Plastic lens manufacturing method, plastic lens and electronic device

Abstract

A plastic lens manufacturing method, a plastic lens and an electronic device are disclosed. The plastic lens manufacturing method may comprise the steps of: heating a lens; cooling the heated lens; reheating the cooled lens; and recooling the reheated lens.

Description

Method for manufacturing plastic lenses, plastic lenses and electronic devices

[0001] The present disclosure relates to a method for manufacturing a plastic lens, a plastic lens, and an electronic device including the same, according to various embodiments.

[0002] Electronic devices can refer to devices that perform specific functions according to the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device.

[0003] Head-mounted displays (HMDs), a representative device of virtual and mixed reality (VR), require high-definition, expanded field of view to provide users with a high sense of immersion. To achieve a compact structure by shortening the focal length based on the display, recent VR devices are adopting multiple lenses along with polarizing films. Plastic lenses are mainly used to reduce the weight of the lenses to minimize user fatigue from prolonged wear and use. Furthermore, VR devices are categorized into methods using regular lenses, Fresnel lenses, and pancake lenses. Pancake lenses utilize polarizing films to narrow the optical path through selective transmission and reflection.

[0004] According to embodiments of the present disclosure, a method for manufacturing a plastic lens may include a two-step heat treatment process.

[0005] According to embodiments of the present disclosure, a plastic lens may include a phase difference of 20 nm (nanometer) or less, and may be manufactured using a method for manufacturing a plastic lens according to embodiments of the present disclosure.

[0006] According to embodiments of the present disclosure, an electronic device may include a lens or lens module according to embodiments of the present disclosure.

[0007] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to embodiments.

[0008] FIG. 2 is a perspective view illustrating the internal configuration of a wearable electronic device according to one embodiment.

[0009] FIGS. 3A and 3B are drawings showing the front and back of a wearable electronic device according to one embodiment.

[0010] Figure 4 is a process flow diagram of a method for manufacturing a plastic lens according to embodiments.

[0011] Figure 5 is a temperature profile in a method for manufacturing a plastic lens according to embodiments.

[0012] Figure 6a shows the phase difference of the injected plastic lens according to embodiments.

[0013] Figure 6b shows the phase difference of a two-stage heat-treated plastic lens according to embodiments.

[0014] FIG. 7 illustrates a configuration of a lens module including a plastic lens according to embodiments.

[0015] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0016] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to embodiments.

[0017] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0018] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0019] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0020] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0021] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0022] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0023] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0024] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0025] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0026] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0027] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0028] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0029] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0030] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0031] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0032] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0033] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0034] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0035] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0036] According to embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0037] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0038] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0039] FIG. 2 is a perspective view illustrating the internal configuration of a wearable electronic device (200) according to embodiments.

[0040] Referring to FIG. 2, a wearable electronic device (200) according to embodiments may include at least one of a light output module (211), a display member (201), and a camera module (250).

[0041] According to one embodiment of the present disclosure, the light output module (211) (e.g., a display) may include a light source capable of outputting an image, and a lens for guiding the image to the display member (201). According to one embodiment of the present disclosure, the light output module (211) may include at least one of a liquid crystal display (LCD), a digital mirror device (DMD), a liquid crystal on silicon (LCoS), an organic light emitting diode (OLED), or a micro light emitting diode (micro LED).

[0042] The display may include, for example, a liquid crystal display (LCD), a digital mirror device (DMD), a liquid crystal on silicon (LCoS), an organic light emitting diode (OLED), or a micro light emitting diode (micro LED). Although not shown, if the display is composed of one of a liquid crystal display, a digital mirror display, or a silicon liquid crystal display, the wearable electronic device (200) may include a light source that irradiates light onto a screen output area of ​​the display. In another embodiment, if the display can generate light on its own, for example, if it is composed of one of an organic light emitting diode or a micro LED, the wearable electronic device (200) may provide a good quality virtual image to the user even without including a separate light source. In one embodiment, if the display is implemented with an organic light emitting diode or a micro LED, a light source is unnecessary, and thus the wearable electronic device (200) may be lightweight. A wearable electronic device (200) may include a display, a first transparent member, and / or a second transparent member, and a user may use the wearable electronic device (200) while wearing it on his or her face. The first transparent member and / or the second transparent member may be formed of a glass plate, a plastic plate, or a polymer, and may be manufactured to be transparent or translucent. According to one embodiment, the first transparent member may be arranged to face the user's right eye, and the second transparent member may be arranged to face the user's left eye. According to various embodiments, if the display is transparent, it may be arranged at a position facing the user's eye to form a screen display unit.

[0043] The lens adjusts the focus of the image displayed on the display so that it can be seen by the user. Examples include Fresnel lenses, pancake lenses, and multi-channel lenses.

[0044] According to one embodiment of the present disclosure, the display member (201) may include an optical waveguide (e.g., a waveguide). According to one embodiment of the present disclosure, an output image of an optical output module (211) incident on one end of the optical waveguide may be propagated inside the optical waveguide and provided to a user. According to one embodiment of the present disclosure, the optical waveguide may include at least one diffractive element (e.g., a diffractive optical element (DOE), a holographic optical element (HOE)) or at least one reflective element (e.g., a reflective mirror). For example, the optical waveguide may guide an output image of the optical output module (211) to a user's eye by using at least one diffractive element or reflective element.

[0045] For example, a waveguide serves to transmit the light generated by the display to the user's eyes.

[0046] The optical waveguide may be made of glass, plastic, or polymer, and may include nano-patterns formed on a portion of the inner or outer surface, for example, a grating structure having a polygonal or curved shape. According to one embodiment, light incident on one end of the waveguide may be propagated within the display optical waveguide by the nano-patterns and provided to a user. In addition, an optical waveguide composed of a free-form prism may provide the incident light to a user through a reflective mirror. The optical waveguide may include at least one diffractive element (e.g., a Diffractive Optical Element (DOE), a Holographic Optical Element (HOE)) or at least one reflective element (e.g., a reflective mirror). The optical waveguide may guide display light emitted from a light source unit to a user's eye by using at least one diffractive element or reflective element included in the optical waveguide.

[0047] According to various embodiments, the diffractive element may include an input optical member / output optical member (not shown). For example, the input optical member may mean an input grating area, and the output optical member (not shown) may mean an output grating area. The input grating area may serve as an input terminal that diffracts (or reflects) light output from (e.g., a Micro LED) to transmit the light to a transparent member (e.g., a first transparent member, a second transparent member) of a screen display unit. The output grating area may serve as an outlet that diffracts (or reflects) light transmitted to a transparent member (e.g., a first transparent member, a second transparent member) of a waveguide to a user's eye.

[0048] According to various embodiments, the reflective element may include a total internal reflection (TIR) ​​optical element or a total internal reflection waveguide. For example, total internal reflection may refer to a method of guiding light such that light (e.g., a virtual image) entering through an input grating region is 100% reflected from one surface (e.g., a specific surface) of the waveguide, thereby transmitting 100% of the light to the output grating region.

[0049] In one embodiment, light emitted from the display may be guided along an optical path through an input optical element into a waveguide. Light traveling within the waveguide may be guided toward the user's eye through an output optical element. The screen display may be determined based on the light emitted toward the user's eye.

[0050] According to one embodiment of the present disclosure, the camera module (250) can capture still images and / or moving images. According to one embodiment, the camera module (250) is disposed within a lens frame and can be disposed around the display member (201).

[0051] According to one embodiment of the present disclosure, the first camera module (251) can capture and / or recognize the trajectory of the user's eye (e.g., pupil, iris) or gaze. According to one embodiment of the present disclosure, the first camera module (251) can periodically or aperiodically transmit information related to the trajectory of the user's eye or gaze (e.g., trajectory information) to a processor (e.g., processor (120) of FIG. 1).

[0052] For example, the first camera module (e.g., ET (Eye Tracking) camera) can be used to detect and track pupils. The first camera module (251) can be used to position the center of the virtual image projected on the AR glasses according to the direction in which the pupils of the AR glasses wearer are looking. The first camera module (251) can include a GS camera to detect the pupil and track rapid eye movements. The first camera modules (251) (e.g., ET cameras) can be installed for the left and right eyes, respectively, and the same camera performance and specifications can be used for each.

[0053] According to one embodiment of the present disclosure, the second camera module (253) can capture an external image.

[0054] For example, the second camera module (253) can capture HR (High Resolution) or PV (Photo Video) and can use a high-resolution camera. The second camera module (253) can include a color camera equipped with functions for obtaining high-quality images, such as an AF function and optical image stabilization (OIS). The second camera module (253) can include a GS camera or an RS camera.

[0055] According to one embodiment of the present disclosure, the third camera module (255) can be used for hand detection and tracking, and user gesture (e.g., hand movement) recognition. According to one embodiment of the present disclosure, the third camera module (255) can be used for 3 degrees of freedom (3DoF), 6DoF head tracking, position (space, environment) recognition, and / or movement recognition. According to one embodiment of the present disclosure, the second camera module (253) can also be used for hand detection and tracking, and user gesture recognition. According to one embodiment of the present disclosure, at least one of the first camera module (251) to the third camera module (255) can be replaced with a sensor module (e.g., a LiDAR sensor). For example, the sensor module can include at least one of a vertical cavity surface emitting laser (VCSEL), an infrared sensor, and / or a photodiode.

[0056] For example, the third camera module (255) is a camera used for 3DoF, 6DoF head tracking, hand detection and tracking, and spatial recognition, and may include a GS (Global shutter) camera. Since a stereo camera is required for head tracking and spatial recognition, the third camera module (255) may include two or more GS cameras. The third camera module (255) may use a GS camera, which has superior performance (image drag) compared to a RS (Rolling shutter) camera, to detect and track fine movements such as rapid hand movements and fingers. The third camera module (255) may perform spatial recognition for 6DoF, and a SLAM function through depth shooting. In addition, it may perform a user gesture recognition function.

[0057] For example, the wearable electronic device (200) may include a fourth camera module. The fourth camera module may include a face tracking (FT) camera. The fourth camera module may detect and track a user's facial expressions.

[0058] In one embodiment, the wearable electronic device (200) may include an illumination module (or LED). The illumination module may be used for various purposes depending on the location where it is attached. As an example, the illumination module attached around the AR glasses frame may be used as an auxiliary means to facilitate gaze detection when tracking eye movements with an ET camera, and may include an IR LED of an infrared wavelength.

[0059] As a practical example, the light emitting unit can be attached adjacent to a camera, such as around a hinge connecting a frame and a temple, or around a bridge connecting frames, to supplement ambient brightness when taking pictures, and can be used when subject detection is not easy in a dark environment.

[0060] In one embodiment, the wearable electronic device (200) may include a printed circuit board (PCB). The printed circuit board may be disposed on the temple portion of the glasses and may transmit electrical signals to each module (Camera, Display, Audio, Sensor) and other printed circuit boards through the FPCB. According to various embodiments, at least one printed circuit board may include a first substrate, a second substrate, and an interposer disposed between the first substrate and the second substrate.

[0061] In one embodiment, a printed circuit board may be placed in the center of the set, and electrical signals may be transmitted to each module (e.g., Camera, Display, Audio, Sensor) and other printed circuit boards through the FPCB.

[0062] FIGS. 3A and 3B are drawings showing the front and back of a wearable electronic device (300) according to embodiments.

[0063] Referring to FIGS. 3A and 3B, in one embodiment, camera modules (311, 312, 313, 314, 315, 316) and / or depth sensors (317) for obtaining information related to the surrounding environment of the wearable electronic device (300) may be arranged on the first surface (310) of the housing.

[0064] In one embodiment, the camera modules (311, 312) can acquire images related to the environment surrounding the wearable electronic device.

[0065] In one embodiment, the camera modules (313, 314, 315, 316) can acquire images while the wearable electronic device is worn by a user. The camera modules (313, 314, 315, 316) can be used for hand detection and tracking, and user gesture (e.g., hand movement) recognition. The camera modules (313, 314, 315, 316) can be used for 3DoF, 6DoF head tracking, position (spatial, environmental) recognition, and / or movement recognition. In one embodiment, the camera modules (311, 312) can also be used for hand detection and tracking, and user gesture.

[0066] In one embodiment, a depth sensor (317) may be configured to transmit a signal and receive a signal reflected from a subject, and may be used for purposes such as time of flight (TOF) to determine the distance to an object. Instead of or in addition to the depth sensor (317), the camera modules (213, 214, 215, 216) may determine the distance to an object.

[0067] In one embodiment, the depth sensor (317) can be used to determine the distance to an object, such as with Time of Flight (TOF). TOF (Time of Flight) is a technology that measures the distance to an object using signals (such as near-infrared, ultrasound, or laser). TOF technology emits a signal from a transmitter, and measures the signal's flight time at a receiver.

[0068] According to one embodiment, a camera module (325, 326) for facial recognition and / or a display (321) (and / or a lens) may be disposed on the second side (320) of the housing.

[0069] In one embodiment, a face recognition camera module (325, 326) adjacent to the display may be used to recognize a user's face, or may recognize and / or track both eyes of the user.

[0070] In one embodiment, the display (321) (and / or lens) may be disposed on the second side (320) of the wearable electronic device (300). In one embodiment, the wearable electronic device (300) may not include camera modules (315, 316) among the plurality of camera modules (313, 314, 315, 316). Although not illustrated in FIGS. 3A and 3B , the wearable electronic device (300) may further include at least one of the configurations illustrated in FIG. 2 .

[0071] As described above, according to one embodiment, the wearable electronic device (300) may have a form factor for being worn on a user's head. The wearable electronic device (300) may further include a strap and / or a wearing member for being secured to a body part of the user. The wearable electronic device (300) may provide a user experience based on augmented reality, virtual reality, and / or mixed reality while being worn on the user's head.

[0072] According to one embodiment, FIG. 4 is a process flow diagram of a method for manufacturing a plastic lens according to embodiments. Referring to FIG. 4, the method for manufacturing a plastic lens in FIG. 4 may include a step of heat-treating a lens (410); a step of cooling a heat-treated lens (420); a step of re-heat-treating a cooled lens (430); and a step of re-cooling a re-heat-treated lens (440). FIG. 5 illustrates a temperature profile of a method for manufacturing a plastic lens according to embodiments, and the method for manufacturing a plastic lens will be described with reference to FIGS. 4 and 5.

[0073] In one embodiment, the process (410) for heat treating the lens may be a process for heating and heat treating (e.g., annealing) the injection-molded lens. In one embodiment, the injection molding may utilize a plastic lens injection molding method known in the art of the present disclosure, which is not specifically described herein. In some embodiments, in the process (410) for heat treating the lens, the lens may be a lens that has not undergone an additional heat treatment process other than a temperature required for molding in a molding machine or outside of a molding machine. In some embodiments, in the process (410) for heat treating the lens, the lens may be a lens that has undergone an injection, cooling, and ejection process within a molding machine.

[0074] In one embodiment, the lens may be a plastic lens. In some embodiments, the lens may include an organic material applicable to an optical lens (e.g., a monomer, a polymer, etc.), and may include at least one or more of polystyrene (PS), allyl diglycol carbonate resin, polycarbonate resin (PC), polyacrylic resin, poly(methyl methacrylate; PMMA), polyolefin resin (e.g., cyclic olefin copolymer (COC)), or polyurethane, or a combination thereof. In one embodiment, the plastic lens may have a refractive index of about 1.40 to about 1.80.

[0075] According to one embodiment, the process (410) of heat treating a lens may be heat treated (or annealed) by heating to a heating temperature (e.g., T1 in FIG. 5) that is about -10° C. to about -20° C. lower than the transition temperature of the lens or lens material. In some embodiments, the transition temperature may be the glass transition temperature (Tg).

[0076] In one embodiment, referring to FIG. 5, the heating temperature (e.g., T1 of FIG. 5) of the process (410) for heat treating the lens may be about 90° C. to about 140° C.; about 90° C. to about 130° C.; or about 100° C. to about 130° C. In one embodiment, the holding time (e.g., D1 of FIG. 5) at the mentioned heating temperature (e.g., T1 of FIG. 5) may be about 6 hours or less; about 4 hours or less; about 3 hours or less; about 2 hours or less; or about 10 minutes to about 3 hours; about 30 minutes to about 3 hours; or about 1 hour to about 2.5 hours, in consideration of reducing the process time, eliminating birefringence, and maintaining the dimensional stability of the lens. The mentioned temperature and time may be a minimum, a maximum, or an average value, respectively.

[0077] In one embodiment, the heating rate of the heat treating process (410) of the lens may be higher than that of the reheat treating process (430). In some embodiments, the heating rate of the heat treating process (410) may be about 1 °C / min to about 5 °C / min; about 1 °C / min to about 4 °C / min; about 1 °C / min to about 3 °C / min; about 1 °C / min to about 2 °C / min; or about 1.5 °C / min to about 1.8 °C / min.

[0078] According to one embodiment, the process of heat treating the lens (410) can remove factors that cause birefringence, such as molding stress (e.g., current stress), during the injection molding process by stabilizing the structure of the lens by applying the temperature, time, or both mentioned above.

[0079] In one embodiment, referring to FIG. 5, the process of cooling a heat-treated lens (420) may be a process of cooling a heat-treated (e.g., annealed) lens during a heating temperature (e.g., T1 of FIG. 5) and a holding time (e.g., D1 of FIG. 5) in the process of heat-treating a lens (410).

[0080] According to one embodiment, the cooling process (420) may cool to a temperature (e.g., T2 in FIG. 5) that is about -30° C. to about -50° C. lower than the heating temperature (e.g., T1 in FIG. 5) of the heat-treating process (410) of the lens.

[0081] According to one embodiment, the cooling process (420) may cool at a cooling rate of about 0.2 °C / min to about 1 °C / min (i.e., minus (-) units are omitted).

[0082] According to one embodiment, the cooling process (420) performs a hardening process by rapidly cooling the heated lens by applying the mentioned temperature and cooling rate, which can reduce the dimensional change of the lens due to the heat treatment and reduce the process time (C / T, cycle time) (e.g., D1+D2+D3+D4 in FIG. 5).

[0083] According to one embodiment, referring to FIG. 5, the reheating process (430) may be a process of reheating a lens cooled to a cooling temperature (e.g., T2 in FIG. 5) in the cooling process (420).

[0084] In one embodiment, the reheat treatment process (430) may be performed at a different temperature (e.g., T3 of FIG. 5) than the heating temperature of the heat treatment process (410). In some embodiments, such reheat treatment may provide a heat treatment (or annealing) process or effect. In one embodiment, the reheat treatment process (430) may be performed at a lower heating temperature (e.g., T2 of FIG. 5) than the heating temperature of the heat treatment process (410) (e.g., T1 of FIG. 5). In some embodiments, the heating temperature of the reheat treatment process (430) (e.g., T3 of FIG. 5) may be about -5°C to about -30°C lower than the heating temperature of the heat treatment process (410) (e.g., T1 of FIG. 5).

[0085] In one embodiment, the reheat treatment process (430) may have a lower heating rate than the heat treatment process (410) and may provide a temperature profile with a gentle temperature rise slope. In one embodiment, the heating rate of the reheat treatment process (430) may be from about 0.05°C / min to about 1°C / min.

[0086] In one embodiment, the reheat treatment process (430) may have a shorter holding time (e.g., H1 in FIG. 5) than the heat treatment process (410) (e.g., D1 in FIG. 5). In one embodiment, the reheat treatment process (430) may be performed with a holding time (e.g., H1 in FIG. 5) of about 30 seconds or more; about 1 minute or more; about 5 minutes or more; about 10 minutes or less; about 8 minutes or less; or about 3 minutes or less after heating to a heating temperature (e.g., T3 in FIG. 5), or a recooling process (440) immediately after heating to a heating temperature (e.g., T3 in FIG. 5). In some embodiments, the reheat treatment process (430) may include no holding time (e.g., H1 in FIG. 5) or a short holding time of about 1 minute or less.

[0087] According to one embodiment, the reheat treatment process (430) can remove factors that cause birefringence, such as molding stress (e.g., current stress), during the injection molding process by stabilizing the structure of the lens by applying the temperature, time, or both mentioned above.

[0088] According to one embodiment, the reheat treatment process (430) can improve the birefringence of the lens and secure dimensional stability by using a gentle temperature gradient (e.g., temperature increase rate) and a short residence time, thereby improving the performance of the lens.

[0089] According to one embodiment, the recooling process (440) can provide a temperature profile having a gentle temperature decrease slope with a lower cooling rate than the cooling process (420). That is, the recooling process (440) can cool in a slow cooling manner that cools more slowly than the cooling process (420). This can eliminate birefringence through tissue stabilization through repeated heating and cooling. According to one embodiment, the recooling process (440) can cool at a cooling rate of about 0.05 °C / min to about 0.2 °C / min (i.e., minus (-) units are omitted) (e.g., D4 in FIG. 5) (however, when H1 is applied, D4 applies from H1 onward).

[0090] According to one embodiment, the recooling process (440) may cool to a temperature (e.g., T4 in FIG. 5) that is about -30° C. to about -50° C. (e.g., temperature difference between T3 and T4 in FIG. 5) lower than the temperature of the reheating process (430) (e.g., T3 in FIG. 5).

[0091] According to one embodiment, the heat treatment process (410) may be performed for about 10% to about 20% of the total process time (C / T) (e.g., D1+D2+D3+D4 in FIG. 5), including the heat treatment process (410), the cooling process (420), the reheat treatment process (430); and the recooling process (440).

[0092] According to one embodiment, the cooling process (420) may be performed for about 15% or less; about 10% or less; or about 8% or less of the total process time (C / T) (e.g., D1+D2+D3+D4 in FIG. 5) including the heat treatment process (410), the cooling process (420), the reheat treatment process (430); and the recooling process (440).

[0093] According to one embodiment, the manufacturing method of the present disclosure can reduce the process time through two-step heat treatment (or heating), eliminate birefringence caused by residual stress, etc., through tissue stabilization of the lens, and cause no or little dimensional change (e.g., change in aspherical quality and outer diameter, etc.) of the lens. According to one embodiment, the heat treatment process (410) and the re-heat treatment process (430) can have different heating rates, different heating temperatures (e.g., T1 and T3), or both.

[0094] In some embodiments, the cooling process (420) and the recooling process (440) may have different cooling rates, different cooling temperatures, or both. In some embodiments, the cooling process (420) may be a rapid cooling process with a faster cooling rate than the recooling process (440).

[0095] Example

[0096] The injected lens was subjected to heat treatment (i.e., annealing), rapid cooling, reheat treatment (i.e., annealing), and slow cooling processes according to the temperature profile of Fig. 5 and the process conditions presented in Table 1. The total process time (C / T) was approximately 12 hours.

[0097] The injected lens is a plastic lens, injection-molded with acrylic resin, and has a refractive index of approximately 1.494 and a transition temperature (e.g., glass transition temperature) of approximately 120°C.

[0098] Table 2 shows the dimensions and properties of the lenses measured before and after heat treatment. In addition, the phase difference before and after heat treatment is measured, as shown in Fig. 6a (injected lens) and Fig. 6b (lens treated with the two-step heat treatment process of Table 1).

[0099] Heat treatment processQuick cooling processReheat treatment processSlow cooling processTarget temperature (℃)Time (h)Target temperature (℃)Cooling rate (℃ / min)Target temperature (℃)Heating rate (℃ / min)Target temperature (℃)Cooling rate (℃ / min)1102h800.2 ~ 0.251000.1 ~ 0.15800.1 ~ 0.15

[0100] Before heat treatment (injected lens) After heat treatment (after the process treatment in Table 1) Measured value Measured value Change Phase difference (nm) 257.8-17.2 Outer diameter (mm) 43.948 43.88 10.067 Center thickness (mm) 5.00 15.007-0.006 Aspheric A 12.25 38 10.48 21.772 Aspheric B (Aspheric AS (㎛)) 9.48 75 (8 ㎛) 5.766 (3 ㎛) 3.722 (5 ㎛) Mohs hardness (2000g, Mohs hardness) Not measurable Scratch occurred at Mohs hardness 4 - Pencil hardness (surface roughness ㎛) HB and H (Ra: 0.42) HB and H (Ra: 0.45) - Dupont hardness (GIT 100 g)665.7693.327.6

[0101] (1) DuPont hardness was measured using a DuPont hardness tester (test standard: ASTM D 2794).

[0102] (2) Pencil hardness was measured using the ASTM D3363 test standard by checking the scratch-free hardness at a speed of 60 mm / min under a vertical load of 1 kg using a pencil hardness meter.

[0103] (3) Mohs hardness was measured using a standardized method using a Mohs hardness scale.

[0104] (4)AS (Astigmatism) is a lens (radius: approx. 35) Aspheric measurement error using my X-axis and Y-axis values.

[0105] (5) The phase difference value is the average value measured at three wavelengths: 523 nm, 543 nm, and 575 nm.

[0106] Examining Table 2, it can be seen that the two-step heat treatment process according to the embodiments of the present disclosure eliminates birefringence of the plastic lens, thereby reducing the phase difference. Furthermore, the short process time of approximately 12 hours minimizes dimensional changes and improves the performance of the plastic lens.

[0107] In addition, it can be confirmed from FIGS. 6a and 6b that a plastic lens with significantly improved phase difference (average: 7.8 nm and maximum: 33.6 nm) was obtained through a two-step heat treatment process.

[0108] According to one embodiment, the two-step heat treatment process according to embodiments of the present disclosure (e.g., the manufacturing method of FIG. 4 and the temperature profile of FIG. 5) can reduce dimensional changes in a plastic lens and improve the strength (e.g., Mohs hardness, pencil hardness, etc.) of the lens. In addition, the present disclosure can provide an aspherical plastic lens with improved aspherical quality and resolution by reducing astigmatism through the two-step heat treatment process according to embodiments of the present disclosure.

[0109] In one embodiment, the plastic lens may have a minimum (or average) phase difference of about 20 nm (nanometer) or less; about 18 nm (nanometer) or less; about 15 nm (nanometer) or less; about 13 nm (nanometer) or less; about 12 nm (nanometer) or less; about 10 nm (nanometer) or less; about 8 nm (nanometer) or less; or about 5 nm (nanometer) or less. In some embodiments, the plastic lens may have a phase difference of 1 nm (nanometer) to about 20 nm (nanometer). In some embodiments, the plastic lens may have a maximum phase difference of greater than about 20 nm (nanometer) to about 80 nm (nanometer); about 21 nm (nanometer) to about 80 nm (nanometer); about 25 nm (nanometer) to about 80 nm (nanometer); about 30 nm (nanometer) to about 80 nm; It may be about 35 nm(nanometer) to about 80 nm(nanometer); about 35 nm(nanometer) to about 75 nm(nanometer); about 35 nm(nanometer) to about 60 nm(nanometer); or about 40 nm(nanometer) to about 55 nm(nanometer). In some embodiments, the phase difference value of the plastic lens is measured within a wavelength range of about 500 nm(nanometer) to about 600 nm(nanometer).

[0110] In one embodiment, a plastic lens may be manufactured by a manufacturing method according to embodiments of the present disclosure (e.g., the manufacturing method of FIG. 4 and the temperature profile of FIG. 5). In one embodiment, the plastic lens may have a dimensional change of about 20% or less; about 15% or less; about 10% or less; about 8% or less; about 5% or less; about 3% or less; or about 1% or less; about 0.5% or less; or about 0.1% or less; or about 0% before and after processing by a manufacturing method according to embodiments of the present disclosure. In some embodiments, the dimensional change may be a radius (or diameter), a thickness, or an aspherical characteristic (e.g., astigmatism (AS)) of the lens. In some embodiments, a manufacturing method according to embodiments of the present disclosure may reduce the dimensional change while reducing the process time.

[0111] According to one embodiment, the plastic lens is an aspherical lens having astigmatism (AS) of about 5 micrometers (μm) or less; about 4 micrometers (μm) or less; about 3 micrometers (μm) or less; or about 2 micrometers (μm) or less, and may be a pancake lens.

[0112] According to one embodiment, referring to FIG. 7, FIG. 7 illustrates a configuration of a lens module (500) according to one embodiment, wherein the lens module (500) may include a single or multiple plastic lenses (510, 510a, 501b, 510c); a polarizing plate (520) and optical elements (530a and 530b).

[0113] According to one embodiment, the plastic lenses (510, 510a, 501b, 510c) may be pancake lenses. According to one embodiment, at least one of the plastic lenses (510, 510a, 501b, 510c) may have a polarizing plate (520) disposed thereon, for example, the polarizing plate (520) may be laminated onto the plastic lens (510).

[0114] According to one embodiment, the lens module (500) may be a pancake lens module that selectively reduces the optical path through transmission and reflection. The pancake lens may be a plastic lens in which the birefringence is eliminated and the dimensional change is reduced through the manufacturing method according to the embodiments of the present disclosure (e.g., the manufacturing method of FIG. 4 and the temperature profile of FIG. 5), thereby improving the performance of the lens.

[0115] According to one embodiment, the optical elements (530a and 530b) may correspond to optical components for optical control (e.g., optical path, luminance, blocking, reflection, etc.) of a light source (e.g., a display). In some embodiments, the optical elements may include optical elements of a transmissive type, optical elements of a reflective type, optical elements of an absorptive type, etc. In some embodiments, the optical elements (530a and 530b) may be selected from those known in the art of the present disclosure, i.e., may include, but are not limited to, reflectors, polarizers, mirrors, etc.

[0116] According to one embodiment, the plastic lens may be manufactured by a method according to embodiments of the present disclosure (e.g., the manufacturing method of FIG. 4 and the temperature profile of FIG. 5).

[0117] According to one embodiment, an electronic device including a plastic lens may be provided. In one embodiment, the electronic device may be a virtual reality device. In some embodiments, the electronic device may be a virtual reality headset (e.g., a wearable electronic device (200) or a wearable electronic device (300) of FIG. 2) or a head-mounted display (HMD) (e.g., a light output module (211) of FIG. 2 or a display (321) of FIGS. 3A and 3B).

[0118] According to one embodiment, the plastic lens can provide a compact plastic lens module (e.g., lens module (500) of FIG. 7) with improved performance by eliminating birefringence (e.g., phase difference) due to accumulation of residual stress generated during the injection process and reducing dimensional changes (e.g., outer diameter or thickness) due to a heat treatment (or annealing) process.

[0119] In the related technical field, plastic injection lenses are manufactured by injecting molten injection resin through the gate of an injection molding machine and molding it. Injection lenses molded in this way can experience increased birefringence due to accumulated molding stress (e.g., residual stress) around the lens shape and the gate. In the case of pancake lenses used as plastic injection lenses in the related technical field, polarizing films can be used to reduce the optical path. However, the distance from the display to the human eye is shorter than that of other lenses, and the screen of a small display is greatly magnified, so the effect of birefringence is greater than that of other lenses. This birefringence can cause ghosting and deteriorate contrast ratio performance as more light enters the lens. In the related technical field, annealing of plastic lenses requires a long process time (e.g., a C / T (cycle time) of approximately 20 hours or more) because it is performed slowly after a long period of residence at a high temperature, which can result in significant dimensional changes in the lens.

[0120] Accordingly, according to embodiments of the present disclosure, a method for manufacturing a plastic lens (e.g., a method for manufacturing a plastic lens of FIG. 4 and a temperature profile of FIG. 5) can reduce a process time (e.g., C / T of about 12 hours) and lower a phase difference of a lens through a two-stage heat treatment process (or annealing process) in which rapid cooling and slow cooling processes are introduced. According to one embodiment, the method for manufacturing a plastic lens can lower birefringence (e.g., phase difference) due to accumulation of residual stress generated during an injection process. According to one embodiment, the method for manufacturing a plastic lens can improve the quality and performance of the lens because dimensional changes (e.g., outer diameter or thickness, etc.) due to the heat treatment process (or annealing process) are small or almost non-existent. According to one embodiment, the method for manufacturing a plastic lens can provide a plastic lens (e.g., a pancake lens) with improved resolution and clarity by securing aspherical quality (e.g., lowering an astigmatism (AS) value).

[0121] According to embodiments of the present disclosure, a plastic lens provides a compact plastic lens module, and can be used as an electronic device such as a virtual reality device (e.g., a wearable electronic device (200) of FIG. 2 or a wearable electronic device (300) of FIG. 3), and can reduce the size (e.g., volume or thickness) thereof.

[0122] According to embodiments of the present disclosure, a method for manufacturing a plastic lens (e.g., a method for manufacturing a plastic lens of FIG. 4 and a temperature profile of FIG. 5) may include a process for heat-treating a lens (410); a process for cooling a heated lens (420); a process for re-heat-treating a cooled lens (430); and a process for re-cooling a re-heat-treated lens (440).

[0123] According to one embodiment, the heating temperature (T1) of the heat treatment process (410) may be about -10°C to about -20°C lower than the Tg (glass transition temperature) of the lens.

[0124] According to one embodiment, the heating temperature (T1) of the heat treatment process (410) may be from about 90° C. to about 140° C.

[0125] According to one embodiment, the cooling process (420) may be cooling to a temperature (T2) that is about -30° C. to about -50° C. lower than the temperature (T1) of the heat treatment process (410) (e.g., the temperature difference between T1 and T2).

[0126] According to one embodiment, the heating temperature (T3) of the reheating process (430) may be lower than the heating temperature (T1) of the heat treatment process (410).

[0127] According to one embodiment, the heating temperature (T3) of the reheating process (430) may be lower than the heating temperature of the heat treatment process (410) by about -5° C. to about -30° C. (e.g., the temperature difference between T1 and T3).

[0128] According to one embodiment, the reheat treatment process (430) may have a lower heating rate than the heat treatment process (410).

[0129] According to one embodiment, the heating rate of the reheat treatment process (430) may be from about 0.5°C / min to about 10°C / min.

[0130] In one embodiment, the recooling process (440) may have a lower cooling rate than the cooling process (420).

[0131] According to one embodiment, the recooling process (440) may be cooling at a cooling rate of about 0.05 °C / min to about 0.2 °C / min (wherein, minus (-) is omitted).

[0132] According to one embodiment, the holding time (D1) of the heat treatment process (410), the heat treatment process (410), the cooling process (420), the reheat treatment process (430); and the recooling process (440) may be maintained at about 10% to about 20% of the total process time (D1+D2+D3+D4).

[0133] In one embodiment, the reheat treatment process (430) may have a shorter holding time than the heat treatment process (410).

[0134] According to embodiments of the present disclosure, the plastic lens may include a phase difference of about 20 nm (nanometer) or less.

[0135] In one embodiment, the minimum value of the phase difference of the plastic lens may be about 20 nm((nanometer)) or less, and the maximum value may be greater than about 20 nm((nanometer)) to about 80 nm((nanometer)).

[0136] According to one embodiment, the plastic lens may be an aspherical lens having astigmatism (AS) of 5 ㎛ (micrometer) or less.

[0137] According to one embodiment, the plastic lens may be manufactured by a method according to embodiments of the present disclosure (e.g., the method for manufacturing a plastic lens of FIG. 4 and the temperature profile of FIG. 5). According to one embodiment, the plastic lens may provide a compact plastic lens module (e.g., a pancake lens module) with improved performance by reducing dimensional changes (e.g., outer diameter or thickness, etc.) due to a heat treatment (or annealing) process while reducing birefringence (e.g., phase difference) due to accumulation of residual stress generated during the injection molding process.

[0138] According to embodiments of the present disclosure, an electronic device (e.g., a wearable electronic device (200) or a wearable electronic device (300) of FIG. 2) may include a lens module (500) including a plastic lens (510, 510a, 510b, and 510c) according to embodiments of the present disclosure; and a polarizing plate (520) on the plastic lens.

[0139] In one embodiment, the lens module (500) may be a pancake lens module.

[0140] In one embodiment, the electronic device may be a virtual reality (VR) device.

[0141] In one embodiment, the electronic device may be a virtual reality headset (e.g., the wearable electronic device (200) of FIG. 2 or the wearable electronic device (300) of FIG. 3).

[0142] In one embodiment, the electronic device may be a head mounted display (HMD) (e.g., the light output module (211) of FIG. 2 or the display (321) of FIGS. 3A and 3B).

[0143] According to one embodiment, an electronic device including a plastic lens, i.e., a virtual reality headset (e.g., a wearable electronic device (200) of FIG. 2 or a wearable electronic device (300) of FIG. 3) can be manufactured in a compact and slim glasses-type form by applying a compact plastic lens module (e.g., a pancake lens module).

[0144] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0145] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0146] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0147] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0148] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be available through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0149] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. Process of heat treating the lens; A process of cooling a heated lens; A process for reheating a cooled lens; and A process of recooling a reheat-treated lens; A method for manufacturing a plastic lens, comprising:

2. In paragraph 1, A method for manufacturing a plastic lens, wherein the heating temperature of the heat treatment process is -10°C to -20°C lower than the Tg (glass transition temperature) of the lens.

3. In any one of paragraphs 1 and 2, A method for manufacturing a plastic lens, wherein the heating temperature of the above heat treatment process is 90°C to 140°C.

4. In any one of paragraphs 1 to 3, A method for manufacturing a plastic lens, wherein the cooling process is performed at a temperature of -30°C to -50°C lower than the temperature of the heat treatment process.

5. In any one of paragraphs 1 to 4, A method for manufacturing a plastic lens, wherein the heating temperature of the above reheat treatment process is lower than the heating temperature of the above heat treatment process.

6. In any one of paragraphs 1 to 5, A method for manufacturing a plastic lens, wherein the heating temperature of the above reheat treatment process is -5 ℃ to -30 ℃ lower than the heating temperature of the above heat treatment process.

7. In any one of paragraphs 1 to 6, A method for manufacturing a plastic lens, wherein the above reheat treatment process has a lower heating rate than the above heat treatment process.

8. In any one of paragraphs 1 to 7, A method for manufacturing a plastic lens, wherein the heating rate of the above reheat treatment process is 0.05 ℃ / min to 1 ℃ / min.

9. In any one of paragraphs 1 to 8, A method for manufacturing a plastic lens, wherein the recooling process has a lower cooling rate than the cooling process.

10. In any one of paragraphs 1 to 9, A method for manufacturing a plastic lens, wherein the above recooling process is performed at a cooling rate of 0.05 ℃ / min to 0.2 ℃ / min.

11. In any one of paragraphs 1 to 10, A method for manufacturing a plastic lens, wherein the holding time of the above reheat treatment process is shorter than that of the above heat treatment process.

12. A plastic lens comprising a phase difference of 20 nm or less.

13. In paragraph 12, The minimum value of the phase difference of the above plastic lens is 20 nm (nanometer) or less, and the maximum value is more than 20 nm (nanometer) to 80 nm (nanometer), The above plastic lens is an aspherical lens having astigmatism (AS) of 5 ㎛ (micrometer) or less.

14. In any one of paragraphs 12 to 13, A plastic lens, wherein the plastic lens is manufactured by the method of any one of claims 1 to 11.

15. A plastic lens according to any one of claims 12 to 14; and A polarizing plate on the above plastic lens; A lens module comprising; Including, An electronic device, wherein the lens module is a pancake lens module.

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