Microwave module

Abstract

The invention relates to a microwave module comprising a microwave chip comprising a substrate, an active layer comprising passive and active components on a first face of the chip, an electrical ground layer on a second face opposite the first face, the active layer comprising microstrip guide transmission lines; a housing encapsulating the microwave chip, the housing comprising a redistribution layer (RDL) covering the active layer of the microwave chip and comprising electrical connection traces for a connection between the active layer and electrical interfaces of the microwave module; the active layer comprising at least one ground terminal connected to the ground layer of the microwave chip, the ground terminal being connected to at least one of the electrical interfaces, referred to as ground interface, via at least one of the electrical connection traces, referred to as ground trace, the ground interface being configured to be connected to an electrical ground of a circuit board, the ground interface and the ground trace being opposite the active layer.

Description

DESCRIPTION Title of the invention: MICROWAVE MODULE

[0001] The invention relates to a microwave module comprising a microwave chip. The invention further relates to an assembly comprising a microwave module according to the invention and an electronic card.

[0002] Microwave chips or MMIC circuits (for "Monolithic Microwave Integrated Circuit" in English) are circuits made using microelectronics techniques. They are used, for example, in radars to increase the power of the signal emitted by the antenna, for example from a few mW to around 100W.

[0003] Figure 1 shows a partial bottom view of an example of a known microwave module 1 mounted on an electronic card 3, the electronic card being shown transparently. The microwave module 1 comprises a microwave chip 110 encapsulated in a housing 120. The chip 110 comprises a substrate, a first face comprising an active layer 111, and a ground layer on a second face opposite the first face. The active layer 111 comprises active components (not shown) of the microwave chip 110, such as a transistor for example, and passive components (not shown) of the microwave chip 110, such as capacitors or inductors. The active layer 111 also comprises transmission lines (not shown) allowing the propagation of microwave signals from or to the components of the active layer 111.The transmission lines can form microstrip transmission lines allowing the propagation of a positive polarity of the microwave signal, while the ground layer allows the propagation of a negative polarity of the microwave signal.

[0004] After its manufacture, the microwave chip 110 is encapsulated in the housing 120 by a wafer-level packaging technique or FOWLP (for “Fan-Out Wafer Level Packaging” in English) known per se. The housing 120 notably comprises a plastic molding covering the second face and the sides of the microwave chip 110, in particular for mechanical protection of the microwave chip 110. The housing 120 further comprises a redistribution layer or RDL (for “Redistribution Layer” in English). English) 124. The RDL layer 124 covers the active layer 111 and allows terminals 115, 116, 113 of the microwave chip 110 to be connected to external components. For this purpose, the RDL layer 124 comprises electrical connection traces 125, 126, 123. These electrical connection traces 125, 126, 123 lead to interfaces 135, 136, 133 of the package 120, which are in particular balls (or “bumps” in English). Typically, in the FOWLP packaging technique, the electrical connection interfaces 135, 136, 133 are located at the periphery of the active layer 111. The terminals 115, 116, 113 of the chip 110 are at the edge of the active layer 111, the electrical connection traces extending from the edges of the chip to the electrical interfaces 135, 136, 133. In other words, the electrical connection interfaces 135, 136, 133 are not opposite the electronic card 3, but at the periphery thereof, as for example illustrated in FIG. 1.

[0005] Typically, the microwave chip 110 includes microwave signal input terminals 115 connected to respective input interfaces 135 via respective electrical connection traces 125; and microwave signal output terminals 116 connected to respective output interfaces 136 via respective electrical connection traces 126.

[0006] Typically, the microwave module 1 is mounted on the electronic card 3 so that the first face of the microwave chip 110 is oriented towards the electronic card 3. The interfaces 135, 136, 133 make it possible to connect the connection traces 125, 126, 123 of the RDL layer 124 with tracks of the electronic card 3.

[0007] The microwave transition between the electronic card 3 and the microwave chip 110, i.e. the transmission of microwave signals between the electronic card 3 and the microwave chip 110, is typically characterized by parameters [S]. The parameters [S] describe the input-output relationship of the power levels reflected or transmitted between ports of the microwave module 1 - electronic card 3 assembly. Thus, the electronic card 3 comprises a first port P1 delivering a microwave signal to the microwave chip 110, and a second port P2 receiving a microwave signal from the microwave chip 110. The input terminals 115 of the microwave chip 110 form a third port P3; and the output terminals 116 of the microwave chip 110 form a fourth port P4. Parameters S31, S24 represent the power transferred from the first port P1 to the third port P3 and that transferred from the fourth port P4 to the second port P2, respectively. In other words, parameters S31, S24 respectively designate the transmission losses between the first port P1 and the third port P3, and between the fourth port P4 and the second port P2. They must therefore be as close as possible to zero when expressed in decibels (dB) or to unity when expressed on a linear scale. Parameters S11, S33, S22, S44 represent the reflection losses respectively at the first port P1, the third port P3, the second port P2, and the fourth port P4. They must have the lowest possible negative values ​​when expressed in decibels (dB). Parameter S34 represents the isolation between the fourth port P4 and the third port P3.It should have the lowest possible negative value when expressed in decibels (dB). For efficient operation of the microwave module, we seek to minimize losses in microwave transitions, resulting in an improvement in the [S] parameters.

[0008] US patent publication US11557545 B2 discloses an MMIC circuit mounted on a printed circuit board such that the active layer is oriented towards the printed circuit board. This circuit is associated with a FOWLP technology package in which the connection interfaces are on the periphery of the microwave chip. The microwave chip includes an additional ground layer between the active layer and the RDL layer of the package, which complicates the manufacturing of the assembly consisting of the MMIC circuit and the package.

[0009] A microwave module is therefore sought which allows mounting on an electronic card with the active layer oriented towards said electronic card, and to obtain reduced losses in microwave transitions in a simple manner.

[0010] For this purpose, the invention proposes a microwave module comprising: - a microwave chip comprising a substrate, an active layer comprising passive and active components on a first face of the chip, an electrical ground layer on a second face opposite the first face, the active layer comprising microstrip guide transmission lines; - a package encapsulating the microwave chip, said package comprising a redistribution layer (RDL) covering the active layer of the microwave chip and comprising electrical connection traces for a connection between the active layer and electrical interfaces of the microwave module; the active layer comprising at least one ground terminal connected to the ground layer of the microwave chip, said ground terminal being connected to at least one of the electrical interfaces, called "ground interface", via at least one of the electrical connection traces, called "ground trace", said ground interface being configured to be connected to an electrical ground of an electronic card, said ground interface and said ground trace being opposite the active layer.

[0011] By providing ground interfaces and ground traces facing the first face of the chip, the electrical path between the ground interface and the chip's ground layer is shorter than if the interfaces had been positioned at the edge of the chip. This allows an improvement in the chip's [S] parameters.

[0012] According to one embodiment, the at least one ground terminal is connected to the ground layer via an electrical connection via passing through the substrate, a distance between said via and the ground interface being equal to a minimum distance defined by a manufacturing method of the microwave module.

[0013] Alternatively, said minimum distance is less than or equal to 200pm, 150pm or 100pm, or equal to zero.

[0014] According to one embodiment, the microwave chip comprises first terminals located in a peripheral zone of the active layer, the at least one ground terminal being located in a central zone of the active layer delimited by said peripheral zone, the at least one ground trace and the at least one ground interface being opposite said central zone of the active layer.

[0015] According to one embodiment, said active layer comprises input terminals configured to receive a microwave signal entering the microwave chip and output terminals configured to deliver a microwave signal emitted by the microwave chip; the active layer comprising at least at least one ground terminal, called a “side ground terminal”, located near the input terminals or the output terminals.

[0016] According to a variant, the at least one lateral ground terminal is located at a distance from the input terminals or the output terminals less than or equal to 700 pm or 400 pm, or even 300 pm.

[0017] According to one variant, the microwave module comprises two lateral ground terminals located on either side of the input terminals and / or two lateral ground terminals located on either side of the output terminals.

[0018] According to one embodiment, the microwave module comprises a plurality of said ground terminals, called “internal ground terminals”, forming a mesh in the active layer of the microwave chip.

[0019] According to one embodiment, at least one internal ground terminal is located between active or passive components of the microwave chip.

[0020] The invention also relates to an assembly comprising: - a microwave module according to the invention, - an electronic card comprising an electrical ground layer, said microwave module being mounted on the electronic card so that the active layer of the chip is oriented towards said electronic card, the at least one ground interface being electrically connected to the ground of the electronic card.

[0021] According to one embodiment, the at least one ground interface comes against a respective terminal of the electronic card, said ground interface, said terminal of the electronic card and a via connecting the terminal of the electronic card to the electrical ground of the electronic card, being aligned in a transverse direction relative to the first face of the microwave chip.

[0022] Other features and advantages of the present invention will become more apparent upon reading the following description in relation to the following appended figures: [Fig 1]: Figure 1, already described, illustrates a prior art microwave module mounted on an electronic card; [Fig 2]: Figure 2 illustrates an example of a microwave module according to the invention mounted on an electronic card; [Fig 3a]: Figure 3a illustrates an example of a microwave module according to the invention mounted on an electronic card, shown without its microwave chip; [Fig 3b]: Figure 3b illustrates the example of a microwave module in Figure 3a, shown with its microwave chip; [Fig 4]: Figure 4 represents the shapes of the parameter S31 with a microwave module according to the prior art and an example of a microwave module according to the invention; [Fig 5]: Figure 5 represents the shapes of the parameter S24 with a microwave module according to the prior art and an example of a microwave module according to the invention; [Fig 6]: Figure 6 represents the shapes of the parameter S11 with a microwave module according to the prior art and an example of a microwave module according to the invention; [Fig 7]: Figure 7 represents the shapes of the parameter S22 with a microwave module according to the prior art and an example of a microwave module according to the invention; [Fig 8]: Figure 8 represents the shapes of the parameter S34 with a microwave module according to the prior art and an example of a microwave module according to the invention.

[0023] Figure 2 shows a cross-sectional view of an example of a microwave module 200 according to the invention. The microwave module 200 comprises a microwave chip 210 or MMIC circuit. The microwave chip 210 comprises an active layer 211 on a first of its faces, a substrate S, and an electrical ground layer 212 on a second face opposite the first. In particular, the active layer 211, the substrate S, and the ground layer 212 form a stack in which the layers are superimposed in this order. The active layer 211 comprises the active components of the microwave chip 210, such as a transistor 214 for example. Source electrodes of the transistor 214 are for example connected to the ground layer 212 of the chip 210 via electrical connection vias. The active layer 211 comprises passive components of the microwave chip 210, such as capacitors or inductors. The active layer 211 also comprises transmission lines allowing in particular the propagation of microwave signals from or to the components of the active layer 211. The transmission lines form microstrip transmission lines allowing the propagation of a positive polarity of the microwave signal, while the ground layer 212 allows the propagation of a negative polarity of the microwave signal.

[0024] The use of MMIC circuits in microstrip guides requires several specific technological steps to be carried out.

[0025] First, the substrate thickness must be defined and controlled. Indeed, technological steps of substrate thinning and etching of the semiconductor layers are necessary to connect the front and back sides of the electronic chip. In addition, the back side of the MMIC chip must be metallized. The thickness of the substrate of the electronic chip thus helps to define the characteristic impedances of the microstrip lines produced (with their width).

[0026] Then, it is also necessary to make metallized holes (via holes according to the commonly used Anglo-Saxon term) in the substrate thus electrically connecting the front face and the rear face of the MMIC chip to ground the circuit elements located on the front face (for example "shunt" capacitor according to the commonly used Anglo-Saxon term).

[0027] A housing 220 encapsulates the microwave chip 210. The housing 220 comprises a redistribution layer (“RDL layer” in the following) 224 which covers the active layer 211, in particular by coming into direct contact with the active layer 211. The RDL layer 224 makes it possible in particular to connect terminals of the microwave chip 210, in particular of the active layer 211, with external components. The RDL layer 224 comprises electrical connection traces 223, 225, 226, 227 for a connection between the active layer 211 and electrical interfaces 233, 235, 236, 237 of the microwave module 200. In particular, the electrical interfaces 233, 235, 236, 237 are on one side of the module microwave 200 which is parallel to the first face of the microwave chip 210.

[0028] In the active layer 211, a ground terminal 217 is connected to the ground layer 212. A connection trace 227 of the RDL layer 224, called the ground trace, connects the ground terminal 217 to an electrical interface 237, called the ground interface. The ground interface 237 is configured to be connected to a ground 322 of an electronic card 300. The microwave module 200 is particular in that the ground interface 237 and the ground trace 227 are opposite the active layer 211. In other words, in a direction perpendicular to the first face of the active layer 211 going from the outside to the inside of the chip 210, the ground trace 227 and the ground interface 237 are located above the active layer 211.

[0029] In particular, the microwave module 200 is mounted on the electronic card 300 so that the active layer 211 of the chip 210 is oriented towards the electronic card 300. This configuration is called a “flip chip” according to the commonly used English term. The ground interface 237 can then be electrically connected to the ground 322 of the electronic card 300.

[0030] For this purpose, the electronic card 300 comprises in particular a terminal 327, in particular an electrical track, on its face oriented towards the microwave module 200, against which the ground interface 237 comes into contact. In particular, the electrical ground 322 of the electronic card 300 is on an opposite face of the electronic card 300. The terminal 327, in particular the electrical track, can then be in electrical contact with the electrical ground 322 of the electronic card 300 via an electrical connection via V.

[0031] By being positioned opposite the active layer 211, the ground trace 227 and the ground interface 237 allow a connection between the ground 212 of the microwave chip 210 and the ground 322 of the electronic card 300 which is closest to the active layer 211. This connection between the grounds 212, 322 allows, by its location close to the active layer 211, to limit the radiation induced by the circulation of a microwave signal in the chip 210 and therefore better guidance of the microwave signal in the transmission lines. This allows to reduce the losses in the microwave module 200. In the art prior, the ground terminal of the chip 210 is connected to a connection interface which is located on the periphery of the microwave chip.

[0032] The ground terminal 217 is in particular connected to the ground layer 212 by an electrical connection via V, for example a metallized hole, passing through the substrate S. To minimize the resistances and the inductances, and therefore the losses, the electrical path between the ground layer 212 of the chip 210 and the ground interface 237 is preferably as short as possible. In particular, the distance between the via V connecting the ground terminal 217 to the ground layer 212 and the ground interface 231 is chosen so as to be equal to a minimum distance defined by the manufacturing method of the microwave module 200. For example, the distance between the via V and the ground interface 237 is measured between a central axis of the via V and a central axis of the ground interface 237.Such a minimum distance is for example determined by a precision of a lithography or an etching used in the manufacturing process, or by an uncertainty of placement of the components in the chip 210 or the package 220, in particular vias and / or connection interfaces.

[0033] For example, such a minimum distance may be equal to 200 pm, or even 100 pm, or have an intermediate value such as 150 pm for example. Preferably the minimum distance is equal to zero, which allows for alignment of the via V, the ground terminal 217, the ground trace 227 and the ground interface 237. The electrical path between the ground 212 of the chip 210 and the ground interface 237 is then as direct as possible, which further minimizes the resistances and inductances in the electrical path.

[0034] Preferably, when the microwave module 200 is mounted on the electronic card 300, the ground interface 237, the terminal 327 of the electronic card 300 and the via V connecting the terminal 327 of the electronic card 300 to the electrical ground 322 of the electronic card 300, are aligned. In particular, they are aligned in a transverse direction, in particular perpendicular, relative to the first face of the microwave chip 210. This further improves the microwave transitions between the electronic card 300 and the microwave chip 210.

[0035] According to one embodiment, the housing 220 is of the FOWLP type. The microwave chip 210 comprises first terminals 213 located in an area peripheral of the active layer 211. The ground terminal 217 is then located in a central zone of the active layer 211 delimited by the peripheral zone. The ground terminal 217 is therefore distinct from the first terminals 213. The ground trace 227 and the ground interface 237 are then opposite the central zone of the active layer 211.

[0036] This is particularly visible in figures 3a and 3b showing a partial bottom view of the example of microwave module 200 mounted on the electronic card 300, the electronic card being shown in transparency. In figure 3a, the microwave chip is not shown. The first terminals 213 are visible at the edge of the active layer 211. The first terminals 213 are in particular connected to electrical connection interfaces 233 located at the periphery of the active layer 211. In particular, electrical connection traces 223 connect the first terminals 213 from the edges of the active layer 211 to the electrical interfaces 233. In other words, the electrical connection interfaces 233 connected to the first terminals 213 of the active layer 211 are not opposite the active layer 211, but are located at the periphery thereof.

[0037] The chip 210 is notably manufactured using microelectronics processes. In particular, after its manufacture, the first face and the second face of the chip 210 each form an external face of the chip 210. After its manufacture, the microwave chip 210 is notably encapsulated in the housing 220 using a FOWLP technique. Referring again to FIG. 2, the housing 220 notably comprises a plastic molding 222 covering the second face and the sides of the microwave chip 210, in particular for mechanical protection of the microwave chip 210. The plastic molding 222 may be made of an epoxy material. In particular, the RDL layer 224 forms a layer against the active layer 211, and rests by its edges against a portion of the plastic molding 222.The RDL layer 224 may comprise a first passivation sub-layer, in particular against the active layer 211; a second sub-layer comprising the electrical connection traces 223, 225, 226, 227; and a third passivation sub-layer. The passivation sub-layers are for example made of an electrically insulating material. The first passivation sub-layer may comprise windows allowing contact between the terminals. electrical connections 213, 215, 216, 217 of the active layer 211 and the electrical connection traces 223, 225, 226, 227. The third passivation sub-layer may comprise windows allowing contact between the electrical connection traces 223, 225, 226, 227 and the interfaces 233, 235, 236, 237. The interfaces 233, 235, 236, 237 of the housing 220 allow in particular to electrically connect the microwave module 200, in particular the active layer 211 of the microwave chip 210, with its environment. The interfaces 233, 235, 236, 237 are for example balls (or "bump" in English). The interfaces 233, 235, 236, 237 are in particular on a face of the microwave module 200 which is parallel to the first face of the microwave chip 210.In particular, the interfaces 233, 235, 236, 237 come against the surface of the electronic card 300 when the microwave module 200 is mounted on the electronic card 300 so that the active layer 211 of the microwave chip 210 is oriented towards the electronic card 300.

[0038] In particular, the active layer 211 comprises input terminals 215 through which the microwave chip receives a microwave signal, in particular from the electronic card 300. In particular, the active layer comprises output terminals 216 which emit a microwave signal from the microwave chip 210, in particular to the electronic card 300. The input terminals 215 of the active layer 211 may comprise three electrodes. A central electrode receives a positive polarity of the microwave signal. Two electrodes, located on either side of the central electrode, receive a negative polarity of the microwave signal and are connected to the ground 212 of the chip 210, in particular by means of vias passing through the substrate S. Similarly, the output terminals 216 may comprise three electrodes.The input terminals 215 and the output terminals 216 belong in particular to the first terminals of the active layer 211 located at the edge thereof. Connection traces 225, 226 connect the input terminals 215 and output terminals 216 to respective input interfaces 235 and output interfaces 236. The input interfaces 235 and output interfaces 236 are in particular located at the periphery of the chip 210.

[0039] According to one embodiment, at least one ground terminal 217L, called a “lateral ground terminal”, is located near the input terminals 215 or the output terminals 216. The lateral ground terminal 217L makes it possible in particular to reduce losses in the microwave transitions for low frequencies of the microwave signal and to suppress resonances. The lateral ground terminal 217L is preferably as close as possible to the input terminals 215 or output terminals 216. For example, the ground terminal 217L is at a distance from them which is less than or equal to 700pm or 400pm, or even 300pm. Preferably, a lateral ground terminal 217L is located on each side of the input terminals 215 or the output terminals 216. The effects of the lateral ground terminals 217L on the microwave transitions are then symmetrical, which further reduces losses on the microwave transitions.

[0040] According to one embodiment, the active layer 211 comprises a plurality of ground terminals 217i, called "inner ground terminals", which form a mesh in the active layer 211 of the microwave chip 210. The inner ground terminals 217i are in particular distributed over the entire active layer 211. In particular, the inner ground terminals 217i are distributed in the central zone of the active layer 211. The inner ground terminals 217i are preferably positioned in the active layer 211 as soon as the size of the active layer 211 allows it, that is to say when there is sufficient space between the components of the active layer 211. The inner ground terminals 217i make it possible in particular to reduce losses in the microwave transitions for medium or high frequencies of the microwave signal.In particular, the inner ground terminals 217i also improve the isolation of the housing, as will be better understood with FIG. 8 described later. In this regard, it is particularly advantageous to place the inner ground terminals 217i between active or passive components of the active layer 211. Furthermore, the greater the number of inner ground terminals 217i of the mesh, the greater the frequencies for which losses can be reduced.

[0041] As illustrated for example in figures 3a, 3b, the electronic card 300 comprises in particular a first port P1 delivering a microwave signal to the microwave chip 210, and a second port P2 receiving a microwave signal from the microwave chip 210. In particular, the input terminals 215 of the microwave chip 210 form a third port P3; and the output terminals 216 of the microwave chip 210 form a fourth port P4.

[0042] The advantages of the ground terminals 217, 217L, 217i on the microwave transitions will be better understood by referring to Figures 4 to 8, which represent the shapes of parameters S as a function of the frequency of the microwave signal. In these figures, graph G1 corresponds to a microwave module according to the prior art, and graph G2 corresponds to an example of a microwave module according to the invention.

[0043] Figure 4 represents the parameter S31 corresponding to the transmission losses between the first port P1 and the third port P3. Figure 5 represents the parameter S24 corresponding to the transmission losses between the fourth port P4 and the second port P2. It can be seen that with the microwave module according to the invention, the transmission losses remain close to zero for higher frequencies than in the prior art, and they are also less subject to resonances.

[0044] Figure 6 represents the parameter S11 corresponding to the reflection losses at the first port P1. Figure 7 represents the parameter S22 corresponding to the reflection losses at the second port P2. It can be seen that with the microwave module according to the invention, the reflection losses have a more regular appearance and are less subject to resonances.

[0045] Figure 8 represents the parameter S34 corresponding to the isolation between the fourth port P4 and the third port P3. It can be seen that with the microwave module according to the invention, the transmission losses from port P4 to port P3 (sometimes called isolation) have lower negative values ​​than in the prior art, and they are also less subject to resonances.

[0046] The invention has been described with a microwave module 200 comprising a microwave chip 210. But the microwave module 200 could comprise several of them, in particular connected to each other.

Claims

CLAIMS 1. Microwave module (200) comprising: - a microwave chip (210) comprising a substrate (S), an active layer (211) comprising passive and active components on a first face of the chip, an electrical ground layer (212) on a second face opposite the first face, the active layer (211) comprising microstrip guide transmission lines; - a housing (220) encapsulating the microwave chip (210), said housing (220) comprising a redistribution layer (224) covering the active layer (211) of the microwave chip (210) and comprising electrical connection traces (223, 225, 226, 227) for a connection between the active layer (211) and electrical interfaces (233, 235, 236, 237) of the microwave module (200);the active layer (211) comprising at least one ground terminal (217, 217L, 217i) connected to the ground layer (212) of the microwave chip (210), said ground terminal (217, 217L, 217i) being connected to at least one of the electrical interfaces, called "ground interface" (237), via at least one of the electrical connection traces, called "ground trace" (227), said ground interface (237) being configured to be connected to an electrical ground (322) of an electronic card (300), said ground interface (237) and said ground trace (227) being opposite the active layer (211).; 2. Microwave module (200) according to claim 1, wherein the at least one ground terminal (217, 217L, 217i) is connected to the ground layer (212) via an electrical connection via (V) passing through the substrate (S), a distance between said via (V) and the ground interface (237) being equal to a minimum distance defined by a manufacturing method of the microwave module (200).

3. Microwave module (200) according to the preceding claim, wherein said minimum distance is less than or equal to 200pm, 150pm or 100pm, or equal to zero.

4. Microwave module (200) according to one of the preceding claims, wherein the microwave chip (210) comprises first terminals (213) located in a peripheral zone of the active layer (211), the at least one ground terminal (217, 217L, 217i) being located in a central zone of the active layer (211) delimited by said peripheral zone, the at least one ground trace (227) and the at least one ground interface (237), being opposite said central zone of the active layer (211).

5. Microwave module (200) according to one of the preceding claims, wherein said active layer (211) comprises input terminals (215) configured to receive a microwave signal entering the microwave chip (210) and output terminals (216) configured to deliver a microwave signal emitted by the microwave chip (210); the active layer (211) comprising at least one ground terminal, called a “lateral ground terminal” (217L), located near the input terminals (215) or the output terminals (216).

6. Microwave module (200) according to the preceding claim, in which the at least one lateral ground terminal (217L) is located at a distance from the input terminals (215) or the output terminals (216) less than or equal to 700pm or 400pm, or even 300pm.

7. Microwave module (200) according to claim 5 or 6, comprising two lateral ground terminals (217L) located on either side of the input terminals (215) and / or two lateral ground terminals (217L) located on either side of the output terminals (216).

8. Microwave module (200) according to one of the preceding claims, comprising a plurality of said ground terminals, called “internal ground terminals” (217i), forming a mesh in the active layer (211) of the microwave chip (210).

9. Microwave module (200) according to the preceding claim, wherein at least one internal ground terminal (217i) is located between active or passive components of the microwave chip (210).

10. Set including: - a microwave module (200) according to one of the preceding claims, - an electronic card (300) comprising an electrical ground layer (322), said microwave module (200) being mounted on the electronic card (300) so that the active layer (211) of the chip (210) is oriented towards said electronic card (300), the at least one ground interface (237) being electrically connected to the ground (322) of the electronic card (300).

11. Assembly according to the preceding claim, in which the at least one ground interface (237) comes against a respective terminal (327) of the electronic card (300), said ground interface (237), said terminal (327) of the electronic card (300) and a via (V) connecting the terminal (327) of the electronic card (300) to the electrical ground (322) of the electronic card (300), being aligned in a transverse direction relative to the first face of the microwave chip (210).

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