Ultraviolet curing method and system, and manicure apparatus and additive printing apparatus

Abstract

Disclosed in the present invention are an ultraviolet curing method and system, and a manicure apparatus and an additive printing apparatus. The method comprises: acquiring morphological information of a region to be irradiated of an object to be irradiated that is within the irradiation range of an ultraviolet projection system; on the basis of the morphological information, calculating the distance between each block in the region to be irradiated and the ultraviolet projection system; on the basis of the region to be irradiated, generating an irradiation pattern matching the region to be irradiated; on the basis of the irradiation pattern, the ultraviolet projection system forming an illumination region matching the irradiation pattern; and on the basis of the morphological information and the distance between each block in the region to be irradiated and the ultraviolet projection system, adjusting the light-emission intensity of a light-emitting point at each position in the ultraviolet projection system. In the ultraviolet curing method and system and the manicure apparatus provided in the present invention, by means of acquiring, in real time, morphological information of an object to be irradiated, and generating, on the basis of the information, an irradiation pattern matching a region to be irradiated, the precise irradiation for an ultraviolet irradiation region on a surface to be cured is realized.

Description

UV curing method, system, nail art device and additive printing device

[0001] This invention claims priority to Chinese patent application No. 202311532036.X, filed with the Patent Office of China on November 17, 2023, entitled “UV curing method, system, nail art device and additive printing device”. The entire contents of this application are incorporated herein by reference. Technical Field

[0002] The present invention relates to the field of light curing technology, and in particular to an ultraviolet light curing method, system, nail art device and additive printing device. Background Art

[0003] UV curing, a widely used curing method in industrial production, has attracted widespread attention and adoption due to its fast curing speed and excellent curing results. This technology primarily utilizes ultraviolet light emitted by UV lamps to rapidly cure materials and is widely used in nail art, printing, coating, plastic molding, and other fields.

[0004] In traditional UV curing, UV lamps typically directly irradiate the material to achieve curing. However, this curing method has certain problems. Because the UV light emitted by the UV lamp has a certain degree of diffusion, the UV light can also irradiate undesired areas. This can cause the material to be over-cured or under-cured in some areas, affecting product performance and quality.

[0005] Therefore, in response to the above technical problems, it is necessary to provide a new UV curing method, system, nail art device and additive printing device.

[0006] Summary of the Invention

[0007] The object of the present invention is to provide a UV curing method, system, nail art device and additive printing device, which can concentrate UV light on the irradiated area that needs to be photocured.

[0008] To achieve the above objectives, the present invention provides the following technical solutions:

[0009] In a first aspect, the present invention provides a UV curing method, comprising:

[0010] Real-time acquisition of morphological information of the area to be irradiated of the object to be irradiated within the irradiation range of the ultraviolet micro-pixel light-emitting array projection system;

[0011] Based on the morphological information, calculating the distance between each block in the area to be irradiated and the ultraviolet micro-pixel light emitting array projection system;

[0012] Based on the area to be irradiated, generating an irradiation pattern matching the area to be irradiated;

[0013] Based on the illumination pattern, the ultraviolet micro-pixel light emitting array projection system forms an illumination area matching the illumination pattern to illuminate the area to be illuminated;

[0014] Based on the morphological information and the distance from each block in the area to be irradiated to the ultraviolet micro-pixel light-emitting array projection system, the luminous intensity of the light-emitting points at each position in the ultraviolet micro-pixel light-emitting array projection system is adjusted so that the difference in light intensity received by each block in the area to be irradiated is within a preset range.

[0015] In one or more embodiments, real-time acquisition of morphological information of an area to be irradiated of an object to be irradiated within an irradiation range of an ultraviolet micro-pixel light emitting array projection system includes:

[0016] Based on the image acquisition module and / or the 3D information acquisition module, the contour, posture, depth and / or angle information of the area to be irradiated of the object to be irradiated within the irradiation range of the ultraviolet micro-pixel light-emitting array projection system is obtained in real time.

[0017] In one or more embodiments, calculating the distance from each block in the area to be irradiated to the ultraviolet micro-pixel light emitting array projection system based on the morphological information includes:

[0018] Based on the morphological information, mapping the area to be irradiated and the ultraviolet micro-pixel light emitting array projection system to the same spatial coordinate system;

[0019] Based on the spatial coordinates of each block in the area to be irradiated and the ultraviolet micro-pixel light emitting array projection system, the distance from each block in the area to be irradiated to the ultraviolet micro-pixel light emitting array projection system is calculated.

[0020] In one or more embodiments, adjusting the luminous intensity of the luminous points at various positions in the ultraviolet micro-pixel luminous array projection system based on the morphological information and the distance between each block in the area to be irradiated and the ultraviolet micro-pixel luminous array projection system includes:

[0021] When the shape of a block in the area to be irradiated or the distance from a block to the ultraviolet micro-pixel light-emitting array projection system changes, one or more light-emitting points and their light-emitting intensities corresponding to the block in the ultraviolet micro-pixel light-emitting array projection system are re-matched.

[0022] In one or more embodiments, the method further comprises:

[0023] Calculating the matching degree between the illuminated area and the area to be illuminated;

[0024] If the matching degree is lower than a preset threshold, adjusting the illumination pattern based on a positional deviation between the illumination area and the area to be illuminated;

[0025] Based on the adjusted illumination pattern, the illumination area formed by the ultraviolet micro-pixel light emitting array projection system is updated so that the updated illumination area matches the area to be illuminated.

[0026] In one or more embodiments, calculating the degree of matching between the illuminated area and the area to be illuminated includes:

[0027] Acquiring an image including the illuminated area and the area to be illuminated;

[0028] Based on the degree of overlap between the illuminated area and the area to be illuminated in the image, a degree of matching between the illuminated area and the area to be illuminated is calculated.

[0029] In one or more embodiments, the method further comprises:

[0030] Predicting the position of the area to be irradiated at a next moment based on the moving speed of the area to be irradiated;

[0031] Based on the predicted position, the light-emitting point position of the ultraviolet micro-pixel light-emitting array projection system is adjusted so that the irradiation position of the illumination area corresponds to the predicted position.

[0032] In one or more embodiments, the method further comprises:

[0033] The ultraviolet micro-pixel light emitting array projection system is subjected to dithering adjustment so that the difference in cumulative irradiation dose between any two points in each block of the area to be irradiated is less than a preset value.

[0034] In one or more embodiments, the method further comprises:

[0035] Real-time statistics of the radiation dose received by each block in the area to be irradiated;

[0036] When the cumulative radiation dose received by a certain block in the area to be irradiated reaches a preset dose, the light-emitting point corresponding to the block is turned off.

[0037] In one or more embodiments, the method further comprises:

[0038] Based on the radiation dose received by each block;

[0039] Different values ​​or display colors are assigned to blocks that have reached the preset dose and blocks that have not reached the preset dose.

[0040] In a second aspect, the present invention provides a UV curing system comprising:

[0041] An acquisition module is used to acquire, in real time, morphological information of an area to be irradiated of an object to be irradiated within the irradiation range of the ultraviolet micro-pixel light-emitting array projection system;

[0042] a calculation module, configured to identify the area to be irradiated and calculate, based on the morphological information, the distance between each block in the area to be irradiated and the ultraviolet micro-pixel light emitting array projection system;

[0043] A generating module, configured to generate an illumination pattern matching the area to be irradiated based on the area to be irradiated;

[0044] an illumination module, configured to enable the ultraviolet micro-pixel light emitting array projection system to form an illumination area matching the illumination pattern based on the illumination pattern, so as to illuminate the area to be illuminated;

[0045] An adjustment module is used to adjust the luminous intensity of each light-emitting point in the ultraviolet micro-pixel light-emitting array projection system based on the morphological information and the distance between each block in the area to be irradiated and the ultraviolet micro-pixel light-emitting array projection system, so that the difference in light intensity received by each block in the area to be irradiated is within a preset range.

[0046] In one or more embodiments, the ultraviolet micro-pixel light-emitting array projection system includes an ultraviolet micro-pixel light-emitting array and an optical projection system, the ultraviolet micro-pixel light-emitting array includes a driving chip and an ultraviolet micro-pixel light-emitting device arranged on the driving chip, and the ultraviolet micro-pixel light-emitting device is electrically connected to the driving chip.

[0047] In one or more embodiments, the optical projection system includes a jitter adjustment component and a lens component for focusing the ultraviolet light emitted by the ultraviolet micro-pixel light-emitting array, and the jitter adjustment component can drive the lens component to deflect the optical axis of the lens component.

[0048] In one or more embodiments, the ultraviolet micro-pixel light-emitting array includes a jitter adjustment component, a substrate, and a plurality of ultraviolet micro-pixel light-emitting devices arranged on the substrate. The jitter adjustment component is used to drive the ultraviolet micro-pixel light-emitting array so that the ultraviolet micro-pixel light-emitting array jitters in a direction parallel to the substrate.

[0049] In a third aspect, the present invention provides a nail art device comprising the aforementioned UV curing system, and the nail art device can be used to implement the aforementioned UV curing method.

[0050] In a fourth aspect, the present invention provides an additive printing device, which includes the UV curing system as described above, and the nail art device can be used to implement the UV curing method as described above.

[0051] Compared with the prior art, the UV curing method, system, nail art device and additive printing device provided by the present invention obtain the morphological information of the object to be irradiated in real time, and generate an irradiation pattern matching the area to be irradiated based on this information, thereby achieving precise irradiation of the UV irradiation area of ​​the surface to be cured; and by adjusting the luminous intensity of the luminous points at various positions in the UV micro-pixel light-emitting array projection system, it is ensured that the difference in light intensity received by each block in the area to be irradiated is within a preset range, thereby achieving uniform irradiation and avoiding the problem of local over-curing or under-curing. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] FIG1 is a flow chart of a UV curing method according to one embodiment of the present invention;

[0053] FIG2 is a block diagram of a UV curing system according to an embodiment of the present invention. DETAILED DESCRIPTION

[0054] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0055] Unless expressly stated otherwise, throughout the specification and claims, the term “comprise” or variations such as “include” or “comprising” will be understood to include the stated elements or components but not to exclude other elements or components.

[0056] In existing UV curing technology, due to the diffusion of UV light, direct irradiation from UV lamps can cause the light to simultaneously irradiate areas that are not intended to be irradiated, which may cause local over-curing or under-curing of the material, thereby affecting the performance and quality of the final product.

[0057] To solve the aforementioned problems, the core implementation idea of ​​the present invention is to obtain the morphological information of the object to be irradiated in real time, and based on this information, generate an irradiation pattern that matches the area to be irradiated, thereby achieving precise control of the ultraviolet light irradiation area. By adjusting the luminous intensity of the light-emitting points at various positions in the ultraviolet micro-pixel light-emitting array projection system, it is ensured that the difference in light intensity received by each block in the area to be irradiated is within a preset range, thereby achieving uniform irradiation and avoiding the problem of local over-curing or under-curing. In addition, this method can be adjusted and optimized in real time to adapt to changes in the morphology of the object to be irradiated, ensuring the stability and reliability of the curing effect.

[0058] Please refer to Figure 1, which is a flow chart of a UV curing method according to one embodiment of the present invention. The UV curing method specifically comprises the following steps:

[0059] S101: Acquire in real time the morphological information of the area to be irradiated of the object to be irradiated within the irradiation range of the ultraviolet micro-pixel light emitting array projection system.

[0060] It is understood that in order to accurately illuminate the irradiated area of ​​the object, it is necessary to first understand the morphological characteristics of the object to be irradiated, so as to generate a matching irradiation pattern and adjust the luminous intensity. Because the object to be irradiated may change during the curing process, such as moving, rotating, and deforming, its morphological information must be acquired in real time to ensure the curing effect and quality.

[0061] Specifically, based on the image acquisition module and / or the 3D information acquisition module, the contour, posture, depth and / or angle information of the irradiated area of ​​the object to be irradiated within the irradiation range of the ultraviolet micro-pixel light emitting array projection system can be obtained in real time.

[0062] It should be noted that a high-resolution camera or other image sensor can be used to capture a two-dimensional image of the object to be illuminated in real time, and image processing algorithms can be used to extract the object's contour and posture information. For example, techniques such as edge detection and contour extraction can be used to obtain the object's contour; techniques such as feature point matching and posture estimation can be used to obtain the object's posture.

[0063] Laser scanning, stereo vision, depth cameras, and other technologies can also be used to obtain real-time three-dimensional morphological information of the object being illuminated, thereby obtaining the object's depth and angle information. For example, laser scanning can accurately measure the depth of an object's surface by the difference in laser round-trip time; stereo vision can calculate the parallax of two images at different angles to calculate the depth of an object and the contours or angles of each surface; or structured light can be used to illuminate the surface of an object and obtain the surface contour and morphology by identifying and calculating the deformation of the structured light on the object's surface.

[0064] In step S101, one or more devices capable of capturing the surface features of the object to be irradiated, such as a camera, a laser scanner, an infrared sensor, etc., can be used to observe and measure the object to be irradiated in real time, and obtain information such as its surface contour (i.e., edge line), posture (i.e., position and direction), depth (i.e., distance) and angle (i.e., inclination) to facilitate subsequent calculation and control.

[0065] By acquiring real-time morphological information about the object being irradiated, dynamic tracking and adaptation to the object can be achieved, ensuring that UV light consistently and accurately targets the areas requiring curing, minimizing the impact on undesired areas. Furthermore, acquiring morphological information about the object being irradiated provides the necessary data and basis for subsequent calculations and control, improving curing efficiency and accuracy.

[0066] In a specific nail art example, let's assume the object to be illuminated is a fingernail, coated with a layer of nail glue that needs to be cured. To cure the nail glue, ultraviolet light is used. The image acquisition module captures the contours and posture of the nail glue. The 3D information acquisition module then measures the depth and angle of each point on the nail glue surface from the UV micro-pixel array projection system.

[0067] In another specific example of additive printing, assuming that the object to be irradiated is a model to be 3D printed, it is identified based on the layer-by-layer slice data of the 3D model. In order to achieve layer-by-layer solidification of the 3D printed model, ultraviolet light needs to be used for irradiation. The image acquisition module can be used to synchronously capture and identify the state change information such as the layer-by-layer contour, position, and distance of the printed model according to the progress of 3D printing. The 3D information acquisition module also measures the depth and angle information of each point on the surface of the layer-by-layer printed model to the ultraviolet micro-pixel light-emitting array projection system to dynamically adjust the lighting area and brightness of the ultraviolet micro-pixel light-emitting array.

[0068] S102: Calculating the distance between each block in the area to be irradiated and the ultraviolet micro-pixel light emitting array projection system based on the morphological information.

[0069] It is understood that to achieve uniform illumination of the area to be illuminated, the luminous intensity of the corresponding light points needs to be adjusted based on the distance between each block of the illuminated area and the ultraviolet micro-pixel light array projection system, so that each block receives similar light intensity. Because the distances from different blocks to the ultraviolet micro-pixel light array projection system may vary, it is necessary to calculate these distances first to facilitate subsequent adjustments.

[0070] Based on the morphological information of the object to be irradiated obtained in step S101, such as outline, posture, depth, and angle, the area to be irradiated can be divided into several small blocks, such as pixels or grids. The area to be irradiated and the ultraviolet micro-pixel light array projection system are both represented in a unified spatial coordinate system, such as a Cartesian coordinate system or a polar coordinate system. The distance from the center point or other representative point of each block to the ultraviolet micro-pixel light array projection system is then calculated to facilitate subsequent illumination intensity control.

[0071] Specifically, based on the morphological information, the area to be irradiated and the ultraviolet micro-pixel light-emitting array projection system can be mapped to the same spatial coordinate system; and based on the spatial coordinates of each block in the area to be irradiated and the ultraviolet micro-pixel light-emitting array projection system, the distance from each block in the area to be irradiated to the ultraviolet micro-pixel light-emitting array projection system can be calculated.

[0072] For example, in the aforementioned nail art example, the area where the nail art glue layer is located can be divided into several small blocks. The area where the nail art glue layer is located and the ultraviolet micro-pixel light array projection system are both mapped to the same spatial coordinate system, and the distance from each block to the light plane of the ultraviolet micro-pixel light array projection system is calculated. The distance from each block to the ultraviolet micro-pixel light array projection system can be calculated using the following formula:

[0073] Among them, d is the distance from each block to the ultraviolet micro-pixel light-emitting array projection system, x, y, and z are the spatial coordinates of the center point or other representative point of each block, and x0, y0, and z0 are the spatial coordinates of the light-emitting point corresponding to the center point or other representative point of the block in the ultraviolet micro-pixel light-emitting array projection system.

[0074] S103: Based on the area to be irradiated, generating an irradiation pattern matching the area to be irradiated.

[0075] In step S103, the image acquisition module and / or the 3D information acquisition module transmit the acquired information to the processor. Based on this information, the processor calculates the area where the nail glue layer is located and generates an illumination pattern that matches it. Based on this illumination pattern, the processor controls the illumination and illumination intensity of the light points at various locations in the UV micro-pixel light-emitting array projection system, ensuring that the UV light only illuminates the area where the nail glue layer is located and that the light intensity received by each block is similar.

[0076] If the nail glue layer moves or rotates during the curing process, the image acquisition module and 3D information acquisition module can capture these changes and transmit the new shape information to the controller. Based on this new shape information, the processor recalculates the area where the nail glue layer is located and updates the irradiation pattern.

[0077] Specifically, the illumination pattern can be generated through digital image processing, computer graphics, and deep learning models.

[0078] For example, digital image processing technology can be used to convert the morphological information of the area to be irradiated into a binary image, in which the area to be irradiated is white and the area not to be irradiated is black. Edge detection algorithms, such as Canny and Sobel, can then be used to extract the edge information of the area to be irradiated and generate an irradiation pattern. Geometric modeling technology in computer graphics can also be used to create a three-dimensional model based on the morphological information of the area to be irradiated. The three-dimensional model can be converted into a pixel image, i.e., an irradiation pattern, through a rasterization process. Deep learning (such as a convolutional neural network (CNN)) can also be used to train the model so that it learns to generate irradiation based on the input morphological information of the area to be irradiated. The morphological information of the area to be irradiated is input into the trained model to obtain an irradiation pattern.

[0079] S104: Based on the illumination pattern, the ultraviolet micro-pixel light emitting array projection system forms an illumination area matching the illumination pattern to illuminate the area to be illuminated.

[0080] In step S104, based on the illumination pattern generated in step S103 that matches the area to be illuminated, the system controls the illumination of the light points at various locations within the UV micro-pixel array projection system. This allows the UV micro-pixel array projection system to create an illumination area that matches the illumination pattern, thereby projecting UV light onto the area to be illuminated. If the position or posture of the object to be illuminated changes, the system adjusts the light array in real time to ensure that the illumination area always matches the illumination pattern.

[0081] S105: Based on the morphological information and the distance between each block in the area to be irradiated and the ultraviolet micro-pixel light-emitting array projection system, adjust the luminous intensity of the light-emitting points at each position in the ultraviolet micro-pixel light-emitting array projection system so that the difference in light intensity received by each block in the area to be irradiated is within a preset range.

[0082] It is understood that in order to achieve uniform illumination of the irradiated area of ​​the object to be irradiated, it is necessary to adjust the luminous intensity of the luminous points at the corresponding positions based on the shape of each block and the distance from the ultraviolet micro-pixel light-emitting array projection system, so that the light intensity received by each block is similar or within an acceptable range. Because different blocks may have different shapes or distances from the ultraviolet micro-pixel light-emitting array projection system, it is necessary to adjust the light intensity based on the shape of each block and the distance from the ultraviolet micro-pixel light-emitting array projection system.

[0083] For example, a two-dimensional array that matches the layout of the light-emitting points of the light-emitting array can be set in the ultraviolet micro-pixel light-emitting array projection system. The grayscale value or color value corresponding to each grid point in the received illumination pattern is stored in the two-dimensional array to represent its luminous intensity. Then, each position in the two-dimensional array is traversed, and according to the stored grayscale value or color value, the light-emitting point at the corresponding position is controlled to emit light and the luminous intensity. If the grayscale value or color value is 0 or black, it means that the position does not need to emit light; if the grayscale value or color value is 255 or white, it means that the position needs to emit light with maximum intensity; if the grayscale value or color value is between 0 and 255, it means that the position needs to emit light with a corresponding intensity.

[0084] Specifically, when the shape of a block in the area to be irradiated or the distance from a block to the ultraviolet micro-pixel light-emitting array projection system changes, one or more light-emitting points and their light-emitting intensities corresponding to the block in the ultraviolet micro-pixel light-emitting array projection system are re-matched.

[0085] The image acquisition module and / or 3D information acquisition module can monitor in real time whether the shape and distance of each block in the area to be illuminated have changed, such as movement, rotation, deformation, etc. If so, the luminous intensity of one or more light-emitting points corresponding to the changed block is recalculated and adjusted to ensure that the light intensity received by the changed block remains within a preset range. By re-matching the one or more light-emitting points and their luminous intensity corresponding to the changed block in the ultraviolet micro-pixel light-emitting array projection system, dynamic adaptation and uniform illumination of the area to be illuminated can be achieved.

[0086] In an example of adjusting the luminous intensity based on distance changes, a two-dimensional array that matches the layout of the luminous points of the luminous array can be set in the ultraviolet micro-pixel luminous array projection system. The distance of each block to the ultraviolet micro-pixel luminous array projection system and the expected light intensity received by each block are stored in the two-dimensional array. The light intensity can be set according to the curing requirements of the object to be irradiated or other factors, such as curing time, curing depth, curing uniformity, etc. Each position is traversed in the two-dimensional array, and the luminous intensity of the light point at the corresponding position is calculated and adjusted according to its stored distance and light intensity. The luminous intensity can be calculated and adjusted according to the following formula:

[0087] Where I is the luminous intensity of the light point, E is the desired light intensity received by the block, and d is the distance between the block and the UV micro-pixel light array projection system. By re-matching the light point or points and their luminous intensity corresponding to the moved block in the UV micro-pixel light array projection system, the light intensity received by the block at the changed distance can be kept within the preset range, thus achieving uniform illumination.

[0088] In an exemplary embodiment, the UV curing method in this embodiment further includes: calculating the matching degree between the illumination area and the area to be irradiated; if the matching degree is lower than a preset threshold, adjusting the illumination pattern based on the position deviation between the illumination area and the area to be irradiated; based on the adjusted illumination pattern, updating the illumination area formed by the UV micro-pixel light-emitting array projection system so that the updated illumination area matches the area to be irradiated.

[0089] The degree of match between the illumination area formed by the ultraviolet micro-pixel light-emitting array projection system and the to-be-illuminated area of ​​the object to be illuminated can be calculated. If the degree of match falls below a preset threshold (pre-set standard), the illumination of the luminous points at various positions in the illumination pattern can be adjusted based on the positional deviation between the two, so that the illumination pattern more closely matches the shape and position of the to-be-illuminated area. Then, based on the adjusted illumination pattern, the illumination area formed by the ultraviolet micro-pixel light-emitting array projection system is updated to more closely match the to-be-illuminated area.

[0090] In a specific example, a grid of the same size and resolution as the ultraviolet micro-pixel light array projection system can be created on a two-dimensional plane or a two-dimensional curved surface. The outlines of the two-dimensional illuminated area and the area to be illuminated are marked on the grid, and the degree of overlap between the two is calculated. Based on the overlap, the degree of match between the two-dimensional illuminated area and the area to be illuminated can be calculated. The higher the overlap, the closer the match between the illuminated area and the area to be illuminated; the lower the overlap, the less match there is.

[0091] If the matching degree is lower than a preset threshold, the illumination pattern needs to be adjusted based on the positional deviation between the illuminated area and the area to be illuminated. For example, the illumination pattern can be adjusted based on the positional deviation between the illuminated area and the area to be illuminated using the following method:

[0092] In the UV micro-pixel array projection system, a two-dimensional array of uniform size and resolution is set up. The two-dimensional array stores the presence or absence of a light point at each location, representing the illumination pattern and forming an illuminated area. Each location in the two-dimensional array is traversed, and the illuminated area is transformed by translation, rotation, scaling, and other transformations based on the positional deviation between the illuminated area and the area to be illuminated, so that the illuminated area more closely matches the shape and position of the area to be illuminated.

[0093] Image processing techniques, such as edge detection, contour extraction, and image segmentation, can be used to calculate the degree of overlap. The contours of the illuminated area and the area to be illuminated are extracted from the image containing the illuminated area and the area to be illuminated, and the degree of overlap between the two is calculated, such as the overlapping area, overlap ratio, and overlap center. Machine vision techniques, such as target detection, target tracking, and target recognition, can also be used to identify the position and shape of the illuminated area and the area to be illuminated from the image containing the illuminated area and the area to be illuminated, and calculate the degree of overlap between the two, such as Euclidean distance, cosine similarity, and Hamming distance. Sensor technologies, such as infrared sensors, laser sensors, and ultrasonic sensors, can also be used to collect the distance and angle information between the illuminated area and the area to be illuminated from the image containing the illuminated area and the area to be illuminated, and calculate the degree of overlap between the two, such as the offset, rotation angle, and degree of deformation.

[0094] In an exemplary embodiment, the ultraviolet light curing method in this embodiment also includes: predicting the position of the area to be irradiated at the next moment based on the moving speed of the area to be irradiated; and adjusting the light-emitting point position of the ultraviolet micro-pixel light-emitting array projection system based on the predicted position so that the irradiation position of the irradiated area corresponds to the predicted position.

[0095] Based on the movement speed of the illuminated area of ​​the object, such as translational speed or rotational speed, kinematic formulas can be applied to predict the position of the illuminated area at the next moment. Based on this predicted position, the illumination of the light points at various locations in the UV micro-pixel array projection system is adjusted, so that the illuminated area formed by the UV micro-pixel array projection system can promptly follow and correspond to the movement of the illuminated area. The time interval at the next moment is the interval between image refresh frames.

[0096] In a specific example, sensors or other measuring devices, such as accelerometers, gyroscopes, encoders, etc., can be used to measure the movement speed of the area to be irradiated, such as translation speed, rotation speed, etc., in real time, and the measurement results can be transmitted to a controller or other computing device, such as a PLC, MCU, PC, etc. The movement speed (rate and direction) of each partition can be determined based on the position changes of the object to be irradiated and the area to be irradiated in the structure of multiple adjacent image acquisitions, combined with the frame rate of the image acquisition device. One or more algorithms, such as Kalman filtering, Bayesian reasoning, neural networks, etc., can be used to predict the position of the area to be irradiated at the next moment based on the aforementioned measurement results and the initial position of the object to be irradiated and the area to be irradiated in the previous frame, and the prediction results are transmitted to the ultraviolet micro-pixel light-emitting array projection system. A two-dimensional array matching the light-emitting points can be set in the ultraviolet micro-pixel light-emitting array projection system, and based on the prediction results, the light-emitting of each light-emitting point is adjusted so that the illumination area formed by the ultraviolet micro-pixel light-emitting array projection system can timely follow the movement of the area to be irradiated.

[0097] In an exemplary embodiment, the ultraviolet light curing method in this embodiment also includes: performing dithering adjustment on the ultraviolet micro-pixel light emitting array projection system so that the difference in the cumulative irradiation dose between any two points in each block of the area to be irradiated is less than a preset value.

[0098] It is understandable that due to the gaps between the light-emitting points of the ultraviolet micro-pixel light-emitting array projection system, the light intensity at the position corresponding to the gap in the illumination area is insufficient. If the position corresponding to the gap in the illumination area always irradiates the same position in the area to be irradiated, it may cause the cumulative radiation dose received at this position to be insufficient, thereby affecting the curing effect, such as producing a rasterized surface unevenness or introducing interlayer defects, and then causing internal defects in the printed product.

[0099] To this end, the ultraviolet micro-pixel light-emitting array projection system can be jitter-adjusted (small random or regular movements or rotations) so that the illuminated area produces a small offset or rotation on the two-dimensional plane, so that the position of the corresponding gap in the illuminated area will not always illuminate the same position of the area to be irradiated, but will vary within a small range, so that each position of the object to be irradiated can receive sufficient ultraviolet light.

[0100] In a specific example, a dither parameter may be set in the ultraviolet micro-pixel light emitting array projection system, such as a dither amplitude (preferably higher than half the gap width), a dither frequency (preferably higher than twice the illumination pattern update frequency), a dither direction, etc. (preferably two intersecting directions in a plane perpendicular to the optical axis direction, with the direction selection being combined with the arrangement of the ultraviolet micro-pixels), to control the movement or rotation of the ultraviolet micro-pixel light emitting array projection system. A timer or other triggering device, such as a sensor, a switch, etc., may be set in the ultraviolet micro-pixel light emitting array projection system to control the dithering time or condition of the ultraviolet micro-pixel light emitting array projection system. When the timer or other triggering device is started, the ultraviolet micro-pixel light emitting array projection system is moved or rotated slightly randomly or regularly according to the dither parameter, so that the illuminated area is slightly offset or rotated on the two-dimensional plane, so that the position corresponding to the gap in the illuminated area does not always illuminate the same position of the area to be irradiated, but varies within a small range.

[0101] In an exemplary embodiment, in order to avoid over-curing or under-curing of each block in the area to be irradiated, the ultraviolet light curing method in this embodiment also includes: real-time statistics of the irradiation dose received by each block in the area to be irradiated; when the cumulative irradiation dose received by a block in the area to be irradiated reaches a preset dose, turning off the light-emitting point corresponding to the block.

[0102] In order to achieve accurate irradiation of the area to be irradiated of the object to be irradiated, the irradiation dose received by each block can be counted in real time, and the corresponding light-emitting points can be turned off according to the irradiation dose. Since different blocks may require different curing conditions, such as curing time, curing depth, curing uniformity, etc., it is necessary to set them according to the curing requirements of each block or other factors, such as material properties, ambient temperature, mechanical stress, etc. By counting and turning off the light-emitting points in real time, it is possible to avoid redundant or unnecessary irradiation of blocks that have been cured or do not need to be cured, thereby improving the curing effect and quality. At the same time, it also improves the utilization rate of ultraviolet light. The ultraviolet micro-pixels corresponding to the non-target irradiation areas do not need to be lit, which reduces the overall power consumption and thus extends the overall service life of the ultraviolet micro-pixel array.

[0103] The intensity and duration of the UV light received by each block in the irradiated area of ​​the object to be irradiated can be measured and recorded in real time by sensors or other measuring equipment, thereby calculating the irradiation dose received by each block, such as energy density and exposure time. When the irradiation dose received by a block reaches the preset dose, it indicates that the block has been cured and no longer needs to receive UV light. Therefore, the light point in the UV micro-pixel light-emitting array projection system corresponding to the block is turned off to stop irradiating the block.

[0104] In a specific example, a two-dimensional array corresponding to the light-emitting point array can be set in the ultraviolet micro-pixel light-emitting array projection system, and according to the irradiation dose received by the block corresponding to each light-emitting point, the corresponding irradiation dose is stored in each position of the two-dimensional array to represent the irradiation dose distribution. A preset dose, such as energy density, exposure time, etc., is set in the ultraviolet micro-pixel light-emitting array projection system to control the curing conditions of each block. Each position in the two-dimensional array is traversed, and according to the stored irradiation dose and the preset dose, it is determined whether the light-emitting point corresponding to the corresponding position needs to be turned off. If the irradiation dose of a certain position reaches or exceeds the preset dose, the light-emitting point corresponding to the position is turned off to stop irradiating the block corresponding to the position; if the irradiation dose of a certain position is lower than the preset dose, the light-emitting point corresponding to the position is kept unchanged to continue irradiating the block corresponding to the position.

[0105] In an exemplary embodiment, the UV curing method of this embodiment further includes: based on the statistical analysis of the irradiation dose received by each block, assigning different numerical values ​​or display colors to blocks that have reached a preset dose and blocks that have not. The numerical values ​​or display colors can be used to distinguish between blocks that have reached and have not reached the preset dose, allowing the user to adjust the posture of the object to be irradiated according to the irradiation situation and avoid the situation where some blocks cannot be irradiated.

[0106] Referring to Figure 2, based on the same inventive concept as the aforementioned UV curing method, an embodiment of the present invention provides a UV curing system 200, which includes an acquisition module 201, a calculation module 202, a generation module 203, an illumination module 204 and an adjustment module 205.

[0107] The acquisition module 201 is used to acquire in real time the morphological information of the area to be irradiated of the object to be irradiated within the irradiation range of the ultraviolet micro-pixel light-emitting array projection system. The calculation module 202 is used to calculate the distance from each block in the area to be irradiated to the ultraviolet micro-pixel light-emitting array projection system based on the morphological information. The generation module 203 is used to generate an illumination pattern matching the area to be irradiated based on the area to be irradiated. The illumination module 204 is used to enable the ultraviolet micro-pixel light-emitting array projection system to form an illumination area matching the illumination pattern based on the illumination pattern to illuminate the area to be irradiated. The adjustment module 205 is used to adjust the luminous intensity of each luminous point in the ultraviolet micro-pixel light-emitting array projection system based on the morphological information and the distance from each block in the area to be irradiated to the ultraviolet micro-pixel light-emitting array projection system, so that the difference in the illumination intensity received by each block in the area to be irradiated is within a preset range.

[0108] Specifically, the acquisition module 201 can acquire in real time the contour, posture, depth and / or angle information of the irradiated area of ​​the object to be irradiated within the irradiation range of the ultraviolet micro-pixel light emitting array projection system based on the image acquisition module and / or the 3D information acquisition module.

[0109] The calculation module 202 can be used to identify the area to be irradiated and, based on the morphological information, map the area to be irradiated and the ultraviolet micro-pixel light-emitting array projection system to the same spatial coordinate system; and based on the spatial coordinates of each block in the area to be irradiated and the ultraviolet micro-pixel light-emitting array projection system, calculate the distance from each block in the area to be irradiated to the ultraviolet micro-pixel light-emitting array projection system.

[0110] The adjustment module 205 can re-match one or more light-emitting points and their light-emitting intensities corresponding to a block in the ultraviolet micro-pixel light-emitting array projection system when the shape of a block in the area to be irradiated or the distance from the block to the ultraviolet micro-pixel light-emitting array projection system changes.

[0111] In an exemplary embodiment, an ultraviolet micro-pixel light-emitting array projection system includes an ultraviolet micro-pixel light-emitting array and an optical projection system. The ultraviolet micro-pixel light-emitting array includes a driver chip and ultraviolet micro-pixel light-emitting devices disposed on the driver chip, wherein the ultraviolet micro-pixel light-emitting devices are electrically connected to the driver chip.

[0112] It should be noted that the ultraviolet micro-pixel light-emitting array can be a two-dimensional array composed of many tiny ultraviolet light-emitting devices (which can be self-luminous devices based on organic light-emitting diodes (OLEDs), inorganic light-emitting diodes (LEDs), or other materials). Each light-emitting device can be individually controlled to emit light and its light intensity, thereby forming an illuminated image. The optical projection system can be a system composed of components such as lenses, reflectors, and polarizers, which can magnify the image on the ultraviolet micro-pixel light-emitting array and project it onto a receiving screen or other surface.

[0113] Specifically, the optical projection system includes a jitter adjustment component and a lens component for focusing the ultraviolet light emitted by the ultraviolet micro-pixel light-emitting array. The jitter adjustment component can drive the lens component to deflect the optical axis of the lens component.

[0114] In a specific example, the adjustment component can be a mechanical or electronic device capable of controlling the position and angle of the lens assembly. For example, it can be a dither adjustment component based on a piezoelectric ceramic actuator. This component comprises a piezoelectric ceramic actuator and a bracket. The piezoelectric ceramic actuator can produce slight deformation under the action of voltage, thereby causing the lens assembly fixed to the bracket to perform slight translation or rotation, thereby deflecting the optical axis of the lens assembly. This component can perform dither adjustment on the lens assembly based on preset parameters or real-time feedback signals to cause the illuminated area to vibrate.

[0115] In another specific example, a UV micro-pixel light-emitting array includes a dither adjustment component, a substrate, and a plurality of UV micro-pixel light-emitting devices disposed on the substrate. The dither adjustment component can be used to drive the UV micro-pixel light-emitting array to dither the UV micro-pixel light-emitting array in a direction parallel to the substrate. A black matrix (BM) can also be disposed between the plurality of UV micro-pixel light-emitting devices to further improve the collimation of light emitted by the UV micro-pixel light-emitting devices.

[0116] The lens assembly can be an optical element capable of adjusting the focus of ultraviolet light, such as a liquid crystal lens-based lens assembly. This assembly consists of a liquid crystal lens and a polarizer. The liquid crystal lens is a variable-focus lens that uses the alignment of liquid crystal molecules to change its refractive index, while the polarizer is an optical element that can control the polarization direction of light. When ultraviolet light emitted by the ultraviolet micro-pixel array becomes polarized light after passing through the polarizer, the liquid crystal lens changes the polarization direction of the light in response to voltage, thereby changing the degree of focus of the light. The assembly can apply different voltages to the liquid crystal lens based on preset parameters or real-time feedback signals to focus the ultraviolet light to a desired position.

[0117] In an exemplary embodiment, the UV curing system 200 also includes an update module 206, which can be used to calculate the matching degree between the illumination area and the area to be irradiated; when the matching degree is lower than a preset threshold, the illumination pattern can be adjusted based on the position deviation between the illumination area and the area to be irradiated; and based on the adjusted illumination pattern, the illumination area formed by the UV micro-pixel light emitting array projection system is updated so that the updated illumination area matches the area to be irradiated.

[0118] In an exemplary embodiment, the UV curing system 200 also includes a prediction module 207, which can predict the position of the area to be irradiated at the next moment based on the moving speed of the area to be irradiated; and based on the predicted position, adjust the light-emitting point position of the UV micro-pixel light-emitting array projection system so that the irradiation position of the irradiated area corresponds to the predicted position.

[0119] In an exemplary embodiment, the UV curing system 200 further includes a dithering module 208, which is used to perform dithering adjustment on the UV micro-pixel light emitting array projection system so that the difference in the cumulative irradiation dose between any two points in each block of the area to be irradiated is less than a preset value.

[0120] In an exemplary embodiment, the UV curing system 200 further includes a statistical module 209, which can be used to count in real time the irradiation dose received by each block in the area to be irradiated; and when the cumulative irradiation dose received by a block in the area to be irradiated reaches a preset dose, the light-emitting point corresponding to the block is turned off.

[0121] In one embodiment of the present invention, a nail art device is provided. The nail art device is a device that can use ultraviolet light to cure nail art materials. The device includes an ultraviolet curing system that can implement the aforementioned ultraviolet curing method. The nail art device can be used to implement the aforementioned ultraviolet curing method.

[0122] In one embodiment of the present invention, an additive printing device is provided. The additive printing device is a device that can use ultraviolet light to cure additive printing materials. The device includes an ultraviolet curing system that can implement the aforementioned ultraviolet curing method. The nail art device can be used to implement the aforementioned ultraviolet curing method.

[0123] The foregoing descriptions of specific exemplary embodiments of the present invention are for purposes of illustration and description. These descriptions are not intended to limit the invention to the precise forms disclosed, and it is apparent that many modifications and variations are possible in light of the foregoing teachings. The exemplary embodiments have been selected and described for the purpose of explaining the specific principles of the invention and their practical application, thereby enabling those skilled in the art to make and utilize a variety of exemplary embodiments of the invention and various options and variations. The scope of the invention is intended to be defined by the claims and their equivalents.

Claims

1. A UV curing method, characterized in that: include: Acquire in real time the morphological information of the area to be irradiated of the object to be irradiated within the irradiation range of the ultraviolet micro-pixel light-emitting array projection system; Based on the morphological information, calculating the distance between each block in the area to be irradiated and the ultraviolet micro-pixel light emitting array projection system; Based on the area to be irradiated, generating an irradiation pattern matching the area to be irradiated; Based on the illumination pattern, the ultraviolet micro-pixel light emitting array projection system forms an illumination area matching the illumination pattern to illuminate the area to be illuminated; Based on the morphological information and the distance from each block in the area to be irradiated to the ultraviolet micro-pixel light-emitting array projection system, the luminous intensity of the light-emitting points at each position in the ultraviolet micro-pixel light-emitting array projection system is adjusted so that the difference in light intensity received by each block in the area to be irradiated is within a preset range.

2. The UV curing method according to claim 1, characterized in that: Real-time acquisition of morphological information of the area to be irradiated of the object to be irradiated within the irradiation range of the ultraviolet micro-pixel light-emitting array projection system, including: Based on the image acquisition module and / or the 3D information acquisition module, the contour, posture, depth and / or angle information of the irradiated area of ​​the object to be irradiated within the irradiation range of the ultraviolet micro-pixel light-emitting array projection system is acquired in real time.

3. The UV curing method according to claim 1, characterized in that: Based on the morphological information, calculating the distance between each block in the area to be irradiated and the ultraviolet micro-pixel light emitting array projection system includes: Based on the morphological information, mapping the area to be irradiated and the ultraviolet micro-pixel light emitting array projection system to the same spatial coordinate system; Based on the spatial coordinates of each block in the area to be irradiated and the ultraviolet micro-pixel light emitting array projection system, the distance from each block in the area to be irradiated to the ultraviolet micro-pixel light emitting array projection system is calculated.

4. The UV curing method according to claim 1, characterized in that: Based on the morphological information and the distances from each block in the area to be irradiated to the ultraviolet micro-pixel light-emitting array projection system, adjusting the light intensity of the light-emitting points at each position in the ultraviolet micro-pixel light-emitting array projection system includes: When the shape of a block in the area to be irradiated or the distance from a block to the ultraviolet micro-pixel light-emitting array projection system changes, one or more light-emitting points and their light-emitting intensities corresponding to the block in the ultraviolet micro-pixel light-emitting array projection system are re-matched.

5. The UV curing method according to claim 1, characterized in that: The method further comprises: Calculating the matching degree between the illumination area and the area to be illuminated; If the matching degree is lower than a preset threshold, adjusting the illumination pattern based on a position deviation between the illumination area and the area to be illuminated; Based on the adjusted illumination pattern, the illumination area formed by the ultraviolet micro-pixel light emitting array projection system is updated so that the updated illumination area matches the area to be illuminated.

6. The UV curing method according to claim 5, characterized in that: Calculating the matching degree between the illuminated area and the area to be illuminated includes: Acquire an image including the illumination area and the area to be illuminated; Based on the degree of overlap between the illuminated area and the area to be illuminated in the image, the degree of match between the illuminated area and the area to be illuminated is calculated.

7. The UV curing method according to claim 1, characterized in that: The method further comprises: Based on the moving speed of the area to be irradiated, predicting the position of the area to be irradiated at the next moment; Based on the predicted position, the light-emitting point position of the ultraviolet micro-pixel light-emitting array projection system is adjusted so that the irradiation position of the illumination area corresponds to the predicted position.

8. The UV curing method according to claim 1, characterized in that: The method further comprises: The ultraviolet micro-pixel light emitting array projection system is adjusted in a dithering manner so that the difference in the cumulative irradiation dose between any two points in each block of the area to be irradiated is less than a preset value.

9. The UV curing method according to claim 1, characterized in that: The method further comprises: Real-time statistics of the radiation dose received by each block in the area to be irradiated; When the cumulative radiation dose received by a certain block in the area to be irradiated reaches a preset dose, the light-emitting point corresponding to the block is turned off.

10. The UV curing method according to claim 9, characterized in that: The method further comprises: Based on the radiation dose received by each block; Different values ​​or display colors are assigned to blocks that have reached the preset dose and blocks that have not reached the preset dose.

11. A UV curing system, characterized in that: include: An acquisition module, used for acquiring in real time the morphological information of the to-be-irradiated area of ​​the to-be-irradiated object within the irradiation range of the ultraviolet micro-pixel light-emitting array projection system; A calculation module, used for identifying the area to be irradiated and calculating the distance from each block in the area to be irradiated to the ultraviolet micro-pixel light emitting array projection system based on the morphological information; A generation module, used to generate an irradiation map matching the area to be irradiated based on the area to be irradiated case; an illumination module, configured to enable the ultraviolet micro-pixel light emitting array projection system to form an illumination area matching the illumination pattern based on the illumination pattern, so as to illuminate the area to be illuminated; An adjustment module is used to adjust the luminous intensity of each light-emitting point in the ultraviolet micro-pixel light-emitting array projection system based on the morphological information and the distance from each block in the area to be irradiated to the ultraviolet micro-pixel light-emitting array projection system, so that the difference in light intensity received by each block in the area to be irradiated is within a preset range.

12. The UV curing system according to claim 11, characterized in that: The ultraviolet micro-pixel light-emitting array projection system includes an ultraviolet micro-pixel light-emitting array and an optical projection system. The ultraviolet micro-pixel light-emitting array includes a driving chip and an ultraviolet micro-pixel light-emitting device arranged on the driving chip. The ultraviolet micro-pixel light-emitting device is electrically connected to the driving chip.

13. The UV curing system according to claim 12, wherein: The optical projection system includes a jitter adjustment component and a lens component for focusing the ultraviolet light emitted by the ultraviolet micro-pixel light-emitting array. The jitter adjustment component can drive the lens component to deflect the optical axis of the lens component.

14. The UV curing system according to claim 12, wherein: The ultraviolet micro-pixel light-emitting array includes a jitter adjustment component, a substrate and a plurality of ultraviolet micro-pixel light-emitting devices arranged on the substrate. The jitter adjustment component is used to drive the ultraviolet micro-pixel light-emitting array to make the ultraviolet micro-pixel light-emitting array jitter in a direction parallel to the substrate.

15. A nail art device, characterized in that: Includes the UV curing system as described in claim 11.

16. An additive printing device, characterized in that: Includes the UV curing system as described in claim 11.

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