Power distribution apparatus and vehicle
By using MCU, Efuse chip and multi-channel high-side drive module combined power distribution in automotive electronic control units (ECUs), the problem of high cost and complexity of one-to-one distribution of Efuse chips is solved, and a lower cost and higher reliability distribution solution is achieved.
Patent Information
- Application Number
- PCT/CN2024/090875
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-10-30
- Filing Date
- 2024-04-30
- Publication Date
- 2025-05-08
AI Technical Summary
The existing automotive electronic control unit (ECU) normal power distribution scheme uses Efuse chips for one-to-one power distribution, which is high in cost and complexity. The Efuse chip itself does not have the power-on precharge function, which can easily lead to instant charging overcurrent and power distribution shutdown.
The MCU, Efuse chip and multi-channel high-side drive module are used to combine power distribution. The MCU is used to respond to the power-on and sleep state of the whole vehicle, control the output driving voltage of the multi-channel high-side drive module and Efuse chip to achieve normal and low-power power distribution.
By reducing the use of Efuse chips, the cost of power distribution devices is reduced, the need for power-on pre-charge circuits is avoided, and the reliability and continuity of power distribution is improved.
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Figure CN2024090875_08052025_PF_FP_ABST
Abstract
Description
Power distribution device and vehicle
[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on October 30, 2023, with application number 202311423773.6 and invention name “A distribution device and vehicle”, and claims priority to the Chinese patent application filed with the China Patent Office on October 30, 2023, with application number 202322923038.3 and patent application name “A distribution device and vehicle”, the entire contents of which are incorporated by reference into this application. Technical Field
[0002] The present application relates to the field of automobile technology, and in particular to a power distribution device and a vehicle. Background Art
[0003] With the continuous evolution of automotive electrical and electronic architecture, the traditional distributed architecture is gradually shifting to a new generation of regional architecture. In this new regional architecture, many automotive electronic control units need to implement regional intelligent power distribution. Intelligent power distribution requires functions such as current detection and I²T curve protection algorithms to replace the functions of traditional physical fuses. Some automotive electronic control units (ECUs) require power distribution not only after the vehicle is started but also after the vehicle is in sleep mode. This power distribution method is called constant power distribution.
[0004] Currently, the industry's ECU power distribution solution uses Efuse chips for one-to-one power distribution, as shown in Figure 1. Efuse chips are relatively new in the industry, and the cost of the single chip and peripheral circuits is high, making them difficult to replace. Furthermore, the Efuse chip itself lacks a pre-charge function, which can cause instantaneous overcurrent and power shutdown at power-up. Therefore, a separate pre-charge circuit design is required. In summary, the one-to-one power distribution solution using Efuse chips is not only costly but also complex in design.
[0005] Summary of the Invention
[0006] The purpose of this application is to propose a power distribution device and a vehicle to solve the technical problem that the current ECU normal power distribution solution in the industry uses Efuse chips for one-to-one power distribution, which is costly and complex.
[0007] To achieve the above objectives, an embodiment of the present application provides a power distribution device, including an MCU, an Efuse chip, and a multi-channel high-side driver module;
[0008] The input pin of the Efuse chip is connected to the MCU for receiving the control signal of the MCU; the output pin of the Efuse chip is connected to multiple ECUs for outputting driving voltage to the ECU;
[0009] The multi-channel high-side driver module includes a plurality of drive channels corresponding to the plurality of ECUs one by one; an input pin of each drive channel is connected to the MCU for receiving a control signal from the MCU; an output pin of each drive channel is connected to a corresponding ECU for outputting a drive voltage to the ECU;
[0010] The MCU is used to respond to the vehicle power-on, control the multiple drive channels to output drive voltages to distribute power normally to the multiple ECUs, and control the Efuse chip to turn off the output drive voltage;
[0011] The MCU is also used to respond to the vehicle's sleep state, control the Efuse chip to output a driving voltage to perform low-power power distribution to the multiple ECUs, and control the multiple driving channels to turn off the output driving voltage.
[0012] The power distribution device of the embodiment of the present application has the following beneficial effects:
[0013] If there are at least two small current (less than 5A current) permanent power distribution ECUs in the regional controller, an Efuse chip and a multi-channel high-side driver module are used for combined power distribution. The multi-channel high-side driver module is used to perform normal power distribution to the at least two small current permanent power distribution ECUs when the whole vehicle is powered on and running, and the Efuse chip is used to perform low-power power distribution to the at least two small current permanent power distribution ECUs after the whole vehicle is dormant. Compared with the one-to-one power distribution solution of the Efuse chip, the combined power distribution method of the embodiment of the present application only requires one Efuse chip, which reduces the use of the Efuse chip. The high-side driver chip has strong impact current resistance, does not require a power-on pre-charging circuit, and will not have a power-on overcurrent shutdown problem. Therefore, there is no need to add an additional power-on pre-charging circuit, and the high-side driver chip has a low cost. In summary, the power distribution device structure design of the embodiment of the present application is simple, which can greatly reduce the cost of the power distribution device.
[0014] An embodiment of the present application also provides a vehicle, comprising the above-mentioned power distribution device.
[0015] Details and advantages not described in detail in the embodiments of the present application are described in detail in the specific implementation manner. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0017] FIG1 is a structural diagram of a power distribution device mentioned in the background technology.
[0018] FIG2 is a structural diagram of a power distribution device in one embodiment of the present application.
[0019] FIG3 is a structural diagram of a power distribution device in a specific embodiment of the present application.
[0020] FIG4 is a flow chart of a normal power distribution working mode after the power distribution device shown in FIG3 is powered on.
[0021] FIG5 is a flow chart of the sleep switching low power distribution working mode of the power distribution device shown in FIG3 .
[0022] FIG6 is a flow chart of the power distribution switching working mode after the ECU of the power distribution device shown in FIG3 wakes up. DETAILED DESCRIPTION
[0023] The detailed description of the accompanying drawings is intended to serve as an illustration of the current embodiment of the present application and is not intended to represent the only form in which the present application can be implemented. It should be understood that the same or equivalent functions can be accomplished by different embodiments intended to be included in the spirit and scope of the present application.
[0024] One embodiment of the present application provides a power distribution device that can implement two power distribution modes: normal power distribution (power distribution by an HSD chip) and low-power power distribution (power distribution by an Efuse chip). Referring to FIG2 , the device includes an MCU, an Efuse chip, and a multi-channel high-side driver module.
[0025] The input pin of the Efuse chip is connected to an output pin of the MCU to receive a control signal output by the MCU, which can be an SPI or IO port control signal; the output pin of the Efuse chip is connected to the power input of multiple ECUs to output a driving voltage to the ECUs and distribute power to the ECUs;
[0026] The multi-channel high-side driver module (HSD) includes multiple drive channels corresponding to the multiple ECUs. The input pin of each drive channel is connected to an output pin of the MCU to receive a control signal output by the MCU, which can be a high / low level logic voltage. The output pin of each drive channel is connected to the power input of a corresponding ECU to output a drive voltage to the ECU to distribute power to the ECU.
[0027] The MCU is used to respond to vehicle power-on, control the multiple drive channels to output drive voltages to distribute power to the multiple ECUs normally, and control the Efuse chip to turn off the output drive voltage. At this time, the multi-channel high-side driver module controls the high-current power distribution provided by the ECUs during normal operation, and the current is generally within 5A.
[0028] The MCU is also used to respond to the vehicle's sleep state, control the Efuse chip to output a driving voltage to distribute low-power power to the multiple ECUs, and control the multiple drive channels to turn off the output driving voltage; at this time, the Efuse chip output provides the current required for the ECU to sleep, and the current is generally within 10mA.
[0029] Specifically, the Efuse constant power distribution in the current automobile zone controller is a new technology, and its application design is not perfect. In the zone controller, both the large current (>5A) and small current (<5A) constant power distribution ECU loads use the Efuse chip for one-to-one power distribution design. Based on this, this embodiment proposes the above-mentioned power distribution device for the needs of small current constant power distribution ECU (that is, the multiple ECUs). If there are at least two small current constant power distribution ECUs in the zone controller, an Efuse chip and a multi-channel high-side driver module can be used to combine power distribution. The multi-channel high-side driver module is used to distribute power to the at least two ECUs when the vehicle is powered on. The small current constant power distribution ECU performs normal power distribution, and the Efuse chip is used to perform low-power power distribution to the at least two small current constant power distribution ECUs after the entire vehicle is in sleep mode. Compared with the one-to-one power distribution solution of the Efuse chip, the combined power distribution method of the embodiment of the present application only requires one Efuse chip, which reduces the use of the Efuse chip. The HSD chip has a strong impact current resistance capability, does not require a power-on pre-charging circuit, and will not have a power-on overcurrent shutdown problem. Therefore, there is no need to add a separate power-on pre-charging circuit, and the cost of the HSD chip is relatively low. In summary, the power distribution device of this embodiment has a simple structural design and can greatly reduce the cost of the power distribution device.
[0030] In some embodiments, the output pin of the Efuse chip is connected to each ECU via a power diode, the anode of the power diode is connected to the output pin of the Efuse chip, and the cathode of the diode is connected to the power input pin of the ECU.
[0031] Specifically, the power diode is a power diode with a relatively low voltage drop, and is primarily used to isolate the parallel drive outputs of the HSD chip and the Efuse chip. The specific model is not limited, but the diode power consumption when the output is short-circuited must be considered. Since the Efuse chip has a limited output current in low-power mode, for example, the ST VNF1048 Efuse chip has a fixed output current of only 200mA in low-power mode, and the Infineon 2ED2410 Efuse chip can configure the output current size through peripheral circuits in low-power mode, after hibernation, if the ECU wiring harness is short-circuited to GND, causing a sharp increase in current, i.e., an EUC overcurrent, exceeding the current limit of the Efuse chip in low-power mode, the corresponding power diode will be reverse biased, and the power diode will not conduct, isolating the faulty ECU from the Efuse chip.
[0032] In some embodiments, the Efuse chip is provided with a diagnostic pin, the diagnostic pin is connected to the wake-up pin of the MCU, and the diagnostic pin is used to output a diagnostic signal to the MCU;
[0033] Wherein: if the current flowing through any ECU is greater than the preset current limit of the Efuse chip in low-power mode when the Efuse chip performs low-power power distribution for the multiple ECUs, the diagnostic signal is low level to wake up the MCU; otherwise, the diagnostic signal is high level, the MCU is in sleep mode or the multi-channel high-side driver module supplies power to the multiple ECUs;
[0034] Specifically, a detection module can be set up, which can be integrated inside the Efuse chip, and is used to detect whether the current flowing through the multiple ECUs is greater than the preset current limit of the Efuse chip in low power consumption mode. The Efuse chip determines whether to output a high-level diagnostic signal or a low-level diagnostic signal based on the detection result.
[0035] The MCU is also used to control the operation of the Efuse chip and the multi-channel high-side driver module according to the diagnostic signal;
[0036] The MCU is used to respond to the vehicle power-on and output corresponding control signals to the multiple drive channels and the Efuse chip, control the multiple drive channels to output drive voltages to distribute power to the multiple ECUs normally, and control the Efuse chip to turn off the output drive voltage;
[0037] Wherein: when the diagnostic signal is at a high level, the MCU responds to the vehicle sleeping state and outputs corresponding control signals to the multiple drive channels and the Efuse chip, controls the Efuse chip to output drive voltage to perform low-power power distribution to the multiple ECUs, and controls the multiple drive channels to turn off the output drive voltage;
[0038] Among them: when the diagnostic signal is at a low level, the MCU is awakened by the Efuse chip, and is used to output corresponding control signals to the multiple drive channels and the Efuse chip, control the multiple drive channels to output drive voltages to distribute power to the multiple ECUs normally, and control the Efuse chip to turn off the output drive voltage. At this time, the power distribution mode is switched from the low-power power distribution of the Efuse chip to the normal power distribution of the HSD chip.
[0039] In some embodiments, the power distribution device also includes an inversion circuit and a switching diode, the input pin of the inversion circuit is connected to the diagnostic pin, the output pin of the inversion circuit is connected to the anode of the switching diode, and the cathode of the switching diode is connected to the input pins of the multiple drive channels; the inversion circuit is used to receive the diagnostic signal and invert the diagnostic signal. If the diagnostic signal is a high level, a low level is obtained after inversion, and the switching diode is not conductive at this time; if the diagnostic signal is a low level, a high level is obtained after inversion, and the switching diode is conductive at this time, and the high level is sent to the input pins of the multiple drive channels.
[0040] Among them, when the input pin of the drive channel inputs a high level, the output pin of the drive channel outputs a drive voltage to distribute power to the ECU normally. When the input pin of the drive channel inputs a low level, the output pin of the drive channel turns off the output drive voltage.
[0041] Specifically, after the Efuse chip wakes up the MCU, the entire mode switching process takes about 30ms to switch the HSD chip output to normal power distribution for the ECU. This 30ms time will cause the power distribution of the subsequent ECU to be interrupted, and the power distribution cannot be maintained continuously during the switching process. Therefore, an inversion circuit is designed in this embodiment. The diagnostic signal passes through the inversion circuit and forms an OR gate with the control signal output by the MCU to the multiple drive channels. The change in the diagnostic signal level can not only wake up the MCU, but also instantly control the HSD chip output to open, thereby ensuring the power distribution continuity of the ECU after the power distribution mode is switched.
[0042] In some embodiments, the multi-channel high-side driver module further includes a current detection pin, which is connected to the ADC function detection pin of the MCU and is used to output the distribution current signal of each ECU to the MCU; specifically, a current sensor can be provided to detect the distribution current signal of each ECU and feed back the detection result to the multi-channel high-side driver module;
[0043] The MCU is also used to diagnose whether each ECU has a fault based on the distribution current signal of each ECU. If any ECU has a fault, a drive channel corresponding to the ECU is controlled to shut down the output drive voltage, thereby isolating the faulty ECU from the HSD chip and realizing the I2T protection function. Specifically, the signal output by the current detection pin is a corresponding voltage value obtained by ADC conversion of the distribution current of each ECU, so that the MCU can perform calculations. The MCU compares the voltage value with a preset voltage threshold internally. If the voltage value is greater than or equal to the voltage threshold, the corresponding ECU is determined to be faulty. If the voltage value is less than the voltage threshold, the corresponding ECU is determined to be normal.
[0044] In some embodiments, the multi-channel high-side driver module is provided with a diagnostic function selection input pin, the diagnostic function selection input pin is connected to the diagnostic function selection output pin of the MCU, and the diagnostic function selection input pin is used to receive a diagnostic function selection signal output by the diagnostic function selection output pin of the MCU;
[0045] The multi-channel high-side driver module is specifically configured to determine a target ECU according to the diagnostic function selection signal, and output a distribution current signal of the target ECU to the MCU.
[0046] In some embodiments, the input pin of each driving channel is connected to an output pin of the MCU via a switching diode, the anode of the switching diode is connected to the MCU, and the cathode of the switching diode is connected to the input pin of each driving channel;
[0047] Specifically, when the output pin of the MCU outputs a high level, the corresponding switching diode is turned on, the input pin of the drive channel receives a high level, and the output pin of the drive channel outputs a drive voltage to distribute power to the ECU normally. When the output pin of the MCU outputs a low level, the corresponding switching diode is not turned on, the input pin of the drive channel receives a low level, and the output pin of the drive channel turns off the output drive voltage.
[0048] In some embodiments, the multi-channel high-side driver module is formed by connecting multiple single-channel HSD chips in parallel, or by connecting multiple multi-channel HSD chips in parallel, or by connecting a multi-channel HSD chip, or by connecting at least one single-channel HSD chip and at least one multi-channel HSD chip in parallel, or by connecting an SPI-controlled high-side driver chip.
[0049] For example, FIG3 shows a power distribution device in a specific embodiment. In the power distribution device of FIG3 , a multi-channel high-side driver module is formed by connecting at least one single-channel HSD chip and at least one multi-channel HSD chip in parallel. The multi-channel high-side driver module includes n HSD chips, respectively named HSD_1 to HSD_n.
[0050] Among them, HSD_1 is a multi-channel HSD chip, HSD_1 includes two drive channels 1 and 2, drive channel 1 inputs IN_1 signal and outputs OUT_1 signal, drive channel 2 inputs IN_2 signal and outputs OUT_2 signal, HSD_1 is provided with an enable pin, a diagnostic function selection input pin and a current detection pin, the enable pin is used to receive the enable signal DEN_1 output by the MCU, for example, when DEN_1 is high, drive channel 1 is enabled, when DEN_1 is low, drive channel 1 is disabled; when the IN_1 signal is high and the drive channel 1 is enabled, the drive channel 1 outputs OUT_1 signal to distribute power to the corresponding ECU, when the IN_1 signal is low and the drive channel 1 is disabled, the drive channel 1 turns off the output OUT_ 1 signal, for example, when DEN_2 is high, driving channel 2 is enabled, and when DEN_2 is low, driving channel 2 is disabled; when the IN_2 signal is high and driving channel 2 is enabled, driving channel 2 to output the OUT_2 signal for the corresponding ECU power distribution, when the IN_2 signal is low and driving channel 2 is disabled, driving channel 2 to turn off the output OUT_2 signal. The diagnostic function selection input pin is used to receive the diagnostic function selection signal SEL_1 output by the MCU, and the current detection pin is used to output the ECU power distribution current signal ADC_1 to the MCU; when SEL_1 is low, ADC_1 outputs the current ADC value corresponding to channel OUT1; when SEL_1 is high, ADC_1 outputs the current ADC value corresponding to channel OUT2;
[0051] Among them, HSD_n is a single-channel HSD chip, HSD_1 includes one drive channel n, drive channel n inputs IN_n signal, and outputs OUT_n signal. HSD_n is provided with an enable pin, a diagnostic function selection input pin and a current detection pin. The enable pin is used to receive the enable signal DEN_n output by the MCU. For example, when DEN_n is high, the drive channel n is enabled, and when DEN_n is low, the drive channel n is not enabled; when the IN_n signal is high and the drive channel n is enabled, the drive channel n outputs the OUT_n signal for the corresponding ECU power distribution, and when the IN_n signal is low and the drive channel n is not enabled, the drive channel n turns off the output OUT_n signal. The diagnostic function selection input pin is used to receive the diagnostic function selection signal SEL_n output by the MCU, and the current detection pin is used to output the ECU power distribution current signal ADC_n to the MCU; when SEL_n is high, ADC_n outputs the channel OUT n corresponding to the current ADC value; when SEL_1 is low, ADC_n output is turned off.
[0052] Specifically, the current ADC value refers to the result of converting the current signal into a digital signal through an analog-to-digital converter (ADC). The ADC value is usually expressed as a current value in digital form and can be used to measure and analyze the current. The size and accuracy of the ADC value depend on the number of bits (bits) of the ADC and the reference voltage. The higher the number of bits, the higher the accuracy of the ADC and the wider the current range that can be represented. The reference voltage determines the unit and range of the ADC value. For example, assuming that the number of bits of an ADC is 10 and the reference voltage is 5V, the current resolution of the ADC is 5V / 2^10=5mV, that is, each ADC unit represents a current of 5 millivolts. If a current signal is 20mA, the corresponding ADC value is 20mA / 5mV=4. Therefore, the current ADC value can be achieved by converting the current signal into a suitable voltage range and using an appropriate ADC.
[0053] Among them, the power distribution device in Figure 3 mainly includes the following working modes: normal power distribution after power-on, low-power power distribution switching during sleep, and power distribution switching after ECU wakes up.
[0054] Please refer to Figure 4. The normal power distribution operation mode after power-on operation includes: when the MCU is powered on and initialized, the IN_1~IN_n pins are pulled high, that is, the OUT output of the HSD chip channel is controlled to supply normal power to the subsequent ECU. At this time, the Efuse chip is controlled by the MCU to not output; the MCU simultaneously controls DEN_1~DEN_n and SEL_1~SEL_n. Through the level changes of SEL_1~SEL_n, ADC_1~ADC_n polls and outputs the voltage ADC value corresponding to the current distributed to the ECU, which is used to monitor the current value of the subsequent ECU_n under normal power supply in real time. If the ECU_n has an overcurrent or a short circuit to GND, the ADC output current value can be used to perform I2T protection and shut down the output.
[0055] Please refer to Figure 5. The sleep-switching low-power distribution working mode includes: when the vehicle is about to enter the sleep state, the MCU switches the power distribution according to the following two conditions: ① The MCU receives the sleep command from the vehicle CAN bus network message; ② The MCU reads the current value output by the HSD chip channel, that is, the ECU_1~ECU_n distribution current, and the distribution current is less than 50mA; when the above two conditions are met, the MCU controls the Efuse chip to enter the low-power mode and output power for a period of time. The MCU controls the HSD chip output to turn off, that is, the HSD chip enters the sleep mode and no longer distributes power to ECU_1~ECU_n. At this time, the Efuse chip completely distributes power to ECU_1~ECU_n in the sleep mode, thereby realizing automatic switching of the power distribution mode.
[0056] Please refer to Figure 6. The working modes of power distribution switching after the ECU wakes up include: since the output current of the Efuse chip is limited in low-power mode, such as the ST VNF1048 has a fixed output current of only 200mA in low-power mode, and the Infineon 2ED2410 can configure the output current size through peripheral circuits in low-power mode; therefore, after hibernation, if the subsequent ECU_1~ECU_n is awakened by the subsequent node, causing the current to return to normal working state, or the ECU_1~ECU_n harness is short-circuited to GND, causing the current to increase sharply, exceeding the current limit of the Efuse chip in low-power mode, the Efuse chip shuts down the output in low-power mode, triggering the diagnostic signal DIAG to generate a level change, waking up the MCU to switch the power distribution mode to the HSD chip for power supply; the HSD chip IN_n and the diagnostic signal DIAG The output of the parallel OR gate control is used to switch the HSD chip output to the ECU power distribution after the Efuse chip wakes up the MCU. The entire mode switching process takes about 30ms, which will cause the power distribution of the subsequent ECU_1 to ECU_n to be interrupted, and it is impossible to maintain the power distribution continuity during the switching process. Therefore, the diagnostic signal DIAG passes through the inversion circuit and forms an OR gate with IN_1 to IN_n. The diagnostic signal DIAG produces a level change to wake up the MCU and can also instantly control the HSD chip to turn on, ensuring the power distribution continuity of ECU_1 to ECU_n after the mode switch.
[0057] Another embodiment of the present application further provides a vehicle, which includes the power distribution device described in the above embodiment.
[0058] While various embodiments of the present application have been described above, the above descriptions are illustrative, non-exhaustive, and not intended to be limiting of the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or technological improvements in the marketplace, or to enable others skilled in the art to understand the embodiments disclosed herein.
Claims
1. A power distribution device, characterized in that: Including MCU, Efuse chip and multi-channel high-side driver module; The input pin of the Efuse chip is connected to the MCU to receive the control signal of the MCU; the output pin of the Efuse chip is connected to multiple ECUs to output the driving voltage to the ECU; The multi-channel high-side driver module includes a plurality of drive channels corresponding one-to-one to the plurality of ECUs; The input pin of each driving channel is connected to the MCU and is used to receive the control signal of the MCU; The output pin of each driving channel is connected to a corresponding ECU for outputting driving voltage to the ECU; The MCU is used to respond to the whole vehicle power-on, control the multiple drive channels to output drive voltage to distribute power to the multiple ECUs, and control the Efuse chip to turn off the output drive voltage; The MCU is also used to respond to the vehicle sleeping state, control the Efuse chip to output the driving voltage to distribute power to the multiple ECUs, and control the multiple driving channels to turn off the output driving voltage.
2. The power distribution device according to claim 1, characterized in that: The output pin of the Efuse chip is connected to each ECU via a power diode, the anode of the power diode is connected to the output pin of the Efuse chip, and the cathode of the diode is connected to the power input pin of the ECU.
3. The power distribution device according to claim 2, characterized in that: The Efuse chip is provided with a diagnostic pin, and the diagnostic pin is used to output a diagnostic signal to the MCU; Wherein: if the current flowing through any ECU is greater than the preset current limit when the Efuse chip performs low-power power distribution for the multiple ECUs, the diagnostic signal is at a low level; otherwise, the diagnostic signal is at a high level; The MCU is also used to control the operation of the Efuse chip and the multi-channel high-side driver module according to the diagnostic signal; Wherein: the MCU responds to the vehicle power-on, controls the multiple drive channels to output drive voltages to distribute power to the multiple ECUs normally, and controls the Efuse chip to turn off the output drive voltage; When the diagnostic signal is at a high level, the MCU responds to the vehicle sleeping state, controls the Efuse chip to output the driving voltage to distribute power to the multiple ECUs, and controls the multiple driving channels to turn off the output driving voltage; When the diagnostic signal is at a low level, the MCU controls the multiple drive channels to output drive voltages to distribute power to the multiple ECUs, and controls the Efuse chip to turn off the output drive voltage.
4. The power distribution device according to claim 3, characterized in that: The power distribution device further comprises an inversion circuit and a switch diode, wherein an input pin of the inversion circuit is connected to the diagnosis pin, an output pin of the inversion circuit is connected to an anode of the switch diode, and a cathode of the switch diode is connected to input pins of the plurality of drive channels; Among them, when the input pin of the drive channel inputs a high level, the output pin of the drive channel outputs a drive voltage to distribute power to the ECU normally. When the input pin of the drive channel inputs a low level, the output pin of the drive channel turns off the output drive voltage.
5. The power distribution device according to claim 1, characterized in that: The multi-channel high-side driver module further includes a current detection pin, which is connected to the MCU and is used to output a distribution current signal of each ECU to the MCU; The MCU is also used to diagnose whether each ECU fails according to the distribution current signal of each ECU. If any ECU fails, a drive channel corresponding to the ECU is controlled to turn off the output drive voltage.
6. The power distribution device according to claim 5, characterized in that: The multi-channel high-side driver module is provided with a diagnostic function selection input pin, and the diagnostic function selection input pin is used to receive a diagnostic function selection signal of the MCU; The multi-channel high-side driver module is specifically used to determine the target ECU according to the diagnostic function selection signal, and output the distribution current signal of the target ECU to the MCU.
7. The power distribution device according to claim 1, characterized in that: The input pin of each driving channel is connected to the MCU via a switching diode, the anode of the switching diode is connected to the MCU, and the cathode of the switching diode is connected to the input pin of each driving channel.
8. The power distribution device according to claim 1, characterized in that: The multi-channel high-side driver module is formed by connecting multiple single-channel HSD chips in parallel, or multiple multi-channel HSD chips in parallel, or one multi-channel HSD chip, or at least one single-channel HSD chip and at least one multi-channel HSD chip in parallel, or an SPI-controlled high-side driver chip.
9. A vehicle, characterized in that: The invention comprises the power distribution device according to any one of claims 1 to 8.
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