Plate polishing and grinding device and plate polishing and grinding method

Abstract

The present application relates to a plate polishing and grinding device and a plate polishing and grinding method. The plate polishing and grinding device comprises: a conveying assembly, which has a conveying plane for conveying plates; a polishing and grinding assembly, which is arranged on an upper side of the conveying assembly and comprises a grinding head unit capable of swinging in a first direction and a second direction; and a measurement assembly, which is located at a plate feeding end of the conveying assembly and is used for measuring the dimensions of an outer edge contour of a circumferential outer side of a plate, wherein a plurality of grinding-head back swinging turning points are arranged on the outer edge contour of the plate, and a polishing and grinding trajectory is planned and formed on the basis of the plurality of grinding-head back swinging turning points; and the grinding head unit swings along the polishing and grinding trajectory, so as to polish and grind the plate.

Description

Plate polishing device and plate polishing method Technical Field

[0001] The present application relates to the technical field of plate polishing, and in particular to a plate polishing device and a plate polishing method. Background Art

[0002] In the existing technology, surface polishing of stone, rock slabs, ceramic slabs, metal plates, glass and other plates is an important link in the processing process. The surface of the plate is continuously polished by a polishing grinding head to make the surface of the plate reach a certain glossiness.

[0003] Existing plate polishing equipment uses multiple polishing heads to swing in unison. However, due to the often irregular edge profiles of plates and the varying widths of each plate during polishing, existing plate polishing equipment features a plate edge profile sensor located in front of the feeder. Upon detecting the plate edge, the grinding heads raise to avoid contact with the conveyor belt. The grinding heads then continue to swing outward until they reach the outermost edge of the plate, then turn around and swing back. Once they reach the plate edge, the grinding heads lower to continue polishing.

[0004] As you can see, to prevent the grinding head from grinding against the conveyor belt, it raises. However, while it's raised, the grinding head continues to rotate without contacting the sheet material, wasting energy by idling and doing useless work. Furthermore, untimely raising and lowering the grinding head and the resulting impact can result in poor polishing of the sheet material's edges, leading to yellowing and dark shadows.

[0005] Summary of the Invention

[0006] In order to overcome at least one of the defects of the above-mentioned prior art, according to one aspect of the present application, a plate polishing device is provided to effectively prevent the grinding head unit from idling and doing useless work, thereby improving efficiency and reducing energy consumption.

[0007] A plate polishing device comprises: a conveying component having a conveying plane for conveying plates; a polishing component arranged on the upper side of the conveying component, the polishing component comprising a grinding head unit that can swing along a first direction and a second direction; wherein, within the conveying plane, the first direction is the conveying direction of the conveying component, and the second direction is a direction perpendicular to the conveying direction of the conveying component; a detection component, which is located at the plate feeding end of the conveying component and is used to detect the outer edge contour size of the circumferential outer side of the plate; wherein, a plurality of grinding head swing-back inflection points are arranged on the outer edge contour of the plate, and a polishing track is formed according to the planning of the plurality of grinding head swing-back inflection points, and the grinding head unit swings along the polishing track to polish the plate.

[0008] Optionally, the grinding head unit can be raised and lowered along a third direction, wherein the third direction is the height direction of the conveying component; the detection component is also used to detect the inner edge contour size of the hole on the plate; wherein, the grinding head lifting point and the grinding head lowering point are determined on the inner edge contour of the plate, and a lifting trajectory with avoidance holes is formed according to the grinding head lifting point and the grinding head lowering point, and the grinding head unit is raised and lowered along the lifting trajectory, and the lifting trajectory is formed within the polishing trajectory.

[0009] Optionally, multiple inflection points for the grinding head to swing back are planned at intervals on the outer edge contours on both sides of the plate in the second direction; wherein, on the outer edge contour on one side, in the first direction, multiple inflection points for the grinding head to swing back are marked as the i-th in sequence, where i = {1, 2, ..., n}, n represents the corresponding number and n is a natural number greater than 1; on the outer edge contour on the other side, in the first direction, multiple inflection points for the grinding head to swing back are marked as the r-th in sequence, r = {1, 2, ..., n}, n represents the corresponding number and n is a natural number greater than 1; multiple inflection points for the grinding head to swing back are moved according to the path planning of the i = 1, r = 1, r = 2, i = 2, i = 3, r = 3, ..., i = n or r = m to form the polishing trajectory.

[0010] Optionally, the i-th inflection point of the grinding head swinging back and the r-th inflection point of the grinding head swinging back are aligned along the second direction, where i=r.

[0011] Optionally, the polishing trajectory between the i-th inflection point of the grinding head's swing back and the r-th inflection point of the grinding head's swing back is a first polishing path, where i=r; wherein, the first polishing path passes through the inner edge contour of the hole on the plate to set the grinding head lifting point and the grinding head lowering point.

[0012] Optionally, it also includes a frame, and the polishing assembly also includes: a first guide rail, which is connected to the frame; a first beam, which is slidably connected to the first guide rail; a fixed seat, which is slidably connected to the first beam, and the grinding head unit is arranged on the fixed seat; a first direction swing drive unit, which is used to drive the fixed seat to move in a first direction relative to the first beam; and a second direction swing drive unit, which is used to drive the first beam to move in a second direction relative to the first guide rail.

[0013] Optionally, the first direction swing drive unit is connected to the fixed seat, and the second direction swing drive unit is connected to the first beam; a straight rack is fixed on the first guide rail, and the first beam is slidably arranged on the first guide rail, and the driving end of the second direction swing drive unit is provided with a gear meshing with the straight rack; the driving end of the first direction swing drive unit is provided with a rotating disk, the rotating disk is eccentric and rotatably connected to a connecting rod, and the end of the connecting rod away from the rotating disk is rotatably connected to the first beam.

[0014] Optionally, the polishing assembly also includes: a third-directional lifting drive unit, which is connected to the fixed seat, and the lifting end of the third-directional lifting drive unit is provided with a main shaft, and the main shaft is connected to the grinding head unit; a grinding head rotation drive unit, which is connected to the fixed seat, and the driving end of the grinding head rotation drive unit is connected to a rotating shaft sleeve through a conveyor belt, and the rotating shaft sleeve is outer-mounted on the main shaft, and one of the main shaft and the rotating shaft sleeve is provided with a guide key and the other is provided with a guide groove.

[0015] According to another aspect of the present application, a plate polishing method is provided, which is applied to the above-mentioned plate polishing device, comprising the following steps:

[0016] Obtaining the outer edge contour position data of the plate, and calculating the outer edge contour size data of the plate using the outer edge contour position data of the plate;

[0017] Based on the outer edge profile size data of the plate and the conveying speed data, determine the turning point of the grinding head's swing back;

[0018] Plan the polishing trajectory based on the turning point of the grinding head's swing back;

[0019] The grinding head unit is driven to swing along the polishing track to perform adaptive edge contour polishing.

[0020] Optionally, the plate polishing method further includes the following steps:

[0021] Obtaining the inner edge contour position data of the plate, and calculating the inner edge contour size data of the plate using the inner edge contour position data of the plate;

[0022] Determining the grinding head raising point and the grinding head lowering point based on the inner edge profile dimension data and the conveying speed data of the plate;

[0023] Planning the lifting trajectory based on the grinding head lifting point and the grinding head lowering point;

[0024] The grinding head unit is driven to move up and down along the lifting track.

[0025] In summary, the plate polishing device and plate polishing method provided by this application have the following technical effects:

[0026] In view of the problems of the existing plate polishing devices such as the grinding head idling and doing useless work and resulting in poor plate edge polishing effect, the plate polishing device of this embodiment improves the polishing structure. The detection component therein detects the corresponding outer edge contour dimensions of plates of different shapes in real time, and determines multiple grinding head swing back inflection points on the corresponding outer edge contours. Then, a preset algorithm is used to plan and form corresponding polishing trajectories, so that the polishing swing amplitude of the grinding head unit is adaptive to the outer edge contour of the plate. Adaptive polishing is performed according to the different shapes of plates, avoiding the situation where the grinding head unit idles and does useless work, improving efficiency and reducing energy consumption. At the same time, the adaptive polishing of plates of different shapes can improve the surface polishing quality of the plates, especially the edge polishing effect, and prevent the problems of yellow edges and dark shadows at the edges of the plates. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIG1 is a schematic diagram of a plate polishing track of an existing plate polishing equipment;

[0028] FIG2 is a schematic structural diagram of a plate polishing device according to an embodiment of the present application;

[0029] FIG3 is a schematic diagram of the structure of a conveying assembly conveying a plate in a plate polishing device according to an embodiment of the present application;

[0030] FIG4 is a schematic structural diagram of a polishing path for a plate having holes in a plate polishing device according to an embodiment of the present application;

[0031] FIG5 is a schematic structural diagram of the polishing path of a plate without holes in the plate polishing device according to an embodiment of the present application;

[0032] FIG6 is another structural schematic diagram of the plate polishing device according to an embodiment of the present application;

[0033] FIG7 is a partial enlarged view of point A in FIG6;

[0034] FIG8 is a schematic structural diagram of a polishing assembly in a plate polishing device according to an embodiment of the present application;

[0035] FIG9 is another structural schematic diagram of the polishing assembly in the plate polishing device according to an embodiment of the present application;

[0036] FIG10 is another structural schematic diagram of the polishing assembly in the plate polishing device according to an embodiment of the present application;

[0037] FIG11 is another structural schematic diagram of the polishing assembly in the plate polishing device according to an embodiment of the present application;

[0038] Figures: 1-frame, 11-first guide rail, 2-conveyor assembly, 21-conveyor belt, 3-polishing assembly, 31-grinding head unit, 32-first guide rail, 321-spur rack, 322-gear, 33-first beam, 34-fixed seat, 35-first direction swing drive unit, 36-second direction swing drive unit, 37-rotating disk, 371-connecting rod, 38-third direction lifting drive unit, 381-spindle, 382-rotating sleeve, 39-grinding head rotation drive unit, 391-conveyor belt, 4-detection assembly, 5-grinding head swing back inflection point, 61-grinding head lifting point, 62-grinding head lowering point, 7-plate, 71-outer edge contour position, 72-inner edge contour position, 73-polishing track, 731-first polishing path, 732-second polishing path, 74-lifting track. DETAILED DESCRIPTION

[0039] For better understanding and implementation, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0040] In the description of this application, it should be noted that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limiting this application.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0042] In the existing technology, surface polishing of stone, rock slabs, ceramic slabs, metal plates, glass and other plates is an important link in the processing process. The surface of the plate is continuously polished by a polishing grinding head to make the surface of the plate reach a certain glossiness.

[0043] Existing plate polishing equipment uses multiple polishing grinding heads to swing in unison to polish the plates. However, since the edge profile of the plate is usually irregular, and the width of each plate during polishing is also different. In existing plate polishing equipment, there is a plate edge profile detection sensor in front of the brick feeding direction. When the edge profile of the plate is detected, the grinding head will rise to avoid it (i.e., it will rise at line B2) to prevent the grinding head from grinding against the conveyor belt (see Figure 1, which is a schematic diagram of the plate polishing trajectory of the existing plate polishing equipment); then, the grinding head continues to swing outward (i.e., in the direction of arrow B) until the plate swings to the outermost edge, then turns around and swings back (i.e., reaches line B1 and swings back), returns to the edge profile position of the plate, and the grinding head descends to continue polishing.

[0044] As you can see, to prevent the grinding head from grinding against the conveyor belt, it rises. However, while raised, the grinding head continues to rotate but doesn't make contact with the sheet material, effectively wasting energy by idling (i.e., the grinding head is idle in the area between B1 and B2 in the diagram). Furthermore, untimely raising and lowering the grinding head and the resulting impact can result in poor polishing of the sheet material's edges, leading to yellowing and dark shadows.

[0045] 2 to 11 , the present application discloses a plate polishing device and a plate polishing method for polishing an irregular plate 7 using the plate polishing device.

[0046] Example 1 Structure of a plate polishing device

[0047] 2 to 11 , this embodiment discloses a plate polishing device that can be specifically applied to plates 7 with irregular contours and can adaptively connect and polish. The polishing objects include, but are not limited to, stone, rock, ceramic, metal, glass, and other plates 7. The specific structure is as follows:

[0048] The plate polishing device includes a conveying component 2, a polishing component 3 and a detection component 4.

[0049] Among them, the conveying component 2 has a conveying plane for conveying the plate 7; the polishing component 3 is arranged on the upper side of the conveying component 2, and the polishing component 3 includes a grinding head unit 31 that can swing along a first direction and a second direction; wherein, within the conveying plane, the first direction is the conveying direction of the conveying component 2, and the second direction is a direction perpendicular to the conveying direction of the conveying component 2; the detection component 4 is located at the plate feeding end of the conveying component 2, and is used to detect the outer contour size of the plate 7.

[0050] Among them, multiple grinding head swing back inflection points 5 are set on the outer edge contour of the plate 7, and a polishing track 73 is planned according to the multiple grinding head swing back inflection points 5. The grinding head unit 31 swings along the polishing track 73 to polish the plate 7.

[0051] It should be noted that the first direction is the X direction in FIG. 2 , and the second direction is the Y direction in FIG. 2 .

[0052] In view of the problem that the existing plate polishing device has the problem that the grinding head rotates idle and does useless work, and causes poor polishing effect on the edge of the plate 7, the plate polishing device of this embodiment improves the polishing structure. The detection component 4 will detect the corresponding outer edge contour dimensions of the plates 7 of different shapes in real time, and determine multiple grinding head swing back inflection points 5 on the corresponding outer edge contours, and then form corresponding polishing trajectories 73 through preset algorithm planning, so that the polishing swing amplitude of the grinding head unit 31 is adaptive to the outer edge contour of the plate 7, and adaptive polishing is performed according to the plates 7 of different shapes, avoiding the situation where the grinding head unit 31 rotates idle and does useless work, thereby improving efficiency and reducing energy consumption.

[0053] At the same time, the adaptive polishing of the plates 7 of different shapes can improve the surface polishing quality of the plates 7, especially the edge polishing effect, and prevent the problems of yellow edges and dark shadows at the edges of the plates.

[0054] Among them, preferably, as for how to determine the inflection point 5 for the grinding head to swing back on the outer edge contour of the plate 7, the outer edge contour size of the plate 7 can be detected by the detection component 4, and the conveying speed of the plate 7 can be detected by the speed sensor. Then, according to the outer edge contour size and the conveying speed, the inflection point 5 for the grinding head to swing back can be automatically calculated by the computer preset algorithm software, and then multiple inflection points 5 for the grinding head to swing back are connected in sequence to form a polishing track 73, which can be referred to Figures 4 and 5.

[0055] Referring to Figures 9-11 , the grinding head unit 31 can optionally be raised and lowered along a third direction, which corresponds to the height of the conveyor assembly 2 . The detection assembly 4 is further configured to detect the inner edge profile dimensions of the hole in the plate 7 . A grinding head elevation point 61 and a grinding head descending point 62 are determined on the inner edge profile of the plate 7 . These elevation points 61 and 62 form a lifting trajectory 74 that avoids the hole. The grinding head unit 31 is raised and lowered along this trajectory 74 , which is formed within the polishing trajectory 73 . In the illustrated embodiment, the third direction is the Z direction.

[0056] In view of the fact that some existing plates 7 have holes, in order to prevent the grinding head unit 31 from contacting the conveyor belt 21 of the conveying assembly 2 when passing through the holes in the plates 7, the grinding head unit 31 needs to rise when reaching the edge of the hole, and then descend to continue grinding after passing through the hole. Therefore, the grinding head unit 31 can be raised and lowered along the third direction to avoid the holes, so as to more appropriately grind the plates 7.

[0057] At the same time, the lifting trajectory 74 is planned within the polishing trajectory 73, and the lifting trajectory 74 of the lifting point of the grinding head unit 31 can be combined with the polishing trajectory 73 of the grinding head unit 31, which can effectively plan the polishing trajectory 73 with the highest polishing efficiency to improve the polishing efficiency; at the same time, it can also avoid holes to prevent the grinding head unit 31 from contacting the conveyor belt 21.

[0058] It should be noted that there are two types of plate materials 7 available today: one type is a plate material 7 without holes, and the outer edge dimensions of the plate material 7 detected by the detection assembly 4 are currently the outer edge dimensions; the other type is a plate material 7 with holes, and the outer and inner edge dimensions of the plate material 7 detected by the detection assembly 4 are currently the outer and inner edge dimensions. Therefore, the plate polishing device is applicable to at least two different types of irregular plate materials 7.

[0059] Specifically, when it is necessary to polish a plate 7 without holes, please refer to Figure 6. The plate polishing device can calculate multiple grinding head swing back inflection points 5 based on the outer edge contour size and conveying speed of the plate 7 of the detection component 4 through the computer preset algorithm software, plan the polishing trajectory 73, and issue instructions to drive the grinding head unit 31 to swing along the polishing trajectory 73.

[0060] More specifically, when it is necessary to polish a plate 7 with holes, please refer to Figure 7. The plate polishing device can calculate the grinding head's swing-back inflection point 5, the grinding head's rising point 61, and the grinding head's lowering point 62 according to the outer edge contour size, inner edge contour size, and conveying speed of the plate 7 of the detection component 4 through a computer's preset algorithm software, plan a polishing trajectory 73 and a lifting trajectory 74, and issue instructions to control and drive the grinding head unit 31 to swing along the polishing trajectory 73 and to rise and fall along the lifting trajectory 74.

[0061] It should also be noted that, referring to Figures 4 and 5, the inflection point 5 of the grinding head's swing back refers to the turning point where the grinding head unit 31 polishes the surface of the plate 7 and moves to the outer contour of the circumferential outer side of the plate 7. The rotation angle of the turning point can be close to 90° or other suitable angles, which needs to be determined according to the actual outer contour of the plate 7; the grinding head lifting point 61 and the grinding head lowering point 62 refer to the rising or falling of the grinding head unit 31 when it polishes the surface of the plate 7 and moves to the inner contour of the hole in the plate 7. The lifting height can be set according to actual conditions.

[0062] 4 and 5 , optionally, a plurality of grinding head swing-back inflection points 5 are planned at intervals on the outer edge contours of the plate 7 on both sides opposite to each other along the second direction.

[0063] Among them, on the outer edge contour on one side, in the first direction, multiple grinding head swing back inflection points 5 are marked as the i-th in sequence, where i = {1, 2, ..., n}, n represents the corresponding number and n is a natural number greater than 1; on the outer edge contour on the other side, in the first direction, multiple grinding head swing back inflection points 5 are marked as the r-th in sequence, r = {1, 2, ..., n}, n represents the corresponding number and n is a natural number greater than 1; multiple grinding head swing back inflection points 5 move according to the path planning of i = 1, r = 1, r = 2, i = 2, i = 3, r = 3, ..., i = n or r = m to form a polishing trajectory 73. In this way, the specific position of the inflection point 5 of the grinding head's swing back is located on the outer edge contours of the opposite sides of the plate 7 along the second direction. At the same time, multiple inflection points 5 of the grinding head's swing back will be connected in a certain logical order to plan and form a polishing track 73, wherein the logical order is: first connect with the inflection point 5 of the grinding head's swing back on the opposite side, then connect with the inflection point 5 of the grinding head's swing back on the same side, and then connect with the inflection point 5 of the grinding head's swing back on the opposite side, that is, first connect with the opposite side and then connect with the same side to plan and form the polishing track 73. Therefore, a wave-like polishing track 73 can be formed, which can well cover the surface of the plate 7 to be ground, so as to improve the polishing efficiency.

[0064] Referring to Figures 4 and 5 , the i-th grinding head swing-back inflection point 5 and the r-th grinding head swing-back inflection point 5 are optionally aligned along the second direction, where i = r. Thus, the first grinding head swing-back inflection point 5 is aligned with the first grinding head swing-back inflection point 5 , the second grinding head swing-back inflection point 5 is aligned with the second grinding head swing-back inflection point 5 , and the third grinding head swing-back inflection point 5 is aligned with the third grinding head swing-back inflection point 5 . Therefore, the alignment of the two grinding head swing-back inflection points 5 on opposite sides effectively simplifies the determination of the positions of the grinding head swing-back inflection points 5 on the outer edge contour, thereby improving the efficiency of determining the grinding head swing-back inflection points 5 .

[0065] At the same time, it should be noted that the polishing track 73 of the grinding head unit 31 on the surface of the plate 7 will form an approximately square wave shape, see Figures 4 and 5, which can further fully polish the surface of the plate 7 and improve the polishing efficiency.

[0066] It should be noted that, in order to facilitate understanding of the determination of the position of the inflection point 5 of the grinding head swinging back and the polishing trajectory 73, the outer edge contours of the plate 7 on both sides along the second direction are exemplified as the upper and lower outer edge contours.

[0067] Among them, the polishing trajectory 73 specifically includes a first polishing path 731 and a second polishing path 732. A plurality of grinding head swing-back inflection points 5 are arranged at intervals on the upper and lower outer edge contours of the plate 7 along the second direction. The plurality of grinding head swing-back inflection points 5 of the upper and lower outer edge contours are aligned up and down in pairs to form the first polishing path 731. The two grinding head swing-back inflection points 5 of the same outer contour form the second polishing path 732, and the second polishing path 732 is arranged one above and one below and in sequence along the first direction between the two adjacent first polishing paths 731.

[0068] After the detection component 4 obtains the outline dimensions of the plate 7, the computer's preset algorithm software will determine multiple grinding head swing-back inflection points 5 based on the above-mentioned determination method. The multiple grinding head swing-back inflection points 5 will be connected by two grinding head swing-back inflection points 5 aligned with the upper and lower edge contours to form a first polishing path 731, and two adjacent grinding head swing-back inflection points 5 with the same edge contour will be connected to form a second polishing path 732. The second polishing path 732 is sequentially arranged between the two adjacent first polishing paths 731, one above and one below, to form a polishing path that approximates a square wave shape. Of course, in other embodiments, the spacing between the grinding head swing-back inflection points 5 with the same edge contour can also be different, and the spacing size can be planned according to the actual size of the plate 7.

[0069] It should be noted that the same spacing between the inflection points 5 of the grinding heads swinging back for the same edge profile means that the two adjacent first polishing paths 731 are the same.

[0070] Referring to Figures 4 and 5 , the polishing path 73 between the i-th grinding head swing-back inflection point 5 and the r-th grinding head swing-back inflection point 5 optionally constitutes a first polishing path 731, where i = r. The first polishing path 731 passes through the inner edge contour of the hole in the plate 7, where the grinding head raising point 61 and the grinding head lowering point 62 are located. This allows the raising and lowering trajectory 74 of the raising and lowering points of the grinding head unit 31 to be specifically integrated into the first polishing path 731 of the polishing path 73, effectively designing the polishing path 73 with the highest polishing efficiency, thereby improving polishing efficiency. Furthermore, the holes can be avoided, preventing the grinding head unit 31 from contacting the conveyor belt 21.

[0071] 6 to 11 , optionally, the plate polishing device further includes a frame 1 .

[0072] The polishing assembly 3 further includes a first guide rail 11 , a first beam 33 , a fixing seat 34 , a first direction swing driving unit 35 , and a second direction swing driving unit 36 ​​.

[0073] Among them, the first guide rail 11 is connected to the frame 1, the first beam 33 is slidably connected to the first guide rail 11, the fixed seat 34 is slidably connected to the first beam 33, and the grinding head unit 31 is arranged on the fixed seat 34, the first direction swing drive unit 35 is used to drive the fixed seat 34 to move along the first direction relative to the first beam 33, and the second direction swing drive unit 36 ​​is used to drive the first beam 33 to move along the second direction relative to the first guide rail 11.

[0074] In view of the fact that the grinding head unit 31 can swing along the first direction and the second direction to polish the plate 7, the specific implementation structure in this embodiment can be: a first guide rail 11 is set on the frame 1, a first beam 33 is set on the first guide rail 11, a fixed seat 34 is set on the first beam 33, and a grinding head unit 31 is set on the fixed seat 34, and the first beam 33 is driven to move along the second direction by the second direction swinging driving unit 36. At this moment, the first beam 33, the fixed seat 34 and the grinding head unit 31 will all move along the second direction.

[0075] At the same time, the first direction swing driving unit 35 drives the fixed seat 34 to move along the first direction. At this moment, both the fixed seat 34 and the grinding head unit 31 will move along the first direction, so that the grinding head unit 31 can move along the first direction and the second direction, and polish the plate 7 according to the polishing trajectory 73.

[0076] In some other embodiments, the first direction swing drive unit 35 may be a linear motion module, such as a synchronous belt linear module, a ball screw linear module, a linear motor module or a telescopic cylinder, to drive the grinding head unit 31 to move linearly along the first direction.

[0077] In some other embodiments, the second direction swing drive unit 36 ​​may be a linear motion module, such as a synchronous belt linear module, a ball screw linear module, a linear motor module or a telescopic cylinder, to drive the grinding head unit 31 to move linearly along the second direction.

[0078] Referring to Figures 6 to 11, optionally, the first direction swing drive unit 35 is connected to the fixed seat 34, and the second direction swing drive unit 36 ​​is connected to the first beam 33; a straight rack 321 is fixed on the first guide rail 11, and the first beam 33 is slidably arranged on the first guide rail 11, and the driving end of the second direction swing drive unit 36 ​​is provided with a gear 322 engaged with the straight rack 321; the driving end of the first direction swing drive unit 35 is provided with a rotating disk 37, the rotating disk 37 is eccentric and rotatably connected to a connecting rod 371, and the end of the connecting rod 371 away from the rotating disk 37 is rotatably connected to the first beam 33.

[0079] In view of the fact that the first direction swing drive unit 35 and the second direction swing drive unit 36 ​​can drive the grinding head unit 31 to move along the first direction and the second direction, the specific implementation structure in this embodiment may be that the spur rack 321 is fixed on the first guide rail 11, the second direction swing drive unit 36 ​​is arranged on the first beam body 33, and the driving end of the second direction swing drive unit 36 ​​is provided with a gear 322, the second direction swing drive unit 36 ​​drives the gear 322 to rotate, and the gear 322 and the spur rack 321 are engaged. Since the spur rack 321 is fixed on the first guide rail 11, the spur rack 321 is fixed, so the gear 322 will move along the second direction on the spur rack 321, thereby driving the second direction swing drive unit 36, the first beam body 33, the fixed seat 34, the first direction swing drive unit 35 and the grinding head unit 31 to move along the second direction.

[0080] Furthermore, the driving end of the first-direction swing drive unit 35 is provided with a rotating disk 37. One end of a connecting rod 371 is eccentrically mounted on the rotating disk 37, and the other end of the connecting rod 371 is connected to the first beam 33. Therefore, when the first-direction swing drive unit 35 drives the rotating disk 37 to rotate, the position of the connecting rod 371 itself changes, thereby changing the relative spacing between the first-direction swing drive unit 35 and the first beam 33 in the first direction, thereby driving the fixed base 34 and the grinding head unit 31 to move in the first direction. This arrangement enables the grinding head unit 31 to move in both the first and second directions, polishing the plate 7 along the polishing trajectory 73, while also making the structure more compact.

[0081] Optionally, the first direction swing driving unit 35 and the second direction swing driving unit 36 ​​may be servo motors.

[0082] Referring to Figures 6 to 11, optionally, the polishing assembly 3 also includes: a third-directional lifting drive unit 38, which is connected to the fixed seat 34, and the lifting end of the third-directional lifting drive unit 38 is provided with a main shaft 381, and the main shaft 381 is connected to the grinding head unit 31; a grinding head rotation drive unit 39, which is connected to the fixed seat 34, and the driving end of the grinding head rotation drive unit 39 is connected to a rotating shaft sleeve 382 through a conveyor belt 391, and the rotating shaft sleeve 382 is arranged on the outer surface of the main shaft 381, and one of the main shaft 381 and the rotating shaft sleeve 382 is provided with a guide key and the other is provided with a guide groove.

[0083] Specifically, the inner wall of the rotating sleeve 382 defines an axial guide groove. The axis of the main shaft 381 is parallel to the axis of the rotating sleeve 382. A guide key is provided on the main shaft 381 to mate with the guide groove and is slidably embedded within the guide groove. In the illustrated embodiment, the inner wall of the rotating sleeve 382 axially extends in the third direction, i.e., the Z direction. Furthermore, a rotating bearing is provided between the lifting end of the third-direction lifting drive unit 38 and the main shaft 381. A rotating bearing is also provided between the rotating sleeve 382 and the fixed base 34.

[0084] In view of the fact that the grinding head unit 31 can realize the polishing of the plate 7 by rotating itself and can also be raised and lowered along the third direction, the specific implementation structure in this embodiment can be that the grinding head rotation drive unit 39 drives the rotating sleeve 382 to rotate through the conveyor belt 391, the rotating sleeve 382 drives the main shaft 381 to rotate through the guide key, and the main shaft 381 drives the grinding head unit 31 to rotate, so as to realize the polishing of the plate 7.

[0085] At the same time, when the grinding head unit 31 needs to be raised or lowered to avoid the hole, the third-directional lifting drive unit 38 is extended or retracted to drive the main shaft 381 to extend or retract, and the main shaft 381 drives the grinding head unit 31 to be raised or lowered. Since the guide key can slide axially in the guide groove, it can be raised or lowered without affecting the rotation of the grinding head unit 31, so as to realize the rotation and lifting of the grinding head unit 31 itself; at the same time, the structure is compact and occupies a small area.

[0086] Optionally, the third direction lifting drive unit 38 can be a linear motion module, such as a synchronous belt linear module, a ball screw linear module, a linear motor module or a telescopic cylinder, to drive the grinding head unit 31 to move linearly along the third direction.

[0087] Optionally, the grinding head rotation drive unit 39 may be a servo motor.

[0088] Optionally, pulleys are provided on the grinding head rotation drive unit 39 and the third direction lifting drive unit 38 at locations in contact with the conveyor belt 391 .

[0089] In some other embodiments, the grinding head unit 31 can also realize the rotation and lifting of the grinding head unit 31 itself through a polishing grinding head driving device with patent number CN202210736268.6.

[0090] In some other embodiments, the grinding head unit 31 can also be set on the frame 1 via an XYZ mobile platform. The XYZ mobile platform, also known as a three-coordinate high-precision mobile platform, is a platform that can achieve precise movement in the X, Y, and Z directions. The XYZ platform mainly includes an X-axis moving part, a Y-axis moving part, and a Z-axis moving part. This is a prior art and will not be described in detail.

[0091] Referring to FIG6 , a plurality of polishing assemblies 33 may be optionally provided, with the plurality of polishing assemblies 33 being sequentially spaced apart along the first direction on the upper side of the conveyor assembly 2 . In this manner, the grinding head unit 31 in each polishing assembly 33 can swing in the first and second directions and rise and fall in the third direction. Each grinding head unit 31 is independently controlled to sequentially polish the plate 7 multiple times, thereby improving the polishing effect of the plate 7 . Furthermore, adjacent plates 7 can be transported without a gap, achieving continuous polishing of the plates 7 and improving production efficiency.

[0092] Preferably, the detection component 4 can be a detection tool for obtaining the contour dimensions of the irregular plate 7, for example, a detection tool equipped with an image sensor related to image vision, such as a camera based on a CCD (Charge-coupled Device) chip or a camera based on a CMOS (Complementary Metal Oxide Semiconductor); or a detection tool that uses laser or ultrasonic waves to detect the contour dimensions of the irregular plate 7, such as a profilometer that can measure the contour of the object using the laser detection principle. Such a detection tool can obtain the edge contour position data of the plate 7, and through the calculation of the detection tool's built-in program, obtain the edge contour dimension data of the plate 7, providing a basis for subsequent polishing and grinding.

[0093] Moreover, given that the contour of the plate 7 detected by the detection component 4 specifically includes an outer contour and an inner contour, the above-mentioned detection tool can specifically obtain the outer edge contour position 71 data and the inner edge contour position 72 data of the plate 7, and obtain the outer edge contour size data and the inner edge contour size data of the plate 7 through calculations in the built-in program of the detection tool to provide a basis for subsequent polishing movements.

[0094] Preferably, the conveying assembly 2 includes a conveying belt 21, a driving shaft, a driven shaft, and a conveying drive member. The driving shaft and the driven shaft are respectively arranged on both sides of the frame 1 along the first direction, and the axes of the driving shaft and the driven shaft are perpendicular to the first direction of the frame 1. The conveying belt 21 is sleeved outside the driving shaft and the driven shaft. The conveying drive member is arranged on one side of the frame 1, and the output end of the conveying drive member is connected to the driving shaft. Through this arrangement, the conveying drive member drives the driving shaft to rotate, and through the cooperation of the driving shaft, the driven shaft and the conveying belt 21, the conveying belt 21 is driven to rotate, thereby conveying the plate 7. Further preferably, the conveying drive member is a servo motor.

[0095] Example 2 A plate polishing method

[0096] This embodiment discloses a plate polishing method, which can be specifically applied to a plate 7 with an irregular profile for adaptive connection polishing. The plate polishing device of embodiment 1 can be used to polish the plate 7. The specific steps are as follows:

[0097] S10: Obtaining the outer edge contour position data 71 of the plate 7, and calculating the outer edge contour size data of the plate 7 using the outer edge contour position data 71 of the plate 7;

[0098] S11: Based on the outer edge profile dimension data of the plate 7 and the conveying speed data, determining the turning point 5 for the grinding head to swing back;

[0099] S12: planning the polishing trajectory 73 based on the turning point 5 of the grinding head swinging back;

[0100] S13: driving the grinding head unit 31 to swing along the polishing track 73 to perform adaptive edge contour polishing.

[0101] In view of the problem that the existing plate polishing device has the problem of the grinding head idling and doing useless work and causing poor edge polishing effect of the plate 7, the plate polishing method of this embodiment obtains the outer edge contour position 71 data of the plate 7 of different shapes, calculates the outer edge contour size data of the plate 7 of different shapes, and determines multiple grinding head swing back inflection points 5 on the corresponding outer edge contours, and then plans to form the corresponding polishing trajectories 73, so that the polishing swing amplitude of the grinding head unit 31 is adaptive to the outer edge contour of the plate 7 of different shapes. Adaptive polishing can be performed according to the different shapes of the plate 7, avoiding the situation where the grinding head unit 31 idles and does useless work, improving efficiency and reducing energy consumption. At the same time, the adaptive polishing of the plates 7 of different shapes can improve the surface polishing quality of the plate 7, especially the edge polishing effect, and prevent the problems of yellow edges and dark shadows at the edge of the plate 7.

[0102] Example 3: A plate polishing method

[0103] This embodiment discloses a plate polishing method, which can be specifically applied to adaptively connected polishing of plates 7 with irregular contours. The plate polishing device of Example 1 can be used to polish the plate 7. At the same time, given that some existing plates 7 have holes, in order to prevent the grinding head unit 31 from contacting the conveyor belt 21 of the conveyor assembly 2 when passing through the hole in the plate 7, the grinding head unit 31 needs to rise when it reaches the edge of the hole, and then descend to continue polishing after passing through the hole. Therefore, the specific steps are as follows:

[0104] S20: Obtaining the outer edge contour position data 71 of the plate 7, and calculating the outer edge contour size data of the plate 7 using the outer edge contour position data 71 of the plate 7;

[0105] S21: Acquire the inner edge contour position data 72 of the plate 7, and calculate the inner edge contour size data of the plate 7 using the inner edge contour position data 72 of the plate 7;

[0106] S22: Determine the turning point 5 for the grinding head to swing back based on the outer edge profile dimension data of the plate 7 and the conveying speed data;

[0107] S23: planning the polishing trajectory 73 based on the turning point 5 of the grinding head swinging back;

[0108] S24: Determine the grinding head raising point 61 and the grinding head lowering point 62 based on the inner edge profile dimension data and the conveying speed data of the plate 7;

[0109] S25: planning a lifting trajectory 74 based on the grinding head lifting point 61 and the grinding head lowering point 62;

[0110] S26: driving the grinding head unit 31 to swing along the polishing track 73 and driving the grinding head unit 31 to rise and fall along the lifting track 74 to perform adaptive edge contour polishing.

[0111] In this way, the grinding head unit 31 can be prevented from contacting the conveyor belt 21 of the conveying assembly 2 through the hole in the plate 7. The grinding head unit 31 needs to rise when it reaches the edge of the hole, and then descend to continue polishing after passing through the hole. Therefore, the grinding head unit 31 can be lifted and lowered along the third direction to avoid the hole, so as to polish the plate 7 more appropriately; at the same time, the lifting trajectory 74 is planned in the polishing trajectory 73, and the lifting trajectory 74 of the lifting point of the grinding head unit 31 can be combined with the polishing trajectory 73 of the grinding head unit 31, which can effectively plan the polishing trajectory 73 with the highest polishing efficiency to improve the polishing efficiency; at the same time, it can also avoid the hole and prevent the grinding head unit 31 from contacting the conveyor belt 21.

[0112] Optionally, the specific steps of the plate polishing method are to first plan the polishing trajectory 73 in S23, and then in step S24, determine the grinding head lifting point 61 and the grinding head lowering point 62 based on the inner edge contour size data of the plate 7, the conveying speed data and the polishing trajectory 73.

[0113] Example 4: A plate polishing method

[0114] This embodiment discloses a plate polishing method, which can be specifically applied to adaptively connect and polish plates 7 with irregular contours. The plate polishing device of Example 1 can be used to polish the plate 7. At the same time, in order to enable the grinding head unit 31 to move along three axes, namely, the first direction, the second direction, and the third direction, so as to achieve adaptive polishing of plates 7 with different shapes, the specific implementation steps are as follows:

[0115] S30: Using the detection component 4 to obtain the outer edge contour position 71 data of the plate 7, and using the outer edge contour position 71 data of the plate 7, using the built-in program of the detection component 4 to calculate the outer edge contour size data of the plate 7;

[0116] S31: using the detection component 4 to obtain the inner edge contour position 72 data of the plate 7, and using the inner edge contour position 72 data of the plate 7, using the built-in program of the detection component 4 to calculate the inner edge contour size data of the plate 7;

[0117] S32: Determine the turning point 5 for the grinding head to swing back based on the outer edge profile dimension data of the plate 7 and the conveying speed data;

[0118] S33: Based on the turning point 5 of the grinding head swinging back, a preset algorithm is used to plan the polishing trajectory 73;

[0119] S34: Determine the grinding head raising point 61 and the grinding head lowering point 62 based on the inner edge profile dimension data and the conveying speed data of the plate 7;

[0120] S35: Based on the grinding head raising point 61 and the grinding head lowering point 62, a preset algorithm is used to plan the raising and lowering trajectory 74;

[0121] S36: Use the first direction swing drive unit 35 and the second direction swing drive unit 36 ​​to drive the grinding head unit 31 to swing along the polishing track 73, and use the third direction lifting drive unit 38 to drive the grinding head unit 31 to rise and fall along the lifting track 74 to perform adaptive edge contour polishing.

[0122] The technical means disclosed in the present application are not limited to those disclosed in the above-mentioned embodiments, but also include technical solutions composed of any combination of the above-mentioned technical features. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of the present application, and such improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A plate polishing device, comprising: A conveying assembly (2) having a conveying plane for conveying a plate (7); A polishing assembly (3) is arranged on the upper side of the conveying assembly (2), and the polishing assembly (3) comprises a grinding head unit (31) which can swing along a first direction and a second direction; wherein, within the conveying plane, the first direction is the conveying direction of the conveying assembly (2), and the second direction is a direction perpendicular to the conveying direction of the conveying assembly (2); A detection component (4), which is located at the plate (7) feeding end of the conveying component (2) and is used to detect the outer edge contour size of the circumferential outer side of the plate (7); A plurality of grinding head swing-back inflection points (5) are arranged on the outer edge profile of the plate (7), and a polishing track (73) is formed according to the planning of the plurality of grinding head swing-back inflection points (5), and the grinding head unit (31) swings along the polishing track (73) to polish the plate (7).

2. A plate polishing device according to claim 1, wherein: The grinding head unit (31) can be raised and lowered along a third direction, wherein the third direction is the height direction of the conveying component (2); the detection component (4) is also used to detect the inner edge contour size of the hole on the plate (7); A grinding head lifting point (61) and a grinding head lowering point (62) are determined on the inner edge contour of the plate (7), and a lifting track (74) with avoidance holes is formed according to the grinding head lifting point (61) and the grinding head lowering point (62). The grinding head unit (31) is lifted and lowered along the lifting track (74), and the lifting track (74) is formed within the polishing track (73).

3. A plate polishing device according to claim 2, wherein a plurality of grinding head swing back inflection points (5) are arranged at intervals on the outer edge contours of the plate (7) on both sides opposite to each other along the second direction; in, On the outer edge contour of one side, in the first direction, a plurality of turning points (5) of the grinding head swinging back are marked as i-th in sequence, where i={1, 2, ..., n}, n represents the corresponding number and n is a natural number greater than 1; On the outer edge contour of the other side, in the first direction, a plurality of turning points (5) of the grinding head swinging back are marked as rth in sequence, where r={1, 2, ..., n}, and n represents the corresponding number and is a natural number greater than 1; The multiple grinding heads swing back at the inflection points (5) according to the path planning of the i=1th, r=1th, r=2th, i=2th, i=3th, r=3th, ..., i=nth or r=mth to form the polishing trajectory (73).

4. According to the plate polishing device of claim 3, the i-th grinding head swing-back inflection point (5) and the r-th grinding head swing-back inflection point (5) are aligned along the second direction, wherein i=r.

5. A plate polishing device according to claim 3, wherein: The polishing track (73) between the i-th turning point (5) of the grinding head swinging back and the r-th turning point (5) of the grinding head swinging back is the first polishing path (731), wherein i=r; Wherein, the first polishing path (731) passes through the inner edge contour of the hole on the plate (7) to set the grinding head raising point (61) and the grinding head lowering point (62).

6. A plate polishing device according to any one of claims 1 to 5, further comprising a frame (1), and the polishing assembly (3) further comprising: A first guide rail (32) connected to the frame (1); A first beam body (33) slidably connected to the first guide rail (32); A fixed seat (34) which is slidably connected to the first beam body (33), and the grinding head unit (31) is arranged on the fixed seat (34); A first direction swing driving unit (35) used for driving the fixing seat (34) to move along a first direction relative to the first beam body (33); A second direction swing driving unit (36) is used to drive the first beam (33) to move along a second direction relative to the first guide rail (32).

7. A plate polishing device according to claim 6, wherein: The first direction swing driving unit (35) is connected to the fixing seat (34), and the second direction swing driving unit (36) is connected to the first beam body (33); A spur rack (321) is fixed on the first guide rail (32), the first beam (33) is slidably arranged on the first guide rail (32), and a gear (322) meshing with the spur rack (321) is provided at the driving end of the second direction swing driving unit (36); A rotating disk (37) is provided at the driving end of the first-direction swing driving unit (35); the rotating disk (37) is eccentric and rotatably connected to a connecting rod (371); an end of the connecting rod (371) away from the rotating disk (37) is rotatably connected to the first beam body (33).

8. A plate polishing device according to claim 6, wherein: The polishing assembly (3) further comprises: A third-direction lifting drive unit (38), which is connected to the fixed seat (34); a lifting end of the third-direction lifting drive unit (38) is provided with a main shaft (381), and the main shaft (381) is connected to the grinding head unit (31); The grinding head rotation driving unit (39) is connected to the fixed seat (34), and the driving end of the grinding head rotation driving unit (39) is connected to a rotating sleeve (382) through a conveyor belt (391), and the rotating sleeve (382) is disposed on the main A shaft (381), wherein one of the main shaft (381) and the rotating sleeve (382) is provided with a guide key and the other is provided with a guide groove.

9. A plate polishing method, applied to a plate polishing device according to any one of claims 1 to 8, comprising the following steps: Obtaining data on the outer edge contour position (71) of the plate (7), and using the data on the outer edge contour position (71) of the plate (7) to calculate and obtain data on the outer edge contour size of the plate (7); Based on the outer edge profile dimension data of the plate (7) and the conveying speed data, the turning point (5) of the grinding head swinging back is determined; The polishing trajectory (73) is planned based on the turning point (5) of the grinding head swinging back; The grinding head unit (31) is driven to swing along the polishing track (73) to perform adaptive edge profile polishing.

10. The plate polishing method according to claim 9 further comprises the following steps: Obtaining data on the inner edge contour position (72) of the plate (7), and using the data on the inner edge contour position (72) of the plate (7) to calculate and obtain data on the inner edge contour size of the plate (7); Determining the grinding head raising point (61) and the grinding head lowering point (62) based on the inner edge profile dimension data and the conveying speed data of the plate (7); Planning a lifting trajectory (74) based on the grinding head lifting point (61) and the grinding head lowering point (62); The grinding head unit (31) is driven to move up and down along the lifting track (74).

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