Photosensitive resin composition, insulating film, and display device comprising same

Abstract

A photosensitive resin composition having a coloring function is disclosed. According to one aspect, the provided photosensitive resin composition comprises an alkali-soluble resin and a photoactive compound, wherein the alkali-soluble resin and / or the photoactive compound has an absorption maximum of a wavelength of 400 to 550 nm on the basis of UV-vis spectroscopy.

Description

Photosensitive resin composition, insulating film and display device including the same The present invention relates to a photosensitive resin composition, and more specifically, to a photosensitive resin composition, an insulating film, and a display device including the same. Photosensitive resin compositions are representative functional polymer materials used in the production of various precision electronic products. They are currently being used significantly in high-tech industries, particularly in the production of semiconductors and displays. Generally, a photosensitive resin composition refers to a composition whose molecular structure undergoes a chemical change upon exposure to light within a short period of time, resulting in changes in physical properties such as solubility in specific solvents, coloration, and curing. Photosensitive resin compositions enable fine-precision processing, significantly reduce energy and raw materials compared to thermal reaction processes, and allow for quick and accurate work in small installation spaces. Therefore, they are widely used in various precision electronic industries such as advanced printing, semiconductor production, display production, and photocurable surface coating materials. These photosensitive resin compositions can be broadly divided into negative and positive types. Negative photosensitive resin compositions are the type in which the light-irradiated portion becomes insoluble in the developer, and positive photosensitive resin compositions are the type in which the light-irradiated portion becomes soluble in the developer. Recently, as electronic devices have become highly integrated and finely patterned, positive photosensitive resin compositions are mainly used because they can minimize the defect rate and increase processing efficiency and resolution. The purpose of the present invention is to provide a photosensitive resin composition capable of lowering the transmittance of a pattern film. Another object of the present invention is to provide a photosensitive resin composition having excellent sensitivity, residual film ratio, adhesion of a cured film to a substrate, chemical resistance, heat resistance, hygroscopicity, and device reliability at an appropriate level. Another object of the present invention is to provide a photosensitive resin composition having a coloring function. Another object of the present invention is to provide an insulating film including a cured body in which the photosensitive resin composition is cured. Another object of the present invention is to provide a display device including the insulating film. The purposes of the present invention are not limited to those mentioned above, and other unmentioned purposes and advantages of the present invention can be understood through the following description and will be more clearly understood through the embodiments of the present invention. Furthermore, it will be readily apparent that the purposes and advantages of the present invention can be realized by the means and combinations thereof set forth in the claims. [1] According to one aspect of the present invention for achieving the above purpose, a photosensitive resin composition is provided, comprising: an alkali-soluble resin; and a photoactive compound; wherein at least one of the alkali-soluble resin and the photoactive compound has an absorption maximum (inflection point) at a wavelength of 400 to 550 nm based on UV-Vis spectroscopy. [2] In the above [1], at least one of the alkali-soluble resin and the photoactive compound may include at least one of the structures represented by the following chemical formulae 1, 2-1 to 2-3, and 3 to 7. Preferably, at least one of the alkali-soluble resin and the photoactive compound may include a combination of the structures of the following chemical formulae 1 and 2-1, a combination of the structures of the following chemical formulae 1 and 2-2, or a combination of the structures of the following chemical formulae 2-2 and 2-3. According to some embodiments of the present invention, at least one of the alkali-soluble resin and the photoactive compound may include a combination of the structures of the following chemical formulae 1 and 2-1, a combination of the structures of the following chemical formulae 1 and 2-2, or a combination of the structures of the following chemical formulae 2-2 and 2-3, thereby realizing a higher film remaining rate. [Chemical Formula 1] [Chemical Formula 2-1] [Chemical Formula 2-2] [Chemical Formula 2-3] [Chemical Formula 3] [Chemical Formula 4] [Chemical Formula 5] [Chemical Formula 6] [Chemical Formula 7] In the above chemical formula 2-1, R is hydrogen; or a substituted or unsubstituted organic group; and in the above chemical formulas 2-2 and 2-3, R a and R b are each independently a substituted or unsubstituted pentagonal ring; or a substituted or unsubstituted hexagonal ring; and in the above chemical formula 3, Rc is each independently a hydrogen atom; or a substituted or unsubstituted hydrocarbon group having 1 or more carbon atoms; and in the above chemical formula 4, R1 includes a trivalent organic group or a nitrogen atom, and R2 includes each independently a hydrogen atom, a hydroxyl group, a sulfonic acid ester group; or a substituted or unsubstituted hydrocarbon group having 1 or more carbon atoms. [3] In the above [1] or [2], the alkali-soluble resin may include a structure derived from any one of the compounds represented by the following chemical formulas 1a to 1j. [Chemical Formula 1a] In the above chemical formula 1a, R 11 and R 12 Each independently contains a direct bond, a hydrogen atom, and a divalent organic group, where R11 and R 12 If one of them is a hydrogen atom, the other is a direct bond or a divalent organic group, n is 0 or 1, and R 13 and R 14 are each independently a hydrogen atom, a hydroxyl group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms: [Chemical Formula 1b] In the above chemical formula 1b, R 15 Inland R 26 are each independently carbon or a heteroatom, and R 27 and R 28 are each independently a substituent having 1 to 5 substituents in the ring, each of which independently comprises a hydrogen atom, a nitro group, a hydroxyl group, or an amine group, and at least one of each of the substituents is an amine group: [Chemical Formula 1c] [Chemical Formula 1d] In the above chemical formulas 1c and 1d, R 29 Inland R 36 are each independently carbon or a heteroatom. [Chemical Formula 1e] In the above chemical formula 1e, R 37 and R 38 are each independently substituted with 1 to 4 substituents, wherein each substituent is independently a hydrogen atom, an amine group, or an acid anhydride group, and at least one of the substituents is an amine group or an acid anhydride group, wherein the acid anhydride group is R 37 and R 38 When each is substituted by two or more, each substituent is combined with each other to form: [Chemical formula 1f] In the above chemical formula 1f, R 39 is a trivalent organic group or nitrogen atom, and R 40 Inland R 42 are each independently a hydrogen atom or an amine group, each independently substituted with 1 to 5 substituents, wherein R 40 Inland R 42 At least one of them is an amine group: [Chemical formula 1g] [Chemical formula 1h] In the above chemical formulas 1g and 1h, Q1 to Q6 are each independently a mono- or poly-substituted substituent, a hydrogen atom, an amine group, or an acid anhydride group, wherein at least one of Q1 to Q3 is an amine group or an acid anhydride group, wherein the acid anhydride group is formed by combining the respective substituents when at least one of Q1 to Q3 is poly-substituted, and wherein at least one of Q4 to Q6 is an amine group or an acid anhydride group, wherein the acid anhydride group is formed by combining the respective substituents when at least one of Q4 to Q6 is poly-substituted. [Chemical Formula 1i] In the above chemical formula 1i, Q7 comprises a hydrogen atom; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; an amine group; or an acid anhydride group; wherein Q7 comprises one or more amine groups; or one or more acid anhydride groups; and R 51 , R 52 and R 54 are each independently a hydrogen atom; a nitro group; a hydroxy group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; and R 53is a nitrogen atom, and R bonded to N is a hydrogen atom; or a substituted or unsubstituted organic group. For example, when Q7 is the substituted alkyl group or the substituted aryl group, it may include one or more amine groups or one or more acid anhydride groups. [Chemical formula 1j] In the above chemical formula 1j, Q 10 Inland Q 12 are each independently a hydrogen atom; a hydroxyl group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; and Q 13 and Q 14 each independently comprises a hydrogen atom; one or more amine groups; or one or more acid anhydride groups. [4] In any one of the above [1] to [3], the alkali-soluble resin may include any one selected from the group consisting of polyamic acid, polyamic ester, and polyimide. [5] In the above [4], the imidization degree of the polyimide may be 50% or more. [6] In any one of the above [3] to [5], a structure derived from any one of the compounds represented by the above chemical formulas 1a to 1j may be included in an amount of 5 mol% or more relative to the total mol of the alkali-soluble resin. [7] In any one of the above [1] to [6], the photoactive compound may include a sulfonic acid esterified quinonediazide compound. [8] In the above [7], the sulfonic acid esterified quinonediazide compound may include a phenol compound as a parent (ballast). [9] In the above [8], the phenol compound may include at least one of the compounds represented by the following chemical formulas 2a to 2j. [Chemical Formula 2a] In the above chemical formula 2a, R 43 Inland R 45 are each independently a mono- or poly-substituted substituent, wherein each of the substituents is independently a hydrogen atom, a nitro group, or a hydroxy group, and at least one of the substituents is a hydroxy group: [Chemical Formula 2b] In the above chemical formula 2b, R 46 is a substituted substituent having 1 to 5 substituents, each independently a hydrogen atom, a nitro group or a hydroxy group, wherein R 46 At least one of which contains a hydroxyl group, R 47 is a nitrogen atom, and R 48 Inland R 50 are each independently a hydrogen atom; a hydroxyl group; a nitro group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms. [Chemical Formula 2c] In the above chemical formula 2c, R 51 is a substituted substituent having 1 to 5 atoms, each independently a hydrogen atom; a nitro group; a hydroxyl group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; wherein R 51 At least one of which is a hydroxyl group, and R 52 and R 54 are each independently a hydrogen atom; a nitro group; a hydroxy group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; and R 53 is a nitrogen atom, and R bonded to N is a hydrogen atom; or a substituted or unsubstituted organic group. [Chemical formula 2d] In the above chemical formula 2d, R 55 Inland R 62 are each independently a hydrogen atom; a nitro group; a hydroxy group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; wherein R 55 Inland R 62 At least one of which is a hydroxyl group. [Chemical Formula 2e] In the above chemical formula 2e, R 63 is a trivalent organic group; or a nitrogen atom, and R 64 Inland R 66 are each a substituted substituent having 1 to 5 atoms, each independently a hydrogen atom; a nitro group; a hydroxyl group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; wherein R 64 Inland R 66 At least one of which is a hydroxyl group. [Chemical formula 2f] [Chemical formula 2g] In the above chemical formulas 2f and 2g, Q1 to Q6 are each independently a mono- or poly-substituted substituent, and are each independently a hydrogen atom, a nitro group, a hydroxyl group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, at least one of Q1 to Q3 is a hydroxyl group, and at least one of Q4 and Q6 is a hydroxyl group. In some examples, Q1 to Q6 may each independently be a mono-substituted, di-substituted, tri-substituted, or tetra-substituted substituent. [Chemical formula 2h] In the above chemical formula 2h, Q 10 Inland Q 12are each independently a hydrogen atom; a nitro group; a hydroxy group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; and Q 13 is a hydrogen atom; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; and Q 14 and Q 15 are each independently a hydrogen atom; a nitro group; a hydroxy group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; wherein Q 14 and Q 15 At least one of which is a hydroxyl group. [Chemical formula 2i] In the above chemical formula 2i, Q 10 Inland Q 12 are each independently a hydrogen atom; a nitro group; a hydroxy group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; and Q 13 is a hydrogen atom; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; and Q 16 and Q 17 are each independently a hydrogen atom; a nitro group; a hydroxyl group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; wherein Q 16 and Q 17 At least one of which is a hydroxyl group. [Chemical formula 2j] In the above chemical formula 2j, Q 18 is a divalent linking group containing one or more aromatic rings, and Q 19are each independently a substituent having 1 to 5 substituents on a benzene ring, wherein at least one of the 1 to 5 substituted substituents is a hydroxy group. For example, Q 18 may be a phenylene group or a naphthalene group, and Q 19 In , all hydroxyl groups can be substituted at the para positions relative to all four benzene rings, and the remaining substituents can all be hydrogen atoms.

[0010] In any one of the above [7] to [9], the content of the sulfonic acid esterified quinonediazide compound may be 5 to 40 parts by weight based on 100 parts by weight of the alkali-soluble resin.

[0011] In any one of the above [1] to

[0010] , the photosensitive resin composition may further include a solvent.

[0012] In any one of the above [1] to

[0011] , the photosensitive resin composition may further include at least one of a crosslinking agent, a thermal oxidation generator, and a UV absorber.

[0013] According to the UPLC (Ultra Performance Liquid Chromatography) analysis method in any one of the above [7] to

[0012] , the degree of sulfonic acid esterification of the sulfonic acid esterified quinonediazide compound may be 1.0 to 3.3%.

[0014] According to another aspect of the present invention, an insulating film is provided that includes a cured product of a photosensitive resin composition according to any one of [1] to

[0013] .

[0015] According to another aspect of the present invention, a display device including an insulating film according to

[0014] is provided. Preferably, the display device may be an OLED element. The solutions to the above problems do not enumerate all features of the present invention. The various features of the present invention, along with their corresponding advantages and effects, can be understood in more detail by referring to the specific examples below. According to one aspect of the present invention, coloring properties can be easily imparted even without separately adding a coloring additive. According to another aspect of the present invention, while imparting the above coloring properties, it is possible to maintain or improve at an excellent level all of the following: an appropriate level of sensitivity, a high residual film rate, low transmittance properties, excellent adhesion to a substrate, chemical resistance, heat resistance, low moisture absorption, reliability of the device, etc. In addition to the effects described above, specific effects of the present invention are described below while explaining specific details for carrying out the invention. Figure 1 illustrates a display device according to one embodiment of the present invention. In this specification, singular expressions include plural expressions unless the context clearly indicates otherwise. The numerical range indicated by the term "to" in this specification refers to a numerical range that includes the values ​​described before and after the term as the lower limit and the upper limit, respectively. When multiple numerical values ​​are disclosed as the upper and lower limits of an arbitrary numerical range, the numerical range disclosed in this specification can be understood as any numerical range that has any one of the multiple lower limit values ​​and any one of the multiple upper limit values ​​as the lower limit and the upper limit, respectively. For example, when a to b, or c to d is described in the specification, it can be understood that a or more and b or less, a or more and d or less, c or more and d or less, or c or more and b or less is described. As used herein, “substituted” means a group in which at least one hydrogen atom is substituted with a halogen atom, a hydroxyl group, a carboxyl group, a nitro group, an amine group, a sulfide group, a thiol group, an alkoxy group, an acetoxy group, a nitrile group, an aldehyde group, an ether group, an ester group, an acetal group, a ketone group, a C1 to C 30 Alkyl group of C2 to C 30 Alkenyl group, C2 to C 30 Alkynyl group, C1 to C 40 Alkylsilyl group, C5 to C 40 Arylsilyl group, C3 to C 30 Cycloalkyl group, C3 to C 30 Allyl group, C6 to C 30 Aryl group, heterocyclic group (e.g. C2 to C) 30 Heterocycloalkyl group, C3 to C 30 is defined as being replaced by any one selected from the group consisting of heteroaryl groups, derivatives thereof, and combinations thereof. Here, each of the above substituents may combine with each other when adjacent to each other to form a substituted or unsubstituted fused ring or spiro structure. In this specification, “fused ring” means a ring in which two or more rings are joined by sharing two or more atoms, and may include, for example, a fused aliphatic ring, a fused aromatic ring, a fused heteroaliphatic ring, a fused heteroaromatic ring, or a combination thereof. As used herein, “spiro structure” means a structure having a spiro union, which means a connection formed by two rings sharing only one atom. For example, the alkyl group may be straight chain or branched, and specifically, methyl, ethyl, propyl, n-propyl, isopropyl, butyl, n-butyl, isobutyl, tert-butyl, sec-butyl, 1-methyl-butyl, 1-ethyl-butyl, pentyl, n-pentyl, isopentyl, neopentyl, tert-pentyl, hexyl, n-hexyl, 1-methylpentyl, 2-methylpentyl, 4-methyl-2-pentyl, 3,3-dimethylbutyl, 2-ethylbutyl, heptyl, n-heptyl, 1-methylhexyl, cyclopentylmethyl, cyclohexylmethyl, octyl, n-octyl, tert-octyl, 1-methylheptyl, 2-ethylhexyl, 2-propylpentyl, n-nonyl, 2,2-dimethylheptyl, 1-ethyl-propyl, It can be 1,1-dimethyl-propyl, isohexyl, 2-methylpentyl, 4-methylhexyl, 5-methylhexyl, etc. In this specification, the number of carbon atoms in the “substituted or unsubstituted alkyl group having 1 or more carbon atoms” may be 1 or more, 1 to 30, 1 to 20, or 1 to 10. In the present specification, the number of carbon atoms in the “substituted or unsubstituted aryl group having 6 or more carbon atoms” may be 6 or more, 6 to 50, 6 to 40, 6 to 30, or 6 to 20. For example, an ester group may mean -COO-R, or R-COO-, wherein the number of carbon atoms in the R group of the ester group may be 1 to 50. For example, the cycloalkyl group can be cyclopropyl, cyclobutyl, cyclopentyl, 3-methylcyclopentyl, 2,3-dimethylcyclopentyl, cyclohexyl, 3-methylcyclohexyl, 4-methylcyclohexyl, 2,3-dimethylcyclohexyl, 3,4,5-trimethylcyclohexyl, 4-tert-butylcyclohexyl, cycloheptyl, cyclooctyl, and the like. For example, the alkenyl group may be straight or branched, and the number of carbon atoms is not particularly limited, but is preferably 2 to 40. Specific examples thereof include vinyl, 1-propenyl, isopropenyl, 1-butenyl, 2-butenyl, 3-butenyl, 1-pentenyl, 2-pentenyl, 3-pentenyl, 3-methyl-1-butenyl, 1,3-butadienyl, allyl, 1-phenylvinyl-1-yl, 2-phenylvinyl-1-yl, 2,2-diphenylvinyl-1-yl, 2-phenyl-2-(naphthyl-1-yl)vinyl-1-yl, 2,2-bis(diphenyl-1-yl)vinyl-1-yl, stilbenyl, styrenyl, etc. For example, the aryl group may be a monocyclic aryl group or a polycyclic aryl group, and specifically may be a phenyl group, a biphenyl group, a terphenyl group, a naphthyl group, anthracenyl group, a phenanthryl group, a pyrenyl group, a perylenyl group, a chrysenyl group, a fluorenyl group, etc. For example, a heterocyclic group includes one or more non-carbon atoms, heteroatoms, and the heteroatoms may include one or more atoms selected from the group consisting of O, N, Se, and S. The number of carbon atoms in the heterocyclic group is not particularly limited, but it may be preferable that it has 2 to 60 carbon atoms. Examples of heterocyclic groups include thiophene group, furan group, pyrrole group, imidazole group, thiazole group, oxazole group, oxadiazole group, triazole group, pyridyl group, bipyridyl group, pyrimidyl group, triazine group, triazole group, acridyl group, pyridazine group, pyrazinyl group, quinolinyl group, quinazoline group, quinoxalinyl group, phthalazinyl group, pyrido pyrimidinyl group, pyrido pyrazinyl group, pyrazino pyrazinyl group, isoquinoline group, indole group, carbazole group, benzoxazole group, benzimidazole group, benzothiazole group, benzocarbazole group, benzothiophene group, dibenzothiophene group, benzofuranyl group, phenanthroline group, thiazolyl group, isoxazolyl group, Examples include, but are not limited to, oxadiazolyl group, thiadiazolyl group, benzothiazolyl group, phenothiazinyl group, and dibenzofuranyl group. As used herein, "organic group" may be defined as a monovalent or polyvalent group containing at least one carbon atom. For example, the polyvalent group may be a divalent or trivalent linking group. In some examples, the organic group may have 1 to 40, 1 to 30, or 1 to 20 carbon atoms. In the present specification, the “unsubstituted hydrocarbon group” is a substituent composed of carbon and hydrogen, which may be a functional group having 1 or more carbon atoms, and specifically, may be a functional group having 1 to 40, 1 to 30, or 1 to 20 carbon atoms. On the other hand, the “substituted hydrocarbon group” in the present specification is a substituent in which at least one hydrogen atom of the unsubstituted hydrocarbon group is a halogen atom, a hydroxyl group, a carboxyl group, a nitro group, an amine group, a sulfide group, a thiol group, an alkoxy group, an acetoxy group, a nitrile group, an aldehyde group, an ether group, an ester group, an acetal group, a ketone group, a C1 to C 30 Alkyl group of C2 to C 30 Alkenyl group, C2 to C 30 Alkynyl group, C1 to C 40 Alkylsilyl group, C5 to C 40 Arylsilyl group, C3 to C 30 Cycloalkyl group, C3 to C 30 Allyl group, C6 to C 30 Aryl group, heterocyclic group (e.g. C2 to C) 30 Heterocycloalkyl group, C3 to C 30 It can be defined as being replaced by any one selected from the group consisting of heteroaryl groups, derivatives thereof, and combinations thereof. In this specification, “composition” may mean a mixture of materials including the composition, a reaction product formed from the materials of the composition, or a decomposition product. For example, the content of the material in the composition may be measured using gas chromatography. Specifically, the content of the material may be analyzed using a gas chromatography device from Agilent (Product name: Agilent 7890 GC, Column: HP-5, Carrier gas: Helium (flow rate 2.4 mL / min), Detector: FID, Injection volume: 1 uL, Initial value: 70°C / 4.2 min, Final value: 280°C / 7.8 min, Program rate: 15°C / min). In this specification, "*" can be defined as a moiety or bond that is bonded to another moiety within the molecule. Here, the other moiety within the molecule may include a substituent or a non-substituent. Specifically, the substituent may be an atom or an atomic group bonded to the main chain (or parent), and the non-substituent may mean any molecular structure not defined by the substituent. For example, when there are two or more *s, the other moieties within the molecule may be the same or different. For example, *, which is defined as a moiety that is not bonded to another moiety within the molecule, may bond to an atom that is indirectly bonded to form a ring structure within the molecule. According to one aspect of the present invention, a photosensitive resin composition is provided, comprising: an alkali-soluble resin; and a photoactive compound; wherein at least one of the alkali-soluble resin and the photoactive compound has an absorption maximum (inflection point) at a wavelength of 400 to 550 nm based on UV-Vis spectroscopy. According to one aspect of the present invention, by using a compound capable of imparting coloring properties as a monomer used in the synthesis of the alkali-soluble resin and / or a ballast used in the synthesis of the photoactive compound, coloring properties can be easily imparted even without separately adding a colored additive. According to another aspect of the present invention, while imparting the coloring properties, an appropriate level of sensitivity, a high film residue rate, low transmittance properties, excellent adhesion to a substrate, chemical resistance, heat resistance, low moisture absorption, reliability of a device, etc. can all be maintained or improved at an excellent level. Below, the configuration of the present invention is described in more detail. 1. Photosensitive resin composition The photosensitive resin composition according to the present invention has reactivity and alkali solubility by photoactivity and includes an alkali-soluble resin to implement developability. The alkali-soluble resin according to the present invention may have an absorption maximum (inflection point) at a wavelength of 400 to 550 nm based on UV-Vis spectroscopy. For example, the absorption maximum can be analyzed by measuring light transmittance at a wavelength of 400 to 550 nm using a UV-Vis NIR Spectrophotometer under a C light source and a viewing angle of 2 degrees, as specified in ASTM E313-73. The alkali-soluble resin according to the present invention may include at least one of the structures represented by the following chemical formulae 1, 2-1 to 2-3, and 3 to 7. [Chemical Formula 1] [Chemical Formula 2-1] [Chemical Formula 2-2] [Chemical Formula 2-3] [Chemical Formula 3] [Chemical Formula 4] [Chemical Formula 5] [Chemical Formula 6] [Chemical Formula 7] In the above chemical formula 2-1, R is hydrogen; or a substituted or unsubstituted organic group; and in the above chemical formulas 2-2 and 2-3, R a and R b are each independently a substituted or unsubstituted pentagonal ring; or a substituted or unsubstituted hexagonal ring; and in the above chemical formula 3, Rc is each independently a hydrogen atom; or a substituted or unsubstituted hydrocarbon group having 1 or more carbon atoms; and in the above chemical formula 4, R1 includes a trivalent organic group or a nitrogen atom, and R2 each independently includes a hydrogen atom, a hydroxyl group, a sulfonic acid ester group, or a substituted or unsubstituted hydrocarbon group having 1 or more carbon atoms. In some examples, the pentagonal ring may contain one or two nitrogen atoms within the ring. In some examples, the hexagonal ring may contain one, two, or three nitrogen atoms within the ring. Specifically, the hexagonal ring may be pyrazine, pyridazine, or pyrimidine. Specifically, in the above chemical formula 2-1, R may be hydrogen; or a substituted or unsubstituted organic group. In the above chemical formula 4, R1 includes a trivalent organic group or a nitrogen atom, and R2 each independently includes a hydrogen atom, a hydroxyl group, a sulfonic acid ester group, or a substituted or unsubstituted hydrocarbon group having 1 or more carbon atoms. Here, the trivalent organic group is not particularly limited and may include a substituted or unsubstituted alkylidyne capable of forming a trivalent bond having 1 or more carbon atoms; a substituted or unsubstituted trivalent aromatic linking group; or a trivalent heteroaromatic linking group; etc. In some examples, the substituted or unsubstituted alkylidyne may be methylidyne; substituted or unsubstituted ethylidyne; or substituted or unsubstituted propylidyne. In the alkali-soluble resin according to the present invention, R2 in the chemical formula 4 may be independently a hydrogen atom or a substituted or unsubstituted hydrocarbon group, each of which is a 1 to 5 substituted substituent bonded to a benzene ring. For example, the number of carbon atoms in the substituted or unsubstituted hydrocarbon group may be 1 or more. In this case, two * moieties in the chemical formula 4 may be bonded to different molecular structures. According to some embodiments of the present invention, by including at least one of the structures represented by chemical formulae 1, 2-1 to 2-3, and 3 to 7 in the alkali-soluble resin, coloring properties can be easily imparted without separately adding a coloring additive, and at the same time, appropriate sensitivity, high film residue rate, low transmittance properties, excellent adhesion to a substrate, chemical resistance, heat resistance, low moisture absorption, reliability of the device, etc. can all be maintained or improved at excellent levels. According to some embodiments of the present invention, the alkali-soluble resin may include a structure derived from any one of the compounds represented by the following chemical formulae 1a to 1j. Here, the compounds represented by the above chemical formulae 1a to 1j may be monomers used in the synthesis of the alkali-soluble resin. Accordingly, the acid anhydride group and / or amine group contained in the monomer may be reactive functional groups that undergo a reaction in the process of condensation polymerization of various monomers to synthesize a polyimide. [Chemical Formula 1a] In the above chemical formula 1a, R 11 and R 12 Each independently contains a direct bond, a hydrogen atom, and a divalent organic group, where R 11 and R 12 If one of them is a hydrogen atom, the other is a direct bond or a divalent organic group, n is 0 or 1, and R 13 and R 14 are each independently a hydrogen atom, a hydroxyl group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms. [Chemical Formula 1b] In the above chemical formula 1b, R 15 Inland R 26 are each independently carbon or a heteroatom, and R 27 and R 28are each independently a substituent having 1 to 5 substituents in the ring, wherein each of the substituents independently includes a hydrogen atom, a nitro group, a hydroxyl group, or an amine group, and at least one of the substituents is an amine group. Since at least one of the substituents corresponds to an amine group, a ring opening reaction of an acid anhydride structure can proceed. Here, the heteroatom may be, for example, a nitrogen atom, an oxygen atom, or a sulfur atom, and may be specifically a nitrogen atom. [Chemical Formula 1c] [Chemical Formula 1d] In the above chemical formulas 1c and 1d, R 29 Inland R 36 are each independently carbon or a heteroatom. Here, the heteroatom may be, for example, a nitrogen atom, an oxygen atom, a sulfur atom, etc., and may specifically be a nitrogen atom. [Chemical Formula 1e] In the above chemical formula 1e, R 37 and R 38 are each independently substituted with 1 to 4 substituents, wherein each of the substituents is independently a hydrogen atom, an amine group, or an acid anhydride group, and at least one of the substituents is an amine group or an acid anhydride group, wherein the acid anhydride group is R 37 and R 38 When each of the groups is substituted by two or more, the substituents are combined with each other to form a monomer. Specifically, since at least one of the substituents corresponds to an amine group or an acid anhydride group, the monomer can be used in the synthesis of a polyimide that imparts coloring properties. [Chemical formula 1f] In the above chemical formula 1f, R 39 is a trivalent organic group or nitrogen atom, and R40 Inland R 42 are each independently a hydrogen atom or an amine group, each independently substituted with 1 to 5 substituents, wherein R 40 Inland R 42 At least one of them is an amine group. [Chemical formula 1g] [Chemical formula 1h] In the above chemical formulas 1g and 1h, Q1 to Q6 are each independently a mono- or poly-substituted substituent, a hydrogen atom, an amine group, or an acid anhydride group, wherein at least one of Q1 to Q3 is an amine group or an acid anhydride group, wherein the acid anhydride group is formed by combining the respective substituents when at least one of Q1 to Q3 is poly-substituted, and wherein at least one of Q4 to Q6 is an amine group or an acid anhydride group, wherein the acid anhydride group is formed by combining the respective substituents when at least one of Q4 to Q6 is poly-substituted. [Chemical Formula 1i] In the above chemical formula 1i, Q7 is a hydrogen atom, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, and includes an amine group or an acid anhydride group, wherein Q7 includes one or more amine groups, or one or more acid anhydride groups, and R 51 , R 52 and R 54 are each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, and R 53 is a nitrogen atom, and R bonded to N is a hydrogen atom or a substituted or unsubstituted organic group: [Chemical formula 1j] In the above chemical formula 1j, Q10 Inland Q 12 are each independently a hydrogen atom, a hydroxyl group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, and Q 13 and Q 14 Each independently comprises a hydrogen atom, one or more amine groups, or one or more acid anhydride groups. According to some embodiments of the present invention, since the alkali-soluble resin includes a structure derived from any one of the compounds represented by the chemical formulae 1a to 1j, coloring properties can be easily imparted without separately adding a coloring additive, and at the same time, appropriate sensitivity, high film retention rate, low transmittance properties, excellent adhesion to a substrate, chemical resistance, heat resistance, low moisture absorption, reliability of the device, etc. can all be maintained or improved at excellent levels. The alkali-soluble resin according to the present invention may include any one selected from the group consisting of polyamic acid, polyamic ester, and polyimide, and may specifically include polyimide. Specifically, when the alkali-soluble resin is polyimide, it may exhibit superior heat resistance and chemical resistance compared to other resins. According to some embodiments of the present invention, the imidization degree of the polyimide may be 50% or more, 60% or more, 70% or more, 80% or more, 90% or more, 94% or more, 95% or more, or 96% or more. According to some embodiments of the present invention, when the imidization degree of the polyimide satisfies the numerical range, the chemical resistance, hygroscopicity, and operating reliability performance can be sufficiently improved. If the imidization degree of the polyimide is less than the numerical range, the sensitivity can be improved, but the chemical resistance, hygroscopicity, and operating reliability may be deteriorated. According to some embodiments of the present invention, the alkali-soluble resin may contain a structure derived from any one of the compounds represented by the above chemical formulae 1a to 1j in an amount of 5 mol% or more, relative to the total moles of the alkali-soluble resin. Specifically, the structure derived from any one of the compounds represented by the above chemical formulae 1a to 1j may be contained in an amount of 5 mol% or more, 10 mol% or more, 10 to 60 mol%, 20 to 50 mol%, or 30 to 40 mol%. According to some embodiments of the present invention, since the structure derived from any one of the compounds represented by the above chemical formulae 1a to 1j is contained within the above mol% range, coloring characteristics can be easily imparted even without separately adding a coloring additive, and at the same time, an appropriate level of sensitivity, a high residual film ratio, low transmittance characteristics, excellent adhesion to a substrate, chemical resistance, heat resistance, low moisture absorption, and reliability of the device can all be maintained or improved at excellent levels. In this specification, “weight average molecular weight” or “number average molecular weight” refers to the standard polystyrene-converted molecular weight, which can be analyzed using a GPC (Gel permeation chromatography) device. For example, in the case of the GPC analysis method, the developing solvent may be Tetrahydrofuran (THF), the column may be PL Olexis from Polymer Laboratories, the sample concentration may be 5 mg / mL, the sample injection amount may be 100 ㎕, the flow rate may be 1 mL / min, the detector may be Agilent High Temperature RI detector, and the column temperature may be set to 40°C. According to some embodiments of the present invention, the weight average molecular weight of the alkali-soluble resin may be 1,000 to 50,000 g / mol, specifically 1,000 to 30,000 g / mol. According to some embodiments of the present invention, since the weight average molecular weight of the alkali-soluble resin satisfies the numerical range, the developability and the adhesive strength of the cured film to the substrate can be improved at the same time. The photoactive compound according to the present invention can improve sensitivity through efficient absorption of light and at the same time improve the solubility of a photosensitive resin composition due to excellent compatibility with an alkali-soluble resin. In addition, the photoactive compound according to the present invention may include at least one of the structures represented by the chemical formulae 1, 2-1 to 2-3, and 3 to 7 to impart coloring properties even without separately adding a colored additive. According to some embodiments of the present invention, since the photoactive compound includes at least one of the structures represented by the chemical formulae 1, 2-1 to 2-3, and 3 to 7, coloring properties can be easily imparted even without separately adding a colored additive, and at the same time, an appropriate level of sensitivity, a high film residue rate, low transmittance characteristics, excellent adhesion to a substrate, chemical resistance, heat resistance, low moisture absorption, reliability of the device, etc. can all be maintained or improved at an excellent level. The photoactive compound according to some embodiments of the present invention may include a sulfonic acid esterified quinonediazide compound to enhance resistance to a developer and photosensitivity. Here, the sulfonic acid esterified quinonediazide compound may be a compound produced by a hydroxyl group of a quinonediazide compound undergoing a sulfonic acid esterification reaction. For example, the hydroxyl group may be converted into a naphthoquinonediazide (NQD) sulfonic acid ester group after the reaction. Specifically, the sulfonic acid esterified quinonediazide compound may include a phenol compound as a parent (ballast), and more specifically, the phenol compound may include at least one of the compounds represented by the following chemical formulae 2a to 2j. [Chemical Formula 2a] In the above chemical formula 2a, R 43 Inland R 45are each independently a mono- or poly-substituted substituent, wherein each of the substituents is independently a hydrogen atom, a nitro group, or a hydroxy group, and at least one of the substituents is a hydroxy group. [Chemical Formula 2b] In the above chemical formula 2b, R 46 is a substituted substituent having 1 to 5 substituents, each independently a hydrogen atom, a nitro group or a hydroxy group, wherein R 46 At least one of which contains a hydroxyl group, R 47 is a nitrogen atom, and R 48 Inland R 50 are each independently a hydrogen atom, a hydroxyl group, a nitro group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms. [Chemical Formula 2c] In the above chemical formula 2c, R 51 is a substituted substituent having 1 to 5 atoms, each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, wherein R 51 At least one of which is a hydroxyl group, and R 52 and R 54 are each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, and R 53 is a nitrogen atom, and R bonded to N is a hydrogen atom; or a substituted or unsubstituted organic group. [Chemical formula 2d] In the above chemical formula 2d, R 55 Inland R 62are each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, wherein R 55 Inland R 62 At least one of which is a hydroxyl group. [Chemical Formula 2e] In the above chemical formula 2e, R 63 is a trivalent organic group; or a nitrogen atom, and R 64 Inland R 66 are each a substituted substituent having 1 to 5 atoms, each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, wherein R 64 Inland R 66 At least one of which is a hydroxyl group. [Chemical formula 2f] [Chemical formula 2g] In the above chemical formulas 2f and 2g, Q1 to Q6 are each independently a mono- or polysubstituted substituent, and are each independently a hydrogen atom, a nitro group, a hydroxyl group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, at least one of Q1 to Q3 is a hydroxyl group, and at least one of Q4 and Q6 is a hydroxyl group. [Chemical formula 2h] In the above chemical formula 2h, Q 10 Inland Q 12 are each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, and Q 13is a hydrogen atom, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, and Q 14 and Q 15 are each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, wherein Q 14 and Q 15 At least one of which is a hydroxyl group. [Chemical formula 2i] In the above chemical formula 2i, Q 10 Inland Q 12 are each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, and Q 13 is a hydrogen atom, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, and Q 16 and Q 17 are each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, wherein Q 16 and Q 17 At least one of which is a hydroxyl group. [Chemical formula 2j] In the above chemical formula 2j, Q 18 is a divalent linking group containing one or more aromatic rings, and Q 19 are each independently a substituent having 1 to 5 substituents on a benzene ring, and at least one of the 1 to 5 substituted substituents may be a hydroxy group. For example, the aromatic ring may be a benzene ring, and specifically, the Q 18may be a substituted or unsubstituted phenylene group or a substituted or unsubstituted naphthalene group. For example, the above Q 19 Is It may be a hydroxyl group substituted at the para position, and the remaining substituents may all be hydrogen atoms. According to some embodiments of the present invention, by using any one or more of the compounds represented by the above chemical formulae 2a to 2j as a ballast of a photoactive compound, coloring properties can be easily imparted without separately adding a colored additive, and at the same time, an appropriate level of sensitivity, a high film residue rate, low transmittance properties, excellent adhesion to a substrate, chemical resistance, heat resistance, low moisture absorption, and reliability of the device can all be maintained or improved at an excellent level. According to some embodiments of the present invention, the content of the sulfonic acid esterified quinonediazide compound may be 5 to 40 parts by weight, more than 10 but less than 40 parts by weight, 15 to 35 parts by weight, 20 to 35 parts by weight, 25 to 35 parts by weight, 28 to 32 parts by weight, or 29 to 31 parts by weight, based on 100 parts by weight of the alkali-soluble resin, and preferably 30 to 31 parts by weight. According to some embodiments of the present invention, when the content of the sulfonic acid esterified quinonediazide compound satisfies the numerical range, the pattern shape can be appropriately maintained while appropriate photosensitivity and heat resistance can be secured. Specifically, the sulfonic acid esterified quinonediazide compound may be one in which at least one of the hydroxy groups in the quinonediazide compound is sulfonic acid esterified. In some embodiments of the present invention, the degree of sulfonic acid esterification of the sulfonic acid esterified quinonediazide compound may be 1.0 to 3.3%, 1.2 to 3.0%, 1.5 to 2.5%, 1.8 to 2.2%, or 1.9 to 2.0%. Here, the degree of sulfonic acid esterification may mean the degree to which the phenol group (-OH) is substituted with the sulfonic acid esterification group relative to the total number of phenol groups of the entire sulfonic acid esterified quinonediazide compound. For example, the degree of sulfonic acid esterification may be analyzed by an analysis method of UPLC (Ultra Performance Liquid Chromatography). According to some embodiments of the present invention, by controlling the degree of sulfonic acid esterification within the above numerical range, performances such as sensitivity, film retention rate, transmittance, and device operating reliability may all be improved. The photosensitive resin composition according to the present invention may further include a solvent that disperses or dissolves the above-described composition. For example, the solvent is not particularly limited, but may include at least one selected from the group consisting of gamma-butyrolactone (GBL), N-methylpyrrolidone (NMP), propylene glycol monomethyl ether acetate (PGME), ethyl lactate (EL), methyl 3-methoxypropionate (MMP), propylene glycol monomethyl ether (PGME), diethylene glycol ethyl methyl ether (MEDG), diethylene glycol butyl methyl ether (MBDG), diethylene glycol dimethyl ether (DMDG), and diethylene glycol diethyl ether (DEDG). The photosensitive resin composition according to the present invention may further include at least one of a crosslinking agent, a thermal oxidation generator, and a UV absorber. The crosslinking agent according to the present invention can effectively control the shape of a pattern by undergoing a crosslinking reaction with an alkaline-soluble resin through light or heat. For example, the crosslinking agent may be any one of the groups represented by the following chemical formulas. When the photosensitive resin composition further includes a thermal oxidation generator or UV absorber, the heat resistance, hygroscopicity, etc. of the resin composition are improved, thereby achieving the effect of ensuring even better panel reliability. Among the groups represented by the above chemical formulas, each R' is independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, or a substituent of the following chemical formula C, and at least one of R' is a substituent of the following chemical formula C, and in the following chemical formula C, n is an integer of 1 to 6, and R a is an alkyl group having 1 to 3 carbon atoms. Specifically, in the chemical formula C, n may be 1, 2, 3, 4, 5, or 6. [Chemical Formula C] For example, the photosensitive resin composition may be a positive photosensitive resin composition. 2. Insulating film and display device According to another aspect of the present invention, an insulating film is provided comprising a cured body in which the photosensitive resin composition of some embodiments is cured. In some embodiments of the present invention, the sensitivity of the insulating film may be 100 mJ or less or 80 mJ or less based on a specimen having a thickness of 2.0 μm. In some embodiments of the present invention, the transmittance of the insulating film measured using a spectrophotometer in a wavelength range of 400 to 500 nm may be less than 20% or less than 10%. In some embodiments of the present invention, after immersion in methylpyrrolidone (NMP) at 60°C for 120 seconds, the thickness change rate of the insulating film before and after immersion may be less than 300 Å. In some embodiments of the present invention, the insulating film may be heated from room temperature to 900°C at a rate of 10°C per minute, and then the 5 wt% Loss temperature may be greater than 300°C. In some embodiments of the present invention, after 240 hours of purification in a constant temperature and humidity oven at 85°C and 85% RH, the change in the thickness of the insulating film before and after being placed in the oven may be less than 300 Å. According to another aspect of the present invention, a display device including the insulating film is provided. As a preferred example, the display device may be a display device for an organic light-emitting element, and specifically, may be an organic light-emitting diode (OLED). In some embodiments of the present invention, the display device for the organic electroluminescent element includes a first electrode formed on a substrate; an insulating film formed on the first electrode; and a second electrode formed on the insulating film, wherein the insulating film may be a cured version of the photosensitive resin composition according to some embodiments. In some embodiments of the present invention, the insulating film may be patterned to partially expose the upper surface of the first electrode. In some embodiments of the present invention, the insulating film may be formed to cover an edge portion of the first electrode. In some embodiments of the present invention, when the display device is a display device for an organic electroluminescent element, the time (T) for which the luminance drops by 3% in the OLED element On state at 85°C and 85% RH 97 ) can be more than 1,000 hours. Hereinafter, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. However, this is merely an example, and the scope of the present invention is not limited by the following contents. [Synthesis Preparation Example: Preparation of Monomer] To synthesize polyimide, the monomers listed in Table 1 below were prepared. Monomer chemical formula ODPA A1 PA A2 A3 Bis-APAF B1 B2 B3 3-AP B4 B5 B6 B7 B8 [First Synthesis Example: Synthesis of Polyimide] Diamine dissolution step: Under a dry nitrogen stream, a diamine solution was prepared by dissolving diamine having the composition and content described in Table 2 below in gamma-butyrolactone. Idianhydride dissolution step: While stirring the above diamine solution, the diamine having the composition and content described in Table 2 was added and dissolved, and then stirred at 70°C for 4 hours. End-cap step: After adding and stirring the above-mentioned dihydride, an amine and / or acid anhydride having the composition and content described in Table 2 below was added, and stirring was performed at 70°C for 2 hours. Imidization step: The resultant product, to which the above acid anhydride was added and stirred, was stirred at 160°C or higher for 4 hours or more to complete the reaction, thereby finally synthesizing a dyed polyimide polymer. Meanwhile, the unit of each composition in Tables 2 and 3 below is mol. In addition, the degree of imidization in polyimide was measured by measuring the infrared absorption spectrum of polyimide, and the absorption peak derived from the imide structure was 1377 cm. -1 Step of measuring the peak intensity P1 in the vicinity; After heat-treating the polyimide at 350°C for 1 hour, the infrared absorption spectrum is measured to find that 1377 cm -1The step of measuring the peak intensity P2 in the vicinity; and the step of calculating the degree of imidization of the polyimide using the peak intensities P1 and P2 through the following equation 1 can be calculated. [Formula 1] Imidization degree [%] = (P1 / P2) Х100 ClassificationDianhydrideAcid anhydrideDiamineAminePIODPAA1PAA2A3Bis-APAFB1B2B33-APB4B5Imidization degreeSynthesis example145452010094%Synthesis example245452010094%Synthesis example345452010094%Synthesis example410045452096%Synthesis example510045452096%Synthesis example610045452096%Synthesis example710045452096%Synthesis example810045452096%Synthesis example910045452096%Synthesis example10100454520 96% Synthetic Example 11100 45 45 20 96% Synthetic Example 12100 45 45 20 96% Synthetic Example 13454520 5050 94% Synthetic Example 144545 20 5050 94% Synthetic Example 154545 205050 94% Synthetic Example 16454520 50 50 94% Synthetic Example 174545 20 50 50 94% Synthetic Example 184545 2050 50 94% Synthetic Example 19454520 50 50 94% Synthetic Example 204545 20 50 50 94% Synthetic Example 214545 2050 50 94% Synthetic Example 225050 4545 20 96% Synthetic Example 235050 4545 20 96% Synthetic Example 245050 4545 2096% Synthetic Example 255050 45 45 20 96% Synthetic Example 265050 45 45 20 96% Synthetic Example 275050 45 45 2096% Synthetic Example 285050 45 45 20 96% Synthetic Example 295050 45 45 20 96% Synthetic Example 305050 45 45 2096% Synthetic Example 31100 90 20 96% Synthetic Example 32100 90 20 96% Synthetic Example 33100 90 2096% Synthetic Example 3490 20 100 94% Synthetic Example 3590 20 100 94% synthetic example 3690 20100 94%1) ODPA: 4,4'-Oxydiphthalic Anhydride2) PA: Phthalic anhydride3) Bis-APAF: 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane4) 3-AP: 3-Aminophenol5) PI: Polyimide, ClassificationDianhydrideAcid anhydrideDiamineAminePIODPAA1PAA2A3Bis-APAFB6B7B83-APB4B5Imidization degreeSynthesis example37100 100 10010045 20 96%Synthesis example38100 10010045 20 96%Synthesis example39100 100 10010045 20 96%Synthesis example40100 100 10045 45 20 96%Synthesis example41100 45 45 20 96%Synthesis example42100 45 45 20 96%Synthesis example43100 10096% [Comparative Synthesis Example: Synthesis of Polyimide] Polyimide was synthesized using the same method as in the first synthesis example, but using monomers having the contents described in Table 4 below. Classification: Dianhydride, Acid anhydride, Diamine, Amine, PIODPAA1, PAA2, A3, Bis-APAFB1, B2, B3, 3-APB4, B5, Degree of imidization, Comparison, Synthesis example 1, 100, 96, 895%, Comparison, Synthesis example 2, 100, 96, 895%, Comparison, Synthesis example 3, 100, 96, 895%, Comparison, Synthesis example 4, 96, 81, 0095%, Comparison, Synthesis example 5, 96, 81, 0095%, Comparison, Synthesis example 6, 96, 81, 0095%, Comparison, Synthesis example 7, 45, 45, 20, 100, 95%, Comparison, Synthesis example 8, 45, 45, 20, 100, 30%, Comparison, Synthesis example 9, 90, 20, 30, 70, 95% [Preparation Example: Synthesis of Photoactive Compound (PAC)] Preparation of the Ballast: Each ballast described in Table 5 below was prepared. Synthesis of sulfonic acid esterified photoactive compounds: Under a dry nitrogen stream, each parent compound (Ballast) described in Table 5 below and 5-naphthoquinonediazidesulfonic acid chloride were dissolved in 1,4-dioxane at room temperature in a molar ratio of 1:2. Triethylamine was added dropwise thereto so that the temperature did not exceed 35°C. After the addition, the mixture was stirred at 40°C for 2 hours. The triethylamine salt was filtered, and the resulting solution was poured into water. The precipitate was filtered and washed with 1% hydrochloric acid solution. Thereafter, the mixture was washed three times with water. The precipitate was dried in a vacuum dryer to prepare a sulfonic acid esterified quinonediazide compound. TPPA, the parent of photoactive compounds (PAC) Ballast 1 Ballast 2 Ballast 3 Ballast 4 Ballast 5 Ballast 6 Ballast 7 [Manufacturing Example 1: Preparation of Photosensitive Resin Composition] An alkaline-soluble resin, a photoactive compound, and a crosslinking agent and a coating aid having the composition and contents described in Table 6 below were mixed and then added to a solvent to prepare a photosensitive resin composition having a total solid content of 5 to 50 wt%. Classification Alkali soluble resin Photoactive compound (transparent PAC) Color additive Structure Content Structure Content Content Example 1 Synthesis Example 1 100 parts by weight TPPA 20 parts by weight - Example 2 Synthesis Example 2 100 parts by weight TPPA 20 parts by weight - Example 3 Synthesis Example 3 100 parts by weight TPPA 20 parts by weight - Example 4 Synthesis Example 4 100 parts by weight TPPA 20 parts by weight - Example 5 Synthesis Example 5 100 parts by weight TPPA 20 parts by weight - Example 6 Synthesis Example 6 100 parts by weight TPPA 20 parts by weight - Example 7 Synthesis Example 7 100 parts by weight TPPA 20 parts by weight - Example 8 Synthesis Example 8 100 parts by weight TPPA 20 parts by weight - Example 9 Synthesis Example 9 100 parts by weight TPPA 20 parts by weight - Example 10 Synthesis Example 10 100 parts by weight TPPA 20 parts by weight - Example 11 Synthesis Example 11 100 Part by weight TPPA20 parts by weight - Example 12 Synthesis Example 12 100 Part by weight TPPA20 parts by weight - Example 13 Synthesis Example 13 100 Part by weight TPPA20 parts by weight - Example 14 Synthesis Example 14 100 Part by weight TPPA20 parts by weight - Example 15 Synthesis Example 15 100 Part by weight TPPA20 parts by weight - Example 16 Synthesis Example 16 100 Part by weight TPPA20 parts by weight - Example 17 Synthesis Example 17 100 Part by weight TPPA20 parts by weight - Example 18 Synthesis Example 18 100 Part by weight TPPA20 parts by weight - Example 19 Synthesis Example 19 100 Part by weight TPPA20 parts by weight - Example 20 Synthesis Example 20 100 Part by weight TPPA20 parts by weight - Example 21 Synthesis Example 21 100 Part by weight TPPA20 parts by weight - Example 22 Synthesis Example 22 100 Part by weight TPPA20 parts by weight - Example 23 Synthesis Example 23 100 parts by weight TPPA20 parts by weight - Example 24 Synthesis Example 24 100 parts by weight TPPA20 parts by weight - Example 25 Synthesis Example 25 100 parts by weight TPPA20 parts by weight - Example 26 Synthesis Example 26 100 parts by weight TPPA20 parts by weight - Example 27 Synthesis Example 27 100 parts by weight TPPA20 parts by weight - Example 28 Synthesis Example 28 100 parts by weight TPPA20 parts by weight - Example 29 Synthesis Example 29 100 parts by weight TPPA20 parts by weight - Example 30 Synthesis Example 30 100 parts by weight TPPA20 parts by weight - [Manufacturing Example 2: Preparation of Photosensitive Resin Composition] A photosensitive resin composition was prepared in the same manner as in Manufacturing Example 1, except that the alkali-soluble resin and photoactive compound were used as described in any one of Tables 7 to 9 below. In all examples and comparative examples except for examples 139 to 142, the degree of sulfonic acid esterification of the photoactive compound was fixed at 2.0%. Specifically, the degree of sulfonic acid esterification of the photoactive compound according to example 139 was adjusted to 1.2%, the degree of sulfonic acid esterification of the photoactive compound according to example 140 was adjusted to 3.0%, the degree of sulfonic acid esterification of the photoactive compound according to example 141 was adjusted to 1.0%, and the degree of sulfonic acid esterification of the photoactive compound according to example 142 was adjusted to 3.3%. Classification Alkali soluble resin Photoactive compound (colored PAC) Colored additive Structure Content Structure Content Content Example 31 Synthesis Example 1 100 parts by weight Ballast 120 parts by weight - Example 32 Synthesis Example 2 100 parts by weight Ballast 120 parts by weight - Example 33 Synthesis Example 3 100 parts by weight Ballast 120 parts by weight - Example 34 Synthesis Example 4 100 parts by weight Ballast 120 parts by weight - Example 35 Synthesis Example 5 100 parts by weight Ballast 120 parts by weight - Example 36 Synthesis Example 6 100 parts by weight Ballast 120 parts by weight - Example 37 Synthesis Example 7 100 parts by weight Ballast 120 parts by weight - Example 38 Synthesis Example 8 100 parts by weight Ballast 120 parts by weight - Example 39 Synthesis Example 9 100 parts by weight Ballast 120 parts by weight - Example 40 Synthesis Example 10 100 parts by weight ballast 120 parts by weight - Example 41 Synthesis Example 11 100 parts by weight ballast 120 parts by weight - Example 42 Synthesis Example 12 100 parts by weight ballast 120 parts by weight - Example 43 Synthesis Example 1 100 parts by weight ballast 220 parts by weight - Example 44 Synthesis Example 2 100 parts by weight ballast 220 parts by weight - Example 45 Synthesis Example 3 100 parts by weight ballast 220 parts by weight - Example 46 Synthesis Example 4 100 parts by weight ballast 220 parts by weight - Example 47 Synthesis Example 5 100 parts by weight ballast 220 parts by weight - Example 48 Synthesis Example 6 100 parts by weight ballast 220 parts by weight - Example 49 Synthesis Example 7 100 parts by weight ballast 220 parts by weight - Example 50 Synthesis Example 8 100 parts by weight ballast 220 parts by weight - Example 51 Synthesis Example 9 100 parts by weight ballast 220 parts by weight - Example 52 Synthesis Example 10 100 parts by weight ballast 220 parts by weight - Example 53 Synthesis Example 11 100 parts by weight ballast 220 parts by weight - Example 54 Synthesis Example 12 100 parts by weight ballast 220 parts by weight - Example 55 Synthesis Example 1 100 parts by weight ballast 320 parts by weight - Example 56 Synthesis Example 2 100 parts by weight ballast 320 parts by weight - Example 57 Synthesis Example 3 100 parts by weight ballast 320 parts by weight - Example 58 Synthesis Example 4 100 parts by weight ballast 320 parts by weight - Example 59 Synthesis Example 5 100 Weight part ballast 320 parts by weight - Example 60 Synthesis example 6100 Weight part ballast 320 parts by weight - Example 61 Synthesis example 7100 Weight part ballast 320 parts by weight - Example 62 Synthesis example 8100 Weight part ballast 320 parts by weight - Example 63 Synthesis example 9100 Weight part ballast 320 parts by weight - Example64 Synthesis Example 10 100 parts by weight of ballast 320 parts by weight - Example 65 Synthesis Example 11 100 parts by weight of ballast 320 parts by weight - Example 66 Synthesis Example 12 100 parts by weight of ballast 320 parts by weight - Example 67 Synthesis Example 1 100 parts by weight of ballast 420 parts by weight - Example 68 Synthesis Example 2 100 parts by weight of ballast 420 parts by weight - Example 69 Synthesis Example 3 100 parts by weight of ballast 420 parts by weight - Example 70 Synthesis Example 4 100 parts by weight of ballast 420 parts by weight - Example 71 Synthesis Example 5 100 parts by weight of ballast 420 parts by weight - Example 72 Synthesis Example 6 100 parts by weight of ballast 420 parts by weight - Example 73 Synthesis Example 7 100 parts by weight of ballast 420 parts by weight - Example 74 Synthesis Example 8 100 Weight part ballast 420 parts by weight - Example 75 Synthesis example 9 100 Weight part ballast 420 parts by weight - Example 76 Synthesis example 10 100 Weight part ballast 420 parts by weight - Example 77 Synthesis example 11 100 Weight part ballast 420 parts by weight - Example 78 Synthesis example 12 100 Weight part ballast 420 parts by weight - Example 79 Synthesis example 1 100 Weight part ballast 520 parts by weight - Example 80 Synthesis example 2 100 Weight part ballast 520 parts by weight - Example 81 Synthesis example 3 100 Weight part ballast 520 parts by weight - Example 82 Synthesis example 4 100 Weight part ballast 520 parts by weight - Example 83 Synthesis example 5 100 Weight part ballast 520 parts by weight - Example 84 Synthesis example 6 100 Weight part ballast 520 parts by weight - Example 85 Synthesis example 7 100 Weight part ballast 520 parts by weight - Example 86 Synthesis example 8 100 Weight part ballast 520 parts by weight - Example 87 Synthesis example 9 100 Weight part ballast 520 parts by weight - Example 88 Synthesis example 10 100 Weight part ballast 520 parts by weight - Example 89 Synthesis example 11 100 Weight part ballast 520 parts by weight - Example 90 Synthesis example 12 100 Weight part ballast 520 parts by weight - Example 91 Synthesis example 1 100 Weight part ballast 620 parts by weight - Example 92 Synthesis example 2 100 Weight part ballast 620 parts by weight - Example 93 Synthesis example 3 100 Weight part ballast 620 parts by weight - Example 94 Synthesis example 4 100 Weight part ballast 620 parts by weight - Example 95 Synthesis example 5100 Weight part ballast 620 parts by weight - Example 96 Synthesis example 6100 Weight part ballast 620 parts by weight - Example 97 Synthesis example 7100 Weight part ballast 620 parts by weight - Example 98 Synthesis example 8100 Weight part ballast 620 parts by weight - Example 99 Synthesis example 9100Weight part ballast 620 parts by weight - Example 100 Synthesis example 10100 Weight part ballast 620 parts by weight - Example 101 Synthesis example 11100 Weight part ballast 620 parts by weight - Example 102 Synthesis example 12100 Weight part ballast 620 parts by weight - Classification Alkali soluble resin Photoactive compound (colored PAC) Colored additive Structure Content Structure Content Content Example 103 Synthesis Example 31 100 parts by weight Ballast 120 parts by weight - Example 104 Synthesis Example 32 100 parts by weight Ballast 120 parts by weight - Example 105 Synthesis Example 33 100 parts by weight Ballast 120 parts by weight - Example 106 Synthesis Example 34 100 parts by weight Ballast 120 parts by weight - Example 107 Synthesis Example 35 100 parts by weight Ballast 120 parts by weight - Example 108 Synthesis Example 36 100 parts by weight Ballast 120 parts by weight - Example 109 Synthesis Example 31 100 parts by weight Ballast 220 parts by weight - Example 110 Synthesis Example 32 100 parts by weight Ballast 220 parts by weight - Example 111 Synthesis Example 33 100 Weight part ballast 220 parts by weight - Example 112 Synthesis example 34 100 Weight part ballast 220 parts by weight - Example 113 Synthesis example 35 100 Weight part ballast 220 parts by weight - Example 114 Synthesis example 36 100 Weight part ballast 220 parts by weight - Example 115 Synthesis example 31 100 Weight part ballast 320 parts by weight - Example 116 Synthesis example 32 100 Weight part ballast 320 parts by weight - Example 117 Synthesis example 33 100 Weight part ballast 320 parts by weight - Example 118 Synthesis example 34 100 Weight part ballast 320 parts by weight - Example 119 Synthesis example 35 100 Weight part ballast 320 parts by weight - Example 120 Synthesis example 36 100 Weight part ballast 320 parts by weight - Example 121 Synthesis Example 31 100 parts by weight of ballast 420 parts by weight - Example 122 Synthesis Example 32 100 parts by weight of ballast 420 parts by weight - Example 123 Synthesis Example 33 100 parts by weight of ballast 420 parts by weight - Example 124 Synthesis Example 34 100 parts by weight of ballast 420 parts by weight - Example 125 Synthesis Example 35 100 parts by weight of ballast 420 parts by weight - Example 126 Synthesis Example 36 100 parts by weight of ballast 420 parts by weight - Example 127 Synthesis Example 31 100 parts by weight of ballast 520 parts by weight - Example 128 Synthesis Example 32 100 parts by weight of ballast 520 parts by weight - Example 129 Synthesis Example 33 100 parts by weight of ballast 520 parts by weight - Example 130 Synthesis Example 34 100 Weight ballast 520 parts by weight - Example 131 Synthesis example 35100 Weight ballast 520 parts by weight - Example 132 Synthesis example 36100 Weight ballast 520 parts by weight - Example 133 Synthesis example 31100 Weight ballast 620 parts by weight - Example 134 Synthesis example 32100Weight part ballast 620 parts by weight - Example 135 Synthesis example 33 100 Weight part ballast 620 parts by weight - Example 136 Synthesis example 34 100 Weight part ballast 620 parts by weight - Example 137 Synthesis example 35 100 Weight part ballast 620 parts by weight - Example 138 Synthesis example 36 100 Weight part ballast 620 parts by weight - Classification Alkali soluble resin Photoactive compound (colored PAC) Color additive Sulfonic acid esterification degree (%) Structure Content Structure Content Content Example 139 Synthesis example 1100 parts by weight Ballast 720 parts by weight - 1.2 Example 140 Synthesis example 1100 parts by weight Ballast 720 parts by weight - 3.0 Example 141 Synthesis example 1100 parts by weight Ballast 720 parts by weight - 1.0 Example 142 Synthesis example 1100 parts by weight Ballast 720 parts by weight - 3.3 Example 143 Synthesis example 37 100 parts by weight Ballast 720 parts by weight - 2.0 Example 144 Synthesis example 38 100 parts by weight Ballast 720 parts by weight - 2.0 Example 145 Synthesis example 39 100 parts by weight Ballast 720 parts by weight - 2.0 Example 146 Synthetic Example 40 100 parts by weight of ballast 720 parts by weight - 2.0 Example 147 Synthetic Example 41 100 parts by weight of ballast 720 parts by weight - 2.0 Example 148 Synthetic Example 42 100 parts by weight of ballast 720 parts by weight - 2.0 Example 149 Synthetic Example 1100 parts by weight of ballast 75 parts by weight - 2.0 Example 150 Synthetic Example 1100 parts by weight of ballast 710 parts by weight - 2.0 Example 151 Synthetic Example 1100 parts by weight of ballast 730 parts by weight - 2.0 Example 152 Synthetic Example 1100 parts by weight of ballast 740 parts by weight - 2.0 Example 153 Synthetic Example 1100 parts by weight of ballast 745 parts by weight - 2.0 Example 154 Synthetic Example 1100 parts by weight of ballast 71 parts by weight - 2.0 Meanwhile, compounds represented by the following chemical formulas D-1 and D-2 were prepared as colored additives 1 and 2 in Table 10 below, respectively. [Chemical Formula D-1] [Chemical Formula D-2] Classification Alkali soluble resin Photoactive compound (transparent PAC) Color additive Structure Content Structure Content Structure Content Comparative Example 1 Comparative Synthesis Example 1 100 parts by weight TPPA 20 parts by weight -- Comparative Example 2 Comparative Synthesis Example 2 100 parts by weight TPPA 20 parts by weight -- Comparative Example 3 Comparative Synthesis Example 3 100 parts by weight TPPA 20 parts by weight -- Comparative Example 4 Comparative Synthesis Example 4 100 parts by weight TPPA 20 parts by weight -- Comparative Example 5 Comparative Synthesis Example 5 100 parts by weight TPPA 20 parts by weight -- Comparative Example 6 Comparative Synthesis Example 6 100 parts by weight TPPA 20 parts by weight -- Comparative Example 7 Comparative Synthesis Example 1 100 parts by weight TPPA 20 parts by weight D-120 Comparative Example 8 Comparative Synthesis Example 2 100 parts by weight TPPA 20 parts by weight D-120 Comparative Example 9 Comparative Synthesis Example 3 100 Part by weight TPPA20Part by weight D-120Comparative Example 10Comparative Synthetic Example 4100 Part by weight TPPA20Part by weight D-120Comparative Example 11Comparative Synthetic Example 5100 Part by weight TPPA20Part by weight D-120Comparative Example 12Comparative Synthetic Example 6100 Part by weight TPPA20Part by weight D-120Comparative Example 13Comparative Synthetic Example 1100 Part by weight TPPA20Part by weight D-220Comparative Example 14Comparative Synthetic Example 2100 Part by weight TPPA20Part by weight D-220Comparative Example 15Comparative Synthetic Example 3100 Part by weight TPPA20Part by weight D-220Comparative Example 16Comparative Synthetic Example 4100 Part by weight TPPA20Part by weight D-220Comparative Example 17Comparative Synthetic Example 5100 Part by weight TPPA20Part by weight D-220Comparative Example 18Comparative Synthetic Example 6100 Part by weight TPPA20part by weight D-220Comparative Example 19Comparative Synthetic Example 7100part by weight Ballast 19part by weight--Comparative Example 20Comparative Synthetic Example 7100part by weight Ballast 150part by weight--Comparative Example 21Comparative Synthetic Example 8100part by weight TPPA20part by weight--Comparative Example 22Comparative Synthetic Example 9100part by weight TPPA20part by weight--Comparative Example 23Synthetic Example 43100part by weight TPPA20part by weight-- [Experimental Example: Evaluation of Photosensitive Resin Composition and Insulating Film] After applying the photosensitive resin composition according to the above manufacturing example using a slit coater on an ITO substrate, a VCD (vacuum drying) process was performed at a pressure of 66 Pa, and prebaking was performed on a hot plate at 120°C for 2 minutes to form a cured film having a thickness of 1.5 μm. 1) Sensitivity The cured film formed as described above was irradiated with ultraviolet rays having an intensity of 20 mW / cm2 in the broadband using a predetermined pattern mask at a dose based on a contact hole CD with a sensitivity of 2.5 μm, and then developed with a 2.38 wt% aqueous solution of tetramethyl ammonium hydroxide at 23°C for 1 minute, followed by rinsing with ultrapure water for 1 minute. Then, the film was cured in an oven at 250°C for 60 minutes to obtain a pattern film (insulating film) having a thickness of 2.0 μm. At this time, if the sensitivity is 80 mJ or less, it is indicated as ◎, if it is over 80 mJ and under 100 mJ, it is indicated as O, if it is over 100 mJ and under 120 mJ, it is indicated as △, and if it is over 120 mJ, it is indicated as Х. 2) Residual rate The change in film thickness formed during the sensitivity measurement of the above 1) was measured. The film thickness is expressed as a ratio of (thickness after curing / thickness after prebaking), and a film thickness of 65% or more is indicated by ◎, a film thickness of 60% or more is indicated by O, a film thickness of 50% or more but less than 60% is indicated by △, and a film thickness of less than 50% is indicated by Х. 3) Transmittance Transmittance evaluation was performed by measuring the transmittance (400 to 500 nm) of the pattern film formed during the sensitivity measurement using a spectrophotometer. If the transmittance at this time is 10% or less, it is indicated as ◎, if it is more than 10% and less than 20%, it is indicated as O, if it is more than 20% and less than 50%, it is indicated as △, and if it is more than 50%, it is indicated as X. 4) Adhesion The pattern film was formed in the same way as the sensitivity measurement in 1) above, but the adhesive strength was compared and evaluated based on the minimum CD of the attached dot pattern. If the adhesive strength was secured when the minimum CD of the dot pattern was 5㎛ or more and less than 10㎛, it was marked as O, if the adhesive strength was secured when the minimum CD of the dot pattern was 10㎛ or more and less than 15㎛, it was marked as △, and if the adhesive strength was secured when the minimum CD was 15㎛ or more or not, it was marked as X. 5) Chemical resistance The cured film formed on the above substrate was immersed in methylpyrrolidone (NMP) at 60°C for 120 seconds, and the change rate in the thickness of the cured film before and after immersion was measured. If it was less than 300Å, it was marked as O, if it was 300 or more and less than 600Å, it was marked as △, and if it was 600Å or more, it was marked as X. 6) Heat resistance Heat resistance was measured using TGA. After sampling the pattern film formed during the sensitivity measurement of 1) above, the temperature was increased from room temperature to 900°C at a rate of 10°C per minute using TGA. A case where the 5 wt% loss temperature exceeded 300°C was indicated as O, a case where the 5 wt% loss temperature was 280 to 300°C was indicated as △, and a case where the 5 wt% loss temperature was less than 280°C was indicated as X. 7) Hygroscopicity The pattern film formed during the sensitivity measurement of the above 1) was purified in a constant temperature and humidity oven at 85°C and 85% RH for 240 hours, and the hygroscopicity was evaluated based on the change in film thickness before and after being placed in the oven. A thickness change of less than 300 Å was marked as O, a thickness change of 300 or more to less than 600 Å was marked as △, and a thickness change of 600 Å or more was marked as X. 8) OLED driving reliability Fig. 1 illustrates a display device according to one embodiment of the present invention. Referring to Fig. 1, the display device according to one embodiment of the present invention may include a via (1), an anode electrode (2), a PDL (Pixel Define Layer, 3), an EL (4), a cathode electrode (5), and a CPL (Capping Layer, 6). A pattern film was formed on a substrate like Fig. 1 using the same method as in the sensitivity measurement of 1) above, and EL (4) was deposited. Mg / Ag was deposited as a cathode electrode (5) on top, and an encapsulation process was performed. Based on 85°C and 85% RH, the time (T) for a 3% luminance drop in the OLED element On state 97) was evaluated. If more than 1,000 hours were secured, it was marked as O, if 700 to less than 1,000 hours were secured, it was marked as △, and if less than 700 hours were secured, it was marked as X. Classification SensitivityResidual film rateTransmittance (low transmittance)Adhesion Chemical resistance Heat resistance Hygroscopicity Operation reliability Example 1◎OOOOOOO Example 2◎OOOOOOO Example 3◎OOOOOOO Example 4◎OOOOOOO Example 5◎OOOOOOO Example 6◎OOOOOOO Example 7◎OOOOOOO Example 8◎OOOOOOO Example 9◎OOOOOOO Example 10◎OOOOOOO Example 11◎OOOOOOO Example 12◎OOOOOOO Example 13OO◎OOOOO Example 14OO◎OOOOO Example 15OO◎OOOOO Example 16OO◎OOOOO Example 17OO◎OOOOO Example 18OO◎OOOOO Example 19OO◎OOOOO Example 20OO◎OOOOO Example 21OO◎OOOOOOEmbodiment 22OO◎OOOOOOEmbodiment 23OO◎OOOOOOEmbodiment 24OO◎OOOOOOEmbodiment 25OO◎OOOOOOEmbodiment 26OO◎OOOOOEmbodiment 27OO◎OOOOOOEmbodiment 28OO◎OOOOOOEmbodiment 29OO◎OOOOOEmbodiment 30OO◎OOOOO SensitivityResidual film rateTransmittance (low transmittance)AdhesionChemical resistanceHeat resistanceHygroscopicityOperating reliabilityExample 31O◎◎OOOOOExample 32O◎◎OOOOOExample 33O◎◎OOOOOExample 34O◎◎OOOOOExample 35O◎◎OOOOOExample 36O◎◎OOOOOExample 37O◎◎OOOOOExample 38O◎◎OOOOOExample 39O◎◎OOOOOExample 40O◎◎OOOOOExample 41O◎◎OOOOOExample 42O◎◎OOOOOExample 43O◎◎OOOOOExample 44O◎◎OOOOOExample 45O◎◎OOOOOExample 46O◎◎OOOOOExample 47O◎◎OOOOOExample 48O◎◎OOOOOOExample 49O◎◎OOOOOExample 50O◎◎OOOOOExample 51O◎◎OOOOOExample 52O◎◎OOOOOExample 53O◎◎OOOOOExample 54O◎◎OOOOOExample 55O◎◎OOOOOExample 56O◎◎OOOOOExample 57O◎◎OOOOOExample 58O◎◎OOOOOExample 59O◎◎OOOOOExample 60O◎◎OOOOOExample 61O◎◎OOOOOExample 62O◎◎OOOOOExample 63O◎◎OOOOOExample 64O◎◎OOOOOExample 65O◎◎OOOOOExample 66O◎◎OOOOOExample 67O◎◎OOOOOExample 68O◎◎OOOOOEmbodiment 69O◎◎OOOOOEmbodiment 70O◎◎OOOOOEmbodiment 71O◎◎OOOOOEmbodiment 72O◎◎OOOOOEmbodiment 73O◎◎OOOOOEmbodiment 74O◎◎OOOOOEmbodiment 75O◎◎OOOOOEmbodiment 76O◎◎OOOOOEmbodiment 77O◎◎OOOOOEmbodiment 78O◎◎OOOOOEmbodiment 79O◎◎OOOOOEmbodiment 80O◎◎OOOOOEmbodiment 81O◎◎OOOOOEmbodiment 82O◎◎OOOOOEmbodiment 83O◎◎OOOOOEmbodiment 84O◎◎OOOOOEmbodiment 85O◎◎OOOOOEmbodiment 86O◎◎OOOOOEmbodiment 87O◎◎OOOOOEmbodiment 88O◎◎OOOOOOEmbodiment 89O◎◎OOOOOOEmbodiment 90O◎◎OOOOOOEmbodiment 91O◎◎OOOOOOEmbodiment 92O◎◎OOOOOOEmbodiment 93O◎◎OOOOOOEmbodiment 94O◎◎OOOOOOEmbodiment 95O◎◎OOOOOOEmbodiment 96O◎◎OOOOOOEmbodiment 97O◎◎OOOOOOEmbodiment 98O◎◎OOOOOOEmbodiment99O◎◎OOOOOExample 100O◎◎OOOOOExample 101O◎◎OOOOOExample 102O◎◎OOOOO SensitivityResidual film rateTransmittance (low transmittance)AdhesionChemical resistanceHeat resistanceHygroscopicityOperating reliabilityExample 103◎◎OOOOOOExample 104◎◎OOOOOOExample 105◎◎OOOOOOExample 106◎◎OOOOOOExample 107◎◎OOOOOOExample 108◎◎OOOOOOExample 109◎◎OOOOOOExample 110◎◎OOOOOOExample 111◎◎OOOOOOExample 112◎◎OOOOOOExample 113◎◎OOOOOOExample 114◎◎OOOOOOExample 115◎◎OOOOOOExample 116◎◎OOOOOOExample 117◎◎OOOOOOExample 118◎◎OOOOOOExample 119◎◎OOOOOOExample 120◎◎OOOOOOEmbodiment 121◎◎OOOOOOEmbodiment 122◎◎OOOOOOEmbodiment 123◎◎OOOOOOEmbodiment 124◎◎OOOOOOEmbodiment 125◎◎OOOOOOEmbodiment 126◎◎OOOOOOEmbodiment 127◎◎OOOOOOEmbodiment 128◎◎OOOOOOEmbodiment 129◎◎OOOOOOEmbodiment 130◎◎OOOOOOEmbodiment 131◎◎OOOOOOEmbodiment 132◎◎OOOOOOEmbodiment 133◎◎OOOOOOEmbodiment 134◎◎OOOOOOEmbodiment 135◎◎OOOOOOEmbodiment 136◎◎OOOOOOEmbodiment 137◎◎OOOOOOEmbodiment 138◎◎OOOOOO Distinctive sensitivity, residual film rate, transmittance, adhesive strength, chemical resistance, heat resistance, hygroscopicity, operating reliability, Example 139OOOOOOOO, Example 140O◎◎OOOO, Example 141ΔΔΔOOOOO, Example 142Δ◎◎OOOOΔ, Example 143◎OOOOOO, Example 144◎OOOOOO, Example 145◎OOOOOO, Example 146◎OOOOOO, Example 147◎OOOOOO, Example 148◎OOOOOO, Example 149OOOOOOOO, Example 150OOOOOOOO, Example 151◎◎◎OOOO, Example 152O◎◎OOOO, Example 153Δ◎◎OOOO, Example 154ΔΔΔOOOOO Distinction sensitivity, film residual rate, transmittance, adhesive strength, chemical resistance, heat resistance, hygroscopicity, driving reliability, comparative example 1OOXOOOOOComparative example 2OOΔOOOOOComparative example 3OOΔOOOOOComparative example 4OOXOOOOOComparative example 5OOΔOOOOOComparative example 6OOΔOOOOOComparative example 7ΔOOΔΔΔΔXComparative example 8ΔO◎ΔΔΔΔXComparative example 9ΔO◎ΔΔΔΔXComparative example 10ΔOOΔΔΔΔXComparative example 11ΔO◎ΔΔΔΔXComparative example 12ΔO◎ΔΔΔΔΔXComparative example 13ΔOΔΔΔΔΔXComparative example 14ΔOOΔΔΔΔXComparative example 15ΔOOΔΔΔΔXComparative example 16ΔOΔΔΔΔΔXComparative example 17ΔOOΔΔΔΔXComparative example 18ΔOOΔΔΔΔΔComparative example 19ΔΔOOOOOOComparative example 20XOOOOOOOComparative example 21◎OOOΔOΔΔComparative example 22XO◎OOOOOComparative example 23OΔ◎OOOOO Referring to Tables 11 to 15 above, it was confirmed that all examples had an absorption maximum at a wavelength of 400 to 550 nm based on UV-Vis spectroscopy in which at least one of the alkali-soluble resin and the photoactive compound had an absorption maximum at a wavelength of 400 to 550 nm, thereby achieving excellent effects in terms of sensitivity, film residue, adhesion of the cured film to the substrate, chemical resistance, heat resistance, hygroscopicity, and device reliability at an appropriate level compared to the comparative examples. Comparing Examples 139 to 142, it was confirmed that by adjusting the degree of sulfonic acid esterification of the photoactive compound to 1.2 to 3.0%, the sensitivity, film residue, transmittance, and device operating reliability were all improved. Comparing Examples 149 to 154, it was confirmed that the sensitivity, film retention rate, and transmittance performance were all improved when the content of the photoactive compound was adjusted to 5 to 40 parts by weight relative to 100 parts by weight of the alkali-soluble resin. In addition, comparing Examples 149 to 152, it was confirmed that the sensitivity performance was further improved when the content of the photoactive compound was adjusted to more than 10 and less than 40 parts by weight relative to 100 parts by weight of the alkali-soluble resin, and specifically, to 20 to 35 parts by weight. Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements made by those skilled in the art using the basic concept of the present invention defined in the following claims also fall within the scope of the present invention.

Claims

1. Alkali-soluble resin; and containing a photoactive compound; At least one of the alkaline-soluble resin and the photoactive compound has an absorption maximum at a wavelength of 400 to 550 nm based on UV-Vis spectroscopy. Photosensitive resin composition.

2. In paragraph 1, At least one of the alkali-soluble resin and the photoactive compound comprises at least one of the structures represented by the following chemical formulae 1, 2-1 to 2-3, and 3 to 7. Photosensitive resin composition: [Chemical Formula 1] [Chemical Formula 2-1] [Chemical Formula 2-2] [Chemical Formula 2-3] [Chemical Formula 3] [Chemical Formula 4] [Chemical Formula 5] [Chemical Formula 6] [Chemical Formula 7] In the above chemical formula 2-1, R is hydrogen; or, a substituted or unsubstituted organic group; and In the above chemical formulas 2-2 and 2-3, R a and R b are each independently a substituted or unsubstituted pentagonal ring; or a substituted or unsubstituted hexagonal ring; In the above chemical formula 3, Rc is each independently a hydrogen atom; or a substituted or unsubstituted hydrocarbon group having 1 or more carbon atoms; In the above chemical formula 4, R1 contains a trivalent organic group or a nitrogen atom, R2 each independently comprises a hydrogen atom; a hydroxy group; a sulfonic acid ester group; or a substituted or unsubstituted hydrocarbon group having 1 or more carbon atoms.

3. In paragraph 1, The above alkaline soluble resin is, A structure derived from any one of the compounds represented by the following chemical formulas 1a to 1j, Photosensitive resin composition: [Chemical Formula 1a] In the above chemical formula 1a, R 11 and R 12 Each independently comprises a direct bond, a hydrogen atom, or a divalent organic group, wherein R 11 and R 12 If one of them is a hydrogen atom, the other is a direct bond or a divalent organic group, n is 0 or 1, R 13 and R 14 are each independently a hydrogen atom; a hydroxyl group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; [Chemical Formula 1b] In the above chemical formula 1b, R 15 Inland R 26 are each independently carbon or a heteroatom, R 27 and R 28 are each independently a substituent having 1 to 5 substituents in the ring, each of said substituents independently including a hydrogen atom, a nitro group, a hydroxy group, or an amine group, and at least one of said substituents is an amine group: [Chemical Formula 1c] [Chemical Formula 1d] In the above chemical formulas 1c and 1d, R 29 Inland R 36 are each independently carbon or a heteroatom: [Chemical Formula 1e] In the above chemical formula 1e, R 37 and R 38 are each independently substituted with 1 to 4 substituents, Each of the above substituents is independently a hydrogen atom, an amine group, or an acid anhydride group, and at least one of the above substituents is an amine group or an acid anhydride group, wherein the acid anhydride group is R 37 and R 38 When each is substituted by two or more, each substituent is combined with each other to form: [Chemical formula 1f] In the above chemical formula 1f, R 39 is a trivalent organic group, or a nitrogen atom, R 40 Inland R 42 are each independently a hydrogen atom or an amine group, each independently substituted with 1 to 5 substituents, wherein R 40 Inland R 42 At least one of them is an amine group: [Chemical formula 1g] [Chemical formula 1h] In the above chemical formulas 1g and 1h, Q1 to Q6 are each independently a mono- or polysubstituted substituent, a hydrogen atom, an amine group, or an acid anhydride group, Here, at least one of Q1 to Q3 is an amine group or an acid anhydride group, and wherein the acid anhydride group is formed by combining each substituent with each other when at least one of Q1 to Q3 is polysubstituted, Here, at least one of Q4 to Q6 is an amine group or an acid anhydride group, and the acid anhydride group is formed when each substituent is bonded to each other when at least one of Q4 to Q6 is polysubstituted: [Chemical Formula 1i] In the above chemical formula 1i, Q7 comprises a hydrogen atom; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; an amine group; or an acid anhydride group; wherein Q7 comprises one or more amine groups; or one or more acid anhydride groups; R 51 , R 52 and R 54 are each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, R 53 is a nitrogen atom, R bonded to N is a hydrogen atom; or a substituted or unsubstituted organic group; [Chemical formula 1j] In the above chemical formula 1j, Q 10 Inland Q 12 are each independently a hydrogen atom; a hydroxyl group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; Q 13 and Q 14 Each independently comprises a hydrogen atom, one or more amine groups, or one or more acid anhydride groups.

4. In paragraph 1, The above alkaline soluble resin is, Containing any one selected from the group consisting of polyamic acid, polyamic ester and polyimide, Photosensitive resin composition.

5. In paragraph 4, The imidization degree of the above polyimide is 50% or more, Photosensitive resin composition.

6. In paragraph 3, A structure derived from any one of the compounds represented by the chemical formulas 1a to 1j is included in an amount of 5 mol% or more relative to the total mole of the alkaline-soluble resin. Photosensitive resin composition.

7. In paragraph 1, The photoactive compound comprises a sulfonic acid esterified quinonediazide compound. Photosensitive resin composition.

8. In paragraph 7, The above sulfonic acid esterified quinonediazide compound contains a phenol compound as a parent (ballast). Photosensitive resin composition.

9. In paragraph 8, The above phenol compounds are, Comprising at least one compound represented by the following chemical formulas 2a to 2j, Photosensitive resin composition: [Chemical Formula 2a] In the above chemical formula 2a, R 43 Inland R 45 are each independently a mono- or poly-substituted substituent, and each of the substituents is independently a hydrogen atom, a nitro group, or a hydroxy group, At least one of the above substituents is a hydroxy group: [Chemical Formula 2b] In the above chemical formula 2b, R 46 is a substituted substituent having 1 to 5 substituents, each independently a hydrogen atom, a nitro group or a hydroxy group, wherein R 46 At least one of which contains a hydroxyl group, R 47 is a nitrogen atom, R 48 Inland R 50 are each independently a hydrogen atom; a hydroxyl group; a nitro group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms: [Chemical Formula 2c] In the above chemical formula 2c, R 51 is a substituted substituent having 1 to 5 atoms, each independently a hydrogen atom; a nitro group; a hydroxyl group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; wherein R 51 At least one of which is a hydroxyl group, R 52 and R 54 are each independently a hydrogen atom; a nitro group; a hydroxy group; a substituted or unsubstituted alkyl group having 1 or more carbon atoms; or a substituted or unsubstituted aryl group having 6 or more carbon atoms; R 53 is a nitrogen atom, R bonded to N is a hydrogen atom; or a substituted or unsubstituted organic group: [Chemical formula 2d] In the above chemical formula 2d, R 55 Inland R 62 are each independently A hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, Here R 55 Inland R 62 At least one of which is a hydroxyl group: [Chemical Formula 2e] In the above chemical formula 2e, R 63 is a trivalent organic group; or a nitrogen atom, R 64 Inland R 66 are each a substituted substituent having 1 to 5 atoms, each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, wherein R 64 Inland R 66 At least one of which is a hydroxyl group: [Chemical formula 2f] [Chemical formula 2g] In the above chemical formulas 2f and 2g, Q1 to Q6 are each independently a mono- or polysubstituted substituent, Each independently represents a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, At least one of Q1 to Q3 is a hydroxyl group, At least one of Q4 and Q6 is a hydroxyl group: [Chemical formula 2h] In the above chemical formula 2h, Q 10 Inland Q 12 are each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, Q 13 is a hydrogen atom, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, Q 14 and Q 15 are each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, wherein Q 14 and Q 15 At least one of which is a hydroxyl group: [Chemical formula 2i] In the above chemical formula 2i, Q 10 Inland Q 12 are each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, Q 13 is a hydrogen atom, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, Q 16 and Q 17 are each independently a hydrogen atom, a nitro group, a hydroxy group, a substituted or unsubstituted alkyl group having 1 or more carbon atoms, or a substituted or unsubstituted aryl group having 6 or more carbon atoms, wherein Q 16 and Q 17 At least one of which is a hydroxyl group: [Chemical formula 2j] In the above chemical formula 2j, Q 18 is a divalent linking group containing one or more aromatic rings, Q 19 are each independently a substituent having 1 to 5 substituted groups on a benzene ring, and at least one of the 1 to 5 substituted substituents is a hydroxy group.

10. In paragraph 7, The content of the above sulfonic acid esterified quinonediazide compound is 5 to 40 parts by weight based on 100 parts by weight of the alkali-soluble resin. Photosensitive resin composition.

11. In paragraph 1; solvent; further comprising, Photosensitive resin composition.

12. In paragraph 1, Further comprising at least one of a crosslinking agent, a thermal acid generator, and a UV absorber. Photosensitive resin composition.

13. In paragraph 7, According to the UPLC (Ultra Performance Liquid Chromatography) analysis method, The degree of sulfonic acid esterification of the above sulfonic acid esterified quinonediazide compound is 1.0 to 3.3%. Photosensitive resin composition.

14. An insulating film comprising a cured body in which the photosensitive resin composition according to paragraph 1 is cured.

15. A display device including an insulating film according to Article 14.

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