A multi-layer embedded antenna, its energy collection circuit and its packaging manufacturing method

Abstract

The present invention discloses a multi-layer embedded antenna, an energy collection circuit and a method for manufacturing the same, and relates to the field of wearable power generation and energy collection. The multi-layer embedded antenna comprises: a feedback end (1008) and a top functional layer (1004), an intermediate functional layer (1010) and a bottom functional layer (1006) stacked in sequence; the intermediate functional layer (1010) comprises multiple intermediate conductive layers (10104) and multiple intermediate insulating layers (10108), and the intermediate conductive layers (10104) and the intermediate insulating layers (10108) are alternately stacked; a plurality of vias (1002) are uniformly distributed in the top functional layer (1004), the intermediate functional layer (1010) and the bottom functional layer (1006) along the extension direction of the serpentine antenna. Compared with a single-layer antenna, the return loss of the multi-layer embedded antenna can be reduced by 5dB or more, and the energy pickup antenna loss is small. It can work in multiple ISM bands at the same time, that is, it can collect radio frequency energy in multiple ISM bands at the same time.

Description

Technical Field

[0001] The present invention relates to the field of wearable power generation and energy collection, and in particular to a multi-layer embedded antenna, an energy collection circuit thereof, and a method for manufacturing the packaging thereof. Background Art

[0002] The prior art solution proposes a RF electromagnetic wave energy collection array cube suitable for mobile phones and Wi-Fi. The RF electromagnetic wave energy collection array cube, the four sides of the device are surrounded by four array antenna patches, and the top surface of the device is an energy recovery plate; the array antenna patch is a ring array antenna with an air layer dielectric layer, composed of 2×2 ring array elements, and is fed by microstrip lines. Each array element has two pairs of symmetrical C-shaped rings to achieve dual-frequency for collecting 1.9GHz (non-ISM band) and 2.4GHz RF energy in the environment. The applied ISM (Industrial, Scientific and Medical (ISM)) working frequency band is single. The array antenna patch includes a first medium and a second medium. The first medium is an FR4 board with a thickness of 1.6mm; the second medium is an air layer with a thickness of 7mm.

[0003] Therefore, the array antenna patch of the prior art has a large thickness and cannot be flexibly processed. The RF energy collection band of the rectangular microstrip line antenna is narrow and is limited to a specific working frequency band. It cannot be applied to multiple ISM bands and therefore cannot be applied to multiple scenarios and fields. Summary of the invention

[0004] The technical problem to be solved by the present invention is to address the deficiencies in the prior art and to provide a multi-layer embedded antenna, its energy collection circuit and its packaging manufacturing method, which can achieve low return loss, can work in multiple ISM frequency bands at the same time, has adjustable output voltage, adopts flexible packaging and has the advantages of thin thickness and wearability, and is suitable for a variety of application scenarios and fields.

[0005] The technical solution of the present invention to solve the above technical problems is as follows:

[0006] A multi-layer embedded antenna, comprising: a feedback end and a top functional layer, a middle functional layer and a bottom functional layer stacked in sequence;

[0007] The intermediate functional layer includes multiple intermediate conductive layers and multiple intermediate insulating layers, and the intermediate conductive layers and the intermediate insulating layers are alternately stacked;

[0008] A plurality of vias are evenly distributed in the top functional layer, the middle functional layer and the bottom functional layer along the extension direction of the antenna of the serpentine structure;

[0009] Each via is connected from the top functional layer, through the middle functional layer, to the bottom functional layer;

[0010] The feedback end is arranged at one end of the top functional layer and is used for connecting with the impedance matching network.

[0011] The beneficial effects of the present invention are: by designing the geometric dimensions and array arrangement of vias connecting the multi-layer antennas, it is possible to achieve enhanced energy coupling and adapt to multiple industrial, scientific and medical (ISM) free frequency bands, and is applicable to multiple fields.

[0012] This solution has middle and bottom conductive patterns with the same profile, and the top, middle, and bottom conductive lines are connected by through holes. Ninety-nine vias with an average diameter of 150 μm can be used to embed the top, middle, and bottom conductive layers to form a multi-layer embedded antenna. By adjusting the impedance matching network, the multi-layer embedded antenna can operate in different ISM bands without changing the antenna shape or redesigning it, and can greatly reduce the return loss and lower the energy collection threshold.

[0013] Compared with single-layer antennas, the return loss of multi-layer embedded antennas can be reduced by 5dB or more, and the energy picking antenna loss is small.

[0014] The energy harvesting antenna can work in multiple ISM frequency bands (868MHz\915MHz\2.4GHz) at the same time, that is, it can collect radio frequency energy in multiple ISM frequency bands at the same time.

[0015] Further, the top functional layer includes: a top solder resist layer and a top conductive layer;

[0016] The bottom functional layer includes: a bottom solder resist layer and a bottom conductive layer;

[0017] Each via hole connects the top solder resist layer, the top conductive layer, the middle functional layer, the bottom solder resist layer and the bottom conductive layer.

[0018] Further, the material of the via, the top conductive layer, the bottom conductive layer and the plurality of intermediate conductive layers is metal;

[0019] Alternatively, the materials of the via, the top conductive layer, the bottom conductive layer and the plurality of intermediate conductive layers are two-dimensional inorganic compounds.

[0020] Furthermore, the two-dimensional inorganic compound includes: graphene, transition metal halide, transition metal carbide, transition metal nitride or transition metal carbonitride.

[0021] Furthermore, the transition metal carbonitride includes: Mxene; the transition metal halide includes: MoS2.

[0022] Another technical solution of the present invention to solve the above technical problems is as follows:

[0023] A weak radio frequency energy collection circuit for a multi-layer embedded antenna, comprising: a multi-layer embedded antenna as described in any one of the above schemes, an impedance matching network, a radio frequency direct current conversion chip, a storage element and a voltage regulating unit;

[0024] The multi-layer embedded antenna is connected to the impedance matching network through a feedback end;

[0025] The impedance matching network is connected to the radio frequency direct current conversion chip, the storage element and the voltage regulating unit in sequence;

[0026] The voltage regulating unit is used to adjust the voltage value of the output end of the weak radio frequency energy collection circuit through the first resistor or the second resistor.

[0027] The beneficial effects of the present invention are as follows: the weak radio frequency energy collection circuit of the present scheme has few structural components, simple control, small internal loss, and adjustable circuit output voltage, adopts a flexible packaging form, and is wearable.

[0028] Furthermore, the voltage regulating unit is specifically used to set the second resistor to reduce the output voltage of the circuit, and the formula for calculating the second resistor is:

[0029]

[0030] It is also specifically used to set the output voltage of the first resistance boosting circuit, and the formula for calculating the first resistance is:

[0031]

[0032] Wherein, V is the desired output voltage value, R2 is the first resistor, and R3 is the second resistor.

[0033] The beneficial effect of adopting the above further solution is that: this solution achieves adjustable output voltage of the radio frequency energy harvesting circuit by adjusting the first resistor and the second resistor of the voltage regulating unit.

[0034] Another technical solution of the present invention to solve the above technical problems is as follows:

[0035] A method for manufacturing a flexible package for a weak radio frequency energy harvesting circuit, used for manufacturing a flexible package for a weak radio frequency energy harvesting circuit as in any of the above schemes, comprising:

[0036] The polydimethylsiloxane liquid and the curing liquid are mixed in a preset ratio, and stirred and vacuumed for a preset time to form a gel;

[0037] The flexible system of weak radio frequency energy harvesting circuit was placed in the gel, heated to 60 degrees for 3 hours, and then left to stand for 24 hours;

[0038] Then demoulding and cutting are performed to form a flexible package for the weak radio frequency energy collection circuit.

[0039] The beneficial effect of the present invention is that: the present solution can make the radio frequency energy pickup system composed of the multi-layer embedded antenna and the weak radio frequency energy collection circuit wearable through a flexible printing solution.

[0040] Furthermore, the preset ratio is 10:1; the preset time is 2 hours.

[0041] Another technical solution of the present invention to solve the above technical problems is as follows:

[0042] A signal radio frequency energy transceiver device, comprising: a multi-layer embedded antenna according to any of the above solutions;

[0043] Or, including: a weak radio frequency energy collection circuit for a multi-layer embedded antenna according to any of the above schemes.

[0044] Advantages of additional aspects of the present invention will be given in part in the following description, and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A schematic diagram of the structure of a multi-layer embedded antenna provided by an embodiment of the present invention;

[0046] Figure 2 A schematic diagram of the top layer geometric shape of a multi-layer embedded antenna provided in another embodiment of the present invention;

[0047] Figure 3 A schematic diagram of the bottom layer geometric shape of a multi-layer embedded antenna provided in another embodiment of the present invention;

[0048] Figure 4 A schematic diagram of a weak radio frequency energy collection circuit provided for other embodiments of the present invention;

[0049] Figure 5 A block diagram of a weak radio frequency energy pickup system provided for other embodiments of the present invention;

[0050] Figure 6 A schematic diagram of the geometric array arrangement of multi-layer embedded antenna vias provided in other embodiments of the present invention;

[0051] Figure 7 A schematic diagram of a flexible packaging method for a multi-layer embedded antenna and a weak radio frequency energy collection circuit provided by other embodiments of the present invention;

[0052] Figure 8 Return loss test results of multi-layer embedded antennas provided in other embodiments of the present invention;

[0053] Fig. 9Antenna performance test results of the multilayer embedded antenna provided by other embodiments of the present invention at the center frequency of 868 MHz in the European regional frequency band: (a) impedance matching network; (b) measured return loss;

[0054] Fig.10 Antenna performance test results of multilayer embedded antennas provided in other embodiments of the present invention at a center frequency of 915 MHz in the North American, Japanese, and Oceanian regional frequency bands: (a) impedance matching network; (b) measured return loss;

[0055] Fig.11 Antenna performance test results of the multi-layer embedded antenna provided by an embodiment of the present invention at the center frequency of 2.4 GHz in the global Wi-Fi frequency band: (a) impedance matching network; (b) measured return loss. DETAILED DESCRIPTION

[0056] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention but not to limit the scope of the present invention.

[0057] like Figure 1 As shown, a multi-layer embedded antenna provided by an embodiment of the present invention includes:

[0058] A feedback end 1008 and a top functional layer 1004, a middle functional layer 1010 and a bottom functional layer 1006 stacked in sequence;

[0059] The intermediate functional layer 1010 includes a plurality of intermediate conductive layers 10104 and a plurality of intermediate insulating layers 10108, wherein the intermediate conductive layers 10104 and the intermediate insulating layers 10108 are alternately stacked;

[0060] In the top functional layer 1004, the middle functional layer 1010 and the bottom functional layer 1006, a plurality of vias 1002 are evenly distributed along the extension direction of the serpentine structure antenna; it should be noted that the vias 1002 arranged in a preset geometric size can be designed with different sizes according to the frequency bands in different fields, for example Figure 6As shown, the geometric array arrangement design of several vias 1002 of the multi-layer embedded antenna 100. In this specific embodiment, the diameter of the via is 150 microns, and the hole center distance between adjacent vias is 1.5 mm. This size is applicable to various ISM bands such as 868MHz\915MHz\2.4GHz; but the geometric size of the via and the arrangement between the vias are not limited to the above-mentioned sizes, wherein the arrangement between the vias may include different distances of the vias from the left and right edges, and the arrangement of different vias is not limited to the linear equidistant arrangement. In order to strengthen energy coupling and adapt to multiple industrial, scientific and medical ISM free frequency bands, middle and bottom conductive patterns with the same profile are designed, and the top, middle and bottom conductive lines are connected by through holes. In a certain embodiment, ninety-nine vias with an average diameter of 150μm can be used to embed the top, middle and bottom conductive layers to form a multi-layer embedded antenna. By adjusting the impedance matching network, the multi-layer embedded antenna can operate in different ISM bands without changing the antenna shape or redesigning it, and can greatly reduce the return loss and lower the energy collection threshold.

[0061] Each via 1002 is connected from the top functional layer 1004 to the bottom functional layer 1006 via the middle functional layer 1010;

[0062] The feedback terminal 1008 is disposed at one end of the top functional layer 1004 for connecting to the impedance matching network 1102 .

[0063] In one embodiment, the feedback terminal 1008 is connected to the weak RF energy pickup system through the impedance matching network 1102. The connection block diagram between the antenna and the weak RF energy pickup system is as follows: Figure 5 As shown, the system 10 includes a multi-layer embedded antenna 100 and an energy collection circuit. When working, the multi-layer embedded antenna 100 receives far-field radio frequency electromagnetic wave signals transmitted by a radio frequency power source and picks up radio frequency electromagnetic wave energy, and collects and stores energy through the energy collection circuit 110.

[0064] It should be noted that, in a certain embodiment, the feedback end 1008 of the top antenna is connected to the top mirror plane 1050 through a π-shaped impedance matching network, and the antenna shape is mirrored onto the ground plane to form a dipole antenna with half wavelength. The specific geometric shape is as follows: Figure 2 As shown, the geometric shape of the multi-layer mosaic antenna 100 is illustrated by taking the top layer as an example. The structural elements of the top layer of the antenna include a top functional layer 1004 , a plurality of vias 1002 , a feedback terminal 1008 and a top mirror plane 1050 .

[0065] like Figure 3The figure shows the geometric shape of the multi-layer embedded antenna 100 , taking the bottom layer as an example. The structural elements of the bottom layer of the antenna include a bottom functional layer 1006 , a plurality of vias 1002 and a bottom mirror plane 1060 .

[0066] The geometric shapes of several intermediate layers of the multi-layer embedded antenna 100 are consistent with the bottom layer, including an intermediate functional layer 1010 , several vias 1002 and an intermediate mirror plane. The geometric shape of the intermediate layer is not shown in the figure, and its geometric shape is the same as 1060 .

[0067] The impedance-matched RF signal passes through the weak RF energy harvesting circuit 110, and then the harvested energy is stored in the capacitor. The output of the weak RF energy harvesting circuit 110 is connected to the energy management system to power the sensor and the wireless data transmission module.

[0068] By designing the geometric dimensions and array arrangement of the vias connecting the multi-layer antennas, it is possible to enhance energy coupling and adapt to multiple industrial, scientific and medical ISM free frequency bands, making it suitable for multiple fields.

[0069] In one embodiment, the multi-layer embedded antenna 100 includes a plurality of vias 1002 arranged in specific geometric dimensions, a top functional layer 1004, a bottom functional layer 1006, a plurality of intermediate functional layers 1010, and a feedback terminal 1008. The top functional layer 1004 includes a top solder resist layer 10042 and a top conductive layer 10044; the bottom functional layer 1006 includes a bottom solder resist layer 10062 and a bottom conductive layer 10064; the intermediate functional layer 1010 includes a plurality of intermediate conductive layers 10104 and a plurality of intermediate insulating layers 10108. The via 1002 is connected from the top conductive layer 10044, through the plurality of intermediate conductive layers 10104, to the bottom conductive layer 10064. The materials of via 1002, top conductive layer 10044, bottom conductive layer 10064 and middle conductive layer 10104 are metals, or two-dimensional inorganic compounds such as graphene, transition metal carbides, transition metal halides, transition metal nitrides or transition metal carbonitrides, transition metal carbonitrides such as MXene, transition metal halides such as MoS2, etc.

[0070] In another embodiment, compared with a single-layer antenna with the same design profile operating in the 868 MHz frequency band, the return loss of the multi-layer embedded antenna is reduced by 5 dB, the return loss of the multi-layer embedded antenna is -23 dB, and the return loss of the single-layer antenna is -18 dB. Figure 8 By adjusting the impedance matching network, the multilayer embedded antenna can operate in different ISM bands without changing the antenna shape or redesigning it. Fig. 9The impedance matching network and return loss test results of the antenna operating at a center frequency of 868MHz are shown. 868MHz corresponds to the European regional ISM band European ERC REC 70-03, 863–870MHz. For the North American, Japanese, and Oceania regional bands, it can be tuned to a center frequency of 915MHz, i.e., the US FCC Title-47, 902–928MHz, the Canadian RSS-210, 902–928MHz, the Japanese ARIB STD-T108, 915–930MHz, and the Australian and New Zealand AS / NZS 4268, 915–928MHz, as shown in Figure 1. Fig.10 The multi-layer mosaic antenna can also be tuned to the popular global Wi-Fi frequency band 2.4GHz–2.5GHz, as shown in Fig.11 shown.

[0071] This solution has middle and bottom conductive patterns with the same profile, and the top, middle, and bottom conductive lines are connected by through holes. Ninety-nine vias with an average diameter of 150 μm can be used to embed the top, middle, and bottom conductive layers to form a multi-layer embedded antenna. By adjusting the impedance matching network, the multi-layer embedded antenna can operate in different ISM bands without changing the antenna shape or redesigning it, and can greatly reduce the return loss and lower the energy collection threshold.

[0072] The energy picking antenna has low loss: compared with the single-layer antenna, the return loss of the multi-layer embedded antenna can be reduced by 5dB or more.

[0073] The energy harvesting antenna can work simultaneously in multiple ISM frequency bands of 868MHz\915MHz\2.4GHz, that is, it can collect radio frequency energy in multiple ISM frequency bands at the same time.

[0074] Preferably, in any of the above embodiments, the top functional layer 1004 includes: a top solder resist layer 10042 and a top conductive layer 10044;

[0075] The bottom functional layer 1006 includes: a bottom solder resist layer 10062 and a bottom conductive layer 10064;

[0076] Each via 1002 connects the top solder resist layer 10042 , the top conductive layer 10044 , the middle functional layer 1010 , the bottom solder resist layer 10062 , and the bottom conductive layer 10064 .

[0077] Preferably, in any of the above embodiments, the material of the via 1002, the top conductive layer 10044, the bottom conductive layer 10064 and the plurality of intermediate conductive layers 10104 is metal;

[0078] Alternatively, the materials of the via 1002 , the top conductive layer 10044 , the bottom conductive layer 10064 , and the plurality of intermediate conductive layers 10104 are two-dimensional inorganic compounds.

[0079] Preferably, in any of the above embodiments, the two-dimensional inorganic compound includes: graphene, transition metal halide, transition metal carbide, transition metal nitride or transition metal carbonitride.

[0080] Preferably, in any of the above embodiments, the transition metal carbonitride includes: Mxene; the transition metal halide includes: MoS2; the transition metal halide, i.e., MX2, M is a transition metal such as vanadium, tantalum, molybdenum, etc., and X is sulfur, selenium, tellurium, etc.

[0081] In one embodiment, if Figure 4 As shown, a weak radio frequency energy collection circuit for a multi-layer embedded antenna comprises: a multi-layer embedded antenna 100 as in any of the above embodiments, an impedance matching network 1102, a radio frequency direct current conversion chip 1104, a storage element 1106 and a voltage regulating unit 1108;

[0082] The multi-layer embedded antenna 100 is connected to the impedance matching network 1102 via the feedback terminal 1008;

[0083] The impedance matching network 1102 is connected to the RF-DC conversion chip 1104, the storage element 1106 and the voltage regulating unit 1108 in sequence;

[0084] The voltage regulating unit 1108 is used to adjust the voltage value at the output end of the weak RF energy collection circuit through the first resistor or the second resistor. Figure 4 The resistor R2 in the figure is as follows: Figure 4 The resistor R3 in.

[0085] In one embodiment, the weak RF energy harvesting circuit 110 includes an impedance matching network 1102, an RF to DC conversion chip 1104, a storage element 1106, and a voltage regulating unit 1108. The multi-layer embedded antenna 100 is connected to the weak RF energy harvesting circuit 110 through the impedance matching network 1102.

[0086] In this embodiment, the impedance matching network includes impedance elements Z1, Z2 and Z3. Z1, Z2 and Z3 can be resistors, capacitors or inductors or left blank, and the model is 0402 patch. Figure 9-11The impedance element parameter values ​​in three implementation cases are given; the chip model of the RF to DC conversion chip 1104 can be P2110B; the storage element 1106, the storage element model in this embodiment can be TPSV108M006R0050, and the parameter value is 1000μF. The voltage regulating unit 1108 can include resistors R1, R2, R3 and connector J1, the resistor model is 0603 patch, and the connector model is two 2.54mm; R1 is 0Ω, and the parameter values ​​of R2 and R3 are calculated according to the output voltage requirements.

[0087] The voltage value of the circuit output terminal J1 can be adjusted by adjusting the resistor R2 or R3 of the voltage regulating unit 1108. When R2 or R3 is not connected, the circuit output voltage is 3.3V; if the output voltage of the circuit needs to be lowered, the resistor R3 can be set, and its value is:

[0088]

[0089] If you need to increase the output voltage of the circuit, you can set the resistor R2, and its value is:

[0090]

[0091] V is the desired output voltage value.

[0092] The weak energy collection circuit is not limited to the multi-layer embedded antenna structure of the present patent, and a common antenna can also be connected to the weak RF energy collection circuit 110 through the impedance matching network 1102 .

[0093] The weak radio frequency energy harvesting circuit of this scheme has few structural components, simple control, small internal loss, and adjustable circuit output voltage. It adopts a flexible packaging form and is wearable.

[0094] Preferably, in any of the above embodiments, the voltage regulating unit 1108 is specifically used to set the output voltage of the second resistance reduction circuit, and the formula for calculating the second resistance is:

[0095]

[0096] It is also specifically used to set the output voltage of the first resistance boosting circuit, and the formula for calculating the first resistance is:

[0097]

[0098] Wherein, V is the desired output voltage value, R2 is the first resistor, and R3 is the second resistor.

[0099] This solution achieves adjustable output voltage of the radio frequency energy harvesting circuit by adjusting the first resistor and the second resistor of the voltage regulating unit.

[0100] In one embodiment, if Figure 7 As shown, a method for manufacturing a flexible package for a weak radio frequency energy harvesting circuit is used to manufacture a flexible package for a weak radio frequency energy harvesting circuit as in any of the above embodiments, comprising:

[0101] The polydimethylsiloxane liquid and the curing liquid were mixed in a ratio of 10:1, and stirred and vacuumed for 2 hours to form a gel;

[0102] The flexible system of weak radio frequency energy harvesting circuit was placed in the gel, heated to 60 degrees for 3 hours, and then left to stand for 24 hours;

[0103] Then demoulding and cutting are performed to form a flexible package for the weak radio frequency energy collection circuit.

[0104] The beneficial effect of the present invention is that: the present solution can make the radio frequency energy pickup system composed of the multi-layer embedded antenna and the weak radio frequency energy collection circuit wearable through a flexible printing solution.

[0105] In a certain embodiment, a radio frequency energy transceiver device includes: a multi-layer embedded antenna as described in any of the above embodiments;

[0106] Or, including: a weak radio frequency energy collection circuit for a multi-layer embedded antenna as in any of the above embodiments.

[0107] The transceiver device may include a mobile phone, a wireless communication terminal or a wearable electronic device, etc.

[0108] The reader should understand that in the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0109] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0110] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiments of the present invention.

[0111] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0112] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the various embodiments of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0113] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A multi-layer embedded antenna, characterized in that: include: A feedback end (1008) and a top functional layer (1004), a middle functional layer (1010) and a bottom functional layer (1006) stacked in sequence; The intermediate functional layer (1010) includes a plurality of intermediate conductive layers (10104) and a plurality of intermediate insulating layers (10108), wherein the intermediate conductive layers (10104) and the intermediate insulating layers (10108) are alternately stacked; A plurality of vias (1002) are evenly distributed in the top functional layer (1004), the middle functional layer (1010) and the bottom functional layer (1006) along the extension direction of the serpentine structure antenna; Each via (1002) is connected from the top functional layer (1004) through the middle functional layer (1010) to the bottom functional layer (1006); The feedback end (1008) is arranged at one end of the top functional layer (1004) and is used to connect to the impedance matching network (1102); The conductive pattern in the middle functional layer (1010) has the same profile as the conductive pattern in the bottom functional layer (1006); The conductive pattern in the top functional layer (1004), the conductive pattern in the middle functional layer (1010), and the conductive pattern in the bottom functional layer (1006) are connected to each other through the via (1002); The bottom layer structure of the multi-layer embedded antenna comprises: a bottom functional layer (1006), a plurality of via holes (1002) and a bottom mirror plane (1060); The intermediate layer structure of the multi-layer embedded antenna comprises: an intermediate functional layer (1010), a plurality of via holes (1002) and an intermediate mirror plane; The geometric shape of the intermediate layer structure is the same as the geometric shape of the bottom mirror plane (1060).

2. The multi-layer mosaic antenna according to claim 1, characterized in that: The top functional layer (1004) includes: a top solder resist layer (10042) and a top conductive layer (10044); The bottom functional layer (1006) includes: a bottom solder resist layer (10062) and a bottom conductive layer (10064); Each via (1002) connects the top solder resist layer (10042), the top conductive layer (10044), the middle functional layer (1010), the bottom solder resist layer (10062) and the bottom conductive layer (10064).

3. A multi-layer mosaic antenna according to claim 2, characterized in that: The material of the via (1002), the top conductive layer (10044), the bottom conductive layer (10064) and the plurality of intermediate conductive layers (10104) is metal; Alternatively, the materials of the via (1002), the top conductive layer (10044), the bottom conductive layer (10064) and the plurality of intermediate conductive layers (10104) are two-dimensional inorganic compounds.

4. The multi-layer mosaic antenna according to claim 3, characterized in that: The two-dimensional inorganic compounds include: graphene, transition metal halides, transition metal carbides, transition metal nitrides or transition metal carbonitrides.

5. The multi-layer mosaic antenna according to claim 4, characterized in that: The transition metal carbonitride includes: Mxene; the transition metal halide includes: MoS2.

6. A weak radio frequency energy collection circuit for a multi-layer embedded antenna, characterized in that: include: The multi-layer embedded antenna (100), impedance matching network (1102), radio frequency to direct current conversion chip (1104), storage element (1106) and voltage regulating unit (1108) as claimed in any one of claims 1 to 4; The multi-layer embedded antenna (100) is connected to an impedance matching network (1102) via a feedback end (1008); The impedance matching network (1102) is sequentially connected to the radio frequency to direct current conversion chip (1104), the storage element (1106) and the voltage regulating unit (1108); The voltage regulating unit (1108) is used to regulate the voltage value at the output end of the weak radio frequency energy collection circuit through the first resistor or the second resistor.

7. The weak radio frequency energy collection circuit for a multi-layer embedded antenna according to claim 6, characterized in that: The voltage regulating unit (1108) is specifically used to set the second resistor to reduce the output voltage of the circuit. The formula for calculating the second resistor is: It is also specifically used to set the output voltage of the first resistance boosting circuit, and the formula for calculating the first resistance is: Wherein, V is the desired output voltage value, R2 is the first resistor, and R3 is the second resistor.

8. A method for manufacturing a flexible package for a weak radio frequency energy harvesting circuit, characterized in that: Used to make the weak radio frequency energy collection circuit flexible package as claimed in claim 6 or 7, comprising: The polydimethylsiloxane liquid and the curing liquid are mixed in a preset ratio, and stirred and vacuumed for a preset time to form a gel; The flexible system of weak radio frequency energy harvesting circuit was placed in the gel, heated to 60 degrees for 3 hours, and then left to stand for 24 hours; Then demoulding and cutting are performed to form a flexible package for the weak radio frequency energy collection circuit.

9. The method for manufacturing a flexible package for a weak radio frequency energy harvesting circuit according to claim 8, characterized in that: The preset ratio is 10:1; the preset time is 2 hours.

10. A radio frequency energy transceiver, characterized in that: include: A multi-layer embedded antenna as described in any one of claims 1 to 5; Or, comprising: a weak radio frequency energy collection circuit for a multi-layer embedded antenna as described in claim 6 or 7.

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