Glass-ceramic composition and manufacturing method thereof

Abstract

A glass-ceramic composition according to one embodiment of the present disclosure may comprise a cordierite (2MgO · 2Al2O3 · 5SiO2) crystal phase, MgO, Al2O3, SiO2, B2O3, and P2O5. An electronic device according to one embodiment may comprise a cover including the glass-ceramic composition.

Description

Glass-ceramic composition and method for producing the same

[0001] The present disclosure relates to a glass-ceramic composition and a method for producing the same.

[0002] As a material for the cover part of a portable electronic device, a zirconia (ZrO2) ceramic material or a silicon nitride (Si3N4) ceramic material having appropriate durability and strength can be used.

[0003] The cover component of a portable electronic device may interfere with radio waves transmitted and received by the antenna component inside the device, and the degree of radio wave interference varies depending on the permittivity of the material of the cover component.

[0004] Glass materials used as cover parts for portable electronic devices have a low Vickers surface hardness, which makes them easily scratched during daily life, and stress is concentrated in these scratched areas, ultimately leading to easy breakage.

[0005] Zirconia (ZrO2), another material used for cover components in portable electronic devices, offers excellent strength and hardness. However, its high dielectric constant leads to significant propagation loss, and its high density makes it heavy. Furthermore, its manufacturing process requires high-temperature sintering, making it complex and difficult to manufacture.

[0006] A glass-ceramic composition according to one embodiment of the present disclosure includes a cordierite (2MgO · 2Al2O3 · 5SiO2) crystal phase and may include MgO, Al2O3, SiO2, B2O3, and P2O5.

[0007] An electronic device according to one embodiment of the present disclosure comprises a housing of the electronic device, at least a portion of which is formed of a glass-ceramic composition including a cordierite (2MgO · 2Al2O3 · 5SiO2) crystal phase, wherein the glass-ceramic composition may include MgO, Al2O3, SiO2, B2O3, and P2O5.

[0008] A method for manufacturing a glass-ceramic composition according to one embodiment of the present disclosure may include the steps of manufacturing a glass frit including MgO, Al2O3, SiO2, B2O3, and P2O5; and the step of sintering a molded body of the glass frit. The step of sintering the molded body of the glass frit may generate a cordierite (2MgO · 2Al2O3 · 5SiO2) crystal phase in the glass-ceramic composition.

[0009] A glass-frit composition according to one embodiment of the present disclosure comprises MgO, Al2O3, SiO2, B2O3, and P2O5, wherein the MgO, the Al2O3, the SiO2, the B2O3, and the P2O5 may be associated with the formation of a cordierite (2MgO · 2Al2O3 · 5SiO2) crystal phase.

[0010] A glass frit or glass-ceramic composition and a method for producing the same according to one embodiment of the present disclosure can provide a material having low dielectric constant, low density, high strength, and high hardness.

[0011] An electronic device according to one embodiment of the present disclosure can minimize antenna transmission and reception radio interference caused by a cover component material, be lightweight, and have high strength characteristics and / or high hardness characteristics.

[0012] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0013] FIG. 2 is a perspective view of a portable electronic device according to one embodiment, viewed from one direction.

[0014] FIG. 3 is a perspective view of a portable electronic device according to one embodiment, viewed from another direction.

[0015] FIG. 4 is an exploded perspective view of a portable electronic device according to one embodiment.

[0016] FIG. 5 is a flow chart illustrating a method for manufacturing a glass-ceramic composition according to one embodiment.

[0017] FIG. 6 is a flowchart illustrating a method for manufacturing glass frit according to one embodiment.

[0018] FIG. 7 is a flow chart illustrating a method for manufacturing a glass-ceramic composition using yttria-stabilized zirconia as a filler according to one embodiment.

[0019] FIG. 8 is a flowchart illustrating a method for manufacturing a housing component of a portable electronic device according to one embodiment.

[0020] FIG. 9 is a flowchart illustrating a method for manufacturing an electronic device by assembling housing components according to one embodiment.

[0021] FIG. 10 illustrates an XRD pattern of a glass-ceramic composition comprising a cordierite crystal phase according to one embodiment.

[0022] FIG. 11 illustrates an XRD pattern of a glass-ceramic composition comprising a cordierite crystal phase and / or a zirconia crystal phase according to one embodiment.

[0023] Below, embodiments of the present disclosure are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In addition, for the purpose of clearly explaining the present disclosure in the drawings, parts irrelevant to the description are omitted, and similar parts are designated with similar reference numerals throughout the specification.

[0024] The terms used in this disclosure are described as currently common terms, taking into account the functions mentioned herein. However, these terms may mean various other terms depending on the intentions of those skilled in the art, precedents, the emergence of new technologies, etc. Therefore, the terms used in this disclosure should not be interpreted solely based on their names, but rather based on the meanings of the terms and the overall content of this disclosure.

[0025] Additionally, while terms such as first, second, etc. may be used to describe various components, the components should not be limited by these terms. These terms are used to distinguish one component from another.

[0026] Throughout the specification, when a part is said to be "connected" to another part, this includes not only the cases where the parts are "directly connected" but also the cases where the parts are "electrically connected" with other elements intervening. Furthermore, when a part is said to "include" a component, this does not exclude other components, but rather includes other components, unless otherwise stated.

[0027] The phrases “in one embodiment” and the like appearing in various places throughout this disclosure do not necessarily all refer to the same embodiment.

[0028] An embodiment of the present disclosure may be represented by functional block configurations and various processing steps. Some or all of these functional blocks may be implemented by various hardware and / or software configurations that perform specific functions. For example, the functional blocks of the present disclosure may be implemented by one or more microprocessors or by circuit configurations for a given function. Furthermore, for example, the functional blocks of the present disclosure may be implemented in various programming or scripting languages. The functional blocks may be implemented by algorithms that execute on one or more processors. Furthermore, the present disclosure may employ conventional techniques for electronic configuration, signal processing, and / or data processing. Terms such as "mechanism," "element," "means," and "configuration" may be used broadly and are not limited to mechanical and physical configurations.

[0029] Additionally, the connecting lines or connecting members between components depicted in the drawings are merely exemplary representations of functional connections and / or physical or circuit connections. In an actual device, connections between components may be represented by various functional connections, physical connections, or circuit connections that may be replaced or added.

[0030] The present disclosure will be described in detail with reference to the attached drawings below.

[0031] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0032] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0033] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0034] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0035] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0036] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0037] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0038] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0039] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0040] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0041] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0042] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0043] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0044] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0045] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0046] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0047] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0048] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0049] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0050] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0051] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0052] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0053] Fig. 2 is a perspective view of a portable electronic device according to one embodiment, viewed from one direction. Fig. 3 is a perspective view of a portable electronic device according to one embodiment, viewed from another direction.

[0054] Referring to FIGS. 2 to 4 , an electronic device (200) according to one embodiment may include a housing (210) including a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B). The housing may also refer to a structure forming a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIG. 1 . The first side (210A) may be formed by a front plate (202). The second side (210B) may be formed by a back plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, or a combination of at least two of the foregoing materials (e.g., glass-ceramic in which ceramic is distributed by partial crystallization of glass within a glass matrix). The above side (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled with the front plate (202) and the rear plate (211). The rear plate (211) and the side bezel structure (218) may be formed integrally and include the same material.

[0055] According to one embodiment, the electronic device (200) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module, a camera module (204, 205, 206), a key input device (217), a light-emitting element (not shown), and a connector hole (208, 209). The electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the light-emitting element (not shown)) or may additionally include other components.

[0056] The display (220) may be exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be exposed through the front plate (202), which forms portions of the first surface (210A) and the side surfaces (210C). In one embodiment, the edges of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment, in order to expand the area over which the display (220) is exposed, the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same.

[0057] In one embodiment, a recess or opening may be formed in a portion of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module, a camera module (205), and a light-emitting element may be included that is aligned with the recess or opening. At least one of an audio module (214), a sensor module, a camera module (205), a fingerprint sensor, and a light-emitting element may be included on a back surface of the screen display area of ​​the display (220). The display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0058] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sounds, and in one embodiment, multiple microphones may be disposed to detect the direction of sounds. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. The speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0059] The sensor module can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module may include, for example, a first sensor module (not shown) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (not shown) (e.g., an HRM sensor) and / or a fourth sensor module (not shown) (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., the display (220) as well as the second surface (210B). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0060] The camera modules (204, 205, 206) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (206) disposed on a second side (210B), and / or a flash (204). The camera devices (205, 206) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (204) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0061] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). The key input device may include a sensor module (not shown) disposed on a second surface (210B) of the housing (210).

[0062] A light-emitting element (not shown) may be disposed, for example, on a first surface (210A) of the housing (210). The light-emitting element may provide, for example, status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, a camera module (205). The light-emitting element may include, for example, an LED, an IR LED, and a xenon lamp.

[0063] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0064] FIG. 4 is an exploded perspective view of a portable electronic device according to one embodiment.

[0065] Referring to FIG. 4, the electronic device (200) may include a side bezel structure (231), a first support member (232) (e.g., a bracket), a front plate (222), a display (220), a printed circuit board (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna (270), and a rear plate (280). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., the first support member (232) or the second support member (260)) or may additionally include other components. At least one of the components of the electronic device (200) may be the same as or similar to at least one of the components of the electronic device (200) of FIG. 1 or FIG. 2, and any redundant description thereof will be omitted below.

[0066] The first support member (232) may be disposed inside the electronic device (200) and connected to the side bezel structure (231), or may be formed integrally with the side bezel structure (231). The first support member (232) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member (232) may have a display (220) coupled to one surface and a printed circuit board (240) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0067] The memory may include, for example, volatile memory or non-volatile memory.

[0068] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0069] The battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (200), or may be disposed detachably from the electronic device (200).

[0070] The antenna (270) may be positioned between the rear plate (280) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (231) and / or the first support member (232).

[0071] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0072] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to encompass various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" each include all possible combinations of the items listed together in that phrase. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0073] Referring to FIGS. 2 to 4, the first surface (210A), the second surface (210B), and the side surface (210C) constituting the housing (210) of the electronic device (200) can form an internal space. The electronic device (200) can mount electronic components in the internal space of the housing (210). The electronic components mounted in the internal space of the housing (210) can be protected from the outside by the housing.

[0074] A part (or one side) of a housing (210) of an electronic device (200) according to one embodiment of the present disclosure may be formed of a ceramic material having a Vickers hardness of 700 Hv or more and / or a bending strength of 80 MPa or more, and may protect electronic components mounted in an internal space.

[0075] Also, referring to FIGS. 2 to 4, among the electronic components mounted in the internal space of the housing (210), the antenna (270) can transmit signals or power to or receive signals from the outside. Some of the signals or power transmitted or received by the antenna (270) may be lost by the housing (210).

[0076] A part (or one side) of the housing (210) of the electronic device (200) according to one embodiment of the present disclosure may be formed of a ceramic material having a dielectric constant of 10 or less, and thus, the influence of the housing (210) on a signal or power transmitted or received by an antenna (270) mounted in the internal space of the housing (210) (e.g., loss of signal or power, etc.) may be minimized.

[0077] FIG. 5 is a flowchart (500) illustrating a method for manufacturing a glass-ceramic composition according to one embodiment.

[0078] A method for manufacturing a glass-ceramic according to one embodiment of the present disclosure may include a step (510) of manufacturing a glass frit including MgO, Al2O3, SiO2, B2O3, and P2O5, and a step (520) of sintering a molded body of the glass frit. In the step of sintering the molded body of the glass frit, a cordierite (2MgO · 2Al2O3 · 5SiO2) crystal phase may be generated in the glass-ceramic composition.

[0079] In step (510), a glass frit can be manufactured by melting and vitrifying a glass raw material including MgO, Al2O3, and SiO2. To melt and vitrify MgO, Al2O3, and SiO2, B2O3 and / or P2O5 can be added. When B2O3 and / or P2O5 are added to MgO, Al2O3, and SiO2, B2O3 and / or P2O5 can lower the melting temperature of the glass raw material including MgO, Al2O3, and SiO2 and promote vitrification.

[0080] By sintering a molded body of glass frit including MgO, Al2O3, SiO2, B2O3, and P2O5 in step (520), a glass-ceramic composition having a cordierite crystal phase (or a cordierite single phase) can be produced. By sintering the molded body of glass frit, vitrified MgO, Al2O3, and SiO2 included in the glass frit can be crystallized into a cordierite crystal phase.

[0081] According to one embodiment, a cordierite crystal phase formed by sintering MgO, Al2O3, and SiO2 may have high strength and / or hardness characteristics. Since a glass-ceramic composition according to one embodiment of the present disclosure includes a cordierite crystal phase within the composition, it may have high strength and / or hardness characteristics even without using other glass raw materials having high strength and / or hardness.

[0082] MgO, Al2O3, SiO2, B2O3, and P2O5 have lower dielectric constants and densities than other ceramic materials with higher strength and / or hardness (e.g., zirconia). According to one embodiment of the present disclosure, a glass-ceramic formed from a glass frit comprising MgO, Al2O3, SiO2, B2O3, and P2O5 may have low dielectric constants and / or low density properties.

[0083] According to one embodiment of the present disclosure, a method for manufacturing a glass-ceramic composition can manufacture a glass frit including MgO, Al2O3, SiO2, B2O3, P2O5, and ZrO2 in step (510). In step (520), a glass-ceramic composition having a cordierite crystal phase and / or a zirconia crystal phase can be produced by sintering a molded body of the glass frit including MgO, Al2O3, SiO2, B2O3, P2O5, and ZrO2.

[0084] In step (510) according to one embodiment, ZrO2 may be added to MgO, Al2O3, and SiO2. Glass frit may be produced by melting and vitrifying MgO, Al2O3, SiO2, and ZrO2. B2O3 and / or P2O5 may be added during the process of melting and vitrifying MgO, Al2O3, SiO2, and ZrO2. B2O3 and / or P2O5 may lower the melting temperature of MgO, Al2O3, SiO2, and ZrO2 and promote vitrification.

[0085] In step (520), a glass-ceramic composition having a cordierite crystal phase and / or a zirconia crystal phase can be produced by sintering a molded body of a glass frit including MgO, Al2O3, SiO2, B2O3, P2O5, and ZrO2. By sintering the molded body of the glass frit, the vitrified MgO, Al2O3, and SiO2 included in the glass frit can be crystallized into a cordierite crystal phase, and the vitrified ZrO2 can be crystallized into a zirconia crystal phase. A glass-ceramic composition including a cordierite crystal phase produced by sintering MgO, Al2O3, and SiO2 and / or a zirconia crystal phase produced by adding ZrO2 can have high strength and / or hardness characteristics. Glass frit comprising MgO, Al2O3, SiO2, B2O3, and P2O5 and / or glass-ceramic compositions formed from the glass frit may have higher strength and / or hardness properties by further comprising ZrO2.

[0086] A method for producing a glass-ceramic composition may include, in the step of producing a glass frit, adding ZrO2 to MgO, Al2O3, SiO2, B2O3, and P2O5. B2O3 and / or P2O5 may be used for melting and vitrification of the glass frit.

[0087] FIG. 6 is a flowchart (600) illustrating a method for manufacturing glass frit according to one embodiment.

[0088] The step (510) of manufacturing the glass frit of FIG. 5 can be described with reference to FIG. 6.

[0089] Referring to FIG. 6, the step (510) of manufacturing a glass frit may include a step (610) of mixing a glass raw material including MgO, Al2O3, SiO2, B2O3, and P2O5, a step (620) of melting the mixed glass raw material, a step (630) of rapidly cooling the molten glass raw material to obtain glass shatter, a step (640) of crushing and drying the glass shatter, and a step (650) of manufacturing a glass frit including MgO, Al2O3, SiO2, B2O3, and P2O5.

[0090] In step (610), the required amount of glass raw material can be prepared in the form of a small-sized powder. By adjusting the composition ratio of various components included in the glass raw material in step (610), crystallization of glass within the glass-ceramic can be induced in step (520) of FIG. 5. For example, by adjusting the composition ratio of MgO, Al2O3, and SiO2 among various components included in the glass raw material, the generation and / or growth of a cordierite crystal phase can be induced in step (520) of FIG. 5.

[0091] In one embodiment, other components may be added and mixed as glass raw materials in step (610), and the addition of other components may promote the formation and / or growth of cordierite crystal phases. For example, by controlling the composition ratio of B2O3 and P2O5, the formation and / or growth of cordierite crystal phases may be promoted.

[0092] In one embodiment, other components may be added and mixed as glass raw materials in step (610), and the addition of other components may induce the generation and / or growth of cordierite crystal phases and / or other crystal phases. For example, ZrO2 may be added to the glass raw material, and the ZrO2 contained in the glass raw material may induce the generation and / or growth of zirconia crystal phases in step (520) of FIG. 5.

[0093] In step (620), the glass raw material may undergo a melting process (or vitrification) above the liquidus temperature. The temperature of the melting process in step (620) (hereinafter, melting temperature) may be lowered by various components included in the glass raw material in step (610). For example, the B2O3 or P2O5 component included in the glass raw material may lower the melting temperature. As the content of B2O3 or P2O5 included in the glass raw material increases within a predetermined range (e.g., 1 to 5 wt% of B2O3 and / or 1 to 5 wt% of P2O5), the melting temperature may be lowered. For example, as the content of Al2O3 or MgO increases, the melting temperature may be increased. For example, when the glass raw material contains 11 to 18 wt% of MgO, 28 to 34 wt% of Al2O3, 41 to 51 wt% of SiO2, 0 to 8 wt% of ZrO2, 1 to 5 wt% of B2O3, and / or 1 to 5 wt% of P2O5, the glass raw material can be turned into liquid glass (glass melt) through a melting process at 1600°C for 6 hours.

[0094] In step (630), glass fragments can be obtained by rapidly cooling the molten glass. For example, compressed cooling air or cooling water can be used to rapidly cool the molten glass.

[0095] In step (640), the glass fragments may be crushed and dried to become glass powder. The glass powder produced in step (640) may be used as glass frit in step (650) either as is or after further processing.

[0096] The composition ratio of MgO, Al2O3, SiO2, B2O3, and P2O5 included in the glass frit of step (650) can be considered to be the same as the composition ratio of MgO, Al2O3, SiO2, B2O3, and P2O5 included in the mixture of glass raw materials of step (610). In addition, the composition ratio of MgO, Al2O3, SiO2, B2O3, and P2O5 present in the glass-ceramic composition produced by vitrifying the glass frit of step (650) can also be considered to be the same as the composition ratio of the mixture of glass raw materials of step (610) or the composition ratio of the glass frit of step (650). For example, when the glass raw material of step (610) includes 11 to 18 wt% of MgO and / or 28 to 34 wt% of Al2O3, 41 to 51 wt% of SiO2, the glass frit of step (650) and the glass-ceramic composition manufactured therefrom may also include 11 to 18 wt% of MgO and / or 28 to 34 wt% of Al2O3, 41 to 51 wt% of SiO2.

[0097] FIG. 6 is only used as an example of a method for manufacturing a glass frit for the purpose of explaining the glass frit of the present disclosure, and the glass frit of the present disclosure is not limited to a glass frit manufactured through the method of FIG. 6. Furthermore, the components or composition (component ratio) of the glass raw material for manufacturing the glass frit of the present disclosure are not limited by the components or composition of the glass raw material described in FIG. 6. For example, the components or composition included in the glass frit according to one embodiment may be changed within a range that induces the formation and / or growth of a cordierite crystal phase and / or other crystal phases.

[0098] FIG. 7 is a flow chart (700) illustrating a method for manufacturing a glass-ceramic composition using yttria-stabilized zirconia as a filler according to one embodiment.

[0099] Referring to FIG. 7, a method for manufacturing a glass-ceramic composition according to one embodiment may include a step (710) of manufacturing a glass frit including MgO, Al2O3, SiO2, B2O3, P2O5, and ZrO2, a step (720) of manufacturing a molded body of the glass frit using the glass frit and yttria-stabilized zirconia, and a step (730) of sintering the molded body of the glass frit to produce a cordierite crystal phase and / or a zirconia crystal phase.

[0100] In the description of Fig. 7, descriptions that overlap with those described in Fig. 5 are omitted. As described in Fig. 5, a method for manufacturing a glass-ceramic composition may include a step (710) of manufacturing a glass frit including MgO, Al2O3, SiO2, B2O3, P2O5, and ZrO2, and a step (730) of sintering a molded body of the glass frit to produce a cordierite crystal phase and / or a zirconia crystal phase.

[0101] A method for manufacturing a glass-ceramic composition according to one embodiment may further include a step (720) of manufacturing a molded article of glass frit using glass frit and yttria-stabilized zirconia. For example, in the step (720) of manufacturing a molded article of glass frit, yttria-stabilized zirconia may be added as a filler.

[0102] A zirconia crystal phase can be produced by sintering a molded body of glass frit containing yttria-stabilized zirconia. For example, if yttria-stabilized zirconia is used to manufacture the molded body of glass frit in step (720), ZrO2 or Zirconia crystal phases can be generated from yttria-stabilized zirconia.

[0103] FIG. 7 is only used as an example of a method for manufacturing a glass-ceramic composition for the purpose of explaining the yttria-stabilized zirconia filler of the present disclosure, and of course, does not limit the use of the yttria-stabilized zirconia filler of the present disclosure. Referring to FIG. 7, in step (720), as an example, a molded body can be manufactured by mixing a glass frit including ZrO2 and yttria-stabilized zirconia. By sintering the molded body in which the glass frit including ZrO2 and yttria-stabilized zirconia are mixed, a zirconia crystal phase within the glass-ceramic composition can be generated, wherein the zirconia crystal phase can be generated from ZrO2 included in the glass frit and / or can be generated from the yttria-stabilized zirconia.

[0104] According to one embodiment, a molded article may be manufactured by mixing a glass frit comprising MgO, Al2O3, SiO2, B2O3, and P2O5 with yttria-stabilized zirconia. By sintering the molded article mixed with yttria-stabilized zirconia, a zirconia crystal phase may be formed within the glass-ceramic composition, wherein the zirconia crystal phase may be formed from yttria-stabilized zirconia.

[0105] FIG. 8 is a flowchart (800) illustrating a method for manufacturing a housing component of a portable electronic device according to one embodiment.

[0106] Referring to FIG. 8, a method for manufacturing a housing part of an electronic device may include a step (810) of preparing a glass frit including MgO, Al2O3, SiO2, B2O3, and P2O5, a step (820) of mixing the glass frit with other ceramic raw materials, a step (830) of granulating the glass frit or the mixed raw materials of the glass frit, a step (840) of compression molding to obtain a molded body having an appearance corresponding to the housing part, and a step (850) of sintering the molded body and then processing the shape to manufacture the housing part.

[0107] The step (810) of preparing a glass frit may include the step of preparing a glass frit including MgO, Al2O3, SiO2, B2O3, and P2O5 of the step (510) of FIG. 5 or the step of preparing a glass frit including MgO, Al2O3, SiO2, B2O3, P2O5, and ZrO2 of the step (710) of FIG. 7.

[0108] The step (820) of mixing glass frit with other ceramic raw materials refers to the step of mixing other ceramic raw materials to reinforce the strength of the glass frit. The step (820) of mixing glass frit with other ceramic raw materials may include the step of mixing glass frit with yttria-stabilized zirconia of step (720) of FIG. 7. The step (820) may include the step of mixing glass frit with additional MgO or the step of mixing glass frit with ZrO2. The step of mixing glass frit with other ceramic raw materials may be omitted, and step (830) may be performed only with the glass frit manufactured in step (810).

[0109] The step (830) of forming a glass frit or a mixed raw material of glass frit may include a step of forming granules by mixing the glass frit manufactured in step (810) or the mixed raw material of glass frit manufactured in step (820) with a polymer.

[0110] The step (840) of obtaining a molded body having an appearance corresponding to a housing component by compression molding may include a step of molding a spheroidized material using a press method. For example, the molded body obtained in step (840) may have an appearance corresponding to at least a portion of at least one of the first surface (210A), the second surface (210B), the side surface (210C), the front plate (202) of the first surface (210A), the rear plate (211) of the second surface (210B), or the side bezel structure (218) of FIGS. 2 to 4.

[0111] The step (850) of manufacturing a housing part by sintering the molded body and then machining the shape may include a step of performing detailed shape machining based on the appearance implemented in step (840). For example, a processing technique utilizing a laser may be used.

[0112] FIG. 9 is a flowchart (900) illustrating a method for manufacturing an electronic device by assembling a housing component using a glass frit or glass-ceramic composition according to one embodiment.

[0113] Referring to FIG. 9, a method for manufacturing an electronic device by assembling housing parts may include a step of performing other post-processing on the housing parts (910), a step of inspecting the appearance of the housing parts and attaching auxiliary materials (920), and a step of manufacturing an electronic device product by assembling the housing parts (930).

[0114] Step (910) may include, for example, a step of polishing or coating the surface of the housing component.

[0115] Step (920) may include an operation of inspecting whether a housing part has an external defect and an operation of attaching a material to a housing part determined to be free of defects.

[0116] Cosmetic defects that may be found on the exterior of the housing component may be inspected, for example, for inclusions (e.g., bubbles) present within the housing component, roughness, flatness, scratches, scuffs, cracks, flatness, height, warpage, wrinkles, dents, or other deformations of the surface of the housing component. Such defects may occur in each step or step (910) of FIGS. 5 to 8 described above.

[0117] Step (930) is an operation of assembling housing components to manufacture an electronic device product, and may further include post-assembly inspection to ensure that the components are installed correctly and meet quality standards.

[0118] FIG. 10 illustrates an XRD pattern (1000) of a glass-ceramic composition comprising a cordierite crystal phase according to one embodiment.

[0119] The XRD pattern (1000) of the glass-ceramic composition of FIG. 10 can be obtained by performing X-ray diffraction (XRD) analysis on a sintered body manufactured according to the glass composition of Table 1 and the methods of FIGS. 5 to 8. For example, the pattern (1010) is an XRD pattern of a sintered body manufactured from a glass raw material including 13 wt% MgO, 32.89 wt% Al2O3, 48.45 wt% SiO2, 2.83 wt% B2O3, and 2.83 wt% P2O5, which is the first glass composition (#1) of Table 1.

[0120] In performing the method of FIGS. 5 to 8 used in FIGS. 10 and 11, the glass raw material was subjected to a melting process at 1600°C for 6 hours (e.g., step (620)), and the molded body was formed at 1050 o A 2-hour sintering process was performed at C (e.g., step (520), step (730), or step (850)).

[0121] Patterns (1020) to (1060) are XRD patterns of sintered bodies manufactured from glass raw materials including MgO, Al2O3, SiO2, B2O3, P2O5, and ZrO2 according to the second to sixth glass compositions (#2 to #6), respectively.

[0122]

[0123] Referring to FIG. 10, patterns (1010) to (1040) have α-cordierite peaks (1071). Patterns (1010) to (1040) indicate the presence of α-cordierite crystal phases in glass-ceramic compositions manufactured according to the first to fourth glass compositions (#1 to #4).

[0124] Patterns (1050) and (1060) have an α-cordierite peak (1071) and a ZrO2 peak (1072). Patterns (1050) and (1060) indicate the presence of an α-cordierite crystal phase and a ZrO2 crystal phase in the glass-ceramic compositions manufactured according to the fifth and sixth glass compositions (#5 to #6).

[0125] The first to sixth glass compositions (#1 to #6) of Table 1 fall within the range of 12 to 17 wt% of MgO, 29 to 33 wt% of Al2O3, 42 to 50 wt% of SiO2, 0 to 7 wt% of ZrO2, 1 to 4 wt% of B2O3, and / or 1 to 4 wt% of P2O5. Referring to FIG. 10, a glass-ceramic composition manufactured from a glass raw material including 12 to 17 wt% of MgO, 29 to 33 wt% of Al2O3, 42 to 50 wt% of SiO2, 1 to 4 wt% of B2O3 and / or 1 to 4 wt% of P2O5 may include a cordierite crystal phase, and a glass-ceramic composition manufactured from a glass raw material further including 0 to 7 wt% of ZrO2 may include a cordierite crystal phase and a ZrO2 crystal phase.

[0126] A glass frit or glass-ceramic composition according to one embodiment of the present disclosure may include 11 to 18 wt% of MgO, 28 to 34 wt% of Al2O3, and 41 to 51 wt% of SiO2. The glass-ceramic composition may have high hardness and / or strength properties by including a cordierite crystal phase. When the contents of MgO, Al2O3, and SiO2 in the glass frit are outside the above-described range, the cordierite crystal phase in the glass-ceramic composition may not be formed or may not grow, and the hardness and / or strength of the glass-ceramic composition may be reduced.

[0127] A glass frit or glass-ceramic composition according to one embodiment of the present disclosure may include 1 to 5 wt% of B2O3 and / or 1 to 5 wt% of P2O5. As described in FIG. 6, 1 to 5 wt% of B2O3 and 1 to 5 wt% of P2O5 included in a glass raw material can lower the melting temperature of the glass raw material and promote vitrification, thereby alleviating the complexity or difficulty of a manufacturing process of the glass frit. The glass frit manufactured in this way and the glass-ceramic composition manufactured from the glass frit can include 1 to 5 wt% of B2O3 and 1 to 5 wt% of P2O5. If the content of B2O3 and / or P2O5 is outside the above-described range, the melting temperature in the glass frit manufacturing process may increase, which may result in the glass raw material not being vitrified, or the cordierite crystal phase may not be formed in the sintering and crystallization stages in the glass-ceramic manufacturing process, which may result in a decrease in the hardness of the glass-ceramic.

[0128] According to one embodiment of the present disclosure, a glass frit or glass-ceramic composition may include ZrO2 in an amount of greater than 0 and less than or equal to 8 wt%. As described above, by sintering the glass frit containing ZrO2, the mechanical strength of the sintered body of the glass-ceramic composition may be enhanced. In the process of manufacturing the glass frit, if the content of ZrO2 contained in the glass raw material exceeds 8 wt%, the glass melting temperature may increase, making the process of manufacturing the glass frit complicated and difficult.

[0129] The composition ratio of the materials contained in the glass raw material may be identical to the composition ratio of the materials contained in the glass frit or glass-ceramic composition manufactured from the glass raw material. Accordingly, the glass compositions (#1 to #6) of Table 1 and the glass frit manufactured according to the method of FIG. 6 or the sintered body (glass-ceramic composition) manufactured from such glass frit according to the methods of FIGS. 5, 7, and 8 may have the glass compositions (#1 to #6). For example, a glass-ceramic composition produced by sintering a glass frit comprising 11 to 18 wt% MgO, 28 to 34 wt% Al2O3, and 41 to 51 wt% SiO2 may include a cordierite crystal phase within the glass-ceramic composition and at the same time include 11 to 18 wt% MgO, 28 to 34 wt% Al2O3, and 41 to 51 wt% SiO2. Furthermore, a glass-ceramic composition produced by sintering a glass frit further comprising 0 to 8 wt% ZrO2 may further include a zirconia crystal phase within the glass-ceramic composition and at the same time include 0 to 8 wt% ZrO2.

[0130] Table 2 shows the density, Vickers hardness, dielectric constant, and flexural strength properties of sintered bodies (glass-ceramic compositions) manufactured from glass raw materials containing the glass compositions of Table 1.

[0131] Referring to Table 2, Examples 1 to 6 are cases where glass-ceramic compositions were manufactured by sintering a molded body of glass frit as in FIG. 5 with the glass composition of Table 1, and Examples 7 to 15 are cases where glass-ceramic compositions were manufactured by sintering a molded body of glass frit manufactured by adding yttria-stabilized zirconia to the glass frit as in FIG. 7 with the glass composition of Table 1. For example, Example 7 is a case where a glass-ceramic composition was manufactured by adding yttria-stabilized zirconia to the glass frit of the third glass composition (#3). As shown in Table 2, the density, Vickers hardness, dielectric constant, and flexural strength properties of the glass-ceramic composition may vary depending on the glass composition of the glass frit (or the glass composition of the glass raw material) or the amount of yttria-stabilized zirconia added.

[0132]

[0133] Referring to Tables 1 and 2, for Examples 1 to 4 of Table 2, since the glass frit does not include ZrO2 and no yttria-stabilized zirconia filler is used to form the molded body of the glass frit, the glass-ceramic composition thus produced may not include a zirconia crystal phase. The fact that the patterns (1010) to (1040) for Examples 1 to 4 do not have a ZrO2 peak (1072) may indicate that the glass-ceramic compositions of Examples 1 to 4 do not include a zirconia crystal phase. The patterns (1010) to (1040) for Examples 1 to 4 have an α-cordierite peak (1071). Referring to Table 1 and Fig. 10, it can be determined that the properties of Vickers hardness of 700 Hv or more and / or bending strength of 80 Mpa or more in Table 2 are secured by the cordierite crystal phase generated by MgO, Al2O3, SiO2, B2O3, and P2O5.

[0134] Referring to Table 2, the density of the glass-ceramic compositions of Examples 1 to 4 is 3.5 g / cm3 Hereinafter, the glass frit and glass-ceramic compositions comprising the first to sixth glass compositions (#1 to #6) have the following characteristics: a dielectric constant of 6 or less, a Vickers hardness of 700 Hv or more, and / or a flexural strength of 80 Mpa or more. The glass frit and glass-ceramic compositions are suitable for use in manufacturing a housing of a portable electronic device.

[0135] For Examples 5 and 6, the glass frit and the glass-ceramic composition further include ZrO2, so that the glass-ceramic composition includes a zirconia crystal phase generated from ZrO2. In FIG. 10, the patterns (1050) and (1060) for Examples 5 and 6 have a ZrO2 peak (1072).

[0136] The density and dielectric constant of the glass-ceramic compositions of Examples 5 and 6 slightly increased compared to Examples 1 to 4 as ZrO2 was added, but were still 3.5 g / cm each. 3 Below and below 6 are very low. The Vickers hardness and flexural strength of the glass-ceramic compositions of Examples 5 and 6 increase compared to Examples 1 to 4 as ZrO2 is added, and can have characteristics of Vickers hardness of 800 Hv or more and / or flexural strength of 100 Mpa or more. Pattern (1050) and pattern (1060) have an α-cordierite peak (1071) and a ZrO2 peak (1072). By generating or growing a cordierite crystal phase and a zirconia crystal phase in the glass-ceramic composition, the characteristics of Vickers hardness and / or flexural strength of the glass-ceramic composition can be enhanced.

[0137] As in Examples 5 and 6, by adding ZrO2 to the glass composition of the glass frit or the glass-ceramic composition, the Vickers hardness and / or flexural strength properties of the glass-ceramic composition can be enhanced.

[0138] Examples 7 to 15 of Table 2 used glass frit having the third glass composition (#3), the fifth glass composition (#5), and the sixth glass composition (#6) of Table 1 and yttria-stabilized zirconia (YSZ, containing 8 wt% Y2O3). As in step (720) of FIG. 7, yttria-stabilized zirconia was added (e.g., used as a filler or mixed into the glass frit) to manufacture molded articles of the glass frit having the third glass composition (#3), the fifth glass composition (#5), and the sixth glass composition (#6) (in the example of FIG. 7). In Examples 7 to 15, 5, 10, and 15 wt% of yttria-stabilized zirconia were added, respectively.

[0139] Referring to Examples 7 to 15, the Vickers hardness and / or flexural strength of the glass-ceramic composition including YSZ may be increased compared to Examples 1 to 6 that do not include YSZ, and may have properties of 800 Hv or more and / or 90 MPa or more, respectively. In particular, in Examples 11 and 14, when 10 wt% YSZ is contained in the glass frit of #5 and #6, the glass-ceramic composition may have properties of Vickers hardness of 900 Hv or more and / or flexural strength of 150 MPa or more.

[0140] The sintered bodies of Examples 7 to 15 may include a cordierite crystal phase derived from MgO, Al2O3, and SiO2 and a zirconia crystal phase derived from ZrO2 and / or YSZ.

[0141] The sintered bodies of Examples 7 to 15, unlike the sintered bodies of Examples 3, 5, and 6, may include a zirconia crystal phase generated by sintering YSZ. The properties of the sintered bodies of Examples 7 to 15 having higher Vickers hardness and / or flexural strength than the sintered bodies of Examples 3, 5, or 6 that do not include YSZ may be secured by the zirconia crystal phase generated by YSZ.

[0142] The sintered bodies of Examples 10 to 15, unlike the sintered bodies of Examples 7 to 9, may include a zirconia crystal phase generated by sintering ZrO2 included in the glass frit. Based on the results of comparing the physical properties of Examples 10 to 15 with those of Examples 7 to 9, it can be seen that the simultaneous presence of a zirconia component derived from the glass frit in the glass-ceramic and a zirconia component derived from the YSZ filler is advantageous in securing high Vickers hardness and / or flexural strength properties.

[0143] In Examples 7 to 15, the density and dielectric constant of the glass-ceramic composition slightly increased as the YSZ content of the glass-ceramic composition increased, but at 3.5 g / cm 3 Below and below 6 are low levels.

[0144] According to one embodiment of the present disclosure, the material of the glass-ceramic composition or the housing of the electronic device has a Vickers hardness of 700 Hv or more, a dielectric constant of 7 or less, and a density of 3.5 g / cm 3 It may have the following characteristics:

[0145] FIG. 11 illustrates an XRD pattern (1100) of a glass-ceramic composition comprising a cordierite crystal phase and a zirconia crystal phase according to one embodiment.

[0146] Figure 11 is an XRD pattern of the glass-ceramic compositions of Examples 8, 11, and 14 of Table 2. The glass-ceramic compositions of Examples 8, 11, and 14 are produced using glass frit comprising glass compositions #3 to #6 of Table 1 and 10 wt% of YSZ filler.

[0147] Referring to FIG. 11, the XRD patterns (1130, 1150, 1160) of the glass-ceramic compositions of Examples 8, 11, and 14 include both a peak (1171) of the diffraction pattern of the α-cordierite crystal phase and peaks (1172, 1173) of the diffraction pattern of the zirconia crystal phase. The glass-ceramic compositions of Examples 8, 11, and 14 include a cordierite crystal phase and a zirconia crystal phase.

[0148] Referring to pattern (1130) of Example 8 of FIG. 11, a glass-ceramic according to one embodiment may include a zirconia crystal phase generated by sintering YSZ.

[0149] Also, referring to patterns (1150) of embodiment 11 and pattern (1160) of embodiment 14 of FIG. 11, a glass-ceramic according to one embodiment may include a zirconia crystal phase generated by sintering a glass frit including ZrO2 and YSZ. Also, referring to patterns (1130, 1150, 1160) of FIG. 11, a cordierite crystal phase may be generated by sintering a glass frit including MgO, Al2O3, SiO2, B2O3, and P2O5. Referring to the fact that patterns (1130, 1150, 1160) of FIG. 11 have the same peaks (1172, 1173), when YSZ is added to a glass frit and sintered, the same type of zirconia crystal phase may be generated regardless of whether the glass frit includes ZrO2.

[0150] As described above, the present disclosure provides a glass-ceramic composition comprising a cordierite crystal phase and comprising MgO, Al2O3, SiO2, B2O3, and P2O5, a method for producing the same, and a glass frit composition used for producing the same. The present disclosure also provides a composition or content of MgO, Al2O3, SiO2, B2O3, P2O5, ZrO2, and YSZ to secure density, Vickers hardness, permittivity, and / or bending strength properties suitable for use as a material for a housing of a portable electronic device.

[0151] For example, a glass frit or glass-ceramic composition according to one embodiment of the present disclosure may have a glass composition of 11 to 18 wt% of MgO, 28 to 34 wt% of Al2O3, 41 to 51 wt% of SiO2, 1 to 5 wt% of B2O3, and / or 1 to 5 wt% of P2O5, as shown in Table 1. The glass frit or glass-ceramic composition may preferably have a glass composition of 11 to 18 wt% MgO, 28 to 34 wt% Al2O3, 41 to 51 wt% SiO2, 0 to 8 wt% ZrO2, 1 to 5 wt% B2O3 and / or 1 to 5 wt% P2O5, more preferably, 12 to 17 wt% MgO, 29 to 33 wt% Al2O3, 42 to 50 wt% SiO2, 0 to 7 wt% ZrO2, 1 to 4 wt% B2O3 and / or 1 to 4 wt% P2O5.

[0152] Meanwhile, the bending strength in Table 2 was measured and calculated according to KS M ISO 14125 and KS M ISO 178, and the details are as follows.

[0153] Flexural strength = (3 x span distance x maximum load) / (2 x width x thickness^2)

[0154] 1) Dimensions of the specimen: 38~39 mm (length) x 18~19 mm (width) x 1.2~1.5 mm (thickness)

[0155] 2) Spacing: 10 mm

[0156] A glass-ceramic composition according to one embodiment of the present disclosure includes a cordierite (2MgO · 2Al2O3 · 5SiO2) crystal phase and may include MgO, Al2O3, SiO2, B2O3, and P2O5.

[0157] The glass-ceramic composition of the present disclosure can have both the low dielectric constant properties of MgO, Al2O3, SiO2, B2O3, and P2O5 and the high surface hardness and mechanical strength properties of the cordierite crystal phase by including a cordierite crystal phase obtained by vitrification and crystallization of MgO, Al2O3, and SiO2.

[0158] The above glass-ceramic composition may include 11 to 18 wt% of the MgO, 28 to 34 wt% of the Al2O3, 41 to 51 wt% of the SiO2, 1 to 5 wt% of the B2O3, and 1 to 5 wt% of the P2O5.

[0159] The glass-ceramic composition of the present disclosure has a dielectric constant of 20 or more and a density of 5.8 g / cm, which is typical of zirconia-based ceramics. 3 Unlike the above characteristics, it has a dielectric constant of less than 10 and a density of 3.5 g / cm. 3 It can have the characteristics of Vickers hardness of 700 Hv or more and bending strength of 80 MPa or more while having the characteristics of less than 100 Hv.

[0160] The above glass-ceramic composition may further include a zirconia (ZrO2) crystal phase.

[0161] The above glass-ceramic composition may further include ZrO2 in an amount of more than 0 and less than or equal to 8 wt%.

[0162] The glass-ceramic composition of the present disclosure can be manufactured by a sintering process of only 2 hours at a relatively low temperature of 1050°C, unlike the process of manufacturing general zirconia-based ceramics that requires a high-temperature (e.g., 1400°C) sintering process.

[0163] The glass-ceramic composition is produced from a molded body of glass frit, and the molded body of glass frit may further include yttria-stabilized zirconia (YSZ).

[0164] The molded body of the glass frit may further comprise yttria-stabilized zirconia in an amount of more than 0 and less than or equal to 10 wt%.

[0165] The glass-ceramic composition of the present disclosure can be a glass-ceramic composition having enhanced Vickers hardness and flexural strength by further adding stabilized zirconia to the glass frit and sintering the glass frit.

[0166] The above cordierite crystal phase can be produced by sintering a molded body of glass frit containing MgO, Al2O3, SiO2, B2O3, and P2O5.

[0167] An electronic device according to one embodiment of the present disclosure comprises a housing of the electronic device, at least a portion of which is formed of a glass-ceramic composition including a cordierite (2MgO · 2Al2O3 · 5SiO2) crystal phase, wherein the glass-ceramic composition may include MgO, Al2O3, SiO2, B2O3, and P2O5.

[0168] The above glass-ceramic composition may further include 11 to 18 wt% of the MgO, 28 to 34 wt% of the Al2O3, 41 to 51 wt% of the SiO2, 1 to 5 wt% of the B2O3, and 1 to 5 wt% of the P2O5.

[0169] Since the housing of the electronic device of the present disclosure is formed of a glass-ceramic composition having a dielectric constant of 10 or less, the influence of the housing on signals or power required for communication of the electronic device (e.g., loss of signals or power due to the housing) can be minimized. In addition, the housing of the electronic device has a density of 3.5 g / cm. 3 Since it is formed of a glass-ceramic composition having a Vickers hardness of 700 Hv or more and a bending strength of 80 MPa or more, it can have lightweight and high strength qualities.

[0170] The above glass-ceramic composition may further include a zirconia crystal phase.

[0171] The above glass-ceramic composition may further comprise ZrO2 in an amount of greater than 0 and less than or equal to 8 wt%.

[0172] The glass-ceramic composition is produced from a molded body of glass frit, and the molded body of glass frit may further include yttria-stabilized zirconia (YSZ).

[0173] The molded body of the glass frit may further comprise yttria-stabilized zirconia in an amount of more than 0 and less than or equal to 10 wt%.

[0174] At least a portion of the housing of the electronic device may include a back glass of the electronic device.

[0175] A method for producing a glass-ceramic composition according to one embodiment of the present disclosure may include the steps of producing a glass frit including MgO, Al2O3, SiO2, B2O3, and P2O5; and the step of sintering a molded body of the glass frit. The step of sintering the molded body of the glass frit may produce a cordierite (2MgO · 2Al2O3 · 5SiO2) crystal phase in the glass-ceramic composition.

[0176] The above glass frit may include 11 to 18 wt% of the MgO, 28 to 34 wt% of the Al2O3, 41 to 51 wt% of the SiO2, 1 to 5 wt% of the B2O3, and 1 to 5 wt% of the P2O5.

[0177] According to one embodiment, by including 1 to 5 wt% of B2O3 and 1 to 5 wt% of P2O5 in the production of glass frit, the melting temperatures of MgO, Al2O3, SiO2, B2O3, and P2O5 can be lowered, thereby reducing the complexity or difficulty of the melting and vitrification process.

[0178] The step of sintering the molded body of the glass frit can generate a zirconia (ZrO2) crystal phase in the glass-ceramic composition.

[0179] The above glass frit further comprises ZrO2 in an amount of more than 0 and less than 8 wt%, and the zirconia crystal phase can be formed from the ZrO2.

[0180] The method may further include a step of manufacturing a molded body of the glass frit using the glass frit and yttria-stabilized zirconia (YSZ).

[0181] The step of manufacturing the molded body of the above glass frit may use yttria-stabilized zirconia in an amount of more than 0 and less than 10 wt%.

[0182] A glass-frit composition according to one embodiment of the present disclosure comprises MgO, Al2O3, SiO2, B2O3, and P2O5, wherein the MgO, the Al2O3, the SiO2, the B2O3, and the P2O5 may be associated with the formation of a cordierite (2MgO · 2Al2O3 · 5SiO2) crystal phase.

[0183] The above MgO may be included in an amount of 11 to 18 wt%, the above Al2O3 may be included in an amount of 28 to 34 wt%, the above SiO2 may be included in an amount of 41 to 51 wt%, and the above B2O3 may be included in an amount of 1 to 5 wt%.

[0184] The above glass frit composition further comprises ZrO2, and the ZrO2 may be associated with a zirconia crystal phase.

[0185] The above ZrO2 may be included in an amount of 0 to 8 wt%.

[0186] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0187] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0188] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0189] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0190] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0191] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a glass-ceramic composition, Cordierite (cordierite, 2MgO 2Al 2 O 3 · 5SiO 2 ) including the decision phase, MgO, Al 2 O 3 , SiO 2 , B 2 O 3 , and P 2 O 5 A glass-ceramic composition comprising:

2. In claim 1, The above glass-ceramic composition comprises 11 to 18 wt% of the MgO, 28 to 34 wt% of the Al. 2 O 3 , 41 to 51 wt% of the above SiO 2 , 1 to 5 wt% of the above B 2 O 3 and 1 to 5 wt% of the above P 2 O 5 A glass-ceramic composition comprising:

3. In claim 1, Zirconia (ZrO 2 ) A glass-ceramic composition further comprising a crystal phase.

4. In claim 3, ZrO of 0 to 8 wt% 2 A glass-ceramic composition further comprising:

5. In claim 4, The above glass-ceramic composition is produced from a molded body of glass frit, A glass-ceramic composition, wherein the molded body of the glass frit further comprises yttria-stabilized zirconia (YSZ).

6. In claim 5, A glass-ceramic composition, wherein the molded body of the glass frit further comprises 0 to 10 wt% of the yttria-stabilized zirconia.

7. In claim 1, The above cordierite crystal phase is MgO, Al 2 O 3 , SiO 2 , B 2 O 3 , and P 2 O 5 A glass-ceramic composition produced by sintering a molded body of glass frit including:

8. In electronic devices, At least a portion of the housing of the electronic device is made of cordierite (2MgO 2Al). 2 O 3 · 5SiO 2 ) is formed of a glass-ceramic composition including a crystal phase, The above glass-ceramic composition comprises MgO, Al 2 O 3 , SiO 2 , B 2 O 3 , and P 2 O 5 An electronic device comprising:

9. In claim 8, The above glass-ceramic composition comprises 11 to 18 wt% of the MgO, 28 to 34 wt% of the Al. 2 O 3 , 41 to 51 wt% of the above SiO 2 , 1 to 5 wt% of the above B 2 O 3 and 1 to 5 wt% of the above P 2 O 5 An electronic device comprising:

10. In claim 8, An electronic device, wherein the glass-ceramic composition further comprises a zirconia crystal phase.

11. In claim 10, The above glass-ceramic composition comprises ZrO in an amount of more than 0 and less than or equal to 8 wt%. 2 An electronic device further comprising:

12. In claim 11, The above glass-ceramic composition is produced from a molded body of glass frit, An electronic device, wherein the molded body of the glass frit further comprises yttria-stabilized zirconia (YSZ).

13. In claim 12, An electronic device, wherein the molded body of the glass frit further comprises 0 to 10 wt% of the yttria-stabilized zirconia.

14. In claim 8, An electronic device, wherein at least a portion of the housing of the electronic device comprises a back glass of the electronic device.

15. In a glass-frit composition, MgO, Al 2 O 3 , SiO 2 , B 2 O 3 , and P 2 O 5 Including, The above MgO, the above Al 2 O 3 , the above SiO 2 , above B 2 O 3 , and the above P 2 O 5 is cordierite (cordierite, 2MgO 2Al 2 O 3 · 5SiO 2 ) related to the formation of the decision-making phase, Glass frit composition.

Images