Substrate and inspection system

Abstract

A substrate according to the present invention includes: a substrate main body; a plurality of land portions that have a sensing portion and a terminal portion and that are supported by the substrate main body; and a dummy pad portion provided in a second region surrounding a first region in which the sensing portion is provided on the substrate main body.

Description

Substrate and inspection system

[0001] The present invention relates to a substrate and an inspection system.

[0002] Patent Document 1 discloses a substrate having a substrate body and a metal land portion provided on the surface of the substrate body. Such a substrate is used, for example, in a test to determine whether cells collected from a patient suspected of having skin cancer contain cancer cells.

[0003] Special Publication No. 2021-516336

[0004] In the case of the substrate described above, the land portion provided on the surface of the substrate body is subjected to surface treatment such as plating to form a sensing portion. It is desirable that the thickness of the plating of such a sensing portion does not vary as much as possible depending on the location.

[0005] The present invention has been made in view of the above circumstances, and has as its object to provide a substrate and an inspection system in which the thickness of the sensing portion has little variation.

[0006] One aspect of the substrate according to the present invention comprises a substrate body, a plurality of land portions having sensing portions and terminal portions and supported by the substrate body, and a dummy pad portion provided in a second region of the substrate body that surrounds a first region in which the sensing portions are provided.

[0007] One aspect of the testing system according to the present invention comprises: the above-described substrate; and a testing device having a substrate support portion that supports the substrate, and that measures the impedance of a target cell placed on a sensing portion of the substrate.

[0008] According to the present invention, it is possible to provide a substrate and an inspection system in which the thickness of the sensing portion has little variation.

[0009] FIG. 1A is a perspective view of an inspection system according to an embodiment of the present invention. FIG. 1B is a schematic cross-sectional view of the inspection device. FIG. 2 is a plan view of a substrate. FIG. 3 is a bottom view of the substrate. FIG. 4 is a cross-sectional view of the substrate shown in FIG. 2 taken along line C1-C1, illustrating the configuration of a land portion. FIG. 5 is a cross-sectional view of the substrate shown in FIG. 2 taken along line C1-C1, illustrating the configuration of a dummy pad portion. FIG. 6A is a plan view showing an example of a modified substrate. FIG. 6B is a plan view showing an example of a modified substrate. FIG. 6C is a plan view showing an example of a modified substrate. FIG. 6D is a plan view showing an example of a modified substrate. FIG. 6E is a plan view showing an example of a modified substrate. FIG. 6F is a plan view showing an example of a modified substrate. FIG. 6G is a plan view showing an example of a modified substrate. FIG. 7 is a schematic plan view of an example of a final work size substrate. FIG. 8 is a diagram showing test results. FIG. 9 is a diagram showing test results. FIG. 10 is a diagram showing test results. Figure 11 is a diagram showing the test results, Figure 12 is a diagram showing the test results, and Figure 13 is a diagram showing the test results.

[0010] Hereinafter, an embodiment of a substrate according to the present invention will be described with reference to the drawings. Note that the same components are denoted by the same reference numerals. The matters described below together with the accompanying drawings are intended to explain exemplary embodiments and are not intended to represent the only embodiments.

[0011] [Embodiment] An inspection system 1 and a substrate 3 according to an embodiment of the present invention will be described with reference to Figs. 1A to 5 .

[0012] 1A is a perspective view of an inspection system 1 according to an embodiment of the present invention. The inspection system 1 is an inspection system for cells. Examples of cells include various cancer cells. Cells that are the subject of inspection by the inspection system 1 are referred to as target cells.

[0013] First, we will provide an overview of the testing system 1. The testing system 1 is used, for example, to check whether cells (i.e., target cells) collected from a patient by a doctor during surgery are cancer cells.

[0014] The operator places a target cell on the upper surface of the substrate 3 set on the substrate support part 22 of the inspection device 2. The inspection device 2 then measures the impedance of the target cell placed on the upper surface of the substrate 3. The inspection device 2 then determines whether or not the target cell is a cancer cell based on the measured impedance. The inspection device 2 displays the determination result on the display part 23.

[0015] In the case of such an examination system 1, the doctor can judge the status of the surgery while checking the determination results of the examination device 2. This allows the time required for the surgery to be significantly reduced.

[0016] In particular, the substrate 3 according to this embodiment includes a dummy pad portion 36, which will be described later. Such a dummy pad portion 36 can reduce the variation in the plating thickness dimension of the sensing portion 34 (in other words, the land portion 32) provided on the upper surface of the substrate 3. As a result, the testing system 1 including the substrate 3 according to this embodiment can reduce the variation in the detected value of the impedance of the target cell. Therefore, the testing system 1 can improve the reliability of the detected value.

[0017] First, a specific configuration of the inspection system 1 according to this embodiment will be described below. Then, examples of the present invention and the results of tests conducted by the inventors to confirm the functions and effects of the present invention will be described.

[0018] (Inspection System) The inspection system 1 includes an inspection device 2 and a substrate 3 .

[0019] In the following description, a Cartesian coordinate system (X, Y, Z) shown in each drawing may be used to explain the structure of each component constituting the inspection system 1. The X direction coincides with the front-to-rear direction of the inspection device 2 constituting the inspection system 1.

[0020] The positive side in the X direction corresponds to the front side of the inspection device 2. The front side of the inspection device 2 is the side that a user faces when in use. The negative side in the X direction corresponds to the rear side of the inspection device 2.

[0021] The Y direction corresponds to the left-right direction of the inspection device 2. The + side of the Y direction corresponds to the left side when viewing the inspection device 2 from the front of the device 2. The - side of the Y direction corresponds to the right side when viewing the inspection device 2 from the front of the device 2.

[0022] The Z direction corresponds to the up-down direction of the inspection device 2. The positive side of the Z direction corresponds to the upper side of the inspection device 2. The upper side of the inspection device 2 is the side away from the ground surface on which the inspection device 2 is installed. The negative side of the Z direction corresponds to the lower side of the inspection device 2.

[0023] (Testing Device) The testing device 2 is an example of a measuring device and has the function of measuring the impedance of target cells. Cells have unique impedances depending on their type. The testing device 2 identifies the type of target cells (e.g., whether they are cancer cells or not) based on the measured impedance.

[0024] The inspection device 2 has a device main body 21 , a substrate support part 22 , and a display part 23 .

[0025] The device main body 21 is composed of a box-shaped housing 211 and various devices (not shown) housed in the housing 211. The devices include, for example, a main board (not shown) and a control unit (not shown). The control unit is mounted on the main board and controls the overall operation of the inspection device 2.

[0026] (Substrate Supporting Portion) The substrate supporting portion 22 is provided on the upper surface of the housing 211. The substrate supporting portion 22 is a portion that supports the substrate 3 when the inspection device 2 is in use (that is, when inspection is performed).

[0027] The board support part 22 is provided, for example, on the upper surface of the housing 211. The board support part 22 has an inspection area 22R provided on the upper surface of the housing 211. The inspection area 22R is a space that opens upward. The board support part 22 also has at least a pair of device-side terminal parts 221, 222 (see FIG. 4 ) in the inspection area 22R.

[0028] The device-side terminals 221 and 222 are pin-shaped and extend in the vertical direction. During use, the device-side terminals 221 and 222 each come into contact with a terminal 35 of a land 32 on the substrate 3 (to be described later).

[0029] The device-side terminal 221 is connected to the positive electrode of a power supply via an electric circuit (not shown) provided in the inspection device 2. The device-side terminal 222 is connected to the negative electrode of a power supply via an electric circuit (not shown) provided in the inspection device 2.

[0030] The substrate support part 22 also has a mounting part 223 in the inspection region 22R on which the outer edge of the substrate 3 is placed. The substrate support part 22 has a positioning member 224 on the mounting part 223. The positioning member 224 engages with a through-hole 31a provided in the outer edge of the substrate 3 to position the substrate 3. The substrate support part 22 also has a cover 225 that covers the inspection region 22R.

[0031] When the substrate 3 is placed on the placement portion 223 of the substrate support portion 22, the device-side terminal portions 221, 222 come into contact with the terminal portions 35 of the lands 32 on the substrate 3 from below.

[0032] (Display unit) The display unit 23 is provided on the front surface of the housing 211. The display unit 23 is a display that displays information. During testing, the display unit 23 displays the impedance of the target cells measured by the testing device 2 and / or the type of the target cells (whether they are cancer cells, etc.) identified based on the impedance of the target cells measured by the testing device 2.

[0033] (Substrate) Next, the substrate 3 will be described with reference to FIGS. 1A to 5. FIG. 2 is a plan view of the substrate 3. FIG. 3 is a bottom view of the substrate 3. FIG. 4 is a cross-sectional view of the substrate 3 taken along line C1-C1 in FIG. 2, illustrating the configuration of the land portion 32. In FIG. 4, only two adjacent land portions 32 are shown. FIG. 5 is a cross-sectional view of the substrate 3 taken along line C1-C1 in FIG. 2, illustrating the configuration of the dummy pad portion 36.

[0034] The substrate 3 has a substrate body 31, a plurality of lands 32, and dummy pads 36. When in use (in other words, during testing), the substrate 3 is placed on a substrate support portion 22 (see FIG. 1A) of the testing device 2.

[0035] (Substrate body) The substrate body 31 is a rectangular plate made of resin. The substrate body 31 has a first surface 311 (i.e., upper surface) disposed on the upper side during use and a second surface 312 (i.e., lower surface) disposed on the lower side during use. The second surface 312 faces the substrate support part 22 of the inspection device 2 in the up-down direction during use.

[0036] The substrate body 31 has a plurality of through holes 313 (see FIG. 4) that penetrate the substrate body 31 in the vertical direction.

[0037] A first end (i.e., an upper end) of the through hole 313 opens to the first surface 311 of the substrate body 31. A second end (i.e., a lower end) of the through hole 313 opens to the second surface 312 of the substrate body 31.

[0038] In this embodiment, the central axis of the through-hole 313 is parallel to the vertical direction, and the cross-sectional shape of the through-hole 313 is circular or elliptical.

[0039] The cross-sectional shape of the through hole 313 is not limited to a circle or an ellipse. The cross-sectional shape of the through hole 313 refers to the shape of the through hole 313 when the substrate body 31 is cut along a plane parallel to the first surface 311 and the second surface 312 and the through hole 313 is viewed from above.

[0040] In this embodiment, the through holes 313 are provided in multiple rows (four rows in this embodiment) in the left-right direction. Each row includes multiple (22 in this embodiment) through holes 313 lined up in the front-rear direction.

[0041] In this embodiment, the positions of the through holes 313 in adjacent rows in the left-right direction are aligned in the front-rear direction. However, the positions of the through holes 313 in adjacent rows in the left-right direction may be misaligned in the front-rear direction.

[0042] That is, the through holes 313 may be arranged in a so-called staggered pattern. By arranging the through holes in a staggered pattern, the distance between the terminal portions 35 of the land portions 32 (described later) in the front-rear direction can be reduced. As a result, many land portions 32 can be provided on the substrate 3.

[0043] The substrate body 31 also has a first metal layer 314 (see FIG. 4 ) around the through-hole 313 on the first surface 311. The first metal layer 314 is made of copper. The shape of the first metal layer 314 in a plan view is the same as the shape of the sensing unit 34, which will be described later, in a plan view.

[0044] The substrate body 31 also has a second metal layer 315 (see FIG. 4 ) around the through hole 313 on the second surface 312. The second metal layer 315 is made of copper. The shape of the second metal layer 315 in a plan view is the same as the shape of the terminal portion 35 in a plan view, which will be described later.

[0045] Furthermore, the substrate body 31 has a third metal layer 316 (see FIG. 5 ) on the first surface 311 in a portion where a dummy pad portion 36 (described later) is formed. The third metal layer 316 is made of copper. The shape of the third metal layer 316 in a plan view is the same as the shape of the dummy pad portion 36 (described later) in a plan view.

[0046] (Land portion) Each of the multiple land portions 32 is made of metal and is supported by the substrate main body 31. The configuration of one land portion 32 will be described below. The land portion 32 is a portion that is electrically connected to the inspection device 2 during use (in other words, during inspection). In other words, the multiple land portions 32 are lands used for inspection. In this embodiment, the multiple land portions 32 have the same configuration.

[0047] As shown in FIG. 4 , the land portion 32 includes a land base portion 33 , a sensing portion 34 , and a terminal portion 35 .

[0048] The land base 33 has a base body 331, a resin part 332, a first lid layer 333, and a second lid layer 334. The land base 33 connects a sensing part 34 (described later) and a terminal part 35. Such a land base 33 corresponds to an example of a connecting part.

[0049] The base body 331 includes a first base layer 331a, a second base layer 331b, and a connecting portion 331c.

[0050] The first base layer 331a is provided on the first surface 311 of the substrate body 31. Specifically, the first base layer 331a is provided on the upper surface of the first metal layer 314. The first base layer 331a is made of copper. The shape of the first base layer 331a in a plan view is the same as the shape of the first metal layer 314 in a plan view.

[0051] The second base layer 331b is provided on the second surface 312 of the substrate body 31. Specifically, the second base layer 331b is provided on the lower surface of the second metal layer 315. The second base layer 331b is made of copper. The shape of the second base layer 331b in a plan view is the same as the shape of the second metal layer 315 in a plan view.

[0052] The connecting portion 331c is cylindrical and disposed inside the through-hole 313. The connecting portion 331c connects the first base layer 331a and the second base layer 331b. The connecting portion 331c is made of copper.

[0053] The base body 331 having the above-described configuration is formed on the substrate body 31 by plating.

[0054] The resin part 332 is axially shaped and is inserted into the base main body 331. The central axis of the resin part 332 coincides with the central axis of the through-hole 313. The resin part 332 may be omitted. In this case, the connecting part 331c may be cylindrical.

[0055] The first lid layer 333 is provided on the first surface 311 of the substrate body 31. Specifically, the first lid layer 333 is provided on the upper surface of the first base layer 331a. The first lid layer 333 is made of copper.

[0056] The shape of the first lid layer 333 in a plan view is the same as the shapes of the first metal layer 314 and the first base layer 331a in a plan view. The first lid layer 333 is formed on the upper surface of the first base layer 331a by plating.

[0057] The second lid layer 334 is provided on the second surface 312 of the substrate body 31. Specifically, the second lid layer 334 is provided on the lower surface of the second base layer 331b. The second lid layer 334 is made of copper.

[0058] The shape of the second lid layer 334 in a plan view is the same as the shapes of the second metal layer 315 and the second base layer 331b in a plan view. The second lid layer 334 is formed on the lower surface of the second base layer 331b by plating.

[0059] (Sensing Unit) The sensing unit 34 is provided on the first surface 311 of the substrate body 31. Specifically, the sensing unit 34 is provided on the upper end surface of the land base 33. More specifically, the sensing unit 34 is provided on the upper surface of the first lid layer 333 of the land base 33. The shape of the sensing unit 34 in a planar view is the same as the shape of the first lid layer 333 in a planar view.

[0060] The region on the first surface 311 of the substrate body 31 where the sensing unit 34 is provided is referred to as a first region R １ The first region R １ In FIG. 2, the dashed two-dot line α １ The first region R １ As shown in FIG. 2, the area is a rectangular area in a plan view.

[0061] Furthermore, the first region R １ The first region R includes a portion where the sensing unit 34 is provided and a portion where the sensing unit 34 is not provided. １ The ratio of the area of ​​the portion where the sensing section 34 is provided to the area of ​​the entire surface is defined as the area occupancy rate of the sensing section 34.

[0062] In this embodiment, the area occupancy rate of the sensing section 34 is 17% or more. The area occupancy rate of the sensing section 34 is preferably 30% or more and 88% or less. The reason for adopting such a range of the area occupancy rate will be described later.

[0063] The sensing section 34 is a part that comes into contact with a target object (target cells in this embodiment) whose impedance is to be measured during use (in other words, during testing).

[0064] The sensing portion 34 is made of, for example, silver and is configured by a plating layer formed on the upper surface of the first lid layer 333 of the land base 33 by electroless plating.

[0065] The sensing unit 34 has a silver chloride layer formed on its surface (i.e., upper surface) by silver chloride treatment. Such silver chloride treatment can increase the surface area of ​​the sensing unit 34. As a result, the impedance of the sensing unit 34 is lowered. The sensing unit may be made of gold. In this case, the sensing unit has a platinum black layer formed on its surface (i.e., upper surface) by platinum black treatment.

[0066] Such a sensing section 34 has a desired thickness. If the thickness of the sensing section 34 is small, there is a possibility that a diffusion reaction will occur between the copper constituting the land base 33 and the silver constituting the sensing section 34 when the substrate 3 is exposed to a high-temperature environment for a long period of time. If such a diffusion reaction occurs, copper will be deposited on the surface of the sensing section 34, and the impedance of the sensing section 34 may increase.

[0067] On the other hand, if the thickness of the sensing unit 34 is increased in order to suppress the above-mentioned diffusion reaction, the silver particles that make up the sensing unit 34 may become larger. If the silver particles that make up the sensing unit 34 become larger, it becomes impossible to increase the surface area of ​​the sensing unit 34 even if a silver chloride treatment is applied to the surface of the sensing unit 34. As a result, the impedance of the sensing unit 34 may become larger.

[0068] From this viewpoint, the thickness of the sensing unit 34 is preferably 0.1 μm or more and 0.8 μm or less. The thickness of the sensing unit 34 is more preferably 0.1 μm or more and 0.6 μm or less. However, the thickness of the sensing unit may be determined appropriately depending on the specifications of the substrate 3.

[0069] (Terminal Portion) The terminal portion 35 is provided at the lower end of the base body 331 of the land base 33. During use (in other words, during testing), the terminal portion 35 comes into contact with device-side terminal portions 221, 222 (see FIG. 4 ) of the testing device 2 that measures the impedance of the target object (in this embodiment, the target cell).

[0070] The terminal portion 35 is provided on the second surface 312 of the substrate body 31. Specifically, the terminal portion 35 is provided on the lower end surface of the land base 33. More specifically, the terminal portion 35 is provided on the lower surface of the second lid layer 334 of the land base 33.

[0071] The shape of the terminal portion 35 in a plan view is the same as the shape of the second lid layer 334 in a plan view. Specifically, the outer shape of the terminal portion 35 is a shape that fits the inner circumferential surface of the through hole 313 (circular or elliptical in this embodiment).

[0072] The terminal portion 35 is made of, for example, silver, and is formed by a plating layer formed on the lower surface of the second cover layer 334 of the land base 33 by electroless plating.

[0073] In this embodiment, the terminal portion 35 does not have a silver chloride layer on its surface (i.e., its lower surface). However, the terminal portion 35 may have a silver chloride layer formed by silver chloride treatment on its surface (i.e., its lower surface). The terminal portion may be made of gold. In this case, the terminal portion has a platinum black layer formed by platinum black treatment on its surface (i.e., its upper surface).

[0074] Such terminal portion 35 has a desired thickness. If the thickness of terminal portion 35 is small, a diffusion reaction may occur between the copper constituting land base 33 and the silver constituting terminal portion 35 when exposed to a high-temperature environment for a long period of time. If such a diffusion reaction occurs, copper may be deposited on the surface of terminal portion 35, which may increase the impedance of terminal portion 35.

[0075] On the other hand, if the thickness of the terminal portion 35 is increased in order to suppress the above-mentioned diffusion reaction, the silver particles constituting the terminal portion 35 may become larger. If the silver particles constituting the terminal portion 35 become larger, it becomes impossible to increase the surface area of ​​the terminal portion 35. As a result, the impedance of the terminal portion 35 may become larger.

[0076] From this viewpoint, the thickness of the terminal portion 35 is preferably 0.1 μm or more and 0.8 μm or less, and more preferably 0.1 μm or more and 0.6 μm or less.

[0077] (Dummy Pad Section) Next, the configuration of the dummy pad section 36 will be described with reference to Figures 2 and 5. The dummy pad section 36 has a rectangular frame shape in the plan view shown in Figure 2. Such a dummy pad section 36 is a section that is not electrically connected to the inspection device 2 during use (in other words, during inspection). In other words, the dummy pad section 36 is a land that is not used during inspection.

[0078] The dummy pad portion 36 is continuous around the entire periphery. In other words, the dummy pad portion 36 is a continuous rectangular frame. The dummy pad portion may have a discontinuous portion in part (see FIG. 6D ). In other words, the dummy pad portion may be a discontinuous rectangular frame.

[0079] The dummy pad portion 36 is provided on the first surface 311 (in other words, the upper surface) of the substrate body 31. Specifically, the dummy pad portion 36 is provided in the second region R ２ It is set up in.

[0080] Second area R ２ represents a first region R on the first surface 311 where the sensing unit 34 is provided. １ (See FIG. 2). ２ In FIG. 2, the dashed two-dot line α １ and the dashed double-dashed line α ２ The area is enclosed by and.

[0081] In this embodiment, the dummy pad portion 36 is formed in the second region R ２ 6D, 6E, 6F, and 6G, the dummy pad portion is provided in the second region R ２ In this case, the predetermined area including at least the four corners may be provided in the predetermined area including at least the four corners. For example, the predetermined area including at least the four corners may be the four areas R surrounded by the two-dot chain lines in FIG. 6D. ２１ It may be.

[0082] 5, the dummy pad portions 36 are provided only on the first surface 311 of the substrate main body 31. In other words, the dummy pad portions 36 are not provided on the second surface 312 of the substrate main body 31.

[0083] The dummy pad portion 36 has a predetermined width W １ In this embodiment, the width W of the dummy pad portion 36 is １ The width W of the dummy pad portion 36 is 0.10 mm or more. １ It is preferable that the width W is 0.25 mm or more. １ The reasons for adopting this will be explained later.

[0084] In this embodiment, the width W of the dummy pad portion 36 １ is constant over the entire periphery of the dummy pad portion 36. However, the width dimension W of the dummy pad portion 36 １ may be partially different.

[0085] The distance between the sensing section 34 and the dummy pad section 36 is D １ (See Figure 2) Distance D １ As shown in FIG. 2, the first region R １ 1. The distance between the sensing portion 34 and the dummy pad portion 36 of the land portion 32 located at the outermost edge of the wiring pattern.

[0086] In this embodiment, the distance D １ is 0.025 mm or more, preferably 0.1 mm or more, and more preferably 0.25 mm or more and 1.00 mm or less. １ The reasons for adopting this will be explained later.

[0087] 5, the dummy pad portion 36 has a base portion 361 and a plating layer 362. The base portion 361 has a rectangular frame shape and is formed in the second region R ２ Specifically, the base 361 is provided on the upper surface of the third metal layer 316 provided on the first surface 311 of the substrate body 31 .

[0088] The base 361 includes a first base layer 361a and a first lid layer 361b.

[0089] The first base layer 361a is provided on the first surface 311 of the substrate body 31. Specifically, the first base layer 361a is provided on the upper surface of the third metal layer 316. The first base layer 361a is made of copper.

[0090] The shape of the first base layer 361a in a plan view is the same as the shape of the third metal layer 316 in a plan view. The first base layer 361a is made of copper. The first base layer 361a is formed on the substrate main body 31 by plating.

[0091] The first lid layer 361b is provided on the first surface 311 of the substrate body 31. Specifically, the first lid layer 361b is provided on the upper surface of the first base layer 361a. The first lid layer 361b is made of copper.

[0092] The shape of the first lid layer 361b in a plan view is the same as the shapes of the third metal layer 316 and the first base layer 361a in a plan view. The first lid layer 361b is formed on the upper surface of the first base layer 361a by plating.

[0093] The plating layer 362 is provided on the surface (i.e., the upper surface) of the base 361 (specifically, the first lid layer 361b). The plating layer 362 is made of silver. The plating layer 362 is formed by electroless plating on the surface (i.e., the upper surface) of the base 361.

[0094] The plating layer 362 has a silver chloride layer formed on the surface (i.e., the upper surface) by silver chloride treatment. The plating layer may be gold. In this case, the plating layer has a platinum black layer formed on the surface (i.e., the upper surface) by platinum black treatment. The silver chloride layer may be omitted.

[0095] The dummy pad portion 36 having the above-described configuration contributes to reducing the variation in the thickness dimension of the sensing portion 34 between the lands 32 when forming the sensing portion 34 of the substrate 3. The action and effect of such a dummy pad portion 36 will be described later.

[0096] When in use (in other words, during inspection), the substrate 3 having the above configuration is placed on the mounting portion 223 of the substrate support portion 22 of the inspection device 2 (see FIG. 1A ). In this state, the device-side terminal portions 221 and 222 of the inspection device 2 each come into contact with the terminal portion 35 of the land portion 32 on the substrate 3, as shown in FIGS. 1B and 4 .

[0097] That is, the device-side terminals 221, 222 of the inspection device 2 are electrically connected to the land 32 of the substrate 3. In the present embodiment, the land 32 electrically connected to the device-side terminal 221 of the inspection device 2 and the land 32 electrically connected to the device-side terminal 222 of the inspection device 2 are arranged adjacent to each other.

[0098] Hereinafter, for convenience of explanation, the land portion 32 electrically connected to the device-side terminal portion 221 of the inspection device 2 will be referred to as the land portion 32a (see FIG. 4 ). On the other hand, the land portion 32 electrically connected to the device-side terminal portion 222 of the inspection device 2 will be referred to as the land portion 32b (see FIG. 4 ).

[0099] Then, the user places the target cell 5 (see FIGS. 1B and 4) on the first surface 311 (i.e., the upper surface) of the substrate 3. Specifically, the user places the target cell 5 above the land portion 32a and the land portion 32b so as to straddle the land portion 32a and the land portion 32b.

[0100] Since the target cell 5 is conductive, the land portion 32 a and the land portion 32 b are electrically connected to each other. As a result, a current flows between the device-side terminal portion 221 and the device-side terminal portion 222 of the testing device 2 via the land portion 32 a, the target cell 5, and the land portion 32 b.

[0101] The testing device 2 measures the impedance of the target cell 5 based on the current flowing between the device-side terminal 221 and the device-side terminal 222. The testing device 2 then identifies the type of the target cell 5 based on the measured impedance of the target cell 5. Specifically, it identifies whether the target cell 5 is a cancer cell.

[0102] After the inspection, the substrate 3 is discarded after a single use. In other words, the substrate 3 is a disposable substrate. However, if many unused lands 32 remain, the substrate 3 may be used multiple times.

[0103] The use of the substrate 3 is not limited to the above-mentioned use. The substrate 3 can be applied to various devices that measure the characteristics of an object. Furthermore, the configuration of the substrate is not limited to the above-mentioned substrate 3. Modified examples of the substrate will be described below. Figures 6A to 6G are diagrams showing modified examples 1 to 7 of the substrate.

[0104] 6A is a plan view of a substrate 3A according to Modification 1. The substrate 3A has a land portion 32A whose configuration is different from that of the land portion 32 in the above-described embodiment.

[0105] Specifically, in the case of the land portion 32A, the shape of the sensing portion 34A in a plan view is quadrilateral (square or rectangle). For the land base of the land portion 32A, the description of the land base 33 in Fig. 4 may be referred to as appropriate. The rest of the configuration of the substrate 3A is the same as the configuration of the substrate 3 in the embodiment.

[0106] 6B is a plan view of a substrate 3B according to substrate modification 2. In substrate 3B, the configuration of land portions 32B is different from that of land portions 32 in the above-described embodiment.

[0107] Specifically, in the case of the land portion 32B, the shape of the sensing portion 34B in a plan view is circular. For the land base of the land portion 32B, the description of the land base 33 in Fig. 4 may be referred to as appropriate. The rest of the configuration of the substrate 3B is the same as the configuration of the substrate 3 in the embodiment.

[0108] 6C is a plan view of a substrate 3C according to substrate variation 3. The configuration of the lands 32C1 to 32C3 of the substrate 3C is different from that of the lands 32 in the above-described embodiment. Specifically, the substrate 3C has three types of lands 32C1 to 32C3.

[0109] In the case of the land portion 32C1, the shape of the sensing portion 34C1 in a plan view is quadrilateral (square or rectangle). For the land base of the land portion 32C1, the description of the land base 33 in FIG. 4 may be referred to as appropriate.

[0110] In the case of the land portion 32C2, the shape of the sensing portion 34C2 in a plan view is circular. For the land base of the land portion 32C2, the description of the land base 33 in FIG.

[0111] In the case of the land portion 32C3, the shape of the sensing portion 34C3 in a plan view is triangular. For the land base of the land portion 32C3, the description of the land base 33 in FIG.

[0112] The arrangement order of the lands 32C1 to 32C3 may be regular or irregular. In this way, the substrate may have multiple types of lands. The rest of the configuration of the substrate 3C is the same as the configuration of the substrate 3 in the embodiment.

[0113] 6D is a plan view of a substrate 3D according to substrate modification 4. In the substrate 3D, the configurations of the land portions 32D and the dummy pad portions 36D are different from the land portions 32 and the dummy pad portions 36 in the above-described embodiment.

[0114] Specifically, in the case of the land portion 32D, the shape of the sensing portion 34D in a plan view is quadrilateral (square or rectangle). For the land base of the land portion 32D, the description of the land base 33 in FIG. 4 may be referred to as appropriate.

[0115] The dummy pad portion 36D has a discontinuous rectangular frame shape. In other words, the dummy pad portion 36D has discontinuous portions. In the present embodiment, the dummy pad portion 36D is also formed in the second region R２ The projections are provided in a predetermined area including at least the four corners.

[0116] The predetermined area including at least four corners is, for example, the four areas R surrounded by the two-dot chain lines in FIG. ２１ In this way, the shape of the dummy pad portion 36D may be various shapes. The rest of the configuration of the substrate 3D is the same as the configuration of the substrate 3 in the embodiment.

[0117] 6E is a plan view of a substrate 3E according to substrate modification 5. The substrate 3E has a land portion 32E and a dummy pad portion 36E whose configurations differ from those of the land portion 32 and the dummy pad portion 36 in the above-described embodiment.

[0118] Specifically, in the case of the land portion 32E, the shape of the sensing portion 34E in a plan view is quadrilateral (square or rectangle). For the land base of the land portion 32E, the description of the land base 33 in FIG. 4 may be referred to as appropriate.

[0119] The dummy pad portion 36E is formed in the second region R ２ Specifically, the dummy pad portion 36E is provided in a part of the second region R ２ The markers are provided only in a predetermined area including the four corners.

[0120] The dummy pad portions 36E are each formed in the second region R ２ The dummy pad portion 36E in this modification may be regarded as a dummy pad portion in the shape of a discontinuous rectangular frame. The rest of the configuration of the substrate 3E is the same as that of the substrate 3 in the embodiment.

[0121] 6F is a plan view of a substrate 3F according to substrate modification 6. The substrate 3F has a land portion 32F and a dummy pad portion 36F that are different from the land portion 32 and the dummy pad portion 36 in the above-described embodiment in their configurations.

[0122] Specifically, in the case of the land portion 32F, the shape of the sensing portion 34F in a plan view is quadrilateral (square or rectangle). For the land base of the land portion 32F, the description of the land base 33 in FIG. 4 may be referred to as appropriate.

[0123] The dummy pad portion 36F is formed in the second region R ２ Specifically, the dummy pad portion 36F is provided in a part of the second region R ２ The markers are provided only in a predetermined area including the four corners.

[0124] The dummy pad portions 36F are each formed in the second region R ２ The dummy pad portions 36F are curved so as to bend along the four corners of the substrate 3. In this way, the shape of the dummy pad portions 36F may be various. The rest of the configuration of the substrate 3F is the same as the configuration of the substrate 3 in the embodiment.

[0125] 6G is a plan view of a substrate 3G according to substrate modification 7. The substrate 3G has a dummy pad portion 36G whose configuration differs from that of the dummy pad portion 36 in the above-described embodiment.

[0126] The substrate 3G also has horizontal side symbols 37a and vertical side symbols 37b around the dummy pad portions 36. The horizontal side symbols 37a and vertical side symbols 37b are symbols that allow the user to specify an area on the substrate 3 to be used during inspection.

[0127] In other words, the horizontal symbol 37a and the vertical symbol 37b are symbols for specifying the sensing unit 34 to be used during testing. In this example, the horizontal direction corresponds to the left-right direction of the board 3G, and the vertical direction corresponds to the front-rear direction of the board 3G.

[0128] For example, when using the sensing unit 34 included in area A-1, the user inputs the symbol "A" in the horizontal symbol 37a and the symbol "1" in the vertical symbol 37b into the inspection device 2. The inspection device 2 measures the impedance of the target cell using the sensing unit 34 included in area A-1 specified by the user.

[0129] In this modification, the right and left sides of the dummy pad section 36G are separated by the vertical symbols 37b, allowing the user to intuitively recognize the vertical regions of the substrate 3G by looking at the separation positions of the dummy pad section 36G.

[0130] The dummy pad portion 36G in this modified example may be regarded as a dummy pad portion having a discontinuous rectangular frame shape. The rest of the configuration of the substrate 3G is the same as that of the substrate 3 in the embodiment.

[0131] Examples of the substrate 3 according to the present invention and tests conducted to confirm the action and effect of the substrate 3 according to this embodiment will be described below. Note that the present invention is not limited to these examples and tests.

[0132] The inventors of the present invention conducted tests to confirm the effects and advantages obtained by providing the dummy pad portions 36 on the substrate 3 .

[0133] (1) Manufacturing Method of Test Specimens First, the inventors prepared a plurality of test specimens. The substrate of the test specimens was a copper-clad laminate for printed wiring boards. Specifically, the substrate (not shown) was L-6705C1 manufactured by Nikkan Industries Co., Ltd. The thickness of the substrate was 1.6 mm. The thickness of the copper foil provided on the surface of the substrate was 18 μm.

[0134] This base material was cut to obtain a rectangular work-size substrate (not shown). The width of the work-size substrate was 40 cm. The length of the work-size substrate was 25 cm. On the surface (specifically, the first surface) of the work-size substrate thus obtained, a pattern corresponding to the land base 33 of the land portion 32 and the base 361 of the dummy pad portion 36 on the substrate 3 was formed.

[0135] This test was conducted to examine the effect of providing the dummy pad portion 36 on the substrate 3 on variations in the thickness dimension of the sensing portion 34. For this reason, the test specimen does not include the components corresponding to the through-hole 313 and terminal portion 35 of the substrate main body 31 in the above-described embodiment.

[0136] (1.1) Pattern Formation A method for forming the land bases 33 of the lands 32 and the bases 361 of the dummy pads 36 on a work-size substrate will now be described. First, a first intermediate work-size substrate (not shown) was prepared by performing soft etching on the work-size substrate as pre-polishing. Then, a dry film was attached to the surface of the first intermediate work-size substrate to prepare a second intermediate work-size substrate (not shown).

[0137] Next, a circuit print film was placed on the surface of the second intermediate work size substrate, and the surface was exposed to UV light to harden only the patterned portion of the dry film, thereby producing a third intermediate work size substrate (not shown). The unhardened portion of the dry film was then removed with a developer.

[0138] Next, the third intermediate work size substrate was subjected to an etching process to remove unnecessary copper from the third intermediate work size substrate, thereby producing a fourth intermediate work size substrate (not shown). A copper pattern was formed on the surface of the fourth intermediate work size substrate.

[0139] Next, the fourth intermediate work-size substrate was immersed in a sodium hydroxide solution to peel off the dry film from the fourth intermediate work-size substrate, exposing the copper pattern. After that, a 15 μm thick copper plating was applied as a base to obtain a fifth intermediate work-size substrate 6 (see FIG. 7 ). This copper plating corresponds to the first lid layer 333 in the land portion 32 described above. This copper plating also corresponds to the first lid layer 361b in the dummy pad portion 36 described above.

[0140] The fifth intermediate work-size substrate 6 has 15 types of pattern portions 61 (see FIG. 7) on its surface. The pattern portions 61 may be considered to be patterns corresponding to the land bases 33 (see FIGS. 4 and 5) of the multiple lands 32 and the bases 361 of the dummy pads 36 on the substrate 3. The horizontal and vertical spacing between the pattern portions 61 is set to 5 cm or more.

[0141] (1.2) Plating Process By performing plating process on the pattern portion 61 formed on the surface of the fifth intermediate work-size substrate 6 obtained as described above, a plating layer corresponding to the sensing portions 34 (see Figure 4) of the multiple land portions 32 and the plating layer 362 of the dummy pad portions 36 was formed on the surface (specifically, the upper surface) of the pattern portion 61.

[0142] In this example, a silver plating solution, AG-100B manufactured by MacDermid Performance Solutions Japan, was used as the plating solution.

[0143] The target final thickness of the plating layer was set to 0.5 μm. Note that the target final thickness of the plating layer is the target final thickness of the sensing portion 34 of the land portion 32 formed by plating. The thickness of the sensing portion 34 that is actually formed may deviate from 0.5 μm depending on various conditions of the plating process.

[0144] A pre-plating treatment was performed on the fifth intermediate work-size substrate 6. The temperature of the silver plating solution in the pre-plating treatment was 52° C. The pre-plating treatment time was 30 seconds.

[0145] Next, the pre-plated fifth intermediate work-size substrate 6 was subjected to a main plating process. The temperature of the silver plating solution in the main plating process was 52° C. The main plating process lasted for 2 minutes and 24 seconds.

[0146] The worker continued to shake the fifth intermediate work-size substrate 6 during the main plating process. After the main plating process, the fifth intermediate work-size substrate 6 was subjected to cleaning processes (cleaning with tap water and cleaning with pure water), drying, and lamination processes to obtain a final work-size substrate (not shown). In the lamination process, a protective film was laminated over the entire surface of the fifth intermediate work-size substrate 6.

[0147] (1.3) Cutting Process The final work size substrate obtained as described above was cut into test pieces of a predetermined size. The horizontal dimension of the test pieces was 70 mm. The vertical dimension of the test pieces was 70 mm. After the cutting process, the protective film was peeled off from the surface of the test pieces.

[0148] (2) Regarding the Test Conventionally, a substrate (hereinafter referred to as a "substrate of a conventional structure") has been known in which the dummy pad portion 36, the through-hole 313, the terminal portion 35, etc. are omitted from the substrate 3 shown in Fig. 2. Such a substrate of a conventional structure differs from the configuration of the substrate 3 described above in that it does not include the dummy pad portion 36, the through-hole 313, and the terminal portion 35, but is manufactured by a manufacturing method substantially similar to the manufacturing method described above.

[0149] The inventors have found that in the case of a substrate having a conventional structure, there is a large variation in the thickness dimension of the sensing portion 34 (see FIG. 2 ). Specifically, the inventors have found that in the case of a substrate having a conventional structure, the thickness dimension of the sensing portion 34 at the corners is larger than the thickness dimension of the sensing portion 34 at the center.

[0150] The central sensing portion 34 is indicated by the dashed two-dot line R in FIG. ３ The four sensing units 34 are provided in the area surrounded by . The corner sensing units 34 are the sensing units 34 at the four corners of the sensing units 34 in FIG.

[0151] The inventors then considered that one of the causes of the variation in the thickness dimension of the sensing portion 34 is that, in the above-mentioned plating process, the ion concentration (e.g., silver ion concentration) of the plating solution (e.g., silver plating solution) that forms the sensing portion 34 in the corners is higher than the ion concentration (e.g., silver ion concentration) of the plating solution (e.g., silver plating solution) that forms the sensing portion 34 in the center.

[0152] Therefore, the inventor came up with the idea for the substrate 3 according to this embodiment, in which a dummy pad portion 36 is provided around the corner sensing portion 34 in order to lower the ion concentration of the plating solution that forms the corner sensing portion 34 during the above-mentioned plating process.

[0153] The inventors then conducted tests to confirm the actions and effects of the substrate 3 according to this embodiment.

[0154] (First Test) First, the inventors conducted a test (hereinafter referred to as the first test) to confirm the effect of the presence or absence of a dummy pad portion on the variation in the thickness dimension of the sensing portion 34. The first test was also a test to confirm the effect of the area occupancy rate of the sensing portion 34 on the variation in the thickness dimension of the sensing portion 34. For the first test, the inventors created test pieces S1 to S14 using the manufacturing method described above.

[0155] Test specimens S1 to S4 are substrates that do not have dummy pad portions. Such test specimens S1 to S4 correspond to reference examples. On the other hand, test specimens S5 to S14 are substrates that have dummy pad portions. Such test specimens S5 to S14 correspond to working examples. The configuration of test specimens S1 to S14 may also be explained using the configuration of substrate 3 shown in FIG. 2.

[0156] The conditions for test pieces S1 to S14 are shown in Table 1 below.

[0157]

[0158] The area occupancy in Table 1 is the area occupied by the first region R １ (see FIG. 2) is the ratio of the sensing unit 34 to the total.

[0159] The width dimension W in Table 1 above １ is the width of the dummy pad portion 36 (see FIG. 2). １ is the distance D between the sensing section 34 and the dummy pad section 36 １ (See Figure 2) Distance D １ As shown in FIG. 2, the first region R １ 1. The distance between the sensing portion 34 and the dummy pad portion 36 of the land portion 32 located at the outermost edge of the wiring pattern.

[0160] In the first test, the inventor measured the thickness of the sensing portion 34 of the test pieces S1 to S14. １ and the thickness dimension T of the corner sensing portion 34. ２The ratio R was calculated using the following formula (1).

[0161] The central sensing portion 34 is indicated by the dashed two-dot line R in FIG. ３ The four sensing units 34 are provided in the area surrounded by the arrows. The thickness dimension T １ was taken as the average value of the thickness dimensions of these four sensing parts 34.

[0162] The corner sensing portions 34 are the sensing portions 34 at the four corners of the sensing portions 34 in FIG. ２ was taken as the average value of the thickness dimensions of these four sensing parts 34.

[0163]

[0164] Fig. 8 is a diagram showing the ratios R of the test specimens S1 to S14 calculated based on the measurement results. In Fig. 8, the horizontal axis represents the area occupancy rate. Also, in Fig. 8, the vertical axis represents the ratio R. Fig. 8 shows the ratios R of the test specimens S1 to S14. The reference symbols S1 to S14 shown in Fig. 8 indicate the ratios R of the test specimens S1 to S14.

[0165] In Fig. 8, an approximation line L1 indicates an approximation line obtained by approximating the ratios R of the test specimens S1 to S4, which are reference examples, using a quadratic curve. Also, in Fig. 8, an approximation line L2 indicates an approximation line obtained by approximating the ratios R of the test specimens S5 to S14, which are examples, using a quadratic curve.

[0166] As is clear from the approximation lines L1 and L2 shown in Figure 8, the approximation line L2 showing the ratio R of the test specimens S5 to S14, which are examples, is located entirely above the approximation line R1 showing the ratio R of the test specimens S1 to S4, which are reference examples.

[0167] This is because the thickness dimension T of the central sensing portion 34 of the test pieces S5 to S14 equipped with the dummy pad portion 36 is smaller than that of the test pieces S1 to S4 not equipped with the dummy pad portion 36. １ and the thickness dimension T of the corner sensing portion 34. ２ This means that the difference is small.

[0168] In other words, the relationship between the approximation lines L1 and L2 shown in Figure 8 means that the variation in the thickness dimension of the sensing portion 34 for test pieces S5 to S14 is smaller than the variation in the thickness dimension of the sensing portion 34 for test pieces S1 to S4.

[0169] From the above results, the inventors have confirmed that the provision of the dummy pad portion 36 reduces the variation in the thickness dimension of the sensing portion 34 .

[0170] 8, the approximation line L2 is positioned generally above the approximation line L1. As a result, the inventors have confirmed that the inclusion of a dummy pad portion reduces the variation in the thickness dimension of the sensing portion 34, regardless of the area occupancy rate.

[0171] Fig. 9 is a diagram showing the difference between the approximation line L2 and the approximation line L1 in Fig. 8. It can be seen from Fig. 9 that when the area occupancy is 17% or more, the difference between the approximation line L2 and the approximation line L1 is 3% or more. Therefore, it is preferable that the area occupancy of the sensing unit 34 be 17% or more.

[0172] 9 also shows that when the area occupancy is 30% or more and 88% or less, the difference between the approximation line L2 and the approximation line L1 is 6% or more. Therefore, it is more preferable that the area occupancy of the sensing section 34 is 30% or more and 88% or less. The peak of the difference between the approximation line L2 and the approximation line L1 was 8.8%. In this case, the area occupancy of the sensing section 34 was 59%.

[0173] (Second Test) Next, the inventor measured the distance D between the dummy pad portion and the sensing portion. １ A test (hereinafter referred to as the second test) was conducted to confirm the influence of the thickness of the sensing unit 34 (see FIG. 2) on the variation in the thickness dimension of the sensing unit 34. For the second test, the inventors produced test pieces S15 to S22 by a method similar to the manufacturing method described above.

[0174] The conditions for test pieces S15 to S22 are shown in Table 2 below.

[0175]

[0176] Then, the thickness dimension of the sensing portion 34 of the test pieces S15 to S22 was measured, and the thickness dimension T １ and the thickness dimension T of the corner sensing portion 34. ２ The ratio R was calculated using the above formula (1), similarly to the first test.

[0177] 10 is a diagram showing the ratio R of the test pieces S15 to S18 calculated based on the measurement results. In FIG. 10, the horizontal axis represents the distance D １ In Fig. 10, the vertical axis represents the ratio R. In Fig. 10, the ratios R of the test specimens S15 to S18 are shown. The reference symbols S15 to S18 shown in Fig. 10 represent the ratios R of the test specimens S15 to S18. In Fig. 10, the approximation line L3 represents an approximation line obtained by approximating the ratios R of the test specimens S15 to S18 by a straight line.

[0178] 11 is a diagram showing the ratio R of the test pieces S19 to S22 calculated based on the measurement results. In FIG. 11, the horizontal axis represents the distance D １ In Fig. 11, the vertical axis represents the ratio R. In Fig. 11, the ratios R of the test specimens S19 to S22 are shown. The reference symbols S19 to S22 shown in Fig. 11 represent the ratios R of the test specimens S19 to S22. In Fig. 11, the approximation line L4 represents an approximation line obtained by approximating the ratios R of the test specimens S19 to S22 by a straight line.

[0179] As shown in FIGS. 10 and 11, the ratio R of the test pieces S15 to S18 and the ratio R of the test pieces S19 to S22 are １ 10 and 11, the ratio R of the test pieces S15 to S18 and the ratio R of the test pieces S19 to S22 are 0.8 or more when the distance D １ The larger it is, the smaller it tends to be.

[0180] In other words, the distance D １ The larger the ratio R is, the larger the variation in the thickness dimension of the sensing section 34 tends to be. If the ratio R is 0.8 or more, the variation in the thickness dimension of the sensing section 34 is sufficiently small. １The distance D is preferably 0.25 mm or more and 1.00 mm or less. １ Although the lower limit of the distance D is not confirmed in this experiment, it is preferable that the distance D is as small as possible. １ As the range of １ The lower limit of the thickness is preferably 0.025 mm or more, and more preferably 0.1 mm or more.

[0181] (Third Test) Next, the inventors measured the width W of the dummy pad portion. １ A test (hereinafter referred to as the third test) was conducted to examine the influence of the thickness of the sensing unit 34 (see FIG. 2) on the variation in the thickness dimension of the sensing unit 34. The inventors produced test pieces S23 to S32 using a method similar to the manufacturing method described above.

[0182] The conditions for test pieces S23 to S32 are shown in Table 3 below.

[0183]

[0184] Then, the thickness dimension of the sensing portion 34 of the test pieces S23 to S32 is measured, and the thickness dimension T １ and the thickness dimension T of the corner sensing portion 34. ２ The ratio R was calculated using the above formula (1), similarly to the first test.

[0185] 12 is a diagram showing the measurement results of the ratio R of the test pieces S23 to S27 calculated based on the measurement results. In FIG. 12, the horizontal axis represents the width dimension W １ In addition, in Fig. 12, the vertical axis represents the ratio R. Fig. 12 shows the ratio R for each of the test specimens S23 to S27. The reference symbols S23 to S27 shown in Fig. 12 represent the ratio R for the test specimens S23 to S27. Note that the value of the ratio R for the width dimension W1 = 0 was the value for the test specimen S2 without a dummy pad.

[0186] In Fig. 12, the approximation line L5 indicates the approximation line obtained by approximating the ratio R of the test pieces S23 to S27 by a quadratic curve. １ The measurement results of the ratio R for the test specimen with zero width dimension W are also shown. １The test piece with a value of zero is a test piece that does not have a dummy pad portion.

[0187] 13 is a diagram showing the measurement results of the ratio R of the test pieces S28 to S32 calculated based on the measurement results. In FIG. 13, the horizontal axis represents the width dimension W １ In FIG. 13, the vertical axis indicates the ratio R. In FIG. 13, the ratio R of each of the test pieces S28 to S32 is shown. The reference symbols S28 to S32 shown in FIG. 13 indicate the ratio R of the test pieces S28 to S32. The width dimension W １ The value of the ratio R = 0 was used as the value of the test piece S3 without a dummy pad.

[0188] In Fig. 13, the approximation line L6 indicates the approximation line obtained by approximating the ratio R of the test pieces S28 to S32 by a quadratic curve. １ The measurement results of the ratio R for the test specimen with zero width dimension W are also shown. １ The test piece with a value of zero is a test piece that does not have a dummy pad portion.

[0189] As shown in FIGS. 12 and 13, the ratio R of the test pieces S23 to S27 and the ratio R of the test pieces S28 to S32 are １ 12 and 13, the ratio R of the test pieces S23 to S27 and the ratio R of the test pieces S28 to S32 are 0.8 or more in the range of 0.10 mm or more. １ It tends to become larger as

[0190] In other words, the width dimension W １ The larger the ratio R is, the smaller the variation in the thickness dimension of the sensing section 34 tends to be. If the ratio R is 0.8 or more, the variation in the thickness dimension of the sensing section 34 is sufficiently small. １ It is preferable that the width W is 0.10 mm or more. １ It is more preferable that the width W is 0.25 mm or more. １ The upper limit of the width dimension W may be set appropriately depending on the size of the substrate 3. １ The upper limit may be 1.25 mm.

[0191] (Operations and Effects of the Present Embodiment) As described above, in the case of the substrate 3 according to the present embodiment, the substrate 3 includes the dummy pad portion 36. This makes it possible to reduce the variation in the thickness dimension of the sensing portion 34. The reason for this is as described above. Other operations and effects obtained from the configuration of the substrate 3 according to the present embodiment are as described above.

[0192] The disclosures of the specification, drawings, and abstract contained in Japanese Patent Application No. 2023-212410, filed December 15, 2023, are incorporated herein by reference in their entirety.

[0193] The present invention can be suitably applied to various inspection devices that measure characteristic values ​​of objects placed on a substrate.

[0194] 1 Inspection system 2 Inspection device 21 Device body 211 Housing 22 Substrate support portion 22R Inspection area 221, 222 Device side terminal portion 223 Placement portion 224 Positioning member 225 Cover 23 Display portion 3, 3A, 3B, 3C, 3D, 3E, 3F, 3G Substrate 31 Substrate body 31a Through hole 311 First surface 312 Second surface 313 Through hole 314 First metal layer 315 Second metal layer 316 Third metal layer 32, 32a, 32b, 32A, 32B, 32C1, 32C2, 32C3 Land portion 32D, 32E, 32F Land portion 33 Land base portion 331 Base body 331a First base layer 331b Second base layer 331c Connection portion 332 Resin portion 333 First lid layer 334 Second lid layer 34, 34A, 34B, 34C1, 34C2, 34C3, 34D, 34E, 34F Sensing portion 35 Terminal portion 36, 36D, 36E, 36F, 36G Dummy pad portion 361 Base portion 361a First base layer 361b First lid layer 362 Plating layer 37a Horizontal side symbol 37b Vertical side symbol 5 Target cell 6 Fifth intermediate work size substrate 61 Pattern portion R １ First area R ２ second area

Claims

1. A substrate comprising: a substrate body; a plurality of land portions supported by the substrate body and having a sensing portion and a terminal portion; and a dummy pad portion provided in a second region of the substrate body surrounding a first region in which the sensing portion is provided.

2. The substrate as described in claim 1, wherein the sensing portion is provided on a first surface of the substrate body, the terminal portion is provided on a second surface of the substrate body, and the land portion is disposed in a through hole of the substrate body, and further includes a connection portion that connects the sensing portion and the terminal portion.

3. The substrate according to claim 2, wherein the dummy pad portion is provided only on the first surface.

4. The substrate according to claim 2, wherein the sensing portion is constituted by a plating layer formed on the surface of the connection portion by electroless plating.

5. The board according to claim 1, wherein the sensing portion, when in use, contacts an object whose impedance is to be measured, and the terminal portion, when in use, contacts an apparatus-side terminal portion of a measuring device that measures the impedance of the object.

6. The substrate as described in claim 1, wherein the first region is a rectangular region, the second region is a frame-shaped region surrounding the first region, and the dummy pad portion is provided in a portion of the second region that includes at least four corners.

7. The substrate according to claim 6, wherein the dummy pad portion is in the shape of a rectangular frame that fits along the second region.

8. The substrate according to claim 7, wherein the dummy pad portion is in the form of a continuous rectangular frame or a discontinuous rectangular frame.

9. The substrate according to claim 1, wherein an area occupancy rate, which is a ratio of the area occupied by the sensing portion in the first region, is 17% or more and 100% or less.

10. The substrate according to claim 9, wherein the area occupancy rate is 30% or more and 88% or less.

11. The substrate according to claim 1, wherein the distance between the sensing portion provided on the outermost edge side in the first region and the dummy pad portion is 0.1 mm or more and 1.00 mm or less.

12. The substrate according to claim 1, wherein the width of the dummy pad portion is 0.1 mm or more.

13. The substrate according to claim 12, wherein the width of the dummy pad portion is 0.25 mm or more.

14. The substrate according to claim 1, wherein the substrate body has symbols around the dummy pad portion for designating the sensing portion to be used during inspection, and the dummy pad portion is divided in accordance with the symbols.

15. An inspection system comprising: a substrate according to claim 1; and an inspection device having a substrate support portion for supporting the substrate, the inspection device measuring the impedance of a target cell placed on the sensing portion of the substrate.

Images