Connector socket and electronic device including same

Abstract

An electronic device according to one embodiment disclosed herein may comprise: a circuit board on which a plurality of conductive pads are formed; and a connector socket disposed on the circuit board. The connector socket may comprise: a connector housing including a plurality of openings and a side wall formed to surround at least a portion of the plurality of openings; and a plurality of conductive pins disposed to pass through the plurality of openings of the connector housing and including a first portion exposed toward a front surface and a second portion exposed toward a rear surface and electrically connected to the plurality of conductive pads. The side wall of the connector housing includes a protruding portion protruding toward the rear surface, and the second portion of the plurality of conductive pins may be positioned so as to be surrounded by the protruding portion and not exposed to the outside.

Description

Connector socket and electronic device including same

[0001] One embodiment disclosed in this document relates to a connector socket and an electronic device including the same.

[0002] With the advancement of technology in electronics, information, and communication technologies, the trend of integrating various functions into a single portable communication device or electronic device is accelerating. For example, smartphones incorporate functions such as audio playback, photography, and electronic notebooks in addition to communication functions. Furthermore, the installation of additional applications allows smartphones to offer even more diverse functions.

[0003] Portable devices, such as laptops, tablet PCs, or smartphones, may include various input / output structures or interfaces for electrical connection between internal components of the device or with external devices. For example, the portable device may include a connector structure for connecting a main circuit board and at least one sub-circuit board electrically connected to the main circuit board.

[0004] The connector structure is a structure for electrical connection between circuit boards (e.g., a main circuit board and a sub-circuit board), and a connector (e.g., a female connector or a male connector) mounted on the main circuit board and another connector (e.g., a male connector or a female connector) mounted on the sub-circuit board for electrical connection with the main circuit board can be provided to be electrically coupled to each other.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0006] The present invention is defined by the three appended claims.

[0007] An electronic device according to one embodiment of the present disclosure may include a circuit board having a plurality of conductive pads formed thereon, and a connector socket disposed on the circuit board. The connector socket may include a connector housing including a plurality of openings and a side wall formed to surround at least a portion of the plurality of openings, and a plurality of conductive pins disposed to penetrate the plurality of openings of the connector housing, the conductive pins including a first portion exposed toward a front side and a second portion exposed toward a rear side to be electrically connected to the plurality of conductive pads. The side wall of the connector housing may include a protruding portion protruding (e.g., extended) toward the rear side, and the second portions of the plurality of conductive pins may be positioned so as to be surrounded by the protruding portions and not exposed to the outside.

[0008] A connector socket according to one embodiment of the present disclosure may include a connector housing including a plurality of openings and a sidewall formed to surround at least a portion of the plurality of openings, and a plurality of conductive pins disposed to penetrate the plurality of openings of the connector housing, the conductive pins including a first portion exposed toward the front and a second portion exposed toward the rear to form an electrical contact with a circuit board. The sidewall of the connector housing may include a protruding portion protruding toward the rear, and the second portion of the plurality of conductive pins may be surrounded by the protruding portion.

[0009] However, the problem to be solved in the present disclosure is not limited to one or more of the above-mentioned embodiments, and may be determined in various ways without departing from the spirit and scope of the present disclosure.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0011] FIG. 2 is a perspective view of the front of a connector socket (30) according to one embodiment of the present disclosure.

[0012] FIG. 3 is a perspective view of the rear of a connector socket (30) according to one embodiment of the present disclosure.

[0013] FIG. 4 is a perspective view of the rear side of a cross-sectional view of the connector socket (30) of FIG. 2 cut along line AA` according to one embodiment of the present disclosure.

[0014] FIG. 5 is a cross-sectional view of the connector socket (30) of FIG. 2 placed on a circuit board according to one embodiment of the present disclosure, taken along line AA`.

[0015] FIG. 6 is a cross-sectional view showing a coupling state between a connector socket and a connector plug according to one embodiment of the present disclosure.

[0016] Fig. 7a is a cross-sectional view showing the structure of a general connector socket (20).

[0017] FIG. 7b is a cross-sectional view showing the structure of a connector socket (30) according to one embodiment of the present disclosure.

[0018] Fig. 8a is a cross-sectional view showing a general connector socket (20) and conductive connection pads (21a) of a circuit board (21) for electrical connection.

[0019] FIG. 8b is a cross-sectional view showing conductive pads (212) of a circuit board (210) for electrical connection with a connector socket (30) according to one embodiment of the present disclosure.

[0020] FIG. 9a is a perspective view of the rear of a connector socket (30a) according to one embodiment of the present disclosure.

[0021] FIG. 9b is a perspective view of the rear side of a cross-sectional view of the connector socket (30a) of FIG. 9a cut along the BB` line according to one embodiment of the present disclosure.

[0022] FIG. 10 is a cross-sectional view of the connector socket (30a) of FIG. 9a placed on a circuit board (210a) according to one embodiment of the present disclosure, taken along line BB`.

[0023] FIG. 11a is a perspective view of the rear of a connector socket (30b) according to one embodiment of the present disclosure.

[0024] FIG. 11b is a perspective view of the rear side of a cross-sectional view of the connector socket (30b) of FIG. 11a cut along line CC` according to one embodiment of the present disclosure.

[0025] FIG. 12 is a cross-sectional view of the connector socket (30b) of FIG. 11a placed on a circuit board (210) according to one embodiment of the present disclosure, taken along line CC`.

[0026] FIG. 13a is a perspective view of the rear of a connector socket (30c) according to one embodiment of the present disclosure.

[0027] FIG. 13b is a perspective view of the rear side of a cross-sectional view of the connector socket (30c) of FIG. 13a cut along the line DD` according to one embodiment of the present disclosure.

[0028] FIG. 14 is a cross-sectional view taken along line DD` of the connector socket (30c) of FIG. 13a disposed on a circuit board (210a) according to one embodiment of the present disclosure.

[0029] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0030] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0031] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0032] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0033] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] FIG. 2 is a perspective view of the front of a connector socket (30) according to one embodiment of the present disclosure.

[0057] FIG. 3 is a perspective view of the rear of a connector socket (30) according to one embodiment of the present disclosure.

[0058] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include a circuit board (e.g., circuit board (210) of FIG. 5) and a connector socket (30) disposed on the circuit board (210). The connector socket (30) may be an electrical component that forms an electrically connected circuit by being coupled male and female with a connector plug (e.g., connector plug (40) of FIG. 6). The connector socket (30) may be referred to as, for example, a connector receptacle, a connector female, or a concentic plug.

[0059] The configuration of the connector socket (30) of FIGS. 2 and 3 may be partially or entirely identical to the configuration of the connection terminal (178) of FIG. 1. The embodiments of FIGS. 2 and 3 may be optionally combined with the embodiments of FIGS. 4 to 14.

[0060] According to one embodiment, the connector socket (30) may be disposed within the electronic device (101) and may provide a physical and electrical connection between other electrical components disposed within the electronic device (101). According to one embodiment, the connector socket (30) may be exposed at least partially from one end of the electronic device (101) and may provide a physical and electrical connection with an external electronic device (e.g., the electronic device (102) of FIG. 1).

[0061] According to one embodiment, the connector socket (30) may include a connector housing (300), and a plurality of conductive pins (400) arranged within the connector housing (300). The connector housing (300) may include a bottom side part designed to be coupled to one side (e.g., one surface) of a circuit board (210), and a top side part designed to be insertable at least a portion of a connector plug (40).

[0062] According to one embodiment, the connector housing (300) may include a supporting frame (310), a plurality of openings (320), a side wall (330) formed to surround at least a portion of the plurality of openings (320), a central wall (340) that partially partitions an inner space, and / or a coupling portion (350) for coupling with a circuit board (210). The components of the connector housing (300) (e.g., the supporting frame (310), the plurality of openings (320), the side wall (330), the central wall (340), and / or the coupling portion (350)) may be selectively coupled.

[0063] According to one embodiment, the support frame (310) forms a lower side (e.g., a side facing the -Z axis) of the connector housing (300) and may support side walls (330), a central wall (340), and / or mating portions (350) of the connector housing (300). The support frame (310) may be positioned to face the circuit board (210).

[0064] According to one embodiment, the side wall (330) may constitute a portion of the exterior of the connector housing (300). The side wall (330) may be arranged to surround the inner space (S) of the connector housing (300). The side wall (330) may include a first side wall portion (331), a second side wall portion (332), a third side wall portion (333), and / or a fourth side wall portion (334). The first side wall portion (331), the second side wall portion (332), the third side wall portion (333), and / or the fourth side wall portion (334) may have a square loop shape when viewed from the front side of the connector housing (300).

[0065] According to one embodiment, the first side wall portion (331) may have a first length along a first longitudinal direction (e.g., the Y-axis direction). The second side wall portion (332) may extend in a second longitudinal direction (e.g., the X-axis direction) that is substantially perpendicular from the first side wall portion (331). The second side wall portion (332) may extend to have a length shorter than the first length. The third side wall portion (333) may extend in a substantially perpendicular direction (e.g., the Y-axis direction) from the second side wall portion (332). The third side wall portion (333) may extend in a direction that is substantially parallel to the first side wall portion (331). The third side wall portion (333) may have the first length along the first longitudinal direction. The fourth side wall portion (334) may extend in a substantially perpendicular direction (e.g., in the Y-axis direction) from the third side wall portion (333) (or the first side wall portion (331)). The fourth side wall portion (334) may extend in a substantially parallel direction with the second side wall portion (332). The fourth side wall portion (334) may have the second length along the second longitudinal direction.

[0066] According to one embodiment, the first side wall portion (331), the second side wall portion (332), the third side wall portion (333), and / or the fourth side wall portion (334) may have at least a portion of a curved side. The shape of the first side wall portion (331), the second side wall portion (332), the third side wall portion (333), and / or the fourth side wall portion (334) may be a rectangular shape (e.g., a square or a rectangle). The first side wall portion (331), the second side wall portion (332), the third side wall portion (333), and / or the fourth side wall portion (334) may be formed integrally, but is not limited thereto.

[0067] According to one embodiment, the sidewall (330) may include a plurality of first grooves (335). Each of the plurality of first grooves (335) of the sidewall (330) may be formed to be concave or curved so as to position (e.g., insert) at least a portion of each of the plurality of conductive pins (400).

[0068] According to one embodiment, a plurality of first grooves (335) of the side wall (330) may correspond to a plurality of second grooves (345) formed in the central wall (340). For example, a plurality of first-first grooves (335a) arranged in parallel along a first longitudinal direction (e.g., Y-axis direction) of the first side wall portion (331) may be formed to correspond to (e.g., face) a plurality of second-first grooves (345a) arranged on one side of the central wall (340). For example, a plurality of first-second grooves (335b) arranged in parallel along a first longitudinal direction (e.g., Y-axis direction) of the third side wall portion (333) may be formed to correspond to (e.g., face) a plurality of second-second grooves (345b) arranged on the other side of the central wall (340). The plurality of first-first grooves (335a) of the first side wall portion (331) and the plurality of first-second grooves (335b) of the third side wall portion (333) are in a form that is open toward the inner space and may be named at least one of a slit, a recess, or a space with one side open.

[0069] According to one embodiment, each of the plurality of conductive pins (400) may have a part positioned within the first groove (335) and another part positioned within the second groove (345). For example, a part of the conductive pin (400) (e.g., the first-first portion (410a) of FIG. 5) may be inserted within the first groove (335) of the side wall (330), and another part (e.g., the first-second portion (410b) of FIG. 5) may be inserted within the second groove (345) of the central wall (340). According to one embodiment, since the first groove (335) and the second groove (345) have a shape that is opened in the front direction (e.g., the +Z-axis direction), when the front side of the connector housing (300) is viewed, a part of the conductive pin (400) (e.g., the first portion (410)) may be exposed.

[0070] According to one embodiment, the side wall (330) may include a protruding portion (336) formed to protrude toward the rear side (e.g., in the -Z-axis direction) and be arranged to contact the circuit board (210) and surround the plurality of conductive pins (400) so as not to be exposed to the outside. For example, the protruding portion (336) may be shaped to protrude from one side (e.g., one side facing the -Z-axis) of the support frame (310). For example, the protruding portion (336) may be shaped to protrude from a portion (e.g., the second portion (420)) of the plurality of conductive pins (400) exposed from one side (e.g., one side facing the -Z-axis) of the support frame (310). The protruding portion (336) may be named at least one of an extended portion, a convex portion, a bump portion, a lump portion, or a dam.

[0071] According to one embodiment, the protruding portion (336) may be an end portion of the side wall (330) facing the -Z-axis direction. The end portion may be defined as an edge of the side wall (330) facing the -Z-axis direction and a portion adjacent thereto. When looking at the rear side of the connector housing (300), the protruding portion (336) may have a closed loop shape. For example, the protruding portion (336) may be formed by one end of the first side wall portion (331), one end of the third side wall portion (333), and a portion extending from the one end, and may have a rectangular (e.g., square or rectangular) loop shape. For example, the protruding portion (336) may include a first protruding portion (336a) which is an end portion of the first side wall portion (331), a third protruding portion (336c) which is an end portion of the third side wall portion (333), a second protruding portion (336b) which extends from the first protruding portion (336a) to the third protruding portion (336c) and is adjacent to the second side wall portion (332), and a fourth protruding portion (336d) which extends from the first protruding portion (336a) to the third protruding portion (336c) and is adjacent to the fourth side wall portion (334).

[0072] According to one embodiment, the protruding portion (336) may be stepped from one side (e.g., one side facing the -Z axis) of the support frame (310). A portion of the protruding portion (336) may be stepped from an end of the second side wall portion (332) and / or the fourth side wall portion (334).

[0073] According to one embodiment, the thickness of the protruding portion (336) may be different from the thicknesses of other portions of the side wall (330). For example, when looking at the front side of the connector housing (300), the thickness of the side wall (330) formed to surround the inner space (S) may have a first thickness, and when looking at the rear side of the connector housing (300), the thickness of the side wall (e.g., the protruding portion (336)) protruding in the -Z-axis direction may have a second thickness less than or equal to the first thickness. For example, the second thickness may be substantially less than or equal to half of the first thickness.

[0074] According to one embodiment, the central wall (340) may have a shape that protrudes from the center region of the support frame (310) toward the front side (e.g., in the +Z-axis direction) and may partially partition the inner space (S). The central wall (340) may have a shape that extends long along the first longitudinal direction (e.g., in the Y-axis direction) and may have a shape corresponding to at least a portion of the side wall (330) (e.g., a rectangle (e.g., a square or a rectangle)).

[0075] In one embodiment, the central wall (340) may be spaced apart from the side walls (330). For example, the central wall (340) may be spaced apart from the first side wall portion (331), the second side wall portion (332), the third side wall portion (333), and / or the fourth side wall portion (334) on each side. For example, when looking at the front side of the connector housing (300), the central wall (340) may have an island shape spaced apart from the side walls (330).

[0076] According to one embodiment, the central wall (340) may include a plurality of second grooves (345). Each of the plurality of second grooves (345) of the central wall (340) may be formed to be concave or curved so that at least a portion of each of the plurality of conductive pins (400) may be positioned (e.g., inserted). The plurality of second grooves (345) of the central wall (340) may correspond to the plurality of first grooves (335) formed in the side wall (330). For example, a plurality of second-first grooves (345a) arranged in parallel along a first longitudinal direction (e.g., a Y-axis direction) on one side portion (e.g., a portion facing the +X-axis direction) of the central wall (340) may be formed to correspond to the plurality of first grooves (335) arranged on the first side wall portion (331). For example, a plurality of second-second grooves (345b) arranged in parallel along the first longitudinal direction (e.g., the Y-axis direction) on the other side portion (e.g., the portion facing the -X-axis direction) of the central wall (340) may be formed to correspond to a plurality of first-second grooves (335b) arranged on the third side wall portion (333). The plurality of second-first grooves (345a) and second-second grooves (345b) of the central wall (340) are formed to be open toward the inner space (S) and may be named at least one of a slit, a recess, or a space having one side open.

[0077] According to one embodiment, each of the plurality of conductive pins (400) may have a portion positioned within the first groove (335) and another portion positioned within the second groove (345). For example, a portion (e.g., the first-first portion (410a)) of the conductive pin (400) may be inserted within the second groove (345) of the central wall (340), and another portion (e.g., the first-second portion (410b)) may be inserted within the first groove (335) of the side wall (330). According to one embodiment, since the first groove (335) and the second groove (345) have a shape that is open toward the front, when the front side of the connector housing (300) is viewed, a portion (e.g., the first portion (410)) of the conductive pin (400) may be exposed.

[0078] According to one embodiment, the plurality of openings (320) may be arranged to penetrate the connector housing (300) as a space (e.g., a gap) in which the plurality of conductive pins (400) are positioned or exposed to the outside of the connector housing (300).

[0079] According to one embodiment, a plurality of openings (320) may be arranged in parallel on both sides of a central wall (340). The plurality of openings (320) may include first openings (320a) formed between the central wall (340) and the first side wall portion (331) and second openings (320b) formed between the central wall (340) and the third side wall portion (333). The first openings (320a) and the second openings (320b) may be formed in substantially the same number and may be arranged in parallel to correspond to each other. At least some of the plurality of conductive pins (400) may be inserted into each of the first openings (320a) and the second openings (320b).

[0080] According to one embodiment, at least a portion of the space of the plurality of openings (320) may be formed to penetrate the support frame (310), and when viewed toward the rear side of the support frame (310), the plurality of openings (320) may be arranged in parallel with a constant size and spacing.

[0081] According to one embodiment, the inner space (S) of the connector housing (300) may include a first space (S1) for arranging a plurality of conductive pins (400) and a second space (S2) for seating (e.g., placing) the connector plug (40). The first space (S1) and the second space (S2) may be connected to each other. The first space (S1) may include a plurality of openings (320) and adjacent areas of the plurality of openings (320).

[0082] According to one embodiment, a first space (S1) (e.g., a plurality of openings (320)) formed by the first side wall (330) (or the third side wall (330)) and the central wall (340) of the inner space (S) may be a space in which at least a portion of a plurality of conductive pins (400) is arranged. For example, a portion of each of the plurality of conductive pins (400) that is not inserted into the first groove (335) of the first side wall (330) and / or a portion that is not inserted into the second groove (345) of the central wall (340) may protrude or become into the first space (S1) to facilitate contact with the conductive terminals of the connector plug (40). For example, the non-inserted portion of each of the plurality of conductive pins (400) may be positioned within the first space (S1) (e.g., a plurality of openings (320)).

[0083] According to one embodiment, the second space (S2) formed by the second side wall (330) (or the fourth side wall (330)) and the central wall (340) of the inner space (S) may be a space into which a protruding portion (not shown) of the connector plug (40) is inserted. The connector plug (40) may include a protruding portion for being inserted into the connector housing (300) and fixed to the connector socket (30) in addition to the electrical contact with the conductive pins (400) to ensure stable coupling with the connector socket (30). The protruding portion of the connector plug (40) and the second space (S2) of the connector housing (300) may be coupled in a male-female manner with corresponding shapes.

[0084] According to one embodiment, the second space (S2) may be defined as a space between both ends of the central wall (340) and the side walls (330). For example, the second space (S2) may include a 2-1 space (S21) that provides a space between one end of the central wall (340) (e.g., an end facing the +Y axis) and the second side wall portion (332), and a 2-2 space (S22) that provides a space between the other end of the central wall (340) (e.g., an end facing the -Y axis) and the second side wall portion (332).

[0085] According to one embodiment, the second space (S2) and the portion formed to surround the second space (S2) may be referred to as an upper joining portion. For example, the second-first space (S21) may be a space surrounded by the second side wall portion (332), the central wall (340), a portion of the first side wall portion (331), and a portion of the third side wall portion (333), and may extend toward the first space (S1). For example, the second-second space (S22) may be a space surrounded by the fourth side wall portion (334), the central wall (340), a portion of the first side wall portion (331), and a portion of the third side wall portion (333), and may extend toward the first space (S1).

[0086] According to one embodiment, the coupling portion (350) may extend from both ends of the support frame (310) and be connected to one side of the circuit board (210). The coupling portion (350) may be referred to as a lower coupling portion. For example, the upper coupling portion of the connector housing (300) may be a portion for coupling and fixing with the connector plug (40), and the lower coupling portion of the connector housing (300) may be a portion for coupling and fixing with the circuit board (210).

[0087] According to one embodiment, the coupling portion (350) may include a seating area (351) extending from the support frame (310) or the side wall (330), and a fixed area (353) protruding from the seating area (351) toward the outside of the side wall (330). The seating area (351) may extend from both ends of the support frame (310) or the protruding portion (336). For example, the seating area (351) may include a region extending from the second protruding portion (336b) and a region extending from the fourth protruding portion (336d). For example, the seating area (351) may include a region disposed on one end direction (e.g., +Y-axis direction) of the support frame (310) and a region disposed on one end direction (e.g., -Y-axis direction) of the support frame (310). The fixed area (353) has a shape that protrudes from both ends (e.g., +X-axis direction, -X-axis direction) of the settling area (351) and can be in contact with and fixed to one side of the circuit board (210).

[0088] According to one embodiment, a plurality of conductive pins (400) are arranged in an inner space (S) of the connector housing (300), at least some of which are exposed and can be electrically connected to the connector plug (40) and / or the circuit board (210).

[0089] According to one embodiment, a plurality of conductive pins (400) may be arranged to penetrate a plurality of openings (320) of a connector housing (300) and may include a first portion (410) exposed toward a front side (e.g., in the +Z-axis direction) and a second portion (420) exposed toward a rear side (e.g., in the -Z-axis direction) to be electrically connected to a circuit board (210) (e.g., a plurality of conductive pads (212) of the circuit board (210) of FIG. 5).

[0090] According to one embodiment, the plurality of conductive pins (400) may include first conductive pins (400a) arranged in a first space (S1) of the connector housing (300) and second conductive pins (400b) arranged in a second space (S2) of the connector housing (300). The first conductive pins (400a) may each have the same shape and may be arranged at a designated (e.g., set) interval within the first space (S1) along a first longitudinal direction (e.g., Y-axis direction). The second conductive pins (400b) may each have the same shape and may be arranged at a designated interval within the second space (S2) along a first longitudinal direction (e.g., Y-axis direction). The first conductive pins (400a) and the second conductive pins (400b) may be arranged in parallel with each other with the central wall (340) therebetween.

[0091] According to one embodiment, among the plurality of conductive pins (400), the first conductive pins (400a) may be positioned between the first side wall portion (331) and the central wall (340). For example, each of the first conductive pins (400a) may maintain a state in which at least a portion thereof is inserted into the first-first groove (335a) formed in the first side wall portion (331) and the second-first groove (345a) of the central wall (340). For example, since the first-first groove (335a) and the second-first groove (345a) are opened on the front side (e.g., in the +Z-axis direction), each of the first conductive pins (400a) may have a portion thereof facing the front side exposed to the outside of the connector housing (300). For example, since each of the first conductive pins (400a) includes at least a portion of an elastic part, when coupled with the connector plug (40), the elastic part is pushed toward the inside of the second-first groove (345a) and provides elastic force in the opposite direction, thereby strengthening the coupling force.

[0092] For example, each of the second conductive pins (400b) may maintain a state in which at least a portion thereof is inserted into the first-second groove (335b) formed in the third side wall portion (333) and the second-second groove (345b) of the central wall (340). For example, since the first-second groove (335b) and the second-second groove (345b) are opened on the front side (e.g., in the +Z-axis direction), each of the second conductive pins (400b) may have a portion facing the front side exposed to the outside of the connector housing (300). For example, since each of the second conductive pins (400b) includes at least a portion of an elastic portion, when coupled with the connector plug (40), the elastic portion may be pushed inward into the second-second groove (345b) and provide elastic force in the opposite direction to strengthen the coupling force.

[0093] FIG. 4 is a perspective view of the rear side of a cross-sectional view of the connector socket (30) of FIG. 2 cut along line AA` according to one embodiment of the present disclosure.

[0094] FIG. 5 is a cross-sectional view of the connector socket (30) of FIG. 2 placed on a circuit board according to one embodiment of the present disclosure, taken along line AA`.

[0095] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include a circuit board (210) and a connector socket (30) disposed on the circuit board (210). The connector socket (30) may include a connector housing (300) and a plurality of conductive pins (400) disposed within the connector housing (300).

[0096] The configuration of the connector socket (30) of FIGS. 4 and 5 may be partially or completely identical to the configuration of the connector socket (30) of FIGS. 2 and 3. The embodiments of FIGS. 4 and 5 may be optionally combined with the embodiments of FIGS. 2 and 3 and the embodiments of FIGS. 6 to 14.

[0097] According to one embodiment, the connector housing (300) may include a supporting frame (310), a plurality of openings (320), and a side wall (330) formed to surround at least a portion of the plurality of openings (320), and / or a central wall (340) that partially partitions an inner space.

[0098] According to one embodiment, the connector housing (300) has an open upper shape, and the side wall (330) of the connector housing (300) may be arranged to surround an inner space. According to one embodiment, the side wall (330) of the connector housing (300) may include an extension portion (337) extending toward the front side (e.g., in the +Z-axis direction). The extension portion (337) may have a shape that protrudes further toward the front side (e.g., in the +Z-axis direction) compared to the center wall (340). When the extension portion (337) is coupled with a connector plug (e.g., the connector plug (40) of FIG. 6), the connector housing (300) may provide an inner space that is blocked from the outside without an open portion.

[0099] According to one embodiment, the side wall (330) of the connector housing (300) may include a protruding portion (336) formed to protrude (e.g., extend) toward the rear side (e.g., in the -Z-axis direction) and be in contact with the circuit board (210), surround the plurality of conductive pins (400), and not expose them. The protruding portion (336) may limit or reduce the inflow of foreign substances (e.g., moisture or dust) into the lower side of the connector housing (300) by limiting the formation of a gap between the lower side of the connector housing (300) and the circuit board (210). The protruding portion (336) may provide a sealing function between the connector housing (300) and the circuit board (210).

[0100] According to one embodiment, the circuit board (210) may include a recess (215) for positioning a protruding portion (336) of the connector housing (300). The recess (215) may be a groove-shaped groove formed inwardly of the circuit board (210) and may be provided in a shape corresponding to the shape of the protruding portion (336). For example, when the protruding portion (336) is a loop-shaped shape formed to surround the lower sides of a plurality of conductive pins (400), the recess (215) may be a loop-shaped shape corresponding to the protruding portion (336) so that the protruding portion (336) can be fitted as a whole. The recess (215) may be formed through a surface (a side) etching process of the circuit board (210).

[0101] According to the present disclosure, the state in which the protruding portion (336) of the connector housing (300) is inserted and coupled into the recess (215) of the circuit board (210) can seal the inner space of the connector housing (300) from the outside. Accordingly, a plurality of conductive pins (400) can be blocked from the outside by the coupling of the connector housing (300) and the circuit board (210) without a separate coating treatment, and the inflow of foreign substances (e.g., moisture or dust) can be limited or reduced.

[0102] According to one embodiment, a plurality of conductive pads (212) may be arranged on one side (e.g., one side facing the +Z axis) of the circuit board (210). Since the plurality of conductive pads (212) are formed for electrical connection with the plurality of conductive pins (400), the plurality of conductive pads (212) may be formed in positions and numbers corresponding to the plurality of conductive pins (400). For example, each of the plurality of conductive pads (212) may be electrically connected to each of the plurality of conductive pins (400) that face or contact each other through a soldering process.

[0103] According to one embodiment, a plurality of conductive pads (212) may be arranged in parallel on both sides with respect to an imaginary center line (X1) extending from a center wall (340) of a connector housing (300). The plurality of conductive pads (212) may include first conductive pads (212a) arranged inside the first openings (320a) of the connector housing (300) and / or on the circuit board (210), and second conductive pads (212b) arranged inside the second openings (320b) of the connector housing (300) and / or on the circuit board (210). The first conductive pads (212a) may each have the same shape and may be arranged at a specified interval along a first longitudinal direction (e.g., Y-axis direction). The second conductive pads (212b) may each have the same shape and may be arranged at a specified interval along a first longitudinal direction (e.g., Y-axis direction). The first conductive pads (212a) and the second conductive pads (212b) can be arranged parallel to each other with an imaginary center line (X1) between them.

[0104] According to one embodiment, a plurality of conductive pins (400) are arranged in an inner space (e.g., a plurality of openings (320)) of the connector housing (300), at least some of which are exposed and can be electrically connected to the connector plug (40) and / or the circuit board (210).

[0105] According to one embodiment, each of the plurality of conductive pins (400) may be arranged to penetrate through the plurality of openings (320) of the connector housing (300) and include a first portion (410) exposed toward the front side (e.g., in the +Z-axis direction), a second portion (420) exposed toward the rear side (e.g., in the -Z-axis direction) to be electrically connected to the plurality of conductive pads (212) of the circuit board (210), and / or a third portion (430) for fixing to the connector housing (300).

[0106] According to one embodiment, each of the plurality of conductive pins (400) has a first portion (410) that is at least partially exposed to the outside of the connector housing (300), and the exposed portion is substantially for electrical connection with the connector plug (40), and may not be exposed when coupled with the connector plug (40). The first portion (410) may include a first-first portion (410a) and a first-second portion (410b) that are spaced apart from each other, and a conductive terminal (e.g., a conductive terminal (43) of FIG. 6) of the connector plug (40) is inserted into a space formed by the first-first portion (410a) and the first-second portion (410b), and both sides of the conductive terminal (43) may come into contact with the first-first portion (410a) and the first-second portion (410b), respectively, to form a contact point.

[0107] According to one embodiment, the first-first portion (410a) may be a portion adjacent to the central wall (340), and the first-second portion (410b) may be a portion adjacent to the side wall (330). For example, the first-first portion (410a) may be at least partially inserted into a groove of the central wall (340) (e.g., the second-first groove (345a), the second-second groove (345b) of FIG. 2) and may have a partially curved shape. The groove of the central wall (340) (e.g., the second-first groove (345a), the second-second groove (345b) of FIG. 2) is open toward the front side (e.g., in the +Z-axis direction), so that when the front side is viewed, the first-first portion (410a) may be at least partially visible.

[0108] According to one embodiment, the first-first portion (410a) may be inserted into a groove (e.g., the second-first groove (345a), the second-second groove (345b)) of the central wall (340), and may include an end portion (410aa) adjacent to an imaginary center line (X1) and a second portion (420) extending from the end portion (410aa) and a curved elastic portion (410ab). The elastic portion (410ab) may move left and right in the X-axis direction due to the engagement and disengagement of the connector plug (40). For example, the elastic portion (410ab) may maintain a strong engagement with the connector plug (40) by moving a portion in the -X-axis direction and providing an elastic force in the +X-axis direction when the connector plug (40) is inserted.

[0109] According to one embodiment, the first-second portion (410b) is inserted into a groove (e.g., the first-first groove (335a) and the first-second groove (335b) of FIG. 2) of the side wall (e.g., the first side wall portion (331) and the third side wall portion (333)), and may have a partially curved shape. The groove (e.g., the first-first groove (335a) and the first-second groove (335b) of FIG. 2) of the side wall (e.g., the first side wall portion (331) and the third side wall portion (333)) is opened toward the front side (e.g., in the +Z-axis direction), so that when the front side (e.g., in the +Z-axis direction) is viewed, the first-second portion (410b) can be at least partially visible.

[0110] According to one embodiment, the first-second portion (410b) may be inserted into a groove of the side wall (330) (e.g., the first-first groove (335a) and the first-second groove (335b) of FIG. 2), and may include a support portion (410ba) that contacts the side wall and a curved contact portion (410bb) that extends from the support portion (410ba) to the third portion (430). The contact portion (410bb) may protrude toward the inner space (S) to provide electrical contact with the elastic portion (410ab) when the connector plug (40) is engaged.

[0111] According to one embodiment, the second portion (420) of each of the plurality of conductive pins (400) may be disposed between the first-first portion (410a) and the first-second portion (410b), and may extend from the first-first portion (410a) to the first-second portion (410b). For example, each of the plurality of conductive pins (400) may be a pin structure extending from the first-first portion (410a), the second portion (420), and the first-second portion (410b), and the first-first portion (410a), the second portion (420), and the first-second portion (410b) may be designed with different shapes.

[0112] According to one embodiment, the second portion (420) of each of the plurality of conductive pins (400) may be a portion for electrical connection (e.g., soldering) with a conductive pad (212) of a circuit board (210), and may be in the shape of a flat plate.

[0113] Unlike the conductive pins of a general connector socket (e.g., the connector socket (20) of FIG. 7a), the conductive pins (400) of the connector socket (30) according to one embodiment may have a portion (e.g., a second portion (420)) for electrical connection with the circuit board (210) disposed inside the connector socket (30). For example, when the connector socket (30) is coupled with the connector plug (40), the conductive terminals (43) of the connector plug (40) and the second portions (420) of the conductive pins (400) may face each other while being spaced apart from each other. Accordingly, the size of the conductive pins (400) of the connector socket (30) may be reduced, and the overall size of the connector socket (30) in which the conductive pins (400) are mounted may be reduced.

[0114] In one embodiment, the third portion (430) of each of the plurality of conductive pins (400) can be received in a portion of the connector housing (300) to secure the conductive pin (400). The side walls of the connector housing (300) (e.g., the first side wall portion (331) and the third side wall portion (333)) can include a rearwardly concave (e.g., curved) receiving groove (338). The third portion (430) of each of the plurality of conductive pins (400) extends from one end of the first-second portion (410b) and is inserted into the receiving groove (338) to secure each of the plurality of conductive pins (400) to the connector housing (300). The third portion (430) of each of the plurality of conductive pins (400) is fitted into the receiving groove (338) in the -Z-axis direction, and the length of the third portion (430) coupled with the receiving groove (338) may be more than half the height of the side wall (e.g., the first side wall portion (331) and the third side wall portion (333)). Accordingly, each of the conductive pins (400) can maintain a stable state as a whole.

[0115] FIG. 6 is a cross-sectional view showing a coupling state between a connector socket and a connector plug according to one embodiment of the present disclosure.

[0116] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include a first circuit board (210), a second circuit board (220) spaced apart from and facing the first circuit board (210), a connector socket (30) disposed on the first circuit board (210), and a connector plug (40) disposed on the second circuit board (220).

[0117] According to one embodiment, the connector socket (30) may include a connector housing (300), a plurality of conductive pins (400) arranged within the connector housing (300). According to one embodiment, the connector plug (40) may include a support member (41), and a conductive terminal (43) formed to surround a portion of the support member (41).

[0118] The configuration of the connector socket (30) of Fig. 6 may be partially or entirely identical to the configuration of the connector socket (30) of Figs. 2 to 5. The embodiment of Fig. 6 may be optionally combined with the embodiments of Figs. 2 to 5 and the embodiments of Figs. 7 to 14.

[0119] According to one embodiment, the support member (41) of the connector plug (40) is a structure that can be inserted into the inner space of the connector housing (300) and may be made of an insulating material. The support member (41) may include a support portion facing the second circuit board (220) and a protruding portion at both ends of the support portion that is bent toward one side (e.g., the inner space of the connector housing (300)). For example, the support member (41) may have a '┏┓' shape.

[0120] According to one embodiment, the conductive terminal (43) of the connector plug (40) may be arranged to surround the protruding portions of both ends of the support member, and may include a portion bent toward the inner space of the connector housing (300) and a ground portion coupled (e.g., soldered) on the second circuit board (220). The conductive terminal (43) of the connector plug (40) may be formed in multiple pieces to correspond to the plurality of conductive pins (400) as a portion for electrical connection with the conductive pins (400) of the connector socket (30).

[0121] According to one embodiment, the plurality of conductive terminals (43) of the connector plug (40) may include first conductive terminals (43a) corresponding to the first conductive pins (400a) and second conductive terminals (43b) corresponding to the second conductive pins (400b). The first conductive terminals (43a) may each have the same shape and may be arranged with a designated interval for physical coupling and electrical coupling with the first conductive pins (400a) within the first opening (320a) along the first longitudinal direction (e.g., Y-axis direction). The second conductive terminals (43b) may each have the same shape and may be arranged with a designated interval for physical coupling and electrical coupling with the second conductive pins (400b) within the second opening (320b) along the first longitudinal direction (e.g., Y-axis direction). The first conductive terminals (43a) and the second conductive terminals (43b) can be arranged parallel to each other with the central wall (340) between them.

[0122] According to one embodiment, the connector socket (30) and the connector plug (40) can be mated in a male-female manner. The conductive terminal (43) of the connector plug (40) can be plugged into the inner space of the connector socket (30) to provide an electrical connection between the first circuit board (210) and the second circuit board (220). Thereafter, the conductive terminal (43) of the connector plug (40) can be plugged out from the inner space of the connector socket (30) to provide electrical separation between the first circuit board (210) and the second circuit board (220).

[0123] According to one embodiment, the plug-in state may be a state in which the first conductive pins (400a) of the connector socket (30) are in contact with the first conductive terminals (43a) of the connector plug (40) and are electrically connected. For example, the first conductive terminal (43a) of the connector plug (40) may be inserted between the first portions (e.g., the spaced 1-1 portion (410a) and the 1-2 portion (410b)) of the first conductive pins (400a) of the connector socket (30), such that one side (e.g., one side facing the -X axis) of the first conductive terminal (43a) facing the center wall (340) may contact (or overlap) the 1-1 portion (410a), and one side (e.g., one side facing the +X axis) of the first conductive terminal (43a) may contact (or overlap) the 1-2 portion (410b). For example, the second conductive terminal (43b) of the connector plug (40) may be inserted between the first portions (e.g., the spaced 1-1 portion (410a) and the 1-2 portion (410b)) of the second conductive pins (400b) of the connector socket (30), such that one side (e.g., one side facing the +X axis) of the second conductive terminal (43b) facing the center wall (340) may contact (or overlap) the 1-1 portion (410a), and one side (e.g., one side facing the -X axis) of the second conductive terminal (43b) may contact (or overlap) the 1-2 portion (410b).

[0124] According to one embodiment, the side wall (330) of the connector housing (300) (e.g., the first side wall portion (331), the third side wall portion (333)) may include a protruding portion (336) facing the first circuit board (210) and an extending portion (337) facing the second circuit board (220). The protruding portion (336) and the extending portion (337) may have a closed loop shape. The protruding portion (336) may be arranged in contact with the first circuit board (210) to partition and / or separate a space where the conductive pin (400) and the conductive terminal (43) are located from another space. For example, the protruding portion (336) may be maintained in a state inserted into a recess (215) of the first circuit board (210). In the plug-in state, the extension portion (337) can be brought into contact with the second circuit board (220) to partition and / or separate the space where the conductive pin (400) and the conductive terminal (43) are located and other spaces.

[0125] According to one embodiment of the present disclosure, the lower and upper sides where the conductive pin (400) and the conductive terminal (43) are coupled can be blocked from the outside by the side walls of the connector housing (300) (e.g., the protruding portion (336) and the extended portion (337)). Accordingly, the ingress of foreign substances (e.g., moisture or dust) into the inside of the connector socket (30) and the connector plug (40) can be limited or reduced.

[0126] Fig. 7a is a cross-sectional view showing the structure of a general connector socket (20), and Fig. 7b is a cross-sectional view showing the structure of a connector socket (30) according to one embodiment of the present disclosure.

[0127] FIG. 8a is a cross-sectional view showing conductive connection pads (21a) of a circuit board (21) for electrical connection with a general connector socket (20), and FIG. 8b is a cross-sectional view showing conductive pads (212) of a circuit board (210) for electrical connection with a connector socket (30) according to one embodiment of the present disclosure.

[0128] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include a circuit board (210) and a connector socket (30) disposed on the circuit board (210). The connector socket (30) may include a connector housing (300) and a plurality of conductive pins (400) disposed within the connector housing (300).

[0129] The configuration of the connector socket (30) of FIGS. 7b and 8b may be partially or entirely identical to the configuration of the connector socket (30) of FIGS. 2 to 6. The embodiments of FIGS. 7b and 8b may be optionally combined with the embodiments of FIGS. 2 to 6 and the embodiments of FIGS. 9 to 14.

[0130] Hereinafter, the differences between the general connector socket (20) of FIGS. 7a and 8a and the connector socket (30) of the present disclosure of FIGS. 7b and 8b will be described.

[0131] Referring to the structure of the connector socket (20) and the circuit board (21) of FIGS. 7A and 8A, the connector housing (22) may be structured so that a portion for coupling with a connector plug (e.g., connector plug (40) of FIG. 6) is located inside the connector housing (22), and a portion for coupling with the circuit board (21) (e.g., mounting portion (P1)) may be located outside the connector housing (22). For example, the mounting portion (P1) of the first conductive pins (23a) may be located outside the connector housing (22) (e.g., in the +X-axis direction), and the mounting portion (P1) of the second conductive pins (23a) may be located outside the connector housing (22) (e.g., in the -X-axis direction).

[0132] Referring to the structure of the connector socket (20) and the circuit board (21) of FIGS. 7A and 8A, the circuit board (21) may include a plurality of conductive pads (26) for coupling with a plurality of conductive pins (23) and a coupling pad (C) for coupling with a coupling portion (e.g., coupling portion (350) of FIG. 3) of the connector housing (22). As the mounting portions (P1) of the plurality of conductive pins (23) are arranged on the outside of the connector housing (22), a plurality of conductive pads (26) may be arranged at corresponding positions (e.g., one surface of the circuit board (21)). For example, the first conductive pads (26a) may be arranged along an outer line (l1) (e.g., a line facing the +X-axis direction) of the coupling pads (C) on the circuit board (21) so as to correspond to the mounting portions (P1) of the first conductive pins (23a). For example, the second conductive pads (26b) may be arranged along an outer line (l2) (e.g., a line facing the -X-axis direction) of the bonding pads (C) on the circuit board (21) so as to correspond to the mounting portions (P1) of the second conductive pins (23b). The distance (e.g., the outermost distance) between the first conductive pads (26a) and the second conductive pads (26b) may be defined as d1.

[0133] Referring to the structure of the connector socket (30) and the circuit board (210) of FIGS. 7b and 8b, a plurality of conductive pins (400) may be arranged entirely in the inner space of the connector housing (300) so as not to be exposed to the outside. A portion for coupling with a connector plug (e.g., the connector plug (40) of FIG. 6) and a mounting portion (e.g., the second portion (420)) for coupling with a circuit board (210) may be structured to be located inside the connector housing (300). For example, the mounting portion (e.g., the second portion (420)) of the first conductive pins (400a) may be located between the central wall (340) and the first side wall portion (331) of the connector housing (300), and the mounting portion (e.g., the second portion (420)) of the second conductive pins (400b) may be located between the central wall (340) and the third side wall portion (333) of the connector housing (300).

[0134] Referring to the structure of the connector socket (30) and the circuit board (210) of FIGS. 7B and 8B, the circuit board (210) may include a plurality of conductive pads (212) for coupling with a plurality of conductive pins (400) and a coupling pad (C) for coupling with a coupling portion (e.g., coupling portion (350) of FIG. 3) of the connector housing (300). As the mounting portion (e.g., the second portion (420)) of the plurality of conductive pins (400) is arranged on the inside of the connector housing (300), a plurality of conductive pads (212) may be arranged at a corresponding position (e.g., one side of the circuit board (210). For example, the first conductive pads (212a) may be arranged along an inner line (L1) (e.g., a line facing the +X-axis direction) of the bonding pads (C) on the circuit board (210) so as to correspond to the mounting portions (420) of the first conductive pins (400a). For example, the second conductive pads (212b) may be arranged along an inner line (L2) (e.g., a line facing the -X-axis direction) of the bonding pads (C) on the circuit board (210) so as to correspond to the mounting portions (420) of the second conductive pins (400b). The distance (e.g., the outermost distance) between the first conductive pads (212a) and the second conductive pads (212b) may be defined as D1.

[0135] The mounting portion (P1) of the conductive pins (23) of the connector socket (20) of FIGS. 7A and 8A may be easily exposed to external foreign substances (e.g., moisture or dust) as they are located outside the connector housing (22). Accordingly, the mounting portion (P1) of the conductive pins (23) is generally coated with a waterproof coating. In contrast, the conductive pins (400) of the connector socket (30) of FIGS. 7B and 8B according to one embodiment are located entirely inside the connector housing (300), and the structure of the side wall (330) sealing the circuit board (210) and the connector housing (300) may limit external foreign substances (e.g., moisture or dust) from entering the mounting portion (e.g., the second portion (420)) of the conductive pins (400).

[0136] The mounting portions (P1) of the conductive pins (23) of the connector socket (20) of FIGS. 7A and 8A are located outside the connector housing (22), and the conductive pins (400) of the connector socket (30) of FIGS. 7B and 8B according to one embodiment are located inside the connector housing (300), so that the spacing between the conductive pins arranged in parallel may be different. The spacing (e.g., D1) between the conductive pads (e.g., first conductive pads (212a) and second conductive pads (212b)) arranged in parallel on the circuit board (21) of FIG. 8B may be formed to have a smaller length compared to the spacing (e.g., d1) between the conductive pads (e.g., first conductive pads (26a) and second conductive pads (26b)) arranged in parallel on the circuit board (21) of FIG. 8A. Accordingly, the overall size of the connector socket (30) mounted on the circuit board (210) according to one embodiment can be relatively reduced. Considering the mounting space within a mobile electronic device, the reduction in the size of the connector socket (30) can provide an effect of improving the mounting space of other electrical components on the circuit board.

[0137] FIG. 9a is a perspective view of the rear of a connector socket (30a) according to one embodiment of the present disclosure.

[0138] FIG. 9b is a perspective view of the rear side of a cross-sectional view of the connector socket (30a) of FIG. 9a cut along the BB` line according to one embodiment of the present disclosure.

[0139] FIG. 10 is a cross-sectional view of the connector socket (30a) of FIG. 9a placed on a circuit board (210a) according to one embodiment of the present disclosure, taken along line BB`.

[0140] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include a circuit board (210a) and a connector socket (30a) disposed on the circuit board (210a). The connector socket (30a) may include a connector housing (300) and a plurality of conductive pins (400) disposed within the connector housing (300).

[0141] The configuration of the connector socket (30a) of FIGS. 9a, 9b, and 10 may be partially or entirely identical to the configuration of the connector socket (30) of FIGS. 2 and 3. The configuration of the circuit board (210a) of FIGS. 9a, 9b, and 10 may be partially or entirely identical to the configuration of the circuit board (210) of FIG. 5. The embodiments of FIGS. 9a, 9b, and 10 may be selectively combined with the embodiments of FIGS. 2 to 6, 7b, and 8b, and the embodiments of FIGS. 11a to 14.

[0142] According to one embodiment, the connector housing (300) may include a supporting frame (310), a plurality of openings (320), and a side wall (330) formed to surround at least a portion of the plurality of openings (320), and / or a central wall (340) that partially partitions an inner space, and / or a coupling portion (3501).

[0143] Below, the side wall (330) and the joining portion (3501) that are different from the embodiments of FIGS. 2 to 6 will be described.

[0144] According to one embodiment, the sidewall (330) may form part of the exterior of the connector housing (300). The sidewall (330) may be arranged to surround an inner space (e.g., a plurality of openings (320)) of the connector housing (300).

[0145] According to one embodiment, the side wall (330) may include a protruding portion (3361) formed to protrude toward the rear side (e.g., in the -Z-axis direction) and be positioned to contact the circuit board (210a) and surround a plurality of conductive pins (400) so as not to be exposed to the outside.

[0146] According to one embodiment, when looking at the rear side of the connector housing (300), the protruding portion (3361) may have a closed loop shape. For example, the protruding portion (3361) is formed by one end of the first side wall portion (331), one end of the third side wall portion (333), and a portion extending from the one end, and may have a rectangular (e.g., square or rectangular) loop shape.

[0147] According to one embodiment, the coupling portion (3501) may extend from both ends of the support frame (310) and / or the protruding portion (3361) and be connected to one side of the circuit board (210a). For example, the coupling portion (3501) may include a region extending from a +Y-axis-oriented portion of the protruding portion (3361) and a region extending from a -Y-axis-oriented portion of the protruding portion (3361).

[0148] In one embodiment, the coupling portion (3501) and the protruding portion (3361) may form an integrated structure. The coupling portion (3501) and the protruding portion (3361) may be composed of the same material. In one embodiment, the coupling portion (3501) and the protruding portion (3361) may form an integrated structure with other parts of the connector housing (300).

[0149] In one embodiment, the joining portion (3501) and the protruding portion (3361) may be manufactured by insert injection molding together with other portions of the connector housing (300). For example, the joining portion (3501) and the protruding portion (3361) may be formed of a metal material (e.g., an insert), and other portions of the connector housing (300) (e.g., a support frame (310), a side wall (330) excluding the protruding portion (3361), and a central wall (340)) may be manufactured as injection molded products by an insert injection molding process.

[0150] According to one embodiment, the joining portion (3501) and the protruding portion (3361) are a monolithic support body, and the monolithic support body may be exposed to the rear side of the connector housing (300) and may be structured to seamlessly extend from the joining portion (3501) to the protruding portion (3361).

[0151] According to one embodiment, the joining portion (3501) and the protruding portion (3361) may be formed as a single piece (or one body). Since the joining portion (3501) and the protruding portion (3361) are formed by a cutting process during manufacturing for the insert product, they may be separated as separate elements and then joined (e.g., bonded with an adhesive material) or not assembled.

[0152] According to one embodiment, the coupling portion (3501) and the protruding portion (3361) are positioned toward the rear side (e.g., in the -Z-axis direction) of the connector housing (300) and can be surface-mounted on the circuit board (210a). For example, the coupling portion (3501) made of a metal material is surface-mounted on a coupling pad (e.g., coupling pad (C) of FIG. 8B) of the circuit board (210a), and the protruding portion (3361) made of a metal material can be directly surface-mounted (e.g., soldered) on the circuit board (210a). The circuit board (210a) can be coupled with the protruding portion (3361) to block (e.g., waterproof) the inner area of ​​the protruding portion (3361) from the outside without forming a separate recess for insertion of the protruding portion (3361).

[0153] According to one embodiment, the coupling portion (3501), the protruding portion (3361), and the circuit board (210a) may be formed to surround the second portion (420) of the plurality of conductive pins (400) so as not to be exposed. The second portion (420) of the plurality of conductive pins (400) may be a mounting portion (e.g., a portion soldered to the conductive pad (212)) for electrical connection with the circuit board (210). The protruding portion (3361) may limit or reduce the inflow of foreign substances (e.g., moisture or dust) into the lower side of the connector housing (300) by limiting the formation of a gap between the lower surface of the connector housing (300) and the circuit board (210).

[0154] FIG. 11a is a perspective view of the rear of a connector socket (30b) according to one embodiment of the present disclosure.

[0155] FIG. 11b is a perspective view of the rear side of a cross-sectional view of the connector socket (30b) of FIG. 11a cut along line CC` according to one embodiment of the present disclosure.

[0156] FIG. 12 is a cross-sectional view of the connector socket (30b) of FIG. 11a placed on a circuit board (210) according to one embodiment of the present disclosure, taken along line CC`.

[0157] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include a circuit board (210) and a connector socket (30b) disposed on the circuit board (210). The connector socket (30b) may include a connector housing (300) and a plurality of conductive pins (400) disposed within the connector housing (300).

[0158] The configuration of the connector socket (30b) of FIGS. 11a, 11b, and 12 may be partially or entirely identical to the configuration of the connector socket (30) of FIGS. 2 and 3. The configuration of the circuit board (210) of FIGS. 11a, 11b, and 12 may be partially or entirely identical to the configuration of the circuit board (210) of FIG. 5. The embodiments of FIGS. 11a, 11b, and 12 may be selectively combined with the embodiments of FIGS. 2 to 6, 7b, 8b, 9a to 10, and 13a to 14.

[0159] According to one embodiment, the connector housing (300) may include a supporting frame (310), a plurality of openings (320), and a side wall (330) formed to surround at least a portion of the plurality of openings (320), and / or a central wall (340) that partially partitions an inner space, and / or a coupling portion (350).

[0160] Hereinafter, a description will be given focusing on the side wall (330) (e.g., protruding portion (3362)) that is different from the embodiments of FIGS. 2 to 6.

[0161] According to one embodiment, the sidewall (330) may form part of the exterior of the connector housing (300). The sidewall (330) may be arranged to surround an inner space (e.g., a plurality of openings (320)) of the connector housing (300).

[0162] According to one embodiment, the side wall (330) may include a protruding portion (3362) formed to protrude toward the rear side (e.g., in the -Z-axis direction) and be positioned to contact the circuit board (210) and surround a plurality of conductive pins (400) so as not to be exposed to the outside.

[0163] According to one embodiment, when looking at the rear side of the connector housing (300), the protruding portion (3362) may have a closed loop shape. For example, the protruding portion (3362) is formed by one end of the first side wall portion (331), one end of the third side wall portion (333), and a portion extending from the one end, and may have a rectangular (e.g., square or rectangular) loop shape.

[0164] According to one embodiment, the protruding portion (3362) may be formed of a different material than other portions of the side wall (330) (e.g., a portion extending from the side wall (330) in a front side direction (e.g., in the +Z-axis direction). The protruding portion (3362) may be a thermoplastic polymer material, for example, at least one of polyethylene (PE), polypropylene (PP), polystyrene (PS), polycarbonate (PC), polyethylene terephthalate (PET), or polyacetal (POM). The thermoplastic polymer material may have a melting point of approximately 150 degrees.

[0165] In one embodiment, the protruding portion (3362) of the side wall (330) and portions other than the protruding portion (3362) may be manufactured by double injection molding. The side wall (330) may form an integral structure as a whole. In one embodiment, the side wall (330) and other portions of the connector housing (300) (e.g., the support frame (310) and the central wall (340)) may form an integral structure. The term "double injection molding" as used herein refers to a well-known manufacturing process. Therefore, the principle or additional details of the double injection molding process are not described so as not to obscure the disclosure. Therefore, the term "double injection molded structure" as a product of the double injection molding process has a well-known meaning, as those skilled in the art will readily understand.

[0166] According to one embodiment, the protruding portion (3362) of the side wall (330) can form a strong bond with the recess (215) of the circuit board (210) by being formed of a thermoplastic polymer material. For example, when a surface mounting process (e.g., a heating process, peak temperature approximately 230 degrees) is performed while the protruding portion (3362) of the side wall (330) is inserted into the recess (215) of the circuit board (210), the protruding portion (3362) within the recess (215) is melted (e.g., after being melted) and then hardened at room temperature to maintain a strong bond with the circuit board (210). The hardened protruding portion (3362) can be completely adhered to the recess (215) of the circuit board (210) to form a sealing structure. For example, the hardened protrusion (3362) can be formed in a filled or bonded state within a recess (215) of a circuit board (210).

[0167] According to one embodiment, the protruding portion (3362) of the thermoplastic material and the circuit board (210) can be formed to surround the second portion (420) of the plurality of conductive pins (400) so as not to be exposed. The second portion (420) of the plurality of conductive pins (400) can be a mounting portion (e.g., a portion soldered to the conductive pad (212)) for electrical connection with the circuit board (210). The protruding portion (3362) can limit a gap between the lower side of the connector housing (300) and the circuit board (210) and provide a sealing function, thereby limiting or reducing the inflow of foreign substances (e.g., moisture or dust) into the lower side of the connector housing (300).

[0168] FIG. 13a is a perspective view of the rear of a connector socket (30c) according to one embodiment of the present disclosure.

[0169] FIG. 13b is a perspective view of the rear side of a cross-sectional view of the connector socket (30c) of FIG. 13a cut along the line DD` according to one embodiment of the present disclosure.

[0170] FIG. 14 is a cross-sectional view taken along line DD` of the connector socket (30c) of FIG. 13a disposed on a circuit board (210a) according to one embodiment of the present disclosure.

[0171] According to one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include a circuit board (210) and a connector socket (30c) disposed on the circuit board (210). The connector socket (30c) may include a connector housing (300) and a plurality of conductive pins (400) disposed within the connector housing (300).

[0172] The configuration of the connector socket (30c) of FIGS. 13a, 13b, and 14 may be partially or entirely identical to the configuration of the connector socket (30) of FIGS. 2 and 3. The configuration of the circuit board (210a) of FIGS. 13a, 13b, and 14 may be partially or entirely identical to the configuration of the circuit board (210) of FIG. 5. The embodiments of FIGS. 13a, 13b, and 14 may be selectively combined with the embodiments of FIGS. 2 to 6, 7b, and 8b, and the embodiments of FIGS. 9a to 12.

[0173] According to one embodiment, the connector housing (300) may include a supporting frame (310), a plurality of openings (320), and a side wall (330) formed to surround at least a portion of the plurality of openings (320), and / or a central wall (340) that partially partitions an inner space, and / or a coupling portion (350).

[0174] Hereinafter, a description will be given focusing on the side wall (330) (e.g., protruding portion (3363)) that is different from the embodiments of FIGS. 2 to 6.

[0175] According to one embodiment, the sidewall (330) may form part of the exterior of the connector housing (300). The sidewall (330) may be arranged to surround an inner space (e.g., a plurality of openings (320)) of the connector housing (300).

[0176] According to one embodiment, the side wall (330) may include a protruding portion (3363) formed to protrude toward the rear side (e.g., in the -Z-axis direction) and be positioned to contact the circuit board (210) and surround a plurality of conductive pins (400) so as not to be exposed to the outside.

[0177] According to one embodiment, when looking at the rear side of the connector housing (300), the protruding portion (3363) may have a closed loop shape. For example, the protruding portion (3363) is formed by one end of the first side wall portion (331), one end of the third side wall portion (333), and a portion extending from the one end, and may have a rectangular (e.g., square or rectangular) loop shape.

[0178] According to one embodiment, the protruding portion (3363) may be formed of a different material from another portion of the side wall (330) (e.g., a portion extending from the side wall (330) in the front side direction (e.g., in the +Z-axis direction). The protruding portion (3363) may include a conductive material (e.g., a metal material) and form a structure that is integrally formed with another portion of the side wall (330).

[0179] According to one embodiment, the protruding portion (3363) can be manufactured through LDS (laser direct structuring) molding. A pattern is selectively processed using a laser on the end of the support frame (310) and / or the side wall (330) formed as an injection molded product of the connector housing (300) to form a rough surface in micro units, and a conductive pattern (e.g., the protruding portion (3363)) can be formed on the rough surface through plating. The plating method can be a primary method or a primary and secondary method, and the primary plating can be a Cu plating process, and the secondary plating can be a Ni plating process.

[0180] According to one embodiment, the protruding portion (3363) is positioned toward the rear side (e.g., in the -Z-axis direction) of the connector housing (300) and can be surface-mounted on the circuit board (210a). For example, the protruding portion (3363) made of a metal material can be directly surface-mounted (e.g., soldered) on the circuit board (210a). The circuit board (210a) can be coupled with the protruding portion (3363) to block (e.g., waterproof) the inner area of ​​the protruding portion (3363) from the outside without forming a separate recess for inserting the protruding portion (3363).

[0181] According to one embodiment, the protruding portion (3363) formed of an LDS material and the circuit board (210a) may be formed to surround the second portion (420) of the plurality of conductive pins (400) so as not to be exposed. The second portion (420) of the plurality of conductive pins (400) may be a mounting portion (e.g., a portion soldered to the conductive pad (212)) for electrical connection with the circuit board (210). The protruding portion (3363) may limit or reduce the inflow of foreign substances (e.g., moisture or dust) into the lower side of the connector housing (300) by limiting the formation of a gap between the lower side of the connector housing (300) and the circuit board (210).

[0182] A connector socket arranged on a circuit board according to one embodiment may provide a structure capable of preventing the inflow of foreign substances (e.g., moisture).

[0183] In a connector socket according to one embodiment of the present disclosure, a plurality of conductive pins may be arranged within a connector housing. For example, the connector housing may include a sidewall formed to surround the side surfaces of the plurality of conductive pins. Accordingly, since the electrical connection portion between the connector socket and the circuit board is not exposed to the outside of the connector housing, the ingress of foreign substances (e.g., moisture) may be limited or reduced. Furthermore, the cost of a separate coating treatment on the outer surfaces of the plurality of conductive pins may be eliminated, thereby reducing manufacturing costs.

[0184] In one embodiment, the size of the connector socket can be reduced by arranging the mounting portions (e.g., contact portions) of a plurality of conductive pins, which are typically exposed outside the connector housing, inside the connector housing. Accordingly, the positions of a plurality of conductive pads on a circuit board to which the plurality of conductive pins are soldered can be changed, thereby reducing the mounting space occupied by the connector socket on the circuit board. Considering the mounting space within a mobile electronic device, the reduction in the size of the connector socket can provide an effect of improving the mounting space of other electrical components on the circuit board.

[0185] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0186] An electronic device (e.g., 101 of FIG. 1) according to one embodiment includes a circuit board (e.g., 210 of FIG. 5) having a plurality of conductive pads (e.g., 212 of FIG. 5) formed thereon, and a connector socket (e.g., 30 of FIG. 5) disposed on the circuit board. The connector socket (e.g., 30 in FIG. 5) includes a connector housing (e.g., 300 in FIG. 5) including a plurality of openings (e.g., 320 in FIG. 5) and a side wall (e.g., 330 in FIG. 5) formed to surround at least a portion of the plurality of openings, and a plurality of conductive pins (e.g., 400 in FIG. 5) disposed to penetrate the plurality of openings of the connector housing and including a first portion (e.g., 410 in FIG. 5) exposed toward a front side (e.g., in the +Z-axis direction in FIG. 5) and a second portion (e.g., 420 in FIG. 5) exposed toward a rear side (e.g., in the -Z-axis direction in FIG. 5) to be electrically connected to the plurality of conductive pads. The side wall of the connector housing includes a protruding portion protruding toward the rear side, and the second portions of the plurality of conductive pins are positioned so as to be surrounded by the protruding portion and not exposed to the outside. In this way, the ingress of foreign matter (e.g. moisture) into the connector housing or electrical connection part can be effectively prevented or limited.

[0187] According to one embodiment, the connector housing (e.g., 300 in FIG. 5) may further include a coupling portion (e.g., 350 in FIG. 5) extending from both sides of the protruding portion in the shape of a closed loop and for coupling with the circuit board.

[0188] According to one embodiment, the protruding portion and the joining portion may be formed as a monolithic structure made of substantially the same material.

[0189] According to one embodiment, at least one of the protruding portion or the joining portion may comprise a metallic material.

[0190] According to one embodiment, each of the first portions (e.g., 410 of FIG. 5) of the plurality of conductive pins (e.g., 400 of FIG. 5) may include a first-first portion (e.g., 410a of FIG. 5) and a first-second portion (e.g., 410b of FIG. 5) that are spaced apart from each other. Each of the second portions (e.g., 420 of FIG. 5) of the plurality of conductive pins may be disposed between the first-first portion and the first-second portion, and may extend from the first-first portion to the first-second portion.

[0191] In one embodiment, the side wall includes a recessed receiving groove (e.g., 338 in FIG. 5) in the rear direction, and each of the first portions (e.g., 410 in FIG. 5) of the plurality of conductive pins (e.g., 400 in FIG. 5) may include a first-first portion (e.g., 410a in FIG. 5) and a first-second portion (e.g., 410b in FIG. 5) that are spaced apart from each other. Each of the plurality of conductive pins may include a third portion (e.g., 430 in FIG. 5) extending from one end of the first-second portion and inserted into the receiving groove to secure each of the plurality of conductive pins to the connector housing.

[0192] According to one embodiment, the connector housing may further include a central wall (e.g., 340 in FIG. 5) that partitions at least a portion of the inner space. The first-first portion (e.g., 410a in FIG. 5) may include an end portion (e.g., 410aa in FIG. 5) adjacent to or in contact with the central wall, and an elastic portion (e.g., 410ab in FIG. 5) that extends and is curved toward the second portion.

[0193] According to one embodiment, the connector housing further includes a central wall (e.g., 340 in FIG. 5) that partitions at least a portion of the inner space, and each of the plurality of conductive pins is positioned between the side wall and the central wall, and at least a portion of the conductive pins can be maintained inserted into a groove formed in the side wall and a groove formed in the central wall.

[0194] According to one embodiment, the protruding portion of the side wall may be shaped to protrude toward the rear surface from the lower side of the second portion of each of the plurality of conductive pins.

[0195] According to one embodiment, the circuit board includes a recess (e.g., 215 in FIG. 5) arranged to surround the plurality of conductive pads, and the protruding portion of the connector housing can be inserted into the recess.

[0196] According to one embodiment, the circuit board includes a recess (e.g., 215 in FIG. 12) arranged to surround the plurality of conductive pads, and at least a portion of the protruding portion of the connector housing is formed of a thermoplastic polymer material and can be filled within the recess.

[0197] According to one embodiment, the connector housing may be formed with a double injection structure including a protruding portion and other portions.

[0198] According to one embodiment, at least a portion of the protruding portion may be plated, and the plated protruding portion may be surface-mounted on one side of the circuit board.

[0199] According to one embodiment, the electronic device may further include a second circuit board (e.g., 220 of FIG. 6) facing and spaced apart from the circuit board, and a connector plug (e.g., 40 of FIG. 6) disposed on the second circuit board and capable of being engaged with a connector socket. The connector plug may include a plurality of conductive terminals (e.g., 43 of FIG. 6) formed such that, when inserted into an inner side formed by each of the plurality of conductive pins, the plurality of conductive pins contact the first portion and face the second portion.

[0200] According to one embodiment, the side wall of the connector socket may further include an extension portion (e.g., 337 of FIG. 6) extending toward the front. When the connector socket and the connector plug are coupled, the extension portion may be arranged to contact the second circuit board and surround the connector plug, thereby providing a limited inner space from the outside.

[0201] A connector socket (e.g., 30 of FIG. 5) according to one embodiment may include a connector housing (e.g., 300 of FIG. 5) including a plurality of openings (e.g., 320 of FIG. 5) and a sidewall (330) formed to surround at least a portion of the plurality of openings, and a plurality of conductive pins (e.g., 400 of FIG. 5) disposed to penetrate the plurality of openings of the connector housing and including a first portion (e.g., 410 of FIG. 5) exposed toward a front side (e.g., in the +Z-axis direction of FIG. 5) and a second portion (e.g., 420 of FIG. 5) exposed toward a rear side (e.g., in the -Z-axis direction of FIG. 5) to form electrical contact with a circuit board. The sidewall of the connector housing may include a protruding portion protruding toward the rear side, and the second portions of the plurality of conductive pins may be surrounded by the protruding portions.

[0202] According to one embodiment, each of the first portions (e.g., 410 of FIG. 5) of the plurality of conductive pins (e.g., 400 of FIG. 5) may include a first-first portion (e.g., 410a of FIG. 5) and a first-second portion (e.g., 410b of FIG. 5) that are spaced apart from each other. Each of the second portions (e.g., 420 of FIG. 5) of the plurality of conductive pins may be disposed between the first-first portion and the first-second portion, and may extend from the first-first portion to the first-second portion.

[0203] According to one embodiment, the connector housing may further include a central wall (e.g., 340 in FIG. 5) that partitions at least a portion of the inner space. Each of the plurality of conductive pins may be positioned between the side wall and the central wall, and at least a portion of the conductive pins may remain inserted into a groove formed in the side wall and a groove formed in the central wall.

[0204] According to one embodiment, the connector housing (e.g., 300 in FIG. 5) may further include a coupling portion (e.g., 350 in FIG. 5) extending from both sides of the protruding portion in the shape of a closed loop and for coupling with the circuit board. The protruding portion and the coupling portion may be formed as a monolithic structure made of substantially the same material.

[0205] According to one embodiment, at least one of the protruding portion or the joining portion may comprise a metallic material.

[0206] It should be understood that the various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, but rather to encompass various modifications, equivalents, or alternatives of the embodiments.

Claims

1. In an electronic device (101), A first circuit board (210) having a plurality of challenging pads (212) formed thereon; and Including a connector socket (30) arranged on the first circuit board, The above connector socket (30) is, A connector housing (300) comprising a plurality of openings (320) and a side wall (330) formed to surround at least a portion of the plurality of openings (320); and A plurality of conductive pins (400) are arranged to penetrate the plurality of openings (320) of the connector housing (300), and include a first portion (410) exposed toward the front (+Z-axis direction) and a second portion (420) exposed toward the rear (-Z-axis direction) to be electrically connected to the plurality of conductive pads (212). An electronic device, wherein the side wall (330) of the connector housing (300) includes a protruding portion (336) protruding toward the rear, and the second portion (420) of the plurality of conductive pins (400) is surrounded by the protruding portion (336) and positioned so as not to be exposed to the outside.

2. In paragraph 1, The above connector housing (300) is An electronic device (101) further including a joining portion (350) extending from both sides of the protruding portion (336) in the shape of a closed loop and for joining with the first circuit board (210).

3. In paragraph 2, An electronic device (101), wherein the protruding portion (336) and the joining portion (350) are formed as a monolithic structure made of substantially the same material.

4. In either paragraph 2 or paragraph 3, An electronic device (101), wherein at least one of the protruding portion (336) or the joining portion (350) comprises a metal material.

5. In any one of paragraphs 1 to 4, The first portion (410) of each of the plurality of conductive pins (400) includes a first-first portion (410a) and a first-second portion (410b) spaced apart from each other, An electronic device (101), wherein each of the second portions (420) of the plurality of conductive pins is disposed between the first-first portion (410a) and the first-second portion (410b), and extends from the first-first portion (410a) to the first-second portion (410b).

6. In any one of paragraphs 1 to 4, The above side wall (330) includes a concave receiving groove (338) toward the rear, The first portion (410) of each of the plurality of conductive pins (400) includes a first-first portion (410a) and a first-second portion (410b) spaced apart from each other, An electronic device (101), wherein each of the plurality of conductive pins (400) includes a third portion (430) extending from one end of the first-second portion (410b) and inserted into the receiving groove (338) to secure each of the plurality of conductive pins (400) to the connector housing (300).

7. In clause 5 or 6, The above connector housing (300) further includes a central wall (340) that partitions at least a portion of the inner space, An electronic device (101), wherein the first-first portion (410a) includes an end portion (410aa) adjacent to or in contact with the central wall (340), and an elastic portion (410ab) that extends and is curved toward the second portion (420).

8. In any one of paragraphs 1 to 6, The above connector housing (300) further includes a central wall (340) that partitions at least a portion of the inner space, An electronic device (101), wherein each of the plurality of conductive pins (400) is positioned between a side wall (330) and a center wall (340), and at least some of the same remain inserted into a groove formed in the side wall (330) and a groove formed in the center wall (340).

9. In any one of paragraphs 1 to 8, The protruding portion (336) of the side wall (330) is an electronic device (101) that protrudes from the bottom surface of the second portion (420) of each of the plurality of conductive pins (400) toward the rear surface.

10. In any one of paragraphs 1 to 9, The first circuit board (210) includes a recess (215) arranged to surround the plurality of conductive pads (212), The protruding portion (336) of the above connector housing (300) is inserted into the recess (215), the electronic device (101).

11. In either paragraph 1 or paragraph 9, The above first circuit board (210) includes a recess (215) arranged to surround the plurality of conductive pads (212). An electronic device (101) in which at least a portion of the protruding portion (336) of the connector housing (300) is formed of a thermoplastic polymer material and filled within the recess (215).

12. In paragraph 11, The above connector housing (300) is an electronic device (101) in which the protruding portion (336) and other portions are formed with a double injection structure.

13. In either paragraph 1 or paragraph 9, An electronic device (101) in which at least a portion of the protruding portion (336) is plated, and the plated protruding portion (336) is surface-mounted (SMT) to one surface of the first circuit board (210).

14. In any one of paragraphs 1 to 13, A second circuit board (220) facing and spaced apart from the first circuit board (210); and It further includes a connector plug (40) arranged on the second circuit board (220) and capable of being combined with the connector socket (30), An electronic device (101), wherein the connector plug (40) includes a plurality of conductive terminals (43) formed so that, when inserted into the inner side formed by each of the plurality of conductive pins (400), the plurality of conductive pins (400) come into contact with the first portion (410) and face the second portion (420).

15. In paragraph 14, The side wall (330) of the above connector socket (30) further includes an extension portion (337) extending toward the front, An electronic device (101), wherein, when the connector socket (30) and the connector plug (40) are coupled, the extension portion (337) is arranged to contact the second circuit board (220) and surround the connector plug (40), thereby providing a limited inner space from the outside.

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