Electronic device including antenna

Abstract

An electronic device including an antenna is provided. The electronic device may include: at least one wireless communication circuit configured to provide a signal of a specified frequency band to a conductive portion operating as an antenna radiator; a first ground member arranged in a housing; a second ground member arranged in the housing; a first matching circuit arranged on a first feeding line for transmitting a first feeding signal of a first frequency band, the first feeding signal being provided to a first feeding point on the conductive portion, and grounded to the first ground member; a first filter connected to the first feeding point and grounded to the second ground member; a second matching circuit arranged on a second feeding line for transmitting a second feeding signal of a second frequency band, the second feeding signal being provided to a second feeding point on the conductive portion, and grounded to the first ground member; and a second filter connected to the second feeding point and grounded to the second ground member.

Description

electronic device with antenna

[0001] The present disclosure relates to an electronic device having an antenna, and more particularly, to an electronic device including a conductive member that operates as an antenna radiator.

[0002] The use of electronic devices such as smartphones or tablet PCs of bar type, foldable type, rollable type, and sliding type is increasing, and various functions are provided by the electronic devices. The electronic devices can perform wireless communication with other electronic devices using at least one antenna. For example, at least a portion of the housing of the electronic device may be formed of a conductive material (e.g., metal), and the electronic device may use at least a portion of the housing formed of the conductive material as an antenna (or radiator, or antenna radiator) for performing wireless communication. The electronic device can radiate signals of multiple frequency bands by providing multiple feeding signals to one conductive material.

[0003] One embodiment may provide an electronic device, comprising: a housing (210) including a front plate (202) facing the front of the electronic device, a rear plate (211) facing the rear of the electronic device, and a side member (218) disposed between the front plate and the rear plate, the side member including a conductive portion that operates as an antenna radiator; at least one wireless communication circuit (192) electrically connected to the conductive portion and providing a signal of a designated frequency band; a first ground member (301) disposed within the housing; a second ground member (302) disposed within the housing so as to at least partially overlap the first ground member; a first matching circuit (310) disposed on a first feed line that transmits a first feed signal of a first frequency band provided from the at least one wireless communication circuit to a first feed point on the conductive portion, the first matching circuit being grounded to the first ground member; and a first filter (312) connected to the first feed point and grounded to the second ground member. In addition, the electronic device may include a second matching circuit (320) disposed on a second feed line for transmitting a second feed signal of a second frequency band provided from the at least one wireless communication circuit to a second feed point on the conductive portion, the second matching circuit being grounded to the first ground member; and a second filter (322) connected to the second feed point and grounded to the second ground member.

[0004] In addition, one embodiment may provide an electronic device including a housing (210) including a side member (218), the side member including a conductive portion that operates as an antenna radiator; at least one wireless communication circuit (192) electrically connected to the conductive portion and providing a signal of a designated frequency band; a first ground member (301) disposed within the housing; a second ground member (302) disposed within the housing so as to at least partially overlap the first ground member; a first matching circuit (310) disposed on a first feed line that transmits a first feed signal of a first frequency band provided from the at least one wireless communication circuit to a first feed point on the conductive portion, the first matching circuit being grounded to the first ground member; and a first filter (312) connected to the first feed point and grounded to the second ground member. In addition, the electronic device may include a second matching circuit (320) disposed on a second feed line for transmitting a second feed signal of a second frequency band provided from the at least one wireless communication circuit to a second feed point on the conductive portion and grounded to the second ground member; and a second filter (322) connected to the second feed point and grounded to the first ground member.

[0005] In addition, one embodiment may provide an electronic device including a housing (210) including a side member (218), the side member including a conductive portion that operates as an antenna radiator; at least one wireless communication circuit (192) electrically connected to the conductive portion and providing a signal of a designated frequency band; a first ground member (301) disposed within the housing; a second ground member (302) disposed at least partially overlapping the first ground member; a third ground member (303) disposed overlapping at least one of the first ground member or the second ground member; a first matching circuit (310) disposed on a first feed line that transmits a first feed signal of a first frequency band provided from the at least one wireless communication circuit to a first feed point on the conductive portion, the first matching circuit being grounded to the first ground member; and a plurality of first filters (312-1, 312-2) connected to the first feed point and grounded to the second ground member and the third ground member. Each of the plurality of first filters (312-1, 312-2) may be grounded to correspond to each of the second ground member and the third ground member. For example, the first-first filter (312-1) among the plurality of first filters (312-1, 312-2) may be connected to the second ground member, and the first-second filter (312-2) among the plurality of first filters (312-1, 312-2) may be connected to the third ground member.In addition, the electronic device may include a second matching circuit (320) disposed on a second feed line for transmitting a second feed signal of a second frequency band provided from the at least one wireless communication circuit to a second feed point on the conductive portion and grounded to the first ground member; a plurality of second filters (322-1, 322-2) connected to the second feed point and grounded to the second ground member and the third ground member, respectively; a third matching circuit (340) disposed on a third feed line for transmitting a third feed signal of a third frequency band provided from the at least one wireless communication circuit to a third feed point on the conductive portion and grounded to the first ground member; and a plurality of third filters (332-1, 332-2) connected to the third feed point and grounded to the second ground member and the third ground member, respectively.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2A is a perspective view of the front of an electronic device according to one embodiment.

[0008] Figure 2b is a perspective view of the electronic device of Figure 2a viewed from the rear.

[0009] FIG. 3 is a drawing showing an example in which multiple power supply signals are provided to a side member that operates as an antenna radiator of an electronic device according to one embodiment.

[0010] FIG. 4 is a cross-sectional view of an electronic device showing a portion where a first ground member, a second ground member, a first matching circuit, a first filter, and an antenna radiator are connected according to one embodiment.

[0011] FIG. 5A is a diagram showing an electrical path through which a first power supply signal is transmitted to a second ground member through an antenna radiator according to one embodiment.

[0012] FIG. 5b is a diagram showing an electrical path through which a second feed signal is transmitted to a second ground member through an antenna radiator according to one embodiment.

[0013] FIG. 6 is a diagram showing the distribution of an H-field formed on a first ground member based on a first power supply point and a second power supply point according to one embodiment.

[0014] FIG. 7 is a drawing showing an example of a connection point on a first ground member according to one embodiment of the present disclosure.

[0015] FIG. 8 is a drawing showing an example of a switch being placed at a connection point on a first ground according to one embodiment of the present disclosure.

[0016] FIG. 9 is a diagram showing the performance of an antenna radiator when a first feed signal and a second feed signal are fed to the antenna radiator according to one embodiment of the present disclosure.

[0017] FIG. 10A is a diagram showing an example in which a first matching circuit, a first filter, a second matching circuit, and a second filter are connected to a first ground member and a second ground member according to one embodiment.

[0018] FIG. 10b is a diagram illustrating an example in which a first matching circuit, a first filter, a second matching circuit, and a second filter are connected to a first ground member and a second ground member according to one embodiment.

[0019] FIG. 10c is a diagram showing an example in which a first matching circuit, a first filter, a second matching circuit, and a second filter are connected to a first ground member and a second ground member according to one embodiment.

[0020] FIG. 11 is a diagram showing an example of an antenna radiator and a ground being arranged to supply a first power supply signal and a second power supply signal in an electronic device according to one embodiment.

[0021] FIG. 12 is a diagram illustrating an example of arrangement of a first matching circuit, a first filter, a second matching circuit, a second filter, a first ground member, a second ground member, and an antenna radiator when looking at the electronic device from the front of the electronic device according to one embodiment.

[0022] FIG. 13 is a diagram illustrating an example of arrangement of a first matching circuit, a first filter, a first ground member, a second ground member, and an antenna radiator when viewed from the side of the electronic device according to one embodiment.

[0023] FIG. 14a is a drawing showing examples of a first ground member and a second ground member according to one embodiment.

[0024] FIG. 14b is a drawing showing an example of a first ground member and a second ground member according to one embodiment.

[0025] FIG. 14c is a drawing showing an example of a first ground member and a second ground member according to one embodiment.

[0026] FIG. 14d is a drawing showing examples of a first ground member and a second ground member according to one embodiment.

[0027] FIG. 14e is a drawing showing an example of a first ground member and a second ground member according to one embodiment.

[0028] FIG. 14f is a drawing showing an example of a first ground member and a second ground member according to one embodiment.

[0029] FIG. 15 is a drawing showing an example of a switch positioned at a connection point of a first ground member to which a second ground member is connected when looking at the electronic device from the front of the electronic device according to one embodiment.

[0030] FIG. 16 is a drawing showing an example in which a first ground member and a second ground member are connected to each other through an FPCB according to one embodiment.

[0031] FIG. 17 is a diagram showing an example in which three power supply signals are provided to an antenna radiator according to one embodiment.

[0032] Below, embodiments of the present disclosure are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In addition, for the purpose of clearly explaining the present disclosure in the drawings, parts irrelevant to the description are omitted, and similar parts are designated with similar reference numerals throughout the specification.

[0033] The terms used in this disclosure are described as currently common terms, taking into account the functions mentioned herein. However, these terms may mean various other terms depending on the intentions of those skilled in the art, precedents, the emergence of new technologies, etc. Therefore, the terms used in this disclosure should not be interpreted solely based on their names, but rather based on the meanings of the terms and the overall content of this disclosure.

[0034] Additionally, while terms such as first, second, etc. may be used to describe various components, the components should not be limited by these terms. These terms are used to distinguish one component from another.

[0035] Throughout the specification, when a part is said to be "connected" to another part, this includes not only the cases where the parts are "directly connected" but also the cases where the parts are "electrically connected" with other elements intervening. Furthermore, when a part is said to "include" a component, this does not exclude other components, but rather includes other components, unless otherwise stated.

[0036] The phrases “in one embodiment” and the like appearing in various places throughout this disclosure do not necessarily all refer to the same embodiment.

[0037] An embodiment of the present disclosure may be represented by functional block configurations and various processing steps. Some or all of these functional blocks may be implemented by various hardware and / or software configurations that perform specific functions. For example, the functional blocks of the present disclosure may be implemented by one or more microprocessors or by circuit configurations for a given function. Furthermore, for example, the functional blocks of the present disclosure may be implemented in various programming or scripting languages. The functional blocks may be implemented by algorithms that execute on one or more processors. Furthermore, the present disclosure may employ conventional techniques for electronic configuration, signal processing, and / or data processing. Terms such as “mechanism,” “element,” “means,” and “configuration” may be used broadly and are not limited to mechanical and physical configurations.

[0038] Additionally, the connecting lines or connecting members between components depicted in the drawings are merely exemplary representations of functional connections and / or physical or circuit connections. In an actual device, connections between components may be represented by various functional connections, physical connections, or circuit connections that may be replaced or added.

[0039] The present disclosure will be described in detail with reference to the attached drawings below.

[0040] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with the electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0041] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0042] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0043] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0044] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0045] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0046] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0047] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0048] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0049] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0050] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0051] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0052] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0053] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0054] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0055] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0056] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0057] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0058] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0059] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0060] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0061] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0062] FIG. 2a is a perspective view of the front of an electronic device according to one embodiment, and FIG. 2b is a perspective view of the rear of the electronic device of FIG. 2a.

[0063] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment (e.g., the electronic device (101) of FIG. 1 ) may include a housing (210) that includes a first side (or “front side”) (210A), a second side (or “back side”) (210B), and a side surface (or “side wall”) (210C) enclosing a space between the first side (210A) and the second side (210B). In another embodiment (not shown), the housing (210) may also refer to a structure forming a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIGS. 2A and 2B .

[0064] In one embodiment, the first side (210A) may be formed by a front plate (202) (or “cover window”) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). In one embodiment, the front plate (202) may include a curved portion that extends seamlessly from the first side (210A) toward the rear plate (211) at least at one side edge portion.

[0065] In one embodiment, the second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. In one embodiment, the back plate (211) may include a curved portion extending seamlessly from the second side (210B) toward the front plate (202) at least at one end.

[0066] In one embodiment, the side (210C) may be formed by a side member (or “bracket”) (218) that is coupled to the front plate (202) and the back plate (211) and comprises a metal and / or polymer. In some embodiments, the back plate (211) and the side member (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum). In one example, the side member (218) may comprise a conductive portion (2181) and / or at least one non-conductive portion (2182, 2183). For example, a first non-conductive portion (2182) may be arranged on one end of the conductive portion (2181) (e.g., one end in the -x direction), and a second non-conductive portion (2183) may be arranged on the other end of the conductive portion (2181) (e.g., one end in the +x direction) to electrically isolate the conductive portion (2181). In another example, the conductive portion (2181) may be fed from a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) and may operate as an antenna radiator that transmits and / or receives an RF signal of a specified frequency band.

[0067] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203), a sensor module (not shown), a camera module (205, 212, 213, 214, 215, 206), a key input device (217), or a connector hole (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217)) or may additionally include other components.

[0068] In some embodiments, the electronic device (200) may further include a light-emitting element, which may be positioned adjacent to the display (201) within an area provided by the front plate (202). The light-emitting element may, for example, provide status information of the electronic device (200) in the form of light. In other embodiments, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0069] In one embodiment, the display (201) may be visible to the outside of the electronic device (200) through a substantial portion of the front plate (202). In some embodiments, the edge of the display (201) may be formed to be substantially the same as an adjacent outer shape (e.g., curved) of the front plate (202). In other embodiments (not shown), the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area to which the display (201) is exposed. In other embodiments (not shown), the electronic device (200) may form a recess or opening in a portion of the screen display area of ​​the display (201), and may include other electronic components aligned with the recess or opening, such as a camera module (205), a proximity sensor (not shown), or an ambient light sensor.

[0070] In another embodiment (not shown), the display (201) may include at least one of a camera module (212, 213, 214, 215), a fingerprint sensor (not shown), and a flash (206) on the back surface of the screen display area. In another embodiment (not shown), the display (201) may be coupled with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0071] According to one embodiment, the audio module (203) may include a microphone hole and / or a speaker hole. The microphone hole may have a microphone positioned inside for capturing external sounds, and in some embodiments, multiple microphones may be positioned to detect the direction of sounds. In some embodiments, the speaker hole and the microphone hole may be implemented as a single hole, or a speaker may be included without a speaker hole (e.g., a piezo speaker). The speaker hole may include an external speaker hole and / or a receiver hole for calls.

[0072] According to one embodiment, the electronic device (200) may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state by including a sensor module (not shown). For example, the sensor module may further include a proximity sensor disposed on a first side (210A) of the housing (210), a fingerprint sensor integrated into or disposed adjacent to the display (201), and / or a biometric sensor (e.g., an HRM sensor) disposed on a second side (210B) of the housing (210). The electronic device (200) may further include at least one of a sensor module (not shown), for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0073] According to one embodiment, the camera modules (205, 212, 213, 214, 215, 206) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), and a second camera device (212, 213, 214, 215) disposed on a second side (210B) and / or a flash (206). In one example, the aforementioned camera devices (205, 212, 213, 214, 215) may include one or more lenses, an image sensor, and / or an image signal processor. In another example, the flash (206) may include a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (200).

[0074] In one embodiment, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In other embodiments, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In some embodiments, the key input device may include at least a portion of a fingerprint sensor disposed on a second surface (210B) of the housing (210).

[0075] According to one embodiment, the connector hole (208) may accommodate a connector for transmitting and receiving power and / or data with an external electronic device, and / or a connector for transmitting and receiving audio signals with the external electronic device. For example, the connector hole (208) may include a USB connector or an earphone jack. In one embodiment, the USB connector and the earphone jack may be implemented as a single hole (e.g., 208 of FIGS. 2A and 2B), and according to another embodiment (not shown), the electronic device (200) may transmit and receive power and / or data, or transmit and receive audio signals, with an external electronic device (e.g., the electronic device (102, 104) of FIG. 1) without a separate connector hole.

[0076] FIG. 3 is a drawing showing an example in which multiple power supply signals are provided to a side member that operates as an antenna radiator of an electronic device according to one embodiment.

[0077] Referring to FIG. 3, an electronic device (101) according to one embodiment may include a first ground member (301), a second ground member (302), a first matching circuit (310), a first filter (312), a second matching circuit (320), a second filter (322), and an antenna radiator (330).

[0078] According to one embodiment, the first ground member (301) may be a ground member connected to at least one of the first matching circuit (310), the first filter (312), the second matching circuit (320), or the second filter (322). The first ground member (301) may include at least some of the components within the electronic device (101). For example, the first ground member (301) may include at least one of a printed circuit board (PCB), a support member (e.g., a front metal), a laser direct structuring (LDS)-based member, a speaker device, a motor device, or a grip pad, but is not limited thereto. For example, when the first ground member (301) is a PCB having a laminated structure in which dielectric layers and metal plating layers are alternately and repeatedly laminated, a fill cut area in which a part of the plating layer is removed within the first ground member (301) may be a non-grounded area, and an area (e.g., a plating layer) other than the fill cut area may be a grounded area.

[0079] According to one embodiment, the second ground member (302) may be a ground member connected to at least one of the first matching circuit (310), the first filter (312), the second matching circuit (320), or the second filter (322). The second ground member (302) may include at least some of the components within the electronic device (101). For example, the second ground member (302) may include, but is not limited to, at least one of a printed circuit board (PCB), a support member (e.g., a front metal), a laser direct structuring (LDS)-based member, a speaker device, a motor device, or a grip pad. For example, when the second ground member (302) is a PCB having a laminated structure in which dielectric layers and metal plating layers are alternately and repeatedly laminated, a fill cut area in which a part of the plating layer is removed within the second ground member (302) may be a non-grounded area, and an area (e.g., a plating layer) other than the fill cut area may be a grounded area.

[0080] According to one embodiment, among the first ground member (301) and the second ground member (302), the first matching circuit (310) and the first filter (312) may be grounded to different ground members, respectively. Additionally, among the first ground member (301) and the second ground member (302), the second matching circuit (320) and the second filter (322) may be grounded to different ground members, respectively.

[0081] According to one embodiment, at least a portion of the first ground member (301) may be arranged to overlap with the second ground member (302). For example, when viewed in the -z-axis direction of FIG. 2A, at least a portion of the first ground member (301) may be arranged to overlap with the second ground member (302). The overlapping first ground member (301) and second ground member (302) may be electrically connected to each other through one or more connection points.

[0082] Although it has been described above that at least a portion of the first ground member (301) overlaps the second ground member (302), this is not limiting. For example, the first ground member (301) may be positioned so as not to overlap the second ground member (302). In this case, the first ground member (301) and the second ground member (302) may be positioned adjacent to each other, but this is not limiting.

[0083] According to one embodiment, the first matching circuit (310) may be arranged to adjust the length of the electrical path of the antenna radiator (330) that radiates the first feed signal of the first frequency band. For example, the first matching circuit (310) may be arranged on a feed line (341) that transmits the first feed signal from a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) to the antenna radiator (330), and the first matching circuit (310) may be grounded to the first ground member (301). For example, the first matching circuit (310) may be arranged near the first feed point (351) on the feed line (341) from the wireless communication circuit to the first feed point (351).

[0084] In one embodiment, the first ground member (301) may include a PCB, and the first matching circuit (310) may be disposed on the PCB at a position adjacent to the first power supply point (351) and grounded to the first ground member (301). For example, the first matching circuit (310) may also be disposed on another PCB. For example, when the first ground member (301) includes a PCB, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be disposed on the PCB or on another PCB. The first matching circuit (310) may include, for example, at least one capacitance and / or at least one inductance.

[0085] According to one embodiment, the first frequency band may be, for example, a frequency band for global positioning system (GPS) communication, a frequency band for Bluetooth communication, or a frequency band for 5G (5th generation) communication, but is not limited thereto. In addition, the first frequency band may be, for example, a frequency band of 824 to 960 MHz, a frequency band of 1710 to 2170 MHz, but is not limited thereto. In addition, for example, the first frequency band and the second frequency band do not overlap each other, and the gap between the first frequency band and the second frequency band may be at least greater than 800 MHz.

[0086] In one embodiment, the first filter (312) may be arranged to remove frequency interference from a feed signal other than the first feed signal. For example, the first filter (312) may be arranged to remove frequency interference from a second feed signal other than the first feed signal. In one embodiment, the first filter (312) may be grounded to the second ground member (302) rather than the first ground member (301). For example, the first filter (312) may be positioned between the first feed point (351) and the second ground member (302). For example, the first ground member (301) may include a PCB, and the first filter (312) may be positioned on the PCB adjacent to the first feed point (351) and grounded to the second ground member (302).

[0087] According to one embodiment, the first filter (312) may be configured to allow a second feed signal of a second frequency band to pass through to the second ground element (302). The second feed signal may be a signal of the second frequency band, and the second feed signal flowing through the antenna radiator (330) may pass through the first filter (312) to the second ground element (302).

[0088] According to one embodiment, the second matching circuit (320) may be arranged to adjust the length of an electrical path of an antenna radiator (330) that radiates a second feed signal of a second frequency band. For example, the second matching circuit (320) may be arranged on a feed line (342) that transmits a second feed signal from a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) to the antenna radiator (330), and the second matching circuit (320) may be grounded to the first ground member (301). For example, the second matching circuit (320) may be arranged near the second feed point (352) on the feed line (342) from the wireless communication circuit to the second feed point (352).

[0089] According to one embodiment, the first ground member (301) may include a PCB, and the second matching circuit (320) may be disposed on the PCB at a position adjacent to the second power supply point (352) and may be grounded to the first ground member (301). Alternatively, the second matching circuit (320) may be disposed on a PCB other than the PCB. When the first ground member (301) includes a PCB, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be disposed on the PCB or on a different PCB. The second matching circuit (320) may include, for example, at least one capacitance and / or at least one inductance.

[0090] According to one embodiment, the second frequency band may be, for example, but not limited to, a frequency band for GPS communication, a frequency band for Bluetooth communication, or a frequency band for 5G communication. In addition, the second frequency band may be, for example, but not limited to, a frequency band of 824 to 960 MHz or a frequency band of 1710 to 2170 MHz. In addition, for example, the first frequency band and the second frequency band may not overlap each other, and the gap between the first frequency band and the second frequency band may be at least greater than 800 MHz. For example, the first frequency band may be a frequency band for GPS communication and the second frequency band may be a frequency band for Bluetooth communication. Or, for example, the first frequency band may be a frequency band for Bluetooth communication and the second frequency band may be a frequency band for 5G communication. Alternatively, for example, the first frequency band may be a reception frequency band of 824 to 960 MHz, and the second frequency band may be a reception frequency band of 1710 to 2170 MHz.

[0091] In one embodiment, the second filter (322) may be arranged to remove frequency interference from a feed signal other than the second feed signal. For example, the second filter (322) may be arranged to remove frequency interference from the first feed signal rather than the second feed signal. In one embodiment, the second filter (322) may be grounded to the second ground member (302) rather than the first ground member (301). For example, the second filter (322) may be arranged between the second feed point (352) and the second ground member (302). For example, the first ground member (301) may include a PCB, and the first filter (312) may be arranged on the PCB at a position adjacent to the second feed point (352) and grounded to the second ground member (302).

[0092] According to one embodiment, the second filter (322) may be formed such that the first feed signal of the first frequency band passes through to the second ground element (302). The first feed signal may be a signal of the first frequency band, and the first feed signal flowing through the antenna radiator (330) may pass through the second filter (322) to the second ground element (302).

[0093] According to one embodiment, the first matching circuit (310) and the first filter (312) are each grounded to different ground elements, and the second matching circuit (320) and the second filter (322) are each grounded to different ground elements, so that in a situation where an RF signal is single-fed and / or multi-fed to an antenna radiator (330) described later, signal interference between the first matching circuit (310) and the first filter (312) and / or signal interference between the second matching circuit (320) and the second filter (322) can be reduced.

[0094] According to one embodiment, at least a portion of the side member (218) of FIG. 2A may be utilized as an antenna radiator (330). The antenna radiator (330) may correspond, for example, to the conductive portion (2181) of the side member (218) of FIG. 2A, but is not limited thereto. The antenna radiator (330) may be another conductive portion included in the side member (218) of FIG. 2A.

[0095] FIG. 4 is a cross-sectional view of an electronic device showing a portion where a first ground member, a second ground member, a first matching circuit, a first filter, and an antenna radiator are connected according to one embodiment.

[0096] According to one embodiment, FIG. 4 may show an example in which a first ground member (301), a second ground member (302), a first matching circuit (310), a first filter (312), and an antenna radiator (330) are connected when looking at the electronic device (101) in the x-axis direction of FIG. 2A.

[0097] Referring to FIG. 4, the first ground member (301) and the second ground member (302) according to one embodiment may be arranged in a stacked structure. For example, at least a portion of the first ground member (301) may be stacked with the second ground member (302) when looking at the electronic device (101) in the -z-axis direction. The first ground member (301) and the second ground member (302) may be electrically connected to each other through a connecting member (360). An example in which the first ground member (301) and the second ground member (302) are connected to each other through the connecting member (360) will be described in more detail with reference to FIGS. 7 and 8.

[0098] According to one embodiment, the first matching circuit (310) may be positioned on a feed line (341) that transmits a first feed signal from a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) to a first feed point (351) of the antenna radiator (330). Additionally, the first matching circuit (310) may be grounded to a first ground member (301).

[0099] According to one embodiment, the first filter (312) may be connected to the first feed point (351) of the antenna radiator (330) and grounded to the second ground member (302).

[0100] In the above, the first ground member (301) and the second ground member (302) are described as separate members connected to each other via a connecting member (360), but this is not limited thereto. For example, the first ground member (301) and the second ground member (302) may be formed to be distinct from each other within a single member.

[0101] FIG. 5A is a diagram showing an electrical path through which a first power supply signal is transmitted to a second ground member through an antenna radiator according to one embodiment.

[0102] Referring to FIG. 5A, for example, a first feed signal of a first frequency band may be fed to a first feed point (351) of an antenna radiator (330). The first feed signal fed to the first feed point (351) of the antenna radiator (330) may flow to a second ground element (302) via a second filter (322) along an electrical path (500). In this case, the first feed signal may be a signal of a first frequency band, and the second filter (322) may be a filter that passes a signal of the first frequency band to the second ground element (302).

[0103] In addition, for example, the first filter (312) may be a filter that passes a second feed signal of a second frequency band to a second ground member (302), and since the first feed signal of the first frequency band cannot pass through the first filter (312) to flow to the second ground member (302), the first feed signal of the first frequency band may be blocked by the first filter (312) from flowing to the second ground member (302). In addition, for example, the second filter (322) may pass a signal of the first frequency band toward the second ground member (302), and the second filter (322) may block a signal of a frequency band not included in the first frequency band from flowing to the second ground member (302).

[0104] FIG. 5b is a diagram showing an electrical path through which a second feed signal is transmitted to a second ground member through an antenna radiator according to one embodiment.

[0105] Referring to FIG. 5B, for example, a second feed signal of a second frequency band may be fed to a second feed point (352) of an antenna radiator (330). The second feed signal fed to the second feed point (352) of the antenna radiator (330) may flow to a second ground member (302) via a first filter (312) along an electrical path (502). In this case, the second feed signal may be a signal of a second frequency band, and the first filter (312) may be a filter that passes a signal of the second frequency band to the second ground member (302).

[0106] In addition, for example, the second filter (322) may be a filter that passes a first feed signal of a first frequency band to a second ground member (302), and a second feed signal of a second frequency band cannot pass through the second filter (322) to flow to the second ground member (302), so that the second feed signal of the second frequency band can be blocked by the second filter (322) from flowing to the second ground member (302). In addition, for example, the first filter (312) may pass a signal of a second frequency band toward the second ground member (302), and block a signal of a frequency band not included in the second frequency band from flowing to the second ground member (302).

[0107] According to one embodiment, since the first matching circuit (310) and the first filter (312) are each grounded to different ground elements, when the first feed signal and the second feed signal are multi-fed to the antenna radiator (330), interference between the adjacent first matching circuits (310) and the first filter (312) can be reduced. For example, interference between the inductor and / or capacitor in the first matching circuit (310) and the inductor and / or capacitor in the first filter (312) can be reduced. In addition, since the second matching circuit (320) and the second filter (322) are each grounded to different ground elements, interference between the adjacent second matching circuits (320) and the second filter (322) can be reduced when the first feed signal and the second feed signal are multi-fed to the antenna radiator (330). For example, interference between the inductor and / or capacitor in the second matching circuit (320) and the inductor and / or capacitor in the second filter (322) can be reduced.

[0108] FIG. 6 is a diagram showing the distribution of an H-field formed on a first ground member based on a first power supply point and a second power supply point according to one embodiment.

[0109] Referring to FIG. 6, for example, a first feed signal of a first frequency band may be fed to an antenna radiator (330) through a first feed point (351), and a second feed signal of a second frequency band may be fed to an antenna radiator (330) through a first feed point (352).

[0110] In addition, on the first ground member (301), an H-field may be formed from a first point (600) corresponding to the first feeding point (351), and an H-field may be formed from a second point (602) corresponding to the first feeding point (352). In this case, for example, the second frequency band may be a higher frequency band than the first frequency band. In addition, for example, the gap between the first frequency band and the second frequency band may be at least greater than 800 MHz.

[0111] In one embodiment, the second frequency band is higher than the first frequency band, and the H-field formed with respect to the second point (602) due to the second feed signal of the second frequency band being fed to the antenna radiator (330) may be stronger than the H-field formed with respect to the first point (600) due to the first feed signal of the first frequency band being fed to the antenna radiator (330).

[0112] Accordingly, at least one point within an area where the H-field formed based on the first point (600) and the H-field formed based on the second point (602) on the first ground member (301) are relatively weak can be set as a connection point on the first ground member (301) to be connected to the second ground member (302). For example, based on the strength of the H-field formed based on the second point (602), which is a strong H-field, at least one point within areas (610, 612) where the strength of the H-field formed based on the second point (602) is relatively small can be set as a connection point on the first ground member (301) to be connected to the second ground member (302).

[0113] Areas (610, 612) of FIG. 6 are examples of areas where connection points can be set, and areas where connection points can be set are not limited to areas (610, 612).

[0114] FIG. 7 is a drawing showing an example of a connection point on a first ground member according to one embodiment of the present disclosure.

[0115] Referring to FIG. 7, connection points (621, 622, 623, 624) on the second ground member (302) and the first ground member (301) can be set based on the H-field formed by the second power supply signal of the second frequency band, which is a higher frequency band among the first frequency band and the second frequency band.

[0116] For example, points that are spaced apart from a second point (602) on the first ground member (301), which corresponds to a second feed point (352) on the antenna radiator (330) to which a second feed signal of a second frequency band is fed, at a predetermined distance or more may be set as connection points (621, 622, 623, 624). For example, the connection points (621, 622, 623, 624) may be set within an area that is spaced apart from the second point (602) by more than 1 / 4 of the wavelength of the reference frequency of the second frequency band. For example, the reference frequency of the second frequency band may be 3 GHz, and points within an area that is spaced apart from the second point (602) by more than about 25 mm, which is 1 / 4 of the wavelength (λ) of 3 GHz, may be set as connection points (621, 622, 623, 624).

[0117] Meanwhile, although FIG. 7 describes that four connection points (621, 622, 623, 624) are set on the first ground member (301), the number and positions of the connection points are not limited thereto. For example, on the first ground member (301), the connection points may be set in various ways within an area where the intensity of the H-field formed from the first point (600) and the intensity of the H-field formed from the second point (602) are small. For example, the connection points may be set in various ways within an area further away from the first point (600) by more than 1 / 4 of the wavelength of the reference frequency of the first frequency band, and further away from the second point (602) by more than 1 / 4 of the wavelength of the reference frequency of the second frequency band. In addition, for example, a line area or a surface area, rather than a point, may be set as an area to be connected to the second ground member (302) on the first ground member (301).

[0118] FIG. 8 is a drawing showing an example of a switch being placed at a connection point on a first ground according to one embodiment of the present disclosure.

[0119] Referring to FIG. 8, according to one embodiment, connection points (621, 622, 623, 624) on a first ground member (301) can be connected to a second ground member (302) via switches (631, 632, 633, 634). For example, switches (631, 632, 633, 634) can be arranged on connection points (621, 622, 623, 624) on the first ground member (301), and the switches (631, 632, 633, 634) can be connected to the second ground member (302). For example, connection points (621, 622, 623, 624) on the first ground member (301) may be connected to switches (631, 632, 633, 634), and switches (631, 632, 633, 634) may be connected to the second ground member (302). In one embodiment, the positions and / or number of connection points (621, 622, 623, 624) may be changed based on the frequency band.

[0120] According to one embodiment, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may turn switches (631, 632, 633, 634) on / off differently depending on the type and number of feed signals fed to the antenna radiator (330). According to one embodiment, switches (631, 632, 633, 634) may be turned on / off differently depending on a first frequency band of a first feed signal and a second frequency band of a second feed signal. For example, switches (631, 632, 633, 634) may be selectively turned on / off depending on whether the antenna radiator (330) is single-feed or multi-feed. For example, the switches (631, 632, 633, 634) can be selectively turned on / off depending on whether the first feed signal, the second feed signal, or the first feed signal and the second feed signal are fed together to the antenna radiator (330). In this case, the connection points on the first ground member (301) are not limited to those in FIGS. 7 and 8 and can be variously set, and the switches of the connection points can be variously selectively turned on / off based on whether the antenna radiator is single-fed or multi-fed and the frequency band of the signal being fed.

[0121] FIG. 9 is a diagram showing the performance of an antenna radiator when a first feed signal and a second feed signal are fed to the antenna radiator according to one embodiment of the present disclosure.

[0122] The graph of FIG. 9 shows the S parameter and radiation efficiency of an antenna radiator (330) fed with a first feed signal of a first frequency band of 1 GHz to 1.5 GHz and a second feed signal of a second frequency band of 3 GHz to 3.5 GHz in the electronic device (101) of FIGS. 1 to 8, when the first feed signal of a first frequency band to 1.5 GHz is fed to a first feed point (351), the second feed signal of a second frequency band to 3.5 GHz is fed to the second feed point, and the connection points (631, 632, 633, 634) on the first ground member are connected to the second ground member (302).

[0123] Referring to FIG. 9, when a first feed signal of a first frequency band of 1 GHz to 1.5 GHz is fed to a first feed point (351) and a second feed signal of a second frequency band of 3 GHz to 3.5 GHz is fed to a second feed point, interference between the first feed signal of the first frequency band and the second feed signal of the second frequency band is reduced, so that signal radiation characteristics in both the first frequency band and the second frequency band can be effectively maintained. Accordingly, the antenna radiator (330) fed with the first feed signal and the second feed signal can effectively radiate signals in the first frequency band and signals in the second frequency band.

[0124] FIG. 10A is a diagram showing an example in which a first matching circuit, a first filter, a second matching circuit, and a second filter are connected to a first ground member and a second ground member according to one embodiment.

[0125] Referring to FIG. 10A, the first matching circuit (310) may be grounded to the first ground member (301), and the first filter (312) may be grounded to the second ground member (302). In addition, the second matching circuit (320) may be grounded to the second ground member (302), and the second filter (322) may be grounded to the first ground member (301).

[0126] According to one embodiment, a first feed signal fed to the antenna radiator (330) can flow to the first ground member (301) through the antenna radiator (330) and the second filter (322), and a second feed signal fed to the antenna radiator (330) can flow to the second ground member (302) through the antenna radiator (330) and the first filter (312).

[0127] In this case, since the first matching circuit (310) and the first filter (312) are grounded to different ground members, interference between the adjacent first matching circuits (310) and the first filter (312) can be reduced when the first feed signal and the second feed signal are multi-fed to the antenna radiator (330). In addition, since the second matching circuit (320) and the second filter (322) are grounded to different ground members, interference between the adjacent second matching circuits (320) and the second filter (322) can be reduced when the first feed signal and the second feed signal are multi-fed to the antenna radiator (330).

[0128] FIG. 10b is a diagram illustrating an example in which a first matching circuit, a first filter, a second matching circuit, and a second filter are connected to a first ground member and a second ground member according to one embodiment.

[0129] Referring to FIG. 10b, the first matching circuit (310) may be grounded to the second ground member (302), and the first filter (312) may be grounded to the first ground member (301). In addition, the second matching circuit (320) may be grounded to the first ground member (301), and the second filter (322) may be grounded to the second ground member (302).

[0130] According to one embodiment, a first feed signal fed to the antenna radiator (330) can flow to a second ground member (302) through the antenna radiator (330) and a second filter (322), and a second feed signal fed to the antenna radiator (330) can flow to a first ground member (301) through the antenna radiator (330) and a first filter (312).

[0131] In this case, since the first matching circuit (310) and the first filter (312) are grounded to different ground members, interference between the adjacent first matching circuits (310) and the first filter (312) can be reduced when the first feed signal and the second feed signal are multi-fed to the antenna radiator (330). In addition, since the second matching circuit (320) and the second filter (322) are grounded to different ground members, interference between the adjacent second matching circuits (320) and the second filter (322) can be reduced when the first feed signal and the second feed signal are multi-fed to the antenna radiator (330).

[0132] FIG. 10c is a diagram showing an example in which a first matching circuit, a first filter, a second matching circuit, and a second filter are connected to a first ground member and a second ground member according to one embodiment.

[0133] Referring to FIG. 10c, the first matching circuit (310) may be grounded to the second ground member (302), and the first filter (312) may be grounded to the first ground member (301). In addition, the second matching circuit (320) may be grounded to the second ground member (302), and the second filter (322) may be grounded to the first ground member (301).

[0134] According to one embodiment, a first feed signal fed to the antenna radiator (330) can flow to the first ground member (301) through the antenna radiator (330) and the second filter (322), and a second feed signal fed to the antenna radiator (330) can flow to the first ground member (301) through the antenna radiator (330) and the first filter (312).

[0135] In this case, since the first matching circuit (310) and the first filter (312) are grounded to different ground members, interference between the adjacent first matching circuits (310) and the first filter (312) can be reduced when the first feed signal and the second feed signal are multi-fed to the antenna radiator (330). In addition, since the second matching circuit (320) and the second filter (322) are grounded to different ground members, interference between the adjacent second matching circuits (320) and the second filter (322) can be reduced when the first feed signal and the second feed signal are multi-fed to the antenna radiator (330).

[0136] FIG. 11 is a diagram showing an example of an arrangement of an antenna radiator and a ground member to which a first power supply signal and a second power supply signal are supplied in an electronic device according to one embodiment.

[0137] Referring to FIG. 11, an antenna radiator (330) may be formed on a side member located at the lower portion of the electronic device (101), and a first ground member (301) may be placed at a position adjacent to the antenna radiator (330).

[0138] The arrangement of the first ground member (301), the second ground member (302), the first matching circuit (310), the first filter (312), the second matching circuit (320), and the second filter (322) within the electronic device (101) will be described in more detail in FIGS. 12 to 17.

[0139] FIG. 12 is a diagram illustrating an example of arrangement of a first matching circuit, a first filter, a second matching circuit, a second filter, a first ground member, a second ground member, and an antenna radiator when looking at the electronic device from the front of the electronic device according to one embodiment.

[0140] Referring to FIG. 12, when looking at the electronic device in the -z direction of FIG. 2A, the first ground member (301) and the second ground member (302) may be arranged to be stacked on each other. For example, the first ground member (301) may include a PCB, and the second ground member (302) may include a support member (e.g., a front metal) that supports components within the electronic device (101). For example, the first ground member (301) may include a ground member formed within the PCB.

[0141] According to one embodiment, the first matching circuit (310), the first filter (312), and the connecting member (371) may be arranged on a PCB. For example, the first matching circuit (310) and the first filter (312) may be arranged on the PCB so as to be electrically connected to the first feeding point (351) of the antenna radiator (330) through the connecting member (371). However, the arrangement positions of the first matching circuit (310), the first filter (312), and the connecting member (371) are not limited thereto.

[0142] According to one embodiment, the first matching circuit (310) may be grounded to a ground region (301-1) of the first ground member (301). For example, the first ground member (301) may include a PCB having a laminated structure in which dielectric layers and metal plating layers are alternately and repeatedly laminated, and the ground region (301-1) may be an area (e.g., a plating layer) other than a fill cut area in which a portion of the plating layer is removed within the PCB. For example, the first filter (312) may be grounded to the second ground member (302) through a connecting member (372) located between the first ground member (301) and the second ground member (302).

[0143] According to one embodiment, the second matching circuit (320), the second filter (322), and the connecting member (373) may be arranged on a PCB. For example, the second matching circuit (320) and the second filter (322) may be arranged on the PCB so as to be electrically connected to the first feeding point (352) of the antenna radiator (330) through the connecting member (373). The arrangement positions of the second matching circuit (320), the second filter (322), and the connecting member (373) are not limited thereto.

[0144] According to one embodiment, the second matching circuit (320) may be grounded to a ground region (301-1) of the first ground member (301). For example, the first ground member (301) may include a PCB having a laminated structure in which dielectric layers and metal plating layers are alternately and repeatedly laminated, and the ground region (301-1) may be an area (e.g., a plating layer) other than a fill cut area in which a portion of the plating layer is removed within the first ground member (301). For example, the second filter (322) may be grounded to the second ground member (302) through a connecting member (374) located between the first ground member (301) and the second ground member (302).

[0145] According to one embodiment, the first ground member (301) and the second ground member (302) may be connected to each other through a connecting member (361) and / or a connecting member (362) disposed between the first ground member (301) and the second ground member (302). For example, the position at which the connecting member (361) and / or the connecting member (362) is disposed may be set based on at least one of a first frequency band of the first feed signal, a second frequency band of the second feed signal, a position of the first feed point (351), a position of the first feed point (352), positions of electronic components on the first ground member (301), or an area of ​​the first ground member (301) that overlaps the second ground member (302).

[0146] The connecting member (371, 372, 373, 374, 361, 362) may include, but is not limited to, a C-clip, a surface mounted device (SMD) gasket, a flexible printed circuit board (FPCB), a spring, a plate spring, a conductive sponge, a screw, and a spring washer, for example.

[0147] FIG. 13 is a diagram illustrating an example of arrangement of a first matching circuit, a first filter, a first ground member, a second ground member, and an antenna radiator when viewed from the side of the electronic device according to one embodiment.

[0148] Referring to FIG. 12, when looking at the electronic device in the x direction of FIG. 2A, a second ground member (302) may be disposed below (e.g., in the -z-axis direction) the first ground member (301). For example, the first ground member (301) may include at least a portion of a PCB, and the second ground member (302) may include a support member (e.g., a front metal) that supports components within the electronic device (101). For example, the first ground member (301) may include a ground member formed within the PCB.

[0149] According to one embodiment, the first matching circuit (310) and the connecting member (371) may be disposed on the upper surface of the PCB (e.g., in the +z-axis direction), and the first filter (312) and the connecting member (372) may be disposed on the lower surface of the PCB (e.g., in the -z-axis direction). The first matching circuit (310) and the first filter (312) may be connected to the antenna radiator (330) through the connecting member (371), and the first matching circuit (310) may be grounded to the first ground member (301).

[0150] According to one embodiment, the first filter (312) is connected to a connecting member (372), and the connecting member (372) is disposed between the first ground member (301) and the second ground member (302), so that the first filter (312) can be grounded to the second ground member (302) through the connecting member (372).

[0151] FIGS. 14A to 14F are drawings showing examples of a first ground member and a second ground member according to various embodiments.

[0152] Referring to FIG. 14a, for example, the first ground member (301) may include at least a portion of a PCB, and the second ground member (302) may include a support member (e.g., a metal front) that supports electronic components within the electronic device (101).

[0153] Referring to FIG. 14B, for example, the first ground member (301) may be a member including a support member (1402) (e.g., a metal front) that supports at least a portion of the PCB (1400) and electronic components within the electronic device (101), and the second ground member (302) may include at least a portion of a separate PCB separated from the first ground member (301). In this case, for example, the first ground member (301) may include a ground area formed within the PCB (1400) and a support member (1402) (e.g., a metal front) that supports electronic components within the electronic device (101).

[0154] Referring to FIG. 14C, for example, the first ground member (301) may be a member including a support member (1402) (e.g., a metal front) that supports at least a portion of the PCB (1400) and electronic components within the electronic device (101), and the second ground member (302) may be a member based on LDS (laser direct structuring). In this case, for example, the first ground member (301) may include a ground area formed within the PCB (1400) and a support member (1402) (e.g., a metal front) that supports electronic components within the electronic device (101).

[0155] Referring to FIG. 14d, for example, the first ground member (301) may be a member including a support member (1402) (e.g., a metal front) that supports at least a portion of the PCB (1400) and electronic components within the electronic device (101), and the second ground member (302) may be a speaker device. In this case, for example, the first ground member (301) may include a ground area formed within the PCB (1400) and a support member (1402) (e.g., a metal front) that supports electronic components within the electronic device (101).

[0156] Referring to FIG. 14E, for example, the first ground member (301) may be a member including a support member (1402) (e.g., a metal front) that supports at least a portion of the PCB (1400) and electronic components within the electronic device (101), and the second ground member (302) may be a motor device. In this case, for example, the first ground member (301) may include a ground area formed within the PCB (1400) and a support member (1402) (e.g., a metal front) that supports electronic components within the electronic device (101).

[0157] Referring to FIG. 14f, for example, the first ground member (301) may be a member including a support member (1402) (e.g., a metal front) that supports electronic components within the PCB (1400) and the electronic device (101), and the second ground member (302) may be a grip pad device.

[0158] As shown in FIGS. 14A to 14F, various types and sizes of ground elements may be used for the multi-feeding of the present disclosure. According to one embodiment, the smaller the size of at least one of the first ground element (301) and the second ground element (302), the better the antenna radiation performance may be as the higher frequency band feeding signal is grounded for the multi-feeding. Accordingly, for example, the size of the first ground element (301), the size of the second ground element (302), and the connection point between the first ground element (301) and the second ground element (302) may be set differently depending on the frequency bands of the multi-feeding feeding signals. Alternatively, for example, the frequency bands of the multi-powered power signals may be set differently depending on the size of the first ground member (301) to be used in the electronic device (101), the size of the second ground member (302), and the connection point between the first ground member (301) and the second ground member (302).

[0159] FIG. 15 is a drawing showing an example of a switch positioned at a connection point of a first ground member to which a second ground member is connected when looking at the electronic device from the front of the electronic device according to one embodiment.

[0160] Referring to FIG. 15, according to one embodiment, the first ground member (301) may be a PCB, and the second ground member (302) may be a support member (e.g., a metal front) that supports electronic components within the electronic device (101). In addition, a first switch (1501), a second switch (1502), and a third switch (1503) may be disposed between the first ground member (301) and the second ground member (302). The first ground member (301) and the second ground member (302) may be selectively connected through at least one of the first switch (1501), the second switch (1502), and the third switch (1503).

[0161] According to one embodiment, the positions at which the first switch (1501), the second switch (1502), and the third switch (1503) are disposed in the first ground member (301) may be determined based on at least one of the intensity of the H-field formed based on the first feeding point (351) or the intensity of the H-field formed based on the second feeding point (352). For example, the positions at which the first switch (1501), the second switch (1502), and the third switch (1503) are disposed in the first ground member (301) may be determined based on at least one of the wavelength of the reference frequency of the first frequency band of the first feeding signal or the wavelength of the reference frequency of the second frequency band of the second feeding signal. For example, the first switch (1501), the second switch (1502), and the third switch (1503) may be arranged within at least one of an area further than 1 / 4 of the wavelength of the reference frequency of the first frequency band of the first feed signal from the first feed point (351) or an area further than 1 / 4 of the wavelength of the reference frequency of the second frequency band of the second feed signal from the first feed point (352).

[0162] According to one embodiment, the on / off of the first switch (1501), the second switch (1502), and the third switch (1503) may be controlled based on at least one of the type of power supply to the antenna radiator (330), the frequency band of the first power supply signal, or the frequency band of the second power supply signal. For example, the on / off of the first switch (1501), the second switch (1502), and the third switch (1503) may be selectively controlled depending on whether the power supply to the antenna radiator (330) is single power supply (e.g., the first power supply signal or the second power supply signal is supplied to the antenna radiator (330)) or multi-power supply (e.g., the first power supply signal or the second power supply signal is supplied together to the antenna radiator (330). Additionally, for example, the on / off of the first switch (1501), the second switch (1502), and the third switch (1503) can be selectively controlled according to the combination of frequency bands of the power supply signals supplied to the antenna radiator (330).

[0163] FIG. 16 is a drawing showing an example in which a first ground member and a second ground member are connected to each other through an FPCB according to one embodiment.

[0164] Referring to FIG. 16, the first connection point (1601) of the first ground member (301) and the second connection point (1602) of the second ground member (302) can be connected to each other through an FPCB (1604) arranged between the first ground member (301) and the second ground member (302). For example, in a case where there is insufficient space to arrange a connection member (e.g., a C-clip, a spring, a plate spring, a conductive sponge, a screw, a spring washer, etc.) to connect the first ground member (301) and the second ground member (302), the first connection point (1601) can be connected to the second connection point (1602) through the FPCB (1604). Additionally, for example, when looking at the electronic device (101) in the -z direction of FIG. 2A, the first connection point (1601) of the first ground member (301) may not overlap with the second connection point (1602) of the second ground member (302). In this case, the first connection point (1601) of the first ground member (301) may be, for example, one of the connection points set in FIG. 7, but is not limited thereto.

[0165] FIG. 17 is a diagram showing an example in which three power supply signals are provided to an antenna radiator according to one embodiment.

[0166] Referring to FIG. 17, an electronic device (101) according to one embodiment may include a first ground member (301), a second ground member (302), a third ground member (303), a first matching circuit (310), a first-first filter (312-1), a first-second filter (312-2), a second matching circuit (320), a second-first filter (322-1), a second-second filter (322-2), a third matching circuit (340), a third-first filter (332-1), a third-second filter (332-2), and / or an antenna radiator (330).

[0167] According to one embodiment, the first ground member (301) may be a ground member connected to at least one of the first matching circuit (310), the first-first filter (312-1), the first-second filter (312-2), the second matching circuit (320), the second-first filter (322-1), the second-second filter (322-2), the third matching circuit (340), the third-first filter (332-1), or the third-second filter (332-2). The first ground member (301) may include at least some of the components within the electronic device (101). For example, the first ground member (301) may include, but is not limited to, at least one of a printed circuit board (PCB), a support member (e.g., a front metal), a laser direct structuring (LDS)-based member, a speaker device, a motor device, or a grip pad.

[0168] According to one embodiment, the second ground member (302) may be a ground member connected to at least one of the first matching circuit (310), the first-first filter (312-1), the first-second filter (312-2), the second matching circuit (320), the second-first filter (322-1), the second-second filter (322-2), the third matching circuit (340), the third-first filter (332-1), or the third-second filter (332-2). The second ground member (302) may include at least some of the components within the electronic device (101). For example, the second ground member (302) may include, but is not limited to, at least one of a printed circuit board (PCB), a support member (e.g., a front metal), a laser direct structuring (LDS)-based member, a speaker device, a motor device, or a grip pad.

[0169] According to one embodiment, the third ground member (303) may be a ground member connected to at least one of the first matching circuit (310), the first-first filter (312-1), the first-second filter (312-2), the second matching circuit (320), the second-first filter (322-1), the second-second filter (322-2), the third matching circuit (340), the third-first filter (332-1), or the third-second filter (332-2). The third ground member (303) may include at least some of the components within the electronic device (101). For example, the third ground member (303) may include, but is not limited to, at least one of a printed circuit board (PCB), a support member (e.g., a front metal), a laser direct structuring (LDS)-based member, a speaker device, a motor device, or a grip pad.

[0170] According to one embodiment, among the first ground member (301), the second ground member (302), and the third ground member (303), the first matching circuit (310), the first-first filter (312-1), and the first-second filter (312-2) may be connected to different ground members, respectively. Among the first ground member (301), the second ground member (302), and the third ground member (303), the second matching circuit (320), the second-first filter (322-1), and the second-second filter (322-2) may be connected to different ground members, respectively. Among the first ground member (301), the second ground member (302), and the third ground member (303), the third matching circuit (340), the third-first filter (332-1), and the third-second filter (332-2) may be connected to different ground members, respectively.

[0171] According to one embodiment, at least a portion of the first ground member (301) may be arranged to overlap with the second ground member (302) and the third ground member (303). For example, when viewed in the -z-axis direction of FIG. 2A, at least a portion of the first ground member (301) may be arranged to overlap or stack with the second ground member (302) and the third ground member (303). The first ground member (301), the second ground member (302), and the third ground member (303) may be electrically connected to each other through one or more connection points.

[0172] According to one embodiment, the first matching circuit (310) may be arranged to adjust the length of an electrical path of an antenna radiator (330) that radiates a first feed signal of a first frequency band. The first matching circuit (310) may be arranged on a feed line (341) that transmits the first feed signal from a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) to the antenna radiator (330), and the first matching circuit (310) may be grounded to the first ground member (301). For example, the first matching circuit (310) may be arranged near the first feed point (351) on the feed line (341) from the wireless communication circuit to the first feed point (351).

[0173] According to one embodiment, the first ground member (301) may be a PCB, and the first matching circuit (310) may be disposed on the first ground member (301) at a position adjacent to the first power supply point (351) and may be grounded to the first ground member (301). Alternatively, the first matching circuit (310) may be disposed on a PCB other than the first ground member (301). When the first ground member (301) is a PCB, the wireless communication circuit may be disposed on the first ground member (301) or on another PCB. The first matching circuit (310) may include at least one capacitance and / or at least one inductance. The first frequency band may be, for example, but is not limited to, a frequency band for GPS communication, a frequency band for Bluetooth communication, or a frequency band for 5G communication. Additionally, the first frequency band may be, for example, a frequency band of 824 to 960 MHz or a frequency band of 1710 to 2170 MHz, but is not limited thereto. Additionally, for example, the first frequency band, the second frequency band, and the third frequency band may not overlap each other, and the gaps between the first frequency band, the second frequency band, and the third frequency band may each be at least greater than 800 MHz.

[0174] According to one embodiment, the first-first filter (312-1) and the first-second filter (312-2) may be arranged to remove frequency interference from a feed signal other than the first feed signal. For example, the first-first filter (312-1) may be arranged to remove frequency interference from a second feed signal other than the first feed signal, and the first-second filter (312-2) may be arranged to remove frequency interference from a third feed signal other than the first feed signal. The first-first filter (312-1) may be grounded to the second ground member (302) other than the first ground member (301), and the first-second filter (312-2) may be grounded to the third ground member (303). For example, the first ground member (301) may be a PCB, and the first-first filter (312-1) and the first-second filter (312-2) may be positioned adjacent to the first power supply point (351) on the first ground member (301).

[0175] According to one embodiment, the first-first filter (312-1) may be configured to allow a second feed signal of a second frequency band to pass through to a second ground element (302). The second feed signal may be a signal of a second frequency band, and the second feed signal flowing through the antenna radiator (330) may pass through the first-first filter (312-1) to the second ground element (302).

[0176] According to one embodiment, the first-second filter (312-2) may be configured to allow a third feed signal of a third frequency band to pass through to a third ground element (303). The third feed signal may be a signal of a third frequency band, and the third feed signal flowing through the antenna radiator (330) may pass through the first-second filter (312-2) to the third ground element (303).

[0177] According to one embodiment, the second matching circuit (320) may be arranged to adjust the length of an electrical path of an antenna radiator (330) that radiates a second feed signal of a second frequency band. The second matching circuit (320) may be arranged on a feed line (342) that transmits a second feed signal from a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) to the antenna radiator (330), and the second matching circuit (320) may be grounded to the first ground member (301). For example, the second matching circuit (320) may be arranged near the second feed point (352) on the feed line (342) from the wireless communication circuit to the second feed point (352).

[0178] In one embodiment, the first ground member (301) may be a PCB, and the second matching circuit (320) may be disposed on the first ground member (301) at a position adjacent to the second power supply point (352) and may be grounded to the first ground member (301). Alternatively, the second matching circuit (320) may be disposed on a PCB other than the first ground member (301). When the first ground member (301) is a PCB, the wireless communication circuit may be disposed on the first ground member (301) or on another PCB. The second matching circuit (320) may include at least one capacitance and / or at least one inductance. The second frequency band may be, for example, but is not limited to, a frequency band for GPS communication, a frequency band for Bluetooth communication, or a frequency band for 5G communication. Additionally, the second frequency band may be, for example, a frequency band of 824 to 960 MHz or a frequency band of 1710 to 2170 MHz, but is not limited thereto. Additionally, for example, the first frequency band, the second frequency band, and the third frequency band may not overlap each other, and the gaps between the first frequency band, the second frequency band, and the third frequency band may each be at least greater than 800 MHz.

[0179] According to one embodiment, the second-first filter (322-1) and the second-second filter (322-2) may be arranged to remove frequency interference from feed signals other than the second feed signal. For example, the second-first filter (322-1) may be arranged to remove frequency interference from the first feed signal other than the second feed signal, and the second-second filter (322-2) may be arranged to remove frequency interference from the third feed signal other than the second feed signal. The second-first filter (322-1) may be grounded to the second ground member (302) other than the first ground member (301), and the second-second filter (322-2) may be grounded to the third ground member (303). For example, the first ground member (301) may be a PCB, and the second-first filter (322-1) and the second-second filter (322-2) may be positioned adjacent to the second power supply point (352) on the first ground member (301).

[0180] According to one embodiment, the second-first filter (322-1) may be formed such that the first feed signal of the first frequency band passes through to the second ground element (302). The first feed signal may be a signal of the first frequency band, and the first feed signal flowing through the antenna radiator (330) may pass through the second-first filter (322-1) to the second ground element (302).

[0181] According to one embodiment, the second-second filter (322-2) may be configured to allow a third feed signal of a third frequency band to pass through to a third ground element (303). The third feed signal may be a signal of a third frequency band, and the third feed signal flowing through the antenna radiator (330) may pass through the second-second filter (322-2) to the third ground element (303).

[0182] According to one embodiment, the third matching circuit (340) may be arranged to adjust the length of the electrical path of the antenna radiator (330) that radiates the third feed signal of the third frequency band. The third matching circuit (340) may be arranged on a feed line (343) that transmits the third feed signal from a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) to the antenna radiator (330), and the third matching circuit (340) may be grounded to the first ground member (301). For example, the third matching circuit (340) may be arranged near the third feed point (353) on the feed line (343) from the wireless communication circuit to the third feed point (353).

[0183] In one embodiment, the first ground member (301) may be a PCB, and the third matching circuit (340) may be disposed on the first ground member (301) at a position adjacent to the third power supply point (353) and may be grounded to the first ground member (301). Alternatively, the third matching circuit (340) may be disposed on a PCB other than the first ground member (301). When the first ground member (301) is a PCB, the wireless communication circuit may be disposed on the first ground member (301) or on another PCB. The third matching circuit (340) may include at least one capacitance and / or at least one inductance. The third frequency band may be, for example, but is not limited to, a frequency band for GPS communication, a frequency band for Bluetooth communication, or a frequency band for 5G communication. Additionally, the second frequency band may be, for example, a frequency band of 824 to 960 MHz or a frequency band of 1710 to 2170 MHz, but is not limited thereto. Additionally, for example, the first frequency band, the second frequency band, and the third frequency band may not overlap each other, and the gaps between the first frequency band, the second frequency band, and the third frequency band may each be at least greater than 800 MHz.

[0184] According to one embodiment, the third-first filter (332-1) and the third-second filter (332-2) may be arranged to remove frequency interference from feed signals other than the third feed signal. For example, the third-first filter (332-1) may be arranged to remove frequency interference from the first feed signal other than the third feed signal, and the third-second filter (332-2) may be arranged to remove frequency interference from the first feed signal other than the third feed signal. The third-first filter (332-1) may be grounded to the second ground member (302) other than the first ground member (301), and the third-second filter (332-2) may be grounded to the third ground member (303). For example, the first ground member (301) may be a PCB, and the third-first filter (332-1) and the third-second filter (332-2) may be positioned adjacent to the third power supply point (353) on the first ground member (301).

[0185] According to one embodiment, the third-first filter (332-1) may be formed such that the first feed signal of the first frequency band passes through to the second ground element (302). The first feed signal may be a signal of the first frequency band, and the first feed signal flowing through the antenna radiator (330) may pass through the third-first filter (332-1) to the second ground element (302).

[0186] According to one embodiment, the third-second filter (332-2) may be formed such that the second feed signal of the second frequency band passes through to the third ground element (303). The second feed signal may be a signal of the second frequency band, and the first feed signal flowing through the antenna radiator (330) may pass through the third-second filter (332-2) to the third ground element (303).

[0187] According to one embodiment, at least a portion of the side member (218) of FIG. 2A may be utilized as an antenna radiator (330). For example, it may correspond to, but is not limited to, the conductive portion (2181) of the side member (218) of FIG. 2A. The antenna radiator (330) may be another conductive portion included in the side member (218) of FIG. 2A.

[0188] In the above, the first ground member (301), the second ground member (302), and the third ground member (303) have been described as separate members that are connected to each other, but this is not limited thereto. At least two of the first ground member (301), the second ground member (302), or the third ground member (303) may be formed to be distinct from each other within one member.

[0189] According to one embodiment, an electronic device (101) comprises a housing (210) including a front plate (202) facing the front of the electronic device, a rear plate (211) facing the rear of the electronic device, and a side member (218) disposed between the front plate and the rear plate, the side member including a conductive portion that operates as an antenna radiator; at least one wireless communication circuit (192) electrically connected to the conductive portion and providing a signal of a designated frequency band; a first ground member (301) disposed within the housing; a second ground member (302) disposed within the housing so as to at least partially overlap the first ground member; a first matching circuit (310) disposed on a first feed line that transmits a first feed signal of a first frequency band provided from the at least one wireless communication circuit to a first feed point on the conductive portion, the first matching circuit being grounded to the first ground member; a first filter (312) connected to the first feed point and grounded to the second ground member; It may include a second matching circuit (320) disposed on a second feed line for transmitting a second feed signal of a second frequency band provided from at least one wireless communication circuit to a second feed point on the conductive portion and grounded to the first ground member; and a second filter (322) connected to the second feed point and grounded to the second ground member.

[0190] Additionally, the second ground member may be electrically connected to at least one connection point of the first ground member.

[0191] Additionally, the first frequency band is higher than the second frequency band, and a distance from the first feeding point to the at least one connection point can be determined based on a wavelength of the first frequency band that is higher than the second frequency band.

[0192] Additionally, the distance from the first feeding point to the at least one connection point may be longer than 1 / 4 of the wavelength of the first frequency band.

[0193] Additionally, at least one connection point of the first ground member can be connected to the second ground member via at least one switch.

[0194] Additionally, the operation of the at least one switch can be controlled according to a frequency band of at least one of the first power supply signal or the second power supply signal supplied to the conductive portion from the at least one wireless communication circuit.

[0195] Additionally, at least one connection point of the first ground member may be connected to the second ground member via at least one of a C-clip, a surface mounted device (SMD) gasket, or a flexible printed circuit board (FPCB).

[0196] Additionally, the first ground member may include a printed circuit board (PCB) on which the wireless communication circuit and the matching circuit are arranged, and the second ground member may be a metal member that supports electronic components within the housing of the electronic device.

[0197] Additionally, the first ground member may include a printed circuit board (PCB) positioned near the conductive portion, and the second ground member may be another PCB spaced apart from the PCB.

[0198] Additionally, the first ground member may include a PCB arranged around the conductive portion, and the second ground member may include at least one of the electronic components within the electronic device.

[0199] Additionally, the first power supply signal may be supplied to the first power supply point and transmitted to the second ground member through the second filter connected to the second power supply point via at least a portion of the conductive portion.

[0200] Additionally, the second feed signal may be fed to the second feed point and transmitted to the second ground member through the first filter connected to the first feed point via at least a portion of the conductive portion.

[0201] According to one embodiment, there is provided a housing (210) comprising a side member (218), the side member including a conductive portion that operates as an antenna radiator; at least one wireless communication circuit (192) electrically connected to the conductive portion and providing a signal of a designated frequency band; a first ground member (301) disposed within the housing; a second ground member (302) disposed within the housing so as to at least partially overlap the first ground member; a first matching circuit (310) disposed on a first feed line for transmitting a first feed signal of a first frequency band provided from the at least one wireless communication circuit to a first feed point on the conductive portion, and grounded to the first ground member; a first filter (312) connected to the first feed point and grounded to the second ground member; a second matching circuit (320) disposed on a second feed line for transmitting a second feed signal of a second frequency band provided from the at least one wireless communication circuit to a second feed point on the conductive portion, and grounded to the second ground member; An electronic device can be provided, including a second filter (322) connected to the second power supply point and grounded to the first ground member.

[0202] Additionally, the second ground member may be electrically connected to at least one connection point of the first ground member.

[0203] Additionally, the first frequency band is higher than the second frequency band, and a distance from the first feeding point to the at least one connection point can be determined based on a wavelength of the first frequency band that is higher than the second frequency band.

[0204] Additionally, the distance from the first feeding point to the at least one connection point may be longer than 1 / 4 of the wavelength of the first frequency band.

[0205] Additionally, at least one connection point of the first ground member can be connected to the second ground member via at least one switch.

[0206] Additionally, the operation of the at least one switch can be controlled according to a frequency band of at least one of the first power supply signal or the second power supply signal supplied to the conductive portion from the at least one wireless communication circuit.

[0207] Additionally, at least one connection point of the first ground member may be connected to the second ground member via at least one of a C-clip, a surface mounted device (SMD) gasket, or a flexible printed circuit board (FPCB).

[0208] According to one embodiment, there is provided a housing (210) comprising a side member (218), the side member including a conductive portion that operates as an antenna radiator; at least one wireless communication circuit (192) electrically connected to the conductive portion and providing a signal of a designated frequency band; a first ground member (301) disposed within the housing; a second ground member (302) disposed at least partially overlapping the first ground member; a third ground member (303) disposed overlapping at least one of the first ground member or the second ground member; a first matching circuit (310) disposed on a first feed line that transmits a first feed signal of a first frequency band provided from the at least one wireless communication circuit to a first feed point on the conductive portion, the first matching circuit being grounded to the first ground member; a plurality of first filters (312-1, 312-2) connected to the first feed point and grounded to the second ground member and the third ground member, respectively; An electronic device may be provided, comprising: a second matching circuit (320) disposed on a second feed line for transmitting a second feed signal of a second frequency band provided from at least one wireless communication circuit to a second feed point on the conductive portion, and grounded to the first ground member; a plurality of second filters (322-1, 322-2) connected to the second feed point and grounded to the second ground member and the third ground member, respectively; a third matching circuit (340) disposed on a third feed line for transmitting a third feed signal of a third frequency band provided from at least one wireless communication circuit to a third feed point on the conductive portion, and grounded to the first ground member; and a plurality of third filters (332-1, 332-2) connected to the third feed point and grounded to the second ground member and the third ground member, respectively.

[0209] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0210] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0211] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0212] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0213] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0214] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A housing (210) comprising a front plate (202) facing the front of the electronic device, a rear plate (211) facing the rear of the electronic device, and a side member (218) disposed between the front plate and the rear plate, wherein the side member includes a conductive portion that operates as an antenna radiator; At least one wireless communication circuit (192) electrically connected to the above-described conductive portion and providing a signal of a designated frequency band; A first ground member (301) disposed within the housing; A second ground member (302) positioned within the housing so as to overlap at least a portion of the first ground member; A first matching circuit (310) disposed on a first power line for transmitting a first power signal of a first frequency band provided from at least one wireless communication circuit to a first power point on the conductive portion, and grounded to the first ground member; A first filter (312) connected to the first power supply point and grounded to the second ground member; A second matching circuit (320) disposed on a second feed line for transmitting a second feed signal of a second frequency band provided from at least one wireless communication circuit to a second feed point on the conductive portion, and grounded to the first ground member; and A second filter (322) connected to the second power supply point and grounded to the second ground member; An electronic device comprising:

2. In paragraph 1, An electronic device, wherein the second ground member is electrically connected to at least one connection point of the first ground member.

3. In paragraph 2, The above first frequency band is higher than the above second frequency band, An electronic device, wherein the distance from the first feeding point to the at least one connection point is determined based on the length of a wavelength of the first frequency band which is higher than the second frequency band.

4. In paragraph 3, An electronic device, wherein a distance from the first feeding point to the at least one connecting point is longer than 1 / 4 of the wavelength of the first frequency band.

5. In paragraph 2, An electronic device, wherein at least one connection point of the first ground member is connected to the second ground member through at least one switch.

6. In paragraph 5, An electronic device, wherein the operation of the at least one switch is controlled according to a frequency band of at least one of the first power supply signal or the second power supply signal supplied to the conductive portion from the at least one wireless communication circuit.

7. In paragraph 2, An electronic device, wherein at least one connection point of the first ground member is connected to the second ground member via at least one of a C-clip, a surface mounted device (SMD) gasket, or a flexible printed circuit board (FPCB).

8. In paragraph 1, The above first ground member includes a printed circuit board (PCB) on which the wireless communication circuit and the matching circuit are arranged, An electronic device, wherein the second ground member is a metal member that supports electronic components within the housing of the electronic device.

9. In paragraph 1, The above first ground member includes a printed circuit board (PCB) arranged near the conductive portion, An electronic device, wherein the second ground member is another PCB separated from the PCB.

10. In paragraph 1, The above first ground member includes a PCB arranged around the periphery of the conductive portion, An electronic device, wherein the second ground member comprises at least one of electronic components within the electronic device.

11. In paragraph 1, An electronic device, wherein the first power supply signal is supplied to the first power supply point and transmitted to the second ground member through the second filter connected to the second power supply point via at least a portion of the conductive portion.

12. In paragraph 1, An electronic device, wherein the second feed signal is fed to the second feed point and transmitted to the second ground member through the first filter connected to the first feed point via at least a portion of the conductive portion.

13. In electronic devices, A housing (210) comprising a side member (218), the side member including a conductive portion that operates as an antenna radiator; At least one wireless communication circuit (192) electrically connected to the above-described conductive portion and providing a signal of a designated frequency band; A first ground member (301) disposed within the housing; A second ground member (302) positioned within the housing so as to overlap at least a portion of the first ground member; A first matching circuit (310) disposed on a first power line for transmitting a first power signal of a first frequency band provided from at least one wireless communication circuit to a first power point on the conductive portion, and grounded to the first ground member; A first filter (312) connected to the first power supply point and grounded to the second ground member; A second matching circuit (320) disposed on a second feed line for transmitting a second feed signal of a second frequency band provided from at least one wireless communication circuit to a second feed point on the conductive portion, and grounded to the second ground member; and A second filter (322) connected to the second power supply point and grounded to the first ground member; An electronic device comprising:

14. In paragraph 13, An electronic device, wherein the second ground member is electrically connected to at least one connection point of the first ground member.

15. In paragraph 14, The above first frequency band is higher than the above second frequency band, An electronic device, wherein the distance from the first feeding point to the at least one connection point is determined based on the length of a wavelength of the first frequency band which is higher than the second frequency band.

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