Organic light-emitting display device

Abstract

This organic light-emitting display device may comprise: banks between sub-pixels on a substrate; anode electrodes on the sub-pixels; an organic light-emitting layer on the anode electrodes and the banks; cathode electrodes on the organic light-emitting layer; and protrusions disposed above the banks so as to be spaced apart from the organic light-emitting layer. The protrusion can include an etch stop layer including one of ITO, Al2O3, Cu and CuOx on the uppermost side thereof.

Description

organic light emitting display device

[0001] The embodiment relates to an organic light emitting display device.

[0002] As demand for portable information media increases, attempts to apply organic light-emitting diodes (OLEDs) to various lightweight and thin information electronic devices are expanding. Recently, OLEDs are being applied to product groups such as mobile PCs and automobiles rather than TVs or mobile phones. Since OLEDs applied to mobile PCs and automobiles operate with still images for long periods of time, long lifespan is required. To achieve long lifespan, light extraction from OLEDs must be maximized. Furthermore, to reduce costs, it is necessary to expand the technology to produce OLEDs on substrates (110) of not only 8.5th generation (2200x2500mm) but also 10.5th generation (3370x2940mm). To produce OLEDs with long lifespan, each subpixel with a top emission structure and side-by-side structure must be implemented with a structure of two or more OLEDs.

[0003] The structure of these organic light-emitting devices can be obtained through deposition equipment using a fine metal mask (FMM, hereinafter referred to as FMM). However, the deposition method using FMM has the problem of low productivity because the production logistics must be produced only in a cluster manner rather than an inline manner. In addition, there is a problem of low alignment position accuracy (PPA) of the subpixel unit between the FMM and the substrate. Accordingly, the emission area ratio (EAR) is small, which limits the product life. Here, the emission area ratio is a value obtained by dividing the emission area of ​​a subpixel by the area of ​​the subpixel.

[0004] Therefore, it is very urgent to develop an organic light-emitting display device having a new deposition method and a new organic light-emitting element structure using the new deposition method to solve the aforementioned problems.

[0005] The present invention aims to solve the above-mentioned and other problems.

[0006] Another object of the embodiment is to provide an organic light emitting display device having a novel structure.

[0007] Another object of the present invention is to provide an organic light emitting display device capable of improving lifespan.

[0008] Another object of the present invention is to provide an organic light-emitting display device capable of improving productivity and yield.

[0009] Another object of the present invention is to provide an organic light-emitting display device capable of improving image quality.

[0010] The technical problems of the embodiment are not limited to those described in this article, but include those that can be understood through the description of the invention.

[0011] According to one aspect of the embodiment to achieve the above or other purposes, an organic light-emitting display device includes: a bank between sub-pixels on a substrate; an anode electrode on the sub-pixel; an organic light-emitting layer on the anode electrode and the bank; a cathode electrode on the organic light-emitting layer; and a protrusion disposed on an upper side of the bank to be spaced apart from the organic light-emitting layer; wherein the protrusion includes an etch-preventing layer including one of ITO, Al2O3, Cu, and CuOx on an uppermost side thereof.

[0012] The above protrusion has a connection structure including an auxiliary electrode electrically connected to the cathode electrode, and the etch-preventing layer can be disposed on the connection structure.

[0013] The protrusion may include a first layer on the bank, a second layer on the first layer, and a third layer below the first layer. A side of the third layer may be positioned on the same vertical line or diagonal line as a side of the second layer, or may extend from a side of the second layer in the direction of the subpixel. A side of the first layer may enter the inside of the protrusion from a side of the second layer.

[0014] The above etching prevention layer may be disposed on the second layer.

[0015] The above etch-preventing layer may surround the second layer.

[0016] The above etch-preventing layer can be disposed on the side and lower side of the second layer.

[0017] The etch-preventing layer may include a first etch-preventing layer on the second layer; and a second etch-preventing layer between the second layer and the first etch-preventing layer.

[0018] The first etching prevention layer may be disposed on the lower side of the second layer via a side of the second etching prevention layer.

[0019] At least one of the first layer, the second layer or the third layer may be the auxiliary electrode.

[0020] The above protrusion may include a seed layer and a plating layer on the seed layer. The plating layer may be the etching prevention layer.

[0021] The above plating layer may have a width of the upper region smaller than the width of the lower region and may have a round mushroom structure at the edge of the surface of the upper region.

[0022] The above protrusion may further include a cover layer on the above plating layer.

[0023] The organic light-emitting display device may further include a blocking structure that induces a hole injection layer of the organic light-emitting layer in the bank to be disconnected.

[0024] The effects of the organic light-emitting display device according to the embodiment are described as follows.

[0025] According to at least one of the embodiments, there is an advantage that the process can be simplified and the process cost can be reduced because there is no need to use FMM.

[0026] According to at least one of the embodiments, there is an advantage that the EAR within a subpixel can be increased without the need for using an FMM, thereby improving the lifetime.

[0027] According to at least one of the embodiments, the organic light-emitting device is deposited on a large-area substrate in an inline deposition system, thereby providing advantages in productivity, yield, and material utilization efficiency.

[0028] Further scope of applicability of the embodiments will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of the embodiments will be readily apparent to those skilled in the art, it should be understood that the detailed description and specific embodiments, such as preferred embodiments, are given by way of example only.

[0029] FIG. 1 is a plan view schematically illustrating an organic light-emitting display device according to a first embodiment.

[0030] Figure 2 is a plan view illustrating one pixel of Figure 1.

[0031] Fig. 3 is a circuit diagram illustrating an organic light-emitting display device according to an embodiment.

[0032] Figure 4a is a cross-sectional view taken along line AA' in the pixel of Figure 2.

[0033] Figure 4b is a cross-sectional view taken along line BB' in the pixel of Figure 2.

[0034] Figure 4c is a cross-sectional view taken along line CC' in the pixel of Figure 2.

[0035] Fig. 5 is a cross-sectional view illustrating an organic light-emitting display device according to the first embodiment.

[0036] FIGS. 6A to 6C illustrate a manufacturing process of an organic light-emitting display device according to the first embodiment.

[0037] Fig. 7 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment.

[0038] FIGS. 8A to 8C illustrate a manufacturing process of an organic light-emitting display device according to a second embodiment.

[0039] Fig. 9 is a cross-sectional view illustrating an organic light-emitting display device according to a third embodiment.

[0040] Fig. 10 is a cross-sectional view illustrating an organic light-emitting display device according to the fourth embodiment.

[0041] The sizes, shapes, and dimensions of components depicted in the drawings may differ from the actual components. Furthermore, even if the same components are depicted with different sizes, shapes, and dimensions across drawings, this is merely an example within the drawings, and the same components may have the same sizes, shapes, and dimensions across drawings.

[0042] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes 'module' and 'part' used for components in the following description are given or used interchangeably in consideration of the ease of writing the specification, and do not have distinct meanings or roles in themselves. In addition, the attached drawings are intended to make it easier to understand the embodiments disclosed in the present specification, and the technical ideas disclosed in the present specification are not limited by the attached drawings. In addition, when an element such as a layer, region, or substrate is referred to as existing 'on' another element, this includes that it may be directly on the other element or that other intermediate elements may exist therebetween.

[0043] Hereinafter, an organic light-emitting display device having a side-by-side structure manufactured using a photolithography process is disclosed. This structure is referred to as a side-by-side structure by photolithography (Ph-SbS). By using a photolithography process, the use of an FMM is eliminated, simplifying the process and reducing the process cost. In addition, the EAR within a subpixel is increased, thereby improving the lifespan. In addition, since an organic light-emitting element is deposited on a large-area substrate in an inline deposition system, productivity, yield, and material utilization efficiency can be improved.

[0044] Hereinafter, the red subpixel (SPr) may be referred to as a first subpixel, the green subpixel (SPg) may be referred to as a second subpixel, and the blue subpixel (SPb) may be referred to as a third subpixel. In addition, the red organic light-emitting element (120r) may be referred to as a first organic light-emitting element, the green organic light-emitting element (120g) may be referred to as a second organic light-emitting element, and the blue organic light-emitting element (120b) may be referred to as a third organic light-emitting element.

[0045] Hereinafter, the organic light-emitting display device (100) is a top-emitting type that displays an image by emitting light in the upper direction of the substrate (110), but a bottom-emitting type that displays an image by emitting light in the lower direction of the substrate (110) may also be included in the technical concept of the present invention.

[0046] Hereinafter, the drawing symbols of the auxiliary electrodes may be given as AC as shown in Fig. 3 unless a separate drawing symbol is given.

[0047] Fig. 1 is a schematic plan view of an organic light-emitting display device according to a first embodiment. Fig. 2 is a plan view illustrating one pixel of Fig. 1.

[0048] Referring to FIGS. 1 and 2, an organic light-emitting display device (100) according to the first embodiment may include a plurality of pixels (P) arranged in a matrix. The plurality of pixels (P) may be positioned in a display area (AA). An area other than the display area (AA) may be a non-display area (NAA).

[0049] Each pixel (P) may include, for example, a red subpixel (SPr), a green subpixel (SPg), and a blue subpixel (SPb). For example, a red organic light-emitting element (120r) may be disposed in a red subpixel (SPr), a green organic light-emitting element (120g) may be disposed in a green subpixel (SPg), and a blue organic light-emitting element (120b) may be disposed in a blue subpixel (SPb). Although the drawing illustrates that one pixel (P) includes three subpixels (SPr, SPg, SPb), it may include more subpixels.

[0050] The drawing shows the area of ​​the blue subpixel (SPb) to be larger than the area of ​​the red subpixel (SPr) or the area of ​​the green subpixel (SPg), but other variations are possible.

[0051] Each subpixel (SPr, SPg, SPb) may include an emitting area (EA) and a non-emitting area (NEA). The emitting area (EA) may be an area where the organic light-emitting elements (120r, 120g, 120b) of each subpixel (SPr, SPg, SPb) are arranged, and the non-emitting area (NEA) may be an area remaining in each subpixel (SPr, SPg, SPb) excluding the emitting area (EA).

[0052] Meanwhile, a first power line (PL1) and a second power line (PL2) may be provided to supply power to each subpixel (SPr, SPg, SPb). A first power terminal (101) may be electrically connected to one end of the first power line (PL1), and a second power terminal (102) may be electrically connected to one end of the second power line (PL2). The first power terminal (101) and the second power terminal (102) may be electrically connected to a power supply unit (not shown) to receive a first potential voltage and a second potential voltage. The second potential voltage may be greater than the first potential voltage, and the first potential voltage may be grounded.

[0053] A first power line (PL1) and a second power line (PL2) may be arranged between non-emitting areas (NEAs) along a first direction (X). The first power line (PL1) and the second power line (PL2) may be electrically connected to each subpixel (SPr, SPg, SPb).

[0054] The contact pad (103) may be located in the non-emitting area (NEA). The first power line (PL1) may be electrically connected to the contact pad (103).

[0055] The auxiliary electrode (AC in FIG. 3) may be positioned in the non-luminous area (NEA). The auxiliary electrode (AC) may be positioned in the non-luminous area (NEA) along the second direction (Y), but is not limited thereto.

[0056] The auxiliary electrode (AC) may be positioned in a non-emitting area (NEA) adjacent to each subpixel (SPr, SPg, SPb). The auxiliary electrode (AC) may be electrically connected to a first power line (PL1) via a contact pad (103).

[0057] The first power line (PL1), the contact pad (103) and the auxiliary electrode (AC) can be arranged in different layers.

[0058] The auxiliary electrode (AC) may be electrically connected to the cathode electrode of an adjacent organic light-emitting element (120r, 120g, 120b) of an adjacent subpixel (SPr, SPg, SPb). For example, when the auxiliary electrode (AC) is positioned between a red subpixel (SPr) and a green subpixel (SPg), the auxiliary electrode (AC) may be electrically connected to the cathode electrode of the red organic light-emitting element (120r) and the cathode electrode of the green organic light-emitting element (120g).

[0059] Accordingly, the auxiliary electrode (AC) can supply the first potential voltage from the first power line (PL1) to the cathode electrode of each organic light-emitting element (120r, 120g, 120b).

[0060] Meanwhile, the second power line (PL2) may be electrically connected to the driving circuit (106) of each subpixel (SPr, SPg, SPb), for example, a driving transistor, but is not limited thereto. Accordingly, when a specific subpixel is selected in response to a scan signal provided through a specific gate line, light having a brightness corresponding to the current flowing in the driving transistor of the specific subpixel may be emitted by the first potential voltage of the first power line (PL1) and the second potential voltage of the second power line (PL2).

[0061] A plurality of organic light-emitting elements (120r, 120g, 120b) may be arranged in a stripe shape along the second direction (Y). That is, the plurality of organic light-emitting elements (120r, 120g, 120b) may be arranged continuously without being separated along the second direction (Y). For example, red organic light-emitting elements (120r) may be arranged continuously along the second direction (Y), green organic light-emitting elements (120g) may be arranged continuously along the second direction (Y), and blue organic light-emitting elements (120b) may be arranged continuously along the second direction (Y).

[0062] As another example, the plurality of organic light-emitting elements (120r, 120g, 120b) may be separated into pixel (P) units or row-line units along the second direction (Y). That is, the red organic light-emitting element (120r) may be separated into pixel (P) units or row-line units along the second direction (Y), the green organic light-emitting element (120g) may be separated into pixel (P) units or row-line units along the second direction (Y), and the blue organic light-emitting element (120b) may be separated into pixel (P) units or row-line units along the second direction (Y).

[0063] The red subpixels (SPr), green subpixels (SPg), and blue subpixels (SPb) can be alternately arranged in units of columns along the first direction (X). That is, the red subpixels (SPr), green subpixels (SPg), and blue subpixels (SPb) having different colors can be sequentially positioned along the first direction (X) to implement an organic light-emitting display device having a side-by-side structure.

[0064] Meanwhile, an asymmetric open-connect (AOC) structure (105) may be positioned in the non-emitting area (NEA). In an embodiment, the asymmetric open-connect structure (105) may include a connecting structure (105A) and a blocking structure (105B). Since the ratios of depth and gap in the undercut structures of each of the connecting structure (105A) and the blocking structure (105B) are different, the structure may be named an asymmetric open-connect structure (105). The depth may represent the width of the undercut structure in the horizontal direction, and the gap may represent the width of the undercut structure in the vertical direction.

[0065] As will be explained later, lateral leakage current between a plurality of subpixels (SPr, SPg, SPb) can be prevented by the asymmetric blocking connection structure (105). The lateral leakage current may refer to a leakage current flowing between adjacent subpixels (SPr, SPg, SPb) along the first direction (X). In addition, an electrical short between an anode electrode and a cathode electrode in the corresponding subpixels (SPr, SPg, SPb) can be prevented by the asymmetric blocking connection structure (105). Therefore, by using the asymmetric blocking connection structure (105), color spotting due to leakage current can be improved and luminous efficiency and brightness can be significantly improved.

[0066] The connection structure (105A) may be a structure that electrically connects the auxiliary electrode (AC) to the cathode electrode of each organic light-emitting element (120r, 120g, 120b). The blocking structure (105B) may be a structure that separates a layer including a low-resistance organic light-emitting material of each organic light-emitting element (120r, 120g, 120b), such as a hole injection layer, a charge generation layer, etc., thereby preventing an electrical short between the anode electrode and the cathode electrode and reducing leakage current between sub-pixels. The asymmetric blocking connection structure (105) may also be called a 'paradoxical blocking connection'.

[0067] Fig. 3 is a circuit diagram illustrating an organic light-emitting display device according to an embodiment. Fig. 3 may be a circuit diagram for an electrical connection from the first power terminal (101) and the second power terminal (102) in Fig. 2 to a green subpixel (SPg). The circuit diagram illustrated in Fig. 2 may also be equally applied to a circuit diagram for an electrical connection from the first power terminal (101) and the second power terminal (102) to a red subpixel (SPr) or a blue subpixel (SPb).

[0068] As shown in FIG. 3, the first power terminal (101) and the second power terminal (102) can be arranged in the non-display area (NAA), and the first power line (PL1) and the second power line (PL2) can be arranged in the non-display area (NAA) and the display area (AA).

[0069] A contact pad (103) is positioned in the non-emitting area (NEA) and can be electrically connected to a first power line (PL1). The first power line (PL1) can be electrically connected to an auxiliary electrode (AC) through the contact pad (103).

[0070] The organic light-emitting element (120g) may be arranged in the light-emitting area (EA) of the subpixel (SPg), and the connection structure (105A) and the blocking structure (105B) may be arranged in the non-light-emitting area (NEA). The asymmetric blocking connection structure (105) illustrated in FIG. 2 may be formed by the connection structure (105A) and the blocking structure (105B). The auxiliary electrode (AC) may be electrically connected to the cathode electrode (123g) of the organic light-emitting element (120g) by the connection structure (105A). The hole injection layer, etc., of the organic light-emitting element (120g) may be electrically disconnected by the blocking structure (105B), thereby causing an electrical short circuit between the anode electrode (121g) and the cathode electrode (123g).

[0071] As illustrated in Figure 3, various resistances can be formed between each component. Each resistance can be defined as follows.

[0072] R1: Contact resistance between the contact pad (103) and the auxiliary electrode (AC)

[0073] R2: Resistance between the auxiliary electrode (AC) and the cathode electrode

[0074] R4: Resistance between the anode electrode (121g) and the cathode electrode (123g) due to the hole injection layer arranged in the horizontal direction, etc.

[0075] R5: Resistance between the anode electrode (121g) and the cathode electrode (123g) due to multiple organic light-emitting layers arranged in a vertical direction.

[0076] R6: Resistance between the first power line (PL1) and the contact pad (103)

[0077] R7: Resistance between the first power line (PL1) and the auxiliary electrode (AC)

[0078] Among the resistors mentioned above, the hole injection layer forming the fourth resistor (R4) is made of a low-resistance organic light-emitting material, so that leakage current can easily flow through the hole injection layer. If leakage current flows through the hole injection layer, etc., an electrical short between the anode electrode (121g) and the cathode electrode (123g) may cause light not to be emitted from the corresponding subpixel (SPr, SPg, SPb) or the luminance of the light may be significantly lower than the desired luminance.

[0079] In an embodiment, the hole injection layer corresponding to the blocking structure (105B) is cut off by the blocking structure (105B), so that leakage current flowing to the hole injection layer, etc. can be cut off.

[0080] In an embodiment, the cathode electrode (123g) can be easily connected to the auxiliary electrode (AC) by the connection structure (105A), and the deposition area of ​​the organic light-emitting element (120g) can be maximized to improve the light-emitting efficiency.

[0081] Fig. 4a is a cross-sectional view taken along line AA' in the pixel of Fig. 2. Fig. 4b is a cross-sectional view taken along line BB' in the pixel of Fig. 2. Fig. 4c is a cross-sectional view taken along line CC' in the pixel of Fig. 2.

[0082] Referring to FIGS. 1, 2, and 4a to 4c, an organic light-emitting display device according to an embodiment may include a plurality of banks (111-1, 111-2), a plurality of protrusions (130-1, 130-2), a plurality of organic light-emitting elements (120r, 120g, 120b), etc.

[0083] A plurality of banks (111-1, 111-2), a plurality of protrusions (130-1, 130-2), and a plurality of organic light-emitting elements (120r, 120g, 120b) may be arranged on a substrate (110). The plurality of banks (111-1, 111-2), the plurality of protrusions (130-1, 130-2), and / or the plurality of organic light-emitting elements (120r, 120g, 120b) may be arranged on the substrate (110) in a stripe shape along a second direction (Y), respectively. In this case, subpixels of the same color may be arranged along the second direction (Y). For example, a plurality of red subpixels (SPr) may be arranged in a stripe shape along the second direction (Y). The banks (111-1, 111-2) may include an inorganic material or an organic material. For example, the banks (111-1, 111-2) may include inorganic materials such as SiNx, SiON, etc.

[0084] Meanwhile, as illustrated in FIG. 4c, the transverse banks (111-3) may be arranged in row-line units along the second direction (Y). Conversely, the protrusions may not be arranged in row-line units along the second direction (Y). That is, the protrusions may not be arranged on the transverse banks (111-3) along the second direction (Y).

[0085] To distinguish them from the transverse banks (111-3), the first bank (111-1) and the second bank (111-2) may be referred to as longitudinal banks.

[0086] The plurality of subpixels (SPr, SPg, SPb) may be separated from each other by a plurality of banks (111-1, 111-2). A first bank (111-1) may be arranged between a red subpixel (SPr) and a green subpixel (SPg), and a second bank (111-2) may be arranged between a green subpixel (SPg) and a blue subpixel (SPb). Although not shown, a third bank may be arranged between a blue subpixel (SPb) and another red subpixel (SPr).

[0087] A plurality of organic light-emitting elements (120r, 120g, 120b) can be spatially separated and electrically isolated from each other by a plurality of banks (111-1, 111-2). Accordingly, lateral leakage current between the plurality of subpixels (SPr, SPg, SPb) can be blocked, thereby improving color spotting and enhancing light-emitting efficiency and brightness.

[0088] A red organic light-emitting element (120r) may be placed in a red subpixel (SPr), a green organic light-emitting element (120g) may be placed in a green subpixel (SPg), and a blue organic light-emitting element (120b) may be placed in a blue subpixel (SPb).

[0089] The plurality of banks (111-1, 111-2) may have a grid shape. For example, the banks (111-1, 111-2) may be arranged along the perimeter of the subpixels (SPr, SPg, SPb). That is, the plurality of banks (111-1, 111-2) may be arranged between adjacent subpixels (SPr, SPg, SPb) along the first direction (X) and between adjacent subpixels (SPr, SPg, SPb) along the second direction (Y). In this case, the adjacent subpixels (SPr, SPg, SPb) along the first direction (X) may have different colors, while the adjacent subpixels (SPr, SPg, SPb) along the second direction (Y) may have the same color.

[0090] A plurality of organic light-emitting elements (120r, 120g, 120b) can be separated from each other by a plurality of banks (111-1, 111-2). The plurality of banks (111-1, 111-2) can be arranged to distinguish each of the plurality of organic light-emitting elements (120r, 120g, 120b). The red organic light-emitting element (120r) and the green organic light-emitting element (120g) can be separated by the first bank (111-1), and the green organic light-emitting element (120g) and the blue organic light-emitting element (120b) can be separated by the second bank (111-2).

[0091] Meanwhile, the organic light-emitting display device according to the embodiment may include a blocking structure (105B) in the edge region of each of the plurality of banks (111-1, 111-2). For example, the blocking structure (105B) may be arranged in the edge region of the lower side of each of the plurality of banks (111-1, 111-2), but is not limited thereto.

[0092] The blocking structure (105B) may be arranged in an edge region of the banks (111-1, 111-2) between subpixels (SPr, SPg, SPb) along the first direction (X). The blocking structure (105B) may be arranged in an edge region of the banks (111-1, 111-2) between subpixels (SPr, SPg, SPb) along the second direction (Y).

[0093] When organic light-emitting elements (120r, 120g, 120b) are deposited on banks (111-1, 111-2), some layers of the organic light-emitting elements (120r, 120g, 120b) may be disconnected by the blocking structure (105B). For example, the blocking structure (105B) may disconnect a low-resistance layer of each organic light-emitting element (120r, 120g, 120b). The low-resistance layer may include, for example, a hole injection layer, a charge generation layer, etc. The low-resistance layer may mean a layer having a resistance value lower than the resistance value of a high-resistance layer, for example, an organic light-emitting layer, an electron transport layer, an electron injection layer, etc.

[0094] For example, the organic light-emitting layers (122r, 122g, 122b) of each organic light-emitting element (120r, 120g, 120b) may have separation structures (125-1 to 125-3) corresponding to the blocking structure (105B). The separation structures (125-1 to 125-3) may mean a shape in which some layers of the organic light-emitting layers (122r, 122g, 122b) are disconnected. Accordingly, in the separation structures (125-1 to 125-3), for example, a hole injection layer, a charge generation layer, etc. may be disconnected.

[0095] The blocking structure (105B) may include at least one blocking layer (113) extending inward from the side of the bank (111-1, 111-2). An undercut structure may be formed in the edge region of the bank (111-1, 111-2) by the blocking layer (113). The blocking layer (113) may include, but is not limited to, a silicon-based inorganic material, aluminum (Al), molybdenum (Mo), a molybdenum alloy, or the like.

[0096] In a case where an organic light-emitting element (120r, 120g, 120b) is deposited on a bank (111-1, 111-2) in which an undercut structure is formed in this way, some layers corresponding to the undercut structure, such as a hole injection layer and a charge generation layer, among the organic light-emitting layers (122r, 122g, 122b) of the organic light-emitting element (120r, 120g, 120b) may be disconnected.

[0097] Meanwhile, as described above, organic light-emitting elements (120r, 120g, 120b) corresponding to each subpixel (SPr, SPg, SPb) may be arranged.

[0098] The red organic light-emitting element (120r) may include an anode electrode (121r), a red organic light-emitting layer (122r), a cathode electrode (123r), etc. The red organic light-emitting layer (122r) may be disposed on the anode electrode (121r), and the cathode electrode (123r) may be disposed on the red organic light-emitting layer (122r). The green organic light-emitting element (120g) may include an anode electrode (121g), a green organic light-emitting layer (122g), a cathode electrode (123g), etc. The green organic light-emitting layer (122g) may be disposed on the anode electrode (121g), and the cathode electrode (123g) may be disposed on the green organic light-emitting layer (122g). The blue organic light-emitting element (120b) may include an anode electrode (121b), a blue organic light-emitting layer (122b), a cathode electrode (123b), etc. The blue organic light-emitting layer (122b) may be disposed on the anode electrode (121b), and the cathode electrode (123b) may be disposed on the blue organic light-emitting layer (122b).

[0099] The anode electrode (121r, 121g, 121b) may include multiple conductive layers. The anode electrode (121r, 121g, 121b) may have a triple structure composed of ITO / Ag alloy / ITO. The anode electrode (121r, 121g, 121b) may have a triple structure composed of ITO / Ag alloy / (Ti, Mo or MoTi).

[0100] One end of the anode electrode (121r, 121g, 121b) may be placed below the bank (111-1, 111-2). That is, one end of the bank (111-1, 111-2) may be placed on one end of the anode electrode (121r, 121g, 121b). One end of the anode electrode (121r, 121g, 121b) may vertically overlap with the bank (111-1, 111-2).

[0101] The red organic light-emitting layer (122r), the green organic light-emitting layer (122g), and the blue organic light-emitting layer (122b) may include at least a hole injection layer including a low-resistance organic light-emitting material.

[0102] Meanwhile, one end of the hole injection layer and / or the charge generation layer may be in contact with the cathode electrode (123r, 123g, 123b). In addition, the lower surface of the hole injection layer may be in contact with the anode electrode (121r, 121g, 121b). In this case, since the resistance of the hole injection layer is small, a leakage current may flow between the anode electrode (121r, 121g, 121b) and the cathode electrode (123r, 123g, 123b), which may cause an electrical short between the anode electrode (121r, 121g, 121b) and the cathode electrode (123r, 123g, 123b).

[0103] However, according to the embodiment, since the hole injection layer and / or the charge generation layer are disconnected by the blocking structure (105B) arranged in the edge region of the bank (111-1, 111-2), the anode electrode (121r, 121g, 121b) and the cathode electrode (123r, 123g, 123b) are electrically disconnected, so that an electrical short can be prevented.

[0104] Meanwhile, the organic light-emitting display device according to the embodiment may include a plurality of protrusions (130-1, 130-2).

[0105] A plurality of organic light-emitting elements (120r, 120g, 120b) can be spatially separated and electrically isolated from each other by a plurality of protrusions (130-1, 130-2). Accordingly, lateral leakage current between the plurality of subpixels (SPr, SPg, SPb) can be blocked, thereby improving color unevenness and enhancing light-emitting efficiency and brightness.

[0106] A plurality of protrusions (130-1, 130-2) may be arranged on the upper side of a plurality of banks (111-1, 111-2). A first protrusion (130-1) may be arranged on the upper side of a first bank (111-1) between a red subpixel (SPr) and a green subpixel (SPg). A second protrusion (130-2) may be arranged on the upper side of a second bank (111-2) between a green subpixel (SPg) and a blue subpixel (SPb).

[0107] The left and right sides of the protrusions (130-1, 130-2) may have shapes that are symmetrical with respect to the central normal line of the protrusions (130-1, 130-2), but this is not limited thereto. For example, the left and right sides of the protrusions (130-1, 130-2) may each have an undercut structure. In this case, the undercut structure on the left side and the undercut structure on the right side may have shapes that are symmetrical with respect to the central normal line of the protrusions (130-1, 130-2).

[0108] The protrusions (130-1, 130-2) may have a connecting structure (105A) including an auxiliary electrode (AC) electrically connected to the cathode electrodes (123r, 123g, 123b).

[0109] The protrusions (130-1, 130-2) may include a first layer (131) and a second layer (132) on the first layer (131).

[0110] The side of the first layer (131) can enter the inside of the protrusion from the side of the second layer (132). Therefore, an undercut structure can be formed on the side of the protrusion by the first layer (131) and the second layer (132). The undercut structure can have a cave shape. For example, the undercut structure can have a U-shaped dongle shape. Therefore, the undercut structure can be called a dongle, a U-shaped cave, a cave, etc. In order to form the undercut structure, the first layer (131) and the second layer (132) can have different etching selectivities. For example, the first layer (131) can include a material having a high etching rate, and the second layer (132) can include a material having a low etching rate. Accordingly, when the first layer (131) and the second layer (132) are etched after a photosensitive pattern is formed on the second layer (132), the side of the first layer (131) is etched faster than the side of the second layer (132), so that an undercut structure can be formed on the side of the protrusion (130-1, 130-2).

[0111] At least one of the first layer (131) or the second layer (132) may include a metal or a conductive oxide material having excellent electrical conductivity. Examples of the metal that may be used include titanium (Ti), molybdenum (Mo), molybdenum-titanium (MoTi), aluminum (Al), copper (Cu), and alloys thereof. Examples of the conductive oxide material that may be used include ITO and IZO.

[0112] Meanwhile, by adjusting the distance between the target and source of the evaporation source (or evaporation source device), the deposition material can be deposited on the substrate (110) at different deposition angles. The target-source distance may be the distance between the evaporation source and the substrate (110). The deposition angle may be the angle of an imaginary line between the evaporation source and the lower edge (132a) of the second layer (132) with respect to the normal direction. For example, the larger the target-source distance, the smaller the deposition angle. The smaller the deposition angle, the closer the layer formed by the deposition material can be deposited to the adjacent subpixel. The larger the deposition angle, the closer the layer can be deposited to the protrusions (130-1, 130-2).

[0113] As shown in FIGS. 4a, 4b, and 4c, by depositing the deposition materials at different deposition angles, one end of the organic light-emitting layer (122r, 122g, 122b) and one end of the first conductive layer (123-1) of the cathode electrode (123r, 123g, 123b) can be positioned differently from each other.

[0114] The cathode electrode (123r, 123g, 123b) may include a plurality of conductive layers (123-1, 123-2). For example, the cathode electrode (123r, 123g, 123b) may include a first conductive layer (123-1) and a second conductive layer (123-2) on the first conductive layer (123-1), but may also include three or more conductive layers.

[0115] One end of the organic light-emitting layer (122r, 122g, 122b) and one end of the first conductive layer (123-1) may be positioned on the upper side of the bank (111-1, 111-2). For example, one end of the organic light-emitting layer (122r, 122g, 122b) may be positioned closer to the first layer (131) than one end of the first conductive layer (123-1).

[0116] The second conductive layer (123-2) may be disposed on the entire area of ​​the substrate (110). The second conductive layer (123-2) may be deposited using a sputtering process. That is, the second conductive layer (123-2) may be disposed on the upper side of the first conductive layer (123-1) of each subpixel (SPr, SPg, SPb), the upper side of the banks (111-1, 111-2), and the side and upper side of the protrusions (130-1, 130-2). The second conductive layer (123-2) may be in contact with the side of the first layer (131) and / or the lower side of the second layer (132).

[0117] For example, the first conductive layer (123-1) may include a metal having excellent electrical conductivity, and the second conductive layer (123-2) may include a conductive oxide material. For example, the first conductive layer (123-1) may include a Mg:Ag alloy, and the second conductive layer (123-2) may include ITO, IZO, and the like.

[0118] A first conductive layer (123-1) can be formed by deposition of a Mg:Ag alloy using an evaporation source. However, since the step coverage characteristics of Mg:Ag are poor, it is difficult for a deposition material including a Mg:Ag alloy to be deposited deep within the undercut structure of the connection structure (105A). In addition, if the film thickness uniformity of the first conductive layer (123-1) including a Mg:Ag alloy is insufficient or the process margin is insufficient, the first conductive layer (123-1) may not be electrically connected to the auxiliary electrode (AC) included in the connection structure (105A), resulting in poor electrical connection.

[0119] To solve this problem, a conductive oxide material such as ITO having excellent step coverage characteristics can be deposited on the substrate (110) using a sputtering process, thereby being deposited deep within the undercut structure of the connection structure (105A). Accordingly, the second conductive layer (123-2) can be stably deposited on the side of the first layer (131), which is the auxiliary electrode (AC), so that electrical connection failure between the cathode electrodes (123r, 123g, 123b) including the first conductive layer (123-1) and the second conductive layer (123-2) and the auxiliary electrode (AC) can be prevented. In addition, the uniformity of the film thickness of the conductive layer can be secured, so that the stability of production quality can be improved.

[0120] When the second conductive layer (123-2) is formed on the first conductive layer (123-1), there is no need to adjust or manage the deposition angle to deposit the first conductive layer (123-1) using an evaporation source. In addition, even if the first conductive layer (123-1) as well as the organic light-emitting layers (122r, 122g, 122b) using an evaporation source are freely deposited without being restricted by the deposition angle, the organic light-emitting layers (122r, 122g, 122b) can be deposited in the corresponding subpixels (SPr, SPg, SPb), and the cathode electrodes (123r, 123g, 123b) can be stably connected to the auxiliary electrodes (AC) of the protrusions (130-1, 130-2) by the second conductive layer (123-2). Therefore, when configured with a combination of the aforementioned connection structure (105A) and blocking structure (105B), productivity and material utilization efficiency can be improved through a more free deposition process.

[0121] In addition, when the organic light-emitting display device is implemented in a top emission manner, the light-emitting efficiency can be improved by utilizing constructive interference between the anode electrode (121r, 121g, 121b) and the cathode electrode (123r, 123g, 123b) by using a cathode electrode (123r, 123g, 123b) including a first conductive layer (123-1) including an Ag:Mg alloy and an anode electrode (121r, 121g, 121b) including a semi-transparent material.

[0122] Meanwhile, the protrusions (130-1, 130-2) may include a fourth layer (134) on the second layer (132). The fourth layer (134) may be omitted. The fourth layer (134) may include an inorganic material such as SiO2, SiNx, or SiONx. The fourth layer (134) may include a conductive oxide material such as ITO. The fourth layer (134) may act as a stopper for the second layer (132). As described above, in order to form a side-by-side structure, the red subpixel (SPr), the green subpixel (SPg), and the blue subpixel (SPb) may be etched twice, respectively. At this time, when these two etchings are performed, the area or thickness of the second layer (132) may be changed. In this case, the deposition angle determined by the lower edge (132a) of the second layer (132) is different, so the deposition area in each subpixel (SPr, SPg, SPb) is different, which ultimately leads to a problem of deterioration in image quality.

[0123] In order to solve the above-mentioned problem, when a fourth layer (134) that acts as a stopper is formed on the second layer (132), even if two etchings are performed, the etching of the second layer (132) is suppressed or prevented by the fourth layer (134), so that the deposition angle determined by the edge (132a) on the lower side of the second layer (132) can be fixed. Accordingly, the deposition area in each subpixel (SPr, SPg, SPb) is secured to the target area, so that the image quality can be improved.

[0124] Although not shown, a third layer may be disposed beneath the first layer (131), but this is not limited thereto. The third layer may include a material having a low etching rate. The third layer may include a metal or a conductive oxide material having excellent electrical conductivity. The third layer may include an inorganic material having a low etching rate.

[0125] When the third layer comprises a metal or a conductive oxide material, the third layer may be an auxiliary electrode (AC).

[0126] The etching rate of the third layer may be the same as or slower than the etching rate of the second layer (132). When the second layer (132) and the third layer are etched simultaneously, since the etching rate of the third layer is the same as or slower than the etching rate of the second layer (132), the side of the third layer may be positioned on the same vertical line as the side of the second layer (132) or may be arranged to extend further in the direction of the adjacent subpixel from the side of the second layer (132).

[0127] Meanwhile, the organic light-emitting display device according to the embodiment may include an encapsulating layer (135). The encapsulating layer (135) may be a blocking layer that prevents moisture or the like from penetrating into the organic light-emitting elements (120r, 120g, 120b).

[0128] Meanwhile, the organic light-emitting display device according to the embodiment may include a plurality of color filter layers (140r, 140g, 140b) and a plurality of encapsulating layers (141r, 141g, 141b).

[0129] The plurality of color filter layers (140r, 140g, 140b) may include a resin material. The plurality of encapsulating layers (141r, 141g, 141b) may include a plurality of layers. Some of the plurality of layers may include an inorganic material, and other layers may include an organic material.

[0130] The red color filter layer (140r) may be arranged in the red subpixel (SPr). The red color filter layer (140r) may be arranged on the red organic light-emitting element (120r) in the red subpixel (SPr), so that only red light corresponding to the target red wavelength band preset to the red color filter layer (140r) among the wavelength bands of red light emitted from the red organic light-emitting element (120r) may be emitted.

[0131] A green color filter layer (140g) may be arranged on a green subpixel (SPg). The green color filter layer (140g) may be arranged on a green organic light-emitting element (120g) in the green subpixel (SPg), so that only green light corresponding to a target green wavelength band preset to the green color filter layer (140g) among the wavelength bands of green light emitted from the green organic light-emitting element (120g) may be emitted.

[0132] The blue color filter layer (140b) may be arranged in the blue subpixel (SPb). The blue color filter layer (140b) may be arranged on the blue organic light-emitting element (120b) in the blue subpixel (SPb), so that only blue light corresponding to a target blue wavelength band preset in the blue subpixel layer can be emitted among the wavelength band of blue light emitted from the blue organic light-emitting element (120b).

[0133] Each of the plurality of color filter layers (140r, 140g, 140b) may have a color filter function that allows only color light of a preset wavelength band to be emitted.

[0134] As described above, the plurality of color filter layers (140r, 140g, 140b) can further improve the color purity of each color compared to when there is no color filter layer, and in particular, can play a role in improving the change in color purity according to the viewing angle in an organic light-emitting display device having a top emission structure. Currently, a polarizing plate is attached to remove light reflected by the reflective material of the anode electrode (121r, 121g, 121b) when external light is incident. However, the most important role of the plurality of color filter layers (140r, 140g, 140b) may be that the plurality of color filter layers (140r, 140g, 140b) can absorb external light to improve the contrast ratio, and further, the polarizing plate can be removed to contribute to cost reduction.

[0135] Meanwhile, the plurality of color filter layers (140r, 140g, 140b) may each have the function of a photosensitive pattern for forming a pattern of an encapsulating layer (135), a cathode electrode (123r, 123g, 123b), and an organic light-emitting layer (122r, 122g, 122b).

[0136] As illustrated in Fig. 4a, the encapsulation layer (135), the cathode electrode (123r), and the red organic light-emitting layer (122r) can be etched using the red color filter layer (140r) so that they can be formed only in the red subpixel (SPr). In this case, one end of the encapsulation layer (135), one end of the cathode electrode (123r), and one end of the red organic light-emitting layer (122r) can be positioned on the same vertical line or diagonal line on the first protrusion (130-1).

[0137] As illustrated in Fig. 4b, the encapsulation layer (135), the cathode electrode (123g), and the green organic light-emitting layer (122g) can be etched using the green color filter layer (140g) so that they can be formed only in the green subpixel (SPg). In this case, one end of the encapsulation layer (135), one end of the cathode electrode (123g), and one end of the green organic light-emitting layer (122g) can be positioned on the same vertical line or diagonal line on the first protrusion (130-1).

[0138] As illustrated in Fig. 4c, the encapsulation layer (135), the cathode electrode (123b), and the blue organic light-emitting layer (122b) can be etched using the blue color filter layer (140b) to be formed only in the blue subpixel (SPb). In this case, one end of the encapsulation layer (135), one end of the cathode electrode (123b), and one end of the blue organic light-emitting layer (122b) can be positioned on the same vertical line or diagonal line on the first protrusion (130-1).

[0139] As an example, it may be formed in the order of a blue organic light-emitting element (120b), a green organic light-emitting element (120g), and a red organic light-emitting element (120r), but is not limited thereto.

[0140] Meanwhile, the encapsulating layer (141r, 141g, 141b) may include multiple layers including organic or inorganic materials.

[0141] The encapsulating layers (141r, 141g, 141b) can protect the plurality of color filter layers (140r, 140g, 140b) made of a resin material from being etched. For example, the blue encapsulating layer (141b) is formed on the blue color filter layer (140b) used for patterning the blue organic light-emitting element (120b), so that the blue encapsulating layer (141b) can prevent the etching of the blue color filter layer (140b) while the green organic light-emitting element (120g) is being etched. Similarly, by forming a green encapsulating layer (141g) on ​​a green color filter layer (140g) used for patterning a green organic light-emitting element (120g), the green encapsulating layer (141g) can prevent the etching of the green color filter layer (140g) while the red organic light-emitting element (120r) is etched. Accordingly, the red encapsulating layer (141r), the green encapsulating layer (141g), and the blue encapsulating layer (141b) can serve as stoppers to prevent etching.

[0142] Meanwhile, each of the plurality of color filter layers (140r, 140g, 140b) may include a light scattering agent or a light diffusing agent. By scattering or diffusing light by the light scattering agent or the light diffusing agent, the luminous efficiency may be improved.

[0143] Meanwhile, the red encapsulating layer (141r), the green encapsulating layer (141g), and the blue encapsulating layer (141b) may each include multiple layers including inorganic materials and organic materials.

[0144] The red encapsulating layer (141r) may be disposed on the red color filter layer (140r), the green encapsulating layer (141g) may be disposed on the green color filter layer (140g), and the blue encapsulating layer (141b) may be disposed on the blue color filter layer (140b).

[0145] The red encapsulating layer (141r), the green encapsulating layer (141g), and the blue encapsulating layer (141b) may each include at least one layer. For example, the red encapsulating layer (141r), the green encapsulating layer (141g), and the blue encapsulating layer (141b) may each include a first inorganic layer, an organic layer on the first inorganic layer, a second inorganic layer on the organic layer, and the like, but are not limited thereto. The first inorganic layer and the second inorganic layer may include an inorganic material such as SiNx, and the organic layer may include a resin material, but are not limited thereto.

[0146] According to an embodiment, a plurality of subpixels (SPr, SPg, SPb) may be sequentially formed to manufacture an organic light-emitting display device having a side-by-side structure. For example, a blue organic light-emitting element (120b), a blue color filter layer (140b), and a blue encapsulation layer (141b) may be formed and patterned over the entire area of ​​a substrate (110) using a photolithography process, thereby forming a blue subpixel (SPb). Thereafter, a green organic light-emitting element (120g), a green color filter layer (140g), and a green encapsulation layer (141g) may be formed and patterned over the entire area of ​​the substrate (110) using a photolithography process, thereby forming a green subpixel (SPg). Thereafter, a red organic light-emitting element (120r), a red color filter layer (140r), and a red encapsulation layer (141r) may be formed and patterned using a photolithography process, thereby forming a red subpixel (SPr).

[0147] Meanwhile, in the first embodiment (Figs. 1 and 2), a red organic light-emitting element (120r), a green organic light-emitting element (120g), and a blue organic light-emitting element (120b) can be arranged in a stripe shape along the second direction (Y).

[0148] Alternatively, although not shown, a red organic light-emitting element (120r), a green organic light-emitting element (120g), and a blue organic light-emitting element (120b) may be arranged spaced apart from each other in a dot shape. The red organic light-emitting element (120r) may be arranged in a red subpixel (SPr), the green organic light-emitting element (120g) may be arranged in a green subpixel (SPg), and the blue organic light-emitting element (120b) may be arranged in a blue subpixel (SPb). One pixel (P) may be configured by the red subpixel (SPr), the green subpixel (SPg), and the blue subpixel (SPb).

[0149] For example, the red organic light-emitting element (120r) and the green organic light-emitting element (120g) may be each disconnected by one row line along the second direction (Y). For example, the blue organic light-emitting element (120b) may be disconnected by two row lines along the second direction (Y).

[0150] For example, the area of ​​the blue organic light-emitting element (120b) may be larger than the area of ​​the red organic light-emitting element (120r) or the area of ​​the green organic light-emitting element (120g). The length of the blue organic light-emitting element (120b) in the second direction (Y) may be similar to the sum of the width of the red organic light-emitting element (120r) and the width of the green organic light-emitting element (120g), but is not limited thereto.

[0151] In a pixel structure in which a red organic light-emitting element (120r), a green organic light-emitting element (120g), and a blue organic light-emitting element (120b) are arranged spaced apart from each other in a dot shape, there is no connection structure (105A in FIG. 4A) between adjacent subpixels along the first direction (X), but an asymmetric blocking connection structure (105), i.e., a connection structure (105A) and a blocking structure (105B), may be provided at at least two or more corners of each subpixel (SPr, SPg, SPb) along the second direction (Y).

[0152] FIG. 5 is a cross-sectional view illustrating an organic light-emitting display device according to a first embodiment. Although FIG. 5 illustrates the first bank (111-1) and the first protrusion (130-1) of FIGS. 4A to 4C, the second bank (111-2) may also have the same structure or shape as the first bank (111-1) illustrated in FIG. 5. The remaining components not illustrated in FIG. 5 may also be illustrated in FIG. 5 in the same manner as the corresponding components illustrated in FIGS. 4A to 4C.

[0153] Referring to FIGS. 4A to 4C and FIG. 5, the organic light-emitting display device according to the first embodiment may include a first bank (111-1), a first protrusion (130-1), etc.

[0154] The first bank (111-1) and the first protrusion (130-1) have been described in FIGS. 4a to 4c, so detailed descriptions are omitted.

[0155] The first protrusion (130-1) may include an etch-preventing layer (150). The etch-preventing layer (150) may not be included in the first protrusion (130-1). That is, the etch-preventing layer (150) may be provided separately on the upper side of the first protrusion (130-1).

[0156] When manufacturing an organic light-emitting display device having a side-by-side structure using a photolithography process, the size or shape of the first protrusion (130-1) may change during two etching processes performed for each subpixel (SPr, SPg, SPb), which may affect the image quality of the product. The etching prevention layer (150) may play a role in preventing the image quality of the product from being affected by ensuring that the size or shape of the first protrusion (130-1) remains unchanged even when two etching processes are performed.

[0157] Specifically, an organic deposition material for forming a hole injection layer, an organic light-emitting layer (122g), a charge generation layer, etc., a deposition material for forming a cathode electrode (123g), and an organic or inorganic material for forming an encapsulating layer may be subjected to a dry etching process using a gas such as CF4, SF6, O2, Cl2, etc. While these materials are dry etched, the first protrusion (130-1) may also be etched, so that the size or shape of the first protrusion (130-1) may be changed.

[0158] When the size or shape of the first protrusion (130-1) is changed, the opening depth (D) or opening gap (G) of the undercut structure (151) of the connection structure (105A) may change, which may affect the connection resistance (or contact resistance) between the auxiliary electrode (AC) and the cathode electrode (123g). Accordingly, a difference in the characteristics of the organic light-emitting element (120r, 120g, 120b) for each subpixel (SPr, SPg, SPb) may occur, which may result in poor image quality such as stains or color spots.

[0159] To solve this problem, an etch-preventing layer (150) may be formed on the uppermost side of the first protrusion (130-1). The etch-preventing layer (150) protects the first protrusion (130-1) from being etched by an etching gas such as CF4 during an etching process, so that the size or shape of the first protrusion (130-1) may not change. Accordingly, the opening depth (D) or the opening gap (G) of the undercut structure (151) of the connection structure (105A) is maintained as is, so that the difference in characteristics of the organic light-emitting elements (120r, 120g, 120b) for each subpixel (SPr, SPg, SPb) is eliminated, thereby preventing poor image quality.

[0160] Referring again to FIG. 5, the first protrusion (130-1) may have a connection structure (105A) including an auxiliary electrode (AC) electrically connected to the cathode electrode (123g). In this case, an etch-preventing layer (150) may be disposed on the connection structure (105A).

[0161] The first protrusion (130-1) may include a first layer (131) on the first bank (111-1), a second layer (132) on the first layer (131), and a third layer (133) below the first layer (131). The third layer (133) may be omitted. At least one of the first layer (131), the second layer (132), or the third layer (133) may be an auxiliary electrode (AC).

[0162] The first layer (131), the second layer (132), and the third layer (133) may have different etching selectivities. For example, the etching rate of the second layer (132) may be greater than the etching rate of the first layer (131) or the third layer (133). When the first layer (131), the second layer (132), and the third layer (133) are etched, the side of the first layer (131) may be etched the fastest, thereby forming an undercut structure (151). That is, the side of the first layer (131) may enter the inside of the first protrusion (130-1) from the side of the second layer, thereby forming an undercut structure (151). The side of the third layer (133) may be positioned on the same vertical line or diagonal line as the side of the second layer (132), or may extend from the side of the second layer (132) in the direction of the subpixel (SPg).

[0163] The etch-preventing layer (150) may include a material that is not etched by an etching gas such as CF4. For example, the etch-preventing layer (150) may include a conductive oxide material such as ITO. For example, the etch-preventing layer (150) may include an insulating material such as Al2O3. For example, the etch-preventing layer (150) may include a metal such as copper (Cu). For example, the etch-preventing layer (150) may include a metal oxide material such as CuOx.

[0164] The etch-preventing layer (150) may be disposed on the connecting structure (105A). For example, the etch-preventing layer (150) may be disposed on the second layer (132) of the first protrusion (130-1).

[0165] The lower edge (132a) of the second layer (132) is an important region that determines the deposition angle at which various deposition materials constituting the organic light-emitting element (120g) are sprayed onto the substrate (110). Therefore, when the lower edge (132a) of the second layer (132) is etched by an etching gas such as CF4, the size or shape of the first protrusion (130-1) may change. When the lower edge (132a) of the second layer (132) is etched, the deposition angle at which various deposition materials are sprayed onto the substrate (110) may be different from the target deposition angle. Accordingly, image quality defects as described above may occur.

[0166] Referring again to FIG. 5, the etch-preventing layer (150) may surround the second layer (132) of the first protrusion (130-1). For example, the etch-preventing layer (150) may be disposed on the side and lower side of the second layer (132). Accordingly, since the lower edge (132a) of the second layer (132) is not exposed by the etch-preventing layer (150), the lower edge (132a) of the second layer (132) may not be etched by an etching gas such as CF4.

[0167] The etch-preventing layer (150) may include a first etch-preventing layer (150-1) and a second etch-preventing layer (150-2).

[0168] The second etching prevention layer (150-2) may be omitted. The second etching prevention layer (150-2) may be the fourth layer (134) illustrated in FIGS. 4a and 4b, but is not limited thereto.

[0169] The first etch-preventing layer (150-1) may be disposed on the second layer (132) of the first protrusion (130-1), and the second etch-preventing layer (150-2) may be disposed between the second layer (132) and the first etch-preventing layer (150-1). The first etch-preventing layer (150-1) may be disposed on the second etch-preventing layer (150-2).

[0170] The first etch-stop layer (150-1) may surround not only the second layer (132) of the first protrusion (130-1) but also the second etch-stop layer (150-2). In this case, the first etch-stop layer (150-1) may be disposed on the lower side of the second layer (132) of the first protrusion (130-1) via the side of the second etch-stop layer (150-2).

[0171] For example, the first etch-preventing layer (150-1) may include a conductive oxide material such as ITO, and the second etch-preventing layer (150-2) may include an insulating material such as Al2O3, but is not limited thereto.

[0172] According to an embodiment, since an etch-preventing layer (150) is disposed on the first protrusion (130-1), when manufacturing an organic light-emitting display device having a side-by-side structure using a photolithography process, even if two etching processes are performed for each subpixel (SPr, SPg, SPb), the first protrusion (130-1) may not be etched by the etch-preventing layer (150). Accordingly, the difference in characteristics of the organic light-emitting elements (120r, 120g, 120b) for each subpixel (SPr, SPg, SPb) may be eliminated, thereby preventing poor image quality.

[0173] FIGS. 6A to 6C illustrate a manufacturing process of an organic light-emitting display device according to the first embodiment.

[0174] As illustrated in FIGS. 4A to 4C and FIG. 6A, a third layer (133), a first layer (131), and a second layer (132) may be formed on the first bank (111-1). The first layer (131), the second layer (132), and the third layer (133) may have different etching selectivities.

[0175] An insulating film and a photosensitive film are formed on the second layer (132), and an etching process is performed on the insulating film using a patterned photosensitive pattern (153) to form a second etching prevention layer (150-2).

[0176] As shown in FIGS. 4A to 4C and 6B, an etching process is performed on the third layer, the first layer (131), and the second layer (132) using a photosensitive pattern (153), so that a connection structure (105A) having an undercut structure (151) can be formed.

[0177] Afterwards, the photosensitive pattern (153) can be removed.

[0178] Thereafter, a photosensitive pattern (154) can be formed on the remaining area of ​​the substrate (110) excluding the second etch-preventing layer (150-2).

[0179] Thereafter, a conductive oxide film can be deposited on the substrate (110). The conductive oxide film can be deposited on the second etch-preventing layer (150-2) and the photosensitive pattern (154).

[0180] As illustrated in FIGS. 4A to 4C and FIG. 6C, the photosensitive pattern (154) on which the conductive oxide film is deposited is removed, so that the conductive oxide film can be formed as the first etching-preventive layer (150-1) on the second etching-preventive layer (150-2). The etching-preventive layer (150) can be formed by the first etching-preventive layer (150-1) and the second etching-preventive layer (150-2).

[0181] Alternatively, by omitting the process illustrated in FIG. 6a, the second etch-stop layer (150-2) may be omitted. Subsequently, by performing the processes illustrated in FIGS. 6b and 6c, the etch-stop layer (150) may include only the first etch-stop layer (150-1) as a single layer.

[0182] Fig. 7 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment. Although Fig. 5 illustrates the first bank (111-1) in Figs. 4a to 4c, the second bank (111-2) may also have the same structure or shape as the first bank (111-1) illustrated in Fig. 5. The remaining components not illustrated in Fig. 5 may also be illustrated in Fig. 5 in the same manner as the corresponding components illustrated in Figs. 4a to 4c.

[0183] Referring to FIGS. 4A to 4C and FIG. 7, the organic light-emitting display device according to the second embodiment may include a first bank (111-1), a first protrusion (130-1), etc.

[0184] The first bank (111-1) and the first protrusion (130-1) have been described in FIGS. 4a to 4c, so detailed descriptions are omitted.

[0185] The first protrusion (130-1) may include a plating layer (162). The plating layer (162) itself may be an etch-preventing layer (150).

[0186] A seed layer (161) may be provided for forming a plating layer (162). Accordingly, the first protrusion (130-1) may include a seed layer (161) and a plating layer (162).

[0187] In an embodiment, the first protrusion (130-1) may include a connection structure (105A) and an etch-resistant layer (150). That is, the first protrusion (130-1) may include a connection structure (105A) having an undercut structure (151) and an etch-resistant layer (150) on the connection structure (105A). In this case, the undercut structure (151) and the etch-resistant layer (150) may be formed integrally by a plating layer (162).

[0188] The seed layer (161) may include a metal that facilitates the formation of a plating layer (162). The plating layer (162) may include a metal such as copper (Cu).

[0189] As will be explained later, after the seed layer (161) is formed on the first bank (111-1), a photosensitive pattern (155 in FIG. 8A) may be formed in an area other than an area where a plating layer (162) is to be formed. The photosensitive pattern (155) may have a shape corresponding to the undercut structure (151). Thereafter, a plating process may be performed using the photosensitive pattern (155), thereby forming a connection structure (105A) of the undercut structure (151). When the plating process is continuously performed thereafter, a plating layer (162) is formed on the upper surface of the photosensitive pattern (155), and the plating layer (162) formed on the upper surface of the photosensitive pattern (155) may become an etch-preventing layer (150). Depending on the shape of the photosensitive pattern (155), various undercut structures (151) may be formed. In addition, by adjusting the distance between the photosensitive pattern (155) and the seed layer (161) or the thickness of the photosensitive pattern (155), an undercut structure (151) having various aperture depths (D) and aperture gaps (G) can be formed.

[0190] The plating layer (162) may include a lower region (162-1) and an upper region (162-2). An undercut structure (151) of the connection structure (105A) may be formed by the lower region (162-1) and the upper region.

[0191] In the plating layer (162), the width of the upper region (162-2) may be greater than the width of the lower region (162-1). The plating layer (162) may have a round-shaped mushroom structure at the edge of the surface of the upper region (162-2). By means of this round-shaped mushroom structure, uniformity of the film thickness and homogeneity of the film quality of the deposition material deposited on the plating layer (162) can be secured.

[0192] According to an embodiment, since a plating layer (162) including a connection structure (105A) and an etching prevention layer (150) is provided, when an organic light-emitting display device having a side-by-side structure is manufactured using a photolithography process, even if two etching processes are performed for each subpixel (SPr, SPg, SPb), the first protrusion (130-1) may not be etched by the etching prevention layer (150). Accordingly, the difference in characteristics of the organic light-emitting elements (120r, 120g, 120b) for each subpixel (SPr, SPg, SPb) may be eliminated, thereby preventing poor image quality.

[0193] According to the embodiment, since there is no need to form an undercut structure (151) through deposition and etching of the first layer (131), the second layer (132), and the third layer (133) as illustrated in FIG. 5, the process is greatly simplified, and an undercut structure (151) having an accurate and continuous aperture depth (D) and aperture gap (G) is secured, so that the difference in characteristics of the organic light-emitting elements (120r, 120g, 120b) for each subpixel (SPr, SPg, SPb) is eliminated, and poor image quality can be prevented.

[0194] FIGS. 8A to 8C illustrate a manufacturing process of an organic light-emitting display device according to a second embodiment.

[0195] As illustrated in FIGS. 4A to 4C and FIG. 8A, a seed layer (161) may be formed on the first bank (111-1). The seed layer (161) may include a metal.

[0196] Thereafter, a photosensitive pattern (155) may be formed on the first bank (111-1). The photosensitive pattern (155) may not be formed on the upper layer of the seed layer (161) or within a predetermined distance from the seed layer (161).

[0197] As shown in FIGS. 4a to 4c and FIG. 8b, after the substrate (110) is placed in the plating bath, a predetermined voltage is applied to the seed layer (161), so that a plating layer (162) can be grown using the seed layer (161) exposed by the photosensitive pattern (155) as a seed.

[0198] The photosensitive pattern (155) can be patterned taking into account the undercut structure (151) of the connection structure (105A). For example, the upper side of the photosensitive pattern (155) can be positioned closer to the seed layer (161) than the lower side.

[0199] The thickness of the photosensitive pattern (155) can determine the size of the aperture depth (D) of the undercut structure (151). The aperture depth (D) of the undercut structure (151) can be expressed by Equation 1.

[0200] [Formula 1]

[0201] D = PD1 - PD2

[0202] PD1 may represent the thickness of the plating layer (162), and PD2 may represent the thickness (PD2) of the photosensitive pattern (155).

[0203] In this case, the aperture depth (D) may be equal to the thickness (PD1) of the plating layer (162) on the upper surface of the photosensitive pattern (155), but is not limited thereto.

[0204] The plating layer (162) may include a metal such as copper (Cu). Copper is easy to plate, has low resistance, and can be robust in dry etching.

[0205] The plating process can be performed until the plating layer (162) is grown on the upper surface of the photosensitive pattern (155). The edge of the surface of the plating layer (162) grown on the upper surface of the photosensitive pattern (155) can have a round shape.

[0206] As shown in FIGS. 4a to 4c and FIG. 8c, by removing the photosensitive pattern (155), a mushroom-structured plating layer (162) having an undercut structure (151) and a round shape at the edge of the surface can be formed.

[0207] Fig. 9 is a cross-sectional view illustrating an organic light-emitting display device according to a third embodiment. Fig. 10 is a cross-sectional view illustrating an organic light-emitting display device according to a fourth embodiment. The third and fourth embodiments are identical to the second embodiment (Fig. 7) except for the cover layer (163). In the third and fourth embodiments, components having the same shape, structure, and / or function as those in the second embodiment are given the same reference numerals, and detailed descriptions are omitted.

[0208] In the third embodiment (Fig. 9) and the fourth embodiment (Fig. 10), the first protrusion (130-1) may include a cover layer (163) on the plating layer (162).

[0209] The cover layer (163) may be formed by oxidizing the surface of the plating layer (162). When the plating layer (162) is oxidized, an oxide layer such as CuOx may be formed. Therefore, the cover layer (163) may include an oxide layer. Since the oxide layer has a black color, it may also be used as a black matrix (layer). Typically, a black matrix (layer) is arranged between subpixels to prevent color mixing. For this purpose, a separate black matrix (layer) is provided between subpixels.

[0210] However, according to the embodiment, since the cover layer (163) is used as a black matrix (layer), there is no need to form a separate black matrix, so material costs are reduced, the process is simplified, and the product thickness can be reduced.

[0211] In the third embodiment (Fig. 9), the width of the seed layer (161) may be smaller than the width of the lower region (162-1) of the plating layer (162). In this case, the plating layer (162) may cover the seed layer (161). The plating layer (162) may be disposed on the upper surface and side surfaces of the seed layer (161).

[0212] In the fourth embodiment (Fig. 10), the width of the seed layer (161) may be greater than the width of the lower region (162-1) of the plating layer (162). In this case, the central region of the seed layer (161) may vertically overlap with the plating layer (162), and the edge region of the seed layer (161) may not vertically overlap with the plating layer (162).

[0213] Since the seed layer (161) includes metal, the seed layer (161) can also be used as an auxiliary electrode (AC). Accordingly, even if the cathode electrode (123g) of the organic light-emitting element (120g) is not in contact with the plating layer (162) but only with the seed layer (161), it can be electrically connected to the first power line (PL1 of FIGS. 1 and 3) through the seed layer (161), which is the auxiliary electrode (AC).

Claims

1. Bank between sub-pixels on the substrate; An anode electrode in the above sub-pixel; An organic light-emitting layer on the anode electrode and the bank; A cathode electrode on the organic light-emitting layer; including a protrusion positioned so as to be spaced apart from the organic light-emitting layer on the upper side of the bank; The above protrusion comprises an etch-resistant layer comprising one of ITO, Al2O3, Cu and CuOx on its uppermost side; Organic light emitting display device.

2. In paragraph 1, The above protrusion has a connecting structure including an auxiliary electrode electrically connected to the cathode electrode, The above etch-preventing layer is disposed on the above connecting structure, Organic light emitting display device.

3. In paragraph 2, The above protrusion is, First layer on the above bank; a second layer on the first layer; and a third layer below the first layer; The side of the third layer is positioned on the same vertical line or diagonal line as the side of the second layer or extends in the direction of the subpixel from the side of the second layer, The side of the first layer is recessed into the inside of the protrusion from the side of the second layer, Organic light emitting display device.

4. In paragraph 3, The above etch-preventing layer is disposed on the second layer, Organic light emitting display device.

5. In paragraph 4, The above etch-preventing layer surrounds the second layer, Organic light emitting display device.

6. In paragraph 4, The above etch-preventing layer is disposed on the side and lower side of the second layer, Organic light emitting display device.

7. In paragraph 3, The above etching prevention layer is, A first etch-preventing layer on the second layer; and A second etching prevention layer between the second layer and the first etching prevention layer; Organic light emitting display device.

8. In paragraph 7, The first etching prevention layer is disposed on the lower side of the second layer via the side of the second etching prevention layer. Organic light emitting display device.

9. In paragraph 3, At least one of the first layer, the second layer or the third layer is the auxiliary electrode, Organic light emitting display device.

10. In paragraph 1, The above protrusion is, seed layer; and A plating layer on the seed layer; The above plating layer is the above etching prevention layer, Organic light emitting display device.

11. In paragraph 10, The above plating layer is, The width of the upper region is smaller than that of the lower region and has a round mushroom structure at the edge of the surface of the upper region. Organic light emitting display device.

12. In paragraph 10, The above protrusion is, Further comprising a cover layer on the above plating layer; Organic light emitting display device.

13. In paragraph 1, further comprising a blocking structure that induces the hole injection layer of the organic light-emitting layer in the bank to be disconnected; Organic light emitting display device.

Images