Projection lens and laser projection device

Abstract

A projection lens (003), comprising a lens mount (100), a lens assembly (200), and a mirror (300), wherein the mirror (300) is arranged on the lens mount (100), the material of the mirror (300) comprises an optical material and a heat dissipation material (320), and a mirror body (310) has a reflective surface (311), the reflective surface (311) of the mirror body (310) being arranged opposite an exit end of the lens assembly (200) and facing the lens assembly (200), and the reflective surface (311) being configured to reflect an imaging light beam emitted from the exit end onto a projection screen (020). The mirror (300) can dissipate heat by means of the heat dissipation material (320), thereby alleviating the problem of thermal deformation of the mirror (300). Further provided is a laser projection device (010).

Description

Projection lenses and laser projection equipment

[0001] This application claims priority to Chinese patent application No. 202311785560.8, filed on December 22, 2023, with the invention name “Ultra-short-throw lens and laser projection device”, and claims priority to Chinese patent application No. 202410176477.9, filed on February 7, 2024, with the invention name “Laser lens, preparation method thereof, and laser device”, and claims priority to Chinese patent application No. 202410030595.9, filed on January 8, 2024, with the invention name “Ultra-short-throw projection lens and laser projection device”, and also claims priority to Chinese patent application No. 202410134376.5, filed on January 31, 2024, with the invention name “Laser lens, preparation method thereof, and laser device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of projection technology, and in particular to a projection lens and a laser projection device. Background Art

[0003] With the rapid development of projection technology, ultra-short-throw projection technology has received widespread attention due to its advantage of being able to project larger images within a short distance.

[0004] The ultra-short-focus projection equipment includes a laser light source, an optical machine and an ultra-short-focus lens. The laser light source is used to provide a laser beam to the optical machine. The optical machine is used to modulate the laser beam emitted by the laser light source and obtain an image beam, and then emit the image beam toward the ultra-short-focus lens. The ultra-short-focus lens is used to form an image of the image beam and reflect it to the projection screen through the reflector inside the ultra-short-focus lens to form an image.

[0005] Due to the high energy of the laser, the reflector absorbs part of the energy of the image beam when reflecting the image beam, causing the temperature of the reflector to rise, which in turn causes the reflector to deform due to heat, changes the focal depth of the reflector, and poor display effect of the projection image on the projection screen. Summary of the Invention

[0006] This application provides a projection lens and a laser projection device. This application provides the following technical solutions:

[0007] On one hand, the present application provides a projection lens, comprising: a lens mount, a lens assembly, and a reflector;

[0008] The lens assembly is arranged on the lens mount and is used to form an image of the incident image light beam;

[0009] The reflector is arranged on the lens holder, and the material of the reflector includes an optical material and a heat dissipation material, and the thermal conductivity of the heat dissipation material is greater than the thermal conductivity of the optical material;

[0010] The reflector has a reflecting surface, which is arranged opposite to the exit end of the lens assembly and faces the lens assembly. The reflecting surface is used to reflect the imaging light beam emitted from the exit end.

[0011] On the other hand, the present application provides a projection lens, comprising: a lens mount, a lens assembly, and a reflector;

[0012] The lens assembly is arranged on the lens mount and is used to form an image of the incident image light beam;

[0013] The reflector is arranged on the lens holder, and the reflector has a heat dissipation channel and a heat dissipation medium distributed in the heat dissipation channel;

[0014] The reflector further has a reflecting surface, which is arranged opposite to the exit end of the lens assembly and faces the lens assembly, and is used to reflect the imaging light beam emitted from the exit end.

[0015] On the other hand, the present application provides a laser projection device, including a laser light source, an optical machine and the above-mentioned projection lens, wherein the laser light source is used to provide a laser beam to the optical machine, the optical machine is used to modulate the laser beam to obtain an image beam, and project the image beam into the ultra-short focus lens for imaging to obtain an imaging beam, and the projection lens is used to project the image onto a projection screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] FIG1 is a schematic structural diagram of a projection system provided in an embodiment of the present application;

[0018] FIG2 is a schematic structural diagram of a laser projection device provided in an embodiment of the present application;

[0019] FIG3 is an exploded schematic diagram of the projection lens in FIG2 ;

[0020] FIG4 is a schematic diagram of the internal structure of the projection lens in FIG2 ;

[0021] FIG5 is a schematic structural diagram of a reflector provided in an embodiment of the present application;

[0022] FIG6 is a cross-sectional view of the reflector shown in FIG5;

[0023] FIG7 is a schematic diagram of light energy distribution of a reflector provided in an embodiment of the present application;

[0024] FIG8 is a schematic structural diagram of another reflector provided in an embodiment of the present application;

[0025] FIG9 is a schematic structural diagram of another reflector provided in an embodiment of the present application;

[0026] FIG10 is a schematic diagram of a process for preparing a laser lens according to an embodiment of the present application;

[0027] FIG11 is another schematic flow chart of a method for preparing a laser lens according to an embodiment of the present application;

[0028] FIG12 is a schematic structural diagram of a reflector provided in another embodiment of the present application;

[0029] FIG13 is a schematic structural diagram of another reflector provided in another embodiment of the present application;

[0030] FIG14 is a plan view of a reflector provided in another embodiment of the present application;

[0031] FIG15 is a cross-sectional schematic diagram of a reflector provided in another embodiment of the present application;

[0032] FIG16 is another cross-sectional schematic diagram of a reflector provided in another embodiment of the present application;

[0033] FIG17 is a schematic structural diagram of a mold used to form a reflector provided in an embodiment of the present application;

[0034] FIG18 is a schematic structural diagram of a reflector provided in another embodiment of the present application;

[0035] FIG19 is a schematic cross-sectional view of the reflector shown in FIG18 ;

[0036] FIG20 is a partial enlarged view of the heat-conducting pipe shown in FIG19;

[0037] FIG21 is a schematic structural diagram of another reflector provided in yet another embodiment of the present application;

[0038] FIG22 is a schematic structural diagram of another reflector provided in another embodiment of the present application;

[0039] FIG23 is a schematic structural diagram of another reflector provided in another embodiment of the present application;

[0040] FIG24 is an exploded schematic diagram of the reflector in FIG23 . DETAILED DESCRIPTION

[0041] In order to make the purpose, implementation mode and advantages of the present application clearer, the exemplary implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0042] It should be noted that the brief descriptions of terms in this application are only for the purpose of facilitating the understanding of the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their ordinary and usual meanings.

[0043] In addition, the terms "comprises" and "comprising" and any variations thereof are intended to cover but not exclude inclusion, for example, a product or device comprising a list of components is not necessarily limited to those components expressly listed but may include other components not expressly listed or inherent to such product or device.

[0044] In the description of this application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0045] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout this application, unless otherwise specified, "plurality" means two or more.

[0046] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0047] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0048] In related art, when laser projection equipment is operating, the reflector absorbs some of the energy of the image beam, causing the reflector temperature to rise. As the reflector temperature rises, it expands and deforms, leading to temperature drift. This deformation of the reflector changes the focus position of the reflector, resulting in poor display quality. Furthermore, the smaller the focal depth of the lens, the greater the impact of the reflector deformation on the display quality.

[0049] In view of this, embodiments of the present application provide a projection lens, wherein a reflector in the projection lens includes a reflector body and a heat dissipation structure connected to the reflector body. By providing the heat dissipation structure on the reflector body, the thermal conductivity of the reflector body can be improved, thereby increasing the amount of heat conduction between the reflector body and the air, thereby reducing the temperature of the reflector body. This also prevents excessive heat concentration in a specific location on the reflector body, thereby improving the problem of poor projection display quality caused by thermal deformation of the reflector.

[0050] Please refer to Figure 1, which is a schematic diagram of the structure of a projection system provided in an embodiment of the present application. The projection system may include: a laser projection device 010 and a projection screen 020. The laser projection device 010 can project an image onto the projection screen 020, allowing the user to view the image displayed on the projection screen 020.

[0051] FIG2 is a schematic diagram of the structure of a laser projection device provided in an embodiment of the present application. As shown in FIG2 , the laser projection device 010 provided in an embodiment of the present application may include: a laser light source 001 , an optical engine 002 , and a projection lens 003 .

[0052] The laser light source 001 is used to emit a laser beam. The optical engine 002 is used to generate an image beam based on the laser beam provided by the laser light source 001 and direct the image beam to the projection lens 003. The projection lens 003 can be an ultra-short-throw lens. After receiving the image beam, the projection lens 003 can form an image of the image beam and project it onto the projection screen 020.

[0053] Figure 3 is an exploded view of the projection lens in Figure 2, and Figure 4 is a schematic view of the internal structure of the projection lens in Figure 2. As shown in Figures 3 and 4, the projection lens 003 provided in the embodiment of the present application may include: a lens holder 100, a lens assembly 200, and a reflector 300.

[0054] The lens assembly 200 can be disposed on the lens mount 100 to form an image of the incident image beam. The reflector 300 can also be disposed on the lens mount 110, and the reflector 300 and the lens assembly 200 can be spaced apart.

[0055] For example, the lens assembly 200 is used to process the image beam emitted by the optical engine 002 and generate an imaging beam directed to the reflector 300. The reflector 300 is used to reflect the imaging beam generated by the lens assembly 200 to a set position, for example, the imaging beam generated by the lens assembly 200 can be reflected onto the projection screen 020.

[0056] It should be noted that the lens mount 100 is used to support the lens assembly 200 and the reflector 300. Its shape and size can be designed based on the specific shapes of the lens assembly 200 and the reflector 300, and are not limited here. In some implementations, as shown in Figures 2 and 3, the lens mount 100 can be a shell-like structure, and the lens assembly 200 and the reflector 300 can be disposed within the lens mount 100. In this way, the lens mount 100 can provide protection for the lens assembly 200 and the reflector 300. Furthermore, there are no restrictions on the specific material of the lens mount 100. In some implementations, the lens mount 100 can be made of plastic, which helps reduce the weight of the lens mount 100 and also reduces the cost of the lens mount 100. There are no specific restrictions on the number, type, and arrangement of the lenses that make up the lens assembly 200. The lens assembly 200 only needs to be able to process the image beam emitted by the optical engine 002 into the imaging beam emitted by the reflector 300.

[0057] In an embodiment of the present application, the reflector 300 may have a reflective surface 311, and the reflective surface 311 of the reflector 300 is arranged opposite to the output end of the lens assembly 200, and the reflective surface 311 of the reflector 300 faces the lens assembly 200. The reflective surface 311 is used to reflect the imaging light beam emitted from the output end so as to reflect it onto the projection screen 020.

[0058] In some embodiments, the surface of the reflector 300 facing the lens assembly 200 (ie, the reflective surface 311 ) may be a concave surface. In this case, the reflector 300 is a curved reflector.

[0059] It can be understood that when the reflectivity of the reflective surface 311 is high, the amount of heat absorbed by the reflector 300 for the imaging light beam can be reduced, and the thermal deformation problem of the reflector 300 can be improved. To this end, in order to further improve the reflectivity of the reflector 300 for the imaging light beam, in some possible implementations, the reflector 300 may also include a film layer (not shown in the figure) for reflecting the imaging light beam. The film layer can be distributed on the side of the reflector 300 facing the lens assembly 200, and the film layer can be a metal film or a non-metal film. It should be noted that when the reflector 300 includes a film layer for reflecting the imaging light beam, the reflective surface 311 can be understood as the surface of the film layer facing the lens assembly 200.

[0060] Here, when the film layer disposed on the side of the reflector 300 facing the lens assembly 200 is a metal film, the metal film has a relatively smooth wall surface due to its low roughness, thereby allowing the reflective surface 311 to have a high reflectivity. The metal film can be made of aluminum, silver, nickel, or aluminum oxide, etc., as long as the metal film has a high reflectivity. This embodiment does not impose any restrictions on the material of the metal film.

[0061] In some implementations, the reflector 300 is typically a sheet structure formed by injection molding an optical material (e.g., optical plastic), which has low production costs and good deformation resistance at a small thickness. However, the reflector 300 may still expand and deform when heated.

[0062] To this end, embodiments of the present application provide a reflector 300 comprising both an optical material and a heat dissipation material to reduce the probability of expansion and deformation of the reflector 300 when heated. Specifically, the reflector 300 may comprise both an optical material and a heat dissipation material. The heat dissipation material may have a greater thermal conductivity than the optical material.

[0063] In this case, because reflector 300 includes not only optical material but also heat dissipation material, and the thermal conductivity of the heat dissipation material is greater than that of the optical material, the heat dissipation material in reflector 300 has excellent thermal conductivity. This improves the conduction of heat within reflector 300, thereby preventing excessive heat concentration in a single location within reflector 300 and increasing the amount of heat exchange between the entire reflector 300 and the air. In other words, the provision of the heat dissipation material reduces the extent of thermal expansion of reflector 300 caused by excessively high temperatures, thereby ensuring a better display quality for the image subsequently presented on projection screen 020.

[0064] In one implementation, as shown in Figures 5 and 6 , Figure 5 is a schematic structural diagram of a reflector provided in an embodiment of the present application, and Figure 6 is a cross-sectional view of the reflector shown in Figure 5 . Reflector 300 is a lens-like structure made by mixing an optical material with a heat dissipation material 320. For example, during the manufacturing process of reflector 300, heat dissipation material 320 can be first mixed with an optical material, and then the optical material mixed with heat dissipation material 320 can be injection molded to obtain reflector 300.

[0065] It should be noted that the optical material can be an optical plastic. For example, the optical material can be cycloolefin polymer (COP), and specific models include Zeonex K26R, 1430R, and 360R. The above materials are merely examples and are not intended to be limiting. It is understood that optical plastics typically have a low thermal conductivity, such as 0.2 W / (m*K), 0.3 W / (m*K), or 0.4 W / (m*K), indicating that the optical material has poor thermal conductivity.

[0066] The heat dissipation material 320 has a greater thermal conductivity than the optical material, and thus has better thermal conductivity. Thus, when the reflector 300 includes the heat dissipation material 320, the heat generated by the illumination beam incident on the reflector 300 can be conducted through the heat dissipation material 320, thereby reducing the temperature of the reflector 300 and minimizing thermal deformation of the reflector 300.

[0067] In some possible implementations, the thermal conductivity of the heat dissipation material 320 is greater than or equal to 5 W / (m*K).

[0068] It should be noted that the thermal conductivity of the heat dissipation material 320 can be specifically 5W / (m*K), 10W / (m*K), 20W / (m*K), 30W / (m*K), 40W / (m*K), 50W / (m*K), 60W / (m*K), 70W / (m*K), 80W / (m*K), 90W / (m*K), 100W / (m*K), 150W / (m*K), 2000W / (m*K), etc. The embodiments of the present application do not limit the specific thermal conductivity of the heat dissipation material 320, nor are they limited to the above examples.

[0069] It can be understood that when the thermal conductivity of the heat dissipation material 320 is greater than or equal to 5W / (m*K), the heat dissipation material 320 has good thermal conductivity, and the heat is conducted through the heat dissipation material 320 at a faster rate, so as to ensure that the heat dissipation material can conduct the heat to the outside of the reflector 300 at a higher conduction rate, and can quickly reduce the overall temperature of the reflector 300, thereby avoiding deformation of the reflector 300 due to excessive heat.

[0070] In some possible implementations, the thermal expansion coefficient of the heat dissipation material 320 is less than or equal to 60*10 -6 ℃.

[0071] It should be noted that the thermal expansion coefficient of the heat dissipation material 320 can be specifically 0.1*10 -6 ℃、0.5*10 -6 ℃, 1.0*10 -6 ℃、1.5*10 -6 ℃、2.0*10 -6 ℃、10.0*10 -6 ℃、20.0*10 -6 ℃、30.0*10 -6 ℃、40.0*10 -6 ℃、50.0*10 -6 ℃、60.0*10 -6 ℃, etc. The embodiment of the present application does not limit the specific thermal expansion coefficient of the heat dissipation material 320, nor is it limited to the above examples.

[0072] In this application, optical materials usually have a high thermal expansion coefficient, such as 65*10 -6 ℃、66*10 -6 ℃、67*10 -6 ℃、68*10 -6 ℃、69*10 -6 ℃、70*10 -6 ℃、71*10 -6 ℃、72*10 -6 ℃、73*10 -6 ℃、74*10 -6 ℃、75*10 -6 ℃, etc. The embodiments of the present application do not limit the specific thermal expansion coefficient of the optical material, nor are they limited to the above examples.

[0073] It is understandable that when the reflector 300 only has the optical material with the above properties, the shape of the reflector 300 is easily affected by temperature. When the temperature changes, the reflector 300 only having the optical material is prone to a large degree of deformation.

[0074] In the case where the reflector 300 not only has the optical material with the above-mentioned properties, but also has the heat dissipation material 320 with the above-mentioned properties, the shape of the reflector 300 is less affected by temperature. When the temperature changes, the reflector 300 having both the optical material and the heat dissipation material 320 is not prone to significant deformation.

[0075] It is understood that when the thermal expansion coefficient of the heat dissipation material 320 is less than or equal to 60*10-6 When the temperature is 0.5°C, the heat dissipation material 320 is less deformed by the temperature change. Therefore, when the reflector 300 includes the heat dissipation material 320, under the same temperature change, the heat dissipation material 320 can alleviate the deformation of the reflector 300 and avoid the reflector 300 from being deformed to a greater extent.

[0076] In some possible implementations, the heat dissipation material 320 may be in powder form. Here, the diameter of the heat dissipation material 320 is less than or equal to 100 μm.

[0077] It should be noted that the diameter of the heat dissipation material 320 can be arbitrary. For example, the diameter of the heat dissipation material 320 can be 0.1μm, 0.5μm, 1.0μm, 5.0μm, 10.0μm, 20.0μm, 30.0μm, 40.0μm, 50.0μm, 60.0μm, 70.0μm, 80.0μm, 90.0μm, 100.0μm, 1mm, etc. The embodiment of the present application does not limit the specific diameter of the heat dissipation material 320, nor is it limited to the above examples.

[0078] It is understood that since the reflector 300 is manufactured by injection molding using a mixture of optical material and heat dissipation material 320, the diameter of the heat dissipation material 320, when in powder form, will affect the surface roughness of the reflector 300. Here, the larger the diameter of the heat dissipation material 320, the greater the surface roughness of the reflector 300 manufactured by injection molding; and the smaller the diameter of the heat dissipation material 320, the smaller the surface roughness of the reflector 300 manufactured by injection molding.

[0079] For example, when the diameter of the heat dissipation material 320 is large, such as when the diameter of the heat dissipation material 320 is greater than 1 / 15 of the thickness of the reflector and less than or equal to the thickness of the reflector, the heat dissipation structure prepared by the heat dissipation material 320 will have a greater probability of being exposed to the outer surface of the reflector 300. At this time, the surface roughness of the reflector 300 is relatively large.

[0080] It should be noted that when the surface roughness of the reflector 300 is large, the surface roughness of the reflector 300 used to reflect light is large, and light is easily diffusely reflected when passing through the reflective surface, thereby affecting the accuracy of light reflection of the reflector 300 and further affecting the reflective performance of the reflector 300.

[0081] To this end, when the diameter of the heat dissipation material 320 is less than or equal to 100 μm, the diameter of the heat dissipation material 320 is small, and the probability of the heat dissipation structure prepared by the heat dissipation material 320 being exposed to the outer surface of the reflector 300 is small. At this time, the surface roughness of the reflector 300 is small, thereby reducing the probability of diffuse reflection of light and improving the reflective performance of the reflector 300.

[0082] It should be noted that the diameter of the heat dissipation material 320 is related to the thickness of the reflector 300. For example, when the thickness of the reflector 300 is greater, the diameter range of the heat dissipation material 320 is greater; when the thickness of the reflector 300 is smaller, the diameter range of the heat dissipation material 320 is smaller.

[0083] In some possible implementations, the heat dissipation material 320 includes one or more of graphene, carbon fiber, and metal materials.

[0084] It is understandable that the metal material can be diverse. For example, the metal material can include one of aluminum, copper, gold, magnesium, silver, nickel, iron, and tin; another example is that the preparation material of the metal can also include multiple of aluminum, copper, gold, magnesium, silver, nickel, iron, and tin, that is, the metal material can also be an alloy.

[0085] It should be noted that the heat dissipation material 320 may have at least one of the aforementioned thermal conductivity, thermal expansion coefficient, and diameter. For example, the thermal conductivity of graphene is in the range of 3000-5000 W / (m*K), and the thermal expansion coefficient of graphene is 8.8*10 -6 ℃, the diameter of graphene can be 0.42μm; the thermal conductivity of carbon fiber is 100W / (m*K), and the thermal expansion coefficient of carbon fiber ranges from 0.5-2.5*10 -6 ℃, the diameter of carbon fiber is 6μm; the thermal conductivity of aluminum is 237W / (m*K), and the thermal expansion coefficient of aluminum is 23.2*10 -6 ℃, the diameter of aluminum can range from 12μm to 75μm; the thermal expansion coefficient of copper is 17.5*10 -6 ℃; the diameter of gold can range from 1.45μm to 3.2μm; the thermal conductivity of magnesium is 156W / (m*K); the thermal expansion coefficient of silver is 19.5*10 -6 ℃.

[0086] It is understood that when the heat dissipation material 320 is an alloy material, it can also have at least one of the aforementioned thermal conductivity, thermal expansion coefficient, and diameter. For example, when the heat dissipation material 320 is an aluminum alloy (AlSi10Mg), its thermal conductivity is 140W / (m*K), its thermal expansion coefficient is 2.3*10 -6 ℃, and its diameter can range from 50μm to 120μm.

[0087] In some possible embodiments, as shown in FIG5 , the reflector 300 further includes a non-reflective surface 312, and the reflective surface 311 and the non-reflective surface 312 are adjacently disposed along the surface extension direction of the reflector 300. The non-reflective surface 312 typically includes an edge region located outside the light irradiation region. Here, the reflector 300 can be assembled to the lens mount 100 via the portion where the non-reflective surface 312 is located.

[0088] Please refer to Figure 7, which is a schematic diagram of light energy distribution of a reflector provided in an embodiment of the present application. Figure 7 is a schematic diagram of light energy distribution on the reflector body 310 when the reflector body 310 reflects the imaging light beam.

[0089] In some possible implementations, as shown in FIG7 , the reflector 300 may have a first temperature region A and a second temperature region B. The optical power density corresponding to the first temperature region A is greater than the optical power density of the second temperature region B. Accordingly, the first temperature region A absorbs more heat than the second temperature region B, such that the temperature of the first temperature region A is greater than the temperature of the second temperature region B. In the present application, the projection of the heat dissipation structure in the reflector 300 onto the reflector body 310 is distributed at least within the first temperature region A.

[0090] The first temperature region A may also be referred to as a high temperature region or a high energy region, and the second temperature region B may also be referred to as a low temperature region or a low energy region.

[0091] 7 , there are two first temperature regions A, located at the lower left and lower right of the reflector 300. In some implementations, there may be more than two first temperature regions A.

[0092] When there are multiple first temperature regions A, the optical power densities corresponding to the multiple first temperature regions A may be the same, or different, or partially the same and partially different. It is only necessary to ensure that the optical power density corresponding to any one first temperature region A is greater than the optical power density corresponding to the second temperature region B. Furthermore, when there are multiple first temperature regions A, the areas corresponding to the multiple first temperature regions A may be the same, or partially the same, or different. This embodiment of the present application does not impose any limitation on this.

[0093] 7 , there are two second temperature regions B, located respectively at the upper left and upper right of the reflector 300. In some implementations, the number of second temperature regions B may be more than two.

[0094] When there are multiple second temperature regions B, the optical power densities corresponding to the multiple second temperature regions B may be the same, or different, or partially the same and partially different. It is only necessary to ensure that the optical power density corresponding to each second temperature region B is less than the optical power density corresponding to the first temperature region A. Furthermore, when there are multiple second temperature regions B, the areas corresponding to the multiple second temperature regions B may be the same, or partially the same, or different. This embodiment of the present application does not limit this.

[0095] Here, in the case where the heat dissipation structure is formed by a heat dissipation material 320 mixed into the optical material, the heat dissipation material 320 needs to be distributed at least within the first temperature region A, so that the heat dissipation material 320 can dissipate heat in the first temperature region A, thereby making the temperature of the first temperature region A within a reasonable range, so as to avoid excessive concentration of heat in the first temperature region A and causing excessive deformation of the surface of the reflector body 310.

[0096] It should be noted that the heat dissipation material 320 needs to be distributed at least in the first temperature region A. In other possible embodiments, the heat dissipation structure 320 can be distributed not only in the first temperature region A but also in the second temperature region B.

[0097] In one possible scenario, as shown in FIG8 , which is a schematic structural diagram of another reflector provided in an embodiment of the present application, heat dissipation material 320 may be provided only in the first temperature region A, and no heat dissipation material may be provided in the second temperature region B. In this case, the heat dissipation material 320 in the first temperature region A may be evenly distributed. The heat dissipation material 320 distributed throughout the first temperature region A can achieve a better heat dissipation effect in the first temperature region A, thereby preventing heat from being concentrated in the higher temperature first temperature region A.

[0098] In another possible scenario, as shown in FIG9 , which is a schematic structural diagram of another reflector provided in an embodiment of the present application, heat dissipation material 320 may be provided not only within the first temperature region A but also within the second temperature region B. In this case, the heat dissipation material 320 may be evenly distributed within both the first temperature region A and the second temperature region B. The heat dissipation material 320 distributed within the first temperature region A can not only provide a good heat dissipation effect for the first temperature region A, thereby preventing heat concentration in the higher temperature first temperature region A, but also provide a heat dissipation effect for the second temperature region B, thereby preventing excessive heat concentration in the second temperature region B. It should be noted that, as shown in FIG9 , since the portion of the reflector body 310 where the reflective surface 311 and the portion where the non-reflective surface 312 are located can be formed simultaneously through an injection molding process, the non-reflective surface 312 of the reflector body 310 may also contain heat dissipation material 320.

[0099] The present application also provides a method for manufacturing a laser lens 100 , which is used to manufacture the aforementioned laser lens 100 . As shown in FIG10 , the method for manufacturing the laser lens 100 includes:

[0100] S100, mixing and melting the heat dissipation material and the optical material to form a molten mixed material.

[0101] It is understandable that the method of mixing the heat dissipation material and the optical material can be arbitrary, such as stirring and mixing. The embodiment of the present application does not limit the mixing method of the heat dissipation material and the optical material, nor is it limited to the above examples.

[0102] It should be noted that before mixing the heat dissipation material and the optical material, the optical material, i.e., the optical plastic, may be melted first, and then the powdered heat dissipation material is added and fully blended through the aforementioned mixing method to form a molten mixed material. The molten mixed material has a certain degree of fluidity.

[0103] S200, injecting the molten mixed material into an injection mold to form a reflector.

[0104] S300, coating the surface of the reflector to form a reflective surface.

[0105] It will be appreciated that the position of the reflective surface 311 has been described above, and the position of the coated surface can be referred to in detail, and will not be further described here. It should be noted that the coating may be applied to the entire surface of the reflector 300 facing the lens assembly 200, such as the reflective surface 311. Furthermore, a portion of the non-reflective surface 312 is also coated to provide a margin for the performance of the reflector 300.

[0106] S400. Install the reflector and lens assembly on the lens mount, with the reflective surface facing the lens assembly.

[0107] Through the above-mentioned setting, the heat dissipation material has a thermal conductivity better than that of the optical material. In the process of the optical material reflecting light and generating heat, the heat dissipation material can conduct the heat to the outside of the reflector 300, thereby reducing the temperature of the reflector 300 and preventing the reflector 300 from being deformed due to excessive heat, thereby avoiding the temperature drift problem of the projection lens 003, thereby ensuring the picture display effect of the laser device 200.

[0108] 11 , in some possible implementations, injecting the molten mixed material into an injection mold includes:

[0109] S210. Provide a first injection mold and a second injection mold. The first injection mold and the second injection mold are relatively combined to form an injection cavity and an injection channel. The injection channel is connected to the injection cavity. The injection cavity has a processing surface corresponding to the reflective surface.

[0110] It should be noted that the injection cavity formed by the first injection mold and the second injection mold is adapted to the reflector 300. The first injection mold and the second injection mold can be an upper mold and a lower mold, respectively, or a left mold and a right mold, respectively. The embodiments of the present application do not limit the specific structures of the first injection mold and the second injection mold, nor are they limited to the above examples.

[0111] S220, injecting the molten mixed material into the injection cavity through the injection channel, and setting processing parameters so that the heat dissipation material is distributed at least in the first temperature region.

[0112] With reference to the above content, the heat dissipation material may be distributed only in the first temperature region A, or may be distributed throughout the first temperature region A and the second temperature region B. Detailed description is omitted here.

[0113] S230 , after the molten mixed material solidifies, demolding the first injection mold and the second injection mold to form a reflector.

[0114] It is understandable that the solidification method can be arbitrary. For example, the solidification can be cooling solidification such as air cooling or water cooling. The embodiment of the present application does not limit the solidification method of the molten mixed material, nor is it limited to the above examples.

[0115] Through the above arrangement, the heat dissipation material can be placed close to the reflective surface 311. The heat dissipation material has better thermal conductivity than the optical material. When the optical material reflects light and generates heat, the heat dissipation material can conduct the heat to the outside of the reflector 300, thereby reducing the temperature of the reflector 300 and preventing deformation of the reflector 300 due to excessive heat. This further prevents temperature drift of the projection lens 003, thereby ensuring the image display effect of the laser device 200.

[0116] In another implementation, as shown in FIG12 , which is a schematic structural diagram of a reflector provided by another embodiment of the present application, the reflector 300 may include a reflector body 310 and a heat conducting member 330 connected to the reflector body 310 .

[0117] The reflector body 310 is at least formed of an optical material, and the heat conducting member 330 is at least partially formed of a heat dissipating material.

[0118] In one possible scenario, the reflector body 310 is formed entirely of optical material. In this case, the reflector body 310 can be obtained by injection molding the optical material, and the heat dissipation material in the reflector 300 can be used to form the heat conducting member 330 .

[0119] In another possible scenario, a portion of the heat dissipation material in the material of the reflector 300 can be used to form the heat conductor 330, and the other portion of the heat dissipation material can be combined with the optical material to form the reflector body 310. Exemplarily, the heat dissipation material in the material of the reflector 300 may include: a first heat dissipation material and a second heat dissipation material. The reflector body 310 in the reflector 300 is a lens-like structure made of an optical material mixed with a first heat dissipation material; the heat conductor 330 in the reflector 300 is a solid structure made of a second heat dissipation material. Here, the first heat dissipation material can be in powder form, and the formation process of the reflector body 310 can refer to the above content and will not be repeated here. In addition, the first heat dissipation material and the second heat dissipation material can be the same or different. The embodiments of the present application are not limited to this.

[0120] In the embodiment of the present application, the heat conducting member 330 in the reflector 300 may be a metal member with good thermal conductivity. Therefore, by providing the heat conducting member 330 on the reflector body 3110, the heat conduction performance within the reflector body 310 can be improved, thereby preventing excessive heat concentration in a certain location of the reflector body 310 and increasing the heat exchange between the reflector 300 and the air. In other words, by providing the heat conducting member 330, the degree of deformation of the reflector body 310 caused by excessive temperature of the reflector body 310 can be reduced.

[0121] It should be noted that the thermal expansion coefficient of the heat conductor 330 is low, so the deformation of the heat conductor 330 after heating is small, which avoids the deformation of the reflector body 310 due to the pressure of the heat conductor 330 due to the large deformation of the heat conductor 300.

[0122] Here, the heat conducting member 330 in the reflector 300 includes a heat conducting metal sheet or a heat conducting metal mesh. When the heat conducting member 330 includes a heat conducting metal sheet, at least a portion of the heat conducting member 330 is a sheet-like structure; when the heat conducting member 330 includes a heat conducting metal mesh, at least a portion of the heat conducting member 330 is a mesh-like structure.

[0123] In the reflector 300 , the heat conducting member 330 may be disposed on a side of the reflector body 310 facing away from the reflective surface 311 ; or, the heat conducting member 330 may be embedded inside the reflector body 310 .

[0124] As shown in FIG12 , when the heat conducting member 330 is disposed on a side of the reflector body 310 facing away from the reflective surface 311, the reflector body 310 may have a first mounting groove U1 on the side facing away from the reflective surface 311. At least a portion of the heat conducting member 330 is located within the first mounting groove U1. Here, the reflector body 310 with the first mounting groove U1 may be directly formed through an injection molding process.

[0125] In the present application, the shape of the first mounting groove U1 matches the shape of the heat conducting member 330, and heat conducting members 330 of different shapes can be provided with first mounting grooves U1 of different shapes. Exemplarily, as shown in Figure 12, when at least a portion of the heat conducting member 330 is a sheet-like structure, the first mounting groove U1 can be a planar groove that matches the shape of the sheet-like structure. As shown in Figure 13, Figure 13 is a schematic structural diagram of another reflector provided by another embodiment of the present application. When at least a portion of the heat conducting member 330 is a mesh structure, the first mounting groove U1 can be a mesh groove that matches the shape of the mesh structure.

[0126] It should be noted that the depth of the first mounting groove U1 needs to be less than the thickness of the reflector body 310 to ensure that the first mounting groove U1, located on the side of the reflector body 310 facing away from the reflective surface 311, does not affect the reflective surface 311, thereby ensuring that the reflective surface 311 can properly reflect the illumination beam. Furthermore, the depth of the first mounting groove U1 must be greater than or equal to the thickness of the heat conducting member 330. This reduces the protrusion height of the heat conducting member 330 from the reflector body 310, ensuring a relatively flat appearance for the reflector 300.

[0127] For example, the thermal conductor 330 can be installed in the first mounting groove U1 of the reflector body 310 by means of snap-fitting, screwing, or bonding. That is, after the reflector body 310 is injection-molded, the thermal conductor 330 is assembled to the reflector body 310 by means of snap-fitting, screwing, or bonding. It should be noted that when the thermal conductor is bonded and fixed in the first mounting groove U1 by adhesive, the thermal expansion coefficient of the adhesive must be close to that of the reflector body 310 to reduce compressive deformation of the reflector body 310 caused by excessive thermal deformation of the adhesive.

[0128] In some possible implementations, as shown in FIG12 , the heat conducting member 330 may include a connecting portion 331 and a heat conducting portion 332, wherein the connecting portion 331 may be fixedly connected to the reflector body 310 within the first mounting groove U1. Thus, by connecting the connecting portion 331 to the reflector body 310, the heat conducting portion 332 may be fixed to the first mounting groove U1. Here, the connecting portion 331 may be connected to the reflector body 310 by screws.

[0129] In a specific embodiment, as shown in Figure 14, Figure 14 is a plan view of a reflector provided by another embodiment of the present application. A first gap M1 is provided between the heat conducting member 330 located in the first mounting groove U1 and the reflector body 310. Here, the first gap M1 can be 0.01mm-0.1mm. This ensures that the first gap M1 is small and does not affect the heat conduction between the reflector body 310 and the heat conducting member 330. At the same time, by providing the first gap M1, the heat conducting member 330 and the reflector body 310 are not directly attached to each other. Due to factors such as the shape of the heat conducting member 330 and the assembly of the heat conducting member 330 and the reflector body 310, the reflector body 310 will not be deformed by the pressure of the heat conducting member 330. Furthermore, by providing the first gap M1, the molding precision requirements of the heat conducting member 330 can be reduced. That is, there is no need to strictly require that the shape of the heat conducting member 330 be compatible with the shape of the first mounting groove U1 of the reflector body 310, resulting in lower manufacturing costs.

[0130] In some embodiments of the present application, the first gap M1 between the heat conductor 330 and the reflector body 310 is filled with thermal grease or thermally conductive silicone (not shown). This facilitates heat transfer between the reflector body 310 and the heat conductor 330, improving the heat dissipation performance of the reflector body 310. In other possible implementations, the first gap M1 may also be filled with other thermally conductive materials, which are not limited in this embodiment.

[0131] It should be noted that after the heat conductor 330 is installed in the first installation groove U1 set on the side of the reflector body 310 away from the reflective surface 311, it can be ensured that the heat conductor 330 will be exposed to the outside of the reflector body 310, so that the heat conductor 330 can serve as a heat transfer medium to better realize the heat exchange between the reflector body 310 and the air, thereby improving the effect of the reflector body 310 transferring heat to the air through the heat conductor 330 for heat dissipation.

[0132] In other possible cases, the heat conductor 330 may also be directly mounted on the wall surface of the reflector body 310 opposite to the reflective surface 311 , that is, the shape of the reflector body 310 may not be changed, thereby reducing the manufacturing cost.

[0133] As shown in Figure 15, Figure 15 is a schematic cross-sectional view of a reflector provided by another embodiment of the present application. When the heat conductive member 330 is embedded within the reflector body 310, the heat conductive member is not exposed outside the reflector body 310, and the integrity and appearance of the reflector body 310 are improved. In addition, when the heat conductive member 330 is embedded within the reflector body 310, the reflector body 310 has a bearing cavity U2 inside. The heat conductive member 330 can be located within the bearing cavity U2.

[0134] In one possible implementation, the reflector body 310 includes a first lens portion and a second lens portion that are spliced ​​together. The first lens portion and the second lens portion can be formed separately through different injection molding processes. After the first lens portion and the second lens portion are spliced ​​together, a bearing cavity U2 can be formed between the first lens portion and the second lens portion. In this case, the heat conductive member 330 can be first installed on the first lens portion by means of snap-fitting, screwing, gluing, etc., and then the second lens portion can be spliced ​​onto the first lens portion. The heat conductive member 330 can then be installed in the bearing cavity U2 of the reflector body 310.

[0135] It should be noted that when the reflector body 310 includes a first lens portion and a second lens portion that are joined together, and the heat conducting member 330 is installed between the first lens portion and the second lens portion to form a bearing cavity U2, the heat conducting portion 332 of the heat conducting member can be spaced apart from the inner wall surface of the bearing cavity U2 to form a second gap M2. The function of this second gap M2 is the same as that of the first gap M1 in the above embodiment, and will not be further described here.

[0136] In another possible implementation, as shown in Figure 16, Figure 16 is another cross-sectional schematic diagram of a reflector provided by another embodiment of the present application. The reflector 300 is a lens-like structure formed by injection molding with an internally arranged heat-conducting member 330 on the outside. That is, in the process of preparing the reflector 300, the heat-conducting member 330 can be first placed inside the injection mold, and then injection molding can be performed inside the injection mold. After the injection molding is completed and the injection mold is removed, the reflector body 310 with the heat-conducting member 330 embedded inside can be obtained. In this case, it can be ensured that the reflector body 310 has a relatively smooth wall surface and a relatively uniform thickness. At the same time, it can also be ensured that the connection stability between the heat-conducting member 330 and the reflector body 310 is high, and fatigue separation between the heat-conducting member 330 and the reflector body 310 will not occur.

[0137] For example, as shown in Figure 17, Figure 17 is a schematic diagram of the structure of a mold used to form a reflector provided in an embodiment of the present application. In the process of forming the reflector body 310 with the heat conductive member 330 embedded therein by the injection molding process, the heat conductive member 330 can be installed on the support structure 430 between the reflector body mold core 410 and the reflector body mold base 420. After the reflector body mold core 410 and the reflector body mold base 420 are molded together, a fluid optical material is injected. After the reflector body 310 is injection molded by the injection molding process, the heat conductive member 330 is disconnected from the support structure 430 during demoulding, and the reflector body 310 is ejected to the outside of the reflector body mold core 410 and the reflector body mold base 420. In this way, the reflector body 310 with the heat conductive member 330 embedded therein can be obtained after cutting.

[0138] It should be noted that after the reflector body 310 with the heat conductive member 330 embedded therein is formed by the injection molding process, the inner wall of the bearing cavity U2 inside the reflector body 310 can be completely fitted with the outer wall of the heat conductive member 330 without any gap between the two.

[0139] In other possible implementations, in the process of forming the reflector body 310 with the heat conductor 330 embedded therein by an injection molding process, a gap forming structure (not shown) can also be provided between the reflector body mold core 410 and the reflector body mold base 420. The gap forming structure has a hollow inner cavity, the central portion of the heat conductor 330 is located in the inner cavity of the gap forming structure, and the edge portion of the heat conductor 330 extends to the outside of the inner cavity of the gap forming structure. In this way, after demolding, the inner cavity of the gap forming structure corresponds to the bearing cavity U2 of the reflector body 310, the edge portion of the heat conductor 330 is fixedly connected to the reflector body 310, the central portion of the heat conductor 330 is located in the bearing cavity U2, and the central portion of the heat conductor 330 is spaced from the inner wall surface of the bearing cavity U2 to form a second gap M2.

[0140] In the embodiment of the present application, the material of the heat conducting member 330 in the above embodiment can be aluminum, copper, etc., or an alloy, which is not limited in this embodiment.

[0141] In some embodiments of the present application, the structure of the heat conducting member 330 is not limited in this embodiment. The heat conducting member 330 may include a heat conducting metal sheet. The shape of the heat conducting metal sheet may be rectangular, hexagonal, etc., and the number of the heat conducting metal sheets may be one or more. In the case where there are multiple heat conducting metal sheets, the multiple heat conducting metal sheets may be interconnected as a whole, or the multiple heat conducting metal sheets may be spaced apart from each other. Exemplarily, the multiple heat conducting metal sheets are divided into two groups, the multiple heat conducting metal sheets in each group are interconnected, and the two groups of heat conducting metal sheets are spaced apart from each other.

[0142] In some embodiments of the present application, through holes may be provided on the thermally conductive metal sheet. In this case, the thermally conductive metal sheet may have a mesh structure, that is, the thermal conductive component 330 may also include a thermally conductive metal mesh. The mesh size of the thermally conductive metal mesh may be limited as needed. For example, when the mesh size of the thermally conductive metal mesh is larger, the thermally conductive metal mesh evolves into a strip-frame structure.

[0143] In some embodiments of the present application, the hardness and thickness of the heat conducting member 330 are not limited in this embodiment, as long as effective heat conduction can be achieved. For example, the heat conducting member 330 can be a thin film structure with a relatively small thickness and hardness.

[0144] In some embodiments of the present application, the heat conductor 330 can also be a support member with greater hardness. In this way, the strength of the reflector body 310 can be improved by the heat conductor 330, that is, the ability of the reflector body 310 to resist thermal deformation is improved, and the projection display effect of the projection screen is better.

[0145] In some embodiments of the present application, after the strength of the reflector body 310 in resisting thermal deformation becomes higher, the thickness of the reflector body 310 can be reduced accordingly. In this way, the heat concentrated on the reflector body 310 is smaller, thereby avoiding the reflector body 310 from overheating. Moreover, since the thickness of the reflector body 310 is smaller, the heat exchange amount between the reflector body 310 and the control can be increased, thereby changing the problem of the reflector body 310 being deformed by heat.

[0146] In some embodiments of the present application, the optical power density corresponding to different positions of the reflector body 310 is different, that is, the temperature at different positions of the reflector body 310 is different. For example, as shown in Figure 7, the reflector body 310 may have a first temperature region A and a second temperature region B. The optical power density corresponding to the first temperature region A is greater than the optical power density of the second temperature region B. Accordingly, the heat absorbed by the first temperature region A is greater than the heat absorbed by the second temperature region B, so that the temperature of the first temperature region A is greater than the temperature of the second temperature region B. In the present application, the projection of the heat dissipation structure in the reflector 300 on the reflector body 310 is distributed at least within the first temperature zone A. Here, for the distribution characteristics of the first temperature region A and the second temperature region B, reference can be made to the corresponding content in the aforementioned embodiments, which will not be repeated here.

[0147] Here, when the heat dissipation structure is a heat conductor 330, the heat conductor 330 needs to be distributed at least in the first temperature zone A, so that the heat conductor 330 can dissipate heat to the first temperature zone A, thereby making the temperature of the first temperature zone A within a reasonable range, so as to avoid excessive concentration of heat in the first temperature zone A and causing excessive deformation of the surface of the reflector body 310.

[0148] In some embodiments of the present application, depending on the arrangement of the heat conductive member 330, the projection of the heat conductive member 330 on the reflector body 310 may cover the entire first temperature region A, or may simultaneously cover a portion of the first temperature region A and a portion of the second temperature region B. For example, the projection of the heat conductive member 330 on the reflector body 310 covers a portion of the first temperature region A and a portion of the second temperature region B, or the projection of the heat conductive member 330 on the reflector body 310 covers the entire first temperature region A and the entire second temperature region B, which is not limited in this embodiment.

[0149] In some embodiments of the present application, the projection corresponding to the heat conducting member 330 covers a greater proportion of the first temperature region A than the second temperature region B. The projection of the heat conducting member 330 corresponding to the first temperature region A and the second temperature region B is divided into two parts. For ease of description, the two parts of the projection can be referred to as the first part and the second part. The first part corresponds to the first temperature region A, and the second part corresponds to the second temperature region B. The area ratio of the first part to the first temperature region A is greater than the area ratio of the second part to the second temperature region B. In this way, the heat conducting member 330 can conduct heat and dissipate heat in most areas of the first temperature region A, that is, it can conduct heat to the reflector body 310 in a targeted manner, achieving a better heat dissipation effect.

[0150] In some embodiments of the present application, the number of first temperature regions A may be multiple, for example, two or more, depending on the optical path of the laser beam. For example, if a heat conducting member 330 is provided corresponding to each first temperature region A and the heat conducting member 330 includes multiple heat conducting metal sheets, the heat conducting metal sheets may be divided into two groups, with one group of heat conducting metal sheets provided corresponding to each first temperature region A.

[0151] In some embodiments of the present application, different types of heat conducting members 330 may be provided on the reflector body 310 as needed. For example, the first temperature zone A corresponds to a heat conducting member 330 comprising a plurality of heat conducting metal sheets, and the second temperature zone B corresponds to a heat conducting member 330 comprising a heat conducting metal mesh.

[0152] It should be noted that the above description is based on the example of a metal heat conductor 330. In other possible implementations, the heat conductor may also be a non-metallic heat conductor. Due to the good thermal conductivity of non-metallic heat conductors, they can improve the conduction of high heat within the reflector body 310, thereby preventing excessive heat concentration at one or more locations within the reflector body 310. This can also increase the heat exchange between the reflector body 310 and the air. Therefore, by improving the heat conduction performance within the reflector body 310 through non-metallic heat conductors, the heat dissipation capacity of the reflector body 310 can be improved, the surface shape of the reflector body 310 can be controlled within a reasonable range, and a good projection display effect can be ensured.

[0153] There is no restriction on the specific material of the non-metallic heat conductive member. It is sufficient that the non-metallic heat conductive member has a thermal conductivity greater than or equal to 1.4 W / (m·K). For example, the non-metallic heat conductive member may be carbon fiber or graphene.

[0154] The embodiment of the present application also provides a reflector 300 having a heat dissipation channel and a heat dissipation medium distributed within the heat dissipation channel to reduce the probability of expansion and deformation of the reflector 300 when heated. As shown in Figures 18, 19, and 20, Figure 18 is a schematic structural diagram of a reflector provided by another embodiment of the present application, Figure 19 is a schematic cross-sectional view of the reflector shown in Figure 18, and Figure 20 is a partial enlarged view of the heat-conducting pipe shown in Figure 19. In other words, the reflector 300 also has a heat dissipation channel L and a heat dissipation medium (not shown in the figure) distributed within the heat dissipation channel L.

[0155] In this case, during the process of the reflector 300 reflecting the imaging light beam, the heat dissipation medium distributed in the heat dissipation channel L of the reflector 300 can exchange heat with the reflector 300, thereby transferring the heat on the reflector 300 to the air. To this end, the heat dissipation medium in the heat dissipation channel L can improve the thermal conductivity of the reflector 300, and can promptly remove the heat from the reflector 300, thereby improving the phenomenon of excessive heat concentration on the reflector 300 and reducing the degree of deformation of the reflector 300 caused by the excessive temperature of the reflector 300.

[0156] The specific type of heat dissipation medium is not limited herein. In some implementations, the heat dissipation medium may include a phase-change medium. By absorbing heat from the reflector 300 and undergoing a phase change, the phase-change medium can promptly transfer the heat from the reflector 300 to the air, keeping the temperature of the reflector 300 within a reasonable range. Therefore, the phase-change medium can improve the heat dissipation capability of the reflector 300, thereby alleviating the problem of heat-induced deformation of the reflector 300.

[0157] Specifically, the phase-change medium within the heat dissipation channel L is heated at the heat source until a phase change occurs. This heat convection then forms within the heat dissipation channel L, cooling at the heat dissipation end before flowing back to the heat source end. This repetitive process accelerates heat transfer, allowing the heat from the reflector 300 to be transferred to the air in a timely manner. The phase-change medium absorbs heat from the reflector 300 at the heat source end and transfers the heat to the air at the heat dissipation end.

[0158] The phase change medium can be a thermally conductive gel, water, mineral oil, fluorinated liquid, solid-liquid phase change material, or solid-solid phase change material. For example, when the phase change medium is water, the water absorbs heat from the reflector 300 at the heat source end and changes from liquid to gas. It then exchanges heat with air at the heat dissipation end, condenses into liquid water, and flows back to the heat source end, removing heat from the reflector 300 in this reciprocating process.

[0159] In other implementations, the heat dissipation medium may also include a heat-conducting fluid and heat-conducting particles mixed into the heat-conducting fluid. The heat-conducting particles may be nanoscale heat-conducting particles. By mixing the nanoscale heat-conducting particles with the heat-conducting fluid, the heat dissipation medium can have a high thermal conductivity, which can promptly remove heat generated by the reflector 300, keeping the temperature of the reflector 300 within a reasonable range and alleviating the problem of heat-induced deformation of the reflector 300. The nanoscale heat-conducting particles may be nanoscale metal particles or nanoscale metal oxide particles, etc., without specific limitation herein.

[0160] By adding nano-scale heat-conducting particles to a heat-conducting fluid, the structure of the heat-conducting fluid can be changed, thereby enhancing the energy transfer process inside the heat-conducting fluid and increasing the thermal conductivity. In addition, due to the small size effect of the nano-scale heat-conducting particles, micro-convection occurs between the nano-scale heat-conducting particles and the heat-conducting fluid. This micro-convection enhances the energy transfer process between the nano-scale heat-conducting particles and the heat-conducting fluid, thereby increasing the thermal conductivity of the heat-dissipating medium. Therefore, after the nano-scale heat-conducting particles and the heat-conducting fluid are mixed, the heat-dissipating medium can be provided with a high thermal conductivity, thereby improving the heat dissipation capability of the reflector 300.

[0161] The number of heat dissipation channels L may be one or more. When there are multiple heat dissipation channels L, the shapes of the multiple heat dissipation channels L may be the same, partially the same, or different. Furthermore, when there are multiple heat dissipation channels L, the multiple heat dissipation channels L may be disconnected, partially connected, or fully connected.

[0162] In an embodiment of the present application, the optical power density corresponding to different positions of the reflector 300 is different, so that the temperature at different positions of the reflector 300 is different. For example, as shown in Figure 7, the reflector 300 may have a first temperature region A and a second temperature region B. The optical power density corresponding to the first temperature region A is greater than the optical power density of the second temperature region B. Accordingly, the heat absorbed by the first temperature region A is greater than the heat absorbed by the second temperature region B, so that the temperature of the first temperature region A is greater than the temperature of the second temperature region B. In the present application, the projection of the heat dissipation structure in the reflector 300 on the reflector 300 is distributed at least within the first temperature zone A. Here, the distribution characteristics of the first temperature region A and the second temperature region B can refer to the corresponding content in the aforementioned embodiment, which will not be repeated here.

[0163] Here, in the case where the heat dissipation structure is a heat dissipation medium distributed in the heat dissipation channel L of the reflector 300, the heat dissipation channel L needs to be distributed at least in the first temperature zone A, so that the heat dissipation medium can dissipate heat to the first temperature zone A, thereby making the temperature of the first temperature zone A within a reasonable range, so as to avoid excessive concentration of heat in the first temperature zone A and causing excessive deformation of the surface of the reflector 300.

[0164] The correspondence between the heat dissipation channels L and the first temperature region A, and between the heat dissipation channels L and the second temperature region B, can be determined based on heat dissipation requirements. In some implementations, the heat dissipation channels L can be distributed within a portion of the first temperature region A. In other implementations, the heat dissipation channels L can be distributed throughout the first temperature region A. In yet another implementation, the heat dissipation channels L can be distributed within a portion of the first temperature region A and within a portion of the second temperature region B. In yet another implementation, the heat dissipation channels L can be distributed throughout the first temperature region A and throughout the second temperature region B.

[0165] Here, when the heat dissipation channel L is distributed in the first temperature region A, the heat dissipation channel L can dissipate heat for the first temperature region A; when the heat dissipation channel L is distributed in the second temperature region B, the heat dissipation channel L can dissipate heat for the second temperature region B.

[0166] In some implementations, when the heat dissipation channels L corresponding to the first temperature region A and the second temperature region B are connected, the heat dissipation medium in the heat dissipation channel L corresponding to the first temperature region A can move to the heat dissipation channel L corresponding to the second temperature region B after absorbing heat. This can further accelerate the heat dissipation speed of the heat dissipation medium and help balance heat.

[0167] In other implementations, when both the first temperature region A and the second temperature region B correspond to the heat dissipation channels L, the heat dissipation channels L corresponding to the first temperature region A and the second temperature region B may also be disconnected. This embodiment of the present application is not limited to this.

[0168] In an exemplary implementation, as shown in FIG. 18 , FIG. 19 and FIG. 20 , the reflector 300 may include: a reflector body 310 and a heat-conducting pipe 340 .

[0169] The reflector body 310 has a reflective surface 311 on the side facing the lens assembly 200. The heat conducting pipe 340 may be located on the side of the reflector body 310 away from the reflective surface 311. The heat conducting pipe 340 may have a heat dissipation channel L for accommodating a heat dissipation medium.

[0170] In this case, during the process of the reflective surface 311 of the reflector body 310 reflecting the imaging light beam, the heat dissipation medium can exchange heat with the reflector body 310 through the heat-conducting pipe 340, and exchange heat with the air through the heat-conducting pipe 340 to transfer the heat of the reflector body 310 to the air, thereby improving the thermal conductivity performance of the heat in the reflector body 310.

[0171] Furthermore, the heat-dissipating medium can transfer heat from the reflector body 310 to the air through the heat-conducting pipe 340, thereby preventing excessive heat concentration at one or more locations on the reflector body 310, which could cause significant surface deformation of the reflector body 310. Furthermore, by properly designing the orientation of the heat-dissipating pipe 340 so that the direction of the heat-dissipating channel L aligns with the heat distribution on the reflector body 310, the temperature of the reflector body 310 can be reduced. Furthermore, the heat-conducting pipe 340 and the heat-dissipating medium can be preassembled into components and then assembled with the reflector body 310, thereby improving the assembly efficiency of the reflector 300.

[0172] There is no limitation on the specific number of the heat-conducting pipes 340. For example, as shown in FIG18 , the number of the heat-conducting pipes 340 is eight. Of course, the number of the heat-conducting pipes 340 may be more or less than eight.

[0173] Of course, when there are multiple heat-conducting pipes 340 , the structures or shapes of the multiple heat-conducting pipes 340 may be the same, or different, or some may be the same and others may be different.

[0174] As shown in FIG. 18 , the first temperature region A corresponds to four heat-conducting pipes 340 . Of course, the number of heat-conducting pipes 340 corresponding to the first temperature region A may be more or less than four.

[0175] As shown in FIG. 18 , the second temperature region B corresponds to four heat-conducting pipes 340 . Of course, the number of heat-conducting pipes 340 corresponding to the second temperature region B may be more or less than four.

[0176] 18 , a portion of the heat-conducting pipe 340 corresponds to the first temperature region A, and another portion corresponds to the second temperature region B. Of course, the heat-conducting pipes 340 corresponding to the first temperature region A and the second temperature region B may not be connected.

[0177] The shape of the heat-conducting pipe 340 can be determined based on the direction of the heat dissipation channel L or the heat distribution on the reflector body 310. In some implementations, as shown in FIG18 , the heat-conducting pipe 340 can include a first pipe segment 341 with a long arc shape and a second pipe segment 342 with multiple corners. The first pipe segment 341 corresponds to the first temperature region A, and the second pipe segment 342 corresponds to the second temperature region B. Because the first pipe segment 341 is long and arc-shaped, the heat dissipation channel L formed by the first pipe segment 341 has fewer inflection points. Therefore, the long and arc-shaped first pipe segment 341 can improve the heat dissipation rate for the first temperature region A. Because the second pipe segment 342 has multiple corners, the heat dissipation channel L formed by the second pipe segment 342 has multiple inflection points. Therefore, the second pipe segment 342 with multiple inflection points can improve uniformity, thereby improving the overall heat dissipation effect of the reflector 300.

[0178] In other implementations, the heat-conducting pipe 340 may also be a long curved pipe structure, as shown in Figure 21, which is a schematic structural diagram of another reflector provided in another embodiment of the present application. There may be two long curved heat-conducting pipes 340, and these two heat-conducting pipes 340 may be respectively distributed in the two first temperature regions A.

[0179] In some other implementations, the heat-conducting pipe fittings 340 may also be an elongated pipe structure, as shown in FIG22 , which is a schematic structural diagram of another reflector provided by another embodiment of the present application. The elongated pipe structure may be distributed within the first temperature region A, or may be distributed within the second temperature region B. Here, the number of the heat-conducting pipe fittings 340 is multiple, and the multiple heat-conducting pipe fittings 340 are symmetrically arranged. Of course, the multiple heat-conducting pipe fittings 340 may also be asymmetrically arranged. As shown in FIG22 , the multiple heat-conducting pipe fittings 340 have the same shape. Of course, the shapes of the multiple heat-conducting pipe fittings 340 may also be different. Therefore, when the number of the heat-conducting pipe fittings 340 is multiple, the shapes of the multiple heat-conducting pipe fittings 340 may be the same, or may be different, or may be partially the same.

[0180] In order to improve the heat conduction effect of the heat conducting pipe 340, the heat conducting pipe 340 can be made of a high heat conducting material. The high heat conducting material can be a metal material, a non-metal material, or a mixed heat conducting material composed of a metal material and a non-metal material. For example, the heat conducting pipe 340 can be made of copper.

[0181] The specific structure of the heat-conducting pipe 340 is not limited here. In some implementations, the heat-conducting pipe 340 can be a heat pipe. In this way, the cost of the heat-conducting pipe 340 can be reduced while improving the heat dissipation capacity of the reflector body 310.

[0182] In other implementations, the inner wall of the heat-conducting pipe 340 may also be provided with a heat-conducting microstructure (not shown in the figure). By providing the heat-conducting microstructure on the inner wall of the heat-conducting pipe 340, the heat exchange area between the heat-conducting pipe 340 and the heat dissipation medium can be increased, thereby increasing the heat conduction speed of the heat-conducting pipe 340, and further improving the heat dissipation capacity of the heat-conducting pipe 340.

[0183] The specific structure of the heat-conducting microstructure is not limited here. For example, the heat-conducting microstructure may include a plurality of columnar portions (not shown in the figure). In addition, the heat-conducting microstructure may be a regular microstructure or an irregular microstructure, which is not limited here.

[0184] In some further implementations, the inner wall of the heat-conducting pipe 340 may also be provided with a thermally conductive film. For example, the thermally conductive film may be a graphene heat dissipation film. The high thermal conductivity of the graphene heat dissipation film can improve heat transfer between the heat dissipation medium and the heat-conducting pipe 340, thereby further enhancing the heat dissipation capability of the heat-conducting pipe 340.

[0185] The graphene heat dissipation film may be composed of one or more graphene layers.

[0186] To further improve thermal conductivity between the heat-conducting pipe 340 and the reflector body 310, in some implementations, a heat-conducting medium (not shown) may be filled between the reflector body 310 and the heat-conducting pipe 340. This improves thermal conductivity between the heat-conducting pipe 340 and the reflector body 310, further enhancing the heat dissipation capability of the reflector body 310. The heat-conducting medium may be thermal grease or thermal silica gel. Furthermore, the heat-conducting medium may be in a sheet or paste form.

[0187] In order to increase the heat exchange area between the reflector body 310 and the heat-conducting pipe 340, in some possible implementations, as shown in Figure 20, a second mounting groove U3 can be opened on the side of the reflector body 310 facing away from the reflective surface 311, and at least a portion of the heat-conducting pipe 340 can be located inside the second mounting groove U3.

[0188] By disposing the heat conducting pipe 340 inside the second mounting groove U3, the heat exchange area between the heat conducting pipe 340 and the reflector body 310 can be increased, which helps to improve the heat dissipation capacity of the reflector body 310. In addition, the volume of the reflector 300 can be reduced, which helps to miniaturize the reflector 300.

[0189] 20 , it can be seen that the second mounting groove U3 is a groove provided on the side of the reflector body 310 away from the reflective surface 311 , and the shape of the groove matches the shape of the heat conducting pipe 340 .

[0190] When the reflector body 310 is formed by an injection molding process, in some implementations, the heat-conducting pipe 340 may also be disposed inside the reflector body 310 (not shown in the figure), which may also improve the heat transfer and heat dissipation capabilities of the reflector body 310 .

[0191] To achieve a fixed connection between the heat-conducting pipe 340 and the reflector body 310, in some implementations, the heat-conducting pipe 340 can be fixedly connected to the reflector body 310 by bonding. In other implementations, the heat-conducting pipe 340 can also be embedded in the second mounting groove U3, so that the outer wall of the heat-conducting pipe 340 abuts the inner wall of the second mounting groove U3, thereby achieving a fixed connection between the heat-conducting pipe 340 and the reflector body 310. In still other implementations, the reflector 300 can further include a fixing member that covers the heat-conducting pipe 340 and is fixedly connected to the reflector body 310 to achieve a fixed connection between the reflector body 310 and the heat-conducting pipe 340.

[0192] In another exemplary implementation, please refer to Figures 23 and 24 . Figure 23 is a schematic structural diagram of another reflector provided in another embodiment of the present application, and Figure 24 is an exploded schematic diagram of the reflector in Figure 23 . The reflector body 310 may include: a reflector body 310 and a cover 350 .

[0193] The reflector body 310 may have a reflective surface 311 on the side facing the lens assembly 200. A cover 350 may be connected to the side of the reflector body 310 facing away from the reflective surface 311. Furthermore, a heat dissipation channel L for accommodating a heat dissipation medium may be formed between the cover 350 and the reflector body 310. This formation of the heat dissipation channel L for accommodating the heat dissipation medium further shortens the heat transfer path and reduces thermal resistance, thereby further improving the heat dissipation capability of the reflector body 310.

[0194] There is no limitation on the specific material of the cover 350. In some implementations, the cover 350 can be a polyester substrate (PET film) or a coating such as copper foil.

[0195] The heat dissipation channel L formed by the cover 350 and the reflector body 310 may be one or more, and is not specifically limited here. For example, the cover 350 and the reflector body 310 form multiple heat dissipation channels L arranged side by side, and any two heat dissipation channels L are connected.

[0196] There is no limitation on how to form the heat dissipation channel L. In some implementations, as shown in FIG24 , a plurality of protruding strips 3131 may be provided on the side of the reflector body 310 facing away from the reflective surface 311. The protruding strips 3131 and the cover 350 may form the heat dissipation channel L. In other implementations, the protruding strips 3131 may also be provided on the cover 350. In this case, the surface of the reflector body 310 facing away from the reflective surface 311 and the protruding strips 3131 form the heat dissipation channel L.

[0197] 23 and 24 , a groove for accommodating the protruding strip 3131 is formed on the side of the reflector body 310 facing away from the reflective surface 311 , and the inner wall of the groove, the protruding strip 3131 and the cover 350 together form a plurality of heat dissipation channels L.

[0198] As shown in FIG24 , the heat dissipation channel L is in the shape of a strip. Of course, the heat dissipation channel L may also be in other shapes, such as a shape similar to the heat conduction pipe 340 in FIG18 or the shape of the heat conduction pipe 340 in FIG22 .

[0199] In some embodiments of the present application, as shown in FIG21 , the reflector 300 may further include a micropump 360. The micropump 360 is used to drive the heat dissipation medium to circulate within the heat dissipation channel L. By driving the heat dissipation medium to circulate within the heat dissipation channel L through the micropump 360, the flow rate of the heat dissipation medium can be increased, further improving the heat dissipation effect. Furthermore, the heat dissipation medium can be promptly recirculated to ensure that heat generated by the reflector body 310 is promptly removed by the heat dissipation medium.

[0200] Taking the reflector 300 including the heat-conducting pipe 340 as an example, as shown in FIG21 , there are two micropumps 360, each disposed between the two heat-conducting pipes 340. The first ends of the two heat-conducting pipes 340 are connected via one micropump 360, and the second ends of the two heat-conducting pipes 340 are connected via another micropump 360. The two micropumps 360 allow the heat dissipation medium to circulate within the two heat-conducting pipes 340, thereby achieving heat balance.

[0201] It should be noted that, when the reflector 300 includes the heat dissipation channel L, the reflector body 300 in the reflector 300 may be made of optical material alone or optical material mixed with heat dissipation material. This embodiment of the present application does not limit this.

[0202] The present embodiment provides a laser projection device, which includes a laser light source 001, an optical engine 002, and the projection lens 003. The structure, function, and working principle of the projection lens 003 have been described in the above embodiments and will not be described in this embodiment.

[0203] In some embodiments of the present application, laser light source 001 is used to provide a laser beam to optical engine 002. Laser light source 001 can be a three-color laser light source capable of emitting red, blue, and green lasers. Optical engine 002 is used to modulate the laser beam to produce an image beam, and then project the image beam into projection lens 003 for imaging. Projection lens 003 is used to project the image onto a projection screen.

[0204] In some embodiments of the present application, the laser light source 001 may also adopt an imaging method of monochromatic laser and multiple phosphor wheels, which is not limited in this embodiment.

[0205] By adopting the above-mentioned projection lens 003, the reflector 300 in the projection lens 003 has a better ability to resist thermal deformation, and the display effect of the laser projection device is better.

[0206] In some embodiments of the present application, in order to enable the laser light source 001 to provide an illumination beam to the optical machine 002, the laser light source 001 has a light outlet, and the surface where the light outlet is located is the connection surface between the laser light source 001 and the optical machine 002. Through the connection surface, the laser light source 001 provides an illumination beam to the optical machine 002.

[0207] At the same time, according to the design of the internal illumination optical path of optical engine 002, optical engine 002 has a light inlet and a light outlet. The light inlet of optical engine 002 is connected to the light outlet of laser light source 001, and the light outlet of optical engine 002 is connected to projection lens 003. The light inlet and light outlet of optical engine 002 are typically located on different sides of optical engine 002 that are perpendicular to each other. The perpendicularity here refers to the perpendicularity in spatial position. The different sides can be different sides of the rectangular parallelepiped optical engine 002 shell or different sides of an irregular three-dimensional structure.

[0208] In some embodiments of the present application, in order to ensure that the various optical components in the entire housing meet the sealing and airtightness requirements, the laser light source 001, the optical engine 002 and the projection lens 003 are each enclosed by a corresponding housing.

[0209] In some embodiments of the present application, the laser projection device may also include multiple circuit boards, located within the space enclosed by the optical engine 002, the projection lens 003, and another portion of the overall device housing. In this case, the optical engine 002 and the projection lens 003 can separate the overall device into two sections: one section can accommodate the laser light source 001, and the other section can accommodate the circuit boards. This division can be considered as separating the optical and electrical components.

[0210] In some embodiments of the present application, the multiple circuit boards include a power board, a TV board, a control board, a display board, and the like. The multiple circuit boards can be stacked flatly, or some can be placed along the bottom surface of the overall housing, while others can be vertically arranged along the sides of the overall housing. The multiple circuit boards are centrally arranged, along the length of the overall housing, along with the aforementioned optical section.

[0211] In some embodiments of the present application, the above-mentioned laser projection equipment also includes multiple structures such as speakers and fans, and the speakers and fan light structures are all arranged in the entire machine casing.

[0212] It should be noted that the optical section also typically includes a driver circuit. However, since this circuit is smaller and less complex than the display board, signal board, and power board, the driver circuit on the laser light source 001 side can be considered the optical section, while the circuit board side is the electrical section. This separate arrangement of the different main units not only facilitates assembly and debugging of the entire system, but also facilitates the design requirements of the optical and electrical sections, such as heat dissipation, wiring, and electromagnetic testing.

[0213] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

[0214] For ease of explanation, the above description has been made with reference to specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations are possible. The above embodiments are selected and described to better explain the principles and practical applications, so that those skilled in the art can better utilize the embodiments and various different variations of the embodiments suitable for specific use considerations.

Claims

1. A projection lens, characterized in that: include: lens mounts, lens assemblies, and reflectors; The lens assembly is arranged on the lens mount and is used to image the incident image light beam; The reflector is arranged on the lens holder, and the material of the reflector includes an optical material and a heat dissipation material, and the thermal conductivity of the heat dissipation material is greater than the thermal conductivity of the optical material; The reflector has a reflective surface, which is arranged opposite to the exit end of the lens assembly and faces the lens assembly, and is used to reflect the imaging light beam emitted from the exit end.

2. The projection lens according to claim 1, characterized in that: The reflector is a lens-like structure made by mixing the optical material with the heat dissipation material.

3. The projection lens according to claim 2, characterized in that: The thermal conductivity of the heat dissipation material is greater than or equal to 5 W / (m*K).

4. The projection lens according to claim 2, characterized in that: The thermal expansion coefficient of the heat dissipation material is less than or equal to 60*10 -6 ℃.

5. The projection lens according to claim 2, characterized in that: The heat dissipation material is in powder form, and the diameter of the heat dissipation material is less than or equal to 100 μm.

6. The projection lens according to any one of claims 2 to 5, characterized in that: The heat dissipation material includes one or more of graphene, carbon fiber and metal material.

7. The projection lens according to claim 1, wherein: The reflector comprises: a reflective body and a heat-conducting member connected to the reflector body; the reflector body has the reflective surface on a side facing the lens assembly; Wherein, the reflector body is at least formed by the optical material, and the heat conducting member is formed by at least a part of the heat dissipation material.

8. The projection lens according to claim 7, characterized in that: The heat conducting member is arranged on a side of the reflector body away from the reflecting surface; or, the heat conducting member is embedded in the interior of the reflector body.

9. The projection lens according to claim 8, characterized in that: In the case where the heat conducting member is arranged on a side of the reflector body away from the reflective surface, the side of the reflector body away from the reflective surface has a first mounting groove, and at least a portion of the heat conducting member is located in the first mounting groove.

10. The projection lens according to claim 8, characterized in that: In the case where the heat conducting component is embedded in the interior of the reflector body, the interior of the reflector body has a bearing cavity, and the heat conducting component is located in the bearing cavity.

11. The projection lens according to claim 10, characterized in that: The reflector is a lens-like structure with the heat-conducting member disposed inside and formed outside by injection molding.

12. The projection lens according to any one of claims 7 to 11, characterized in that: The heat dissipation material includes: a first heat dissipation material and a second heat dissipation material; the reflector body is a lens-like structure made of the optical material mixed with the first heat dissipation material; and the heat conductive element is a solid structure made of the second heat dissipation material.

13. The projection lens according to any one of claims 1 to 5 and 7 to 11, characterized in that: The reflector has a first temperature region and a second temperature region, the optical power density corresponding to the first temperature region is greater than the optical power density corresponding to the second temperature region, and the heat dissipation material is distributed at least in the first temperature region.

14. A projection lens, characterized in that: include: lens mounts, lens assemblies, and reflectors; The lens assembly is arranged on the lens mount and is used to image the incident image light beam; The reflector is arranged on the lens seat, and the reflector has a heat dissipation channel and a heat dissipation medium distributed in the heat dissipation channel; Wherein, the reflector further has a reflecting surface, which is arranged opposite to the exit end of the lens assembly and faces the lens assembly, and is used to reflect the imaging light beam emitted from the exit end.

15. The projection lens according to claim 14, characterized in that: The reflector comprises: a reflector body and a heat-conducting pipe; the reflector body has the reflecting surface on the side facing the lens assembly, the heat-conducting pipe is located on the side of the reflector body away from the reflecting surface, and the heat-conducting pipe has the heat dissipation channel for accommodating the heat dissipation medium.

16. The projection lens according to claim 14, wherein: The reflector comprises: a reflector body and a cover; the reflector body has the reflective surface on a side facing the lens assembly; the cover is connected to a side of the reflector body away from the reflective surface; the cover and the reflector body can enclose the heat dissipation channel for accommodating the heat dissipation medium.

17. The projection lens according to any one of claims 14 to 16, characterized in that: The reflector further comprises a micro pump, and the micro pump is used to drive the heat dissipation medium to circulate inside the heat dissipation channel.

18. The projection lens according to claim 17, characterized in that: The heat dissipation medium includes a phase change medium; or, the heat dissipation medium includes a heat conduction fluid and heat conduction particles mixed into the heat conduction fluid.

19. The projection lens according to any one of claims 14 to 16 and 18, characterized in that: The reflector has a first temperature zone and a second temperature zone, the optical power density corresponding to the first temperature zone is greater than the optical power density corresponding to the second temperature zone, and the heat dissipation channel is distributed at least in the first temperature zone.

20. A laser device, characterized in that: It comprises: a laser light source, an optical machine and a projection lens as described in any one of claims 1 to 19, wherein the laser light source is used to provide a laser beam to the optical machine, the optical machine is used to modulate the laser beam to obtain an image beam, and project the image beam into the ultra-short focus lens for imaging to obtain an imaging beam, and the projection lens is used to project the image onto a projection screen.

Images