Electronic component and substrate with built-in electronic component

Abstract

[Problem] To provide an electronic component suitable for being built in a substrate for use. [Solution] An electronic component 10 includes a magnetic element body 20 and a metal frame 30 embedded in the magnetic element body 20. The metal frame 30 includes: sections 31 and 32 which are substantially parallel to each other; a section 33 which connects one end of the section 31 and one end of the section 32; a section 34 which is connected to the other end of the section 31 and at least a part of which is exposed from a main surface 21 of the magnetic element body 20; and a section 35 which is connected to the other end of the section 32 and at least a part of which is exposed from a main surface 22 of the magnetic element body 20.

Description

Electronic components and electronic component embedded boards

[0001] The present disclosure relates to an electronic component, and more particularly to an electronic component having a structure in which a coil is embedded in a magnetic body, and also to an electronic component-embedded substrate that incorporates such an electronic component.

[0002] Patent Document 1 discloses an inductor having a structure in which a conductor formed by bending a metal plate is embedded in an element body.

[0003] Japanese Patent Application Laid-Open No. 2022-151206

[0004] The inductor disclosed in Patent Document 1 is a surface-mount electronic component.

[0005] In this disclosure, electronic components suitable for use within a substrate are described.

[0006] An electronic component according to one aspect of the present disclosure comprises a magnetic body having a first main surface and a second main surface located opposite the first main surface, and a first metal frame embedded in the magnetic body, the first metal frame including a first section and a second section that are opposite and substantially parallel to each other, a third section that connects one end of the first section to one end of the second section, a fourth section that is connected to the other end of the first section and at least a portion of which is exposed from the first main surface, and a fifth section that is connected to the other end of the second section and at least a portion of which is exposed from the second main surface.

[0007] According to the present disclosure, an electronic component suitable for use within a substrate is provided.

[0008] FIGS. 1A and 1B are schematic perspective views showing the appearance of an electronic component 10 according to a first embodiment of the technology disclosed herein, viewed from different directions. FIGS. 1C and 1D are schematic see-through perspective views of the electronic component 10, viewed from different directions. FIG. 2 is a schematic perspective view illustrating the structure of a metal frame 30. FIG. 3 is a schematic cross-sectional view of an electronic component-embedded substrate 100 incorporating an electronic component 10. FIG. 4A is a schematic see-through perspective view showing the appearance of an electronic component 10A according to a second embodiment of the technology disclosed herein. FIG. 4B is a schematic see-through top view of the electronic component 10A. FIG. 5A is a schematic see-through perspective view showing the appearance of an electronic component 10B according to a third embodiment of the technology disclosed herein. FIG. 5B is a schematic see-through top view of the electronic component 10B. FIG. 6 is a schematic diagram illustrating the direction of a magnetic field generated by the electronic component 10B. FIG. 7( a) is a schematic see-through perspective view showing the appearance of an electronic component 10C according to a fourth embodiment of the technology disclosed herein. FIG. 7( b) is a schematic see-through top view of the electronic component 10C. FIG. 8 is a schematic perspective view illustrating the structure of a metal frame 301 according to a first modified example. FIG. 9( a) is a schematic perspective view illustrating the structure of a metal frame 302 according to a second modified example. FIG. 9( b) is a schematic perspective view illustrating a modified example of the metal frame 302. FIG. 10( a) is a schematic perspective view illustrating the structure of a metal frame 303 according to a third modified example. FIG. 10( b) is a schematic perspective view illustrating a modified example of the metal frame 303. FIG. 11( a) is a schematic perspective view illustrating the structure of a metal frame 304 according to a fourth modified example. FIG. 11( b) is a schematic perspective view illustrating a modified example of the metal frame 304. FIG. 12( a) is a schematic perspective view illustrating the structure of a metal frame 305 according to a fifth modified example. FIG. 12( b) is a schematic perspective view illustrating a modified example of the metal frame 305. Fig. 13(a) is a schematic perspective view illustrating the structure of a metal frame 306 according to a sixth modified example. Fig. 13(b) is a schematic perspective view illustrating a modified example of the metal frame 306. Fig. 14(a) is a schematic perspective view illustrating the structure of a metal frame 307 according to a seventh modified example. Fig. 14(b) is a schematic perspective view illustrating a modified example of the metal frame 307.FIG. 15( a) is a schematic perspective view illustrating the structure of a metal frame 308 according to an eighth modified example. FIG. 15( b) is a schematic perspective view illustrating a modified example of the metal frame 308. FIG. 16 is a schematic perspective view illustrating the structure of a metal frame 309 according to a ninth modified example. FIG. 17 is a schematic perspective view illustrating the structure of a metal frame 310 according to a tenth modified example. FIG. 18 is a schematic perspective view illustrating the structure of a metal frame 311 according to an eleventh modified example. FIG. 19 is a schematic perspective view illustrating the structure of a metal frame 312 according to a twelfth modified example. FIG. 20 is a schematic perspective view illustrating the structure of a metal frame 313 according to a thirteenth modified example. FIG. 21 is a schematic perspective view illustrating the structure of a metal frame 314 according to a fourteenth modified example. FIG. 22 is a schematic perspective view illustrating the structure of a metal frame 315 according to a fifteenth modified example. FIG. 23 is a schematic perspective view illustrating the structure of a metal frame 316 according to a sixteenth modified example.

[0009] Hereinafter, embodiments of the technology according to the present disclosure will be described in detail with reference to the accompanying drawings.

[0010] 1( a) and 1(b) are schematic perspective views showing the appearance of an electronic component 10 according to a first embodiment of the technology disclosed herein, viewed from different directions. Also, FIGS. 1(c) and 1(d) are schematic perspective perspective views of the electronic component 10, viewed from different directions. For ease of explanation, FIG. 1 illustrates tentative X-, Y-, and Z-axes. Hereinafter, the direction indicated by the arrow on each axis will be referred to as the + (plus) direction, and the opposite direction as the - (minus) direction (the same applies to the other drawings). In the present disclosure, the Z direction may be referred to as the first direction, the X direction as the second direction, and the Y direction as the third direction.

[0011] 1(a) to 1(d) includes a magnetic body 20 and a metal frame 30 embedded in the magnetic body 20. The magnetic body 20 may be made of a composite magnetic material in which a magnetic filler made of a high-permeability material such as ferrite or permalloy is solidified with a resin binder. The magnetic body 20 has main surfaces 21 and 22 that form an XY plane and are located opposite each other, side surfaces 23 and 24 that form a YZ plane and are located opposite each other, and side surfaces 25 and 26 that form an XZ plane and are located opposite each other.

[0012] The metal frame 30 is a member made of metal (e.g., copper (Cu)) and functions as a coil conductor. The metal frame 30 may be made, for example, by punching a flat metal plate and then bending it. In this case, the thickness of the metal frame 30 may be approximately constant throughout. The metal frame 30 may also be an integral metal member without any joints or the like. In this way, using the metal frame 30 as the coil conductor reduces DC resistance compared to when a coil conductor made of a plating film or the like is used. Therefore, the electronic component 10 according to this embodiment can be suitably used, for example, as an inductor for a power supply circuit.

[0013] FIG. 2 is a schematic perspective view for explaining the structure of the metal frame 30. As shown in FIG.

[0014] The metal frame 30 shown in FIG. 2 includes flat plate-like sections 31 and 32 that extend in the XY direction (with the Z direction being the thickness direction) and are generally parallel to each other, a flat plate-like section 33 that connects the end of section 31 in the +X direction with the end of section 32 in the +X direction and extends in the YZ direction (with the X direction being the thickness direction), a section 34 connected to the end of section 31 in the −X direction, and a section 35 connected to the end of section 32 in the −X direction. Sections 31 and 32 need only overlap in the Z direction and do not need to be strictly parallel. Furthermore, section 33 does not need to be strictly perpendicular to sections 31 and 32; it may have a certain degree of inclination (for example, approximately ±20° from the perpendicular).

[0015] As shown in FIGS. 1( c) and 1(d), the region of the magnetic body 20 sandwiched in the Z direction by sections 31 and 32 constitutes an inner diameter region 27 of the coil conductor. The coil axis of the coil conductor made of the metal frame 30 is in the Y direction and passes through the inner diameter region 27. Section 31 is located closer to the main surface 22 than the inner diameter region 27. An XY plane, which is a part of section 31, may be exposed from the main surface 22, as illustrated in FIG. 1(a). Section 32 is located closer to the main surface 21 than the inner diameter region 27. An XY plane, which is a part of section 32, may be exposed from the main surface 21, as illustrated in FIG. 1(b). It is not essential that parts of sections 31 and 32 are exposed from the magnetic body 20. However, by exposing parts of sections 31 and 32 from the magnetic body 20, it becomes possible, for example, to efficiently dissipate heat generated by a current flowing through the metal frame 30. In contrast, section 33 may be entirely embedded in magnetic body 20. In this case, section 33 is not exposed from the surface of magnetic body 20. Note that, from the viewpoint of improving heat dissipation, at least a portion of section 33 may be exposed from magnetic body 20. In this case, the dimension of electronic component 10 in the X direction is reduced. Furthermore, metal frame 30 may be configured so as not to be exposed from side surfaces 23 to 26.

[0016] Section 34 includes a terminal portion 341 extending in the XY direction (with the Z direction being the thickness direction) and at least a portion of which is exposed from main surface 21, and a connecting portion 342 extending in the YZ direction (with the X direction being the thickness direction) and connecting terminal portion 341 to the end of section 31 in the -X direction. The connecting portion 342 extends in the -Z direction from section 31 toward terminal portion 341. Terminal portion 341 also extends in the -X direction from the boundary with connecting portion 342. In other words, section 31 and terminal portion 341 are located on opposite sides of each other in the X direction with respect to connecting portion 342. The connecting portion 342 does not need to be strictly perpendicular to terminal portion 341 and section 31, and may have a certain degree of inclination. As shown in FIG. 1B , an XY plane, which is a portion of terminal portion 341, is exposed from main surface 21 of the magnetic base body 20. The surface of the terminal portion 341 exposed from the main surface 21 of the magnetic body 20 constitutes one terminal electrode of the coil conductor. The surface of the terminal portion 341 exposed from the main surface 21 of the magnetic body 20 and the surface of the section 32 exposed from the main surface 21 of the magnetic body 20 may form the same plane.

[0017] Section 35 includes a terminal portion 351 extending in the XY direction (with the Z direction being the thickness direction) and at least a portion of which is exposed from main surface 22, and a connecting portion 352 extending in the YZ direction (with the X direction being the thickness direction) and connecting terminal portion 351 to the end of section 32 in the −X direction. The connecting portion 352 extends in the +Z direction from section 32 toward terminal portion 351. Terminal portion 351 also extends in the −X direction from the boundary with connecting portion 352. In other words, section 32 and terminal portion 351 are located on opposite sides of each other in the X direction with respect to connecting portion 352. The connecting portion 352 does not need to be strictly perpendicular to terminal portion 351 and section 32, and may have a certain degree of inclination. As shown in FIG. 1A , an XY plane, which is a portion of terminal portion 351, is exposed from main surface 22 of the magnetic base body 20. The surface of the terminal portion 351 exposed from the main surface 22 of the magnetic body 20 constitutes the other terminal electrode of the coil conductor. The surface of the terminal portion 351 exposed from the main surface 22 of the magnetic body 20 and the surface of the section 31 exposed from the main surface 22 of the magnetic body 20 may form the same plane.

[0018] The terminal portion 341 exposed from the main surface 21 of the magnetic body 20 and the terminal portion 351 exposed from the main surface 22 of the magnetic body 20 are positioned at different positions in the Y direction. As a result, the terminal portion 341 and the terminal portion 351 do not overlap in a plan view seen from the Z direction. The terminal portion 341 and the terminal portion 351 may be positioned at the same position in the X direction. As another modification, the terminal portion 341 and the terminal portion 351 may be formed so that they partially overlap in a plan view seen from the Z direction. In this case, for example, at least a portion of the terminal portion 341 may be expanded in the +Y direction, and at least a portion of the terminal portion 351 may be expanded in the -Y direction.

[0019] The connecting portion 342 of section 34 and the connecting portion 352 of section 35 are arranged in the Y direction. The connecting portions 342 and 352 may be arranged such that the YZ surface of the connecting portion 342 facing the section 33 and the YZ surface of the connecting portion 352 facing the section 33 are aligned in the same plane. The connecting portions 342 and 352 may be arranged such that the YZ surface of the connecting portion 342 opposite the surface facing the section 33 and the YZ surface of the connecting portion 352 opposite the surface facing the section 33 are aligned in the same plane. The inner diameter region 27 of the magnetic body 20 is sandwiched in the X direction by the section 33 and the connecting portions 342, 352. In other words, the inner diameter region 27 of the magnetic body 20 is surrounded in the X and Z directions by the metal frame 30 whose axial direction is the Y direction.

[0020] With this configuration, the metal frame 30 embedded in the magnetic body 20 forms a coil conductor that wraps around for approximately one turn. A terminal portion 341 that forms one end of the coil conductor is exposed from one main surface 21 of the magnetic body 20, and a terminal portion 351 that forms the other end of the coil conductor is exposed from the other main surface 22 of the magnetic body 20. This makes it possible to connect the coil conductor in the electronic component 10 from both sides in the Z direction (the opposing main surfaces 21 and 22 of the magnetic body 20), unlike surface-mounted electronic components. This makes the electronic component 10 easy to use, for example, by being embedded in a substrate.

[0021] Terminal portion 341 is bent outward (toward the −X direction) from connection portion 342, and terminal portion 351 is bent outward (toward the −X direction) from connection portion 352, so that the distance between terminal portion 341 exposed from main surface 21 and section 32 is ensured, and the distance between terminal portion 351 exposed from main surface 22 and section 31 is also ensured. This makes it possible to further improve the short-circuit resistance between terminal portion 341 and section 32 and between terminal portion 351 and section 31.

[0022] FIG. 3 is a schematic cross-sectional view of an electronic component built-in substrate 100 incorporating an electronic component 10 according to this embodiment.

[0023] The electronic component-embedded substrate 100 of the example shown in FIG. 3 includes a core layer 110 having a through hole 113, an insulating resin layer 121 provided on one main surface 111 of the core layer 110, and an insulating resin layer 122 provided on the other main surface 112 of the core layer 110. The core layer 110 is a high-strength insulating layer made of a core material such as glass cloth impregnated with a resin material. In contrast, the insulating resin layers 121 and 122 are insulating layers made of a resin material that does not contain a core material such as glass cloth, and are highly flexible. The electronic component 10 according to this embodiment is housed in the through hole 113 of the core layer 110 such that the main surface 21 and terminal portions 341 of the magnetic body 20 are covered with the insulating resin layer 121, and the main surface 22 and terminal portions 351 of the magnetic body 20 are covered with the insulating resin layer 122.

[0024] Conductor layers L1 and L2 are formed on the front and back of insulating resin layer 121. Conductor layer L1 is exposed on one surface of electronic component-embedded substrate 100, and a portion of it is covered with solder resist 131. Of conductor patterns 141 to 144 located on conductor layer L1, the portions not covered with solder resist 131 form external terminals. Furthermore, conductor pattern 141 located on conductor layer L1 is connected to terminal portion 341 of electronic component 10 through via conductor 151 that penetrates insulating resin layer 121.

[0025] The conductor layer L2 is located between the insulating resin layer 121 and the core layer 110. In the example shown in Fig. 3, the conductor layer L2 includes conductor patterns 162 and 164. The conductor pattern 142 located on the conductor layer L1 is connected to the conductor pattern 162 located on the conductor layer L2 through a via conductor 152 that penetrates the insulating resin layer 121. Furthermore, the conductor pattern 144 located on the conductor layer L1 is connected to the conductor pattern 164 located on the conductor layer L2 through a via conductor 154 that penetrates the insulating resin layer 121.

[0026] Conductor layers L3 and L4 are formed on the front and back of insulating resin layer 122. Conductor layer L4 is exposed on the other surface of electronic component-embedded substrate 100, and a portion of it is covered with solder resist 132. Of conductor patterns 171 to 174 located on conductor layer L4, the portions not covered with solder resist 132 form external terminals. Furthermore, conductor pattern 174 located on conductor layer L4 is connected to terminal portion 351 of electronic component 10 through via conductor 184 that penetrates insulating resin layer 122.

[0027] The conductor layer L3 is located between the insulating resin layer 122 and the core layer 110. In the example shown in Fig. 3, the conductor layer L3 includes conductor patterns 191 and 193. The conductor pattern 171 located on the conductor layer L4 is connected to the conductor pattern 191 located on the conductor layer L3 through a via conductor 181 that penetrates the insulating resin layer 122. Furthermore, the conductor pattern 173 located on the conductor layer L4 is connected to the conductor pattern 193 located on the conductor layer L3 through a via conductor 183 that penetrates the insulating resin layer 122.

[0028] Furthermore, the core layer 110 may be provided with a plurality of through-hole conductors, including through-hole conductors TH1 and TH2. These through-hole conductors all penetrate the core layer 110 and interconnect the conductor pattern located on the conductor layer L2 and the conductor pattern located on the conductor layer L3. In the example shown in Fig. 3, the conductor pattern 162 located on the conductor layer L2 and the conductor pattern 191 located on the conductor layer L3 are connected via the through-hole conductor TH1. The conductor pattern 164 located on the conductor layer L2 and the conductor pattern 193 located on the conductor layer L3 are connected via the through-hole conductor TH2.

[0029] 3, insulating resin layer 121 is thicker than insulating resin layer 122. Furthermore, in the example shown in Fig. 3, the thickness of electronic component 10 in the Z direction is thicker than the thickness of core layer 110 in the Z direction, and main surface 21 of magnetic body 20 of electronic component 10 protrudes from main surface 111 of core layer 110. In contrast, main surface 22 of magnetic body 20 of electronic component 10 may be flush with main surface 112 of core layer 110. This reduces the thickness of insulating resin layer 121 in the portion covering terminal portion 341, thereby improving the processing accuracy of vias that expose terminal portion 341.

[0030] Fig. 4A is a schematic perspective view showing the appearance of an electronic component 10A according to a second embodiment of the technology disclosed herein, and Fig. 4B is a schematic perspective top view of the electronic component 10A.

[0031] 4(a) and 4(b) differs from electronic component 10 according to the first embodiment in that a magnetic core 28 is provided in an inner diameter region 27 surrounded by a metal frame 30. The other basic configuration may be the same as that of electronic component 10 according to the first embodiment, and the same elements are denoted by the same reference numerals, and redundant explanations will be omitted.

[0032] The magnetic core 28 is made of a material with a higher magnetic permeability than the magnetic base body 20. By disposing such a magnetic core 28 in the inner diameter region 27, it is possible to increase the inductance of the coil conductor made of the metal frame 30. The magnetic core 28 may be formed to a size and shape such that a portion of it protrudes from the inner diameter region 27 of the metal frame 30, as shown in, for example, Figures 4(a) and 4(b). However, without being limited thereto, the magnetic core 28 may be formed to a size and shape such that it fits within the inner diameter region 27 of the metal frame 30, for example.

[0033] Fig. 5A is a schematic perspective view showing the appearance of an electronic component 10B according to a third embodiment of the technology disclosed herein, and Fig. 5B is a schematic perspective top view of the electronic component 10B.

[0034] 5(a) and 5(b) differs from the electronic component 10 according to the first embodiment in that a separate metal frame 30B is embedded in the magnetic base body 20. Since the other basic configuration is the same as that of the electronic component 10 according to the first embodiment, the same elements are given the same reference numerals and redundant explanations will be omitted. Furthermore, each element constituting the metal frame 30B is given a reference numeral with the letter B added to the end of the reference numeral of the corresponding element of the metal frame 30.

[0035] 5(a) and 5(b), the metal frame 30B is formed in substantially the same shape as the metal frame 30 described above. The metal frame 30 and the metal frame 30B are arranged in the Y direction inside the magnetic base body 20. The metal frame 30B is embedded coaxially with the metal frame 30 in the magnetic base body 20, with the metal frame 30 rotated 180° around a coil axis extending in the Y direction. This makes it possible to embed two coil conductors in one electronic component. Furthermore, three or more coil conductors may be embedded in one electronic component.

[0036] In the example shown in Figures 5(a) and 5(b), the positions of the connection parts 342, 352 of the metal frame 30 and the section 33B of the metal frame 30B in the X direction are approximately the same, and the positions of the section 33 of the metal frame 30 and the connection parts 342B, 352B of the metal frame 30B in the X direction are approximately the same.

[0037] When electronic component 10B according to this embodiment is actually used, if metal frame 30 is designed so that current flows from terminal portion 351 to terminal portion 341, and metal frame 30B is designed so that current flows from terminal portion 341B to terminal portion 351B, the magnetic fields generated by metal frame 30 and 30B will cancel each other out less, thereby increasing inductance. That is, as shown in FIG. 6 , when current flows from terminal portion 351 to terminal portion 341 of metal frame 30, the current flows in the −Z direction through connection portions 342 and 352, and the current flows in the +Z direction through section 33. On the other hand, when current flows from terminal portion 341B to terminal portion 351B of metal frame 30B, the current flows in the −Z direction through connection portions 342B and 352B, and the current flows in the +Z direction through section 33B. As a result, the magnetic fields generated by the connection portions 342 and 352 and the magnetic field generated by the section 33B are in the same direction in the region indicated by the symbol B1, and the magnetic fields in this region B1 can be reinforced. Similarly, the magnetic fields generated by the connection portions 342B and 352B and the magnetic field generated by the section 33 are in the same direction in the region indicated by the symbol B2, and the magnetic fields in this region B2 can be reinforced.

[0038] Fig. 7A is a schematic perspective view illustrating the appearance of an electronic component 10C according to a fourth embodiment of the technology disclosed herein, and Fig. 7B is a schematic perspective top view of the electronic component 10C.

[0039] 7(a) and 7(b) differs from electronic component 10B according to the third embodiment in that magnetic cores 28 are provided in inner diameter region 27 surrounded by metal frame 30 and inner diameter region 27B surrounded by metal frame 30B. Since the other basic configuration is the same as that of electronic component 10B according to the third embodiment, the same elements are designated by the same reference numerals and redundant description will be omitted.

[0040] The magnetic core 28 is made of a material with a higher magnetic permeability than the magnetic body 20, and has a continuous shape that penetrates the inner diameter region 27 surrounded by the metal frame 30 and the inner diameter region 27B surrounded by the metal frame 30B. In this way, a common magnetic core 28 can be used even when multiple metal frames are embedded in the magnetic body 20. This makes it possible to reduce the number of parts.

[0041] FIG. 8 is a schematic perspective view for explaining the structure of a metal frame 301 according to a first modified example.

[0042] The metal frame 301 shown in Fig. 8 differs from the metal frame 30 shown in Fig. 2 in that the width in the Y direction of the terminal portions 341, 351 is increased. Since the other basic configuration is the same as that of the metal frame 30 shown in Fig. 2, the same elements are given the same reference numerals and redundant explanations will be omitted.

[0043] 8 , the width in the Y direction of the connection portions 342, 352 is W2, while the width in the Y direction of the terminal portions 341, 351 is W1 (>W2). The direction in which the terminal portion 341 expands is the −Y direction, which prevents interference with the connection portion 352 due to the expanded width. Similarly, the direction in which the terminal portion 351 expands is the +Y direction, which prevents interference with the connection portion 342 due to the expanded width. In this way, expanding the width of the terminal portions 341, 351 in the Y direction increases the exposed area from the magnetic base body 20, thereby improving connection reliability.

[0044] FIG. 9A is a schematic perspective view for explaining the structure of a metal frame 302 according to a second modified example.

[0045] 9A differs from the metal frame 30 shown in Fig. 2 in that the terminal portion 341 is bent in the +X direction from the connection portion 342, and the terminal portion 351 is bent in the +X direction from the connection portion 352. The other basic configuration is the same as that of the metal frame 30 shown in Fig. 2, and therefore the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0046] 9( a), terminal portion 341 and a portion of section 31 face each other in the Z direction with inner diameter region 27 interposed therebetween, and terminal portion 351 and a portion of section 32 face each other in the Z direction with inner diameter region 27 interposed therebetween. By bending terminal portions 341 and 351 inward (toward the +X direction) in this manner, it is possible to reduce the size of metal frame 30 in the X direction. Furthermore, as in metal frame 302A shown in FIG. 9( b), the width of inwardly bent terminal portions 341 and 351 in the Y direction may be increased.

[0047] FIG. 10A is a schematic perspective view for explaining the structure of a metal frame 303 according to a third modified example.

[0048] 10A differs from the metal frame 30 shown in Fig. 2 in that the terminal portion 351 is bent in the +X direction from the connection portion 352. The other basic configuration is the same as that of the metal frame 30 shown in Fig. 2, so the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0049] In the example shown in FIG. 10( a), the terminal portion 351 and a portion of the section 32 face each other in the Z direction with the inner diameter region 27 interposed therebetween. The terminal portion 341 is bent in the −X direction (outward) from the connection portion 342, similar to the metal frame 30 shown in FIG. 2. In this manner, one of the terminal portions 341, 351 may be bent inward, and the other of the terminal portions 341, 351 may be bent outward. Furthermore, as in the metal frame 303A shown in FIG. 10( b), the width in the Y direction of the terminal portion 341 bent outward and the width in the Y direction of the terminal portion 351 bent inward may be increased.

[0050] FIG. 11A is a schematic perspective view for explaining the structure of a metal frame 304 according to a fourth modified example.

[0051] The metal frame 304 shown in FIG. 11( a) does not have terminal portions 341, 351 bent in the X direction, and differs from the metal frame 30 shown in FIG. 2 in that the XY planes, which are the tips of the connecting portions 342, 352, form the terminal portions 341, 351. Other basic configurations are the same as those of the metal frame 30 shown in FIG. 2, so the same elements are given the same reference numerals and redundant description will be omitted. In this way, it is not essential that the terminal portions 341, 351 are portions bent from the connecting portions 342, 352. Furthermore, as in the metal frame 304A shown in FIG. 11( b), the width of the connecting portions 342, 352 in the Y direction may be increased to increase the area of ​​the exposed terminal portions 341, 351.

[0052] FIG. 12A is a schematic perspective view for explaining the structure of a metal frame 305 according to the fifth modified example.

[0053] 12A differs from the metal frame 30 shown in Fig. 2 in that the connection portions 342, 352 extend in the XZ directions (the Y direction is the thickness direction) and the connection portions 342 and 352 face each other in the Y direction via the inner diameter region 27. The other basic configuration is the same as that of the metal frame 30 shown in Fig. 2, so the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0054] 12(a), terminal portion 341 is bent in the −Y direction from connection portion 342, and terminal portion 351 is bent in the +Y direction from connection portion 352. This makes it possible to ensure sufficient area for sections 31 and 32. Furthermore, as in metal frame 305A shown in FIG. 12(b), the width in the X direction of terminal portions 341 and 351 bent outward may be increased.

[0055] FIG. 13A is a schematic perspective view for explaining the structure of a metal frame 306 according to a sixth modified example.

[0056] 13(a) differs from the metal frame 305 shown in Fig. 13(a) in that the terminal portion 341 is bent in the +Y direction from the connection portion 342, and the terminal portion 351 is bent in the -Y direction from the connection portion 352. The other basic configuration is the same as that of the metal frame 305 shown in Fig. 13(a), and therefore the same elements are given the same reference numerals and redundant explanations will be omitted.

[0057] 13( a), terminal portion 341 and a portion of section 31 face each other in the Z direction with inner diameter region 27 interposed therebetween, and terminal portion 351 and a portion of section 32 face each other in the Z direction with inner diameter region 27 interposed therebetween. In this manner, by bending terminal portion 341 inward (toward the +Y direction) and terminal portion 351 inward (toward the −Y direction), it is possible to reduce the size of metal frame 30 in the Y direction. Furthermore, as in metal frame 306A shown in FIG. 13( b), the width in the X direction of inwardly bent terminal portions 341 and 351 may be increased.

[0058] FIG. 14A is a schematic perspective view for explaining the structure of a metal frame 307 according to the seventh modification.

[0059] The metal frame 307 shown in Fig. 14(a) differs from the metal frame 305 shown in Fig. 12(a) in that the terminal portion 351 is bent in the -Y direction from the connection portion 352. The other basic configuration is the same as that of the metal frame 305 shown in Fig. 12(a), and therefore the same elements are given the same reference numerals and redundant explanations will be omitted.

[0060] In the example shown in FIG. 14( a), the terminal portion 351 and a portion of the section 32 face each other in the Z direction with the inner diameter region 27 interposed therebetween. The terminal portion 341 is bent in the −Y direction (outward) from the connection portion 342, similar to the metal frame 305 shown in FIG. 12( a). In this manner, one of the terminal portions 341, 351 may be bent inward, and the other of the terminal portions 341, 351 may be bent outward. Furthermore, as in the metal frame 307A shown in FIG. 14( b), the width in the X direction of the terminal portion 341 bent outward and the width in the X direction of the terminal portion 351 bent inward may be increased.

[0061] FIG. 15A is a schematic perspective view for explaining the structure of a metal frame 308 according to an eighth modified example.

[0062] The metal frame 308 shown in FIG. 15( a) does not have terminal portions 341, 351 bent in the Y direction, and differs from the metal frame 305 shown in FIG. 12( a) in that the XY planes, which are the tips of the connecting portions 342, 352, form the terminal portions 341, 351. Other basic configurations are the same as those of the metal frame 305 shown in FIG. 12( a), so the same elements are denoted by the same reference numerals and redundant description will be omitted. Thus, it is not essential that the terminal portions 341, 351 be bent from the connecting portions 342, 352. Furthermore, as in the metal frame 308A shown in FIG. 15( b), the area of ​​the exposed terminal portions 341, 351 may be increased by increasing the width of the connecting portions 342, 352 in the X direction.

[0063] FIG. 16 is a schematic perspective view for explaining the structure of a metal frame 309 according to a ninth modification.

[0064] The metal frame 309 shown in FIG. 16 includes sections 31 and 32 that extend in the XZ direction (with the Y direction being the thickness direction) and are generally parallel to each other, section 33 that connects the end of section 31 in the +X direction with the end of section 32 in the +X direction and extends in the YZ direction (with the X direction being the thickness direction), section 34 that is connected to the end of section 31 in the −X direction, and section 35 that is connected to the end of section 32 in the −X direction.

[0065] The region of the magnetic body 20 sandwiched between sections 31 and 32 in the Y direction constitutes the inner diameter region 27 of the coil conductor. The coil axis of the coil conductor made of the metal frame 309 is in the Z direction and passes through the inner diameter region 27. Section 31 is located closer to the side surface 26 than the inner diameter region 27. Section 32 is located closer to the side surface 25 than the inner diameter region 27. Section 34 is a portion bent from section 31 toward the +Y direction (outward), and its surface is exposed from the main surface 21 of the magnetic body 20. Section 35 is a portion bent from section 32 toward the −Y direction (outward), and its surface is exposed from the main surface 22 of the magnetic body 20.

[0066] 16 , the coil axis of the coil conductor formed by the metal frame may be in the Z direction. Furthermore, section 34 does not need to be composed of terminal portion 341 and connecting portion 342, and the portion bent from section 31 may be directly exposed from main surface 21 of the magnetic body 20. Similarly, section 35 does not need to be composed of terminal portion 351 and connecting portion 352, and the portion bent from section 32 may be directly exposed from main surface 22 of the magnetic body 20.

[0067] FIG. 17 is a schematic perspective view for explaining the structure of a metal frame 310 according to a tenth modification.

[0068] A metal frame 310 shown in Fig. 17 differs from the metal frame 309 shown in Fig. 16 in that section 34 is bent in the -Y direction from section 31, and section 35 is bent in the +Y direction from section 32. The other basic configuration is the same as that of the metal frame 309 shown in Fig. 16, and therefore the same elements are given the same reference numerals and redundant explanations will be omitted.

[0069] 17, a part of section 34 and a part of section 35 face each other in the Z direction via inner diameter region 27. In this way, by bending section 34 inward (toward the −Y direction) and bending section 35 inward (toward the +Y direction), it is possible to reduce the size of metal frame 310 in the Y direction.

[0070] FIG. 18 is a schematic perspective view for explaining the structure of a metal frame 311 according to an eleventh modification.

[0071] The metal frame 311 shown in Fig. 18 differs from the metal frame 309 shown in Fig. 16 in that section 34 is bent in the -Y direction from section 31. Other basic configurations are the same as those of the metal frame 309 shown in Fig. 16, so the same elements are given the same reference numerals and redundant explanations will be omitted. Section 35, like the metal frame 309 shown in Fig. 16, is bent in the -Y direction (outward) from section 32. In this way, one of sections 34 and 35 may be bent inward and the other of sections 34 and 35 may be bent outward.

[0072] FIG. 19 is a schematic perspective view for explaining the structure of a metal frame 312 according to a twelfth modification.

[0073] The metal frame 312 shown in Fig. 19 differs from the metal frame 309 shown in Fig. 16 in that it does not have sections 34 and 35 bent in the X direction, and the XY plane at the end of section 31 forms section 34, and the XY plane at the end of section 32 forms section 35. Since the other basic configuration is the same as that of the metal frame 309 shown in Fig. 16, the same elements are given the same reference numerals and redundant description will be omitted. In this way, it is not essential that sections 34 and 35 are portions bent from sections 31 and 32, respectively.

[0074] FIG. 20 is a schematic perspective view for explaining the structure of a metal frame 313 according to the thirteenth modification.

[0075] 20 differs from the metal frame 309 shown in Fig. 16 in that section 34 is made up of a terminal portion 341 and a connecting portion 342, section 35 is made up of a terminal portion 351 and a connecting portion 352, the connecting portions 342 and 352 extend in the YZ directions (the X direction is the thickness direction), and the terminal portions 341 and 351 extend in the XY directions (the Z direction is the thickness direction).The rest of the basic configuration is the same as that of the metal frame 309 shown in Fig. 16, so the same elements are given the same reference numerals and redundant explanations will be omitted.

[0076] 20, connecting portion 342 is bent from section 31 toward the −Y direction, and connecting portion 352 is bent from section 32 toward the +Y direction. As a result, section 33 and connecting portions 342, 352 face each other in the X direction via inner diameter region 27. Furthermore, terminal portion 341 is bent from connecting portion 342 toward the −X direction (outward), and terminal portion 351 is bent from connecting portion 352 toward the −X direction (outward). With this structure, it is possible to obtain a larger inductance than metal frame 309 shown in FIG. 16.

[0077] FIG. 21 is a schematic perspective view for explaining the structure of a metal frame 314 according to a fourteenth modification.

[0078] The metal frame 314 shown in Fig. 21 differs from the metal frame 313 shown in Fig. 20 in that the terminal portion 341 is bent inward in the +X direction from the connection portion 342, and the terminal portion 351 is bent inward in the +X direction from the connection portion 352. Since the other basic configuration is the same as that of the metal frame 313 shown in Fig. 20, the same elements are given the same reference numerals and redundant description will be omitted. By bending the terminal portions 341, 351 inward (towards the +X direction) in this way, it is possible to reduce the size of the metal frame 314 in the X direction.

[0079] FIG. 22 is a schematic perspective view for explaining the structure of a metal frame 315 according to a fifteenth modification.

[0080] The metal frame 315 shown in Fig. 22 differs from the metal frame 313 shown in Fig. 20 in that the terminal portion 341 is bent in the +X direction (inward) from the connection portion 342. Other basic configurations are the same as those of the metal frame 313 shown in Fig. 20, so the same elements are given the same reference numerals and redundant explanations will be omitted. The terminal portion 351, like the metal frame 313 shown in Fig. 20, is bent in the -X direction (outward) from the connection portion 352. In this way, one of the terminal portions 341, 351 may be bent inward and the other of the terminal portions 341, 351 may be bent outward.

[0081] FIG. 23 is a schematic perspective view for explaining the structure of a metal frame 316 according to a sixteenth modification.

[0082] The metal frame 316 shown in Fig. 23 does not have terminal portions 341, 351 bent in the X direction, and differs from the metal frame 313 shown in Fig. 20 in that the XY planes that are the tips of the connecting portions 342, 352 form the terminal portions 341, 351. Since the other basic configuration is the same as that of the metal frame 313 shown in Fig. 20, the same elements are given the same reference numerals and redundant explanations will be omitted. In this way, it is not essential that the terminal portions 341, 351 are portions bent from the connecting portions 342, 352.

[0083] The above describes embodiments of the technology according to the present disclosure, but the technology according to the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the gist of the technology, and it goes without saying that these modifications are also included within the scope of the technology according to the present disclosure.

[0084] Note that the technology according to the present disclosure also includes any suitable combination of the above-described embodiments and modifications.

[0085] For example, the electronic component 10B according to the third embodiment may be configured by combining and arranging the electronic component 10 according to the first embodiment and the electronic component 10A according to the second embodiment described above. That is, in this case, a magnetic core 28 is arranged in the inner diameter region 27 of one or more of the two or more metal frames.

[0086] Also, for example, a metal frame 301 according to a first modified example illustrated in FIG. 8 may be used as the metal frame of the second to fourth embodiments described above. Similarly, for example, the metal frame 302 (302A) according to the second modified example illustrated in FIGS. 9( a) and 9(b), the metal frame 303 (303A) according to the third modified example illustrated in FIGS. 10(a) and 10(b), the metal frame 304 (304A) according to the fourth modified example illustrated in FIGS. 11(a) and 11(b), the metal frame 305 (305A) according to the fifth modified example illustrated in FIGS. 12(a) and 12(b), the metal frame 306 (306A) according to the sixth modified example illustrated in FIGS. 13(a) and 13(b), the metal frame 307 (307A) according to the seventh modified example illustrated in FIGS. 14(a) and 14(b), and the metal frame 308 (308A) according to the eighth modified example illustrated in FIGS. 15(a) and 15(b) may be used as the metal frames of the second to fourth embodiments described above.

[0087] 16 may be used as the metal frame of the second or third embodiment described above. When the metal frame 309 is used as the metal frame of the second embodiment described above, the magnetic core 28 may be formed in an appropriate shape and size so as to fit within the inner diameter region 27. An electronic component similar to the third or fourth embodiment may be formed by arranging one or more metal frames 309 each having a magnetic core 28 disposed in the inner diameter region. Similarly, for example, the metal frame 310 according to the tenth modified example shown in FIG. 17 , the metal frame 311 according to the eleventh modified example shown in FIG. 18 , the metal frame 312 according to the twelfth modified example shown in FIG. 19 , the metal frame 313 according to the thirteenth modified example shown in FIG. 20 , the metal frame 314 according to the fourteenth modified example shown in FIG. 21 , the metal frame 315 according to the fifteenth modified example shown in FIG. 22 , and the metal frame 316 according to the sixteenth modified example shown in FIG. 23 may be used as the metal frame of the second or third embodiment described above. Note that when the metal frames according to these modified examples are used as the metal frame of the second embodiment described above, the magnetic core 28 only needs to be formed in an appropriate shape and size so as to fit within the inner diameter region 27. Furthermore, an electronic component similar to the third or fourth embodiment may be formed by arranging one or more metal frames each having a magnetic core 28 arranged in the inner diameter region.

[0088] Note that an electronic component similar to the third or fourth embodiment may be formed by combining one or more of the metal frames 30 illustrated in FIG. 2 with one or more of the metal frames according to the respective modified examples, and an electronic component similar to the third or fourth embodiment may be formed by combining a plurality of metal frames according to the respective modified examples.

[0089] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0090] An electronic component according to one aspect of the present disclosure includes a magnetic body having a first main surface and a second main surface opposite the first main surface, and a first metal frame embedded in the magnetic body, the first metal frame including a first section and a second section facing each other and substantially parallel to each other, a third section connecting one end of the first section with one end of the second section, a fourth section connected to the other end of the first section and at least a portion of which is exposed from the first main surface, and a fifth section connected to the other end of the second section and at least a portion of which is exposed from the second main surface. This allows one end and the other end of the coil conductor made of the first metal frame to be exposed on both sides of the magnetic body.

[0091] In the electronic component described above, the first section and the second section may face each other in a first direction, the magnetic body may include an inner diameter region sandwiched between the first section and the second section in the first direction, the first section may be located closer to the second main surface than the inner diameter region, the second section may be located closer to the first main surface than the inner diameter region, the fourth section may include a first terminal portion at least partially exposed from the first main surface and a first connection portion connecting the first terminal portion to the other end of the first section, and the fifth section may include a second terminal portion at least partially exposed from the second main surface and a second connection portion connecting the second terminal portion to the other end of the second section. This allows the first and second sections to have sufficient cross-sectional areas even when the electronic component is made low-profile, thereby reducing DC resistance.

[0092] In the electronic component described above, the third section and the first and second connection portions may face each other in a second direction perpendicular to the first direction, and the inner diameter region may be sandwiched between the third section and the first and second connection portions in the second direction. This allows for greater inductance to be obtained. In this case, at least the first, second, and third sections of the first metal frame, the first connection portion, and the second connection portion may form a coil, and the second direction may be perpendicular to the coil axis direction of the coil. This prevents interference between the magnetic field generated by the first metal frame and the first and second connection portions.

[0093] In the electronic component described above, the first connection portion and the second connection portion may face each other in a third direction perpendicular to the first direction, and the inner diameter region may be sandwiched between the first connection portion and the second connection portion in the third direction. This allows for a larger inductance to be obtained. In this case, at least the first section, the second section, and the third section of the first metal frame may form a coil, and the third direction may be parallel to the coil axis direction of the coil. This allows for a reduction in the size of the first metal frame in the third direction perpendicular to the first and second directions.

[0094] In the electronic component, a portion of the first section may be exposed from the second main surface, and a portion of the second section may be exposed from the first main surface, thereby improving heat dissipation characteristics.

[0095] In the electronic component, at least the first section, the second section, the third section, the first connecting portion, and the second connecting portion of the first metal frame may form a coil, and the coil axis direction of the coil may be perpendicular to the first and second main surfaces. This facilitates reducing the height of the electronic component. In this case, the first section and the second section may face each other in a third direction, the magnetic body may include an inner diameter region sandwiched between the first and second sections in the third direction, the fourth section may include a first terminal at least partially exposed from the first main surface and a first connecting portion connecting the first terminal to the other end of the first section, and the fifth section may include a second terminal at least partially exposed from the second main surface and a second connecting portion connecting the second terminal to the other end of the second section, and the inner diameter region may be sandwiched between the third section, the first connecting portion, and the second connecting portion in a second direction perpendicular to the third direction. This makes it possible to obtain a larger inductance.

[0096] The electronic component may further include a magnetic core that is disposed in an inner diameter region between the first and second sections and has a higher magnetic permeability than the magnetic body, thereby enabling a larger inductance to be obtained.

[0097] The electronic component may further include a second metal frame having the same shape as the first metal frame, and the first and second metal frames may be coaxially embedded in the magnetic body, thereby providing an electronic component with two built-in coil conductors.

[0098] An electronic component-embedded substrate according to one aspect of the present disclosure includes a core layer in which the above-described electronic component is embedded, a first conductor pattern covering one main surface of the core layer and connected to a fourth section exposed from the magnetic body, and a second conductor pattern covering the other main surface of the core layer and connected to a fifth section exposed from the magnetic body. By mounting a switching circuit or the like on the electronic component-embedded substrate, it is possible to configure a power supply circuit with a built-in inductor.

[0099] This application claims the benefit of Japanese Patent Application No. 2023-151451, filed on September 19, 2023, the entire disclosure of which is incorporated herein by reference.

[0100] 10, 10A to 10C Electronic component 20 Magnetic body 21 Main surface (first main surface) of magnetic body 22 Main surface (second main surface) of magnetic body 23 to 26 Side surface of magnetic body 27, 27B Inner diameter region 28 Magnetic core 30, 30B, 301 to 316, 302A to 308A Metal frame 31 Metal frame section (first section) 32 Metal frame section (second section) 33, 33B Metal frame section (third section) 34 Metal frame section (fourth section) 35 Metal frame section (fifth section) 100 Electronic component built-in substrate 110 Core layer 111 One main surface of core layer 112 Other main surface of core layer 113 Through hole 121, 122 Insulating resin layer 131, 132 Solder resist 141 to 144, 162, 164, 171 to 174, 191, 193 Conductive patterns 151, 152, 154, 181, 183, 184 Via conductors 341, 351 Terminal portions 342, 352, 342B, 352B Connection portions B1, B2 Regions L1 to L4 Conductive layers TH1, TH2 Through-hole conductors

Claims

1. An electronic component comprising: a magnetic body having a first main surface and a second main surface located opposite the first main surface; and a first metal frame embedded in the magnetic body, wherein the first metal frame includes a first section and a second section which are opposed to each other and substantially parallel to each other, a third section which connects one end of the first section to one end of the second section, a fourth section which is connected to the other end of the first section and at least a portion of which is exposed from the first main surface, and a fifth section which is connected to the other end of the second section and at least a portion of which is exposed from the second main surface.

2. The electronic component described in claim 1, wherein the first section and the second section oppose each other in a first direction, the magnetic body includes an inner diameter region sandwiched between the first section and the second section in the first direction, the first section is located closer to the second main surface than the inner diameter region, the second section is located closer to the first main surface than the inner diameter region, the fourth section includes a first terminal portion at least a portion of which is exposed from the first main surface and a first connection portion connecting the first terminal portion and the other end of the first section, and the fifth section includes a second terminal portion at least a portion of which is exposed from the second main surface and a second connection portion connecting the second terminal portion and the other end of the second section.

3. The electronic component described in claim 2, wherein the third section, the first connection portion, and the second connection portion face each other in a second direction perpendicular to the first direction, and the inner diameter region is sandwiched between the third section, the first connection portion, and the second connection portion in the second direction.

4. The electronic component according to claim 3, wherein at least the first section, the second section, the third section, the first connection portion, and the second connection portion of the first metal frame form a coil, and the second direction is perpendicular to a coil axis direction of the coil.

5. The electronic component according to claim 2, wherein the first connection portion and the second connection portion face each other in a third direction perpendicular to the first direction, and the inner diameter region is sandwiched between the first connection portion and the second connection portion in the third direction.

6. The electronic component according to claim 5, wherein at least the first section, the second section, and the third section of the first metal frame form a coil, and the third direction is parallel to a coil axis direction of the coil.

7. The electronic component according to claim 1, wherein a portion of the first section is exposed from the second main surface, and a portion of the second section is exposed from the first main surface.

8. The electronic component according to claim 1, wherein at least the first section, the second section, the third section, the first connection portion, and the second connection portion of the first metal frame form a coil, and a coil axis direction of the coil is perpendicular to the first main surface and the second main surface.

9. The electronic component described in claim 8, wherein the first section and the second section oppose each other in a third direction, the magnetic body includes an inner diameter region sandwiched between the first section and the second section from the third direction, the fourth section includes a first terminal portion at least partially exposed from the first main surface and a first connection portion connecting the first terminal portion and the other end of the first section, the fifth section includes a second terminal portion at least partially exposed from the second main surface and a second connection portion connecting the second terminal portion and the other end of the second section, and the inner diameter region is sandwiched between the third section, the first connection portion and the second connection portion from a second direction perpendicular to the third direction.

10. The electronic component according to claim 1, further comprising a magnetic core having a higher magnetic permeability than the magnetic body, the magnetic core being disposed in an inner diameter region between the first section and the second section.

11. The electronic component according to claim 1, further comprising a second metal frame having the same shape as the first metal frame, the first metal frame and the second metal frame being coaxially embedded in the magnetic body.

12. An electronic component-embedded substrate comprising: a core layer in which an electronic component according to any one of claims 1 to 11 is embedded; a first conductor pattern covering one main surface of the core layer and connected to the fourth section exposed from the magnetic base body; and a second conductor pattern covering the other main surface of the core layer and connected to the fifth section exposed from the magnetic base body.

Images