Display panel and display device

Abstract

The present application provides a display panel and a display device. The display panel comprises a substrate, a dam, a first metal partition structure, a common layer and a cathode. The side surface of the first metal partition structure close to a hole area is provided with a recessed first undercut structure, so as not only to prevent water vapor from laterally invading a display area via the common layer, but also to avoid electrochemical corrosion due to a conductive path formed by the charged cathode overlapping the first metal partition structure.

Description

Display panel and display device Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Compared to traditional rigid display panels, flexible organic light-emitting diode (OLED) display panels offer advantages such as self-luminescence, wide viewing angles, high contrast, low power consumption, and extremely fast response times. OLED luminescent materials are organic materials that are extremely sensitive to water and oxygen. Flexible OLEDs typically utilize thin film encapsulation (TFE) technology, typically a multilayered inorganic / organic / inorganic film structure. This reduces the water vapor transmission rate (WVTR) to approximately 10-6 g / m2·day, ensuring the proper functioning of the OLED luminescent material.

[0003] At present, the OLED display panel with under-screen camera needs to dig a hole in the panel to place the camera. In order to ensure the packaging performance of the opening area, it is necessary to separate the common layer in this area from the common layer in the display area to prevent water vapor from invading laterally through the common layer. Then, the area is encapsulated by thin film packaging to ensure the packaging performance of the opening area and extend the service life of the product. In the transition area, the common layer is separated at this position by engraving the side of the metal partition structure to form a step difference, forming a discontinuous common layer, and external water vapor cannot invade the display area through the common layer. However, the cathode above the common layer will also be isolated at the metal partition structure. The cathode is a mixed metal layer of Mg / Ag. After being isolated at the metal partition structure, it overlaps with the intermediate metal Al of the metal partition structure to form a circuit conduction. During the reliability test, water vapor and K in the polarizer + When water vapor enters the common layer interface, it simultaneously connects to the disconnected cathode and the intermediate Al metal in the metal partition structure, conducting the entire cathode surface of the display area and transmitting negative voltage, forming an electrochemically corroded cathode. Under the action of electrons, water vapor generates OH⁻ ions, which react with the TFE inorganic film to form K₂SiO₃. This dissolves in the aqueous solution, destroying the TFE encapsulation layer and causing package failure. Once water vapor enters the display area, it reacts with the luminescent material, resulting in black spots / rings, which seriously shorten the product's lifespan.

[0004] Therefore, it is necessary to provide a display panel and a display device to improve this defect. SUMMARY OF THE INVENTION

[0005] The embodiments of the present application provide a display panel and a display device, which can suppress electrochemical corrosion of the conductive circuit between the cathode and the metal partition structure, improve the packaging performance of the display panel, extend the reliability testing time, and increase the product service life.

[0006] An embodiment of the present application provides a display panel, comprising an aperture area, a transition area disposed around the aperture area, and a display area disposed around the transition area. The display panel further comprises:

[0007] substrate;

[0008] a dam, disposed on the substrate and located in the transition zone;

[0009] a first metal partition structure disposed on the substrate, the first metal partition structure being located in the transition region, the first metal partition structure being disposed on a side of the dam away from the opening region, and a first undercut structure being recessed on a side of the first metal partition structure close to the dam;

[0010] a common layer comprising a first common portion and a second common portion, wherein the first common portion extends continuously from the display area to the upper surface of the first metal partition structure facing away from the substrate, and the second common portion extends in a direction away from the opening area, and an end of the second common portion away from the opening area is located within the first undercut structure, and the first common portion and the second common portion are disconnected;

[0011] The cathode includes a first cathode portion and a second cathode portion, wherein the first cathode portion is arranged on the surface of the first common portion, one end of the second cathode portion is arranged in the first undercut structure and on the surface of the second common portion, and the first cathode portion is disconnected from the second cathode portion.

[0012] An embodiment of the present application further provides a display device, including a display panel, wherein the display panel includes an opening area, a transition area disposed around the opening area, and a display area disposed around the transition area, and the display panel further includes:

[0013] substrate;

[0014] a dam, disposed on the substrate and located in the transition zone;

[0015] a first metal partition structure disposed on the substrate, the first metal partition structure being located in the transition region, the first metal partition structure being disposed on a side of the dam away from the opening region, and a first undercut structure being recessed on a side of the first metal partition structure close to the dam;

[0016] a common layer comprising a first common portion and a second common portion, wherein the first common portion extends continuously from the display area to the upper surface of the first metal partition structure facing away from the substrate, and the second common portion extends in a direction away from the opening area, and an end of the second common portion away from the opening area is located within the first undercut structure, and the first common portion and the second common portion are disconnected;

[0017] The cathode includes a first cathode portion and a second cathode portion, wherein the first cathode portion is arranged on the surface of the first common portion, one end of the second cathode portion is arranged in the first undercut structure and on the surface of the second common portion, and the first cathode portion is disconnected from the second cathode portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below only disclose some embodiments. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] FIG1 is a partial plan view of a display panel provided in an embodiment of the present application;

[0020] FIG2 is a cross-sectional view of the first display panel provided by an embodiment of the present application along the AA′ direction shown in FIG1 ;

[0021] FIG3 is an enlarged schematic diagram of the first metal partition structure in FIG2 ;

[0022] FIG4 is an enlarged schematic diagram of the second metal partition structure in FIG2 ;

[0023] FIG5 is a cross-sectional view of a second display panel provided by an embodiment of the present application along the AA′ direction shown in FIG1 ;

[0024] FIG6 is a cross-sectional view of a third display panel provided by an embodiment of the present application along the line AA′ shown in FIG1 ;

[0025] 7a to 7d are schematic flow charts of a method for manufacturing a display panel according to an embodiment of the present application. Modes for Carrying Out the Invention

[0026] The following descriptions of the various embodiments refer to the accompanying figures to illustrate specific embodiments in which the present disclosure may be implemented. Directional terms used in this disclosure, such as "up," "down," "front," "back," "left," "right," "inside," "outside," and "side," refer only to the directions in the accompanying figures. Therefore, these directional terms are intended to illustrate and facilitate understanding of the present disclosure and are not intended to limit the present disclosure. In the figures, similarly structured elements are denoted by the same reference numerals.

[0027] The present disclosure is further described below with reference to the accompanying drawings and specific embodiments:

[0028] The embodiments of the present application provide a display panel that can suppress electrochemical corrosion of the conductive circuit between the cathode and the metal partition structure, improve the packaging performance of the display panel, extend the reliability testing time, and increase the product service life.

[0029] A display panel includes an opening area, a transition area disposed around the opening area, and a display area disposed around the transition area. The display panel further includes:

[0030] substrate;

[0031] a dam, disposed on the substrate and located in the transition zone;

[0032] a first metal partition structure disposed on the substrate, the first metal partition structure being located in the transition region, the first metal partition structure being disposed on a side of the dam away from the opening region, and a first undercut structure being recessed on a side of the first metal partition structure close to the dam;

[0033] a common layer comprising a first common portion and a second common portion, wherein the first common portion extends continuously from the display area to the upper surface of the first metal partition structure facing away from the substrate, and the second common portion extends in a direction away from the opening area, and an end of the second common portion away from the opening area is located within the first undercut structure, and the first common portion and the second common portion are disconnected;

[0034] The cathode includes a first cathode portion and a second cathode portion, wherein the first cathode portion is arranged on the surface of the first common portion, one end of the second cathode portion is arranged in the first undercut structure and on the surface of the second common portion, and the first cathode portion is disconnected from the second cathode portion.

[0035] According to one embodiment of the present application, the display panel also includes a high-voltage DC power signal line and a low-voltage DC power signal line, the first metal partition structure is electrically connected to the high-voltage DC power signal line, and the cathode is electrically connected to the low-voltage DC power signal line.

[0036] According to an embodiment of the present application, the high-voltage DC power signal line is arranged around the first metal partition structure, and the high-voltage DC power signal line is overlapped with the first metal partition structure at multiple locations around the four sides.

[0037] According to an embodiment of the present application, the high-voltage DC power signal wiring is in a grid shape.

[0038] According to an embodiment of the present application, the high-voltage DC power signal line is arranged on the same layer as the first metal partition structure.

[0039] According to an embodiment of the present application, the display panel includes an organic insulating layer, the organic insulating layer at least covers a side surface of the first metal partition structure close to the display area, and the first common portion is partially disposed on a surface of the organic insulating layer.

[0040] According to an embodiment of the present application, the organic insulating layer covers at least a portion of a surface of the first metal partition structure facing away from the substrate.

[0041] According to an embodiment of the present application, the organic insulating layer includes at least one planar layer and a pixel definition layer disposed on the planar layer, and at least one of the planar layer and the pixel definition layer at least covers a side surface of the first metal partition structure close to the display area.

[0042] According to an embodiment of the present application, the display panel includes a first source-drain electrode layer, the organic insulating layer includes a first planar layer, and the first source-drain electrode layer is disposed between the first planar layer and the substrate;

[0043] Wherein, the first metal partition structure is provided in the same layer as the first source-drain electrode layer.

[0044] According to an embodiment of the present application, the display panel includes a first source-drain electrode layer, a first planarization layer, a second source-drain electrode layer, and a second planarization layer stacked on the substrate;

[0045] In which, the first metal partition structure is arranged on the same layer as the second source-drain electrode layer, the edge of the first flat layer close to the opening area is located on the side of the first metal partition structure close to the display area, and at least one of the second flat layer and the pixel definition layer at least covers the side of the first metal partition structure close to the display area.

[0046] According to an embodiment of the present application, the display panel includes a first source-drain electrode layer, a first planar layer, a second source-drain electrode layer, a second planar layer, a third source-drain electrode layer, and a third planar layer stacked on the substrate;

[0047] In which, the first metal partition structure is arranged on the same layer as the third source-drain electrode layer, the edges of the first flat layer and the second flat layer close to the opening area are both located on the side of the first metal partition structure close to the display area, and at least one of the third flat layer and the pixel definition layer at least covers the side of the first metal partition structure close to the display area.

[0048] According to one embodiment of the present application, in a direction perpendicular to the substrate, an edge of the first common portion close to the first undercut structure is farther away from the substrate than an edge of the second common portion close to the first undercut structure, and an edge of the first cathode portion close to the first undercut structure is farther away from the substrate than an edge of the second cathode portion close to the first undercut structure.

[0049] According to one embodiment of the present application, the first metal partition structure includes a first conductive layer, a second conductive layer and a third conductive layer stacked on the substrate, and the end of the second conductive layer close to the opening area is retracted into the first conductive layer and the end of the third conductive layer close to the opening area, and the end of the second conductive layer close to the opening area is enclosed with the end of the first conductive layer and the end of the third conductive layer close to the opening area to form the first undercut structure.

[0050] According to one embodiment of the present application, the second common portion is in contact with the first conductive layer, and one end of the second common portion located in the first undercut structure is disconnected from the second conductive layer. The second cathode portion is in contact with the first conductive layer, and one end of the second cathode portion located in the first undercut structure is disconnected from the second conductive layer.

[0051] According to an embodiment of the present application, the display panel further includes:

[0052] At least one second metal partition structure is disposed on the substrate, wherein the at least one second metal partition structure is located on a side of the dam close to the opening area, and the second metal partition structure is disposed around the opening area;

[0053] wherein, at least one of the side surfaces of the second metal partition structure close to the opening area and the side surfaces close to the dam is recessed with a second undercut structure; the second common portion comprises a first common sub-portion and a second common sub-portion, the first common sub-portion being disconnected from the second common sub-portion, the first common sub-portion being disposed on a surface of the second metal partition structure facing away from the substrate, the second common sub-portion being disposed on opposite sides of the second metal partition structure and being disposed within the first undercut structure and the second undercut structure, the first common sub-portion being disconnected from the second common sub-portion;

[0054] The second cathode portion includes a first cathode sub-portion and a second cathode sub-portion, the first cathode sub-portion and the second cathode sub-portion are disconnected, the first cathode sub-portion is arranged on the surface of the first common sub-portion, the second cathode sub-portion is arranged on the surface of the second common sub-portion, the end of the second cathode sub-portion is arranged in the first undercut structure and the second undercut structure, and the first cathode sub-portion and the second cathode sub-portion are disconnected.

[0055] According to an embodiment of the present application, the second metal partition structure includes a fourth conductive layer, a fifth conductive layer, and a sixth conductive layer stacked on the substrate, an end of the fifth conductive layer close to the opening area is retracted into the fourth conductive layer and an end of the sixth conductive layer close to the opening area, and an end of the fifth conductive layer close to the opening area is enclosed with an end of the fourth conductive layer and an end of the sixth conductive layer close to the opening area to form the second undercut structure;

[0056] And / or, one end of the fifth conductive layer close to the dam is retracted into one end of the fourth conductive layer and the sixth conductive layer close to the dam, and one end of the fifth conductive layer close to the dam is enclosed with one end of the fourth conductive layer and the sixth conductive layer close to the dam to form the second undercut structure.

[0057] According to an embodiment of the present application, the display panel further includes a plurality of bosses, some of the bosses are disposed between the first metal partition structure and the substrate, and another portion of the bosses are disposed between the second metal partition structure and the substrate.

[0058] According to one embodiment of the present application, the display panel further includes an encapsulation layer, which is continuously arranged in the transition area and the display area, and the encapsulation layer covers the common layer, the cathode, the first metal partition structure, the first undercut structure, the second metal partition structure and the second undercut structure.

[0059] According to an embodiment of the present application, the common layer includes a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer that are stacked.

[0060] Beneficial effects of the embodiments of the present application: The embodiments of the present application provide a display panel and a display device, wherein the display panel includes a substrate, a dam, a first metal partition structure, a common layer and a cathode, the first metal partition structure is recessed with a first bottom cut structure on the side near the dam, the common layer includes a first common portion and a second common portion, and the cathode layer includes a first cathode portion and a second cathode portion. The step difference formed by the first bottom cut structure can not only isolate the first common portion and the second common portion, cut off the path for water vapor to invade the display area through the common layer, and prevent water vapor from invading the display area laterally through the common layer, but also isolate the charged first cathode portion from the second cathode portion, and avoid the first cathode portion and the first metal partition structure from overlapping to form a conductive path and causing electrochemical corrosion, thereby improving the packaging performance and increasing the service life of the product.

[0061] As shown in Figures 1 and 2, Figure 1 is a partial plan view of a display panel provided in an embodiment of the present application, and Figure 2 is a cross-sectional view of the first display panel provided in an embodiment of the present application along the A-A' direction shown in Figure 1. The display panel includes an opening area A1, a transition area A2 disposed on the periphery of the opening area A1, and a display area A3 disposed on the periphery of the transition area A2. The opening area A1 is used to place the camera assembly and provide a path for the camera assembly to obtain external light. The transition area A2 serves as a transition area between the opening area A1 and the display area A3 and is used to prevent moisture from the external environment from invading the display area A3 through the opening area A1. The display area A3 is mainly used to realize the function of displaying images on the screen. The opening area A1 and the transition area A2 do not have the function of displaying images.

[0062] The opening area A1 is provided with a light-transmitting hole 11. The light-transmitting hole 11 can penetrate the display panel in the thickness direction of the display panel, or can only penetrate part of the film layer of the display panel, but does not penetrate the display panel. The camera component is correspondingly arranged in the light-transmitting hole 11 or below the light-transmitting hole, and the camera component obtains external light through the light-transmitting hole 11.

[0063] In one embodiment, the size and shape of the light-transmitting hole are the same as the size and shape of the opening area A1. The opening area A1 is circular. The transition area A2 is arranged around the opening area A1. The shape of the transition area A2 can be regarded as a closed ring. The display area A3 is arranged around the transition area A2.

[0064] In some other embodiments, the number of opening areas A1 and light-transmitting holes is not limited to one in the above embodiments, but can also be two or more. The shape of the opening area A1 is not limited to the circle in the above embodiments, but can also be an ellipse, a long strip, a teardrop shape or other unconventional shapes. The shapes of the transition area A2 and the display area A3 can be adapted to the shape of the opening area A1.

[0065] As shown in Figures 1 and 2, the display panel includes a substrate 1, a dam 7 and a first metal partition structure 2. The dam 7 is arranged on the substrate 1, the dam 7 is located in the transition area A2 and is arranged around the opening area A1, the first metal partition structure 2 is arranged on the substrate 1, the first metal partition structure 2 is located in the transition area A2 and is arranged on the side of the dam 7 away from the opening area A1, the first metal partition structure 2 is arranged around the opening area A1, and the shape of the positive projection of the first metal partition structure 2 on the substrate 1 is a closed ring.

[0066] It should be noted that substrate 1 is an array substrate, comprising a base and an inorganic insulating layer, a gate metal layer, an active layer, and a source / drain electrode metal layer disposed thereon. The base is a flexible base, and the base material may be, but is not limited to, polyimide. The first metal partition structure 2 disposed on substrate 1 may refer to the first metal partition structure 2 being disposed on the surface of the base and in direct contact with the surface of the base, or may refer to the first metal partition structure 2 being disposed on the surface of the base and separated from the surface of the base by an inorganic insulating layer or other film layer.

[0067] As shown in Figures 2 and 3, Figure 3 is an enlarged schematic diagram of the first metal partition structure in Figure 2. A first undercut structure 20 is recessed on the side of the first metal partition structure 2 near the opening area A1. The first undercut structure 20 is formed by the middle area of ​​the side of the first metal partition structure 2 near the opening area A1 being recessed into the interior of the first metal partition structure 2. No groove is provided on the side of the first metal partition structure 2 near the display area A3.

[0068] The display panel also includes a common layer 3, which includes a first common portion 31 and a second common portion 32. The first common portion 31 extends continuously from the display area A3 to the upper surface of the first metal partition structure 2 away from the substrate 1, and the second common portion 32 extends in a direction away from the opening area A1, and the end of the second common portion 32 away from the opening area is located in the first bottom cut structure 20. The first common portion 31 and the second common portion 32 are disconnected, and the film layer structure and material of the first common portion 31 and the second common portion 32 are the same.

[0069] The common layer 3 includes but is not limited to a stacked hole injection layer, a hole transport layer, an electron transport layer and an electron injection layer. The display panel also includes a plurality of patterned light-emitting layers 6, which are arranged between the hole transport layer and the electron transport layer. The hole injection layer, the hole transport layer, the electron injection layer and the electron transport layer are all prepared by a whole-surface evaporation process. Since a first undercut structure 20 is formed on the side of the first metal partition structure 2 close to the opening area A1, a step difference is formed between the surface of the first metal partition structure 2 facing away from the substrate 1 and the bottom of the first metal partition structure 2. When the above-mentioned film layers are formed by evaporation, the step difference cannot be filled due to the thin thickness of the common layer 3, thereby forming a first common part 31 and a second common part 32, and the first common part 31 and the second common part 32 are disconnected at the side of the first metal partition structure 2 close to the opening area A1. Under this structure, after external water vapor penetrates into the second common portion 32 through the light-transmitting hole of the opening area A1, the first common portion 31 and the second common portion 32 are disconnected, and the water vapor cannot continue to penetrate the first common portion 31. Therefore, it cannot further penetrate into the display area A3 through the second common portion 32, thereby preventing the water vapor from penetrating into the display area A3 and causing damage to the luminescent material.

[0070] As shown in Figure 3, in the direction perpendicular to the substrate 1, the edge of the first common portion 31 close to the first undercut structure 20 is farther away from the substrate 1 than the edge of the second common portion 32 close to the first undercut structure 20, that is, the edge of the first common portion 31 close to the first undercut structure 20 and the edge of the second common portion 32 close to the first undercut structure 20 are located on horizontal planes at different heights, and the distance between the plane where the edge of the first common portion 31 close to the first undercut structure 20 is located and the substrate 1 is greater than the distance between the plane where the edge of the second common portion 32 close to the first undercut structure 20 is located and the substrate 1.

[0071] As shown in Figures 2 and 3 , the display panel also includes a cathode 4, which includes a first cathode portion 41 and a second cathode portion 42. The first cathode portion 41 is disposed on the surface of the first common portion 31. Both the first cathode portion 41 and the first common portion 31 extend continuously from the display area A3 to the surface of the first metal partition structure 2 facing away from the substrate 1. One end of the second cathode portion 42 is disposed within the first undercut structure 20 and on the surface of the second common portion 32. The first cathode portion 41 and the second cathode portion 42 are disconnected. In this structure, the first cathode portion 41 and the second cathode portion 42 are separated by the first metal partition structure 2, and the first cathode portion 41 is continuously distributed only from the display area A3 to the upper surface of the first metal partition structure 2 facing away from the substrate 1. This can prevent the charged first cathode portion 41 from overlapping with the first metal partition structure 2 to form a conductive path and cause electrochemical corrosion, thereby improving packaging performance and increasing the service life of the product.

[0072] It should be noted that the cathode 4 is also prepared by a full-surface evaporation process. The principle of the disconnection between the first cathode portion 41 and the second cathode portion 42 at the side of the first metal partition structure 2 near the opening area A1 is the same as the principle of the disconnection between the first common portion 31 and the second common portion 32 of the above-mentioned common layer 3 at this location, which will not be repeated here.

[0073] As shown in Figure 3, in the direction perpendicular to the substrate 1, the edge of the first cathode portion 41 close to the first undercut structure 20 is farther away from the substrate 1 than the edge of the second cathode portion 42 close to the first undercut structure 20, that is, the edge of the first cathode portion 41 close to the first undercut structure 20 and the edge of the second cathode portion 42 close to the first undercut structure 20 are located on horizontal planes at different heights, and the distance between the plane where the edge of the first cathode portion 41 close to the first undercut structure 20 is located and the substrate 1 is greater than the distance between the plane where the edge of the second cathode portion 42 close to the first undercut structure 20 is located and the substrate 1.

[0074] In the energized state, the voltage of the first cathode portion 41 is negative, and the voltage of the first metal partition structure 2 is positive. When the second cathode portion 42 is deposited in the first undercut structure 20 and overlaps with the first metal partition structure 2 to form a conductive path, the voltage of the second cathode portion 42 overlapped with the first metal partition structure 2 is also positive because the voltage of the first metal partition structure 2 is positive. + The voltage of the electrolyte environment formed after entering the panel is a positive voltage, and the voltage of the first metal partition structure 2 is also a positive voltage. There is no electrode for electrochemical corrosion. Therefore, the embodiment of the present application can destroy the conditions for electrochemical corrosion and inhibit electrochemical corrosion of the conductive path between the cathode 4 and the first metal partition structure 2, thereby improving the packaging performance and increasing the service life of the product.

[0075] In some embodiments, as shown in FIG1 , the display panel further includes a high-voltage DC power signal line VDD and a low-voltage DC power signal line (not shown). The first metal partition structure 2 is electrically connected to the high-voltage DC power signal line VDD, and the cathode 4 is electrically connected to the low-voltage DC power signal line. The high-voltage DC power signal line VDD transmits a high-voltage DC power signal, which is a constant positive DC voltage signal. The low-voltage DC power signal line transmits a low-voltage DC power signal, which is a constant negative DC voltage signal. In this structure, by electrically connecting the first metal partition structure 2 to the high-voltage DC power signal line VDD, the high-voltage DC power signal line VDD can be used to output a positive voltage to the first metal partition structure 2, thereby disrupting the conditions for electrochemical corrosion and suppressing electrochemical corrosion of the conductive path between the cathode 4 and the first metal partition structure 2.

[0076] In one embodiment, as shown in FIG1 , the first metal partition structure 2 is a closed loop when viewed from above, and the high-voltage DC power signal line VDD is disposed on the periphery of and around the first metal partition structure 2. The high-voltage DC power signal line VDD is overlapped with the first metal partition structure 2 at multiple locations around the periphery. By providing multiple overlap points around the first metal partition structure 2 to overlap the high-voltage DC power signal line VDD with the first metal partition structure 2, the contact area between the DC power signal line VDD and the first metal partition structure 2 can be increased, thereby reducing the impedance between the high-voltage DC power signal line VDD and the first metal partition structure 2.

[0077] In one embodiment, as shown in FIG1 , the high-voltage DC power signal trace VDD is in a grid shape.

[0078] In some embodiments, the display panel includes an organic insulating layer 5 , which at least covers the side surface of the first metal partition structure 2 close to the display area A3 . The first common portion 31 is partially disposed on the surface of the organic insulating layer 5 .

[0079] In one embodiment, as shown in FIG1 , the organic insulating layer 5 covers the side of the first metal partition structure 2 near the display area A3, and the first common portion 31 and the first cathode portion 41 are both continuously laid from the surface of the first metal partition structure 2 facing away from the substrate 1 to the surface of the organic insulating layer 5. The organic insulating layer 5 insulates the first cathode portion 41 from the first metal partition structure 2, and the side of the first metal partition structure 2 near the opening area A1 is not covered by the organic insulating layer. In this way, the organic insulating layer 5 can be used to protect the side of the first metal partition structure 2 near the display area A3, avoiding etching of the side of the first metal partition structure 2 near the display area A3 when etching to form the first undercut structure 20. This allows the first common portion 31 and the first cathode portion 41 to be continuously distributed from the surface of the first metal partition structure 2 facing away from the substrate 1 to the display area A3, avoiding the first common portion 31 and the first cathode portion 41 being disconnected at the side of the first metal partition structure 2 near the display area A3 and overlapping with the first metal partition structure 2.

[0080] In some embodiments, the organic insulating layer 5 not only covers the side surface of the first metal partition structure 2 close to the display area A3 , but also covers at least a portion of the surface of the first metal partition structure 2 facing away from the substrate 1 .

[0081] In one embodiment, as shown in Figure 1, the organic insulating layer 5 covers the portion of the surface of the first metal partition structure 2 facing away from the substrate 1 close to the display area A3 and the side of the first metal partition structure 2 close to the display area A3. By extending the coverage range of the organic insulating layer 5 to the surface of the first metal partition structure 2 facing away from the substrate 1, it can be ensured that the organic insulating layer 5 covers the side of the first metal partition structure 2 close to the display area A3, thereby preventing the side of the first metal partition structure 2 close to the display area A3 from being etched to form a step difference, resulting in the first common portion 31 and the first cathode portion 41 being disconnected at the side of the first metal partition structure 2 close to the display area A3 and overlapping with the first metal partition structure 2.

[0082] In one embodiment, the organic insulating layer 5 not only covers the side surface of the first metal partition structure 2 close to the display area A3 , but also completely covers the surface of the first metal partition structure 2 facing away from the substrate 1 .

[0083] In some embodiments, the organic insulating layer 5 includes at least one planar layer and a pixel definition layer 50 disposed on the planar layer. At least one of the planar layer and the pixel definition layer 50 covers at least the side of the first metal partition structure 2 close to the display area A3.

[0084] In one embodiment, as shown in FIG3 , the organic insulating layer 5 includes a first planar layer 51 and a pixel definition layer 50. The first planar layer 51 is disposed on the substrate 1, and the pixel definition layer 50 is disposed on the surface of the first planar layer 51 facing away from the substrate 1. Both the first planar layer 51 and the pixel definition layer 50 are made of an organic insulating material. The pixel definition layer 50 has a plurality of pixel openings, and the light-emitting layer 6 is disposed within the pixel openings. The first planar layer 51 covers a portion of the side surface of the first metal partition structure 2 near the display area A3, and the pixel definition layer 50 covers a portion of the surface of the first metal partition structure 2 facing away from the substrate 1, and also covers the side surface of the first metal partition structure 2 near the display area A3 that is not covered by the first planar layer 51.

[0085] In one embodiment, the edge of the first planar layer 51 near the opening area A1 is located on the side of the first metal partition structure 2 near the display area A3. That is, the first planar layer 51 does not cover the side of the first metal partition structure 2 near the display area A3, while the pixel definition layer 50 covers the side of the first metal partition structure 2 near the display area A3. Based on this structure, the pixel definition layer 50 can further cover at least a portion of the surface of the first metal partition structure 2 facing away from the substrate 1.

[0086] In one embodiment, the first planarizing layer 51 covers the side of the first metal partition structure 2 near the display area A3. The edge of the pixel definition layer 50 near the opening area A1 is located on the side of the first metal partition structure 2 near the display area A3. In other words, the pixel definition layer 50 does not cover the side of the first metal partition structure 2 near the display area A3. Based on this structure, the first planarizing layer 51 can further cover at least a portion of the surface of the first metal partition structure 2 facing away from the substrate 1.

[0087] In one embodiment, as shown in Figure 3, the display panel also includes a first source-drain electrode layer SD1, the first source-drain electrode layer SD1 is arranged between the first flat layer 51 and the substrate 1, and the first metal partition structure 2 is arranged on the same layer as the first source-drain electrode layer SD1. The film layer structure and material of the first metal partition structure 2 are the same as the film layer structure and material of the first source-drain electrode layer SD1, that is, the first metal partition structure 2 can be prepared synchronously with the process of the first source-drain electrode layer SD1.

[0088] In one embodiment, the high-voltage DC power signal line VDD is arranged on the same layer as the first metal partition structure 2, and the film layer structure and material of the high-voltage DC power signal line VDD are the same as the film layer structure and material of the first metal partition structure 2, that is, the first metal partition structure 2 and the high-voltage DC power signal line VDD can be prepared simultaneously using the process of the first source-drain electrode layer SD1.

[0089] In some other embodiments, the high-voltage DC power signal line VDD is disposed in a different layer from the first metal partition structure 2. For example, the high-voltage DC power signal line VDD can be disposed in a gate metal layer, or when the display panel has multiple source and drain electrode metal layers, the high-voltage DC power signal line VDD and the first metal partition structure 2 can be disposed in the same layer as different source and drain electrode metal layers, respectively. The high-voltage DC power signal line VDD and the first metal partition structure 2 can be electrically connected through a via in the insulating layer.

[0090] In some embodiments, the display panel includes a first source-drain electrode layer SD1, a first flat layer 51, a second source-drain electrode layer SD2, and a second flat layer 52 stacked on a substrate 1. The first metal partition structure 2 and the second source-drain electrode layer SD2 are arranged on the same layer. The edge of the first flat layer 51 close to the opening area A1 is located on the side of the first metal partition structure 2 close to the display area A3. At least one of the second flat layer 52 and the pixel definition layer 50 covers at least the side of the first metal partition structure 2 close to the display area A3.

[0091] In one embodiment, as shown in FIG5 , FIG5 is a cross-sectional view of the second display panel provided by the embodiment of the present application along the A-A' direction shown in FIG1 . Its structure is substantially the same as that of the display panel shown in FIG2 , except that: the organic insulating layer 5 has a first flat layer 51 and a second flat layer 52, the display panel has a first source-drain electrode layer SD1 and a second source-drain electrode layer SD2, the first flat layer 51 covers the first source-drain electrode layer SD1, the second source-drain electrode layer SD2 is disposed on the first flat layer 51, the first metal partition structure 2 is disposed on the same layer as the second source-drain electrode layer SD2, and the first metal partition structure 2 is disposed on the substrate 1. The edge of the first flat layer 51 near the opening area A1 is located on the side of the first metal partition structure 2 near the display area A3, and the second flat layer 52 and the pixel definition layer 50 both cover the side of the first metal partition structure 2 near the display area A3 and the portion of the surface of the first metal partition structure 2 facing away from the substrate 1.

[0092] In one embodiment, the edges of the first flat layer 51 and the second flat layer 52 near the opening area A1 are both located on the side of the first metal partition structure 2 near the display area A3, and the pixel definition layer 50 covers the side of the first metal partition structure 2 near the display area A3 and the portion of the surface of the first metal partition structure 2 facing away from the substrate 1.

[0093] In one embodiment, the edges of the first flat layer 51 and the pixel definition layer 50 near the opening area A1 are both located on the side of the first metal partition structure 2 near the display area A3, and the second flat layer 52 covers the side of the first metal partition structure 2 near the display area A3 and the portion of the surface of the first metal partition structure 2 facing away from the substrate 1.

[0094] In one embodiment, when the display panel has a first source-drain electrode layer SD1 and a second source-drain electrode layer SD2 , the first metal partition structure 2 may also be provided in the same layer as the first source-drain electrode layer SD1 .

[0095] In some embodiments, the display panel includes a first source-drain electrode layer SD1, a first flat layer 51, a second source-drain electrode layer SD2, a second flat layer 52, a third source-drain electrode layer SD3 and a third flat layer 53 stacked on a substrate 1. The first metal partition structure 2 and the third source-drain electrode layer SD3 are arranged on the same layer. The edges of the first flat layer 51 and the second flat layer 52 close to the opening area A1 are both located on the side of the first metal partition structure 2 close to the display area A3. At least one of the third flat layer 53 and the pixel definition layer 50 covers at least the side of the first metal partition structure 2 close to the display area A3.

[0096] In one embodiment, as shown in Figure 6, Figure 6 is a cross-sectional view of the third display panel provided by the embodiment of the present application along the A-A' direction shown in Figure 1, and its structure is roughly the same as the structure of the display panel shown in Figure 2, except that: the organic insulating layer 5 has a first flat layer 51, a second flat layer 52 and a third flat layer 53, the display panel has a first source-drain electrode layer SD1, a second source-drain electrode layer SD2 and a third source-drain electrode layer SD3, the first metal partition structure 2 and the third source-drain electrode layer SD3 are arranged in the same layer, the edges of the first flat layer 51 and the second flat layer 52 close to the opening area A1 are both located on the side of the first metal partition structure 2 close to the display area A3, the third flat layer 53 and the pixel definition layer 50 both cover the side of the first metal partition structure 2 close to the display area A3 and the portion of the surface of the first metal partition structure 2 facing away from the substrate 1.

[0097] In one embodiment, the edges of the first flat layer 51, the second flat layer 52 and the third flat layer 53 near the opening area A1 are all located on the side of the first metal partition structure 2 near the display area A3, and the pixel definition layer 50 covers the side of the first metal partition structure 2 near the display area A3 and the portion of the surface of the first metal partition structure 2 facing away from the substrate 1.

[0098] In some other embodiments, when the display panel has a first source-drain electrode layer SD1, a second source-drain electrode layer SD2 and a third source-drain electrode layer SD3, the first metal partition structure 2 may also be provided in the same layer as the second source-drain electrode layer SD2 or the first source-drain electrode layer SD1.

[0099] In some embodiments, as shown in Figure 3, the first metal partition structure 2 includes a first conductive layer 21, a second conductive layer 22 and a third conductive layer 23 stacked on the substrate 1, the second conductive layer 22 is arranged between the first conductive layer 21 and the third conductive layer 23, and the end of the second conductive layer 22 close to the opening area A1 is retracted into the first conductive layer 21 and the end of the third conductive layer 23 close to the opening area A1.

[0100] One end of the second conductive layer 22 near the opening area A1 and one end of the first conductive layer 21 and the third conductive layer 23 near the opening area A1 are enclosed to form a first undercut structure 20. The first undercut structure 20 can be regarded as a groove formed on the side of the first metal partition structure near the opening area A1, wherein the side of the second conductive layer 22 near the opening area A1 serves as the bottom of the groove of the first undercut structure 20, and the surface of the first conductive layer 21 near the third conductive layer 23 and the surface of the third conductive layer 23 near the first conductive layer 21 can serve as the groove wall of the first undercut structure 20.

[0101] The second common portion 32 is in contact with the first conductive layer 21, and one end of the second common portion 32 located in the first bottom cut structure 20 is disconnected from the second conductive layer 22. The second cathode portion 42 is in contact with the first conductive layer 21, and one end of the second cathode portion 42 located in the first bottom cut structure 20 is disconnected from the second conductive layer 22. In this way, the voltage of the first metal partition structure 2 can be transferred to the second cathode portion 42, so that the voltage of the second cathode portion 42 is positive, thereby destroying the conditions for electrochemical corrosion and inhibiting electrochemical corrosion from occurring in the conductive path between the cathode 4 and the first metal partition structure 2.

[0102] In one embodiment, the second conductive layer 22 is made of a different material from the first conductive layer 21, and the first conductive layer 21 is made of the same material as the third conductive layer 23. The etching rate of the second conductive layer 22 is greater than that of the first conductive layer 21 and the third conductive layer 23. This ensures that when the first metal partition structure 2 is etched, the etching degree of the second conductive layer 22 is greater than that of the first conductive layer 21 and the third conductive layer 23, so as to form the first undercut structure 20.

[0103] In one embodiment, the first conductive layer 21 and the third conductive layer 23 are both made of titanium, and the second conductive layer 22 is made of aluminum.

[0104] In some embodiments, as shown in Figures 1, 2, and 4, Figure 4 is an enlarged schematic diagram of the second metal partition structure in Figure 2. The display panel further includes a dam 7 and at least one second metal partition structure 8. The dam 7 is disposed on the substrate 1. The dam 7 is located on the side of the first metal partition structure 2 near the opening area A1. The dam 7 is disposed around the opening area A1. The dam 7 can be made of the same material as at least one layer of the organic insulating layer 5. For example, the dam 7 can be made of the same material as the pixel definition layer 50. The dam 7 can be prepared simultaneously with the pixel definition layer 50 using the same process. The material of the dam 7 can also be the same as that of the planar layer; alternatively, the dam 7 can include at least two upper and lower portions, one portion of which is made of the same material as the planar layer, and the other portion is made of the same material as the pixel definition layer.

[0105] The second metal partition structure 8 is disposed on the substrate 1 . At least one second metal partition structure 8 is located on a side of the dam 7 close to the opening area A1 . The second metal partition structure 8 is disposed around the opening area A1 .

[0106] At least one of the side surfaces of the second metal partition structure 8 close to the opening area A1 and the side surfaces close to the dam 7 is recessed with a second undercut structure 80. The second common portion 32 includes a first common sub-portion 321 and a second common sub-portion 322. The first common sub-portion 321 is arranged on the surface of the second metal partition structure 8 facing away from the substrate 1, and the second common sub-portion 322 is arranged on opposite sides of the second metal partition structure 8 and is placed in the first undercut structure 20 and the second undercut structure 80. The first common sub-portion 321 is disconnected from the second common sub-portion 322.

[0107] As shown in Figure 4, in the direction perpendicular to the substrate 1, the edge of the first common sub-portion 321 close to the second undercut structure 80 is farther away from the substrate 1 than the edge of the second common sub-portion 322 close to the second undercut structure 80, that is, the edge of the first common sub-portion 321 close to the second undercut structure 80 and the edge of the second common sub-portion 322 close to the second undercut structure 80 are located on horizontal planes at different heights, and the distance between the plane where the edge of the first common sub-portion 321 close to the second undercut structure 80 is located and the substrate 1 is greater than the distance between the plane where the edge of the second common sub-portion 322 close to the second undercut structure 80 is located and the substrate 1.

[0108] The second cathode portion 42 includes a first cathode sub-portion 421 and a second cathode sub-portion 422. The first cathode sub-portion 421 and the second cathode sub-portion 422 are disconnected from each other. The first cathode sub-portion 421 is arranged on the surface of the first common sub-portion 321, and the second cathode sub-portion 422 is arranged on the surface of the second common sub-portion 322 and in the first undercut structure 20 and / or the second undercut structure 80.

[0109] As shown in Figure 4, in the direction perpendicular to the substrate 1, the edge of the first cathode sub-portion 421 close to the second undercut structure 80 is farther away from the substrate 1 than the edge of the second cathode sub-portion 422 close to the second undercut structure 80, that is, the edge of the first cathode sub-portion 421 close to the second undercut structure 80 and the edge of the second cathode sub-portion 422 close to the second undercut structure 80 are located on horizontal planes at different heights, and the distance between the plane where the edge of the first cathode sub-portion 421 close to the second undercut structure 80 is located and the substrate 1 is greater than the distance between the plane where the edge of the second cathode sub-portion 422 close to the second undercut structure 80 is located and the substrate 1.

[0110] It should be noted that the principle of the first common sub-section 321 and the second common sub-section 322 being disconnected at the second bottom cut structure 80 and the principle of the first cathode sub-section 421 and the second cathode sub-section 422 being disconnected at the second bottom cut structure 80 are the same as the principle of the first common section 31 and the second common section 32 of the common layer 3 being disconnected at this point as described above, and will not be repeated here.

[0111] As shown in Figures 1 and 2, the shapes of the positive projections of the dam 7 and the second metal partition structure 8 on the substrate 1 are both closed rings, so that the second metal partition structure 8 can be used to isolate the common layer 3 and cathode 4 of the display area A3 from the common layer 3 and cathode 4 of the transition area A2.

[0112] In some embodiments, as shown in FIG2 , the display panel has multiple second metal partition structures 8 , which can be two, three, or four or more. The multiple second metal partition structures 8 are spaced apart on one side of the dam 7 near the opening area A1. In this structure, by adding multiple second metal partition structures 8 in the transition area A2 , the common layer 3 and the cathode 4 can be separated into multiple disconnected portions, further reducing the risk of water vapor invading the display area A3 through the common layer 3 .

[0113] It should be noted that the number of the second metal partition structures 8 shown in FIG2 does not represent the number of the second metal partition structures 8 in actual applications. The number of the second metal partition structures 8 can be set according to demand and is not limited here.

[0114] In some embodiments, the display panel has multiple second metal partition structures 8, at least one second metal partition structure 8 is arranged on the side of the dam 7 close to the opening area A1, and at least one second metal partition structure 8 is arranged between the dam 7 and the first metal partition structure 2.

[0115] In one embodiment, a second metal partition structure 8 is provided on one side of the dam 7 close to the opening area A1 and between the dam 7 and the first metal partition structure 2 .

[0116] In one embodiment, six second metal partition structures 8 are provided on the side of the dam 7 close to the opening area A1, and two second metal partition structures 8 are provided between the dam 7 and the first metal partition structure 2. In actual applications, the number of second metal partition structures 8 on the side of the dam 7 close to the opening area A1 and between the dam 7 and the first metal partition structure 2 can be set as needed and is not limited here.

[0117] In some embodiments, as shown in Figure 4, the second metal partition structure 8 includes a fourth conductive layer 81, a fifth conductive layer 82 and a sixth conductive layer 83 stacked on the substrate 1, and the end of the fifth conductive layer 82 close to the opening area A1 is retracted into the end of the fourth conductive layer 81 and the sixth conductive layer 83 close to the opening area A1, and the end of the fifth conductive layer 82 close to the opening area A1 is surrounded by the end of the fourth conductive layer 81 and the sixth conductive layer 83 close to the opening area A1 to form a second undercut structure 80, and the end of the fifth conductive layer 82 close to the dam 7 is retracted into the end of the fourth conductive layer 81 and the sixth conductive layer 83 close to the dam 7, and the end of the fifth conductive layer 82 close to the dam 7 is surrounded by the end of the fourth conductive layer 81 and the sixth conductive layer 83 close to the dam 7 to form a second undercut structure 80.

[0118] In one embodiment, the fourth conductive layer 81 and the sixth conductive layer 83 are both made of titanium, and the fifth conductive layer 82 is made of aluminum.

[0119] In one embodiment, the first metal partition structure 2 and the second metal partition structure 8 are arranged on the same layer, and the film layer structure and material of the first metal partition structure 2 are the same as the film layer structure and material of the second metal partition structure 8, that is, the first metal partition structure 2 and the second metal partition structure 8 can be prepared simultaneously using the same process.

[0120] In one embodiment, the display panel further includes a plurality of bosses 9, some of which are disposed between the first metal partition structure 2 and the substrate 1, and others of which are disposed between the second metal partition structure 8 and the substrate 1. The bosses 9 may be etched from an inorganic insulating layer such as a buffer layer, a gate insulating layer, and an interlayer dielectric layer. By adding bosses 9 to the bottom of the first metal partition structure 2 and the second metal partition structure 8, the step difference between the first metal partition structure 2 and the second metal partition structure 8 can be increased, which facilitates disconnection of the common layer 3 and the cathode 4 at the first metal partition structure 2 and the second metal partition structure 8.

[0121] In some embodiments, the display panel further includes an encapsulation layer 10, which is continuously disposed in the transition area A2 and the display area A3, and the encapsulation layer covers the common layer 3, the cathode 4, the first metal partition structure 2, the first undercut structure 20, the second metal partition structure 8 and the second undercut structure 80.

[0122] In one embodiment, the encapsulation layer 10 is a thin film encapsulation structure, and the encapsulation layer 10 includes a first inorganic encapsulation layer 101, an organic encapsulation layer 103 and a second inorganic encapsulation layer 102. The organic encapsulation layer 103 is sandwiched between the first inorganic encapsulation layer 101 and the second inorganic encapsulation layer 102. The organic encapsulation layer 102 is blocked by the dam 7 on the side of the dam 7 close to the display area A3. The first inorganic encapsulation layer 101 and the second inorganic encapsulation layer 102 are continuously distributed from the display area A3 to the junction of the transition area A2 and the opening area A1.

[0123] Based on the display panel provided in the above-mentioned embodiment of the present application, the embodiment of the present application further provides a method for manufacturing the display panel. With reference to FIG. 7 a to FIG. 7 d , FIG. 7 a to FIG. 7 d are schematic flow charts of the method for manufacturing the display panel provided in the embodiment of the present application. This application only takes the first display panel shown in FIG. 2 as an example. The method for manufacturing the display panel includes:

[0124] Step S1 : forming a first metal partition structure 2 on a substrate 1 .

[0125] As shown in Figure 7a, step S1 specifically includes: forming a metal layer on a substrate 1; etching the metal layer using a dry etching process to form a first metal partition structure 2 and multiple second metal partition structures 8, with the second metal partition structures 8 being located on the side of the first metal partition structure 2 near the opening area A1. The metal layer can be a source / drain electrode metal layer. When the display panel has multiple source / drain electrode metal layers, the metal layer can be any one of the source / drain electrode metal layers.

[0126] Step S2 : forming an organic insulating layer 5 on the first metal partition structure 2 .

[0127] As shown in Figure 7b, step S1 specifically includes: depositing an organic insulating material on substrate 1; etching the organic insulating material through an etching process to form an organic insulating layer 5 and a dam 7, with the dam 7 located between the first metal partition structure 2 and the second metal partition structure 8. The organic insulating layer 5 covers the side of the first metal partition structure 2 near the display area A3 and the portion of the surface of the first metal partition structure 2 facing away from the substrate 1.

[0128] Step S3: performing side engraving processing on the first metal partition structure 2 and the second metal partition structure 8 to form a first undercut structure and a second undercut structure.

[0129] As shown in Figures 3, 4 and 7b, in step S3, the first metal partition structure 2 and the second metal partition structure 8 can be side-etched by a wet etching process. The side of the first metal partition structure 2 close to the opening area A1 is not covered by the organic insulating layer 5, so a first undercut structure is formed on the side of the first metal partition structure 2 close to the opening area A1, and a second undercut structure is formed on the side of the second metal partition structure close to the opening area A1 and the side close to the dam 7.

[0130] Step S4 : forming a common layer 3 and a cathode 4 on the substrate 1 .

[0131] As shown in Figure 7c, since there are step differences on the sides of the first metal partition structure 2 and the second metal partition structure 8, the common layer 3 and the cathode 4 will be disconnected on the side of the first metal partition structure 2 close to the opening area A1 and the side of the second metal partition structure 8 close to the opening area A1 and the side close to the dam 7, forming a discontinuous film layer.

[0132] Step S5: forming a packaging layer 10 on the substrate 1 .

[0133] As shown in FIG7 d , the encapsulation layer 10 is continuously disposed in the transition area A2 and the display area A3 , and covers the common layer 3 , the cathode 4 , the first metal partition structure 2 , the first undercut structure, the second metal partition structure 8 and the second undercut structure.

[0134] The encapsulation layer 10 is a thin film encapsulation structure, comprising a first inorganic encapsulation layer 101, an organic encapsulation layer 103, and a second inorganic encapsulation layer 102. The organic encapsulation layer 103 is sandwiched between the first and second inorganic encapsulation layers 101, 102. The organic encapsulation layer 102 is blocked by the dam 7 on the side of the dam 7 closest to the display area A3. The first and second inorganic encapsulation layers 101, 102 are both continuously distributed from the display area A3 to the junction of the transition area A2 and the aperture area A1. The first and second inorganic encapsulation layers 101, 102 can be deposited by plasma-enhanced chemical vapor deposition, while the organic encapsulation layer can be deposited by inkjet printing.

[0135] It should be noted that this embodiment only takes the first type of display panel shown in FIG. 2 as an example. The manufacturing methods of the display panels described in other embodiments are substantially the same as the above method and are not described in detail here.

[0136] Based on the display panels provided in the above embodiments of the present application, embodiments of the present application further provide a display device, comprising a camera assembly and a display panel provided in any of the above embodiments, wherein the camera assembly is disposed correspondingly to the opening area of ​​the display panel. The display device includes, but is not limited to, display devices such as smartphones, smartwatches, desktop computers, laptop computers, and televisions.

[0137] Beneficial effects of the embodiments of the present application: The embodiments of the present application provide a display panel and a display device, which display panel includes a substrate, a first metal partition structure, a common layer and a cathode, the first metal partition structure is provided with a first bottom cut structure on the side near the opening area, the common layer includes a first common part and a second common part, and the cathode layer includes a first cathode part and a second cathode part. The step difference formed by the first bottom cut structure can not only separate the first common part and the second common part, cut off the path for water vapor to invade the display area through the common layer, and prevent water vapor from invading the display area laterally through the common layer, but also separate the charged first cathode part from the uncharged second cathode part near the opening area, avoiding the charged first cathode part and the first metal partition structure from overlapping to form a conductive path and causing electrochemical corrosion, thereby improving the packaging performance and increasing the service life of the product.

[0138] In summary, although the present application is disclosed above with preferred embodiments, the above preferred embodiments are not intended to limit the present application. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application is based on the scope defined by the claims.

Claims

1. A display panel, comprising an opening area, a transition area arranged at the periphery of the opening area, and a display area arranged at the periphery of the transition area, wherein the display panel further comprises: include: substrate; a dam disposed on the substrate and located in the transition zone; A first metal partition structure is disposed on the substrate, the first metal partition structure is located in the transition area, the first metal partition structure is disposed on a side of the dam away from the opening area, and a first undercut structure is concavely provided on a side of the first metal partition structure close to the dam; A common layer, comprising a first common portion and a second common portion, wherein the first common portion continuously extends from the display area to an upper surface of the first metal partition structure away from the substrate, the second common portion extends in a direction away from the opening area, and an end of the second common portion away from the opening area is located in the first undercut structure, and the first common portion is disconnected from the second common portion; The cathode includes a first cathode portion and a second cathode portion, wherein the first cathode portion is arranged on the surface of the first common portion, one end of the second cathode portion is arranged in the first undercut structure and on the surface of the second common portion, and the first cathode portion is disconnected from the second cathode portion.

2. The display panel according to claim 1, in, The display panel also includes a high-voltage DC power signal line and a low-voltage DC power signal line, the first metal partition structure is electrically connected to the high-voltage DC power signal line, and the cathode is electrically connected to the low-voltage DC power signal line.

3. The display panel according to claim 2, in, The high-voltage direct current power signal routing is arranged around the first metal partition structure, and the high-voltage direct current power signal routing is overlapped with the first metal partition structure at multiple locations around the periphery.

4. The display panel according to claim 3, in, The high-voltage direct current power signal wiring is in a grid shape.

5. The display panel according to claim 2, in, The high-voltage direct current power signal wiring is arranged on the same layer as the first metal partition structure.

6. The display panel according to claim 1, in, The display panel includes an organic insulating layer 5 , which at least covers the side surface of the first metal partition structure close to the display area, and the first common portion is partially arranged on the surface of the organic insulating layer.

7. The display panel according to claim 6, in, The organic insulating layer covers at least a portion of a surface of the first metal partition structure facing away from the substrate.

8. The display panel according to claim 6, in, The organic insulating layer includes at least one planar layer and a pixel definition layer disposed on the planar layer, and at least one of the planar layer and the pixel definition layer at least covers a side surface of the first metal partition structure close to the display area.

9. The display panel according to claim 8, in, The display panel includes a first source-drain electrode layer, the organic insulating layer includes a first planar layer, and the first source-drain electrode layer is arranged between the first planar layer and the substrate; Wherein, the first metal partition structure is arranged in the same layer as the first source-drain electrode layer.

10. The display panel according to claim 8, in, The display panel includes a first source-drain electrode layer, a first planar layer, a second source-drain electrode layer and a second planar layer stacked on the substrate; Among them, the first metal partition structure is arranged on the same layer as the second source-drain electrode layer, the edge of the first flat layer close to the opening area is located on the side of the first metal partition structure close to the display area, and at least one of the second flat layer and the pixel definition layer at least covers the side of the first metal partition structure close to the display area.

11. The display panel according to claim 8, in, The display panel includes a first source-drain electrode layer, a first planar layer, a second source-drain electrode layer, a second planar layer, a third source-drain electrode layer and a third planar layer stacked on the substrate; Among them, the first metal partition structure is arranged on the same layer as the third source-drain electrode layer, the edges of the first flat layer and the second flat layer close to the opening area are both located on the side of the first metal partition structure close to the display area, and at least one of the third flat layer and the pixel definition layer at least covers the side of the first metal partition structure close to the display area.

12. The display panel according to claim 1, in, In a direction perpendicular to the substrate, an edge of the first common portion close to the first undercut structure is farther away from the substrate than an edge of the second common portion close to the first undercut structure, and an edge of the first cathode portion close to the first undercut structure is farther away from the substrate than an edge of the second cathode portion close to the first undercut structure.

13. The display panel according to claim 1, in, The first metal partition structure includes a first conductive layer, a second conductive layer and a third conductive layer stacked on the substrate, an end of the second conductive layer close to the opening area is retracted into an end of the first conductive layer and the third conductive layer close to the opening area, and an end of the second conductive layer close to the opening area is enclosed with an end of the first conductive layer and the third conductive layer close to the opening area to form the first undercut structure.

14. The display panel according to claim 13, in, The second common portion is in contact with the first conductive layer, and one end of the second common portion located in the first undercut structure is disconnected from the second conductive layer. The second cathode portion is in contact with the first conductive layer, and one end of the second cathode portion located in the first undercut structure is disconnected from the second conductive layer.

15. The display panel according to claim 1, in, The display panel further includes: At least one second metal partition structure is disposed on the substrate, at least one second metal partition structure is located on a side of the dam close to the opening area, and the second metal partition structure is disposed around the opening area; Wherein, at least one of the side surfaces of the second metal partition structure close to the opening area and the side surfaces close to the dam is recessed with a second undercut structure, the second common portion comprises a first common sub-portion and a second common sub-portion, the first common sub-portion is arranged on the surface of the second metal partition structure away from the substrate, the second common sub-portion is arranged on opposite sides of the second metal partition structure and is placed in the first undercut structure and the second undercut structure, and the first common sub-portion is disconnected from the second common sub-portion; The second cathode portion includes a first cathode sub-portion and a second cathode sub-portion, the first cathode sub-portion is arranged on the surface of the first common sub-portion, the second cathode sub-portion is arranged on the surface of the second common sub-portion, the end of the second cathode sub-portion is arranged in the first undercut structure and the second undercut structure, and the first cathode sub-portion is disconnected from the second cathode sub-portion.

16. The display panel according to claim 15, in, The second metal partition structure comprises a fourth conductive layer, a fifth conductive layer and a sixth conductive layer stacked on the substrate, an end of the fifth conductive layer close to the opening area is retracted inside the fourth conductive layer and an end of the sixth conductive layer close to the opening area, and an end of the fifth conductive layer close to the opening area is surrounded by the fourth conductive layer and an end of the sixth conductive layer close to the opening area to form the second undercut structure; And / or, one end of the fifth conductive layer close to the dam is retracted into one end of the fourth conductive layer and the sixth conductive layer close to the dam, and one end of the fifth conductive layer close to the dam is enclosed with one end of the fourth conductive layer and the sixth conductive layer close to the dam to form the second undercut structure.

17. The display panel according to claim 15, in, The display panel further includes a plurality of bosses, some of which are disposed between the first metal partition structure and the substrate, and other parts of which are disposed between the second metal partition structure and the substrate.

18. The display panel according to claim 15, in, The display panel also includes an encapsulation layer, which is continuously arranged in the transition area and the display area, and covers the common layer, the cathode, the first metal partition structure, the first undercut structure, the second metal partition structure and the second undercut structure.

19. The display panel according to claim 1, in, The common layer includes a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer that are stacked.

20. A display device, comprising a display panel, the display panel comprising an opening area, a transition area arranged at the periphery of the opening area, and a display area arranged at the periphery of the transition area, the display panel further comprising: include: substrate; a dam disposed on the substrate and located in the transition zone; A first metal partition structure is disposed on the substrate, the first metal partition structure is located in the transition area, the first metal partition structure is disposed on a side of the dam away from the opening area, and a first undercut structure is concavely provided on a side of the first metal partition structure close to the dam; A common layer, comprising a first common portion and a second common portion, wherein the first common portion continuously extends from the display area to an upper surface of the first metal partition structure away from the substrate, the second common portion extends in a direction away from the opening area, and an end of the second common portion away from the opening area is located in the first undercut structure, and the first common portion is disconnected from the second common portion; The cathode includes a first cathode portion and a second cathode portion, wherein the first cathode portion is arranged on the surface of the first common portion, one end of the second cathode portion is arranged in the first undercut structure and on the surface of the second common portion, and the first cathode portion is disconnected from the second cathode portion.

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