Electronic apparatus and electronic device

Abstract

Provided in the embodiments of the present application are an electronic apparatus and an electronic device. The electronic apparatus comprises a first circuit board, a second circuit board, a first cellular radio frequency front end, a non-cellular radio frequency front end and a system on chip. The first circuit board and the second circuit board are arranged to be spaced apart, the first circuit board being in circuit connection to the second circuit board. One of the first cellular radio frequency front end and the non-cellular radio frequency front end is arranged on the first circuit board, and the other one is arranged on the second circuit board; or the first cellular radio frequency front end and the non-cellular radio frequency front end are both arranged on the second circuit board. The system on chip is arranged on the first circuit board and is electrically connected to both the first cellular radio frequency front end and the non-cellular radio frequency front end. The electronic device comprises a housing and the electronic apparatus, the electronic apparatus being mounted in the housing. The embodiments of the present application achieve dispersed arrangement of heat sources, thereby avoiding the defect of the traditional solution of using a heat conduction material for transferring heat.

Description

Electronic devices and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on August 23, 2023, with application number 202311069979.3 and application name “Electronic Devices and Electronic Equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic products, and in particular to an electronic device and an electronic device. Background Art

[0003] As shown in Figure 1, in traditional foldable screen phones, the primary heat source is located in the main frame of the device. This results in a high temperature rise in the main frame during operation, impacting device reliability and user experience. Compared to the main frame, the temperature rise of the sub-frame is lower. As shown in Figure 2, to achieve heat distribution, one existing solution is to use thermally conductive material across the hinge to transfer heat from the main frame to the sub-frame, thereby achieving thermal balance between the main and sub-frames. However, the need for thermally conductive material to span the hinge further increases the complexity and difficulty of hinge design. Furthermore, the thermally conductive material occupies a portion of the overall device space, resulting in a reduction in battery volume and lower battery capacity design values ​​for a given device thickness. The high price of thermally conductive material increases the overall device cost. Furthermore, due to the gap in the hinge area, which causes mechanical movement, the thermal conductivity in this area is poor. This results in high cross-axis heat transfer with limited effectiveness.

[0004] Summary of the Invention

[0005] The embodiments of the present application provide an electronic device and an electronic device that can disperse heat sources and avoid the defects of traditional solutions that use thermally conductive materials to transfer heat.

[0006] In a first aspect, an embodiment of the present application provides an electronic device, including a first circuit board, a second circuit board, a first cellular RF front end, a non-cellular RF front end, and a system-level chip; the first circuit board and the second circuit board are arranged at intervals, and the first circuit board and the second circuit board are circuit-connected; one of the first cellular RF front end and the non-cellular RF front end is arranged on the first circuit board, and the other is arranged on the second circuit board, or the first cellular RF front end and the non-cellular RF front end are both arranged on the second circuit board; the system-level chip is arranged on the first circuit board and is electrically connected to both the first cellular RF front end and the non-cellular RF front end.

[0007] In this solution, by placing the cellular RF front-end and non-cellular RF front-end on separate circuit boards, heat sources can be dispersed to different areas of the electronic device, avoiding heat concentration and improving overall heat dissipation and heat distribution. Furthermore, there's no need to install thermally conductive material between these different areas of the electronic device, reducing costs and saving space, allowing for larger batteries and higher capacitance designs.

[0008] In one implementation of the first aspect, the electronic device further includes a non-cellular antenna module, which is disposed on the first circuit board or the second circuit board and is electrically connected to the non-cellular RF front end. By distributing heat sources such as the non-cellular antenna module, the cellular RF front end, and the non-cellular RF front end, heat concentration can be avoided, further improving the heat dissipation and heat distribution performance of the entire device. Furthermore, there is no need to provide thermally conductive material between different areas of the electronic device, thereby reducing costs and saving space, which is conducive to increasing the battery size and improving the designed capacitance value.

[0009] In one implementation of the first aspect, the electronic device further includes a non-cellular RF chip, which is disposed on the first circuit board or the second circuit board, and is electrically connected to the non-cellular antenna module; and the system-level chip is electrically connected to the non-cellular RF chip. By distributing heat sources such as the non-cellular RF chip, the non-cellular antenna module, the cellular RF front end, and the non-cellular RF front end, heat concentration can be avoided, further improving the heat dissipation and heat distribution performance of the entire device. Furthermore, there is no need to provide thermally conductive materials between the different areas of the electronic device, thereby reducing costs and saving space, which is conducive to increasing the battery volume and improving the design value of the capacitance capacity.

[0010] In one implementation of the first aspect, the electronic device further includes a first cellular antenna module, which is disposed on the first circuit board or the second circuit board, and is electrically connected to the first cellular RF front end. By dispersing several or all of the heat sources in the first cellular antenna module, the non-cellular RF chip, the non-cellular antenna module, the cellular RF front end, and the non-cellular RF front end, heat concentration can be avoided, further improving the heat dissipation and heat distribution performance of the entire device. Furthermore, there is no need to provide thermally conductive materials between the different areas of the electronic device, thereby reducing costs and saving space, which is conducive to increasing the battery volume and improving the design value of the capacitance capacity.

[0011] In one implementation of the first aspect, the electronic device further includes a first cellular RF chip, the first cellular RF chip is arranged on the first circuit board or the second circuit board, the first cellular RF chip is electrically connected to the first cellular antenna module; and the system-level chip is electrically connected to the first cellular RF chip. By dispersing several or all of the heat sources in the first cellular RF chip, the first cellular antenna module, the non-cellular RF chip, the non-cellular antenna module, the cellular RF front end, and the non-cellular RF front end, heat concentration can be avoided, further improving the heat dissipation performance and heat distribution performance of the entire device. Furthermore, there is no need to set thermal conductive materials between the different areas of the electronic device, thereby reducing costs and saving space, which is conducive to increasing the battery volume and improving the design value of the capacitance capacity.

[0012] In one implementation of the first aspect, the electronic device further includes a first cellular RF chip and a first cellular antenna module, the first cellular RF chip being electrically connected to the first cellular antenna module, the first cellular antenna module being electrically connected to the first cellular RF front end, the first cellular RF chip, the first cellular antenna module, the first cellular RF front end, and the non-cellular antenna module being all disposed on a first circuit board, and the non-cellular RF chip and the non-cellular RF front end being both disposed on a second circuit board; and the system-level chip being electrically connected to the first cellular RF chip. By disposing the first cellular RF chip, the first cellular antenna module, the first cellular RF front end, and the non-cellular antenna module, as well as the non-cellular RF chip and the non-cellular RF on different circuit boards, heat sources can be dispersed to different areas of the electronic device, avoiding heat concentration and facilitating improved heat dissipation and heat distribution performance of the entire device. Furthermore, there is no need to provide thermally conductive material between the different areas of the electronic device, thereby reducing costs and saving space, which is conducive to increasing the battery size and improving the designed capacitance value.

[0013] In one implementation of the first aspect, the electronic device further includes a first cellular RF chip and a first cellular antenna module, the first cellular RF chip being electrically connected to the first cellular antenna module, the first cellular antenna module being electrically connected to the first cellular RF front end, the first cellular antenna module, the non-cellular RF chip, the non-cellular antenna module, and the non-cellular RF front end being all disposed on a first circuit board, and the first cellular RF chip and the first cellular RF front end being both disposed on a second circuit board; and the system-on-chip being electrically connected to the first cellular RF chip. By disposing the first cellular antenna module, the non-cellular RF chip, the non-cellular antenna module, and the non-cellular RF front end, as well as the first cellular RF chip and the first cellular RF front end, respectively, on different circuit boards, heat sources can be dispersed to different areas of the electronic device, avoiding heat concentration and facilitating improved heat dissipation and heat distribution performance of the entire device. Furthermore, there is no need to provide thermally conductive material between the different areas of the electronic device, thereby reducing costs and saving space, which facilitates increasing the battery size and improving the designed capacitance value.

[0014] In one implementation of the first aspect, the first cellular antenna module includes an N77 module, an N79 module, and a mid-high frequency (MHB) module. The electronic device also includes a power amplifier, and the system-on-chip is electrically connected to the first cellular radio frequency chip via the power amplifier. The power amplifier amplifies power and can alleviate significant signal loss across the axis.

[0015] In one implementation of the first aspect, the electronic device further includes a first cellular RF chip, a first cellular antenna module, a second cellular RF chip, a second cellular RF front end, and a second cellular antenna module. The first cellular RF chip is electrically connected to the first cellular antenna module, the first cellular antenna module is electrically connected to the first cellular RF front end, the second cellular RF chip is electrically connected to the second cellular antenna module, and the second cellular antenna module is electrically connected to the second cellular RF front end. The first cellular RF chip, the first cellular RF front end, the first cellular antenna module, the non-cellular RF chip, the non-cellular antenna module, and the non-cellular RF front end are all disposed on a first circuit board, and the second cellular RF chip, the second cellular RF front end, and the second cellular antenna module are all disposed on a second circuit board. The system-on-chip is electrically connected to the first cellular RF chip and the second cellular RF chip. By disposing the first cellular RF chip, the first cellular RF front end, the first cellular antenna module, the non-cellular RF chip, the non-cellular antenna module, and the non-cellular RF front end, as well as the second cellular RF chip, the second cellular RF front end, and the second cellular antenna module on different circuit boards, heat sources can be dispersed to different areas of the electronic device, avoiding heat concentration and facilitating improved heat dissipation and heat distribution performance of the entire device. Furthermore, there is no need to provide heat-conducting materials between the different areas of the electronic device, thereby reducing costs and saving space, which is conducive to increasing the battery volume and improving the design value of the capacitance capacity.

[0016] In one implementation of the first aspect, the electronic device further includes a first power amplifier disposed on the first circuit board, the system-on-chip being electrically connected to the first cellular radio frequency chip via the first power amplifier; and / or the electronic device further includes a second power amplifier disposed on the second circuit board, the system-on-chip being electrically connected to the second cellular radio frequency chip via the second power amplifier. The power amplifier has a power amplification function and can alleviate the problem of large signal transaxial loss.

[0017] In one implementation of the first aspect, the electronic device further includes a first cellular radio frequency chip and a first cellular antenna module, the first cellular radio frequency chip being electrically connected to the first cellular antenna module, the first cellular antenna module being electrically connected to the first cellular radio frequency front end, and the first cellular radio frequency chip, the first cellular radio frequency front end, the first cellular antenna module, the non-cellular radio frequency chip, the non-cellular radio frequency front end, and the non-cellular antenna module being all arranged on a second circuit board. By arranging the system-level chip, the first cellular radio frequency chip, the first cellular radio frequency front end, the first cellular antenna module, the non-cellular radio frequency chip, the non-cellular radio frequency front end, and the non-cellular antenna module on different circuit boards, respectively, heat sources can be dispersed in different areas of the electronic device, avoiding heat concentration, which is beneficial to improving the heat dissipation and heat distribution performance of the entire device. Furthermore, there is no need to set thermal conductive materials between the different areas of the electronic device, thereby reducing costs and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitance capacity.

[0018] In one implementation of the first aspect, the electronic device further includes a third power amplifier disposed on the second circuit board, and the system-on-chip is electrically connected to the first cellular radio frequency chip via the third power amplifier. The power amplifier has a power amplification function and can improve the problem of large signal transaxial loss.

[0019] In one implementation of the first aspect, the electronic device further includes a camera module, which is disposed on the second circuit board. The camera module is electrically connected to the system-on-chip via a flexible circuit board, and the flexible circuit board has a transaxial loss of 1dB / 100mm to 2dB / 100mm. This flexible circuit board has low transaxial loss, and the camera module transmits signals to the system-on-chip via the low-loss flexible circuit board, thereby reducing transaxial loss.

[0020] In one implementation of the first aspect, the non-cellular RF chip, the non-cellular RF front end, the non-cellular antenna module, and the system-level chip are all arranged on a first circuit board; the electronic device also includes a first cellular RF chip and a first cellular antenna module, the first cellular RF chip and the first cellular antenna module are both arranged on a second circuit board, the first cellular RF chip and the first cellular antenna module are electrically connected; and the system-level chip is electrically connected to the first cellular RF chip. By arranging the non-cellular RF chip, the non-cellular RF front end, the non-cellular antenna module and the system-level chip, as well as the first cellular RF chip and the first cellular antenna module on different circuit boards, heat sources can be dispersed in different areas of the electronic device, avoiding heat concentration, which is beneficial to improving the heat dissipation and heat distribution performance of the entire device. Furthermore, there is no need to set thermal conductive materials between the different areas of the electronic device, thereby reducing costs and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitance capacity.

[0021] In one implementation of the first aspect, the electronic device further includes a first power management chip and a second power management chip, the first power management chip being arranged on a first circuit board and electrically connected to the system-level chip, and the second power management chip being arranged on a second circuit board and electrically connected to the system-level chip. By arranging the first power management chip, the second power management chip, the non-cellular radio frequency chip, the non-cellular radio frequency front end, the non-cellular antenna module and the system-level chip, the first cellular radio frequency chip and the first cellular antenna module on different circuit boards, respectively, the heat source can be dispersed in different areas of the electronic device to avoid heat concentration, which is beneficial to improving the heat dissipation performance and heat distribution performance of the entire device. Furthermore, there is no need to set thermal conductive materials between the different areas of the electronic device, thereby reducing costs and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitance capacity.

[0022] Secondly, embodiments of the present application provide an electronic device comprising a housing and an electronic device, wherein the electronic device is mounted within the housing. This solution disperses heat sources, avoiding the drawback of conventional solutions that use thermally conductive materials to transfer heat, resulting in improved heat dissipation and heat distribution performance for the electronic device. It eliminates the need for thermally conductive materials between different areas of the electronic device, reduces costs, saves space, and facilitates larger batteries and improved capacitance design values.

[0023] In one implementation of the second aspect, the housing includes a first housing and a second housing, and the electronic device further includes a hinge connecting the first housing and the second housing, the hinge being configured to generate mechanical motion to cause the first housing and the second housing to rotate relative to each other, thereby folding or unfolding the electronic device; the first circuit board is mounted within the first housing, and the second circuit board is mounted within the second housing. This solution can be applied to foldable screen devices, significantly improving the heat dissipation and heat distribution performance of foldable screen electronic devices, reducing costs, saving space, increasing battery size, and improving the design value of capacitor capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic diagram of thermal distribution simulation of a traditional folding screen mobile phone;

[0025] Figure 2 is a schematic diagram of a heat distribution solution for a traditional foldable screen mobile phone;

[0026] FIG3 is a schematic diagram of the hardware framework structure of an electronic device according to an embodiment of the present application;

[0027] FIG4 is a schematic diagram of the appearance structure of an electronic device according to an embodiment of the present application;

[0028] FIG5 is a schematic diagram of the appearance structure of another electronic device according to an embodiment of the present application;

[0029] FIG6 is a plan view schematically showing a device arrangement of an electronic device according to an embodiment of the present application;

[0030] FIG7 is a plan view schematically showing a device arrangement of another electronic device according to an embodiment of the present application;

[0031] FIG8 is a plan view schematically showing a device arrangement of another electronic device according to an embodiment of the present application;

[0032] FIG9 is a plan view showing a device arrangement of another electronic device according to an embodiment of the present application;

[0033] FIG10 a is a schematic plan view showing a device arrangement of another electronic device according to an embodiment of the present application;

[0034] FIG10 b is a plan view schematically showing a device arrangement of another electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0035] For ease of understanding, the relevant technical terms involved in the embodiments of this application are explained and described below.

[0036] In the description of the embodiments of the present application, unless otherwise specified, "multiple" refers to two or more.

[0037] The terms "first", "second", etc. are used for descriptive purposes only and should not be understood to suggest or imply relative importance or to implicitly indicate the quantity of the technical features indicated. Features qualified as "first" or "second" may explicitly or implicitly include one or more of such features.

[0038] The term "connect" should be interpreted broadly. For example, "connect" can mean either a detachable or non-detachable connection, a direct connection, or an indirect connection through an intermediary. The term "fix" should also be interpreted broadly. For example, "fix" can mean either a direct fixation or an indirect fixation through an intermediary.

[0039] The directional terms used in the embodiments of this application, such as "upper," "lower," "top," and "bottom," are merely references to the directions in the accompanying drawings. These directional terms are intended to better and more clearly illustrate and facilitate understanding of the embodiments of this application. They do not explicitly or implicitly indicate that the devices or components referred to must have a specific orientation, be constructed or operate in a specific orientation, and therefore should not be construed as limiting the embodiments of this application.

[0040] In the description of the embodiments of this application, unless otherwise specified, "and / or" is simply a description of an association relationship between associated objects, indicating that three relationships can exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone.

[0041] The following embodiments of the present application provide an electronic device, including but not limited to mobile phones (such as bar phones, foldable phones, curved screen phones, etc.), tablet computers, laptops (including foldable laptops), smart screens, smart bracelets, smart watches, mixed reality devices (such as MR headsets), virtual reality devices (such as VR glasses), augmented reality devices, vehicle-mounted devices (such as car computers), etc.

[0042] The following first describes the basic hardware framework of the electronic device according to the embodiment of the present application, and then describes in detail the design of the electronic device for distributing the heat sources.

[0043] FIG3 shows a schematic diagram of the hardware framework structure of an electronic device 100 according to an embodiment of the present application. It will be understood that the composition of the electronic device 100 shown in FIG3 is merely illustrative, and the electronic device 100 may have more or fewer components than shown in FIG3 , may combine two or more components, or may have a different component configuration. The various components shown in FIG3 may be implemented in hardware, including one or more signal processing and / or application-specific integrated circuits, software, or a combination of hardware and software.

[0044] As shown in Figure 3, the electronic device 100 may include a system on chip (SoC) 110, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 101, an antenna 102, a cellular radio frequency module 150, a non-cellular radio frequency module 160, a camera 193, a display screen 194, etc.

[0045] The SoC 110 may include one or more processing units, for example, an application processor (AP), a modem, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a memory, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU). The different processing units may be independent devices or integrated into one or more SoCs.

[0046] The USB interface 130 is an interface that complies with USB standards and may be a Mini USB interface, a Micro USB interface, a USB Type-C interface, or the like. The USB interface 130 can be used to connect a charger to charge the electronic device 100, or to transfer data between the electronic device 100 and peripheral devices. It can also be used to connect headphones to play audio. This interface can also be used to connect other electronic devices, such as augmented reality devices.

[0047] It is understood that the interface connection relationship between the modules illustrated in the embodiment of the present invention is merely an illustrative illustration and does not constitute a structural limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may also adopt different interface connection methods from the above embodiments, or a combination of multiple interface connection methods.

[0048] The charging management module 140 is configured to receive charging input from a charger. The charger can be either a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 can receive charging input from the wired charger via the USB interface 130. In some wireless charging embodiments, the charging management module 140 can receive wireless charging input via the wireless charging coil of the electronic device 100. While charging the battery 142, the charging management module 140 can also provide power to the electronic device via the power management module 141.

[0049] The power management module 141 is used to connect the battery 142, the charging management module 140 and the system-on-chip 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140, and provides power to the system-on-chip 110, the display 194, the camera 193, the cellular radio frequency module 150, the non-cellular radio frequency module 160, etc. The power management module 141 can also be used to monitor parameters such as battery capacity, battery cycle count, battery health status (such as leakage, impedance, etc.). In some other embodiments, the power management module 141 can also be set in the system-on-chip 110. In other embodiments, the power management module 141 and the charging management module 140 can also be set in the same device.

[0050] The communication function of the electronic device 100 can be implemented through the antenna 101, the antenna 102, the cellular radio frequency module 150, the non-cellular radio frequency module 160, the modem and the baseband processor.

[0051] Antenna 101 and antenna 102 each represent a type of antenna, and do not limit the number of antennas in each type. As needed, antenna 101 may include one or more antennas, and antenna 102 may include one or more antennas. Antenna 101 and antenna 102 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 100 can be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve antenna utilization. For example, antenna 101 can be reused as a diversity antenna for a wireless local area network. In other embodiments, the antenna can be used in conjunction with a tuning switch.

[0052] The cellular RF module 150 can provide solutions for cellular communications including 2G / 3G / 4G / 5G, etc., applied to the electronic device 100. The cellular RF module 150 may include a cellular RF chip, a cellular RF front end, and a cellular antenna module. The cellular RF module 150 can receive electromagnetic waves from the antenna 101, filter, amplify, and process the received electromagnetic waves, and transmit them to the modem for demodulation. The cellular RF module 150 can also amplify the signal modulated by the modem and convert it into electromagnetic waves for radiation through the antenna 101. In some embodiments, at least some functional modules of the cellular RF module 150 can be integrated into the system-on-chip 110. In some embodiments, at least some functional modules of the cellular RF module 150 can be set in the same device as at least some modules of the system-on-chip 110.

[0053] The modem may include a modulator and a demodulator. The modulator is used to modulate the low-frequency baseband signal to be sent into a medium-high frequency signal. The demodulator is used to demodulate the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After being processed by the baseband processor, the low-frequency baseband signal is passed to the AP. The AP outputs a sound signal through an audio device (not limited to a speaker, a receiver, etc.) or displays an image or video through a display screen 194. In some embodiments, the modem may be an independent device. In other embodiments, the modem may be independent of the system-level chip 110 and be set in the same device as the cellular RF module 150 or other functional modules.

[0054] The non-cellular radio frequency module 160 can provide non-cellular communication solutions for the electronic device 100, including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication technology (NFC), infrared technology (IR), etc. Among them, GNSS can include global positioning system (GPS), global navigation satellite system (GLONASS), Beidou navigation satellite system (BDS), quasi-zenith satellite system (QZSS) and / or satellite based augmentation system (SBAS).

[0055] The non-cellular RF module 160 may include a non-cellular RF chip, a non-cellular RF front-end module (FEM), and a non-cellular antenna module. The non-cellular RF module 160 receives electromagnetic waves via the antenna 102, frequency-modulates and filters the electromagnetic wave signals, and transmits the processed signals to the system-on-chip 110. The non-cellular RF module 160 may also receive signals to be transmitted from the system-on-chip 110, frequency-modulate and amplify them, and then convert them into electromagnetic waves for radiation via the antenna 102.

[0056] In some embodiments, the antenna 101 of the electronic device 100 is coupled to the cellular radio frequency module 150, and the antenna 102 is coupled to the non-cellular radio frequency module 160, so that the electronic device 100 can communicate with a network and other devices through wireless communication technologies. The wireless communication technologies may include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code division multiple access (WCDMA), time-division code division multiple access (TD-SCDMA), long term evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technology.

[0057] Electronic device 100 implements display functionality through a GPU, display screen 194, and an access point (AP). A GPU is a microsystem-on-a-chip (SoC) for image processing that connects display screen 194 and the access point (AP). The GPU is used to perform mathematical and geometric calculations for graphics rendering. SoC 110 may include one or more GPUs that execute program instructions to generate or modify display information.

[0058] Display screen 194 is used to display images, videos, etc. Display screen 194 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a MiniLED, a MicroLED, a Micro-OLED, a quantum dot light-emitting diode (QLED), etc. In some embodiments, as shown in FIG3 , electronic device 100 may include one or N display screens (represented by display screens 1 to N) 194 , where N is a positive integer greater than 1.

[0059] The electronic device 100 can implement a shooting function through an ISP, a camera 193, a video codec, a GPU, a display screen 194, and an AP.

[0060] The ISP processes data fed back by camera 193. For example, when taking a photo, the shutter is opened, and light is transmitted through the lens to the camera's photosensitive element. The light signal is converted into an electrical signal, which is then passed to the ISP for processing and converted into a visible image. The ISP can also perform algorithmic optimization on image noise and brightness. It can also optimize parameters such as exposure and color temperature of the captured scene. In some embodiments, the ISP can be located within camera 193.

[0061] The camera 193 is used to capture still images or videos. The object generates an optical image through the lens and projects it onto the photosensitive element. The photosensitive element can be a charge coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the light signal into an electrical signal, and then passes the electrical signal to the ISP for conversion into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into an image signal in a standard RGB, YUV or other format. In some embodiments, as shown in FIG3 , the electronic device 100 may include 1 or N cameras (represented by cameras 1 to N) 193, where N is a positive integer greater than 1.

[0062] Figures 4 and 5 illustrate the external structures of two electronic devices 1 according to embodiments of the present application. For example, the electronic device 1 may be a foldable phone, which may be an outward-folding phone (with the screen on the outside after folding) or an inward-folding phone (with the screen hidden on the inside after folding).

[0063] As shown in Figures 4 and 5, electronic device 1 may include a first housing 11, a first circuit board 12, a hinge 13, a second housing 14, and a second circuit board 15. Hinge 13 is connected between first housing 11 and second housing 14. Hinge 13 can generate mechanical movement, allowing first housing 11 and second housing 14 to rotate relative to each other, thereby allowing electronic device 1 to be folded or unfolded.

[0064] With reference to Figure 4 , when the electronic device 1 is held normally by a user, the hinge 13 extends generally horizontally, and the first housing 11 and the second housing 14 fold toward the center from the top and bottom sides, or unfold from the center to the top and bottom sides, respectively. The electronic device 1 shown in Figure 4 can be referred to as a "small folding phone." With reference to Figure 5 , when the electronic device 1 is held normally by a user, the hinge 13 extends generally vertically, and the first housing 11 and the second housing 14 fold toward the center from the left and right sides, or unfold from the center to the left and right sides, respectively. The electronic device 1 shown in Figure 5 can be referred to as a "large folding phone."

[0065] As shown in Figures 4 and 5, the first circuit board 12 is mounted within the first housing 11, and the second circuit board 15 is mounted within the second housing 14. Illustratively, the first and second circuit boards 12, 15 can be connected via a flexible connector, enabling inter-board data transmission. Alternatively, the first and second circuit boards 12, 15 can be connected via a flexible connector and coupled to a single or multiple coaxial cables for inter-board data transmission. Alternatively, the first and second circuit boards 12, 15 can communicate using millimeter wave technology. Various components can be arranged on both the first and second circuit boards 12, 15, as described below.

[0066] FIG6 is a schematic plan view showing the arrangement of components on the first circuit board 12 and the second circuit board 15 in the electronic device 1 according to the first embodiment.

[0067] As shown in FIG6 , a system-on-chip 125 and a cellular RF module (RF system) 123 may be arranged on the first circuit board 12. The cellular RF module 123 may include a first cellular RF chip 123a, a first cellular RF front end 123b, and a first cellular antenna module 123c. The system-on-chip 125 may be electrically connected to the first cellular RF chip 123a, the first cellular RF chip 123a may be electrically connected to the first cellular RF front end 123b, and the first cellular RF front end 123b may be electrically connected to the first cellular antenna module 123c.

[0068] The system-on-chip 125 may integrate an AP, a modem, and the like.

[0069] The first cellular RF chip 123a is a RF transceiver (RF transceiver or RFIC), and its functions may include: 1. Transmission: Modulate, amplify, filter and other processes the digital signal from the modem to convert it into a cellular RF signal suitable for wireless transmission, and send the cellular RF signal out. 2. Reception: Receive the cellular RF signal from the antenna, amplify, filter and demodulate it to convert it into a digital signal for processing by the baseband processor. 3. Frequency conversion: Convert the cellular RF signal between different frequency bands. For example, the electronic device 1 needs to support communications in multiple frequency bands at the same time (such as 2G, 3G, 4G, 5G, etc.). The first cellular RF chip 123a can perform frequency conversion as needed to enable the electronic device 1 to communicate on different frequency bands. 4. RF front-end control: Control the operation of the first cellular RF front-end 123b.

[0070] The first cellular RF front end 123b is connected between the first cellular RF chip 123a and the first cellular antenna module 123c, and is used to filter, amplify, reduce noise, perform channel switching, filter matching, impedance matching, and other processing on the cellular RF signal. Specifically, the first cellular RF front end 123b may include a transmitter and a receiver. The transmitter may include components such as a power amplifier (PA), a duplexer, or a multiplexer. The transmitter may amplify and filter the weaker cellular RF signal generated by the first cellular RF chip 123a during signal transmission. The receiver may include components such as a filter, an LNA, and an RF switch. The receiver may amplify and filter the received cellular RF signal to a range suitable for the operation of the first cellular RF chip 123a during signal reception.

[0071] The first cellular RF front end 123b may include all cellular RF front ends in the electronic device 1, that is, all cellular RF front ends in the electronic device 1 may be arranged on the first circuit board 12. Alternatively, the first cellular RF front end 123b may include only a portion of the cellular RF front ends in the electronic device 1, and the other portion of the cellular RF front ends may be arranged on the second circuit board 15.

[0072] The first cellular antenna module 123c is used to connect the first cellular RF front end 123b and the first cellular antenna (described below), and is used to transmit RF signals between the first cellular RF front end 123b and the first cellular antenna. It can also perform filtering and modulation functions. Illustratively, the first cellular antenna module 123c may include components such as a transmission cable, a ground feed, a matching circuit, and matching devices.

[0073] The first cellular antenna module 123c may include all cellular antenna modules in the electronic device 1, that is, all cellular antenna modules are arranged on the side where the first circuit board 12 is located. Alternatively, the first cellular antenna module 123c may include only a portion of the cellular antenna modules in the electronic device 1, such as the low-band diversity (LB DIV) antenna module and the low-band multiple-input multiple-output (LB MIMO) antenna module 2. Other cellular antenna modules in the electronic device 1, such as the LB MIMO antenna module 1 and the low-band main (LB Main) antenna module, may be arranged on the side where the second circuit board 15 is located. For these cellular antenna modules arranged on the side of the second circuit board 15, a matching cellular RF front end may be arranged on the side of the second circuit board 15.

[0074] The electronic device 1 also includes a first cellular antenna (in this embodiment, the antenna may also be referred to as a radiator), which is used to transmit and receive cellular RF signals. This embodiment does not limit the structural form of the first cellular antenna. For example, the first cellular antenna may be a slot antenna, a mid-frame radiator, an LDS (Laser Direct Structuring) antenna, a PCB (Printed Circuit Board) antenna, a ceramic antenna, or a patch antenna arranged on a circuit board. The position of the first cellular antenna can be set as needed. For example, the first cellular antenna can be located near the first cellular RF front end 123b. The first cellular antenna may include all cellular antennas in the electronic device 1; alternatively, the first cellular antenna may include only a portion of the cellular antennas in the electronic device 1, such as a low-frequency diversity antenna, a low-frequency MIMO antenna, or a low-frequency main antenna.

[0075] As shown in FIG6 , a non-cellular antenna module 121 and a non-cellular RF front end 124 may also be arranged on the first circuit board 12 .

[0076] The non-cellular RF front end 124 is a non-cellular RF front end that can be electrically connected to the GPS antenna module 121b, for example, through a transmission line (such as a coaxial line, a soft or hard board, etc.). The non-cellular RF front end 124 can be, for example, an LNA. The non-cellular RF front end 124 can amplify the weak RF signal received by the GPS antenna and minimize the introduction of noise, which can improve the receiving sensitivity of the RF transceiver. It will be understood that Figure 6 only shows one non-cellular RF front end 124, which is merely an example and does not limit the actual number of non-cellular RF front ends 124. As needed, one or more non-cellular RF front ends 124 can be provided, and one non-cellular RF front end 124 is connected to one GPS antenna module.

[0077] The non-cellular antenna module 121 is used to transmit and receive non-cellular electromagnetic wave signals, including but not limited to Wi-Fi signals, Bluetooth signals, GNSS signals (such as GPS signals, Beidou navigation signals, etc.), NFC signals, FM signals, infrared signals, etc. The non-cellular antenna module 121 is used to connect to the non-cellular RF front end 124 and the non-cellular antenna (described below) to transmit RF signals between the non-cellular RF front end 124 and the non-cellular antenna. It can also have filtering and modulation functions. Illustratively, the non-cellular antenna module 121 may include a transmission cable, a ground feed, a matching circuit, matching components, etc.

[0078] It is understood that FIG6 shows only the Wi-Fi antenna module 121a and the GPS antenna module 121b. This is merely an example and does not limit the type and number of the non-cellular antenna modules 121. Schematically, the Wi-Fi antenna module 121a may include a Wi-Fi 2.4GHz antenna module, a Wi-Fi 5GHz antenna module, a Wi-Fi 2.4GHz + 5GHz antenna module (the same Wi-Fi antenna can operate in both the 2.4GHz and 5GHz frequency bands). Schematically, the GPS antenna module 121b may include a GPS L1 antenna module and a GPS L5 antenna module.

[0079] The electronic device 1 also includes a non-cellular antenna, which is used to transmit and receive non-cellular RF signals. This embodiment does not limit the structural form of the non-cellular antenna. For example, the non-cellular antenna may be a slot antenna, a mid-frame radiator, an LDS antenna, a PCB antenna, a ceramic antenna, or a patch antenna arranged on a circuit board. The position of the non-cellular antenna can be set as needed. For example, the non-cellular antenna can be located near the non-cellular RF front end 124. The non-cellular antenna can include all non-cellular antennas in the electronic device 1; alternatively, the non-cellular antenna can include only a portion of the non-cellular antennas in the electronic device 1, such as a Wi-Fi antenna and a GPS antenna.

[0080] As shown in Figure 6, a non-cellular RF chip 152 and a non-cellular RF front end 151 can be arranged on the second circuit board 15, and the non-cellular RF chip 152 and the non-cellular RF front end 151 are electrically connected. Corresponding to the cellular RF module, the non-cellular RF chip 152, the non-cellular RF front end 151, and the non-cellular antenna module 121 can be collectively referred to as a non-cellular RF module.

[0081] Corresponding to the first cellular RF chip 123a, the non-cellular RF chip 152 is also a RF transceiver and can be referred to as an NC chip. The non-cellular RF chip 152 can control the operation of the non-cellular RF front end 151.

[0082] The non-cellular RF front end 151 is connected between the non-cellular RF chip 152 and the Wi-Fi antenna module 121a. Schematically, the electrical connection between the non-cellular RF front end 151 and the Wi-Fi antenna module 121a can be achieved through a transmission line (such as a coaxial line, a soft or hard board, etc.). The non-cellular RF front end 151 is used to filter and amplify Wi-Fi signals. The non-cellular RF front end 151 may include a transmitter and a receiver. The transmitter may include components such as a power amplifier (PA), a duplexer, or a multiplexer. The transmitter may amplify and filter the weaker non-cellular RF signal generated by the non-cellular RF chip 152 during the signal transmission process. The receiver may include components such as a filter, an LNA, and an RF switch. The receiver may amplify and filter the received non-cellular RF signal to a range suitable for the operation of the non-cellular RF chip 152 during the signal reception process.

[0083] It should be understood that FIG6 shows only one non-cellular RF front end 151. This is merely an example and does not limit the actual number of non-cellular RF front ends 151. As needed, one or more non-cellular RF front ends 151 may be provided, with each non-cellular RF front end 151 correspondingly connected to a Wi-Fi antenna module. Multiple non-cellular RF front ends 151 may also form an n*n array (e.g., a 2*2 array). As shown in FIG6 , the system-on-chip 125 may be electrically connected to the first cellular RF chip 123a, and the first cellular RF front end 123b is electrically connected to the first cellular RF chip 123a and the first cellular antenna module 123c, thereby enabling the transmission and reception of cellular RF signals. The system-on-chip 125 is also electrically connected to the non-cellular RF chip 152, and the non-cellular RF front end 151 is electrically connected to the non-cellular RF chip 152 and the Wi-Fi antenna module 121a, thereby enabling the transmission and reception of Wi-Fi signals. The non-cellular RF front end 124 is electrically connected to the non-cellular RF chip 152 and the GPS antenna module 121b, thereby enabling the transmission and reception of GPS signals.

[0084] The system-on-chip (SoC) 125 is one of the primary heat sources within electronic device 1. The first cellular RF chip 123a and first cellular RF front-end 123b within the cellular RF module 123, as well as the non-cellular RF chip 152 and non-cellular RF front-end 151, are also susceptible to heat generation. As shown in Figure 6, by implementing the SoC 125, cellular RF module 123, non-cellular antenna module 121, and non-cellular RF front-end 124 on the first circuit board 12, and the non-cellular RF front-end 151 and non-cellular RF chip 152 on the second circuit board 15, the heat sources can be dispersed across both sides of the electronic device 1, avoiding heat concentration and improving overall heat dissipation and heat distribution. Furthermore, the need for thermally conductive material between the main and sub-frames is eliminated, reducing costs and saving space, facilitating a larger battery and increasing the designed capacitance. In particular, when the electronic device 1 is a compact, compact foldable phone, the dispersed heat source design of this embodiment can significantly improve the device's heat dissipation and heat distribution.

[0085] As described above, the solution of this embodiment allows for the decentralized placement of RF modules (including both cellular and non-cellular RF modules), with some RF modules located on one side of the first circuit board 12 and others on the other side of the second circuit board 15. Compared to the traditional centralized placement solution, the solution of this embodiment expands the usable antenna area, which helps reduce antenna combining and the number of combining components (such as switches and matching modules), thereby reducing combining losses and improving transmission. The expanded usable antenna area also facilitates the design of n*n (e.g., 8*8, 4*4, etc.) Wi-Fi solutions.

[0086] FIG7 is a schematic plan view showing the arrangement of components on the first circuit board 22 and the second circuit board 25 in the electronic device 2 of the second embodiment.

[0087] As shown in FIG7 , a system-level chip 222, a first cellular antenna module 221, a non-cellular RF chip 223a, a non-cellular RF front end 223b, and a non-cellular antenna module 223c may be arranged on the first circuit board 22.

[0088] The first cellular antenna module 221 may include all cellular antenna modules in the electronic device 2, that is, all cellular antenna modules are arranged on the side where the first circuit board 22 is located. Alternatively, the first cellular antenna module 221 may include only a portion of the cellular antenna modules in the electronic device 2. Schematically, the first cellular antenna module 221 may include an N77 module, an N79 module, and a mid / high band (MHB) module. The N77 module and the N79 module are both antenna modules for the 5G frequency band, and the MHB module can be an antenna module for the 2G frequency band, the 3G frequency band, or the 4G frequency band. The N77 module, the N79 module, and the MHB module can each be a single module or include multiple modules. For example, the N77 module may include the N77-1 module, the N77-2 module, the N77-3 module, the N77-4 module, etc., the N79 module may include the N79-1 module, the N79-2 module, the N79-3 module, the N79-4 module, etc., and the MHB module may include the MHB-1 module, the MHB-2 module, the MHB-3 module, the MHB-4 module, etc.

[0089] Illustratively, the electronic device 2 may further include an LB DIV antenna module and an LB MIMO antenna module 2 located on one side of the first circuit board 22, and an LB MIMO antenna module 1, an MHB1 antenna module, and an LB Main antenna module located on one side of the second circuit board 25. For these cellular antenna modules, a matching cellular RF front end may be arranged nearby.

[0090] The non-cellular RF chip 223a is electrically connected to the system-on-chip 222, and the non-cellular RF front end 223b is electrically connected to the non-cellular RF chip 223a and the non-cellular antenna module 223c. The non-cellular RF chip 223a can be the same as or similar to the non-cellular RF chip 152 in the first embodiment, the non-cellular RF front end 223b can be the same as or similar to the non-cellular RF front end 151 in the first embodiment, and the non-cellular antenna module 223c can be the same as or similar to the non-cellular antenna module 121 in the first embodiment.

[0091] As shown in FIG7 , a power amplifier 251, a first cellular RF front end 252, and a first cellular RF chip 253 can be arranged on the second circuit board 25. The first cellular RF front end 252 electrically connects the first cellular antenna module 221 and the first cellular RF chip 253. High-speed signals can be transmitted between the first cellular RF front end 252 and the first cellular antenna module 221. Each first cellular antenna module and the first cellular RF front end 252 can be connected via a low-loss transmission line, including but not limited to a coaxial line. There can be one or more first cellular RF front ends 252. When there are multiple first cellular RF front ends 252, one first cellular RF front end 252 is connected to one first cellular antenna module 221. The power amplifier (transiver) 251 can electrically connect the system-on-chip 222 and the first cellular RF chip 253. The power amplifier 251 has a power amplification function and can improve the problem of large signal loss across the axis. The power amplifier 251 can also be omitted as needed.

[0092] As shown in Figure 7, the system-on-chip 222 is electrically connected to the first cellular RF chip 253, and the first cellular RF front end 252 is electrically connected to the first cellular RF chip 253 and the first cellular antenna module 221, thereby enabling the transmission and reception of cellular RF signals. The system-on-chip 222 is also electrically connected to the non-cellular RF chip 223a, and the non-cellular RF front end 223b is electrically connected to the non-cellular RF chip 223a and the non-cellular antenna module 223c, thereby enabling the transmission and reception of non-cellular RF signals.

[0093] As shown in FIG7 , the solution of the second embodiment is to make the system-level chip 222, the first cellular antenna module 221, the non-cellular RF chip 223a, the non-cellular RF front end 223b and the non-cellular antenna module 223c on the first circuit board 22, and make the first cellular RF front end 252 and the first cellular RF chip 253 on the second circuit board 25, so that the heat source can be dispersed on both sides of the electronic device 2 to avoid heat concentration, which is beneficial to improving the heat dissipation performance and heat distribution performance of the whole device. Furthermore, there is no need to set a thermal conductive material between the main and sub-frames, thereby reducing costs, and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitance capacity. In particular, when the electronic device 2 is a small folding mobile phone with a relatively small size and a relatively compact device layout, the heat source dispersion layout design of this embodiment can greatly improve the heat dissipation performance and heat distribution performance of the small folding mobile phone.

[0094] As described above, the solution of this embodiment allows for the decentralized placement of RF modules (including both cellular and non-cellular RF modules), with some RF modules located on one side of the first circuit board 22 and others on the other side of the second circuit board 25. Compared to traditional centralized placement solutions, this embodiment expands the usable antenna area, which helps reduce antenna combining and the number of combining components (such as switches and matching modules), thereby reducing combining losses and improving transmission. The expanded usable antenna area also facilitates the design of nxn Wi-Fi solutions.

[0095] FIG8 is a schematic plan view showing the arrangement of components on the first circuit board 32 and the second circuit board 35 in the electronic device 3 of the third embodiment.

[0096] As shown in FIG8 , a system-level chip 323, a power amplifier 322, a first cellular RF module 321, a non-cellular RF chip 324a, a non-cellular RF front end 324b, and a non-cellular antenna module 324c may be arranged on the first circuit board 32.

[0097] The first cellular RF module 321 can, for example, operate in the MHB frequency band. The first cellular RF module 321 can include a first cellular RF chip 321a, a first cellular RF front end 321b, and a first cellular antenna module 321c. The power amplifier 322 electrically connects the system-on-chip 323 to the first cellular RF chip 321a, the first cellular RF chip 321a electrically connects the power amplifier 322 to the first cellular RF front end 321b, the first cellular RF front end 321b electrically connects the first cellular RF chip 321a to the first cellular antenna module 321c, and the first cellular antenna module 321c connects the first cellular RF front end 321b to the first cellular antenna. The power amplifier 322 amplifies power and can improve the problem of large signal loss across the axis. The power amplifier 322 can be omitted as needed.

[0098] The non-cellular RF chip 324a is electrically connected to the system-on-chip 323, and the non-cellular RF front end 324b is electrically connected to the non-cellular RF chip 324a and the non-cellular antenna module 324c. As shown in Figure 8, a power amplifier 351 and a second cellular RF module 352 can be arranged on the second circuit board 35. The power amplifier 351 performs power amplification and can improve the problem of large signal loss across the axis. The power amplifier 351 can also be omitted as needed. Illustratively, the second cellular RF module 352 can operate in the low frequency (LB) band. The second cellular RF module 352 can include a second cellular RF chip 352a, a second cellular RF front end 352b, and a second cellular antenna module 352c. The power amplifier 351 is electrically connected to the system-on-chip 323 and the second cellular RF chip 352a. The second cellular RF chip 352a is electrically connected to the power amplifier 322 and the second cellular RF front end 352b. The second cellular RF front end 352b is electrically connected to the second cellular RF chip 352a and the second cellular antenna module 352c.

[0099] The electronic device 3 may further include a second cellular antenna, which may operate in a different frequency band than the first cellular antenna. This embodiment does not limit the structural form of the second cellular antenna. For example, the second cellular antenna may be a slot antenna, a mid-frame radiator, an LDS antenna, a PCB antenna, a ceramic antenna, or a patch antenna arranged on a circuit board. The position of the second cellular antenna may be set as needed. For example, the second cellular antenna may be located near the second cellular RF front end 352b. The second cellular antenna module 352c connects the second cellular RF front end 352b to the second cellular antenna.

[0100] In this embodiment, the first circuit board 32 and the second circuit board 35 can be connected by a flexible printed circuit (FPC), which can span the hinge 13. In order to reduce the trans-axis loss, an FPC with lower trans-axis loss can be customized. The trans-axis loss of the FPC can be, for example, between 1dB / 100mm and 2dB / 100mm, such as 1dB / 100mm, 1.5dB / 100mm or 2dB / 100mm; the length of the trans-axis FPC can also be reduced (for example, reducing it to less than 30mm). Alternatively, the SoC can be customized to increase the link differential mode insertion loss that the SoC can withstand to greater than or equal to 7dB (for example, 12dB). Alternatively, the first circuit board 32 and the second circuit board 35 can also communicate in the form of millimeter waves.

[0101] As shown in Figure 8, on the side of the first circuit board 32, the first cellular RF module 321 can transmit and receive cellular RF signals in the MHB band, and the non-cellular RF module can transmit and receive non-cellular RF signals. On the side of the second circuit board 35, the second cellular RF module 352 can transmit and receive cellular RF signals in the LB band.

[0102] As shown in Figure 8, the solution of embodiment 3 is to make the system-level chip 323, the first cellular radio frequency module 321, the non-cellular radio frequency chip 324a, the non-cellular radio frequency front end 324b and the non-cellular antenna module 324c on the first circuit board 22, and the second cellular radio frequency module 352 on the second circuit board 25, so that the heat source can be dispersed on both sides of the electronic device 3 to avoid heat concentration, which is beneficial to improving the heat dissipation performance and heat distribution performance of the whole device. Furthermore, there is no need to set a thermal conductive material between the main and sub-frames, thereby reducing costs, and saving space, which is beneficial to increasing the battery volume and improving the design value of the capacitance capacity. In particular, when the electronic device 3 is a small folding mobile phone with a relatively small size and a relatively compact device layout, the heat source dispersion layout design of this embodiment can greatly improve the heat dissipation performance and heat distribution performance of the small folding mobile phone.

[0103] Furthermore, the ample space on one side of the first circuit board 32 expands the available antenna area, reducing antenna combining and the number of combining components (such as switches and matching modules), thereby reducing combining losses and improving transmission. This allows for multiple Wi-Fi antenna solutions, such as 4x4 and 8x8 antennas, without the need for shared Wi-Fi.

[0104] FIG9 is a schematic plan view showing the arrangement of components on the second circuit board 42 and the first circuit board 45 in the electronic device 4 of the fourth embodiment.

[0105] As shown in FIG. 9 , a system-on-chip 451 may be disposed on the first circuit board 45 .

[0106] As shown in FIG9 , a power amplifier 422 , a first cellular RF module 421 , a non-cellular RF chip 423 a , a non-cellular RF front end 423 b , a non-cellular antenna module 423 c and a camera module 424 may be arranged on the second circuit board 42 . Among them:

[0107] The power amplifier 422 is electrically connected to the system-on-chip 451. The power amplifier 422 has a power amplification function and can improve the problem of large signal loss during transaxial transmission. The power amplifier 422 can also be omitted as needed.

[0108] The first cellular RF module 421 may include a first cellular RF chip 421a, a first cellular RF front end 421b and a first cellular antenna module 421c. The first cellular RF chip 421a is electrically connected to the power amplifier 422 and the first cellular RF front end 421b. The first cellular RF front end 421b is electrically connected to the first cellular RF chip 421a and the first cellular antenna module 421c.

[0109] The first cellular RF front end 421b may include all cellular RF front ends in the electronic device 4, that is, all cellular RF front ends in the electronic device 4 may be arranged on the second circuit board 42. Alternatively, the first cellular RF front end 421b may include only a portion of the cellular RF front ends in the electronic device 4, and the other portion may be arranged on the first circuit board 45.

[0110] The first cellular antenna module 421c may include all cellular antenna modules in the electronic device 4, that is, all cellular antenna modules are arranged on the side where the second circuit board 42 is located. Alternatively, the first cellular antenna module 421c may include only a portion of the cellular antenna modules in the electronic device 4, such as the LB DIV antenna module and the LB MIMO antenna module 2. Other cellular antenna modules in the electronic device 4, such as the LB MIMO antenna module 1 and the LB Main antenna module, may be arranged on the side where the first circuit board 45 is located. For these cellular antenna modules arranged on the side of the first circuit board 45, a matching cellular RF front end may be arranged on the side of the first circuit board 45.

[0111] The non-cellular RF chip 423a is electrically connected to the system-on-chip 451 and the non-cellular RF front end 423b, and the non-cellular RF front end 423b is electrically connected to the non-cellular RF chip 423a and the non-cellular antenna module 423c.

[0112] The camera module 424 is electrically connected to the system-on-chip 451. Illustratively, the camera module 424 can be electrically connected to the system-on-chip 451 via an FPC with low transaxial loss, allowing high-speed signals to be transmitted between the camera module 424 and the system-on-chip 451. The transaxial loss of the FPC can be, for example, between 1dB / 100mm and 2dB / 100mm, such as 1dB / 100mm, 1.5dB / 100mm, or 2dB / 100mm.

[0113] In this embodiment, the first circuit board 45 and the second circuit board 42 can be connected by an FPC, which can span the hinge 13. In order to reduce the transaxial loss, an FPC with lower transaxial loss can be customized. The transaxial loss of the FPC can be, for example, between 1dB / 100mm and 2dB / 100mm, such as 1dB / 100mm, 1.5dB / 100mm or 2dB / 100mm. The length of the transaxial FPC can also be reduced (for example, to within 30mm). Alternatively, the SoC can be customized to increase the link differential mode insertion loss that the SoC can withstand to greater than or equal to 7dB (for example, 12dB). Alternatively, the first circuit board 45 and the second circuit board 42 can also communicate via millimeter waves.

[0114] As shown in FIG9 , the solution of the fourth embodiment is to place the system-level chip 451 on the first circuit board 45 and arrange the first cellular radio frequency module 421 and the non-cellular radio frequency module on the second circuit board 42. This can isolate other heat sources from the system-level chip 451 as the main heat source, avoid heat concentration, and help improve the heat dissipation and heat distribution performance of the entire device. Furthermore, there is no need to set a thermal conductive material between the main and auxiliary frames, thereby reducing costs, and saving space, which is conducive to increasing the battery volume and improving the design value of the capacitance capacity. In particular, when the electronic device 4 is a small folding mobile phone with a relatively small size and a relatively compact device layout, the heat source dispersion layout design of this embodiment can greatly improve the heat dissipation and heat distribution performance of the small folding mobile phone.

[0115] As described above, this embodiment's solution maximizes the available area on one side of the first circuit board 45, making full use of the space on the side of the first circuit board 45 for antenna placement. This helps reduce antenna combining and the number of combining components (such as switches and matching modules), thereby reducing combining losses and improving transmission. The expanded available antenna area also facilitates the design of n*n Wi-Fi solutions.

[0116] Figure 10a is a schematic plan view of the arrangement of components on a first circuit board 53 and a second circuit board 51 in an electronic device 5 in an implementation of Example 5. For example, the electronic device 5 may be a large foldable mobile phone.

[0117] As shown in Figure 10a, a transverse centerline L1 and a longitudinal centerline L2 can be defined within the electronic device 5. The longitudinal centerline L2 can be parallel to the hinge 13, and the electronic device 5 can be bilaterally symmetrical about the longitudinal centerline L2. The transverse centerline L1 can be perpendicular to the longitudinal centerline L2, and the electronic device 5 can be vertically symmetrical about the transverse centerline L1. The transverse centerline L1 and the longitudinal centerline L2 intersect vertically and horizontally, dividing the electronic device 5 into four regions.

[0118] As shown in Figure 10a, the first circuit board 53 can be arranged with a system-on-chip 532, a non-cellular antenna module 531, a non-cellular RF front-end 533, and a non-cellular RF chip 534. The system-on-chip 532 and the non-cellular antenna module 531 can be arranged in the upper right corner, while the non-cellular RF front-end 533 and the non-cellular RF chip 534 can be arranged in the lower right corner. The system-on-chip 532 is electrically connected to the non-cellular RF chip 534, and the non-cellular RF front-end 533 is electrically connected to the non-cellular RF chip 534 and the non-cellular antenna module 531. The non-cellular RF module located on one side of the first circuit board 53 can transmit and receive non-cellular RF signals.

[0119] As shown in Figure 10a, a first cellular antenna module 511, a first cellular RF front end 512, and a first cellular RF chip 513 may be arranged on the second circuit board 51. The first cellular antenna module 511, the first cellular RF front end 512, and the first cellular RF chip 513 may be located in the upper left corner.

[0120] As shown in Figure 10a, the solution of Example 5 can disperse the heat source on both sides of the electronic device 5 by arranging the system-level chip 532, non-cellular antenna module 531, non-cellular RF front end 533, and non-cellular RF chip 534 on one side of the first circuit board 53, and arranging the first cellular antenna module 511, first cellular RF front end 512, and first cellular RF chip 513 on the side of the second circuit board 51, thereby avoiding heat concentration and improving the heat dissipation and heat distribution performance of the entire device. As an example, arranging the system-level chip 532 and non-cellular antenna module 531 on one side of the first circuit board 53 and the non-cellular RF front end 533 and non-cellular RF chip 534 on the other side of the first circuit board 53 can further disperse the heat source and enhance the heat dissipation and heat distribution performance of the entire device. Furthermore, there is no need to set thermal conductive material between the main and sub-frames, thereby reducing costs and saving space, which is conducive to increasing the battery volume and improving the designed capacitance value.

[0121] Based on FIG10a , in the embodiment shown in FIG10b , the electronic device 5 may further include a first power management chip 535 and a second power management chip 514. The first power management chip 535 may be disposed in the lower right corner of the first circuit board 53, electrically connected to the system-on-chip 532, and configured to manage the battery on one side of the first circuit board 53. The second power management chip 514 may be disposed in the lower left corner of the second circuit board 51, electrically connected to the system-on-chip 532, and configured to manage the battery on one side of the second circuit board 51.

[0122] The implementation shown in Figure 10b can disperse the heat source and optimize the heat dissipation and heat distribution performance of the entire machine by dispersing the first power management chip 535 and the second power management chip 514 and arranging the first power management chip 535 and the system-level chip 532 on both sides of the first circuit board 53 respectively.

[0123] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: It includes a first circuit board, a second circuit board, a first cellular radio frequency front end, a non-cellular radio frequency front end and a system-level chip; The first circuit board and the second circuit board are arranged at an interval, and the first circuit board and the second circuit board are connected in circuit; One of the first cellular RF front end and the non-cellular RF front end is arranged on the first circuit board, and the other is arranged on the second circuit board, or both the first cellular RF front end and the non-cellular RF front end are arranged on the second circuit board; The system-level chip is arranged on the first circuit board and is electrically connected to both the first cellular radio frequency front end and the non-cellular radio frequency front end.

2. The electronic device according to claim 1, characterized in that: The electronic device further includes a non-cellular antenna module, which is arranged on the first circuit board or the second circuit board, and is electrically connected to the non-cellular radio frequency front end.

3. The electronic device according to claim 2, characterized in that: The electronic device also includes a non-cellular radio frequency chip, which is arranged on the first circuit board or the second circuit board, and is electrically connected to the non-cellular antenna module; the system-level chip is electrically connected to the non-cellular radio frequency chip.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The electronic device further includes a first cellular antenna module, which is arranged on the first circuit board or the second circuit board, and is electrically connected to the first cellular radio frequency front end.

5. The electronic device according to claim 4, characterized in that: The electronic device further includes a first cellular radio frequency chip, which is arranged on the first circuit board or the second circuit board, and is electrically connected to the first cellular antenna module; The system-level chip is electrically connected to the first cellular radio frequency chip.

6. The electronic device according to claim 3, characterized in that: The electronic device also includes a first cellular radio frequency chip and a first cellular antenna module, the first cellular radio frequency chip is electrically connected to the first cellular antenna module, the first cellular antenna module is electrically connected to the first cellular radio frequency front end, the first cellular radio frequency chip, the first cellular antenna module, the first cellular radio frequency front end and the non-cellular antenna module are all arranged on the first circuit board, the non-cellular radio frequency chip and the non-cellular radio frequency front end are both arranged on the second circuit board; the system-level chip is electrically connected to the first cellular radio frequency chip.

7. The electronic device according to claim 3, characterized in that: The electronic device also includes a first cellular radio frequency chip and a first cellular antenna module, the first cellular radio frequency chip is electrically connected to the first cellular antenna module, the first cellular antenna module is electrically connected to the first cellular radio frequency front end, the first cellular antenna module, the non-cellular radio frequency chip, the non-cellular antenna module and the non-cellular radio frequency front end are all arranged on the first circuit board, the first cellular radio frequency chip and the first cellular radio frequency front end are both arranged on the second circuit board; the system-level chip is electrically connected to the first cellular radio frequency chip.

8. The electronic device according to claim 7, characterized in that: The first cellular antenna module includes an N77 module, an N79 module and a medium-high frequency MHB module; The electronic device further includes a power amplifier, and the system-level chip is electrically connected to the first cellular radio frequency chip via the power amplifier.

9. The electronic device according to claim 3, characterized in that: The electronic device also includes a first cellular RF chip, a first cellular antenna module, a second cellular RF chip, a second cellular RF front end, and a second cellular antenna module. The first cellular RF chip is electrically connected to the first cellular antenna module, the first cellular antenna module is electrically connected to the first cellular RF front end, the second cellular RF chip is electrically connected to the second cellular antenna module, and the second cellular antenna module is electrically connected to the second cellular RF front end. The first cellular RF chip, the first cellular RF front end, the first cellular antenna module, the non-cellular RF chip, the non-cellular antenna module, and the non-cellular RF front end are all arranged on the first circuit board, and the second cellular RF chip, the second cellular RF front end, and the second cellular antenna module are all arranged on the second circuit board; the system-level chip is electrically connected to the first cellular RF chip and the second cellular RF chip.

10. The electronic device according to claim 9, characterized in that: The electronic device further comprises a first power amplifier disposed on the first circuit board, and the system-level chip is electrically connected to the first cellular radio frequency chip via the first power amplifier; And / or, the electronic device further comprises a second power amplifier disposed on the second circuit board, and the system-level chip The rate amplifier is electrically connected to the second cellular radio frequency chip.

11. The electronic device according to claim 3, characterized in that: The electronic device also includes a first cellular RF chip and a first cellular antenna module, the first cellular RF chip is electrically connected to the first cellular antenna module, the first cellular antenna module is electrically connected to the first cellular RF front end, and the first cellular RF chip, the first cellular RF front end, the first cellular antenna module, the non-cellular RF chip, the non-cellular RF front end and the non-cellular antenna module are all arranged on the second circuit board.

12. The electronic device according to claim 11, characterized in that: The electronic device further includes a third power amplifier disposed on the second circuit board, and the system-level chip is electrically connected to the first cellular radio frequency chip via the third power amplifier.

13. The electronic device according to claim 11 or 12, characterized in that: The electronic device further includes a camera module, which is arranged on the second circuit board. The camera module is electrically connected to the system-level chip via a flexible circuit board, and the trans-axis loss of the flexible circuit board is 1 dB / 100 mm to 2 dB / 100 mm.

14. The electronic device according to claim 3, characterized in that: The non-cellular radio frequency chip, the non-cellular radio frequency front end, the non-cellular antenna module and the system-level chip are all arranged on the first circuit board; The electronic device further includes a first cellular radio frequency chip and a first cellular antenna module, wherein the first cellular radio frequency chip and the first cellular antenna module are both arranged on the second circuit board, and the first cellular radio frequency chip is electrically connected to the first cellular antenna module; The system-level chip is electrically connected to the first cellular radio frequency chip.

15. The electronic device according to claim 14, characterized in that: The electronic device also includes a first power management chip and a second power management chip. The first power management chip is arranged on the first circuit board and electrically connected to the system-level chip. The second power management chip is arranged on the second circuit board and electrically connected to the system-level chip.

16. An electronic device, characterized in that: It comprises a housing and the electronic device according to any one of claims 1 to 15, wherein the electronic device is installed in the housing.

17. The electronic device according to claim 16, characterized in that: The housing includes a first housing and a second housing, and the electronic device further includes a hinge, the hinge connecting the first housing and the second housing, the hinge being used to generate a mechanical movement to make the first housing and the second housing rotate relative to each other, so that the electronic device can be folded or unfolded; The first circuit board is installed in the first shell, and the second circuit board is installed in the second shell.

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