Image sensor, electronic device comprising image sensor, and operating method thereof

Abstract

An electronic device according to various embodiments may comprise a camera module. An image sensor of the camera module may comprise: a first pixel group for outputting phase difference data in a first direction; and a second pixel group for outputting phase difference data in a second direction. The image sensor according to various embodiments can acquire phase difference data of two or more directions without increasing the number of times an analog-to-digital conversion operation is performed. Various embodiments other than the described embodiments are possible.

Description

Image sensor, electronic device including image sensor, and method of operating same

[0001] The present disclosure relates to an image sensor, an electronic device including the image sensor, and a method of operating the same.

[0002] An electronic device including a device for photographing a subject (e.g., a camera) may perform an operation to focus on the subject to capture a clear image (e.g., at least one of a still image or a moving image). For example, the electronic device may perform an operation to move the position of a lens based on the distance from the image sensor to the subject.

[0003] There are two methods for focusing on a subject: contrast-based autofocus detection and phase-based autofocus detection. Contrast-based autofocus detection may refer to a method for focusing that utilizes the characteristic that the subject's outline is clear when in focus, resulting in a high contrast value, and that the contrast is low when out of focus. Contrast-based autofocus detection may include an operation of moving a lens assembly, measuring the contrast of at least a portion of the image formed on the image sensor, and determining the position of the lens where the contrast is maximum as the position in focus.

[0004] Phase-difference focus detection may refer to a method of detecting focus based on at least one of the direction or amount of offset by utilizing the phase difference obtained from two or more different phase images. However, the focusing method is not limited to this, and a hybrid method combining a contrast autofocus detection method and a phase-difference autofocus detection method may also be used.

[0005] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is prior art in connection with the present disclosure.

[0006] An aspect of the present disclosure is to address at least the problems and / or disadvantages described above and to provide at least the advantages described below. Accordingly, an aspect of the present disclosure provides an image sensor, an electronic device including the image sensor, and a method of operating the same.

[0007] Additional aspects will be disclosed in part in the description that follows, and in part will be obvious from the description or may be learned by example of the embodiments presented.

[0008] According to one aspect of the present disclosure, an electronic device is provided. The electronic device may include a camera module including at least one lens, an image sensor configured to detect light received through the at least one lens and output a signal, a memory storing one or more computer programs, and one or more processors communicatively coupled to the camera module and the memory. The image sensor may include a first pixel group including a first microlens and a second pixel group including a second microlens. The first pixel group may include a first unit pixel including a first photosensitive element, a second photosensitive element, and a third photosensitive element. The first photosensitive element may be arranged to receive at least a portion of light passing through the first microlens. The second photosensitive element may be arranged in a first direction with respect to the first photosensitive element. The third photosensitive element may be arranged in a second direction different from the first direction with respect to the first photosensitive element. The second pixel group may include a second unit pixel including a fourth photosensitive element, a fifth photosensitive element, and a sixth photosensitive element. The fourth photosensitive element may be arranged to receive at least a portion of light passing through the second microlens. The fifth photosensitive element may be arranged in the first direction with respect to the fourth photosensitive element. The sixth photosensitive element may be arranged in the second direction with respect to the fourth photosensitive element. The one or more computer programs may include instructions that are individually or collectively executed by the at least one processor to control the image sensor such that the electronic device reads out a signal from the first photosensitive element and the fourth photosensitive element based on a first operation signal.The one or more computer programs may include instructions that are individually or collectively executed by the at least one processor to control the image sensor so that the electronic device reads out signals from the second photosensitive element and the sixth photosensitive element based on a second operation signal. The one or more computer programs may include instructions that are individually or collectively executed by the at least one processor to control the image sensor so that the electronic device reads out signals from the third photosensitive element and the fifth photosensitive element based on a third operation signal.

[0009] According to one aspect of the present disclosure, a method of operating an electronic device including an image sensor including a first pixel group including a first photosensitive element, a second photosensitive element, and a third photosensitive element, and a second pixel group including a fourth photosensitive element, a fifth photosensitive element, and a sixth photosensitive element is provided. The method includes an operation of the electronic device reading out a signal from the first photosensitive element and the fourth photosensitive element based on a first operation signal. The method includes an operation of the electronic device reading out a signal from the second photosensitive element and the sixth photosensitive element based on a second operation signal. The method includes an operation of the electronic device reading out a signal from the third photosensitive element and the fifth photosensitive element based on a third operation signal. The first photosensitive element is arranged to receive light passing through a first microlens. The second photosensitive element is arranged in a first direction with respect to the first photosensitive element. The third photosensitive element is arranged in a second direction different from the first direction with respect to the first photosensitive element. The fourth photosensitive element is arranged to receive light passing through the second micro lens. The fifth photosensitive element is arranged in the first direction with respect to the fourth photosensitive element. The sixth photosensitive element is arranged in the second direction with respect to the fourth photosensitive element.

[0010] According to one aspect of the present disclosure, an image sensor includes a first pixel group and a second pixel group. The first pixel group includes a first unit pixel including a first individual pixel, a second individual pixel, and a third individual pixel corresponding to a first micro lens. The second individual pixel is arranged in a first direction with respect to the first individual pixel. The third individual pixel is arranged in a second direction different from the first direction with respect to the first individual pixel. The second pixel group includes a first unit pixel including a fourth individual pixel, a fifth individual pixel, and a sixth individual pixel corresponding to the second micro lens. The fifth individual pixel is arranged in the first direction with respect to the fourth individual pixel. The sixth individual pixel is arranged in the second direction with respect to the fourth individual pixel. The first individual pixel and the fourth individual pixel are connected to a first signal line transmitting a first operation signal. The second individual pixel and the sixth individual pixel are connected to a second signal line transmitting a second operation signal. The third individual pixel and the fifth individual pixel are connected to a third signal line that transmits a third operation signal.

[0011] According to one aspect of the present disclosure, a computer-readable non-transitory storage medium is provided storing one or more computer programs including computer-executable instructions that are individually or collectively executed by one or more processors of an electronic device to cause the electronic device to perform operations, wherein the electronic device includes an image sensor including a first pixel group including a first photosensitive element, a second photosensitive element, and a third photosensitive element, and a second pixel group including a fourth photosensitive element, a fifth photosensitive element, and a sixth photosensitive element. The method includes an operation of reading out a signal from the first photosensitive element and the fourth photosensitive element based on a first operation signal by the electronic device, an operation of reading out a signal from the second photosensitive element and the sixth photosensitive element based on a second operation signal by the electronic device, and an operation of reading out a signal from the third photosensitive element and the fifth photosensitive element based on a third operation signal by the electronic device, wherein the first photosensitive element is arranged to receive light passing through a first micro lens, the second photosensitive element is arranged in a first direction with respect to the first photosensitive element, the third photosensitive element is arranged in a second direction different from the first direction with respect to the first photosensitive element, the fourth photosensitive element is arranged to receive light passing through a second micro lens, the fifth photosensitive element is arranged in the first direction with respect to the fourth photosensitive element, and the sixth photosensitive element is arranged in the second direction with respect to the fourth photosensitive element.

[0012] Other aspects, advantages and salient features will become apparent to those skilled in the art from the following detailed description of various embodiments of the present invention taken in conjunction with the accompanying drawings.

[0013] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0014] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0015] FIG. 2 is a block diagram illustrating a camera module according to various embodiments of the present disclosure.

[0016] FIG. 3 is a diagram conceptually illustrating the configuration of an image sensor according to one embodiment of the present disclosure.

[0017] FIG. 4 is a diagram illustrating an example of a first region in which a first pixel group is arranged and a second region in which a second pixel group is arranged within a unit region within an image sensor according to one embodiment of the present disclosure.

[0018] FIG. 5 is a diagram illustrating a connection relationship between individual pixels of a first pixel group and individual pixels of a second pixel group and signal lines according to one embodiment of the present disclosure.

[0019] FIG. 6 is a circuit diagram illustrating a circuit constituting at least a portion of a first unit pixel of a first pixel group and a circuit constituting at least a portion of a second unit pixel of a second pixel group according to one embodiment of the present disclosure.

[0020] FIG. 7 is a diagram illustrating a timeline and operation of pixels in a signal section for operation of pixels included in an image sensor according to one embodiment of the present disclosure.

[0021] FIG. 8 is a drawing illustrating an example of a first pattern included in an image sensor according to one embodiment of the present disclosure.

[0022] FIG. 9 is a diagram illustrating an example of a second pattern included in an image sensor according to one embodiment of the present disclosure.

[0023] FIG. 10 illustrates an example of how a first pixel group and a second pixel group are arranged within an image sensor according to one embodiment of the present disclosure.

[0024] FIG. 11 illustrates an example of how a first pixel group and a second pixel group are arranged within an image sensor according to one embodiment of the present disclosure.

[0025] FIG. 12 illustrates an example of how a first pixel group and a second pixel group are arranged within an image sensor according to one embodiment of the present disclosure.

[0026] FIG. 13 illustrates an example of how a first pixel group and a second pixel group are arranged within an image sensor according to one embodiment of the present disclosure.

[0027] FIG. 14 illustrates an example of how a first pixel group and a second pixel group are arranged within an image sensor according to one embodiment of the present disclosure.

[0028] FIG. 15 is a flowchart illustrating a process for an electronic device to obtain phase difference information according to one embodiment of the present disclosure.

[0029] FIG. 16 is a flowchart illustrating a process in which an electronic device according to one embodiment of the present disclosure acquires phase difference information by changing a phase difference acquisition direction based on a specified condition.

[0030] FIG. 17 is a diagram illustrating the direction of phase difference information included in a frame before and after changing the phase difference acquisition direction of an electronic device according to one embodiment of the present disclosure.

[0031] FIG. 18 is a block diagram illustrating a structure for outputting information from an image sensor according to one embodiment of the present disclosure.

[0032] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. While it includes numerous specific details to facilitate this understanding, these are to be considered merely exemplary. Accordingly, those skilled in the art will recognize that various modifications and variations can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and structures may be omitted for clarity and brevity.

[0033] The terms and words used in the following description and claims are not limited to their bibliographic meanings and may be used by the inventors solely to facilitate a clear and consistent understanding of the present disclosure. Accordingly, it will be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0034] In one embodiment, when a focus is to be detected according to a phase difference focus detection method, an image sensor capable of phase detection, an electronic device including the image sensor, and an operating method thereof may be provided. As the image sensor outputs information having a large number of pixels, an image having a high resolution can be obtained. However, since the amount of output from the image sensor is large, high power consumption may be required. Accordingly, when the number of ADC (analog to digital converter) operations increases for phase detection, high power consumption may be required. According to one embodiment, the image sensor, the electronic device including the image sensor, and the operating method thereof may be provided to lower the amount of output required from the image sensor while providing data for phase detection.

[0035] Additionally, as the number of ADC operations increases, the number of frames that the image sensor can output per unit time decreases, which may lower the frame rate that the image sensor can provide. According to one embodiment, an image sensor, an electronic device including the image sensor, and an operating method thereof may be provided to prevent loss of frame rate while providing data for phase detection.

[0036] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field pertaining to the present disclosure from the description of the present disclosure.

[0037] It should be understood that each block of the flowchart and the combination of flowcharts may be performed by one or more computer programs containing instructions. One or more computer programs may be stored entirely in a single memory device, or one or more computer programs may be divided into different parts stored in multiple different memory devices.

[0038] The functions or operations described in the present disclosure may be processed by a single processor or a combination of processors. A single processor or a combination of processors is a circuit that performs processing and includes an application processor (AP, for example, a central processing unit (CPU)), a communication processor (CP, for example, a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (for example, an artificial intelligence (AI) chip), a Wi-Fi chip, a near field communication (NFC) chip, a connectivity chip, a sensor controller, a touch controller, a fingerprint sensor controller, a display driver integrated circuit (DDIC), an audio codec (CODEC) chip, a universal serial bus (USB) controller, a camera controller, an image processing integrated circuit (IC), a microprocessor unit (MPU), a system on chip (SoC) IC, or a similar circuit.

[0039] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0040] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0041] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0042] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0043] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0044] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0045] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0046] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0047] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0048] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0049] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0050] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0051] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0052] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0053] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0054] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0055] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0056] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a fifth-generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196) to verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199).

[0057] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4th generation (4G) network, for example, new radio access technology (NR). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0058] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0059] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0060] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0061] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0062] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0063] The various embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding element from other corresponding elements and do not limit the corresponding elements in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0064] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0065] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0066] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0067] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0068] FIG. 2 is a block diagram (200) illustrating a camera module (180) according to various embodiments of the present disclosure.

[0069] Referring to FIG. 2, within the block diagram (200), the camera module (180) may include a lens assembly (210), a flash (220), an image sensor (230), an image stabilizer (240), a memory (250) (e.g., a buffer memory), or an image signal processor (260). The lens assembly (210) may collect light emitted from a subject that is a target of image capturing. The lens assembly (210) may include one or more lenses. According to one embodiment, the camera module (180) may include a plurality of lens assemblies (210). In this case, the camera module (180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (210) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. A lens assembly (210) may include, for example, a wide-angle lens or a telephoto lens.

[0070] The flash (220) can emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (220) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor (230) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (210) into an electrical signal. According to one embodiment, the image sensor (230) can include one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (230) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0071] The image stabilizer (240) can move at least one lens or image sensor (230) included in the lens assembly (210) in a specific direction or control the operating characteristics of the image sensor (230) (e.g., adjusting the read-out timing, etc.) in response to the movement of the camera module (180) or the electronic device (101) including the same. This allows compensating for at least some of the negative effects of the movement on the captured image. In one embodiment, the image stabilizer (240) can detect such movement of the camera module (180) or the electronic device (101) using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module (180). In one embodiment, the image stabilizer (240) can be implemented as, for example, an optical image stabilizer. The memory (250) can temporarily store at least a portion of the image acquired through the image sensor (230) for the next image processing task. For example, when image acquisition is delayed due to the shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (250), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (250) can be acquired and processed, for example, by the image signal processor (260). According to one embodiment, the memory (250) can be configured as at least a portion of the memory (130) or as a separate memory that operates independently therefrom.

[0072] The image signal processor (260) can perform one or more image processing operations on an image acquired through an image sensor (230) or an image stored in a memory (250). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (260) may perform control (e.g., exposure time control, read-out timing control, etc.) for at least one of the components included in the camera module (180) (e.g., image sensor (230)). An image processed by the image signal processor (260) may be stored back in the memory (250) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor (260) may include at least one of the processors (120). It may be configured as a separate processor that is configured as a part of the processor (120) or operates independently of the processor (120). If the image signal processor (260) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (260) may be displayed through the display module (160) as is or after undergoing additional image processing by the processor (120).

[0073] According to one embodiment, the electronic device (101) may include a plurality of camera modules (180), each having different properties or functions. In this case, for example, at least one of the plurality of camera modules (180) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (180) may be a front camera, and at least another may be a rear camera.

[0074] FIG. 3 is a diagram conceptually illustrating the configuration of an image sensor according to one embodiment of the present disclosure.

[0075] Referring to FIG. 3, the image sensor (230) may include a micro lens array (MLA) (311), a color filter array (CFA) (313), a light receiving unit (315), and a calculation unit (317).

[0076] In one embodiment, the microlens array (311) may be arranged so that a light bundle (321) that passes through the lens assembly (e.g., the lens assembly (210) of FIG. 2) and forms an image on the image sensor (230) is focused on a light-receiving element of the light-receiving unit (315). The light bundle (323) that passes through the microlens array (311) may have at least a portion of wavelengths other than a band corresponding to a specific color blocked as it passes through the color filter array (313). For example, the color filter array may be arranged at a position corresponding to a pixel of the image sensor (230). The light bundles (325) that pass through the color filter array (313) may be detected by a light-receiving element (e.g., a photodiode) of the light-receiving unit (315). The light-receiving unit (315) may include a light-receiving element that generates a charge when receiving light and converts it into an electrical signal, and a circuit that reads out the charge of the light-receiving element. A circuit may be further placed between the light receiving unit (315) and the calculation unit (317) to digitize the signal read from the light receiving unit (315) or reduce noise.

[0077] In one embodiment, the operation unit (317) can perform an operation to process electrical data (or signal) (327) output from the light receiving unit (315). The operation unit (317) can output data (329) acquired based on the operation result. The operation unit (317) can output data acquired based on the operation result. The output of the operation unit (317) can be the output of the image sensor (230).

[0078] In one embodiment, the calculation unit (317) may perform an operation to calibrate the read data as an operation to process the electrical data (327). For example, the operation performed by the calculation unit (317) may include at least one of an operation to reduce deviation between pixels due to optical characteristics or relative positions of pixels within a sensor, an operation to reduce noise generated in an analog signal, an operation to remove defects, an operation to perform remosaic, or an operation to apply to a specific application (e.g., a proximity sensor function, a timing adjustment function, a high dynamic range (HDR) tone mapping function).

[0079] In one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1)) may input operations performed by a computing unit (317) to another processor (e.g., an application processor (AP), a central processing unit (CPU), a graphic processing unit (GPU), a neural processing unit (NPU), or an image signal processor (ISP).

[0080] In Fig. 3, the number of micro lenses included in the micro lens array (311) and the number of light receiving elements of the light receiving unit (315) are illustrated as being the same, but this is not limited thereto. In one embodiment, a plurality of light receiving elements may be arranged at a position for receiving light through one micro lens.

[0081] FIG. 4 is a diagram illustrating an example of a first region in which a first pixel group is arranged and a second region in which a second pixel group is arranged within a unit region within an image sensor according to one embodiment of the present disclosure.

[0082] Referring to FIG. 4, the image sensor (230) may include one or more unit areas (400). The unit area (400) may refer to an area that becomes a unit when the image sensor (230) reads out phase difference information. In one embodiment, the image sensor (230) may output a first phase difference data value for a first direction and a second phase difference data value for a second direction for each unit area (400).

[0083] In one embodiment, a first region (410) and a second region (420) may be included within a unit region (400) of an image sensor (230). The unit region (400) may refer to a region corresponding to one unit of phase difference data output by the image sensor (230). For example, the image sensor (230) according to one embodiment may output at least one value corresponding to one unit of first phase difference data and one unit of second phase difference data from one unit region. An electronic device (e.g., the electronic device (101) of FIG. 1) may perform an auto-focus function based on at least one of the first phase difference data or the second phase difference data acquired from unit regions included in a region of interest among a plurality of unit regions (400).

[0084] In one embodiment, a first pixel group including at least one first unit pixel configured to output first phase difference data corresponding to a first direction (e.g., x-axis direction) may be arranged in a first region (410). In one embodiment, a second pixel group including at least one second unit pixel configured to output second phase difference data corresponding to a second direction (e.g., y-axis direction) may be arranged in a second region (420). In one embodiment, the image sensor (230) may be configured such that the first pixel groups arranged in the first region (410) output second phase difference data corresponding to the second direction, and the second pixel groups arranged in the second region (420) output first phase difference data corresponding to the first direction.

[0085] FIG. 5 is a diagram illustrating a connection relationship between individual pixels of a first pixel group and individual pixels of a second pixel group and signal lines (SL1, SL2, SL3, SL4) according to one embodiment of the present disclosure.

[0086] In the present disclosure, a unit pixel included in a pixel group of an image sensor (e.g., the image sensor (230) of FIGS. 2, 3, and 4) may include individual pixels corresponding to micro lenses. The individual pixels may be arranged to receive at least a portion of light passing through the micro lenses. For example, a unit pixel may include a plurality of photosensitive elements arranged in an N x N array to correspond to one micro lens. N may be 2 or more. However, the arrangement of the photosensitive elements is not limited thereto.

[0087] Referring to FIG. 5, a first unit pixel (501) included in a first pixel group may include a first individual pixel, a second individual pixel, and a third individual pixel corresponding to a first micro lens (511). The first unit pixel (501) may include three or more photosensitive elements constituting the first individual pixel, the second individual pixel, and the third individual pixel. In one embodiment, a second unit pixel (502) included in a second pixel group may include a fourth individual pixel, a fifth individual pixel, and a sixth individual pixel corresponding to the second micro lens (512). The second unit pixel (502) may include three or more photosensitive elements constituting the fourth individual pixel, the fifth individual pixel, and the sixth individual pixel.

[0088] In one embodiment, an individual pixel may include a photosensitive element capable of detecting light and outputting a signal. For example, the photosensitive element may include a photodiode, a pinned-photodiode, a phototransistor, or a photogate. However, the photosensitive element is not limited to the examples described above. A first individual pixel may include a first photosensitive element (521) arranged to receive at least a portion of light passing through a first microlens (511). A second individual pixel may include a second photosensitive element (522) arranged in a first direction (e.g., in the +x-axis direction) with respect to the first photosensitive element (521). A third individual pixel may include a third photosensitive element (523) arranged in a second direction (e.g., in the -y-axis direction) with respect to the first photosensitive element (521). The fourth individual pixel may include a fourth photosensitive element (524) arranged to receive at least a portion of the light passing through the second microlens (512). The fifth individual pixel may include a fifth photosensitive element (525) arranged in a first direction (e.g., in the +x-axis direction) with respect to the fourth photosensitive element (524). The sixth individual pixel may include a sixth photosensitive element (526) arranged in a second direction (e.g., in the -y-axis direction) with respect to the fourth photosensitive element (524).

[0089] In one embodiment, the first individual pixel and the fourth individual pixel may be connected to a first signal line (SL1) transmitting a first operation signal. The image sensor according to one embodiment may be configured to read signals from the first photosensitive element (521) and the fourth photosensitive element (524) based on the first operation signal transmitted through the first signal line (SL1). In one embodiment, the second individual pixel and the sixth individual pixel may be connected to a second signal line (SL2) transmitting a second operation signal. The image sensor according to one embodiment may be configured to read signals from the second photosensitive element (522) and the sixth photosensitive element (526) based on the second operation signal transmitted through the second signal line (SL2). In one embodiment, the third individual pixel and the fifth individual pixel may be connected to a third signal line (SL3). An image sensor according to one embodiment may be configured to read signals from a third photosensitive element (523) and a fifth photosensitive element (525) based on a third operation signal transmitted through a third signal line (SL3).

[0090] In one embodiment, the first unit pixel (501) may include a seventh individual pixel. The second unit pixel (502) may include an eighth individual pixel. The seventh individual pixel may further include a seventh photosensitive element (527) disposed in a second direction (e.g., -y direction) with respect to the second photosensitive element (522) and disposed in a first direction (e.g., +x direction) with respect to the third photosensitive element (523). The eighth individual pixel may further include an eighth photosensitive element (528) disposed in a second direction (e.g., -y direction) with respect to the fifth photosensitive element (525) and disposed in a first direction (e.g., +x direction) with respect to the sixth photosensitive element (526). The seventh individual pixel and the eighth individual pixel may be connected to a fourth signal line (SL4). An image sensor according to one embodiment may be configured to read signals from the seventh photosensitive element (527) and the eighth photosensitive element (528) based on a fourth operation signal transmitted through the fourth signal line (SL4).

[0091] FIG. 6 is a circuit diagram illustrating a circuit constituting at least a portion of a first unit pixel of a first pixel group and a circuit constituting at least a portion of a second unit pixel of a second pixel group according to one embodiment of the present disclosure.

[0092] In one embodiment, an image sensor (e.g., the image sensor (230) of FIGS. 2 to 4) may have a structure that reads out the pixel value of at least one individual pixel through a floating diffusion node. FIG. 6 illustrates a structure in which four individual pixels within a unit pixel share one floating diffusion node. However, the present invention is not limited thereto. For example, the image sensor may be configured to have a structure in which a greater number of individual pixels (e.g., eight individual pixels included in two unit pixels) share one floating diffusion node. Although FIG. 6 illustrates a structure in which one unit pixel includes four individual pixels (four photosensitive elements), the number of individual pixels included in a unit pixel is not limited thereto. For example, one unit pixel may include nine individual pixels.

[0093] Referring to FIG. 6, a first unit pixel (501) may include a first photosensitive element (521), a second photosensitive element (522), and a third photosensitive element (523). The first unit pixel (501) may include a first switch (621) connected between the first photosensitive element (521) and a first floating diffusion node (611). The first unit pixel (501) may include a second switch (622) connected between the second photosensitive element (522) and the first floating diffusion node (611). The first unit pixel (501) may include a third switch (623) connected between the third photosensitive element (523) and the first floating diffusion node (611).

[0094] In one embodiment, the first switch (621) can transfer the charge generated by the first photosensitive element (521) to the first floating diffusion node (611) based on a first operation signal transmitted through the first signal line (SL1). The second switch (622) can transfer the charge generated in the second photosensitive element (522) to the first floating diffusion node (611) based on a second operation signal transmitted through the second signal line (SL2). The third switch (623) can transfer the charge generated in the third photosensitive element (523) to the first floating diffusion node (611) based on a third operation signal transmitted through the third signal line (SL3). A voltage according to the charge transferred to the first floating diffusion node (611) can be read out based on a selector signal (SEL) that reads out a signal of the corresponding line.

[0095] In one embodiment, when the first floating diffusion node (611) of the first unit pixel (501) is connected to the drain voltage (VDD) by the reset signal (RG), the charge accumulated in the first floating diffusion node (611) can be reset. The photosensitive elements can also be reset by the reset signal (RG). For example, referring to FIG. 7, each photosensitive element (e.g., the first photosensitive element (521), the second photosensitive element (522), the third photosensitive element (523), and the seventh photosensitive element (527)) can also be reset by the reset signal (RG) at time t1.

[0096] In one embodiment, the second unit pixel (502) may include a fourth photosensitive element (524), a fifth photosensitive element (525), and a sixth photosensitive element (526). The second unit pixel (502) may include a fourth switch (624) connected between the fourth photosensitive element (524) and the second floating diffusion node (612). The second unit pixel (502) may include a fifth switch (625) connected between the fifth photosensitive element (525) and the second floating diffusion node (612). The second unit pixel (502) may include a sixth switch (626) connected between the sixth photosensitive element (526) and the second floating diffusion node (612).

[0097] In one embodiment, the fourth switch (624) can transfer the charge generated by the fourth photosensitive element (524) to the second floating diffusion node (612) based on a first operation signal transmitted through the first signal line (SL1). The fifth switch (625) can transfer the charge generated by the fifth photosensitive element (525) to the second floating diffusion node (612) based on a third operation signal transmitted through the third signal line (SL3). The sixth switch (626) can transfer the charge generated by the sixth photosensitive element (526) to the second floating diffusion node (612) based on a second operation signal transmitted through the second signal line (SL2).

[0098] In one embodiment, the first unit pixel (501) may further include a seventh photosensitive element (527). The first unit pixel (501) may further include a seventh switch (627) connected between the seventh photosensitive element (527) and the first floating diffusion node (611). The second unit pixel (502) may further include an eighth photosensitive element (528). The second unit pixel (502) may further include an eighth switch (628) connected between the eighth photosensitive element (528) and the second floating diffusion node (612). The seventh switch (627) and the eighth switch (628) may be configured to transmit a signal generated in the photosensitive element to the floating diffusion node in response to a fourth operation signal transmitted through the fourth signal line (SL4). The seventh switch (627) may be configured to transfer the charge generated by the seventh photosensitive element (527) to the first floating diffusion node (611) based on the fourth operation signal. The eighth switch (628) may be configured to transfer the charge generated by the eighth photosensitive element (528) to the second floating diffusion node (612) based on the fourth operation signal. A voltage according to the charge transferred to the second floating diffusion node (612) may be read out based on a selector signal (SEL) that reads out a signal of the corresponding line.

[0099] In one embodiment, when the second floating diffusion node (612) of the second unit pixel (502) is connected to the drain voltage (VDD) by the reset signal (RG), the charge accumulated in the second floating diffusion node (612) can be reset.

[0100] In one embodiment, each of the switches (621, 622, 623, 624, 625, 626, 627, 628) illustrated in FIG. 6 may include a component configured to close based on an actuation signal. For example, each of the switches (621, 622, 623, 624, 625, 626, 627, 628) may include at least one transistor.

[0101] FIG. 7 is a diagram illustrating a timeline and operation of pixels in a signal section for signals for operation of pixels included in an image sensor (e.g., image sensor (230) of FIGS. 2 to 4) according to one embodiment of the present disclosure.

[0102] FIG. 7 illustrates an example of an operation for explaining the operation of an image sensor according to one embodiment, and is not necessarily limited to reading the output values ​​of pixels according to the timeline of the signal illustrated in FIG. 7.

[0103] Referring to FIG. 7, an image sensor according to one embodiment (e.g., the image sensor (230) of FIGS. 2 to 4) can reset pixels based on signals for performing a reset operation at a first time point (t1). While the reset signal (RG) is turned on, charges accumulated in floating diffusion nodes (e.g., the first floating diffusion node (611) and the second floating diffusion node (612) of FIG. 6) can be removed. While the pixels are reset, the image sensor can perform an exposure operation in which each pixel is exposed to light during an exposure period (700) including the second time point (t2).

[0104] In one embodiment, during a first time period (P1) after the exposure period (700) (or after the third time point (t3)), the image sensor can read a signal (or phase data) based on a first operation signal transmitted through a first signal line (SL1) and a third operation signal transmitted through a third signal line (SL3). In the first time period (P1), the image sensor can convert a first voltage detected when a first charge generated by a first photosensitive element (521) (a first individual pixel) from a first unit pixel included in a first pixel group and a third charge generated by a third photosensitive element (523) (a third individual pixel) have moved to a first floating diffusion node into a first digital value. In the first time interval (P1), the image sensor can convert the second voltage detected in the state where the fourth charge generated by the fourth photosensitive element (524) (the fourth individual pixel) from the second unit pixel included in the second pixel group and the fifth charge generated by the fifth photosensitive element (525) (the fifth individual pixel) have moved to the second floating diffusion node into a second digital value.

[0105] In one embodiment, during a second time interval (P2) after a fourth time point (t4), the image sensor can read a signal (or phase data) based on a second operation signal transmitted through a second signal line (SL2) and a fourth operation signal transmitted through a fourth signal line (SL4). In the second time interval (P2), the image sensor can convert a third voltage detected in a state where a second charge generated by a second photosensitive element (522) (a second individual pixel) from a first unit pixel included in a first pixel group and a seventh charge generated by a seventh photosensitive element (527) (a seventh individual pixel) have moved to the first floating diffusion node into a third digital value (ADC (analog to digital converting)). In the second time interval (P2), the image sensor can convert the fourth voltage detected in the state where the sixth charge generated by the sixth photosensitive element (526) (the sixth individual pixel) from the second unit pixel included in the second pixel group and the eighth charge generated by the eighth photosensitive element (528) (the eighth individual pixel) have moved to the second floating diffusion node into a fourth digital value.

[0106] In one embodiment, the first voltage and the third voltage may be voltages detected through a source follower from a voltage of a first floating diffusion node (611) included in a first unit pixel (e.g., the first unit pixel (501) of FIG. 5). The second voltage and the fourth voltage may be voltages detected through a source follower from a voltage of a second floating diffusion node (612) included in a second unit pixel (e.g., the second unit pixel (502) of FIG. 5).

[0107] In one embodiment, an electronic device including an image sensor (e.g., the electronic device 101 of FIG. 1) can obtain first phase data based on a first digital value. The electronic device can obtain second phase data based on a difference between a third digital value and the first digital value. The electronic device can obtain first phase difference data for a first direction (e.g., a horizontal direction) based on a correlation operation for the first phase data and the second phase data. The electronic device including an image sensor can obtain third phase data based on a second digital value. The electronic device can obtain fourth phase data based on a difference between a fourth digital value and the second digital value. The electronic device can obtain second phase difference data for a second direction (e.g., a vertical direction) based on a correlation operation for the third phase data and the fourth phase data. Therefore, the electronic device can obtain the first phase difference data and the second phase difference data together without performing a read operation for obtaining the first phase difference data and a read operation for obtaining the second phase difference data separately.

[0108] FIG. 8 is a drawing illustrating an example of a first pattern (800) included in an image sensor (e.g., the image sensor ((230) of FIGS. 2 to 4)) according to one embodiment of the present disclosure.

[0109] Referring to FIG. 8, the first pattern (800) may include a color filter array (e.g., the color filter array (313) of FIG. 3) configured with a red-green-green-blue (RGGB) pattern. One micro lens (811) (e.g., the micro lens array (311) of FIG. 3) may be arranged for each color channel of the color filter array. Four light-receiving elements (821, 822, 823, 824) may be arranged on the back of the micro lens (811) to receive light collected by passing through the micro lens (811). The image sensor (230) may configure a unit pixel (801) in which each of the light-receiving elements (821, 822, 823, 824) is included as an individual pixel. As illustrated in FIG. 8, the first pattern (800) in which one micro lens and four photodetectors are arranged in each channel of the color filter array may be referred to as a 4PD (photo diode) structure.

[0110] In one embodiment, the image sensor (230) may include a pixel array in which a first pattern (800) is repeated. However, the arrangement structure of pixels included in the pixel array constituting the image sensor (230) and the color configuration of the color filter are not limited to the first pattern (800).

[0111] FIG. 9 is a diagram illustrating an example of a second pattern included in an image sensor according to one embodiment of the present disclosure.

[0112] Referring to FIG. 9, in the second pattern (900), four micro lenses (e.g., the micro lens array (311) of FIG. 3) may be arranged for each color channel of the RGGB pattern included in the color filter array (e.g., the color filter array (313) of FIG. 3) included in the image sensor (230) of the electronic device (e.g., the electronic device (101) of FIG. 1). Four light-receiving elements arranged to receive light may be arranged on the back of each micro lens.

[0113] In one embodiment, the image sensor may be configured such that eight individual pixels (901) share a single floating diffusion node (910). Referring to FIG. 9, among the micro lenses arranged in a single color channel, light-receiving elements arranged at positions corresponding to the first micro lens (911) or the second micro lens (912) may be configured to share the floating diffusion node (910). The image sensor may include a first photosensitive element (921), a second photosensitive element (922), a third photosensitive element (923), and a seventh photosensitive element (927) arranged to receive light focused through the first micro lens (911). The image sensor (230) may include a fourth photosensitive element (924), a fifth photosensitive element (925), a sixth photosensitive element (926), and an eighth photosensitive element (928) arranged to receive light focused through the second micro lens (912).

[0114] In one embodiment, the image sensor may include a first switch (931) connected between a first photosensitive element (921) and a floating diffusion node (910). The image sensor may include a second switch (932) connected between a second photosensitive element (922) and the floating diffusion node (910). The image sensor may include a third switch (933) connected between a third photosensitive element (923) and the floating diffusion node (910). The image sensor may include a fourth switch (934) connected between a fourth photosensitive element (924) and the floating diffusion node (910). The image sensor may include a fifth switch (935) connected between a fifth photosensitive element (925) and the floating diffusion node (910). The image sensor may include a sixth switch (936) connected between a sixth photosensitive element (926) and the floating diffusion node (910). The image sensor may include a seventh switch (937) connected between the seventh photosensitive element (927) and the floating diffusion node (910). The image sensor may include an eighth switch (938) connected between the eighth photosensitive element (928) and the floating diffusion node (910).

[0115] In one embodiment, the image sensor may include a structure in which the second pattern (900) is repeated. In one embodiment in which the second pattern (900) is repeatedly arranged, if the pixels included in the second pattern (900) are pixels belonging to a first pixel group (e.g., first unit pixels), the first switch (931) and the fourth switch (934) may be connected to a first signal line transmitting a first operation signal (e.g., the first signal line (SL1) of FIG. 5). If the pixels included in the second pattern (900) are pixels belonging to a first pixel group (e.g., first unit pixels), the second switch (932) and the fifth switch (935) may be connected to a second signal line (e.g., the second signal line (SL2) of FIG. 5). If the pixels included in the second pattern (900) are pixels belonging to the first pixel group (e.g., first unit pixels), the third switch (933) and the sixth switch (936) may be connected to a third signal line (e.g., the third signal line (SL3) of FIG. 5). If the pixels included in the second pattern (900) are pixels belonging to the first pixel group (e.g., first unit pixels), the seventh switch (937) and the eighth switch (938) may be connected to a fourth signal line (e.g., the fourth signal line (SL4) of FIG. 5). If the pixels included in the second pattern (900) are pixels belonging to the second pixel group (e.g., second unit pixels), the first switch (931) and the fourth switch (934) may be connected to the first signal line. If the pixels included in the second pattern (900) are pixels belonging to the second pixel group (e.g., second unit pixels), the second switch (932) and the fifth switch (935) may be connected to the third signal line. If the pixels included in the second pattern (900) are pixels belonging to the second pixel group (e.g., second unit pixels), the third switch (933) and the sixth switch (936) may be connected to the second signal line.If the pixels included in the second pattern (900) are pixels belonging to the second pixel group (e.g., second unit pixels), the seventh switch (937) and the eighth switch (938) may be connected to the fourth signal line. Since the signal lines of some individual pixels included in the second pixel group are cross-connected differently from the case of the first pixel group, phase difference data in a different direction from that detected in the first pixel group may be detected from the pixels included in the second pixel group. In one embodiment, if the switch includes a transistor, the gate of the transistor may be connected to the signal line.

[0116] FIG. 10 illustrates an example of how a first pixel group and a second pixel group are arranged within an image sensor (e.g., the image sensor (230) of FIGS. 2 to 4) according to one embodiment of the present disclosure.

[0117] Referring to FIG. 10, the image sensor may include a first region (1021) in which unit pixels of a first pixel group (e.g., the first unit pixel (501) of FIG. 5) are arranged for each unit region (1010) and a second region (1023) in which unit pixels of a second pixel group (e.g., the second unit pixel (502) of FIG. 5) are arranged. The image sensor may obtain a value corresponding to a unit of phase difference data from the unit region (1010). The image sensor may obtain first phase difference data related to a phase difference in a first direction from a first pixel group of a first region (1021) of the unit region (1010), and may obtain second phase difference data related to a phase difference in a second direction from a second pixel group of a second region (1023).

[0118] In one embodiment, the image sensor may be arranged in a repeating manner with unit areas (1010) including a first area (1021) and a second area (1023). However, this is not limited thereto. The first pixel group and the second pixel group may be arranged in different shapes within a plurality of unit areas included in the image sensor.

[0119] Referring to FIG. 10, the second region (1023) may be configured in a form in which unit pixels included in the second pixel group are grouped together. However, this is not limited thereto. The unit pixels included in the second pixel group may also be arranged in a dispersed manner.

[0120] FIG. 11 illustrates an example of how a first pixel group and a second pixel group are arranged within an image sensor according to one embodiment of the present disclosure.

[0121] Referring to FIG. 11, unit pixels within a pixel group of an image sensor may be arranged in a distributed manner. Referring to FIG. 11, a first unit region (1111) may include a second region (1123) in which unit pixels of a second pixel group (e.g., the second unit pixel (502) of FIG. 5) are arranged. Unit pixels of the first pixel group (e.g., the first unit pixel (501) of FIG. 5) may be arranged in a remaining region excluding the second region (1123) within the first unit region (1111). The region in which the unit pixels of the first pixel group are arranged may be referred to as a first region (1121).

[0122] According to one embodiment, the positions at which the unit pixels of the second pixel group are arranged within a plurality of unit regions may be different from each other. Referring to FIG. 11, the positions of the second region (1123) arranged within the first unit region (1111) and the third region (1124) arranged within the second unit region (1112) may be different from each other. By configuring the positions of the second region (1123) arranged within the first unit region (1111) and the third region (1124) arranged within the second unit region (1112) to be different from each other, the influence of fixed pattern noise on the readout results of the image sensor can be reduced.

[0123] In one embodiment, even if the arrangement of the unit pixels is distributed, the image sensor can be configured such that the ratio of the color channels corresponding to the unit pixels included in each pixel group is maintained as the ratio of the color channels included in the pattern in which the image sensor is configured. For example, if the image sensor is configured based on the pattern (800) illustrated in FIG. 8, the ratio of the number of pixels of the red channel, the number of pixels of the green channel, and the number of pixels of the blue channel among the unit pixels included in the second pixel group can be 1:2:1. Even if the image sensor according to one embodiment has a different arrangement structure (e.g., the arrangement structure illustrated in FIG. 10, FIG. 12, FIG. 13, or FIG. 14) than the arrangement structure of the unit pixels illustrated in FIG. 11, the ratio of the color channels of each pixel group of the image sensor can be configured such that it is maintained.

[0124] FIG. 12 illustrates an example of how a first pixel group and a second pixel group are arranged within an image sensor according to one embodiment of the present disclosure.

[0125] In one embodiment, the second pixel group may be arranged in a central portion of the unit area. Referring to FIG. 12, unit pixels of the second pixel group (e.g., the second unit pixel (502) of FIG. 5) may be arranged in a central area (e.g., the second pixel group (1223)) within the unit area (1210). Unit pixels of the first pixel group (e.g., the first unit pixel (501) of FIG. 5) may be arranged in the remaining area (e.g., the first pixel group (1221)) within the unit area (1210). By locating the second pixel group in the central area (e.g., the second pixel group (1223)) within the unit area (1210), an offset between the phase of the first pixel group (1221) and the phase of the second pixel group (1223) can be eliminated.

[0126] FIG. 13 illustrates an example of how a first pixel group and a second pixel group are arranged within an image sensor according to one embodiment of the present disclosure.

[0127] According to one embodiment, an image sensor (e.g., an image sensor (230) of FIGS. 2 to 4) may have a connection structure with the same signal lines (e.g., signal lines (SL1, SL2, SL3, SL4) of FIG. 5) in which unit pixels arranged in the same row or column are connected to the same signal lines for reasons related to the manufacturing process of the image sensor (e.g., an image sensor (230) of FIGS. 2 to 4) or for reasons related to the structure of the layout constituting the image sensor (e.g., an image sensor (230) of FIGS. 2 to 4). In a unit area, unit pixels belonging to a first pixel group (e.g., a first unit pixel (501) of FIG. 5) may be arranged in rows or columns of some of the unit pixels included in the image sensor. In a unit area, unit pixels belonging to a second pixel group (e.g., a second unit pixel (502) of FIG. 5) may be arranged in rows or columns of the remaining unit pixels.

[0128] Referring to FIG. 13, unit pixels arranged in a first column (1321) of unit pixels within a unit area (1310) of an image sensor according to an example embodiment may be unit pixels belonging to a first pixel group. Unit pixels arranged in a second column (1323) of unit pixels within the unit area (1310) may be unit pixels belonging to a second pixel group.

[0129] FIG. 14 illustrates an example of how a first pixel group and a second pixel group are arranged within an image sensor according to one embodiment of the present disclosure.

[0130] In one embodiment, the positions where the first pixel group and the second pixel group are arranged may be configured in various ways. Referring to FIG. 14, unit pixels belonging to the first pixel group (e.g., the first unit pixel (501) of FIG. 5) may be arranged in the right area (1421) of the unit area (1410). Unit pixels belonging to the second pixel group (e.g., the second unit pixel (502) of FIG. 5) may be arranged in the left area (1423) of the unit area (1410).

[0131] In one embodiment, the size of the area where the first pixel group is arranged and the size of the area where the second pixel group is arranged may be different from each other. For example, the number of unit pixels belonging to the first pixel group may be greater than the number of unit pixels belonging to the second pixel group. An image sensor according to one embodiment (e.g., the image sensor (230) of FIGS. 2 to 4) may be configured such that phase difference data in a direction with higher importance among the first direction and the second direction is acquired from a greater number of unit pixels than phase difference data in the other direction. For example, the image sensor may be configured such that the number of unit pixels that operate to acquire horizontal phase difference data (e.g., the first unit pixel (501) of FIG. 5) is greater than the number of unit pixels that operate to acquire vertical phase difference data (e.g., the second unit pixel (502) of FIG. 5).

[0132] FIG. 15 is a flowchart (1500) illustrating a process for obtaining phase difference information by an electronic device (e.g., the electronic device (101) of FIG. 1) according to one embodiment of the present disclosure.

[0133] In the present disclosure, the operation of the electronic device can be understood as being performed by a processor (e.g., the processor (120) of FIG. 1) executing instructions stored in a memory (e.g., the memory (130) of FIG. 1) to perform operations or control components of the electronic device.

[0134] Referring to FIG. 15, in operation 1510, the electronic device may read a signal from a photosensitive element of an image sensor (e.g., a first photosensitive element (521) of a first unit pixel (501) of FIG. 5, a fourth photosensitive element (524) of a second unit pixel (502) of FIG. 5) based on a first operation signal (e.g., a signal transmitted through a first signal line (SL1) of FIG. 5). According to one embodiment, in parallel with operation 1510, the electronic device may read a signal from a photosensitive element (e.g., a third photosensitive element (523) of a first unit pixel (501) of FIG. 5, a fifth photosensitive element (525) of a second unit pixel (502) of FIG. 5) based on a third operation signal (e.g., a signal transmitted through a third signal line (SL3) of FIG. 5) in operation 1520. The electronic device can read out a sum value of the signals of individual pixels read out based on the first operation signal and individual pixels read out based on the third operation signal. For example, referring to FIG. 5, the electronic device can obtain a left pixel value (LY) from the first unit pixel (501) and an upper pixel value (TY) from the second unit pixel (502) by performing analog-to-digital conversion (ADC) on the signals read out in operations 1510 and 1520.

[0135] According to one embodiment, in operation 1530, the electronic device may read a signal from a photosensitive element of the image sensor (e.g., the second photosensitive element (522) of the first unit pixel (501) of FIG. 5, the sixth photosensitive element (526) of the second unit pixel (502) of FIG. 5) based on a second operation signal (e.g., a signal transmitted through the second signal line (SL2) of FIG. 5). In one embodiment, when the unit pixel includes four individual pixels (photosensitive elements) arranged in a 2 x 2 array, the electronic device may further perform an operation of reading a signal from a photosensitive element of the image sensor (e.g., the seventh photosensitive element (527) of the first unit pixel (501) of FIG. 5, the eighth photosensitive element (528) of the second unit pixel (502) of FIG. 5) based on a fourth operation signal (e.g., a signal transmitted through the fourth signal line (SL4) of FIG. 5) together with operation 1530. The electronic device can read out a sum of the signals of individual pixels read out based on the second operation signal and individual pixels read out based on the fourth operation signal in operation 1530. For example, referring to FIG. 5, the electronic device can obtain a right pixel value (RY) from the first unit pixel (501) and a bottom pixel value (BY) from the second unit pixel (502) by performing an ADC on the signal read out in operation 1530.

[0136] According to one embodiment, in operation 1540, the electronic device may obtain phase difference information from the obtained information. The obtained information may include, for example, information obtained by performing operations 1510, 1520, and 1530. The obtained information may include, for example, at least one of a left pixel value (LY), an upper pixel value (TY), a right pixel value (RY), or a lower pixel value (BY). For example, the electronic device may perform a correlation operation based on the obtained information to obtain first phase difference data for a first direction and second phase difference data for a second direction.

[0137] FIG. 16 is a flowchart illustrating a process in which an electronic device (e.g., the electronic device (101) of FIG. 1) acquires phase difference information by changing a phase difference acquisition direction based on a specified condition according to one embodiment of the present disclosure.

[0138] Referring to FIG. 16, in a method (1600), in operation 1610, an electronic device may determine whether a specified condition is satisfied. For example, the electronic device may compare the reliability (or importance) of first phase difference information with the reliability (or importance) of second phase difference information. The first phase difference information may include information about a phase difference in a first direction. The second phase difference information may include information about a phase difference in a second direction different from the first direction. For example, the electronic device may determine a reliability (or importance) value for at least one of a left pixel value (LY), an upper pixel value (TY), a right pixel value (RY), or a lower pixel value (BY) for a region of interest. The region of interest may refer to a region for focusing by performing AF. In one embodiment, the electronic device may also determine information having a higher importance among the first phase difference information and the second phase difference information based on a posture in which the electronic device is placed. For example, the electronic device may determine phase difference information of a direction with high importance based on whether the first direction (e.g., x-axis direction) or the second direction (e.g., y-axis direction) of the image sensor (230) of FIG. 4 is horizontally or vertically arranged with respect to the ground. The electronic device may obtain information about the attitude by using a sensor (e.g., a gyro sensor or an acceleration sensor) for detecting the attitude of the electronic device.

[0139] In one embodiment, when the reliability (or importance) value for the first phase difference information is greater than or equal to the reliability (or importance) value for the second phase difference information, the electronic device may perform operation 1620 of obtaining phase difference information. For example, referring to FIG. 5, the first operation signal (SL1) and the third operation signal (SL3) may be transmitted together so that the left pixel value (LY) may be read from the first unit pixel (501) and the upper pixel value (TY) may be read from the second unit pixel (502). For example, the second operation signal (SL2) and the fourth operation signal (SL4) may be transmitted together so that the right pixel value (RY) may be read from the first unit pixel (501) and the lower pixel value (BT) may be read from the second unit pixel (502). For example, the electronic device may perform an operation of obtaining phase difference information based on the timeline illustrated in FIG. 7. In operation 1620, the number of unit pixels that read out a signal for obtaining first phase difference information within an image sensor of an electronic device (e.g., an image sensor (230) of FIGS. 2 to 4) may be greater than the number of unit pixels that read out a signal for obtaining second phase difference information.

[0140] In one embodiment, when the reliability (or importance) value for the second phase difference information is greater than the reliability (or importance) value for the first phase difference information, the electronic device may perform operation 1630 of changing the phase difference acquisition direction to acquire the phase difference information. For example, referring to FIG. 5, the first operation signal (SL1) and the second operation signal (SL2) may be transmitted together so that the upper pixel value (TY) may be read from the first unit pixel (501) and the left pixel value (LY) may be read from the second unit pixel (502). For example, the third operation signal (SL3) and the fourth operation signal (SL4) may be transmitted together so that the lower pixel value (BY) may be read from the first unit pixel (501) and the right pixel value (RY) may be read from the second unit pixel (502). In operation 1630, the number of unit pixels that read out signals for obtaining second phase difference information within an image sensor of the electronic device may be greater than the number of unit pixels that read out signals for obtaining first phase difference information.

[0141] In one embodiment, when a camera of an electronic device is rotated 90 degrees about an axis in which it is facing to capture a scene, operation 1630 may be performed in which the phase difference acquisition direction is changed.

[0142] In operation 1640, the electronic device according to one embodiment may perform an auto-focus (AF) function based on at least one of the first phase difference information or the second phase difference information obtained by performing operation 1620 or operation 1630. For example, the electronic device may control the operation of an AF actuator for performing the auto-focus function of the electronic device based on the phase difference information.

[0143] FIG. 17 is a diagram illustrating the direction of phase difference information included in a first frame before changing the phase difference acquisition direction and a second frame after the change, according to an embodiment of the present disclosure.

[0144] Fig. 17 may be understood as illustrating a unit area constituting a unit of an AF frame acquired to perform an autofocus function within an image sensor.

[0145] Referring to FIG. 17, an electronic device can obtain phase difference data in a vertical direction (y-axis direction) from unit pixels arranged in a first region (1711) with respect to a first frame (1710). The electronic device can obtain phase difference data in a horizontal direction (x-axis direction) from unit pixels arranged in a second region (1712) other than the first region (1711).

[0146] In one embodiment, the electronic device may analyze phase difference data for the first frame (1710). If it is determined that the importance of the phase difference information for the vertical direction (or the reliability of the vertical phase difference) on focal length detection is greater than the importance of the phase difference information for the horizontal direction (or the reliability of the horizontal phase difference), the electronic device may cause the unit pixels of the image sensor to change the direction in which they acquire the phase difference information. Referring to FIG. 17, the electronic device may acquire phase difference data for the horizontal direction (x-axis direction) from the unit pixels arranged in the first region (1721) for the second frame (1720). The electronic device may acquire phase difference data for the vertical direction (y-axis direction) from the unit pixels arranged in the second region (1722).

[0147] In one embodiment, if the camera of the electronic device is rotated 90 degrees about the direction in which it is facing to capture the scene, the direction of phase difference acquisition may change.

[0148] FIG. 18 is a block diagram illustrating a structure for outputting information from an image sensor according to one embodiment of the present disclosure.

[0149] Referring to FIG. 18, a camera module (e.g., a camera module (180) of FIGS. 1 and 2) of an electronic device (e.g., an electronic device (101) of FIG. 1) including an image sensor may include a pixel array (1800), a reorder (1810), and a remosaic operator (1820).

[0150] In one embodiment, the pixel array (1800) may include an array of pixels included in an image sensor (e.g., the image sensor (230) of FIGS. 2 to 4). When performing a remosaic operation (1820) on information acquired from the image sensor, the information read from the pixel array (1800) may be transferred to a reorderer (1810).

[0151] In one embodiment, at least one of the reorder unit (1810) or the remosaic unit (1820) may be configured as at least a part of an image signal processor (e.g., the image signal processor (260) of FIG. 2) or a processor (e.g., the processor (120) of FIG. 1), but is not limited thereto. For example, at least one of the reorder unit (1810) or the remosaic unit (1820) may be configured as a part of an image sensor (e.g., the operation unit (317) of FIG. 3). At least one of the reorder unit (1810) or the remosaic unit (1820) may be configured to include a memory or an operation circuit that records a program to be executed by the processor.

[0152] In one embodiment, before performing a re-mosaic operation, the electronic device may perform a reorder operation on data output from the pixel array (1800). The re-mosaic operation may refer to an operation that converts image data that is not in a specified pattern (e.g., a Bayer pattern) into a specified pattern. The reorder unit (1810) may change the arrangement within the image frame for at least some of the pixel values ​​output from the pixel array (1800). For example, the reorder unit (1810) may be configured to change the order of a pixel value read out based on a second operation signal (e.g., a pixel value read out from the sixth photosensitive element (526)) and a pixel value read out based on a third operation signal (e.g., a pixel value read out from the fifth photosensitive element (525)) in a unit pixel of a second pixel group (e.g., a second unit pixel (502) of FIG. 5). The remosaic operator (1820) can perform a remosaic operation on pixel values ​​whose order has changed.

[0153] According to one embodiment, an electronic device and a method of operating the same can be provided that can provide phase difference information for two or more directions while preventing a decrease in the frame rate of an image sensor.

[0154] The first case, which provides only one-way phase difference information, and the second case, which provides two-way phase difference information through two analog-to-digital conversion (ADC) operations, can be compared with the case of an electronic device according to one embodiment.

[0155] In the first case, the image sensor can only provide phase difference information in the horizontal direction (H). In the second case, the image sensor can provide phase difference information in the horizontal direction (H) and phase difference information in the vertical direction (V). However, in the second case, since an ADC operation for obtaining the phase difference information in the horizontal direction (H) and an ADC operation for obtaining the phase difference information in the vertical direction (V) must be performed, the frame rate is reduced compared to the first case. An electronic device and an operating method thereof according to one embodiment can provide horizontal direction (H) phase difference information obtained from some pixels among all pixels of the image sensor and vertical direction (V) phase difference information obtained from the remaining pixels, while allowing the image sensor to support the same frame rate as the first case. Therefore, an electronic device and an operating method thereof according to one embodiment can enable an AF operation to be performed with high accuracy compared to the first case. An electronic device and an operating method thereof according to one embodiment can reduce or prevent a reduction in the frame rate from the first case compared to the second case.

[0156] In one embodiment, an electronic device (e.g., an electronic device (101) of FIG. 1) may include a camera module (e.g., a camera module (180) of FIGS. 1 to 2), at least one processor (e.g., a processor (120) of FIG. 1), and a memory (e.g., a memory (130) of FIG. 1). The camera module (e.g., a camera module (180) of FIGS. 1 to 2) may include at least one lens (e.g., a lens assembly (210) of FIG. 2) and an image sensor (e.g., an image sensor (230) of FIGS. 2 to 4) configured to detect light received through the at least one lens (e.g., a lens assembly (210) of FIG. 2) and output a signal). The memory (e.g., a memory (130) of FIG. 1) may include one or more instructions that are executed by at least one processor (e.g., a processor (120) of FIG. 1) to cause the electronic device (e.g., an electronic device (101) of FIG. 1) to perform an operation. Instructions can be stored. The image sensor (e.g., the image sensor (230) of FIGS. 2 to 4) may include a first pixel group including a first micro lens (e.g., the first micro lens (511) of FIG. 5) and a second pixel group including a second micro lens (e.g., the second micro lens (512) of FIG. 5). The first pixel group may include a first unit pixel (e.g., the first unit pixel (501) of FIG. 5) including a first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5), a second photosensitive element (e.g., the second photosensitive element (522) of FIG. 5) and a third photosensitive element (e.g., the third photosensitive element (523) of FIG. 5). The first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5) may include the first micro lens (e.g., the first micro lens (512) of FIG. 5). The second photosensitive element (e.g., the second photosensitive element (522) of FIG. 5) may be arranged to receive at least a portion of the light passing through the lens (511). The second photosensitive element (e.g., the second photosensitive element (522) of FIG. 5) may be arranged in a first direction (e.g., the x-axis direction) with respect to the first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5).The third photosensitive element (e.g., the third photosensitive element (523) of FIG. 5) may be arranged in a second direction (e.g., the y-axis direction) different from the first direction with respect to the first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5). The second pixel group may include a second unit pixel (e.g., the second unit pixel (502) of FIG. 5) including a fourth photosensitive element (e.g., the fourth photosensitive element (524) of FIG. 5), a fifth photosensitive element (e.g., the fifth photosensitive element (525) of FIG. 5), and a sixth photosensitive element (e.g., the sixth photosensitive element (526) of FIG. 5). The fourth photosensitive element (e.g., the fourth photosensitive element (524) of FIG. 5) may be arranged to receive at least a portion of light passing through the second microlens (e.g., the second microlens (512) of FIG. 5). The fifth photosensitive element (e.g., the fifth photosensitive element (525) of FIG. 5) may be arranged in the first direction with respect to the fourth photosensitive element (e.g., the fourth photosensitive element (524) of FIG. 5). The sixth photosensitive element (e.g., the sixth photosensitive element (526) of FIG. 5) may be arranged in the second direction with respect to the fourth photosensitive element (e.g., the fourth photosensitive element (524) of FIG. 5). The one or more instructions may be executed by the at least one processor (e.g., the processor (120) of FIG. 1) to control the image sensor (230) to read signals from the first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5) and the fourth photosensitive element (e.g., the fourth photosensitive element (524) of FIG. 5)) based on the first operation signal.The one or more instructions may be executed by the at least one processor (e.g., the processor (20) of FIG. 1) to cause the electronic device (e.g., the electronic device (101) of FIG. 1) to control the image sensor to read signals from the second photosensitive element (e.g., the second photosensitive element (522) of FIG. 5) and the sixth photosensitive element (e.g., the sixth photosensitive element (526) of FIG. 5) based on a second operation signal. The one or more instructions may be executed by the at least one processor (e.g., the processor (120) of FIG. 1) to cause the electronic device (e.g., the electronic device (101) of FIG. 1) to control the image sensor to read signals from the third photosensitive element (e.g., the third photosensitive element (523) of FIG. 5) and the fifth photosensitive element (e.g., the fifth photosensitive element (525) of FIG. 5) based on a third operation signal.

[0157] In one embodiment, the first unit pixel (e.g., the first unit pixel (501) of FIG. 5) may include a first floating diffusion node (e.g., the first floating diffusion node (611) of FIG. 1), a first switch (e.g., the first switch (621) of FIG. 6), a second switch (e.g., the second switch (622) of FIG. 6), and a third switch (e.g., the third switch (623) of FIG. 6). The first switch (e.g., the first switch (621) of FIG. 6) may be connected between the first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5) and the first floating diffusion node (e.g., the first floating diffusion node (611) of FIG. 1). The second switch (e.g., the second switch (622) of FIG. 6) may be connected between the second photosensitive element (e.g., the second photosensitive element (522) of FIG. 5) and the first floating diffusion node (e.g., the first floating diffusion node (611) of FIG. 1). The third switch (e.g., the third switch (623) of FIG. 6) may be connected between the third photosensitive element (e.g., the third photosensitive element (523) of FIG. 5) and the first floating diffusion node (e.g., the first floating diffusion node (611) of FIG. 1). The second unit pixel (e.g., the second unit pixel (502) of FIG. 5) may include a second floating diffusion node (e.g., the second floating diffusion node (612) of FIG. 1), a fourth switch (e.g., the fourth switch (624) of FIG. 6), a fifth switch (e.g., the fifth switch (625) of FIG. 6), and a sixth switch (e.g., the sixth switch (626) of FIG. 6). The fourth switch (e.g., the fourth switch (624) of FIG. 6) may be connected between the fourth photosensitive element (e.g., the fourth photosensitive element (524) of FIG. 5) and the second floating diffusion node (e.g., the second floating diffusion node (612) of FIG. 1). The fifth switch (e.g., the fifth switch (625) of FIG. 6) may be connected between the fifth photosensitive element (e.g., the fifth photosensitive element (525) of FIG. 5) and the second floating diffusion node (e.g., the second floating diffusion node (612) of FIG. 1).The sixth switch (e.g., the sixth switch (626) of FIG. 6) may be connected between the sixth photosensitive element (e.g., the sixth photosensitive element (526) of FIG. 5) and the second floating diffusion node (e.g., the second floating diffusion node (612) of FIG. 1). The image sensor (e.g., the image sensor (230) of FIGS. 2 to 4) may include a first signal line (e.g., the first signal line (SL1) of FIG. 5), a second signal line (e.g., the second signal line (SL2) of FIG. 5), and a third signal line (e.g., the third signal line (SL3) of FIG. 5). The first signal line (e.g., the first signal line (SL1) of FIG. 5) may be connected to the first switch (e.g., the first switch (621) of FIG. 6) and the fourth switch (e.g., the fourth switch (624) of FIG. 6). The second signal line (e.g., the second signal line (SL2) of FIG. 5) may be connected to the second switch (e.g., the second switch (622) of FIG. 6) and the sixth switch (e.g., the sixth switch (626) of FIG. 6). The third signal line (e.g., the third signal line (SL3) of FIG. 5) may be connected to the third switch (e.g., the third switch (623) of FIG. 6) and the fifth switch (e.g., the fifth switch (625) of FIG. 6).

[0158] In one embodiment, the first direction and the second direction may be orthogonal to each other. The image sensor (e.g., the image sensor (230) of FIGS. 2 to 4) may be configured to obtain first phase difference data regarding a phase difference between pixels arranged in the second direction from the first pixel group. The image sensor (e.g., the image sensor (230) of FIGS. 2 to 4) may be configured to obtain second phase difference data regarding a phase difference between pixels arranged in the first direction from the second pixel group.

[0159] In one embodiment, the number of unit pixels of the first pixel group within a unit area included in the image sensor (e.g., the image sensor (230) of FIGS. 2 to 4) may be greater than the number of unit pixels of the second pixel group.

[0160] In one embodiment, the first unit pixel (e.g., the first unit pixel (501) of FIG. 5) may include a plurality of photosensitive elements arranged in an N x N array, including the first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5), the second photosensitive element (e.g., the second photosensitive element (522) of FIG. 5), and the third photosensitive element (e.g., the third photosensitive element (523) of FIG. 5). The second unit pixel (e.g., the second unit pixel (502) of FIG. 5) may include a fourth photosensitive element (e.g., the fourth photosensitive element (524) of FIG. 5), a fifth photosensitive element (e.g., the fifth photosensitive element (525) of FIG. 5), and a sixth photosensitive element (e.g., the sixth photosensitive element (526) of FIG. 5), and may include a plurality of photosensitive elements arranged in an N x N array. The above N can have a value of 2 or more.

[0161] In one embodiment, the at least one processor (e.g., processor (120) of FIG. 1) may be configured to determine whether a specified condition is satisfied. The at least one processor (e.g., processor (120) of FIG. 1) may be configured to read a signal by transmitting the first operation signal and the third operation signal together based on determining that the specified condition is not satisfied. Based on determining that the specified condition is satisfied, the at least one processor (e.g., processor (120) of FIG. 1) may be configured to read a signal by transmitting the first operation signal and the second operation signal together.

[0162] In one embodiment, the specified condition may be that the reliability of the phase difference in the second direction is higher than the reliability of the phase difference in the first direction.

[0163]

[0164] In one embodiment, the image sensor (e.g., the image sensor (230) of FIGS. 2 to 4) or the at least one processor (e.g., the processor (120) of FIG. 1) may be configured to rearrange information output from the fifth photosensitive element (e.g., the fifth photosensitive element (525) of FIG. 5) included in the second pixel group within an image frame output from the image sensor (e.g., the image sensor (230) of FIGS. 2 to 4)) and information output from the sixth photosensitive element (e.g., the sixth photosensitive element (526) of FIG. 5) within the image frame.

[0165] In one embodiment, the first pixel group (e.g., pixels of the first region (1121) of FIG. 11) and the second pixel group (e.g., pixels of the second region (1123) of FIG. 11) may be included in a first unit region (e.g., first unit region (1111) of FIG. 11) of the image sensor (e.g., image sensor (230) of FIG. 2). The image sensor (e.g., image sensor (230) of FIG. 2) may include a third pixel group and a fourth pixel group (e.g., pixels of the third region (1124) of FIG. 11). The third pixel group may include photosensitive elements configured to read phase difference information in the same direction as the photosensitive elements of the first pixel group (e.g., pixels of the first region (1121) of FIG. 11). The fourth pixel group (e.g., pixels of the third region (1124) of FIG. 11) may include photosensitive elements configured to read phase difference information in the same direction as the photosensitive elements of the second pixel group (e.g., pixels of the second region (1123) of FIG. 11). The position at which the fourth pixel group (e.g., pixels of the third region (1124) of FIG. 11) is arranged within the second unit region (e.g., pixels of the second unit region (1112) of FIG. 11) may be at least partially different from the position at which the second pixel group (e.g., pixels of the second region (1123) of FIG. 11) is arranged within the first unit region (e.g., pixels of the first unit region (1111) of FIG. 11).

[0166] In one embodiment, the at least one processor (e.g., processor (120) of FIG. 1) may be configured to obtain first phase difference data by adding a signal read out based on the first operation signal and a signal read out based on the second operation signal from the image sensor (e.g., image sensor (230) of FIGS. 2 to 4).

[0167] In one embodiment, an operating method of an electronic device (e.g., the electronic device (101) of FIG. 1) including an image sensor (e.g., the image sensor (230) of FIGS. 2 to 4) including a first pixel group including a first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5), a second photosensitive element (e.g., the second photosensitive element (522) of FIG. 5) and a third photosensitive element (e.g., the third photosensitive element (523) of FIG. 5)) and a second pixel group including a fourth photosensitive element (e.g., the fourth photosensitive element (524) of FIG. 5), a fifth photosensitive element (e.g., the fifth photosensitive element (525) of FIG. 5) and a sixth photosensitive element (e.g., the sixth photosensitive element (526) of FIG. 5)) is provided, based on a first operation signal, the first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5) and the fourth photosensitive element (e.g., the third photosensitive element (523) of FIG. 5) are operated. An operation of an electronic device (e.g., an electronic device (101) of FIG. 1) may include an operation of reading out a signal from the second photosensitive element (e.g., the second photosensitive element (522) of FIG. 5) and the sixth photosensitive element (e.g., the sixth photosensitive element (526) of FIG. 5) based on a second operation signal. An operation of an electronic device (e.g., an electronic device (101) of FIG. 1) may include an operation of reading out a signal from the third photosensitive element (e.g., the third photosensitive element (523) of FIG. 5) and the fifth photosensitive element (e.g., the fifth photosensitive element (525) of FIG. 5) based on a third operation signal. The first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5) may be arranged to receive light passing through the first micro lens (e.g., the first micro lens (511) of FIG. 5). The second photosensitive element (e.g., the second photosensitive element (522) of FIG. 5) may be arranged in a first direction with respect to the first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5).The third photosensitive element (e.g., the third photosensitive element (523) of FIG. 5) may be arranged in a second direction different from the first direction with respect to the first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5). The fourth photosensitive element (e.g., the fourth photosensitive element (524) of FIG. 5) may be arranged to receive light passing through the second microlens (e.g., the second microlens (512) of FIG. 5). The fifth photosensitive element (e.g., the fifth photosensitive element (525) of FIG. 5) may be arranged in the first direction with respect to the fourth photosensitive element (e.g., the fourth photosensitive element (524) of FIG. 5). The sixth photosensitive element (e.g., the sixth photosensitive element (526) of FIG. 5) may be arranged in the second direction with respect to the fourth photosensitive element (e.g., the fourth photosensitive element (524) of FIG. 5).

[0168] In one embodiment, the first direction and the second direction may be orthogonal to each other. The method may further include an operation of obtaining first phase difference data regarding a phase difference between pixels arranged in the second direction from the first pixel group. The operation may further include an operation of obtaining second phase difference data regarding a phase difference between pixels arranged in the first direction from the second pixel group.

[0169] The method may further include an operation for determining whether a specified condition is satisfied. The method may further include an operation for transmitting the first operation signal and the third operation signal together based on a determination that the specified condition is not satisfied. The method may further include an operation for transmitting the first operation signal and the second operation signal together based on a determination that the specified condition is not satisfied.

[0170] In one embodiment, the specified condition may be that the reliability of the phase difference in the second direction is higher than the reliability of the phase difference in the first direction.

[0171] In one embodiment, the method may further include an operation of rearranging information output from the fifth photosensitive element (e.g., the fifth photosensitive element (525) of FIG. 5) included in the second pixel group and information output from the sixth photosensitive element (e.g., the sixth photosensitive element (526) of FIG. 5)) within an image frame output from the image sensor (e.g., the image sensor (230) of FIGS. 2 to 4).

[0172] In one embodiment, an image sensor (e.g., the image sensor (230) of FIGS. 2 to 4) may include a first pixel group and a second pixel group. The first pixel group may include a first unit pixel (e.g., the first unit pixel (501) of FIG. 5) including a first individual pixel, a second individual pixel, and a third individual pixel corresponding to a first micro lens (e.g., the first micro lens (511) of FIG. 5). The second individual pixel may be arranged in a first direction with respect to the first individual pixel. The third individual pixel may be arranged in a second direction different from the first direction with respect to the first individual pixel. The second pixel group may include a second unit pixel (e.g., the second unit pixel (502) of FIG. 5) including a fourth individual pixel, a fifth individual pixel, and a sixth individual pixel corresponding to a second micro lens (e.g., the second micro lens (512) of FIG. 5). The fifth individual pixel may be arranged in the first direction with respect to the fourth individual pixel. The sixth individual pixel may be arranged in the second direction with respect to the fourth individual pixel. The first individual pixel and the fourth individual pixel may be connected to a first signal line (e.g., the first signal line (SL1) of FIG. 5) that transmits a first operation signal. The second individual pixel and the sixth individual pixel may be connected to a second signal line (e.g., the second signal line (SL2) of FIG. 5) that transmits a second operation signal. The third individual pixel and the fifth individual pixel may be connected to a third signal line (e.g., the third signal line (SL3) of FIG. 5) that transmits a third operation signal.

[0173] In one embodiment, the first individual pixel may include a first switch (e.g., the first switch (621) of FIG. 6) connected between a first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5) and a first floating diffusion node (e.g., the first floating diffusion node (611) of FIG. 1) of the first unit pixel (e.g., the first unit pixel (501) of FIG. 5). The second individual pixel may include a second switch (e.g., the second switch (622) of FIG. 6) connected between a second photosensitive element (e.g., the second photosensitive element (522) of FIG. 5) and the first floating diffusion node (e.g., the first floating diffusion node (611) of FIG. 1). The third individual pixel may include a third switch (e.g., the third switch (623) of FIG. 6) connected between a third photosensitive element (e.g., the third photosensitive element (523) of FIG. 5) and the first floating diffusion node (e.g., the first floating diffusion node (611) of FIG. 1). The fourth individual pixel may include a fourth switch (e.g., the fourth switch (624) of FIG. 6) connected between a fourth photosensitive element (e.g., the fourth photosensitive element (524) of FIG. 5) and a second floating diffusion node (e.g., the second floating diffusion node (612) of FIG. 1) of the second unit pixel (e.g., the second unit pixel (502) of FIG. 5). The fifth individual pixel may include a fifth switch (e.g., the fifth switch (625) of FIG. 6) connected between a fifth photosensitive element (e.g., the fifth photosensitive element (525) of FIG. 5) and the second floating diffusion node (e.g., the second floating diffusion node (612) of FIG. 1). The sixth individual pixel may include a sixth switch (e.g., the sixth switch (626) of FIG. 6) connected between a sixth photosensitive element (e.g., the sixth photosensitive element (526) of FIG. 5) and the second floating diffusion node (e.g., the second floating diffusion node (612) of FIG. 1). The first signal line (e.g., the first signal line (SL1) of FIG. 5) may be connected to the first switch (e.g., the first switch (621) of FIG. 6) and the fourth switch (e.g., the fourth switch (624) of FIG. 6).The second signal line (e.g., the second signal line (SL2) of FIG. 5) may be connected to the second switch (e.g., the second switch (622) of FIG. 6) and the sixth switch (e.g., the sixth switch (626) of FIG. 6). The third signal line (e.g., the third signal line (SL3) of FIG. 5) may be connected to the third switch (e.g., the third switch (623) of FIG. 6) and the fifth switch (e.g., the fifth switch (625) of FIG. 6).

[0174] In one embodiment, the first direction and the second direction may be orthogonal to each other. The image sensor (e.g., the image sensor (230) of FIGS. 2 to 4) may further include a calculation unit configured to obtain first phase difference data regarding a phase difference between pixels arranged in the second direction from the first pixel group, and to obtain second phase difference data regarding a phase difference between pixels arranged in the first direction from the second pixel group.

[0175] In one embodiment, the image sensor (e.g., the image sensor (230) of FIGS. 2 to 4) may be configured such that the number of unit pixels of the first pixel group is greater than the number of unit pixels of the second pixel group within a unit area included in the image sensor (e.g., the image sensor (230) of FIGS. 2 to 4).

[0176] In one embodiment, the first unit pixel (e.g., the first unit pixel (501) of FIG. 5) may include a plurality of photosensitive elements arranged in an N x N array, including the first photosensitive element (e.g., the first photosensitive element (521) of FIG. 5), the second photosensitive element (e.g., the second photosensitive element (522) of FIG. 5), and the third photosensitive element (e.g., the third photosensitive element (523) of FIG. 5). The second unit pixel (e.g., the second unit pixel (502) of FIG. 5) may include a fourth photosensitive element (e.g., the fourth photosensitive element (524) of FIG. 5), a fifth photosensitive element (e.g., the fifth photosensitive element (525) of FIG. 5), and a sixth photosensitive element (e.g., the sixth photosensitive element (526) of FIG. 5), and may include a plurality of photosensitive elements arranged in an N x N array. The above N can have a value of 2 or more.

[0177] An electronic device and an operating method thereof according to various embodiments can provide phase difference information for two or more directions without reducing the frame rate or reducing the degree of reduction.

[0178] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0179] The embodiments presented in this disclosure are not mutually exclusive, and components of the embodiments may be combined with each other within the scope of the purpose presented in this disclosure.

[0180] The methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0181] When implemented in software, a computer-readable storage medium storing one or more programs (software modules) may be provided. The one or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. The one or more programs include instructions that cause the electronic device to execute methods according to embodiments described in the claims or specification of the present disclosure.

[0182] In the present disclosure, the functions or operations performed by the electronic device may be performed by one or more processors executing one or more instructions stored in a memory. The functions or operations of the electronic device mentioned in the present disclosure may be performed by one processor executing one or more instructions, or may be performed by a combination of multiple processors executing one or more instructions. The processor mentioned in the present disclosure may be understood to include circuitry for performing calculations or controlling other components of the electronic device. For example, the one or more processors may include a central processing unit (CPU), a microprocessor unit (MPU), an application processor (AP), a communication processor (CP), a neural processing unit (NPU), a system on a chip (SoC), or an integrated circuit (IC) configured to execute one or more instructions. The one or more processors may be configured to perform the operations of the electronic device described above.

[0183] These programs (software modules, software) may be stored in a non-volatile memory including random access memory, flash memory, read only memory (ROM), electrically erasable programmable read only memory (EEPROM), magnetic disc storage devices, compact disc ROMs (CD-ROMs), digital versatile discs (DVDs) or other forms of optical storage devices, magnetic cassettes, or a memory formed by a combination of some or all of these. The memory may be formed by a single storage medium or may be formed by a combination of a plurality of storage media. The one or more instructions may be stored in a single storage medium or may be distributed and stored in a plurality of storage media.

[0184] Additionally, the program may be stored on an attachable storage device that is accessible via a communication network such as the Internet, an intranet, a local area network (LAN), a wide LAN (WLAN), or a storage area network (SAN), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure via an external port. Additionally, a separate storage device on the communication network may be connected to a device performing an embodiment of the present disclosure.

[0185] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed in the singular or plural form, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in the plural form may be composed of singular elements, or components expressed in the singular form may be composed of plural elements.

[0186] Additionally, in the present disclosure, terms such as “part”, “module”, etc. may refer to a hardware component such as a processor or circuit, and / or a software component executed by a hardware component such as a processor.

[0187] A "component" or "module" may be implemented by a program stored in an addressable storage medium and executed by a processor. For example, a "component" or "module" may be implemented by components such as software components, object-oriented software components, class components, and task components, as well as processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuitry, data, databases, data structures, tables, arrays, and variables.

[0188] The specific implementations described in this disclosure are merely exemplary and do not limit the scope of the present disclosure in any way. For the sake of brevity, descriptions of conventional electronic components, control systems, software, and other functional aspects of the systems may be omitted.

[0189] Additionally, in the present disclosure, “comprising at least one of a, b, or c” may mean “comprising only a, including only b, including only c, or including a combination of two or more (including a and b, including b and c, including a and c, or including all of a, b, and c).

[0190] While the detailed description of this disclosure has described specific embodiments, it should be understood that various modifications are possible without departing from the scope of this disclosure. Therefore, the scope of this disclosure should not be limited to the described embodiments, but should be defined not only by the scope of the claims described below, but also by equivalents thereof.

Claims

1. In electronic devices, A camera module comprising at least one lens and an image sensor configured to detect light received through the at least one lens and output a signal; A memory storing one or more computer programs; and comprising one or more processors communicatively coupled with the camera module and the memory; The image sensor includes a first pixel group including a first micro lens and a second pixel group including a second micro lens, The above first pixel group includes a first unit pixel including a first photosensitive element, a second photosensitive element, and a third photosensitive element, The first photosensitive element is arranged to receive at least a portion of the light passing through the first micro lens, The second photosensitive element is arranged in a first direction with respect to the first photosensitive element, The third photosensitive element is arranged in a second direction different from the first direction with respect to the first photosensitive element, The second pixel group includes a second unit pixel including a fourth photosensitive element, a fifth photosensitive element, and a sixth photosensitive element, The fourth photosensitive element is arranged to receive at least a portion of the light passing through the second micro lens, The fifth photosensitive element is arranged in the first direction with respect to the fourth photosensitive element, The sixth photosensitive element is arranged in the second direction with respect to the fourth photosensitive element, The one or more computer programs are individually or collectively executed by the at least one processor so that the electronic device: Controlling the image sensor to read out signals from the first photosensitive element and the fourth photosensitive element based on the first operation signal, Controlling the image sensor to read out signals from the second photosensitive element and the sixth photosensitive element based on the second operation signal; An electronic device comprising instructions for controlling the image sensor to read out signals from the third photosensitive element and the fifth photosensitive element based on a third operation signal.

2. In claim 1, The above first unit pixel is: 1st floating diffusion node, a first switch connected between the first photosensitive element and the first floating diffusion node; a second switch connected between the second photosensitive element and the first floating diffusion node; a third switch connected between the third photosensitive element and the first floating diffusion node; The second unit pixel is: Second floating diffusion node, a fourth switch connected between the fourth photosensitive element and the second floating diffusion node; a fifth switch connected between the fifth photosensitive element and the second floating diffusion node, and comprising a sixth switch connected between the sixth photosensitive element and the second floating diffusion node; The above image sensor: A first signal line connected to the first switch and the fourth switch; A second signal line connected to the second switch and the sixth switch, and An electronic device comprising a third signal line connected to the third switch and the fifth switch.

3. In claim 1, The above first direction and the above second direction are orthogonal to each other, The above image sensor: Obtain first phase difference data for the phase difference between pixels arranged in the second direction from the first pixel group, An electronic device configured to obtain second phase difference data regarding a phase difference between pixels arranged in the first direction from the second pixel group.

4. In claim 1, An electronic device, wherein the number of unit pixels of the first pixel group within the unit area of ​​the image sensor is greater than the number of unit pixels of the second pixel group.

5. In claim 1, The first unit pixel includes a plurality of photosensitive elements arranged in an N x N array, including the first photosensitive element, the second photosensitive element, and the third photosensitive element, The second unit pixel includes a plurality of photosensitive elements arranged in an N x N array, including the fourth photosensitive element, the fifth photosensitive element, and the sixth photosensitive element, An electronic device wherein N is 2 or more.

6. In claim 1, The at least one computer program, when individually or collectively executed by the at least one processor, causes the electronic device to: Determine whether a specified condition is satisfied, The first operation signal and the third operation signal are transmitted together to read out a signal based on the determination that the above-mentioned specified condition is not satisfied, An electronic device further comprising computer-executable instructions for causing the first operation signal and the second operation signal to be transmitted together to read out a signal based on determining that the above specified condition is satisfied.

7. In claim 6, An electronic device wherein the above specified condition is that the reliability of the phase difference in the second direction is higher than the reliability of the phase difference in the first direction.

8. In claim 1, The above image sensor, Among the pixels included in the image frame output from the image sensor, for pixels included in the second pixel group, the information output from the fifth photosensitive element and the information output from the sixth photosensitive element are configured to be rearranged, or An electronic device, wherein the one or more computer programs further include computer-executable instructions that, when individually or collectively executed by the at least one processor, cause the electronic device to rearrange information output from the fifth photosensitive element and information output from the sixth photosensitive element with respect to pixels included in the second pixel group among pixels included in an image frame output from the image sensor.

9. In claim 1, The first pixel group and the second pixel group are included in the first unit area of ​​the image sensor, The image sensor further includes a second unit area including a third pixel group and a fourth pixel group, The third pixel group includes photosensitive elements configured to read out phase difference information in a direction corresponding to the phase difference information read out from the photosensitive elements of the first pixel group, The fourth pixel group includes photosensitive elements configured to read out phase difference information in a direction corresponding to the phase difference information read out from the photosensitive elements of the second pixel group, An electronic device, wherein the position at which the fourth pixel group is arranged within the second unit area is at least partially different from the position at which the second pixel group is arranged within the first unit area.

10. In claim 1, An electronic device, wherein the one or more computer programs further include computer-executable instructions that, when individually or collectively executed by the at least one processor, cause the electronic device to obtain first phase difference data by combining a signal read out from the image sensor based on the first operation signal and a signal read out based on the second operation signal.

11. A method performed by an electronic device including an image sensor including a first pixel group including a first photosensitive element, a second photosensitive element, and a third photosensitive element, and a second pixel group including a fourth photosensitive element, a fifth photosensitive element, and a sixth photosensitive element, An operation of reading out a signal from the first photosensitive element and the fourth photosensitive element based on a first operation signal; An operation of reading out a signal from the second photosensitive element and the sixth photosensitive element based on a second operation signal; and An operation of reading out a signal from the third photosensitive element and the fifth photosensitive element based on a third operation signal, The above first photosensitive element is arranged to receive light passing through the first micro lens, The second photosensitive element is arranged in a first direction with respect to the first photosensitive element, The third photosensitive element is arranged in a second direction different from the first direction with respect to the first photosensitive element, The fourth photosensitive element is arranged to receive light passing through the second micro lens, The fifth photosensitive element is arranged in the first direction with respect to the fourth photosensitive element, A method wherein the sixth photosensitive element is arranged in the second direction with respect to the fourth photosensitive element.

12. In claim 11, The above first direction and the above second direction are orthogonal to each other, The above method, An operation of obtaining first phase difference data for a phase difference between pixels arranged in the second direction from the first pixel group, and A method further comprising the operation of obtaining second phase difference data regarding a phase difference between pixels arranged in the first direction from the second pixel group.

13. In claim 11, An action that determines whether a specified condition is satisfied; An operation of transmitting the first operation signal and the third operation signal together based on the determination that the above specified condition is not satisfied; and A method further comprising an operation of transmitting the first operation signal and the second operation signal together based on determining that the above specified condition is not satisfied.

14. In claim 13, A method wherein the above specified condition is that the reliability of the phase difference in the second direction is higher than the reliability of the phase difference in the first direction.

15. One or more computer programs storing computer-executable instructions that are individually or collectively executed by one or more processors of an electronic device to cause the electronic device to perform operations, wherein the electronic device includes an image sensor including a first group of pixels including a first photosensitive element, a second photosensitive element and a third photosensitive element and a second group of pixels including a fourth photosensitive element, a fifth photosensitive element and a sixth photosensitive element, the operations comprising: An operation of reading out a signal from the first photosensitive element and the fourth photosensitive element based on a first operation signal by the electronic device; An operation of reading out a signal from the second photosensitive element and the sixth photosensitive element based on a second operation signal by the electronic device; and An operation of reading out a signal from the third photosensitive element and the fifth photosensitive element based on a third operation signal by the electronic device is included. The above first photosensitive element is arranged to receive light passing through the first micro lens, The second photosensitive element is arranged in a first direction with respect to the first photosensitive element, The third photosensitive element is arranged in a second direction different from the first direction with respect to the first photosensitive element, The fourth photosensitive element is arranged to receive light passing through the second micro lens, The fifth photosensitive element is arranged in the first direction with respect to the fourth photosensitive element, A computer-readable non-transitory recording medium, wherein the sixth photosensitive element is arranged in the second direction with respect to the fourth photosensitive element.

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