Heat dissipation module, heat dissipation device including same, RF module for antenna, antenna device, and lighting device

Abstract

The present invention relates to a heat dissipation module, a heat dissipation device including same, an RF filter for an antenna, an antenna device, and a lighting device. The heat dissipation module includes a heat conduction panel body having a refrigerant flow space which is a closed space in which a refrigerant is filled and circulates while undergoing phase-change between gas and liquid to emit heat. The refrigerant flow space includes: a first section which is an evaporation area for receiving heat from a heating element that is a heat dissipation target; and a second section which is a path through which a liquid refrigerant condensed from a gaseous state to a liquid state in the refrigerant flows to the first section by surface tension or gravity. The heating element is coupled to the outside of the heat conduction panel body corresponding to the first section in any one of a fitting method and a bonding method.

Description

Heat dissipation module and heat dissipation device including the same, RF module for antenna, antenna device and lighting device

[0001] The present invention relates to a heat dissipation module and a heat dissipation apparatus including the same, an RF module for an antenna, an antenna apparatus and a lighting apparatus (HEAT DISSIPATION MODULE AND HEAT DISSIPATION APPARATUS, RF MODULE FOR ANTENNA, ANTENNA APPARATUS AND LIGHTING APPARATUS INCLUDING THE SAME HEAT DISSIPATION MODULE), and more particularly, to a heat dissipation module including the same, an RF module for an antenna, an antenna apparatus and a lighting apparatus, which can rapidly discharge system operating heat from an installation space to the outside to further improve the performance of a device when a distributed arrangement design for a limited installation space of heating elements according to electrical operation is required.

[0002] In general, an electronic device (electronic device) is a device or appliance that is powered by electrical energy.

[0003] The interior of such electronic devices (electronic devices) contains functional elements that are driven by the electrical energy supplied as the main system operating components and generate a predetermined driving heat.

[0004] However, it is already well known that the main performance of electronic devices (electronic equipment) depends on dissipating the driving heat generated from the above-mentioned functional elements as quickly and effectively as possible. However, the recent trend in the design of electronic devices (electronic equipment) is toward miniaturization and compactness, and since the area where heat dissipation mainly occurs is different for each electronic device (electronic equipment) due to its unique function, there is a problem that greatly limits the diversity of product design in that the trend is to design the electronic device (electronic equipment) to have concentrated heat dissipation using a part of the electronic device (electronic equipment).

[0005] A representative electronic device (electronic device) having such functional elements and a configuration requiring heat dissipation may include a wireless communication device (e.g., an antenna device) manufactured by the applicant of the present invention.

[0006] In particular, in antenna devices, which are representative electronic devices, beam forming is a signal processing technology that focuses a directional signal on a specific location or receiver. In general, an array antenna is used in which multiple radiating elements are arranged to implement a sharp beam pattern by multiple radiating elements. Here, in order to make the beam narrower, the antenna elements are arranged in a sub-array form, and an RF chain is provided for each sub-array.

[0007] Meanwhile, as low-orbit satellite communication services for drones and urban air traffic (UAM) become more active in the future, a living area of ​​about 200 to 300 meters above the ground will be formed, and to respond to this, antennas will also need to cover an area higher than their installation location.

[0008] However, when the antenna elements are equipped as a sub-array, the tilting range (or steering range) of the vertical beam is very limited to about ±10 degrees (based on 64TRx), and there is a problem that sidelobe and scan loss phenomena occur when forced tilting.

[0009] To solve these problems, there is a trend toward a digital control method that controls each individual antenna unit in the digital stage. In this case, the amount of heat generated by individual functional elements (e.g., heat generating elements) increases further, making the issue of heat dissipation to prevent performance degradation of the functional elements more urgent.

[0010] This is also one of the major problems in lighting devices, which perform the main function of directly converting electrical energy into light energy.

[0011]

[0012] The present invention has been devised to solve the above-mentioned technical problem, and its purpose is to provide a heat dissipation module capable of providing diversity in the layout design of internal main functional elements of an electronic device (electronic device), a heat dissipation device including the same, an RF module for an antenna, an antenna device, and a lighting device.

[0013] In addition, another object of the present invention is to provide a heat dissipation module capable of preventing performance degradation of functional elements by quickly and efficiently dissipating system operation heat generated from functional elements provided in a closed installation space to the outside, a heat dissipation device including the same, an RF module for an antenna, an antenna device, and a lighting device.

[0014] In addition, the present invention provides an RF module for an antenna and an antenna device including the same, which can expand the tilting range of a vertical beam by individually controlling the signals of each radiating element in a digital stage by corresponding an RF chain to each signal of each radiating element when an electronic device is implemented as an antenna device, and which can implement Massive MIMO for 5G-Advanced to 6G next-generation communications by improving and applying a heat dissipation structure that efficiently dissipates heat generated from a heating surface of an antenna unit. Another object of the present invention is to provide an antenna device including the same.

[0015] The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0016] A heat dissipation module according to one embodiment of the present invention comprises a heat-conducting panel body having a refrigerant flow space, which is a space in which a refrigerant is filled therein and the refrigerant circulates in a closed space to release heat by changing phases, wherein the refrigerant flow space comprises: a first section, which is an evaporation region that receives heat from a heating element that is a heat dissipation target; and a second section, which is a path through which a liquid refrigerant condensed from a gaseous state to a liquid state among the refrigerants flows to the first section by surface tension or gravity, and the heating element is coupled to an outer side of the heat-conducting panel body corresponding to the first section by either a fitting method or a bonding method.

[0017] Here, the first section of the refrigerant flow space may be disposed within an inner space in which the heating elements are disposed, and the second section of the refrigerant flow space may be disposed such that at least a portion thereof is physically exposed to an outer space partitioned from the inner space.

[0018] In addition, when the inner space and the outer space are physically partitioned by the housing body, the first section of the refrigerant flow space may be positioned relatively lower with respect to the direction of gravity, but may be disposed in the inner space of the housing body, and the second section of the refrigerant flow space may be positioned relatively upper with respect to the direction of gravity, but may be disposed to be exposed to the outer space outside the housing body.

[0019] In addition, the refrigerant flow space may be formed such that the first section and the second section are mutually connected so that the refrigerant circulates in a gas-liquid manner from the lower end of the first section to the upper end of the second section as the phase changes.

[0020] In addition, when a part of the heat-conducting panel body corresponding to the first section is defined as an inner heat dissipation part, the inner heat dissipation part may be provided with either a heat pipe in which a refrigerant is filled and the filled refrigerant undergoes a phase change and circulates a gas-liquid, or a first phase change fin.

[0021] In addition, the first phase change pin may have one side made of SUS material and the other side made of Cu material.

[0022] In addition, when a part of the heat-conducting panel body corresponding to the second section is defined as an external heat dissipation part, the external heat dissipation part may be provided with a second phase change fin that is connected to the first section and in which the refrigerant that has been phase-changed into a gaseous refrigerant from the first section exchanges heat with the outside air and condenses into a liquid refrigerant.

[0023] Additionally, the second phase change pin may have one side made of SUS material and the other side made of Cu material.

[0024] According to one embodiment of the present invention, a heat dissipation device includes a functional element that is electrically driven and performs a predetermined function, a plurality of device modules that are provided to control the functional elements by module, and a heat dissipation module that is vertically or horizontally coupled to the device modules so as to discharge heat generated from heating surfaces of heating elements provided in the functional device modules, wherein the heat dissipation module includes a heat-conducting panel body having a refrigerant flow space, which is a space in which a refrigerant is filled therein and the refrigerant circulates in a gas-liquid manner to discharge heat while changing phases within a closed space, wherein the refrigerant flow space includes a first section that is an evaporation region that receives heat from a heating element that is a heat dissipation target; and a second section that is a path through which a liquid refrigerant that is condensed from a gaseous state to a liquid state flows to the first section by surface tension or gravity, and the heating element may be coupled to an outer side of the heat-conducting panel body corresponding to the first section by any one of a fitting method and a bonding method.

[0025] Here, the first section of the refrigerant flow space may be disposed within an inner space in which the heating elements are disposed, and at least a portion of the second section of the refrigerant flow space may be disposed to be physically exposed to an outer space partitioned from the inner space.

[0026] In addition, when the inner space and the outer space are physically partitioned by the housing body, the first section of the refrigerant flow space may be positioned relatively lower with respect to the direction of gravity, but may be disposed in the inner space of the housing body, and the second section of the refrigerant flow space may be positioned relatively upper with respect to the direction of gravity, but may be disposed to be exposed to the outer space outside the housing body.

[0027] In addition, the refrigerant flow space may be formed such that the first section and the second section are mutually connected so that the refrigerant circulates in a gas-liquid manner from the lower end of the first section to the upper end of the second section as the phase changes.

[0028] In addition, when a part of the heat-conducting panel body corresponding to the first section is defined as an inner heat dissipation part, the inner heat dissipation part may be provided with either a heat pipe in which a refrigerant is filled and the filled refrigerant undergoes a phase change and circulates a gas-liquid, or a first phase change fin.

[0029] In addition, the first phase change pin may have one side made of SUS material and the other side made of Cu material.

[0030] In addition, when a part of the heat-conducting panel body corresponding to the second section is defined as an external heat dissipation part, the external heat dissipation part may be provided with a second phase change fin that is connected to the first section and in which the refrigerant that has been phase-changed into a gaseous refrigerant from the first section exchanges heat with the outside air and condenses into a liquid refrigerant.

[0031] Additionally, the second phase change pin may have one side made of SUS material and the other side made of Cu material.

[0032] According to one embodiment of the present invention, an RF module for an antenna comprises: a plurality of antenna units including a radiating element having at least one polarization, an RF chain corresponding to each polarization of the radiating element so as to individually control the polarization of the radiating element; and a heat dissipation module coupled in a vertical or horizontal direction to the antenna unit so as to discharge heat generated from heating surfaces of heating elements provided in adjacent antenna units for each polarization; wherein the heat dissipation module comprises a heat-conductive panel body having a refrigerant flow space, which is a space in which a refrigerant is filled therein and the refrigerant circulates in a gas-liquid manner to discharge heat while changing phases within a closed space, wherein the refrigerant flow space comprises: a first section which is an evaporation region that receives heat from a heating element as a heat dissipation target; and a second section which is a path through which a liquid refrigerant condensed from a gaseous state to a liquid state flows to the first section by surface tension or gravity; and the heating element is coupled to an outer side of the heat-conductive panel body corresponding to the first section by any one of a fitting method and a bonding method.

[0033] According to another embodiment of the present invention, an RF module for an antenna includes a radiating element having a plurality of polarizations, an RF chain corresponding to each polarization of the radiating element, and a heat dissipation module for discharging heat generated from a plurality of heating elements vertically arranged with their heating surfaces facing left and right on one side of a plurality of RF filters involved in one polarization among a plurality of antenna units that are stacked on each other and a plurality of adjacent antenna units, the heat dissipation module including a heat-conducting panel body having a refrigerant flow space, which is a space in which a refrigerant is filled therein and the refrigerant circulates in a gas-liquid manner to release heat while changing phases within a closed space, wherein the refrigerant flow space includes a first section, which is an evaporation region that receives heat from the heating element as a heat dissipation target, and a second section, which is a path through which a liquid refrigerant condensed from a gaseous state to a liquid state among the refrigerant flows to the first section by surface tension or gravity, and the heating element is coupled to an outer side of the heat-conducting panel body corresponding to the first section by any one of a fitting method and a bonding method.

[0034] Here, the plurality of antenna units may each include a first polarization antenna unit involved in one polarization of the radiating element equipped to radiate a dual polarization beam, and a second polarization antenna unit involved in the other polarization of the radiating element equipped to radiate a dual polarization beam.

[0035] In addition, the first polarized antenna unit and the second polarized antenna unit include a plurality of one-side RF filters that are stacked in a single row in the vertical direction and are vertically arranged in a tile-like structure so that the longitudinal ends are positioned front and back respectively, and a plurality of other-side RF filters that are stacked in a single row in the vertical direction so that the left and right sides of one of the plurality of one-side RF filters are stacked in a single row in the vertical direction and are vertically arranged in a tile-like structure so that the longitudinal ends are positioned front and back respectively, and among the plurality of one-side RF filters and the plurality of other-side RF filters, the filters that are stacked in the tile-like structure at the same position in the vertical direction can constitute two RF channels.

[0036] In addition, the plurality of antenna units further include a PA board having one side feed line and the other side feed line for supplying a predetermined electrical signal to the plurality of one-side RF filters and the plurality of other-side RF filters constituting the two RF channels, and heating elements involved in one of the two RF channels mounted on one of both sides, and the PA board can be stacked in the tile-like structure on one of the left and right sides of the plurality of one-side RF filters and the plurality of other-side RF filters.

[0037] Additionally, the plurality of heating elements mounted on the PA board may include at least one of a PA (Power Amplifier), an LNA (Low Noise Amplifier), and an RFIC.

[0038] In addition, the heat dissipation module is stacked and arranged in surface thermal contact with the outer surface of the PA board of each of the first polarized antenna unit and the second polarized antenna unit, so as to receive and dissipate heat generated from the plurality of heating elements.

[0039] In addition, the heat dissipation module may include an inner heat dissipation part that is in surface thermal contact with one side of the PA board on which the plurality of heating elements are mounted, and an outer heat dissipation part that radiates heat transferred from the inner heat dissipation part by exchanging it with the outside air.

[0040] In addition, the inner heat dissipation part and the outer heat dissipation part can be formed to be connected to each other so that a refrigerant is filled inside and the filled refrigerant circulates in a gas-liquid manner.

[0041] In addition, the inner heat dissipation unit may be provided with one of a plurality of heat pipes and a first phase change fin of a plate-type heat exchanger in which a refrigerant is filled therein and the filled refrigerant is phase-changed and circulated into a gas-liquid state.

[0042] In addition, the inner heat dissipation part and the outer heat dissipation part may be provided with a second phase change fin of a plate-type heat exchanger type that is formed to be mutually connected so that a refrigerant is filled therein and the filled refrigerant circulates from the inner heat dissipation part to the outer heat dissipation part in a gaseous and liquid form.

[0043] In addition, the inner heat dissipation part equipped with the first phase change fin of the plate-type heat exchanger type may be equipped with one side that is in surface thermal contact with one side of the PA board and made of Cu material, and the other side that is not in surface thermal contact with one side of the PA board and made of SUS material.

[0044] In addition, the outer heat dissipation part and the inner heat dissipation part equipped with the second phase change fin of the plate-type heat exchanger type may be equipped with both sides made of SUS material.

[0045] In addition, the outer heat dissipation part equipped with the second phase change fin of the plate-type heat exchanger type may be equipped with both sides made of SUS material, and the inner heat dissipation part equipped with the second phase change fin of the plate-type heat exchanger may be equipped with one side that is in surface thermal contact with one side of the PA board made of Cu material, and the other side that is not in surface thermal contact with one side of the PA board may be equipped with SUS material.

[0046] In addition, the inner heat dissipation part and the outer heat dissipation part are manufactured by joining the edges of two metal panel members manufactured by a press molding method to form a refrigerant flow space in which the refrigerant is filled therein, and the two metal panel members may be formed with a plurality of strength reinforcing parts processed and formed by a press molding method to reinforce their own rigidity and to be mutually joined at least within the refrigerant flow space.

[0047] In addition, when the two metal panel members are made of Cu material or SUS material, the coolant may be water.

[0048] In addition, the radiating element includes a first polarized element connected to a signal transmitted along the one-side feed line and arranged to be connected to the plurality of one-side RF filters, and a second polarized element connected to a signal transmitted along the other-side feed line and arranged to be connected to the plurality of other-side RF filters, and the first polarized element and the second polarized element can be mounted on the front ends of the plurality of one-side RF filters and the plurality of other-side RF filters with one end and the other end intersecting with each other.

[0049] In addition, the front surfaces of the plurality of one-side RF filters and the plurality of other-side RF filters can perform the function of a reflector that reflects the beam emitted from the radiating element forward.

[0050] In addition, the radiating element is arranged to partition between the plurality of one-side RF filters and the plurality of other-side RF filters and the first polarized element and the second polarized element, and further includes a base panel supporting the first polarized element and the second polarized element, and the base panel can have a forward protrusion height at which radiation beams emitted from the first polarized element and the second polarized element are blocked from being emitted to adjacent radiating elements.

[0051] Additionally, the base panel can be supported forward by the PA board.

[0052] According to another embodiment of the present invention, an RF module for an antenna comprises a first polarized antenna unit and a second polarized antenna unit including a radiating element having dual polarization, an RF chain corresponding to each polarization of the radiating element so as to individually control the dual polarization of the radiating element, and a heat dissipation module for discharging heat generated from heating surfaces of heating elements provided in the first polarized antenna unit and the second polarized antenna unit, wherein the heat dissipation module is of a plate-type heat exchange type, and the heating elements of the first polarized antenna unit and the second polarized antenna unit are arranged on one side and the other side so as to be in surface thermal contact with each other.

[0053] Here, the first polarized antenna unit and the second polarized antenna unit include a plurality of one-side RF filters that are stacked in a single row in the vertical direction and are vertically arranged in a tile-like structure so that the longitudinal ends are positioned front and back respectively, and a plurality of other-side RF filters that are stacked in a single row in the vertical direction so that the left and right sides of one of the left and right sides of the plurality of one-side RF filters are stacked in a single row in the vertical direction and are vertically arranged in a tile-like structure so that the longitudinal ends are positioned front and back respectively, and among the plurality of one-side RF filters and the plurality of other-side RF filters, the filters that are stacked in the tile-like structure at the same position in the vertical direction can constitute two RF channels.

[0054] In addition, the plurality of antenna units further include a PA board having one side feed line and the other side feed line for supplying a predetermined electrical signal to the plurality of one-side RF filters and the plurality of other-side RF filters constituting the two RF channels, and heating elements involved in one of the two RF channels mounted on one of both sides, and the PA board can be stacked in the tile-like structure on one of the left and right sides of the plurality of one-side RF filters and the plurality of other-side RF filters.

[0055] In addition, the single heat dissipation module may include an inner heat dissipation part that is in surface thermal contact with one side of the PA board on which the plurality of heating elements are mounted, and an outer heat dissipation part that dissipates heat transferred from the inner heat dissipation part by exchanging it with the outside air.

[0056] In addition, the one-side RF filter and the other-side RF filter are formed such that the front-to-back width length is longer than the front-to-back width length of the inner heat dissipation part of the heat dissipation module, and the first polarized antenna unit and the second polarized antenna unit can be coupled to one side and the other side of the single heat dissipation module, respectively, with the PA boards involved in the two RF channels interposed therebetween by fixing screws that are fastened through the front coupling flange and the rear coupling flange formed at the front and rear ends of the one-side RF filter and the other-side RF filter.

[0057] According to one embodiment of the present invention, an antenna device includes an antenna housing body in the shape of a box having an open front and an installation space formed inside, a digital board having a rear surface tightly laminated and coupled to the installation space, wherein heating elements are mounted and arranged on at least one of the two sides, and an RF module for an antenna electrically connected to the digital board for signals, wherein the two sides are vertically arranged in the up-and-down direction so that each of the two sides faces left and right in the installation space, wherein the RF module for an antenna includes a plurality of antenna units including a radiating element having at least one polarization, an RF chain corresponding to the polarization of each of the radiating elements so as to individually control the polarization of the radiating element, and a heat dissipation module coupled in a vertical or horizontal direction to the antenna unit so as to discharge heat generated from heating surfaces of heating elements provided in a plurality of adjacent antenna units for each polarization, wherein the heat dissipation module includes an inner heat dissipation part that extends into the installation space and receives and conducts heat from the heating elements, and an outer heat dissipation part that extends to the outside of the installation space and exchanges heat transferred from the inner heat dissipation part with air (outside air) in an external space.

[0058] Here, the plurality of antenna units may each include a first polarization antenna unit involved in one polarization of the radiating element equipped to radiate a dual polarization beam, and a second polarization antenna unit involved in the other polarization of the radiating element equipped to radiate a dual polarization beam.

[0059] In addition, the first polarized antenna unit and the second polarized antenna unit include a plurality of one-side RF filters that are stacked in a single row in the vertical direction and are vertically arranged in a tile-like structure so that the longitudinal ends are positioned front and back respectively, and a plurality of other-side RF filters that are stacked in a single row in the vertical direction so that the left and right sides of one of the plurality of one-side RF filters are stacked in a single row in the vertical direction and are vertically arranged in a tile-like structure so that the longitudinal ends are positioned front and back respectively, and among the plurality of one-side RF filters and the plurality of other-side RF filters, the filters that are stacked in the tile-like structure at the same position in the vertical direction can constitute two RF channels.

[0060] In addition, the plurality of antenna units further include a PA board having one side feed line and the other side feed line for supplying a predetermined electrical signal to the plurality of one-side RF filters and the plurality of other-side RF filters constituting the two RF channels, and heating elements involved in one of the two RF channels mounted on one of both sides, and the PA board is arranged in a tile-like structure in a stacked manner on one of the left and right sides of the plurality of one-side RF filters and the plurality of other-side RF filters, and the inner heat dissipation part of the heat dissipation module can be arranged in a tile-like structure in a stacked manner so as to be in surface thermal contact with the outer surface of the PA board.

[0061] In addition, a hydrogen socket portion for electrically connecting a socket pin with the digital board may be provided at the rear end of the front and rear width directions of the PA board, and the digital board may be provided with a female socket portion to which the hydrogen socket portion of the PA board is connected with a socket pin.

[0062] In addition, among the heat dissipation modules, the outer heat dissipation part is exposed to the external space through the upper part of the antenna housing body, and a guide slot may be formed long in the front-back direction on the upper part of the antenna housing body to guide insertion when the PA board is connected to the digital board with a socket pin.

[0063] In addition, the outer heat dissipation part of the heat dissipation module may further include a finger guard panel assembly coupled to the antenna housing body so as to surround the outer heat dissipation part exposed to the external space through the upper portion of the antenna housing body and not contact the outer heat dissipation part exposed to the external space through the upper portion of the antenna housing body.

[0064] In addition, the finger guard panel assembly is provided to shield the entire remaining portion except for the front portion of the outer heat dissipation portion exposed to the upper portion of the antenna housing body, and further includes a radome panel that shields the open front portion of the antenna housing body and is provided with a material through which a beam emitted from the radiating element is transmitted, wherein a radome extension panel that shields the front portion of the outer heat dissipation portion that is not shielded by the finger guard panel assembly may be integrally formed on the upper portion of the radome panel.

[0065] Additionally, at least a portion of the finger guard panel assembly and the radome extension panel may be formed with a plurality of ventilation holes through which air from the external space passes.

[0066] According to another embodiment of the present invention, an antenna device includes an antenna housing body in the shape of a box having an open front and an installation space formed inside, a digital board having a rear surface tightly laminated and coupled to the installation space and having heating elements mounted on at least one of the two surfaces, and an RF module for an antenna electrically connected to the digital board in a signal manner, the two surfaces being vertically arranged in the up-and-down direction so that each of the two surfaces faces left and right in the installation space, wherein the RF module for an antenna includes a first polarized antenna unit and a second polarized antenna unit including a radiating element having a dual polarization, an RF chain corresponding to each polarization of the radiating element so as to individually control the dual polarization of the radiating element, and a heat dissipation module for discharging heat generated from the heating surfaces of the heating elements provided in the first polarized antenna unit and the second polarized antenna unit, wherein the heat dissipation module is a plate-type heat exchanger, and the heating elements of the first polarized antenna unit and the second polarized antenna unit are arranged on one side and the other side so as to be in surface thermal contact with each other.

[0067] According to one embodiment of the present invention, a lighting device includes a lighting body in the shape of a box having one side open for irradiating light and an installation space formed therein, an LED substrate provided in the installation space of the lighting body and having LED elements mounted and arranged on at least one side of both sides, and an LED module electrically signal-connected to the LED substrate and vertically arranged in the installation space, wherein the LED module includes a heat dissipation module vertically or horizontally coupled to one side or the other side of the LED substrate to discharge heat generated from a heat-generating surface of the LED elements mounted on the LED substrate, wherein the heat dissipation module includes an inner heat dissipation part that extends into the installation space and receives and conducts heat from the LED elements, and an outer heat dissipation part that extends to the outside of the installation space and exchanges heat transferred from the inner heat dissipation part with air (outside air) in an external space.

[0068]

[0069] According to one embodiment of the present invention, a heat dissipation module, a heat dissipation device including the same, an RF module for an antenna, an antenna device, and a lighting device have the effect of ensuring diversity in the layout design of internal main functional elements of an electronic device (electronic device).

[0070] In addition, the present invention has the effect of preventing performance degradation of functional elements by quickly and efficiently dissipating system operation heat generated from functional elements provided in a closed installation space to the outside.

[0071] In addition, the present invention has the effect of significantly increasing the tilting range of the vertical beam by individually controlling the signal of each radiating element in the digital section without constructing the radiating elements as a sub-array.

[0072] In addition, the present invention can efficiently dissipate heat generated from the heating surface of the antenna unit, and has the effect of implementing Massive MIMO for 5G-Advanced to 6G next-generation communications without increasing the size of the antenna device by stacking a large number of antenna units in a stack-up and tile-type structure.

[0073]

[0074] FIG. 1A and FIG. 1B are perspective views showing the front and rear exteriors of an antenna device according to one embodiment of the present invention.

[0075] Figures 2a and 2b are exploded perspective views of Figures 1a and 1b, respectively.

[0076] Figure 3 is a perspective view showing the configuration of Figure 1a with the radome panel and finger guard panel assembly removed.

[0077] Fig. 4 is an exploded perspective view of Fig. 3, showing the combined appearance of the unit RF chain unit of the configuration of Fig. 3 to the antenna housing body.

[0078] Fig. 5 is a rear perspective view showing the hydrogen socket portion of the unit RF chain unit of Fig. 4.

[0079] Figure 6 is a left and right perspective view showing the unit RF chain unit of Figure 4.

[0080] Figures 7a and 7b are exploded perspective views of (a) and (b) of Figure 6,

[0081] Figure 8 is a perspective view showing an antenna unit according to polarization of a radiating element.

[0082] Figures 9a and 9b are exploded perspective views of (a) and (b) of Figure 8,

[0083] Figure 10 is a front view of Figure 3,

[0084] Fig. 11 is a cross-sectional view taken along line AA of Fig. 10,

[0085] Fig. 12 is a cutaway perspective view taken along line AA of Fig. 10.

[0086] Figure 13 is a side view (a) of Figure 8, a cross-sectional view (b) taken along line BB, and an enlarged view of the portion thereof.

[0087] FIG. 14 is a perspective view showing another embodiment of an antenna unit among the configurations of an RF module (100) for an antenna according to one embodiment of the present invention.

[0088] Figure 15 is an exploded perspective view of Figure 14,

[0089] Fig. 16 is a cross-sectional view taken along line CC of Fig. 14.

[0090] FIG. 17 is a partially cut-away perspective view and a partially enlarged perspective view at different angles showing a lighting device (1a) including a heat dissipation module (150) according to one embodiment of the present invention.

[0091]

[0092] <Explanation of symbols>

[0093] 1: Antenna device 10: Antenna housing body

[0094] 10S: Installation space 15: Digital board

[0095] 16: Female socket 17: Guide slot

[0096] 20: Radome panel 25: Radome extension panel

[0097] 26,36: Vent holes 30: Finger guard panel assembly

[0098] 100: RF module for antenna 110: Antenna unit

[0099] 120: Radiating element 130: RF filter

[0100] 135: Creamshell cover 140: PA board

[0101] 145: Heating elements (PA elements) 150: Heat dissipation module

[0102] 151: Inner heat dissipation part 152: Outer heat dissipation part

[0103] 153,154: Strength reinforcement 155: Frame

[0104]

[0105] Hereinafter, a heat dissipation module and a heat dissipation device including the same, an RF module for an antenna, an antenna device, and a lighting device according to one embodiment of the present invention will be described in detail with reference to the attached drawings.

[0106] When assigning reference numerals to components in each drawing, it should be noted that identical components are assigned the same numerals whenever possible, even if they appear on different drawings. Furthermore, when describing embodiments of the present invention, if a detailed description of a related known configuration or function is deemed to hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0107] In describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this application.

[0108] For example, in order to explain specific embodiments of the present invention, the following referenced FIGS. 1A to 16 illustrate only an antenna device among representative products manufactured by the applicant of the present invention and a lighting device among representative products manufactured by an affiliate of the applicant of the present invention as examples, as it is difficult to illustrate all types of electronic devices (electronic equipment) of which there are many, and the meaning and scope of rights thereof should not be interpreted as being limited in a formal manner.

[0109]

[0110] FIG. 1a and FIG. 1b are perspective views showing the front and rear exteriors of an antenna device according to one embodiment of the present invention, FIG. 2a and FIG. 2b are exploded perspective views of FIG. 1a and FIG. 1b, respectively, and FIG. 3 is a perspective view showing a state in which the radome panel and finger guard panel assembly of the configuration of FIG. 1a are removed.

[0111] One embodiment of the present invention relates to a heat dissipation module (150) for dissipating heat generated from functional elements of an electronic device (electronic device) (e.g., see PA element (145) and LED element (145a) described below) to the outside.

[0112] More specifically, a heat dissipation module (150) according to one embodiment of the present invention may include a heat conducting panel body (not shown in the drawing) having a refrigerant flow space (see drawing reference numeral '158' of FIG. 13 described below), which is a space in which a refrigerant is filled inside and circulates in a gas-liquid manner to release heat while the refrigerant undergoes a phase change within a closed space, as shown in FIGS. 1A to 3.

[0113] Here, the refrigerant flow space (158) may include a first section (not shown in the drawing) which is an evaporation area that receives heat from a heat generating element (see PA element (145) and LED element (145a) described later) as a heat dissipation target, and a second section (not shown in the drawing) which is a path through which liquid refrigerant condensed from a gaseous state to a liquid state flows to the first section by surface tension or gravity.

[0114] More specifically, the first section of the refrigerant flow space (158) is positioned closest to the heating elements (145, 145a) and is a section where the heating elements (145, 145a) are connected directly or through a predetermined intermediate configuration, and can be given the function of a section that serves as a kind of connection end, and the second section is a section of the refrigerant flow space (158) other than the first section, and can be given the function of a space where the refrigerant flows so as to circulate in a gas-liquid manner in an entirely closed space.

[0115] A heating element (145, 145a) can be connected to the outside of the heat-conducting panel body corresponding to the first section by either a fitting method or a bonding method.

[0116] For example, the fitting method for the first section is such that the joining end corresponding to the first section is fitted into the support housing bar (170), which is a joining medium component of the heat-conducting panel body, as shown in FIG. 17 described later, and at this time, it is preferable that the first section be set as the closest part to the heating elements (145, 145a).

[0117] The method of fitting the first section and the heating elements (145, 145a) described above will be described in more detail later.

[0118] Meanwhile, the first section of the refrigerant flow space (158) can be placed within an inner space (corresponding to the installation space (10S) of the antenna housing body (10) described later) where heating elements (145, 145a) are placed.

[0119] Additionally, the second section of the refrigerant flow space (158) may be arranged so that at least a portion thereof is physically exposed to the outer space (installation space (10S)) and partitioned.

[0120] Here, the inner space is a space where heat generated from functional elements (heat generating elements (components corresponding to drawing symbols '145' and '145a') that drive electronic devices (electronic equipment) is directly emitted, and can be interpreted as a closed space such as the installation space (10S) of the antenna housing body (10) described below.

[0121] In addition, the outer space is a space physically separated from the installation space (10S) of the antenna housing body (10), and can be a concept contrasted with a space in which outside air (external air) flows freely.

[0122] Here, when the inner space and the outer space are physically partitioned by the housing body (same configuration as the antenna housing body (10)) (10), the first section of the refrigerant flow space (158) may be positioned relatively lower with respect to the direction of gravity, but may be disposed in the inner space of the housing body (10), and the second section of the refrigerant flow space (158) may be positioned relatively upper with respect to the direction of gravity, but may be disposed to be exposed to the outer space outside the housing body (10).

[0123] However, since the refrigerant is filled inside the refrigerant flow space (158) as described above, the first section and the second section can be formed to be connected to each other so that the refrigerant changes phase and flows in a gas-liquid circulating manner from the lower end of the first section to the upper end of the second section.

[0124] In this way, since the refrigerant must circulate in a gas-liquid manner between the first and second sections of the refrigerant flow space (158), it is preferable that the heat-conducting panel body be formed integrally, but it is not necessary that the heat-conducting panel body be formed integrally from the first section to the second section.

[0125] For example, when a part of the heat-conducting panel body corresponding to the first section is defined as an inner heat dissipation portion (151), the inner heat dissipation portion (151) may be provided with either a heat pipe filled with refrigerant and the filled refrigerant undergoing a phase change and circulating into a gas-liquid state, or a first phase change fin. In this case, the refrigerant of the first section and the refrigerant of the second section may be independently connected.

[0126] However, even if the first section and the second section are connected, the heat-conducting panel body does not need to be formed integrally, and in this case, when a part of the heat-conducting panel body corresponding to the second section is defined as an outer heat-dissipating portion (152), the outer heat-dissipating portion (152) may be separately manufactured and provided as a second phase-change fin that is connected to the first section and in which the refrigerant that has been phase-changed into a gaseous refrigerant from the first section exchanges heat with the outside air and condenses into a liquid refrigerant.

[0127] Meanwhile, the first phase change pin and the second phase change pin may have one surface made of SUS material and the other surface made of Cu material.

[0128] In particular, in the case where the heating surfaces of the heating elements (145) for the first section of the heat-conducting panel body are joined in a surface thermal contact bonding manner, it is preferable that the surface (other surface) with which the heating surfaces of the heating elements (145) are in direct contact be made of Cu material having relatively high thermal conductivity, and the opposite surface (one surface) be made of SUS material.

[0129] Next, a heat dissipation device according to one embodiment of the present invention will be described in detail.

[0130] A heat dissipation device (not indicated in the drawing) according to one embodiment of the present invention, as referenced in FIGS. 1A to 3, comprises a functional element (referring to a radiating element (120) and a heating element (PA element (145)) for beam forming irradiation of the antenna device (1) of FIGS. 1A to 13, which will be described later, and a heating element (LED element (145a)) of a lighting device (1a) of FIG. 17, which will be described later) that is electrically driven and performs a predetermined function, a plurality of device modules (referring to the antenna unit (110) of FIGS. 1A to 13, which will be described later, and the LED module (110a) of FIG. 17, which will be described later) that are provided to control the functional elements (145, 145a) by module, and a device module (110, 110a) that discharges heat generated from the heating surfaces of the heating elements (145, 145a) provided in the functional device modules (110, 110a) in a vertical or horizontal direction with respect to the device modules (110, 110a). It includes a combined heat dissipation module (150).

[0131] Since the heat dissipation module (150) here has been sufficiently described above, a detailed description of the overlapping parts will be omitted, and below, the antenna device (1) and the lighting device (1a), which are representative electronic devices (electronic devices) to which the heat dissipation module (150) according to one embodiment of the present invention can be directly applied, are described, which are representative products manufactured by the applicant of the present invention.

[0132] An antenna device (1) according to one embodiment of the present invention, as shown in FIGS. 1A to 3, may have a plurality of radiating elements (120) arranged in an array antenna form in the vertical and left-right directions on the front of the installation space (10S) of the antenna housing body (10).

[0133] An array antenna refers to an antenna that arranges a plurality of radiating elements (120) at predetermined locations according to a certain pattern, and radiates a beam in a predetermined direction by adjusting the phase and size, etc. according to the arrangement location of each radiating element (120).

[0134] The individual radiating elements (120) may be provided as dual polarization elements in which feeder points (not shown) are arranged in an X shape diagonally to form a ±45 degree polarization beam.

[0135] Such individual radiating elements (120) are each involved in the transmission and reception signals of 2T2R, and as shown in FIGS. 2A to 3, eight are arranged in the upper and lower directions of the front surface of the antenna housing body (10) and eight are arranged in the left and right directions of the front surface, thereby enabling implementation of Massive MIMO for 5G-Advanced to 6G next-generation communications with a total of 128 TRx transmission channels.

[0136] As a similar type of antenna device, we can cite the AESA radar, which is a core piece of equipment installed on the KF-X and a fighter jet radar that has been under development by the Agency for Defense Development since 2016.

[0137] AESA stands for Active Electronically Scanned Array, which means active electronically scanned phased array, and the TR module (TRM) including antenna elements can be phased arrayed in brick type and tile type.

[0138] Typically, a brick-type phased array may include a PA (Power Amplifier) ​​element, an LNA element, a phase / gain controller, and a digital transmit / receive control unit.

[0139] Here, the brick-type phased array is a two-dimensional structure that is arranged in a plane by mounting the PA elements and LNA, phase / gain controller, and digital transmission / reception control elements described above on one board so that the transmission and reception signals are transmitted in a parallel direction on the same plane as the system module.

[0140] Meanwhile, the tile-type phased array is a form close to a general type of phased array applied to the Massive MIMO technology manufactured by the applicant of the present invention, and it can be said that the RF module and antenna device for the antenna described below are included in the scope of rights within an equal range in terms of the heat dissipation function of the AESA radar.

[0141] In general, beamforming can be divided into digital beamforming and analog beamforming. Analog beamforming is a method of forming a beam by branching an analog signal that has undergone digital signal processing into multiple paths and setting the phase shift and power amplifier in each path. It consists of a transmission and reception system structure consisting of one RF chain and multiple phase shifters and signal attenuators.

[0142] Analog beamforming is a method that shapes and directs beams by varying the phase shift and the phase and amplitude values ​​of signal attenuators connected to each individual antenna. This analog beamforming technique suffers from system performance and cost-effectiveness due to the limited resolution of phase shift and the high cost of components. Furthermore, it is structurally incompatible with high-capacity spatial multiplexing transmission techniques.

[0143] In contrast, digital beamforming is a technique that forms beams at the digital stage using baseband processing of a base station to maximize diversity and multiplexing gain. In addition, digital beamforming does not use RF circuits such as phase shifters or signal attenuators, and digital beamforming techniques based on this system structure can change the angle of the beam by changing the phase and amplitude of the signal through digital signal processing at the baseband, rather than changing the phase and amplitude of the signal at the RF stage.

[0144] In particular, the RF chain functions to modulate signals suitable for transmission using a radio frequency antenna or to convert signals received via an antenna element (radiating element) into signals suitable for sampling and baseband processing.

[0145] However, in order to configure each RF chain, it is essential to have a filter, a power amplifier (PA), a low noise amplifier (LNA), and an RFIC (especially, the RFIC is configured to include a digital to analog converter (DAC) / analog to digital converter (ADC), a mixer, etc.), and in order to implement 128TRx equipment that can be applied to 5G-Advanced or 6G next-generation communications Massive MIMO beyond 64TRx equipment, the number of RF chains increases rapidly, which raises issues regarding heat dissipation and size.

[0146] That is, the size of the antenna device is determined by frequency band, and if each component for a large number of RF chains that are increased to fit that size are mounted on a flat board such as a main board, the number of mounted components becomes too large, which in effect increases the size of the antenna device, or there is a problem that they have no choice but to be mounted densely and concentratedly in a limited size.

[0147] In particular, in the case of an array antenna with a large number of RF chains, in the past, it was implemented as a sub-array to narrow the antenna beam, and not only did the number of radiating elements increase as the additional sub-arrays were implemented, but the design of the feeding line also became complicated, and there was a problem that an analog adjustment type phase shifter must be installed for phase adjustment between the existing array antenna and the sub-array.

[0148] For reference, the antenna device of the additional implementation of the sub-array also has an advantageous aspect in forming a narrow beam desired by the designer and increasing the gain for evaluating the performance of the antenna device, and although the steering angle of the horizontal beam based on 68TRx is desirable at ±45 degrees, the tilting angle of the vertical beam is limited to a very small range of about ±10 degrees, which is an issue that makes it unsuitable for low-orbit satellite communication services for recent drones or urban air traffic (UAM), where the living area is formed at about 200 to 300 m from the ground.

[0149] In addition, the increase in the number of components described above ultimately leads to a problem of heat dissipation of system heat inside the antenna housing body (10). Since it is difficult to construct a heat dissipation structure for beam radiation in the forward direction, a heat dissipation structure is constructed in which most of the heat generated from the heat generating elements is dissipated to the rear side through a plurality of heat sink fins (11) integrally formed on the rear side of the antenna housing body (10).

[0150] Therefore, the limitations of the rear-side concentrated heat dissipation structure ultimately lead to limitations in the application of Massive MIMO technology for 5G-Advanced or 6G next-generation communications with transmission channels of 128TRx, which is realistically acting as a major difficulty in product manufacturing and design.

[0151] An antenna device (1) according to one embodiment of the present invention proposes a new concept of technical configuration that forms a narrow beam desired by a designer in response to the number of RF channels implemented based on 128TRx without constructing the above-described sub-array, and also constructs an effective heat dissipation system.

[0152] An antenna device (1) according to one embodiment of the present invention includes, as referenced in FIGS. 1A to 3, an antenna housing body (10) in the shape of a rectangular parallelepiped having an open front and an installation space (10S) formed inside, a digital board (15) whose rear surface is laminated and tightly bonded to the installation space (10S) of the antenna housing body (10) and on which heating elements are mounted and arranged on at least one of both surfaces, and an RF module (100) for an antenna that is electrically signal-connected to the digital board (15) and on which both surfaces are vertically arranged in the up-and-down direction so that each of the two surfaces faces left and right in the installation space (10S).

[0153] Here, the installation space (10S) formed in the antenna housing body (10) may be formed to be long in the vertical direction, and the width of the left and right ends may be formed to be greater than the thickness in the front-back direction. The front of the installation space (10S) is open, and a radome panel (20) described later may be combined to shield the installation space (10S).

[0154] Meanwhile, the digital board (15) laminated and bonded to the installation space (10S) of the antenna housing body (10), despite its name, can be understood as a concept that includes both general PCBs and PBAs. However, it should be noted that in one embodiment of the present invention, the name is given because the heating elements that perform analog functions in the RF module (100) for the antenna are mounted separately from the heating elements mounted on the digital board (15).

[0155] Although not shown in the drawing, the heating elements mounted on the digital board (15) may be mounted distributed on the back surface of one of the two sides of the digital board (15) so that rear heat dissipation is smoothly achieved through a plurality of heat sink fins (11) integrally formed on the back surface of the antenna housing body (10). These heating elements may typically include FPGA elements, etc.

[0156] The antenna housing body (10) is made of a metal material with excellent thermal conductivity so that the system heat inside the installation space (10S) can be easily transferred to the outside, and a plurality of heat sink fins (11) can be formed integrally in a predetermined pattern shape on the back surface of the antenna housing body (10) to receive the system heat including the heating elements of the digital board (15) and increase the heat exchange area with the outside air at the rear.

[0157] An RF module (100) for an antenna according to one embodiment of the present invention may include a plurality of antenna units (see reference numeral '110' of FIG. 5) including a radiating element (120) having at least one polarization and an RF chain (not indicated in the drawing) corresponding to the polarization of each of the radiating elements (120) so as to individually control the polarization of the radiating element (120), as shown in FIGS. 1A to 3.

[0158] A plurality of antenna units (110) may be provided with a first polarization antenna unit (see reference numeral '110A' of FIG. 8 described below) involved in one polarization and a second polarization antenna unit (see reference numeral '110B' of FIG. 8 described below) involved in the other polarization, with eight radiating elements (120) arranged to implement 2TRx each, so as to implement a large number of RF channels corresponding to the 128TRx standard and to enable more beam radiation to be conducted without mutual interference.

[0159] The specific configuration and function of the first polarized antenna unit (110A) and the second polarized antenna unit (110B) will be described in more detail later.

[0160] Meanwhile, the RF module (100) for an antenna according to one embodiment of the present invention may further include a heat dissipation module (150) coupled in a vertical or horizontal direction to the antenna units (110) to discharge heat generated from the heating surfaces of heating elements (e.g., see PA element (145) described below) provided in a plurality of adjacent antenna units (110A, 110B) for each polarization, as shown in FIGS. 1A to 3.

[0161] Here, the heat dissipation module (150) may include a heat conducting panel body having a refrigerant flow space (158), which is a space in which refrigerant is filled inside and circulates in a gas-liquid manner to release heat while changing phases within a closed space, as described above.

[0162] In addition, the refrigerant flow space (158) may include a first section, which is an evaporation area that receives heat from heating elements (145) that are heat dissipation targets, and a second section, which is a path through which liquid refrigerant condensed from a gaseous state to a liquid state flows to the first section by surface tension or gravity.

[0163] Meanwhile, the heat dissipation module (150) may include an inner heat dissipation part (151) that extends into the installation space (10S) of the antenna housing body (10) to receive and conduct heat from the heating elements (145), as shown in FIGS. 1A to 3, and an outer heat dissipation part (152) that extends to the outside of the installation space (10S) to exchange heat transferred from the inner heat dissipation part (151) with air (outside air) in the external space.

[0164] Here, the inner heat dissipation section (151) can be defined as a concept including the first section and at least a part of the second section described above, and the outer heat dissipation section (152) can be defined as a concept including only the second section.

[0165] Fig. 4 is an exploded perspective view of Fig. 3, showing the combined appearance of the antenna housing body of the unit RF chain unit in the configuration of Fig. 3, and Fig. 5 is a rear perspective view showing the hydrogen socket part of the unit RF chain unit of Fig. 4.

[0166] A plurality of antenna units (110) are electrically connected to a digital board (15) that is stacked in modules in the installation space (10S) of the antenna housing body (10) as shown in FIGS. 4 and 5, and the inner heat dissipation part (151) of the heat dissipation module (150) described above may be positioned inside the installation space (10S) while the outer heat dissipation part (152) may be installed to be exposed to the outside of the antenna housing body (10) (more specifically, the upper outer space of the antenna housing body (10).

[0167] To this end, a guide slot (17) for installing a plurality of antenna units (110) in modules may be formed long in the front-back direction at the upper end of the antenna housing body (10). The process of installing a plurality of antenna units (110) into the antenna housing body (10) through the guide slot (17) will be described in more detail later.

[0168] Meanwhile, the antenna device (1) according to one embodiment of the present invention may further include a finger guard panel assembly (30) coupled to the antenna housing body (10) so as to surround and not contact the outer heat dissipation part (152) exposed to the external space through the upper portion of the antenna housing body (10) when the outer heat dissipation part (152) of the heat dissipation module (150) is installed so as to be exposed to the external space through the upper portion of the antenna housing body (10), as referenced in FIGS. 1A to 5 (particularly, FIGS. 2A and 2B).

[0169] The finger guard panel assembly (30) may be provided to shield the entire remaining portion except for the front portion of the outer heat dissipation portion (152) exposed to the upper portion of the antenna housing body (10).

[0170] More specifically, the finger guard panel assembly (30) may include a rear shielding panel (31) installed upright to shield the rear of the outer heat dissipation unit (152), as shown in FIGS. 2A and 2B , an upper shielding panel (32) connected to the upper end of the rear shielding panel (31) and installed horizontally to shield the upper end of the outer heat dissipation unit (152), and a left shielding panel (33) and a right shielding panel (34) connected at the rear end and the upper end to the rear shielding panel (31) and the upper shielding panel (32), respectively, and installed upright to shield the side of the outer heat dissipation unit (152) of the heat dissipation module (150) provided at the leftmost and rightmost of the antenna housing body (10) among a plurality of heat dissipation modules (150).

[0171] In addition, the finger guard panel assembly (30) may further include a rear lower mounting bar (35a) that mediates the connection between the lower end of the rear shielding panel (31) and the upper rear end of the antenna housing body (10), a rear upper mounting bar (35b) that mediates the connection between the upper end of the rear shielding panel (31) and the rear end of the upper shielding panel (32), a front upper mounting bar (35c) that mediates the connection between the front end of the upper shielding panel (32) and the upper end of the radome panel (20) described later, and a front lower mounting bar (35d) that mediates the connection between the radome extension panel (25) described later, which performs a function similar to that of the finger guard panel assembly (30) among the radome panels (20), and the upper front end of the antenna housing body (10).

[0172] At least a portion of the finger guard panel assembly (30) (in one embodiment of the present invention, the rear shield panel (31) and the upper shield panel (32)) may be formed with a plurality of ventilation holes (36) through which air (outside air) from the external space passes.

[0173] Meanwhile, the installation space (10S) of the antenna housing body (10) with an open front may be provided so as to be shielded by a radome panel (20), as shown in FIGS. 1A to 3.

[0174] The radome panel (20) protects various components provided inside the installation space (10S) from the external environment, but may be provided with a material through which the beam emitted from the radiating element (120) is smoothly transmitted.

[0175] Meanwhile, a radome extension panel (25) that shields the front portion of the outer heat dissipation portion (152) that is not shielded by the finger guard panel assembly (30) may be further formed integrally on the upper portion of the radome panel (20).

[0176] Here, it will be natural that a number of ventilation holes (26) through which air from the external space passes can be formed in the radome extension panel (25) to facilitate heat exchange with the external heat dissipation unit (152).

[0177] However, the area where the external heat dissipation part (152) is located, although it is a space shielded by the finger guard panel assembly (30) and the radome extension panel (25), can still be defined as an 'external space' in that external air can freely flow in and out through the aforementioned plurality of ventilation holes (36, 26).

[0178] Fig. 6 is a left and right perspective view showing the unit RF chain unit of Fig. 4, Figs. 7a and 7b are exploded perspective views of (a) and (b) of Fig. 6, Fig. 8 is a perspective view showing an antenna unit according to polarization of a radiating element, and Figs. 9a and 9b are exploded perspective views of (a) and (b) of Fig. 8.

[0179] Hereinafter, the RF module (100) for the antenna coupled to the digital board (15) in the installation space (10S) of the antenna housing body (10) will be described in detail as follows.

[0180] As referred to in FIGS. 6 to 10, an RF module (100) for an antenna according to one embodiment of the present invention includes a radiating element (120) having at least one polarization, a plurality of antenna units (110) including an RF chain corresponding to each polarization of the radiating element (120) so as to individually control the polarization of the radiating element (120), and a heat dissipation module (150) coupled in a vertical or horizontal direction to the antenna unit (110) so as to discharge heat generated from the heating surfaces of heating elements (e.g., refer to the PA element referred to by reference numeral '140') provided in a plurality of adjacent antenna units (110A or 110B) for each polarization.

[0181] Here, a plurality of antenna units (110) can be stacked and arranged in eight rows in the horizontal direction on the installation space (10S) of the antenna housing body (10).

[0182] The term 'lamination' used below is defined and explained as being divided into two types as follows.

[0183] For example, assuming that the radiation direction of the radiating element (120) is forward, and assuming that the installation space (10S) of the antenna housing body (10) is provided in the shape of a rectangular parallelepiped with an open front and a long vertical direction and a short width in the left-right direction, the continuous arrangement in the vertical direction is defined as a 'stack-up stacking', and the continuous arrangement in the left-right direction is defined as a 'tile-type structure stacking'.

[0184] However, the term “laminated” used in describing one embodiment of the present invention is merely a term used to more clearly understand the present invention, and the scope of the rights of the present invention should not be interpreted as being limited by the described term.

[0185] An RF module (100) for an antenna according to one embodiment of the present invention may include a first polarized antenna unit (110A) involved in one polarization of a radiating element (120) equipped to radiate a dual polarized beam, as referenced in FIGS. 1A to 9B, and a second polarized antenna unit (110B) involved in the other polarization of the radiating element (120) equipped to radiate a dual polarized beam.

[0186] Here, the first polarized antenna unit (110A) and the second polarized antenna unit (110B) may include a plurality of one-sided RF filters (130A) that are stacked in a single row in the vertical direction, but are vertically arranged in a tile-like structure so that the longitudinal ends are positioned front and back respectively, and a plurality of other-sided RF filters (130B) that are stacked in a single row in the vertical direction so that the left and right sides of the plurality of one-sided RF filters (130A) are stacked in a single row in the vertical direction, but are vertically arranged in a tile-like structure so that the longitudinal ends are positioned front and back respectively.

[0187] Additionally, a clamshell cover (135) may be placed on the outer surface of one side RF filter (130A) and the other side RF filter (130B) to block external signal interference with the adjacent PA board (140) and RF filter (130).

[0188] Meanwhile, the radiating element (120) may include a first polarization element (120a) arranged to be connected to a signal transmitted along one feed line and connected to a plurality of one-sided RF filters (130A), and a second polarization element (120b) arranged to be connected to a signal transmitted along the other feed line and connected to a plurality of one-sided RF filters (130B).

[0189] Here, the first polarized element (120a) and the second polarized element (120b) can be installed in the front end of a plurality of one-side RF filters (130A) and a plurality of other-side RF filters (130B) with one end and the other end intersecting each other.

[0190] In addition, the front surfaces of the plurality of one-sided RF filters (130A) and the plurality of other-sided RF filters (130B) can perform the function of a reflector that reflects the beam emitted from the radiating element (120) forward. That is, although not shown in the drawing, a predetermined metal film is integrally formed by applying it to the front surfaces of the plurality of one-sided RF filters (130A) and the plurality of other-sided RF filters (130B), thereby performing the reflector function itself.

[0191] Meanwhile, the radiating element (120) is arranged to partition between a plurality of one-side RF filters (130A) and a plurality of other-side RF filters (130B) and a first polarized element (120a) and a second polarized element (120b), and may further include a base panel (125) that supports the first polarized element (120a) and the second polarized element (120b).

[0192] Here, the base panel (125) may have a forward protrusion height at which radiation beams emitted from the first polarized element (120a) and the second polarized element (120b) are blocked from being emitted to adjacent radiation elements (120).

[0193] In particular, the base panel (125) can be installed to be supported forward by the PA board (140) among the configurations of multiple antenna units (110).

[0194] In this way, the filters (elements) stacked in a tile-like structure at the same position in the vertical direction among the plurality of one-side RF filters (130A) and the plurality of other-side RF filters (130B) constitute two RF channels.

[0195] More specifically, the antenna unit (110) is equipped with a combination of a one-side RF filter (130A) and an other-side RF filter (130B) that implement a 2T2R transmission path, and is arranged in a stacked and tiled structure with a plurality of (refer to the drawing reference numerals '101 to 108' of FIGS. 2A to 4) stacked up, thereby implementing a transmission path of a total of 128 TRx.

[0196] Each of the plurality of antenna units (110) may further include a single-sided feeder line and a single-sided feeder line (not shown) that supply a predetermined electrical signal to a plurality of single-sided RF filters (130A) and a plurality of single-sided RF filters (130B) that constitute two RF channels, and a PA board (140) on which heating elements involved in one of the two RF channels are mounted on one of both sides.

[0197] In particular, a plurality of power amplifier (PA) elements (145) as one of the power amplifier elements can be mounted on at least one side of the PA board (140), and heat generated from the PA elements (145) can be dissipated to the outside of the antenna housing body (10) by a heat dissipation module (150).

[0198] However, it is natural that the heating elements mounted on the PA board (140) are not necessarily limited to the PA element (145), and may further include either a low noise amplifier (LNA) or an RFIC.

[0199] Meanwhile, a hydrogen socket portion (146) for electrically connecting a socket pin to a digital board (15) may be provided at the rear end of the PA board (140) in the front-rear width direction. The hydrogen socket portion (146) may be formed in a shape that protrudes further rearward than the rear end of the PA board (140).

[0200] In addition, a female socket part (16) to which a male socket part (146) of a PA board (140) is connected by a socket pin may be provided on the front side of the digital board (15).

[0201] A plurality of antenna units (110) can be modularly coupled while being guided by a guide slot (17) provided at the top of the antenna housing body (10) to guide the insertion coupling when the PA board (140) is coupled to the digital board (15) by a socket pin, in that the outer heat dissipation part (152) of the heat dissipation module (150) is exposed to the external space through the upper part of the antenna housing body (10).

[0202] In this way, in the case of the antenna device (1) according to one embodiment of the present invention, unlike the case where digital elements and analog elements are centrally mounted without separation on a single board such as a digital board (15) arranged in the installation space (10S) of the antenna housing body (10), some of the heating elements (e.g., PA elements (145)) are distributed on the PA board (140) of each polarization antenna unit (the first polarization antenna unit (110A) and the second polarization antenna unit (110B)) among the plurality of antenna units (110) involved in each RF channel and arranged in a stack-up lamination and tile-type lamination manner, thereby creating an advantage of enabling individual control of beam forming for a large number of RF chains without implementing a sub-array.

[0203] In addition, the heat dissipation module (150) described later is designed and manufactured with a structure suitable for efficient external heat dissipation from the heating elements (145) of the PA board (140) arranged in a stack-up laminated and tile-type laminated manner, so that the individual control of beam forming for the large number of RF chains described above and the narrow design of each beam can be perfectly implemented.

[0204] More specifically, the heat dissipation module (150) is arranged in surface thermal contact with the outer surface of the PA board (140) of each of the first polarized antenna unit (110A) and the second polarized antenna unit (110B), as referenced in FIGS. 6 to 9B, and serves to receive and dissipate heat generated from a plurality of heating elements (145).

[0205] That is, the heat dissipation module (150) may include a first heat dissipation unit (150-1) arranged in surface thermal contact with the heating elements (145) mounted on the PA board (140) of the first polarized antenna unit (110A), and a second heat dissipation unit (150-2) arranged in surface thermal contact with the heating elements (145) mounted on the PA board (140) of the second polarized antenna unit (110B).

[0206] Therefore, between the first heat dissipation unit (150-1) and the second heat dissipation unit (150-2), one of a plurality of one-side RF filters (130A) and the other-side RF filters (130B) can be stacked and arranged in a different manner depending on the direction.

[0207] For example, on the inner surface of the first heat dissipation unit (150-1) facing the second heat dissipation unit (150-2), a plurality of one-sided RF filters (130A) involved in one polarization among dual polarizations may be stacked and laminated, and a one-sided PA board (140-1) involved in one polarization among dual polarizations may be arranged between the first heat dissipation unit (150-1) and the plurality of one-sided RF filters (130A).

[0208] Likewise, on the outer surface of the second heat dissipation unit (150-2), a plurality of other-side RF filters (130B) involved in the other polarization among the dual polarizations may be stacked and laminated, and a other-side PA board (140-2) involved in the other polarization among the dual polarizations may be placed between the second heat dissipation unit (150-2) and the plurality of other-side RF filters (130B).

[0209] In this way, the RF module (100) for an antenna according to one embodiment of the present invention may be provided so that the heat generated from the heating elements (145) of one side PA board (140-1) and the other side PA board (140-2) for each polarization is individually dissipated by the first heat dissipation unit (150-1) and the second heat dissipation unit (150-2), as shown in FIGS. 6 to 9b.

[0210] In particular, the bonding method that enables surface thermal contact between one side PA board (140-1) and the other side PA board (140-2) for each outer surface of the first heat dissipation unit (150-2) and the second heat dissipation unit (150-2) described above is not shown in the drawing, but the electronic component surface mounting technology of the POB (Package On Board) method can be applied.

[0211] However, in the case of the POB method, a soldering material (not shown) must be applied to bond between the outer surfaces of the first heat dissipation part (150-1) or the second heat dissipation part (150-2) of one-sided PA board (140-1) or the other-sided PA board (140-2) made of PCB material, and considering that heat transfer resistance inevitably occurs due to the applied soldering material, a bonding method in which the heating elements (145) directly mounted on one-sided PA board (140-1) or the other-sided PA board (140-2) make surface thermal contact with the outer surface of the first heat dissipation part (150-1) or the second heat dissipation part (150-2) may be more advantageous.

[0212] Hereinafter, an antenna unit (110) according to one embodiment is defined as one implemented to dissipate heat generated from the heating elements (145) of one side PA board (140-1) and the other side PA board (140-2) for each polarization by two heat dissipating parts (150-1, 150-2) as described above, and an embodiment to be described with reference to FIGS. 14 to 16 described below is defined as an antenna unit (1110) according to another embodiment.

[0213] That is, in the RF module (100) for antenna of the present invention, the antenna unit does not necessarily have to be equipped with two heat dissipation parts (150-1, 150-2) to perform heat dissipation for each polarization as in the above-described embodiment, and it may also be equipped so that the heat generating elements (145) of one PA board (140-1) and the other PA board (140-2) are arranged on the left and right sides of a single heat dissipation module (1150) so as to be in surface thermal contact at the same time. This will be described in more detail later.

[0214] In particular, the heat dissipation module (150) includes an inner heat dissipation part (151) that is in surface thermal contact with one side of a PA board (140) on which a plurality of heating elements (145) are mounted, and an outer heat dissipation part (152) that radiates heat transferred from the inner heat dissipation part by exchanging heat with the outside air, as has already been described in detail.

[0215] Fig. 10 is a front view of Fig. 3, Fig. 11 is a cross-sectional view taken along line AA of Fig. 10, Fig. 12 is a cutaway perspective view taken along line AA of Fig. 10, and Fig. 13 is a side view (a) of Fig. 8, a cross-sectional view (b) taken along line BB, and an enlarged view of a portion thereof.

[0216] The inner heat dissipation part (151) and the outer heat dissipation part (152) forming the heat dissipation module (150) can be formed to be connected to each other so that a refrigerant is filled therein and the filled refrigerant circulates in a gaseous state, as shown in FIGS. 10 to 13.

[0217] Here, the inner heat dissipation unit (151), although not shown in the drawing, may be provided with a plurality of heat pipes in which a refrigerant is filled inside and the filled refrigerant undergoes a phase change and circulates in a gas-liquid manner.

[0218] However, it is not necessary for the inner heat dissipation part (151) to be equipped with a heat pipe, and as shown in FIGS. 10 to 13, it may be equipped with a first phase change fin (not indicated by a separate drawing symbol) of a panel type heat exchanger (PTX) in which a refrigerant is filled inside and the filled refrigerant is phase-changed and circulated into a gas-liquid state.

[0219] In addition, the inner heat dissipation part (151) and the outer heat dissipation part (152) may be provided with a second phase change fin (not indicated by a separate drawing symbol) of a plate-type heat exchange type that is filled with refrigerant inside and is formed to be in communication with each other so that the filled refrigerant circulates in a gaseous and liquid form from the inner heat dissipation part (151) to the outer heat dissipation part (152), as shown in FIGS. 10 to 13.

[0220] Here, the inner heat dissipation part (151) and the outer heat dissipation part (152) can be manufactured by joining the edges (155) of two metal panel members manufactured by a press molding method to form a refrigerant flow space (158) in which refrigerant is filled inside.

[0221] In particular, two metal panel members may be formed with a plurality of strength reinforcing parts (153, 154) processed and formed by a press molding method to reinforce their own rigidity and to be mutually joined at least within the refrigerant flow space (158).

[0222] More specifically, a plurality of strength reinforcing members (153, 154) can be formed by protruding a predetermined length in a circular or oval shape toward the refrigerant flow space (158) through a press molding method on one surface of two metal panel members forming the inner heat dissipation member (151) and the outer heat dissipation member (152), respectively.

[0223] Here, the inner heat dissipation part (151) equipped with the first phase change fin of the plate-type heat exchanger may be equipped with a Cu material on one side that is in surface thermal contact with one side of the PA board (140), and a SUS material on the other side that is not in surface thermal contact with one side of the PA board (140). This is because, when the inner heat dissipation part (151) is equipped with only a SUS material, surface bonding between the SUS material and the PA board (140) is difficult, and therefore, a Cu material that is easy to bond to the PA board (140) may be adopted.

[0224] However, since the outer heat dissipation part (152) is not scheduled to have surface contact (surface thermal contact) with the PA board (140), and on the premise that the above-described disadvantages of surface bonding can be overcome, it is natural that the outer heat dissipation part (152) and the inner heat dissipation part (151) equipped with the second phase change fin of the plate-type heat exchanger type can be equipped with both sides made of SUS material.

[0225] For example, the outer heat dissipation part (152) equipped with the second phase change fin of the plate-type heat exchanger type may be equipped with both sides made of SUS material, and the inner heat dissipation part (151) equipped with the second phase change fin of the plate-type heat exchanger type may be equipped with one side that is in surface thermal contact with one side of the PA board (140) made of Cu material, and the other side that is not in surface thermal contact with one side of the PA board (140) may be equipped with SUS material.

[0226] Meanwhile, the refrigerant filled in the refrigerant flow space (158) of the heat dissipation module (150) may be water that does not chemically react with the metal material forming the two metal panel members. For reference, when water is used as the refrigerant, it is preferable to exclude aluminum (Al) from among the metal materials forming the heat dissipation module (150). This is because aluminum (Al) has a problem in that, due to its material characteristics, when it comes into contact with water, it causes an oxidation reaction and generates a predetermined amount of hydrogen gas, thereby increasing the internal pressure of the refrigerant flow space (158).

[0227] In this way, two metal panel members are processed and formed by a press molding method, and an inner heat dissipation part (151) of a heat dissipation module (150) in which a refrigerant is filled inside and a refrigerant flow space (158) in which the phase-changed refrigerant circulates in a gaseous state is formed, is provided so as to make surface thermal contact with one surface of a PA board (140) on which heating elements (145) separated from a digital board (15) are mounted, thereby inducing a rapid phase change of the filled liquid refrigerant into a gaseous refrigerant and causing the evaporated gaseous refrigerant to disperse and flow toward the outer heat dissipation part (152), thereby efficiently dissipating the system heat based on 128TRx.

[0228] Meanwhile, the refrigerant flow space (158) of the inner heat dissipation part (151) that is in surface thermal contact with one side of the PA board (140) may further include an absorber (not shown) that captures liquid refrigerant and evaporates the captured liquid refrigerant into gaseous refrigerant by heat transferred from the heating elements (145).

[0229] Here, it is preferable that the absorber be positioned so as to occupy only half of the thickness of the refrigerant flow space (158) of the inner heat dissipation portion (151) adjacent to the PA board (140).

[0230] This is to ensure that the liquid refrigerant actively vaporizes in half of the thickness of the refrigerant flow space (158) of the inner heat dissipation portion (151) equipped with an absorber, and then the gaseous refrigerant flows freely in the remaining half, thereby securing a flow path for the gaseous refrigerant toward the outer heat dissipation portion (152).

[0231] More preferably, when the inner heat dissipation part (151) is equipped with a first phase change fin of a plate-type heat exchange type, the absorber may be positioned only in the half portion corresponding to the portion in which one side of the PA board (140) and the surface in surface thermal contact are equipped with a Cu material.

[0232] FIG. 14 is a perspective view showing another embodiment of an antenna unit among the configurations of an RF module (100) for an antenna according to one embodiment of the present invention, FIG. 15 is an exploded perspective view of FIG. 14, and FIG. 16 is a cross-sectional view taken along line CC of FIG. 14.

[0233] Referring to FIGS. 14 to 16, an antenna unit (1110) according to another embodiment of the present invention may include a single heat dissipation module (1150) equipped with a plate-type heat exchange type, a one-side PA board (140-1) bonded to one side of the heat dissipation module (1150), and an other-side PA board (140-2) bonded to the other side of the heat dissipation module (1150).

[0234] In addition, an antenna unit (1110) according to another embodiment of the present invention may further include a one-sided RF filter (130A) laminated on an outer surface of one-sided PA board (140-1) and providing bonding force of one-sided PA board (140-1) to a single heat dissipation module (1150), and a second-sided RF filter (130B) laminated on an outer surface of the other-sided PA board (140-2) and providing bonding force of the other-sided PA board (140-2) to a single heat dissipation module (1150).

[0235] Here, the one-side PA board (140-1) and the one-side RF filter (130A) stacked on one side of a single heat dissipation module (1150) can function as a first polarization antenna unit (110A) involved in one polarization of a radiating element (120) equipped to radiate a dual polarization beam, and the other-side PA board (140-2) and the other-side RF filter (130B) stacked on the other side of the single heat dissipation module (1150) can function as a second polarization antenna unit (110B) involved in the other polarization of a radiating element (120) equipped to radiate a dual polarization beam.

[0236] The antenna unit (1110) according to another embodiment of the present invention is different from the antenna unit (110) according to one embodiment of the present invention, which is provided with two heat dissipation parts (150-1) and second heat dissipation parts (150-2) corresponding to heat dissipation modules (150) for each polarization, in that it is provided so as to simultaneously dissipate heat generated from heat generating elements (145) mounted on one side PA board (140-1) on the side of the first polarization antenna unit (110A) and heat generating elements (145) mounted on the other side PA board (140-2) on the side of the second polarization antenna unit (110B) through a single heat dissipation path.

[0237] Here, the bonding force for each of the heating elements (145) of the one-side PA board (140-1) and the other-side PA board (140-2) on one side and the other side of the single heat dissipation module (1150) can be provided through the bonding force between the one-side RF filter (130A) and the other-side RF filter (130B) described above.

[0238] More specifically, the one-side RF filter (130A) and the other-side RF filter (130B) can be formed such that the front-to-back width length is longer than the front-to-back width length of the inner heat dissipation part (1151) of the heat dissipation module (1150), as shown in FIGS. 15 and 16.

[0239] Here, a front coupling flange (131F-a, 131F-b) protruding further forward than the front end of the inner heat dissipation part (1151) and a rear coupling flange (131R-a, 131R-b) protruding further backward than the rear end of the inner heat dissipation part (1151) may be formed on the front end and rear end of one side RF filter (130A) and the front end and rear end of the other side RF filter (130B), respectively.

[0240] As shown in Fig. 16, a screw fastening hole (132) may be formed in the form of a through hole or fastening hole in the front coupling flange (131F-a, 131F-b) and the rear coupling flange (131R-a, 131R-b) to mutually screw-fasten one side RF filter (130A) and the other side RF filter (130B) by a fixing screw (133).

[0241] According to another embodiment of the present invention, an antenna unit (1110) having such a configuration, at least one side and the other side corresponding to the inner heat dissipation portion (1151) of a single heat dissipation module (1150) can be firmly supported from the outside through one side PA board (140-1) and the other side PA board (140-2) supported by one side RF filter (130A) and the other side RF filter (130B).

[0242] Accordingly, despite the change in internal pressure that occurs when the phase of the refrigerant in the refrigerant flow space (1158) provided inside the inner heat dissipation part (1151) changes, the rigidity of one side and the other side itself made of the metal panel member can be additionally reinforced.

[0243] In addition, the surface thermal contact between the heating elements (145) of one side PA board (140-1) and the other side PA board (140-2) can be more stably implemented by the fastening force when fastening through the above-described fixing screw (133).

[0244] In addition, the heat generated by the heating elements (145) of the first polarized antenna unit (110A) and the second polarized antenna unit (110B) involved in both dual polarizations can be effectively dissipated in a single heat dissipation module (1150), and the number of heat dissipation modules (1150) can be reduced compared to the antenna unit (110) according to one embodiment of the present invention, thereby providing the advantage of reducing the manufacturing cost of the product.

[0245] According to the RF module (100) for an antenna according to one embodiment of the present invention and the antenna device (1) including the same, beam forming of a single polarization unit radiating element (120) implemented with an RF channel of 128TRx can be individually controlled, and not only can the narrow design of the radiation beam be very simple without adding an additional configuration such as a sub-array, but also the system heat concentration phenomenon of heat generating elements concentratedly mounted on a single flat board (main board, etc.) is efficiently dissipated using a heat dissipation module (150) having an improved heat dissipation structure, thereby having the effect of implementing Massive MIMO for 5G-Advanced to 6G next-generation communications.

[0246] However, in the case of the RF module (100) for an antenna according to one embodiment of the present invention and the antenna device (1) including the same, even when a plurality of antenna units (110) are arranged in a stack-up lamination and tile-type lamination manner, the narrow design of the beam may be difficult depending on the density between each radiating element (120). Therefore, in this case, by increasing the distance between the radiating elements (120) slightly more than the ideal distance of 0.5λ (for example, 0.75λ), interference between beams radiated through adjacent RF channels can be minimized.

[0247] More specifically, the spacing between radiating elements having the same polarization characteristics is typically 0.5λ (where λ represents the wavelength at the center frequency point of the frequency band of the antenna array), but to ensure weak correlation, the larger the spacing, the better, and the spacing between rows (see 101 to 108) of adjacent radiating elements (120) can be adjusted in the range of 0.5λ to 1.0λ.

[0248] In addition, under the premise that the above-described heat dissipation problem due to the exponential increase in the RF chain can be effectively solved through the heat dissipation module (150), another theoretical solution may be to create a pencil beam by further reducing the angle of the radiation beam by increasing the number of radiating elements (120) in the vertical direction.

[0249] In this case, in the case of the RF module (100) for an antenna according to one embodiment of the present invention and the antenna device (1) including the same, 8 radiating elements (120) are arranged in the vertical direction to build an RF channel based on 128TRx. However, if the number of radiating elements (120) arranged in the vertical direction is added by 8 more, a total of 16 elements can be arranged to build an RF channel based on 256TRx. In addition, if the number of radiating elements (120) arranged is double that (32 elements in the array), a total of 32 elements can be arranged to build an RF channel based on 512TRx.

[0250] FIG. 17 is a partially cut-away perspective view and a partially enlarged perspective view at different angles showing a lighting device (1a) including a heat dissipation module (150) according to one embodiment of the present invention.

[0251] A lighting device (1a) including a heat dissipation module (150) according to one embodiment of the present invention may include, as referenced in FIG. 17, a lighting body (10) in the shape of a box having one side opened for irradiating light and an installation space (not indicated by a drawing symbol) formed inside, an LED substrate (140a) provided in the installation space of the lighting body (10) and having LED elements mounted and arranged on at least one side of both sides, and an LED module (110a) electrically connected to the LED substrate (140a) and vertically arranged in the vertical direction in the installation space.

[0252] Here, the LED module (110a) may include a heat dissipation module (150) that is vertically or horizontally coupled to one side or the other side of the LED substrate (140a) to discharge heat generated from the heating surface of the LED elements (145a) (heat generating elements) mounted on the LED substrate (140a).

[0253] The heat dissipation module (150) at this time may also include, as described above, an inner heat dissipation part (151) that extends into the installation space and conducts heat received from LED elements (145a) (heat generating elements), and an outer heat dissipation part (152) that extends to the outside of the installation space and exchanges heat transferred from the inner heat dissipation part (151) with the air (outside air) of the external space.

[0254] In addition, the refrigerant flow space (158) may include a first section, which is an evaporation area that receives heat from LED elements (145a) that are heat dissipation targets, and a second section, which is a path through which liquid refrigerant condensed from a gaseous state to a liquid state flows to the first section by surface tension or gravity.

[0255] At this time, it will be obvious that the inner heat dissipation section (151) can be defined as a concept including the first section and at least a part of the second section described above, and the outer heat dissipation section (152) can be defined as a concept including only the second section.

[0256] In particular, in the case of a lighting device (1a) including a heat dissipation module (150) according to one embodiment of the present invention, an inner heat dissipation part (151) corresponding to a coupling end can be coupled in a fitting manner using a configuration such as a support housing body (170) as a coupling medium configuration.

[0257] Here, the support housing body (170) is joined in a fitting manner in which a cross-sectional groove having a roughly 'ㄷ' shape is formed, and when the LED substrate (140a) is inserted and laminated toward the cross-sectional groove side, a joining end corresponding to the first section of the heat-conducting panel body is fitted between a gap between a pair of installation brackets (190) that mediate fixation to the cross-sectional groove side.

[0258] According to a heat dissipation module (150) according to an embodiment of the present invention configured as described above, a heat dissipation device including the same, an RF module (100) for an antenna, an antenna device (1), and a lighting device (1a), even when the functional elements are arranged longitudinally in the vertical direction and distributed in the internal space (installation space (10S)) of the housing body (antenna housing body (10)), the heat dissipation module (150) including a heat-conducting panel body in which the individual functions are clearly divided into a first section and a second section provides the advantage of securing diversity in the arrangement design of each functional element and maximizing heat dissipation performance, thereby maximizing the system performance of an electronic device (electronic device).

[0259]

[0260] Hereinafter, a heat dissipation module, a heat dissipation device including the same, an RF module for an antenna, an antenna device, and a lighting device according to an embodiment of the present invention have been described in detail with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the above-described embodiments, and it will be understood that various modifications and equivalent implementations are possible by those skilled in the art to which the present invention pertains. Therefore, the true scope of the present invention is defined by the claims set forth below.

[0261]

[0262] The present invention provides a heat dissipation module, a heat dissipation device including the same, an RF module for an antenna, an antenna device, and a lighting device that can improve the performance of a device by quickly discharging system operating heat from the installation space to the outside when a distributed layout design for a limited installation space for heating elements according to electrical operation is required.

Claims

1. A heat conductive panel body having a refrigerant flow space, which is a space in which refrigerant is filled inside and the refrigerant circulates in a closed space to release heat as the refrigerant changes phase; including: The refrigerant flow space includes a first section, which is an evaporation area that receives heat from a heating element that is a heat dissipation target; and a second section, which is a path through which the liquid refrigerant, which is condensed from a gaseous state to a liquid state, flows to the first section by surface tension or gravity. A heat dissipation module in which the heating element is connected to the outside of the heat-conducting panel body corresponding to the first section in one of a fitting method and a bonding method.

2. In claim 1, A heat dissipation module, wherein the first section of the refrigerant flow space is disposed within an inner space in which the heating elements are disposed, and the second section of the refrigerant flow space is disposed such that at least a portion thereof is physically exposed to an outer space partitioned from the inner space.

3. In claim 2, When the inner space and outer space are physically partitioned by the housing body, Among the above refrigerant flow spaces, the first section is located relatively lower with respect to the direction of gravity, and is arranged in the internal space of the housing body, A heat dissipation module in which the second section of the above refrigerant flow space is positioned relatively higher with respect to the direction of gravity, but is exposed to the outer space outside the housing body.

4. In claim 3, The above refrigerant flow space is a heat dissipation module in which the first section and the second section are formed in communication with each other so that the refrigerant flows in a gas-liquid circulating manner from the lower end of the first section to the upper end of the second section as the phase changes.

5. In any one of claims 1 to 4, When a part of the heat-conducting panel body corresponding to the first section is defined as an inner heat-dissipating part, A heat dissipation module, wherein the inner heat dissipation part is provided with one of a heat pipe filled with a refrigerant and the filled refrigerant undergoes a phase change and circulates a gas-liquid phase, and a first phase change fin.

6. In claim 5, The above first phase change fin is a heat dissipation module having one side made of SUS material and the other side made of Cu material.

7. In any one of claims 1 to 4, When a part of the heat-conducting panel body corresponding to the second section is defined as an external heat-dissipating portion, A heat dissipation module, wherein the above outer heat dissipation section is connected to the first section and is provided with a second phase change fin through which the refrigerant that has been phase-changed from the first section into a gaseous refrigerant exchanges heat with the outside air and condenses into a liquid refrigerant.

8. In claim 7, The above second phase change fin is a heat dissipation module having one side made of SUS material and the other side made of Cu material.

9. A functional element that is electrically driven and performs a predetermined function; A plurality of device modules provided to control the above functional elements by module; and A heat dissipation module coupled vertically or horizontally to the device module to discharge heat generated from the heating surfaces of the heating elements provided in the above functional device module; The above heat dissipation module, A heat-conducting panel body having a refrigerant flow space, which is a space in which refrigerant is filled inside and the refrigerant circulates in a gas-liquid manner to release heat as the refrigerant changes phase within a closed space; including: The refrigerant flow space includes a first section, which is an evaporation area that receives heat from a heating element that is a heat dissipation target; and a second section, which is a path through which the liquid refrigerant, which is condensed from a gaseous state to a liquid state, flows to the first section by surface tension or gravity. A heat dissipation device in which the heating element is connected to the outside of the heat-conducting panel body corresponding to the first section in one of a fitting method and a bonding method.

10. In claim 9, A heat dissipation device, wherein the first section of the refrigerant flow space is disposed within an inner space in which the heating elements are disposed, and at least a portion of the second section of the refrigerant flow space is disposed to be physically exposed to an outer space partitioned from the inner space.

11. In claim 10, When the inner space and outer space are physically partitioned by the housing body, Among the above refrigerant flow spaces, the first section is located relatively lower with respect to the direction of gravity, and is arranged in the internal space of the housing body, A heat dissipation device in which the second section of the above refrigerant flow space is positioned relatively higher with respect to the direction of gravity, but is exposed to the outer space outside the housing body.

12. In claim 11, A heat dissipation device in which the first section and the second section are formed in communication with each other so that the refrigerant flows in a gas-liquid circulating manner from the lower end of the first section to the upper end of the second section as the refrigerant undergoes a phase change.

13. In any one of claims 9 to 12, When a part of the heat-conducting panel body corresponding to the first section is defined as an inner heat-dissipating part, A heat dissipation device, wherein the inner heat dissipation part is provided with one of a heat pipe filled with a refrigerant and the filled refrigerant undergoes a phase change and circulates a gas-liquid phase, and a first phase change fin.

14. In claim 13, The above first phase change fin is a heat dissipation module having one side made of SUS material and the other side made of Cu material.

15. In any one of claims 9 to 12, When a part of the heat-conducting panel body corresponding to the second section is defined as an external heat-dissipating portion, A heat dissipation device, wherein the outer heat dissipation section is connected to the first section and is provided with a second phase change fin that condenses the refrigerant, which has been phase-changed from the first section into a gaseous refrigerant, into a liquid refrigerant by exchanging heat with the outside air.

16. In claim 15, The above second phase change fin is a heat dissipation device having one side made of SUS material and the other side made of Cu material.

17. A radiating element having at least one polarization; A plurality of antenna units including RF chains corresponding to the polarization of each of the radiating elements so as to individually control the polarization of the radiating elements; and A heat dissipation module coupled vertically or horizontally to the antenna unit to discharge heat generated from the heating surfaces of heating elements provided in a plurality of adjacent antenna units for each polarization; The above heat dissipation module includes a heat conductive panel body having a refrigerant flow space, which is a space in which refrigerant is filled inside and the refrigerant circulates in a gas-liquid manner to release heat as the refrigerant changes phase within a closed space; The refrigerant flow space includes a first section, which is an evaporation area that receives heat from a heating element that is a heat dissipation target; and a second section, which is a path through which the liquid refrigerant, which is condensed from a gaseous state to a liquid state, flows to the first section by surface tension or gravity. An antenna RF module in which the heating element is connected to the outside of the heat-conducting panel body corresponding to the first section in one of a fitting method and a bonding method.

18. Radiating element with multiple polarizations; A plurality of antenna units, each of which includes an RF chain corresponding to each polarization of the above-mentioned radiating element and is stacked on top of each other; and A heat dissipation module that discharges heat generated from a plurality of heating elements vertically arranged with heating surfaces facing left and right on one side of a plurality of RF filters involved in one polarization among a plurality of adjacent antenna units; The above heat dissipation module includes a heat conductive panel body having a refrigerant flow space, which is a space in which refrigerant is filled inside and the refrigerant circulates in a gas-liquid manner to release heat as the refrigerant changes phase within a closed space; The refrigerant flow space includes a first section, which is an evaporation area that receives heat from a heating element that is a heat dissipation target; and a second section, which is a path through which the liquid refrigerant, which is condensed from a gaseous state to a liquid state, flows to the first section by surface tension or gravity. An antenna RF module, wherein the heating element is connected to the outside of the heat-conducting panel body corresponding to the first section in one of a fitting method and a bonding method.

19. In claim 17 or claim 18, Each of the above multiple antenna units, A first polarized antenna unit engaged in one polarization of the radiating element equipped to radiate a dual polarized beam; and An RF module for an antenna, comprising a second polarization antenna unit that is involved in the other polarization of the radiating element, which is equipped to radiate a dual polarization beam.

20. In claim 19, The above first polarized antenna unit and the second polarized antenna unit, A plurality of one-sided RF filters stacked in a vertically tiled structure so that the longitudinal ends are positioned in front and behind each other; and A plurality of RF filters on the other side are stacked vertically in a single row in the vertical direction so as to be stacked in the left and right direction with respect to one of the left and right sides of the plurality of RF filters on the other side, and are vertically stacked in a tile-like structure so that the longitudinal ends are positioned front and back respectively; An RF module for an antenna, wherein the filters arranged in a tile-like structure at the same vertical position among the plurality of one-side RF filters and the plurality of other-side RF filters constitute two RF channels.

21. In claim 20, Each of the above multiple antenna units, A one-side feed line and an opposite-side feed line that supply a predetermined electrical signal to the plurality of one-side RF filters and the plurality of opposite-side RF filters that constitute the two RF channels; and A PA board further comprising heating elements for one of the two RF channels mounted on one of the two sides; The above PA board is an RF module for an antenna, wherein the RF module is stacked in a tile-like structure on one of the left and right sides of the plurality of one-side RF filters and the plurality of other-side RF filters.

22. In claim 21, The plurality of heating elements mounted on the PA board are RF modules for antennas, including at least one of a PA (Power Amplifier), an LNA (Low Noise Amplifier), and an RFIC.

23. In claim 21, The above heat dissipation module, An RF module for an antenna, wherein the first polarized antenna unit and the second polarized antenna unit are stacked in surface thermal contact with the outer surface of the PA board, respectively, and receive and radiate heat generated from the plurality of heating elements.

24. In claim 23, The above heat dissipation module, An inner heat dissipation part in surface thermal contact with one side of the PA board on which the plurality of heating elements are mounted; and An RF module for an antenna, comprising an outer heat dissipation unit that dissipates heat transferred from the inner heat dissipation unit by exchanging heat with the outside air.

25. In claim 24, An RF module for an antenna, wherein the inner heat dissipation portion and the outer heat dissipation portion are formed to be connected to each other so that a refrigerant is filled therein and the filled refrigerant circulates in a gaseous state.

26. In claim 24, An RF module for an antenna, wherein the inner heat dissipation part is provided with one of a plurality of heat pipes and a first phase change fin of a plate-type heat exchanger, wherein a refrigerant is filled therein and the filled refrigerant is phase-changed and circulated into a gas-liquid state.

27. In claim 24, An RF module for an antenna, wherein the inner heat dissipation part and the outer heat dissipation part are provided with a second phase change fin of a plate-type heat exchanger type that is formed to be mutually connected so that a refrigerant is filled therein and the filled refrigerant circulates in a gaseous liquid form from the inner heat dissipation part to the outer heat dissipation part.

28. In claim 26, An RF module for an antenna, wherein the inner heat dissipation part equipped with the first phase change fin of the plate-type heat exchanger type has one side in surface thermal contact with one side of the PA board made of Cu material, and the other side not in surface thermal contact with one side of the PA board made of SUS material.

29. In claim 27, An RF module for an antenna, wherein the outer heat dissipation part and the inner heat dissipation part, which are equipped with the second phase change fin of the above plate-type heat exchanger type, are equipped with SUS material on both sides.

30. In claim 27, The outer heat dissipation part equipped with the second phase change fin of the above plate heat exchange type is equipped with both sides made of SUS material, An RF module for an antenna, wherein the inner heat dissipation part equipped with the second phase change fin of the plate-type heat exchanger type has one side in surface thermal contact with one side of the PA board made of Cu material, and the other side not in surface thermal contact with one side of the PA board made of SUS material.

31. In claim 25, The inner heat dissipation part and the outer heat dissipation part are manufactured by joining the edges of two metal panel members manufactured by a press molding method to form a refrigerant flow space in which the refrigerant is filled inside. An RF module for an antenna, wherein the two metal panel members above are formed with a plurality of strength reinforcing parts processed and formed by a press molding method to reinforce their own rigidity and to be mutually joined at least within the refrigerant flow space.

32. In claim 31, An RF module for an antenna, wherein the above two metal panel members are made of Cu material or SUS material, and the coolant is water.

33. In claim 21, The above radiating element is, A first polarized element connected to a signal transmitted along the one-sided feed line and arranged to be connected to the plurality of one-sided RF filters; and A second polarization element connected to a signal transmitted along the other side feed line and arranged to be connected to the plurality of other side RF filters; An RF module for an antenna, wherein the first polarized element and the second polarized element are mounted on the front end of the plurality of one-side RF filters and the plurality of other-side RF filters while their first and second ends intersect with each other.

34. In claim 21, An RF module for an antenna, wherein the front surfaces of the plurality of one-side RF filters and the plurality of other-side RF filters perform the function of a reflector that reflects a beam emitted from the radiating element forward.

35. In claim 33, The above radiating element is, A base panel is further included, which is arranged to partition between the plurality of one-side RF filters and the plurality of other-side RF filters and the first polarized element and the second polarized element, and which supports the first polarized element and the second polarized element; An RF module for an antenna, wherein the base panel has a forward protrusion height that blocks radiation from the first polarized element and the second polarized element to adjacent radiating elements.

36. In claim 19, The above base panel is an RF module for an antenna, supported forward by the PA board.

37. Radiating element with dual polarization; A first polarization antenna unit and a second polarization antenna unit including RF chains corresponding to the polarization of each of the radiating elements to individually control the dual polarization of the radiating elements; and A heat dissipation module that discharges heat generated from the heating surfaces of each heating element provided in the first polarized antenna unit and the second polarized antenna unit; The above heat dissipation module is a plate-type heat exchanger type, and the respective heating elements of the first polarized antenna unit and the second polarized antenna unit are arranged on one side and the other side, respectively, so as to be in surface thermal contact.

38. In claim 37, The above first polarized antenna unit and the second polarized antenna unit, A plurality of one-sided RF filters stacked in a vertically tiled structure so that the longitudinal ends are positioned in front and behind each other; and A plurality of RF filters on the other side are stacked vertically in a single row in the vertical direction so as to be stacked in the left and right direction with respect to one of the left and right sides of the plurality of RF filters on the other side, and are vertically stacked in a tile-like structure so that the longitudinal ends are positioned front and back respectively; An RF module for an antenna, wherein the filters arranged in a tile-like structure at the same vertical position among the plurality of one-side RF filters and the plurality of other-side RF filters constitute two RF channels.

39. In claim 38, Each of the above multiple antenna units, A one-side feed line and an opposite-side feed line that supply a predetermined electrical signal to the plurality of one-side RF filters and the plurality of opposite-side RF filters that constitute the two RF channels; and A PA board further comprising heating elements for one of the two RF channels mounted on one of the two sides; The above PA board is an RF module for an antenna, wherein the RF module is stacked in a tile-like structure on one of the left and right sides of the plurality of one-side RF filters and the plurality of other-side RF filters.

40. In claim 39, The above single heat dissipation module, An inner heat dissipation part in surface thermal contact with one side of the PA board on which the plurality of heating elements are mounted; and An RF module for an antenna, comprising an outer heat dissipation unit that dissipates heat transferred from the inner heat dissipation unit by exchanging heat with the outside air.

41. In claim 40, The above one-side RF filter and the other-side RF filter are formed such that the front-to-back width is longer than the front-to-back width of the inner heat dissipation part of the heat dissipation module, An RF module for an antenna, wherein the first polarized antenna unit and the second polarized antenna unit are coupled to one side and the other side of the single heat dissipation module, respectively, with the PA boards involved in the two RF channels interposed therebetween by fixing screws that are fastened through the front coupling flange and the rear coupling flange formed at the front and rear ends of the one side RF filter and the other side RF filter.

42. Antenna housing body in the shape of a ship with an open front and an installation space formed inside; A digital board having heating elements mounted on at least one side of the two sides and laminated so that the back surface is in close contact with the above installation space; and An RF module for an antenna electrically connected to the digital board, the antenna being vertically arranged in the vertical direction with both sides facing left and right in the installation space; The RF module for the above antenna is, A radiating element having at least one polarization; A plurality of antenna units including RF chains corresponding to the polarization of each of the radiating elements so as to individually control the polarization of the radiating elements; and A heat dissipation module coupled vertically or horizontally to the antenna unit to discharge heat generated from the heating surfaces of heating elements provided in a plurality of adjacent antenna units for each polarization; The above heat dissipation module, An inner heat dissipation part that extends into the above installation space and conducts heat received from the above heating elements; and An antenna device including an external heat dissipation unit that extends outside the installation space and exchanges heat transferred from the internal heat dissipation unit with air (outside air) in the external space.

43. In claim 42, Each of the above multiple antenna units, A first polarized antenna unit engaged in one polarization of the radiating element equipped to radiate a dual polarized beam; and An antenna device comprising a second polarization antenna unit that is involved in the other polarization of the radiating element, which is equipped to radiate a dual polarization beam.

44. In claim 43, The above first polarized antenna unit and the second polarized antenna unit, A plurality of one-sided RF filters stacked in a vertically tiled structure so that the longitudinal ends are positioned in front and behind each other; and A plurality of RF filters on the other side are stacked vertically in a single row in the vertical direction so as to be stacked in the left and right direction with respect to one of the left and right sides of the plurality of RF filters on the other side, and are vertically stacked in a tile-like structure so that the longitudinal ends are positioned front and back respectively; An antenna device in which the filters arranged in a tile-like structure in the same vertical position among the plurality of one-side RF filters and the plurality of other-side RF filters constitute two RF channels.

45. In claim 44, Each of the above multiple antenna units, A one-side feed line and an opposite-side feed line that supply a predetermined electrical signal to the plurality of one-side RF filters and the plurality of opposite-side RF filters that constitute the two RF channels; and A PA board further comprising heating elements for one of the two RF channels mounted on one of the two sides; The above PA board is laminated in the tile-like structure on one of the left and right sides of the plurality of one-side RF filters and the plurality of other-side RF filters, An antenna device in which the inner heat dissipation part of the above heat dissipation module is laminated in a tile-like structure so as to be in surface thermal contact with the outer surface of the PA board.

46. ​​In claim 45, A hydrogen socket part for electrically connecting the socket pins with the digital board is provided at the rear end of the front and rear width directions of the above PA board. An antenna device, wherein the digital board has a female socket portion to which the male socket portion of the PA board is connected with a socket pin.

47. In claim 46, Among the above heat dissipation modules, the outer heat dissipation part is exposed to the external space through the upper part of the antenna housing body, An antenna device having a guide slot formed long in the front-back direction at the upper part of the antenna housing body to guide insertion when the PA board is connected to the digital board with a socket pin.

48. In claim 43, Among the above heat dissipation modules, the outer heat dissipation part is exposed to the external space through the upper part of the antenna housing body, An antenna device further comprising a finger guard panel assembly coupled to the antenna housing body so as to surround the outer heat dissipation portion exposed to the external space through the upper portion of the antenna housing body without contacting it.

49. In claim 48, The above finger guard panel assembly is provided to shield all parts except the front part of the outer heat dissipation part exposed to the upper part of the antenna housing body, A radome panel that shields the open front of the antenna housing body and is made of a material through which a beam emitted from the radiating element is transmitted; further comprising: An antenna device, wherein a radome extension panel is integrally formed on the upper portion of the radome panel to shield the front portion of the outer heat dissipation portion that is not shielded by the finger guard panel assembly.

50. In claim 49, An antenna device, wherein at least a portion of the finger guard panel assembly and the radome extension panel have a plurality of ventilation holes formed therein through which air from the external space passes.

51. Antenna housing body in the shape of a ship with an open front and an installation space formed inside; A digital board having heating elements mounted on at least one side of the two sides and laminated so that the back surface is in close contact with the above installation space; and An RF module for an antenna electrically connected to the digital board, the antenna being vertically arranged in the vertical direction with both sides facing left and right in the installation space; The RF module for the above antenna is, Radiating element with dual polarization; A first polarization antenna unit and a second polarization antenna unit including RF chains corresponding to the polarization of each of the radiating elements to individually control the dual polarization of the radiating elements; and A heat dissipation module that discharges heat generated from the heating surfaces of each heating element provided in the first polarized antenna unit and the second polarized antenna unit; including, The above heat dissipation module is a plate-type heat exchanger type, and the respective heating elements of the first polarized antenna unit and the second polarized antenna unit are arranged on one side and the other side, respectively, so as to be in surface thermal contact.

52. A lighting body in the shape of a box with one side open for light irradiation and an installation space formed inside; An LED substrate provided in the installation space of the above lighting body, with LED elements mounted on at least one side of both sides; and An LED module electrically connected to the LED substrate and vertically arranged in the installation space; The LED module includes a heat dissipation module that is vertically or horizontally coupled to one side or the other side of the LED substrate to discharge heat generated from the heating surface of the LED elements mounted on the LED substrate; The above heat dissipation module, An inner heat dissipation unit that extends into the above installation space and conducts heat received from the LED elements; and A lighting device comprising an external heat dissipation unit that extends outside the above-mentioned installation space and exchanges heat transferred from the internal heat dissipation unit with air (outside air) in the external space.

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