Skin treatment element

Abstract

Disclosed herein is a skin treatment element having a microstructure, provided with a substrate (1) and a treatment unit (2). The treatment unit (2) is provided with a treatment end (21) and a connecting seat (22). The connecting seat (22) is connected to the surface on one side of the substrate (1), and the treatment end (21) is provided with a first blade part (211). The skin treatment element provides good structural strength and puncture capacity for the treatment unit, such that the strict requirements of the product on materials and machining processes are reduced, thus improving the comprehensive production cost-efficiency and the safety of the product, and making microneedle transdermal administration products widely applicable.

Description

Skin treatment components Technical Field

[0001] The present invention relates to a skin treatment tool used in the technical field of transdermal drug delivery, in particular to a skin treatment element with a microstructure. Background Art

[0002] The stratum corneum of human skin has a barrier protection function, but it also makes it difficult for active ingredients to be absorbed through the skin. In the field of transdermal drug delivery technology, chemical or physical methods can be used to improve the transdermal absorption efficiency of active ingredients. Traditional products use chemical methods to improve transdermal absorption efficiency, among which plasters are more common. However, the chemical penetration enhancers added to plasters can easily cause skin redness, itching and allergic reactions, which has certain defects. The new transdermal drug delivery method uses physical methods. Among the products that use physical methods to improve transdermal absorption efficiency, microneedle transdermal drug delivery products have the advantages of safety, high efficiency, and simple operation, and are favored by domestic and foreign experts.

[0003] Microneedle transdermal drug delivery products are made of metal, single-crystal silicon, polymers, or other suitable materials and comprise a substrate and a microneedle unit array formed on the substrate. Examples include the technical solutions disclosed in the Chinese invention patent "Metal Microneedle Array Chip, Preparation Method, and Use thereof (Authorization Announcement No.: CN100402107C)." Microneedle transdermal drug delivery products utilize the microneedle unit array to act on the skin surface, overcoming the skin's surface barrier layer and forming dredging channels, enabling rapid and efficient transdermal absorption of active ingredients. These products offer advantages such as minimally invasiveness, non-invasiveness, painlessness, safety, and high efficacy. They can be used in conjunction with a variety of medical devices and have broad application prospects, such as the technical solutions and related applications disclosed in the Chinese invention patent "Built-in Non-verbal Guidance Device Integrable into an Applicator (Authorization Announcement No.: CN103079634B)."

[0004] However, there are still many areas for improvement in existing microneedle transdermal drug delivery products.

[0005] First, in existing microneedle transdermal drug delivery products, the width of the microneedle unit is at the micron or even nanometer level, the needle body is tapered and relatively sharp, and the aspect ratio usually reaches 5 or even 10 to ensure that the product has good puncture ability. However, the microneedle unit of this structure is prone to breakage and damage during the processing process, the product yield is low, and the corresponding processing cost is high, and the product cannot benefit the majority of ordinary patients.

[0006] Secondly, during the use of microneedle transdermal drug delivery products, the microneedle units may break inside the skin, so the safety of this product needs to be improved.

[0007] In summary, current microneedle transdermal drug delivery products have many technical problems, such as low structural strength, low yield, high production cost, and the need to improve safety of use. Technical issues

[0008] Current microneedle transdermal drug delivery products have many technical problems, such as low structural strength, low yield, high production cost, and the need to improve safety of use. Technical Solutions

[0009] In view of the fact that current microneedle transdermal drug delivery products have many technical problems such as low structural strength, low yield, high processing cost, and the need for further improvement in safety of use, the present invention discloses a skin treatment element.

[0010] The skin treatment element comprises a substrate and a treatment unit. The treatment unit comprises a treatment end and a connection seat. The connection seat is connected to one side surface of the substrate. The treatment end comprises a first cutting edge.

[0011] Preferably, the first blade portion is parallel to the substrate.

[0012] Preferably, an extension line of the first blade portion intersects with the base plate.

[0013] Preferably, the extension line of the first blade portion intersects with the base plate, and the intersection angle is greater than 0° and not greater than 60°.

[0014] Preferably, the length of the first edge portion is not less than 10 nanometers.

[0015] Preferably, the substrate is made of at least one of single crystal silicon material, polymer material, metal material, and plastic, or a combination of several of them.

[0016] Preferably, when the substrate is made of single crystal silicon material, the crystal plane orientation of the substrate is any one of (100), (110), and (111).

[0017] Preferably, a columnar substrate is formed on one side surface of the substrate, and the processing unit is formed by etching the columnar substrate through a physical and chemical method.

[0018] Preferably, the columnar substrate is in the shape of a polygonal prism or a cylinder, and the outer contour of the connecting seat is in the shape of a polygon or a circle.

[0019] Preferably, the columnar substrate is in the shape of a quadrangular prism, a hexagonal prism or an octagonal prism, and the outer contour of the connecting seat is in the shape of a rectangle, a hexagon or an octagon.

[0020] Preferably, the physical and chemical method etches the columnar substrate according to the crystal plane orientation and forms an etching plane.

[0021] Preferably, the processing unit has more than two etching planes, and the etching planes are formed between the connecting seat and the processing end.

[0022] Preferably, the processing end further has a second cutting edge, and the second cutting edge and the first cutting edge are distributed at the edge of the same etching plane, and the first cutting edge and the second cutting edge are not connected.

[0023] Preferably, the processing end further has a second cutting edge portion, the second cutting edge portion is connected end to end with the first cutting edge portion, and an angle is formed between the second cutting edge portion and the first cutting edge portion.

[0024] Preferably, the processing unit is made of at least one of single crystal silicon material, polymer material, and metal material.

[0025] Preferably, the processing unit array is arranged on one side surface of the substrate.

[0026] Preferably, the processing units are arranged in a grid array on the substrate.

[0027] Preferably, the spacing between adjacent processing units is not less than 0.1 mm and not more than 5 mm.

[0028] Preferably, the height of the processing unit is not less than 10 nanometers and not more than 1 millimeter.

[0029] The above technical solution is further explained as follows.

[0030] In the present application, the substrate can be made of single crystal silicon, metal, polymer materials, etc., and the processing flow includes pretreatment operations and processing and forming operations. The pretreatment operation is to pre-treat the substrate through corresponding processing technology according to the different substrate materials, and form a columnar substrate on one side of the substrate surface; the processing and forming operation is to modify the structural morphology of the columnar substrate and finally form a processing unit. Taking single crystal silicon material as an example, the crystal plane orientation of the single crystal silicon forming the substrate can be any type of (100), (110), (111). The substrate can be pre-treated by masking, photolithography, etching and other pretreatment operations to form a columnar substrate on one side of the substrate surface. The columnar substrate can be in the shape of a polygonal prism or a cylinder. After the pretreatment is completed, the columnar substrate can be processed by a 3D etching process to finally form a processing unit. It should be noted that the 3D etching process includes physical and chemical etching processes, such as chemical anisotropic etching process, dry etching process, wet etching process, etc.

[0031] Connecting seat and processing end: The processing unit is formed on the substrate and extends and grows outward from one side surface of the substrate. The end of the processing unit connected to the substrate is defined as the connecting seat, and the end of the processing unit away from the substrate is defined as the processing end. The processing end is used to contact the skin and form a dredging channel on the skin surface.

[0032] Etching plane: Single crystal silicon has multiple different crystal plane orientations, such as (100), (110), and (111). This material exhibits anisotropy. When single crystal silicon is anisotropically etched using chemical methods, different crystal planes have different etching rates. In this application, the processing unit can be formed by a columnar substrate through a 3D etching process, and the columnar substrate is chemically anisotropically etched during the processing. In the same etching process, since the columnar substrate has multiple different crystal plane orientations, different crystal plane orientations correspond to different etching rates, thus forming multiple "etching planes" with different angles and directions on the columnar substrate.

[0033] Blade: The processing unit will undergo etching in different directions during the processing process, thereby forming multiple etching planes with different angles and directions on the surface of the processing unit. The edges where the etching planes intersect form sharp edges, which are defined as "blade"; the blade located at the end of the processing end that can first contact the skin is defined as the "first blade", and the blade adjacent to the "first blade" is defined as the "second blade".

[0034] Length of the blade: The edge where the etching planes intersect forms a sharp edge, which is the "blade". The length of the edge is defined as the "length of the blade". Accordingly, the "blade" also has a thickness, and the "thickness of the blade" refers to the thickness of the edge.

[0035] The first and second blades are not connected: In some embodiments, the first and second blades are located on opposite edges of the same etched surface, such as opposite edges of a diamond-shaped etched surface. In this case, the first and second blades are not connected. When the treatment unit is in operation, the first blade first contacts the skin, then the etched surface on the treatment end slides relative to the skin, and then the second blade contacts the skin.

[0036] The first and second blades form an angle: In some embodiments, the first blade can be formed by two etched planes in different directions. On this basis, a third etched plane (in a different direction from the first two etched planes) etches the treatment end and a portion of the first blade. The edge of the third etched plane then forms the second blade, which is connected to the first blade and forms a specific angle. When the treatment unit is in operation, the first blade first contacts the skin, followed by the second blade.

[0037] The angle between the extension line of the first blade and the substrate: The "first blade" is formed during the etching process of the processing unit. Due to different etching directions, the extension line of the "first blade" can remain parallel to the substrate (analogous to a "wedge"), or it can be at a certain angle to the substrate (analogous to the "end of a Tang sword"). The size of this angle can be changed by adjusting the etching direction. Beneficial effects

[0038] In the present technical solution, the processing end of the processing unit has a thin and sharp first blade, which can achieve micron-level or even nano-level precision through etching processing, can meet the needs of skin dredging and care, and can form micron-level or nano-level dredging channels on the skin surface, facilitating efficient transdermal absorption of effective ingredients. The uniqueness of this technical solution is that the first blade has a sufficient size in the length direction, which makes the overall structure of the processing unit more reliable and sturdy, and can effectively improve the yield of the processing unit in the processing process, while reducing the chance of the processing unit breaking when treating the skin. In summary, the skin processing element in the present technical solution can better take into account the structural strength and puncture ability of the processing unit, reduce the product's stringent requirements on materials and processing technology, thereby reducing the overall production cost, while improving the safety of the product, so that microneedle transdermal drug delivery products can serve the public more widely. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] FIG1 is an enlarged structural diagram of a treatment unit in a first embodiment of a skin treatment element according to the present invention.

[0040] FIG2 is a schematic structural diagram of a skin treatment element according to a first embodiment of the present invention.

[0041] FIG3 is a schematic structural diagram of a first embodiment of a skin treatment element according to the present invention acting on the stratum corneum of the skin.

[0042] FIG4 is an enlarged structural diagram of a processing unit in a second embodiment of a skin treatment element according to the present invention.

[0043] FIG5 is an enlarged structural diagram of the processing unit in the third embodiment of the skin treatment element of the present invention.

[0044] FIG6 is a schematic structural diagram of a third embodiment of a skin treatment element according to the present invention.

[0045] FIG. 7 is an enlarged structural diagram of the processing unit in the fourth embodiment of the skin treatment element of the present invention.

[0046] FIG8 is an enlarged structural diagram of the processing unit in the fifth embodiment of the skin treatment element of the present invention.

[0047] FIG9 is a schematic structural diagram of a fifth embodiment of a skin treatment element according to the present invention.

[0048] FIG10 is an enlarged structural diagram of the processing unit in the sixth embodiment of the skin treatment element of the present invention.

[0049] FIG. 11 is an enlarged structural diagram of the processing unit in the seventh embodiment of the skin treatment element of the present invention.

[0050] FIG12 is a schematic structural diagram of a seventh embodiment of a skin treatment element according to the present invention.

[0051] FIG13 is an electron microscope magnified top view of the treatment end of the eighth embodiment of the skin treatment element of the present invention.

[0052] List of reference numerals:

[0053] T, stratum corneum; Y, skin treatment element; 1, substrate; 2, treatment unit; 21, treatment end; 211, first blade; 212, second blade; 213, third blade; 22, connecting seat; 23, etching plane. Modes for Carrying Out the Invention

[0054] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0055] The substrate can be made of one or more materials selected from single crystal silicon, metal, plastic, silicone, and polymer materials. In some specific embodiments of the present application, the processing flow includes a pre-treatment operation and a processing and forming operation. The pre-treatment operation is to pre-treat the substrate through a corresponding processing technology according to the different substrate materials, so as to form a columnar substrate on one side of the substrate surface; the processing and forming operation is to process and modify the structural morphology of the columnar substrate, and finally form a processing unit with a processing end. Taking single crystal silicon material as an example, the crystal plane orientation of the single crystal silicon forming the substrate can be any type of (100), (110), and (111). By performing masking, photolithography, etching and other pre-treatment operations on the substrate, a columnar substrate is formed on one side of the substrate surface. The columnar substrate has a structure such as a polygonal prism or a cylinder. After the pre-treatment is completed, in the processing and forming operation, the columnar substrate can be processed by a 3D etching process. After physical and chemical etching, the columnar substrate will form multiple etching planes with different directions and angles, and the edges between the etching planes will eventually form a blade.

[0056] In the present application, the skin treatment element Y has a substrate 1 and a treatment unit 2 . The treatment unit 2 has a treatment end 21 and a connection seat 22 . The connection seat 22 is connected to one side surface of the substrate 1 . The treatment end 21 has a first blade 211 .

[0057] The shape of the substrate 1 can be adaptively cut according to the style of the connector or platform on the loaded device, such as rectangle, square, regular hexagon, regular octagon, circle, etc. In some application scenarios, the thickness of the substrate 1 is not less than 0.1 mm, such as 0.1 mm, 0.15 mm, or 0.2 mm.

[0058] The material of the processing unit 2 can be one or more of single crystal silicon, metal, plastic, silicone, and polymer materials. In some embodiments, the processing unit 2 can be made of the same material as the substrate 1, for example, both are made of single crystal silicon or polymer materials. In some embodiments, the processing unit 2 can be made of different materials than the substrate 1, for example, the processing unit 2 is made of polymer materials and the substrate 1 is made of single crystal silicon or metal materials. In some application scenarios, the height of the processing unit 2 is between 10 nanometers and 1 millimeter, for example, 20nm, 50nm, 80nm, 100nm, 200nm, 300nm, 500nm, 10μm, 20μm, 50μm, and 200μm.

[0059] The skin treatment element Y can be used with a variety of medical devices, such as massagers, penetration enhancers, hyaluronic acid treatment machines, and rollers, offering a wide range of applications. The skin treatment element Y has various designs for different application scenarios, as further described below through several examples. Example 1

[0060] Figure 1 is an enlarged schematic diagram of the processing units in the first embodiment of the skin treatment element of the present invention. Figure 2 is a schematic diagram of the first embodiment of the skin treatment element of the present invention. Figure 3 is a schematic diagram of the structure of the first embodiment of the skin treatment element of the present invention acting on the stratum corneum of the skin. As shown in Figures 1 and 2, in the first embodiment, the processing units 2 are arranged in an array on one side of a substrate 1 (the thickness of the substrate 1 is omitted for structural simplicity), with a specific layout of 4*4. It is readily apparent that the processing units 2 can also be arranged in other suitable configurations based on design requirements, such as a 3*3, 5*5, 6*6, 7*7, 8*8, 9*9, or 10*10 square matrix configuration. Of course, a 3*4, 4*5, 4*6, or other suitable rectangular matrix configurations are also possible. It is readily understood that the processing units 2 can also be arranged in a honeycomb array, a concentric circle array, or other suitable array configurations. The specific configuration and configuration can be flexibly adjusted based on user needs and usage scenarios, and this embodiment is not intended to be limiting. In this embodiment 1, the spacing between adjacent treatment units 2 is not less than 0.1 mm and not more than 5 mm. By adjusting the arrangement spacing of the treatment units 2, the treatment efficiency of the skin treatment element on the skin can be changed to meet different care needs. Optional sizes include 0.35 mm, 0.4 mm or 0.46 mm.

[0061] The processing unit 2 is fixedly connected to the substrate 1 via a connector 22. The processing unit 2 can be formed from a cylindrical substrate through a 3D etching process. After the physical and chemical etching process, a processing end 21 is formed at the end of the processing unit 2 away from the substrate 1. The processing unit 2 has multiple etched surfaces 23.

[0062] As shown in Figures 1 and 2, in this first embodiment, the outer contour of the connecting base 22 is rectangular. Alternatively, the outer contour of the connecting base 2 can also be processed into a polygonal or circular shape. Accordingly, the cylindrical substrate can be a prism or a cylinder, such as a quadrangular prism, a hexagonal prism, or an octagonal prism. Taking the cylindrical substrate as a quadrangular prism as an example, the processing unit 2 in the first embodiment is etched to form two etched planes 23. The etching process etches from the processing end 21 to the connecting base 22, thereby forming an etched plane 23 on the processing unit 2 extending from the processing end 21 to the connecting base 22, as shown in the shaded area in Figure 1 (one of the etched planes is obscured). After etching, the processing unit 2 forms a wedge shape, and the tip of the wedge (i.e., the edge where the two etched planes 23 intersect) forms a sharp edge, which forms the first blade portion 211 of the processing end 21. During the processing process, controlling the etching direction can produce a sharp and thin blade portion, thereby improving the skin clearing and treatment effect of the processing unit 2. In this first embodiment, the first blade portion 211 is parallel to the substrate 1. The length of the first blade portion 211 is not less than 10 nm, such as 10 nm, 100 nm, 500 nm, 1000 nm, or 8000 nm. Furthermore, the length of the first blade portion 211 can be not less than 500 nm or not less than 1000 nm. This structure enables the processing unit 2 to have a sufficiently wide and thick dimension along the length direction of the blade portion, thereby effectively improving the structural strength and reliability of the processing unit, thereby improving the yield rate during the etching process.

[0063] It should be noted that in some other embodiments, the etching process can be performed only on the processing end 21, that is, the etching plane 23 does not extend to the connecting seat 22, and a blade portion can also be processed on the processing end 21. The processing unit of this structure can also achieve the corresponding penetration-promoting care function. It should be noted that the processing unit 2 can also use an octagonal prism as a substrate to form the processing end by etching.

[0064] The skin treatment element Y in Example 1 is used in conjunction with a permeation enhancer. The permeation enhancer drives the skin treatment element Y to vibrate back and forth at high frequencies, thereby clearing the skin surface. As shown in Figure 3, the first blade 211 of the treatment unit 2 can easily penetrate the skin's stratum corneum T, thereby forming a clearing channel therein and facilitating efficient transdermal absorption of the active ingredient. Furthermore, as shown in Figure 2, the large length of the first blade 211 provides sufficient structural strength, further enhancing product safety. Example 2

[0065] Figure 4 is an enlarged schematic diagram of the treatment unit in the second embodiment of the skin treatment element of the present invention. As shown in Figure 4, in this second embodiment, unlike in the first embodiment, the two etched planes 23 have different angles and orientations, resulting in a first blade portion 211 with a predetermined inclination angle. Specifically, the extended line of the first blade portion 211 intersects the substrate 1 at an angle a shown by the dashed line in the figure. Optionally, the angle a at which the extended line of the first blade portion 211 intersects the substrate 1 is greater than 0° and no greater than 60°, such as 10°, 15°, 30°, 45°, or 60°. When using the skin treatment element Y in this second embodiment to treat the stratum corneum, one end of the first blade portion 211 on the treatment unit 2 first contacts the skin, then gradually penetrates the skin and clears it. This angled first blade portion facilitates clearing the stratum corneum and forming a clearing channel. Example 3

[0066] Figure 5 is an enlarged schematic diagram of the structure of the processing unit in the third embodiment of the skin treatment element of the present invention. Figure 6 is a schematic diagram of the structure of the third embodiment of the skin treatment element of the present invention. As shown in Figures 5 and 6, in this third embodiment, the extension line of the first blade portion 211 intersects the substrate 1. Unlike in the second embodiment, the processing unit 2 also has a second blade portion 212. The second blade portion 212 and the first blade portion 211 are located at two opposite edges of the same etching plane 23. In this case, the first blade portion 211 and the second blade portion 212 are not connected. In some cases, the first blade portion 211 and the second blade portion 212 are parallel; alternatively, the first blade portion 211 and the second blade portion 212 may not be parallel. As shown in Figure 6, in this third embodiment, the processing units 2 are arranged in a 3*4 array on the substrate 1. When the skin treatment element Y in the third embodiment is used to care for the stratum corneum, one end of the first blade 211 on the treatment unit 2 first contacts the skin, and then the first blade 211 gradually penetrates the skin. During the gradual penetration process, the etched surface 23 squeezes the stratum corneum and forms a clearing channel on the skin surface; then, the second blade 212 further squeezes the stratum corneum, causing the clearing channel to further open, thereby improving the skin's absorption effect. Example 4

[0067] Figure 7 is an enlarged schematic diagram of the processing unit in the fourth embodiment of the skin treatment element of the present invention. As shown in Figure 7, in this fourth embodiment, the first blade 211 is parallel to the substrate 1. Unlike in the first embodiment, the processing unit 2 also includes a second blade 212, which is located on opposite edges of the same etched plane 23 as the first blade 211. In this case, the first and second blades 211, 212, are not connected. When using the skin treatment element Y in this fourth embodiment to treat the stratum corneum, the first blade 211 of the processing unit 2 first contacts and penetrates the skin. During this penetration, the etched plane 23 and the stratum corneum are compressed against each other. Simultaneously, the second blade 212 further compresses the stratum corneum, further opening the dredging channels and enhancing the skin's absorption. Example 5

[0068] Figure 8 is an enlarged schematic diagram of the structure of the processing unit in the fifth embodiment of the skin treatment element of the present invention. Figure 9 is a schematic diagram of the structure of the fifth embodiment of the skin treatment element of the present invention. As shown in Figures 8 and 9, in this fifth embodiment, the processing unit 2 has a first blade 211 and a second blade 212. Unlike the fourth embodiment, the processing unit 2 also has a third blade 213. The third blade 213 and the second blade 212 are located at two opposite edges of the same etching plane 23, and the second blade 212 and the third blade 213 are not connected. The first blade 211, the second blade 212, and the third blade 213 form three separate cutting areas. In this fifth embodiment, the substrate 1 is disc-shaped, and the processing units 2 are arranged in a 3*3 array on one side of the substrate 1. The processing end with multiple blades formed by etching can not only perform multi-level processing on the stratum corneum on the skin surface, effectively promoting the further opening of the dredging channel, but also has good structural strength, which can reduce the chance of damage to the skin treatment element during processing and improve the safety and reliability of the skin treatment element during skin care. Example 6

[0069] Figure 10 is an enlarged schematic diagram of the structure of the treatment unit in the sixth embodiment of the skin treatment device of the present invention. As shown in Figure 10, in this sixth embodiment, the first blade portion 211 is parallel to the substrate 1. Unlike the first embodiment, the treatment unit 2 also includes a second blade portion 212, which is connected end to end to the first blade portion 211, forming a continuous blade portion with a certain angle. Example 7

[0070] Figure 11 is an enlarged schematic diagram of the processing unit in the seventh embodiment of the skin treatment element of the present invention. Figure 12 is a schematic diagram of the structure of the seventh embodiment of the skin treatment element of the present invention. In this seventh embodiment, the two etched planes 23 have different inclination angles and directions. The edges of the two etched planes form a first blade portion 211, which is parallel to the substrate 1. Unlike in the first embodiment, during the processing, the etching step further etches the first blade portion 211 and also etches away a portion of the first blade portion 211, forming a third etched plane 23. The edge of this etched plane 23 connected to the first blade portion 211 forms a second blade portion 212 and a third blade portion 213, with the second blade portion 212 and the third blade portion 213 forming a predetermined angle. In this seventh embodiment, the processing units are arranged in a 5*5 array on one side of the substrate 1. When the skin treatment element Y in the seventh embodiment is used to care for the stratum corneum, the first blade 211 on the treatment unit 2 first contacts the skin. During the gradual penetration process, the three etched planes push the stratum corneum, forming a special dredging channel on the stratum corneum, thereby improving the skin's absorption effect. Example 8

[0071] Figure 13 is a magnified electron microscope top view of the treatment end of the eighth embodiment of the skin treatment element of the present invention. As shown in Figure 13, in this eighth embodiment, the treatment end has four etched planes in different directions and angles. The edges of the etched planes form a first cutting edge and four second cutting edges connected to the first cutting edge at predetermined angles. The first cutting edge can be parallel to the substrate or at a predetermined angle to the substrate.

[0072] It should be noted that the shape and thickness of the substrate 1 can be flexibly adjusted according to design requirements and assembly requirements; the shape of the connecting seat 22 on the processing unit 2 can be adaptively changed according to process requirements or process flow; the number of etching planes 23 can be increased or decreased according to precision requirements, process requirements, etc.; the number and angle of the blades will also change with the inclination angle and direction of the etching plane 23, and are not limited to three or more; the above-mentioned changes in specific details all have a unique blade-type processing unit, and should also be covered in the inventive concept of the skin treatment element requested for protection in this application.

Claims

1. A skin treatment element, having a substrate and a treatment unit, the treatment unit having a treatment end and a connection base, the connection base being connected to one side surface of the substrate, Characterized in that, The treatment end has a first cutting edge.

2. The skin treatment element according to claim 1, Characterized in that, The first cutting edge is parallel to the substrate.

3. The skin treatment element according to claim 1, Characterized in that, The extension line of the first cutting edge intersects the substrate.

4. The skin treatment element according to claim 3, Characterized in that, The extension line of the first cutting edge intersects the substrate, and the intersection angle is greater than 0° and not greater than 60°.

5. The skin treatment element according to claim 1, Characterized in that, The length of the first cutting edge is not less than 10 nanometers.

6. The skin treatment element according to claim 1, Characterized in that, The substrate is made of at least one or a combination of single crystal silicon material, polymer material, metal material, and plastic.

7. The skin treatment element according to claim 6, Characterized in that, When the substrate is made of single crystal silicon material, the crystal plane orientation of the substrate is any one of (100), (110), and (111).

8. The skin treatment element according to claim 7, Characterized in that, A columnar substrate is formed on one side surface of the substrate, and the treatment unit is formed by chemically anisotropic etching of the columnar substrate.

9. The skin treatment element according to claim 8, Characterized in that, The shape of the columnar substrate is a prism or a cylinder, and the outer contour of the connection base is a polygon or a circle.

10. The skin treatment element according to claim 9, Characterized in that, The shape of the columnar substrate is a quadrangular prism, a hexagonal prism, or an octagonal prism, and the outer contour of the connection base is a rectangle, a hexagon, or an octagon.

11. The skin treatment element according to claim 8, Characterized in that, The chemically anisotropic etching process etches the columnar substrate according to the crystal plane orientation and forms an etched plane.

12. The skin treatment element according to claim 11, Characterized in that, The treatment unit has two or more of the etched planes, and the etched planes are formed between the connection base and the treatment end.

13. The skin treatment element according to claim 12, Characterized in that, The treatment end further has a second cutting edge, the second cutting edge and the first cutting edge are distributed on the edge of the same etched plane and the first cutting edge and the second cutting edge are not connected.

14. The skin treatment element according to claim 12, Characterized in that, The treatment end further has a second cutting edge, the second cutting edge is connected end to end with the first cutting edge, and an angle is formed between the second cutting edge and the first cutting edge.

15. The skin treatment element according to claim 1, Characterized in that, The treatment unit is made of at least one of single crystal silicon material, polymer material, and metal material.

16. The skin treatment element according to claim 1, Characterized in that, The treatment units are arranged in a specific array on one side surface of the substrate.

17. The skin treatment element according to claim 16, wherein, the treatment units are arranged in a grid array, a concentric circle array or a honeycomb array on the substrate.

18. The skin treatment element according to claim 16, wherein, the distance between adjacent treatment units is not less than 0.1 mm and not more than 5 mm.

19. The skin treatment element according to claim 1, wherein, the height of the treatment unit is not less than 10 nanometers and not more than 1 millimeter.

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