Heat dissipation apparatus

Abstract

A heat dissipation apparatus according to the present invention includes: a one side heat conduction panel provided as a metal panel member; and another side heat conduction panel provided as a metal panel member, wherein bent edge end portions of the one side heat conduction panel and the other side heat conduction panel are surface-bonded to each other to form a refrigerant flow space in which a refrigerant undergoes a phase change and flows, and at least a portion of the bent edge end portion of one of the one side heat conduction panel or the other side heat conduction panel is disposed to at least partially overlap the bent edge end portion of the other side heat conduction panel in the thickness direction of the refrigerant flow space so that the bent edge end portions can be surface-bonded to each other, thereby providing the advantages of maximizing heat dissipation performance and preventing injury to workers during product manufacturing.

Description

heat dissipation device

[0001] The present invention relates to a heat dissipation apparatus, and more particularly, to a heat dissipation apparatus that prevents a change in the volume of a refrigerant flow space despite a change in internal pressure within the refrigerant flow space when a refrigerant, which is a phase change material, changes its phase, and is designed so that condensed liquid refrigerant can be evenly collected in the direction of gravity, thereby maximizing heat dissipation performance, and by forming sharp edges to be rounded, prevents injury to workers, and improves product productivity.

[0002] In diverse industries such as communications, electronics, and electrical engineering, related technologies are continuously being developed at an advanced level for application in more advanced industries. This advanced technological development requires high-power energy, and devices utilizing this energy inevitably face the problem of high heat generation. Consequently, the development of appropriate cooling systems is essential.

[0003] Heat dissipation systems are used in a variety of industries, including air conditioners, mobile communications, data centers, aerospace mobility, electric vehicles, energy storage devices, and displays. These systems are a major source of power consumption, and power consumption is steadily increasing as industries develop.

[0004] In general, heat dissipation devices are largely divided into Active Cooling Devices and Passive Cooling Devices. Active Cooling Devices mainly utilize Forced Convection by fans, while Passive Cooling Devices can be classified as a technology that utilizes Natural Convection without fans.

[0005] However, conventional heat dissipation systems have limitations in dissipating the high heat generated by continuously evolving, advanced technologies. Therefore, related industries urgently need innovative technologies to address these issues, and heat dissipation devices are being developed to address this issue.

[0006] Phase change refers to the change in the inherent state of a liquid / gas / solid when it accumulates a large amount of energy or releases stored heat energy.

[0007] A phase change refers to a change in the physical arrangement of molecules rather than a chemical reaction such as chemical bonding or formation. When energy is applied to a substance, the heat that does not undergo a phase change is called sensible heat, and the heat used when the phase changes is called latent heat.

[0008] However, radiators have a problem: since temperature and pressure are proportional, pressure increases as temperature increases. This can lead to the rupture of the radiator itself if the high temperature transmitted from the heating element within the sealed radiator increases pressure. To address this, pressure must be prevented from increasing, and the radiator must have sufficient internal volume to ensure pressure equilibrium during the phase change cycle of the material.

[0009]

[0010] The present invention has been devised to solve the above-mentioned technical problem, and its purpose is to provide a heat dissipation mechanism capable of maximizing heat dissipation performance.

[0011] In addition, another purpose of the present invention is to provide a heat dissipation device that can minimize injury to workers during the manufacturing of a product.

[0012] In addition, another object of the present invention is to provide a heat dissipation device that can prevent injury to installation workers.

[0013] The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0014]

[0015] A heat dissipation device according to one embodiment of the present invention comprises a heat-conducting panel on one side provided with a metal panel member and a heat-conducting panel on the other side provided with a metal panel member, wherein the one heat-conducting panel and the other heat-conducting panel have folded edge ends that are mutually face-to-face bonded to form a refrigerant flow space in which a refrigerant therein undergoes a phase change and flows, and at least a portion of the folded edge end of one of the one heat-conducting panel and the other heat-conducting panel overlaps the other folded edge end in the thickness direction of the refrigerant flow space so as to enable the mutual face-to-face bonding.

[0016] Here, the edge end of the one-side heat-conducting panel and the edge end of the other-side heat-conducting panel can each be bent in a direction that forms the thickness of the refrigerant flow space.

[0017] In addition, the folded edge end of the one-side heat-conducting panel may be a one-side thickness-forming panel that forms part of the thickness of the refrigerant flow space, and the folded edge end of the other-side heat-conducting panel may be a other-side thickness-forming panel that forms part of the thickness of the refrigerant flow space.

[0018] According to another embodiment of the present invention, a heat dissipation device includes a one-sided heat-conducting panel made of a metal panel member and an other-sided heat-conducting panel made of a metal panel member, wherein the one-sided heat-conducting panel and the other-sided heat-conducting panel have folded edge ends that are mutually face-to-face bonded to form a refrigerant flow space in which a refrigerant therein undergoes a phase change and flows, and at least a portion of the folded edge end of one of the one-sided heat-conducting panel and the other-sided heat-conducting panel overlaps with the other folded edge end on an outer side in the thickness direction of the refrigerant flow space so as to enable the mutual face-to-face bonding.

[0019] Here, among the one-sided heat-conducting panel and the other-sided heat-conducting panel, a border end of the other-sided heat-conducting panel to be inserted may be provided with a thickness-forming panel folded perpendicularly, and among the one-sided heat-conducting panel and the other-sided heat-conducting panel, a border end of the one-sided heat-conducting panel to be inserted may be provided with a joint that is folded and contacts the inside of the front end of the thickness-forming panel of the other-sided heat-conducting panel.

[0020] In addition, a contact surface portion may be further processed and formed to protrude outwardly from the refrigerant flow space so as to come into contact with the inner surface of the press-fit portion at the edge end inserted into the press-fit portion having a slot-shaped press-fit slot arranged to transfer heat generated from the heating elements among the one-sided heat-conducting panels.

[0021] Additionally, the contact surface formed on the one-sided heat-conducting panel may be formed to be spaced apart from the joint.

[0022] In addition, a plurality of strength reinforcing portions formed to be sunken toward the refrigerant flow space may be further formed on the one-side heat-conducting panel and the other-side heat-conducting panel, and the contact surface portion may be formed to protrude in the opposite direction to the plurality of strength reinforcing portions formed on the one-side heat-conducting panel.

[0023] In addition, when a portion relatively close to the heating elements that generate and supply a predetermined amount of heat as an end portion of the one-side heat-conducting panel and the other-side heat-conducting panel is defined as an evaporation end portion, and a portion other than the evaporation end portion is defined as a condensation end portion, a plurality of condensation sintered columns may be further included that are arranged on the refrigerant flow space and guide the flow of the condensed liquid refrigerant toward the evaporation end portion in the condensation end portion other than the evaporation end portion of the one-side heat-conducting panel and the other-side heat-conducting panel installed in the pressurized portion.

[0024] Additionally, the plurality of condensing sintered body columns can be installed in the refrigerant flow space via an evaporating sintered body base that connects each end.

[0025] In addition, a plurality of column support protrusions for supporting the installation of the plurality of condensation sintered body columns may be further formed on the one-side heat-conducting panel and the other-side heat-conducting panel, and the contact surface portion may be formed to protrude in the opposite direction to the plurality of column support protrusions formed on the one-side heat-conducting panel.

[0026] A heat dissipation device according to another embodiment of the present invention includes a one-side heat-conducting panel made of a metal panel member and an other-side heat-conducting panel made of a metal panel member and forming a refrigerant flow space between the one-side heat-conducting panel and the other-side heat-conducting panel in which the refrigerant changes phase and flows, and a thickness-forming panel is formed by bending the other-side heat-conducting panel so as to be inserted into the one-side heat-conducting panel, and a tip is joined to be hidden from the outside by the one-side heat-conducting panel.

[0027] Here, in the one-sided heat-conducting panel, a one-sided thickness-forming panel can be folded and formed orthogonally to enable surface bonding with the other-sided thickness-forming panel of the other-sided heat-conducting panel.

[0028] Additionally, the outer surface of the other side heat-conducting panel and the tip of the one side thickness forming panel of the one side heat-conducting panel can be matched with each other.

[0029] In addition, the other side thickness forming panel of the other side heat-conducting panel may be rounded with a radius of a predetermined size with respect to the outer surface of the other side heat-conducting panel so that a gap for applying a filler material is formed between the tip of the one side thickness forming panel of the one side heat-conducting panel.

[0030] In addition, the above-mentioned gap for applying the filler material can be defined as a gap between the tip of the one-sided thickness forming panel that is bent perpendicularly to the outer surface of the one-sided heat-conducting panel and the outer surface of the other-sided heat-conducting panel.

[0031] Additionally, a filler material that melts above a predetermined melting point can be applied to the gap where the filler material is applied.

[0032] In addition, the above-mentioned filler material can be applied to the gap between the filler material applications and then the one-side heat-conducting panel and the other-side heat-conducting panel can be joined by a brazing welding method.

[0033] In addition, the one-side heat-conducting panel and the other-side heat-conducting panel may be provided with a metal panel member made of SUS material.

[0034] In addition, the one-side heat-conducting panel and the other-side heat-conducting panel can be laminated and bonded by a laser welding method or a brazing welding method.

[0035] In addition, the plurality of condensation sintered body columns and evaporation sintered body bases can be formed by sintering powder made of SUS material.

[0036] In addition, the plurality of condensation sintered body columns and evaporation sintered body bases can be formed by sintering metal powder (powder) of the same material as the material of the metal panel members of the one-side heat-conducting panel and the other-side heat-conducting panel.

[0037] Additionally, the material of the metal powder of the plurality of condensation sintered body columns and the evaporation sintered body base may be SUS.

[0038] In addition, the above evaporation sintered body base can be formed by sintering a metal powder made of copper (Cu).

[0039] In addition, the one-side heat-conducting panel and the other-side heat-conducting panel may be made of the same metal material or different metal materials having a thermal conductivity of a predetermined level or higher.

[0040] Additionally, the one-side heat-conducting panel and the other-side heat-conducting panel can be processed into sheet metal using a press mold process.

[0041]

[0042] According to a heat dissipation mechanism according to one embodiment of the present invention, the following various effects can be achieved.

[0043] First, the present invention has the effect of significantly improving the overall heat dissipation performance by dissipating system heat through a phase change process in which a refrigerant is filled inside.

[0044] Second, the present invention has the effect of greatly improving the productivity of a product by forming a refrigerant flow space in which refrigerant is easily filled inside two metal panel members through a laser welding method or a brazing welding method.

[0045] Third, the present invention has the effect of improving work safety by preventing workers from being injured by sharp edges by forming the sharp edges of the product to be rounded when manufacturing the product.

[0046]

[0047] Figure 1 is a perspective view showing a state in which a heat dissipation device according to the present invention is installed in a press-fit portion of a housing body.

[0048] FIG. 2 is a cross-sectional view and an enlarged view of a portion thereof taken along line AA of FIG. 4, showing a heat dissipation mechanism according to the first embodiment of the present invention.

[0049] Fig. 3 is an exploded perspective view of a heat dissipation mechanism according to a modified example of the first embodiment of the present invention, as shown in Fig. 1.

[0050] Figure 4 is a front view of Figure 1,

[0051] Figure 5 is a cross-sectional view taken along line AA of Figure 4 and an enlarged view of a portion thereof, respectively.

[0052] Fig. 6 is a perspective view showing a heat dissipation mechanism according to the second embodiment of the present invention.

[0053] Figure 7 is an exploded perspective view of Figure 6,

[0054] Figure 8 is a front view of Figure 6,

[0055] Figures 9a and 9b are cross-sectional views taken along lines BB and CC of Figure 8 and enlarged views of some parts thereof, respectively.

[0056] Fig. 10 is a perspective view showing an application example of a heat dissipation mechanism according to the third embodiment of the present invention.

[0057] Fig. 11 is a perspective view showing a heat dissipation mechanism according to a third embodiment of the present invention.

[0058] Figure 12 is an exploded perspective view of Figure 11.

[0059] Figure 13 is a front view of Figure 11,

[0060] Figure 14 is a cross-sectional view taken along the line DD of Figure 13 and a partially enlarged view for explaining the joint appearance by the filler material.

[0061] Figure 15 is an exploded cross-sectional view taken along the line DD of Figure 13 and a partially enlarged view illustrating the joint appearance by the filler metal.

[0062]

[0063] <Explanation of symbols>

[0064] 200: Heat dissipation device (first embodiment) 200A: One-sided heat-conducting panel

[0065] 200B: Other side heat conduction panel 200A-P: (One side) Thickness forming panel

[0066] 200B-P: Other side thickness forming panel 220: Contact surface

[0067] 240W: Contact 201: Evaporator

[0068] 203: Condensing section 205: Refrigerant flow space

[0069] 230: Strength reinforcement part 235: Column support protrusion

[0070] 250: Condensate sintered column 251: Column protrusion

[0071] 255: Evaporator sintered body base 290: Air vent tube

[0072] 295: Air vent hole 1200: Heat dissipation mechanism (second embodiment)

[0073] 1200A: One-sided heat-conducting panel 1200B: Other-sided heat-conducting panel

[0074] 1201: Evaporation section 1203: Condensation section

[0075] 1205: Refrigerant flow space 1220: Contact surface

[0076] 1230: Strength reinforcement part 1235: Column support protrusion

[0077] 1240W: Junction 1250: Condensation sintered column

[0078] 1255: Evaporator sintered body base 2200: Heat dissipation mechanism (3rd embodiment)

[0079] 2200A: One-sided heat-conducting panel 2200B: Other-sided heat-conducting panel

[0080] 2201: Evaporation section 2203: Condensation section

[0081] 2205: Refrigerant flow space 2210: Filler material application gap

[0082] 2220: Filler metal 2230: Strength reinforcement

[0083] 2235: Column support protrusion 2250: Condenser sintered body column

[0084] 2255: Evaporator sintered body base 2290: Air vent tube

[0085] 2295: Air vent hole

[0086]

[0087] Hereinafter, a heat dissipation mechanism according to embodiments of the present invention will be described in detail with reference to the attached drawings.

[0088] When assigning reference numerals to components in each drawing, it should be noted that identical components are assigned the same numerals whenever possible, even if they appear on different drawings. Furthermore, when describing embodiments of the present invention, if a detailed description of a related known configuration or function is deemed to hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0089] When describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this application.

[0090]

[0091] FIG. 1 is a perspective view showing a state in which a heat dissipation mechanism according to the present invention is installed in a press-fit portion of a housing body, FIG. 2 is a cross-sectional view taken along line AA of FIG. 4 and an enlarged view of a portion thereof according to a first embodiment of the present invention, FIG. 3 is an exploded perspective view of FIG. 1 of a heat dissipation mechanism according to a second embodiment of the present invention, FIG. 4 is a front view of FIG. 1, and FIG. 5 is a cross-sectional view taken along line AA of FIG. 4 and an enlarged view of a portion thereof, respectively.

[0092] A heat dissipation device (200) according to the first embodiment of the present invention includes a one-side heat-conducting panel (200A) made of a metal panel member, and a other-side heat-conducting panel (200B) made of a metal panel member, as referenced in FIGS. 1 to 5.

[0093] In particular, a portion corresponding to the space between one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) is formed as a refrigerant flow space (205) having a sealed structure with the outside as described later, and the refrigerant is filled and can radiate system heat by undergoing a phase change within the refrigerant flow space (205) by heat supplied from external heating elements (e.g., refer to the drawing reference numeral 51 of FIG. 10 described later). This will be described in more detail later.

[0094] Here, the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) can be made of the same metal material (metal panel material) having a thermal conductivity of a predetermined level or higher.

[0095] Preferably, the refrigerant may be provided with at least stainless steel (SUS) among the metal materials to facilitate phase change of the refrigerant through heat exchange with the outside air (in particular, phase change in which the refrigerant condenses from a gaseous state to a liquid state).

[0096] In this way, the specific reason for adopting SUS material as the metal material for forming one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) will be explained in more detail later.

[0097] In addition, in the heat dissipation device (200) according to the first embodiment of the present invention, one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) can be formed by sheet metal processing using a press mold process.

[0098] For reference, although the press mold process is not shown, it is sufficient to understand that it is a process in which a metal base material panel made of SUS material is processed into sheet metal through a press mold device so that at least each edge end is mutually joined by a joining medium frame body (280). At this time, through the press mold process, not only the outer shapes of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) but also a plurality of strength reinforcing members (230) described later can be formed simultaneously.

[0099] Here, the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) may be sheet metal processed products of metal panel members made of SUS material. The thickness of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) may be set to be very thin, and may be set to a thickness not exceeding 0.15t.

[0100] In general, aluminum (Al) is well known as the most widely utilized metal material in terms of thermal conductivity and weight. In this case, the heat dissipation device itself, which actually performs the heat dissipation or heat exchange function, is in the form of a heat sink fin. In the case where heat transfer is performed solely through the material itself without using a phase-changeable refrigerant as a heat transfer medium, as in one embodiment of the present invention, aluminum can naturally be selected as the optimal material.

[0101] That is, aluminum material has excellent thermal conductivity of 230 and is one of the most widely used materials as a heat dissipation element because of its low specific gravity.

[0102] However, although the aluminum material has superior thermal conductivity and specific gravity to the SUS material, which is the material of the one-side thermal conductive panel (200A) and the other-side thermal conductive panel (200B) adopted in the first embodiment of the present invention (actually, the thermal conductivity of the SUS material is 20), it has the problem that the price is relatively expensive compared to the cost, and when a refrigerant is filled inside, the refrigerant that can be filled is very limited.

[0103] For example, when distilled water (water) is selected as a refrigerant, there is a problem that distilled water must be excluded from the selectable refrigerants because aluminum causes a chemical reaction and makes it impossible to function as a refrigerant.

[0104] In order to solve the problem of aluminum material, in the heat dissipation device (200, 1200, 2200) according to the present invention, the metal material of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) was adopted as SUS material that hardly causes chemical reaction with distilled water.

[0105] The one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) can form a refrigerant flow space (205) in which the refrigerant changes phase and flows inside by being mutually bonded at their edge ends.

[0106] However, when joining the edge ends of two metal panel members having a very thin thickness (0.15T) as described above, the edge ends of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) have a thickness of 0.3T and, without separate processing, have very sharp edges, there is a risk of injury to the worker during work.

[0107] In order to minimize injuries to workers during work, as shown in FIGS. 1 and 2, in the heat dissipation device (200) according to the first embodiment of the present invention, both the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) are formed such that the edge ends (see reference numerals '200A-P' and '200B-P' in FIG. 2) are bent, and each bent edge end is formed as the one-side thickness-forming panel (200A-P) and the other-side thickness-forming panel (200B-P), and a part of the one-side thickness-forming panel (200A-P) of the one-side heat-conducting panel (200A) and the other-side thickness-forming panel (200B-P) of the other-side heat-conducting panel (200B) can be arranged to overlap in the thickness direction of the refrigerant flow space (205).

[0108] More specifically, as referenced in FIG. 2, the one-sided thickness forming panel (200A-P) may be formed by bending along the edge end of the one-sided heat-conducting panel (200A) and being formed to be approximately perpendicular to the other-sided heat-conducting panel (200B), and the other-sided thickness forming panel (200B-P) may be formed by bending along the edge end of the other-sided heat-conducting panel (200B) and being formed to be approximately perpendicular to the one-sided heat-conducting panel (200A).

[0109] That is, the edge end of one side heat-conducting panel (200A) and the edge end of the other side heat-conducting panel (200B) are each bent in a direction that forms the thickness of the refrigerant flow space (205), thereby forming the one side thickness-forming panel (200A-P) and the other side thickness-forming panel (200B-P) described above.

[0110] The heat dissipation device (200) according to the first embodiment of the present invention having such a configuration, as shown in FIG. 2, has one side thickness forming panel (200A-P) and the other side thickness forming panel (200B-P) arranged parallel to each other in the thickness direction of the refrigerant flow space (205), but can be arranged to overlap each other so that mutual surface bonding is possible within the thickness region of the refrigerant flow space (205), and by bonding the mutual surface bonding portions in a predetermined bonding manner, the refrigerant filled inside can be shielded from leaking to the outside.

[0111] However, in the heat dissipation device (200) according to the first embodiment of the present invention, the leading edge of the other-side thickness forming panel (200B-P) is joined in a form such that it is in contact with the inner surface of the one-side thickness forming panel (200A-P) and is not observed from the outside, but the embodiment of the present invention is not necessarily limited thereto.

[0112] That is, the heat dissipation mechanism (200) according to the modified example of the second embodiment of the present invention, as referenced in FIGS. 1, 3 to 5, can be arranged so that at least a portion of the bent edge end of one of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) overlaps the other side of the refrigerant flow space (205) in the thickness direction so as to enable mutual surface contact with the other side of the bent edge end.

[0113] At this time, either one of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) can be joined so as to be inserted into the other. More specifically, the portion where the edge end of the one-sided heat-conducting panel (200A) is bent forms the thickness of the refrigerant flow space (205), and the portion where the edge end of the other-sided heat-conducting panel (200B) is bent can be formed by bending in the opposite direction to the portion where the refrigerant flow space (205) is formed.

[0114] In a heat dissipation device (200) according to a modified example of the first embodiment of the present invention, the edge end of one side heat-conducting panel (200A) is inserted into the edge end side of the other side heat-conducting panel (200B), so that a thickness forming panel (200P) and a joint (200H-1) corresponding to each edge end can be mutually joined.

[0115] More specifically, as referenced in FIGS. 1, 3 to 5B, a thickness forming panel (200A-P) may be provided orthogonally folded at the edge end of one side heat conducting panel (200A) to be inserted among one side heat conducting panel (200A) and the other side heat conducting panel (200B).

[0116] In addition, a joint (240W) that comes into contact with the inner side of the front end of the thickness forming panel (200A-P) of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) inserted therein can be formed by bending.

[0117] At this time, the leading edge of the thickness forming panel (200A-P) of one side heat-conducting panel (200A) and the leading edge of the joint portion (240W) of the other side heat-conducting panel (200B) can be formed to be identically matched to each other. Therefore, the portion including the joint portion (240W) of the other side heat-conducting panel (200B) can be formed in a form in which it is inserted and then joined to the inside of the thickness forming panel (200A-P) of the one side heat-conducting panel (200A).

[0118] In this way, a refrigerant is filled inside between the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) that are mutually joined, and a refrigerant flow space (205) in which the filled refrigerant changes phase and flows is formed, and one end can be inserted and fixed into a slot-shaped press-fit portion (150) formed in the housing portion (110) so that it can be coupled to heating elements (heat-emitting elements of electronic devices, see reference numeral '51' of FIG. 10 described later) that supply heat to the filled refrigerant.

[0119] As shown in FIG. 5, the press-fitting portion (150) includes a one-side press-fitting portion (151) that contacts the outer surface corresponding to the evaporation end (201) described later of one-side heat-conducting panel (200A), and a other-side press-fitting portion (152) that contacts the outer surface corresponding to the evaporation end (201) described later of the other-side heat-conducting panel (200B), and the space between each inner surface of the one-side press-fitting portion (151) and the other-side press-fitting portion (152) can be defined as a press-fitting slot (150S).

[0120] Here, the part inserted into the press-fit part (150) among the edge ends of the heat dissipation device (200) to which one-sided heat-conducting panels (200A) and the other-sided heat-conducting panels (200B) are joined is defined as the evaporation end (201), and all other parts except the evaporation end (201) are defined as the condensation end (203).

[0121] The heat dissipation mechanism (200) according to the modification of the first embodiment of the present invention having such a configuration, in which one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) are each mutually joined through a thickness forming panel (200A-P) and a joint (240W), is to prevent the refrigerant from being separated from the heating elements by the sharply formed edge end through sheet metal processing by a press mold process, and to prevent the worker from being injured by the sharp edge end during or after insertion into the press-fitting portion (150).

[0122] Meanwhile, a contact surface portion (220) may be further processed and formed to protrude outward from the refrigerant flow space (205) so as to come into contact with the inner surface of the other side press-in portion (152) of the press-in portion (150) at the edge end (i.e., the evaporation end portion (201)) inserted into the press-in slot (150S) of the press-in portion (150) having a slot-shaped groove arranged to transfer heat generated from the heating elements among the other side heat-conducting panels (200B).

[0123] The contact surface (220) may serve to provide a contact area to enable joining by laser welding or brazing welding to the inner side of the other side of the press-fitting portion (152) among the press-fitting portions (150) (i.e., the inner wall of the slot-shaped press-fitting slot (150S)). At this time, the contact surface (220) formed on one side of the heat-conducting panel (200A) may be formed to be spaced apart from the joint (240W).

[0124] However, the welding joining method described above is not necessarily limited to either the brazing welding method or the laser welding method.

[0125] For example, for joining inside the refrigerant flow space (205), such as the multiple strength reinforcing members (230) described later, the brazing welding method is a more suitable joining method, and for joining the edge ends of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), the laser welding method is more suitable, and thus, it is possible to combine the above two methods.

[0126] Meanwhile, a plurality of strength reinforcing parts (230) processed from sheet metal during the press mold process and a plurality of column support protrusions (235) that support the installation of the condensation sintered body column (250) described later can be formed in the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) so as to be sunken toward the refrigerant flow space (205), respectively.

[0127] The plurality of strength reinforcing members (230) not only perform the function of reinforcing the strength of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) formed with a very thin thickness, but also perform the function of actively responding to changes in internal pressure that occur when the refrigerant phase changes by welding the mutually contacting portions within the refrigerant flow space (205).

[0128] Here, the contact surface portion (220) formed at the edge end of the other side heat-conducting panel (200B) can be formed to protrude in the opposite direction to the plurality of strength reinforcing portions (230) formed on the other side heat-conducting panel (200B).

[0129] Meanwhile, the heat dissipation device (200) according to the first embodiment of the present invention may further include a plurality of condensing sintered body columns (250) arranged on the refrigerant flow space (205), as referenced in FIGS. 1 to 3.

[0130] A plurality of condensing sintered body columns (250) can be joined to the inner surface of the thickness forming panel (200P) of the other side heat conduction panel (200B) via an evaporating sintered body base (255) that connects each end. Such a plurality of condensing sintered body columns (250) can perform a function of guiding the flow of the condensed liquid refrigerant toward the evaporating end (201) in the condensing end (refer to the drawing reference numeral '203' of FIGS. 6 and 7 described below) excluding the evaporating end (refer to the drawing reference numeral '201' of FIGS. 6 and 7 described below) of the one side heat conduction panel (200A) and the other side heat conduction panel (200B) installed in the press-fitting part (150).

[0131] Here, a plurality of condensation sintered body columns (250) and an evaporation sintered body base (255) can be formed by sintering powder made of SUS material. Hereinafter, a plurality of condensation sintered body columns (250) and an evaporation sintered body base (255) described later are different only in the characteristics (functions) that contribute to the phase change of the refrigerant according to the installation position within the refrigerant flow space (205), and therefore, the manufacturing method thereof is assumed to be the same and described.

[0132] Therefore, when the plurality of condensation sintered body columns (250) and evaporation sintered body bases (255) are understood to be provided with a single-side heat-conducting panel (200A) and a single-side heat-conducting panel (200B) made of a metal panel member made of SUS material, as described above, the forming or processing method may be somewhat different, but it may be understood that the metal powder made of SUS material is sintered to have the same thermal conductivity.

[0133] However, it is not necessary for all of the condensation sintered body columns (250) and the evaporation sintered body base (255) to be sintered with metal powder made of SUS material. In fact, since a high thermal conductivity is required to the extent that the liquid refrigerant is phase-changed into a gaseous refrigerant by the heat supplied from the heating elements (51), the evaporation sintered body base (255) can be formed with a sintered body made of metal powder made of Cu (copper).

[0134] Meanwhile, the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) can be laminated and joined by welding. The welding method herein may include any of the brazing welding methods in addition to the general laser welding method.

[0135] Meanwhile, in the heat dissipation mechanism (200) according to the first embodiment of the present invention, a plurality of support protrusions (251) protruding to be supported on the inner surface of one side heat-conducting panel (200A) and the inner surface of the other side heat-conducting panel (200B) may be integrally formed in the condensation sintered body column (250).

[0136] More specifically, the condensation sintered body column (250) is formed by sintering in a square bar shape with four sides, and one side (hereinafter referred to as the 'first side') is supported or fixed so as to be in contact with the inner surface of one of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) (hereinafter referred to as the 'one-side heat-conducting panel (200A)'), and the front end surfaces of the plurality of support protrusions (251) are formed on a surface (hereinafter referred to as the 'second surface') opposite to the first surface of the condensation sintered body column (250) and can be supported or fixed so as to be in contact with the inner surface of the other-side heat-conducting panel (200B).

[0137] The condenser sintered column (250) of this type has a first surface supported on the inner surface of one side heat-conducting panel (200A), and the leading end surfaces of a plurality of support protrusions (251) formed on the second surface are supported on the inner surface of the other side heat-conducting panel (200B), thereby reinforcing the rigidity of the one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) formed with a relatively thin thickness (0.15T), and by preventing the one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) from shaking (or flowing) according to the change in internal pressure of the refrigerant flow space (205) when the refrigerant phase changes, it can perform the function of improving heat dissipation performance by preventing energy involved in the phase change of the refrigerant from being converted into physical energy unrelated to heat dissipation.

[0138] In addition, it plays a role in ensuring that the gaseous refrigerant or liquid refrigerant flows smoothly through the space between the plurality of support protrusions (251), so that the gas-liquid circulation is not biased to one side, but is evenly distributed and flows.

[0139] Meanwhile, a plurality of column support protrusions (235) that support the installation of a plurality of condensation sintered body columns (250) may be further formed on one side heat conduction panel (200A) and the other side heat conduction panel (200B).

[0140] Likewise, it is obvious that the contact surface (220) formed at the edge end of the other side heat-conducting panel (200B) can be defined as being formed to protrude in the opposite direction to the plurality of support protrusions (251) formed on the other side heat-conducting panel (200B).

[0141] Meanwhile, an air vent hole (295) to which an air vent tube (290) is connected may be formed in either one of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) (in another embodiment of the present invention, the other-side heat-conducting panel (200B) corresponds to this).

[0142] An air vent tube (290) is installed in the air vent hole (295), so that a vacuum process of the refrigerant flow space (205) can be performed through the air vent tube (290) before or after filling the refrigerant.

[0143] FIG. 6 is a perspective view showing a heat dissipation mechanism according to a second embodiment of the present invention, FIG. 7 is an exploded perspective view of FIG. 6, FIG. 8 is a front view of FIG. 6, and FIGS. 9a and 9b are cross-sectional views taken along lines BB and CC of FIG. 8 and enlarged views of some portions thereof.

[0144] The heat dissipation mechanism (200) according to the first embodiment of the present invention and its modifications described with reference to FIGS. 1 to 5 has been described on the assumption that one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) are formed in an approximately rectangular shape, but it should be noted that the overall outer shape of the heat dissipation mechanism is not necessarily limited to a rectangular shape when manufactured.

[0145] For example, according to the heat dissipation mechanism (1200) according to the second embodiment of the present invention as referenced in FIGS. 6 to 9b, it can be formed in various shapes to suit the arrangement of directly applied heating elements and the external appearance of the electronic device product.

[0146] In this way, the heat dissipation mechanism (1200) according to the second embodiment of the present invention may be configured to perform the same function as the heat dissipation mechanism (200) according to the first embodiment of the present invention and its modifications described above, except that the external shape is different.

[0147] More specifically, the heat dissipation mechanism (1200) according to the second embodiment of the present invention also forms a refrigerant flow space (1205) in which the refrigerant changes phase and flows between one side heat-conducting panel (1200A) and the other side heat-conducting panel (1200B), and a specific part of the outer end portions of the one side heat-conducting panel (1200A) and the other side heat-conducting panel (1200B) is defined as a portion that performs a function corresponding to the above-described evaporation end portion (1201) as a portion close to the heating elements, and the remaining outer end portions other than the evaporation end portion (1201) are defined as a portion that performs a function corresponding to the condensation end portion (1203), which is the same as the heat dissipation mechanism (200) according to the first embodiment of the present invention and its modifications.

[0148] That is, in the case of the heat dissipation device (200) according to the first embodiment of the present invention and its modifications described above, the outer shape is formed in a rectangular shape, and one long side (not indicated in the drawing) corresponding to the long side functions as an evaporation end (see drawing number '2201' in FIG. 10 and below described below) that is closely connected to the heating elements, whereas in the case of the heat dissipation device (1200) according to the second embodiment of the present invention, only a part of the edge end functions as an evaporation end that is closely connected to the heating elements that are actually objects to which heat is supplied, and the remaining part is designed to function as a condensation end (see drawing number '2203' in FIG. 10 and below described below).

[0149] In addition, the heat dissipation mechanism (1200) according to the second embodiment of the present invention, as referenced in FIGS. 6 to 9B, may be formed with a plurality of strength reinforcing parts (1230) processed by sheet metal processing during the press mold process and column support protrusions (1235) that support the installation of the condensation sintered body column (1250) so as to be sunken toward the refrigerant flow space (1205) in one side heat-conducting panel (1200A) and the other side heat-conducting panel (1200B), respectively.

[0150] Here, the column support protrusions (1235) are designed to be spaced apart by a width of a pair of approximately the same amount as that of the condensing sintered body columns (1250), so that when the one-side heat-conducting panel (1200A) and the other-side heat-conducting panel (1200B) are mutually joined, the width-wise ends of the condensing sintered body columns (1250) are simultaneously supported on both sides inside the refrigerant flow space (1205), thereby stably supporting the condensing sintered body columns (1250), which are somewhat fragile sintered bodies.

[0151] As already explained, the plurality of strength reinforcing members (1230) not only perform the function of reinforcing the strength of the one-sided heat-conducting panel (1200A) and the other-sided heat-conducting panel (1200B) formed with a very thin thickness, but also perform the function of actively responding to changes in internal pressure that occur when the refrigerant phase changes by welding the mutually contacting portions within the refrigerant flow space (1205).

[0152] Here, too, it is natural that a contact surface portion (1220) can be further processed and formed on the edge end of one side of the heat-conducting panel (1200A) corresponding to the evaporation end portion (1201) that is inserted into the press-fit portion (150) to protrude outward from the refrigerant flow space (1205) so as to come into contact with the inner surface of the press-fit portion (150).

[0153] In addition, in the heat dissipation device (1200) according to the second embodiment of the present invention, the joint (1240W) provided on the other side heat conduction panel (1200B) is arranged so as to be in contact with the inner surface of the thickness forming panel (1200A-P) provided on one side heat conduction panel (1200A), and the joint (1240W) is mutually bonded to form an internal refrigerant flow space (1205), which will be the same technical principle as that of the heat dissipation device (200) according to the first embodiment of the present invention and its modifications, which have already been described.

[0154] Fig. 10 is a perspective view showing an application example of a heat dissipation mechanism according to a third embodiment of the present invention.

[0155] A heat dissipation mechanism (2200) according to a third embodiment of the present invention, as shown in FIG. 10, may be provided to receive heat generated from an electronic device (50, e.g., an LED unit, etc.) in which heat-emitting elements (51, e.g., LED elements in a lighting device) as heat dissipation targets are mounted and dissipate the heat through heat exchange with external air (outside air).

[0156] Here, the electronic device as a heat dissipation target to be dissipated by the heat dissipation mechanism (2200) according to the third embodiment of the present invention is limited to an LED unit (50) including LED elements (151), but the electronic device is not necessarily limited thereto, and an antenna device corresponding to the main technical field of the applicant of the present invention or an electronic device related to a similar technical scope is not excluded.

[0157] The LED unit (50) transmits and supplies heat generated from LED elements (i.e., heating elements, 51) through the back surface in the drawing of FIG. 10 to the heat dissipation mechanism (2200) according to the third embodiment of the present invention.

[0158] However, in order to facilitate installation on the back surface of the LED unit (50) and heat transfer to the heat dissipation mechanism (2200), a plurality of heat transfer media blocks may be installed between the LED unit (50) and the heat dissipation mechanism (2200) using the same principle as the above-described press-fit portion (150), and an evaporation end portion (2201) among the heat dissipation mechanisms (2200) described later may be coupled through an installation groove (155) formed between or in the plurality of heat transfer media blocks.

[0159] Fig. 11 is a perspective view showing a heat dissipation mechanism according to a third embodiment of the present invention, and Fig. 12 is an exploded perspective view of Fig. 11.

[0160] In the heat dissipation mechanism (2200) according to the third embodiment of the present invention, as referenced in FIGS. 11 and 12, the one-side heat-conducting panel (2200A) and the other-side heat-conducting panel (2200B) can also be processed into sheet metal by a press mold process as a metal panel member having a predetermined or higher thermal conductivity, similar to the heat dissipation mechanism (1200) according to the second embodiment of the present invention described above.

[0161] Here, the one-sided heat-conducting panel (2200A) and the other-sided heat-conducting panel (2200B) are sheet metal products made of a metal panel member made of SUS material, and even when the edge ends of the one-sided heat-conducting panel (2200A) and the other-sided heat-conducting panel (2200B) are each face-joined to form a sealed (shielded) refrigerant flow space (2205) inside, the sum of their thicknesses is 0.3t, which is very sharp. Therefore, in order to minimize the risk of injury by the sharp edge ends during the installer's work, the design can be changed to increase the thickness of the product by the thickness-forming panel (2200A-P) described later.

[0162] At this time, either one of the one-sided heat-conducting panel (2200A) and the other-sided heat-conducting panel (2200B) can be joined so as to be inserted into the other. In the heat dissipation device (2200) according to the third embodiment of the present invention, a structure is adopted in which the other-sided thickness-forming panel (2200B-P) of the other-sided heat-conducting panel (2200B) is inserted in the thickness direction formed by the one-sided thickness-forming panel (2200A-P) of the one-sided heat-conducting panel (2200A) described later.

[0163] More specifically, the other side heat-conducting panel (2200B) may be formed by bending so that a portion corresponding to the edge end is inserted into the one side heat-conducting panel (2200A), but the other side thickness forming panel (2200B-P) may be formed by bending so that the tip is hidden from the outside by the one side heat-conducting panel (2200A).

[0164] In addition, in the one-sided heat-conducting panel (2200A), the one-sided thickness-forming panel (2200A-P) can be folded and formed orthogonally to enable surface bonding with the other-sided thickness-forming panel (2200B-P) of the other-sided heat-conducting panel (2200B).

[0165] Here, the other side heat-conducting panel (2200B) is joined to be inserted into the one side heat-conducting panel (2200A), and the other side thickness-formed panel (2200B-P) including the tip of the other side heat-conducting panel (2200B) is inserted and joined with the one side thickness-formed panel (2200A-P) of the one side heat-conducting panel (2200A), so that the tip of the other side thickness-formed panel (2200B-P) is hidden from the outside.

[0166] To this end, the one-sided thickness forming panel (2200A-P) of the one-sided heat-conducting panel (2200A) can be formed by bending perpendicularly to the outer surface of the other-sided thickness forming panel (2200B-P) of the other-sided heat-conducting panel (2200B) so as to be mutually surface-bonded.

[0167] Here, the one-sided thickness forming panel (2200A-P) of the one-sided heat-conducting panel (2200A) functions as a thickness forming panel that forms the entire thickness of the refrigerant flow space (2205), and thus can perform an additional function of preventing injury to workers (including assemblers) by removing sharp edge ends during their work.

[0168] A refrigerant is filled inside the space between the one-sided heat-conducting panel (2200A) and the other-sided heat-conducting panel (2200B) that are thus mutually joined, and a refrigerant flow space (2205) is formed in which the filled refrigerant undergoes a phase change and flows, and can make surface thermal contact with heating elements (51) that supply heat to the filled refrigerant.

[0169] The refrigerant filled in the refrigerant flow space (2205) corresponds to a phase-change material that can be phase-changed by heat supplied from the heating elements (51) or by heat exchange with the external air (outside air). In particular, the refrigerant here is preferably distilled water (water) that does not cause environmental pollution, etc., when the metal material forming the one-side heat-conducting panel (2200A) and the other-side heat-conducting panel (2200B) excludes aluminum (Al).

[0170] Meanwhile, the part of the edge end of the heat dissipation device (2200) according to the third embodiment of the present invention, in which one side heat-conducting panel (2200A) and the other side heat-conducting panel (2200B) are joined, which receives heat from the heating elements (51), is defined as an evaporation end part (2201), and all other parts except the evaporation end part (2201) are defined as a condensation end part (2203).

[0171] Here, the heat dissipation mechanism (2200) according to the third embodiment of the present invention may further include a condenser sintered body column (2250) disposed on the refrigerant flow space (2205), as referenced in FIGS. 11 and 12.

[0172] Meanwhile, the refrigerant flow space (2205) is a region that is relatively lower based on the direction of gravity, and some parts can be understood as a region (evaporation region) where liquid refrigerant is stored and evaporates into gaseous refrigerant as heat is supplied, and some parts can be understood as a region (condensation region) where gaseous refrigerant actively flows and condenses into liquid refrigerant through heat exchange with the outside air (outside air).

[0173] Hereinafter, the evaporation region and the condensation region will be understood to be distinguished based on the dotted line referenced by drawing symbol 2200C in FIG. 11, but most of the liquid refrigerant is stored below the dotted line at 2200C due to gravity, and the gaseous refrigerant will be understood to flow and spread to all parts of the refrigerant flow space (2205) including the evaporation region once it undergoes a phase change from the liquid refrigerant, regardless of the dotted line at 2200C.

[0174] In addition, the area corresponding to the lower side in the direction of gravity based on drawing number 2200C is defined as an evaporation region and an evaporation end (2201), and the area corresponding to the upper side in the direction of gravity based on drawing number 2200C is defined as a condensation region and a condensation end (2203).

[0175] Here, a plurality of condensation sintered body columns (2250) are arranged at an angle so as to be spaced apart within the area of ​​the condensation section (2203), and the plurality of condensation sintered body columns (2250) can be connected at their lower ends based on the direction of gravity by an evaporation sintered body base (2255).

[0176] The condensation sintered body base (252) connecting the lower ends of a plurality of guide sintered body bars (251) can be joined to the inner surface of the thickness forming panel (200P) of the other side heat conducting panel (200B).

[0177] Here, it is preferable that the evaporation unit sintered body base (2255) is formed only on the evaporation unit (2201) side, but in the heat dissipation device (2200) according to the third embodiment of the present invention, an additional sintered body base (2255-1) may be further provided that is additionally extended toward the end of the condensation unit (2203) corresponding to the upper side of the evaporation unit (2201) as an end positioned relatively lower with respect to the direction of gravity among the condensation units (2203).

[0178] When the plurality of condensing sintered body columns (2250) are arranged so that the condensed liquid refrigerant in the area corresponding to the condensing end (2203) naturally flows downward by gravity, the upper part may be positioned upward based on the direction of gravity, and the lower part may be positioned downward based on the direction of gravity, and may be arranged vertically or inclined.

[0179] Here, the sintered body additional base (2255-1) can play a role in easily capturing the liquid refrigerant condensed downward in the direction of gravity through the multiple condensing sintered body columns (2250) described above in an area corresponding to the evaporation end (2201).

[0180] The evaporator sintered body base (2255) is installed at the part of the evaporator section (2201) that is closest to the heating elements (51) and directly receives heat from the heating elements (51) to evaporate the liquid refrigerant.

[0181] Fig. 13 is a front view of Fig. 11, Fig. 14 is a cross-sectional view taken along the line DD of Fig. 13 and a partially enlarged view for explaining the appearance of joining by a filler metal, and Fig. 15 is an exploded cross-sectional view taken along the line DD of Fig. 13 and a partially enlarged view for explaining the appearance of joining by a filler metal.

[0182] In the heat dissipation device (2200) according to the third embodiment of the present invention, as referenced in FIGS. 13 to 15, a portion corresponding to the edge end of the other side heat-conducting panel (2200B) and a portion corresponding to the edge end of the one side heat-conducting panel (2200A) and a portion corresponding to the rounded outer surface of the other side thickness-formed panel (2200B-P) can be joined by a filler material (2220) applied to a filler material application gap (2210) corresponding to the tip of the one side thickness-formed panel (2200A-P).

[0183] In order to form a gap (2210) for applying the solder, the outer surface of the other side heat-conducting panel (2200B) and the tip of the one side thickness forming panel (2200A-P) of the one side heat-conducting panel (2200A) can be formed to match each other.

[0184] More specifically, the other side thickness forming panel (2200B-P) of the other side heat-conducting panel (2200B) can be formed by being rounded and bent with a predetermined radius with respect to the outer surface of the other side heat-conducting panel (2200B) so that the above-described filler material application gap (2210) is formed between the tip of the one side thickness forming panel (2200A-P) of the one side heat-conducting panel (2200A).

[0185] Here, the filler coating gap (2210) can be defined as a gap between the tip of a one-sided thick-formed panel (2200A-P) that is bent perpendicularly to the outer surface of a one-sided heat-conducting panel (2200A) and the outer surface of the other-sided heat-conducting panel (2200B).

[0186] When such a heat-conducting panel (2200B) on the other side is installed to be inserted into the heat-conducting panel on the other side (2200A), as shown in FIGS. 14 and 15, a filler material application gap (2210) in which a filler material (2220) can be applied is naturally formed between the rounded outer surface of the other side thickness forming panel (2200B-P) of the other side heat-conducting panel (2200B) and the tip of the one side thickness forming panel (2200A-P) of the one side heat-conducting panel (2200A), and after the filler material (2220) is applied, the filler material (2220) is melted and permeated by a brazing welding method and then hardened, thereby joining the one side heat-conducting panel (2200A) and the other side heat-conducting panel (2200B).

[0187] The unexplained drawing number 2290 is an 'air vent tube', and the drawing number 2295 is an 'air vent hole'.

[0188]

[0189] Hereinafter, heat dissipation mechanisms according to embodiments of the present invention have been described in detail with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the above-described embodiments, and it will be understood that those skilled in the art to which the present invention pertains can make various modifications and implement the same within an equivalent scope. Therefore, the true scope of the present invention is defined by the claims set forth below.

[0190]

[0191] The present invention provides a heat dissipation device that can maximize heat dissipation performance and improve productivity.

Claims

1. A one-sided heat-conducting panel equipped with a metal panel member; and A second side heat-conducting panel provided with a metal panel member; The above one-sided heat-conducting panel and the other-sided heat-conducting panel have their folded edge ends joined to each other to form a refrigerant flow space in which the refrigerant inside changes phase and flows. A heat dissipation device, wherein at least a portion of a folded edge end of one of the above-mentioned one-side heat-conducting panel and the other-side heat-conducting panel overlaps with the other folded edge end in the thickness direction of the refrigerant flow space so as to enable mutual surface contact.

2. In claim 1, A heat dissipation mechanism in which the edge end of the one-side heat-conducting panel and the edge end of the other-side heat-conducting panel are each bent in a direction forming the thickness of the refrigerant flow space.

3. In claim 2, The folded edge end of the above one-sided heat-conducting panel is a one-sided thickness forming panel that forms part of the thickness of the refrigerant flow space, A heat dissipation device, wherein the bent edge end of the other side heat-conducting panel is a other side thickness forming panel that forms part of the thickness of the refrigerant flow space.

4. One-sided heat-conducting panel equipped with a metal panel member; and A second side heat-conducting panel provided with a metal panel member; The above one-sided heat-conducting panel and the other-sided heat-conducting panel have their folded edge ends joined to each other to form a refrigerant flow space in which the refrigerant inside changes phase and flows. A heat dissipation device, wherein at least a portion of a folded edge end of one of the above-mentioned one-side heat-conducting panel and the other-side heat-conducting panel overlaps with the other folded edge end on the outer side in the thickness direction of the refrigerant flow space so as to enable mutual surface contact.

5. In claim 4, Among the above one-sided heat-conducting panel and the other-sided heat-conducting panel, a thickness forming panel is provided at the edge end of the other-sided heat-conducting panel to be inserted, and is bent perpendicularly. A heat dissipation mechanism in which a joint is formed by bending the edge end of one side of the heat-conducting panel inserted among the one side heat-conducting panel and the other side heat-conducting panel to be in contact with the inner side of the tip end of the thickness forming panel of the other side heat-conducting panel.

6. In claim 5, A heat dissipation mechanism, wherein a contact surface portion is further processed and formed to protrude outwardly from the refrigerant flow space so as to come into contact with the inner surface of the press-fit portion, at a border end inserted into a press-fit portion having a slot-shaped press-fit slot arranged to transfer heat generated from heating elements among the above-mentioned one-sided heat-conducting panels.

7. In claim 6, A heat dissipation mechanism in which the contact surface formed on the one-sided heat-conducting panel is formed to be spaced apart from the joint.

8. In claim 6, In the above one-side heat-conducting panel and the other-side heat-conducting panel, a plurality of strength reinforcing parts are further formed to be sunken toward the refrigerant flow space, A heat dissipation mechanism in which the above contact surface portion is formed to protrude in the opposite direction to the plurality of strength reinforcing portions formed on the other side heat-conducting panel.

9. In claim 5, When the part relatively close to the heating elements that generate and supply a predetermined amount of heat as the end of the one-side heat-conducting panel and the other-side heat-conducting panel is defined as the evaporation end, and the part other than the evaporation end is defined as the condensation end, A heat dissipation device further comprising: a plurality of condensation sintered columns arranged on the refrigerant flow space and guiding the flow of liquid refrigerant condensed in the condensation section excluding the evaporation section of the one-side heat-conducting panel and the other-side heat-conducting panel installed in the pressurized section toward the evaporation section.

10. In claim 9, A heat dissipation device in which the plurality of condenser sintered body columns are installed in the refrigerant flow space via an evaporator sintered body base that connects each end.

11. In claim 9, On the one-side heat-conducting panel and the other-side heat-conducting panel, a plurality of column support protrusions are further formed to support the installation of the plurality of condensation sintered body columns. A heat dissipation mechanism in which the above contact surface portion is formed to protrude in the opposite direction to the plurality of column support protrusions formed on the one-side heat-conducting panel.

12. One-sided heat-conducting panel equipped with a metal panel member; and It comprises a metal panel member, and a heat-conducting panel on the other side forming a refrigerant flow space in which the refrigerant changes phase and flows between the heat-conducting panel on the one side; A heat dissipation device in which the other side heat-conducting panel is formed by bending so as to be inserted into the one side heat-conducting panel, and the other side thickness forming panel is formed by bending so that the tip is hidden from the outside by the one side heat-conducting panel.

13. In claim 12, A heat dissipation mechanism in which a one-sided thickness forming panel is formed by bending the one-sided heat-conducting panel so as to be perpendicular to the other-sided thickness forming panel of the other-sided heat-conducting panel so as to be surface-bonded.

14. In claim 13, A heat dissipation mechanism in which the outer surface of the other side heat-conducting panel and the tip of the one side thickness forming panel of the one side heat-conducting panel are mutually matched.

15. In claim 13, A heat dissipation mechanism in which the other side thickness forming panel of the other side heat-conducting panel is rounded with a radius of a predetermined size with respect to the outer surface of the other side heat-conducting panel so that a gap for applying a filler material is formed between the tip of the one side thickness forming panel of the one side heat-conducting panel.

16. In claim 15, A heat dissipation device, wherein the above-mentioned gap for applying the filler material is defined as a gap between the tip of the one-sided thickness forming panel that is bent perpendicularly to the outer surface of the one-sided heat-conducting panel and the outer surface of the other-sided heat-conducting panel.

17. In claim 15 or claim 16, A heat dissipation device in which a filler material that melts above a predetermined melting point is applied to the above-mentioned filler material application gap.

18. In claim 17, A heat dissipation device in which the above-mentioned filler material is applied to the gap between the above-mentioned filler material applications and then the one-side heat-conducting panel and the other-side heat-conducting panel are joined by a brazing welding method.

19. In any one of claims 1, 4 and 12, The above one-sided heat-conducting panel and the other-sided heat-conducting panel are heat-dissipating devices equipped with metal panel members made of SUS material.

20. In any one of claims 1, 4 and 12, A heat dissipation device in which the above one-sided heat-conducting panel and the other-sided heat-conducting panel are laminated and bonded by a laser welding method or a brazing welding method.

21. In claim 9 or claim 10, The above-mentioned plurality of condensation sintered body columns and evaporation sintered body bases are heat dissipation mechanisms formed by sintering SUS material powder.

22. In claim 21, The above-mentioned plurality of condensation sintered body columns and evaporation sintered body bases are heat dissipation mechanisms formed by sintering metal powder (powder) of the same material as the material of the metal panel members of the one-side heat-conducting panel and the other-side heat-conducting panel.

23. In claim 22, A heat dissipation device in which the material of the metal powder of the plurality of condensation sintered body columns and the evaporation sintered body base is SUS.

24. In claim 22, The above evaporation sintered body base is a heat dissipation device formed by sintering metal powder made of copper (Cu).

25. In any one of claims 1, 4 and 12, A heat dissipation device in which the one-sided heat-conducting panel and the other-sided heat-conducting panel are made of the same metal material or different metal materials having a thermal conductivity higher than a predetermined level.

26. In any one of claims 1, 4 and 12, The above one-sided heat-conducting panel and the other-sided heat-conducting panel are heat-dissipating devices processed from sheet metal using a press mold process.

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