Radiating unit and antenna
By designing a decoupling circuit in the radiation unit of a multi-frequency antenna, the coupling gap between capacitive and inductive conductors is used to solve the cross-band scattering interference problem between the radiation units in a multi-frequency antenna, and the improvement and miniaturization of antenna performance is achieved.
Patent Information
- Application Number
- PCT/CN2023/128080
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-09-15
- Filing Date
- 2023-10-31
- Publication Date
- 2025-03-20
AI Technical Summary
There is strong cross-band scattering interference between different radiation units in multi-frequency antennas, resulting in deterioration of antenna performance, such as deformity in the directional pattern of low-frequency signals, and the performance is sharply reduced.
A radiation unit is designed, including feed barrons, radiation arms, capacitive electrical conductors and inductive electrical conductors. By setting up a coupling gap and a decoupling circuit, parasitic radiation is reduced and coupling signals are suppressed, thereby achieving the decoupling function.
The coupled signals from adjacent radiation units on the radiation unit are effectively suppressed, the parasitic radiation of the signal is reduced, the radiation performance and matching performance are improved, and the antenna is miniaturized and cost-reduced.
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Figure CN2023128080_20032025_PF_FP_ABST
Abstract
Description
Radiating element and antenna
[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on September 15, 2023, with application number 202311201153.8 and invention name “Radiation Unit and Antenna”, the entire contents of which are incorporated by reference into this application. Technical Field
[0002] The present application relates to the field of antenna technology, and in particular to a radiation unit and an antenna. Background Art
[0003] With the rapid development of mobile communication technology, multi-frequency antennas can effectively improve antenna space utilization, achieve miniaturization, and reduce antenna costs while providing more diverse services. Therefore, multi-frequency antennas have become one of the important research directions in the field of next-generation wireless communications.
[0004] In related technologies, multi-band antennas typically consist of sub-antennas (also known as radiating elements) operating in different frequency bands, including at least one low-frequency sub-antenna (also known as a low-frequency radiating element) and at least one high-frequency sub-antenna (also known as a high-frequency radiating element). Each radiating element in a multi-band antenna is placed in a confined space, resulting in strong cross-band scattering interference between different radiating elements. This can severely degrade the performance of the multi-band antenna. For example, a low-frequency radiating element can generate a certain excitation signal for its adjacent high-frequency radiating element, resulting in parasitic radiation, which distorts the directivity pattern of the low-frequency signal and significantly reduces the performance of the low-frequency signal.
[0005] Summary of the Invention
[0006] Based on this, in order to overcome the above-mentioned defects of the prior art, the present application provides a radiation unit and an antenna, which can realize the decoupling function, has a simple design structure, is conducive to miniaturization of the antenna, and reduces the manufacturing cost of the antenna.
[0007] A first aspect of the present application provides a radiation unit, comprising:
[0008] Feed balun;
[0009] a radiation arm, the radiation arm being arranged above the feed balun;
[0010] a first capacitive electrical conductor connected to an upper end of the feed balun;
[0011] a second capacitive electrical conductor, wherein the second capacitive electrical conductor is connected to the radiating arm, and a coupling gap is provided between the second capacitive electrical conductor and the first capacitive electrical conductor; and
[0012] An inductive conductor is provided with two opposite ends, the opposite ends of the inductive conductor are electrically connected to the first capacitive conductor and the second capacitive conductor respectively, and the inductive conductor is located above the radiating surface of the radiating arm.
[0013] In one embodiment, the radiating arm is provided with a feeding portion, and the second capacitive conductor is connected to the feeding portion, or the second capacitive conductor is provided as at least a part of the feeding portion.
[0014] In one embodiment, the radiation unit includes a circuit board, at least one of the feed balun and the radiation arm is disposed on the circuit board, and the first capacitive conductor and the second capacitive conductor are both disposed on the circuit board.
[0015] In one embodiment, the circuit board includes a first circuit board and a second circuit board, the feed balun and the inductive conductor are both arranged on the first circuit board, and the radiating arm is arranged on the second circuit board; the first capacitive conductor and the second capacitive conductor are both arranged on the first circuit board or the second circuit board.
[0016] In one embodiment, the first circuit board includes a main body and an extension portion connected to the main body; the second circuit board is provided with a avoidance groove adapted to the extension portion, and the extension portion extends above the second circuit board through the avoidance groove; the feeding balun is arranged on the main body, and the inductive conductor is arranged on the extension portion.
[0017] In one embodiment, the radiating unit is a dual-polarized radiating unit; the number of the feed baluns is two, the number of the radiating arms is four, the number of the first capacitive conductors is four, the number of the second capacitive conductors is four, the number of the inductive conductors is four, the number of the first circuit boards is two, the two first circuit boards are arranged crosswise with each other, and the number of the second circuit board is one; each of the feed baluns is electrically connected to two of the first capacitive conductors respectively, each of the first capacitive conductors is correspondingly connected to each of the inductive conductors, each of the inductive conductors is correspondingly connected to each of the second capacitive conductors, and each of the second capacitive conductors is correspondingly connected to each of the radiating arms.
[0018] In one embodiment, the feed balun, the first capacitive conductor, the second capacitive conductor, and the inductive conductor are all arranged on the first circuit board; the inductive conductor includes a first line segment connected to the first capacitive conductor and a second line segment connected to the first line segment, and the second line segment is connected to the second capacitive conductor; the feed balun, the first capacitive conductor, and the first line segment are located on one side of the first circuit board, and the second line segment and the second capacitive conductor are located on the other side of the first circuit board, and the first capacitive conductor and the second capacitive conductor are located in corresponding positions.
[0019] In one embodiment, a metallized via connecting the first line segment and the second line segment is provided on the first circuit board; and / or the second capacitive conductor is provided with a first soldering portion, the radiating arm is provided with a feeding portion, the feeding portion is provided with a second soldering portion, and the first soldering portion is soldered to the second soldering portion.
[0020] In one embodiment, the first line segment and the second line segment are L-shaped.
[0021] In one embodiment, the feed balun and the inductive conductor are both arranged on the first circuit board, the first capacitive conductor and the second capacitive conductor are both arranged on the upper surface of the second circuit board, and the second capacitive conductor is arranged circumferentially around the first capacitive conductor.
[0022] In one embodiment, a third soldering portion is provided on the first circuit board and is correspondingly provided between the feeding balun and the inductive conductor, and the third soldering portion is soldered to the first capacitive conductor.
[0023] In one embodiment, the radiation unit further includes a guide plate; the guide plate is arranged above the inductive conductor.
[0024] In one embodiment, the wavelength of the center frequency point of the working frequency band of the radiation unit is set to λ, and the electrical length of the inductive conductor is 0.05λ to 0.5λ.
[0025] In one embodiment, the bottom end of the feed balun is used to connect to the reflector, the distance between the upper surface of the radiating arm and the upper surface of the reflector is set to h, and the wavelength of the center frequency point of the working frequency band of the radiating unit is set to λ, h<0.25λ.
[0026] The second aspect of the present application provides an antenna, which includes at least one high-frequency radiation unit and at least one low-frequency radiation unit, wherein the high-frequency radiation unit is arranged in the lower area or side area of the low-frequency radiation unit; the high-frequency radiation unit is arranged to be at least one radiation unit as described in the first aspect of the present application.
[0027] In one embodiment, the operating frequency band of the low-frequency radiation unit is 698 MHz to 960 MHz, and the operating frequency band of the high-frequency radiation unit is 1427 MHz to 2690 MHz.
[0028] In the radiating element and antenna described in the present application, a first capacitive conductor and a second capacitive conductor are provided with a coupling gap, thereby coupling and cooperating with each other to form a capacitive coupling unit. The inductive conductor, as an inductive conductor unit, is connected to the capacitive coupling unit to form a decoupling circuit. The decoupling circuit can be used to reduce parasitic radiation, effectively suppressing the coupled signal from the adjacent radiating unit on the radiating unit, and reducing the parasitic radiation of the signal on the radiating unit, thereby ensuring good electrical performance and reducing the spacing between adjacent radiating units to achieve antenna miniaturization. In addition, the inductive conductor unit of the decoupling circuit is arranged above the radiating surface, rather than being coplanar with the radiating arm as in the related art, nor is it arranged on the feed balun below the radiating arm. Therefore, the mutual coupling effect between the inductive conductor unit and the radiating arm / feed balun is reduced, thereby improving the radiation performance and matching performance of the radiating unit. The simple structure is also conducive to cost control. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] FIG1 is a schematic structural diagram of a radiation unit according to an embodiment of the present application.
[0030] FIG2 is a top view of the structure shown in FIG1 .
[0031] FIG3 is a schematic diagram of the enlarged structure of the structure shown in FIG2 at point A. FIG.
[0032] FIG4 is a front and back structural diagram of one of the first circuit boards in the structure shown in FIG1 .
[0033] FIG5 is a front and back structural diagram of another first circuit board in the structure shown in FIG1 .
[0034] FIG6 is a structural diagram showing a radiation unit in the structure shown in FIG1 provided with a guide plate.
[0035] FIG7 is a structural diagram of a radiation unit according to another embodiment of the present application.
[0036] FIG8 is a top view of the structure shown in FIG7 .
[0037] FIG9 is a front and back structural diagram of one of the first circuit boards in the structure shown in FIG7 .
[0038] FIG10 is a front and back structural diagram of another first circuit board in the structure shown in FIG7 .
[0039] FIG11 is a structural diagram of a radiation unit according to another embodiment of the present application.
[0040] FIG12 is a top view of the structure shown in FIG11 .
[0041] FIG13 is an enlarged structural diagram of the structure shown in FIG12 at position B. ...
[0042] FIG14 is a front and back structural diagram of one of the first circuit boards in the structure shown in FIG11 .
[0043] FIG15 is a front and back structural diagram of another first circuit board in the structure shown in FIG11.
[0044] FIG16 is a top view of an antenna according to an embodiment of the present application.
[0045] FIG17 is a directional diagram of a low-frequency signal of an antenna according to an embodiment of the present application.
[0046] FIG18 is a directional diagram of a low-frequency signal when a base station antenna in the related art adopts a conventional radiation unit.
[0047] Explanation of the accompanying drawings: 10. Radiating unit; 11. First circuit board; 111. Feed balun; 112. Inductive conductor; 1121. First line segment; 1122. Second line segment; 113. Main body; 114. Extension; 115. First slot; 116. Second slot; 117. Metallized via; 118. Third welding portion; 119. Feed line; 12. Second circuit board; 121. Radiating arm; 1211. Feeding portion; 12111. Second welding portion; 122. Avoidance groove; 13. First capacitive conductor; 14. Second capacitive conductor; 141. First welding portion; 15. Guide plate; 20. Low-frequency radiating unit; 30. Reflection plate. DETAILED DESCRIPTION
[0048] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.
[0049] Referring to Figures 1 to 5, Figure 1 shows a schematic structural diagram of a radiating unit 10 according to an embodiment of the present application. Figure 2 shows a top view of the structure shown in Figure 1. Figure 3 shows an enlarged structural diagram of the structure shown in Figure 2 at point A. Figures 4 and 5 respectively show the front and back structural diagrams of the two first circuit boards 11 in the structure shown in Figure 1. A radiating unit 10 provided in an embodiment of the present application includes: a feed balun 111, a radiating arm 121, a first capacitive conductor 13, a second capacitive conductor 14, and an inductive conductor 112. The radiating arm 121 is disposed above the feed balun 111. The first capacitive conductor 13 is connected to the upper end of the feed balun 111. The second capacitive conductor 14 is connected to the radiating arm 121, and a coupling gap is provided between the second capacitive conductor 14 and the first capacitive conductor 13. The inductive conductor 112 has two opposite ends, which are electrically connected to the first capacitive conductor 13 and the second capacitive conductor 14 respectively. The inductive conductor 112 is located above the radiation surface of the radiation arm 121 .
[0050] In the radiating element 10 described herein, a first capacitive conductor 13 and a second capacitive conductor 14 are provided with a coupling gap, thereby coupling and cooperating to form a capacitive coupling unit. The inductive conductor 112, acting as an inductive conductor unit, is connected to the capacitive coupling unit to form a decoupling circuit. This decoupling circuit can be used to reduce parasitic radiation and effectively suppress coupled signals from adjacent radiating elements, such as the low-frequency radiating element 20, on the radiating element 10. This reduces the parasitic radiation of low-frequency signals on the radiating element 10, thereby ensuring good low-frequency electrical performance and reducing the spacing between high- and low-frequency radiating elements 20, thereby minimizing the antenna. Furthermore, the inductive conductor unit of the decoupling circuit is disposed above the radiating surface, rather than being coplanar with the radiating arm 121 as in the related art, or being disposed on the feed balun 111 below the radiating arm 121. This reduces the mutual coupling between the inductive conductor unit and the radiating arm 121 / feed balun 111, thereby improving the radiation performance and matching performance of the radiating element 10. The simple structure also helps control costs.
[0051] Specifically, to address the diverse application environments of the multi-band antenna, adapt to radiating elements 10 of various shapes and sizes, and target specific low-frequency coupled signal suppression performance, the matching and radiation performance of the radiating element 10 can be fully optimized by flexibly adjusting and configuring the size and shape of the first capacitive conductor 13 and the second capacitive conductor 14 of the decoupling circuit, as well as adjusting the length, shape, and layout of the inductive conductor 112. Specifically, adaptive adjustments can be made based on simulation test results to ensure that both return loss and isolation meet preset values.
[0052] Referring to FIG. 1 , in one embodiment, the inductive conductor 112 is independently disposed in a spatial region as far away from the radiating arm 121 and the feed balun 111 as possible. For example, it is disposed on different sides of the radiating arm 121 from the feed balun 111, namely, on the upper and lower sides of the radiating arm 121, respectively. Furthermore, when the inductive conductor 112 is disposed close to the central axis Z of the radiating element 10, specifically, for example, with a spacing of less than 20 mm, or even less than 10 mm, the distance between the inductive conductor 112 and the radiating arm 121 and the feed balun 111 can be minimized, while reducing the coupling effect between them, thereby ensuring the matching and radiation performance of the radiating element 10 itself, and ensuring the filtering performance of the decoupling circuit.
[0053] Referring to Figures 1 to 5 , in some embodiments, the radiating unit 10 can be either a single-polarization radiating unit or a dual-polarization radiating unit. The difference between the two is the number of radiating arms 121. The single-polarization radiating unit has two radiating arms 121, which are used to radiate and receive antenna signals in a +45° polarization direction or a -45° polarization direction, for example. The dual-polarization radiating unit has four radiating arms 121, which are divided into two groups, each group having two radiating arms 121. One group of radiating arms 121 is arranged on one diagonal line, which is used to radiate and receive antenna signals in a +45° polarization direction, for example, and the other group of radiating arms 121 is arranged on the other diagonal line, which is used to radiate and receive antenna signals in a -45° polarization direction, for example. The radiating unit 10 shown in Figures 1 to 16 in this embodiment is specifically described using a dual-polarization oscillator as an example, but is not limited to this.
[0054] 1 to 5 , when there are four radiating arms 121 , four first capacitive conductors 13 , four inductive conductors 112 , and four second capacitive conductors 14 are correspondingly provided. Each first capacitive conductor 13 , each inductive conductor 112 , and each second capacitive conductor 14 is disposed correspondingly to a respective radiating arm 121 .
[0055] In some embodiments, the contour shape of the radiation arm 121 includes but is not limited to regular shapes such as square, rectangle, circle, or other irregular shapes, and can be flexibly adjusted and configured according to actual needs.
[0056] Referring to FIG. 1 , in one embodiment, the radiating arm 121 is provided with a feeder 1211. The second capacitive conductor 14 is connected to the feeder 1211 by methods including, but not limited to, welding, clamping, or fasteners such as metal screws. Alternatively, the second capacitive conductor 14 may be provided as at least a portion of the feeder 1211, depending on actual needs. In other words, a portion or all of the feeder 1211 may be provided as the second capacitive conductor 14.
[0057] The specific shape and size of the feeder 1211 can also be flexibly adjusted and configured according to actual needs. The feeder 1211 is located at a corner of the radiating arm 121 close to the central axis Z of the radiating unit 10 , so that it can be easily fed with the feeder line 119 .
[0058] It should be noted that the "feeding portion 1211" can be a "part of the radiating arm 121", that is, the "feeding portion 1211" and the "other parts of the radiating arm 121" are manufactured as one piece; it can also be an independent component that can be separated from the "other parts of the radiating arm 121", that is, the "feeding portion 1211" can be manufactured independently and then combined with the "other parts of the radiating arm 121" into a whole.
[0059] The shapes of the first capacitive conductor 13 and the second capacitive conductor 14 may be the same or substantially the same, and may also be flexibly adjusted and designed according to actual needs.
[0060] As an example, the first capacitive conductor 13 and the second capacitive conductor 14 are each configured as a sheet and are disposed opposite each other to form a coupling gap. The sheet may have a regular shape, such as a polygon, a circle, an ellipse, or other irregular shapes. Polygons include, but are not limited to, triangles, quadrilaterals, pentagons, hexagons, and the like.
[0061] As another example, the first capacitive conductor 13 and the second capacitive conductor 14 are disposed on the same plane, and the second capacitive conductor 14 is disposed around the periphery of the first capacitive conductor 13 and forms a coupling gap with the first capacitive conductor 13 .
[0062] In one embodiment, the specific shape of the inductive conductor 112 can be flexibly adjusted and set according to actual needs, including but not limited to various regular shapes and irregular shapes such as U-shape, L-shape, and S-shape, as long as the required electrical length is met and both ends can be connected to the first capacitive conductor 13 and the second capacitive conductor 14 respectively.
[0063] In one embodiment, the wavelength of the center frequency of the operating frequency band of the radiating unit 10 is set to λ, and the electrical length of the inductive conductor 112 includes, but is not limited to, 0.05λ to 0.5λ, specifically, 0.05λ, 0.1λ, 0.2λ, 0.25λ, 0.3λ, 0.4λ, 0.5λ, etc., and can also be set to any value other than 0.05λ to 0.5λ according to actual needs. The inductive conductor 112 includes, but is not limited to, a relatively narrow metal wire, metal strip, or metal rod, thereby enabling the inductive conductor 112 to have a high impedance. Optionally, the width of the inductive conductor 112 is, for example, set to 0.1 mm to 3 mm, specifically, 0.1 mm, 0.3 mm, 0.5 mm, 1 mm, 2 mm, or 3 mm. Furthermore, the impedance of the inductive conductor 112 is set to, for example, 300Ω to 800Ω, specifically any value such as 300Ω, 400Ω, 500Ω, 600Ω, 700Ω, or 800Ω. Of course, the width of the inductive conductor 112 can also be set to any value other than 0.1mm to 3mm based on actual needs. Accordingly, the impedance of the inductive conductor 112 can also be set to any value other than 300Ω to 800Ω based on actual needs.
[0064] 1 to 5 , in one embodiment, the radiating unit 10 includes a circuit board. At least one of the feed balun 111 and the radiating arm 121 is disposed on the circuit board. In addition, the first capacitive conductor 13 and the second capacitive conductor 14 are both disposed on the circuit board.
[0065] Specifically, the circuit board includes a first circuit board 11 and a second circuit board 12. The feed balun 111 and the inductive conductor 112 are both provided on the first circuit board 11, and the radiating arm 121 is provided on the second circuit board 12. Furthermore, the first capacitive conductor 13 and the second capacitive conductor 14 are both provided on the first circuit board 11 or the second circuit board 12. This results in a simple structure, flexible design, and mass production.
[0066] Of course, the first capacitive conductor 13 and the second capacitive conductor 14 are not limited to being disposed on the first circuit board 11. Please refer to Figures 11 to 15 , which illustrate schematic structural diagrams of a radiation unit 10 according to another embodiment. In the radiation unit 10 shown in Figures 11 to 15 , the first capacitive conductor 13 and the second capacitive conductor 14 are both disposed on the second circuit board 12.
[0067] In some embodiments, the feed balun 111 and the inductive conductor 112 are, but are not limited to, printed on the first circuit board 11. The radiating arm 121 is, but is not limited to, printed on the second circuit board 12. Similarly, the first capacitive conductor 13 and the second capacitive conductor 14 are, but are not limited to, printed on the first circuit board 11 or the second circuit board 12.
[0068] Referring to Figures 1 to 5 , in one embodiment, the first circuit board 11 includes a main portion 113 and an extension 114 connected to the main portion 113. The second circuit board 12 is provided with a relief groove 122 adapted to accommodate the extension 114. The extension 114 extends through the relief groove 122 and projects above the second circuit board 12. The feed balun 111 is disposed on the main portion 113, and the inductive conductor 112 is disposed on the extension 114. This arrangement allows the inductive conductor element of the decoupling circuit to be positioned above the radiating surface.
[0069] Referring to Figure 6 , in one embodiment, the radiating element 10 further includes a guide plate 15. This guide plate 15 is positioned above the inductive conductor. Specifically, it is connected to the top of the extension 114. This positions the inductive conductor element between the guide plate 15 and the radiating surface of the radiating arm 121. This arrangement offsets the impedance mismatch caused by coupling between the elements through the parasitic effects between the guide plate 15 and the oscillator, improving performance indicators such as standing wave, isolation, and directivity.
[0070] 1 to 5 , in one embodiment, the radiating unit 10 is a dual-polarized radiating unit. Two feed baluns 111 are provided, four radiating arms 121 are provided, four first capacitive conductors 13 are provided, four second capacitive conductors 14 are provided, and four inductive conductors 112 are provided. Two first circuit boards 11 are provided, the two first circuit boards 11 being arranged crosswise with each other, and one second circuit board 12 is provided. Two feed baluns 111 are provided on the two first circuit boards 11, respectively. Each feed balun 111 is electrically connected to two first capacitive conductors 13, each first capacitive conductor 13 is correspondingly connected to each inductive conductor 112, each inductive conductor 112 is correspondingly connected to each second capacitive conductor 14, and each second capacitive conductor 14 is correspondingly connected to each radiating arm 121.
[0071] To enable the two first circuit boards 11 to be arranged crosswise, in some embodiments, a first slot 115 extending upward is provided on the bottom edge of one of the first circuit boards 11, and a second slot 116 extending downward is provided on the top edge of the other first circuit board 11. The two first circuit boards 11 can be assembled together by interlocking the first slot 115 and the second slot 116.
[0072] Referring to Figures 1 to 5, in one embodiment, a feed balun 111, a first capacitive conductor 13, a second capacitive conductor 14, and an inductive conductor 112 are all disposed on a first circuit board 11. The inductive conductor 112 includes a first segment 1121 connected to the first capacitive conductor 13 and a second segment 1122 connected to the first segment 1121. Specifically, a metallized via 117 is provided on the first circuit board 11, connecting the first segment 1121 and the second segment 1122. Furthermore, the second segment 1122 is connected to the second capacitive conductor 14. The feed balun 111, the first capacitive conductor 13, and the first segment 1121 are located on one side of the first circuit board 11, while the second segment 1122 and the second capacitive conductor 14 are located on the other side of the first circuit board 11. The first capacitive conductor 13 and the second capacitive conductor 14 are positioned in corresponding positions.
[0073] In some embodiments, the shapes of the first line segment 1121 and the second line segment 1122 are independently set and adjusted according to actual needs, specifically including but not limited to being set to an L-shape.
[0074] As an example, the second capacitive conductor 14 is provided with a first welding portion 141 , the radiating arm 121 is provided with a feeding portion 1211 , the feeding portion 1211 is provided with a second welding portion 12111 , and the first welding portion 141 is connected to the second welding portion 12111 by welding.
[0075] The first capacitive conductor 13 and the second capacitive conductor 14 can be located above the radiating surface of the radiating arm 121, as in the radiating unit 10 shown in Figures 1 to 5 , or below the radiating surface of the radiating arm 121, as in the radiating unit 10 shown in Figures 7 to 10 . Optionally, regardless of whether the second capacitive conductor 14 is located above or below the radiating surface of the radiating arm 121, the first soldering portion 141 of the second capacitive conductor 14 is located above the radiating surface, facilitating the soldering connection between the first soldering portion 141 and the second soldering portion 12111.
[0076] The second soldering portion 12111 may be part of the power feeding portion 1211 or independently provided and connected to the power feeding portion 1211. Similarly, the first soldering portion 141 may be part of the second capacitive conductor 14 or independently provided and connected to the second capacitive conductor 14.
[0077] Furthermore, when the first capacitive conductor 13 is located below the radiating surface, the first capacitive conductor 13 forms an integrated structure with the feed balun 111. Specifically, the width of the first capacitive conductor 13 is, for example, consistent with the width of the feed balun 111, but can also be designed in different shapes.
[0078] 11 to 15 , in one embodiment, the feed balun 111 and the inductive conductor 112 are both disposed on the first circuit board 11. The first capacitive conductor 13 and the second capacitive conductor 14 are both disposed on the upper surface of the second circuit board 12. The second capacitive conductor 14 is circumferentially disposed around the first capacitive conductor 13, forming a coupling gap between the second capacitive conductor 14 and the first capacitive conductor 13, thereby achieving mutual coupling.
[0079] 11 to 15 , in one embodiment, a third soldering portion 118 is provided on the first circuit board 11, correspondingly disposed between the feed balun 111 and the inductive conductor 112. The third soldering portion 118 is soldered to the first capacitive conductor 13, thereby electrically connecting the first capacitive conductor 13 to the feed balun 111.
[0080] Specifically, the third welding portion 118 and the inductive conductor 112 are both provided on the protruding portion 114 . The protruding portion 114 passes through the avoiding groove 122 . The third welding portion 118 corresponds to the position of the first capacitive conductor 13 and is fixedly connected by welding.
[0081] Referring to Figures 1 to 5, in some embodiments, a feed line 119 is further provided on the first circuit board 11, and the feed line 119 and the feed balun 111 are respectively located on two opposite sides of the first circuit board 11. The feed line 119 is used to directly electrically connect or couple the corresponding radiating arm 121 for feeding. When the radiating unit 10 is a dual-polarized radiating unit, two feed lines 119 are correspondingly provided, and the tops of the two feed lines 119 are orthogonally arranged. The top of one of the feed lines 119 is used to couple or directly electrically connect the two radiating arms 121 with a +45° polarity to achieve transmission of antenna signals with a +45° polarity; the top of the other feed line 119 is used to couple or directly electrically connect the two radiating arms 121 with a -45° polarity to achieve transmission of antenna signals with a -45° polarity.
[0082] In one embodiment, the wavelength of the center frequency point of the working frequency band of the radiation unit 10 is set to λ, and the electrical length of the inductive conductor 112 is 0.05λ to 0.5λ.
[0083] In one embodiment, the bottom end of the feed balun 111 is used to connect to the reflector 30, the distance between the upper surface of the radiation arm 121 and the upper surface of the reflector 30 is set to h, and the wavelength of the center frequency point of the working frequency band of the radiation unit 10 is set to λ, h<0.25λ.
[0084] In one embodiment, the decoupling circuit can increase the equivalent electrical length of the feed balun 111. Optionally, the spacing h is set to 0.15λ to 0.2λ. This allows for good impedance matching and reduces the height of the radiating arm 121 of the radiating element 10 in the related art (typically 0.25λ), thereby reducing coupled energy from the low-frequency radiating element 20, thereby improving the performance of the low-frequency radiating element 20 and facilitating antenna miniaturization.
[0085] It should be noted that the "first capacitive conductor 13 and the inductive conductor 112" can be "part of the feed balun 111", that is, the "first capacitive conductor 13 and the inductive conductor 112" are integrally formed with the "other parts of the feed balun 111"; or it can be an independent component that can be separated from the "other parts of the feed balun 111", that is, the "first capacitive conductor 13 and the inductive conductor 112" can be manufactured independently and then combined with the "other parts of the feed balun 111" into a whole.
[0086] It should be noted that the "second capacitive conductor 14" can be "a part of the radiating arm 121", that is, the "second capacitive conductor 14" and the "other parts of the radiating arm 121" are integrally formed; or it can be an independent component that is separable from the "other parts of the radiating arm 121", that is, the "second capacitive conductor 14" can be manufactured independently and then combined with the "other parts of the radiating arm 121" into a whole.
[0087] 1 and 16 , in one embodiment, an antenna includes at least one high-frequency radiating unit and at least one low-frequency radiating unit 20, wherein the high-frequency radiating unit is disposed below or to the side of the low-frequency radiating unit 20. The high-frequency radiating unit is specifically configured as the radiating unit 10 described in any of the above embodiments.
[0088] In the antenna described herein, a first capacitive conductor 13 and a second capacitive conductor 14 are provided with a coupling gap, thereby coupling and cooperating to form a capacitive coupling unit. The inductive conductor 112, acting as an inductive conductor unit, is connected to the capacitive coupling unit to form a decoupling circuit. This decoupling circuit can be used to reduce low-frequency parasitic radiation, effectively suppressing the coupled signal from the adjacent low-frequency radiating unit 20 on the radiating unit 10, and reducing the parasitic radiation of low-frequency signals on the radiating unit 10. This ensures good low-frequency electrical performance while reducing the spacing between the high- and low-frequency radiating units 20, thereby miniaturizing the antenna. Furthermore, the inductive conductor unit of the decoupling circuit is positioned above the radiating surface, rather than being coplanar with the radiating arm 121 as in related art, or being positioned on the feed balun 111 below the radiating arm 121. This reduces the mutual coupling between the inductive conductor unit and the radiating arm 121 / feed balun 111, thereby improving the radiation performance and matching performance of the radiating unit 10. The simple structure also helps control costs.
[0089] In one embodiment, the operating frequency band of the low-frequency radiation unit 20 includes but is not limited to 698 MHz to 960 MHz, and the operating frequency band of the radiation unit 10 includes but is not limited to 1427 MHz to 2690 MHz.
[0090] Referring to Figures 17 and 18, Figure 17 illustrates the low-frequency signal pattern of an antenna according to an embodiment of the present application. Figure 17 illustrates the low-frequency signal pattern of a base station antenna in the related art using conventional radiating elements 10. As can be seen from Figure 18, under the same compact layout, all parameters of the antenna provided by this embodiment perform normally. By comparison with Figure 18, it can be seen that when using conventionally designed radiating elements 10, the low-frequency antenna pattern of the antenna is significantly distorted, and performance cannot be guaranteed.
[0091] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.
[0092] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.
[0093] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.
[0094] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.
[0095] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.
[0096] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the description of this application.
[0097] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of this patent application shall be determined by the appended claims.
Claims
1. A radiation unit, characterized in that: The radiation unit comprises: Feed balun; A radiation arm, the radiation arm being arranged above the feeding balun; a first capacitive electrical conductor connected to an upper end of the feed balun; a second capacitive electrical conductor, wherein the second capacitive electrical conductor is connected to the radiation arm, and a coupling gap is provided between the second capacitive electrical conductor and the first capacitive electrical conductor; and The inductive conductor is provided with two opposite ends, the opposite ends of the inductive conductor are electrically connected to the first capacitive conductor and the second capacitive conductor respectively, and the inductive conductor is located above the radiation surface of the radiation arm.
2. The radiation unit according to claim 1, characterized in that: The radiating arm is provided with a feeding portion, and the second capacitive electrical conductor is connected to the feeding portion, or the second capacitive electrical conductor is provided as at least a part of the structure of the feeding portion.
3. The radiation unit according to claim 1, characterized in that: The radiation unit includes a circuit board, at least one of the feed balun and the radiation arm is arranged on the circuit board, and the first capacitive conductor and the second capacitive conductor are both arranged on the circuit board.
4. The radiation unit according to claim 3, characterized in that: The circuit board includes a first circuit board and a second circuit board, the feeding balun and the inductive conductor are both arranged on the first circuit board, and the radiating arm is arranged on the second circuit board; the first capacitive conductor and the second capacitive conductor are both arranged on the first circuit board or the second circuit board.
5. The radiation unit according to claim 4, characterized in that: The first circuit board includes a main body and an extension portion connected to the main body; the second circuit board is provided with an avoidance groove adapted to the extension portion, and the extension portion extends above the second circuit board through the avoidance groove; the feeding balun is arranged on the main body, and the inductive conductor is arranged on the extension portion.
6. The radiation unit according to claim 4, characterized in that: The radiating unit is a dual-polarized radiating unit; the number of the feeding baluns is two, the number of the radiating arms is four, the number of the first capacitive conductors is four, the number of the second capacitive conductors is four, the number of the inductive conductors is four, the number of the first circuit boards is two, the two first circuit boards are cross-arranged with each other, and the number of the second circuit board is one; each of the feeding baluns is electrically connected to two of the first capacitive conductors respectively, each of the first capacitive conductors is connected to each of the inductive conductors correspondingly, each of the inductive conductors is connected to each of the second capacitive conductors correspondingly, and each of the second capacitive conductors is connected to each of the radiating arms correspondingly.
7. The radiation unit according to claim 4, characterized in that: The feeding balun, the first capacitive conductor, the second capacitive conductor and the inductive conductor are all arranged on the first circuit board; the inductive conductor includes a first line segment connected to the first capacitive conductor and a second line segment connected to the first line segment, and the second line segment is connected to the second capacitive conductor; the feeding balun, the first capacitive conductor and the first line segment are located on one side surface of the first circuit board, and the second line segment and the second capacitive conductor are located on the other side surface of the first circuit board, and the positions of the first capacitive conductor and the second capacitive conductor correspond to each other.
8. The radiation unit according to claim 7, characterized in that: The first circuit board is provided with a metallized via connecting the first line segment and the second line segment; and / or the second capacitive conductor is provided with a first welding portion, the radiating arm is provided with a feeding portion, the feeding portion is provided with a second welding portion, and the first welding portion is welded to the second welding portion.
9. The radiation unit according to claim 7, characterized in that: The first line segment and the second line segment are L-shaped.
10. The radiation unit according to claim 4, characterized in that: The feeding balun and the inductive conductor are both arranged on the first circuit board, the first capacitive conductor and the second capacitive conductor are both arranged on the upper surface of the second circuit board, and the second capacitive conductor is arranged circumferentially around the first capacitive conductor.
11. The radiation unit according to claim 10, characterized in that: The first circuit board is provided with a third welding portion correspondingly arranged between the feeding balun and the inductive conductor, and the third welding portion is connected to the first capacitive conductor by welding.
12. The radiation unit according to any one of claims 1 to 11, characterized in that: The radiation unit further comprises a guide plate; the guide plate is arranged above the inductive electrical conductor.
13. The radiation unit according to any one of claims 1 to 11, characterized in that: The wavelength of the central frequency point of the working frequency band of the radiation unit is set to λ, and the electrical length of the inductive conductor is 0.05λ to 0.5λ.
14. The radiation unit according to any one of claims 1 to 11, characterized in that: The bottom end of the feed balun is used to be connected to a reflector, the distance between the upper surface of the radiation arm and the upper surface of the reflector is set to h, the wavelength of the center frequency point of the working frequency band of the radiation unit is set to λ, and h<0.25λ.
15. An antenna, characterized in that: The antenna includes at least one high-frequency radiation unit and at least one low-frequency radiation unit, and the high-frequency radiation unit is arranged in the lower area or the side area of the low-frequency radiation unit; the high-frequency radiation unit is arranged to be at least one radiation unit as described in any one of claims 1 to 14.
16. The antenna according to claim 15, characterized in that The working frequency band of the low-frequency radiation unit is 698 MHz to 960 MHz, and the working frequency band of the high-frequency radiation unit is 1427 MHz to 2690 MHz.
Citation Information
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