Substrate lower receiving device and substrate processing device

Abstract

A substrate lower receiving device according to the present invention comprises a top plate and a base body. The top plate is provided with: an upper surface that contacts a lower surface of a substrate; a plurality of substrate suction paths that are opened in the upper surface; and a negative pressure introduction path that introduces negative pressure into the plurality of substrate suction paths. The base body is provided with: a vacuum chuck part that contacts the lower surface of the top plate to vacuum-chuck the top plate; and a substrate suctioning negative pressure supply part that supplies negative pressure to the negative pressure introduction path of the top plate vacuum-chucked by the vacuum chuck part.

Description

Substrate receiving device and substrate processing device

[0001] The present invention relates to a substrate receiving device that receives a substrate from below in a substrate processing apparatus that performs a predetermined process on the substrate, and to a substrate processing apparatus equipped with this substrate receiving device.

[0002] Conventionally, a known substrate processing apparatus performs a predetermined process on a substrate, such as screen printing, which prints a paste such as solder on the substrate. In the screen printing apparatus, a substrate to be screen printed is supported (supported) from below by a support device. An example of such a substrate support device is disclosed in Patent Document 1 (Patent Document 1). The substrate support device disclosed in Patent Document 1 includes a top plate (substrate support member) with suction holes on its upper surface and a base body (support member installation section) that holds the top plate. After the substrate is placed on the top plate, air is sucked out through the suction holes to vacuum-suck the substrate. The top plate varies in shape and size depending on the size of the substrate, so when switching between different types of substrates to be produced, the top plate is also replaced with respect to the base body.

[0003] Japanese Patent Application Laid-Open No. 2017-144642

[0004] However, in the above-mentioned conventional substrate support device, the top plate was held on the base body by the magnetic force between the magnet and the magnetic material, so if the magnetic force was weak, the holding force of the top plate was insufficient, making the position of the substrate unstable, and if the magnetic force was too strong, it became difficult to replace the top plate.

[0005] Therefore, the present invention aims to provide a substrate support device and a substrate processing device that can not only securely hold a substrate through a top plate by vacuum suction, but also easily replace the top plate relative to the base body.

[0006] The substrate underside support device of the present invention includes a top plate and a base body. The top plate has an upper surface that contacts the underside of a substrate, a plurality of substrate suction paths that open to the top surface, and negative pressure introduction paths that introduce negative pressure into the plurality of substrate suction paths. The base body has a vacuum chuck unit that contacts the underside of the top plate to vacuum-chuck the top plate, and a substrate suction negative pressure supply unit that supplies negative pressure to the negative pressure introduction paths of the top plate vacuum-chucked by the vacuum chuck unit.

[0007] The substrate processing apparatus of the present invention is a substrate processing apparatus that performs a predetermined process on the substrate supported by the substrate support device of the present invention, wherein the top plate is freely replaceable with respect to the base body, and the operation of replacing the top plate with respect to the base body is performed by turning on and off the vacuum chuck of the top plate by the vacuum chuck section.

[0008] According to the present invention, not only can the substrate be reliably held by vacuum suction through the top plate, but the top plate can also be easily replaced with respect to the base body.

[0009] FIG. 1 is a plan view of a screen printing apparatus according to an embodiment of the present invention; FIG. 2 is a side view of a screen printing apparatus according to an embodiment of the present invention; FIG. 3 is an exploded perspective view of a support unit provided in the screen printing apparatus according to an embodiment of the present invention; FIG. 4 is a cross-sectional view of a support unit according to an embodiment of the present invention; FIG. 5 is an exploded perspective view of a top plate provided in the support unit according to an embodiment of the present invention; FIG. 6 is an exploded cross-sectional view of a top plate provided in the support unit according to an embodiment of the present invention; FIG. 7 is a block diagram showing a control system of the screen printing apparatus according to an embodiment of the present invention;

[0010] 1 and 2 show a screen printing apparatus 1 according to an embodiment of the present invention.

[0011] The screen printing apparatus 1 is an apparatus for carrying in a substrate KB supplied from an upstream process side and performing a screen printing operation in which a paste Pst such as solder is printed on an electrode pattern DK provided on the substrate KB. In this embodiment, the flow direction of the substrate KB in the screen printing apparatus 1 (the horizontal direction from left to right in FIG. 1 , the lateral direction as seen from the operator OP) is defined as the X direction, the direction in the horizontal plane perpendicular to the X direction (the front-to-back direction as seen from the operator OP) is defined as the Y direction, and the up-down direction is defined as the Z direction.

[0012] 1 and 2, the screen printing apparatus 1 includes a substrate holding and moving mechanism 12 on a base 11. A mask 13 is installed above the substrate holding and moving mechanism 12, and a print head 14 is disposed above the mask 13.

[0013] 2, the substrate holding and moving mechanism 12 comprises a substrate holding unit 21 and a unit moving mechanism 22. The substrate holding unit 21 transports the substrate KB to a predetermined position and holds the transported substrate KB. The unit moving mechanism 22 moves the entire substrate holding unit 21 in a horizontal plane (XY plane) and up and down (Z direction).

[0014] 2, the board holding unit 21 has a pair of conveyor support members 32 that extend upward and are arranged opposite each other in the Y direction (front-to-back direction) on a lift plate 31 that serves as a base. A pair of conveyors 33 are attached to the inner surfaces of the pair of conveyor support members 32 (the surfaces that face each other). The conveyors 33 extend in the X direction and are arranged parallel to each other and facing each other in the Y direction. The pair of conveyors 33 transport the board KB in the X direction and position it at a predetermined position.

[0015] 2, a support unit 34 serving as a substrate support device is provided above the lift plate 31. The support unit 34 can be raised and lowered by a lift actuator 35 provided on the lift plate 31. A pair of clamp members 36, which are provided above the conveyor 33 and can be opened and closed in the Y direction, are provided at the upper ends of the pair of conveyor support members 32 (see also FIG. 1).

[0016] In Figures 3(a), (b) and 4, the support unit 34 comprises a base table 41 that is raised and lowered by a lifting actuator 35, a base body 42 and an auxiliary support part 43 provided on the upper surface of the base table 41, and a top plate 44 that is detachably held on the upper surface of the base body 42 and supported by the auxiliary support part 43.

[0017] The top plate 44 is detachably held by the base body 42 by having the lower surface at one end in the X direction attracted to the base body 42. The top plate 44 attracts and supports the lower surface of the board KB positioned in a predetermined position by the conveyor 33. A plurality of sizes of top plates 44 are prepared according to the sizes of the board KB, and the top plate 44 according to the size of the board KB to be supported is selected and attracted and held by the base body 42.

[0018] The auxiliary support portion 43 supports the underside of the other end in the Y direction of the top plate 44. The auxiliary support portion 43 is movable in the Y direction along guide rails 41G ( FIGS. 3A and 3B ) provided on the upper surface of the base table 41. The auxiliary support portion 43 moves in the Y direction according to the size of the top plate 44 in the Y direction, thereby stably supporting the other end of the top plate 44 regardless of the size of the top plate 44 (more specifically, the dimension in the Y direction).

[0019] In this manner, in this embodiment, the auxiliary support portion 43 supports a part of the lower surface of the top plate 44 by changing the relative position with respect to the base body 42 depending on the size of the board KB.

[0020] The top plate 44 has an upper surface, which serves as a lower receiving surface for receiving the substrate KB. As shown in Fig. 4, the top plate 44 has a plurality of substrate suction paths 51 that open at multiple locations on its upper surface (lower receiving surface), and negative pressure introduction paths 52 that introduce negative pressure into the plurality of substrate suction paths 51. In Figs. 4, 5, and 6(a) and (b), the top plate 44 has a top plate upper half 44a having the plurality of substrate suction paths 51, and a top plate lower half 44b having the negative pressure introduction paths 52 and joined to the underside of the top plate upper half 44a.

[0021] In this embodiment, the upper surface of the top plate upper half 44a corresponds to the upper surface of the top plate 44, and the lower surface of the top plate lower half 44b corresponds to the lower surface of the top plate 44. As shown in Figures 3(a), (b), 5, and 6(a) and (b), the upper surface of the top plate 44 (top plate upper half 44a) is provided with a plurality of interference avoidance portions 53 that open onto the upper surface of the top plate 44 to avoid interference with components BH and the like mounted on the underside of the supported board KB.

[0022] The arrangement of the interference avoidance portions 53 on the top plate 44 differs depending on the arrangement of the components BH mounted on the back side of the board KB that is the object of production (i.e., the object to be supported by the top plate 44). For this reason, a plurality of top plates 44 are prepared in advance according to not only the size of the board KB that is the object of production, but also the arrangement of the components BH mounted on the back side of the board KB (hence the arrangement of the interference avoidance portions 53 formed on the upper surface of the top plate 44).

[0023] 5 and 6(a), the top plate lower half 44b has a recessed groove 54 that opens to the upper surface. When the top plate lower half 44b is joined to the top plate upper half 44a, the recessed groove 54 is covered by the top plate upper half 44a (FIG. 6(a) → FIG. 6(b)), thereby forming a communication passage 55 between the top plate lower half 44b and the top plate upper half 44a (i.e., inside the top plate 44) (FIG. 6(b)).

[0024] 4 and 6(a) and (b), the plurality of substrate suction paths 51 each extend through the top plate upper half 44a in the thickness direction and are connected to the communication paths 55 of the top plate 44. In other words, the plurality of substrate suction paths 51 provided in the top plate 44 are in communication with each other via the communication paths 55 provided within the top plate 44.

[0025] As described above, in this embodiment, the top plate 44 has a top plate upper half 44a having a plurality of substrate suction paths 51, and a top plate lower half 44b having a negative pressure introduction path 52 and joined to the underside of the top plate upper half 44a, and the communicating path 55 is formed by joining the top plate upper half 44a and the top plate lower half 44b. In detail, the communicating path 55 is formed by a recessed groove 54 provided in the top plate lower half 44b and opening on the upper surface joined to the top plate upper half 44a, and the underside of the top plate upper half 44a that closes the recessed groove 54 when the top plate lower half 44b and the top plate upper half 44a are joined, and the plurality of substrate suction paths 51 are each provided to vertically penetrate the top plate upper half 44a.

[0026] 4, 5, 6(a) and 6(b), a first gasket 56 is provided between the top plate upper half 44a and the top plate lower half 44b as a first sealing member that seals the joint surface between the top plate upper half 44a and the top plate lower half 44b. The first gasket 56 prevents air (pressure) from leaking from between the top plate upper half 44a and the top plate lower half 44b.

[0027] 4 and 5, the negative pressure introduction path 52 is provided so as to open to the underside of the top plate lower half 44b and is connected to the communication path 55. Therefore, when negative pressure is introduced from the negative pressure introduction path 52, a suction force is generated in each of the plurality of substrate suction paths 51 through the communication path 55, and when a substrate KB is placed on the upper surface of the top plate 44 (the upper surface of the top plate upper half 44a), the substrate KB is vacuum-sucked to the upper surface of the top plate 44. In this embodiment, as shown in FIG. 5, a plurality of negative pressure introduction paths 52 are provided side by side in the Y direction and each is connected to a recessed groove 54 (i.e., the communication path 55), but it is sufficient that at least one negative pressure introduction path 52 is provided.

[0028] The upper surface of the base body 42 serves as a top-plate contact surface that comes into contact with the lower surface of the top plate 44. As shown in Figures 3(a) and (b), the base body 42 has an opening on its upper surface (top-plate contact surface) and a recess 57 that forms a sealed area with the top plate 44 (top-plate lower half 44b) that comes into contact with the upper surface, and a substrate suction negative pressure supply part 58 that is connected to the negative pressure introduction path 52 provided in the top plate 44.

[0029] 3A, substrate suction negative pressure supply unit 58 has a shape that extends in the Y direction, and is located below negative pressure introduction paths 52 (plurality of negative pressure introduction paths 52 aligned in the Y direction) provided in top plate 44 when top plate 44 is held on the upper surface of base body 42. Recess 57 has the same dimension in the Y direction as substrate suction negative pressure supply unit 58, and has a dimension in the X direction that is larger than that of substrate suction negative pressure supply unit 58.

[0030] 3A, a convex portion 59P that protrudes upward is provided on the upper surface of the base body 42. Meanwhile, a concave convex portion receiving portion 59Q that can fit into the convex portion 59P is provided on the lower surface of the top plate 44 (more specifically, the top plate lower half 44b). The convex portion 59P and the convex portion receiving portion 59Q are each provided at two locations along the X direction, and the top plate 44 can be positioned relative to the base body 42 by fitting the two convex portions 59P on the base body 42 into the two convex portion receiving portions 59Q on the top plate 44 (FIG. 4).

[0031] 3(a) and 4, a second gasket 60 is installed between the base body 42 and the top plate 44 (more specifically, on the top surface of the base body 42) as a second sealing member that seals the joint surface between the base body 42 and the top plate 44. The second gasket 60 prevents air (pressure) from leaking from between the base body 42 and the top plate 44.

[0032] 4, the aforementioned interference avoidance portion 53 is available in two types: a low-height type in which the bottom of the hole does not reach the top plate lower half 44b (interference avoidance portion 53 also marked with the symbol "53A"), and a high-height type in which the bottom of the hole reaches the top plate lower half 44b or passes vertically through the top plate 44 (interference avoidance portion 53 also marked with the symbol "53B"). The high-height type interference avoidance portion 53 has a length that passes vertically through at least the top plate upper half 44a.

[0033] When the top plate 44 has the above-described high-height interference avoidance portion 53, a through-hole 53H constituting a part of the height of the interference avoidance portion 53 is provided in the first gasket 56, and a lower end portion (through-hole or bottom portion) 53T of the interference avoidance portion 53 is provided in the top plate lower half 44b. In this case, the recessed groove 54 is formed so as to avoid the lower end portion 53T of the interference avoidance portion 53 provided in the top plate lower half 44b, as shown in FIG.

[0034] 4, a first negative pressure supply line 61 connected to a vacuum source VP installed outside the support unit 34 is connected to a recess 57 provided in the base body 42. A second negative pressure supply line 62 connected to the vacuum source VP is connected to a substrate suction negative pressure supply unit 58 provided in the base body 42.

[0035] 4, a first control valve 63 is provided in the first negative pressure supply line 61, and a second control valve 64 is provided in the second negative pressure supply line 62. The first control valve 63 is a valve that opens and closes the first negative pressure supply line 61, and operates to send the negative pressure supplied by the vacuum source VP into the recess 57 through the first negative pressure supply line 61, close the first negative pressure supply line 61, or release the negative pressure in the recess 57 to the atmosphere through the first negative pressure supply line 61 (discharge the negative pressure). The second control valve 64 is a valve that opens and closes the second negative pressure supply line 62, and sends the negative pressure supplied by the vacuum source VP into the substrate suction negative pressure supply unit 58 through the second negative pressure supply line 62, closes the second negative pressure supply line 62, or releases the negative pressure in the substrate suction negative pressure supply unit 58 to the atmosphere through the second negative pressure supply line 62 (discharges the negative pressure).

[0036] With the top plate 44 placed on the top surface of the base body 42, the recess 57 becomes a sealed area sealed by the top plate 44. Therefore, when the first control valve 63 is operated with the top plate 44 placed on the top surface of the base body 42 and the negative pressure supplied by the vacuum source VP is sent into the recess 57, a suction force is generated in the sealed area within the recess 57, and the top plate 44 is vacuum-sucked (vacuum chucked) to the base body 42.

[0037] In this embodiment, the recess 57 provided in the base body 42 and forming a sealed area between the top plate 44 in contact with the base body 42 serves as a vacuum chuck portion that vacuum-chucks the top plate 44 when negative pressure is supplied thereto.

[0038] 1, the mask 13 has a rectangular shape, and its periphery is held by a rectangular mask frame 13W. The mask 13 is made of a metal plate, and has pattern openings 13K formed in its center in an arrangement corresponding to the arrangement of the electrode patterns DK formed on the surface of the substrate KB. A pair of mask support portions 13G extending in the Y direction and facing each other in the X direction are provided above the substrate holding unit 21 (see also FIG. 2). The mask 13 is positioned above the substrate holding unit 21 with its two opposing sides in the X direction supported by the mask support portions 13G.

[0039] 1 and 2, the print head 14 extends in the X direction and is provided with two squeegees 14S below it. The two squeegees 14S are each made of a spatula-shaped member extending in the X direction and are arranged opposite each other in the Y direction.

[0040] The two squeegees 14S can be raised and lowered independently relative to the print head 14. The print head 14 is moved in the Y direction by a print head movement mechanism 14M (FIGS. 1 and 2). The print head movement mechanism 14M consists of a ball screw 14a extending in the Y direction and a drive motor 14b that rotates the ball screw 14a. When the drive motor 14b rotates the ball screw 14a around its axis, the print head 14 moves in the Y direction.

[0041] 7 shows the control system of the screen printing apparatus 1. A control unit 70 provided in the screen printing apparatus 1 controls the transportation of the substrate KB by the substrate holding unit 21, the lifting and lowering of the support unit 34 and the clamping operation of the substrate KB, and the movement operation of the substrate holding unit 21 by the unit movement mechanism 22. The control unit 70 also controls the movement operation of the print head 14 by the print head movement mechanism 14M and the lifting and lowering operation of the squeegee 14S provided in the print head 14. The control unit 70 also controls the operation of the first control valve 63 and the second control valve 64.

[0042] Next, we will explain the procedure for performing screen printing using the screen printing apparatus 1. Before starting the screen printing operation, first, the top plate 44 is set on the base body 42. A plurality of top plates 44 are prepared in advance depending on the size of the board KB to be produced and the arrangement of the components BH mounted on the back side of the board KB. One that corresponds to the board KB to be screen printed is selected and set on the base body 42.

[0043] To set the top plate 44 on the base body 42, first, the top plate 44 is placed on the upper surface of the base body 42. At this time, two convex portion receiving portions 59Q provided on the top plate 44 are fitted into two convex portions 59P provided on the base body 42, thereby positioning the top plate 44 with respect to the base body 42. Furthermore, by adjusting the X-direction position of the auxiliary support portions 43 relative to the base table 41 according to the size of the top plate 44 in the X direction, the top plate 44 is stably supported by the base body 42 and the auxiliary support portions 43.

[0044] When the top plate 44 is placed on the base body 42 as described above, the recesses 57 formed in the base body 42 are blocked by the underside of the top plate 44. Furthermore, each of the plurality of negative pressure introduction paths 52 opening on the underside of the top plate 44 is connected to a substrate suction negative pressure supply unit 58 formed in the base body 42.

[0045] Once the top plate 44 is placed on the base body 42, the control unit 70 operates the first control valve 63 to send negative pressure supplied from the vacuum source VP to the first negative pressure supply line 61. When negative pressure is sent to the first negative pressure supply line 61, negative pressure is introduced into the sealed region formed between the recess 57 of the base body 42 and the underside of the substrate KB, and the top plate 44 is sucked toward the upper surface of the base body 42 (see arrow P1 indicating the air flow in FIG. 8 ). As a result, the top plate 44 is vacuum-chucked to the base body 42, and the top plate 44 is set on the base body 42. After the top plate 44 is set on the base body 42, the first control valve 63 is operated to close the first negative pressure supply line 61, so that the negative pressure state in the recess 57 (i.e., the vacuum-chucked state of the substrate KB) is maintained.

[0046] Once the top plate 44 is set on the base body 42, the screen printing operation begins. In the screen printing operation, first, the substrate KB sent from the upstream process side of the screen printing apparatus 1 is carried in by the conveyor 33 and positioned at a predetermined position. Once the substrate KB is positioned at the predetermined position, the lifting actuator 35 is actuated to lift the base table 41 (arrow A1 shown in FIG. 9( a)), and the upper surface of the top plate 44 is brought into contact with the lower surface of the substrate KB on the conveyor 33 ( FIG. 9( a)). As a result, each of the multiple substrate suction paths 51 opening in the upper surface of the top plate 44 is sealed by the top plate.

[0047] When the top plate 44 comes into contact with the substrate KB, the control unit 70 activates the second control valve 64, which supplies the negative pressure from the vacuum source VP to the substrate suction negative pressure supply unit 58 of the base body 42 through the second negative pressure supply line 62. This causes negative pressure to be sent from the substrate suction negative pressure supply unit 58 into the negative pressure introduction path 52 of the top plate 44, and negative pressure is introduced into each of the plurality of substrate suction paths 51 through the communication paths 55. This generates a suction force in each substrate suction path 51, sucking the underside of the substrate KB toward the upper surface of the top plate 44 (see arrow P2 indicating the air flow in FIG. 8), and the substrate KB is sucked and held on the upper surface of the top plate 44, and is therefore supported by the top plate 44 (and therefore by the support unit 34).

[0048] Once the substrate KB has been sucked and held on the upper surface of the top plate 44 as described above, the lifting actuator 35 is actuated to lift the base table 41 (arrow A2 shown in FIG. 9(b)). This lifts the substrate KB, and the substrate KB moves upward away from the conveyor 33. Then, once the upper surface of the substrate KB is flush with the upper surfaces of the clamp members 36, the lifting actuator 35 stops the lifting of the base table 41 (FIG. 9(b)). Once the lifting of the base table 41 has stopped, the clamp members 36 are actuated to clamp the substrate KB from the Y direction (arrow B shown in FIG. 9(b)).

[0049] Once the substrate KB has been clamped by the clamp members 36, the unit moving mechanism 22 is actuated to move the substrate holding unit 21 horizontally so that the electrode pattern DK on the substrate KB and the pattern openings 13K formed in the mask 13 are aligned in the vertical direction. The unit moving mechanism 22 then raises the substrate holding unit 21 (arrow A3 shown in FIG. 9( c )), and stops the raising of the substrate holding unit 21 when the upper surface of the substrate KB comes into contact with the lower surface of the mask 13. This brings the electrode pattern DK on the substrate KB into alignment with the pattern openings 13K formed in the mask 13.

[0050] After the upper surface of the substrate KB is brought into contact with the lower surface of the mask 13, paste Pst is supplied to the upper surface of the mask 13, and then one of the two squeegees 14S provided on the print head 14 is lowered so that its lower end abuts on the upper surface of the mask 13 ( FIG. 10( a)). Then, once the lower end of the squeegee 14S abuts on the upper surface of the mask 13, the print head moving mechanism 14M moves the print head 14 in the Y direction ( FIG. 10( a) → FIG. 10( b)). As a result, the paste Pst is scraped onto the mask 13 by the squeegee 14S, and the paste Pst is applied to the electrode pattern DK through the pattern openings 13K of the mask 13.

[0051] After the paste Pst has been applied to the substrate KB by the squeegee 14S, the unit moving mechanism 22 lowers the substrate holding unit 21 to pull the substrate KB downward from the mask 13 (to separate the substrate KB from the mask). After the substrate KB has been separated from the mask, the pair of clamp members 36 are moved in the separation direction to release the clamp on the substrate KB. After the clamp on the substrate KB has been released, the lifting actuator 35 lowers the base table 41, and the substrate KB is lowered onto the conveyor 33.

[0052] Once the board KB has been lowered onto the conveyor 33, the second control valve 64 is operated to open the board suction negative pressure supply unit 58 to the atmosphere and discharge the negative pressure within the board suction path 51. This releases the suction state of the board KB, making it possible to move the board KB from the top plate 44. Once it is possible to move the board KB, the conveyor 33 transports the board KB to the outside. This completes the printing operation for one board KB.

[0053] In this manner, the screen printing apparatus 1 in this embodiment functions as a substrate processing apparatus that performs screen printing (predetermined processing) on ​​the substrate KB supported by the support unit 34. In this screen printing apparatus 1, the top plate 44 is replaceable with respect to the base body 42, and the replacement of the top plate 44 is performed by turning on and off the vacuum chuck of the top plate 44 using the vacuum chuck portion (recess 57).

[0054] More specifically, when the top plate 44 is held on the base body 42, the first control valve 63 is operated as described above so that the negative pressure supplied from the vacuum source VP is introduced into the recess 57 of the base body 42. On the other hand, when the top plate 44 is removed from the base body 42 (to release the holding), the first control valve 63 is operated to open the sealed region formed by the recess 57 and the top plate 44 to the atmosphere through the first negative pressure supply pipe 61, and the negative pressure inside the recess 57 (i.e., inside the vacuum chuck portion) is discharged.

[0055] As described above, the support unit 34 in this embodiment has a top plate 44 which has a plurality of substrate suction paths 51 opening on its upper surface which contacts the underside of the substrate KB and negative pressure introduction paths 52 which introduce negative pressure into the plurality of substrate suction paths 51, and a base body 42 which has a vacuum chuck portion (recess 57) which contacts the underside of the top plate 44 to vacuum chuck the top plate 44 and a substrate suction negative pressure supply portion 58 which supplies negative pressure to the negative pressure introduction paths 52 of the top plate 44 vacuum-chucked by the vacuum chuck portion, so that the substrate KB can be held on the top plate 44 and released from that state by controlling the supply and discharge (supply and discharge) of negative pressure to the vacuum chuck portion (recess 57). Therefore, the substrate support device (support unit 34) in this embodiment not only can reliably hold the substrate KB by vacuum suction through the top plate 44, but also allows the top plate 44 to be easily replaced with respect to the base body 42.

[0056] The above-described work of replacing the top plate 44 with respect to the base body 42 (the work of installing and removing the top plate 44) may be performed manually by an operator OP, or may be performed automatically by introducing a device for replacing the top plate 44 into the screen printing apparatus 1. When replacing the top plate 44 automatically, for example, a carrier member (not shown) that detachably holds the top plate 44 is positioned above the base body 42 using the mask support portion 13G or the like, and the base body 42 is raised by the unit moving mechanism 22 and the lifting actuator 35, thereby transferring the top plate 44 between the carrier member and the base body 42.

[0057] As described above, in the substrate support unit 34 (screen printing apparatus 1, which is a substrate processing apparatus equipped with the support unit 34) serving as the substrate support device in this embodiment, the base body 42 holding the top plate 44 that vacuum-suctions the underside of the substrate KB is equipped with a vacuum chuck portion (recess 57) that vacuum-chucks the top plate 44, and a substrate suction negative pressure supply portion 58 that supplies negative pressure to the top plate 44 vacuum-chucked by the vacuum chuck portion to vacuum-suction the substrate KB, so that the substrate KB can be held on the top plate 44 and released from that state by controlling the supply and discharge of negative pressure to the vacuum chuck portion (recess 57). Therefore, the substrate support device (support unit 34) in this embodiment can reliably hold the substrate KB by vacuum suction, while also easily replacing the top plate 44 with respect to the base body 42.

[0058] While the present invention has been described above with reference to exemplary embodiments, it is not limited to the above and various modifications are possible. For example, in the above-described exemplary embodiments, the interference avoidance portion 53 for avoiding interference with components BH mounted on the underside of the circuit board KB is provided as an opening on the upper surface of the top plate 44. However, when a circuit board KB without components BH mounted on its underside is supported from below, the interference avoidance portion 53 does not need to be provided on the top plate 44. Also, in the above-described exemplary embodiments, the recessed groove 54 forming the communication passage 55 is provided in the top plate lower half 44b. However, the recessed groove 54 may be provided in the top plate upper half 44a. In this case, when the top plate lower half 44b and the top plate upper half 44a are joined, the recessed groove 54 is closed by the upper surface of the top plate lower half 44b, thereby forming the communication passage 55.

[0059] In the above-described embodiment, the top plate 44 is composed of an upper half 44a and a lower half 44b, but the top plate 44 does not necessarily have to be composed of these two halves, and may be composed of a single member. However, if the top plate 44 is composed of these two halves 44a and 44b, there is an advantage in that it is easier to form the plurality of substrate suction paths 51, communication paths 55, and negative pressure introduction paths 52 in the top plate 44. In the above-described embodiment, the auxiliary support portion 43, which supports a portion of the underside of the top plate 44 by changing its position relative to the base body 42, is composed as part of the support unit 34. However, the auxiliary support portion 43 does not necessarily have to be part of the support unit 34, and a portion of the screen printing apparatus 1 other than the support unit 34 may function as the auxiliary support portion 43.

[0060] Furthermore, in the above-described embodiment, the substrate processing apparatus that performs a predetermined process on the substrate KB supported by the substrate support device (support unit 34) is a screen printing apparatus that performs screen printing on the substrate KB, but the substrate processing apparatus may also be another apparatus different from the screen printing apparatus (for example, a component mounting apparatus that mounts components on the substrate KB).

[0061] Provided is a substrate receiving device and a substrate processing device that can not only securely hold a substrate by vacuum suction through a top plate, but also easily replace the top plate with respect to a base body.

[0062] DESCRIPTION OF SYMBOLS 1 Screen printing apparatus (substrate processing apparatus) 34 Lower support unit (substrate lower support device) 41 Base table 41G Guide rail 42 Base body 43 Auxiliary support portion 44 Top plate 44a Top plate upper half 44b Top plate lower half 51 Substrate suction path 52 Negative pressure introduction path 53 Interference avoidance portion 55 Communication path 54 Concave groove 56 First gasket (first sealing member) 57 Concave portion (vacuum chuck portion) 58 Substrate suction negative pressure supply portion 60 Second gasket (second sealing member) 61 First negative pressure supply pipe 62 Second negative pressure supply pipe 63 First control valve 64 Second control valve 70 Control portion KB Substrate

Claims

1. A substrate under-support device having: a top plate having an upper surface which contacts the underside of a substrate, a plurality of substrate suction passages which open onto said upper surface, and a negative pressure introduction passage which introduces negative pressure to said plurality of substrate suction passages; a vacuum chuck section which contacts the underside of said top plate to vacuum chuck said top plate; and a base body having a substrate suction negative pressure supply section which supplies negative pressure to the negative pressure introduction passages of the top plate vacuum chucked by said vacuum chuck section.

2. A substrate supporting device as described in claim 1, wherein the top plate further has an internal communication passage that interconnects the plurality of substrate suction paths, and the negative pressure introduction path introduces negative pressure into the plurality of substrate suction paths through the communication passage.

3. The board underside support device as described in claim 1, wherein the top plate further comprises an interference avoidance portion for avoiding interference with components mounted on the underside of the board, the interference avoidance portion having an opening on the upper surface of the top plate.

4. The substrate under-support device of claim 3, wherein the top plate has an upper half having the plurality of substrate suction paths, and a lower half having the negative pressure introduction path and joined to the underside of the upper half, and the communication path is formed by joining the upper half and the lower half of the top plate.

5. A substrate under-support device as described in claim 4, wherein the lower half of the top plate further has a concave groove opening into an upper surface of the lower half of the top plate which is joined to the upper half of the top plate, the communicating passage being formed from the concave groove and the underside of the upper half of the top plate which closes the concave groove when the lower half of the top plate and the upper half of the top plate are joined, and each of the multiple substrate suction paths penetrates the upper half of the top plate in the vertical direction.

6. A substrate supporting device as described in claim 5, wherein when the interference avoidance portion has a length penetrating at least the upper half of the top plate in the vertical direction, the concave groove is formed so as to avoid the interference avoidance portion.

7. The substrate supporting device according to claim 6, further comprising a first seal member for sealing a joint surface between said top plate upper half and said top plate lower half.

8. The substrate supporting device according to claim 1, wherein the vacuum chuck portion comprises a recess that opens onto an upper surface of the base body and forms a sealed area between the top plate in contact with the base body and the base body.

9. The substrate supporting device according to claim 8, further comprising a second seal member for sealing the joint surface between said base body and said top plate.

10. A substrate processing apparatus which performs a predetermined process on the substrate supported by a substrate support device according to any one of claims 1 to 9, wherein the top plate is freely replaceable with respect to the base body, and the operation of replacing the top plate with respect to the base body is performed by turning on and off the vacuum chuck of the top plate by the vacuum chuck section.

11. The substrate processing apparatus according to claim 10, further comprising an auxiliary support section which supports a portion of the lower surface of said top plate by changing a position relative to said base body.

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