Atomization core and electronic atomization apparatus

Abstract

The present application relates to the technical field of electronic atomization. Provided are an atomization core and an electronic atomization apparatus. The atomization core comprises a silicon-based heat generation body, which may generate heat in a power-on state, and at least three electrodes, which are arranged on the silicon-based heat generation body, wherein the electrodes are arranged spaced apart from each other, and the silicon-based heat generation body, which is arranged between any two adjacent electrodes, forms an atomization area which may separately generate heat. In the present application, at least three electrodes, which are spaced apart from each other, are arranged on a silicon-based heat generation body, and the silicon-based heat generation body, which is arranged between any two adjacent electrodes, forms an atomization area which may separately generate heat, such that an atomization core may form a plurality of atomization areas for converting an atomization substrate into aerosol, thereby facilitating an improvement in an atomization effect of the atomization core.

Description

Atomizer core and electronic atomizer device

[0001] This application claims priority to the Chinese patent application with application number 202311146545.9 filed on September 6, 2023, and invention titled “Atomizer Core and Electronic Atomizer Device,” and incorporates it into this application by reference.

Technical field

[0002] The present application relates to the field of electronic atomization technology, and in particular to an atomization core and an electronic atomization device. [Background Technology]

[0003] Mainstream atomizer cores include cotton and ceramic, but both have certain drawbacks. Cotton cores utilize a rigid mesh heating electrode assembled with flexible cotton, making assembly difficult and inefficient. Furthermore, the mesh core is prone to bending and breaking during winding, causing short circuits and open circuits. Ceramic atomizer cores are limited by the ceramic molding process and material properties. High-precision control of the size and porosity of ceramic materials is difficult, and the high surface roughness of ceramics can easily lead to morphological defects in the heating electrode fabricated on the ceramic.

[0004] To solve the above problems, atomizer cores made of silicon-based materials have been proposed. However, the atomization effects of existing silicon-based atomizer cores are not ideal.

[0005] [Summary of the invention]

[0006] The main technical problem solved by this application is how to improve the atomization effect of the silicon-based atomizer core.

[0007] In order to solve the above technical problems, a technical solution adopted in this application is: to provide an atomization core, including a silicon-based heating element that can generate heat when powered, and at least three electrodes arranged on the silicon-based heating element, the electrodes are arranged at intervals from each other, and the silicon-based heating element between any two adjacent electrodes forms an atomization area that can generate heat independently.

[0008] In some embodiments, the atomization core includes a first electrode, a second electrode, and a third electrode. The portion of the silicon-based heating element between the first electrode and the second electrode forms a first atomization area, and the portion of the silicon-based heating element between the third electrode and the second electrode forms a second atomization area. The first atomization area and the second atomization area are configured to generate heat alternately.

[0009] In some embodiments, the silicon-based heating element has a first surface and a second surface relative to each other, and the silicon-based heating element also has guide holes that pass through the first surface and the second surface. The multiple guide holes are all set in the atomization area and arranged in an array.

[0010] In some embodiments, the portion of at least one of the first surface and the second surface that forms the atomization area is a rough surface, and the plurality of flow guide holes arranged in an array all penetrate the rough surface.

[0011] In some embodiments, at least one of the first surface and the second surface is provided with a liquid storage tank, and the plurality of flow guide holes arranged in an array are all connected to the liquid storage tank.

[0012] In some embodiments, at least one of the first surface and the second surface is provided with a liquid reservoir, and the liquid reservoir and the rough surface are arranged opposite to each other.

[0013] In some embodiments, the depth of the liquid storage tank is between 1 / 3 and 1 / 2 of the thickness of the silicon-based heating element, and the thickness of the silicon-based heating element is the distance between the first surface and the second surface.

[0014] Another technical solution adopted in the present application is: to provide an electronic atomization device, including a shell and the above-mentioned atomization core, the atomization core is arranged in the shell, a liquid holding chamber is formed inside the shell, and the liquid holding chamber and the atomization core are connected to each other; wherein, an air inlet channel is provided at one end of the shell, a suction nozzle is provided at the other end, and a main air channel is provided inside, and the air inlet channel, the atomization area of ​​the atomization core, the main air channel and the suction nozzle are connected in sequence.

[0015] In some embodiments, the electronic atomization device further includes a partition wall that divides the main airway into a plurality of airways, the number of airways is the same as the number of atomization zones, and each airway is connected to a respective atomization zone.

[0016] In some embodiments, the electronic atomization device includes a first shell and a second shell, the first shell and the second shell are connected to form an outer shell, and are surrounded by a liquid holding chamber, which is used to store the atomized matrix; the nozzle is provided in the first shell, and the air inlet channel is provided in the second shell.

[0017] In some embodiments, the first shell includes a first shell portion and a second shell portion that are integrally arranged. The outer contour size of the first shell portion is larger than the outer contour size of the second shell portion. The first shell portion overlaps the second shell portion and cooperates with the second shell to form an outer shell. The second shell portion is embedded in the second shell.

[0018] In some embodiments, the electronic atomization device includes an extension portion extending from one end of the first shell where a suction nozzle is provided, the extension portion is located inside the shell and is arranged to form a main airway; a receiving portion is provided at the end of the extension portion away from the suction nozzle, and a receiving space connected to the main airway is formed in the receiving portion, and the atomization core is accommodated in the receiving space; the receiving portion is also provided with a liquid guide port, which is respectively connected to the receiving space and the liquid holding chamber.

[0019] In some embodiments, the electronic atomization device includes a liquid guide member, which is accommodated in the receiving space and abuts against the atomization core; the liquid guide member is arranged opposite the liquid guide port, or the liquid guide member is arranged through the liquid guide port to guide the atomized matrix to the atomization core.

[0020] In some embodiments, the liquid guide is located on the bottom side of the atomizer core and is provided with a first through hole, the receiving portion is provided with a second through hole, and the second shell is provided with a third through hole; the electronic atomization device also includes a conductive column passing through the first through hole, the second through hole and the third through hole, the conductive column is in contact with the electrode of the atomizer core and is electrically connected to the electrode.

[0021] In some embodiments, the receiving portion abuts against the second shell.

[0022] In some embodiments, the second shell is provided with a limiting groove communicating with the liquid containing cavity, the receiving portion is at least partially accommodated in the limiting groove, and the receiving portion abuts against the bottom wall of the limiting groove.

[0023] In some embodiments, the receiving portion has a bottom surface, a first side surface, and a second side surface, and the first side surface and the second side surface extend from different parts of the circumference of the bottom surface respectively; wherein, the bottom surface abuts against the bottom wall of the limiting groove, the first side surface abuts against the side wall of the limiting groove, and the second side surface is spaced apart from the side wall of the limiting groove; the liquid guide port is opened on the second side surface and is connected to the liquid holding chamber through the limiting groove.

[0024] Different from the prior art, the atomizer core and electronic atomizer device provided by this application have the following beneficial effects:

[0025] The present application arranges at least three electrodes spaced apart from each other on the silicon-based heating element, and enables the silicon-based heating element between any two adjacent electrodes to form an atomization zone that can generate heat independently, so that the atomization core can form multiple atomization zones for converting the atomization matrix into aerosol, which is beneficial to improving the atomization effect of the atomization core.

Brief Description of the Drawings

[0026] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0027] FIG1 is a schematic structural diagram of an atomizer core provided in some embodiments of the present application;

[0028] FIG2 is a schematic structural diagram of the atomizer core in the embodiment of FIG1 from another perspective;

[0029] FIG3 is a schematic structural diagram of an electronic atomization device provided in some embodiments of the present application;

[0030] FIG4 is a schematic diagram of the exploded structure of the electronic atomization device in the embodiment of FIG3 ;

[0031] FIG5 is a schematic structural diagram of a first housing provided in some embodiments of the present application;

[0032] FIG6 is a schematic structural diagram of a second housing provided in some embodiments of the present application;

[0033] FIG7 is a schematic structural diagram of the second housing in the embodiment of FIG6 from another perspective;

[0034] FIG8 is a schematic diagram of the dissected structure of the second housing in the embodiment of FIG6 ;

[0035] FIG9 is a schematic cross-sectional view of an electronic atomization device provided in some embodiments of the present application;

[0036] FIG10 is a schematic diagram of a partial cross-sectional structure of an electronic atomization device provided in some embodiments of the present application;

[0037] FIG11 is a schematic cross-sectional view of the electronic atomization device in the embodiment of FIG10 from another perspective;

[0038] FIG12 is a schematic cross-sectional view of an electronic atomization device provided in some embodiments of the present application;

[0039] FIG13 is a schematic diagram of the cross-sectional structure of the electronic atomization device in the embodiment of FIG12 at another viewing angle. [Specific implementation method]

[0040] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0041] It should be understood that the terms "including" and "having" and any variations thereof as used in this specification and the appended claims are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to the process, method, product, or apparatus.

[0042] It should also be understood that the terms used in this specification and the appended claims are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in this specification and the appended claims, unless the context clearly indicates otherwise, the singular forms of "a", "an" and "the" are intended to include the plural forms. For example, the terms "first" and "second" in the description of this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. For example, the meaning of "multiple" in the description of this application is two or more, unless otherwise clearly and specifically defined.

[0043] To make the above-mentioned purposes, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below in conjunction with the accompanying drawings. It is understood that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0044] An embodiment of the present application provides an atomizer core, which can be used to convert an atomizer matrix into an aerosol.

[0045] Please refer to Figures 1 and 2 together. Figure 1 is a schematic structural diagram of the atomizer core provided in some embodiments of the present application, and Figure 2 is a schematic structural diagram of the atomizer core in the embodiment of Figure 1 from another perspective.

[0046] The atomizer core 10 includes a silicon-based heating element 100 and at least three electrodes 200 disposed on the silicon-based heating element 100. The silicon-based heating element 100 has electrical resistance and generates heat when powered. The electrodes 200 are spaced apart from one another, and the silicon-based heating element 100 between any two adjacent electrodes 200 forms an atomization zone 101 that generates heat independently.

[0047] Specifically, the silicon-based heating element 100 is made of a semiconductor material, specifically, doped single-crystal silicon, polycrystalline silicon, cubic boron arsenide, or other semiconductor materials with good electrical and thermal conductivity. The resistivity of the silicon-based heating element 100 can be configured to be between 1x10-4Ω·m and 1x10-8Ω·m, so that when the silicon-based heating element 100 is energized, it can generate heat and heat up to 200°C-300°C, thereby converting the atomized matrix on the silicon-based heating element 100 into an aerosol.

[0048] The electrode 200 provided on the silicon-based heating element 100 can be connected to an external power source and form a path with the silicon-based heating element 100, thereby enabling the silicon-based heating element 100 to act as a resistor to generate Joule heat. The electrode 200 can be made of a material with a greater conductivity than the silicon-based heating element 100, such as gold, silver, silver-palladium alloy, nickel-chromium alloy, copper, iron, iron-chromium-aluminum, various types of stainless steel, and other materials with excellent conductivity. The electrode 200 can be prepared on the surface of the silicon-based heating element 100 by PVD metal sputtering or other metal deposition processes.

[0049] When the atomizer core 10 is in the atomizing state, two of the multiple electrodes 200 can be connected to an external power source and form a path with the silicon-based heating element 100, so that the portion of the silicon-based heating element 100 between the two energized electrodes 200 forms an atomizing area 101 in a heating state. Optionally, the other two of the multiple electrodes 200 (one of which can be shared) can be simultaneously connected to the external power source, so that another portion of the silicon-based heating element 100 forms another atomizing area 101 in a heating state.

[0050] At the same time, some of the multiple electrodes 200 may be in an unpowered state, and the atomization area 101 formed by these electrodes 200 and the corresponding silicon-based heating elements 100 is in a non-heating state.

[0051] Through the above design, each atomizing zone 101 of the atomizer core 10 can be partially heated and partially non-heated at the same time. The two atomizing zones 101 can alternately heat, forming a cycle. This effectively prevents excessive fatigue thermal stress on the atomizer core 10 and helps extend the service life of the atomizer core 10. The atomizer core 10 includes at least two atomizing zones 101 to achieve the above-mentioned alternating heating function. Correspondingly, the atomizer core 10 has at least three electrodes 200.

[0052] The multiple atomization areas 101 of the atomization core 10 can also be in a heating state at the same time to improve the atomization effect of the atomization core 10 .

[0053] In some embodiments, three electrodes 200 are provided on the silicon-based heating element 100, namely a first electrode 210, a second electrode 220, and a third electrode 230. The portion of the silicon-based heating element 100 between the first electrode 210 and the second electrode 220 forms a first atomization region 102, and the portion of the silicon-based heating element 100 between the third electrode 230 and the second electrode 220 forms a second atomization region 103. The first atomization region 102 and the second atomization region 103 can be configured to generate heat alternately.

[0054] Specifically, the first electrode 210 and the third electrode 230 are both positive electrodes, and the second electrode 220 is a negative electrode. The three electrodes 200 are configured as follows: the first electrode 210 and the second electrode 220 can serve as the positive and negative electrodes of the first atomization area 102, so that the portion of the silicon-based heating element 100 between the first electrode 210 and the second electrode 220 can generate heat; the second electrode 220 and the third electrode 230 can serve as the positive and negative electrodes of the second atomization area 103, so that another portion of the silicon-based heating element 100 between the second electrode 220 and the third electrode 230 can generate heat. In other words, the second electrode 220 can cooperate with one of the first electrode 210 and the third electrode 230 to form the two poles of the heating element. The second electrode 220 can be disposed between the first electrode 210 and the third electrode 230. The silicon-based heating element 100 can be in the form of a strip plate, such as a rectangular plate, and the three electrodes 200 are arranged in sequence along the length of the silicon-based heating element 100.

[0055] When both the first electrode 210 and the second electrode 220 are powered on and the third electrode 230 is powered off, the first atomization area 102 is in a heating state, while the second atomization area 103 is in a non-heating state. When both the second electrode 220 and the third electrode 230 are powered on and the first electrode 210 is powered off, the second atomization area 103 is in a heating state, while the first atomization area 102 is in a non-heating state. When the atomizer core 10 is in the atomizing state, these two states can alternate, ensuring that one of the two atomization areas 101 is always in a heating state and the other is always in a non-heating state.

[0056] In other embodiments, the first electrode 210, the second electrode 220, and the third electrode 230 can be configured such that the first electrode 210 and the third electrode 230 are negative electrodes, and the second electrode 220 is a positive electrode. Similarly, the second electrode 220 can cooperate with the first electrode 210 to serve as the two poles of the first atomization region 102, and can cooperate with the third electrode 230 to serve as the two poles of the second atomization region 103.

[0057] Optionally, a plurality of the first electrode 210 , the second electrode 220 , and the third electrode 230 may be provided. In other embodiments, the plurality of electrodes 200 may be paired in pairs, for example, four electrodes 200 serve as the two poles of the two atomization regions 101 .

[0058] The silicon-based heating element 100 has a first surface 110 and a second surface 120 facing each other. A plurality of electrodes 200 may be arranged at intervals on the first surface 110. The silicon-based heating element 100 further has a guide hole 130 extending through the first surface 110 and the second surface 120.

[0059] Optionally, the silicon-based heating element 100 is provided with a plurality of guide holes 130, each of which is disposed in the atomization region 101 and arranged in an array. For example, the plurality of guide holes 130 may form two hole arrays, with the two hole arrays being disposed in the first atomization region 102 and the second atomization region 103, respectively. Of course, the plurality of guide holes 130 may also be arranged in other arrangements besides an array, such as a radial arrangement.

[0060] In the embodiment of the present application, the pore size of the guide hole 130 can be configured to be within the range of 5-100 microns, for example, 10 microns, 30 microns, 50 microns, 70 microns, 90 microns, etc. The guide hole 130 can serve as a guide structure and storage structure for the atomized matrix, and is used to introduce the atomized matrix on the first surface 110. Moreover, due to the small pore size of the guide hole 130, a portion of the atomized matrix can be locked therein by capillary force, while the other portion of the atomized matrix is ​​transported to the second surface 120 through the guide hole 130.

[0061] When the two electrodes 200 are energized by an external power source, part of the silicon-based heating element 100 between the two electrodes 200 can generate heat. At this time, the hole wall of the guide hole 130 located in this part of the silicon-based heating element 100 can heat the atomized matrix in the hole. The silicon-based heating element 100 can also heat the atomized matrix on the second surface 120 to convert the atomized matrix into an aerosol, thereby avoiding the atomized matrix from contacting the metal conductive layer, the electric heating film or the heating electrode during the atomization process, causing the resistance of the above-mentioned devices to change and reduce the atomization effect, and also eliminating the safety risks caused by local excessive temperature, core sticking and other phenomena during the atomization process.

[0062] The guide holes 130 of the silicon-based heating element 100 can be made by laser etching or photolithography. The array of guide holes 130 can achieve dispersion of the atomized matrix, improve the uniformity of heating and atomization, and effectively increase the contact area between the silicon-based heating element 100 and the atomized matrix. When the silicon-based heating element 100 heats and atomizes, the atomized matrix on the first surface 110 can be quickly adsorbed and transferred to the second surface 120 for boiling and atomization, which is beneficial to reducing atomization power consumption and improving atomization performance.

[0063] In some embodiments, the portion of at least one of the first surface 110 and the second surface 120 that forms the atomization area 101 is a rough surface 140. For example, the portion of the first surface 110 located between two adjacent electrodes 200 is a rough surface 140. The rough surface 140 can be regarded as an uneven velvet surface. The rough surface 140 can be produced by dry texturing, wet texturing, mask texturing, etc., and the thickness can be between 0.1 and 10 μm, which can increase the contact area between the surface of the silicon-based heating element 100 and the atomization matrix, thereby improving the heat utilization rate and better forming a heating boiling effect, which is conducive to increasing the atomization amount and improving the taste of the aerosol.

[0064] Optionally, the plurality of guide holes 130 arranged in an array all penetrate the rough surface 140 of the silicon-based heating element 100 .

[0065] In some embodiments, at least one of the first surface 110 and the second surface 120 of the silicon-based heating element 100 is provided with a liquid reservoir 150. The plurality of flow guide holes 130 are all connected to the liquid reservoir 150. The liquid reservoir 150 can be used to quickly hold a certain amount of atomized matrix to increase the atomization volume of the atomizer core 10. The liquid reservoir 150 can be manufactured by dry etching or wet etching.

[0066] Optionally, the depth of the liquid reservoir 150 is between 1 / 3 and 1 / 2 of the thickness of the silicon-based heating element 100 , such as 11 / 30, 6 / 15, 13 / 30, 5 / 12, 7 / 15, etc. The thickness of the silicon-based heating element 100 is the distance between the first surface 110 and the second surface 120 .

[0067] In some embodiments, at least one of the first surface 110 and the second surface 120 of the silicon-based heating element 100 is provided with a liquid reservoir 150, and the liquid reservoir 150 is arranged opposite to the rough surface 140. For example, the first surface 110 of the silicon-based heating element 100 is formed with a rough surface 140, and the portion of the second surface 120 opposite thereto is provided with a liquid reservoir 150. For another example, the second surface 120 of the silicon-based heating element 100 is formed with a rough surface 140, and the portion of the first surface 110 opposite thereto is provided with a liquid reservoir 150. For another example, both the first surface 110 and the second surface 120 of the silicon-based heating element 100 are formed with a rough surface 140, and both the first surface 110 and the second surface 120 are provided with a liquid reservoir 150 opposite to the rough surface 140. It can be understood that the rough surface 140 and the liquid reservoir 150 are both provided in the atomization area 101.

[0068] Optionally, the first surface 110 of the silicon-based heating element 100 is formed with a rough surface 140, and the second surface 120 is provided with a liquid reservoir 150 opposite the rough surface 140, and is provided with a plurality of guide holes 130 extending through the rough surface 140 and the liquid reservoir 150 and arranged in an array. The rough surface 140, the liquid reservoir 150, and the guide holes 130 are all provided in the atomization region 101 of the silicon-based heating element 100.

[0069] Among them, the atomizing matrix of the silicon-based heating element 100 or the carrier carrying the atomizing matrix can contact the rough surface 140 of the first surface 110, and then be guided to the liquid storage tank 150 of the second surface 120 through the guide hole 130, and stored in the liquid storage tank 150 for a short time, so that the atomizing core 10 can be atomized continuously and stably.

[0070] The embodiment of the present application further provides an electronic atomization device, which includes the above-mentioned atomization core 10.

[0071] Please refer to Figures 3 and 4 together. Figure 3 is a structural diagram of the electronic atomization device provided in some embodiments of the present application, and Figure 4 is a schematic diagram of the decomposed structure of the electronic atomization device in the embodiment of Figure 3.

[0072] The electronic atomization device 20 includes a housing 30, with the atomizer core 10 disposed within the housing 30. An air inlet channel (not shown) is provided at one end of the housing 30, a mouthpiece 31 is provided at the other end, and a main airway (not shown) is provided within the housing 30. The air inlet channel, the atomization area 101 of the atomizer core 10, the main airway, and the mouthpiece 31 are sequentially connected, so that airflow entering the housing 30 from the air inlet channel can entrain the aerosol generated by the atomizer core 10 and flow through the main airway to the mouthpiece 31.

[0073] The electronic atomization device 20 may include a first shell 300 , a second shell 400 , and a base 500 , which may be connected to form a housing 30 and may be interference-fitted to form a whole. The atomization core 10 may be placed between the first shell 300 and the second shell 400 .

[0074] The electronic atomization device 20 may also include a liquid guide 600 and a conductive column 700. The liquid guide 600 is used to guide the atomized matrix to the atomizer core 10, and the conductive column 700 is used to form a path between the atomizer core 10 and an external power source. The liquid guide 600 can be made of a material with good oil retention and oil conductivity, such as organic cotton, linen, or a combination of one or more of organic fibers. The number and position of the conductive columns 700 correspond one-to-one to the electrodes 200 of the atomizer core 10.

[0075] When assembling the electronic atomization device 20, the conductive column 700 can be first assembled in the second shell 400, and then the base 500 can be installed into the second shell 400 and interference fit with it to achieve the closure of the bottom of the second shell 400. This assembly is simple and efficient, and can make the conductive column 700 fully contact with the electrode 200, which is convenient for automated production.

[0076] It should be noted that the shell structure of the embodiment of the present application is not limited to this embodiment. For example, the shell 30 can be formed by connecting only the first shell 300 and the second shell 400; for another example, the shell 30 can be formed by connecting only the first shell 300 and the base 500.

[0077] Please refer to Figures 5 to 9 together. Figure 5 is a structural schematic diagram of the first shell provided in some embodiments of the present application, Figure 6 is a structural schematic diagram of the second shell provided in some embodiments of the present application, Figure 7 is a structural schematic diagram of the second shell in the embodiment of Figure 6 from another perspective, Figure 8 is a sectional structural schematic diagram of the second shell in the embodiment of Figure 6, and Figure 9 is a sectional structural schematic diagram of the electronic atomization device provided in some embodiments of the present application.

[0078] In some embodiments, the suction nozzle 31 can be provided at the top of the housing 30, and the air inlet passage 32 can be provided at the bottom of the housing 30. The first housing 300 and the second housing 400 can be nested and connected to form the housing 30. The suction nozzle 31 is provided on the first housing 300, and the air inlet passage 32 is provided on the second housing 400.

[0079] Optionally, the first housing 300 includes an integrally formed first shell portion 3101 and a second shell portion 3102. The first shell portion 3101 and the second shell portion 3102 may be integrally formed or may be two integrally connected components. The first shell portion 3101 forms the top end of the outer shell 30. The end of the second shell portion 3102 facing away from the first shell portion 3101 forms an opening that communicates with the interior space of the first housing 300.

[0080] The second shell 400 has a bottom 410 and a side portion 420 extending from the periphery of the bottom 410. One end of the side portion 420 forms an opening connected to the internal space of the second shell 400. The first shell 300 and the second shell 400 are arranged to form a liquid holding chamber 401, which is used to store the atomized matrix. Optionally, the side portion 420 extends from the periphery of the bottom 410 toward opposite sides, forming two opposite openings with the bottom 410 as the bottom wall and the side portion 420 as the side wall. The first shell 300 and the base 500 can be respectively embedded in these two grooves and have an interference fit with the side portion 420.

[0081] Among them, the outer contour size of the first shell part 3101 is larger than the outer contour size of the second shell part 3102. The first shell part 3101 is overlapped on the side part 420 of the second shell part 400, and cooperates with the second shell part 400 to form the outer shell 30. The second shell part 3102 can be embedded in the second shell part 400, and can also be interference fit with the side part 420 to improve the stability of the assembly structure. Among them, the second shell part 3102 can be in contact with the bottom 410 of the second shell part 400, so that the bottom 410 can cooperate with the first shell part 300 to form a liquid holding chamber 401 to prevent the atomized matrix from flowing into between the side part 420 and the second shell part 3102. The liquid holding chamber 401 is connected to the atomizer core 10 for liquid conduction, so that the atomized matrix in the liquid holding chamber 401 can be guided to the atomizer core 10 and atomized.

[0082] The overlapped joint between the first shell portion 3101 and the second shell portion 400 can be used to limit the position of the two during assembly, thereby achieving accurate assembly of the shell structure. Through the above design, when installing the electronic atomization device 20, the atomizing matrix can be first injected into the first shell portion 300, and then the first shell portion 300 and the second shell portion 400 are nested and assembled, making the assembly process efficient and leak-proof.

[0083] It is understandable that in other embodiments of the present application, the shell structure may also be designed as the second shell 400 being embedded in the first shell 300, as long as the corresponding nested structures of the two are replaced.

[0084] In some embodiments, the electronic atomization device 20 includes an extension portion 320 extending from one end of the first housing 300 where the nozzle 31 is located. The extension portion 320 is located within the housing 30. The periphery of the housing 30 can surround and be spaced from the periphery of the extension portion 320. Specifically, the second shell portion 3102 of the first housing 300 and the side portion 420 of the second housing 400 can surround the periphery of the extension portion 320.

[0085] The extension portion 320 is arranged to form a main air channel 301 , and the air inlet channel 32 , the atomizing area 101 of the atomizer core 10 , the main air channel 301 and the mouthpiece 31 are sequentially connected, so that the airflow input from the air inlet channel 32 can pass through the atomizer core 10 , the main air channel 301 and reach the mouthpiece 31 in sequence.

[0086] Please further refer to Figures 10 and 11. Figure 10 is a partial cross-sectional structural diagram of the electronic atomization device provided in some embodiments of the present application, and Figure 11 is a cross-sectional structural diagram of the electronic atomization device in the embodiment of Figure 10 from another perspective.

[0087] In some embodiments, a receiving portion 321 may be provided at one end of the extension portion 320 away from the nozzle 31. The receiving portion 321 may form a receiving space 302, and the atomizer core 10 may be accommodated in the receiving space 302. The receiving portion 321 may also be provided with a liquid guide port 303, which connects the receiving space 302 and the liquid holding chamber 401, respectively, so that the liquid holding chamber 401 can be in liquid communication with the atomizer core 10 through the liquid guide port 303.

[0088] The receiving portion 321 can extend from the end of the extension portion 320 facing away from the nozzle 31. The receiving space 302 can be a groove defined in the receiving portion 321. The outer dimensions of the receiving portion 321 are larger than the outer dimensions of the end of the extension portion 320 facing away from the nozzle 31. The receiving portion 321, which forms a groove for the receiving space 302, has a bottom wall and side walls. The bottom wall contacts the second surface 120 of the atomizer core 10. The dimensions of the groove can be designed to match the dimensions of the atomizer core 10. For example, if the atomizer core 10 is in the shape of a square bar, the groove can be a square groove.

[0089] Optionally, the receiving portion 321 abuts against the second housing 400. Specifically, the bottom 410 of the second housing 400 may be provided with a limiting groove 402 communicating with the liquid receiving chamber 401, and the receiving portion 321 is at least partially accommodated in the limiting groove 402, and the receiving portion 321 abuts against the bottom wall of the limiting groove 402.

[0090] Wherein, the receiving portion 321 has a bottom surface 3211, a first side surface 3212 and a second side surface 3213. The first side surface 3212 and the second side surface 3213 extend from different parts of the periphery of the bottom surface 3211 respectively. In this way, the receiving portion 321 has a side surface that forms an undulating shape. Wherein, the bottom surface 3211 abuts against the bottom wall of the limiting groove 402, and the first side surface 3212 abuts against the side wall of the limiting groove 402 to achieve a limiting effect. The second side surface 3213 is spaced apart from the side wall of the limiting groove 402 so that the atomized matrix in the liquid holding chamber 401 can flow to the area between its side wall and the second side surface 3213 in the limiting groove 402. The liquid guide port 303 is opened on the second side surface 3213 and is connected to the limiting groove 402, and is connected to the liquid holding chamber 401 through the limiting groove 402, for introducing the atomized matrix into the receiving portion 321. The receiving portion 321 may have a plurality of first side surfaces 3212 and a plurality of second side surfaces 3213. For example, the receiving portion 321 may have two oppositely disposed first side surfaces 3212 and two oppositely disposed second side surfaces 3213. Each second side surface 3213 may have a liquid guide port 303 formed thereon.

[0091] Optionally, the second shell 400 has a guide slant wall 403 extending from the top of the side wall of the limiting groove 402. The guide slant wall 403 is formed at the portion where the bottom 410 of the second shell 400 contacts the side 420. That is, the portion of the side 420 used to assemble the first shell 300 can be regarded as extending from the top of the guide slant wall 403. The guide slant wall 403 is used to guide the atomized matrix into the limiting groove 402. Specifically, the guide slant wall 403 can be a conical inclined surface formed at the bottom 410, so as to guide all the atomized matrix into the limiting groove 402 to the greatest extent, thereby improving the utilization rate of the atomized matrix and reducing waste.

[0092] In some embodiments, the electronic atomization device 20 further includes a liquid guide 600 . The liquid guide 600 may be disposed in the receiving space 302 and contact the atomizer core 10 to guide the atomized matrix onto the atomizer core 10 .

[0093] The liquid guide member 600 can be disposed directly opposite the liquid guide port 303, so that the atomized substrate entering the receiving space 302 from the liquid guide port 303 can be quickly introduced into the liquid guide member 600. The orthographic projection of the liquid guide member 600 on the second side surface 3213 can cover the liquid guide port 303, so that the atomized substrate entering the receiving space 302 from the liquid guide port 303 can only be introduced into the side of the liquid guide member 600 and further transferred to the atomizer core 10. In addition, the liquid guide member 600 can fully absorb the atomized substrate introduced into the receiving space 302 from the liquid guide port 303.

[0094] The liquid guiding member 600 can also be provided through the liquid guiding port 303 , and one end of the liquid guiding member 600 located outside the receiving space 302 can extend into the limiting groove 402 or the liquid containing cavity 401 , so that the liquid guiding member 600 can contact the atomized matrix and further guide the atomized matrix onto the atomizing core 10 .

[0095] Optionally, the liquid guide 600 is located on the bottom side of the atomizer core 10 and contacts the first surface 110 of the atomizer core 10. The liquid guide 600 can cooperate with the receiving portion 321 to clamp the atomizer core 10. The atomizer core 10 and the liquid guide 600 can also abut against the side walls of the groove body of the receiving portion 321 to form the receiving space 303. The liquid guide 600 can also have an interference fit with the receiving portion 321 to facilitate assembly and positioning, reducing the risk of oil leakage during the atomization process.

[0096] Please refer to Figure 4. The liquid guide 600 can be provided with a first through-hole 601, and the number and position of the first through-hole 601 correspond one-to-one to the electrode 200 of the atomizer core 10. The receiving portion 321 is provided with a second through-hole 304, and the second through-hole 304 can be provided on the bottom surface 3211 of the receiving portion 321 and is connected to the first through-hole 601 and the receiving space 302. The second shell 400 is provided with a third through-hole 404, and the third through-hole 404 is connected to the second through-hole 304. The conductive column 700 of the electronic atomization device 20 can be passed through the first through-hole 601, the second through-hole 304 and the third through-hole 404, and abut against the electrode 200 of the atomizer core 10, and is electrically connected to the electrode 200.

[0097] The second through hole 304 may be an elongated hole so that the plurality of conductive pillars 700 can pass through the second through hole 304. The air inlet channel 32 provided in the second shell 400 may be connected to the second through hole 304 and connected to the atomizer core 10 through the second through hole 304.

[0098] In some embodiments, the base 500 is assembled to the second housing 400 and defines a fourth via hole 501 connected to the third via hole 404 and an air inlet hole 502 connected to the air inlet channel 32. The conductive pillar 700 is also disposed in the fourth via hole 501.

[0099] Please refer to Figures 12 and 13 together. Figure 12 is a schematic diagram of the cross-sectional structure of the electronic atomization device provided in some embodiments of the present application, and Figure 13 is a schematic diagram of the cross-sectional structure of the electronic atomization device in the embodiment of Figure 12 from another perspective.

[0100] In some embodiments, the electronic atomization device 20 further includes a partition wall 323 that divides the main airway 301 into multiple airways 305. The partition wall 323 can be disposed within the extension portion 322 and abut against the inner periphery of the extension portion 322. The partition wall 323 can be integrally formed with the extension portion 322. The number of airways 305 is the same as the number of atomization zones 101 of the atomizer core 10, and each airway 305 is connected to a respective atomization zone 101.

[0101] Specifically, each atomizing area 101 of the atomizer core 10 is directly opposite the entrance of an air passage 305, so that the aerosol generated by each atomizing area 101 of the atomizer core 10 can efficiently pass through the air passage 305. For example, the atomizer core 10 has a first atomizing area 102 and a second atomizing area 103, and two separated air passages 305 are formed in the air passage portion 322. The entrances of the two air passages 305 are respectively arranged directly opposite the first atomizing area 102 and the second atomizing area 103, and the outlets of the two air passages 305 are both connected to the mouthpiece 31. Therefore, regardless of whether either or both of the first atomizing area 102 and the second atomizing area 103 are in a heated state, the generated aerosol can be discharged through the mouthpiece 31.

[0102] Among them, the extension portion 322 and the partition wall 323 can both be walls extending straight along the axial direction of the first shell 300, so that the airway 305 formed by the extension portion 322 and the partition wall 323 is a straight channel, thereby allowing the aerosol to pass through the airway 305 quickly, thereby maximizing the atomization effect, increasing the atomization amount, and reducing the risk of carbon deposition, thereby extending the service life of the electronic atomization device 20.

[0103] Please refer to Figure 11. The bottom surface of each electrode 200 of the atomizer core 10 can be aligned with and abut against the corresponding conductive pillar 700, and the top surface of each electrode 200 can be aligned with and abut against the surface of the receiving portion 321 or the partition wall 323. This can offset the assembly torque of the receiving portion 321, the partition wall 323, the atomizer core 10, and the conductive pillar 700, thereby preventing the atomizer core 10 from being crushed.

[0104] In an embodiment of the present application, the electronic atomization device 20 may further include an electrically connected power supply and a power controller. The power controller has multiple interfaces corresponding to the electrodes 200 of the atomization core 10. For example, corresponding to an atomization core 10 having two positive electrodes and one negative electrode, the power controller has two positive power supply interfaces and one negative power supply interface. Each conductive column 700 that contacts each electrode 200 forms a path with the power supply through each interface of the power controller. In the atomization state, the power controller can cyclically control the corresponding interfaces to output a 1-5V voltage or a high level in a preset order, thereby achieving alternating cyclic heating of the multiple atomization zones 101 of the atomization core 10, reducing fatigue thermal stress in a single atomization zone 101, and thereby extending the service life of the atomization core 10 and the electronic atomization device 20.

[0105] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0106] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An atomizer core, characterized in that: It includes a silicon-based heating element that can generate heat when powered on, and at least three electrodes arranged on the silicon-based heating element. The electrodes are arranged at intervals from each other, and the silicon-based heating element between any two adjacent electrodes forms an atomization area that can generate heat independently.

2. The atomizer core according to claim 1, characterized in that: The atomization core includes a first electrode, a second electrode and a third electrode. The portion of the silicon-based heating element between the first electrode and the second electrode forms a first atomization zone. The portion of the silicon-based heating element between the third electrode and the second electrode forms a second atomization zone. The first atomization zone and the second atomization zone are configured to generate heat alternately.

3. The atomizer core according to claim 1, characterized in that: The silicon-based heating element has a first surface and a second surface that are opposite to each other. The silicon-based heating element also has guide holes that penetrate the first surface and the second surface. A plurality of the guide holes are disposed in the atomization area and are arranged in an array.

4. The atomizer core according to claim 3, characterized in that: The portion of at least one of the first surface and the second surface that forms the atomization area is a rough surface, and the plurality of flow guide holes arranged in an array all penetrate the rough surface.

5. The atomizer core according to claim 3, characterized in that: At least one of the first surface and the second surface is provided with a liquid storage tank, and the plurality of flow guide holes arranged in an array are all connected to the liquid storage tank.

6. The atomizer core according to claim 4, characterized in that: At least one of the first surface and the second surface is provided with a liquid storage groove, and the liquid storage groove and the rough surface are arranged opposite to each other.

7. The atomizer core according to claim 5 or 6, characterized in that: The depth of the liquid storage tank is between 1 / 3 and 1 / 2 of the thickness of the silicon-based heating element, and the thickness of the silicon-based heating element is the distance between the first surface and the second surface.

8. An electronic atomization device, characterized in that: It comprises a shell and an atomizer core as claimed in any one of claims 1 to 7, wherein the atomizer core is arranged in the shell, a liquid containing chamber is formed inside the shell, and the liquid containing chamber is connected to the atomizer core for liquid conduction; wherein an air inlet channel is arranged at one end of the shell, a suction nozzle is arranged at the other end, and a main air channel is arranged inside the shell, and the air inlet channel, the atomization area of ​​the atomizer core, the main air channel and the suction nozzle are connected in sequence.

9. The electronic atomization device according to claim 8, characterized in that: The electronic atomization device also includes a partition wall that divides the main air channel into a plurality of air channels, the number of the air channels is the same as the number of the atomization zones, and each of the air channels is respectively connected to one of the atomization zones.

10. The electronic atomization device according to claim 8, characterized in that: The electronic atomization device includes a first shell and a second shell, the first shell and the second shell are connected to form the outer shell, and are surrounded to form the liquid containing cavity, and the liquid containing cavity is used to store the atomization matrix; the suction nozzle is arranged in the first shell, and the air inlet channel is arranged in the second shell.

11. The electronic atomization device according to claim 10, characterized in that: The first shell includes a first shell portion and a second shell portion that are integrally arranged. The outer contour size of the first shell portion is larger than the outer contour size of the second shell portion. The first shell portion overlaps the second shell portion and cooperates with the second shell portion to form the outer shell. The second shell portion is embedded in the second shell portion.

12. The electronic atomization device according to claim 10, characterized in that: The electronic atomization device includes an extension portion extending from one end of the first shell body where the suction nozzle is provided, the extension portion is located inside the shell and surrounds the main airway; a receiving portion is provided at one end of the extension portion away from the suction nozzle, a receiving space connected to the main airway is formed in the receiving portion, and the atomization core is accommodated in the receiving space; the receiving portion is also provided with a liquid guide port, and the liquid guide port is respectively connected to the receiving space and the liquid holding chamber.

13. The electronic atomization device according to claim 12, characterized in that: The electronic atomization device includes a liquid guiding member, which is accommodated in the receiving space and abuts against the atomization core; the liquid guiding member is arranged opposite to the liquid guiding port, or the liquid guiding member is passed through the liquid guiding port to guide the atomization matrix to the atomization core.

14. The electronic atomization device according to claim 13, characterized in that: The liquid guide member is located on the bottom side of the atomizer core and is provided with a first through hole, the receiving portion is provided with a second through hole, and the second shell is provided with a third through hole; the electronic atomization device also includes a conductive column passing through the first through hole, the second through hole and the third through hole, and the conductive column is in contact with the electrode of the atomizer core and is electrically connected to the electrode.

15. The electronic atomization device according to claim 12, characterized in that: The receiving portion abuts against the second shell.

16. The electronic atomization device according to claim 15, characterized in that: The second shell is provided with a limiting groove communicating with the liquid containing cavity, the receiving portion is at least partially received in the limiting groove, and the receiving portion abuts against the bottom wall of the limiting groove.

17. The electronic atomization device according to claim 16, characterized in that: The receiving portion has a bottom surface, a first side surface, and a second side surface, wherein the first side surface and the second side surface extend from different parts of the circumference of the bottom surface respectively; wherein the bottom surface abuts against the bottom wall of the limiting groove, the first side surface abuts against the side wall of the limiting groove, and the second side surface is spaced apart from the side wall of the limiting groove; the liquid guide port is opened on the second side surface and is connected to the liquid holding chamber through the limiting groove.

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