Dewar assembly and machining method therefor, and detection device

Abstract

A Dewar assembly and a machining method therefor, and a detection device. The Dewar assembly comprises a packaging device and a plurality of functional devices; a sealed cavity is formed in the packaging device; the plurality of functional devices are all mounted in the sealed cavity; the packaging device and the plurality of functional devices are all non-gas-absorbing special components; at least one of the plurality of functional devices serves as a bearing portion of a gas-absorbing structure, and / or the packaging device serves as the bearing portion of the gas-absorbing structure; the gas-absorbing structure comprises a getter layer (300) arranged on at least one portion of the surface of the bearing portion that is communicated with the sealed cavity; the gas-absorbing structure uses the getter layer (300) to absorb gas in the sealed cavity.

Description

Dewar assembly, processing method thereof, and detection equipment Technical Field

[0001] The present application belongs to the technical field of refrigeration equipment, and specifically relates to a Dewar assembly, a processing method thereof, and a detection device. Background Art

[0002] Low-temperature detectors such as infrared detectors are usually installed on a Dewar assembly to utilize the vacuum environment provided by the Dewar assembly.

[0003] Summary of the Invention

[0004] In a first aspect, an embodiment of the present application discloses a Dewar assembly, which includes a packaging device and multiple functional devices, wherein the packaging device has a sealed cavity, and the multiple functional devices are all installed in the sealed cavity. The packaging device and the multiple functional devices are all non-air-intake dedicated parts, at least one of the multiple functional devices serves as a bearing part of an air-intake structure, and / or the packaging device serves as a bearing part of the air-intake structure; the air-intake structure includes an air-intake agent layer arranged on at least a portion of the surface of the bearing part communicating with the sealed cavity, and the air-intake structure uses the air-intake agent layer to absorb gas in the sealed cavity.

[0005] In a second aspect, the present application also discloses a processing method for a Dewar assembly, which includes: removing an oxide layer on the surface of a carrying part to form a first intermediate part, wherein the carrying part includes at least one of a packaging device and a functional device; forming a passivation layer on the surface of the first intermediate part to form a second intermediate part; and forming an adsorbent layer on at least a portion of the surface of the second intermediate part to form an adsorption structure.

[0006] On the third aspect, the present application also discloses a detection device, which includes a detector and the above-mentioned Dewar assembly, the Dewar assembly includes a substrate, the substrate and the detector are both arranged in a sealed cavity of the Dewar assembly, and the detector is installed on the substrate.

[0007] The embodiment of the present application discloses a dewar assembly, which includes a packaging device and a functional device disposed in a sealed cavity of the packaging device. By making at least one of the packaging device and the functional device serve as the bearing portion of the getter structure, and providing a getter layer on at least a portion of the surface of the bearing portion communicating with the sealed cavity, even if gas leaks into the dewar assembly, the getter layer can be used to absorb the gas, thereby ensuring that the vacuum environment of the dewar assembly is relatively sustainable. In addition, by using basic devices such as the packaging device and the functional device in the dewar assembly as the bearing portion of the getter structure for supporting the getter layer, it is no longer necessary to provide additional devices in the dewar assembly to provide a bearing function for the getter layer, thereby making the overall size of the dewar assembly relatively small, reducing the leakage rate of the packaging device, and effectively reducing the difficulty of forming a vacuum environment in the dewar assembly, thereby achieving the purpose of improving the vacuum reliability of the dewar assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings described herein are used to provide further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.

[0009] FIG1 is a schematic structural diagram of a Dewar assembly disclosed in an embodiment of the present application.

[0010] FIG2 is a schematic structural diagram of the shell of the Dewar assembly disclosed in an embodiment of the present application.

[0011] FIG3 is a schematic structural diagram of a cover body in a Dewar assembly disclosed in an embodiment of the present application.

[0012] FIG4 is a schematic structural diagram of a radiation screen in a Dewar assembly disclosed in an embodiment of the present application.

[0013] FIG5 is a flow chart of a method for processing a Dewar assembly disclosed in an embodiment of the present application.

[0014] Reference numerals: 110 - housing, 120 - base, 210 - cover, 220 - light inlet, 300 - getter layer, 410 - substrate, 420 - lead ring, 430 - radiation screen, 440 - cold finger, 450 - cold head, 500 - detector. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0016] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0017] In order to maintain the continuity of its vacuum environment, the current Dewar assembly usually sets a cylindrical or tubular air suction structure inside the shell. The setting of these air suction structures makes the size of the Dewar assembly shell relatively large. On the one hand, it will further increase the difficulty of forming a vacuum environment inside the Dewar assembly. On the other hand, it will also greatly increase the leakage rate of the Dewar assembly, resulting in the relatively low vacuum reliability of the current Dewar assembly.

[0018] As shown in Figures 1 to 4, an embodiment of the present application discloses a Dewar assembly, which includes a packaging device and a plurality of functional devices. The packaging device is a general term for the structure in the Dewar assembly used to provide a packaging function. In order to facilitate processing and assembly, the packaging device can generally include a plurality of separately processed devices, and in the process of assembling the Dewar assembly, the aforementioned multiple devices are interconnected to form a packaging device for providing installation and protection for other devices in the Dewar assembly. For example, the packaging device may include a shell 110, a base 120, a cover 210 and a light inlet 220. In other embodiments of the present application, the packaging device may also include other devices, which is not limited herein. The shell 110 is mounted on the base 120, and the cover 210 is mounted on the side of the shell 110 facing away from the base 120.

[0019] More specifically, the housing 110, base 120, and cover 210 can all be formed of a material with relatively high structural strength, such as metal, to provide relatively reliable protection for other components within the Dewar assembly and ensure that the structural integrity of the packaged components of the Dewar assembly is relatively reliable. In order to ensure that the entire packaged component has a sealed space while allowing external light to enter the Dewar assembly and be captured by components such as the detector 500 installed in the Dewar assembly, the light inlet 220 is formed of a light-transmitting material and is installed at the end of the cover 210 away from the housing 110.

[0020] Functional devices are a general term for components within a dewar assembly that provide corresponding functions. There can be multiple functional devices, and this document does not limit the specific number. For example, in the embodiment of the present application, the functional devices may include substrate 410, wire ring 420, and radiation shield 430. As described above, the packaged device has a sealed cavity, within which each functional device is mounted. Furthermore, the dewar assembly can be used to house a cryogenic detector; to this end, the sealed cavity can also accommodate the detector 500.

[0021] In order to facilitate powering the detector 500, as described above, the functional device includes a substrate 410 and a lead ring 420. Specifically, the detector 500 can be installed on the substrate 410, the lead ring 420 is connected to the substrate 410, and a portion of the lead ring 420 extends out of the shell 110. By connecting the lead ring 420 to an external power supply and other equipment, the detector 500 can be ensured to work normally.

[0022] Based on the Dewar assembly of the above structure, in order to ensure that the vacuum continuity of the Dewar assembly is relatively good, an air suction structure is provided in the Dewar assembly disclosed in the embodiment of the present application. When a small amount of gas is generated or infiltrated into the sealed cavity of the Dewar assembly, the air suction structure can be used to absorb the gas to maintain a relatively high vacuum degree in the sealed cavity of the Dewar assembly.

[0023] In order to prevent the introduction of additional devices in the Dewar assembly when an air-intake structure is provided, in an embodiment of the present application, the basic structure of the Dewar assembly can be used to form the air-intake structure. In an embodiment of the present application, one or more of the multiple functional devices and / or the packaging device can be used as the supporting portion of the air-intake structure. Since the packaging device and the functional device are both used to form the basic structure of the Dewar assembly, by using one or more of the two as the supporting structure (i.e., the supporting portion) of the getter layer, it is not necessary to set up other additional devices for supporting the getter layer. Therefore, when other conditions such as the number, structure, and size of the functional devices remain unchanged, the size of the packaging device can be made relatively small, thereby reducing the number of interconnected welds and other connections in the packaging device and making the size of the welds smaller, thereby reducing the leakage rate of the packaging device used to form the sealed cavity. When the size of the packaging device is relatively small, the size of the accommodating cavity formed by the packaging device is also relatively small, thereby reducing the difficulty of forming a vacuum environment in the sealed cavity.

[0024] In other words, in the embodiments of the present application, the packaging device and each functional device are non-dedicated gas-getter components. That is, both types of devices in the Dewar assembly do not solely serve to getter gas, but rather provide this function alongside other functions. As described above, the packaging device comprises a sealed cavity, meaning that it serves as a package within the Dewar assembly disclosed herein. Of course, the packaging device can also provide other additional technical benefits, such as protection, but for the sake of brevity, these are not described in detail here. The various functional devices each have their own primary functions, such as substrate 410, which provides mounting for detector 500; wire loop 420, which provides electrical connection for detector 500; and radiation shield 430, which provides light distribution for detector 500. In this application, by using the functional devices as carriers for the getter structure, the functional devices, while performing their primary functions, also form a getter structure to getter gas.

[0025] Multiple functional devices can serve as the support portion of the air-intake structure. If certain functional devices have specific functions, such as electrical connections, they may not serve as the support portion of the air-intake structure to prevent adverse effects on their original functions. Simply put, in this application, not all functional devices must serve as the support portion of the air-intake structure.

[0026] In the case of using at least one of the packaging device and the functional device as a bearing part, in order to form an air-absorbing structure, it is also necessary to provide an air-absorbing agent layer on the portion of the surface of the bearing part that is in communication with the sealed cavity, so that the air in the sealed cavity is absorbed by the air-absorbing agent layer. That is, the air-absorbing structure includes a bearing part and an air-absorbing agent layer provided on the portion of the surface of the bearing part that is in communication with the sealed cavity. The air-absorbing agent layer 300 includes a gas-absorbing material that, after being activated, can absorb gas, thereby maintaining a vacuum environment in the space of the sealed cavity. More specifically, the air-absorbing agent layer 300 can include materials such as zirconium oxide, zirconium-vanadium iron, and titanium-zirconium-vanadium. It should be noted that the air-absorbing agent layer 300 can be provided on the portion of the inner surface of any one of the above-mentioned shell 110, base 120, and cover body 210 that is used to form the sealed cavity. However, in order to ensure that the light-inlet member 220 has good light transmittance, the surface of the light-inlet member 220 is no longer provided with an air-absorbing agent layer 300.

[0027] Specifically, the getter layer 300 can be provided only on the portion of the inner surface of the packaged device that forms the sealed cavity. As described above, the packaged device has a sealed cavity, that is, the sealed cavity is enclosed by multiple parts or multiple devices included in the packaged device. Correspondingly, the inner surface of the packaged device necessarily includes a portion that forms the sealed cavity. To this end, the getter layer 300 can be provided on the portion of the inner surface of the packaged device that forms the sealed cavity.

[0028] Alternatively, the getter layer 300 may be provided only on the portion of the surface of the functional device that communicates with the sealed cavity. As described above, the functional device is installed in the sealed cavity. Therefore, the surface of the functional device necessarily includes a portion directly exposed to the sealed cavity. This portion is the portion of the surface of the functional device that communicates with the sealed cavity, and the getter layer 300 may be provided on this portion.

[0029] As described above, a getter layer 300 is provided on the carrier portion. The getter layer 300 is capable of absorbing gas. Thus, even if air or other gases enter the sealed chamber of the Dewar assembly over time, the getter layer 300 on the carrier portion can absorb the gas, thereby maintaining a relatively continuous vacuum environment in the sealed chamber of the Dewar assembly. Of course, the getter layer 300 can also be provided on both the packaged device and the functional device, thereby further increasing the area of ​​the getter layer within the Dewar assembly and improving the Dewar assembly's gettering efficiency and capacity.

[0030] The present invention discloses a Dewar assembly comprising a packaging device and multiple functional devices disposed within a sealed cavity within the packaging device. By utilizing the packaging device and / or one or more of the multiple functional devices as the support portion of the Dewar assembly's getter structure, and providing a getter layer 300 on the surface of the support portion that communicates with the sealed cavity, even if gas leaks into the Dewar assembly, the getter layer 300 can absorb the gas within the sealed cavity, thereby ensuring a relatively stable vacuum environment within the Dewar assembly. Moreover, as described above, in the technical solution disclosed in the embodiment of the present application, the packaging device and each functional device are non-dedicated parts for air absorption. By making the packaging device and the functional device, which are originally the basic devices constituting the Dewar assembly, serve as the bearing parts for bearing the getter layer in the air absorption structure, it is no longer necessary to set up additional devices in the Dewar assembly to provide a bearing function for the getter layer, thereby making the overall size of the Dewar assembly relatively small, that is, the size of the packaging device is small. Therefore, on the one hand, the leakage rate of the packaging device can be reduced, and on the other hand, the volume of the sealed cavity can be made relatively small, reducing the difficulty of forming a vacuum environment in the Dewar assembly, so as to achieve the purpose of improving the vacuum reliability of the Dewar assembly.

[0031] As mentioned above, the getter layer 300 needs to be activated during use, and based on comprehensive considerations such as cost and effectiveness, heating is generally used to activate the getter layer 300. Therefore, before the Dewar assembly is used, the getter layer 300 in the Dewar assembly can be directly activated by heating. Subsequently, the device with the activated getter layer 300 can be assembled into a whole, or the device with the activated getter layer 300 can be assembled into a packaged device.

[0032] However, as the usage time of the Dewar assembly increases, gas gradually invades the sealed cavity, and the amount of gas absorbed by the getter layer 300 will gradually increase, which may cause the getter layer to have a low air absorption efficiency or even fail. In this case, in order to improve the service life of the Dewar assembly, it is usually necessary to reactivate the getter layer 300 in the Dewar assembly. During the reactivation process, in order to reduce the workload and prevent the Dewar assembly from being damaged during the disassembly and assembly process, a heat source is usually set outside the Dewar assembly to activate the getter layer 300 set inside the Dewar assembly. Based on this, the getter layer 300 can be set on the packaging device in the Dewar assembly, and / or on the surface of one or more of the functional devices that are relatively close to the packaging device, so as to reduce the difficulty of activating the getter layer 300.

[0033] As described above, the packaged device may include a base 120 and a shell 110, and the shell 110 is connected to the base 120. More specifically, the functional device may include a cold finger 440, and accordingly, the cold finger 440 is located in the sealed cavity, and the cold finger 440 is mounted on the base 120. More specifically, the cold finger 440 may be connected to the central area of ​​the substrate 410 of the Dewar assembly, and the portion where the cold finger 440 is connected to the substrate 410 is a cold head 450. In an embodiment of the present application, at least a portion of the shell 110 may be arranged around the outside of the cold finger 440, and a getter layer 300 may be provided on the inner surface of the shell 110 facing the cold finger 440. In this case, the getter layer 300 provided on the inner surface of the shell 110 may be activated by direct heating, and the activation efficiency and activation effect of this method are relatively good. It should be noted that the thickness of the getter layer 300 itself is relatively small, and thus in a macroscopic sense the getter layer 300 and the shell 110 can be considered as an integrated structure. For ease of description, the shell 110 formed with the getter layer 300 will still be referred to as a "shell" hereinafter.

[0034] Furthermore, in the process of designing the shell 110, since there is no need to install other larger devices between the shell 110 and the cold finger 440, such as an additional columnar or tubular suction structure for providing suction, in the present application, the portion of the shell 110 surrounding the cold finger 440 can be configured to imitate the cold finger 440, that is, the shape of the shell 110 is similar to that of the cold finger 440, which can maximize the reduction of the distance between the shell 110 and the cold finger 440, thereby making the volume of the space sandwiched between the shell 110 and the cold finger 440 relatively smaller.

[0035] The housing 110 and the cold finger 440 are arranged in close proximity. Close proximity means that the housing 110 and the cold finger 440 are spaced apart from each other, do not touch each other, and the gap between the two is relatively small. This can further reduce the gap between the housing 110 and the cold finger 440, making the volume of the entire sealed cavity smaller, thereby reducing the difficulty of forming a vacuum environment in the Dewar assembly and reducing the leakage rate of the packaged device. Of course, in order to ensure that the cold finger 440 can be properly installed in the housing 110, the housing 110 still needs to reserve an installation gap for the cold finger 440. That is, when the cold finger 440 is installed in the housing 110, there is still a relatively small gap between the opposing parts of the two. As for the specific size of the gap, it can be flexibly determined according to actual conditions, but the size of the gap is necessarily much smaller than the spacing between the housing and the cold finger in the technical solution that requires an additional air intake structure.

[0036] In other words, in the embodiment of the present application, the portion of the shell 110 that is arranged outside the cold finger 440 is contoured and closely adjacent to the cold finger 440. For example, in a direction perpendicular to the axial direction of the cold finger 440, the gap between the portion of the cold finger 440 that is directly opposite to the shell 110 and the shell 110 is less than 3 mm, and if the installation accuracy permits, the gap between the cold finger 440 and the shell 110 in the above direction can be less than 2 mm, so that no additional devices can be arranged between the cold finger and the shell, and the gap between the cold finger and the shell is relatively small, thereby making the volume of the space enclosed between the cold finger and the shell relatively small, which can greatly reduce the overall volume of the housing chamber in the Dewar assembly, thereby reducing the difficulty of forming a vacuum environment in the Dewar assembly and reducing the leakage rate of the Dewar assembly.

[0037] It should be noted that, generally speaking, the cold finger 440 is a cylindrical structure. In this case, the direction perpendicular to the axial direction of the cold finger 440 is the radial direction of the cold finger 440. Furthermore, the getter layer 300 formed on the supporting portion is typically relatively thin, generally less than 1 mm, and can even be less than 2 μm thick. This generally ensures that the getter layer 300 has a sufficient gettering capacity, thereby ensuring that there is at least a 1 mm assembly gap between the getter layer 300 and the cold finger 440, thereby ensuring that the cold finger 440 can be properly installed within the housing 110 and that there is a sufficient distance between the cold finger 440 and the getter layer 300.

[0038] In order to increase the area of ​​the getter layer 300 provided in the Dewar assembly, in some embodiments, the getter layer 300 is provided on the inner surface of the cover 210 of the packaged device. In this case, the getter layer 300 on the inner surface of the cover 210 can also be activated by directly heating outside the Dewar assembly.

[0039] As described above, a getter layer 300 may also be provided on the surface of the functional device. Similar to the housing 110, the functional device formed with the getter layer 300 will be referred to as a "functional device" hereinafter. In some embodiments, the functional device includes a radiation shield 430, which is located inside the housing 210, and the getter layer 300 may be provided on the outer surface of the radiation shield 430. The outer surface of the radiation shield 430 may, for example, include the surface of the radiation shield 430 facing the housing 210. In this case, after the Dewar assembly has been used for a period of time, the getter layer 300 on the outer surface of the radiation shield 430 can be activated by directly heating it outside the Dewar assembly, utilizing the effect of heat propagation through radiation, and providing a gas absorption function.

[0040] Furthermore, during the design of the cover 210 in the Dewar assembly, the cover 210 and the radiation shield 430 can be contoured, thereby reducing the gap between them and the volume of the space between them. Furthermore, by appropriately designing the dimensions of the two, they can be placed in close proximity, further reducing the volume of the space between the cover 210 and the radiation shield 430. This further reduces the volume of the housing cavity, thereby reducing the difficulty of creating a vacuum environment in the sealed cavity and reducing the leakage rate of the packaged device.

[0041] Similarly, the housing 210 and the radiation shield 430 are contoured and arranged in close proximity, and can also refer to the corresponding designs for the housing 110 and cold finger 440 in the above-mentioned embodiment. The structure of the housing 210 can be adaptively designed based on the shape of the radiation shield 430. After the radiation shield 430 is installed inside the housing 210, a relatively small gap exists between any position on the radiation shield 430 and the corresponding position in the housing 210, along a direction perpendicular to the optical axis of the light inlet. This gap can be, for example, less than 3 mm, and if installation accuracy is met, it can be further reduced to less than 2 mm. This results in a relatively small space between the housing 210 and the radiation shield 430, making it impossible to install additional components, thereby further reducing the volume of the entire housing cavity. It should be noted that the direction perpendicular to the optical axis of the light inlet is the radial direction of the cold finger.

[0042] When an absorbent layer 300 is provided on the outer surface of the radiation screen 430, an absorbent layer 300 can be further provided on the inner surface of the radiation screen 430, so that in the process of heating the radiation screen 430 by radiation, the absorbent layers 300 on the inner and outer surfaces of the radiation screen 430 can be activated together, and the complexity and time of the activation process of the absorbent layer 300 will not be greatly increased while greatly improving the gas absorption capacity of the Dewar assembly.

[0043] As described above, in the Dewar assembly disclosed in the embodiments of the present application, at least one of the packaged device and the functional device can serve as the carrier of the getter structure, and the surface of the carrier communicating with the sealed cavity is covered with a getter layer, so that the getter layer 300 on the surface of the carrier can be connected to form a dense film layer, which can be, for example, an insulating film. In this case, the insulating film is closer to the space inside the packaged device than the carrier, that is, the insulating film can surround the sealed cavity and isolate the carrier from the sealed cavity, thereby preventing gas that may be released from the carrier from entering the sealed cavity through the surface communicating with the carrier.

[0044] That is, when the above technical solution is adopted, the getter layer 300 can also be used to cover the surface of the carrier part. Therefore, even if there is a microporous structure inside the carrier part, under the action of the insulating film, the gas in the microporous structure can be suppressed or even prevented from escaping from the carrier part toward the surface of the sealed cavity to the outside of the carrier part, thereby destroying the vacuum environment in the sealed cavity. Moreover, as mentioned above, when the present application uses the packaging device and the functional device as the carrier part of the getter structure, the overall size of the packaging device is relatively small, which can also greatly reduce the area of ​​the part of the packaging device that is connected to the sealed cavity, thereby reducing the degassing source area of ​​the packaging device. Therefore, even if the inhibitory effect of the getter layer 300 on the gas release effect of the carrier part surface decreases over time, the amount of gas escaping from the packaging device into the sealed cavity can be greatly reduced by reducing the degassing source area, thereby achieving the purpose of improving the maintenance time of the vacuum environment of the Dewar assembly.

[0045] As mentioned above, due to current technological bottlenecks, even if a strong, hard material such as metal is used to form the carrier, microporous structures may still exist within the material. Furthermore, after a vacuum environment is established within the sealed cavity, gas within the carrier material may escape from the surface of the material and enter the sealed cavity, disrupting the vacuum environment. Therefore, if at least a portion of the carrier is made of a material that releases gas from its surface, the getter layer 300 can cover at least a portion of the surface of the carrier that communicates with the sealed cavity.

[0046] Based on the above technical solution, in order to take into account the difficulty of processing, the getter layer 300 can generally cover the surface of the support part connected to the sealed cavity, and is limited by the influence of parameters such as the accuracy of the processing technology. In actual application, it may happen that the getter layer 300 cannot form a complete and dense film layer; in other words, there may be tiny holes in the getter layer 300 covering the surface connected to the support part and the sealed cavity. Although the gas released by the material in the support part can still enter the sealed cavity from the aforementioned tiny holes, when this technical solution is adopted, the difficulty of forming the getter layer 300 can be greatly reduced, the processing cost of the getter layer 300 can be greatly reduced, and the overall performance of the Dewar assembly can be improved.

[0047] As for the gas released by the material that can release gas on the surface and enters the sealed cavity through the aforementioned tiny holes, it can be absorbed by the getter layer 300 covering the surface of the supporting part. At the same time, since the amount of gas released by the supporting part is relatively small, and the amount of gas that can enter the sealed cavity from the tiny holes on the getter layer 300 is even smaller, even if the supporting part may release gas into the sealed cavity due to the presence of tiny holes on the getter layer 300, it will basically not have an adverse effect on the stability of the vacuum environment of the sealed cavity. However, when this technical solution is adopted, the difficulty of forming the getter layer 300 and the processing cost can be greatly reduced.

[0048] Based on the Dewar assembly disclosed in any of the above embodiments, the present application also discloses a processing method for processing any of the above Dewar assemblies. As shown in FIG5 , the processing method includes steps S1 to S3.

[0049] S1. Remove the oxide layer on the surface of the bearing part to form a first intermediate part. Specifically, an acidic solution can be used to react with the oxide layer to remove the oxide layer on the surface of the bearing part, and the efficiency and effect of this removal method are relatively good. Specifically, the specific components of the acidic solution can be determined according to actual needs and are not limited here. In addition, in this process, ultrasound can also be used to assist the removal process, so as to separate the substance formed by the reaction of the acidic solution and the oxide layer from the surface of the bearing part, ensuring that the oxide layer on the surface of the bearing part can be completely removed. Of course, the reaction time between the bearing part and the acidic solution can also be determined according to actual conditions. Wherein, the bearing part includes at least one of a packaging device and a functional device.

[0050] S2. Forming a passivation layer on the surface of the first intermediate member. Specifically, the first intermediate member is immersed in a passivation solution for a predetermined period of time. A passivation layer is formed on the surface of the first intermediate member, thereby forming the second intermediate member. The specific components of the passivation solution can be flexibly selected based on the material of the carrier portion and other specific conditions, and are not limited herein.

[0051] S3. Form an adsorbent layer on at least part of the surface of the second intermediate member. Specifically, the method of forming the adsorbent layer 300 on the surface of the second intermediate member can be selected based on the type of the adsorbent layer 300. In order to improve the film forming efficiency and film forming stability of the adsorbent layer 300, in a specific embodiment of the present application, a magnetron sputtering method can be used to form the adsorbent layer 300 on the surface of the second intermediate member, thereby forming an adsorbent structure. In addition, in the above step S3, the adsorbent layer can be formed only on the surface of the portion of the second intermediate member that is connected to the formed sealed cavity. Taking into account the difficulty of processing, the adsorbent layer can be formed on the surface of the sealed cavity formed on the second intermediate member, as well as on the surface of the portion of the second intermediate member located in the sealed cavity.

[0052] In order to further improve the adhesion reliability of the getter layer on the surface of the bearing part, before the above-mentioned step S1, the processing method of the Dewar assembly disclosed in the embodiment of the present application may further include the step of removing impurities such as process debris. In some embodiments, the workpiece to be coated can be immersed in an alkaline solution, and assisted by an ultrasonic cleaning process, so as to remove the process debris on the surface of the bearing part and improve the surface cleanliness of the bearing part. In addition, a deionized water cleaning step can be added between the above steps S1 and S2 to prevent the acidic solution from remaining on the surface of the first intermediate part and adversely affecting the passivation process. Of course, the processing process of the Dewar assembly includes not only the above-mentioned steps, but also the manufacturing and molding process of components such as the bearing part, as well as the assembly process between components, etc. Considering the simplicity of the text, it will not be introduced in detail here.

[0053] As described above, a getter layer 300 is provided on the supporting portion of the Dewar assembly. However, for some components such as the substrate 410, the conditions for providing the getter layer 300 may not be met due to other reasons such as the need to lay out circuits. As described above, even if the component may be formed of a material such as metal and its state after molding is a solid structure, due to the influence of the material itself, the interior of the component may contain a microporous structure containing gas. Furthermore, in order to further reduce the probability of the vacuum environment in the Dewar assembly being destroyed by its own components, the processing method disclosed in the embodiment of the present application also includes: before assembling the Dewar assembly, removing the gas in the non-getter structure, the non-getter structure including the above-mentioned substrate 410. In some embodiments, the gas in the non-getter structure can be removed by baking, and in order to prevent the baking process from damaging the workpiece, the baking temperature can be controlled at 80-100°C. By appropriately increasing the baking time, it can also be ensured that the gas in the non-getter structure can escape from the interior of the workpiece.

[0054] After the Dewar assembly is assembled, the sealed chamber of the Dewar assembly can be evacuated using a vacuum pump, and the leak rate of the Dewar assembly can be tested using a helium mass spectrometer. After the leak rate meets the requirements, the getter layer 300 can be activated by heating or other means, so that the getter layer 300 begins to function and maintains the vacuum environment of the sealed chamber of the Dewar assembly. After the gas in the non-getter structure is removed, the Dewar assembly can also be assembled in a vacuum environment to prevent gas from re-entering the non-getter structure and other components. Before the Dewar assembly is assembled, the getter layer 300 is pre-activated.

[0055] Based on the Dewar assembly disclosed in any of the above embodiments, the present application also discloses a detection device, which includes a detector 500 and any of the above Dewar assemblies. The detector 500 can be, for example, an infrared detector. The detector 500 is arranged in a sealed cavity of the Dewar assembly, and the detector 500 can be installed on the substrate 410 of the Dewar assembly. The substrate 410 of the Dewar assembly is installed on the cold finger 440 of the Dewar assembly. With the help of the cold finger 440, a lower temperature environment can be provided for the detector 500.

[0056] It should be noted that, in this article, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0057] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A Dewar assembly, comprising a packaging device and a plurality of functional devices, The package device has a sealed cavity, The plurality of functional devices are all installed in the sealed cavity, and the packaging device and the plurality of functional devices are non-inhalation dedicated parts. At least one of the plurality of functional devices serves as a bearing part of the air-intake structure, and / or the packaging device serves as a bearing part of the air-intake structure; The getter structure comprises a getter layer (300) arranged on at least a portion of the surface of the bearing portion communicating with the sealed cavity, and the getter structure absorbs gas in the sealed cavity using the getter layer (300).

2. The Dewar assembly according to claim 1, wherein: The packaging device comprises a base (120) and a housing (110) connected to each other. The plurality of functional devices include a cold finger (440), wherein the cold finger (440) is mounted on the base (120), At least a portion of the shell (110) is disposed around the outside of the cold finger (440), and the getter layer (300) is provided on the inner surface of the shell (110) facing the cold finger (440); The portion of the housing (110) that is disposed outside the cold finger (440) is contoured and closely adjacent to the cold finger (440).

3. The Dewar assembly according to claim 1, wherein: The packaging device comprises a housing (110), a cover (210) and a light-incoming member (220). One end of the cover body (210) is connected to the housing (110), and the light-incoming member (220) is arranged at the other end of the cover body (210). The getter layer (300) is provided on the inner surface of the cover body (210).

4. The Dewar assembly according to claim 1, wherein: The packaging device comprises a cover body (210) and a light-incoming member (220) which are connected to each other. The plurality of functional devices include a radiation screen (430), the radiation screen (430) is located on the inner side of the cover body (210), and the getter layer (300) is provided on the outer surface of the radiation screen (430); The cover body (210) and the radiation screen (430) are arranged in a similar shape and in close proximity; The getter layer (300) is provided on the inner surface of the radiation screen (430).

5. The Dewar assembly according to any one of claims 1 to 4, wherein: The surface of the bearing portion communicating with the sealing cavity is covered with the getter layer (300), The getter layer (300) forms an insulating film body, which surrounds the sealed cavity and isolates the bearing portion from the sealed cavity.

6. The Dewar assembly according to any one of claims 1 to 5, wherein: At least part of the bearing portion is made of a material whose surface can release gas, and the getter layer (300) covers the surface of the material whose surface can release gas that is connected to the sealed cavity, so as to prevent the gas released by the material from entering the sealed cavity.

7. A method for processing a Dewar assembly, comprising: Removing an oxide layer on a surface of a carrier portion to form a first intermediate component, wherein the carrier portion includes at least one of a packaging device and a functional device; forming a passivation layer on the surface of the first intermediate member to form a second intermediate member; A getter layer (300) is formed on at least a portion of the surface of the second intermediate member to form a getter structure.

8. The processing method according to claim 7, wherein: The step of forming a getter layer (300) on the surface of the second intermediate member to form the getter structure comprises: A getter layer (300) is formed on the surface of the second intermediate member by magnetron sputtering to form a getter structure.

9. The processing method according to claim 8, wherein: The Dewar assembly comprises a substrate (410), wherein the substrate (410) is used to mount a detector (500), and the method further comprises: Prior to assembling the Dewar assembly, gas is removed from a non-getter structure, the non-getter structure including the substrate (410).

10. A detection device, wherein: The invention comprises a detector (500) and a Dewar assembly according to any one of claims 1 to 6, wherein the Dewar assembly comprises a substrate (410), the substrate (410) and the detector (500) are both arranged in a sealed cavity of the Dewar assembly, and the detector (500) is mounted on the substrate (410).

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