Micro-nano 3D printing curved surface conformal multilayer circuit manufacturing method and system based on charge control

Abstract

The invention provides a charge control electric field driven jet micro-nano 3D printing curved surface conformal multilayer circuit method and system. A high-precision conformal thin film dielectric layer is formed by utilizing charge injection electrowetting and contact electric field driving jet micro-nano 3D printing; and the high-resolution curved surface conformal circuit is manufactured by combining active residual charge elimination and non-contact electric field driving spray deposition micro-nano 3D printing. Through organic combination of active charge regulation and control and electric field driven jet micro-nano 3D printing, a high-precision conformal film dielectric layer and conductive layer conformal circuit and an interlayer interconnection circuit thereof are integrally printed. According to the curved surface conformal multilayer circuit manufacturing method, efficient, low-cost, high-precision and uniform manufacturing of the curved surface conformal multilayer circuit is achieved.

Description

Technical Field

[0001] The present invention belongs to the field of electronic manufacturing and micro-nano 3D printing, and specifically relates to a method and system for printing curved surface conformal multilayer circuits based on charge-controlled electric field-driven jetting micro-nano 3D printing. Background Art

[0002] The statements in this section merely provide background information related to the present invention and do not necessarily constitute prior art.

[0003] Curved surface conformal electronics is a new 3D structural electronic product that has emerged in recent years with the advancement of previous manufacturing technology (especially multi-material micro-nano 3D printing). It subverts the concept of separating the mechanical structure and electronic circuit of traditional products (designing and manufacturing them separately, and then assembling them). Through the close integration of mechanical structure and electronic circuit (manufacturing conformal electronic circuits in 3D structures, complex surfaces, etc., to achieve the organic integration of structure-functional circuit-electronics, and the integration of structure and electronic functions), it not only helps to achieve product multifunctionality, miniaturization, lightweight and intelligence, but also provides a new solution for the development of disruptive innovative products. At present, curved surface conformal electronics has been widely used in many fields such as aerospace, national defense and military, biomedicine, automobiles, wearable devices, health monitoring, and intelligent structures. The current typical conformal electronics and applications mainly include conformal antennas, frequency selective surface (FSS) stealth radar radomes, structural electronics, 3D sensors, electronic skin, robots, microsystem integration, 3D packaging, etc. Curved surface conformal electronics generally include 3D substrates, dielectric layers (dielectric layers), conductive layers, interlayer interconnection circuits, packaging layers, etc.

[0004] Surface conformal electronics generally include a 3D substrate, a dielectric layer (dielectric layer), a conductive layer, an interlayer interconnection circuit, a packaging layer, etc. At present, most surface conformal electronics directly pattern the conductive layer on the substrate surface, that is, pattern conformal electronics and circuits on the substrate surface, and basically do not involve multi-layer dielectric layers, multi-layer conductive layers, and interlayer vertical interconnections. This seriously limits the multifunctionality and high performance of surface conformal electronics. For example, the existing FSS faces problems such as poor conformality, low wave transmission efficiency, narrow-band response, and poor anti-interference ability. It cannot meet the problem of passing through multi-frequency broadband electromagnetic waves. It is urgent to develop multi-layer frequency selective surfaces (FSS) and ultra-wideband FSS stealth radar cover technology based on multi-layer structures. Traditional single-layer conformal antennas have the problem of narrow bandwidth, and it is urgent to develop multi-layer broadband conformal antennas to achieve multi-frequency communication. Therefore, many curved conformal electronic products and applications such as broadband high-stealth FSS stealth radar radome, broadband omnidirectional conformal antenna, aircraft intelligent skin, curved multilayer printed circuit boards, smart wearable devices, 3D structural electronics, structural health monitoring, 3D sensors, smart structures, electromagnetic metamaterials, soft robots, etc. have a huge demand for 3D circuits and curved conformal multilayer circuits, especially the manufacturing of complex curved conformal multilayer circuits is the key core technology to realize these high-performance curved conformal electronic products.

[0005] At present, scholars at home and abroad have proposed a variety of curved surface conformal electronic circuit manufacturing technologies, mainly including: (1) conformal transfer technology; (2) LPKF-LDS laser direct forming of Lepco, Germany; (3) five-axis laser etching; (4) aerosol jet printing of Optomec, USA; (5) inkjet printing; (6) electrohydrodynamic jet printing; (7) vertical jet curved surface conformal micro 3D printing based on local polarization electric field drive; (8) curved surface lithography; (9) extrusion direct writing. In addition, there are multi-axis linkage machining, holographic lithography, etc. However, these existing technologies have the problem of difficulty in manufacturing complex curved surface conformal electronic circuits such as non-unfolded surfaces, variable curvature, and multiple curvatures; and the bonding strength between the conformal circuit and the substrate interface is poor, and the interlayer positioning accuracy is low. In addition, the existing curved conformal circuit manufacturing technology still finds it difficult to achieve high-precision dielectric film manufacturing, especially the high-precision ultra-thin film dielectric layer (high-precision 3D sensors, wearable devices, etc.) and ultra-thick dielectric layer (used for multi-layer FSS, conformal antennas, etc.) manufacturing, which currently cannot meet actual engineering needs.

[0006] In summary, the current manufacturing of curved surface conformal multilayer circuits mainly faces the following difficulties: (1) The existing manufacturing technology cannot realize the manufacturing of high-precision, uniform curved surface dielectric layers (conformal films), resulting in the inability to manufacture curved surface conformal multilayer circuits; (2) It is difficult or even impossible to manufacture high-resolution, high-performance conformal circuits on non-developable, multi-curvature and arbitrarily complex curved substrates; (3) The existing curved surface printing technology faces the problems of slippage and spreading of printing droplets (printing materials with low viscosity), poor printing uniformity and consistency, low precision, poor electrical performance, and poor interface bonding strength; (4) It is difficult to manufacture vertical interconnections of curved surface multilayer circuits. Therefore, the existing technology cannot realize the manufacturing of high-precision curved surface conformal multilayer circuits, especially the manufacturing of high-precision curved surface conformal multilayer circuits on non-developable surfaces, multi-curvature surfaces, etc. Both academia and industry are in urgent need of developing new manufacturing technologies to achieve efficient, low-cost, and high-consistency manufacturing of high-resolution, high-performance (high conductivity, high adhesion), and high-precision curved surface conformal multilayer circuits on non-developable, multi-curvature and arbitrarily complex curved substrates. Summary of the invention

[0007] In order to solve the above problems, the present invention proposes a new method for manufacturing curved surface conformal multilayer circuits based on charge-controlled electric field-driven jet micro-nano 3D printing, which forms a high-precision conformal thin film dielectric layer by combining charge injection electrowetting and electric field-driven jet micro-nano 3D printing; and manufactures high-resolution curved surface conformal circuits by combining active elimination of residual charge and non-contact electric field-driven jet deposition micro-nano 3D printing. Active charge regulation and electric field-driven jet micro-nano 3D printing are organically combined to simultaneously print high-precision conformal films and conformal circuits in an integrated manner, thereby achieving efficient and low-cost manufacturing of high-precision curved surface conformal multilayer circuits.

[0008] A method and system for manufacturing curved surface conformal multilayer circuits based on charge-controlled electric field-driven jetting micro-nano 3D printing, which can achieve efficient and low-cost manufacturing of high-precision curved surface conformal multilayer circuits.

[0009] According to some embodiments, the present invention adopts the following technical solutions:

[0010] A method for manufacturing a curved surface conformal multilayer circuit based on charge-controlled electric field driven jet micro-nano 3D printing, comprising the following steps:

[0011] Step (1): pre-treating the substrate, removing oil and dirt from the substrate (a curved three-dimensional model formed by 3D printing, cutting, injection molding, etc.), and fixing it on the printing platform;

[0012] Step (2): Print the dielectric layer. According to the design requirements, select suitable dielectric materials (polyimide PI, polytetrafluoroethylene PTFE, liquid crystal polymer LCP, resin, PDMS, etc.), and place the prepared printing materials into the conformal thin film dielectric layer printing nozzle (using a conductive nozzle, the nozzle is connected to the positive pole of the high-voltage power supply), use the charge injection electric field driven jet deposition micro-nano 3D printing process, combined with optimized process parameters (voltage, printing speed, back pressure, printing height, etc.), print the first dielectric layer. Through active charge injection and charge injection electrowetting effect, combined with electric field driven jet deposition micro-nano 3D printing, high-precision curved surface conformal thin film dielectric layer manufacturing can be achieved.

[0013] Step (3): Eliminate residual charges. Use a micro static eliminator or the like to eliminate the residual charges on the printed dielectric layer and substrate.

[0014] Step (4): Print the conformal circuit of the conductive layer. Select a suitable conductive ink (nanosilver paste / silver ink, carbon paste, conductive polymer, etc.), and place it in a conformal circuit printing nozzle (using an insulating nozzle such as glass or ceramic, and the extraction electrode arranged on the outside of the nozzle is connected to the positive electrode of the high-voltage power supply). Use a non-contact electric field driven jet deposition micro-nano 3D printing process, combined with optimized process parameters (voltage, printing speed, back pressure, printing height, etc.) to print the first conductive layer conformal circuit. Using a non-contact electric field driven jet deposition micro-nano 3D printing process and a glass insulating nozzle, since there is no charge injection, crosstalk is reduced, printing stability is improved, and high-resolution, high-density curved surface conformal microcircuit manufacturing is achieved. And through curing, sintering and other treatments, the printed circuit is made conductive.

[0015] Step (5): Printing the dielectric layer. Perform the operation of step (2) to print the second (or next) dielectric layer.

[0016] Step (6): Fabricating vertical interconnected vias. Use a laser printing module (to fabricate multiple vertically interconnected micro-holes on the second dielectric layer.

[0017] Step (7): Eliminate residual charge. Perform the operation of step (3).

[0018] Step (8): Printing the conformal circuit of the conductive layer and filling the vertical interconnection vias. Perform the operation of step 4 to print the conformal circuit of the second conductive layer. Subsequently, print the circuit filling the vertical interconnection vias to complete the manufacture of the vertical interconnection circuit. Finally, through curing, sintering and other processes, the printed conformal circuit is made conductive.

[0019] Step (9): Repeat the operations of step (5), step (6), step (7), and step (8) to complete the manufacture of all curved conformal dielectric layers, conformal conductive layer circuits, and interlayer vertical interconnection circuits.

[0020] Step (10): Print the encapsulation layer.

[0021] Step (11): Post-processing.

[0022] As an optional embodiment, in step (1), the matrix material includes but is not limited to ceramic, PEEK, plastic, glass, resin, silicone, metal, etc., and the matrix shape includes but is not limited to any 3D curved surface geometry of developable surface and non-developable surface.

[0023] As an optional embodiment, in step (2), the dielectric material includes but is not limited to at least one of polyimide PI, polytetrafluoroethylene PTFE, liquid crystal polymer LCP, resin, PDMS, and ceramic; and the viscosity range is 1-50000cps.

[0024] As an optional embodiment, in step (2), a charge injection electric field driven jet deposition micro-nano 3D printing process is used, and the conductive nozzle is directly connected to the high voltage power supply. The printing parameters include a printing voltage of -5000V to +5000V, a printing pressure of 0-500kPa, a printing speed of 0-80mm / s, and a printing height of 0.04-3mm.

[0025] As an optional embodiment, in step (4), the conductive material includes at least one of nanosilver ink / silver paste, conductive copper ink / copper paste, silver nanowire ink, carbon paste and conductive polymer, and has a viscosity ranging from 1 to 50,000 cps.

[0026] As an optional embodiment, in step (4), a non-contact electric field driven jet deposition micro-nano 3D printing process is used, an insulating nozzle such as glass or ceramic is used, and an extraction electrode arranged outside the nozzle is connected to the positive electrode of a high-voltage power supply. Printing parameters include a printing voltage of -3000V to +3000V, a printing pressure of 0-300kPa, a printing speed of 0-50mm / s, and a printing height of 0.03-0.5mm.

[0027] As an optional embodiment, in the step (8), a high solid content stretchable conductive material is preferably used as the printing material, and the high solid content stretchable conductive material includes at least one of a stretchable silver paste, a stretchable carbon paste and a conductive polymer, with a solid content greater than 60% and a viscosity range of 0-50000cps. The printing parameters include a printing voltage of 0-2000V, a printing pressure of 0-500kPa, and a printing speed of 0-20mm / s.

[0028] A charge-controlled electric field-driven jet micro-nano 3D printing curved surface conformal multilayer circuit manufacturing system, comprising a five-axis linkage micro 3D printer, a laser drilling module, a control system, etc.

[0029] The five-axis linkage micro 3D printer includes a single potential contact electric field conductive nozzle (conformal film printing nozzle), a non-contact electric field nozzle (conformal circuit printing nozzle) and a static eliminator, wherein:

[0030] The single potential contact electric field conductive nozzle (conformal thin film dielectric printing nozzle) comprises a barrel, an adapter and a printing nozzle, the end of the barrel is provided with a printing conductive nozzle, the upper end of the barrel is provided with an adapter, and the barrel is connected to an air pressure module;

[0031] The non-contact electric field nozzle (conformal circuit printing nozzle) includes a barrel, an adapter, a printing nozzle and an annular electrode. The end of the barrel is provided with the printing nozzle, the printing nozzle jacket is provided with the annular electrode, the upper end of the barrel is provided with an adapter, and the barrel is connected to the air pressure module;

[0032] The static eliminator and the single potential contact electric field conductive nozzle and the non-contact electric field nozzle are arranged side by side, or are automatically switched by using a special device.

[0033] As an optional implementation, the optional range of the inner diameter of the print nozzle of the single potential contact electric field conductive nozzle is 0.1-0.6mm, the print nozzle material is conductive material, the print nozzle is externally connected to a high voltage power supply, and the adjustable range of the high voltage power supply is -5000V to +5000V.

[0034] As an optional implementation, the print head of the non-contact electric field nozzle is made of non-conductive material, and the annular electrode is fixed on the outside of the print head and does not directly contact the printing material.

[0035] As an optional implementation, the optional range of the inner diameter of the printing nozzle of the non-contact electric field nozzle is 0.1-0.6mm, the annular electrode is connected to a high-voltage power supply, and the adjustable range of the high-voltage power supply is -5000V to +5000V.

[0036] As an optional implementation, the pressure range of the air pressure module is 0-500 kPa.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] The present invention solves the difficult problem of manufacturing high-resolution surface conformal multilayer circuits on arbitrarily complex surfaces (especially non-developable surfaces, multi-curvature, and arbitrarily complex surfaces).

[0039] The present invention can realize high-efficiency and low-cost manufacturing of high-precision curved surface conformal multilayer circuits.

[0040] The present invention can realize high-precision manufacturing of curved surface conformal films, and solves the problem of conformal manufacturing of complex curved surface dielectric layers.

[0041] The manufacturing method of the invention has the outstanding advantages of low cost, high precision and wide adaptability.

[0042] The present invention realizes the efficient, low-cost, high-precision and uniform manufacturing of curved conformal multilayer circuits, and in particular provides a new solution with industrial application prospects for many curved conformal electronic products and applications such as broadband strong stealth FSS stealth radar radome, broadband omnidirectional conformal antenna, aircraft intelligent skin, curved multilayer printed circuit boards, intelligent wearable devices, 3D structural electronics, structural health monitoring, 3D sensors, intelligent structures, electromagnetic metamaterials, soft robots, etc.

[0043] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0045] Figure 1 It is a schematic diagram of the method for manufacturing curved surface conformal multilayer circuits based on charge-controlled electric field driven jet micro-nano 3D printing of the present invention.

[0046] Figure 2 This is a schematic diagram of the charge injection electrowetting effect of the present invention.

[0047] Figure 3 This is a schematic diagram of the principle of micro-nano 3D printing driven by non-contact electric field according to the present invention.

[0048] Figure 4 This is a schematic diagram of the conductive nozzle structure for printing a conformal thin film dielectric layer according to the present invention.

[0049] Figure 5 This is a schematic diagram of the conformal circuit printing nozzle structure of the present invention.

[0050] Figure 6 This is a process flow chart of manufacturing curved surface conformal multilayer circuits by charge-controlled electric field driven jet micro-nano 3D printing of the present invention.

[0051] Among them, 1. air pressure module, 2. adapter, 3. storage barrel, 4. printing nozzle, 5. ring electrode. DETAILED DESCRIPTION

[0052] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0053] It should be noted that the following detailed descriptions are all illustrative and intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs.

[0054] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0055] In the absence of conflict, the embodiments in this application and the features in the embodiments may be combined with each other.

[0056] Embodiment 1

[0057] A method for manufacturing curved surface conformal multilayer circuits based on charge injection electrowetting and electric field driven micro-nano 3D printing, such as Figure 1 As shown, it mainly includes the following steps:

[0058] (1) Pretreatment of the substrate: First, the substrate (a curved three-dimensional model formed by 3D printing, cutting, injection molding, etc.) is degreased and cleaned; then a processing code is generated according to the required circuit pattern and input into a five-axis linkage micro-nano 3D printer.

[0059] (2) Printing the first dielectric layer: According to the design requirements, select suitable dielectric materials (polyimide PI, polytetrafluoroethylene PTFE, liquid crystal polymer LCP, resin, PDMS, etc.), and place the prepared dielectric materials into the conformal thin film dielectric layer printing nozzle (using a conductive nozzle, the nozzle is connected to the positive pole of the high-voltage power supply), use the charge injection electric field driven jet deposition micro-nano 3D printing process, combined with optimized process parameters (voltage, printing speed, back pressure, printing height, etc.), print the first dielectric layer. Through active charge injection and charge injection electrowetting effect, combined with electric field driven jet deposition micro 3D printing, high-precision curved surface conformal thin film dielectric layer manufacturing is achieved, and the dielectric layer is cured by heating, UV and other curing methods.

[0060] (3) Elimination of residual charge: The static eliminator device on the five-axis linkage micro 3D printer is used to eliminate the residual charge of the printed dielectric layer and substrate.

[0061] (4) Printing (first layer) conductive layer conformal circuit: Select suitable conductive ink (nanosilver paste / silver ink, carbon paste, conductive polymer, etc.) and place it in the conformal circuit printing nozzle (use glass, ceramic and other insulating nozzles, and the extraction electrode set on the outside of the nozzle is connected to the positive electrode of the high-voltage power supply). Use non-contact electric field driven jet deposition micro-nano 3D printing process, combined with optimized process parameters (voltage, printing speed, back pressure, printing height, etc.) to print the first conductive layer conformal circuit. Using non-contact electric field driven jet deposition micro-nano 3D printing process and glass insulating nozzle, due to the lack of charge injection, crosstalk is reduced, printing stability is improved, and high-resolution, high-density curved surface conformal microcircuit manufacturing is achieved. And through curing, sintering and other treatments, the printed conformal circuit is made conductive.

[0062] (5) Print the second (or next) dielectric layer and repeat the steps in step (2).

[0063] (6) Fabrication of vertical interconnection vias: A laser printing module is used to fabricate multiple vertically interconnected micro-holes on the second dielectric layer.

[0064] (7) Eliminate residual charge. Perform the operation in step 3.

[0065] (8) Printing the conductive layer circuit and filling the vertical interconnection vias. Perform the operation of step 4 to print the second conductive layer circuit. Subsequently, print the circuit that fills the vertical interconnection vias to complete the manufacture of the vertical interconnection circuit. Finally, through curing, sintering and other processes, the printed circuit is made conductive.

[0066] (9) Repeat the operations (5) to (8) to complete the fabrication of all curved conformal dielectric layers and conductive layer conformal circuits.

[0067] (10) Printing the packaging layer: The packaging material is used as the printing material to package the circuit.

[0068] (11) Post-processing: Related electronic components, feed connectors, etc. can be connected as needed, and post-curing, sintering, etc. can be performed.

[0069] In some embodiments, the matrix material of step (1) includes but is not limited to ceramic, PEEK, plastic, glass, resin, silicone, metal, etc., and the matrix shape includes but is not limited to any 3D surface geometry of developable surface and non-developable surface.

[0070] In some embodiments, the dielectric material in step (2) includes but is not limited to polyimide (PI), resin, ceramic, polydimethylsiloxane (PDMS), etc.; and the viscosity ranges from 1 to 50,000 cps.

[0071] In some embodiments, the printing parameters in step (2) include a printing voltage of -5000V to +5000V, a printing pressure of 0-500kPa, a printing speed of 0-80mm / s, and a printing height of 0.04-3mm.

[0072] In some embodiments, the conductive material in step (4) includes nanosilver ink / silver paste, conductive copper ink / copper paste, silver nanowire ink, carbon paste, conductive polymer, and has a viscosity ranging from 1 to 50,000 cps;

[0073] In some embodiments, the printing parameters in step (4) include a printing voltage of -3000V to +3000V, a printing pressure of 0-300kPa, a printing speed of 0-50mm / s, and a printing height of 0.03-0.3mm.

[0074] In some embodiments, the curing methods in steps (2), (4), (5) and (8) include but are not limited to heating curing, ultraviolet curing, infrared curing and chemical curing.

[0075] Embodiment 2

[0076] A method for manufacturing a conformal multilayer frequency selective surface device based on charge injection electrowetting and electric field driven micro 3D printing, such as Figure 6 shown.

[0077] This embodiment uses a hemispherical Teflon (PTFE) substrate with a radius of 10 cm, a printed circuit structure of a multi-layer frequency selective surface, a dielectric material of polyimide (PI), and a conductive material of nano silver paste. The specific implementation steps are as follows:

[0078] Step 1: Pre-treat the substrate. First, clean the Teflon substrate to remove surface impurities; then, use a scanner to digitally reverse the printed substrate, establish a processing model, and generate a processing code based on the required circuit pattern, which is input into the five-axis linkage micro-nano 3D printer.

[0079] Step 2: Print the first PI dielectric layer, use PI solution as the printing material, and place the prepared printing material into the conformal film printing nozzle (using a stainless steel conductive nozzle, the nozzle is connected to the positive electrode of the high-voltage power supply), and use the charge injection electric field to drive the jet deposition micro-nano 3D printing process, such as Figure 4 Move the print head to the printing starting point of the substrate, connect the single potential print head to the positive electrode of the high voltage power supply, set the printing parameters (print head inner diameter 0.1mm, printing height 0.1mm, printing voltage 2000V, printing air pressure 100kPa, workbench moving speed 20mm / s), load the printing path, and conformally print the first dielectric layer PI film on the surface of the Teflon substrate under the action of the charge injection electrowetting effect, as shown in FIG. Figure 2The dielectric layer is cured by heating.

[0080] Step 3: Eliminate residual charge: Use the static eliminator on the five-axis linkage micro-nano 3D printer to eliminate the residual charge in the printed dielectric layer and substrate.

[0081] Step 4: Print the first conformal circuit layer: Use nano-conductive silver paste as the printing material and place it on the conformal circuit printing nozzle (a glass nozzle is used, and the extraction electrode set on the outside of the nozzle is connected to the positive electrode of the high-voltage power supply), and use a non-contact electric field driven jet deposition micro-nano 3D printing process, such as Figure 5 Move the print head to the circuit printing starting point, set the printing parameters (nozzle inner diameter 0.05mm, printing height 0.08mm, printing voltage 2000V, printing air pressure 200kPa, workbench moving speed 40mm / s), load the printing path, and use the self-excited electrostatic field effect to make the conductive material form a Taylor cone to achieve conformal printing of high-precision circuits, as shown. Figure 3 As shown. Since there is no charge injection, crosstalk is reduced, printing stability is improved, and high-resolution, high-density curved surface conformal microcircuit manufacturing is achieved. And through heating, curing and sintering, the printed wires are made conductive.

[0082] Step 5: Since there is no interlayer interconnection in this embodiment, it is not necessary to print interlayer vertical interconnection circuits. Directly repeat steps (2)-(4) to complete the manufacture of conformal circuits for all dielectric layers and conductive layers.

[0083] Step 6: Printing the encapsulation layer and post-processing. After printing, the multi-layer frequency selective surface device is sprayed with an anti-oxidation coating.

[0084] In other embodiments, the matrix material in step 1 includes but is not limited to ceramic, PEEK, plastic, glass, resin, silicone, metal, etc., and the matrix shape includes but is not limited to any 3D curved surface geometry of a developable surface and a non-developable surface;

[0085] In other embodiments, the dielectric material in step 2 includes but is not limited to one of ceramic and polydimethylsiloxane (PDMS);

[0086] In other embodiments, the printing parameters in step 2 include a printing voltage of -5000V to +5000V, a printing pressure of 0-500kPa, a printing speed of 0-80mm / s, and a printing height of 0.04-3mm.

[0087] In other embodiments, the conductive material in step 4 includes nanosilver ink, conductive copper ink / copper paste, silver nanowire ink, carbon paste, conductive polymer, and the viscosity ranges from 0 to 10000 cps;

[0088] In other embodiments, the printing parameters in step 4 include a printing voltage of -3000V to +3000V, a printing pressure of 0-300kPa, a printing speed of 0-50mm / s, and a printing height of 0.03-0.3mm.

[0089] Embodiment 3

[0090] A method for manufacturing a conformal multilayer circuit on a curved surface based on charge injection electrowetting and electric field driven micro-nano 3D printing. In this embodiment, a non-developable curved surface ceramic substrate with an area of ​​20×20 cm is selected, and the printed circuit structure is a multilayer interconnected circuit. The dielectric material is PDMS, and the conductive material is nano silver paste and stretched silver paste. The specific implementation steps are as follows:

[0091] Step 1: Pre-treat the substrate. First, clean the ceramic substrate to remove surface impurities; then, use a scanner to digitally reverse the printed substrate, establish a processing model, and generate a processing code based on the required circuit pattern, which is then input into the five-axis linkage micro-nano 3D printer.

[0092] Step 2: Print the first PDMS dielectric layer. Use PDMS precursor solution as the printing material, and place the prepared printing material into a conformal thin film dielectric printing nozzle (using a stainless steel conductive nozzle, which is connected to the positive electrode of a high-voltage power supply), and use a charge injection electric field to drive the jet deposition micro-nano 3D printing process, such as Figure 4 Move the print head to the printing starting point of the substrate, connect the single potential print head to the positive electrode of the high voltage power supply, set the printing parameters (print head inner diameter 0.2mm, printing height 0.2mm, printing voltage 3000V, printing pressure 200kPa, workbench moving speed 20mm / s), load the printing path, and conformally print a layer of PDMS dielectric film on the surface of the ceramic substrate under the action of the charge injection electrowetting effect, as shown in FIG. Figure 2 The dielectric layer is cured by heating.

[0093] Step 3: Eliminate residual charge: Use the static eliminator device of the five-axis linkage micro-nano 3D printer to eliminate the residual charge in the dielectric layer and the substrate.

[0094] Step 4: Print the conformal circuit of the first conductive layer: Use conductive silver paste as the printing material and place it on the conformal circuit printing nozzle (a glass nozzle is used, and the extraction electrode set on the outside of the nozzle is connected to the positive electrode of the high-voltage power supply), and use a non-contact electric field driven jet deposition micro-nano 3D printing process, such as Figure 5Move the print head to the circuit printing starting point, set the printing parameters (nozzle inner diameter 0.08mm, printing height 0.15mm, printing voltage -2000V, printing pressure 150kPa, workbench moving speed 40mm / s), load the printing path, and use the self-excited electrostatic field effect to make the conductive material form a Taylor cone to achieve conformal printing of high-precision circuits, as shown. Figure 3 As shown. Since there is no charge injection, crosstalk is reduced, printing stability is improved, and high-resolution, high-density curved surface conformal microcircuit manufacturing is achieved. After printing, the wire is cured by heating.

[0095] Step 5: Print the second PDMS dielectric layer. Perform the operation of step 2 to print the second (or next) dielectric layer.

[0096] Step 6: Fabricating vertical interconnection vias A plurality of vertical interconnection vias are fabricated on the second dielectric layer using a laser printing module.

[0097] Step 7: Eliminate residual charge. Perform the operation in step 3.

[0098] Step 8: Print the second conductive layer conformal circuit and vertical interconnection via filling. Perform the operation of step 4 to print the second conductive layer circuit. Subsequently, print the circuit filling the vertical interconnection via to complete the manufacture of the vertical interconnection circuit. Finally, heat and cure the silver paste to complete the conductivity of the printed circuit.

[0099] Step 9: Repeat the operations of step 5, step 6, step 7, and step 8 to complete the manufacture of all curved conformal dielectric layers, conductive layer conformal circuits, and vertical interconnection circuits.

[0100] Step 10: Print the packaging layer. Packaging the curved conformal multi-layer circuit.

[0101] Step 11: Post-processing: Perform dust and oxidation prevention on the multi-layer circuit.

[0102] In other embodiments, the curved surface substrate material in step 1 includes but is not limited to ceramic, PEEK, plastic, glass, resin, silicone, metal, etc., and the substrate shape includes but is not limited to any 3D curved surface geometry of a developable surface and a non-developable surface;

[0103] In other embodiments, the dielectric material in step 2 includes but is not limited to ceramics, polyimide (PI), etc.;

[0104] In other embodiments, the printing parameters in step 2 include a printing voltage of -5000V to +5000V, a printing pressure of 0-500kPa, a printing speed of 0-80mm / s, and a printing height of 0.04-3mm.

[0105] In other embodiments, the conductive material in step 4 includes nanosilver ink, conductive copper ink / copper paste, silver nanowire ink, carbon paste, conductive polymer, stretched carbon paste / conductive polymer, etc., and the viscosity ranges from 0 to 10000 cps;

[0106] In other embodiments, the printing parameters in step 4 include a printing voltage of -3000V to +3000V, a printing pressure of 0-300kPa, a printing speed of 0-50mm / s, and a printing height of 0.03-0.3mm.

[0107] Embodiment 4

[0108] A curved surface conformal multilayer circuit manufacturing system includes a five-axis linkage micro-nano 3D printer, wherein the five-axis linkage micro-nano 3D printer includes a single contact electric field conductive nozzle, a non-contact electric field nozzle and a static eliminator, wherein:

[0109] like Figure 4 As shown, the conformal film printing nozzle comprises a barrel 3, an adapter 2 and a single potential nozzle 4, a conformal film printing nozzle (a conductive nozzle is used, and the nozzle is connected to the positive electrode of a high-voltage power supply) is arranged at the end of the barrel 3, an adapter 2 is arranged at the upper end of the barrel 3, and the barrel 3 is connected to the air pressure module 1;

[0110] like Figure 5 As shown, the conformal circuit print head (non-contact electric field driven jet 3D print head) includes a barrel 3, an adapter 2, an insulating print head 4 and an annular electrode 5. The end of the barrel 3 is provided with an insulating print head (made of glass, ceramic, etc.), the insulating print head jacket is provided with the annular electrode (connected to the positive electrode of the high-voltage power supply), the upper end of the barrel 3 is provided with an adapter 2, and the barrel 3 is connected to the air pressure module 1;

[0111] The conformal film printing nozzle, the conformal circuit printing nozzle, the static eliminator and the laser printing module are arranged side by side.

[0112] The inner diameter of the conformal thin film print head can be selected in the range of 0.1-0.6 mm, the print head material is a conductive material, the print head is externally connected to a high voltage power supply, and the adjustable range of the high voltage power supply is -5000V to +5000V.

[0113] The print head portion of the conformal circuit print head is made of non-conductive material, and the annular electrode 5 is fixed on the outside of the print head 4 and does not directly contact the printing material.

[0114] As an optional implementation, the inner diameter of the print head of the conformal circuit print head can be selected in the range of 0.1-0.6 mm, the annular electrode is connected to a high voltage power supply, and the adjustable range of the high voltage power supply is -5000V to +5000V.

[0115] As an optional implementation, the pressure range of the air pressure module is 0-500 kPa.

[0116] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made by those skilled in the art within the spirit and principle of the present invention without creative labor shall be included in the protection scope of the present invention.

Claims

1. A method for manufacturing curved surface conformal multilayer circuits based on charge-controlled electric field-driven jet micro-nano 3D printing, characterized in that: The following steps are involved: Step (1): pre-treating the substrate, degreasing and decontaminating the substrate, and then fixing it on the printing platform; Step (2): Printing the dielectric layer. According to the design requirements, a suitable dielectric material is selected, and the prepared printing material is placed in the conformal thin film dielectric layer printing nozzle. The charge injection electric field driven jet deposition micro-nano 3D printing process is used, and the process parameters are optimized to print the first dielectric layer. Through active charge injection and charge injection electrowetting effect, combined with electric field driven jet deposition micro-nano 3D printing, high-precision curved surface conformal thin film dielectric layer manufacturing is achieved; Step (3): Eliminating residual charges of the printed dielectric layer and substrate; Step (4): Printing a conformal circuit of the conductive layer, selecting a suitable conductive ink and placing it on a conformal circuit printing nozzle, using a non-contact electric field driven jet deposition micro-nano 3D printing process, combining optimized process parameters, printing the first conductive layer conformal circuit, and achieving conductivity of the printed circuit through curing, sintering and other treatments; Step (5): Printing a dielectric layer, performing the operation of step (2) to print a second or next dielectric layer; Step (6): manufacturing vertical interconnected vias, using a laser printing module to manufacture a plurality of vertically interconnected micro-holes on the second dielectric layer; Step (7): Eliminating residual charge; Step (8): Printing a conductive layer conformal circuit and filling the vertical interconnection through-holes, performing the operation of step (4), printing a second conductive layer conformal circuit, and then printing a circuit filling the vertical interconnection through-holes to complete the manufacture of the vertical interconnection circuit, and completing the printed conformal circuit conductivity through curing and sintering treatment; Step (9): repeating the operations of step (5) to step (8) to complete the manufacture of all curved surface conformal dielectric layers and conductive layer conformal circuits and interlayer vertical interconnection circuits; Step (10): Printing the encapsulation layer; Step (11): perform post-processing.

2. A method for manufacturing curved surface conformal multilayer circuits based on charge-controlled electric field driven jet micro-nano 3D printing as claimed in claim 1, characterized in that: In the step (1), the material of the substrate includes but is not limited to ceramic, PEEK, plastic, glass, resin, silicone, metal, etc., and the shape of the substrate includes but is not limited to any 3D curved surface geometry of a developable surface and a non-developable surface.

3. The method for manufacturing a curved surface conformal multilayer circuit based on charge-controlled electric field driven jet micro-nano 3D printing as claimed in claim 1, characterized in that: In the step (2), the dielectric material includes but is not limited to at least one of polyimide PI, polytetrafluoroethylene PTFE, liquid crystal polymer LCP, resin, PDMS, and ceramic; and the viscosity range is 1-50000cps.

4. The method for manufacturing a curved surface conformal multilayer circuit based on charge-controlled electric field driven jet micro-nano 3D printing as claimed in claim 1, characterized in that: In the step (2), a charge injection electric field is used to drive the jet deposition micro-nano 3D printing process, and the conductive nozzle is directly connected to the high voltage power supply; The optimized process parameters include printing voltage -5000V~+5000V, printing gas pressure 0-500kPa, printing speed 0-80mm / s, and printing height 0.04-3mm.

5. The method for manufacturing curved surface conformal multilayer circuits based on charge-controlled electric field driven jet micro-nano 3D printing as claimed in claim 1, characterized in that: In the step (4), the conductive material includes at least one of nanosilver ink / silver paste, conductive copper ink / copper paste, silver nanowire ink, carbon paste and conductive polymer, and has a viscosity ranging from 1 to 50,000 cps.

6. The method for manufacturing curved surface conformal multilayer circuits based on charge-controlled electric field driven jet micro-nano 3D printing as claimed in claim 1, characterized in that: In the step (4), a non-contact electric field driven jet deposition micro-nano 3D printing process is used, an insulating nozzle such as glass or ceramic is used, and an extraction electrode arranged outside the nozzle is connected to the positive electrode of a high voltage power supply; The optimized process parameters include printing voltage -3000V~+3000V, printing gas pressure 0-300kPa, printing speed 0-50mm / s, and printing height 0.03-0.5mm.

7. The method for manufacturing curved surface conformal multilayer circuits based on charge-controlled electric field driven jet micro-nano 3D printing as claimed in claim 1, characterized in that: In the step (8), a high-solid content stretchable conductive material is selected as the printing material, and the high-solid content stretchable conductive material includes at least one of a stretchable silver paste, a stretchable carbon paste and a conductive polymer, and has a solid content greater than 60% and a viscosity range of 0-50000cps; Printing parameters include printing voltage 0-2000V, printing air pressure 0-500kPa, and printing speed 0-20mm / s.

8. A system for manufacturing curved surface conformal multilayer circuits based on charge-controlled electric field-driven jet micro-nano 3D printing, characterized in that: It includes a five-axis linkage micro 3D printer, a laser drilling module and a control system, including: The five-axis linkage micro 3D printer includes a single potential contact electric field conductive nozzle, a non-contact electric field nozzle and a static eliminator, wherein: The single potential contact electric field conductive nozzle comprises a barrel, an adapter and a printing nozzle, the end of the barrel is provided with a printing conductive nozzle, the upper end of the barrel is provided with an adapter, and the barrel is connected to an air pressure module; The non-contact electric field nozzle comprises a barrel, an adapter, a print nozzle and an annular electrode. The end of the barrel is provided with the print nozzle, the print nozzle jacket is provided with the annular electrode, the upper end of the barrel is provided with an adapter, and the barrel is connected to the air pressure module; The static eliminator and the single potential contact electric field conductive nozzle and the non-contact electric field nozzle are arranged side by side, or are automatically switched by using an automatic switching device.

9. A system for manufacturing curved surface conformal multilayer circuits based on charge-controlled electric field driven jet micro-nano 3D printing as claimed in claim 8, characterized in that: The optional range of the inner diameter of the print head of the single potential contact electric field conductive nozzle is 0.1-0.6mm, the print head material is conductive material, the print head is externally connected to a high voltage power supply, and the adjustable range of the high voltage power supply is -5000V to +5000V.

10. A system for manufacturing curved surface conformal multilayer circuits based on charge-controlled electric field driven jet micro-nano 3D printing as claimed in claim 8, characterized in that: The print head of the non-contact electric field print head is made of non-conductive material, and the annular electrode is fixed outside the print head and does not directly contact the printing material; The optional range of the inner diameter of the printing nozzle of the non-contact electric field nozzle is 0.1-0.6mm, the annular electrode is connected to a high-voltage power supply, and the adjustable range of the high-voltage power supply is -5000V to +5000V; The pressure range of the air pressure module is 0-500kPa.

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