Device for resin molding and method for producing molded resin article

Abstract

A device (1) for resin molding includes: a resin supply mechanism (26) for supplying a granular resin to a resin accommodation part (24) which comprises a release film (F) and a frame-shaped member (24a) placed on the release film (F); a resin molding mechanism (3) which includes a mold (M) comprising an upper mold (UM) and a lower mold (LM) facing the upper mold (UM) and in which the release film (F) to which the granular resin has been supplied is placed between the upper mold (UM) and the lower mold (LM) to perform resin molding; and a resin recovery mechanism (6) which can recover, by suction, the granular resin supplied to the release film (F), without the release film (F) being placed in the mold (M).

Description

Resin molding device and method for manufacturing resin molded product

[0001] The present disclosure relates to a resin molding apparatus and a method for manufacturing a resin molded product.

[0002] Substrates or the like to which semiconductor chips are fixed are generally used as electronic components by being resin-encapsulated. Conventionally, there has been a resin molding apparatus that supplies a resin material to a pre-cut release film and transports the release film to a molding die (see, for example, Patent Document 1).

[0003] In the resin molding device of Patent Document 1, if the resin material supplied onto the release film is inappropriate, such as if the resin material is greater than the target weight, the release film is discarded together with the supplied resin material.

[0004] Japanese Patent Application Laid-Open No. 2021-171920

[0005] When discarding a release film to which a resin material has been supplied, some users of resin molding machines desire to separate and recover the resin material and the release film for recycling or other reasons.

[0006] Therefore, there is a demand for a resin molding apparatus and a method for manufacturing a resin molded product that are capable of separating and recovering the resin material and the release film.

[0007] One embodiment of the resin molding apparatus according to the present disclosure includes a resin supply mechanism that supplies powdered or granular resin to a resin storage section that includes a release film and a frame-shaped member that is placed on the release film; a resin molding mechanism that has a molding die consisting of an upper die and a lower die that faces the upper die and that performs resin molding by placing the release film, to which the powdered or granular resin has been supplied, between the upper die and the lower die; and a resin recovery mechanism that is capable of sucking and recovering the powdered or granular resin that has been supplied to the resin storage section before the release film is placed on the molding die.

[0008] One embodiment of a method for manufacturing a resin molded product according to the present disclosure includes a resin supplying step of supplying a predetermined amount of powdered or granular resin to a resin storage section including a release film and a frame-shaped member arranged on the release film; a determination step of determining whether the powdered or granular resin supplied to the resin storage section is appropriate; a recovery step of suctioning and recovering the powdered or granular resin supplied to the resin storage section if it is determined in the determination step that the powdered or granular resin is appropriate; and a molding step of placing the release film to which the powdered or granular resin has been supplied and a pre-molding substrate between an upper mold and a lower mold and performing resin molding if it is determined in the determination step that the powdered or granular resin is appropriate.

[0009] According to the embodiments of the present disclosure, it is possible to provide a resin molding apparatus and a method for manufacturing a resin molded product that are capable of separating and recovering a resin material and a release film.

[0010] FIG. 1 is a schematic diagram showing a resin molding apparatus according to the present embodiment; FIG. 2 is a schematic diagram showing the configuration of a resin molding module; FIG. 3 is a schematic diagram showing a resin recovery mechanism according to a first embodiment; FIG. 4 is a plan view of a plate-shaped member; FIG. 5 is a schematic diagram showing a resin recovery mechanism according to a second embodiment; and FIG. 6 is a flowchart showing a method for manufacturing a resin molded product.

[0011] Hereinafter, embodiments of a resin molding apparatus and a method for manufacturing a resin molded product according to the present disclosure will be described with reference to the drawings. Note that the embodiments described below are merely examples for explaining the present disclosure, and the present disclosure is not limited to these embodiments. Therefore, the present disclosure can be embodied in various forms without departing from the spirit and scope of the present disclosure.

[0012] Substrates (molding objects) with semiconductor chips (hereinafter sometimes referred to as "chips") fixed thereto are resin-encapsulated and used as electronic components (resin molded products). Techniques for resin-encapsulating substrates include the compression method (compression molding) and the transfer method. One compression method is a resin-encapsulating method in which liquid resin or powdered resin is supplied to a release film, the release film is placed on the lower die of a molding die, and the object to be molded is immersed in the molten liquid resin or powdered resin on the release film to form a resin mold. Examples of electronic elements include resistor elements, capacitor elements, etc. in addition to semiconductor chips.

[0013] [Configuration of Resin Molding Apparatus] FIG. 1 shows a schematic diagram of a resin molding apparatus 1. The resin molding apparatus 1 in this embodiment employs a compression system and includes a resin supply module 2, multiple (three in this embodiment) resin molding modules 3 (an example of a resin molding mechanism), a substrate supply module 4, and a control unit 5. The resin supply module 2, the multiple resin molding modules 3, and the substrate supply module 4 can be independently attached or detached. While the resin molding modules 3 in this embodiment are three, they may be two or fewer or four or more. An optimal number can be selected depending on the production volume. The Z direction in FIG. 1 corresponds to the vertical direction of the resin molding apparatus 1, the X direction corresponds to the arrangement direction of the resin supply module 2, resin molding module 3, and substrate supply module 4, and the Y direction corresponds to the depth direction of each module, perpendicular to the X and Z directions. In the X, Y, and Z directions shown in FIG. 1, the directions indicated by the arrows are the +X, +Y, and +Z directions, and the directions opposite to the arrow directions are the −X, −Y, and −Z directions.

[0014] The control unit 5 includes a processor such as a CPU (Central Processing Unit) and a storage device such as a RAM (Random Access Memory). The control unit 5 controls the operation of the resin molding apparatus 1 by causing the processor to execute a control program stored in the storage device. The operation of the resin molding apparatus 1 described below is performed based on operation commands from the control unit 5, unless otherwise specified. In the following description, explanation of the operation commands from the control unit 5 will be omitted in principle, and the operation commands from the control unit 5 will be explained as necessary.

[0015] The substrate supply module 4 is provided with a pre-molded substrate supply section 41 that supplies pre-molded substrates Sa (an example of a molding object), a molded substrate storage section 42 that stores molded substrates Sb (an example of a resin molded product), a substrate placement section 43 that transfers pre-molded substrates Sa and molded substrates Sb, and a substrate transport mechanism 44 that transports pre-molded substrates Sa and molded substrates Sb. The substrate placement section 43 moves in the Y direction within the substrate supply module 4. The substrate transport mechanism 44 moves in the X direction and the Y direction in each of the substrate supply module 4 and the resin molding module 3. The predetermined position S1 is a position where the substrate transport mechanism 44 waits when not in operation.

[0016] Each of the three resin molding modules 3 is provided with a lower mold LM that can be raised and lowered, and an upper mold UM (see also FIG. 2) that is positioned opposite the lower mold LM. The upper mold UM and lower mold LM constitute a molding mold M. Each resin molding module 3 has a mold clamping mechanism 35 (circular portion indicated by a two-dot chain line) that clamps and opens the upper mold UM and lower mold LM. The lower mold LM and upper mold UM are clamped and opened by moving relatively by the mold clamping mechanism 35. The lower mold LM has a lower mold cavity MC (see also FIG. 2) to which a release film F and a powdered resin as a resin material are supplied. The detailed configuration of the resin molding module 3 will be described later.

[0017] The material for the release film F used in this embodiment is a resin having properties such as heat resistance, releasability, flexibility, and extensibility. Examples of such materials include PTFE (polytetrafluoroethylene), ETFE (ethylene / tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene / hexafluoropropylene copolymer), polypropylene, polystyrene, and polyvinylidene chloride. The average particle size of the granular resin used in this embodiment is not particularly limited, but is, for example, 5 mm or less. Preferably, it is 1 mm or less, more preferably 0.9 mm or less, 0.8 mm or less, 0.7 mm or less, 0.6 mm or less, 0.5 mm or less, 0.4 mm or less, 0.3 mm or less, 0.2 mm or less, or 0.1 mm or less. It is preferable that the particle size distribution of the granular resin be such that 80% or more of the resin is within ±10% of the average particle size.

[0018] The resin supply module 2 is provided with an XY table 21, a release film supply mechanism 22 that supplies a release film F onto the XY table 21, a cleaning mechanism 23 that cleans the lower surface and inner surface of the frame-shaped member 24a, a resin storage unit 24 including the frame-shaped member 24a and the release film F, a resin conveying mechanism 25 that conveys the resin storage unit 24, a resin supply mechanism 26 that supplies powdered or granular resin to the resin storage unit 24, and a resin recovery mechanism 6 that recovers the powdered or granular resin supplied onto the release film F. The XY table 21 moves in the X and Y directions within the resin supply module 2. The frame-shaped member 24a is a hollow frame that is rectangular when viewed along the Z direction. The resin conveying mechanism 25 moves in the X and Y directions within the resin supply module 2 and each of the three resin molding modules 3. The predetermined position M1 is a standby position where the resin conveying mechanism 25 is not operating. The resin recovery mechanism 6 is disposed adjacent to the resin supply mechanism 26. The specific configuration of the resin recovery mechanism 6 will be described later.

[0019] [Configuration of Resin Molding Module] Next, a specific configuration of the resin molding module 3 including the molding mold M will be described. As shown in FIG. 2 , the resin molding module 3 in this embodiment is configured as a press frame in which a lower fixed platen 31 and an upper fixed platen 33 are integrated by a plate-like member 32. A movable platen 34 is provided between the lower fixed platen 31 and the upper fixed platen 33. The movable platen 34 is movable up and down along the plate-like member 32. A mold clamping mechanism 35, which is a device for moving the movable platen 34 up and down, is provided above the lower fixed platen 31 and is composed of a ball screw or the like. The mold clamping mechanism 35 is configured to clamp the molding mold M by moving the movable platen 34 upward, and to open the molding mold M by moving the movable platen 34 downward. The drive source of the mold clamping mechanism 35 is not particularly limited, but an electric motor (not shown), such as a servo motor, can be used, for example.

[0020] The upper mold UM and lower mold LM forming the molding die M are arranged opposite each other and are both composed of metal dies or the like. An upper mold holder 39 including an upper heater 37 is arranged on the underside of the upper fixed platen 33, and the upper mold UM is attached below the upper mold holder 39. The upper mold UM is provided with an upper mold substrate setting section (not shown) for placing the pre-molded substrate Sa, and the pre-molded substrate Sa with chips or the like fixed thereto is attached to the underside of the upper mold UM. A lower mold holder 38 including a lower heater 36 is arranged on the upper surface of the movable platen 34, and the lower mold LM is provided on the lower mold holder 38. The lower mold LM has a lower mold cavity MC into which a release film F and granular resin R are supplied. The pre-molded substrate Sa is sealed with the granular resin R to become a molded substrate Sb.

[0021] 3A and 3B , the specific configuration of the resin recovery mechanism 6 according to the first embodiment will be described. The resin recovery mechanism 6 according to the present embodiment includes a plate-shaped member 61, a first hose 63 (an example of a recovery path), a second hose 64, an air pump 65 (an example of a suction source), a resin recovery unit 66 (an example of a recovery unit), and a film recovery unit 67 (see FIG. 1 ).

[0022] The plate-shaped member 61 is made of resin or metal and is a rectangular plate material whose outer shape is approximately the same size as the outer shape of the frame-shaped member 24a. The plate surface of the plate-shaped member 61 has an area sufficient to cover at least the entire hollow portion inside the frame-shaped member 24a. The plate-shaped member 61 has a first hole 61a, which is a circular through-hole, in the center, and a plurality of (four in this embodiment) second holes 61b, which are circular through-holes with smaller diameters than the first hole 61a, around the first hole 61a. In this embodiment, the four second holes 61b are formed near the four corners of the plate-shaped member 61. The first hole 61a and the second holes 61b are formed in locations that are located in the hollow portion inside the frame-shaped member 24a when the plate-shaped member 61 is placed on top of the frame-shaped member 24a.

[0023] One end of a first hose 63 is connected to the first hole 61a of the plate-like member 61 via a first connecting part 63a. Packings (not shown) are provided at the connection points between the plate-like member 61 and the first connecting part 63a and between the first connecting part 63a and the first hose 63 to prevent air from leaking from these connection points. An air pump 65 capable of sucking air is connected to the other end of the first hose 63. The air pump 65 is housed in a box-shaped resin recovery unit 66. The resin recovery unit 66 is, for example, a dust collection box provided in the resin molding apparatus 1, but may also be a dedicated box separate from the dust collection box.

[0024] One end of a second hose 64 is connected to each of the four second holes 61b of the plate-like member 61 via a second connecting part 64a. Packings (not shown) or the like are disposed at the connection points between the plate-like member 61 and the second connecting part 64a and at the connection points between the second connecting part 64a and the second hose 64, to prevent air from leaking from these connection points. An air compressor (not shown) capable of sending out air (an example of gas) is connected to the other end of each of the four second hoses 64.

[0025] Next, a method for recovering powdered or granular resin R supplied onto the release film F of the resin storage unit 24 will be described. The resin storage unit 24 is constructed by placing a frame-shaped member 24a on top of a release film F cut to a predetermined size. The resin storage unit 24 is moved by the XY table 21 and stopped at a predetermined position below the resin supply mechanism 26 (see FIG. 1). After stopping, powdered or granular resin R is supplied to the resin storage unit 24. If it becomes necessary to recover powdered or granular resin R for reasons described below, the resin storage unit 24 is left in place at the predetermined position below the resin supply mechanism 26, and the plate-shaped member 61 is moved by an actuator (not shown) or the like and placed so as to cover the top of the resin storage unit 24, including the frame-shaped member 24a. At this time, the plate-shaped member 61 and the frame-shaped member 24a are tightly attached to each other so that no gap G (see FIG. 4) is formed at the boundary between them. Therefore, a slight force may be applied to the plate-shaped member 61 to press it against the frame-shaped member 24a. As a result, the powdered or granular resin R is contained in the resin containing space 62 , which is the space formed by the release film F, the frame-shaped member 24 a, and the plate-shaped member 61 .

[0026] Next, in this state, the air pump 65 and the air compressor are operated. As a result, the powdered or granular resin R together with the air in the resin containing space 62 is sucked into the air pump 65 via the first hose 63 and discharged from the resin containing space 62 to the outside (first hose 63) through the first hole 61a. At this time, if the amount of air sucked from the resin containing space 62 through the first hole 61a by the air pump 65 per unit time is made equal to the total amount of air supplied per unit time to the resin containing space 62 from the four second holes 61b by the air compressor, the powdered or granular resin R can be discharged while maintaining a constant pressure (air pressure) in the resin containing space 62.

[0027] When the air pump 65 sucks the powdered resin R together with the air in the resin containing space 62, a suction force from the air pump 65 also acts on the release film F. The release film F is adsorbed to the X-Y table 21 by the air suction, but if the suction force of the air pump 65 is strong, there is a risk that the release film F will be sucked into the air pump 65. However, in this embodiment, the compressed air supplied from the second holes 61b is directed toward the release film F, and this compressed air presses the release film F against the X-Y table 21 on which the release film F is placed, thereby preventing the release film F from being sucked. In particular, because the second holes 61b are formed near the four corners of the plate-like member 61, the release film F can be more effectively prevented from being sucked. Furthermore, when the compressed air hits the powdered or granular resin R, the powdered or granular resin R is raised up, so that the powdered or granular resin R located away from the first hole 61a is easily sucked in, and the powdered or granular resin R can be collected in a short time.

[0028] The powdered or granular resin R that has been sucked by the air pump 65 and discharged from the resin containing space 62 flows through the first hose 63 together with the air and is collected in the resin collection unit 66. After the powdered or granular resin R has been collected, the release film F is transferred together with the frame-shaped member 24a from the X-Y table 21 to the resin conveying mechanism 25. The control unit 5 returns the resin conveying mechanism 25 to a predetermined position M1, and then moves it from the +X direction to the -Y direction, causing the release film F to be collected in the film collection unit 67 (see FIG. 1).

[0029] In this way, the resin recovery mechanism 6 of this embodiment can automatically separate and recover the powdered or granular resin R and the release film F, even after the powdered or granular resin R has been supplied from the resin supply mechanism 26 onto the release film F of the resin containing section 24. This eliminates the need for manual separation of the powdered or granular resin R and the release film F, which was previously required, and allows for easy separation and recovery.

[0030] [Configuration of Resin Recovery Mechanism of Second Embodiment] Next, a specific configuration of the resin recovery mechanism 6 according to the second embodiment will be described with reference to Fig. 4. In this embodiment, the method of maintaining a constant pressure in the resin containing space 62 is different from that of the first embodiment. Other than that, the configuration is the same as that of the first embodiment. Therefore, in the description of this embodiment, parts having the same configuration as those in the first embodiment are denoted by the same reference numerals, and detailed description of the same configuration will be omitted.

[0031] In the resin recovery mechanism 6 of this embodiment, the plate-shaped member 61 has only the first hole 61a and does not have the second hole 61b. When recovering the powdered or granular resin R supplied onto the release film F, the plate-shaped member 61 covers the top of the resin accommodating section 24 including the frame-shaped member 24a so that a gap G is formed at the boundary between the plate-shaped member 61 and the frame-shaped member 24a. "Covering the top of the resin accommodating section 24 including the frame-shaped member 24a with the plate-shaped member 61" includes both the case where the plate-shaped member 61 and the frame-shaped member 24a are in contact with each other as in the first embodiment, and the case where a gap G is formed between the plate-shaped member 61 and the frame-shaped member 24a as in this embodiment. In this embodiment, when the plate-like member 61 is configured to cover the top of the resin containing section 24 including the frame-like member 24a with the gap G remaining, the resin containing space 62 is connected to the outside of the resin containing section 24 by the gap G, and the pressure (atmospheric pressure) in the resin containing space 62 is always equal to the pressure of the air outside the resin containing section 24, even if an air compressor is not used to supply air to the resin containing space 62 through the four second holes 61b. Therefore, even if the air pump 65 is used to suck out the air and powdered or granular resin R in the resin containing space 62, the pressure in the resin containing space 62 will not become negative.

[0032] 1 to 3 and 5, a method for manufacturing a molded substrate Sb (a resin molded product) using the resin molding apparatus 1 equipped with the resin recovery mechanism 6 according to the first embodiment will be described. The method for manufacturing the molded substrate Sb includes a resin supplying step of supplying a predetermined amount of powdered or granular resin R to a resin storage unit 24 including a release film F and a frame-shaped member 24a that holds the release film F, a determination step of determining whether the powdered or granular resin R supplied to the resin storage unit 24 is appropriate, a recovery step of suctioning and recovering the powdered or granular resin R supplied to the release film F if the determination step determines that the powdered or granular resin R is appropriate, and a molding step of positioning the release film F to which the powdered or granular resin R has been supplied and a pre-molded substrate Sa (a molding target) between an upper mold UM and a lower mold LM to perform resin molding if the determination step determines that the powdered or granular resin R is appropriate.

[0033] First, in the substrate supply module 4, the pre-molded substrate Sa is sent from the pre-molded substrate supply section 41 to the substrate placement section 43. Next, the substrate transport mechanism 44 is moved in the -Y direction from a predetermined position S1 to receive the pre-molded substrate Sa from the substrate placement section 43, and after receiving the substrate, the substrate transport mechanism 44 is returned to the predetermined position S1. Next, the substrate transport mechanism 44 is moved in the +X direction to a predetermined position P1 of the resin molding module 3 located in the center of the three resin molding modules 3, for example. Next, in the central resin molding module 3, the substrate transport mechanism 44 is moved in the -Y direction and stopped at a predetermined position C1 above the lower mold LM. Next, the substrate transport mechanism 44 is moved upward to fix the pre-molded substrate Sa to the upper mold UM. Thereafter, the substrate transport mechanism 44 is returned to the predetermined position S1 of the substrate supply module 4.

[0034] In parallel with the delivery of the pre-molded substrate Sa from the substrate supply module 4 to the resin molding module 3, a predetermined amount of powdered or granular resin is supplied onto the release film F in the resin supply module 2 (resin supply process). The specific operation is as follows: In the resin supply module 2, the release film F supplied from the release film supply mechanism 22 to the XY table 21 is cut to a predetermined size (step S51 in FIG. 5). Next, the resin conveying mechanism 25 is moved in the -Y direction from the predetermined position M1 to receive the frame-shaped member 24a cleaned by the cleaning mechanism 23. Next, the resin conveying mechanism 25 is moved in the -Y direction to place the frame-shaped member 24a on the release film F air-adsorbed to the XY table 21. As a result, the release film F is held by the frame-shaped member 24a, forming the resin storage section 24. After that, the resin conveying mechanism 25 is returned to the original position M1.

[0035] Next, the XY table 21 on which the resin accommodation unit 24 is placed is moved in the +X direction, and the resin accommodation unit 24 is stopped at a predetermined position below the resin supply mechanism 26. Next, the XY table 21 is moved in the X and Y directions, so that a predetermined amount of powdered or granular resin is supplied from the resin supply mechanism 26 onto the release film F located in the hollow portion inside the frame-shaped member 24a of the resin accommodation unit 24 (step S52). At this time, the weight of the powdered or granular resin R supplied to the resin accommodation unit 24 is measured by a weight sensor (not shown) (step S53). The weight sensor may be provided in the resin storage unit 26a of the resin supply mechanism 26 or in the XY table 21. The weight (supply amount) of the powdered or granular resin R supplied to the resin accommodation unit 24 is measured based on the weight decrease of the powdered or granular resin R when the weight sensor is provided in the resin storage unit 26a, or based on the weight increase of the powdered or granular resin R when the weight sensor is provided in the XY table 21. The measured weight data of the powdered or granular resin R is sent to the control unit 5 as needed.

[0036] The control unit 5 constantly determines whether the powdered or granular resin R supplied to the resin containing unit 24 is appropriate based on the weight data of the powdered or granular resin R sent from the weight sensor (determination step). When the weight of the powdered or granular resin R supplied to the resin containing unit 24 reaches a predetermined amount, the control unit 5 determines that the supplied powdered or granular resin R is appropriate (predetermined amount) and causes the resin supply mechanism 26 to stop supplying the powdered or granular resin R (No in step S54). Thereafter, the X-Y table 21, carrying the resin containing unit 24 with the predetermined amount of powdered or granular resin R supplied on the release film F, is returned to its original position.

[0037] Next, after releasing the suction of the release film F from the XY table 21, the release film F is sucked using a suction groove (not shown) provided in the frame-shaped member 24a, thereby holding the release film F to the frame-shaped member 24a. The resin conveying mechanism 25 is then moved in the -Y direction from the predetermined position M1 to receive the resin storage unit 24 placed on the XY table 21. The resin conveying mechanism 25 is then returned to its original position M1. The resin conveying mechanism 25 is then moved in the -X direction to a predetermined position P1 of the resin molding module 3 located in the center of the three resin molding modules 3. Next, in the resin molding module 3, the resin conveying mechanism 25 is moved in the -Y direction and stopped at a predetermined position C1 above the lower mold LM. The resin conveying mechanism 25 is then lowered to supply the powdered resin and the release film F to the lower mold cavity MC (step S55). The release film F, sucked by the suction mechanism (not shown), is then held face-down in the lower mold cavity MC. As a result, the powdered resin R on the release film F is supplied to the lower die cavity MC. Thereafter, the resin transport mechanism 25 on which the frame-shaped member 24a is placed is returned to the predetermined position M1.

[0038] Next, in the resin molding module 3, the mold clamping mechanism 35 moves the movable platen 34 upward (in the +Z direction) to clamp the upper mold UM and the lower mold LM together. In this clamped state, the lower mold LM is heated by the lower heater 36 and the upper mold UM is heated by the upper heater 37, melting and hardening the powdered resin R in the lower mold cavity MC. That is, with the pre-molded substrate Sa and the release film F containing the powdered resin R positioned between the upper mold UM and the lower mold LM, the mold clamping mechanism 35 clamps the molding die M, and resin molding seals the pre-molded substrate Sa and the chips and other components fixed to the pre-molded substrate Sa within the lower mold cavity MC, sealing them with the powdered resin R to form the molded substrate Sb (step S56). The mold clamping mechanism 35 then moves the movable platen 34 downward, opening the upper mold UM and the lower mold LM. Next, the substrate transport mechanism 44 is moved from the predetermined position S1 of the substrate supply module 4 to a predetermined position C1 on the lower mold LM, and the molded substrate Sb is received by the substrate transport mechanism 44. Next, the substrate transport mechanism 44 is moved to above the substrate placement unit 43 via the predetermined position S1, and the molded substrate Sb is delivered to the substrate placement unit 43. The substrate placement unit 43 stores the molded substrate Sb in the molded substrate storage unit 42.

[0039] As described above, while the resin supply mechanism 26 supplies the powdered resin R to the resin storage unit 24, a weight sensor (not shown) measures the weight of the supplied powdered resin R, and the measured weight data of the powdered resin R is sent to the control unit 5 as needed. The supply of the powdered resin R is stopped when the weight of the powdered resin R supplied to the resin storage unit 24 reaches a predetermined amount. The "predetermined amount" refers to the amount of resin that can properly seal the pre-molded substrate Sa without leaving any gaps or voids. The control unit 5 determines that the weight of the powdered resin R finally supplied to the resin storage unit 24 is appropriate if it is the predetermined amount. However, if the weight of the powdered resin R in the resin storage unit 24 exceeds the predetermined amount for some reason while the resin supply mechanism 26 has stopped supplying the powdered resin R, the powdered resin R cannot be used to seal the pre-molded substrate Sa. Therefore, the powdered resin R and the release film F must be discarded. In this case, the control unit 5 determines that the supplied powdered or granular resin R is not appropriate (Yes in step S54).

[0040] If the control unit 5 determines that the powdered or granular resin R supplied to the resin storage unit 24 is inappropriate, the control unit 5 activates the resin recovery mechanism 6 to recover the powdered or granular resin R. In response to a command from the control unit 5, the resin recovery mechanism 6 moves the plate-shaped member 61 using an actuator (not shown) or the like to place the plate-shaped member 61 so as to cover the top of the resin storage unit 24, including the frame-shaped member 24a. The control unit 5 then activates the air pump 65 and an air compressor (not shown) to cause the powdered or granular resin R in the resin storage unit 24 (resin storage space 62) to flow from the first hole 61a through the first hose 63 and be recovered in the resin recovery unit 66 (recovery step) (step S57). The release film F from which the powdered or granular resin R has been recovered is transferred together with the frame-shaped member 24a from the XY table 21 to the resin conveying mechanism 25. The control unit 5 returns the resin transport mechanism 25 to the predetermined position M1, and then moves it from the +X direction to the -Y direction, and causes the release film F to be collected by the film collecting unit 67 (step S58).

[0041] Other Embodiments Hereinafter, other embodiments of the first and second embodiments will be described. Note that, for ease of understanding, the same terms and symbols will be used for the same components as those in the above-described embodiments.

[0042] <1> In the first embodiment described above, the plate-shaped member 61 and the frame-shaped member 24a are tightly fitted together so that no gap G is formed at the boundary between them. However, as in the second embodiment, the plate-shaped member 61 may be disposed so that a gap G is formed at the boundary between the plate-shaped member 61 and the frame-shaped member 24a. With this configuration, the pressure in the resin accommodating space 62 is always equal to the pressure of the air outside the resin accommodating portion 24. Therefore, even if the amount of air sucked into the resin accommodating space 62 from the first holes 61a by the air pump 65 per unit time is not equal to the amount of air supplied to the resin accommodating space 62 from the four second holes 61b per unit time by the air compressor, the pressure (air pressure) in the resin accommodating space 62 can always be kept constant.

[0043] <2> In the first embodiment described above, the second hose 64 is connected to the second hole 61b to supply air to the resin accommodating space 62, but the second hole 61b may be configured to communicate with the outside air without connecting the second hose 64. By doing so, even if the plate-shaped member 61 and the frame-shaped member 24a are brought into close contact with each other so that no gap G is formed at the boundary between them, the pressure in the resin accommodating space 62 can always be equal to the pressure of the air outside the resin accommodating section 24.

[0044] <3> In each of the above-described embodiments, only one first hole 61 a is formed, but two or more first holes 61 a may be formed. The first holes 61 a can be formed in optimal locations depending on the distribution of the powdered or granular resin R on the release film F.

[0045] <4> In each of the above-described embodiments, the second holes 61b are formed near the four corners of the plate-like member 61, but they may be formed in other locations. Also, while four second holes 61b are formed around the first hole 61a, three or fewer, or five or more, may be formed. The second holes 61b can be formed in optimal locations and in an optimal number depending on the distribution of the powdered or granular resin R on the release film F.

[0046] <5> In each of the above-described embodiments, the resin recovery mechanism 6 is disposed adjacent to the resin supply mechanism 26. However, the resin recovery mechanism 6 may be disposed in any position where, if the powdered resin R supplied by the resin supply mechanism 26 is inappropriate, the resin recovery mechanism 6 can recover the powdered resin R without significantly moving the resin storage unit 24. For example, the plate-shaped member 61 of the resin recovery mechanism 6 may be disposed above the resin supply mechanism 26 (in the +Z direction) or above the movement path of the X-Y table 21. With this configuration, the plate-shaped member 61 can be lowered to easily cover the resin storage unit 24 disposed on the X-Y table 21. Furthermore, the film recovery unit 67 of the resin recovery mechanism 6 may be provided midway along the movement path of the X-Y table 21.

[0047] <6> In each of the above-described embodiments, the criterion used by the control unit 5 to determine whether the powdered or granular resin R is appropriate is whether the weight of the powdered or granular resin R supplied to the release film F is a predetermined amount. However, this is not limited to this. The criterion for determining whether the powdered or granular resin R is appropriate may be, for example, whether the flow velocity of the powdered or granular resin R when supplied from the resin supply mechanism 26 exceeds a threshold value. In this case, if the flow velocity of the powdered or granular resin R exceeds the threshold value, the control unit 5 determines that the powdered or granular resin R is inappropriate. Alternatively, the criterion may be whether the distribution of the powdered or granular resin R supplied on the release film F is uniform. In this case, if the distribution of the powdered or granular resin R supplied on the release film F is uneven, the control unit 5 determines that the powdered or granular resin R is inappropriate. The criterion for determining whether the powdered or granular resin R is appropriate is whether a good molded substrate Sb can be manufactured when the powdered or granular resin R supplied onto the release film F is used, and any criterion for this purpose can be adopted.

[0048] <7> In each of the above-described embodiments, the release film F after the powdered or granular resin R is collected is transported to the film collection section 67 by the resin transport mechanism 25, but this is not limited to this. Any other mechanism can be used. For example, after the powdered or granular resin R is collected, the release film F may be adsorbed onto the plate-like member 61 by the air pump 65 and transported to the film collection section 67, and the release film F may be collected in the film collection section 67.

[0049] <8> The pre-molded substrate Sa to be resin molded by the resin molding device 1 in the above-described embodiment is, for example, a semiconductor substrate (such as a silicon wafer), a metal substrate (such as a lead frame), a glass substrate, a ceramic substrate, a resin substrate, or a wiring substrate.

[0050] [Outline of the above embodiment] Hereinafter, an outline of the resin molding apparatus 1 and the method for manufacturing the resin molded product (Sb) described in the above embodiment will be described.

[0051] (1) The resin molding device (1) is characterized by the following configuration: a resin supply mechanism (26) that supplies powdered or granular resin (R) to a resin storage section (24) that includes a release film (F) and a frame-shaped member (24a) that is placed on the release film (F); a resin molding mechanism (3) that has a molding die (M) consisting of an upper die (UM) and a lower die (LM) that faces the upper die (UM) and that performs resin molding by placing the release film (F) that has been supplied with the powdered or granular resin (R) between the upper die (UM) and the lower die (LM); and a resin recovery mechanism (6) that can suck and recover the powdered or granular resin (R) that has been supplied to the resin storage section (24) before the release film (F) is placed in the molding die (M).

[0052] The resin molding apparatus (1) according to this characteristic configuration has a resin recovery mechanism (6), so that the powdered or granular resin (R) supplied onto the release film (F) in the resin storage section (24) can be separated from the release film (F) and recovered. As a result, only the release film (F) remains in the resin storage section (24), so that only the release film (F) can be recovered. Therefore, it has been possible to provide a resin molding apparatus (1) that can automatically separate and recover the powdered or granular resin (R) and the release film (F).

[0053] (2) In the resin molding device (1) described in (1) above, the resin recovery mechanism (6) may include a plate-like member (61) that covers the upper part of the resin storage section (24) including the frame-like member (24a) and forms a resin storage space (62) between the release film (F) and the frame-like member (24a), a recovery path (63) that has one end connected to a first hole (61a) formed in the plate-like member (61) and the other end connected to a suction source (65), and a recovery section (66) that is connected to the other end of the recovery path (63).

[0054] With this configuration, the top of the resin storage section (24) is covered with the plate-like member (61) to form a resin storage space (62), and by operating the suction source (65), the powdered or granular resin (R) supplied to the resin storage section (24) can be sucked in and collected from the first hole (61a) through the collection path (63) to the collection section (66).

[0055] (3) In the resin molding device (1) described in (2) above, the plate-like member (61) may have a second hole (61b) that connects the resin storage space (62) to the outside of the resin storage space (62) and can supply gas.

[0056] Gas (air) is sucked in together with the powdered or granular resin (R) through the first hole (61a). With this configuration, by supplying gas to the resin containing space (62) through the second hole (61b), it is possible to prevent a decrease in the gas in the resin containing space (62). As a result, it is possible to prevent problems such as the release film (F) floating up or leakage of the powdered or granular resin (R).

[0057] (4) In the resin molding device (1) described in (3) above, the plate-like member (61) may have a plurality of second holes (61b), and the plurality of second holes (61b) may be arranged around the first hole (61a).

[0058] When the suction source (65) sucks the resin in the resin storage space (62), a suction force also acts on the release film (F). However, with this configuration, since the multiple second holes (61b) are arranged around the first hole (61a), even if a suction force acts on the release film (F), the gas supplied to the resin storage space (62) from the multiple second holes (61b) arranged around the first hole (61a) can press down on the area of ​​the release film (F) where the suction force acts, thereby effectively preventing the release film (F) from being sucked in by the suction force. Furthermore, when the gas hits the powdered or granular resin (R), the powdered or granular resin (R) is stirred up, making it easier to suck in the powdered or granular resin (R) around the first hole (61a), and allowing the powdered or granular resin (R) to be collected in a short time.

[0059] (5) In the resin molding device (1) described in (3) or (4) above, the plate-like member (61) may contact the frame-like member (24a) and cover the upper part of the resin containing section (24).

[0060] Since gas (air) is sucked through the first hole (61 a) together with the powdered or granular resin (R), if the plate-like member (61) is in contact with the frame-like member (24 a) and covers the upper part of the resin containing section (24), the resin containing space (62) will be under negative pressure unless gas is supplied to the resin containing space (62) through the second hole (61 b). However, with this configuration, by supplying gas to the resin containing space (62) through the second hole (61 b), for example, by making the amount of gas in the resin containing space (62) sucked through the first hole (61 a) by the suction source (65) per unit time equal to the amount of gas supplied to the resin containing space (62) per unit time through the second hole (61 b), the powdered or granular resin (R) can be recovered while maintaining a constant pressure (atmospheric pressure) within the resin containing space (62).

[0061] (6) In the resin molding device (1) described in any one of (2) to (4) above, the plate-shaped member (61) may cover the upper part of the resin storage section (24) with a gap (G) between it and the frame-shaped member (24a).

[0062] With this configuration, the gas pressure in the resin containing space (62) can be always equalized to the air pressure outside the resin containing section (24). As a result, the powdered or granular resin (R) around the first hole (61a) is easily sucked in, and the powdered or granular resin (R) can be collected in a short time.

[0063] (7) The manufacturing method of the resin molded product (Sb) is characterized in that it includes a resin supplying step of supplying a predetermined amount of powdered or granular resin (R) to a resin storage section (24) including a release film (F) and a frame-shaped member (24a) arranged on the release film (F); a determination step of determining whether the powdered or granular resin (R) supplied to the resin storage section (24) is appropriate; a recovery step of suctioning and recovering the powdered or granular resin (R) supplied to the resin storage section (24) if it is determined in the determination step that the powdered or granular resin (R) is not appropriate; and a molding step of arranging the release film (F) to which the powdered or granular resin (R) has been supplied and a molding object (Sa) between an upper mold (UM) and a lower mold (LM) to perform resin molding if it is determined in the determination step that the powdered or granular resin (R) is appropriate.

[0064] The method for manufacturing a resin molded product (Sb) according to this feature includes a determination step for determining whether the powdered or granular resin (R) supplied to the resin storage section (24) in the resin supply step is appropriate. Therefore, only the powdered or granular resin (R) determined to be appropriate in the determination step can be placed between the upper mold (UM) and the lower mold (LM) for resin molding. Furthermore, if the powdered or granular resin (R) is determined to be inappropriate in the determination step, the powdered or granular resin (R) supplied to the resin storage section (24) is separated from the release film (F) and collected in the collection step, so that the powdered or granular resin (R) and the release film (F) can be automatically separated and collected.

[0065] (8) In the manufacturing method of the resin molded product (Sb) described in (7) above, the judgment process may judge that the powdered resin (R) is inappropriate if the supply amount of the powdered resin (R) exceeds a predetermined amount, if the flow rate of the powdered resin (R) exceeds a threshold value, or if the distribution of the powdered resin (R) is uneven.

[0066] With this feature, it is possible to reliably recover the powdered or granular resin (R) that may not be able to be used to produce a non-defective product in the molding process.

[0067] The present disclosure can be used in a resin molding apparatus and a method for manufacturing a resin molded product.

[0068] 1: Resin molding device 3: Resin molding module (resin molding mechanism) 6: Resin recovery mechanism 24: Resin storage section 24a: Frame-shaped member 26: Resin supply mechanism 61: Plate-shaped member 61a: First hole 61b: Second hole 62: Resin storage space 63: First hose (recovery path) 65: Air pump (suction source) 66: Resin recovery section (recovery section) F: Release film G: Gap LM: Lower mold M: Molding mold R: Powdered resin Sa: Pre-molded substrate (molded object) Sb: Molded substrate (resin molded product) UM: Upper mold

Claims

1. A resin molding device comprising: a resin supplying mechanism which supplies powdered or granular resin to a resin storage section which includes a release film and a frame-shaped member which is placed on the release film; a resin molding mechanism which has a molding die consisting of an upper die and a lower die opposed to the upper die and which performs resin molding by placing the release film to which the powdered or granular resin has been supplied between the upper die and the lower die; and a resin recovery mechanism which is capable of sucking and recovering the powdered or granular resin supplied to the resin storage section before the release film is placed on the molding die.

2. The resin molding apparatus described in claim 1, wherein the resin recovery mechanism includes a plate-shaped member that covers an upper portion of the resin storage section including the frame-shaped member and forms a resin storage space between the release film and the frame-shaped member, a recovery path having one end connected to a first hole formed in the plate-shaped member and the other end connected to a suction source, and a recovery section connected to the other end of the recovery path.

3. A resin molding apparatus according to claim 2, wherein said plate-like member has a second hole that communicates said resin containing space with the outside of said resin containing space and allows gas to be supplied therethrough.

4. The resin molding apparatus according to claim 3, wherein the plate-like member has a plurality of the second holes, and the plurality of second holes are arranged around the first hole.

5. A resin molding apparatus according to claim 3 or 4, wherein the plate-like member contacts the frame-like member and covers an upper portion of the resin containing portion.

6. A resin molding apparatus according to any one of claims 2 to 4, wherein the plate-like member covers an upper portion of the resin containing section with a gap between the plate-like member and the frame-like member.

7. A method for manufacturing a resin molded product, comprising: a resin supplying step of supplying a predetermined amount of powdered or granular resin to a resin storage section including a release film and a frame-shaped member arranged on the release film; a determination step of determining whether the powdered or granular resin supplied to the resin storage section is proper or not; a recovery step of suctioning and recovering the powdered or granular resin supplied to the resin storage section when it is determined in the determination step that the powdered or granular resin is not proper; and a molding step of placing the release film to which the powdered or granular resin has been supplied and an object to be molded between an upper mold and a lower mold to perform resin molding when it is determined in the determination step that the powdered or granular resin is proper.

8. A method for manufacturing a resin molded product as described in claim 7, wherein the judgment process judges that the powdered or granular resin is not suitable when the supply amount of the powdered or granular resin exceeds the predetermined amount, when the flow rate of the powdered or granular resin exceeds a threshold value, or when the distribution of the powdered or granular resin is uneven.

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