Adaptive temperature control system and method for thermoelectric cooler based on transient supercooling

Abstract

Disclosed in the present invention are an adaptive temperature control system and method for a thermoelectric cooler based on transient supercooling. The system comprises: a temperature detection unit used for acquiring temperature information of a cold end of a thermoelectric cooler; a thermal load monitoring unit used for monitoring thermal load information of the thermoelectric cooler; a PID controller used for controlling and outputting a first current on the basis of the temperature information of the cold end and with an optimization goal of controlling the temperature of the cold end of the thermoelectric cooler to be a target temperature; a transient pulse controller used for controlling a current limit on the basis of the thermal load information; a feedforward controller used for adjusting an advanced control current on the basis of the thermal load information and outputting a second current; a limit output unit used for increasing a total current output limit of the first current and the second current to the current limit on the basis of the current limit generated by the transient pulse controller; and a power output unit used for driving the thermoelectric cooler on the basis of a current generated by the limit output unit. The present invention can significantly improve the thermal load resistance of the thermoelectric cooler and improve the precision and stability of temperature control.

Description

A thermoelectric cooler adaptive temperature control system and method based on transient subcooling Technical Field

[0001] The present invention relates to the field of equipment control technology, and more particularly to a thermoelectric cooler adaptive temperature control system and method based on transient overcooling. Background Art

[0002] As electronic devices become increasingly integrated and miniaturized, heat dissipation becomes increasingly prominent, severely restricting their performance and reliability. In recent years, thermoelectric coolers (TECs) have demonstrated significant potential in active thermal management. TECs are active heat dissipation and temperature control devices based on the Peltier effect, enabling directional heat transport and active cooling. TECs offer advantages such as miniaturized structure, high temperature control accuracy, fast response, high cooling power density, and no moving parts, making them widely used in refrigeration and precision temperature control.

[0003] Currently, the maximum zT value of thermoelectric materials operating near room temperature has long stagnated at 1.0, causing the maximum temperature difference of commercially available single-stage TECs to hover around 70K near room temperature. Furthermore, the maximum cooling power density of a device depends on the material properties and device structure design. Limited by the limitations of processing and packaging techniques, the maximum steady-state cooling power density of conventional commercial devices is generally around 10W / cm2. 2 Because the short-time pulse power of the latest laser chips and high-power chips is as high as 50W / cm 2 At the same time, the thermal load of electronic devices changes dynamically, so the existing TEC steady-state cooling capacity is difficult to meet the short-term temperature control requirements of ultra-high power chips.

[0004] In practical applications, the transient cooling mode (transient pulse supercooling) of TECs is more worthy of attention than the steady-state cooling mode. When a current pulse exceeding the optimal steady-state current is applied, the high responsivity of Peltier heating and the slow diffusion rate of volume Joule heating create a transient pulse supercooling effect. This can overcome material performance limitations, achieving millisecond-level response speeds, cooling densities, and cooling temperature differences far exceeding those achieved during steady-state operation. This approach is expected to be widely used in dynamic, precise temperature control of electronic devices.

[0005] While research on the effects of current pulses on transient overcooling has been extensive, these studies typically focus on pre-set, fixed currents. However, under actual operating conditions, temperature and heat loads change dynamically, and a comprehensive control strategy for TECs operating in transient mode has yet to be established, severely restricting the widespread practical application of the transient overcooling effect. Furthermore, to ensure the proper operation of TECs within a safe range, current limiting is often required at the controller output to prevent device temperature runaway and damage. Existing technologies use the optimal current corresponding to the maximum steady-state cooling capacity as the limiting value, which suffers from temperature control lag and limited cooling capacity.

[0006] For example, patent application CN1453674A discloses a high-precision temperature control circuit for thermoelectric coolers. This solution's PID controller compares a set temperature signal with a collected temperature signal. The differential signal undergoes a PID calculation to generate a TEC control signal, which is then fed into a power driver to control the TEC's temperature. Patent applications CN105607675A and CN204832991U, for example, both utilize traditional PID control as their core. However, this control strategy limits the output to below the steady-state optimal current, preventing the transient overcooling effect from being triggered. This results in limited TEC thermal load resistance and insufficient temperature control accuracy.

[0007] In summary, thermoelectric transient supercooling can overcome the limitations of material properties and achieve cooling performance far exceeding that of steady-state cooling, holding enormous potential for active thermal management in high-power electronic devices. Current research on the effects of current pulses on transient supercooling characteristics has focused on presetting fixed currents. However, under actual operating conditions, temperature and heat loads change dynamically, and a comprehensive control strategy for TECs operating in transient mode has yet to be established, severely restricting the widespread practical application of the transient supercooling effect. Furthermore, to ensure the proper operation of TECs within a safe range, current limiting is often required at the controller output to prevent device temperature runaway and damage. Existing methods use the optimal current corresponding to the maximum steady-state cooling capacity as the limiting value, which suffers from temperature control lag and cooling capacity limitations. Therefore, there is an urgent need for a TEC transient control strategy that can withstand extremely large heat loads and maintain high temperature control accuracy.

[0008] Summary of the Invention

[0009] The purpose of the present invention is to overcome the above-mentioned defects of the prior art and provide a thermoelectric cooler adaptive temperature control system and method based on transient supercooling.

[0010] According to a first aspect of the present invention, a thermoelectric cooler adaptive temperature control system based on transient subcooling is provided. The system comprises: a temperature detection unit, a heat load monitoring unit, a limiter output unit, a power output unit, a thermoelectric cooler, a PID controller, a transient pulse controller, and a feedforward controller; wherein:

[0011] The temperature detection unit is used to obtain the cold end temperature information of the thermoelectric cooler;

[0012] The heat load monitoring unit is used to monitor the heat load information of the thermoelectric cooler;

[0013] The PID controller takes controlling the cold end temperature of the thermoelectric cooler at a target temperature as an optimization goal, and uses the cold end temperature information to regulate the output first current;

[0014] The transient pulse controller regulates the limiting current based on the thermal load information;

[0015] The feedforward controller adjusts the advance control current based on the thermal load information and outputs a second current;

[0016] The amplitude limiting output unit increases the total current output amplitude of the first current and the second current to within the amplitude limiting current according to the amplitude limiting current generated by the transient pulse controller;

[0017] The power output unit is configured to drive the thermoelectric cooler based on the current generated by the amplitude limiting output unit.

[0018] According to a second aspect of the present invention, a method for adaptive temperature control of a thermoelectric cooler based on transient undercooling is provided. The method comprises:

[0019] Obtain cold end temperature information and heat load information of the thermoelectric cooler;

[0020] Taking controlling the cold end temperature of the thermoelectric cooler at a target temperature as an optimization goal, using the cold end temperature information to regulate the output of a first current by a PID controller;

[0021] Adjust the limiting current based on the thermal load information to obtain the limiting current corresponding to the transient pulse controller;

[0022] Adjusting the advance control current based on the thermal load information to obtain a second current output by the feedforward controller;

[0023] According to the amplitude limiting current generated by the transient pulse controller, the total current output amplitude of the first current and the second current is increased to within the amplitude limiting current;

[0024] The thermoelectric cooler is driven based on the current generated by the limiting output unit.

[0025] Compared with existing technologies, the present invention offers the advantage of addressing the problem of adaptive and precise temperature control of thermoelectric coolers (TECs) under extremely high heat loads by proposing an adaptive temperature control strategy for thermoelectric coolers (TECs) based on transient undercooling. This control strategy comprises PID control, transient pulse control, and feedforward control. By incorporating the transient undercooling effect, the TEC's ability to withstand heat loads is significantly improved, and feedforward control enables proactive regulation, further enhancing temperature control accuracy and stability. This invention provides valuable insights for the practical application of the transient undercooling effect of TECs and the precise temperature control of high-power electronic devices.

[0026] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0028] FIG1 is a block diagram of a thermoelectric cooler adaptive temperature control system based on transient undercooling according to an embodiment of the present invention;

[0029] 2 is a schematic diagram showing a change curve of the maximum steady-state cooling capacity and the corresponding optimal current of a thermoelectric cooler and a real-time transient cooling capacity of the thermoelectric cooler according to an embodiment of the present invention;

[0030] FIG3 is a schematic diagram of a high-speed parallel processing process according to an embodiment of the present invention;

[0031] FIG4 is a comparison diagram of temperature control results of a traditional PID control strategy and a control strategy of the present invention when the ultra-large heat load width is 40 ms according to an embodiment of the present invention. DETAILED DESCRIPTION

[0032] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0033] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0034] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0035] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0036] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0037] 1 , the provided thermoelectric cooler adaptive temperature control system based on transient undercooling generally includes: a temperature acquisition unit, a heat load monitoring unit, a main control digital chip (not shown), a limiting output unit, a power output unit and a TEC.

[0038] The temperature acquisition unit includes a temperature sensor and an A / D conversion module, which is used to collect the cold end temperature of the TEC and transmit the temperature signal to the main control digital chip.

[0039] The thermal load monitoring unit is used to obtain the operating frequency or excitation signal of the laser chip, high-power power chip or other high-power devices in real time, and then convert it into a thermal load signal and transmit it to the main control digital chip.

[0040] The main digital control chip primarily runs algorithms such as the PID controller, transient pulse controller, and feedforward controller. Its calculation results are processed through a limited output and then transmitted to the power output unit. For example, the power output unit includes a D / A converter module and a power amplifier. The power output unit receives the digital output signal from the main digital control chip, converts it into an analog signal through the D / A converter, and then drives the TEC through the power amplifier.

[0041] In general, in the process of constructing the algorithm and parameters of the main control digital chip, the current parameterization scan is first performed to measure the maximum steady-state cooling capacity Q of the TEC. c，max , and get the corresponding optimal current I opt ; Then, based on the maximum steady-state cooling capacity, a pulse current P×I is applied opt (P>1) and obtain the real-time cooling capacity, then use a polynomial equation to fit the relationship between the real-time cooling capacity and current pulse of the TEC transient pulse, and import the regular equation into the transient pulse controller algorithm to limit the current output and trigger the transient overcooling effect. The PID controller adopts proportional and integral links, whose parameters can be obtained through simulation or manual adjustment, and the collected temperature is the feedback signal; the feedforward control adopts a proportional link, whose parameters are also determined by simulation or manual adjustment, and performs open-loop control according to the heat load signal to achieve advanced control. Compared with traditional control strategies, the present invention can trigger transient overcooling and advanced temperature control under short-term ultra-large heat loads, thereby greatly improving the accuracy and stability of thermoelectric temperature control.

[0042] In one embodiment, the temperature acquisition unit includes a temperature sensor and an A / D conversion module. The temperature sensor, which can be a thermocouple, thermistor, thermopile, or other sensor, is placed at the cold end of the TEC to detect temperature and transmit the detected analog signal to the A / D conversion module. The A / D conversion module can use an AD9680, ADS54J60, or other high-speed, high-resolution ADC chip. The temperature analog signal is converted to a digital signal through A / D conversion and then transmitted to the main digital control chip.

[0043] The thermal load monitoring unit obtains the operating frequency or excitation signal of the laser chip, high-power power chip or other high-power devices in real time, and then converts it into a thermal load signal and transmits it to the main control digital chip.

[0044] The main control digital chip adopts DSP or FPGA chip which can process in parallel at high speed, and mainly runs algorithms such as PID controller, transient pulse controller and feedforward controller.

[0045] In one embodiment, the PID controller uses a positional PID controller, whose feedback signal is connected to the temperature acquisition unit. The controller takes the difference between the target temperature and the real-time temperature, and adjusts the current output in real time to make the TEC cold-end temperature reach the target value, ensuring high-precision temperature control in normal operation mode. For example, the PID controller algorithm is expressed as:

[0046] Where, e(t) is the difference between the real-time temperature and the target temperature, K p is the proportional link parameter, K i is the integral link parameter, K d is the differential link parameter, T t is the integral anti-saturation time constant. The above parameters are obtained through simulation or manual tuning, and t is the sampling time.

[0047] In order to facilitate the operation of the algorithm on the main digital chip, the output of the PID controller is further discretized as:

[0048] Among them, i is the sampling number, I PID (i) is the output value at sampling time i, e(i) is the error value at sampling time i, e(i-1) is the error value at sampling time i-1, and f is the sampling frequency of the temperature sensor.

[0049] Signal input of transient pulse controller and thermal load monitoring Q load (t) connection, when the high-power device generates a large heat load, the limit output can be adjusted to increase the current output, thereby ensuring that transient overcooling is triggered to suppress temperature rise. For example, the control algorithm of the transient pulse controller is expressed as:

[0050] I max(t) = I opt P(t)(3)

[0051] Among them, I opt The optimal steady-state current is obtained by current parameter sweeping, and the current corresponding to the maximum steady-state cooling capacity of the TEC is measured, which is the optimal current, as shown in Figure 2(a). The pulse amplitude P(t) is the real-time heat load Q load (t) corresponds to the polynomial function, which is in the form of P(t) = a0 + a1 × Q load (t)+a2×Q load (t) 2 a3×Q load (t) 3 +a4×Q load (t) 4 On the basis of the maximum steady-state cooling capacity, a pulse current P×I is applied. opt (P>1) and obtain the real-time cooling capacity, in terms of Q load is the maximum characteristic intersection of cooling capacity and heat load, as shown in Figure 2(b). By changing the pulse current P value, the corresponding Q load The coefficients of the above polynomial function can be obtained by performing multiple fitting.

[0052] The signal input of the feedforward controller and the thermal load monitoring Q load (t) connection, directly adjust the current in time according to the thermal load signal generated by the high-power device, realize advanced control, and improve the response speed of the control system. For example, the sampling ratio link of the feedforward controller, the algorithm is expressed as: I FF (t) = K load Q load (t) (4)

[0053] Among them, K load It is the proportional link parameter, which is obtained through simulation or manual tuning, and ensures that the dynamic performance of the controller meets the requirements and eliminates the lag of system temperature control.

[0054] The limit output unit generates the I max , instantly increase the total current output limit generated by the PID controller and feedforward controller to I max Within.

[0055] The power output unit consists of a D / A converter module and a power amplifier. Its output current should match the current output value calculated by the main digital control chip. The D / A converter module can use the AD5440YRUZ, LTC2757, or other current-mode high-speed, high-resolution DAC chips. The D / A converter module converts the digital current signal generated by the main digital control chip into a continuous analog current signal, which is then transmitted to the power amplifier. The power amplifier, which can be a transistor power module or MOS integrated power module, is connected to the D / A converter module output to amplify the current and drive the TEC.

[0056] TEC is a thermoelectric cooler. When current is connected, it will produce a Peltier effect at the cold end and the hot end, thereby realizing directional heat transport and active cooling.

[0057] In one embodiment, the provided adaptive temperature control strategy for a thermoelectric cooler based on transient subcooling utilizes high-speed parallel processing, as shown in Figure 3. High-speed parallel processing is suitable for DSP or FPGA chips. After chip initialization, five tasks—acquiring real-time temperature, acquiring heat load signals, calculating PID control, calculating feedforward control, and calculating transient pulse control—are simultaneously processed in parallel, with the data results of each task cached. During this time, the D / A chip remains ready to output analog signals in a timely manner based on the cached data. This process improves data sampling and calculation rates, meeting the high response speed requirements of thermoelectric transient temperature control.

[0058] To further verify the effect of the present invention, the temperature control effect of the control strategy of the present invention is verified when the ultra-large heat load width is 40ms, as shown in Figure 4. The cold end of the TEC is connected to a self-heating block, and the hot end is connected to a heat sink; the temperature of the hot end is set at 323K, and the target temperature of the cold end is set at 300K. First, the maximum cooling capacity of the TEC Q is measured by steady-state current scanning. c，max 13.02W / cm 2 , the corresponding optimal current I opt is 5.2A; then apply pulse current P×I opt (P>1) and obtain the real-time cooling capacity, in terms of Q load is the maximum characteristic intersection of cooling capacity and heat load; changing the pulse current P value, the corresponding Q load The polynomial fitting equation is: P(t)=24.11776-5.44262×Q load (t)+0.46947×Q load (t) 2 -0.01703×Q load (t) 3 +2.46514e -4 ×Q load (t) 4

[0059] Next, the above I opt and P(t) are substituted into the transient pulse controller formula (3); in addition, the parameters of the PID controller (formula (2)) and the feedforward controller (formula (4)) are obtained by manual parameter tuning as K p =25A / K,K i =88A / (K·s), K d =0A·s / K, T t =0.5s, f=1kHz, K load =0.5A·cm 2 / W. It can be seen intuitively that the pulse heat load increases to 44.00W / cm2 in 2.0s. 2 When the temperature reaches 308.53K, that is, it increases to 3.38 times of the maximum steady-state cooling capacity, the temperature of the traditional PID control strategy soars to 308.53K, while the temperature fluctuation of the control strategy of the present invention is still controlled within 0.5K; compared with the traditional PID control strategy, the peak temperature of the control strategy of the present invention is reduced by 8.13K, which shows that the control strategy of the present invention can trigger transient overcooling and advanced temperature regulation under short-term ultra-large heat load, thereby greatly improving the accuracy and stability of thermoelectric temperature control.

[0060] In summary, in response to the shortcomings of the TEC temperature control strategy in the prior art, the adaptive temperature control strategy for thermoelectric coolers based on transient undercooling proposed in the present invention can significantly improve the TEC's ability to resist thermal loads by introducing the transient undercooling effect, and further improve the temperature control accuracy and stability through feedforward control, providing important reference value for the practical application of the TEC transient undercooling effect and the precise temperature control of high-power electronic devices.

[0061] The present invention may be a system, a method and / or a computer program product. The computer program product may include a computer-readable storage medium carrying computer-readable program instructions for causing a processor to implement various aspects of the present invention.

[0062] Computer-readable storage medium can be a tangible device that can keep and store the instructions used by the instruction execution device.Computer-readable storage medium can be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device or any suitable combination thereof.More specific examples (non-exhaustive list) of computer-readable storage medium include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanical encoding device, for example, a punch card or a convex structure in a groove having instructions stored thereon, and any suitable combination thereof.Computer-readable storage medium used herein is not interpreted as a transient signal itself, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagated by waveguides or other transmission media (for example, light pulses by fiber optic cables), or electrical signals transmitted by wires.

[0063] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions to be stored in the computer-readable storage medium in each computing / processing device.

[0064] The computer program instructions for performing the operation of the present invention can be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C++, Python, and conventional procedural programming languages ​​such as "C" language or similar programming languages. The computer readable program instructions can be executed entirely on the user's computer, partially on the user's computer, as an independent software package, partially on the user's computer, partially on a remote computer, or completely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (e.g., using an Internet service provider to connect via the Internet). In some embodiments, an electronic circuit, such as a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA), is personalized by utilizing the state information of the computer readable program instructions, and the electronic circuit can execute the computer readable program instructions, thereby realizing various aspects of the present invention.

[0065] Various aspects of the present invention are described herein with reference to flowcharts and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the present invention. It should be understood that each block of the flowcharts and / or block diagrams, and combinations of blocks in the flowcharts and / or block diagrams, can be implemented by computer-readable program instructions.

[0066] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, thereby producing a machine, so that when these instructions are executed by the processor of the computer or other programmable data processing device, a device is generated that implements the functions / actions specified in one or more blocks in the flowchart and / or block diagram. These computer-readable program instructions can also be stored in a computer-readable storage medium, where these instructions cause the computer, programmable data processing device, and / or other device to operate in a specific manner. Thus, the computer-readable medium storing the instructions comprises an article of manufacture that includes instructions for implementing various aspects of the functions / actions specified in one or more blocks in the flowchart and / or block diagram.

[0067] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device, so that a series of operational steps are performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to implement the functions / actions specified in one or more blocks in the flowchart and / or block diagram.

[0068] The flowcharts and block diagrams in the accompanying drawings show the possible implementation architecture, functions and operations of the systems, methods and computer program products according to multiple embodiments of the present invention. In this regard, each box in the flowchart or block diagram can represent a module, program segment or part of an instruction, and the module, program segment or part of the instruction contains one or more executable instructions for implementing the specified logical function. In some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions. It is well known to those skilled in the art that implementation by hardware, implementation by software, and implementation by a combination of software and hardware are all equivalent.

[0069] While various embodiments of the present invention have been described above, the foregoing description is intended to be illustrative, non-exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or technological improvements in the marketplace, or to enable others skilled in the art to understand the embodiments disclosed herein. The scope of the present invention is defined by the appended claims.

Claims

1. A thermoelectric refrigerator adaptive temperature control system based on transient undercooling, comprising: Temperature detection unit, heat load monitoring unit, limit output unit, power output unit, thermoelectric cooler, PID controller, transient pulse controller and feedforward controller; wherein: The temperature detection unit is used to obtain the cold end temperature information of the thermoelectric cooler; The heat load monitoring unit is used to monitor the heat load information of the thermoelectric cooler; The PID controller takes controlling the cold end temperature of the thermoelectric cooler at a target temperature as an optimization goal, and uses the cold end temperature information to adjust and output a first current; The transient pulse controller regulates the limiting current based on the thermal load information; The feedforward controller adjusts the advance control current based on the thermal load information and outputs a second current; The amplitude limiting output unit increases the total current output amplitude of the first current and the second current to within the amplitude limiting current according to the amplitude limiting current generated by the transient pulse controller; The power output unit is used to drive the thermoelectric cooler based on the current generated by the limiting output unit.

2. The system according to claim 1, characterized in that The output current of the PID controller is expressed as: Among them, I PID (t) is the output current of the PID controller at time t, e(t) is the difference between the real-time temperature of the cold end of the thermoelectric cooler and the target temperature, K p is the proportional link parameter, K i K is the integral part, d is the differential link parameter, T t is the integral anti-windup time constant.

3. The system according to claim 1, characterized in that The output of the transient pulse controller is expressed as: max (t) = I opt P(t) Among them, I opt represents the optimal steady-state current. The pulse amplitude P(t) is a polynomial function corresponding to the real-time thermal load and is set to P(t) = a0 + a1 × Q load (t)+a2×Q load (t) 2 +a3×Q load (t) 3 +a4×Q load (t) 4 , a0, a1, a2, a3 and a4 are the polynomial coefficients, Q load (t) is the heat load monitoring value at time t.

4. The system according to claim 3, characterized in that The polynomial coefficients of the pulse amplitude P(t) are obtained according to the following steps: The maximum steady-state cooling capacity Q of the thermoelectric cooler is measured by current parametric sweep c，max , and get the corresponding optimal current I opt ; At the maximum steady-state cooling capacity Q c，max Based on the pulse current P×I opt , and obtain the real-time cooling capacity, where P>1; By changing the P value of the pulse current, the relationship between the real-time cooling capacity of the transient pulse of the thermoelectric cooler and the current pulse is fitted through a polynomial equation, and then the coefficients of the polynomial function are obtained by fitting.

5. The method according to claim 1, characterized in that The output of the feedforward controller is expressed as: FF (t) = K load Q load (t) Among them, K load is the proportional link parameter, Q load (t) is the heat load monitoring value at time t.

6. The system according to claim 1, characterized in that The PID controller, the transient pulse controller and the feedforward controller are arranged on a main control digital chip, and the main control digital chip processes multiple tasks in parallel at the same time.

7. The system according to claim 6, characterized in that The power output unit includes a D / A conversion module and a power amplifier. The D / A conversion module is used to convert the digital current signal generated by the main control digital chip into a continuous current analog signal and transmit it to the power amplifier; the temperature detection unit includes a temperature sensor and an A / D conversion module. The temperature sensor is placed at the cold end of the thermoelectric cooler to detect the temperature, and transmits the detected temperature analog signal to the A / D conversion module, which is converted into a temperature digital signal and then transmitted to the main control digital chip.

8. The system according to claim 7, characterized in that The main control digital chip is a DSP or FPGA chip; the temperature sensor is a thermocouple, a thermistor or a thermopile sensor; the power amplifier adopts a crystal triode power module or a MOS integrated power module.

9. A thermoelectric cooler adaptive temperature control method based on the system according to any one of claims 1 to 8, comprising: Obtain cold end temperature information and heat load information of the thermoelectric cooler; Taking controlling the cold end temperature of the thermoelectric cooler at a target temperature as an optimization goal, using the cold end temperature information to regulate the PID controller to output a first current; Based on the thermal load information, the limiting current is adjusted to obtain the limiting current corresponding to the transient pulse controller; Adjust the advance control current based on the thermal load information to obtain a second current output by the feedforward controller; According to the limiting current generated by the transient pulse controller, the total current output limit of the first current and the second current is increased to within the limiting current; The thermoelectric cooler is driven based on the current generated by the limiting output unit.

10. A computer-readable storage medium having a computer program stored thereon, wherein: When the computer program is executed by a processor, the steps of the method according to claim 9 are implemented.

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