Electronic device including connection structure for ground of antenna

Abstract

Embodiments of the present invention provide an electronic device. The electronic device includes: a first housing part including a conductive portion; a second housing part configured to be movably coupled to the first housing part; a rail guide part electrically connected to the conductive portion and coupled to the first housing part, and including a recess that is at least partially depressed; and a movement guide part coupled to the second housing part and at least partially accommodated in the recess, and configured to move along the recess on the basis of the movement of the second housing part.

Description

An electronic device comprising a connection structure for the ground of an antenna

[0001] The present disclosure relates to an electronic device including a connection structure for a ground of an antenna.

[0002] As demand for highly portable electronic devices increases, electronic devices may include deformable displays. Deformable displays may be slidable, foldable, or rollable. Electronic devices including the displays may transmit signals via an antenna or receive signals via an antenna.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] In embodiments, an electronic device is provided. The electronic device may include a first housing part including a conductive portion, a second housing part configured to be movably coupled to the first housing part, a rail guide part electrically connected to the conductive portion and coupled to the first housing part, the rail guide part including an at least partially sunken recess, and a movement guide part coupled to the second housing part, at least partially received in the recess, and configured to move along the recess based on movement of the second housing part.

[0005] In embodiments, an electronic device is provided. The electronic device may include a first housing part, a second housing part configured to be movably coupled with the first housing part, and a flexible display coupled to the first housing part and the second housing part. The size of a display area of ​​the flexible display may be changed based on movement of the first housing part or the second housing part. The electronic device may include a rail guide part coupled to the first housing part, a movement guide part configured to move along the rail guide part based on movement of the first housing part or the second housing part, an antenna electrically connected to the rail guide part in the first housing part, a protruding member coupled to the rail guide part, and a contact member electrically connected to a conductive part of the first housing part and disposed on one side of the conductive part. At least a portion of the protruding member may be disposed to contact the contact member electrically connected to the conductive part.

[0006] In embodiments, an electronic device is provided. The electronic device may include a housing including a first housing part and a second housing part configured to be movably coupled with the first housing part, a flexible display coupled to the first housing part and the second housing part, a first rail guide part coupled to the first housing part, a first movement guide part configured to move along the first rail guide part according to movement of the second housing, a second rail guide part coupled to the first housing part, a second movement guide part configured to move along the second rail guide part according to movement of the second housing, an antenna electrically connected to at least one of the first rail guide part or the second rail guide part within the first housing part, a first protruding member coupled to the first rail guide part, and a first contact member electrically connected to a first conductive part of the first housing part and disposed on one side of the first conductive part. At least a portion of the first protruding member may be arranged to contact the first contact member, which is electrically connected to the first conductive portion.

[0007] Figure 1 is a block diagram of an electronic device within a network environment.

[0008] Figures 2a to 2d illustrate states of an electronic device including a movable housing.

[0009] Figure 3 illustrates another example of an electronic device including a movable housing.

[0010] Figure 4 is an exploded perspective view of an exemplary electronic device.

[0011] Figure 5 shows examples of electronic devices in the first state and the second state, respectively.

[0012] Fig. 6 shows an example of a guide portion of an electronic device.

[0013] Figure 7 shows an example of a ground point of an electronic device.

[0014] Figures 8a to 8c show examples of connection structures for the ground of an antenna of an electronic device.

[0015] Figures 9a and 9b show examples of connection structures for the ground of an antenna of an electronic device.

[0016] Figures 10a and 10b show examples of connection structures for grounding an antenna of an electronic device.

[0017] Figure 11 shows examples of connection structures in the first state and the second state, respectively.

[0018] Figures 12a to 12f show examples of connection structures using a flexible printed circuit board (FPCB).

[0019] Figures 13a to 13d show examples of ground points.

[0020] Figure 14 shows an example of a ground path of an electronic device.

[0021] Figures 15a to 15d show examples of matching circuits.

[0022] Figures 16a and 16b show examples of radiation performance according to a connection structure for the ground of an antenna of an electronic device.

[0023] Figure 17 shows an example of a connection structure for providing ground through a battery frame.

[0024] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0025] The various embodiments of the present disclosure described below illustrate a hardware-based approach as an example. However, since the various embodiments of the present disclosure include techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0026] In the following description, terms referring to parts of electronic devices (e.g., substrate, PCB (printed circuit board), FPCB (flexible PCB), module, antenna, antenna element, circuit, processor, chip, component, device), terms referring to the shape of parts (e.g., structure, structure, support, contact, protrusion), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, assembly), terms referring to circuits (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna line, RF path, RF module, RF circuit, splitter, divider, coupler, combiner), etc. are examples for convenience of description. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, the terms '...bu', '...gi', '...mul', '...che', etc. used hereinafter may mean at least one shape structure or a unit that processes a function. In the present disclosure, a substrate may represent a circuit board, such as a PCB or FPCB.

[0027] In the present disclosure, expressions such as “more than” or “less than” may be used to determine whether a specific condition is satisfied or fulfilled, but this is merely a description for expressing an example and does not exclude descriptions such as “more than” or “less than.” A condition described as “more than” may be replaced with “more than,” a condition described as “less than” may be replaced with “less than,” and a condition described as “more than and less than” may be replaced with “more than and less than.” In addition, hereinafter, “A” to “B” mean at least one of elements from A (including A) to B (including B). hereinafter, “C” and / or “D” mean at least one of “C” or “D,” that is, including {“C,” “D,” “C” and “D”}.

[0028] FIG. 1 is a block diagram of an electronic device within a network environment according to embodiments.

[0029] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0030] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0031] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0032] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0033] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0034] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0036] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0037] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0038] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0040] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0042] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0044] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0046] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0047] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0048] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0049] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0050] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0051] Figures 2a to 2d illustrate states of an electronic device (101) including a movable housing. Like reference numerals may be used throughout the drawings for the same description. The states of the electronic device (101) may include a first state. The electronic device may include a second state. The states of the electronic device (101) may include states different from the first state and the second state.

[0052] FIG. 2A is a top plan view of an exemplary electronic device (101) in a first state.

[0053] Referring to FIG. 2A, the electronic device (101) may include a first housing part (210), a second housing part (220) movable relative to the first housing part (210) in a first direction (261) parallel to the y-axis or in a second direction (262) parallel to the y-axis and opposite to the first direction (261), and a display (230).

[0054] For example, the electronic device (101) may be in the first state. For example, within the first state, the second housing part (220) may be movable in a first direction (261) among the first direction (261) and the second direction (262) with respect to the first housing part (210). For example, within the first state, the second housing part (220) may be restricted from moving in the second direction (262) with respect to the first housing part (210). For example, the second housing part (220) may have difficulty moving further in the second direction (262) with respect to the first housing part (210). As another example, the second housing part (220) may not be easily moved due to a catch or the like with respect to the first housing part (210) in the second direction (262).

[0055] For example, within the first state, the display (230) may provide a display area having the smallest size on the front surface of the electronic device (101). For example, within the first state, the display area may correspond to the first area (230a). For example, although not illustrated in FIG. 2A, within the first state, an area of ​​the display (230) other than the first area (230a) that is the display area (e.g., the second area (230b) of FIG. 2C) may be included within the first housing part (210). For example, within the first state, the area may be covered by the first housing part (210). For example, within the first state, the area may be rolled into the first housing part (210). For example, within the first state, the first region (230a) may include a planar portion, unlike the region including a curved portion. However, this is not limited thereto. For example, the first region (230a) may also include a curved portion, extending from the planar portion and positioned within an edge portion, within the first state.

[0056] For example, the first state may be referred to as a slide-in state or a closed state in that at least a portion of the second housing part (220) is positioned within the first housing part (210). For example, the first state may be referred to as a reduced state in that it provides the display area having the smallest size, but is not limited thereto.

[0057] For example, the first housing part (210) may include a first image sensor (250-1) within the camera module (180) that is visually exposed through a portion of the first region (230a) and faces a third direction (263) parallel to the z-axis. For example, the camera module (180) may also be arranged to perform its function within the internal space of the electronic device without being visually exposed through a portion of the first region (230a). For example, although not illustrated in FIG. 2A, the second housing part (220) may include one or more second image sensors within the camera module (180) that are exposed through a portion of the second housing part (220) and faces a fourth direction (264) parallel to the z-axis and opposite to the third direction (263). For example, the one or more second image sensors may be exemplified through the description of FIG. 2B.

[0058] FIG. 2b is a rear view of an exemplary electronic device in the first state.

[0059] Referring to FIG. 2B, within the first state, one or more second image sensors (250-2) may be positioned at a position overlapping an opening formed in the first housing part (210). For example, light from the outside of the electronic device (101) may be received by the one or more second image sensors (250-2) through the opening within the first state. For example, since the one or more second image sensors (250-2) are positioned within the opening within the first state, they may be exposed through the opening within the first state. For example, the opening may be an opening (212a) within the first plate (212) of the first housing part (210) that surrounds at least a portion of the second housing part (220). However, the present invention is not limited thereto. For example, within the first state, one or more second image sensors (250-2) included within the second housing part (220) may be covered by the first plate (212) of the first housing part (210).

[0060] Referring again to FIG. 2a, the first state can be changed to the second state.

[0061] For example, the first state (or the second state) can be changed to the second state (or the first state) through one or more intermediate states between the first state and the second state.

[0062] For example, the first state (or the second state) may be changed to the second state (or the first state) based on a set user input. For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a user input to a physical button exposed through a part of the first housing part (210) or a part of the second housing part (220). For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a touch input to an executable object displayed within the display area. For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a touch input having a contact point on the display area and having a pressing strength greater than or equal to a reference strength. For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a voice input received through a microphone of the electronic device (101). For example, the first state (or the second state) may be changed to the second state (or the first state) in response to an external force applied to the first housing part (210) and / or the second housing part (220) to move the second housing part (220) with respect to the first housing part (210). For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a user input identified from an external electronic device (e.g., earbuds or a smart watch) connected to the electronic device (101). However, the present invention is not limited thereto.

[0063] The second state can be illustrated through the description of FIGS. 2c and 2d.

[0064] Figure 2c is a plan view of an exemplary electronic device within a second state.

[0065] Referring to FIG. 2C, the electronic device (101) may be in the second state. For example, in the second state, the second housing part (220) may be movable in the second direction (262) among the first direction (261) and the second direction (262) with respect to the first housing part (210). For example, in the second state, the second housing part (220) may not be movable in the first direction (261) with respect to the first housing part (210).

[0066] For example, within the second state, the display (230) may provide the display area having the largest size. For example, within the second state, the display area may correspond to an area (230c) including a first area (230a) and a second area (230b). For example, the second area (230b), which was included within the first housing part (210) within the first state, may be exposed within the second state. For example, within the second state, the first area (230a) may include a planar portion. However, the invention is not limited thereto. For example, the first area (230a) may also include a curved portion extending from the planar portion and positioned within the edge portion. For example, within the second state, the second area (230b), unlike the first area (230a) within the first state, may include a planar portion among the planar portion and the curved portion. However, the invention is not limited thereto. For example, the second region (230b) may include a curved portion extending from the planar portion of the second region (230b) and positioned within an edge portion.

[0067] For example, the second state may be referred to as a slide-out state or an open state in that at least a portion of the second housing part (220) is positioned outside the first housing part (210). For example, the second state may be referred to as an expanded state in that it provides the display area having the largest size. However, the present invention is not limited thereto.

[0068] For example, the first image sensor (250-1) facing the third direction (263) may move together with the first region (230a) according to the movement of the second housing part (220) in the first direction (261) when the state of the electronic device (101) changes from the first state to the second state. For example, although not shown in FIG. 2C, one or more second image sensors (250-2) facing the fourth direction (264) may move according to the movement of the second housing part (220) in the first direction (261) when the state of the electronic device (101) changes from the first state to the second state. For example, the relative positional relationship between one or more second image sensors (250-2) and the opening may change according to the movement of one or more second image sensors (250-2). For example, the change in the above relative position relationship can be illustrated through Fig. 2d.

[0069] FIG. 2d is a rear view of an exemplary electronic device (101) in a second state.

[0070] Referring to FIG. 2D, within the second state, one or more second image sensors (250-2) may be positioned outside the opening. For example, within the second state, one or more second image sensors (250-2) may be positioned outside the opening (212a) in the first plate (212). For example, because the one or more second image sensors (250-2) are positioned outside the opening (212a) within the second state, the one or more second image sensors (250-2) may be exposed within the second state. For example, because the one or more second image sensors (250-2) are positioned outside the structure within the second state, the relative positional relationship within the second state may be different from the relative positional relationship within the first state.

[0071] For example, if the electronic device (101) does not include an opening such as the opening (212a), one or more second image sensors (250-2) within the second state may be exposed, unlike one or more second image sensors (250-2) within the first state.

[0072] Although not shown in FIGS. 2A, 2B, 2C, and 2D, the electronic device (101) may be in an intermediate state between the first state and the second state. For example, the size of the display area in the intermediate state may be larger than the size of the display area in the first state and smaller than the size of the display area in the second state. For example, the display area in the intermediate state may correspond to an area including a portion of the first region (230a) and the second region (230b). For example, in the intermediate state, a portion of the second region (230b) may be exposed, and another portion (or a remaining portion) of the second region (230b) may be covered by the first housing part (210) or rolled into the first housing part (210). However, the present invention is not limited thereto.

[0073] FIG. 3 illustrates another example of an electronic device (101) including a movable housing. Like reference numerals may be used throughout the drawings for the same description. In FIG. 3, an example of movement in a direction (e.g., (+) x-axis, (-) x-axis)) different from the movement direction (e.g., (+) y-axis, (-) y-axis)) of the second housing part (220) in FIGS. 2A to 2D is described.

[0074] Referring to FIG. 3, the electronic device (101) may include a first housing part (310), a second housing part (320) movable relative to the first housing part (310) in a first direction (361) parallel to the x-axis or in a second direction (362) parallel to the x-axis and opposite to the first direction (361), and a display (330).

[0075] The electronic device (101) may be in the first state. For example, in the first state, the second housing part (320) may be movable relative to the first housing part (310) in the second direction (362) among the first direction (361) and the second direction (362). For example, in the first state, the second housing part (320) may not be movable relative to the first housing part (310) in the first direction (361). For example, in the first state, the display (330) may provide a display area having a smallest size. For example, the first state may be referred to as a slide-in state or a closed state in that at least a portion of the second housing part (320) is positioned within the first housing part (310). For example, the first state may be referred to as a collapsed state in that it provides the display area having the smallest size. However, the present invention is not limited thereto. For example, the first housing part (310) may include an image sensor (not shown) although not shown in FIG. 3. For example, the second housing part (320) may include one or more image sensors (350) within the camera module (180) that are exposed through a portion of the second housing part (320).

[0076] The second housing part (320) can be withdrawn from the first housing part (310). Based on the second housing part (320) being withdrawn from the first housing part (310), the state of the electronic device (101) can be changed from the first state to the second state. In addition, the second housing part (320) can be inserted into the first housing part (310). Based on the second housing part (320) being inserted from the first housing part (310), the state of the electronic device (101) can be changed from the second state to the first state.

[0077] The electronic device (101) may be in the second state. For example, in the second state, the second housing part (320) may be movable relative to the first housing part (310) in a first direction (361) among the first direction (361) and the second direction (362). For example, in the second state, the second housing part (320) may not be movable relative to the first housing part (310) in the second direction (362). For example, in the second state, the display (330) may provide a display area having a largest size. For example, the second state may be referred to as a slide-out state or an open state in that at least a portion of the second housing part (320) is located outside the first housing part (310). For example, the second state may be referred to as an expanded state in that it provides the display area having the largest size. However, the present invention is not limited thereto.

[0078] Hereinafter, operations of an electronic device (101) including a second housing part (220) moving in the directions (e.g., (+) y-axis, (-) y-axis)) in FIGS. 2A to 2D are described, but embodiments of the present disclosure are not limited thereto. Embodiments of the present disclosure may also be applied to an electronic device (101) including a second housing part (320) moving in the directions (e.g., (+) x-axis, (-) x-axis)) in FIG. 3. According to embodiments described below, conductive portions and non-conductive portions of a metal frame of an electronic device (101) may be disposed in a first region (277) or a second region (288) of the electronic device (101). Additionally, according to the embodiments described below, the support member, the bridge portion, and the slot region formed across the bridge portion and the conductive portion of the electronic device (101) may be placed in the first region (277) of the electronic device (101).

[0079] In addition, for the embodiments of the present disclosure, there is no limitation on the structural change due to expansion or contraction in the horizontal or vertical direction, and the radiator structure including the bridge portion and the slot region according to the embodiments described below can be applied to electronic devices of a bar-type or foldable type.

[0080] Figure 4 is an exploded perspective view of an exemplary electronic device (e.g., electronic device (101)). Like reference numerals may represent like or similar descriptions.

[0081] Referring to FIG. 4, the electronic device (101) may include a first housing part (210), a second housing part (220), a display (230), and a driving unit (460).

[0082] The first housing part (210) may include a first cover (411) and a first plate (212). The first cover (411) may at least partially form a side portion of an outer surface of the electronic device (101). For example, the first cover (411) may include an opening for one or more second image sensors (250-2). For example, the first cover (411) may include a surface that supports the first plate (212). For example, the first cover (411) may be coupled to the first plate (212). For example, the first cover (411) may include a frame (430). For example, the first plate (212) may at least partially form a rear portion of the outer surface. For example, the first plate (212) may include an opening (212a) for one or more second image sensors (250-2). For example, the first plate (212) may be disposed on the surface of the first cover (411).

[0083] The second housing part (220) may include a second cover (421) and a second plate (422). The second cover (421) may be at least partially wrapped by the display (230). For example, the second cover (421) may be coupled with at least a portion of an area of ​​the display (230) that wraps the second cover (421) such that the display (230) moves along with the second housing part (220) moving relative to the first housing part (210). For example, the second cover (421) may be coupled with at least one component of the electronic device (101). For example, the second cover (421) may support a printed circuit board (PCB) or a printed board assembly (PBA) that includes components of the electronic device (101). For example, the PCB may include the processor (120). For example, the second cover (421) can support one or more second image sensors (250-2). For example, the second cover (421) can be coupled with at least one structure of the electronic device (101) for a plurality of states including the first state and the second state. For example, the second cover (421) can fix the rack gear (463) of the driving unit (460). For example, the second cover (421) can be coupled with a second plate (422). For example, the second plate (422) can be coupled with the second cover (421) to protect at least one component of the electronic device (101) coupled within the second cover (421) and / or at least one structure of the electronic device (101) coupled within the second cover (421). For example, the second plate (422) can include a structure for the at least one component. For example, the second plate (422) may include one or more openings for one or more second image sensors (250-2).For example, one or more openings may be aligned with one or more second image sensors (250-2) arranged on the second cover (421). For example, the size of each of the one or more openings may correspond to the size of each of the one or more second image sensors (250-2). For example, when the electronic device (101) is viewed from above in a state where the first plate (212) of the electronic device (101) is arranged to face the +z direction, the electronic device (101) may have a structure in which the first plate (212) and the first cover (411) are stacked in that order.

[0084] The driving unit (460) may include a motor (461), a pinion gear (462), and a rack gear (463). For example, the motor (461) may operate based on power from the battery (189). For example, the power may be provided to the motor (461) in response to the user input. For example, the pinion gear (462) may be coupled to the motor (461) via a shaft. For example, the pinion gear (462) may rotate based on the motion of the motor (461) transmitted via the shaft. For example, the rack gear (463) may be arranged relative to the pinion gear (462). For example, teeth of the rack gear (463) may mesh with teeth of the pinion gear (462). For example, the rack gear (463) can be moved in the first direction (261) or the second direction (262) according to the rotation of the pinion gear (462). For example, the second housing part (220) can be moved in the first direction (261) and the second direction (262) by the rack gear (463) that is moved according to the rotation of the pinion gear (462) due to the operation of the motor (461). For example, the first state of the electronic device (101) can be changed to a state different from the first state (e.g., one or more intermediate states or the second state) through the movement of the second housing part (220) in the first direction (261). For example, the second state of the electronic device (101) can be changed to a state other than the second state (e.g., one or more intermediate states or the first state) through the movement of the second housing part (220) in the second direction (262).

[0085] The first housing part (210) may include a frame (430). The frame (430) may be at least partially wrapped by the display (230). For example, although the frame (430) is at least partially wrapped by the display (230), the position of the frame (430) may be maintained independently of the movement of the display (230). For example, the frame (430) may include a multi-bar structure to protect the display (230). The frame (430) may be coupled to at least a portion of a guide portion (e.g., a rail guide portion (480)) that guides the movement of at least a portion of the display (230). For example, a first guide portion (e.g., a first movement guide portion (470a) and a first rail guide portion (480a)) and a second guide portion (e.g., a second movement guide portion (470b) and a second rail guide portion (480b)) may be arranged to respectively engage with both ends of the multi-bar structure and guide the movement (rolling or sliding) of the display (230). Hereinafter, in the present disclosure, the guide portion is a structure for guiding linear motion (LM) between the frame (430) and the second cover (421) or the first housing part (210) and the second housing part (220), and in addition to the guide portion, a guide unit, an LM guide (linear motion guide), a pre-motion guide, an anti-tilt guide, or terms technically and / or structurally equivalent thereto may be used instead. The moving guide part (470) of the above guide part may be used in place of a moving part, a moving part, a moving unit, a head part, an LM head, a slide guide part, or terms technically and / or structurally equivalent thereto, in addition to the moving part.The rail guide portion (480) of the above guide portion may be generally referred to as a rail portion, a fixed portion, a path guide portion, a linear rail, an LM body, an LM rail, or other technically and / or structurally equivalent terms in addition to the rail guide portion.

[0086] The frame (430) can be combined with at least one structure of the electronic device (101) for a plurality of states including the first state and the second state. For example, the movement guide portion (470) can include a first movement guide portion (470a) and a second movement guide portion (470b). The rail guide portion (480) can include a first rail guide portion (480a) and a second rail guide portion (480b). For example, the first movement guide portion (470a) and the first rail guide portion (480a) can be combined to one side of the frame (430). The first rail guide portion (480a) can be connected to the frame (430). The first rail guide portion (480a) can include a structure (e.g., a groove structure, a structure including an at least partially sunken recess) for guiding in one direction (e.g., a y-axis direction). The first moving guide part (470a) can move linearly along the guide area of ​​the above structure of the first rail guide part (480a). The first moving guide part (470a) can be connected to the second cover (421). The second housing part (220) can move according to the movement of the first moving guide part (470a). For example, the second moving guide part (470b) and the second rail guide part (480b) can be coupled to the other side of the frame (430). The second rail guide part (480b) can be connected to the frame (430). The second rail guide part (480b) can include a structure (e.g., a groove structure, a structure including an at least partially sunken recess) for guiding in one direction (e.g., the y-axis direction). The second moving guide part (470b) can move linearly along the guide area of ​​the above structure of the second rail guide part (480b). The second moving guide part (470b) can be connected to the second cover (421). As the second moving guide part (470b) moves, the second housing part (220) can move.

[0087] For example, the frame (430) may be coupled with at least one component of the electronic device (101). For example, the frame (430) may support the battery (189). For example, the battery (189) may be supported through a recess or hole in a surface of the frame (430). For example, the frame (430) may be coupled with one end of a flexible printed circuit board (FPCB) (425) on a surface of the frame (430). For example, although not explicitly shown in FIG. 4, the other end of the FPCB (425) may be connected to a PCB (450) through at least one connector. For example, the PCB (450) may be electrically connected to another PCB (e.g., PCB (424)) that supplies power to the motor (461) through the FPCB (425).

[0088] Embodiments of the present disclosure relate to a grounding structure for improving antenna performance in the first state or the second state of an electronic device (101). For example, the grounding structure can be used to control unnecessary parasitic resonance components that affect the performance of the antenna. As illustrated in FIG. 4, in an electronic device (101) operating in a slide-in or slide-out state, a first housing part (210) or a second housing part (220) can move. Movement of the first housing part (210) or the second housing part (220) can cause a change in the performance of the antenna. For example, due to the movement, a radiated RF signal can cause parasitic resonance. The parasitic resonance is an unnecessary component within the frequency band of the RF signal, which can degrade the radiation performance of the antenna. As a grounding structure for reducing the influence due to parasitic resonance of the antenna, a structure may be used that connects the conductive portion of the first cover (411) of the first housing part (210) to a guide rail that is electrically connected to the antenna. For example, the conductive portion may come into contact with the movable guide portion (470) of the guide rail through a C-clip. However, since the movable guide portion of the guide rail (e.g., the first movable guide portion (470a), the second movable guide portion (470b)) moves, while the conductive portion remains in a fixed position, the C-clip is prone to wear. Repeated movement increases frictional resistance and may cause poor contact or breakage between the C-clip and the movable guide portion of the guide rail (e.g., the first movable guide portion (470a), the second movable guide portion (470b)). Accordingly, embodiments of the present disclosure describe a structure in which the conductive portion is electrically connected to a rail guide portion of the guide rail (e.g., a first rail guide portion (480a), a second rail guide portion (480b)).By electrically connecting the rail guide portion to the conductive portion of the first cover (411) instead of the moving guide portion (470), durability issues due to movement of the ground portion are reduced, and a stable ground structure can be formed. In addition, by arranging matching elements and / or switching circuits on a substrate (e.g., key FPCB) for keys (e.g., volume keys, power keys), the electronic device (101) can adaptively control the ground structure depending on the state of the electronic device (101) or the frequency of a signal radiated through the antenna.

[0089] FIG. 5 illustrates an example of an electronic device (e.g., electronic device (101)) in each of a first state and a second state. Like reference numerals may represent like or similar descriptions.

[0090] Referring to FIG. 5, the first state (501) may be referred to as a slide-in state or a closed state in that at least a portion of the second housing part (220) is positioned within the first housing part (210). For example, the first state (501) may be referred to as a reduced state in that it provides the display area having the smallest size. However, the present invention is not limited thereto. According to one embodiment, the electronic device (101) may include an antenna (520) in an upper region of the electronic device (101) (e.g., the second housing part (220)).

[0091] The electronic device (101) may include a first moving guide portion (470a) and a first rail guide portion (480a). For example, the first moving guide portion (470a) may move linearly according to the movement of the second housing portion (220). The first rail guide portion (480a) may be coupled with the first housing portion (210). The first moving guide portion (470a) may move along the guide area of ​​the first rail guide portion (480a). For example, the first moving guide portion (470a) may be coupled with the second housing portion (220) through a pinion gear (462) and a rack gear (463) of the driving portion (460). As the rack gear (463) moves along with the movement of the first movement guide part (470a), the second housing part (220) can move relative to the first housing part (210). The electronic device (101) may include a second movement guide part (470b) and a second rail guide part (480b). For example, the second movement guide part (470b) can move linearly according to the movement of the second housing part (220). The second rail guide part (480b) can be coupled with the first housing part (210). The second movement guide part (470b) can move along the guide area of ​​the second rail guide part (480b). For example, the second movement guide part (470b) can be coupled with the second housing part (220) through the pinion gear (462) and the rack gear (463) of the driving unit (460). As the rack gear (463) moves along with the movement of the second moving guide part (470b), the second housing part (220) can move relative to the first housing part (210).

[0092] The state of the electronic device (101) may change from the first state (501) to the second state (502) depending on the linear movement of the first housing part (210) or the second housing part (220). The second state (502) may be referred to as a slide-out state or an open state in that at least a portion of the second housing part (220) is positioned outside the first housing part (210). For example, the second state (502) may be referred to as an expanded state in that it provides the display area having the largest size. However, the present invention is not limited thereto. According to one embodiment, the electronic device (101) may include an antenna (510) in a lower region of the electronic device (101) (e.g., the first housing part (210)). For example, the metal frame of the electronic device (101) may include a conductive portion (599). The conductive portion (599) can be used as a radiator of the antenna (510). In the second state (502), the distance between the antenna (510) and the first movable guide portion (470a) may be longer than the distance between the antenna (510) and the first movable guide portion (470a) in the first state (501). On the other hand, the distance between the antenna (510) and the first rail guide portion (480a) in the second state (502) may be substantially the same (e.g., corresponding, identical) as the distance between the antenna (510) and the first rail guide portion (480a) in the first state (501). Since the first rail guide portion (480a) is coupled to the first housing part (470a), even if the first housing part (210) or the second housing part (220) moves, the relative positional relationship with the antenna (510) may not change.

[0093] Fig. 6 illustrates an example of a guide portion (e.g., a guide portion (650)) of an electronic device (e.g., an electronic device (101)). In Fig. 6, a guide portion (650) is illustrated as a combined structure including a rail guide portion (480) and a moving guide portion (470) described through Figs. 4 and 5. The same reference numerals may indicate the same or similar descriptions.

[0094] Referring to FIG. 6, the first state (601) may be referred to as a slide-in state or a closed state in that at least a portion of the second housing part (220) is positioned within the first housing part (210). The first state (601) may correspond to the first state (501) of FIG. 5. The second state (602) may be referred to as a slide-out state or an open state in that at least a portion of the second housing part (220) is positioned outside the first housing part (210). The second state (602) may correspond to the second state (502) of FIG. 5.

[0095] The guide portion (650) may include a moving guide portion (470), a rail guide portion (480), and at least one bearing (e.g., a first ball bearing (611), a second ball bearing (612)) arranged between the moving guide portion (470) and the rail guide portion (480). For smooth movement (e.g., sliding), the at least one bearing may be used to connect the moving guide portion (470) and the rail guide portion (480). For implementation of relatively low rolling resistance, the at least one bearing may be arranged between the moving guide portion (470) and the rail guide portion (480).

[0096] The rail guide portion (480) of the guide portion (650) can be coupled to the first housing part (210) of the electronic device (101). For example, one area of ​​the rail guide portion (480) can be coupled to the first cover (411). The moving guide portion (470) of the guide portion (650) can be coupled to the second housing part (220) of the electronic device (101). For example, one area of ​​the moving guide portion (470) can be coupled to the second cover (421). As the moving guide portion (470) moves along the guide area of ​​the rail guide portion (480), the second housing part (220) can be moved from the first housing part (210). A conductive structure (e.g., a conductive portion (599), a conductive pattern, a slot structure, or other metal structure) disposed on the first housing part (210) can be used as a radiator of an antenna (e.g., an antenna (510)). The conductive structure can be electrically connected to the rail guide part (480). A current generated in the antenna (510) can flow to the rail guide part (480). However, an undesired parasitic resonant frequency component may be generated due to a point contact or non-contact connection state through the at least one bearing disposed between the rail guide part (480) and the moving guide part (470). If the parasitic resonant frequency is located within the frequency band of a signal radiated through the antenna (510), it may affect the radiation performance of the antenna (510). For example, depending on the degree of movement of the first housing part (210) or the second housing part (220), a change in the degree of electromagnetic coupling between the first housing part (210) and the second housing part (220) may occur. Due to the change in the degree of coupling, the parasitic resonance frequency becomes variable and mobile. Due to the characteristics of the variable parasitic resonance frequency, stable grounding performance related to the antenna cannot be maintained, and the antenna performance may deteriorate.In order to provide stable grounding performance even when the first housing part (210) or the second housing part (220) moves, the electronic device (101) according to embodiments of the present disclosure may include a ground connection structure for controlling the parasitic resonance frequency. Since the parasitic resonance frequency is located outside the frequency band of the signal radiated through the antenna (510), antenna performance in the frequency band (i.e., in-band) may be improved. Hereinafter, examples of the ground connection structure are described with reference to FIGS. 7 to 11.

[0097] Fig. 7 illustrates an example of a ground point of an electronic device (e.g., electronic device (101)). To reduce the influence of parasitic resonance due to movement of the first housing part (210) or the second housing part (220), a guide part may be connected to a conductive part of the electronic device (101) (e.g., at least a portion of a metal frame). Identical reference numerals may represent identical or similar descriptions.

[0098] Referring to FIG. 7, the first state (711) may be referred to as a slide-in state or a closed state in that at least a portion of the second housing part (220) is positioned within the first housing part (210). The second state (712) may be referred to as a slide-out state or an open state in that at least a portion of the second housing part (220) is positioned outside the first housing part (210).

[0099] In the first state (711) of the first example (710), the first moving guide portion (470a) and the first conductive portion (741) of the first housing part (210) can be electrically connected through contact with a first contact member (731) (e.g., a C-clip) at a first point (714a). One area of ​​the first contact member (731) can be in contact with the first conductive portion (741), and another area of ​​the first contact member (731) can be in contact with the first moving guide portion (470a). The second moving guide portion (470b) and the second conductive portion (742) of the first housing part (210) can be electrically connected through contact with the second contact member (732) (e.g., a C-clip) at a second point (714b). One area of ​​the second contact member (732) may be in contact with the second conductive portion (742), and another area of ​​the second contact member (732) may be in contact with the second movement guide portion (470b). The first point (714a) may be referred to as a first ground point. The second point (714b) may be referred to as a second ground point. The first point (714a) and the second point (714b) may be located at the same height with respect to one direction (e.g., the y-axis direction). In the second state (712), the first movement guide portion (470a) and the first conductive portion (741) may be in contact with the first contact member (731) at a third point (715a). The third point (715a) may be referred to as a third ground point. In the second state (712), the second moving guide portion (470b) and the second conductive portion (742) can come into contact with each other through the second contact member (732) at a fourth point (715b). The fourth point (715b) may be referred to as a fourth ground point. The third point (715a) and the fourth point (715b) may be positioned at the same height relative to one direction (e.g., the y-axis direction). In the first example (710), the position of the first point (714a) may be different from the position of the third point (715a).For example, the height of the third point (715a) with respect to one direction (e.g., the y-axis direction) may be higher than the height of the first point (714a). The distance between the antenna (e.g., the antenna (510)) disposed on the first housing part (210) and the third point (715a) may be longer than the distance between the antenna and the first point (714a). The position of the second point (714b) may be different from the position of the fourth point (715b). For example, the height of the fourth point (715b) with respect to one direction (e.g., the y-axis direction) may be higher than the height of the second point (714b). The distance between the antenna disposed on the first housing part (210) and the fourth point (715b) may be longer than the distance between the antenna and the second point (714b).

[0100] In the first state (711) of the second example (720), the first rail guide portion (480a) and the first conductive portion (741) of the first housing part (210) can be in contact at a first point (724a) through at least one conductive member (e.g., the first contact member (751)). The first point (724a) may be referred to as a first ground point. The second rail guide portion (480b) and the second conductive portion (742) of the first housing part (210) can be in contact at a second point (724b) through at least one conductive member (e.g., the second contact member (752)). The second point (724b) may be referred to as a second ground point. The first point (724a) and the second point (724b) may be located at the same height with respect to one direction (e.g., the y-axis direction). In the second state (712) of the second example (720), the first rail guide portion (480a) and the first conductive portion (741) can contact each other through the first contact member (751) at a third point (725a). The third point (724a) may be referred to as a third ground point. In the second state (712), the second rail guide portion (480b) and the second conductive portion (742) may contact each other through the second contact member (752) at a fourth point (725b). The fourth point (725b) may be referred to as a fourth ground point. The third point (725a) and the fourth point (725b) may be located at the same height with respect to one direction (e.g., the y-axis direction).

[0101] In the second example (720), the position of the first point (724a) may correspond to the position of the third point (725a). For example, the height of the third point (715a) with respect to one direction (e.g., the y-axis direction) may be substantially the same as the height of the first point (714a). The distance between the antenna arranged on the first housing part (210) and the third point (725a) may be substantially the same as the distance between the antenna and the first point (734a). The position of the second point (724b) may correspond to the position of the fourth point (725b). For example, the height of the fourth point (725b) with respect to one direction (e.g., the y-axis direction) may be substantially the same as the height of the second point (724b). The distance between the antenna placed in the first housing part (210) and the fourth point (725b) may be substantially the same as the distance between the antenna and the second point (724b).

[0102] As illustrated in the first example (710), when a ground path is formed through a moving guide portion of the guide part (e.g., the first moving guide portion (470a), the second moving guide portion (470b)), the position of the ground point is variable depending on the movement of the first housing part (210) or the second housing part (220).

[0103] As illustrated in the second example (720), when a ground path is formed through the rail guide portion of the guide part (e.g., the first rail guide portion (480a), the second rail guide portion (480b)), the position of the ground point is fixed regardless of the movement of the first housing part (210) or the second housing part (220). As the ground point is stably formed, the reliability of the connection between the rail guide portion and the conductive portion can be improved. In addition, at least one conductive member connecting the rail guide portion and the conductive portion can be more robust against wear or poor contact. In addition, as the ground points are fixedly formed, the electronic device (101) can more efficiently control the frequency of parasitic resonance, thereby preventing degradation of antenna performance.

[0104] FIGS. 8A to 8C illustrate examples of a connection structure for a ground of an antenna (e.g., an antenna (510)) of an electronic device (e.g., an electronic device (101)). The connection structure represents a stacked structure when the electronic device (101) described through FIGS. 1 to 7 is viewed in one direction (e.g., the (+) z-axis direction). To describe the connection structure, reference may be made to components of the electronic device (101) described through FIGS. 4 to 7. The same reference numerals may indicate the same or similar descriptions.

[0105] Referring to Fig. 8a, the first cover (411), the moving guide portion (470), and the rail guide portion (480) of the first housing part (210) can be electrically connected through a connection structure (800a). In order to secure a ground path for unnecessary parasitic resonance components, the connection structure (800a) may be in a form in which conductive members are layered.

[0106] The electronic device (101) may include a protruding member (810) disposed on the rail guide portion (480). The protruding member (810) may be disposed on one surface of the rail guide portion (480) and may have a shape that protrudes in a specific direction (e.g., the (+) x-axis direction). In the present disclosure, the protruding member (810) represents a structure made of a conductive material, and in addition to the protruding member, terms such as a contact portion, a contact member, a protruding portion, a protruding portion, a support portion, a protruding area, a support area, a conductive member, a conductive area, a protruding structure, a protruding portion, or technically and / or structurally equivalent terms may be generally used. The electronic device (101) may include a contact member (820) (e.g., a C-clip) disposed on one area (e.g., the conductive portion (811)) on the first cover (411). In the present disclosure, the contact member (820) represents a structure composed of a conductive material, and in addition to the contact member, terms such as a connecting member, a C-clip, an elastic member, a connecting portion, a contact portion, a contact structure, a conductive member, a conductive region, or technically and / or structurally equivalent terms thereof may be generally used. The contact member (820) may be electrically connected to the first cover (411). The contact member (820) may be in contact with the conductive portion (811) of the first cover (411). For example, with respect to the (+) x-axis direction, the conductive members may be stacked in the following order: a rail guide portion (480), a protruding member (810), a contact member (820), and a conductive portion (811). As the protruding member (810) and the contact member (820) come into contact, the rail guide portion (480) may be electrically connected to the conductive portion (811) of the first cover (411) (e.g., at least a portion of the metal frame). A ground path may be formed from the rail guide portion (480) to the conductive portion (811). Due to the ground path, the frequency of the parasitic resonance component may shift outside the frequency band of the RF signal.

[0107] The rail guide portion (480) may include a first portion (881), a second portion (882), and a third portion (883). The first portion (881) represents an area where the rail guide portion (480) is coupled to the first cover (411). The second portion (882) represents an area for accommodating the movement guide portion (470). The third portion (883) represents an area between the first portion (881) and the second portion (882) with respect to one direction (e.g., the y-axis direction). According to one embodiment, the protruding member (810) may be disposed on at least a portion of the third portion (883). In order to secure the radiation length of the antenna and reduce the influence caused by the movement guide portion (470), the protruding member (810) may be disposed on the third portion (883). As the contact member (820) is placed on the first cover (411) at a position corresponding to the third part (883) (e.g., a position having an x-coordinate that is identical to the x-coordinate of the third part (883) or within a critical range from the x-coordinate based on the illustrated coordinate system), the protruding member (810) can contact the contact member (820).

[0108] Referring to FIG. 8b, a connection structure (800b) for grounding an antenna may include a first cover (411), a moving guide portion (470), and a rail guide portion (480) of a first housing part (210). The rail guide portion (480) may be electrically connected to an antenna (e.g., an antenna (510)). For example, the rail guide portion (480) may be connected to a ground substrate of the first housing part (210). The ground substrate may be connected to a conductive portion (599) of the first housing part (210). In order to secure a ground path for unnecessary parasitic resonance components, the connection structure (800b) may include a structure in which conductive members are stacked. The electronic device (101) may include a protruding member (810) disposed on the rail guide portion (480). The protruding member (810) may be disposed on one surface of the rail guide portion (480) and may have a shape that protrudes in a specific direction (e.g., the (+) x-axis direction). The electronic device (101) may include a contact member (820) (e.g., a C-clip) disposed on one area (e.g., a conductive portion (811)) on the first cover (411). The contact member (820) may be electrically connected to the first cover (411). Unlike FIG. 8A, the contact member (820) may be electrically connected to the first cover (411) through a circuit board (825) (e.g., the FPCB (425) of FIG. 4) and a conductive adhesive member (830) (e.g., a conductive tape). In order to stably attach the circuit board (825) to the first cover (411), a conductive adhesive member (830) may be placed between the circuit board (825) and the first cover (411). For example, with respect to the (+) x-axis direction, the conductive members may be laminated in the following order: a rail guide portion (480), a protruding member (810), a contact member (820), a circuit board (825), a conductive adhesive member (830), and a conductive portion (811).As the protruding member (810) and the contact member (820) come into contact, the rail guide portion (480) can be electrically connected to the conductive portion (811) of the first cover (411). A conductive adhesive member (830) can be disposed on one surface of the conductive portion (811) of the first cover (411). A current flowing in the rail guide portion (480) can be transmitted to the conductive portion (811) of the first cover (411) through the connection structure (800b). A ground path can be formed from the rail guide portion (480) to the conductive portion (811). Due to the ground path, the frequency of a parasitic resonance component due to radiation of an RF signal of the antenna can shift outside the frequency band of the RF signal.

[0109] According to one embodiment, the electronic device (101) may include a matching circuit (840) for controlling a parasitic resonance frequency. The matching circuit (840) may be disposed on one surface of a circuit board (825). The matching circuit (840) is described in detail with reference to FIGS. 15A to 15D . Meanwhile, the matching circuit (840) is merely an example of implementation, and the connection structure (800b) illustrated in FIG. 8B is not construed as limiting the embodiments of the present disclosure. For example, the electronic device (101) may include a circuit board (825) and a conductive adhesive member (830) without the matching circuit (840) disposed on the circuit board (825).

[0110] The rail guide portion (480) may include a first portion (881), a second portion (882), and a third portion (883). The first portion (881) represents an area where the rail guide portion (480) is coupled to the first cover (411). The second portion (882) represents an area for accommodating the movement guide portion (470). The third portion (883) represents an area between the first portion (881) and the second portion (882) with respect to one direction (e.g., the y-axis direction). According to one embodiment, the protruding member (810) may be disposed on at least a portion of the third portion (883). In order to secure the radiation length of the antenna and reduce the influence caused by the movement guide portion (470), the protruding member (810) may be disposed on the third portion (883). On the first cover (411), as the contact member (820) is positioned at a position corresponding to the third part (883) (e.g., a position having an x-coordinate that is identical to the x-coordinate of the third part (883) or within a critical range from the x-coordinate based on the illustrated coordinate system), the protruding member (810) can contact the contact member (820).

[0111] Referring to Fig. 8c, the connection structure (800c) for the ground of the antenna may include the first cover (411), the moving guide part (470), and the rail guide part (480) of the first housing part (210). In the connection structure (800a) of Fig. 8a or the connection structure (800b) of Fig. 8b, the rail guide part (480) is electrically connected to the conductive part (811) through the protruding member (810) and the contact member (820). The connection structure (800c) of Fig. 8c may provide an electrical connection between the rail guide part (480) and the conductive part (811) through the contact member (820).

[0112] According to one embodiment, the electronic device (101) may include a contact member (820) (e.g., a C-clip) disposed on an area (e.g., a conductive portion (811)) on a first cover (411). The contact member (820) may be electrically connected to the first cover (411). For example, the contact member (820) may include a substrate portion and an elastic portion. Both the substrate portion and the elastic portion may be made of a conductive material. The substrate portion may be in contact with the conductive portion (811) of the first cover (411). The substrate portion may be disposed on one surface of the conductive portion (811). The elastic portion may have a shape whose height changes due to pressure (e.g., pressure in the (+) x-axis direction). The elastic portion may be in contact with the rail guide portion (480). For example, with respect to the (+) x-axis direction, conductive members may be stacked in the order of a rail guide portion (480), a contact member (820), and a conductive portion (811). As the protruding member (810) and the contact member (820) come into contact, the rail guide portion (480) may be electrically connected to the conductive portion (811) of the first cover (411) (e.g., at least a part of the metal frame). A portion of the signals of the rail guide portion (480) (e.g., a parasitic resonance component) may be transmitted to the conductive portion (811) of the first cover (411) through the connection structure (800c). A ground path may be formed from the rail guide portion (480) to the conductive portion (811). Due to the ground path, the frequency of the parasitic resonance component may shift outside the frequency band of the RF signal.

[0113] In addition to the connection structures illustrated in FIGS. 8A to 8C, a laminated structure for electrically connecting the rail guide portion (480) and the conductive portion (811) of the first cover (411) of the first housing part (210) may be understood as an embodiment of the present disclosure. According to one embodiment, the electronic device (101) may include only the protruding member (810) without the contact member (820). The protruding member (810) may electrically connect the rail guide portion (480) and the conductive portion (811). One area of ​​the protruding member (810) may be in contact with the rail guide portion (480), and another area of ​​the protruding member (810) may be in contact with the conductive portion (811) of the first cover (411). Also, according to one embodiment, the protruding member (810) may be formed integrally with the rail guide portion (480). For example, the rail guide portion (480) may include a protruding region in addition to a first portion (881) for coupling with the first cover (411) and a second portion (882) for accommodating the moving guide portion (470). The protruding region may be located between the first portion (881) and the second portion (882).

[0114] Figures 9a and 9b illustrate examples of connection structures for grounding an antenna (e.g., antenna (510)) of an electronic device (e.g., electronic device (101)). The same reference numerals may represent the same or similar descriptions.

[0115] In FIG. 9a, the connection structure of the first state (e.g., the first state (501), the first state (601), the first state (711)) of the electronic device (101) is illustrated. Example (901a) is a drawing of the connection structure of the electronic device (101) in the first state, viewed in the (+) z-axis direction. Example (901b) is a drawing of the connection structure of the electronic device (101) in the first state, viewed in the (+) x-axis direction. The protruding member (810) may be disposed on one surface of the rail guide portion (480) and may have a shape that protrudes in a specific direction (e.g., the (+) x-axis direction). The contact member (820) may be electrically connected to the first cover (411) through a circuit board (825) (e.g., the FPCB (425) of FIG. 4) and a conductive adhesive member (830) (e.g., a conductive tape). For example, with respect to the (+) x-axis direction, conductive members may be laminated in the following order: a rail guide portion (480), a protruding member (810), a contact member (820), a circuit board (825), a conductive adhesive member (830), and a conductive portion (811). As the protruding member (810) and the contact member (820) come into contact, the rail guide portion (480) may be electrically connected to the conductive portion (811) of the first cover (411).

[0116] In FIG. 9b, the connection structure of the second state (e.g., the second state (502), the second state (602), the second state (712)) of the electronic device (101) is illustrated. Example (902a) is a drawing of the connection structure of the electronic device (101) in the second state, viewed in the (+) z-axis direction. Example (902b) is a drawing of the connection structure of the electronic device (101) in the second state, viewed in the (+) x-axis direction. The protruding member (810) may be disposed on one surface of the rail guide portion (480) and may have a shape that protrudes in a specific direction (e.g., the (+) x-axis direction). The contact member (820) may be electrically connected to the first cover (411) through a circuit board (825) (e.g., the FPCB (425) of FIG. 4) and a conductive adhesive member (830) (e.g., a conductive tape). For example, with respect to the (+) x-axis direction, conductive members may be laminated in the following order: a rail guide portion (480), a protruding member (810), a contact member (820), a circuit board (825), a conductive adhesive member (830), and a conductive portion (811). As the protruding member (810) and the contact member (820) come into contact, the rail guide portion (480) may be electrically connected to the conductive portion (811) of the first cover (411).

[0117] In order to control the linear movement of the first housing part (210) or the second housing part (220), the electronic device (101) may include a guide portion. The guide portion may be coupled to one side of the first cover (411) of the first housing part (210). Even if the second housing part (220) moves in one direction (e.g., the (+) y-axis direction), the rail guide portion (480) of the guide portion may be fixedly coupled to the first cover (411). Accordingly, the ground path of the rail guide portion (480) may be formed at a fixed position.

[0118] FIGS. 10A and 10B illustrate examples of a connection structure for a ground of an antenna of an electronic device (e.g., electronic device (101)). FIG. 10A is a drawing of the connection structure viewed from one side (e.g., xy plane) of the electronic device (101), and FIG. 10B is a drawing of the connection structure viewed from the bottom (e.g., xz plane) of the electronic device (101). The same reference numbers may indicate the same or similar descriptions.

[0119] Referring to FIG. 10A, a connection structure of a first state (1001) of an electronic device (101) (e.g., a first state (501), a first state (601), a first state (711)) is illustrated. In the first state (1001), a protruding member (810) is disposed on one surface of a rail guide portion (480) and may have a shape that protrudes in a specific direction (e.g., a (+) x-axis direction). A contact member (820) may be electrically connected to a first cover (411) through a circuit board (825) (e.g., an FPCB (425) of FIG. 4) (or a circuit board (825) and a conductive adhesive member (not shown)). For example, with respect to the (+) x-axis direction, conductive members may be stacked in the following order: a rail guide portion (480), a protruding member (810), a contact member (820), a circuit board (825), and a conductive portion (811). As the protruding member (810) and the contact member (820) come into contact, the rail guide portion (480) may be electrically connected to the conductive portion (811) of the first cover (411). A connection structure of a second state (1002) of the electronic device (101) (e.g., the second state (502), the second state (602), the second state (712)) is illustrated. In the second state (1002), even if the movement guide portion (470) moves in one direction (e.g., the (+) y-axis direction), contact between the protruding member (810) and the contact member (820) may be maintained. For example, with respect to the (+) x-axis direction, the stacked form of the conductive members can be maintained in the order of the rail guide portion (480), the protruding member (810), the contact member (820), the circuit board (825), the conductive adhesive member (830), and the conductive portion (811).

[0120] Referring to FIG. 10B, the electronic device (101) may include a battery frame (1120) (e.g., frame (430)). A portion (1130) of the battery frame (1120) may be coupled to a rail guide portion (480). According to one embodiment, a portion (1130) of the battery frame (1120) may include an insulating layer. The portion (1130) may be coupled to the rail guide portion (480) through the insulating layer. Due to the insulating layer, current flowing in the rail guide portion (480) may not be provided to the battery frame (1120).

[0121] FIG. 11 illustrates examples of connection structures in each of a first state (e.g., a first state (501), a first state (601), a first state (711), a first state (1001)) and a second state (e.g., a second state (502), a second state (602), a second state (712), a second state (1002)). The same reference numerals may indicate the same or similar descriptions.

[0122] Referring to FIG. 11, the electronic device (101) may include a plurality of connection structures. The electronic device (101) may include, as components of the connection structure on one side, a first movement guide portion (470a), a first rail guide portion (480a), a first protruding member (810a), a first contact member (820a), and a first conductive portion (811a) of the first cover (411). The electronic device (101) may include, as components of the connection structure on another side, a second movement guide portion (470b), a second rail guide portion (480b), a second protruding member (810b), a second contact member (820b), and a second conductive portion (811b) of the first cover (411).

[0123] A first state (1101) of the electronic device (101) (e.g., first state (501), first state (601), first state (711), first state (1001)) may be referred to as a slide-in state or a closed state in that at least a portion of the second housing part (220) is positioned within the first housing part (210). A second state (1102) of the electronic device (101) (e.g., second state (502), second state (602), second state (712), second state (1002)) may be referred to as a slide-out state or an open state in that at least a portion of the second housing part (220) is positioned outside the first housing part (210).

[0124] In the first state (1101), the first protruding member (810a) is disposed on one surface of the first rail guide portion (480a) and may have a shape that protrudes in a specific direction (e.g., the (+) x-axis direction). The first contact member (820a) may be electrically connected to the first cover (411). The first contact member (820a) may be in contact with the first conductive portion (811a) of the first cover (411). As the first protruding member (810a) and the first contact member (820a) are in contact, the first rail guide portion (480a) may be electrically connected to the first conductive portion (811a) of the first cover (411) (e.g., at least a part of the metal frame). The first movement guide portion (470a) may be coupled with the first rail guide portion (480a). A region of the first rail guide portion (480a) coupled with the first movement guide portion (470a) may be different from a region of the first rail guide portion (480a) where the protruding member (810a) is arranged. In the second state (1102), even if the first movement guide portion (470a) moves in one direction (e.g., in the (+) y-axis direction), contact between the first protruding member (810a) and the first contact member (820a) may be maintained.

[0125] In the first state (1101), the second protruding member (810b) may be disposed on one surface of the second rail guide portion (480b) and may have a shape that protrudes in a specific direction (e.g., in the (-) x-axis direction). The second contact member (820b) may be electrically connected to the first cover (411). The second contact member (820b) may be in contact with the second conductive portion (811b) of the first cover (411). As the second protruding member (810b) and the second contact member (820b) are in contact, the first rail guide portion (480b) may be electrically connected to the second conductive portion (811b) of the first cover (411) (e.g., at least a part of the metal frame). The second movement guide portion (470b) may be coupled with the second rail guide portion (480b). A region of the second rail guide portion (480b) coupled with the second movement guide portion (470b) may be different from a region of the second rail guide portion (480b) where the protruding member (810b) is arranged. In the second state (1102), even if the second movement guide portion (470b) moves in one direction (e.g., in the (+) y-axis direction), contact between the second protruding member (810b) and the second contact member (820b) may be maintained.

[0126] Figures 12a to 12f illustrate examples of connection structures using a flexible printed circuit board (FPCB). The same reference numbers may indicate the same or similar descriptions.

[0127] Referring to FIG. 12A, the electronic device (101) may include an FPCB (e.g., FPCB (425) of FIG. 4, circuit board (825)). The FPCB may include a first substrate portion (1210a), a second substrate portion (1210b), a magnetic field coupling (MFC) circuit (1225) for wireless charging, a first key FPCB portion (1235) for a power button, and a second FPCB portion (1230) for a volume button. The first substrate portion (1210a) may correspond to a portion of the FPCB extending from the first key FPCB portion (1235) in one direction (e.g., in the (-) y-axis direction). The second substrate portion (1210b) may correspond to a portion of the FPCB extending in one direction (e.g., the (-) y-axis direction) from the second key FPCB portion (1230). According to one embodiment, the first substrate portion (1210a) and / or the second substrate portion (1210b) may be used for arranging a contact member that contacts a protruding member arranged on a rail guide portion. Examples of contact structures of the rail guide portion, the protruding member, and the contact member of the electronic device (101) are described in detail through FIG. 12c.

[0128] Referring to FIG. 12B, an example of a contact member (820) disposed on one surface of the first substrate portion (1210a) of FIG. 12A is illustrated. FIG. 12B is a view of the first substrate portion (1210a) viewed in one direction (e.g., the (+) x-axis direction). Instead of the contact member (820) directly contacting the conductive portion (e.g., the conductive portion (811)), the contact member (820) and the conductive portion may be electrically connected through the FPCB. While the FPCB is used for electrical connection between the contact member (820) and the conductive portion, a matching circuit may be disposed on a portion (1260) of one surface of the FPCB.

[0129] Referring to FIG. 12c, the electronic device (101) may use the first substrate portion (1210a) and / or the second substrate portion (1210b) as components of a connection structure for grounding, for controlling a matching circuit (e.g., matching circuit (840)) and / or electrically connecting with a processor (e.g., processor (120)). For example, the first connection structure (1270a) may include a contact structure (e.g., first movement guide portion (470a), first rail guide portion (480a)) to allow a signal component due to parasitic resonance to flow to the first cover (411) of the first housing part (210). The first matching circuit (840a) may be disposed on one surface of the first substrate portion (1210a). The first matching circuit (840a) is described in detail with reference to FIGS. 15a to 15d. For example, the second connection structure (1270b) may include a contact structure (e.g., a second moving guide portion (470b), a second rail guide portion (480b)) to allow a signal component due to parasitic resonance to flow to the first cover (411) of the first housing part (210). The second matching circuit (840b) may be arranged on one surface of the second substrate portion (1210b). The second matching circuit (840b) is described in detail with reference to FIGS. 15A to 15D .

[0130] Referring to FIGS. 12d, 12e, and 12f, a first state (1201) of the electronic device (101) (e.g., first state (501), first state (601), first state (711), first state (1001), first state (1101)) may be referred to as a slide-in state or a closed state in that at least a portion of the second housing part (220) is positioned within the first housing part (210). A second state (1202) of the electronic device (101) (e.g., second state (502), second state (602), second state (712), second state (1002), second state (1102))) may be referred to as a slide-out state or an open state in that at least a portion of the second housing part (220) is positioned outside the first housing part (210).

[0131] The first connection structure (1270a) may include a first rail guide portion (480a), a first protruding member (810a), a first contact member (820a), and a first substrate portion (1210a). The first connection structure (1270a) may be electrically connected to a first conductive portion (811a) of the first cover (411) (e.g., at least a part of a metal frame). In the first state (1201), the first protruding member (810a) of the first connection structure (1270a) may be disposed on one surface of the first rail guide portion (480a) and may have a shape that protrudes in a specific direction (e.g., in the (+) x-axis direction). In the second state (1202), even if the first moving guide portion (470a) moves in one direction (e.g., the (+) y-axis direction), the position of the first connection structure (1270a) where the first protruding member (810a) and the first contact member (820a) come into contact can be formed fixedly. That is, the contact between the first protruding member (810a) and the first contact member (820a) can be maintained.

[0132] The second connection structure (1270b) may include a second rail guide portion (480b), a second protruding member (810b), a second contact member (820b), and a second substrate portion (1210b). The second connection structure (1270b) may be electrically connected to a second conductive portion (811b) of the first cover (411) (e.g., at least a part of a metal frame). In the first state (1201), the second protruding member (810b) of the second connection structure (1270b) may be disposed on one surface of the second rail guide portion (480b) and may have a shape that protrudes in a specific direction (e.g., in the (-) x-axis direction). In the second state (1202), even if the second moving guide portion (470b) moves in one direction (e.g., the (+) y-axis direction), the position of the second connecting structure (1270b) where the second protruding member (810b) and the second contact member (820b) come into contact can be formed fixedly. That is, the contact between the second protruding member (810b) and the second contact member (820b) can be maintained.

[0133] Figures 13a to 13d illustrate examples of ground points. Like reference numerals may represent like or similar descriptions.

[0134] Referring to FIG. 13a, the electronic device (101) can control the frequency of the parasitic resonance component (hereinafter, parasitic resonance frequency) through the matching circuit (840). For example, the electronic device (101) can control the matching circuit (840) so that the parasitic resonance frequency is located outside the frequency band of the antenna. Example (1310) shows an example in which the FPCB described through FIGS. 12a to 12f is combined with guide parts of the electronic device (101) (e.g., first moving guide part (470a), first rail guide part (480a), second moving guide part (470b), second rail guide part (480b)). For example, for controlling the matching circuit (840), the electronic device (101) may be connected to a board (1313) (e.g., PCB (450), main PCB, main board, PBA of FIG. 4) on which a processor (e.g., processor (120)) is placed between a conductive portion of the first cover (411) and a contact member (e.g., C-clip) (e.g., FPCB (425), circuit board (825), first substrate portion (1210a), second substrate portion (1210b)) to control the matching circuit (840). In order to explain the connection relationship between the substrate on which the matching circuit (840) is placed and the guide portion, an area (1315) may be referred to. An example (1320) is an enlarged drawing of an area (1315). The first protruding member (810a) is disposed on one surface of the first rail guide portion (480a) and may have a shape that protrudes in a specific direction (e.g., the (+) x-axis direction). The first contact member (820a) may be electrically connected to the first cover (411). The first contact member (820a) may be in contact with the first conductive portion (811a) of the first cover (411) through the conductive adhesive member (830a). As the first protruding member (810a) and the first contact member (820a) are in contact, the first rail guide portion (480a) may be electrically connected to the first conductive portion (811a) of the first cover (411) (e.g., at least a part of the metal frame).

[0135] Referring to FIGS. 13b, 13c, and 13d, the electronic device (101) may include a contact structure for grounding an antenna (e.g., antenna (510)). In terms of forming a ground path, the position of the contact structure may be referred to as a ground point. The contact structure represents a structure in which a protruding member (e.g., a first protruding member (810a), a second protruding member (810b)) and a contact member (e.g., a first contact member (820a), a second contact member (820b)) come into contact. For example, with respect to a first side of the electronic device (101) facing one direction (e.g., a (+) x-axis direction), the first protruding member (810a) may come into contact with the first contact member (820a). The first protruding member (810a) may be coupled to the first rail guide portion (480a). The first contact member (820a) may be electrically connected to the first cover (411) through the first substrate portion (1210a). For example, with respect to the second side facing one direction (e.g., the (-) x-axis direction) of the electronic device (101), the second protruding member (810b) may be in contact with the second contact member (820b). The second protruding member (810b) may be coupled to the second rail guide portion (480b). The second contact member (820b) may be electrically connected to the first cover (411) through the second substrate portion (1210b).

[0136] The ground point indicating the position of the above contact structure can affect the performance of the antenna. Graph (1360) shows the total efficiency according to the ground point. The horizontal axis of graph (1360) shows the frequency (unit: GHz (gigahertz)), and the vertical axis of graph (1360) shows the total efficiency (unit: dB (decibel)). The first line (1361) shows the total efficiency at the first point (1351). The second line (1362) shows the total efficiency at the second point (1352). The third line (1363) shows the total efficiency at the third point (1353). Referring to the first line (1361), the first parasitic resonance region (1371) (e.g., about 1.02 GHz) can be confirmed. Referring to the second line (1362), a second parasitic resonance region (1372) (e.g., about 0.98 GHz) can be identified. Referring to the third line (1363), a third parasitic resonance region (1373) (e.g., about 0.9 GHz) can be identified. For example, a frequency band of an RF signal radiated through an antenna (e.g., antenna (510)) may include about 800 MHz. It can be understood that the farther away from the frequency band, the less the parasitic resonance affects the RF signal. A contact structure providing a ground may be disposed at a first point (1351) between a coupling region (e.g., first portion (881)) where the rail guide portion is coupled to the first cover (411) and a guide region (e.g., second portion (882)) where the rail guide portion receives the moving guide portion, in order to reduce the influence due to parasitic resonance.

[0137] Figure 14 illustrates an example (1400) of a ground path of an electronic device (e.g., electronic device (101)). Like reference numerals may represent the same or similar descriptions.

[0138] Referring to FIG. 14, the electronic device (101) may include, as components of a connection structure on one side, a first moving guide portion (470a), a first rail guide portion (480a), a first protruding member (810a), a first contact member (820a), and a first conductive portion (811a) of the first cover (411). The electronic device (101) may include, as components of a connection structure on another side, a second moving guide portion (470b), a second rail guide portion (480b), a second protruding member (810b), a second contact member (820b), and a second conductive portion (811b) of the first cover (411).

[0139] The electronic device (101) may utilize a ground path to control parasitic resonance due to radiation of an antenna (e.g., antenna (510)) disposed at the bottom. For example, a conductive portion of the first cover (411) may be utilized as a radiator of the antenna. Here, a portion of the first cover (411) may be utilized as a first ground path (1411) for the antenna. For example, the antenna may be connected to a second rail guide portion (480b). The second rail guide portion (480b) may be electrically connected to the first cover (411) of the first housing part (220) through a second protruding member (810b) and a contact member (820b). The second rail guide portion (480b), the second protruding member (810b), and the contact member (820b) may be utilized as a second ground path (1412) for the antenna.

[0140] Figures 15a to 15d illustrate examples of matching circuits (e.g., matching circuit (840)). Like reference numerals may represent like or similar descriptions.

[0141] Referring to FIG. 15a, an example (1510) illustrates an example in which the FPCB described through FIGS. 12a to 12f and FIGS. 13a to 13d is coupled with guide parts (e.g., first moving guide part (470a), first rail guide part (480a), second moving guide part (470b), second rail guide part (480b)) of an electronic device (101). For example, for controlling the matching circuit (840), the electronic device (101) may be connected to a board (1313) (e.g., PCB (450), main PCB, main board, PBA of FIG. 4) on which a processor (e.g., processor (120)) is disposed between a conductive portion of the first cover (411) and a contact member (e.g., C-clip) (e.g., FPCB (425), circuit board (825), first substrate portion (1210a), second substrate portion (1210b)). The contact structure on one side (e.g., the side facing the (+) x-axis direction) of the electronic device (101) may include a first movement guide portion (470a) and a first rail guide portion (480a). The first matching circuit (840a) may be disposed on one side of the first substrate portion (1210a). A contact structure on one side (e.g., a side facing the (+) x-axis direction) of the electronic device (101) may include a second movement guide portion (470b) and a second rail guide portion (480b). A second matching circuit (840b) may be disposed on one side of the second substrate portion (1210b).

[0142] Referring to FIG. 15b, according to one embodiment, a contact member (820) and a matching circuit (840) may be disposed on one surface (1550) of the substrate. For example, the matching circuit (840) may include at least one passive element. As an example, the at least one passive element may include an inductor and / or a capacitor. The at least one passive element may be used to change the location of a frequency at which parasitic resonance occurs.

[0143] Referring to FIG. 15c, according to one embodiment, a contact member (820) and a matching circuit (840) may be disposed on one surface (1550) of the substrate. The matching circuit (840) may include a plurality of elements and a switching circuit (1560). For example, the plurality of elements may include a first element (1540a), a second element (1540b), a third element (1540c), and a fourth element (1540d). As an example, each element of the plurality of elements may include an active element or a passive element (e.g., an inductor and / or a capacitor). Each element of the plurality of elements may be used to change a location of a frequency at which parasitic resonance occurs. The switching circuit (1560) may selectively connect one of the plurality of elements to the contact member (820). One of the plurality of elements may be electrically connected to the contact member (820). The operation of the switching circuit (1560) can be controlled by a processor (e.g., processor (120)).

[0144] Referring to FIG. 15d, a graph (1570) represents the total efficiency for each element. The horizontal axis of the graph (1570) represents the frequency (unit: GHz (gigahertz)), and the vertical axis of the graph (1570) represents the total efficiency (unit: dB (decibel)). A first line (1571) represents the total efficiency when a first element (1540a) is electrically connected to a contact member (820) through a switching circuit (1560). A second line (1572) represents the total efficiency when a second element (1540b) is electrically connected to a contact member (820) through a switching circuit (1560). A third line (1573) represents the total efficiency when a third element (1540c) is electrically connected to a contact member (820) through a switching circuit (1560). The fourth line (1574) represents the overall efficiency when the fourth element (1540d) is electrically connected to the contact member (820) through the switching circuit (1560).

[0145] Referring to the first line (1571), a first parasitic resonance region (1581) can be identified. Referring to the second line (1572), a second parasitic resonance region (1582) can be identified. Referring to the third line (1573), a third parasitic resonance region (1583) can be identified. Referring to the fourth line (1574), a fourth parasitic resonance region (1584) can be identified. It can be understood that the farther the frequency range where parasitic resonance occurs is from the frequency band of the RF signal radiated through the antenna, the less the parasitic resonance affects the RF signal. In order to reduce the effect due to parasitic resonance, the processor (120) can control the switching circuit (1560) to connect the fourth element (1540d) to the contact member (820).

[0146] According to one embodiment, the processor (120) may control the switching circuit (1560) based on the frequency band of the RF signal transmitted through the antenna. For example, while a signal of a first frequency band is transmitted through the antenna, the switching circuit (1560) may be controlled so that a first element (1540a) among the plurality of elements is electrically connected to the contact member (820). For example, while a signal of a second frequency band is transmitted through the antenna, the switching circuit (1560) may be controlled so that a second element (1540b) among the plurality of elements is electrically connected to the contact member (820).

[0147] According to one embodiment, the processor (120) may control the switching circuit (1560) based on the state of the electronic device (101). For example, in a first state of the electronic device (101) (e.g., first state (501), first state (601), first state (711), first state (1001), first state (1101), first state (1201)), the processor (120) may control the switching circuit (1560) so that the first element (1540a) and the contact member (820) are electrically connected. For example, in a second state (e.g., second state (502), second state (602), second state (712), second state (1002), second state (1102), second state (1202)) of the electronic device (101), the processor (120) can control the switching circuit (1560) so that the second element (1540b) among the plurality of elements is electrically connected to the contact member (820).

[0148] Although a plurality of elements and a switching circuit are described as examples of the matching circuit (840) in FIGS. 15B and 15C , embodiments of the present disclosure are not limited thereto. Any circuit component configured to provide variable impedance can be understood as the matching circuit (840) of the present disclosure. For example, the matching circuit (840) may include an element or integrated circuit (IC) configured to provide variable impedance.

[0149] Figures 16a and 16b illustrate examples of radiation performance according to a connection structure for the ground of an antenna of an electronic device (e.g., electronic device (101)). The same reference numerals may represent the same or similar descriptions.

[0150] Referring to Fig. 16a, a graph (1600) represents total efficiency by frequency. The horizontal axis of the graph (1600) represents frequency (unit: GHz (gigahertz)), and the vertical axis of the graph (1600) represents total efficiency (unit: dB (decibel)). A first line (1601) represents total efficiency in an open state where the rail guide portion (480) is not electrically connected to the first cover (411). A second line (1602) represents total efficiency in a short state where an electrical connection is formed between a protruding member (810) disposed on the rail guide portion (480) and a contact member (820) connected to the first cover (411).

[0151] Referring to the first line (1601), the first parasitic resonance region (1611) can be confirmed. Referring to the second line (1602), the first parasitic resonance region (1612) can be confirmed. It can be understood that the farther the frequency range where the parasitic resonance occurs is from the frequency band of the RF signal radiated through the antenna, the less the parasitic resonance affects the RF signal. It can be confirmed that the parasitic resonance component has less effect on the band of the RF signal as the rail guide portion (480) and the first cover (411) are electrically connected through the second line (1602). In addition, since the overall efficiency of the second line (162) is higher than the overall efficiency of the first line (1601) in the frequency band (e.g., about 0.8 GHz), it can be confirmed that the radiation gain of the RF signal also increases.

[0152] Referring to FIG. 16b, a graph (1650) represents total radiation efficiency by frequency. The horizontal axis of the graph (1650) represents frequency (unit: MHz (megahertz)), and the vertical axis of the graph (1650) represents radiation efficiency (unit: dB (decibel)). A first line (1651) represents radiation efficiency in a short state in which an electrical connection is formed between a protruding member (810) disposed on a rail guide portion (480) and a contact member (820) connected to the first cover (411). A second line (1652) represents radiation efficiency in a short state in which an electrical connection is formed between a moving guide portion (470) and the first cover (411) through a contact member (e.g., a C-clip). The third line (1653) represents the overall efficiency in an open state where both the moving guide portion (470) and the rail guide portion (480) are not electrically connected to the first cover (411). The frequency band of the signal radiated through the antenna may include approximately 750 to 800 MHz. Since the first line (1651) provides higher radiation efficiency than the second line (1652) and the third line (1653) in the above frequency band, it can be confirmed that the ground structure using the rail guide portion (480) improves antenna performance.

[0153] Fig. 17 illustrates an example of a connection structure for providing a ground through a battery frame (e.g., frame (430)). The same reference numerals may represent the same or similar descriptions. Examples of forming a ground path for controlling parasitic resonance are described with reference to Figs. 4 to 16b, whereby the rail guide portion (480) is electrically connected to the first cover (411) of the first housing part (210) through at least one conductive member (e.g., protruding member (810), contact member (820)). Meanwhile, the at least one conductive member is not limited to a specific area or direction. As the at least one conductive member, other components may be used in addition to a C-clip or a protruding structure. For example, a screw for fixing the battery frame may be used as a conductive member for forming a ground path. To explain the screw, reference may be made to the battery frame (1120) illustrated in Fig. 10b.

[0154] Referring to FIG. 17, the electronic device (101) may include a battery frame (1120) (e.g., frame (430)). A portion (1130) of the battery frame (1120) may be coupled to a rail guide portion (480). The portion (1130) may include a feeding point (1730). Even if the battery frame (1120) is not electrically connected to the rail guide portion (480), an RF signal may be transmitted to a region within the battery frame (1120) through the feeding point (1730). According to one embodiment, the electronic device (101) may include a screw (1760) for coupling the battery frame (1120) and the first cover (411). The screw (1760) may be made of a metal material and may form an electrical path. Through the screw (1760), the RF signal transmitted can be provided to the first cover (411). In other words, as a ground path for controlling parasitic resonance components, the RF signal can flow in the order of the rail guide portion (480), the feeding point (1730), the screw (1760), and the first cover (411).

[0155] In embodiments, an electronic device (101) is provided. The electronic device (101) may include a first housing part (210) including a conductive portion, a second housing part (220) configured to be movably coupled to the first housing part (210), a rail guide part (480; 480a; 480b) electrically connected to the conductive portion and coupled to the first housing part (210), the rail guide part including an at least partially sunken recess, and a movement guide part (470; 470a; 470b) coupled to the second housing part (220), at least partially received in the recess, and configured to move along the recess based on movement of the second housing part (220).

[0156] According to one embodiment, the electronic device (101) may include a flexible display coupled to the first housing part (210) and the second housing part (220), an antenna electrically connected to the rail guide portion (480; 480a; 480b) of the first housing part (210), a protruding member coupled to the rail guide portion (480; 480a; 480b), and a contact member electrically connected to the conductive portion of the first housing part (210) and disposed on one side of the conductive portion. At least a portion of the protruding member may be disposed to contact the contact member electrically connected to the conductive portion.

[0157] According to one embodiment, the electronic device (101) may include a conductive adhesive disposed on one surface of the conductive portion and a flexible printed circuit board (FPCB) electrically connected to the conductive portion through the conductive adhesive. The contact member may be disposed on a second surface of the FPCB opposite to the first surface on which the FPCB is coupled with the conductive portion.

[0158] According to one embodiment, the electronic device (101) may include a processor and a matching circuit configured to provide a variable impedance. The matching circuit may be disposed on the second surface of the FPCB.

[0159] According to one embodiment, the matching circuit may include a plurality of elements and a switching circuit configured to selectively connect the contact member with one of the plurality of elements. The moving guide portion (470; 470a; 470b) may be arranged at a position having a first state in which a distance between the moving guide portion (470; 470a; 470b) and the antenna is minimum or a second state in which a distance between the moving guide portion (470; 470a; 470b) and the antenna is maximum, depending on movement of the first housing part (210) or the second housing part (220). The processor may be configured to control the switching circuit such that a first element among the plurality of elements is electrically connected to the contact member in the first state, and to control the switching circuit such that a second element among the plurality of elements, different from the first element, is electrically connected to the contact member in the second state.

[0160] In one embodiment, the matching circuit may include a plurality of elements and a switching circuit configured to selectively connect the contact member with one of the plurality of elements. The processor may be configured to control the switching circuit so that a first element among the plurality of elements is electrically connected to the contact member while a signal of a first frequency band is transmitted through the antenna, and to control the switching circuit so that a second element among the plurality of elements is electrically connected to the contact member while a signal of a second frequency band different from the first frequency band is transmitted through the antenna.

[0161] In one embodiment, the FPCB may include an FPCB for a volume key or a power key. The FPCB may be electrically connected to a printed board assembly (PBA) of the electronic device (101) via a magnetic field coupling (MFC) circuit. The processor may be disposed on the PBA.

[0162] In one embodiment, the matching circuit may include a plurality of elements and a switching circuit configured to selectively connect the contact member with one of the plurality of elements. The processor may be configured to identify, among the plurality of elements, an element that causes a frequency of parasitic resonance that is furthest from a frequency of a designated frequency band, and control the switching circuit to connect the element with the contact member.

[0163] According to one embodiment, the electronic device (101) may include a wireless communication circuit. The wireless communication circuit may be configured to transmit a signal of the designated frequency band via the antenna. The frequency of the parasitic resonance caused by movement of the first housing part (210) or the second housing part (220) may be outside the designated frequency band.

[0164] According to one embodiment, the rail guide portion (480; 480a; 480b) may include a first portion for electrical connection with the antenna, a second portion for guiding movement of the movement guide portion (470; 470a; 470b), and a third portion between the first portion and the second portion, based on the movement direction of the first housing part (210) or the second housing part (220). The protruding member may be coupled to the third portion of the rail guide portion (480; 480a; 480b).

[0165] According to one embodiment, the conductive portion of the first housing part (210) may be disposed on one side of the electronic device (101). The one side of the electronic device (101) may face a third direction that is perpendicular to a first direction in which the first housing part (210) or the second housing part (220) moves and perpendicular to a second direction in which a display area of ​​the flexible display faces. The protruding member may protrude from the rail guide portion (480; 480a; 480b) toward the third direction. The contact member may include a C-clip. A substrate portion of the C-clip may be coupled to the one side of the conductive portion, and an elastic portion of the C-clip may be in contact with the protruding member.

[0166] According to one embodiment, the rail guide portion (480; 480a; 480b) may be arranged at a position in which the distance between the moving guide portion (470; 470a; 470b) and the antenna is at a minimum in a first state, the distance between the moving guide portion (470; 470a; 470b) and the antenna is at a maximum in a second state, or the distance between the moving guide portion (470; 470a; 470b) and the antenna is between the minimum and the maximum in a third state, depending on the movement of the first housing part (210) or the second housing part (220). In the first state, the second state, and the third state, at least a portion of the protruding member to which the rail guide portion (480; 480a; 480b) is coupled may come into contact with the contact member arranged on the conductive portion.

[0167] According to one embodiment, the first housing part (210) may include at least one conductive portion. The antenna may include a conductive portion different from the conductive portion among the at least one conductive portion. The rail guide portion (480; 480a; 480b) may be configured to provide a ground path for the antenna through the conductive portion of the first housing part (210) or a flexible printed circuit board (FPCB) on which the contact member is arranged.

[0168] According to one embodiment, the electronic device (101) may include a second antenna disposed on the second housing part (220) and a second contact member electrically connected to the second housing part (220). The movement guide portion (470; 470a; 470b) may be electrically connected to the second housing part (220) through the second contact member.

[0169] According to one embodiment, the electronic device (101) may include a battery and a battery frame for the battery. At least a portion of the battery frame may be in contact with the rail guide portion (480; 480a; 480b) through an insulating coating.

[0170] According to one embodiment, the electronic device (101) may include a printed circuit board (PCB) disposed on the first housing part (210) or the second housing part (220), at least one processor (120) disposed on the PCB, a flexible printed circuit board (FPCB) electrically connecting the conductive portion (811) and the PCB, and a matching circuit (840) disposed adjacent to the rail guide portion (480; 480a; 480b) on the FPCB and configured to provide variable impedance. The at least one processor (120) may be configured to transmit a signal of a specified frequency band through the conductive portion (811). The at least one processor (120) may control the matching circuit (840) based on a frequency of parasitic resonance due to movement of the first housing part (210) or the second housing part (220).

[0171] According to one embodiment, the electronic device (101) may include at least one ball bearing. The at least one ball bearing may be arranged between the rail guide portion (480; 480a; 480b) and the moving guide portion (470; 470a; 470b).

[0172] In embodiments, an electronic device (101) is provided. The electronic device (101) comprises a housing including a first housing part (210) and a second housing part (220) configured to be movably coupled with the first housing part (210), a flexible display (230) coupled to the first housing part (210) and the second housing part (220), a first rail guide part (480; 480a; 480b) coupled to the first housing part (210), a first movement guide part (470; 470a; 470b) configured to move along the first rail guide part (480; 480a; 480b) according to movement of the housing, a second rail guide part (480; 480a; 480b) coupled to the first housing part (210), and configured to move along the second rail guide part (480; 480a; 480b) according to movement of the housing. It may include a second moving guide part (470; 470a; 470b) configured, an antenna electrically connected to at least one of the first rail guide part (480; 480a; 480b) or the second rail guide part within the first housing part (210), a first protruding member (810; 810a; 810b) coupled to the first rail guide part (480; 480a; 480b), and a first contact member (820; 820a; 820b) electrically connected to the first conductive part (811; 811a; 811b) of the first housing part (210) and disposed on one side of the first conductive part (811; 811a; 811b). At least a portion of the first protruding member (810; 810a; 810b) may be arranged to contact the first contact member (820; 820a; 820b) which is electrically connected to the first conductive portion (811; 811a; 811b).

[0173] According to one embodiment, the electronic device (101) may include a second protruding member (810; 810a; 810b) coupled to the second rail guide portion (480; 480a; 480b), and a second contact member (820; 820a; 820b) electrically connected to the second conductive portion (811; 811a; 811b) of the first housing part (210) and disposed on one side of the second conductive portion (811; 811a; 811b). At least a portion of the second protruding member (810; 810a; 810b) may be disposed to contact the second contact member (820; 820a; 820b) electrically connected to the second conductive portion (811; 811a; 811b).

[0174] According to one embodiment, the first housing part (210) may include at least one conductive portion (811; 811a; 811b). The antenna may include a third conductive portion (811; 811a; 811b) that is different from the first conductive portion (811; 811a; 811b) and the second conductive portion (811; 811a; 811b) among the at least one conductive portion (811; 811a; 811b). The first rail guide portion (480; 480a; 480b) can provide a ground path for the antenna through a first FPCB (flexible printed circuit board) on which the first conductive portion (811; 811a; 811b) of the first housing part (210) or the first contact member (820; 820a; 820b) is disposed. The second rail guide portion (480; 480a; 480b) can provide a ground path for the antenna through a second FPCB on which the second conductive portion (811; 811a; 811b) of the first housing part (210) or the second contact member (820; 820a; 820b) is disposed.

[0175] According to one embodiment, the second housing part (220) may be arranged at a position in which, depending on movement of the housing, the distance between the second housing part (220) and the antenna is at a minimum in a first state, the distance between the second housing part (220) and the antenna is at a maximum in a second state, or the distance between the second housing part (220) and the antenna is between the minimum and the maximum in a third state. In the first state, the second state, and the third state, the first protruding member (810; 810a; 810b) may be arranged such that at least a portion of the first protruding member (810; 810a; 810b) maintains contact with the first contact member (820; 820a; 820b) arranged on the first conductive portion (811; 811a; 811b).

[0176] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0177] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0178] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0179] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0180] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0181] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A first housing part including a challenging portion; A second housing part configured to be movably coupled to the first housing part; A rail guide portion electrically connected to the above conductive portion, coupled to the first housing part, and including an at least partially sunken recess; and A moving guide portion coupled to the second housing part and at least partially received in the recess, the moving guide portion configured to move along the recess based on movement of the second housing part. Electronic devices.

2. In claim 1, A flexible display coupled to the first housing part and the second housing part; An antenna electrically connected to the rail guide portion in the first housing part; a protruding member coupled to the above rail guide portion; and Including a contact member electrically connected to the conductive portion of the first housing part and arranged on one side of the conductive portion, At least a portion of said protruding member is arranged to contact said contact member which is electrically connected to said conductive portion, Electronic devices.

3. In claims 1 to 2, A conductive adhesive disposed on one side of the above-mentioned conductive portion; and It includes a flexible printed circuit board (FPCB) electrically connected to the conductive portion through the conductive adhesive member, The above contact member is disposed on a second surface opposite to the first surface on which the FPCB is coupled with the conductive portion. Electronic devices.

4. In claims 1 to 3, processor; and Comprising a matching circuit configured to provide a variable impedance, The above matching circuit is arranged on the second surface of the FPCB. Electronic devices.

5. In claims 1 to 4, The above matching circuit comprises a plurality of elements and a switching circuit (0) configured to selectively connect the contact member with one of the plurality of elements, The above moving guide part is positioned at a position having a first state in which the distance between the moving guide part and the antenna is minimum or a second state in which the distance between the moving guide part and the antenna is maximum, depending on the movement of the first housing part or the second housing part. The above processor, In the first state, the switching circuit (0) is controlled so that a first element among the plurality of elements is electrically connected to the contact member, In the second state, the switching circuit (0) is configured to be controlled so that a second element, which is different from the first element among the plurality of elements, is electrically connected to the contact member. Electronic devices.

6. In claims 1 to 5, The above matching circuit comprises a plurality of elements and a switching circuit (0) configured to selectively connect the contact member with one of the plurality of elements, The above processor, While a signal of the first frequency band is transmitted through the antenna, the switching circuit (0) is controlled so that the first element among the plurality of elements and the contact member are electrically connected, While a signal of a second frequency band different from the first frequency band is transmitted through the antenna, the switching circuit (0) is configured to be controlled so that a second element among the plurality of elements and the contact member are electrically connected. Electronic devices.

7. In claims 1 to 6, The above FPCB includes an FPCB for a volume key or a power key, The above FPCB is electrically connected to the PBA (printed board assembly) of the electronic device through an MFC (magnetic field coupling) circuit, The above processor is disposed in the PBA, Electronic devices.

8. In claims 1 to 7, The above matching circuit comprises a plurality of elements and a switching circuit (0) configured to selectively connect the contact member with one of the plurality of elements, The above processor, Among the above multiple elements, identify an element that causes a frequency of parasitic resonance that is furthest from a frequency of a specified frequency band, The switching circuit (0) is configured to control the above-mentioned element so as to be connected to the above-mentioned contact member. Electronic devices.

9. In claims 1 to 8, Further comprising a wireless communication circuit, The above wireless communication circuit, configured to transmit a signal of the above-mentioned designated frequency band through the above-mentioned antenna, The frequency of parasitic resonance caused by movement of the first housing part or the second housing part is outside the specified frequency band. Electronic devices.

10. In claims 1 to 9, The rail guide portion includes a first portion for electrical connection with the antenna, a second portion for guiding movement of the movement guide portion, and a third portion between the first portion and the second portion, based on the movement direction of the first housing part or the second housing part. The above protruding member is joined to the third part of the rail guide part, Electronic devices.

11. In claims 1 to 10, The conductive portion of the first housing part is disposed on one side of the electronic device, The one side of the electronic device faces a third direction that is perpendicular to a first direction in which the first housing part or the second housing part moves and perpendicular to a second direction in which the display area of ​​the flexible display faces, The above protruding member protrudes from the rail guide portion toward the third direction, The above contact absence comprises a C-clip, The substrate portion of the C-clip is coupled to one side of the conductive portion and the elastic portion of the C-clip is in contact with the protruding member. Electronic devices.

12. In claims 1 to 11, The rail guide portion is positioned at a position having a first state in which the distance between the moving guide portion and the antenna is minimum, a second state in which the distance between the moving guide portion and the antenna is maximum, or a third state in which the distance between the moving guide portion and the antenna is between the minimum and the maximum, depending on the movement of the first housing part or the second housing part. In the first state, the second state, and the third state, at least a portion of the protruding member to which the rail guide portion is coupled is in contact with the contact member arranged on the conductive portion. Electronic devices.

13. In claims 1 to 12, The above first housing part comprises at least one conductive portion, The antenna comprises a conductive portion different from the conductive portion among the at least one conductive portion, configured to provide a ground path for the antenna through the rail guide portion, the conductive portion of the first housing part, or the flexible printed circuit board (FPCB) on which the contact member is arranged. Electronic devices.

14. In claims 1 to 13, a second antenna disposed on the second housing part; and Further comprising a second contact member electrically connected to the second housing part, The above moving guide portion is electrically connected to the second housing part through the second contact member. Electronic devices.

15. In claims 1 to 14, A printed circuit board disposed in the first housing part or the second housing part; At least one processor disposed on the printed circuit board; A flexible printed circuit board (FPCB) electrically connecting the above conductive portion and the printed circuit board; and Further comprising a matching circuit arranged adjacent to the rail guide portion on the FPCB and configured to provide variable impedance; The at least one processor is configured to transmit a signal of a specified frequency band through the conductive portion, The at least one processor controls the matching circuit based on the frequency of parasitic resonance according to movement of the first housing part or the second housing part. Electronic devices.

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