (220) to secure and protect the internal components. For example, the rear cover (270) can include a non-metallic material or a non-conductive material.

[0065] Figure 3 is a development diagram of an electronic device according to one embodiment.

[0066] In one embodiment, the electronic device (201) may be the electronic device 101 in FIG. 1 or the electronic device (201) in FIG. 2.

[0067] Referring to FIG. 3, the electronic device (201) may include a display device (210), an outer housing (220), a support structure (230), a battery (240), a bracket (250), a printed circuit board (260), a rear cover (270), and / or a sensing module (280).

[0068] An outer housing (220) according to one embodiment can protect various components disposed inside (e.g., a display device (210), a support structure (230), a battery (240), a bracket (250), or a printed circuit board (260)).

[0069] The display device (210) according to one embodiment may have an overall plate shape and may display images or text, etc. The display device (210) according to one embodiment may be implemented in various types, such as, for example, an LCD type, an OLED type, or an OCTA type. When the display device (210) according to one embodiment includes a touch panel, the display device (210) may receive a user's touch input and provide it to a processor mounted on a printed circuit board (260). In one embodiment, the display device (210) may have various shapes, such as a circle, an oval, or a square.

[0070] According to one embodiment, the display device (210) may include a second conductive structure implemented with a conductive material (e.g., metal). For example, the second conductive structure may be formed on a flexible printed circuit board (FPCB) included in the display device (210), or may be formed on a separate shielding layer or heat dissipation layer. According to one embodiment, the second conductive structure may be connected to the first conductive structure and / or the printed circuit board (260) of the external housing (220) and included as part of a multi-band antenna.

[0071] According to one embodiment, the display device (210) may include a plurality of conductive plates (e.g., an FPCB, a shielding layer, or a heat dissipation layer, etc.). In one embodiment, the plurality of conductive plates may be connected to a printed circuit board (260) to secure antenna performance. For example, in the FPCB of the display device (210), a pattern may extend in a tail shape, and the tail-shaped pattern may be mounted on a bracket (250) and connected to one surface of the printed circuit board (260). By connecting the plurality of conductive plates included in the display device (210) to the printed circuit board (260), the display device (210) may be prevented or reduced from acting as an interference factor in radio wave transmission and reception, and the display device (210) may be utilized for resonance frequency tuning. In one embodiment, the plurality of conductive plates may form at least a portion of the second conductive structure.

[0072] According to one embodiment, the display device (210) may be formed as a laminated structure including a touch panel, a display panel, an adhesive layer, and an FPCB layer. The laminated structure of the display device (210) according to one embodiment will be described in more detail later in FIG. 5.

[0073] A display device (210) according to one embodiment may include a printed circuit board (260) and signal lines for transmitting and receiving data. For example, the display device (210) may have signal lines (e.g., FPCB) related to signal supply of a display panel, signal lines related to signal supply of a touch screen, signal lines for transmitting and receiving NFC signals, or signal lines for grounding, etc., protrudedly arranged.

[0074] According to one embodiment, the outer housing (220) may include a first conductive structure implemented with a conductive material (e.g., metal) at least in a portion. For example, the first conductive structure may be formed on a portion (e.g., a side wall of the outer housing (220)) having the same or similar height as the display device (210). Depending on the position of the first conductive structure according to one embodiment, the characteristics of the corresponding resonant frequency may vary.

[0075] In one embodiment, a support structure (230) may be disposed between a display device (210) and a printed circuit board (260) to secure the display device (210). For example, at least a portion of the support structure (230) (hereinafter, referred to as a third conductive structure) may be implemented using a conductive material (e.g., a metal material). In one embodiment, the third conductive structure may be, but is not limited to, a conductive plate positioned on the upper surface of the bracket (250).

[0076] In one embodiment, the support structure (230) may be connected to the ground of the printed circuit board (260) or to the first conductive structure of the outer housing (220) to adjust the frequency resonance characteristics.

[0077] According to one embodiment, a battery (240) may be placed on a bracket (250) and electrically connected to a printed circuit board (260). The battery (240) may be charged with power from an external power source and may discharge the charged power to drive an electronic device (201).

[0078] According to one embodiment, a bracket (250) may be configured to place and secure a display device (210), a battery (240), or a printed circuit board (260). For example, signal lines connecting each component may be placed and secured in the bracket (250). For example, the bracket (250) may be formed of a non-conductive material (e.g., plastic). In one embodiment, a conductive structure (e.g., a conductive plate) may be included on one surface of the bracket (250) (e.g., a surface adjacent to the display device (210). In one embodiment, the conductive structure included on one surface of the bracket (250) may be connected to the printed circuit board (260) to affect frequency resonance characteristics.

[0079] According to one embodiment, a printed circuit board (260) may have components such as modules or chips required for driving an electronic device (201) arranged thereon. For example, a processor, memory, or communication module may be arranged on the printed circuit board (260). In one embodiment, the printed circuit board (260) may include a power supply electrically connected to an antenna radiator and may include a separate ground.

[0080] According to one embodiment, the power supply unit may be connected to a first conductive structure of an external housing (220). In this case, the first conductive structure may function as an antenna radiator and may be powered from a wireless communication circuit within a printed circuit board (260) through the power supply unit.

[0081] According to one embodiment, the ground of the printed circuit board (260) may be connected to conductive plates (e.g., FPCB, shielding layer, heat dissipation layer, etc.) included in the display device (210). Additionally, the ground of the printed circuit board (260) may be connected to the first conductive structure included in the external housing (220).

[0082] A rear cover (280) according to one embodiment may be coupled with the outer housing (220) to secure and protect the internal components. For example, the rear cover (270) may include a non-metallic material or a non-conductive material.

[0083] A sensing module (280) according to one embodiment may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (201) or an external environmental state. The sensing module (280) may include, for example, a biometric sensing module (280) (e.g., an HRM sensor) disposed on the second surface (110B) of the housing (110). The electronic device (100) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0084] Figure 4 is a cross-sectional view of an electronic device according to one embodiment.

[0085] The cross-sectional view of Fig. 4 is centered on the main components related to the operation of the antenna, and the cross-sectional view of Fig. 4 may further include additional components.

[0086] Referring to FIG. 4, the electronic device (201) may include an outer housing (220) and a display device (210). In one embodiment, the electronic device (201) may include all or part of the electronic device (101) illustrated in FIG. 1 or the electronic device (201) illustrated in FIG. 2.

[0087] The outer housing (220) can protect various components (e.g., a display device (210), a support structure (230), or a printed circuit board (260)) arranged inside the outer housing (220). The outer housing (220) includes a through hole (222) of a specified size in the center of the first surface (front surface), and an opening can be formed by the through hole (222). For example, the display device (210) can be exposed to the outside through the through hole (222) of the outer housing (220).

[0088] According to one embodiment, the outer housing (220) may include a first conductive structure in at least a portion thereof. For example, the first conductive structure may be formed in the entire outer housing (220) or in a portion thereof. The first conductive structure may be used as an antenna radiator for transmitting and receiving RF signals with an external device. According to one embodiment, the first conductive structure may be formed on a side wall of the outer housing (220). The first conductive structure may be formed in various lengths and shapes and may be arranged in various positions, and depending on the length, shape, and arrangement position of the first conductive structure, the frequency resonance characteristics of the antenna radiator including the first conductive structure may vary.

[0089] When the external housing (220) according to one embodiment is utilized as an antenna radiator, the external housing (220) may be connected to a communication circuit mounted on a printed circuit board (260) disposed inside the external housing (220) to transmit and receive a designated signal. In one embodiment, the size, shape, and bending portion of the external housing (220) may be modified into various forms according to the communication characteristics of the communication module. The external housing (220) may be connected to a feeding point (44a) of the printed circuit board (260) through a feeding line (44). The feeding line (44) may be generally made of metal, and may include an elastic structure (for example, a c-clip, a spring, a plate spring, a conductive sponge, a screw, or a spring washer) in some sections.

[0090] According to one embodiment, the feed point (44a) of the outer housing (220) can be connected to an RF circuit (or RF module) mounted on a printed circuit board (260). The outer housing (220) can be powered from the RF circuit of the printed circuit board through the feed point (44a).

[0091] According to one embodiment, the outer housing (220) may be connected to one or more grounds of a printed circuit board (260) via one or more ground lines.

[0092] According to one embodiment, the power supply line (44) may be implemented as a metal plate having contact portions at both ends. As another example, the contact portions may be formed of an elastic material and may be bent.

[0093] According to one embodiment, at least a portion of the display device (210) may be exposed to the outside through a through hole (222) of the external housing (220). In one embodiment, the display device (210) may be implemented in a laminated structure. For example, the display device (210) may be in a laminated form, such as a glass layer (211), a touch panel (212), a display panel (213), a shielding layer (214), and / or a flexible printed circuit board (FPCB) layer (215) for driving the display panel, which will be described later. However, the laminated structure of the display device (210) is not limited thereto.

[0094] According to one embodiment, the display device (210) may include a second conductive structure. In one embodiment, the second conductive structure may form at least a portion of one layer of a laminated structure of the display device. For example, the second conductive structure may be formed on at least a portion of the FPCB layer (215). For example, the second conductive structure may be formed on a first portion (40a) of the FPCB layer (215), which will be described later.

[0095] According to one embodiment, the FPCB layer (215) may include a first portion (40a) to which a chip and / or module for performing an operation of the electronic device (101) is attached, and a second portion (40b) divided (or separated) from the first portion (40a).

[0096] According to one embodiment, the second portion (40b) of the FPCB layer (215) may be positioned at a portion of an edge of the FPCB layer (215), and a conductive member may be formed in the second portion (40b). For example, the conductive member may include at least one of a conductor or a conductive member. For example, the first portion (40a) may be electrically isolated from the conductive member of the second portion (40b). For example, the first portion (40a) and the conductive member of the second portion (40b) may be electrically isolated from each other by not being connected with a conductive material.

[0097] According to one embodiment, the first portion (40a) is electrically isolated from the conductive member formed in the second portion (40b), but the conductive member formed in the second portion (40b) of the FPCB layer (215) is coupled to the first portion (40a) of the FPCB layer (215), such that the conductive member formed in the second portion (40b) of the FPCB layer (215) can be capacitively connected to the first portion (40a) of the FPCB layer (215). According to one embodiment, a capacitance may be formed between the conductive member formed in the second portion (40b) of the FPCB layer (215) and the first portion (40a) of the FPCB layer (215), whereby the frequency resonance characteristics of the antenna radiator including the external housing (220) of the electronic device (101) and at least a portion of the display device (210) may be adjusted by supplying power to the external housing (220) of the electronic device (101). A low-frequency band E-Field is strongly formed between the display device (210) and the external housing (220), and by dividing and forming the second portion (40b) including the conductive member in a portion of the edge of the FPCB layer (215) where the low-frequency band E-Field is strongly formed, the frequency resonance characteristics of the low-frequency band may be adjusted and a low-frequency wideband may be implemented. In addition, by using the conductive member included in the second part (40b) of the edge of the FPCB layer (215) in proximity to another part of the display device (210), which is the main radiator, it is possible to adjust the frequency resonance characteristics of the low-frequency band and implement a low-frequency wideband.

[0098] According to one embodiment, the conductive member of the second portion (40b) may be connected to a printed circuit board (260). For example, the conductive member of the second portion (40b) may be connected to a ground (44c) of the printed circuit board (260) and used to adjust frequency resonance characteristics. Alternatively, for example, the conductive member of the second portion (40b) may be connected to an RF circuit of the printed circuit board (260), in which case the second portion (40b) may be powered by the RF circuit.

[0099] According to one embodiment, modules or chips necessary for driving the electronic device (201) may be placed on the printed circuit board (260). For example, a processor, memory, or communication module may be placed on the printed circuit board (260). In one embodiment, an RF circuit for communication, a control circuit, a power supply, or a ground may be placed on the printed circuit board (260).

[0100] In one embodiment, the printed circuit board (260) may include a feed portion (44b) capable of transmitting a communication signal (e.g., an RF signal) to the antenna radiator, and may include at least one ground (44c). The feed portion (44b) of the printed circuit board (260) may transmit the RF signal to a feed point (44a) of the external housing (220) via a feed line (44) of the external housing (220).

[0101] According to one embodiment, the printed circuit board (260) may be connected to the display device (210) by a connector (43). For example, the connector (43) may include a ground line (41) and a data line (42). The ground line (41) may connect the ground (44c) of the printed circuit board (260) and the second portion (40b) of the FPCB layer (215). The data line (42) may connect the printed circuit board (260) to the first portion (40a) of the FPCB layer (215). An image signal from the printed circuit board (260) may be provided to the first portion (40a) of the FPCB layer (215) via the data line (42).

[0102] According to one embodiment, the ground line (41) may be included within a connector (43) that provides a video signal from a printed circuit board (260) to a display device (210), but is not limited thereto. For example, the ground line (41) may be implemented as a separate, independent configuration without being included within a connector (43) that includes a data line (42).

[0103] According to one embodiment, the ground line (41) and / or the data line (42) may extend in a tail shape from the FPCB layer (215). For example, the ground line (41) and / or the data line (42) may be generally made of metal and may include an elastic structure (e.g., a c-clip, a spring, a plate spring, a conductive sponge, a screw, or a spring washer) in some sections.

[0104] FIG. 5 is a cross-sectional view of a display device according to one embodiment.

[0105] Referring to FIG. 5, a display device (210) according to one embodiment may include a glass layer (211), a touch panel (212), a display panel (213), a shielding layer (214), and / or an FPCB layer (215).

[0106] According to one embodiment, the glass layer (211) can protect the display device (210) from the outside.

[0107] A touch panel (212) according to one embodiment can detect a user's touch input (or touch pen input). For example, the touch panel (212) can provide a change in a signal (e.g., a change in electrostatic capacity) according to the touch input to a processor (e.g., 120) on a printed circuit board (260). According to one embodiment, the touch panel (212) can include a touch signal line directly connected to the printed circuit board (260). According to one embodiment, the touch panel (212) can be connected to the ground of the printed circuit board (260) and can act as a ground layer, but is not limited thereto.

[0108] A display panel (213) according to one embodiment can output images or text, etc.

[0109] According to one embodiment, the shielding layer (214) can block influence by electromagnetic waves.

[0110] According to one embodiment, the FPCB layer (215) may be equipped with a module or chip, etc., required for driving the display panel (213). At least a portion of the FPCB layer (215) according to one embodiment may be connected to the ground of the printed circuit board (260) and may function as a ground. According to one embodiment, the FPCB layer (215) may be connected to the printed circuit board (260) through a data line (42) for transmitting and receiving data. For example, a first portion (40a) of the FPCB layer (215) may be connected to the printed circuit board (260) through the data line (42). For example, the data line (42) may be included in a connector (43).

[0111] An FPCB layer (215) according to one embodiment may include a first portion (40a) to which a chip and / or module for performing the operation of the display panel (213) is attached, and a second portion (40b) divided (or separated) from the first portion (40a). For example, the first portion (40a) and the second portion (40b) may be electrically separated.

[0112] According to one embodiment, the second portion (40b) may be positioned in a portion of an edge area of ​​the FPCB layer (215), and a conductive member may be formed in the second portion (40b). According to one embodiment, the first portion (40a) and the second portion (40b) are electrically isolated, but the conductive member formed in the second portion (40b) of the FPCB layer (215) is coupled to the first portion (40a) of the FPCB layer (215), so that the conductive member formed in the second portion (40b) of the FPCB layer (215) may be capacitively connected to the first portion (40a) of the FPCB layer (215). According to one embodiment, a capacitance may be formed between the conductive member formed in the second portion (40b) of the FPCB layer (215) and the first portion (40a) of the FPCB layer (215), whereby the frequency resonance characteristics of an antenna radiator including the external housing (220) of the electronic device (101) and at least a portion of the display device (210) may be adjusted by supplying power to the external housing (220) of the electronic device (101).

[0113] According to one embodiment, a low-frequency band E-Field is strongly formed between the display device (210) and the external housing (220), and by forming a second portion (40b) including a conductive member in a portion of the edge of the FPCB layer (215) of the display device (210), the frequency resonance characteristics of the low-frequency band can be adjusted and a low-frequency wideband can be implemented. In addition, by using the conductive member included in the second portion (40b) of the edge of the FPCB layer (215) close to another portion of the display device (210), which is the main radiator, the frequency resonance characteristics of the low-frequency band can be adjusted and a low-frequency wideband can be implemented.

[0114] FIG. 6 is a drawing showing a divided first part and a second part of an FPCB according to one embodiment.

[0115] Referring to FIG. 6, the FPCB layer (215) of the display device (210) according to one embodiment may have a shape including an arc according to the shape of the inner surface of the outer housing (220) of the electronic device (101). A second portion (40b) may be formed on a portion of the edge of the FPCB layer (215), and the second portion (40b) may be electrically divided (or separated) from the first portion (40a) of the FPCB layer (215). A conductive member may be formed on the second portion (40b).

[0116] In one embodiment, the conductive member formed in the second portion (40b) may not be connected to the first portion (40a) of the FPCB layer (215) by a conductive material. In one embodiment, the conductive member formed in the second portion (40b) may be coupled to the first portion (40a) of the FPCB layer (215). For example, the conductive member formed in the second portion (40b) may be coupled to a conductive structure within the first portion (40a) of the FPCB layer (215), but is not limited thereto.

[0117] In one embodiment, a capacitance may be formed between the conductive member formed in the second portion (40b) and the first portion (40a) by supplying power to the outer housing (220). For example, a capacitance may be formed between the conductive member formed in the second portion (40b) and the conductive structure within the first portion (40a).

[0118] FIG. 7 is a diagram illustrating an example in which the electrical length of an antenna radiator including an external housing and at least a portion of a display device is adjusted as the external housing is powered according to one embodiment.

[0119] Referring to FIG. 7, the conductive member of the second portion (40b) of the FPCB layer (215) according to one embodiment may be connected to the printed circuit board (260) through the switch (70). The conductive member of the second portion (40b) of the FPCB layer (215) may be connected to the ground of the printed circuit board (260) through the switch (70). For example, when the switch (70) is short-circuited and the external housing (220) is powered from the printed circuit board (260), the external housing (220), the first portion (40a) of the FPCB layer (215), and the second portion (40b) of the FPCB layer (215) may be coupled to each other. For example, the conductive structure of the outer housing (220) and the first part (40a) of the FPCB layer (215) may be coupled, the conductive structure of the outer housing (220) and the second part (40b) of the FPCB layer (215) may be coupled, and the first part (40a) of the FPCB layer (215) and the second part (40b) of the FPCB layer (215) may be coupled. For example, as the outer housing (220), the first part (40a) of the FPCB layer (215), and the second part (40b) of the FPCB layer (215) are coupled to each other, capacitance may be formed between the conductive structure of the outer housing (220) and the first part (40a) of the FPCB layer (215), capacitance may be formed between the conductive structure of the outer housing (220) and the second part (40b) of the FPCB layer (215), and capacitance may be formed between the first part (40a) of the FPCB layer (215) and the second part (40b) of the FPCB layer (215).

[0120] According to one embodiment, as the switch (70) is shorted or opened, the electrical length of the antenna radiator including at least a portion of the outer housing (220) and the display device (210) can be adjusted and the characteristics of the frequency resonance of the antenna radiator can be adjusted.

[0121] Although the switch (70) is depicted as being positioned outside of the printed circuit board (260) in FIG. 7, this is not limiting. For example, the switch (70) may be positioned on the printed circuit board (260). For example, the switch (70) may be connected to ground via lumped elements on the printed circuit board (260).

[0122] FIG. 8 is a drawing for explaining the length and width of a conductive member formed in a second portion of an FPCB according to one embodiment.

[0123] Referring to FIG. 8, the length and width of the conductive member of the second portion (40b) of the FPCB layer (215) according to one embodiment can be formed so that the electronic device (101) can adjust the frequency resonance characteristics of the low-frequency band.

[0124] For example, the conductive member of the second part (40b) of the FPCB layer (215) may be formed in the divided second part (40b) of the FPCB layer (215) such that the length of the conductive member of the second part (40b) of the FPCB layer (215) is about 10 mm or more, and the length width of the conductive member of the second part (40b) of the FPCB layer (215) is about 1 mm or more.

[0125] FIG. 9 is a drawing showing the radiation performance of an antenna radiator according to the length of a conductive member formed in a second portion of an FPCB according to one embodiment.

[0126] Referring to FIG. 9, the graph of FIG. 9 shows the radiation performance of the antenna radiator when the length of the conductive member of the second part (40b) of the FPCB layer (215) is 20 mm, when the length of the conductive member of the second part (40b) of the FPCB layer (215) is 15 mm, when the length of the conductive member of the second part (40b) of the FPCB layer (215) is 10 mm, and when the length of the conductive member of the second part (40b) of the FPCB layer (215) is 5 mm.

[0127] As shown in Fig. 9, when the length of the conductive member of the second portion (40b) of the FPCB layer (215) is 10 mm or more, the antenna radiator can have good radiation performance in the frequency band of 980 MHz to 1000 MHz. For example, as the length of the conductive member of the second portion (40b) increases, the resonant frequency of the antenna including the conductive structure of the external housing (220) can decrease.

[0128] FIG. 10 is a drawing showing the radiation performance of an antenna radiator according to the width of a conductive member formed in a second portion of an FPCB according to one embodiment.

[0129] Referring to FIG. 10, the graph of FIG. 10 shows the radiation performance of the antenna radiator when the width of the conductive member of the second part (40b) of the FPCB layer (215) is 2 mm, when the width of the conductive member of the second part (40b) of the FPCB layer (215) is 1.5 mm, when the width of the conductive member of the second part (40b) of the FPCB layer (215) is 1 mm, and when the width of the conductive member of the second part (40b) of the FPCB layer (215) is 0.5 mm.

[0130] As shown in Fig. 10, when the width of the conductive member of the second portion (40b) of the FPCB layer (215) is 1 mm or more, the antenna radiator can have good radiation performance in the frequency band of 920 MHz to 940 MHz. For example, even if the width of the conductive member of the second portion (40b) is changed, the resonant frequency of the antenna including the conductive structure of the external housing (220) can be substantially similar. For example, the width of the conductive member of the second portion (40b) can have less of an effect on the resonant frequency of the antenna including the conductive structure of the external housing (220) than the length of the conductive member of the second portion (40b).

[0131] FIG. 11 is a drawing showing an example in which a conductive member formed in a second portion of an FPCB according to one embodiment and a matching circuit of a printed circuit board are connected by a switch.

[0132] Referring to FIG. 11, a second portion (40b) of a PFCB layer (215) according to one embodiment may be connected to a switch (70) on a printed circuit board (260) via a ground line (41). The ground line (41) may be generally made of metal and may include an elastic structure (e.g., a c-clip, a spring, a plate spring, a conductive sponge, a screw, or a spring washer) in some sections.

[0133] According to one embodiment, the switch (70) may be connected to a matching circuit (72) on a printed circuit board (260), and the matching circuit (72) may be connected to a ground (75) on the printed circuit board (260).

[0134] The matching circuit (72) may include at least one lumped element, and may include, for example, a plurality of capacitors (C1, C2, C3, C4). For example, the matching circuit (72) may include a plurality of capacitors (C1, C2, C3, and C4) connected in parallel with each other and may be disposed between the switch (70) and the ground (75). However, the present invention is not limited thereto, and for example, the matching circuit may include at least one of another lumped element (e.g., an inductor or a variable capacitor) or another switch.

[0135] In one embodiment, capacitors (C1, C2, C3, C4) having various capacitances may be included within the matching circuit (72). By arranging capacitors (C1, C2, C3, C4) having various capacitance values ​​within the matching circuit (72) and controlling short-circuiting and opening of the switch (70), the frequency resonance characteristics of the antenna radiator including at least a portion of the external housing (220) and the display device (210) may be adjusted. For example, the frequency resonance characteristics of a low-frequency band of the antenna radiator including at least a portion of the external housing (220) and the display device (210) may be adjusted.

[0136] FIG. 12 is a diagram showing wiring connections between a display device and a printed circuit board according to one embodiment.

[0137] Referring to FIG. 12, a first portion (40a) and a second portion (40b) of an FPCB layer (215) in a display device (210) according to one embodiment may be connected to a printed circuit board (260) through different electrical paths, respectively. For example, a first portion (40a) of an FPCB layer (215) in a display device (210) may be connected to a printed circuit board (260) through a data line (42), and a second portion (40b) of an FPCB layer (215) may be connected to a printed circuit board (260) through a ground line (41). For example, a first portion (40a) of an FPCB layer (215) in a display device (210) may be connected to a ground of a printed circuit board (260) through a data line (42) (e.g., a display connector). The ground line (41) and the data line (42) can be separated from each other and formed as separate lines.

[0138] For example, the second part (40b) of the FPCB layer (215) may be connected to the printed circuit board (260) via the ground line (41). For example, the second part (40b) of the FPCB layer (215) may be connected to the ground (75) of the printed circuit board (260) via the ground line (41). For example, the second part (40b) of the FPCB layer (215) may be connected to the switch (70) on the printed circuit board (260) via the ground line (41), and the switch (70) may be connected to the ground (75) of the printed circuit board (260). For example, the second part (40b) of the FPCB layer (215) may be connected to a switch (70) on a printed circuit board (260) via a ground line (41), the switch (70) may be connected to a matching circuit (72) on the printed circuit board (260), and the matching circuit (72) may be connected to a ground (75) on the printed circuit board (260).

[0139] For example, the first portion (40a) of the FPCB layer (215) may be connected to a printed circuit board (260) via a data line (42). For example, image data may be provided to a display device (210) via the data line (42).

[0140] FIG. 13 is a drawing showing wiring connections between a conductive member disposed below a display device, a display device, and a printed circuit board according to one embodiment.

[0141] Referring to FIG. 13, a second portion (40b) of an FPCB layer (215) in a display device (210) according to one embodiment may not include a conductive member. For example, a conductive member (46) may be disposed below the second portion (40b) of the FPCB layer (215) in the display device (210) so as not to be included in the FPCB layer (215). For example, the second portion (40b) of the FPCB layer (215) may include a fill-cut region. In this case, for example, the conductive member (46) disposed below the first portion (40a) of the FPCB layer (215) may be connected to a printed circuit board (260) via a ground line (41). For example, a conductive member (46) disposed under the second portion (40b) of the FPCB layer (215) can be connected to a ground (75) of a printed circuit board (260) via a ground line (41). For example, a conductive member (46) disposed under the second portion (40b) of the FPCB layer (215) can be connected to a switch (70) on a printed circuit board (260) via a ground line (41), and the switch (70) can be connected to a ground (75) of the printed circuit board (260). For example, a conductive member (46) disposed below the second portion (40b) of the FPCB layer (215) may be connected to a switch (70) on a printed circuit board (260) via a ground line (41), the switch (70) may be connected to a matching circuit (72) on the printed circuit board (260), and the matching circuit may be connected to a ground (75) on the printed circuit board (260).

[0142] For example, the first portion (40a) of the FPCB layer (215) may be connected to a printed circuit board (260) via a data line (42). For example, image data may be provided to a display device (210) via the data line (42).

[0143] According to one embodiment, a conductive member (46) disposed below a second portion (40b) of the FPCB layer (215) can be coupled with a first portion (40a) of the FPCB layer (215).

[0144] In one embodiment, the conductive member (46) may be disposed on the display device (210).

[0145] FIG. 14 is a drawing showing wiring connections between a conductive member disposed below a display device, a display device, and a printed circuit board according to one embodiment.

[0146] Referring to FIG. 14, the FPCB layer (215) of the display device (210) according to one embodiment may not be divided. For example, the FPCB layer (215) of the display device (210) may not be divided into a first portion (40a) and a second portion (40b). For example, a conductive member included in the first portion (40a) may extend to the second portion (40b). In this case, a conductive member (46) may be disposed below a portion of an edge of the FPCB layer (215) of the display device (210). In this case, for example, the conductive member (46) disposed below a portion of an edge of the FPCB layer (215) may be connected to a printed circuit board (260) via a ground line (41). For example, a conductive member (46) disposed below a portion of an edge of the FPCB layer (215) may be connected to a ground (75) of a printed circuit board (260) via a ground line (41). For example, a conductive member (46) disposed below a portion of an edge of the FPCB layer (215) may be connected to a switch (70) on a printed circuit board (260) via a ground line (41), and the switch (70) may be connected to a ground (75) of the printed circuit board (260). For example, a conductive member (46) disposed below a portion of an edge of the FPCB layer (215) may be connected to a switch (70) on a printed circuit board (260) via a ground line (41), and the switch (70) may be connected to a matching circuit on the printed circuit board (260), and the matching circuit (72) may be connected to a ground (75) on the printed circuit board (260).

[0147] For example, the FPCB layer (215) can be connected to a printed circuit board (260) via a data line (42). Image data can be provided to a display device (210) via the data line (42).

[0148] According to one embodiment, a conductive member (46) disposed below a portion of an edge of the FPCB layer (215) may be coupled with the conductive member included in the FPCB layer (215). For example, the conductive member may be a ground layer of the FPCB layer (215).

[0149] FIG. 15 is a drawing showing an example of the arrangement locations of a power supply point, a ground point, and a switch of an electronic device according to one embodiment.

[0150] Referring to FIG. 15, power may be supplied to a first point (80) of an external housing (220) of an electronic device (101) according to one embodiment, and a second point (82) of a second portion (40b) of an FPCB layer (215) may be connected to a printed circuit board (260) via a switch (70). According to one embodiment, the first point (80) may be a power supply point, and the second point (82) may be a ground point.

[0151] For example, based on the drawing of FIG. 15, the first point (80) may be located near the upper right part of the outer housing (220), and the second point (82) may be located near the lower right part of the outer housing (220) among the second part (40b) of the FPCB layer (215).

[0152] For example, when power is supplied to the first point (80) of the outer housing (220), the second point (82) of the FPCB layer (215) is connected to the printed circuit board (260) via the switch (70), and the switch (70) is short-circuited, the outer housing (220), the first portion (40a) of the FPCB layer (215), and the second portion (40b) of the FPCB layer (215) can be coupled to each other. For example, a capacitance is formed between the outer housing (220), the first portion (40a) of the FPCB layer (215), and the second portion (40b) of the FPCB layer (215), and the low-frequency resonance characteristics of the antenna radiator including at least a portion of the outer housing (220) and the display device (210) can be adjusted.

[0153] FIG. 16 is a drawing showing an example of a conductive member formed in a second portion of an FPCB according to one embodiment being powered.

[0154] The cross-sectional view of Fig. 16 is centered on the main components related to the operation of the antenna, and the cross-sectional view of Fig. 16 may further include additional components.

[0155] Referring to FIG. 16, the conductive member formed in the second portion (40b) of the FPCB layer (215) can be connected to the RF circuit of the printed circuit board (260) by the power supply line (45). In this case, the conductive member formed in the second portion (40b) of the FPCB layer (215) can be powered through the power supply line (45). For example, the power supply line (45) can be generally made of metal and can include an elastic structure (e.g., a c-clip, a spring, a plate spring, a conductive sponge, a screw, or a spring washer) in some sections.

[0156] According to one embodiment, the power supply line (45) may be included within a connector (43) that provides a video signal from a printed circuit board (260) to a display device (210), but is not limited thereto. For example, the power supply line (45) may be implemented as a separate, independent configuration, rather than being included within a connector (43) that includes a data line (42).

[0157] FIG. 17 is a drawing showing the performance of an antenna radiator when power is supplied to a conductive member formed in a second portion of an FPCB according to one embodiment.

[0158] Referring to FIG. 17, when the conductive member formed in the second part (40b) of the FPCB layer (215) is powered, the antenna radiator including the conductive member formed in the second part (40b) of the FPCB layer (215) can have good radiation performance in a frequency band of 1000 MHz to 1500 MHz.

[0159] FIG. 18 is a block diagram (1800) of an electronic device (101) for supporting legacy network communication and 5G network communication according to various embodiments. Referring to FIG. 18, the electronic device (101) may include a first communication processor (1812), a second communication processor (1814), a first radio frequency integrated circuit (RFIC) (1822), a second RFIC (1824), a third RFIC (1826), a fourth RFIC (1828), a first radio frequency front end (RFFE) (1832), a second RFFE (1834), a first antenna module (1842), a second antenna module (1844), and an antenna (1848). The electronic device (101) may further include a processor (120) and a memory (130). The network (199) may include a first network (1892) and a second network (1894). According to another embodiment, the electronic device (101) may further include at least one of the components described in FIG. 1, and the network (199) may further include at least one other network. According to one embodiment, the first communication processor (1812), the second communication processor (1814), the first RFIC (1822), the second RFIC (1824), the fourth RFIC (1828), the first RFFE (1832), and the second RFFE (1834) may form at least a portion of the wireless communication module (192). According to another embodiment, the fourth RFIC (1828) may be omitted or may be included as a part of the third RFIC (1826).

[0160] The first communication processor (1812) may establish a communication channel in a band to be used for wireless communication with the first network (1892), and may support legacy network communication through the established communication channel. According to various embodiments, the first network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor (1814) may establish a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second network (1894), and may support 5G network communication through the established communication channel. According to various embodiments, the second network (1894) may be a 5G network defined by the 3GPP. Additionally, according to one embodiment, the first communication processor (1812) or the second communication processor (1814) may establish a communication channel corresponding to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second network (1894), and support 5G network communication through the established communication channel. According to one embodiment, the first communication processor (1812) and the second communication processor (1814) may be implemented in a single chip or a single package. According to various embodiments, the first communication processor (1812) or the second communication processor (1814) may be formed in a single chip or a single package with the processor (120), the auxiliary processor (123), or the communication module (190).

[0161] The first RFIC (1822) may, upon transmission, convert a baseband signal generated by the first communication processor (1812) into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first network (1892) (e.g., a legacy network). Upon reception, the RF signal may be acquired from the first network (1892) (e.g., a legacy network) via an antenna (e.g., the first antenna module (1842)) and preprocessed via an RFFE (e.g., the first RFFE (1832)). The first RFIC (1822) may convert the preprocessed RF signal into a baseband signal so that it may be processed by the first communication processor (1812).

[0162] The second RFIC (1824) may, upon transmission, convert a baseband signal generated by the first communication processor (1812) or the second communication processor (1814) into an RF signal (hereinafter, a 5G Sub6 RF signal) of a Sub6 band (e.g., about 6 GHz or less) used in the second network (1894) (e.g., a 5G network). Upon reception, the 5G Sub6 RF signal may be acquired from the second network (1894) (e.g., a 5G network) via an antenna (e.g., the second antenna module (1844)) and preprocessed via an RFFE (e.g., the second RFFE (1834)). The second RFIC (1824) may convert the preprocessed 5G Sub6 RF signal into a baseband signal so that the preprocessed 5G Sub6 RF signal may be processed by a corresponding communication processor among the first communication processor (1812) or the second communication processor (1814).

[0163] The third RFIC (1826) may convert the baseband signal generated by the second communication processor (1814) into an RF signal (hereinafter, 5G Above6 RF signal) of a 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second network (1894) (e.g., 5G network). Upon reception, the 5G Above6 RF signal may be acquired from the second network (1894) (e.g., 5G network) via an antenna (e.g., antenna 1848) and preprocessed via the third RFFE (1836). The third RFIC (1826) may convert the preprocessed 5G Above6 RF signal into a baseband signal so that it may be processed by the second communication processor (1814). In one embodiment, the third RFFE (1836) may be formed as a part of the third RFIC (1826).

[0164] The electronic device (101) may, according to one embodiment, include a fourth RFIC (1828) separately from or at least as a part of the third RFIC (1826). In this case, the fourth RFIC (1828) may convert a baseband signal generated by the second communication processor (1814) into an RF signal (hereinafter, referred to as an IF signal) of an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) and then transmit the IF signal to the third RFIC (1826). The third RFIC (1826) may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second network (1894) (e.g., a 5G network) via an antenna (e.g., antenna 1848) and converted into an IF signal by the third RFIC (1826). The fourth RFIC (1828) can convert the IF signal into a baseband signal for processing by the second communications processor (1814).

[0165] In one embodiment, the first RFIC (1822) and the second RFIC (1824) may be implemented as a single chip or at least a portion of a single package. In one embodiment, the first RFFE (1832) and the second RFFE (1834) may be implemented as a single chip or at least a portion of a single package. In one embodiment, at least one antenna module of the first antenna module (1842) or the second antenna module (1844) may be omitted or combined with another antenna module to process RF signals of a corresponding plurality of bands.

[0166] According to one embodiment, the third RFIC (1826) and the antenna (1848) may be disposed on the same substrate to form a third antenna module (1846). For example, the wireless communication module (192) or the processor (120) may be disposed on the first substrate (e.g., the main PCB). In this case, the third RFIC (1826) may be disposed on a portion (e.g., the bottom surface) of a second substrate (e.g., the sub PCB) separate from the first substrate, and the antenna (1848) may be disposed on another portion (e.g., the top surface) of the second substrate, thereby forming the third antenna module (1846). By disposing the third RFIC (1826) and the antenna (1848) on the same substrate, it is possible to reduce the length of the transmission line therebetween. This can reduce, for example, the loss (e.g., attenuation) of signals in the high-frequency band (e.g., about 6 GHz to about 60 GHz) used in 5G network communications due to transmission line transmission. As a result, the electronic device (101) can improve the quality or speed of communication with the second network (1894) (e.g., the 5G network).

[0167] According to one embodiment, the antenna (1848) may be formed as an antenna array including a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC (1826) may include a plurality of phase shifters (1838) corresponding to the plurality of antenna elements, for example, as part of the third RFFE (1836). Upon transmission, each of the plurality of phase shifters (1838) may shift the phase of a 5G Above6 RF signal to be transmitted to an external source (e.g., a base station of a 5G network) of the electronic device (101) via its corresponding antenna element. Upon reception, each of the plurality of phase shifters (1838) may shift the phase of a 5G Above6 RF signal received from the external source via its corresponding antenna element to the same or substantially the same phase. This enables transmission or reception via beamforming between the electronic device (101) and the external source.

[0168] The second network (1894) (e.g., a 5G network) may operate independently (e.g., Stand-Alone (SA)) or connected to (e.g., Non-Stand Alone (NSA)) the first network (1892) (e.g., a legacy network). For example, the 5G network may only have an access network (e.g., a 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)). In such a case, the electronic device (101) may access an external network (e.g., the Internet) under the control of the core network (e.g., evolved packed core (EPC)) of the legacy network after accessing the access network of the 5G network. Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) may be stored in the memory (1830) and accessed by other components (e.g., the processor (120), the first communication processor (1812), or the second communication processor (1814)).

[0169] An electronic device according to one embodiment may include an outer housing (220) including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface surrounding a space between the first surface and the second surface; a display device (210) at least partially exposed through the first surface of the outer housing, the display device including a plurality of layers including a flexible printed circuit board (FPCB) layer (215), the FPCB layer including a first portion (40a) and a second portion (40b) divided from the first portion, the second portion including a conductive member formed in a portion of an edge of the FPCB layer; a printed circuit board (260) disposed between the second surface of the outer housing and the display device; a power supply line (44) connecting a communication circuit on the printed circuit board and the outer housing to supply power to the outer housing; and a ground line (41) connecting the conductive member and the printed circuit board. Additionally, the ground line may be included in a connector (43) connecting the printed circuit board and the display device.

[0170] According to one embodiment, the conductive member included in the second portion is electrically separated from the first portion, and the conductive member included in the second portion and the first portion can be coupled to each other.

[0171] According to one embodiment, as an RF signal is transmitted from the communication circuit to the external housing, a capacitance may be formed between the conductive member included in the first portion and the second portion of the display device.

[0172] According to one embodiment, the connector may include a data line (42) for transmitting a video signal provided from the printed circuit board to the display device (210).

[0173] According to one embodiment, the ground line may be connected to a switch (70) within the printed circuit board.

[0174] According to one embodiment, the device further comprises a communication processor (1812, 1814), wherein the communication processor is capable of controlling the switch to adjust the electrical length of an antenna radiator that radiates an RF signal provided from the communication circuit to the external housing.

[0175] According to one embodiment, the switch may be connected to a matching circuit (72) comprising at least one lumped element.

[0176] According to one embodiment, the conductive member included in the second portion may be formed to have a length of 10 mm or more and a width of 1 mm or more.

[0177] According to one embodiment, the outer housing includes a conductive structure forming at least a portion of the first surface and / or the side surface of the outer housing and electrically connected to the communication circuit; wherein the power supply line can connect the communication circuit on the printed circuit board and the conductive structure included within the outer housing.

[0178] An electronic device according to one embodiment may include an outer housing (220) including a conductive structure formed in an area including a side surface of the electronic device; a display device (210) at least partially exposed through a first surface of the outer housing, the display device including a flexible printed circuit board (FPCB) layer (215), the FPCB layer including a first portion (40a) and a second portion (40b) divided from the first portion, the second portion being formed in a portion of an edge area of ​​the FPCB layer and including a conductive member (40); a printed circuit board (260) disposed between a second surface of the outer housing opposite to the first surface and the display device; and a ground line (41) connecting the conductive member and the printed circuit board. In addition, the ground line may be included in a connector (43) connecting the printed circuit board and the display device.

[0179] According to one embodiment, the conductive member included in the second portion divided from the first portion is electrically separated from the first portion, and the conductive member included in the second portion and the first portion can be coupled to each other.

[0180] In one embodiment, as an RF signal is transmitted from the communication circuit on the printed circuit board to the external housing, a capacitance may be formed between the first portion and the second portion of the display device.

[0181] According to one embodiment, the connector may include a data line (42) for transmitting a video signal provided from the printed circuit board to the display device (210).

[0182] According to one embodiment, the ground line is connected to a switch (70) within the printed circuit board, and the electronic device further includes a communication processor (1812, 1814); wherein the communication processor can control the switch to adjust the electrical length of an antenna radiator that radiates an RF signal provided from the communication circuit on the printed circuit board to the external housing.

[0183] In one embodiment, the outer housing may further include a conductive structure forming at least a portion of the first surface and / or the side surface of the outer housing and electrically connected to a communication circuit on the printed circuit board; and a power supply line connecting the communication circuit on the printed circuit board and the conductive structure contained within the outer housing.

[0184] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0185] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0186] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0187] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0188] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0189] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, An outer housing (220) including a first side facing in a first direction, a second side facing in a second direction opposite to the first direction, and a side surface surrounding a space between the first side and the second side; A display device (210) at least partially exposed through the first surface of the outer housing, the display device including a plurality of layers including a flexible printed circuit board (FPCB) layer (215), the FPCB layer including a first portion (40a) and a second portion (40b) divided from the first portion, the second portion including a conductive member formed in a portion of an edge area of ​​the FPCB layer; A printed circuit board (260) disposed between the second surface of the outer housing and the display device; For power supply to the external housing, a power supply line (44) connecting the communication circuit on the printed circuit board and the external housing; and A ground line (41) connecting the conductive member and the printed circuit board; Including, An electronic device, wherein the ground line is included in a connector (43) connecting the printed circuit board and the display device.

2. In paragraph 1, An electronic device wherein the conductive member included in the second portion divided from the first portion is electrically separated from the first portion, and the conductive member included in the second portion and the first portion are coupled to each other.

3. In paragraph 1, An electronic device, wherein a capacitance is formed between the first part and the second part of the display device as an RF signal is transmitted from the communication circuit to the external housing.

4. In paragraph 1, An electronic device, wherein the connector includes a data line (42) for transmitting a video signal provided from the printed circuit board to the display device (210).

5. In paragraph 1, An electronic device wherein the above ground line is connected to a switch (70) within the printed circuit board.

6. In paragraph 5, Communication processor (1812, 1814); Including more, An electronic device wherein the communication processor controls the switch to adjust the electrical length of an antenna radiator that radiates an RF signal provided from the communication circuit to the external housing.

7. In paragraph 5, An electronic device, wherein the switch is connected to a matching circuit (72) including at least one lumped element.

8. In paragraph 1, An electronic device, wherein the conductive member included in the second portion is formed to have a length of 10 mm or more and a width of 1 mm or more.

9. In paragraph 1, The outer housing comprises a conductive structure forming at least a portion of the first surface and / or the side surface of the outer housing and electrically connected to the communication circuit; Including, An electronic device wherein the above power line connects the communication circuit on the printed circuit board and the conductive structure contained within the external housing.

10. In electronic devices, An outer housing (220) comprising a conductive structure formed in an area including a side surface of the electronic device; A display device (210) at least partially exposed through a first surface of the outer housing, the display device including a flexible printed circuit board (FPCB) layer (215), the FPCB layer including a first portion (40a) and a second portion (40b) divided from the first portion, the second portion being formed in a portion of an edge area of ​​the FPCB layer and including a conductive member (40); A printed circuit board (260) disposed between the second side opposite to the first side of the outer housing and the display device; and A ground line (41) connecting the conductive member and the printed circuit board; Including, An electronic device, wherein the ground line is included in a connector (43) connecting the printed circuit board and the display device.

11. In clause 10, An electronic device wherein the conductive member included in the second portion divided from the first portion is electrically separated from the first portion, and the conductive member included in the second portion and the first portion are coupled to each other.

12. In paragraph 10, An electronic device, wherein a capacitance is formed between the first part and the second part of the display device as an RF signal is transmitted from the communication circuit on the printed circuit board to the external housing.

13. In paragraph 10, An electronic device, wherein the connector includes a data line (42) for transmitting a video signal provided from the printed circuit board to the display device (210).

14. In paragraph 10, The above ground line is connected to a switch (70) within the printed circuit board, The above electronic device, Communication processor (1812, 1814); Including more, An electronic device wherein the communication processor controls the switch to adjust the electrical length of an antenna radiator that radiates an RF signal provided from the communication circuit on the printed circuit board to the external housing.

15. In paragraph 10, The outer housing comprises a conductive structure forming at least a portion of the first surface and / or the side surface of the outer housing and electrically connected to a communication circuit on the printed circuit board; and A power line connecting the communication circuit on the printed circuit board and the conductive structure contained within the external housing; An electronic device further comprising:

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