Laser machining apparatus and method

Abstract

The present disclosure relates to a laser machining apparatus and method. The technical problem is to be solved by providing the laser machining apparatus and method that enable a machining recipe (machining condition) to be changed according to the material and thickness of a machining object. To this end, the present disclosure provides the laser machining apparatus comprising: a laser generator for generating a laser beam; a scanner, which emits a laser output from the laser generator so as to machine the machining object; a moving unit for moving the scanner; a vision unit for capturing the machining object machined by the scanner; and a control unit for analyzing the thermal deformation trend of a machining area on the basis of an image of the machining object captured through the vision unit, changing the machining recipe on the basis of the thermal deformation trend, and controlling at least one from among the laser generator, the scanner and the moving unit according to the changed machining recipe.

Description

Laser processing device and method

[0001] The present disclosure relates to a laser processing device and method for processing a processing target using a laser.

[0002] Secondary batteries charge and discharge by allowing ions of an electrolyte injected between an anode and cathode insulated by a separator to move between the two electrodes. The electrodes used in the anode and cathode of these secondary batteries are composed of an electrode body and an electrode active material coated on the electrode body. The electrode body can generally be processed into a sheet, thin plate, or foil form from a highly conductive metal such as aluminum (Al) or copper (Cu).

[0003] The electrode plate (electrode film) for forming the electrode assembly is manufactured in a form in which an active material is applied to a portion of the electrode plate and the remaining portion is left exposed without applying the active material. The exposed portion of the electrode plate is processed to serve as an electrode terminal for connecting the positive and negative electrodes to the outside when forming the electrode assembly (positive electrode, negative electrode, and separator). To enable this processing, the electrode film is formed by applying an active material on the conductor of the thin plate that constitutes the electrode plate, and means a processed state in which it is not distinguishable.

[0004] For this purpose, a notching device is configured. The notching device is a device that forms a terminal by cutting a portion of the exposed portion of the electrode film and the coated portion coated with the active material. To this end, the notching device forms the terminal by cutting a portion of the exposed portion using a punching or laser.

[0005] In the past, notching devices using punching were mainly used, but recently, devices using lasers are being used for notching, and since damage to the electrode is less than that of punching and efficient production is possible, the use of notching devices using lasers is increasing.

[0006] When processing (cutting) electrode plates using a laser, quality changes occur due to mechanical characteristics of the electrode plate, such as its material and thickness. Furthermore, when processing electrode plates using the same processing recipe (processing conditions), it is difficult to find processing conditions that satisfy both the foil and coating sections. Furthermore, even after processing, heat-induced deformation can occur, leading to quality changes.

[0007] The above-described information disclosed in the background technology of this invention is only intended to improve understanding of the background of the present invention, and therefore may include information that does not constitute prior art.

[0008] The purpose of the present invention is to provide a laser processing device and method that can change a processing recipe (processing conditions) according to the material and thickness of a processing target.

[0009] However, the technical problems to be solved by the present invention are not limited to the problems described above, and other problems not mentioned can be clearly understood by those skilled in the art from the description of the invention described below.

[0010] A laser processing device according to one embodiment of the present invention for solving the above technical problem is characterized in that it analyzes a thermal deformation trend of a processing area based on an image of a processing object and changes a processing recipe based on the thermal deformation trend.

[0011] According to the present invention, by changing the processing recipe (processing conditions) according to the material and thickness of the object to be processed, it is possible to secure an optimal processing recipe (processing conditions) and quality.

[0012] According to the present invention, by changing the processing recipe (processing conditions) of the foil portion and the coating portion based on the thermal deformation trend of the foil portion and the coating portion during processing of the object to be processed, a processing recipe (processing conditions) that satisfies both the foil portion and the coating portion can be found, thereby ensuring the quality of the foil portion and the coating portion.

[0013] However, the effects that can be obtained through the present invention are not limited to the effects described above, and other technical effects that are not mentioned can be clearly understood by those skilled in the art from the description of the invention described below.

[0014] The following drawings attached to this specification illustrate preferred embodiments of the present invention, and together with the detailed description of the invention described below, serve to further understand the technical idea of ​​the present invention, and therefore, the present invention should not be interpreted as being limited to matters described in such drawings.

[0015] FIG. 1 is a schematic diagram of a laser processing device according to an embodiment of the present invention;

[0016] Fig. 2 illustrates in detail the laser processing device illustrated in Fig. 1;

[0017] FIG. 3 illustrates a planar shape of an electrode plate according to one embodiment of the present invention;

[0018] FIG. 4 illustrates an example of a laser processing path of an electrode plate according to one embodiment of the present invention;

[0019] FIG. 5 illustrates an example of thermal deformation due to processing of an electrode plate according to one embodiment of the present invention;

[0020] FIG. 6 illustrates an example of a section caused by thermal deformation of a foil portion and a coating portion according to one embodiment of the present invention;

[0021] FIG. 7 illustrates an example for explaining the focus of a laser beam according to one embodiment of the present invention;

[0022] FIG. 8 illustrates the shape of a laser direct hit section according to one embodiment of the present invention;

[0023] FIG. 9 is for explaining a laser processing method according to one embodiment of the present invention;

[0024] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. Prior to this, terms or words used in this specification and claims should not be interpreted as limited to their typical or dictionary meanings, but should be interpreted with meanings and concepts that conform to the technical idea of ​​the present invention based on the principle that the inventor can appropriately define the concept of the term in order to explain his own invention in the best way. Therefore, it should be understood that the embodiments described in this specification and the configurations illustrated in the drawings are only some of the most preferred embodiments of the present invention and do not represent all of the technical idea of ​​the present invention, and various equivalents and modifications may be substituted for them at the time of filing this application. In addition, when used in this specification, "comprise" and "include" and / or "comprising" and "including" specify the presence of mentioned shapes, numbers, steps, operations, elements, components and / or groups thereof, and do not exclude the presence or addition of one or more other shapes, numbers, operations, elements, components and / or groups. Additionally, when describing embodiments of the present invention, “may” and “may be” may include “one or more embodiments of the present invention.”

[0025] Additionally, to facilitate understanding of the invention, the attached drawings may not be drawn to scale and some components may be exaggerated in size. Furthermore, identical components may be assigned the same reference numbers in different embodiments.

[0026] The statement that two compared objects are "identical" means "substantially identical." Therefore, "substantially identical" may include deviations considered low in the art, such as deviations of less than 5%. Furthermore, uniformity of a parameter over a given region may imply uniformity on average.

[0027] Although terms like "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another, and unless otherwise specified, a "first" component may also be a "second" component.

[0028] Throughout the specification, unless otherwise specifically stated, each element may be singular or plural.

[0029] Any configuration being placed "on (or under)" or "above (or below)" a component may mean not only that any configuration is placed in contact with the upper surface (or lower surface) of said component, but also that other configurations may intervene between said component and any configuration placed on (or below) said component.

[0030] Additionally, when it is described that a component is "connected," "coupled," or "connected" to another component, it should be understood that the components may be directly connected or connected to one another, but that other components may also be "interposed" between the components, or that each component may be "connected," "coupled," or "connected" through another component. Furthermore, when it is said that a part is electrically coupled to another part, this includes not only cases where they are directly connected, but also cases where they are connected with another element in between.

[0031] When reference is made throughout the specification to "A and / or B," this means A, B, or A and B, unless otherwise stated. In other words, "and / or" includes all or any combination of the listed items. When reference is made to "C through D," this means C or more and D or less, unless otherwise stated.

[0032]

[0033] FIG. 1 is a schematic diagram showing a laser processing device according to an embodiment of the present invention, FIG. 2 is a detailed diagram showing the laser processing device shown in FIG. 1, FIG. 3 is a diagram showing a planar shape of an electrode plate according to an embodiment of the present invention, FIG. 4 is a diagram showing an example of a laser processing path of an electrode plate according to an embodiment of the present invention, FIG. 5 is a diagram showing an example of thermal deformation due to processing of an electrode plate according to an embodiment of the present invention, FIG. 6 is a diagram showing an example of a section due to thermal deformation of a foil portion and a coating portion according to an embodiment of the present invention, FIG. 7 is a diagram showing an example for explaining a focus of a laser beam according to an embodiment of the present invention, and FIG. 8 is a diagram showing a shape of a laser direct hit section according to an embodiment of the present invention.

[0034] Referring to FIGS. 1 and 2, a laser processing device (100) according to one embodiment of the present invention includes a transport unit (110), a laser generator (120), a scanner (130), a moving unit (140), a vision unit (150), and a control unit (160).

[0035] The transfer unit (110) can transfer the processing object (10) from the supply unit (112) to the recovery unit (114). Here, the processing object (10) may be an electrode plate.

[0036] The transport unit (110) transports the electrode plate (10) wound on the outer surface of the supply roll provided in the supply unit (112) toward the recovery unit (114), and during the transport process, the electrode plate (10) may be partially cut by a laser beam and then wound on the outer surface of the recovery roll provided in the recovery unit (114).

[0037] The laser generator (120) can generate a laser beam by controlling at least one of the laser power, pulse repetition rate (PRR (Hz)), and beam duration according to a control signal of the control unit (160). That is, the laser generator (120) can output a laser beam by controlling at least one of the power, pulse repetition rate, and beam duration of the laser beam according to a power control value, a pulse repetition rate control value, and a beam duration control value included in the control signal.

[0038] A laser beam output from a laser generator (120) can be transmitted to a scanner (130) through an optical member (not shown) including at least one of an optical mirror, a beam dump, and a beam expander, which is arranged between the laser generator (120) and the scanner (130) to form a beam transmission path.

[0039] The scanner (130) can cut the object to be processed (10) by irradiating the laser beam output from the laser generator (120) to a designated location of the object to be processed (10). At this time, the scanner (130) can cut a portion of the object to be processed (10) by irradiating the laser beam to the object to be processed (10) by adjusting the processing speed according to the control signal of the control unit (160). That is, the scanner (130) can irradiate the laser beam to the object to be processed (10) by adjusting the processing speed according to the processing speed control value included in the control signal.

[0040] The scanner (130) can control the processing speed of the laser beam by operating the lens (not shown) and mirror (not shown) provided therein. That is, the scanner (130) changes the position at which the laser beam is irradiated by tilting two mirrors included in the lens, and at this time, the rotation speed of the mirrors may be the processing speed. Therefore, the scanner (130) can control the processing speed by controlling the rotation speed of the mirrors according to the processing speed control value.

[0041] Additionally, the scanner (130) can control the shape and size of the laser beam by driving a lens (not shown) and a mirror (not shown) provided inside.

[0042] The scanner (130) can cut the workpiece (10) by irradiating the laser beam in a direction perpendicular to the transmission path of the laser beam or in a direction horizontal to the ground. Accordingly, the scanner (130) can be configured to move or rotate in three axes (horizontal axis, vertical axis, and an axis perpendicular to these two axes).

[0043] The moving part (140) can move the scanner (130) in the X-axis, Y-axis, and Z-axis directions.

[0044] The workpiece (10) being transported by the transport unit (110) may have height differences even if they are the same product. Accordingly, the transport unit (140) moves the scanner (130) in the Z-axis direction, thereby enabling cutting of products with height deviations without any change in quality.

[0045] Additionally, the moving part (140) can adjust the position of the scanner (130) by moving the scanner (130) along the X-axis and Y-axis.

[0046] The moving part (140) can be implemented as an actuator composed of a motor (e.g., a servo motor) and gears, etc., to move the scanner (130) in three axes, and the movement of the moving part (140) can be controlled by the control part (160).

[0047] The laser beam is irradiated onto the object to be processed (10) while moving in the X-axis, Y-axis, and Z-axis directions by the moving part (140) and the scanner (130), and a processing area having an approximately square shape can be formed on one side of the object to be processed (10) by the laser beam. Here, the object to be processed (10) can be an electrode plate (10) (electrode film).

[0048] The electrode plate (10) may include a foil portion (Foil, 12) in which the electrode body is exposed, as illustrated in FIG. 3, and a coating portion (Coating, 11) formed by applying an active material. Here, the electrode body may be a metal such as aluminum, copper, etc., and the active material may be a material such as carbon powder, but other known materials may also be used as the electrode body or the active material.

[0049] The foil portion (12) where the electrode body is exposed can be processed to function as an electrode terminal for connecting the positive and negative electrodes to the outside when forming an electrode assembly (positive electrode, negative electrode, and separator). Accordingly, the foil portion (12) is configured to transmit current to the coating portion (11) or receive current from the coating portion (11), and can be made of copper, aluminum, or the like.

[0050] These electrode plates (10) can be cut into lengths suitable for the size of the electrode assembly by forming positive and negative terminals through a cutting process using a laser beam, and then divided. At this time, the scanner (130) can cut the electrode plates (10) by irradiating them with a laser beam along a laser processing path.

[0051] Meanwhile, when the electrode plate (10) is processed (cut) using a laser beam, quality changes occur due to mechanical characteristics of the electrode plate (10), such as the material and thickness. In addition, when the electrode plate (10) is processed using the same processing recipe (processing conditions), it is difficult to find processing conditions that satisfy the quality of both the foil portion (12) and the coating portion (11), and deformation due to heat occurs even after processing, which affects the product quality.

[0052] For example, a case in which a laser beam is irradiated along a laser processing path (A) illustrated in Fig. 4 to cut an electrode plate (10) will be described. In Fig. 4, the laser processing path (A) may be a continuous line that starts at a certain point (Start) of the foil portion (12), is formed forward toward the coating portion (11), and then is formed along the left-right direction of the electrode plate (10) from the coating portion (11), and is formed toward the edge (End) of the foil portion (12) from the coating portion (11).

[0053] When the electrode plate (10) is processed (cut) by irradiating the laser beam along the laser processing path (A), the processing area (B) of the electrode plate (10) may be thermally deformed by the laser beam as shown in Fig. 5. Deformation due to heat lowers the quality of the product.

[0054] Therefore, a technology is needed to reduce deformation due to heat even after processing of the electrode plate (10), so that the electrode plate (10) can maintain a constant quality. Since the electrode plate (10) is a processing target (10), the electrode plate (10) will be referred to as a processing target (10) in the following description.

[0055] Accordingly, the laser processing device (100) according to the present invention may include a vision unit (150) that photographs a processing object (10) processed by a scanner (130), and a control unit (160) that changes a processing recipe required for laser processing based on an image of the processing object photographed by the vision unit (150).

[0056] The vision unit (150) can photograph a processing object (10) processed by a scanner (130) and transmit the photographed image of the processing object to the control unit (160).

[0057] The vision unit (150) is configured with a structure in which a camera (not shown) installed on the upper portion of the transport unit (110) through which the processed workpiece (10) moves can photograph the processed workpiece (10). Accordingly, the vision unit (150) may include a camera installed on the upper portion of the transport unit (110) and lighting (not shown) for illuminating the workpiece (10). When the processed workpiece (10) is transported through the transport unit (110), the vision unit (150) can illuminate the workpiece (10) from above to enable clear reading.

[0058] The control unit (160) is a subject that controls the transport unit (110), the laser generator (120), the scanner (130), the moving unit (140), and the vision unit (150), and may be implemented as a central processing unit (CPU), a system on chip (SoC), or a processor. The control unit (160) may control a plurality of hardware or software components connected to the control unit (160) by driving an operating system or application, and may perform various data processing and calculations. The control unit (160) may be configured to execute at least one command stored in a memory (not shown) and store the execution result data in the memory.

[0059] The control unit (160) analyzes the thermal deformation trend of the processing area based on the image of the processing target captured through the vision unit (150), changes the processing recipe based on the thermal deformation trend, and controls at least one of the laser generator (120), the scanner (130), and the moving unit (140) according to the changed processing recipe.

[0060] Below, the operation of the control unit (160) will be described in detail.

[0061] The control unit (160) can control at least one of the laser generator (120), the scanner (130), and the moving unit (140) to initially process the object to be processed (10) according to a processing recipe set according to the object to be processed (10).

[0062] Here, the processing recipe refers to processing conditions preset according to the processing target (10), and may include processing speed, laser power, pulse repetition rate (PRR (Hz)), beam duration (Duration), etc. The processing speed may refer to the rotation speed of a mirror included in the scanner (130). Laser power may refer to the output (%) of a laser beam. Pulse repetition rate (PRR (Hz)) may refer to the number of repetitions of a laser beam (Beam) per second. Beam duration (Duration) may refer to the duration of one laser beam.

[0063] A pulsed laser does not scan a laser beam continuously, but at regular intervals. As the processing speed of the laser beam increases, the spacing between beams increases at the same scanning rate, resulting in different processing characteristics. Laser power is adjusted in percentages of the maximum output, and the power becomes stronger or weaker depending on the ratio. The pulse repetition rate (PRR (Hz)) indicates the number of repetitions of the laser beam per second, affecting the processing characteristics. The beam duration (Duration) indicates the duration of one laser beam, affecting the processing quality. Therefore, a processing recipe may include processing speed, laser power, pulse repetition rate (PRR (Hz)), and beam duration (Duration).

[0064] When the object to be processed (10) is first processed, the control unit (160) may obtain a processing recipe set according to the object to be processed (10) from a memory (not shown) and generate a control signal to adjust at least one of the processing speed, laser power, pulse repetition rate (PRR (Hz)) and beam duration of the laser beam according to the obtained processing recipe.

[0065] That is, since the absorption rate of the laser beam varies depending on the object to be processed (10), the control unit (160) can acquire a processing recipe set by considering the absorption rate of the laser beam according to the material of the object to be processed (10) from the memory. Then, the control unit (160) can transmit a control signal to at least one of the laser generator (120), the scanner (130), and the moving unit (140) so as to adjust the processing speed, laser power, pulse repetition rate, and beam duration of the laser beam included in the acquired processing recipe.

[0066] Since the processing speed is controlled using the scanner (130), the control unit (160) can transmit a control signal including a processing speed control value to the scanner (130). The scanner (130) that receives the control signal can control the processing speed according to the processing speed control value included in the control signal.

[0067] Since the laser power, pulse repetition rate, and beam duration are controlled by the laser generator (120), the control unit (160) can transmit a control signal for controlling at least one of the power, pulse repetition rate, and beam duration to the laser generator (120). The laser generator (120) that receives the control signal can control at least one of the power, pulse repetition rate, and beam duration of the laser beam according to at least one of the power control value, pulse repetition rate control value, and beam duration control value included in the control signal.

[0068] The laser processing device (100) processes a processing object (10) by irradiating a laser beam according to a preset processing recipe, and the processed processing object (10) moves along the transport direction through a transport unit (110).

[0069] As described above, since the processing recipe is set according to the material of the processing object (10), the control unit (160) can process the processing object (10) according to the processing recipe set according to the material of the processing object (10).

[0070] However, even if it is the same processing object (10), the quality of the processing object (10) may change due to various variables such as height deviation, shaking during movement, and foreign substances.

[0071] Accordingly, it is necessary to adjust the processing recipe so that the quality of the processing object (10) does not change due to various variables.

[0072] To this end, the vision unit (150) can photograph the processed object (10) and transmit the photographed image of the processed object to the control unit (160).

[0073] The control unit (160) can analyze the thermal deformation trend of the processing area based on the image of the processing object captured by the vision unit (150). That is, the control unit (160) can analyze the thermal deformation trend including at least one of the thermal deformation width, cut shape, color, and shade in the processing area of ​​the image of the processing object. Here, the thermal deformation width can mean the width of the area deformed by the heat generated by the laser processing.

[0074] When the thermal deformation trend is analyzed, the control unit (160) can divide the processing area into at least one of a direct irradiation zone, a heat affected zone, and a fume affected zone based on the thermal deformation trend.

[0075] When cutting a workpiece (10) using a laser, the processing area can be divided into a laser direct hit area where the laser is directly hit and an area affected by heat energy. The area affected by heat energy can be divided into a heat affected area and a fume affected area based on at least one of color and shade. The laser direct hit area indicates the surface to which the laser beam is irradiated and can be viewed as the starting point of the cutting surface (processing surface). For example, the laser direct hit area can indicate a surface to which a circular laser beam of 30 to 50 μm is irradiated.

[0076] The processing area processed by the laser beam can be divided into a laser direct hit zone, a heat affected zone, and a fume affected zone, as illustrated in FIG. 6. Referring to FIG. 6, it can be seen that the foil portion (12) and the coating portion (11) have different shapes, colors, shades, etc. of the laser direct hit zone, the heat affected zone, and the fume affected zone. In the case of the heat affected zone of the foil portion (12), it can be confirmed mainly in the form of a gradient, as illustrated in (a) of FIG. 6. In the case of the heat affected zone of the coating portion (11), it can be confirmed in the form of a soot, as illustrated in (b) of FIG. With respect to the fume affected zone, it can be confirmed that the fume affected zone is hardly found in the foil portion (12), is mainly found in the coating portion (11), and has a region of a similar gradation to the heat affected zone generated during processing of the foil portion (12).

[0077] Accordingly, the control unit (160) can distinguish between the heat-affected zone and the fume-affected zone based on at least one of the color and shade of the zone affected by heat energy. For example, the control unit (160) can distinguish a zone in which the color value is equal to or greater than a threshold value or the shade level is equal to or greater than a threshold value in the zone affected by heat energy as the heat-affected zone. In addition, the control unit (160) can distinguish a zone in which the color value is equal to or less than a threshold value or the shade level is equal to or less than a threshold value in the zone affected by heat energy as the fume-affected zone.

[0078] As seen in Fig. 6, it can be seen that the foil portion (12) and the coating portion (11) have different thermal deformation trends.

[0079] Accordingly, the control unit (160) needs to make the processing recipe (processing conditions) of the foil portion (12) different from the processing recipe (processing conditions) of the coating portion (11). That is, the control unit (160) can change the processing recipe according to the material and thickness of the foil portion (12), and can change the processing recipe according to the material and thickness of the coating portion (11). In other words, the control unit (160) can change the processing recipe based on the thermal deformation trend of the foil portion (12), and can change the processing recipe based on the thermal deformation trend of the coating portion (11).

[0080] The control unit (160) can change the processing recipe based on the cutting shape of the laser direct hit section. In addition, the control unit (160) can change the processing recipe of the heat affected zone or fume affected zone based on at least one of the color and shade of the heat affected zone or fume affected zone.

[0081] First, the control unit (160) can adjust the size of the laser beam based on the laser direct hit section.

[0082] If there is a part that is not cut in the laser direct hit section, the control unit (160) can control the moving unit (140) to move the scanner (130) in the direction of gravity (Z-axis) to adjust the size of the laser beam. That is, if there is a part that is not cut in the processing area of ​​the image of the object to be processed, the control unit (160) can adjust the beam size by moving the moving unit (140) in the Z-axis.

[0083] When an F-Theta lens is used in the scanner (130), the laser beam converges (focuses) to one point and then spreads out as shown in Fig. 7.

[0084] When the laser beam converges (focuses) to one point, the laser beam can cut (process) the object to be processed (10).

[0085] If the laser beam is not focused or defocused at one point, the power (energy) is not concentrated on the laser beam itself and only heat is transmitted, so the laser beam cannot cut (process) the object to be processed (10). In this case, the control unit (160) must find the focus of the laser beam.

[0086] In order to find the focus of the laser beam, the control unit (160) must adjust the distance between the scanner (130) and the object to be processed (10). To this end, the control unit (160) can transmit a control signal for adjusting the position of the scanner (130) to the moving unit (140). Then, the moving unit (140) can find the focus of the laser beam by moving the scanner (130) in the Z-axis direction according to the control signal. That is, the moving unit (140) can find the focus of the laser beam by moving the scanner (130) upward or downward.

[0087] In this way, the control unit (160) can adjust the size of the laser beam (Beam Size) by adjusting the Z-axis height of the scanner (130) according to full cutting or half cutting. Here, full cutting refers to a case where cutting is perfectly done, and half cutting refers to a case where bridges, etc. remain.

[0088] When half cutting occurs, the control unit (160) can control the moving unit (140) to move the scanner (130) in the Z-axis direction. When full cutting occurs during the movement of the scanner (130), the control unit (160) can control the moving unit (140) to stop the movement of the scanner (130).

[0089] If full cutting is not achieved even when the scanner (130) is moved, the control unit (160) can change the laser power and pulse repetition rate (PRR (Hz)) to find a processing recipe (processing condition) that allows full cutting. If full cutting is not achieved even when the processing recipe values ​​are changed, the manager can inspect the laser processing device (100), replace the protective glass, and then perform processing again.

[0090] In addition, the control unit (160) can distinguish the shape of the laser direct hit section into at least one of a gear shape, a melting shape, and a water drop shape depending on the cutting shape of the laser direct hit section. That is, the control unit (160) can distinguish the laser direct hit section into three shapes, a gear shape, a melting shape, and a water drop shape, as illustrated in FIG. 8.

[0091] Gear formation can occur when the machining speed exceeds the reference speed or the power (energy) is insufficient. Melting formation can occur when the machining speed and power (energy) remain constant. Droplet formation can occur when the machining speed is slower than the reference speed or the power (energy) is excessive.

[0092] Accordingly, when the laser direct hit section is in the shape of a gear or a droplet, the control unit (160) can adjust the processing speed and laser power in the current processing recipe. Then, the control unit (160) can transmit a control signal including a processing speed control value and a power control value to the scanner (130) and the laser generator (120). The scanner (130) that receives the control signal can adjust the processing speed according to the processing speed control value. The laser generator (120) that receives the control signal can adjust the power according to the power control value.

[0093] For example, in the case of a gear shape, the control unit (160) transmits to the scanner (130) and the laser generator (120) a processing speed control value that makes the processing speed slower than the current processing speed and a power control value that makes the laser power larger than the current laser power, thereby making the processing speed slower than the current processing speed and making the power larger than the current power. In the case of a water drop shape, the control unit (160) transmits to the scanner (130) and the laser generator (120) a processing speed control value that makes the processing speed faster than the current processing speed and a power control value that makes the laser power smaller than the current laser power, thereby making the processing speed faster than the current processing speed and making the power (energy) smaller than the current power.

[0094] When the laser direct hit section is in the form of a melting shape, the control unit (160) can adjust at least one of a pulse repetition rate (PRR), a beam duration, and a processing speed in the current processing recipe. Then, the control unit (160) can transmit a control signal including a pulse repetition rate control value, a beam duration control value, and a processing speed control value to the laser generator (120) and the scanner (130). The laser generator (120) receiving the control signal can adjust the pulse repetition rate and the beam duration according to the pulse repetition rate control value and the beam duration control value. The scanner (130) receiving the control signal can adjust the processing speed according to the processing speed control value.

[0095] The control unit (160) can distinguish between a heat affected zone and a fume affected zone based on at least one of color and shade for the affected zone by heat energy of the processing area.

[0096] In the case of the heat affected zone, the light energy generated from the laser generator (120) is converted into heat energy and affects the surroundings, which mainly causes the color of the heat affected zone to change.

[0097] Accordingly, the control unit (160) can adjust at least one of the processing speed, laser power, pulse repetition rate (PRR), and beam duration based on at least one of the width, color, and shading level of the heat affected zone. At this time, the control unit (160) can transmit a control signal including at least one of the processing speed control value, the power control value, the pulse repetition rate control value, and the beam duration control value to the scanner (130) and the laser generator (120). The scanner (130) that receives the control signal can adjust the processing speed according to the processing speed control value. The laser generator (120) that receives the control signal can adjust the power, pulse repetition rate, and beam duration of the laser according to the power control value, the pulse repetition rate control value, and the beam duration control value.

[0098] In the case of the heat affected zone of the foil portion (12), it can be confirmed mainly in the form of a gradient as shown in (a) of Fig. 6. In the case of the heat affected zone of the coating portion (11), it can be confirmed in the form of soot as shown in (b) of Fig. 6.

[0099] Accordingly, in the case of the heat affected zone of the foil portion (12), the control unit (160) can change the processing recipe according to the width and color of the gradient. In the case of the heat affected zone of the coating portion (11), the control unit (160) can change the processing recipe according to the shade level and width of the soot.

[0100] In the case of the heat affected zone, the control unit (160) can change the processing recipe in the order of laser power, processing speed, pulse repetition rate (PRR), and beam duration.

[0101] For example, if the color value of the heat affected zone of the foil portion (12) is higher than the reference color value, the control unit (160) can lower the laser power more than the current laser power. For example, when the object to be processed (10) is being processed at 80% power, if the color value of the heat affected zone is higher than the reference color value, the control unit (160) can lower the power to 70 to 75%. If the color value is higher than the reference color value despite the lowered power, the control unit (160) can reduce the processing speed more than the current processing speed. If the color value is higher than the reference color value despite the reduced processing speed, the control unit (160) can lower the pulse repetition rate (PRR) more than the current pulse repetition rate or increase the beam duration more than the current beam duration.

[0102] The control unit (160) can adjust at least one of the processing speed, laser power, pulse repetition rate (PRR), and beam duration based on at least one of the width and shadow level of the fume influence zone. At this time, the control unit (160) can transmit a control signal including at least one of the processing speed control value, the power control value, the pulse repetition rate control value, and the beam duration control value to the scanner (130) and the laser generator (120). The scanner (130) that receives the control signal can adjust the processing speed according to the processing speed control value. The laser generator (120) that receives the control signal can adjust the power, pulse repetition rate, and beam duration of the laser according to the power control value, the pulse repetition rate control value, and the beam duration control value.

[0103] Referring to FIG. 6 for the fume-affected zone, it can be confirmed that the fume-affected zone is hardly found in the foil portion (12), is mainly found in the coating portion (11), and has a region of gradation similar to the heat-affected zone generated during processing of the foil portion (12). Therefore, in the case of the fume-affected zone of the coating portion (11), the control unit (160) can change the processing recipe according to the width and color of the gradation. That is, the control unit (160) can adjust at least one of the processing speed, laser power, pulse repetition rate (PRR), and beam duration based on the gradation and color of the fume-affected zone of the coating portion (11).

[0104] As described above, the control unit (160) can control the processing recipes of the foil portion (12) and the coating portion (11), respectively. That is, the control unit (160) can change the processing recipe based on the thermal deformation trend of the foil portion (12), and can change the processing recipe based on the thermal deformation trend of the coating portion (11).

[0105] In addition, the control unit (160) can change the processing recipe according to the laser processing path. That is, while processing the object (10) to be processed according to the laser processing path, if there is a foil portion (12) within the laser processing path, the control unit (160) can change the processing recipe based on the thermal deformation trend of the foil portion (12). In addition, if there is a coating portion (11) within the laser processing path, the control unit (160) can change the processing recipe based on the thermal deformation trend of the coating portion (11).

[0106] When cutting (processing) the processing target (10) according to the laser processing path illustrated in Fig. 4, the control unit (160) can change the processing recipe (processing conditions) from the foil portion (12) to the coating portion (11) or from the coating portion (11) to the foil portion (12). For example, the foil portion (12) can be processed at a processing speed of 3 m / s, power of 50%, pulse repetition rate of 800 kHz, and beam duration of 30 ns, and the coating portion (11) can be processed at a processing speed of 1 m / s, power of 80%, pulse repetition rate of 2000 kHz, and beam duration of 240 ns.

[0107] In this way, the control unit (160) can process the foil portion (12) and the coating portion (11) by differentiating the processing recipes during the processing of the object to be processed (10). Through this, the present invention can find a processing recipe (processing condition) that satisfies both the foil portion (12) and the coating portion (11), and can maintain the quality of the foil portion (12) and the coating portion (11).

[0108] In addition, the control unit (160) can compare the thermal deformation width of the processing area with a preset reference range, and if the thermal deformation width exceeds the reference range, the processing target (10) can be judged as defective.

[0109] When the thermal deformation width of the processing area is close to the upper limit or lower limit of the reference range, the control unit (160) can change the processing recipe so that the thermal deformation width becomes smaller than the upper limit, or change the processing recipe so that the thermal deformation width becomes larger than the lower limit.

[0110]

[0111] FIG. 9 is for explaining a laser processing method according to one embodiment of the present invention.

[0112] Referring to FIG. 9, the control unit (160) controls at least one of the laser generator (120), the scanner (130), and the moving unit (140) according to the processing recipe set according to the object to be processed (10) (S902). During the initial processing, the control unit (160) may obtain the processing recipe set according to the object to be processed (10) from a memory (not shown), and may generate a control signal to adjust at least one of the processing speed, laser power, pulse repetition rate (PRR (Hz)), and beam duration of the laser beam according to the obtained processing recipe. The scanner (130) that receives the control signal may adjust the processing speed according to the processing speed value of the processing recipe. The laser generator (120) that receives the control signal may adjust at least one of the power, pulse repetition rate, and beam duration of the laser beam according to at least one of the power value, pulse repetition rate value, and beam duration value of the processing recipe included in the control signal.

[0113] By performing step S902, when the laser generator (120), scanner (130), and moving unit (140) are adjusted according to the processing recipe, the control unit (160) controls the processing object (10) to be processed (S904). At this time, the scanner (130) processes the processing object (10) by irradiating a laser beam according to the processing recipe, and the processed processing object (10) moves along the transport direction via the transport unit (110). Then, the vision unit (150) can take a picture of the processed processing object (10) and transmit it to the control unit (160).

[0114] After performing step S904, when an image of a processing target is received from the vision unit (150) (S906), the control unit (160) analyzes a thermal deformation trend of a processing area based on the image of the processing target (S908). That is, the control unit (160) can analyze a thermal deformation trend including at least one of a thermal deformation width, a cut shape, a color, and a shade in the processing area of ​​the image of the processing target.

[0115] When step S908 is performed, the control unit (160) divides the processing area into at least one of a laser direct hit area, a heat affected area, and a fume affected area based on the thermal deformation trend (S910). When cutting the processing object (10) using a laser, the processing area can be divided into a laser direct hit area that is directly hit by the laser and a heat affected area. The heat affected area can be divided into a heat affected area and a fume affected area based on at least one of color and shade.

[0116] When step S910 is performed, the control unit (160) changes the processing recipe based on the characteristics of at least one section among the laser direct hit section, the heat affected section, and the fume affected section (S912), and controls at least one of the laser generator (120), the scanner (130), and the moving unit (140) according to the changed processing recipe (S914).

[0117] For example, when half cutting is performed in a laser direct hit section, the control unit (160) can change at least one processing recipe among laser power and pulse repetition rate (PRR (Hz)). In addition, the control unit (160) can distinguish the shape of the laser direct hit section into at least one of a gear shape, a melting shape, and a water drop shape depending on the cutting shape of the laser direct hit section. In the case of a gear shape or a water drop shape, the control unit (160) can change at least one processing recipe among a processing speed and a laser power, and in the case of a melting shape, can change at least one processing recipe among a pulse repetition rate (PRR), a beam duration (Duration), and a processing speed.

[0118] Additionally, the control unit (160) can change at least one of the processing recipe of the processing speed, laser power, pulse repetition rate (PRR), and beam duration based on at least one of the width, color, and shade of the heat affected zone.

[0119] Additionally, the control unit (160) can change at least one of the processing recipe of the processing speed, the laser power, the pulse repetition rate (PRR), and the beam duration based on at least one of the width and the shadow level of the fume influence zone.

[0120]

[0121] As described above, according to the present invention, by changing the processing recipe (processing conditions) depending on the material and thickness of the processing target (10), it is possible to secure the optimal processing recipe (processing conditions) and quality.

[0122] According to the present invention, by changing the processing recipe (processing conditions) of the foil portion and the coating portion based on the thermal deformation trend of the foil portion and the coating portion during processing of the object to be processed, a processing recipe (processing conditions) that satisfies both the foil portion and the coating portion can be found, thereby ensuring the quality of the foil portion and the coating portion.

[0123] The term "unit" as used herein may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. The "unit" may be an integrally formed component, or a minimum unit or part of the component that performs one or more functions. For example, according to one embodiment, the "unit" may be implemented in the form of an Application-Specific Integrated Circuit (ASIC).

[0124] The implementations described herein may be implemented as, for example, a method or process, an apparatus, a software program, a data stream, or a signal. Even if discussed only in the context of a single form of implementation (e.g., discussed only as a method), the implementation of the discussed features may also be implemented in other forms (e.g., as an apparatus or a program). An apparatus may be implemented using suitable hardware, software, firmware, and the like. A method may be implemented in an apparatus such as a processor, which generally refers to a processing device including, for example, a computer, a microprocessor, an integrated circuit, or a programmable logic device. A processor also includes a communication device such as a computer, a cell phone, a personal digital assistant ("PDA"), and other devices that facilitate the communication of information between end-users.

[0125] While the present invention has been described with reference to the embodiments illustrated in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent embodiments are possible. Accordingly, the technical protection scope of the present invention should be defined by the following claims.

Claims

1. A laser generator that generates a laser beam; A scanner that processes a workpiece by irradiating a laser beam output from the laser generator; A moving part for moving the above scanner; A vision unit for photographing a processing target processed by the above scanner; and A control unit that analyzes a thermal deformation trend of a processing area based on an image of a processing target captured through the above-described vision unit, changes a processing recipe based on the thermal deformation trend, and controls at least one of the laser generator, scanner, and moving unit according to the changed processing recipe. A laser processing device characterized by including a .

2. In paragraph 1, The above processing recipe is, A laser processing device characterized by including at least one of processing speed, laser power, pulse repetition rate (PRR), and beam duration.

3. In paragraph 1, The above control unit, Controlling at least one of the laser generator, the scanner and the moving part to initially process the workpiece according to the processing recipe set for the workpiece, A laser processing device characterized in that, when receiving an image of a processing target from the above-described vision unit, the processing recipe is changed based on the image of the processing target.

4. In paragraph 1, The above control unit, A laser processing device characterized in that it analyzes a thermal deformation trend including at least one of a thermal deformation width, a cutting shape, a color, and a shade of a processing area in the image of the processing target.

5. In paragraph 4, The above control unit, A laser processing device characterized in that the processing area is divided into at least one of a laser direct hit zone, a heat affected zone, and a fume affected zone based on the thermal deformation trend, and the processing recipe is changed based on the characteristics of each of the divided zones.

6. In paragraph 5, The above control unit, A laser processing device characterized in that, when there is an uncut portion in the above laser direct hit section, the moving part is controlled to move the scanner in the direction of gravity, thereby adjusting the size of the laser beam.

7. In paragraph 6, The above control unit, A laser processing device characterized in that, when full cutting is not achieved by movement of the scanner, at least one processing recipe among laser power and pulse repetition rate (PRR (Hz)) is changed.

8. In paragraph 5, The above control unit, Depending on the cutting shape of the above laser direct hit section, the shape of the above laser direct hit section is classified into at least one of a gear shape, a melting shape, and a water drop shape. A laser processing device characterized in that, in the case of the gear shape or the droplet shape, at least one processing recipe among the processing speed and the laser power is changed, and in the case of the melting shape, at least one processing recipe among the pulse repetition rate (PRR), the beam duration, and the processing speed is changed.

9. In paragraph 5, The above control unit, A laser processing device characterized in that it changes at least one of a processing recipe of a processing speed, a laser power, a pulse repetition rate (PRR), and a beam duration based on at least one of a width, a color, and a shade of the heat affected zone.

10. In paragraph 5, The above control unit, A laser processing device characterized in that at least one of a processing recipe among a processing speed, a laser power, a pulse repetition rate (PRR), and a beam duration (Duration) is changed based on at least one of the width and shadow level of the above fume affected area.

11. In paragraph 1, The above processing object includes a foil portion and a coating portion, The above control unit, A laser processing device characterized in that the processing recipe is changed based on the thermal deformation trend of the foil portion, and the processing recipe is changed based on the thermal deformation trend of the coating portion.

12. In paragraph 11, The above control unit, A laser processing device characterized in that, while processing the object to be processed along a laser processing path, the processing recipe is changed based on a thermal deformation trend of the foil portion within the laser processing path, and the processing recipe is changed based on a thermal deformation trend of the coating portion within the laser processing path.

13. A step in which the control unit controls at least one of the laser generator, the scanner, and the moving unit so that the workpiece is initially processed according to the processing recipe set for the workpiece; A step in which the control unit receives an image of the processed object from the vision unit; A step of the above control unit analyzing the thermal deformation trend of the processing area based on the image of the processing target; The step of the control unit changing the processing recipe based on the thermal deformation trend; and A step in which the control unit controls at least one of the laser generator, scanner and moving unit according to the changed processing recipe. A laser processing method characterized by including a.

14. In paragraph 13, The above processing recipe is, A laser processing method characterized by including at least one of processing speed, laser power, pulse repetition rate (PRR), and beam duration.

15. In paragraph 13, In the step of analyzing the thermal deformation trend of the above processing area, A laser processing method, characterized in that the control unit analyzes a thermal deformation trend including at least one of a thermal deformation width, a cutting shape, a color, and a shade of a processing area in the image of the processing object.

16. In paragraph 15, At the step of changing the above processing recipe, A laser processing method, characterized in that the control unit divides the processing area into at least one of a laser direct hit zone, a heat affected zone, and a fume affected zone based on the thermal deformation trend, and changes the processing recipe based on the characteristics of each of the divided zones.

17. In paragraph 13, The above processing object includes a foil portion and a coating portion, At the step of changing the above processing recipe, A laser processing method, characterized in that the control unit changes the processing recipe based on the thermal deformation trend of the foil portion and changes the processing recipe based on the thermal deformation trend of the coating portion.

18. In paragraph 17, At the step of changing the above processing recipe, A laser processing method characterized in that the control unit, while processing the object to be processed along a laser processing path, changes the processing recipe based on a thermal deformation trend of the foil portion within the laser processing path, and changes the processing recipe based on a thermal deformation trend of the coating portion within the laser processing path.

19. A step in which a laser generator generates a laser beam; A step in which a scanner processes an object to be processed by irradiating the object with a laser beam output from the laser generator; The vision unit takes a picture of the processed object processed by the scanner; and A step in which the control unit analyzes the thermal deformation trend of the processing area based on the image of the processing target captured through the vision unit, changes the processing recipe based on the thermal deformation trend, and controls at least one of the laser generator, the scanner, and the moving unit according to the changed processing recipe. A laser processing method characterized by including a.

20. In paragraph 19, In the above controlling step, The above control unit analyzes a thermal deformation trend including at least one of a thermal deformation width, a cutting shape, a color, and a shade of a processing area in the image of the processing object, Based on the above thermal deformation trend, the processing area is divided into at least one of a laser direct hit area, a heat affected area, and a fume affected area. A laser processing method characterized by changing the processing recipe based on the characteristics of each of the above-mentioned separated sections.

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