Electronic device

Abstract

Provided in the present application is an electronic device. The electronic device comprises a first frame, a second frame, a split-type light guide part and a photosensitive component, wherein the split-type light guide part comprises a first light guide part and a second light guide part. When the electronic device is assembled, the second light guide part and the second frame can be assembled firstly, then the first light guide part and the first frame are assembled, and finally the first frame assembled with the first light guide part is fitted onto the second frame assembled with the second light guide part. After assembly, the second light guide part and the first light guide part are arranged opposite each other. Thus, it can be ensured that the first frame can be easily fitted onto the second frame while the photosensitive component can sense the intensity of external light smoothly, reducing assembly difficulty and improving assembly efficiency.

Description

electronic devices

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on August 7, 2023, with application number 202310993380.2 and invention name “Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of electronic technology, and in particular to an electronic device with a light-guiding structure. Background Art

[0003] Currently, photosensitive devices such as ambient light sensors are widely used in electronic devices such as mobile phones and tablets. For electronic devices with a fully enclosed structure (i.e., a unibody structure) where the middle frame covers the front housing, the existing structural layout of photosensitive devices and light guides is not conducive to rapid assembly during production and needs further improvement.

[0004] Summary of the Invention

[0005] The present application provides an electronic device that can solve the technical problem of difficulty in assembling all-inclusive structure electronic devices in the prior art due to an integrated light guide component.

[0006] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0007] In a first aspect, the present application provides an electronic device, which includes a first frame and a second frame, the first frame surrounding a first accommodating cavity, the first frame including a first frame, and the first frame being provided with a first through hole; the second frame being arranged in the first accommodating cavity, the second frame including a second frame, and the second frame being provided with a second through hole, the second through hole being at least partially opposite to the first through hole; the electronic device also includes a first light guide and a second light guide, the first light guide being at least partially located in the first through hole; the second light guide being at least partially located in the second through hole; the electronic device also includes a photosensitive device arranged inside the electronic device, wherein light can be transmitted to the photosensitive device through the first light guide and the second light guide in sequence.

[0008] According to the electronic device of the embodiment of the present application, the light guide is a split light guide, including a first light guide and a second light guide. When the electronic device is assembled, the second light guide and the second frame can be assembled first, and then the first light guide and the first frame can be assembled. Finally, the first frame equipped with the first light guide is snapped onto the second frame equipped with the second light guide. The relative arrangement of the assembled second light guide and the first light guide allows external light to be smoothly transmitted to the photosensitive device through the second light guide and the first light guide, ensuring that the photosensitive device can smoothly sense the intensity of external light. At the same time, due to the split design of the first light guide and the second light guide, the size design of the first light guide and the second light guide is more flexible, so that the sizes of the two will not interfere with the assembly process, so that the first frame can be easily snapped onto the second frame, reducing the difficulty of assembly and improving assembly efficiency.

[0009] In some embodiments of the first aspect of the present application, adjacent surfaces of the first light guide member and the second light guide member are parallel to each other and spaced apart.

[0010] In some embodiments of the first aspect of the present application, a distance between adjacent surfaces of the first light guide and the second light guide is 0-0.25 mm.

[0011] Since there is a gap between the first light emitting surface and the second light incident surface, the two will not collide with each other, and the maximum upper limit of the gap is controlled to be 0.25mm, which can ensure the transmission efficiency of ambient light between the first light guide member and the second light guide member.

[0012] In some embodiments of the first aspect of the present application, the transmittance of the second light guide member is greater than the transmittance of the first light guide member.

[0013] The first light guide is used to sense ambient light and transmit it to the interior of the mobile terminal. The first light guide is made of a semi-transparent material with highly diffusible particles, which can improve the range of external light perception. The second light guide is made of a high-transmittance material. By setting the transmittance of the second light guide to be greater than that of the first light guide, the luminous flux sensitivity can be improved. In some embodiments of the first aspect of the present application, the area surrounding the second through hole is recessed to form a receiving groove, wherein the bottom surface of the receiving groove is inclined so that in the thickness direction of the electronic device, the bottom surface of the receiving groove gradually moves away from the first frame in the direction away from the display module.

[0014] This inclined arrangement can make it easier for the second frame to be fastened to the first frame, and can also reduce scratches on the first light-emitting surface and the first buffer.

[0015] In some embodiments of the first aspect of the present application, the electronic device further includes a first buffer member disposed between the first light guide member and the second light guide member, wherein the first buffer member is fixedly connected to the receiving groove via a first colloid.

[0016] In this embodiment, by providing the first buffer, the first light guide member can be prevented from directly colliding with or squeezing the second light guide member, thereby avoiding affecting the assembled second light guide member and buffering the squeezing force of the first light guide member.

[0017] In some embodiments of the first aspect of the present application, the first light guide member includes a first light guide column and a first mounting plate, the first mounting plate includes a first mounting surface, the first mounting surface is fixedly connected to the surface of the first frame facing the first accommodating cavity, the first light guide column is arranged on the first mounting surface, and the first light guide column is at least partially accommodated in the first through hole.

[0018] In some embodiments of the first aspect of the present application, the second light guide member includes a second light guide column and a second mounting plate, the second mounting plate includes a second mounting surface, the second mounting surface is fixedly connected to the surface of the second frame facing away from the first through hole, the second light guide column is arranged on the second mounting surface, and is at least partially located in the second through hole.

[0019] In some embodiments of the first aspect of the present application, the second light guide member further includes a light guide plate disposed on a surface of the second mounting plate away from the first through hole, and the light guide plate extends in a direction away from the first through hole.

[0020] In some embodiments of the first aspect of the present application, along a direction parallel to the second mounting surface, the surface of the light guide plate is opposite to the photosensitive element.

[0021] In some embodiments of the first aspect of the present application, the second frame surrounds and forms a second accommodating cavity, and the photosensitive device is located in the second accommodating cavity.

[0022] In some embodiments of the first aspect of the present application, the electronic device further includes a circuit board, the circuit board is disposed in the second accommodating cavity, and the photosensitive element is disposed on the circuit board.

[0023] In some embodiments of the first aspect of the present application, the first frame further includes a first middle plate, which is disposed on a side of the first frame facing the first accommodating cavity;

[0024] The second frame body further includes a second middle plate, which is arranged on a side of the second frame facing the second accommodating cavity;

[0025] The second middle plate, the circuit board and the first middle plate are stacked in sequence in the thickness direction of the electronic device. The photosensitive device is fixedly arranged on the surface of the circuit board close to the second middle plate, and the photosensitive surface of the photosensitive device is away from the circuit board.

[0026] Specifically, to reduce the thickness of the electronic device, the second mid-plate, the circuit board, and the first mid-plate are stacked in sequence, with the photosensitive surface of the photosensitive device facing away from the circuit board. The thickness of the photosensitive device is aligned with the thickness of the electronic device. This stacked structure minimizes the impact of the photosensitive device on the thickness of the electronic device. Furthermore, the second light-emitting surface and the photosensitive surface are opposed to each other, further reducing the thickness of the electronic device. Here, the second light-emitting surface and the photosensitive surface are opposed to each other, meaning that their projections on the plane where the display module of the electronic device is located at least partially overlap.

[0027] In some embodiments of the first aspect of the present application, the electronic device also includes a display module, which is arranged on a side of the second middle plate away from the first middle plate, and the first light guide column is inclined toward the side away from the display module from the first through hole toward the accommodating cavity.

[0028] In this embodiment, the first light guide column is tilted toward the side close to the display module, so that an angle is formed between the axis of the first light guide column and the horizontal plane (i.e., the plane of the display module). This tilted arrangement of the first light guide column allows external light to enter the light guide more easily when the user uses the electronic device normally (with the display module facing upward), thereby achieving more accurate ambient brightness detection.

[0029] In some embodiments of the first aspect of the present application, a surface of the light guide plate close to the second middle plate is a third mounting surface, and the third mounting surface is fixedly connected to the second middle plate.

[0030] In this embodiment, the third mounting surface and the second middle plate are fixedly connected, which can further improve the degree of fixation between the second light guide member and the second frame.

[0031] In some embodiments of the first aspect of the present application, a second colloid is arranged between the first mounting surface and the surface of the first frame facing the first accommodating cavity, the second colloid is circumferentially arranged around the first light guide column, and the first mounting surface is fixedly connected to the surface of the first frame facing the first accommodating cavity through the second colloid.

[0032] By arranging the second colloid around the first light guide column in a circle, it is possible to prevent external liquid from entering the interior of the electronic device through the gap between the first light guide column and the first through hole.

[0033] In some embodiments of the first aspect of the present application, a third colloid is provided between the second mounting surface and the surface of the second frame facing away from the first through hole, and between the third mounting surface and the second middle plate. The third colloid is arranged circumferentially around the second light guide column. The second mounting surface is fixedly connected to the inner surface of the second frame through the third colloid, and the third mounting surface is fixedly connected to the second middle plate through the third colloid.

[0034] By arranging the third colloid circumferentially around the second light guide column, it is possible to prevent external liquid from entering the interior of the electronic device through the gap between the second light guide column and the second through hole.

[0035] In some embodiments of the first aspect of the present application, the second frame and the first middle plate have a second gap in the thickness direction of the electronic device, and the second gap is filled with a second buffer.

[0036] The second buffer member between the first middle plate and the second frame body can prevent external liquid from entering the interior of the electronic device through the gap between the first middle plate and the second frame body.

[0037] In some embodiments of the first aspect of the present application, the first frame and the first middle plate are an integrated structure.

[0038] When the first frame and the first middle plate are split structures, the first middle plate can serve as the appearance surface, and the material of the first middle plate can be more diverse. When the first frame and the first middle plate are integrated structures, the strength of the electronic device can be improved. At this time, the first middle plate can be an appearance surface or a non-appearance surface. When the first middle plate is a non-appearance surface, a layer of shell can be added to the outside of the first middle plate as the appearance surface.

[0039] In some embodiments of the first aspect of the present application, a limiting step is provided around the accommodating groove, and the limiting step includes a limiting step bottom surface and a limiting step side surface. The limiting step bottom surface is used to limit the movement of the first light guide member in a direction perpendicular to the first light emitting surface, and the limiting side surface is used to limit the rotation of the first light guide member.

[0040] In this embodiment, the movement of the first light guide member is further limited by the limiting step, so that the first light guide member can be more firmly assembled.

[0041] In some embodiments of the first aspect of the present application, the electronic device is further provided with a snap-fit ​​structure for fixing the first frame and the second frame on the side of the limiting step, and the accommodating groove, the limiting step and the snap-fit ​​structure are arranged in sequence along the width direction of the electronic device.

[0042] By providing a snap-fit ​​structure on the side of the limiting step, the fastening between the first frame and the second frame can be made more secure. For example, along the width direction of the electronic device, a snap-fit ​​structure is provided on each side of the limiting step to prevent the first frame from being pressed into place or making abnormal noises. At the same time, it can also limit the position of the electronic device in the length and thickness directions, ensuring the position accuracy of the first light guide and the second light guide.

[0043] In some embodiments of the first aspect of the present application, the first light guide column and the first mounting plate are an integrated structure, and / or the second light guide column, the second mounting plate and the light guide plate are an integrated structure.

[0044] In this embodiment, the first light guide column and the first mounting plate of the first light guide member are an integrated structure, and the second light guide column, the second mounting plate and the light guide plate of the second light guide member are an integrated structure, that is, the first light guide member and the second light guide member are an integrally formed structure, which can improve the light transmission efficiency and improve production efficiency.

[0045] In some embodiments of the first aspect of the present application, the light-emitting surface of the first light guide member and / or the light-incoming surface of the second light guide member is one of a polished surface, a textured surface, and a coated surface.

[0046] Through the above surface treatment process, the light transmittance, surface hardness, wear resistance, etc. of the first light emitting surface and the second light incident surface can be increased, thereby improving the light transmission efficiency between the first light guide member and the second light guide member. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] FIG1 is a schematic structural diagram of an electronic device according to some embodiments of the present application;

[0048] FIG2 is an exploded schematic diagram of the electronic device shown in FIG1 ;

[0049] FIG3 is a schematic diagram of a partial cross-sectional structure of the electronic device shown in FIG1 at line AA;

[0050] FIG4 is a schematic structural diagram of an electronic device provided in some other embodiments of the present application;

[0051] FIG5 is a schematic diagram of a partial cross-sectional structure of an electronic device at line BB according to an embodiment shown in FIG4 ;

[0052] FIG6 is a schematic diagram of a partial cross-sectional structure of the electronic device at line BB according to the embodiment of the present application shown in FIG4 ;

[0053] FIG7 is a schematic diagram of a cross-sectional structure of an electronic device at line BB according to another embodiment of the present application shown in FIG4 ;

[0054] (a) and (b) in FIG8 are schematic structural diagrams of the first light guide member;

[0055] FIG9 is a schematic structural diagram of a second light guide member;

[0056] FIG10 is a schematic structural diagram of the first light guide and the second light guide after assembly;

[0057] FIG11 is a schematic diagram of light transmission in the first light guide member and the second light guide member;

[0058] FIG12 is a schematic structural diagram of the front housing of an electronic device;

[0059] FIG13 is an enlarged schematic diagram of a partial structure of the front housing of an electronic device;

[0060] FIG14 is an exploded view of the assembly of the first light guide, the front housing, and the second light guide;

[0061] (a) and (b) in FIG15 are schematic structural diagrams of the locking structure. DETAILED DESCRIPTION

[0062] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being more preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0063] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of the features.

[0064] In the description of the embodiments of the present application, the term "at least one" refers to one or more, and "plurality" refers to two or more. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0065] In the description of the embodiments of this application, the term "and / or" refers to and encompasses any and all possible combinations of one or more of the associated listed items. The term "and / or" describes an association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this application generally indicates that the associated objects are in an "or" relationship.

[0066] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0067] The directional terms mentioned in the embodiments of the present application, such as "inside" and "outside", etc., are only references to the directions in the drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0068] In the description of the embodiments of the present application, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element limited by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In the absence of further restrictions, an element limited by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0069] As used herein, "parallel", "perpendicular", "equal", and "coincidence" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, the difference between the two being equal is less than or equal to 5% of either one. "Coincidence" includes absolute overlap and approximate overlap, wherein the acceptable deviation range of approximate overlap can be, for example, the distance between the two being less than or equal to 0.5 mm.

[0070] The present application provides an electronic device, which is a type of electronic device having a photosensitive device. Specifically, the electronic device can be a portable electronic device or other suitable electronic device. For example, the electronic device can be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, an in-vehicle device, a wearable device (such as a watch or a bracelet), augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, or a VR helmet, etc.

[0071] Please refer to Figures 1, 2, and 3, wherein Figure 1 is a schematic diagram of the structure of an electronic device 100 according to some embodiments of the present application; Figure 2 is an exploded schematic diagram of the electronic device 100 shown in Figure 1; and Figure 3 is a schematic diagram of the partial cross-sectional structure of the electronic device 100 shown in Figure 1 at line AA. "Line AA" refers to the plane where line AA and the arrows at both ends of line AA are located. The descriptions of similar figures in the following text should be understood in the same way and will not be repeated here. In this embodiment, the electronic device 100 is a mobile phone. The electronic device 100 may include a display module 10, a front shell 20, a middle frame 30, a photosensitive device 40, a main circuit board 50, a secondary circuit board 60, a battery 70, a speaker 80, and a back shell 90. The display module 10, the front shell 20, the middle frame 30, and the back shell 90 are stacked in sequence.

[0072] 1 to 3 only schematically illustrate some components of the electronic device 100, and the actual shape, size, position, and structure of these components are not limited by FIG1 , FIG2 , and FIG3 . In other examples, the electronic device 100 may also not include the secondary circuit board 60.

[0073] The display module 10 is used to display image information, video information, and the like. It includes a transparent cover plate 11 and a display screen 12. The transparent cover plate 11 is flat and can be made of materials including, but not limited to, glass, plastic, and ceramic. The transparent cover plate 11 and display screen 12 are stacked and fixedly connected. The connection between the transparent cover plate 11 and display screen 12 can be achieved by, but not limited to, gluing. The transparent cover plate 11 primarily protects the display screen 12 and provides dust protection.

[0074] The display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD), etc. The display surface of the display screen 12 faces the transparent cover plate 11, so that the images, videos, and other information displayed on the display screen 12 can be viewed by the user through the transparent cover plate 11.

[0075] In order to facilitate the description of the embodiments below, an XYZ coordinate system is established for the electronic device 100. Specifically, the thickness direction of the electronic device 100 (that is, the stacking direction of the light-transmitting cover plate 11 and the display screen 12) is defined as the Z-axis direction, and the directions perpendicular to the Z-axis direction are the X-axis direction and the Y-axis direction, and the X-axis direction is perpendicular to the Y-axis direction. Specifically, in this embodiment, the electronic device 100 is in the shape of a rectangular flat plate, wherein the length direction of the electronic device 100 is the Y-axis direction, and the width direction of the electronic device 100 is the X-axis direction. It can be understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs and is not specifically limited here.

[0076] 2 and 3 , the middle frame 30 includes a first frame 311 and a first middle plate 312. The first middle plate 312 is connected to the inner surface of the first frame 311. Specifically, the first middle plate 312 is connected to the end of the inner surface of the first frame 311 away from the display module 10, and the first frame 311 is arranged around the first middle plate 312. The first frame 311 includes a first side 3111, a second side 3112, a third side 3113, and a fourth side 3114 connected in sequence. The first side 3111 and the third side 3113 are arranged opposite each other in a first direction (e.g., the Y-axis direction), and the second side 3112 and the fourth side 3114 are arranged opposite each other in the X-axis direction. In this embodiment, the first side 3111 is the top side frame of the middle frame 30, the second side 3112 is the left side frame of the middle frame 30, the third side 3113 is the bottom side frame of the middle frame 30, and the fourth side 3114 is the right side frame of the middle frame 30.

[0077] The back shell 90 is stacked with the first middle plate 312 of the middle frame 30, and is positioned on the side of the first middle plate 312 facing away from the display module 10. This side of the back shell 90 facing away from the display module 10 forms the exterior surface of the electronic device 100. The back shell 90 is flat. Materials for the back shell 90 include, but are not limited to, glass, plastic, metal, and ceramic. A first frame 311 surrounds the back shell 90, and the back shell 90 is secured to the first frame 311. For example, the back shell 90 can be secured to the first frame 311 by gluing, welding, or snapping, so that the first frame 311 and the back shell 90 can be assembled together. For example, a first step 3110 is formed on the inner circumference of the first frame 311, near the back shell 90, and is recessed in a direction away from the central axis of the first frame 311. The edge of the back shell 90 is supported on the first step 3110. This allows the first step 3110 to be used to position and install the back shell 90, improving installation efficiency. Of course, it is understandable that in other examples, the first step 3110 may not be provided on the first frame 311 , and the outer circumference of the back shell 90 is connected to the inner circumference of the first frame 311 .

[0078] As another example, the middle frame 30 and the back shell 90 can be an integral structure (not shown in the figure). In this case, it can be understood that the first middle plate 312 and the back shell 90 are the same component, and the side of the first middle plate 312 away from the display module 10 forms the exterior surface of the electronic device 100. In addition, the integral structure of the middle frame 30 and the back shell 90 can also reduce the assembly process.

[0079] Please continue to refer to Figures 2 and 3. The front shell 20 also includes a second middle plate 212 and a second frame 211. The second middle plate 212 is in the shape of a rectangular flat plate. The back shell 90, the middle frame 30, the front shell 20 and the display module 10 are stacked, for example, stacked along the direction of the Z axis. The shape of the second middle plate 212 is adapted to the shape of the light-transmitting cover plate 11. The stacking and fixing method of the display module 10 and the front shell 20 can be that the display module 10 is fixed on the second frame 211 of the front shell 20. Specifically, the second middle plate 212 is stacked on the side of the display screen 12 away from the light-transmitting cover plate 11. The second middle plate 212 serves as the structural "skeleton" of the electronic device 100. The main circuit board 50, the auxiliary circuit board 60, the battery 70, etc. can be fixed on the second middle plate 212. It can be understood that in other examples, the front shell 20 may not include the second middle plate 212 and only include the second frame 211. When the front housing 20 does not include the second middle plate 212, the main circuit board 50, the auxiliary circuit board 60, the battery 70, etc. can be fixed to the surface of the display screen 12 away from the light-transmitting cover plate 11, or fixed to the second frame 211, or fixed to the first middle plate 312 of the middle frame 30. In the following description, the front housing 20 including the second middle plate 212 is used as an example.

[0080] The second frame 211 is formed into a ring frame structure. Specifically, please continue to refer to Figure 2, the second frame 211 includes a fifth side 2115, a sixth side 2116, a seventh side 2117 and an eighth side 2118 connected in sequence. Among them, the fifth side 2115 and the seventh side 2117 are arranged relative to each other in a first direction (for example, the Y-axis direction). The sixth side 2116 and the eighth side 2118 are arranged relative to each other in the X-axis direction. In this embodiment, the fifth side 2115 is the top side frame of the front shell 20, the sixth side 2116 is the left side frame of the front shell 20, the seventh side 2117 is the bottom side frame of the front shell 20, and the eighth side 2118 is the right side frame of the front shell 20.

[0081] The second frame 211 is arranged around the second middle plate 212 and the display module 10, and is connected to the second middle plate 212 and the display module 10. Specifically, referring to Figure 3, a second step 2110 is formed on the inner circumference of the second frame 211 near the transparent cover plate 11, which is recessed in a direction away from the central axis of the second frame 211. The edge of the transparent cover plate 11 is supported and fixed on the second step 2110. In this way, the display module 10 can be positioned and installed using the second step 2110, which can improve installation efficiency. Of course, it is understandable that in other examples, the second step 2110 may not be provided on the second frame 211. The outer circumference of the transparent cover plate 11 is connected to the inner circumference of the second frame 211. The connection method between the transparent cover plate 11 and the second frame 211 includes but is not limited to gluing, welding or clamping.

[0082] The front housing 20 can be an integrally formed structure, that is, the second middle plate 212 and the second frame 211 form a single unitary structure. This helps improve the structural strength of the front housing 20, simplifies the processing of the front housing 20, and reduces the production cost of the front housing 20. Of course, the present application is not limited to this. In other examples, the front housing 20 can also be formed by assembling the second frame 211 and the second middle plate 212. The connection methods between the second frame 211 and the second middle plate 212 include, but are not limited to, gluing, snapping, screw connection, welding, etc.

[0083] As shown in Figure 2, the middle frame 30 and the front shell 20 are stacked in the Z-axis direction, and the dimensions of the first frame 311 in the X and Y directions are both larger than the dimensions of the second frame 211 in the X and Y directions, so that the first frame 311 at least partially wraps the second frame 211, forming a full-enclosed structure (i.e., a unibody structure). In this full-enclosed structure, the first side 3111 of the middle frame 30 is located at the periphery of the fifth side 2115 of the front shell 20 and is opposite to the fifth side 2115, the second side 3112 of the middle frame 30 is located at the periphery of the sixth side 2116 of the front shell 20 and is opposite to the sixth side 2116, the third side 3113 of the middle frame 30 is located at the periphery of the seventh side 2117 of the front shell 20 and is opposite to the seventh side 2117, and the fourth side 3114 of the middle frame 30 is located at the periphery of the eighth side 2118 of the front shell 20 and is opposite to the eighth side 2118. Thus, the first frame 311 of the middle frame 30 partially wraps the second frame 211 of the front shell 20 on the outside, and the outer surface of the middle frame 30 becomes the appearance surface of the electronic device 100. For example, the outer surface includes the appearance surface of the top of the electronic device 100.

[0084] It should be noted that when the second frame 211 and the second middle plate 212 are not an integral structure, or the second middle plate 212 is not provided in the front shell 20, the second frame 211 can be an integrally molded structure with the back shell 90, that is, the second frame 211 and the back shell 90 are an integral structure.

[0085] The main circuit board 50 is used to integrate a control chip. The control chip includes a processor (e.g., an application processor (AP), a memory (e.g., double data rate synchronous dynamic random access memory (DDR), universal flash storage (UFS)), and a controller. In some embodiments, the main circuit board 50 is electrically connected to the display screen 12 and is used to control the display screen 12 to display images or videos.

[0086] The main circuit board 50 can be a rigid circuit board, a flexible circuit board, or a combination of rigid and flexible circuit boards. For example, the main circuit board 50 can be made of FR-4 dielectric board, Rogers dielectric board, or a hybrid of FR-4 and Rogers dielectric board. FR-4 is a flame-retardant material grade, and Rogers dielectric board is a high-frequency board.

[0087] The main circuit board 50 is located within the second frame 211 and is fixed relative to the second frame 211. Specifically, the main circuit board 50 is fixed to the surface of the second middle plate 212 away from the display module 10, that is, the surface facing the back shell 90. For example, the main circuit board 50 can be fixed to the surface of the second middle plate 212 away from the display module 10 by means of threaded connection, clamping, gluing, or welding.

[0088] To increase the layout area of ​​the main circuit board 50, electronic components are arranged on the surface of the main circuit board 50 facing the display module 10. Furthermore, to prevent interference between the electronic components on the surface of the main circuit board 50 facing the second mid-plate 212 and the second mid-plate 212, a clearance gap is provided between the electronic components on the surface of the main circuit board 50 facing the display module 10 and the second mid-plate 212. For example, to facilitate the formation of this clearance gap, a protrusion (not shown) is provided on the surface of the second mid-plate 212 facing the back shell 90. The main circuit board 50 is secured to the protrusion. In other examples, the protrusion may also be provided on the main circuit board 50. For example, the protrusion may be a screw post. Of course, it is understood that in other examples, the formation of this clearance gap is not limited to this method. Alternatively, holes or slots may be provided on the second mid-plate 212 at locations corresponding to the electronic components for clearance. As long as the electronic components on the surface of the main circuit board 50 facing the display module 10 are spaced apart from the second mid-plate 212, the clearance gap is sufficient.

[0089] The secondary circuit board 60 is used to integrate a universal serial bus (USB) device 60b. The USB device 60b can be a USB type-C interface device, a USB type-A interface device, a USB type Micro-B interface device, or a USB type-B interface device. A socket 211a (not shown) is provided on the second frame 211 at a position corresponding to the USB device 60b. Accessories such as a charger and a data cable can be electrically connected to the USB device 60b via this socket 211a to enable power, signal, and data transmission.

[0090] The auxiliary circuit board 60 can be a rigid circuit board, a flexible circuit board, or a rigid-flexible circuit board. The auxiliary circuit board 60 can be made of FR-4 dielectric board, Rogers dielectric board, or a hybrid dielectric board of FR-4 and Rogers.

[0091] The secondary circuit board 60 is located within the second frame 211 and is fixed relative to the second frame 211. Specifically, the secondary circuit board 60 is fixed to the surface of the second mid-plate 212 facing away from the display module 10, that is, the surface facing the back shell 90. Specifically, the secondary circuit board 60 can be fixed to the surface of the second mid-plate 212 facing away from the display module 10 by means of threaded connection, snap-fitting, gluing, or welding. The secondary circuit board 60 and the main circuit board 50 are arranged in the Y-axis direction. For example, the secondary circuit board 60 can be arranged on the side of the battery 70 facing the seventh side 2117, and the main circuit board 50 can be arranged on the side of the battery 70 facing the fifth side 2115. It will be understood that when electronic components are arranged on the surface of the secondary circuit board 60 facing the display module 10, in order to prevent interference between the electronic components on the surface of the secondary circuit board 60 facing the display module 10 and the second mid-plate 212, a clearance gap (not shown in the figure) can also be provided between the electronic components on the surface of the secondary circuit board 60 facing the display module 10 and the second mid-plate 212.

[0092] The secondary circuit board 60 is electrically connected to the primary circuit board 50 via a connecting structure to enable data and signal transmission between the secondary circuit board 60 and the primary circuit board 50. The connecting structure may be a flexible printed circuit (FPC). In other embodiments, the connecting structure may also be a conductive wire or enameled wire.

[0093] The battery 70 is fixed to the surface of the second middle plate 212 away from the display module 10, that is, the surface facing the back shell 90, and is located between the main circuit board 50 and the auxiliary circuit board 60. In some embodiments, a mounting groove is provided on the surface of the second middle plate 212 facing the back shell 90, and the battery 70 is fixed in the mounting groove. It is understandable that in other examples, the second middle plate 212 may not be provided with a mounting groove, but the side surface of the main circuit board 50, the side surface of the auxiliary circuit board 60, the surface of the second middle plate 212 facing the back shell 90 and the second frame 211 are used to form a mounting groove for placing the battery 70. The battery 70 is used to provide power to the main circuit board 50, the auxiliary circuit board 60, the display module 10 and the photosensitive device 40.

[0094] The battery 70 may include, but is not limited to, a nickel-cadmium battery, a nickel-metal hydride battery, a lithium battery, or other types of batteries. Furthermore, the number of batteries 70 in the embodiment of the present application may be multiple or one. The specific number and arrangement of the batteries 70 in the embodiment of the present application may be set according to actual needs.

[0095] Speaker 80 is used to convert audio electrical signals into sound signals. Speaker 80 is fixed to the main circuit board 50, and may also be fixed to the auxiliary circuit board 60. Alternatively, in other examples, when electronic device 100 includes other circuit boards in addition to main circuit board 50 and auxiliary circuit board 60, speaker 80 may also be fixed to such other circuit boards, as long as speaker 80 is fixed to the circuit boards.

[0096] As shown in Figure 1, the first side 3111 of the middle frame 30 has a sound hole 311b extending therethrough, and the fifth side 2115 of the front shell 20 also has a sound hole (not shown) extending therethrough at the corresponding position. The sound emitted by the speaker 80 is transmitted to the outside of the electronic device 100 via the sound hole 311b. When the electronic device 100 receives a call or voice message, the voice can be heard by placing the sound hole 311b close to the human ear. In other examples, the sound hole 311b can also be provided between the display module 10 and the fifth side 2115 of the front shell. It is understandable that in other examples, the sound hole 311b can also be formed at one end of the light-transmitting cover plate 11 of the display module 10 adjacent to the fifth side 2115. It is sufficient to ensure that the end of the electronic device 100 having the fifth side 2115 is provided with the sound hole 311b.

[0097] As shown in FIG3 , the light sensor 40 can be used to detect the intensity of ambient light in the external environment in which the electronic device 100 is located. Specifically, the light sensor 40 can be an ambient light sensor. An ambient light sensor typically includes a photosensor and a logic circuit. The photosensor detects ambient light and generates a current. The logic circuit includes a current amplifier and a passive low-pass filter to detect and process the output voltage signal caused by the light input. Using the current ambient light intensity measured by the ambient light sensor, the electronic device 100 can automatically adjust the screen brightness. For example, when the ambient light sensor detects that the current ambient light intensity in the environment in which the electronic device 100 is located is low, the screen brightness can be reduced to prevent glare. When the ambient light sensor detects that the current ambient light intensity in the environment in which the electronic device 100 is located is bright, the screen brightness can be increased to provide a clearer display. Of course, it is understood that in other examples, the light sensor 40 can also be a proximity / ambient light sensor that integrates the functions of an ambient light sensor and a proximity light sensor. It is sufficient as long as the light sensing device 40 has the function of detecting the light intensity of the ambient light in the external environment where the electronic device 100 is located.

[0098] The photosensitive device 40 has a first end 40A1 and a second end 40A2 that face each other along its thickness. The photosensitive device 40 is fixed to the surface of the main circuit board 50 facing the display module 10 by means of the first end 40A1 and is electrically connected to the main circuit board 50. In other examples, the photosensitive device 40 may also be disposed on the surface of the auxiliary circuit board 60 facing the display module 10 and electrically connected to the auxiliary circuit board 60. Alternatively, in other examples, when the electronic device 100 includes other circuit boards in addition to the main circuit board 50 and the auxiliary circuit board 60, the photosensitive device 40 may also be fixed to the surface of the other circuit board facing the display module 10, as long as the photosensitive device 40 is fixed to the surface of the circuit board facing the display module 10. In the following description, the photosensitive device 40 is fixed to the main circuit board 50 as an example.

[0099] For example, the photosensitive device 40 can be mounted on the main circuit board 50 using a surface mount device (SMD) process. This can reduce the height of the photosensitive device 40 protruding from the main circuit board 50, reduce the overall thickness of the main circuit board 50 and the photosensitive device 40, and thus help reduce the overall thickness of the electronic device 100.

[0100] To improve the reliability of the photosensitive device 40 in detecting the intensity of ambient light, the second end 40A2 of the photosensitive device 40 faces the display module 10, and the second end 40A2 of the photosensitive device 40 has a photosensitive surface. As shown in FIG3 , in this embodiment, a gap 201 is provided between the front housing 20 of the electronic device 100 and the display screen 12 of the display module 10, a through hole 202 is provided on the second middle plate 212, and a light guide 401 is provided around the periphery of the photosensitive device 40, or the light guide 401 can be provided above the photosensitive device 40 (not shown in the figure). External light passes through the transparent cover 11 of the display module 10 and then passes through the gap 201 and the light guide 401 to enter the photosensitive device 40, thereby enabling the photosensitive device 40 to receive ambient light. However, in this solution, since a gap 201 is provided between the front shell 20 and the display screen 12 of the display module 10, the effective display area of ​​the display screen 12 becomes smaller, thereby causing the black edge of the screen to increase. In addition, there are problems such as glue overflow and hole blockage at the position of the gap 201, which pose a risk of functional failure. In addition, since a through hole 202 is provided on the second middle plate 212, the structural strength of the second middle plate 212 will also be affected.

[0101] In order to improve the structural strength of the display module 10 and the full-screen design, the structural strength of the second middle plate 212 is also improved. Referring to Figures 4 and 5 , Figure 4 is a schematic structural diagram of an electronic device 100 according to another embodiment, and Figure 5 is a schematic partial cross-sectional structural diagram of the electronic device 100 shown in Figure 4 taken along line BB, specifically, a cross-sectional diagram taken along line BB in the negative direction of the X-axis. 1 to 3 , the ambient light in this embodiment does not enter the photosensitive device 40 through the gap between the front shell 20 and the display screen 12. Instead, a first through hole 311c is provided on the first frame 311 of the middle frame 30, and a second through hole 211c is provided on the second frame 211 of the front shell 20. After the middle frame 30 and the front shell 20 are assembled, the positions of the first through hole 311c and the second through hole 211c are arranged relative to each other, so that at least one light guide member 030 can pass through the first through hole 311c and the second through hole 211c. External light enters the light guide member 030 through the light incident surface 0211 of the light guide member 030 and is emitted from the light emitting surface 0212. The photosensitive device 40 receives the light emitted from the light emitting surface 0212, thereby realizing the detection of the brightness of the external ambient light. This solution opens holes on the first border 311 of the middle frame 30 and the second border 211 of the front shell 20. Since ambient light does not need to pass through the gap between the front shell 20 and the display screen 12 to reach the photosensitive device 40, the size of the gap between the front shell 20 and the display screen 12 can be reduced, thereby reducing the black edge of the screen and improving the display effect. In addition, since there is no need to set a through hole on the second middle plate 212, the strength of the middle plate 212 can be further improved.

[0102] It should be noted that the relative arrangement of the positions of the first through hole 311c and the second through hole 211c means that the projections of the first through hole 311c and the second through hole 211c on the plane formed by the X-axis and the Z-axis at least partially overlap, so that external light can enter the interior of the electronic device 100 through the first through hole 311c and the second through hole 211c.

[0103] However, in the above embodiment, since the electronic device 100 is a fully enclosed unibody structure, which includes both the middle frame 30 and the front shell 20, during the assembly process, the light guide 030 is often assembled with the front shell 20 first, and a part of the light guide 030 protrudes from the outer surface of the second frame 211. When the middle frame 30 and the front shell 20 are assembled, the middle frame 30 needs to be snapped into the front shell 20 from the back of the front shell 20 (i.e., from the Z-axis direction) so that the first frame 311 wraps the second frame 211, and in order to ensure the firmness of the wrapping, there is a small assembly gap between the middle frame 30 and the front shell 20. At this time, the part of the light guide 030 protruding from the outer surface of the second frame 211 will cause assembly interference problems, making it difficult for the middle frame 30 to be snapped onto the front shell 20, which makes this solution difficult to assemble.

[0104] In order to solve the technical problems existing in the above two solutions, so as to achieve the technical effect that the electronic device 100 has a higher screen-to-body ratio while taking into account the ease of assembly of the electronic device 100, the present application provides an electronic device 100 according to another embodiment as shown in Figure 6. Figure 6 is a schematic diagram of the partial cross-sectional structure of the electronic device 100 at line BB according to another solution shown in Figure 4, wherein the light guide 030 includes a first light guide 031 and a second light guide 032 of a split design, wherein the first light guide 031 is assembled with the middle frame 30, and the second light guide 032 is assembled with the front shell 20. Due to the split design, the size design of the second light guide 032 can be more flexible. After being assembled with the front shell 20, the second light guide 032 can not protrude from the outer surface of the front shell 20, thereby making it easier to snap together the middle frame 30 and the front shell 20.

[0105] Figure 8 is a schematic structural diagram of the first light guide 031, Figure 9 is a schematic structural diagram of the second light guide 032, and Figure 10 is a schematic structural diagram of the first light guide 031 and the second light guide 032 after assembly. As shown in Figures 8 to 10, the first light guide 031 includes a first light guide column 0311 and a first mounting plate 0312. The first mounting plate 0312 includes a first mounting surface 0313 and a first light emitting surface 0314. The first mounting surface 0313 is arranged opposite to the first light emitting surface 0314. The first light guide column 0311 is arranged on the first mounting surface 0313 and extends toward a side away from the first mounting surface 0313. The first light guide column 0311 includes a first light incident surface 0315 (i.e., the end face of the first light guide 0311) away from the first mounting surface 0313. The first light guide column 0311 and the first mounting plate 0312 can be a separate design or an integrated design. For example, the two are an integrated design. As shown in Figure 6, when the first light guide 031 is assembled with the middle frame 30, the first light guide column 0311 is at least partially located within the first through hole 311c of the middle frame 30, and the first mounting surface 0313 is aligned with the inner surface of the first edge 311. To ensure the aesthetics of the electronic device 100, the first light guide column 0311 does not protrude from the outer surface of the middle frame 30. For example, the first light-incoming surface 0315 of the first light guide column 0311 is flush with the outer surface of the middle frame 30.

[0106] The second light guide member 032 includes a second light guide column 0321, a second mounting plate 0322, and a light guide plate 0323. The second light guide column 0321 and the light guide plate 0323 are respectively connected to the second mounting plate 0322. The second light guide column 0321, the second mounting plate 0322, and the light guide plate 0323 can be a separate structure or an integrated structure, for example, an integrated structure. The second mounting plate 0322 includes a second mounting surface 0324, which is configured to be disposed opposite the inner surface of the second frame 211.

[0107] The second light guide column 0321 is arranged on the second mounting surface 0324 and extends in a direction away from the second mounting surface 0324 (in the Y direction or nearly parallel to the Y direction). The second light guide column 0321 includes a second light-incoming surface 0325 (i.e., the end surface of the second light guide column 0321) away from the second mounting surface 0324. The light guide plate 0323 is arranged on the other side of the second mounting plate 0322 opposite to the second mounting surface 0324 and extends in a direction opposite to the direction in which the second light guide column 0321 extends (in the negative direction of the Y direction or nearly parallel to the Y direction). The light guide plate 0323 includes a third mounting surface 0326 and a second light emitting surface 0327. The third mounting surface 0326 and the second light emitting surface 0327 are located on both sides of the light guide plate 0323. The third mounting surface 0326 is opposite to the surface of the second middle plate 212 away from the display module 10. The third mounting surface 0326 and the second mounting surface 0324 are respectively matched with the second frame 211 and the second middle plate 212 of the front shell 20, so that the second light guide member 032 is conveniently fixed on the front shell 20.

[0108] Among them, the second light guide member 032 and the front shell 20 are assembled together, and the second light guide column 0321 is assembled on the second through hole 211c, so that at least part of the second light guide column 0321 is located in the second through hole 211c and the second light entrance surface 0325 of the second light guide column 0321 is flush with the outer surface of the second frame 211 (that is, the outer surface of the front shell 20) or slightly protrudes from the outer surface of the second frame 211, the second mounting surface 0324 is in contact with the inner surface of the second frame 211 of the front shell 20, and the third mounting surface 0326 is in contact with the side of the second middle plate 212 of the front shell 20 away from the display module 10. An angle α is formed between the second mounting plate 0322 and the light guide plate 0323. The size of α depends on the angle between the inner surface of the second frame 211 of the front shell 20 and the side of the second middle plate 212 away from the display module 10. α can be 90° or slightly greater than 90°.

[0109] As mentioned above, since the first through hole 311c and the second through hole 211c are arranged relative to each other, at least a portion of the first light guide column 0311 is located in the first through hole 311c of the middle frame 30, and at least a portion of the second light guide column 0321 is located in the second through hole 211c. Therefore, the first light guide column 0311 and the second light guide column 0321 are arranged relative to each other. This relative arrangement allows external ambient light to pass through the first light inlet surface 0315 (i.e., the first light guide column 0311). The light emitted from the first light exit surface 0314 is guided into the first light guide column 0311, and is guided out through the first light exit surface 0314. The light guided out from the first light exit surface 0314 enters the second light guide member 032 through the second light input surface 0325 (i.e., the end face of the second light guide member 032). After the light is conducted in the second light guide member 032, it is transferred to the second light exit surface 0327 and emitted. The photosensitive device 40 receives the light emitted from the second light exit surface 0327, thereby realizing the detection of the brightness of the external environment.

[0110] For example, the opening position of the second through hole 211c is set at the lower part of the second frame 211 of the front shell 20, and the projection part of the first light-entering surface 0315 and the second light-entering surface 0325 on the plane where the first side edge 3111 of the middle frame 30 is located overlaps but does not completely overlap. This can not only ensure the strength of the front shell 20, but also ensure that external light can smoothly reach the interior of the electronic device 100.

[0111] In this solution, since the light guide 030 is designed as a split unit, when assembling the electronic device 100, the second light guide 032 and the front housing 20 can be assembled first, and then the first light guide 031 and the middle frame 30 can be assembled. Finally, the middle frame 30 equipped with the first light guide 031 can be snapped onto the front housing 20 equipped with the second light guide 032. The relative arrangement of the assembled second light guide 032 and the first light guide 031 allows external light to be smoothly transmitted through the second light guide 032 and the first light guide 031 to the photosensitive device 40. Moreover, since the second light-incoming surface 0325 of the second light guide column 0321 is flush with the outer surface of the second frame 211 (i.e., the outer surface of the front housing 20) or slightly protrudes from the outer surface of the second frame 211, the second light guide column 0321 will not interfere with subsequent assembly, and the middle frame 30 can be easily snapped onto the front housing 20, thereby reducing the difficulty of assembly. Moreover, since the light guide 030 includes the first light guide 031 and the second light guide 032, the volume of the light guide 030 is larger, the terminal device can sense the external light intensity at a larger field of view, improve the terminal device's screen brightness automatic adjustment function, and enhance the user experience.

[0112] Continuing with FIG11 , the light propagation path of this embodiment is described in detail. Light enters the first light guide 031 from the outside through the first light inlet surface 0315 and exits from the first light outlet surface 0314. The light exiting from the first light outlet surface 0314 enters the second light inlet surface 0325, and some of the light propagates or reflects within the second light guide 032 before exiting from the second light outlet surface 0327. The photosensitive device 40 receives the light exiting from the second light outlet surface 0327, thereby detecting the brightness of the external environment. It should be noted that after light enters the first light guide 031 from the outside, it may be reflected, refracted, and scattered within the first light guide 031. The same reflection, refracted, and scattered light may occur after entering the second light guide 032. Light may exit from the second light outlet surface 0327 or from the surface opposite the second mounting surface 0324. However, the majority of the light exiting from the second light outlet surface 0327 enters the photosensitive device 40.

[0113] In a more preferred embodiment, as shown in Figure 8, the first light guide column 0311 can be tilted on the first mounting surface 0313 toward the side close to the display module, so that an angle θ is formed between the axis of the first light guide column 0311 and the horizontal plane (i.e., the plane of the display module). This tilted arrangement of the first light guide column 0311 allows external light to more easily enter the light guide when the user uses the electronic device 100 normally (with the display module 10 facing upward), thereby achieving more accurate ambient brightness detection.

[0114] In a more preferred embodiment, as shown in FIG7 , the bottom surface 0612 of the receiving groove 0611 is tilted so that the angle β between the bottom surface 0612 and the horizontal plane (i.e., the surface on which the display module extends) is less than 90°. That is, the distance between the side of the bottom surface 0612 closer to the back shell 90 and the inner surface of the first side 3111 of the middle frame 30 is greater than the distance between the side of the bottom surface 0612 farther from the back shell 90 and the inner surface of the first side 3111 of the middle frame 30. Because the bottom surface 0612 of the receiving groove 0611 is tilted, after the first buffer member 051 is disposed on the receiving groove 0611, the surface of the first buffer member 051 is also tilted. As shown in FIG13 , the first light emitting surface 0314 of the first light guide member 031 and the second light receiving surface 0325 of the second light guide member 032 are both adaptively tilted.

[0115] This tilted arrangement can make it easier for the middle frame 30 to be fastened to the front housing 20 , and can also reduce scratches on the first light emitting surface 0314 and the first buffer member 051 .

[0116] It should be noted that, regardless of which of the aforementioned assembly solutions is used, the first buffer member 051 cannot block the light guide path between the two light guide members. It should be noted that in order to improve the surface effect and surface quality of the light-emitting and light-incoming surfaces and reduce the risk of scratches on the light surfaces by foreign objects, the light-emitting and light-incoming surfaces may be subjected to some surface treatment, such as mirror polishing or surface texture effects.

[0117] Among them, the surface forms of the first light-emitting surface 0314 and the second light-incoming surface 0325 can be not restricted, and can be a flat surface, a curved surface, or a combination of surfaces; and surface treatment can be performed to increase the light transmittance, surface hardness, wear resistance, etc. of the light guide component, and the treatment method can be mirror polishing, texture effect, coating treatment, etc.

[0118] The first light guide 031 and the second light guide 032 may be made of the same material or different materials. The material of the light guide may be one or more of polycarbonate (PC), polymethacrylate (PMMA), polystyrene (PS), polypropylene (PP), polyvinyl chloride (PVC), and polyurethane (PU). When different materials are used, for example, the first light guide 031 may be made of a material that takes into account both the exquisite appearance and light transmittance. The first light guide 031 is used to sense the external ambient light and transmit it to the inside of the mobile terminal. At the same time, the material of the first light guide 031 may be a semi-transparent material with high-diffusion particles to improve the range of external light perception; the second light guide 032 may be made of a material with better light transmittance to improve the luminous flux sensitivity, that is, the light transmittance of the second light guide 032 is greater than that of the first light guide 031. In this way, the entire ambient light solution can take into account both the exquisite appearance and light transmittance.

[0119] Continuing with FIG. 6 or FIG. 7 , a second colloid 041 is disposed between the first mounting surface 0313 of the first light guide 031 and the inner surface of the first frame 311. The first light guide 031 is adhered and fixed to the inner surface of the first frame 311 via the second colloid 041. For example, the second colloid 041 is circumferentially arranged around the first light guide 0311 on the first mounting surface 0313. The circumferential arrangement of the second colloid 041 prevents contaminants such as external liquid from entering the interior of the electronic device 100 through the first through-hole 311c, thereby providing a sealing and protective effect.

[0120] A third colloid 042 is arranged between the second mounting surface 0324 of the second light guide member 032 and the inner surface of the second frame 211, and a third colloid 042 is also arranged between the third mounting surface 0326 of the second light guide member 032 and the second middle plate 212. The second light guide member 032 is adhered to the second frame 211 and the second middle plate 212 through the third colloid 042. Exemplarily, the third colloid 042 is continuously arranged on the second mounting surface 0324 and the third mounting surface 0326, and the third colloid 042 is arranged circumferentially around the second light guide column 0321. Through this arrangement, the third colloid 042 can block pollutants such as external liquids from entering the cavity inside the electronic device 100 through the second through hole 211c, thereby playing a role of sealing and protection.

[0121] Continuing to refer to Figure 6 or Figure 7, a second buffer member 052 can be set between the first middle plate 312 and the front shell 20. The second buffer member 052 provides a buffering effect, so that when the middle frame 30 is buckled onto the front shell 20, it can reduce damage to the front shell 20 and other components. At the same time, it can protect the liquid inlet path in the gap between the front shell 20 and the middle frame 30.

[0122] 12 to 14 , FIG12 is a perspective view of the front housing 20, FIG13 is a partial enlarged view of the front housing 20, and FIG14 is an exploded view of the assembly of the first light guide 041 and the second light guide 032. As shown in FIG12 to 13 , the fifth side 2115 of the front housing 20 has an outer surface 061 (also the outer surface of the front housing), and the outer surface 061 is recessed inwardly in the area surrounding the second through hole 211 c to form a receiving groove 0611. The receiving groove 0611 has a bottom surface 0612 and a peripheral side surface 0613, and the peripheral side surface 0613 is arranged around the bottom surface 0612. The second through hole 211 c passes through the inner surface of the fifth side 2115 and the bottom surface 0612, and the inner surface of the second through hole 211 c is connected to the bottom surface 0612. The shape of the receiving groove 0611 can be an irregular polygon, square, rectangle, trapezoid, circle or any other shape, as long as the receiving groove 0611 covers and surrounds the second through hole 211c.

[0123] Continuing with Figures 6 and 7 , a first buffer member 051, whose shape matches that of the receiving groove 0611, is fixedly mounted on the receiving groove 0611. The first buffer member 051 is provided with a third through hole 0521. The third through hole is positioned opposite the second through hole 211c to allow light emitted from the first light-emitting surface 0314 to enter the second light-incoming surface 0325. For example, a first colloid 053 is disposed between the first buffer member 051 and the receiving groove 0611, and the first buffer member 051 is fixed to the receiving groove 0611 via the first colloid 053. For example, the diameter of the third through hole 0521 is greater than the diameter of the second light-guiding pillar 0321, which in turn is greater than the diameter of the second through hole 211c.

[0124] Exemplarily, the first buffer member 051 can be set to a sealing material such as foam, and the first buffer member 051 can be compressed in the Y-axis direction. By arranging the first buffer member 051 on the accommodating groove 0611, when the middle frame 30 is buckled into the front shell 20 from the Z-axis direction, the first light guide member 031 will first contact the first buffer member 051, and will not cause the first light guide member 031 to directly bump into or squeeze the second light guide member 032, thereby avoiding affecting the assembled second light guide member 032, and further playing the role of buffering the extrusion force of the first light guide member 031.

[0125] Exemplarily, the end face of the second light guide column 0321 (i.e., the second light incident surface 0325) is flush with the bottom surface 0612 of the accommodating groove 0611, or the end face 030123 of the second light guide column 0321 protrudes slightly from the bottom surface 0612 but does not protrude from the outer surface 061, that is, the protrusion of the second light guide column 0321 is based on the fact that it does not interfere with the first light guide component 031 after assembly.

[0126] For example, after assembly, there is a certain gap between the first light emitting surface 0314 of the first light guide member 031 and the second light incident surface 0325 of the second light guide member 032 , and the gap range may be 0-0.25 mm.

[0127] For example, the first colloid 053 and the first buffer member 051 are both arranged around the second through hole 211c, thereby further improving the sealing and protection effect.

[0128] In this embodiment, by respectively setting a second colloid 041 between the first mounting surface 0313 of the first light guide 031 and the inner surface of the first frame 311, setting a third colloid 042 between the third mounting surface 0326 of the second light guide 032 and the second middle plate 212, and setting a second buffer member 052 between the first middle plate 312 and the front shell 20, and the first buffer member 051 and the first colloid 053 on the accommodating groove 0611, external liquid can be effectively prevented from entering the interior of the electronic device 100, thereby forming a multi-level sealing solution.

[0129] Continuing to refer to FIG13 , a limiting step 0614 is further provided near the periphery of the accommodating groove 0611. The limiting step 0614 includes a limiting step bottom surface 0615 and a limiting step side surface 0616. The limiting step bottom surface 0615 and the limiting step side surface 0616 are connected. The limiting step 0614 is arranged around the circumference of the accommodating groove 0611. The limiting platform bottom surface 0615 is parallel to the accommodating groove bottom surface 0612, forming a ring-shaped limiting step bottom surface 0615. The limiting step bottom surface 0615 has a height difference with the outer surface 061 and the bottom surface 0612 in a direction perpendicular to the limiting step bottom surface 0615. The limiting step bottom surface 0615 and the limiting step side surface 0616 form a limiting space. The size of the limiting space is the same as that of the first light guide member 03. 1, the dimensions of the first mounting plate 0312 are matched, so that after the first light guide 031 is assembled, the first light-emitting surface 0314 of the first mounting plate 0312 is aligned or nearly aligned with the bottom surface 0615 of the limiting step, the side surface of the first mounting plate 0312 is aligned or nearly aligned with the side surface 0616 of the limiting step, and the end surface of the second light guide 032 does not protrude from the bottom surface 0615 of the limiting step. The bottom surface 0615 of the limiting step can limit the movement of the first light guide 031 in a direction perpendicular to the bottom surface 0615 of the limiting step, and the side surface 0616 of the limiting step can prevent the first light guide 031 from rotating, avoiding positional deviation and thus preventing the light transmission effect between the first light guide 031 and the second light guide 032. In addition, the limiting step 0614 can also facilitate faster alignment of the first light guide 031 with the second light guide 032, improving installation efficiency. Moreover, by arranging that the end face of the second light guide member 032 does not protrude from the bottom surface 0615 of the limiting step, when the electronic device 100 falls or is hit, the first light guide member 031 will first touch the bottom surface 0615 of the limiting step, and will not touch the second light input surface 0325 of the second light guide member 032, thereby avoiding scratching the second light input surface 0325.

[0130] 14 , the second colloid 041 , the first light guide 031 , the first buffer 051 , the first colloid 053 , the front housing 20 , the third colloid 042 and the second light guide 032 are stacked in the opposite direction of the Y axis.

[0131] Continuing to refer to Figures 13 and 15, the electronic device 100 is further provided with a snap-fit ​​structure 062 in the X-axis direction. The snap-fit ​​structure 062, the limiting step 0614 and the accommodating groove 0611 are distributed along the X-axis direction. For example, the snap-fit ​​structure 062 includes a first snap-fit ​​structure 0621 and a second snap-fit ​​structure 0622. The second snap-fit ​​structure 0621 and the second snap-fit ​​structure 0622 are respectively arranged on both sides of the accommodating groove 0611.

[0132] As shown in FIG15 , the first engaging structure 0621 can be a plug-in structure, wherein a slot 0623 is provided on the outer surface of the front housing 20, and an inserting tongue 0624 is provided on the inner surface of the middle frame 30. When the middle frame 30 is fastened to the front housing 20, the inserting tongue 0624 is inserted into the slot 0623. The second engaging structure 0622 can be a snap-fit ​​structure, wherein a groove 0625 is provided on the surface of the front housing 20, and a raised barb 0626 is provided on the inner surface of the middle frame 30. When the middle frame 30 is fastened to the front housing 20, the barb 0626 is snapped into the groove 0625. The first and second engaging structures 0621 and 0622 can more securely fasten the middle frame 30 to the front housing 20, prevent the middle frame 30 from being pressed into position or making abnormal noises, and limit the displacement of the first light guide 031 in the Y and Z directions, thereby ensuring the positional accuracy of the first light guide 031 and the second light guide 032.

[0133] It should be noted that the specific implementation of the snap-fit ​​structure 062 in this solution is not limited, as long as it can achieve a secure fastening between the middle frame 30 and the front housing 20. For example, the first snap-fit ​​structure 0621 and the second snap-fit ​​structure 0622 can both be plug-in structures or both be snap-fit ​​structures. The first snap-fit ​​structure 0621 can also be a snap-fit ​​structure while the second snap-fit ​​structure 0622 can be a snap-fit ​​structure. The number of snap-fit ​​units in the snap-fit ​​structure 062 can also be greater than two.

[0134] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0135] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: A first frame body, surrounding and forming a first accommodating cavity, wherein the first frame body comprises a first frame, and the first frame is provided with a first through hole; A second frame body is disposed in the first accommodating cavity, the second frame body comprises a second frame, the second frame is provided with a second through hole, and the second through hole is at least partially opposite to the first through hole; A first light guide member, at least partially located in the first through hole; A second light guide member, at least partially located in the second through hole; and A photosensitive device is arranged inside the electronic device, and light can be transmitted to the photosensitive device through the first light guide member and the second light guide member in sequence.

2. The electronic device according to claim 1, characterized in that: Adjacent surfaces of the first light guide member and the second light guide member are parallel to each other and spaced apart.

3. The electronic device according to claim 2, characterized in that: The distance between adjacent surfaces of the first light guide member and the second light guide member is 0-0.25 mm.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The light transmittance of the second light guide member is greater than the light transmittance of the first light guide member.

5. The electronic device according to any one of claims 1 to 4, characterized in that: The peripheral area of ​​the second through hole is recessed to form a receiving groove, and the bottom surface of the receiving groove is inclined so that in the thickness direction of the electronic device, the bottom surface of the receiving groove gradually moves away from the first frame in the direction away from the display module.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The invention also includes a first buffer member, wherein the first buffer member is arranged between the first light guide member and the second light guide member.

7. The electronic device according to claim 6, characterized in that: The first buffer member is fixedly connected to the containing groove via a first colloid.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The first light guide member includes a first light guide column and a first mounting plate, the first mounting plate includes a first mounting surface, the first mounting surface is fixedly connected to the surface of the first frame facing the first accommodating cavity, the first light guide column is arranged on the first mounting surface, and the first light guide column is at least partially accommodated in the first through hole.

9. The electronic device according to any one of claims 1 to 8, characterized in that: The second light guide member includes a second light guide column and a second mounting plate, the second mounting plate includes a second mounting surface, the second mounting surface is fixedly connected to the surface of the second frame facing away from the first through hole, the second light guide column is arranged on the second mounting surface, and is at least partially located in the second through hole.

10. The electronic device according to claim 9, characterized in that: The second light guide member further includes a light guide plate, which is disposed on a surface of the second mounting plate away from the first through hole and extends in a direction away from the first through hole.

11. The electronic device according to claim 10, characterized in that: Along a direction parallel to the second mounting surface, a surface of the light guide plate is opposite to the photosensitive element.

12. The electronic device according to any one of claims 1 to 11, characterized in that: The second frame body surrounds and forms a second accommodating cavity, and the photosensitive device is located in the second accommodating cavity.

13. The electronic device according to claim 12, characterized in that: The electronic device further includes a circuit board, the circuit board is arranged in the second accommodating cavity, and the photosensitive element is arranged on the circuit board.

14. The electronic device according to claim 12 or 13, characterized in that: The first frame body further includes a first middle plate, which is arranged on a side of the first frame facing the first accommodating cavity; The second frame body further includes a second middle plate, which is arranged on a side of the second frame facing the second accommodation cavity.

15. The electronic device according to claim 14, characterized in that: The second middle plate, the circuit board and the first middle plate are stacked in sequence in the thickness direction of the electronic device, the photosensitive device is fixedly arranged on the surface of the circuit board close to the second middle plate, and the photosensitive surface of the photosensitive device is away from the circuit board.

16. The electronic device according to claim 14 or 15, characterized in that: It also includes a display module, which is arranged on a side of the second middle plate away from the first middle plate, and the first light guide column is inclined toward the side away from the display module from the direction of the first through hole toward the accommodating cavity.

17. The electronic device according to any one of claims 5 to 16, characterized in that: A limiting step is arranged around the accommodating groove, and the limiting step includes a limiting step bottom surface and a limiting step side surface, the limiting step bottom surface is used to limit the movement of the first light guide member along a direction perpendicular to the first light emitting surface, and the limiting side surface is used to limit the rotation of the first light guide member.

18. The electronic device according to claim 17, characterized in that: The electronic device is further provided with a snap-fit ​​structure for fixing the first frame body and the second frame body on the side of the limiting step, and the accommodating groove, the limiting step and the snap-fit ​​structure are arranged in sequence along the width direction of the electronic device.

19. The electronic device according to any one of claims 14 to 18, characterized in that: The surface of the light guide plate close to the second middle plate is a third mounting surface, and the third mounting surface is fixedly connected to the second middle plate.

20. The electronic device according to any one of claims 8 to 19, characterized in that: A second colloid is arranged between the first mounting surface and the surface of the first frame facing the first accommodating cavity. The second colloid is circumferentially arranged around the first light guide column. The first mounting surface is fixedly connected to the surface of the first frame facing the first accommodating cavity through the second colloid.

21. The electronic device according to claim 19 or 20, characterized in that: A third colloid is provided between the second mounting surface and the surface of the second frame facing away from the first through hole, and between the third mounting surface and the second middle plate. The third colloid is arranged circumferentially around the second light guide column. The second mounting surface is fixedly connected to the surface of the second frame of the second frame facing away from the first through hole through the third colloid, and the third mounting surface is fixedly connected to the second middle plate through the third colloid.

22. The electronic device according to any one of claims 14 to 21, characterized in that: The second frame and the first middle plate have a second gap in the thickness direction of the electronic device, and the second gap is filled with a second buffer.

23. The electronic device according to any one of claims 14 to 22, characterized in that: The first frame and the first middle plate are an integrated structure.

24. The electronic device according to any one of claims 9 to 23, characterized in that: The first light guide column and the first mounting plate are an integrated structure, and / or the second light guide column, the second mounting plate and the light guide plate are an integrated structure.

25. The electronic device according to any one of claims 9 to 24, characterized in that: The light emitting surface of the first light guide member and / or the light incident surface of the second light guide member is one of a polished surface, a textured surface, and a coated surface.

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