Canister and substrate treatment apparatus

Abstract

The present invention relates to a canister and a substrate treatment apparatus, the canister comprising: a canister body for storing a source material; an inlet part for introducing carrier gas, supplied from an injection part, into the canister body; and an outlet part for discharging the source material, stored in the canister body, to the outside, wherein the inlet part has one end through which the carrier gas is supplied into the canister body and the other end which is connected to the injection part, and the one end of the inlet part is disposed at a position spaced upward from the top of the source material stored in the canister body, so as to supply the carrier gas toward the top of the source material.

Description

Canisters and substrate processing devices

[0001] The present invention relates to a substrate processing device that performs a processing process on a substrate, such as a deposition process or an etching process.

[0002] Typically, to manufacture semiconductor devices, display devices, solar cells, etc., a predetermined thin film layer, thin film circuit pattern, or optical pattern must be formed on a substrate. To this end, substrate processing processes are performed, such as a deposition process that deposits a thin film of a specific material onto the substrate, a photo process that selectively exposes the thin film using a photosensitive material, and an etching process that removes the thin film in the selectively exposed portion to form a pattern. These processing processes are performed by a substrate processing device.

[0003] A substrate processing device according to the prior art may include a substrate support unit that supports a substrate, a supply unit that supplies gas, and an injection unit that injects gas supplied from the supply unit toward the substrate support unit. The supply unit includes a canister that stores a source material, and an injection unit that supplies a carrier gas for transporting the source material to the canister.

[0004] The canister comprises a canister body for storing a source material, and an inlet connected to the injection unit. One end of the inlet is positioned to be immersed in the source material stored in the canister body. Accordingly, the substrate processing device according to the prior art has a problem in that the source material is at risk of being deteriorated due to the carrier gas supplied from within the source material, and if the source material is deteriorated, the quality of the substrate on which the processing process has been performed is degraded.

[0005] The present invention has been devised to solve the above-described problems, and provides a canister and a substrate processing device that can reduce the risk of source material being deteriorated due to carrier gas.

[0006] In order to solve the above-described problem, the present invention may include the following configuration.

[0007] A canister according to the present invention stores a source material to be supplied to a substrate processing device, and may include a canister body for storing the source material; an inlet for introducing a carrier gas supplied from an inlet into the interior of the canister body; and an outlet for discharging the source material stored in the canister body to the outside. One end of the inlet may supply the carrier gas into the interior of the canister body, and the other end may be connected to the inlet. One end of the inlet may be positioned upwardly spaced from the upper end of the source material stored in the canister body, so as to supply the carrier gas toward the upper end of the source material.

[0008] A substrate processing device according to the present invention may include a chamber; a substrate supporter disposed inside the chamber and supporting one or more substrates; an injection unit for injecting gas toward the substrate supporter; and a supply unit connected to the injection unit. The supply unit may include a canister for storing a source material, and an injection unit for supplying a carrier gas to the canister. The canister may include a canister body for storing the source material; an inlet unit for introducing the carrier gas supplied from the injection unit into the interior of the canister body; and an exhaust unit for discharging the source material stored in the canister body to the exterior. The inlet unit may have one end for supplying the carrier gas into the interior of the canister body, and the other end connected to the injection unit. One end of the inlet unit may be disposed at a position spaced upward from an upper end of the source material stored in the canister body, so as to supply the carrier gas toward an upper end of the source material.

[0009] According to the present invention, the following effects can be achieved.

[0010] The present invention is implemented to reduce the risk of source material deterioration due to carrier gas supplied through the inlet. Accordingly, the present invention can improve the quality of the source material supplied to the injection unit, thereby improving the quality of the substrate on which the processing process has been performed.

[0011] Figure 1 is a schematic diagram of a substrate processing device according to the present invention.

[0012] Figures 2 and 3 are schematic side cross-sectional views of an injection unit that injects gas in a substrate processing device according to the present invention.

[0013] Figure 4 is a schematic side view of a canister according to the present invention.

[0014] FIG. 5 is a schematic side cross-sectional view showing a portion of the canister according to the present invention enlarged based on line II of FIG. 4.

[0015] Figure 6 is a schematic perspective view showing another embodiment of the stirring unit in the canister according to the present invention.

[0016] Hereinafter, an embodiment of a substrate processing device according to the present invention will be described in detail with reference to the attached drawings. Since the canister according to the present invention can be included in the substrate processing device according to the present invention, it will be described together with the embodiment of the substrate processing device according to the present invention. In addition, the two parallel dashed-dotted lines in FIG. 5 are omitted.

[0017] Referring to FIG. 1, a substrate processing device (1) according to the present invention performs a processing process on a substrate (100). The substrate (100) may be a silicon substrate, a glass substrate, a metal substrate, or the like. The substrate processing device (1) according to the present invention may perform a deposition process for depositing a thin film on the substrate (100), an etching process for removing a portion of the thin film deposited on the substrate (100), or the like. Hereinafter, an embodiment in which the substrate processing device (1) according to the present invention performs the deposition process will be described, but it will be apparent to those skilled in the art to which the present invention pertains to derive an embodiment in which the substrate processing device (1) according to the present invention performs other processing processes, such as the etching process, therefrom.

[0018] A substrate processing device (1) according to the present invention may include a chamber (2), a substrate support unit (3), an injection unit (4), and a supply unit (5).

[0019] Referring to Fig. 1, the chamber (2) provides a processing space (200). In the processing space (200), a processing process for the substrate (100) can be performed. The processing space (200) can be arranged inside the chamber (2). An exhaust port (not shown) for exhausting gas from the processing space (200) can be coupled to the chamber (2). The substrate support unit (3) and the injection unit (4) can be arranged inside the chamber (2).

[0020] Referring to Fig. 1, the substrate support member (3) supports the substrate (100). The substrate support member (3) may support one substrate (100) or may support multiple substrates (100). When multiple substrates (100) are supported by the substrate support member (3), processing processes for multiple substrates (100) can be performed at once. The substrate support member (3) may be coupled to the chamber (2). The substrate support member (3) may be placed inside the chamber (2).

[0021] Referring to FIGS. 1 to 4, the injection unit (4) injects gas toward the substrate support unit (3). The injection unit (4) may be connected to the supply unit (5). In this case, the injection unit (4) may inject gas supplied from the supply unit (5) toward the substrate support unit (3). The injection unit (4) may be disposed inside the chamber (2). The injection unit (4) may be disposed opposite the substrate support unit (3). The injection unit (4) may be disposed above the substrate support unit (3). The processing space (200) may be disposed between the injection unit (4) and the substrate support unit (3). The injection unit (4) may be coupled to a lid (not shown). The lid may be coupled to the chamber (2) so as to cover the upper portion of the chamber (2).

[0022] The above injection unit (4) may include a first gas path (4a) and a second gas path (4b).

[0023] The first gas path (4a) is for injecting the first gas. One side of the first gas path (4a) may be connected to the supply unit (5) through a pipe, hose, block, or the like. The other side of the first gas path (4a) may be connected to the processing space (200). Accordingly, the first gas supplied from the supply unit (5) may flow along the first gas path (4a) and then be injected into the processing space (200) through the first gas path (4a). The first gas path (4a) may function as a path for the first gas to flow and also as an injection port for injecting the first gas into the processing space (200).

[0024] The second gas path (4b) is for injecting the second gas. The second gas and the first gas may be different gases. For example, when the first gas is a source gas, the second gas may be a reactant gas. The second gas path (4b) may have one end connected to the supply unit (5) through a pipe, hose, block, or the like. The other end of the second gas path (4b) may be connected to the processing space (200). Accordingly, the second gas supplied from the supply unit (5) may flow along the second gas path (4b) and then be injected into the processing space (200) through the second gas path (4b). The above second gas path (4b) can function as a path for the second gas to flow and can also function as an injection port for injecting the second gas into the processing space (200).

[0025] The second gas path (4b) and the first gas path (4a) may be arranged to be spatially separated from each other. Accordingly, the second gas supplied from the supply unit (5) to the second gas path (4b) may be injected into the processing space (200) without passing through the first gas path (4a). The first gas supplied from the supply unit (5) to the first gas path (4a) may be injected into the processing space (200) without passing through the second gas path (4b). The second gas path (4b) and the first gas path (4a) may inject gas toward different parts of the processing space (200).

[0026] For example, as shown in FIG. 2, the injection unit (4) may include a first plate (41) and a second plate (42).

[0027] The first plate (41) is disposed on the upper side of the second plate (42). The first plate (41) and the second plate (42) may be disposed spaced apart from each other. A plurality of first gas holes (411) may be formed in the first plate (41). Each of the first gas holes (411) may function as a passage for the first gas to flow. The first gas holes (411) may belong to the first gas path (4a). A plurality of second gas holes (412) may be formed in the first plate (41). Each of the second gas holes (412) may function as a passage for the second gas to flow. The second gas holes (412) may belong to the second gas path (4b). A plurality of protruding members (413) may be combined with the first plate (41). The protruding members (413) may protrude from the lower surface of the first plate (41) toward the second plate (42). Each of the first gas holes (411) may be formed by penetrating the first plate (41) and the protruding members (413).

[0028] A plurality of openings (421) may be formed in the second plate (42). The openings (421) may be formed by penetrating the second plate (42). The openings (421) may be arranged at positions corresponding to the respective protruding members (413). As illustrated in FIG. 2, the protruding members (413) may be formed to have a length such that they are inserted into each of the openings (421). Although not illustrated, the protruding members (413) may also be formed to have a length such that they are arranged above each of the openings (421). The protruding members (413) may also be formed to have a length that protrudes downward from the second plate (42). The second gas holes (412) may be arranged to inject gas toward the upper surface of the second plate (42). Although not shown, the lower surface of the first plate (41) may be formed flat without the protruding member (413).

[0029] For example, as illustrated in FIG. 3, a plurality of first openings (422) and a plurality of second openings (423) may be formed in the second plate (42).

[0030] The first openings (422) may be formed by penetrating the second plate (42). The second openings (423) may be formed by penetrating the second plate (42). The second plate (42) and the first plate (41) may be arranged to be spaced apart from each other. The lower surface of the first plate (41) facing the second plate (42) may be formed flat without the protruding member (413, illustrated in FIG. 2). The first gas and the second gas may be supplied to the space between the first plate (41) and the second plate (42) through the first gas holes (411) and the second gas holes (412), and then sprayed into the processing space (200) through the first openings (422) and the second openings (423). In this case, when the supply of the first gas through the first gas holes (411) and the supply of the second gas through the second gas holes (412) are performed simultaneously, the first gas and the second gas can be mixed in the space between the first plate (41) and the second plate (42) and then sprayed into the processing space (200) through the first openings (422) and the second openings (423).

[0031] Meanwhile, the first openings (422) may be arranged vertically below each of the first gas holes (411). In this case, the first openings (422) and the first gas holes (411) may be arranged on the same vertical line. Although not shown, the first openings (422) and the first gas holes (411) may be arranged at staggered positions. In this case, the first openings (422) and the first gas holes (411) may be arranged at positions where they do not overlap each other, or may be arranged at positions where they only partially overlap each other.

[0032] Meanwhile, the second openings (423) may be arranged vertically below each of the second gas holes (412). In this case, the second openings (423) and the second gas holes (412) may be arranged on the same vertical line. Although not shown, the second openings (423) and the second gas holes (412) may be arranged at staggered positions. In this case, the second openings (423) and the second gas holes (412) may be arranged at positions where they do not overlap each other, or may be arranged at positions where they only partially overlap each other.

[0033] Meanwhile, the injection unit (4) can form plasma using the second plate (42) and the first plate (41). In this case, plasma power, such as RF power, may be applied to the first plate (41), and the second plate (42) may be grounded. The first plate (41) may be grounded, and plasma power may be applied to the second plate (42).

[0034] Referring to FIGS. 1 to 5, the supply unit (5) can supply gas to the injection unit (4). The supply unit (5) can supply the first gas and the second gas to the injection unit (4). The supply unit (5) can also supply purge gas to the injection unit (4). The supply unit (5) can be connected to the injection unit (4) via a pipe, a hose, a block, or the like. The supply unit (5) can include an injection unit (51) and a canister (52).

[0035] The above injection unit (51) can supply a carrier gas. By the carrier gas, gas can be smoothly supplied from the supply unit (5) to the injection unit (4). The carrier gas can be an inert gas such as argon (Ar). The injection unit (51) can be connected to the canister (52). Accordingly, the injection unit (51) can supply the carrier gas to the canister (52). The injection unit (51) can be connected to the canister (52) through an inlet line (5a). The inlet line (5a) can be implemented as a pipe, a hose, a block, or the like.

[0036] The canister (52) can store a source material (50, as shown in FIG. 5). The canister (52) can be connected to the injection unit (4). Accordingly, the canister (52) can supply the source material (50) to the injection unit (4) using the carrier gas supplied from the injection unit (51). The canister (52) can be connected to the injection unit (4) via a discharge line (5b). The discharge line (5b) can be implemented as a pipe, a hose, a block, or the like. The canister (52) can be implemented as a canister according to the present invention.

[0037] The canister (52) can store a source material (50) in a liquid or solid state. The canister (52) can discharge the source material (50) in a liquid or solid state to the discharge line (5b) using the carrier gas supplied from the injection unit (51). In this case, a vaporizer (not shown) for vaporizing the source material in a liquid state into a gas, or a sublimator (not shown) for sublimating the source material in a solid state into a gas, may be installed in the discharge line (5b). Accordingly, the source gas formed using the source material (50) can be supplied to the injection unit (4). The canister (52) can also discharge the source gas to the discharge line (5b) after vaporizing or sublimating the source material (50) in a liquid or solid state into a source gas. In this case, a heater (not shown) that provides heat for vaporization or sublimation may be installed in the canister (52).

[0038] The above canister (52) may include a canister body (521) and an inlet (522).

[0039] The canister body (521) can store the source material (50). The canister body (521) can be formed in a form in which the interior is empty. Accordingly, the canister body (521) can store the source material (50) using the space within the interior.

[0040] The above inlet (522) can introduce the carrier gas supplied from the injection unit (51) into the interior of the canister body (521). One end (522a) of the inlet (522) can be disposed inside the canister body (521), and the other end (522b) can be connected to the injection unit (51). The other end (522b) of the inlet (522) can be connected to the inlet line (5a) from the outside of the canister body (521), thereby being connected to the injection unit (51) through the inlet line (5a). Accordingly, the inlet (522) can supply the carrier gas supplied through the other end (522b) into the interior of the canister body (521) through the one end (522a). The above inlet (522) may be formed in a cylindrical shape with an entirely empty interior, but is not limited thereto and may be formed in another shape as long as the carrier gas can flow through the interior.

[0041] One end (522a) of the inlet (522) may be positioned at a position spaced upward from the upper end (50a, illustrated in FIG. 5) of the source material (50) stored in the canister body (521). That is, the inlet (522) may be positioned so that the one end (522a) is not submerged in the source material (50) stored in the canister body (521). Accordingly, the inlet (522) may supply the carrier gas toward the upper end (50a) of the source material (50) through the one end (522a). Therefore, when compared to a comparative example in which one end (522a) of the inlet portion (522) is arranged to be immersed in the source material (50) and the carrier gas is injected into the inside of the source material (50), the substrate processing device (1) according to the present invention can reduce the risk of the source material (50) being deteriorated due to the carrier gas supplied through the inlet portion (522). Accordingly, the substrate processing device (1) according to the present invention can improve the quality of the source material (50) supplied to the injection portion (4), and thus can improve the quality of the substrate (100) on which the processing process is performed.

[0042] Meanwhile, when the source material (50) is stored at a preset maximum height inside the canister body (521), the inlet (522) may be positioned at a position where the end (522a) is spaced upward from the upper end (50a) of the source material (50). The maximum height may be preset by the operator. The maximum height may be lower than the height of the canister body (521).

[0043] The above canister (52) may include a discharge portion (523).

[0044] The discharge unit (523) can discharge the source material (50) stored in the canister body (521) to the outside. One end (523a) of the discharge unit (523) can be disposed inside the canister body (521), and the other end (523b) can be disposed outside the canister body (521). Accordingly, the discharge unit (523) can discharge the source material (50) stored inside the canister body (521) to the outside of the canister body (521).

[0045] The other end (523b) of the discharge portion (523) may be connected to the discharge line (5b) from the outside of the canister body (521). Accordingly, the other end (523b) of the discharge portion (523) may be connected to the injection portion (4) through the discharge line (5b). One end (523a) of the discharge portion (523) may be arranged to be submerged inside the source material (50) stored in the canister body (521). Accordingly, the discharge portion (523) may discharge the source material (50) introduced through the one end (523a) to the outside of the canister body (521) through the other end (523b) and supply it to the injection portion (4) through the discharge line (5b). The above discharge portion (523) may be formed in a cylindrical shape with an entirely empty interior, but is not limited thereto, and may be formed in another shape as long as the source material (50) can flow through the interior.

[0046] The above canister (52) may include a cover (524).

[0047] The cover (524) can cover the upper part of the canister body (521). The cover (524) can close the open upper part of the canister body (521). The inlet (522) and the outlet (523) can be coupled to the cover (524). The inlet (522) and the outlet (523) can be coupled to the cover (524) at positions spaced apart from each other. Accordingly, the substrate processing device (1) according to the present invention can reduce the degree of influence between the operation of supplying the carrier gas into the interior of the canister body (521) through the inlet (522) and the operation of discharging the source material (50) stored inside the canister body (521) to the outside through the outlet (523). The above inlet (522) and the above discharge (523) can be coupled to the cover (524) so ​​as to be spaced apart from the inner side wall of the canister body (521).

[0048] When the cover (524) is provided, the inlet (522) and the outlet (523) may be coupled to the cover (524) so ​​as to protrude from the bottom surface (524a) of the cover (524) toward the inside of the canister body (521). The bottom surface (524a) of the cover (524) is arranged to face the source material (50) stored in the canister body (521). The length by which the inlet (522) protrudes from the bottom surface (524a) of the cover (524) may be shorter than the length by which the outlet (523) protrudes from the bottom surface (524a) of the cover (524). Accordingly, the inlet (522) may be arranged so that one end (522a) is not submerged in the source material (50), and the outlet (523) may be arranged so that one end (523a) is submerged inside the source material (50). The inlet (522) and the outlet (523) may be coupled to the cover (524) so ​​as to protrude upward from the upper surface of the cover (524). In this case, the other end (522b) of the inlet (522) and the other end (523b) of the outlet (523) may be arranged at a position spaced upward from the upper surface of the cover (524).

[0049] Referring to FIGS. 1 to 5, the canister (52) may include a stirring unit (525) and a rotating unit (526).

[0050] The above stirring unit (525) may be placed inside the canister body (521). The stirring unit (525) may be rotated by the rotating unit (526) to cause the source material (50) to flow. Accordingly, the stirring unit (525) may reduce the degree of partial deviation in the density of the source material (50). Accordingly, the canister (52) may improve the quality of the source gas supplied to the injection unit (4) by using the stirring unit (525), thereby contributing to improving the quality of the substrate (100) on which the processing process is performed.

[0051] The above stirring unit (525) may include a stirring shaft (525a) and a plurality of stirring blades (525b).

[0052] The above stirring shaft (525a) may be connected to the rotating part (526). The stirring blades (525b) may be coupled to the stirring shaft (525a). As the rotating part (526) provides a rotating force and the stirring shaft (525a) rotates, the stirring blades (525b) coupled to the stirring shaft (525a) rotate together, thereby causing the source material (50) to flow.

[0053] The above stirring blades (525b) may be coupled to the stirring shaft (525a) at positions spaced apart from each other. The stirring blades (525b) may be arranged to be spaced apart from each other in the depth direction of the source material (50). Accordingly, the stirring blades (525b) may further reduce the degree of partial deviation in the density of the source material (50) by causing different parts of the source material (50) to flow.

[0054] The above-described rotating part (526) can rotate the above-described stirring part (525). The above-described rotating part (526) can be coupled to the cover (524). In this case, the above-described stirring shaft (525a) can be coupled to the cover (524) from the upper side of the cover (524). The above-described stirring shaft (525a) can be rotatably coupled to the cover (524). The above-described rotating part (526) can include a motor that provides a rotating force.

[0055] When the above stirring unit (525) is provided, the inlet unit (522) and the discharge unit (523) may be arranged on opposite sides with respect to the stirring unit (525). In this case, the inlet unit (522) and the discharge unit (523) may be arranged on opposite sides with respect to the stirring shaft (525a). Accordingly, the substrate processing device (1) according to the present invention can further reduce the degree of influence between the operation of supplying the carrier gas into the interior of the canister body (521) through the inlet unit (522) and the operation of discharging the source material (50) stored inside the canister body (521) to the outside through the discharge unit (523).

[0056] Referring to FIGS. 1 to 5, the canister (52) may include a first sealing portion (527, shown in FIG. 5).

[0057] The first sealing portion (527) can seal the space between the stirring portion (525) and the cover (524). The first sealing portion (527) is arranged between the bottom surface of the connecting portion (525c) of the stirring portion (525) and the top surface of the cover (524), thereby sealing the space between the stirring portion (525) and the cover (524). That is, the first sealing portion (527) can seal the space between the stirring portion (525) and the cover (524) from the outside of the cover (524). The stirring shaft (525a) can be coupled to one side of the connecting portion (525c), and the other side of the connecting portion (525c) can be coupled to the rotating portion (526). Accordingly, the connecting portion (525c) can connect the stirring shaft (525a) and the rotating portion (526). Since the first sealing portion (527) seals the space between the stirring portion (525) and the cover (524), the substrate processing device (1) according to the present invention can be implemented so that a process can be performed in a vacuum environment even if the stirring portion (525) is provided in the canister (52). The first sealing portion (527) can be implemented as an O-ring. In FIG. 5, the first sealing portion (527) is illustrated as being inserted into a groove formed on the bottom surface of the connecting portion (525c), but this is not limited thereto, and the first sealing portion (527) may also be inserted into a groove formed on the upper surface of the cover (524). The above first sealing portion (527) may be inserted into both the groove formed on the lower surface of the connecting portion (525c) and the groove formed on the upper surface of the cover (524).

[0058] Referring to FIGS. 1 to 5, the canister (52) may include a second sealing portion (528, shown in FIG. 5).

[0059] The second sealing portion (528) can seal the space between the stirring portion (525) and the cover (524). The second sealing portion (528) is positioned between the portion of the connecting portion (525c) inserted into the cover (524) and the cover (524), thereby sealing the space between the stirring portion (525) and the cover (524). That is, the second sealing portion (528) can seal the space between the stirring portion (525) and the cover (524) inside the cover (524). Since the second sealing portion (528) and the first sealing portion (527) double seal the space between the stirring portion (525) and the cover (524) at different locations, the substrate processing device (1) according to the present invention can further strengthen the sealing force for the canister (52) even if the stirring portion (525) is provided in the canister (52). The second sealing portion (528) may be implemented as a quad ring. In FIG. 5, the second sealing portion (528) is illustrated as being inserted into a groove formed in the interior of the cover (524), but is not limited thereto, and the second sealing portion (528) may also be inserted into a groove formed on the side surface of the connecting portion (525c). The second sealing portion (528) may also be inserted into both the groove formed in the interior of the cover (524) and the groove formed on the side surface of the connecting portion (525c). The canister (52) may include a plurality of second sealing portions (528). The second sealing portions (528) may be spaced apart from each other. Accordingly, the second sealing portions (528) may further strengthen the sealing force between the stirring portion (525) and the cover (524).

[0060] Referring to FIGS. 1 to 5, the canister (52) may include a sealing portion (529, shown in FIG. 5).

[0061] The sealing portion (529) can seal the space between the canister body (521) and the cover (524). Accordingly, the substrate processing device (1) according to the present invention can further strengthen the sealing force for the canister (52). The sealing portion (529) can be implemented as an O-ring. In FIG. 5, the sealing portion (529) is illustrated as being inserted into a groove formed on the upper surface of the canister body (521), but is not limited thereto, and the sealing portion (529) may also be inserted into a groove formed on the lower surface of the cover (524). The sealing portion (529) may be inserted into both the groove formed on the upper surface of the canister body (521) and the groove formed on the lower surface of the cover (524).

[0062] Referring to FIGS. 1 to 6, the agitating unit (525) can be implemented so as to not only flow the source material (50) in a horizontal direction, but also flow the source material (50) in a depth direction. To this end, each of the agitating blades (525b) can be implemented as follows.

[0063] One side (5251b) of the stirring blade (525b) and the other side (5252b) of the stirring blade (525b) may be coupled to the stirring shaft (525a) at positions spaced apart from each other along the depth direction of the source material (50). In this case, the stirring blade (525b) may be coupled to the stirring shaft (525a) at a higher height than the other side (5252b) of the stirring blade (525b). One side (5251b) of the stirring blade (525b) and the other side (5252b) of the stirring blade (525b) may be coupled to the stirring shaft (525a) in different directions based on the center of the stirring shaft (525a). That is, the stirring blade (525b) may be formed in a twisted shape while extending from the one side (5251b) to the other side (5252b). Accordingly, the stirring blade (525b) may rotate together with the rotation of the stirring shaft (525a) to cause the source material (50) to flow in the horizontal direction and the depth direction. Accordingly, the stirring unit (525) may further reduce the degree of partial deviation in the density of the source material (50) by using the stirring blades (525b). The center of the stirring shaft (525a) may mean the rotation axis of the stirring shaft (525a). The center of the stirring shaft (525a) may be arranged parallel to the depth direction of the source material (50).

[0064] The above-described stirring unit (525) may include a coupling unit (525d). The coupling unit (525d) may be coupled to coupling wings (5253b) of the stirring blades (525b) to connect the coupling wings (5253b). Each of the coupling wings (5253b) may correspond to a portion of the stirring blade (525b) located between one side (5251b) of the stirring blade (525b) and the other side (5252b) of the stirring blade (525b). Accordingly, the coupling unit (525d) may prevent deformation or the like from occurring in the stirring blades (525b) during the process of flowing the source material (50) while the stirring blades (525b) rotate. The above-mentioned coupling portion (525d) may be positioned at the end of the stirring shaft (525a) in the depth direction of the source material (50). The above-mentioned coupling portion (525d) may be coupled to the stirring shaft (525a) via the coupling wings (5253b). The above-mentioned coupling portion (525d) may also be directly coupled to the stirring shaft (525a).

[0065] Meanwhile, although FIG. 5 illustrates an example of the stirring blades (525b) spaced apart from each other along the depth direction of the source material (50), as illustrated in FIG. 6, the stirring blades (525b) implemented to allow the source material (50) to flow in the horizontal direction and the depth direction may also be applied.

[0066] Meanwhile, when the canister (52) is implemented to supply the source gas, the supply unit (5) may include a reactant gas supply unit (not shown). The reactant gas supply unit may supply the reactant gas to the injection unit (4). The injection unit (4) may inject the reactant gas into the processing space (200) through the second gas path (4b). The supply unit (5) may also include a purge gas supply unit (not shown). The purge gas supply unit may supply the purge gas to the injection unit (4). The injection unit (4) may inject the purge gas into the processing space (200) through at least one of the first gas path (4a) and the second gas path (4b).

[0067] The present invention described above is not limited to the above-described embodiments and the attached drawings, and it will be apparent to a person skilled in the art to which the present invention pertains that various substitutions, modifications, and changes are possible within a scope that does not depart from the technical spirit of the present invention.

Claims

1. Chamber; A substrate support member disposed inside the chamber and supporting one or more substrates; an injection unit for injecting gas toward the substrate support unit; and Including a supply unit connected to the above injection unit, The above supply unit includes a canister for storing a source material, and an injection unit for supplying a carrier gas to the canister, The above canister, A canister body for storing source material; An inlet for introducing the carrier gas supplied from the injection unit into the interior of the canister body; and Includes a discharge unit for discharging the source material stored in the canister body to the outside, The above inlet portion supplies the carrier gas to the inside of the canister body at one end, and the other end is connected to the injection portion. A substrate processing device characterized in that one end of the inlet is positioned upwardly spaced from the top of the source material stored in the canister body to supply the carrier gas toward the top of the source material.

2. In paragraph 1, The canister includes a cover covering the upper portion of the canister body, The inlet and outlet portions are joined to the cover so as to protrude from the bottom surface of the cover toward the inside of the canister body, A substrate processing device characterized in that the length by which the inlet protrudes from the bottom surface of the cover is shorter than the length by which the outlet protrudes from the bottom surface of the cover.

3. In paragraph 1, The above discharge part is arranged at one end inside the canister body and at the other end outside the canister body. One end of the above discharge portion is arranged to be immersed inside the source material, A substrate processing device characterized in that the other end of the above discharge unit is connected to the above injection unit.

4. In paragraph 1, A stirring unit arranged inside the canister body; and A substrate processing device characterized by including a rotating part that rotates the above stirring part.

5. In paragraph 4, The above stirring unit includes a stirring shaft connected to the rotating unit, and a plurality of stirring blades coupled to the stirring shaft, A substrate processing device characterized in that one side and the other side of each of the stirring blades are coupled to the stirring shaft at positions spaced apart from each other along the depth direction of the source material and are coupled to the stirring shaft in different directions based on the center of the stirring shaft.

6. In the fourth paragraph, the canister, A cover covering the upper part of the canister body; A first sealing member that seals between the cover and the stirring member from the outside of the cover; and A substrate processing device characterized by including a second sealing member that seals between the cover and the stirring member inside the cover.

7. In paragraph 1, The canister includes a cover covering the upper portion of the canister body, A substrate processing device characterized in that the inlet and outlet are connected to the cover at positions spaced apart from each other.

8. A canister for storing source materials to be supplied to the substrate processing device. A canister body for storing source material; An inlet for introducing carrier gas supplied from an inlet into the interior of the canister body; and Includes a discharge unit for discharging the source material stored in the canister body to the outside, The above inlet portion supplies the carrier gas to the inside of the canister body at one end, and the other end is connected to the injection portion. A canister characterized in that one end of the inlet is positioned upwardly spaced from the top of the source material stored in the canister body, thereby supplying the carrier gas toward the top of the source material.

9. In paragraph 8, The canister includes a cover covering the upper portion of the canister body, The inlet and outlet portions are joined to the cover so as to protrude from the bottom surface of the cover toward the inside of the canister body, A canister characterized in that the length by which the inlet protrudes from the bottom surface of the cover is shorter than the length by which the outlet protrudes from the bottom surface of the cover.

10. In paragraph 8, The above discharge part is arranged at one end inside the canister body and at the other end outside the canister body. One end of the above discharge portion is arranged to be immersed inside the source material, A canister characterized in that the other end of the discharge section is connected to the injection section of the substrate processing device.

11. In paragraph 8, A stirring unit arranged inside the canister body; and A canister characterized by including a rotating part that rotates the above stirring part.

12. In paragraph 11, The above stirring unit includes a stirring shaft connected to the rotating unit, and a plurality of stirring blades coupled to the stirring shaft, A canister characterized in that one side and the other side of each of the stirring blades are coupled to the stirring shaft at positions spaced apart from each other along the depth direction of the source material and are coupled to the stirring shaft in different directions based on the center of the stirring shaft.

13. In paragraph 11, A cover covering the upper part of the canister body; A first sealing member that seals between the cover and the stirring member from the outside of the cover; and A canister characterized by including a second sealing member that seals between the cover and the stirring member inside the cover.

14. In paragraph 8, The canister includes a cover covering the upper portion of the canister body, A canister characterized in that the inlet and outlet are connected to the cover at positions spaced apart from each other.

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