Pressure touch sensing device having improved structure and method thereof

Abstract

The present invention relates to a pressure touch sensing device having an improved structure and a method thereof, and more specifically, to a pressure touch sensing device having an improved structure and a method thereof, which can prevent a malfunction from occurring when a pressure is repeatedly and rapidly applied, and can prevent a malfunction other than the pressure.

Description

Device and method for detecting pressure touch of improved structure

[0001] The present invention relates to a device and method for detecting a pressure touch having an improved structure, and to a device and method for detecting a pressure touch having an improved structure that can prevent malfunctions from occurring when repetitive and rapid pressure is applied and prevent malfunctions other than pressure.

[0002] Looking at the conventional pressure sheet configuration, as shown in Fig. 1, it is configured to receive pressure influence through a plurality of conductive pads (11, 12, 13) formed by stacking different layers and a non-conductor (50) placed between the conductive pads, and the conductive pads (12, 13) that sense pressure when a hand comes into contact with the pressure sheet.

[0003] Conventional pressure sheets can be expressed in equivalent form as shown in Fig. 2: Ctl (Touch Leak; electrostatic capacitance formed by hand proximity) and Cml (mutual leak; electrostatic capacitance formed on multiple conductive pads leaking to the hand). Ctl and Cml are not electrostatic capacitances formed by pressure, which may cause malfunction.

[0004] The above Ctl has a problem in that the charge / discharge waveform used to measure capacitance in the sensor IC is induced by the hand, increasing the measured capacitance. This causes the measured data (raw data) to increase by the amount of Ctl, and sensitivity increases even without pressure, potentially leading to incorrect judgments.

[0005] Additionally, Cml has the problem of reducing raw data by lowering the measured capacitance formed by the capacitance leaking between the multiple conductive pads formed to measure pressure. This reduces the measured data (raw data) by the amount of Cml's influence, and in some cases, it occurs more than the capacitance formed by pressure, resulting in a problem where pressure cannot be detected.

[0006] Here, Ctl (Touch Leak) refers to the electrostatic capacitance formed by hand proximity, and Cml (mutual leak) refers to the electrostatic capacitance formed on multiple conductive pads that leaks to the hand.

[0007] Referring to FIG. 3, as shown in FIG. 3(a), when a hand approaches the sheet, there is a phenomenon in which unintended data (raw data) increases due to Ctl (Touch Leak), and when pressure is applied to the sheet, the data (raw data) appears as a capacitance that is the sum of the capacitance formed by the pressure and Ctl. This creates a problem in that it is difficult to distinguish what influence caused the increase in data (raw data).

[0008] As shown in Fig. 3(b) and Fig. 3(c), there was a problem in that the capacitance between multiple conductive pads leaked to the hand due to the action of Cml (mutual leak), which reduced the measured capacitance. In the case of Fig. 3(c), where pressure was applied simultaneously with the hand approaching the conductive pad due to a quick hand touch, the increase in data (raw data) due to the pressure could not be confirmed, making it difficult to recognize the pressure.

[0009] As shown in Fig. 3(d), there was a problem in which pressure recognition was difficult due to the phenomenon of Cml dropping and Ctl rising due to the combined action of Cml (mutual leak; capacitance leaking through the hand) and Ctl (touch leak; capacitance formed in the proximity of the hand).

[0010] Therefore, when looking at the conventional pressure sheet stacking diagram, an additional software algorithm was required due to the problem of data (raw data) dropping when the hand touches the sheet or rising as if pressure was applied.

[0011] That is, there is a problem that there is a waste of memory or time due to the additional algorithm, and not only can malfunction occur when repetitive and rapid pressure is applied due to processing by hand contact, but in some cases (formed similarly to Cml = Ctl + Cforce), pressure may not be detected, or malfunction may occur due to the proximity of the hand even in situations where no pressure is applied.

[0012] [Prior Art Literature]

[0013] [Patent Document]

[0014] Republic of Korea Patent No. 10-0807193 (February 28, 2008)

[0015] Republic of Korea Patent Publication No. 10-2018-0090292 (August 10, 2018)

[0016] Republic of Korea Patent No. 10-1943492 (January 29, 2019)

[0017] The purpose of the present invention is to provide a device and method for detecting pressure touch with an improved structure that eliminates changes in electrostatic capacitance induced by a hand by structurally adding shielding to a pressure sheet, changes a waveform sensing a pad closest to a hand among a plurality of conductive pads used to measure pressure into a static voltage, and enables pressure touch to be distinguished without an additional software algorithm, and enables accurate recognition even of repetitive and rapid pressure changes.

[0018] A pressure touch sensing device of an improved structure of the present invention for achieving the above technical problem comprises: a sensor pad including a plurality of conductive pads formed by stacking different layers, and a non-conductor disposed between the conductive pads; a shielding portion provided in a form that surrounds a side surface of the sensor pad and shields a mutual electrostatic capacitance component induced between the conductive pads; and a sensor IC connected to the plurality of conductive pads of the sensor pad; the sensor IC comprises: a first sensor that senses electrostatic capacitance between a conductive pad disposed on the innermost layer among the plurality of conductive pads and a conductive pad disposed adjacent to and above the conductive pad; a second sensor that senses electrostatic capacitance of a conductive pad located on the outermost layer among the plurality of conductive pads; and a conversion portion that converts at least one conductive pad among the plurality of conductive pads to be fixed to a constant voltage or converted into a shield area; The above sensor IC detects a change in electrostatic capacity due to pressure through the first sensor, detects a change in electrostatic capacity due to external touch and proximity through the second sensor, and can control the shielding part with one of ground ground (GND), shield, and static voltage.

[0019] In addition, a device for detecting a pressure touch of an improved structure according to one aspect of the present invention includes a sensor pad including a plurality of conductive pads formed by stacking different layers, and a non-conductor disposed between the plurality of conductive pads; a shielding portion provided in a form that surrounds the side surface of the sensor pad and, depending on the structure, also provided in a form that surrounds the upper portion, and shields a mutual electrostatic capacitance component induced between the conductive pads; and a sensor IC connected to the plurality of conductive pads of the sensor pad; the sensor IC includes a first sensor that senses electrostatic capacitance between a conductive pad disposed in an innermost layer among the plurality of conductive pads and a conductive pad disposed adjacent to and above the innermost layer; and a conversion portion that converts at least one conductive pad among the plurality of conductive pads to be fixed to a constant voltage or converted to a shield area; the sensor IC detects a change in electrostatic capacitance due to pressure through the first sensor, and can control the shielding portion to one of a ground (GND), a shield, and a static voltage.

[0020] In addition, in a device for detecting a pressure touch of an improved structure according to one aspect of the present invention, the sensor pad may have a shield formed at the bottom of the sensor pad depending on the state of the applied mechanism; when the shield is formed at the bottom of the sensor pad, a non-conductor is further included at the bottom of the conductive pad of the innermost layer; and the shield is formed at the bottom of the non-conductor so that the conductive pad disposed at the innermost layer can be prevented from having a change in electrostatic capacity due to external disturbance.

[0021] In addition, a device for detecting a pressure touch of an improved structure according to one aspect of the present invention can reduce changes in sensitivity to external noise and touch by changing the other conductive pads and the shielding portion to one of ground ground (GND), shield, and static voltages when sensing a conductive pad located at the innermost layer among the plurality of conductive pads in the first sensor.

[0022] In addition, a device for detecting a pressure touch of an improved structure according to one aspect of the present invention, when sensing a conductive pad located at the outermost layer among the plurality of conductive pads in the second sensor, the sensor IC operates the conductive pad located below the conductive pad located at the outermost layer as one of a shield, ground ground (GND), and no connect, and operates the shield as one of a ground ground (GND), shield, and static voltage, thereby improving the sensitivity and noise characteristics of the change in electrostatic capacity due to an external touch and proximity.

[0023] In addition, a device for detecting a pressure touch of an improved structure according to one aspect of the present invention senses a conductive pad located at the innermost layer among a plurality of conductive pads through the first sensor after pressure sensing, and detects a change in electrostatic capacity due to an environmental change, and changes other conductive pads and a shielding portion to any one of ground ground (GND), shield, and static voltage, thereby reducing changes in sensitivity to external noise and touch.

[0024] In addition, in a device for detecting a pressure touch of an improved structure according to one aspect of the present invention, the sensor pad may be arranged such that a conductive pad disposed at the outermost layer among the plurality of conductive pads has a narrower area than an adjacent conductive pad; and the shielding portion may be formed in a form that surrounds a conductive pad disposed at the outermost layer among the plurality of conductive pads.

[0025] In addition, a device for detecting a pressure touch of an improved structure according to one aspect of the present invention can improve malfunctions due to conductive foreign substances by outputting a waveform of the same phase to a conductive pad other than the conductive pad that detects the sensing and to a shielding portion when the second sensor detects a change in electrostatic capacity due to an external touch and proximity, thereby preventing a potential difference from occurring.

[0026] In addition, a device for detecting a pressure touch of an improved structure according to one aspect of the present invention can improve the sensitivity and noise characteristics of changes in electrostatic capacity due to external touch and proximity by controlling the shielding part to one of ground ground (GND), shield, and static voltage when sensing a conductive pad located at the outermost layer among the plurality of conductive pads in the second sensor.

[0027] Also, in a method for detecting a pressure touch having an improved structure according to another aspect of the present invention, a device for detecting a pressure touch includes a plurality of conductive pads formed by stacking different layers, a sensor pad including a non-conductor disposed between the conductive pads, a shielding portion provided in a form that surrounds a side surface of the sensor pad and shields a mutual electrostatic capacitance component induced between the conductive pads, and a sensor IC connected to the plurality of conductive pads of the sensor pad, wherein the sensor IC includes a first sensor for sensing pressure, a second sensor for sensing proximity and touch, and a conversion portion for converting at least one conductive pad among the plurality of conductive pads to be fixed to a constant voltage or converted into a shield area, and controlling the shielding portion to one of a ground ground (GND), a shield, and a static voltage; a first sensing step of sensing, in the sensor IC, an electrostatic capacitance between a conductive pad disposed in an innermost layer among the plurality of conductive pads and a conductive pad disposed adjacent to the conductive pad through a first sensor; And in the sensor IC, a second sensing step of sensing the electrostatic capacity of a conductive pad located at the outermost layer among the plurality of conductive pads through a second sensor; the sensor IC detects a change in electrostatic capacity due to pressure through the first sensing step, and detects a change in electrostatic capacity due to external touch and proximity through the second sensing step, and when sensing through the first sensing step or the second sensing step, the shielding part can be connected to one of a ground ground (GND), a shield, and a static voltage.

[0028] In addition, in a method for detecting a pressure touch having an improved structure according to another aspect of the present invention, a device for detecting a pressure touch includes a sensor pad including a plurality of conductive pads formed by stacking different layers, a non-conductor disposed between the plurality of conductive pads, a shielding portion that is provided in a form that surrounds the side surfaces of the sensor pads, and may also be provided in a form that surrounds the upper portions depending on the structure, and that shields a mutual electrostatic capacitance component induced between the conductive pads, and a sensor IC connected to the plurality of conductive pads of the sensor pad, wherein the sensor IC includes a first sensor that senses pressure, and a conversion portion that converts at least one conductive pad among the plurality of conductive pads to be fixed to a constant voltage or converted into a shield area; and controls the shielding portion to one of a ground ground (GND), a shield, and a static voltage; and a first sensing step of sensing, in the sensor IC, an electrostatic capacitance between a conductive pad disposed in an innermost layer among the plurality of conductive pads and a conductive pad disposed adjacent to the conductive pad, through a first sensor; The above sensor IC detects a change in electrostatic capacity due to pressure through a first sensing step, and when sensing through the first sensing step, the shielding part can be connected to one of ground ground (GND), shield, and static voltage.

[0029] In addition, in a method for detecting a pressure touch of an improved structure according to another aspect of the present invention, the sensor pad may have a shield formed at the bottom of the sensor pad depending on the state of the device to which it is applied; when the shield is formed at the bottom of the sensor pad, a non-conductor is further included at the bottom of the conductive pad of the innermost layer; and the shield is formed at the bottom of the non-conductor so that the shield is connected to one of a ground ground (GND), a shield, and a static voltage in the shielding step, thereby preventing a change in electrostatic capacity due to an external disturbance in the conductive pad disposed at the innermost layer.

[0030] In addition, a method for detecting a pressure touch of an improved structure according to another aspect of the present invention is such that, in the first sensing step, when sensing a conductive pad located at the innermost layer among the plurality of conductive pads through the first sensor, the sensor IC can reduce changes in sensitivity to external noise and touch by changing other conductive pads and a shield to one of ground ground (GND), shield, and static voltage.

[0031] In addition, a method for detecting a pressure touch of an improved structure according to another aspect of the present invention comprises, in the second sensing step, when sensing a conductive pad located at the outermost layer among the plurality of conductive pads through the second sensor, the sensor IC operates a conductive pad located below the conductive pad located at the outermost layer as one of a shield, a ground ground (GND), and a no connect, and controls the shield as one of a ground ground (GND), a shield, and a static voltage, thereby improving the sensitivity and noise characteristics of a change in electrostatic capacity due to an external touch and proximity.

[0032] In addition, in a method for detecting a pressure touch of an improved structure according to another aspect of the present invention, after pressure sensing, the sensor IC senses a conductive pad located at the innermost layer among a plurality of conductive pads through the first sensor to detect a change in electrostatic capacity due to an environmental change, and changes other conductive pads and a shield to one of ground ground (GND), shield, and static voltage, thereby reducing changes in sensitivity to external noise and touch.

[0033] In addition, in a method for detecting a pressure touch of an improved structure according to another aspect of the present invention, the sensor pad may be arranged such that a conductive pad disposed on the outermost layer among the plurality of conductive pads may be arranged in a narrower area than an adjacent conductive pad; and the shielding portion may be formed in a shape that surrounds the conductive pad disposed in the narrow area.

[0034] In addition, a method for detecting a pressure touch of an improved structure according to another aspect of the present invention can improve malfunctions due to conductive foreign substances by outputting a waveform of the same phase to a conductive pad other than the conductive pad that detects the sensing and a shielding part when the second sensor detects a change in electrostatic capacity due to an external touch and proximity through the second sensing step, thereby preventing a potential difference from occurring.

[0035] In addition, a method for detecting a pressure touch of an improved structure according to another aspect of the present invention is such that, in the second sensing step, when sensing a conductive pad located at the outermost layer among the plurality of conductive pads through the second sensor, the sensor IC can improve the sensitivity and noise characteristics of the change in electrostatic capacity due to external touch and proximity by operating the shielding part as one of ground ground (GND), shield, and static voltage.

[0036] According to the present invention, by structurally adding shielding to the pressure sheet, the change in electrostatic capacitance induced by the hand is eliminated, and by changing the waveform sensing the pad closest to the hand among the plurality of conductive pads used to measure pressure in terms of the device to a static voltage, the electrostatic capacitance charged by the hand is eliminated, thereby enabling the distinction of pressure touch without an additional software algorithm, and having the effect of enabling accurate recognition even of repetitive and rapid pressure changes.

[0037] In addition, according to the present invention, environmental influences can be detected through a conductive pad without a separate sensor, thereby preventing malfunctions due to changes in the environment (temperature / humidity) and reducing manufacturing costs.

[0038] The accompanying drawings are intended to aid understanding of the present invention and provide examples of the present invention along with detailed descriptions. However, the technical features of the present invention are not limited to specific drawings, and the features disclosed in each drawing may be combined to form new embodiments.

[0039] Figures 1 to 3 are drawings showing problems that occur due to the pressure sheet structure and mutual electrostatic capacitance of a conventional pressure sensor.

[0040] FIGS. 4 and 5 are schematic drawings of a pressure sheet including a sensor pad and a shield of a pressure touch detection device of an improved structure according to the present invention and an improved effect.

[0041] FIG. 6 is a drawing showing that pressure is measured normally without data dropping through a pressure touch detection device of an improved structure according to the present invention.

[0042] FIG. 7 is a drawing showing the structure of a pressure touch sensing device of an improved structure of the present invention.

[0043] FIG. 8 is a drawing showing the configuration of a pressure sheet according to the first embodiment of a pressure touch sensing device of an improved structure of the present invention.

[0044] FIGS. 9 and 10 are drawings showing the configuration of a pressure sheet according to a second embodiment of a pressure touch sensing device of an improved structure of the present invention.

[0045] FIG. 11 and FIG. 12 are drawings showing the configuration of a pressure sheet according to a third embodiment of a pressure touch sensing device of an improved structure of the present invention.

[0046] FIG. 13 is a drawing showing a method for detecting a pressure touch according to the first embodiment of FIG. 8.

[0047] FIG. 14 is a first embodiment showing the state of a conductive pad sensed over time in a method for detecting a pressure touch of an improved structure according to the present invention.

[0048] FIG. 15 is a drawing showing a method for detecting a pressure touch according to the second embodiment of FIGS. 9 and 10.

[0049] FIG. 16 is a second embodiment showing the state of a conductive pad sensed over time in a method for detecting a pressure touch of an improved structure according to the present invention.

[0050] FIG. 17 is a drawing showing a method for detecting a pressure touch according to the third embodiment of FIGS. 11 and 12.

[0051] FIG. 18 is a third embodiment showing the state of a conductive pad sensed over time in a method for detecting a pressure touch of an improved structure according to the present invention.

[0052] Hereinafter, a preferred embodiment according to the present invention will be described in detail with reference to the attached drawings.

[0053] The advantages and features of the present invention and the method for achieving them will become clear with reference to the embodiments described in detail below together with the attached drawings.

[0054] However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and these embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0055] In addition, when describing the present invention, if it is determined that related known technologies may obscure the gist of the present invention, a detailed description thereof will be omitted.

[0056] The features disclosed in each drawing can be combined with each other to form new embodiments.

[0057] Referring to FIGS. 4 to 18, the device and method for detecting a pressure touch of an improved structure according to the present invention can accurately detect a pressure touch by using a plurality of conductive pads.

[0058] When a hand touches a conventional pressure sheet, the electrostatic capacitance between the pressure-sensing pads (PAD) is induced in the hand, which reduces the pressure data (raw data) measured by the sensor IC, and the pressure data (raw data) drops as much as Cml (mutual leak) is formed.

[0059] In addition, since the charge and discharge waveform for measuring the electrostatic capacity is generated on the hand, the pressure data (raw data) measured by the sensor IC increases, and the pressure data (raw data) increases as much as the Ctl (touch leak) is formed.

[0060] To improve this, the pressure touch detection device of the improved structure according to the present invention, referring to FIGS. 4 to 6, has a shielding portion in the form of wrapping the side of the sensor pad, so as to shield the mutual electrostatic capacitance component induced between the conductive pads, and can be improved by changing the sensing method to remove Ctl.

[0061] In addition, it is characterized by not forming Ctl because the outer layer conductive pad is fixed with a static (DC) voltage instead of a driving pulse, so that no charge is transferred to the IC without charging or discharging the finger.

[0062] Therefore, Cml is removed through the shielding, and the waveform sensing the pad closest to the hand among the plurality of conductive pads used to measure pressure is changed to a static voltage to prevent Ctl from being formed.

[0063] This enables pressure touch recognition without additional software algorithms, eliminates memory waste or malfunctions caused by algorithms, and has the effect of enabling accurate recognition even with repetitive and rapid pressure changes.

[0064] A device for detecting a pressure touch of an improved structure of the present invention may include, as shown in FIG. 7, a sensor pad (100) including a plurality of conductive pads (111, 112) formed by stacking different layers, a non-conductor (50) disposed between the conductive pads (111, 112), a shielding member (120) provided in a form that surrounds the side of the sensor pad (100) and shields the mutual capacitance component induced between the conductive pads so that it does not leak, and a sensor IC (200) connected to the plurality of conductive pads of the sensor pad (100).

[0065] In addition, the sensor IC (200) may include a first sensor (210) that senses the electrostatic capacitance between a conductive pad (111) disposed adjacent to and above a conductive pad (112) disposed on the innermost layer among a plurality of conductive pads (111, 112), a second sensor (220) that senses the electrostatic capacitance of a conductive pad located on the outermost layer (111) among a plurality of conductive pads, and a conversion unit (250) that converts at least one of the plurality of conductive pads to be fixed to a constant voltage or converted to a shield area.

[0066] In addition, the sensor IC (200) detects changes in electrostatic capacity due to pressure through the first sensor (210), detects changes in electrostatic capacity due to external touch and proximity through the second sensor (220), and can control the connection of the shielding part (120) to one of ground ground (GND), shield, and static voltage.

[0067] When multiple conductive pads are stacked, the first conductive pad (111) located closest to the surface of the device may be referred to as an outer layer pad, and the second conductive pad (112) located farthest from the surface of the device may be referred to as an inner layer pad.

[0068] Additionally, the first to third conductive pads (111, 112, 113) can be connected to the ground ground (GND) and the first sensor (210), the second sensor (220), and the converter (250), respectively.

[0069] In addition, the first sensor (210) of the sensor IC (200) can sense the electrostatic capacitance between the conductive pads in a differential manner, and the second sensor (220) can detect whether the conductive pads are touched as a self-type sensor.

[0070] That is, the first sensor (210) senses the electrostatic capacitance between the first conductive pad (111) and the second conductive pad (112), and by comparing the difference in electrostatic capacitance, pressure sensing can be detected, and proximity and touch sensing of the first conductive pad (111) can be detected through the second sensor (220).

[0071] Additionally, after detecting a pressure change through the first sensor (210), proximity and touch can be detected through the second sensor (220), or after detecting proximity and touch through the second sensor (220), pressure change can be detected through the first sensor (210).

[0072] That is, regardless of the sensing order of the first sensor (210) and the second sensor (220), if the sensitivity of both the first sensor (210) and the second sensor (220) increases, it can be determined that the touch is caused by a hand.

[0073] Therefore, if the sensitivity of only one of the two sensors increases, it can be determined that the touch is caused by a foreign substance rather than a hand, thereby improving malfunction.

[0074] In addition, a device for detecting a pressure touch of an improved structure according to one aspect of the present invention may include, as shown in FIG. 8(a), a sensor pad (100) according to the first embodiment, a plurality of conductive pads (111, 112) formed by stacking different layers, and a non-conductor (50) disposed on top of each conductive pad (111, 112).

[0075] In addition, the shielding portion (120) is provided in a form that surrounds the side and upper portion of the sensor pad (100), so that it can shield the mutual electrostatic capacitance component generated between the conductive pads.

[0076] In addition, the sensor IC (200) can be connected to a plurality of conductive pads of the sensor pad, and can sense the electrostatic capacitance between the conductive pad (112) disposed in the innermost layer among the plurality of conductive pads and the conductive pad (111) disposed adjacently on top through the first sensor (210), thereby detecting a change in electrostatic capacitance due to pressure.

[0077] In addition, depending on the state of the applied mechanism (the mechanism in which the device for detecting pressure touch is installed), the sensor pad (100) may have a shield (120) formed at the bottom of the sensor pad (100), as shown in Fig. 8(b).

[0078] That is, when a shielding portion (120) is formed at the bottom of the sensor pad (100), a non-conductor (50) is further included at the bottom of the conductive pad (112) of the innermost layer, and the shielding portion (120) is formed at the bottom of the non-conductor (50), so that the conductive pad (112) placed at the innermost layer can be prevented from having a change in electrostatic capacity due to external disturbance.

[0079] In addition, referring to FIGS. 9 and 10, as shown in FIG. 9, the sensor pad (100) may be arranged so that the conductive pad (111) disposed on the outermost layer among the plurality of conductive pads is arranged in the same area as the adjacent conductive pad (112), and as shown in FIG. 10, the sensor pad (100) may be arranged so that the conductive pad (111) disposed on the outermost layer among the plurality of conductive pads is arranged in a narrower area than the adjacent conductive pad (112).

[0080] In addition, the shielding portion (120) is provided in a form that surrounds the side of the conductive pad (111) positioned on the outermost layer among the plurality of conductive pads, and may also be provided in a form that surrounds the upper portion depending on the structure.

[0081] That is, it can be configured in a form in which a shielding part (120) surrounds the conductive pad (111) placed on the outermost layer so that changes in electrostatic capacity due to external touch and proximity can be detected.

[0082] In addition, by using three conductive pads, the second conductive pad (112) and the third conductive pad (113) can be used as pressure sensors, and the first conductive pad (111) can be used as a proximity and touch detection sensor.

[0083] For example, referring to FIGS. 11 and 12, while the first conductive pad (111) senses proximity and touch through the first sensor (210), the second conductive pad (112) is connected to the converter (250), so that the first conductive pad (111) and the second conductive pad (112) have the same phase waveforms superimposed, thereby increasing the sensitivity.

[0084] At this time, it goes without saying that the third conductive pad (113) can also be connected to the converter (250) to further increase the sensing sensitivity.

[0085] That is, when the second sensor (210) senses a change in electrostatic capacity due to external touch and proximity, the conversion unit (250) of the sensor IC (200) outputs a waveform of the same phase to a conductive pad other than the conductive pad that senses the sensing and to the shielding unit so that a potential difference does not occur, thereby improving malfunction against conductive foreign substances.

[0086] In addition, when sensing a conductive pad located in the innermost layer among a plurality of conductive pads in the first sensor (210), the sensor IC (200) can reduce changes in sensitivity to external noise and touch by changing other conductive pads and shielding to ground (GND).

[0087] In addition, by connecting conductive pads (112, 113) other than the first conductive pad (111) sensed through the second sensor (220) to the ground ground (GND), it has the effect of preventing noise induced from the second conductive pad (112) to the first conductive pad (111).

[0088] Additionally, conductive pads other than the conductive pads sensed when sensing through the first sensor (210) and the second sensor (220) can take three different approaches.

[0089] ① When a conductive pad other than the conductive pad being sensed is connected to the converter, the waveforms between the conductive pad being sensed and the conductive pad located below it overlap in the same phase, thereby increasing the sensitivity.

[0090] ② If a conductive pad other than the conductive pad being sensed is not connected, noise induced by the conductive pad being sensed cannot be prevented, but the sensing sensitivity can be increased.

[0091] ③ When connecting a conductive pad other than the sensed conductive pad to ground (GND), noise induced by the sensed conductive pad can be prevented.

[0092] That is, depending on the need for sensing sensitivity and the environment, the conductive pads other than the sensed conductive pads may not be connected, may be connected to the converter to further increase the sensing sensitivity, or may be connected to the ground (GND) to prevent noise.

[0093] That is, in the second sensor (210), when sensing the conductive pad (111) located at the outermost layer among the plurality of conductive pads, the sensor IC (200) causes the conductive pads (112, 113) located below the conductive pad (111) located at the outermost layer to operate as one of a shield, ground ground (GND), and no connection, and causes the shielding portion (120) to operate as one of a shield, ground ground (GND), so as to improve the sensitivity and noise characteristics of the change in electrostatic capacity due to external touch and proximity.

[0094] In addition, in the second sensor (210), when sensing a conductive pad located at the outermost layer among a plurality of conductive pads, the sensor IC (200) can improve the sensitivity and noise characteristics of changes in electrostatic capacity due to external touch and proximity by operating the shielding portion (120) as either a shield or a ground ground (GND).

[0095] In addition, after pressure sensing, the sensor IC (200) senses the conductive pad (113) located at the innermost layer among the plurality of conductive pads through the first sensor (210) to detect a change in electrostatic capacity due to environmental changes, and the other conductive pads (111, 112) and the shielding portion (120) can be changed to any one of ground ground (GND), shield, and static voltage, thereby reducing changes in sensitivity to external noise and touch.

[0096] This can solve the problem of capacitor characteristics physically changing and causing malfunction when the environment (temperature / humidity) changes.

[0097] That is, by changing the outer layer conductive pad (111) located closest to the surface of the device to one of ground ground (GND), shield, and static voltage, sensitivity to external noise and touch is blocked, and by sensing the inner layer conductive pad (113) as a reference (Ref) channel, the value of the conductive pad changed by environmental factors (temperature / humidity) can be confirmed.

[0098] That is, the third conductive pad (113), which is an inner layer conductive pad, can be used as a reference channel concept to respond to environmental changes.

[0099] This has an economical effect by using a conductive pad to measure pressure without the need for a separate existing sensor.

[0100] As described above, the first embodiment cannot perform proximity sensing, but has the advantage that the problematic Cml is not formed by a shield selected from among ground ground (GND), shield, and static voltage, and the Ctl by hand is not formed by improving the sensing waveform, so that judgment is possible only by pressure.

[0101] In addition, the second embodiment may be vulnerable to external noise because the outer conductive pad that can be touched is exposed, but the problematic Ctl is not formed by improving the sensing waveform, has the most economical structure (requiring fewer sheet layers), and has the advantage of being able to determine accurate operation by adding proximity sensing.

[0102] In addition, the third embodiment requires the most material of the sheet layer, but the problematic Cml is not formed by shielding with any of ground ground (GND), shield, and static voltage, is strong against noise with shielding on the outside when measuring pressure, and accurate operation judgment is possible by adding proximity sensing, and has the advantage of being able to judge only by pressure because Ctl is not formed by hand due to improvement in the sensing waveform.

[0103] In addition, a method for detecting a pressure touch of an improved structure according to another aspect of the present invention, referring to FIGS. 13 and 14, a device for detecting a pressure touch includes a sensor pad (100) including a plurality of conductive pads (111, 112) formed by stacking different layers, a non-conductor (50) disposed on the upper portion of each conductive pad, a shielding portion (120) provided in a form that surrounds the side and upper portion of the sensor pad (100) and shields a mutual electrostatic capacitance component induced between the conductive pads, and a sensor IC (200) connected to the plurality of conductive pads of the sensor pad (100), wherein the sensor IC (200) includes a first sensor (210) for sensing pressure, and a conversion portion (250) for converting the conductive pads to be fixed to a constant voltage or converted into a shield area, and can control the connection of the shielding portion (120) to any one of a ground ground (GND), a shield, and a static voltage, and in the sensor IC (200), a plurality of It includes a first sensing step (S101) of sensing the electrostatic capacity between a conductive pad (112) disposed in the innermost layer of the conductive pads and a conductive pad (111) disposed adjacently through a first sensor (210), and the sensor IC (200) detects a change in electrostatic capacity due to pressure through the first sensing step (S101), and when sensing through the first sensing step (S101), the shielding part (120) can be connected to any one of a ground ground (GND), a shield, and a static voltage.

[0104] In addition, after pressure sensing through the first sensing step (S101), the sensor IC (200) senses a conductive pad located at the innermost layer among a plurality of conductive pads through the first sensor (210) to detect a change in electrostatic capacity due to environmental change (S102), and changes other conductive pads and shielding to any one of ground ground (GND), shield, and static voltage, thereby reducing changes in sensitivity to external noise and touch.

[0105] In addition, referring to FIGS. 15 to 18, a method for detecting a pressure touch of an improved structure according to another aspect of the present invention is described. The device for detecting a pressure touch includes a sensor pad (100) including a plurality of conductive pads (111, 112, 113) formed by stacking different layers, a non-conductor (50) disposed between the conductive pads, a shielding portion (120) provided in a form that surrounds the side and upper portion of the sensor pad (100) and shields a mutual electrostatic capacitance component induced between the conductive pads, and a sensor IC (200) connected to the plurality of conductive pads of the sensor pad (100), wherein the sensor IC (200) includes a first sensor (210) for sensing pressure, a second sensor (220) for sensing proximity and touch, and a conversion portion (250) for converting the conductive pads to be fixed to a constant voltage or converted into a shield area, and can control the connection of the shielding portion (120) to a ground (GND).

[0106] In addition, in the sensor IC (200), a first sensing step (S111) of sensing the electrostatic capacity between a conductive pad (113) disposed in the innermost layer among a plurality of conductive pads (111, 112, 113) and a conductive pad (112) disposed adjacently through a first sensor (210), and in the sensor IC (200), a second sensing step (S112) of sensing the electrostatic capacity of a conductive pad (111) located in the outermost layer among a plurality of conductive pads through a second sensor (220) may be included.

[0107] In addition, the sensor IC (200) detects a change in electrostatic capacity due to pressure through the first sensing step (S111), detects a change in electrostatic capacity due to external touch and proximity through the second sensing step (S112), and when sensing through the first sensing step or the second sensing step, the shielding part can be connected to any one of ground ground (GND), shield, and static voltage.

[0108] In addition, after pressure sensing or proximity and touch sensing, the conductive pad (113) located at the innermost layer among the plurality of conductive pads is sensed, and a change in electrostatic capacity due to environmental change is detected (S113), so that other conductive pads and shielding portions are changed to one of ground ground (GND), shield, and static voltage, thereby reducing changes in sensitivity to external noise and touch.

[0109] In addition, in the second sensing step (S112), the conductive pads (112, 113) located below the conductive pads (111) located at the outermost layer can operate as one of shield, ground ground (GND), and no connect, and the shield can operate as one of ground ground (GND), shield, and static voltage, thereby controlling the sensitivity of the change in electrostatic capacity due to external touch and proximity.

[0110] In addition, in the second sensing step (S112), when sensing the conductive pad located at the outermost layer among the plurality of conductive pads through the second sensor (220), the sensor IC (200) can improve the sensitivity and noise characteristics of the change in electrostatic capacity due to external touch and proximity by causing the shielding part (120) to operate as either a shield or a ground ground (GND), and causing the shielding part to operate as either a ground ground (GND), a shield, or a static voltage.

[0111] In addition, in the step (S113) of detecting a change in electrostatic capacity due to an environmental change, when sensing the conductive pad (113) located in the innermost layer, the other conductive pads (111, 112) and the shielding portion (120) can be changed to one of ground ground (GND), shield, and static voltage to reduce changes in sensitivity to external noise and touch.

[0112] Referring to FIG. 17, in addition, in the first sensing step (121), when sensing a conductive pad located in the innermost layer (113) among the plurality of conductive pads through the first sensor (210), the sensor IC (200) can reduce changes in sensitivity to external noise and touch by changing other conductive pads (111, 112) to ground ground (GND).

[0113] In addition, in the second sensing step (S122), when sensing the conductive pad located at the outermost layer (111) among the plurality of conductive pads through the second sensor (210), the sensor IC (200) operates the conductive pads (111, 112) located below the conductive pad located at the outermost layer (111) as one of a shield, ground ground (GND), and no connect, and operates the shield as one of a ground ground (GND), shield, and static voltage, thereby improving the sensitivity and noise characteristics of the change in electrostatic capacity due to external touch and proximity.

[0114] In addition, as illustrated in FIG. 18, the sensing items of the flowchart are not related to the order, and in addition to the combination of conductive pads PAD #1, PAD #2, and PAD #3, pressure information can be acquired with a combination of PAD #1, PAD #2 or PAD #1, PAD #3.

[0115] That is, the electrostatic capacitance of the second conductive pad (112) positioned adjacent to the third conductive pad (113) located at the innermost layer for pressure detection is sensed. At this time, the first conductive pad (111) located at the outermost layer can be connected to any one of ground ground (GND), shield, and static voltage.

[0116] In addition, when performing proximity and touch sensing through the first conductive pad (111), the second and third conductive pads (112, 113), which are conductive pads other than the sensed pad, can operate by selecting one of shield, unconnected, and connected to ground (GND).

[0117] This allows you to select one of three options to adjust the sensing sensitivity depending on the sensing environment.

[0118] At this time, the shield (120) can operate with any one of ground ground (GND), shield, and static voltage.

[0119] There are three ways to block external disturbances:

[0120] In addition, the third conductive pad (113) located at the innermost layer can be used as a reference channel to sense environmental influences, the first conductive pad (111) located at the outermost layer can be connected to any one of ground ground (GND), shield, and static voltage, and the second conductive pad (112) can be operated by selecting any one of ground ground (GND), shield, and static voltage.

[0121] Additionally, the capacitance is sensed using the third conductive pad (113) located at the innermost layer to detect environmental influence.

[0122] Next, when performing proximity and touch sensing through the first conductive pad (111), the second conductive pad (112), which is a conductive pad other than the first conductive pad (111) being sensed, can operate by selecting any one of shield, unconnected, and connected to ground (GND).

[0123] This allows you to select one of three options to adjust the sensing sensitivity depending on the sensing environment.

[0124] At this time, the shielding part (120) can block external noise by operating with any one of ground ground (GND), shield, and static voltage.

[0125] In addition, the sensor pad (100) may be formed such that the conductive pad positioned on the outermost layer (111) among the plurality of conductive pads is positioned in a narrower area than the adjacent conductive pad (112), and the shielding portion (120) may be formed in a form that surrounds the upper portion of the conductive pad (111) positioned on the outermost layer among the plurality of conductive pads.

[0126] Therefore, according to the present invention, by structurally adding a shield that can be applied as one of ground ground (GND), shield, and static voltage to the pressure sheet, the change in electrostatic capacitance induced by the hand is eliminated, and in terms of the device, the waveform that senses the pad closest to the hand among the plurality of conductive pads used to measure pressure is changed to static voltage, so that the pressure touch can be distinguished without an additional software algorithm, and it has the effect of enabling accurate recognition even of repetitive and rapid pressure changes.

[0127] In addition, according to the present invention, environmental influences can be detected through a conductive pad without a separate sensor, thereby preventing malfunctions due to changes in the environment (temperature / humidity) and reducing manufacturing costs.

[0128] Although specific embodiments of the device and method for detecting a pressure touch of the improved structure of the present invention have been described so far, it is obvious that various modifications are possible within the scope of the present invention.

[0129] Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined not only by the claims described below but also by equivalents of the claims.

[0130] That is, it should be understood that the above-described embodiments are exemplary in all respects and not restrictive, and the scope of the present invention is indicated by the claims to be described later rather than the detailed description, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention.

[0131] 50: Nonconductor

[0132] 100: Sensor pad

[0133] 111: First conductive pad

[0134] 112: Second conductive pad

[0135] 113: Third conductive pad

[0136] 120: Ground (GND) shield

[0137] 200: Sensor IC

[0138] 210: First sensor (differential type)

[0139] 220: Second sensor (self mode)

[0140] 250: Conversion section

Claims

1. A sensor pad including a plurality of conductive pads formed by laminating different layers and a non-conductor disposed between the conductive pads; A shielding member that is provided in a form that wraps around the side of the sensor pad and shields the mutual electrostatic capacitance component generated between the conductive pads; and A sensor IC is included that is connected to a plurality of conductive pads of the above sensor pad; The above sensor IC comprises: a first sensor that senses electrostatic capacitance between a conductive pad positioned at the innermost layer among a plurality of conductive pads and a conductive pad positioned adjacent to and above; A second sensor for sensing the electrostatic capacitance of a conductive pad located at the outermost layer among the plurality of conductive pads; and A converter comprising: a converter for converting at least one of the plurality of conductive pads to be fixed to a constant voltage or converted into a shield region; The above sensor IC is an improved structure for detecting pressure touch, which detects a change in electrostatic capacity due to pressure through the first sensor, detects a change in electrostatic capacity due to external touch and proximity through the second sensor, and controls the connection of the shield to one of ground ground (GND), shield, and static voltage.

2. A sensor pad including a plurality of conductive pads formed by laminating different layers and a non-conductor disposed between the plurality of conductive pads; A shielding part that is provided in a form that wraps around the side of the sensor pad and, depending on the structure, also wraps around the upper part, and shields the mutual electrostatic capacitance component generated between the conductive pads; and A sensor IC is included that is connected to a plurality of conductive pads of the above sensor pad; The above sensor IC comprises: a first sensor that senses the electrostatic capacitance between a conductive pad positioned at the innermost layer among a plurality of conductive pads and a conductive pad positioned adjacent to and above; and A converter comprising: a converter for converting at least one of the plurality of conductive pads to be fixed to a constant voltage or converted into a shield region; The above sensor IC is an improved structure pressure touch detection device that detects a change in electrostatic capacitance due to pressure through the first sensor and controls the connection of the shield to any one of ground ground (GND), shield, and static voltage.

3. In claim 1 or claim 2, The above sensor pad may have a shield formed at the bottom of the sensor pad depending on the state of the device to which it is applied; When a shielding portion is formed at the bottom of the above sensor pad, a non-conductor is further included at the bottom of the conductive pad of the innermost layer; A pressure touch detection device having an improved structure, in which a shielding layer is formed on the lower side of a non-conductor disposed under a conductive pad of the innermost layer, thereby preventing the conductive pad disposed in the innermost layer from changing electrostatic capacity due to external disturbance.

4. In claim 1, When sensing a conductive pad located at the innermost layer among the plurality of conductive pads in the first sensor, The above sensor IC is a pressure touch detection device with an improved structure that can reduce changes in sensitivity to external noise and touch by changing other conductive pads and shielding to any one of ground ground (GND), shield, and static voltage.

5. In claim 1, In the second sensor, when sensing a conductive pad located at the outermost layer among the plurality of conductive pads, The above sensor IC is a pressure touch detection device with an improved structure capable of improving the sensitivity and noise characteristics of electrostatic capacity change due to external touch and proximity by operating the conductive pad located below the conductive pad located at the outermost layer as one of a shield, ground ground (GND), and no connect, and operating the shielding part as one of a shield and ground ground (GND).

6. In claim 1 or claim 2, An improved structure for detecting a pressure touch, wherein after pressure sensing, the sensor IC senses a conductive pad located at the innermost layer among a plurality of conductive pads through the first sensor to detect a change in electrostatic capacity due to a change in the environment, and changes the other conductive pads and the shielding to any one of ground ground (GND), shield, and static voltage, thereby reducing changes in sensitivity to external noise and touch.

7. In claim 1, The above sensor pads may be arranged such that the conductive pads arranged on the outermost layer among the plurality of conductive pads can be arranged in a narrower area than adjacent conductive pads; A pressure touch detection device having an improved structure, wherein the shielding member is formed in a form that surrounds the upper part of a conductive pad arranged in the outermost layer among the plurality of conductive pads.

8. In claim 1 or claim 7, An improved pressure touch detection device having an improved structure, wherein, when the second sensor detects a change in electrostatic capacity due to an external touch and proximity, the conversion unit of the sensor IC outputs a waveform of the same phase to conductive pads other than the conductive pad that detects the sensing, and to the shielding unit, thereby preventing the occurrence of a potential difference, thereby improving malfunction due to conductive foreign substances.

9. In claim 1 or claim 7, In the second sensor, when sensing a conductive pad located at the outermost layer among the plurality of conductive pads, The above sensor IC is a pressure touch detection device with an improved structure that can improve the sensitivity and noise characteristics of electrostatic capacitance changes due to external touch and proximity by operating the shielding part with any one of ground ground (GND), shield, and static voltage.

10. A device for detecting a pressure touch comprises a sensor pad including a plurality of conductive pads formed by stacking different layers, a non-conductor arranged between the conductive pads, a shielding portion provided in a form that surrounds the side of the sensor pad and shields a mutual electrostatic capacitance component induced between the conductive pads, and a sensor IC connected to the plurality of conductive pads of the sensor pad. The sensor IC includes a first sensor for sensing pressure, a second sensor for sensing proximity and touch, and a conversion unit for converting at least one of the plurality of conductive pads to be fixed to a positive voltage or converted into a shield area, and controls connection of the shield unit to one of ground ground (GND), shield, and static voltage; In the above sensor IC, a first sensing step for sensing the electrostatic capacitance between a conductive pad arranged in the innermost layer of the plurality of conductive pads and a conductive pad arranged adjacently through a first sensor; and In the above sensor IC, a second sensing step is included for sensing the electrostatic capacitance of a conductive pad located at the outermost layer among the plurality of conductive pads through a second sensor; The above sensor IC detects a change in electrostatic capacity due to pressure through the first sensing step, detects a change in electrostatic capacity due to external touch and proximity through the second sensing step, and connects the shielding part to any one of ground ground (GND), shield, and static voltage during sensing through the first sensing step or the second sensing step.

11. A device for detecting a pressure touch comprises a sensor pad including a plurality of conductive pads formed by stacking different layers, a non-conductor disposed between the plurality of conductive pads, a shielding portion that is provided in a form that surrounds the side surface of the sensor pad and may also be provided in a form that surrounds the upper portion depending on the structure, and a sensor IC that is connected to the plurality of conductive pads of the sensor pad, The sensor IC includes a first sensor for sensing pressure, and a conversion unit for converting at least one of the plurality of conductive pads to be fixed to a constant voltage or converted into a shield area, and controlling connection of the shield unit to one of ground ground (GND), shield, and static voltage; In the above sensor IC, a first sensing step is included for sensing the electrostatic capacitance between a conductive pad arranged in the innermost layer among the plurality of conductive pads and a conductive pad arranged adjacently through a first sensor; The above sensor IC detects a change in electrostatic capacity due to pressure through a first sensing step, and a method for detecting a pressure touch with an improved structure, wherein the shielding part is connected to any one of ground ground (GND), shield, and static voltage during sensing through the first sensing step.

12. In claim 10 or claim 11, The above sensor pad may have a shield formed at the bottom of the sensor pad depending on the state of the device to which it is applied; When a shielding portion is formed at the bottom of the above sensor pad, a non-conductor is further included at the bottom of the conductive pad of the innermost layer; A method for detecting a pressure touch having an improved structure, wherein a shield is formed on the lower part of a non-conductor disposed under a conductive pad of the innermost layer, and in the shielding step, the shield is connected to any one of ground ground (GND), shield, and static voltage to prevent a change in electrostatic capacity of the conductive pad disposed in the innermost layer from occurring due to external disturbance.

13. In claim 10, In the first sensing step, when sensing a conductive pad located in the innermost layer among the plurality of conductive pads through the first sensor, The above sensor IC is an improved structure for detecting a pressure touch, which can reduce changes in sensitivity to external noise and touch by changing each conductive pad and shield to one of ground ground (GND), shield, and static voltage.

14. In claim 10, In the second sensing step, when sensing the conductive pad located at the outermost layer among the plurality of conductive pads through the second sensor, The above sensor IC is configured to operate the conductive pad located below the conductive pad located at the outermost layer as one of a shield, ground ground (GND), and no connect, and the shielding part as one of a shield and ground ground (GND), thereby improving the sensitivity and noise characteristics of the change in electrostatic capacity due to an external touch and proximity, and a method for detecting a pressure touch with an improved structure.

15. In claim 10 or claim 11, An improved structure for detecting a pressure touch, wherein after pressure sensing, the sensor IC senses a conductive pad located at the innermost layer among a plurality of conductive pads through the first sensor to detect a change in electrostatic capacity due to a change in the environment, and changes the other conductive pads and the shielding to any one of ground ground (GND), shield, and static voltage, thereby reducing external noise and changes in sensitivity to touch.

16. In claim 10, The above sensor pads may be arranged such that the conductive pads arranged on the outermost layer among the plurality of conductive pads can be arranged in a narrower area than adjacent conductive pads; A method for detecting a pressure touch of an improved structure, wherein the shielding member is formed in a form that surrounds the conductive pad arranged in the narrow area.

17. In claim 10 or claim 16, A method for detecting a pressure touch with an improved structure, wherein, when the second sensor detects a change in electrostatic capacity due to an external touch and proximity through the second sensing step, the conversion unit of the sensor IC outputs a waveform of the same phase to a conductive pad other than the conductive pad detecting the sensing and to a shielding unit so as to prevent a potential difference from occurring, thereby improving malfunction due to a conductive foreign substance.

18. In claim 10 or claim 16, In the second sensing step, when sensing the conductive pad located at the outermost layer among the plurality of conductive pads through the second sensor, The above sensor IC is a method for detecting a pressure touch with an improved structure, which can improve the sensitivity and noise characteristics of changes in electrostatic capacity due to external touch and proximity by operating the shielding part with any one of ground ground (GND), shield, and static voltage.

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