Display device and method for manufacturing same, and electronic apparatus

Abstract

Provided is a display device capable of improving light extraction efficiency.　This display device is provided with: a plurality of light-emitting elements that are two-dimensionally arranged; and a wall part that has a first reflective surface that reflects light from one of adjacent light-emitting elements, and a second reflective surface that reflects light from the other of the adjacent light-emitting elements, the first reflective surface and the second reflective surface having at least one dissimilar feature.

Description

Display device, manufacturing method thereof, and electronic device

[0001] The present disclosure relates to a display device, a manufacturing method thereof, and an electronic device.

[0002] In display devices, light emitted from light-emitting elements at a wide angle may not be extracted from the front, resulting in a decrease in light extraction efficiency. For this reason, in recent years, technologies have been studied that focus light on a pixel to improve light extraction efficiency.

[0003] For example, Patent Document 1 discloses a technique for improving light extraction efficiency by providing reflectors (reflecting portions) between light-emitting elements and guiding the emitted light of the light-emitting elements toward the upper surface.

[0004] JP 2013-191533 A

[0005] An object of the present disclosure is to provide a display device capable of improving light extraction efficiency and an electronic device including the same.

[0006] In order to solve the above-mentioned problems, the display device according to the present disclosure comprises: a plurality of light-emitting elements arranged two-dimensionally; and a wall portion having a first reflective surface that reflects light from one of the adjacent light-emitting elements, and a second reflective surface that reflects light from the other of the adjacent light-emitting elements, wherein at least one characteristic of the first reflective surface and the second reflective surface is different.

[0007] The manufacturing method of the display device according to the present disclosure includes a step of forming a first reflecting surface on the side of one of adjacent light-emitting element formation regions, and a step of forming a second reflecting surface on the side of the other of the adjacent light-emitting element formation regions, and at least one characteristic of the first reflecting surface and the second reflecting surface is different.

[0008] FIG. 1 is a plan view of a display device according to a first embodiment. FIG. 2 is a plan view showing an enlarged portion of the display region. FIG. 3A is a cross-sectional view taken along line IIIA-IIIA in FIG. 2. FIG. 3B is a cross-sectional view taken along line IIIB-IIIB in FIG. 2. FIG. 3C is a cross-sectional view of a peripheral region. FIG. 3D is a cross-sectional view of a display device according to a modified example. FIG. 4 is a cross-sectional view of an OLED (Organic Light Emitting Diode) layer. FIG. 5A is a cross-sectional view of a wall portion. FIG. 5B is a plan view of the wall portion. FIG. 6A is a cross-sectional view of a manufacturing process of the display device according to the first embodiment. FIG. 6B is a cross-sectional view of a manufacturing process of the display device according to the first embodiment. FIG. 6C is a cross-sectional view of a manufacturing process of the display device according to the first embodiment. FIG. 6D is a cross-sectional view of a manufacturing process of the display device according to the first embodiment. FIG. 6E is a cross-sectional view of a manufacturing process of the display device according to the first embodiment. FIG. 6F is a cross-sectional view of a manufacturing process of the display device according to the first embodiment. FIG. 6G is a cross-sectional view of a manufacturing process of the display device according to the first embodiment. FIG. 6H is a cross-sectional view of a manufacturing process of the display device according to the first embodiment. FIG. 6I is a cross-sectional view of a manufacturing process of the display device according to the first embodiment. FIG. 6J is a cross-sectional view of a manufacturing process of the display device according to the first embodiment. FIG. 7 is a cross-sectional view of a display device according to a second embodiment. FIG. 8 is a cross-sectional view of a display device according to a third embodiment. FIG. 9 is a cross-sectional view of a display device according to a fourth embodiment. FIG. 10A is a cross-sectional view of a display device according to a fifth embodiment. FIG. 10B is a cross-sectional view of a display device according to the fifth embodiment. FIG. 11A is a cross-sectional view of an OLED layer having a single light-emitting unit. FIG. 11B is a cross-sectional view of an OLED layer having two light-emitting units. FIG. 12 is a cross-sectional view of an OLED layer having a single light-emitting unit. FIG. 13A is a cross-sectional view of a display device according to a modified example. FIG. 13B is a cross-sectional view of a display device according to a modified example. FIG. 13C is a cross-sectional view of a display device according to a modified example. FIG. 13D is a cross-sectional view of a display device according to a modified example. FIG. 13E is a cross-sectional view of a display device according to a modified example. FIG. 14 is a cross-sectional view of a display device according to a modified example. FIG. 15 is a cross-sectional view of an edge of a protective layer. FIG. 16 is a cross-sectional view of a display device according to a modified example. FIG. 17A is a cross-sectional view of a first example of a color filter.FIG. 17B is a cross-sectional view of a second example of a color filter. FIG. 18 is a cross-sectional view of a light-shielding layer. FIG. 19A is a cross-sectional view of a display device according to a modified example. FIG. 19B is a cross-sectional view of a display device according to a modified example. FIG. 20 is a cross-sectional view of a display device according to a modified example. FIG. 21 is a cross-sectional view of a display device according to a modified example. FIG. 22 is a schematic view of an optical system. FIG. 23 is a schematic view of an optical system. FIG. 24A is a cross-sectional view of a display device according to a modified example. FIG. 24B is a cross-sectional view of a display device according to a modified example. FIG. 24C is a cross-sectional view of a display device according to a modified example. FIG. 24D is a cross-sectional view of a display device according to a modified example. FIG. 24E is a cross-sectional view of a display device according to a modified example. FIG. 25A is a plan view of a first example of the shape and arrangement pattern of sub-pixels. FIG. 25B is a plan view of a second example of the shape and arrangement pattern of sub-pixels. FIG. 25C is a plan view of a third example of the shape and arrangement pattern of sub-pixels. FIG. 25D is a plan view of a fourth example of the shape and arrangement pattern of sub-pixels. FIG. 25E is a plan view of a fifth example of the shape and arrangement pattern of sub-pixels. FIG. 25F is a plan view of a sixth example of the shape and arrangement pattern of the subpixels. FIG. 25G is a plan view of a seventh example of the shape and arrangement pattern of the subpixels. FIG. 26A is a plan view of an eighth example of the shape and arrangement pattern of the subpixels. FIG. 26B is a plan view of a ninth example of the shape and arrangement pattern of the subpixels. FIG. 26C is a plan view of a tenth example of the shape and arrangement pattern of the subpixels. FIG. 26D is a plan view of an eleventh example of the shape and arrangement pattern of the subpixels. FIG. 27 is a cross-sectional view of a first example of a leakage suppression structure. FIG. 28 is a cross-sectional view of a second example of a leakage suppression structure. FIG. 29 is a cross-sectional view of a third example of a leakage suppression structure. FIG. 30 is a cross-sectional view of a fourth example of a leakage suppression structure. FIG. 31 is a cross-sectional view of a fifth example of a leakage suppression structure. FIG. 32 is a cross-sectional view of a sixth example of a leakage suppression structure. FIG. 33 is a cross-sectional view of a seventh example of a leakage suppression structure. FIG. 34 is an enlarged cross-sectional view of the groove shown in FIG. 33. Fig. 35 is a cross-sectional view of an eighth example of the leakage suppression structure, Fig. 36 is a cross-sectional view of a ninth example of the leakage suppression structure, and Fig. 37 is a plan view for explaining the arrangement of the first electrode and the third electrode.38A, 38B, and 38C are conceptual diagrams for explaining the relationship between a normal LN passing through the center of the light-emitting section, a normal LN' passing through the center of the lens member, and a normal LN" passing through the center of the wavelength selecting section. FIG. 39 is a conceptual diagram for explaining the relationship between a normal LN passing through the center of the light-emitting section, a normal LN' passing through the center of the lens member, and a normal LN" passing through the center of the wavelength selecting section. FIGS. 40A and 40B are conceptual diagrams for explaining the relationship between a normal LN passing through the center of the light-emitting section, a normal LN' passing through the center of the lens member, and a normal LN" passing through the center of the wavelength selecting section. FIG. 41 is a conceptual diagram for explaining the relationship between a normal LN passing through the center of the light-emitting section, a normal LN' passing through the center of the lens member, and a normal LN" passing through the center of the wavelength selecting section. FIG. 42A is a schematic cross-sectional view for explaining a first example of a resonator structure. FIG. 42B is a schematic cross-sectional view for explaining a second example of a resonator structure. FIG. 43A is a schematic cross-sectional view for explaining a third example of a resonator structure. FIG. 43B is a schematic cross-sectional view illustrating a fourth example of a resonator structure. FIG. 44A is a schematic cross-sectional view illustrating a fifth example of a resonator structure. FIG. 44B is a schematic cross-sectional view illustrating a sixth example of a resonator structure. FIG. 45 is a schematic cross-sectional view illustrating a seventh example of a resonator structure. FIG. 46A is a front view of a digital still camera. FIG. 46B is a rear view of a digital still camera. FIG. 47 is a perspective view of a head-mounted display. FIG. 48 is a perspective view of a television device. FIG. 49 is a perspective view of a see-through head-mounted display. FIG. 50 is a perspective view of a smartphone. FIG. 51A is a view showing the interior of a vehicle from the rear to the front of the vehicle. FIG. 51B is a view showing the interior of a vehicle from diagonally rear to diagonally front of the vehicle.

[0009] Embodiments of the present disclosure will be described in the following order. 1. General Description of the Display Device and Manufacturing Method Thereof According to the Present Disclosure 2. First Embodiment (Example of a Display Device) 3. Second Embodiment (Example of a Display Device) 4. Third Embodiment (Example of a Display Device) 5. Fourth Embodiment (Example of a Display Device) 6. Fifth Embodiment (Example of a Display Device) 7. Modifications 8. Example of a Leakage Suppression Structure 9. Relationship between Normals Passing Through the Centers of the Light-Emitting Section, Lens Member, and Wavelength Selecting Section 10. Example of a Resonator Structure 11. Application Example (Example of an Electronic Device) The embodiments described below are preferred specific examples of the present disclosure, and the contents of the present disclosure are not limited to these embodiments. Note that in all drawings of the following embodiments, the same or corresponding parts are denoted by the same reference numerals. Furthermore, to prevent the illustrations from becoming too complicated, reference numerals may be used only for some of the components, or the illustrations may be simplified or enlarged or reduced.

[0010] <1 General Description of the Display Device and Manufacturing Method Thereof According to the Present Disclosure> In the display device according to the present disclosure, the wall portion is preferably provided around the other light-emitting element in plan view. This allows the distance between adjacent light-emitting elements to be narrowed. Therefore, the light extraction efficiency of the display device can be improved while suppressing the effect of the formation of the wall portion on the resolution of the light-emitting element (i.e., pixel resolution). This makes it possible to achieve both high resolution and high brightness.

[0011] In the display device according to the present disclosure, the second reflective surface is preferably provided on the other light-emitting element, which allows the distance between adjacent light-emitting elements to be narrowed, thereby achieving both high definition and high brightness as described above.

[0012] In the display device according to the present disclosure, it is preferable that the light-emitting element includes a first electrode, a light-emitting layer, and a second electrode, and the wall portion is provided adjacent to a side surface of the light-emitting layer and a side surface of the second electrode included in the other light-emitting element, thereby narrowing the distance between adjacent light-emitting elements and achieving both high definition and high brightness as described above.

[0013] In the display device according to the present disclosure, the at least one feature of the first and second reflecting surfaces preferably includes at least one of the following features: (1) the inclination angle of the first reflecting surface is different from the inclination angle of the second reflecting surface, (2) the width of the first reflecting surface in a plan view is different from the width of the second reflecting surface in a plan view, and (3) the area of ​​the first reflecting surface in a plan view is different from the area of ​​the second reflecting surface in a plan view. This allows for individual adjustment of light extraction between one light-emitting element and the other light-emitting element among adjacent light-emitting elements.

[0014] More specifically, in the display device according to the present disclosure, at least one characteristic of the first reflective surface and the second reflective surface preferably includes at least one of the following characteristics: (1) the inclination angle of the first reflective surface is smaller than the inclination angle of the second reflective surface; (2) the width of the first reflective surface in a plan view is larger than the width of the second reflective surface in a plan view; and (3) the area of ​​the first reflective surface in a plan view is larger than the area of ​​the second reflective surface in a plan view. This makes it easier to reflect light from one of the adjacent light-emitting elements upward. Therefore, the light extraction efficiency from the one light-emitting element can be improved.

[0015] In the display device according to the present disclosure, the plurality of light-emitting elements may include, for example, a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, where one of the light-emitting elements is the first light-emitting element or the second light-emitting element and the other of the light-emitting elements is the third light-emitting element. The first light-emitting element, the second light-emitting element, and the third light-emitting element may emit light of different colors. For example, the first light-emitting element may be configured to emit red light, the second light-emitting element may be configured to emit green light, and the third light-emitting element may be configured to emit blue light.

[0016] In the display device according to the present disclosure, the plurality of light-emitting elements may further include at least one of a plurality of fourth light-emitting elements and a plurality of fifth light-emitting elements. The fourth light-emitting element is configured to emit visible light other than red, green, and blue light, such as white light. The fifth light-emitting element is configured to emit light in a wavelength range other than the visible light range, such as infrared light.

[0017] In the display device according to the present disclosure, the third light-emitting element is preferably disposed so as to surround the first light-emitting element and the second light-emitting element in a plan view, whereby the first light-emitting element and the second light-emitting element are each surrounded by the first reflective surface of the wall portion, thereby improving the light extraction efficiency of the first light-emitting element and the second light-emitting element.

[0018] In the display device according to the present disclosure, the area of ​​the light-emitting region of the third light-emitting element in a planar view is preferably larger than the areas of the light-emitting regions of the first light-emitting element and the second light-emitting element in a planar view. This makes it possible to maintain the luminance of the third light-emitting element while keeping the driving current density or driving voltage of the third light-emitting element low. Therefore, the driving life of the third light-emitting element can be improved. Blue OLED elements have a shorter life than red OLED elements, green OLED elements, etc. Therefore, when the third light-emitting element is a blue OLED element, it is preferable that the first light-emitting element, the second light-emitting element, and the third light-emitting element have the above-mentioned relationship in the areas of their light-emitting regions.

[0019] In the display device according to the present disclosure, it is preferable that the first light-emitting element is a red OLED element configured to emit red light, the second light-emitting element is a green OLED element configured to emit green light, and the third light-emitting element is a blue inorganic LED element configured to emit blue light. Blue OLED elements have a shorter lifespan than red OLED elements and green OLED elements. Therefore, by using a blue inorganic LED element instead of a blue OLED element for the third light-emitting element, it is possible to suppress a decrease in the lifespan of the third light-emitting element. Therefore, it is possible to suppress a decrease in the lifespan of the display device.

[0020] In the display device according to the present disclosure, the plurality of light-emitting elements include at least one type of self-luminous light-emitting element selected from the group consisting of, for example, LED elements (inorganic LED elements, OLED elements, etc.), IEL (Inorganic Electro-Luminescence) elements, QLED (Quantum Dot Light Emitting Diode) elements, semiconductor laser elements, etc. The plurality of light-emitting elements may include, for example, at least one type of inorganic LED elements and OLED elements among the above light-emitting elements.

[0021] In the display device according to the present disclosure, it is preferable that the partition wall includes a portion of a layer of one of the light-emitting elements, and that the portion of the layer of the one of the light-emitting elements extends to the wall portion and forms the first reflective surface. This allows the portion of the layer of the one of the light-emitting elements and the first reflective surface of the partition wall to be formed in the same process. The portion of the layer of the one of the light-emitting elements may be an electrode or an organic-material-containing layer included in the one of the light-emitting elements. It is preferable that the electrode also serves as a reflective layer. It is preferable that the organic-material-containing layer also serves as a low-refractive-index layer having a refractive index lower than that of a first protective layer covering the first reflective surface.

[0022] In the display device according to the present disclosure, it is preferable that one of the light-emitting elements includes a hole injection layer, and the hole injection layer extends to the wall portion to form the first reflective surface. This allows the hole injection layer of the one light-emitting element and the first reflective surface of the partition wall to be formed in the same process. It is preferable that the hole injection layer also serves as a low-refractive index layer having a refractive index lower than that of the first protective layer covering the first reflective surface.

[0023] In the display device according to the present disclosure, it is preferable that one of the light-emitting elements includes an electrode, and the electrode extends to the wall portion to form the first reflective surface. This allows the electrode of the one light-emitting element and the first reflective surface of the wall portion to be formed in the same process. It is preferable that the electrode also serves as a reflective layer such as a metal layer.

[0024] In the display device according to the present disclosure, it is preferable that a first protective layer covering the first reflective surface is further provided, and that the wall portion includes a low-refractive index layer having the first reflective surface, the refractive index of the low-refractive index layer being lower than the refractive index of the first protective layer, thereby enabling light from one of the light-emitting elements that is incident on the first reflective surface at an incident angle equal to or greater than a predetermined angle to be totally reflected by the first reflective surface.

[0025] The low refractive index layer is made of, for example, silicon oxide (SiO ｘ ), silicon oxynitride (SiO ｘ N ｙ ), magnesium fluoride (MgF ｘ ) and lithium fluoride (LiF ｘ The first protective layer covering the first reflective surface of the low refractive index layer is a high refractive index layer having a higher refractive index than the low refractive index layer, and includes at least one selected from the group consisting of silicon nitride (SiN ｘ ), aluminum oxide (AlO ｘ ), titanium oxide (TiO ｘ ) and niobium oxide (NbO ｘ ) and at least one selected from the group consisting of

[0026] In the display device according to the present disclosure, the wall portion preferably includes a metal layer having a first reflective surface, whereby light from one of the light-emitting elements can be reflected by the first reflective surface regardless of the incident angle.

[0027] In the display device according to the present disclosure, the wall portion may be a part of a first protective layer covering the plurality of light-emitting elements. In this case, it is preferable that the refractive index of the first protective layer decreases from one of the adjacent light-emitting elements to the other of the adjacent light-emitting elements across the first reflective surface. This allows light from one of the light-emitting elements that is incident on the first reflective surface at an incident angle equal to or greater than a predetermined angle to be totally reflected by the first reflective surface.

[0028] The display device according to the present disclosure further includes a third electrode covering the second reflective surface and connected to the plurality of light-emitting elements, and a second protective layer provided on the third electrode, the refractive index of the second protective layer being preferably higher than the refractive index of the third electrode, such that light from the other light-emitting element that is incident on the third electrode at an incident angle equal to or greater than a predetermined angle can be totally reflected by the third electrode.

[0029] In the display device according to the present disclosure, the light-emitting element preferably includes a first electrode, a light-emitting layer, and a second electrode, in that order, and the bottom of the wall portion is preferably provided on the first electrode. This allows the distance between adjacent light-emitting elements to be narrowed. Furthermore, since light emitted from the light-emitting layer in an upward or lateral direction can be reflected by the second reflective surface, the light extraction efficiency of the display device can be improved.

[0030] In the display device according to the present disclosure, it is preferable that the lower end of the first reflective surface is located at a position lower than one of the light-emitting elements. This allows light emitted obliquely downward from the light-emitting element to be reflected by the second reflective surface, thereby improving the light extraction efficiency of the display device. When the lower end of the first reflective surface is located at a position lower than one of the light-emitting elements as described above, a groove may be provided between adjacent light-emitting elements, and the lower end of the first reflective surface may be located within this groove.

[0031] In the display device according to the present disclosure, one or both of the first and second reflective surfaces of the wall portion may include a curved surface. One or both of the first and second reflective surfaces of the wall portion may have a stepped shape. One or both of the first and second reflective surfaces of the wall portion may have a single-layer structure or a multi-layer structure. One or both of the first and second reflective surfaces of the wall portion may be divided at one or more positions in the height direction of the wall portion.

[0032] The display device according to the present disclosure includes a first electrode, a light-emitting layer, and a second electrode, and the light-emitting layer and the second electrode may be connected between adjacent light-emitting elements. A display device having such a configuration is more productive and easier to achieve high definition than a display device in which the light-emitting layer and the second electrode are separated for each subpixel. In a display device having the above configuration, the wall portion is preferably provided at a position higher than the light-emitting elements. More specifically, for example, the wall portion is preferably provided on or above the second electrode.

[0033] The display device according to the present disclosure may include at least one optical element selected from the group consisting of a lens array and a color filter. The optical element may be encapsulated in an inorganic protective layer. More specifically, two inorganic protective layers may be provided to cover the top and bottom of the optical element in the display area, and the two inorganic protective layers may be connected to each other in the peripheral area of ​​the display area. The inorganic protective layer encapsulating the optical element may have a multi-layer structure. In this case, outgassing from inside the display device and moisture intrusion from outside the display device can be further reduced, thereby improving panel reliability.

[0034] The display device according to the present disclosure may be included in an electronic device. For example, the display device according to the present disclosure may be included in an eyewear device such as a virtual reality (VR) device, a mixed reality (MR) device, or an augmented reality (AR) device, or may be included in an electronic viewfinder (EVF) or a small projector. Eyewear devices also include headsets.

[0035] In the manufacturing method of a display device according to the present disclosure, the first reflective surface is preferably formed around the other light-emitting element forming region, thereby making it possible to reduce the distance between adjacent light-emitting elements.

[0036] In the manufacturing method of the display device according to the present disclosure, the second reflective surface is preferably provided adjacent to a side surface of the light-emitting layer and a side surface of the second electrode included in the light-emitting element formed in the other light-emitting element formation region, thereby reducing the distance between adjacent light-emitting elements.

[0037] In this disclosure, the refractive index refers to the refractive index for light with a wavelength of 589.3 nm (the D line of sodium).

[0038] In the present disclosure, "on member A" in a description such as "member B is provided on member A" indicates the relative positional relationship between member A and member B, and includes not only a state in which member B is located directly on member A without any other member therebetween, but also a state in which member B is located on member A with at least one other member therebetween.

[0039] In the present disclosure, "A is a member a １ and member a ２ and...member a ｎ－１ and member a ｎ "having (or including) in order" means that the member a １ , member a ２ , member a ｎ－１ and member a ｎ is arranged in this order, and the member a ｎ－１ and member a ｎ This does not deny that there are other elements between them.

[0040] 2 First Embodiment [Schematic Configuration of Display Device 101] Fig. 1 is a plan view of a display device 101 according to a first embodiment. The display device 101 has a display region RE1 and a peripheral region RE2 provided around the display region RE1. In the first embodiment, an example will be described in which the display device 101 is a top-emission type (top-emitting type) OLED display device, but the type and type of the display device 101 are not limited to this example. The display device 101 may also be a microdisplay.

[0041] In this specification, the first and second directions that are orthogonal to each other within the display surface of the display device 101 are referred to as the X-axis direction and the Y-axis direction, respectively, and the third direction that is perpendicular to the display surface of the display device 101 is referred to as the Z-axis direction. In the first embodiment, an example will be described in which the X-axis direction is the horizontal direction of the display surface and the Y-axis direction is the vertical direction of the display surface.

[0042] FIG. 2 is an enlarged plan view showing a portion of the display region RE1. A plurality of sub-pixels 10R, 10G, and 10B are two-dimensionally arranged in a predetermined arrangement pattern within the display region RE1. In FIG. 2, areas labeled "R," "G," and "B" represent the sub-pixels 10R, 10G, and 10B, respectively. In the first embodiment, an example in which the predetermined arrangement pattern is a grid arrangement (matrix arrangement) as shown in FIG. 2 will be described, but the arrangement pattern is not limited to this example. A pad unit 113 and a driver (not shown) for displaying images are provided in the peripheral region RE2. A flexible printed circuit (FPC) (not shown) may be connected to the pad unit 113.

[0043] The sub-pixel 10R can emit red light (first light). The sub-pixel 10G can emit green light (second light). The sub-pixel 10B can emit blue light (third light). In the following description, when the sub-pixels 10R, 10G, and 10B are referred to collectively without any particular distinction, the sub-pixels 10R, 10G, and 10B may be simply referred to as sub-pixels 10. In the first embodiment, one pixel is composed of a plurality of four sub-pixels 10R, 10G, 10B, and 10B. However, the configuration of one pixel is not limited to this example.

[0044] In the first embodiment, the subpixel 10 has a square shape in a plan view, as shown in FIG. 2 . Here, the square shape is not limited to a square in the strict sense, but includes shapes that are visually perceived as being close to a square. For example, the square shape includes a shape that is a distorted or deformed square within the range of tolerance, error, etc., and a shape with rounded corners of a square. In the first embodiment, the subpixels 10R, 10G, and 10B have the same size in a plan view.

[0045] [Layer Structure of Display Device 101] Figure 3A is a cross-sectional view taken along line IIIA-IIIA in Figure 2. Figure 3B is a cross-sectional view taken along line IIIB-IIIB in Figure 2. Figure 3C is a cross-sectional view of a peripheral region RE2 of the display device 101. The display device 101 includes a drive circuit board 11, a plurality of light-emitting elements 12R, 12G, and 12B, an insulating layer 13, a contact electrode 14, a plurality of wall portions 15, a protective layer (first protective layer) 16, a common electrode (third electrode) 17, and a protective layer (second protective layer) 18. Note that in Figure 2, the wall portions 15 are colored gray to make their positions easier to understand.

[0046] In this specification, of the two surfaces of each layer constituting the display device 101, the surface facing the display surface (top side) of the display device 101 may be referred to as the first surface (upper surface), and the surface facing the opposite side (bottom side) of the display device 101 from the display surface may be referred to as the second surface (lower surface). In this specification, the peripheral edge of the display region RE1 refers to a portion having a predetermined width extending from the peripheral edge of the display region RE1 toward the inside. In this specification, the peripheral edge of the first surface refers to a portion having a predetermined width extending from the peripheral edge of the first surface toward the inside. In this specification, the term "planar view" refers to a planar view when an object is viewed from a direction perpendicular to the first surface or the second surface. In this specification, the direction from the drive circuit board 11 toward the display surface in the thickness direction (Z-axis direction) of the display device 101 may be referred to as "upward," and the direction from the display surface toward the drive circuit board 11 in the thickness direction (Z-axis direction) of the display device 101 may be referred to as "downward." In this specification, the term "in-plane direction" refers to the in-plane direction of the first surface of the drive circuit board 11, unless otherwise specified.

[0047] (Drive Circuit Board 11) The drive circuit board 11 is a so-called backplane, and is capable of driving a plurality of light-emitting elements 12. The drive circuit board 11 includes a drive circuit that drives the light-emitting elements 12. The drive circuit is composed of drive transistors, wiring (neither of which is shown), etc. The drive circuit board 11 includes a substrate 111 and an insulating layer 112, in that order.

[0048] A plurality of drive transistors (not shown) and the like are provided on the first surface side of the substrate 111. The substrate 111 may be, for example, a semiconductor substrate on which drive transistors and the like can be easily formed, or a glass substrate or resin substrate with low moisture and oxygen permeability. The semiconductor substrate includes, for example, amorphous silicon, polycrystalline silicon, or single crystal silicon. The glass substrate includes, for example, high strain point glass, soda glass, borosilicate glass, forsterite, lead glass, or quartz glass. The resin substrate includes, for example, at least one selected from the group consisting of polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyether sulfone, polyimide, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate.

[0049] The insulating layer 112 is provided on the first surface of the substrate 111 and covers the plurality of driving transistors and the like. The insulating layer 112 includes therein a plurality of contact plugs 112a, a plurality of contact plugs 112aa, a plurality of wirings (not shown), and a potential supply wiring 112bb. The contact plugs 112a and the wirings (not shown) electrically connect the light-emitting elements 12 and the driving transistors. The plurality of contact plugs 112aa electrically connect the contact electrodes 14 and the potential supply wiring 112bb. The contact plugs 112a and 112aa contain at least one metal selected from the group consisting of, for example, tungsten (W), copper (Cu), titanium (Ti), and the like. The wirings (not shown) and the potential supply wiring 112bb are composed of, for example, a metal layer. The metal layer contains at least one metal selected from the group consisting of, for example, aluminum (Al), tungsten (W), copper (Cu), and the like. A barrier metal may be provided on the surface of the wiring (not shown) and the potential supply wiring 112bb. The barrier metal may be, for example, tantalum (Ta) or tantalum nitride (TaN ｘ ) etc.

[0050] The insulating layer 112 is, for example, an organic insulating layer, an inorganic insulating layer, or a laminate thereof. The organic insulating layer contains, for example, at least one selected from the group consisting of polyimide-based resin, acrylic-based resin, and novolac-based resin. The inorganic insulating layer is, for example, silicon oxide (SiO ｘ ), silicon nitride (SiN ｘ ) and silicon oxynitride (SiO ｘ N ｙ ) and the like.

[0051] (Light-emitting elements 12R, 12G, 12B) The light-emitting elements 12R, 12G, and 12B are OLED elements. The color of light emitted by the light-emitting element 12R, the color of light emitted by the light-emitting element 12G, and the color of light emitted by the light-emitting element 12B are different. The light-emitting element 12R can emit red light under the control of a drive circuit or the like. The light-emitting element 12G can emit green light under the control of a drive circuit or the like. The light-emitting element 12B can emit blue light under the control of a drive circuit or the like. The light-emitting element 12R is an example of a first light-emitting element, the light-emitting element 12G is an example of a second light-emitting element, and the light-emitting element 12B is an example of a third light-emitting element. The light-emitting element 12R and the light-emitting element 12G are examples of "one light-emitting element" in the claims, and the light-emitting element 12B is an example of "the other light-emitting element" in the claims.

[0052] In the first embodiment, the sub-pixels 10R, 10G, and 10B are respectively configured by light-emitting elements 12R, 12G, and 12B. In the following description, when the light-emitting elements 12R, 12G, and 12B are referred to collectively without any particular distinction, the light-emitting elements 12R, 12G, and 12B may be simply referred to as light-emitting elements 12. The multiple light-emitting elements 12 are two-dimensionally arranged on the first surface of the drive circuit substrate 11 in a specified arrangement pattern similar to that of the sub-pixels 10.

[0053] The light-emitting element 12R has a first electrode 121, an OLED layer 122R, and a second electrode 123, which are arranged in this order on the first surface of the drive circuit substrate 11. The light-emitting element 12G has a first electrode 121, an OLED layer 122G, and a second electrode 123, which are arranged in this order on the first surface of the drive circuit substrate 11. The light-emitting element 12B has a first electrode 121, an OLED layer 122B, and a second electrode 123, which are arranged in this order on the first surface of the drive circuit substrate 11. In the following description, when the OLED layers 122R, 122G, and 122B are referred to collectively without being particularly distinguished from one another, the OLED layers 122R, 122G, and 122B may be simply referred to as OLED layers 122. The first electrode 121, the OLED layer 122, and the second electrode 123 are separated for each sub-pixel 10. The isolated second electrode 123 is connected to a common electrode 17 formed over the entire display region RE1.

[0054] The area of ​​the light-emitting region of light-emitting element 12B in a planar view (i.e., the area of ​​the light-emitting region of sub-pixel 10B in a planar view) is larger than the area of ​​the light-emitting region of light-emitting element 12R in a planar view (i.e., the area of ​​the light-emitting region of sub-pixel 10R in a planar view) and the area of ​​the light-emitting region of light-emitting element 12G in a planar view (i.e., the area of ​​the light-emitting region of sub-pixel 10G in a planar view). This makes it possible to keep the current density of light-emitting element 12B low while maintaining the luminance of light-emitting element 12B. Therefore, the driving life of light-emitting element 12B can be improved.

[0055] (First Electrode 121) The first electrode 121 is provided on the second surface side of the OLED layer 122. The first electrode 121 is an individual electrode provided individually for each of the plurality of light-emitting elements 12. That is, the first electrode 121 is divided between adjacent light-emitting elements 12 in the in-plane direction. The periphery of the first electrode 121 is located outside the peripheries of the OLED layer 122 and the second electrode 123 in a plan view. As a result, the periphery of the first surface of the first electrode 121 is exposed and not covered by the OLED layer 122. The first electrode 121 is an anode. When a voltage is applied between the first electrode 121 and the second electrode 123, holes are injected from the first electrode 121 to the OLED layer 122.

[0056] The first electrode 121 preferably includes a metal layer as a reflective layer. The metal layer includes at least one metal element selected from the group consisting of aluminum (Al), silver (Ag), chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), molybdenum (Mo), titanium (Ti), tantalum (Ta), magnesium (Mg), iron (Fe), and tungsten (W). The metal layer may include at least one of the metal elements as a constituent element of an alloy. Specific examples of the alloy include an aluminum alloy or a silver alloy. Specific examples of the aluminum alloy include an aluminum-neodymium alloy (AlNd alloy) or an aluminum-copper alloy (AlCu). The thickness of the first electrode 121 is preferably in the range of 100 nm to 300 nm.

[0057] The first electrode 121 may be configured as a multilayer film. The multilayer film may be, for example, a laminated film in which a metal layer and a transparent conductive oxide layer are laminated in this order on the first surface of the drive circuit substrate 11, or a laminated film in which a metal layer and a hole injection layer are laminated in this order on the first surface of the drive circuit substrate 11.

[0058] The transparent conductive oxide layer contains a transparent conductive oxide, for example, at least one selected from the group consisting of transparent conductive oxides containing indium (hereinafter referred to as "indium-based transparent conductive oxides"), transparent conductive oxides containing tin (hereinafter referred to as "tin-based transparent conductive oxides"), and transparent conductive oxides containing zinc (hereinafter referred to as "zinc-based transparent conductive oxides").

[0059] Examples of indium-based transparent conductive oxides include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium gallium zinc oxide (IGZO), and fluorine-doped indium oxide (IFO). Among these transparent conductive oxides, indium tin oxide (ITO) is particularly preferred. Indium tin oxide (ITO) has a particularly low work function barrier for hole injection into the OLED layer 122, allowing the driving voltage of the display device 101 to be particularly low. Examples of tin-based transparent conductive oxides include tin oxide, antimony-doped tin oxide (ATO), and fluorine-doped tin oxide (FTO). Examples of zinc-based transparent conductive oxides include zinc oxide, aluminum-doped zinc oxide (AZO), boron-doped zinc oxide, and gallium-doped zinc oxide (GZO).

[0060] The hole injection layer includes, for example, an inorganic hole injection material. Examples of the inorganic hole injection material include titanium (Ti) and titanium oxide (TiO Ｘ ), titanium nitride (TiN Ｘ ), molybdenum (Mo) or molybdenum oxide (MoO Ｘ ) and other inorganic materials.

[0061] An underlayer (not shown) may be provided adjacent to the second surface side of the metal layer. The underlayer may be capable of improving the crystal orientation of the metal layer when the metal layer is formed. The underlayer contains, for example, at least one metal element selected from the group consisting of titanium (Ti) and tantalum (Ta). The underlayer may contain the at least one metal element as a constituent element of an alloy or a compound. Specific examples of alloys include titanium alloys and tantalum alloys. Specific examples of compounds include titanium nitride (TiN). Ｘ ) etc.

[0062] (OLED layers 122R, 122G, 122B) The OLED layer 122 is provided between the first electrode 121 and the second electrode 123. The OLED layer 122 is divided between the light-emitting elements 12 adjacent in the in-plane direction, and is provided individually for each of the plurality of light-emitting elements 12. By dividing the OLED layer 122 between the sub-pixels 10, current leakage between the sub-pixels 10 can be suppressed. Furthermore, by sealing the OLED layer 122 for each sub-pixel 10, the reliability of the display device 101 can be improved.

[0063] OLED layer 122R includes an organic light-emitting layer capable of emitting red light (hereinafter referred to as a "red organic light-emitting layer"). OLED layer 122G includes an organic light-emitting layer capable of emitting green light (hereinafter referred to as a "green organic light-emitting layer"). OLED layer 122B includes an organic light-emitting layer capable of emitting blue light (hereinafter referred to as a "blue organic light-emitting layer"). In the following description, when the red organic light-emitting layer, green organic light-emitting layer, and blue organic light-emitting layer are referred to collectively without any particular distinction, the red organic light-emitting layer, green organic light-emitting layer, and blue organic light-emitting layer may be simply referred to as organic light-emitting layers.

[0064] The OLED layers 122R, 122G, and 122B may be formed of a laminate including an organic light-emitting layer, in which case some layers of the laminate (e.g., a hole injection layer, an electron injection layer, etc.) may be inorganic layers.

[0065] OLED layers 122R, 122G, and 122B each have, for example, a single layer of light-emitting units. OLED layer 122R having a single layer of light-emitting units has, for example, as shown in FIG. 4 , a hole injection layer 1221, a hole transport layer 1222, a red organic light-emitting layer 1223R, an electron transport layer 1224, and an electron injection layer 1225, arranged in this order from first electrode 121 to second electrode 123. OLED layer 122G having a single layer of light-emitting units has a similar configuration to OLED layer 122R, except that it has, for example, a green organic light-emitting layer 1223G as an organic light-emitting layer, as shown in FIG. 4 . OLED layer 122B having a single layer of light-emitting units has a similar configuration to OLED layer 122R, except that it has, for example, a blue organic light-emitting layer 1223B as an organic light-emitting layer, as shown in FIG. 4 . However, the configurations of OLED layers 122R, 122G, and 122B are not limited to the above example. For example, the electron injection layer 1225 does not have to be provided between the electron transport layer 1224 and the second electrode 123 .

[0066] The OLED layers 122R, 122G, and 122B are not limited to those having a single light-emitting unit, and may have two light-emitting units (tandem structure) or other structures. The OLED layers 122R, 122G, and 122B having two light-emitting units may have, for example, a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, a charge generation layer, a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, and an electron injection layer, in this order from the first electrode 121 to the second electrode 123.

[0067] When an electric field is applied between the first electrode 121 and the second electrode 123, holes are injected from the first electrode 121 into the organic light-emitting layer 1223 via the hole injection layer 1221 and the hole transport layer 1222. Also, electrons are injected from the second electrode 123 into the organic light-emitting layer 1223 via the electron injection layer 1225 and the electron transport layer 1224.

[0068] The hole injection layer 1221 can increase the efficiency of hole injection from the first electrode 121 to the organic light emitting layer 1223 and suppress leakage. The hole injection layer 1221 contains, for example, hexaazatriphenylene (HAT).

[0069] The hole transport layer 1222 can increase the efficiency of hole transport from the first electrode 121 to the organic light emitting layer 1223. The hole transport layer 1222 contains, for example, α-NPD [N,N'-di(1-naphthalyl)-N,N'-diphenyl-[1,1'-biphenyl]-4,4'-diamine].

[0070] The red organic light-emitting layer 1223R can emit red light by recombination of holes injected from the first electrode 121 and electrons injected from the second electrode 123. The red organic light-emitting layer 1223R includes a red light-emitting material. The red light-emitting material may be fluorescent or phosphorescent. Specific examples of the red organic light-emitting material include 4,4-bis(2,2-diphenylvinyl)biphenyl (DPVBi) mixed with 30% by weight of 2,6-bis[(4'-methoxydiphenylamino)styryl]-1,5-dicyanonaphthalene (BSN).

[0071] The green organic light-emitting layer 1223G can emit green light by recombination of holes injected from the first electrode 121 and electrons injected from the second electrode 123. The green organic light-emitting layer 1223G includes a green light-emitting material. The green light-emitting material may be fluorescent or phosphorescent. Specifically, the green organic light-emitting layer 1223G includes, for example, DPVBi mixed with 5 wt % coumarin 6.

[0072] The blue organic light-emitting layer 1223B can emit blue light by recombination of holes injected from the first electrode 121 and electrons injected from the second electrode 123. The blue organic light-emitting layer 1223B includes a blue light-emitting material. The blue light-emitting material may be fluorescent or phosphorescent. Specifically, the blue organic light-emitting layer 1223B includes, for example, a mixture of DPVBi and 2.5 wt % of 4,4'-bis[2-{4-(N,N-diphenylamino)phenyl}vinyl]biphenyl (DPAVBi).

[0073] The electron transport layer 1224 can improve the efficiency of transporting electrons from the second electrode 123 to the organic light emitting layer 1223. The electron transport layer 1224 can be formed of, for example, BCP (2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline), Alq ３(aluminum quinolinol) and Bphen (bathophenanthroline).

[0074] The electron transport layer 1224 is composed of at least one layer, and includes, for example, an electron transport material in which a dopant material is doped into a host material by co-evaporation or the like. Examples of the host material include BCP (2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline), Alq ３ The dopant material includes at least one selected from the group consisting of alkali metals and alkaline earth metals. The alkali metal includes at least one selected from the group consisting of lithium (Li), sodium (Na), potassium (K), rubidium (Rb), and cesium (Cs). The alkaline earth metal includes at least one selected from the group consisting of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba). The doping amount of the dopant material is, for example, in the range of 0.5% by weight to 15% by weight.

[0075] The electron injection layer 1225 can increase the efficiency of electron injection from the second electrode 123 to the organic light-emitting layer 1223. The electron injection layer 1225 contains, for example, an alkali metal, an alkaline earth metal, or a rare earth metal, or a compound containing at least one of these. Specifically, the electron injection layer 1225 contains, for example, lithium (Li), lithium fluoride (LiF), or a mixture containing at least one of these.

[0076] The OLED layer 122 may further include a buffer layer between the electron transport layer 1224 and the second electrode 123. By including the buffer layer in the OLED layer 122, process damage during the formation of the second electrode 123 can be alleviated. When the OLED layer 122 includes a buffer layer as described above, the OLED layer 122 may or may not include an electron injection layer 1225. The buffer layer includes, for example, an alkali metal, an alkaline earth metal, or a rare earth metal, or a compound containing at least one of these. Specific examples of the buffer layer include magnesium (Mg), magnesium silver alloy (MgAg alloy), calcium (Ca), lithium (Li), lithium fluoride (LiF), lithium carbonate (Li ２ CO ３ ), Cesium (Cs), Cesium carbonate (Cs ２ CO ３ ), ytterbium (Yb), ytterbium oxide (Yb ２ O ３ ), or a mixture containing one or more of them.

[0077] The thickness of the hole injection layer 1221 is preferably in the range of 1 nm to 20 nm. The thickness of the hole transport layer 1222 is preferably in the range of 10 nm to 200 nm. The thickness of the organic light-emitting layer 1223 is preferably in the range of 5 nm to 50 nm. The thickness of the electron transport layer 1224 is preferably in the range of 10 nm to 200 nm.

[0078] (Second electrode 123) The second electrode 123 is provided on the first surface side of the OLED layer 122. The second electrode 123 is an individual electrode provided individually for each of the plurality of light-emitting elements 12. That is, the second electrode 123 is separated between the light-emitting elements 12 adjacent to each other in the in-plane direction. The second electrode 123 substantially coincides with the periphery of the OLED layer 122 in a plan view, and the side surface of the second electrode 123 and the side surface of the OLED layer 122 may be connected to be substantially flush with each other.

[0079] The second electrode 123 is a cathode. When a voltage is applied between the first electrode 121 and the second electrode 123, electrons are injected from the second electrode 123 into the OLED layer 122. The second electrode 123 is translucent to the light (blue light, green light, and red light) emitted from the OLED layer 122. The second electrode 123 is preferably a transparent electrode that is transparent to visible light. In this specification, visible light refers to light in a wavelength range of 360 nm or more and 780 nm or less.

[0080] The second electrode 123 preferably contains a material with good optical transparency and a small work function. The second electrode 123 is composed of, for example, at least one layer of a metal layer and a transparent conductive oxide layer. More specifically, the second electrode 123 is composed of, for example, a metal layer, a transparent conductive oxide layer, or a laminated film of a metal layer and a transparent conductive oxide layer. The thickness of the second electrode 123 is, for example, 3 nm to 500 nm, preferably 3 nm to 100 nm or 10 nm to 500 nm.

[0081] The metal layer contains at least one metal element selected from the group consisting of magnesium (Mg), silver (Ag), calcium (Ca), barium (Ba), lithium (Li), cesium (Cs), indium (In), aluminum (Al), and sodium (Na). The metal layer may contain at least one metal element as a constituent element of an alloy or compound. Specific examples of the alloy include a magnesium-silver alloy (MgAg alloy), a magnesium-aluminum alloy (MgAl alloy), and an aluminum-lithium alloy (AlLi alloy). Specific examples of the compound include lithium fluoride (LiF).

[0082] The metal layer may be a multilayer film, for example, having a first metal layer and a second metal layer in that order. The first metal layer may include, for example, at least one metal element selected from the group consisting of magnesium (Mg), silver (Ag), calcium (Ca), barium (Ba), lithium (Li), cesium (Cs), and indium (In). The first metal layer may include the at least one metal element as a constituent element of an alloy or compound. Specific examples of such alloys include magnesium-silver alloys (MgAg alloys), magnesium-aluminum alloys (MgAl alloys), and aluminum-lithium alloys (AlLi alloys). Specific examples of such compounds include lithium fluoride (LiF). The second metal layer may include, for example, at least one metal element selected from the group consisting of magnesium (Mg) and silver (Ag). The second metal layer may include the at least one metal element as a constituent element of an alloy.

[0083] When the metal layer is a multilayer film, the multilayer film may be composed of the same material. For example, the first metal layer and the second metal layer may both be composed of an alloy metal layer containing magnesium (Mg) and silver (Ag), and the concentrations of the constituent elements of the first metal layer and the second metal layer may be different. For example, the Ag concentration of the first metal layer (lower layer) may be lower than the Ag concentration of the second metal layer (upper layer). This can improve the electron injection from the second electrode 123 to the OLED layer 122 while also improving the light extraction efficiency.

[0084] The transparent conductive oxide layer contains a transparent conductive oxide, which may be the same material as the transparent conductive oxide of the first electrode 121, specifically, for example, indium zinc oxide (IZO).

[0085] (Contact Electrode 14) As shown in Fig. 3C, the contact electrode 14 is provided on the first surface of the drive circuit substrate 11 in the peripheral region RE2. The contact electrode 14 is an auxiliary electrode that connects the common electrode 17 and the potential supply wiring 112bb in the drive circuit substrate 11. The first surface of the contact electrode 14 is electrically connected to the peripheral edge portion of the second surface of the common electrode 17. On the other hand, the second surface of the contact electrode 14 is connected to the potential supply wiring 112bb via a plurality of contact plugs 112aa.

[0086] In a plan view, the contact electrode 14 may have a closed loop shape that surrounds the entire outer periphery of the display region RE1, or may have a partially interrupted loop shape that partially surrounds the outer periphery of the display region RE1.

[0087] The contact electrode 14 is composed of, for example, at least one layer of a metal layer and a transparent conductive oxide layer. More specifically, for example, the contact electrode 14 is composed of a single layer film of a metal layer or a transparent conductive oxide layer, or a laminate film of a metal layer and a transparent conductive oxide layer. The contact electrode 14 preferably has a configuration similar to that of the first electrode 121 described above. In this case, the first electrode 121 and the contact electrode 14 can be formed in the same process, thereby simplifying the manufacturing process of the display device 101.

[0088] Examples of materials contained in the contact electrode 14 include the same materials as those in the above-described first electrode 121. Specifically, examples of materials contained in the metal layer of the contact electrode 14 include the same materials as those in the above-described metal layer of the first electrode 121, and examples of materials contained in the transparent conductive oxide layer of the contact electrode 14 include the same materials as those in the above-described transparent conductive oxide layer of the first electrode 121.

[0089] An underlayer (not shown) may be provided adjacent to the second surface side of the metal layer. Examples of materials contained in the underlayer include the same materials as those of the underlayer of the first electrode 121 described above.

[0090] (Insulating Layer 13) The insulating layer 13 is provided on the first surface of the drive circuit board 11 in a portion between the separated first electrodes 121. The insulating layer 13 is an insulating layer for element isolation, and can insulate between the first electrodes 121 adjacent in the in-plane direction.

[0091] The insulating layer 13 has a plurality of openings 13a in the display region RE1. Each of the plurality of openings 13a is provided corresponding to one of the light-emitting elements 12. While FIGS. 3A and 3B illustrate an example in which each first electrode 121 is provided within the opening 13a, the configuration of the insulating layer 13 is not limited to this example. For example, each opening 13a may be provided on the first surface (the surface facing the OLED layer 122) of the first electrode 121. That is, the periphery of the first surface of each first electrode 121 may be covered by the insulating layer 13. The first electrode 121 and the OLED layer 122 come into contact with each other through the openings 13a. The shape of the openings 13a in a plan view is not particularly limited, and may be, for example, a substantially rectangular, circular, or elliptical shape.

[0092] The insulating layer 13 is also provided on the first surface of the drive circuit board 11, between the first electrode 121 and the contact electrode 14. The insulating layer 13 can provide insulation between the first electrode 121 and the contact electrode 14. The insulating layer 13 has an opening 13b in the peripheral region RE2. The opening 13b is provided corresponding to the contact electrode 14. The opening 13b may be provided on the first surface of the contact electrode 14 (the surface connected to the peripheral portion of the common electrode 17). In other words, the peripheral portion of the first surface of the contact electrode 14 may be covered by the insulating layer 13. The contact electrode 14 and the peripheral portion of the common electrode 17 come into contact with each other through the opening 13b. The opening 13b may have a loop shape similar to that of the contact electrode 14.

[0093] The insulating layer 13 is, for example, an organic insulating layer, an inorganic insulating layer, or a laminate thereof. The organic insulating layer contains, for example, at least one selected from the group consisting of polyimide-based resins, acrylic-based resins, and novolac-based resins. The inorganic insulating layer is, for example, silicon oxide (SiO ｘ ), silicon nitride (SiN ｘ ) and silicon oxynitride (SiO ｘ Nｙ ) and the like.

[0094] (Wall portion 15) Fig. 5A is a cross-sectional view of the wall portion 15. Fig. 5B is a plan view of the wall portion 15. The wall portion 15 can reflect light emitted from the light-emitting element 12, i.e., the OLED layer 122, and direct it upward. The wall portion 15 is provided around each light-emitting element 12B in a plan view, and surrounds each light-emitting element 12B. The light-emitting element 12B surrounded by the wall portion 15 surrounds the light-emitting element 12R on all sides in a plan view, and also surrounds the light-emitting element 12G on all sides in a plan view. The wall portion 15 has a square ring shape in a plan view.

[0095] The wall portion 15 stands on the peripheral edge of the first surface of the first electrode 121 and covers the side surface of the OLED layer 122B of each light-emitting element 12B and the side surface of the second electrode 123. A part of the bottom of the wall portion 15 may protrude from the peripheral edge of the first surface of the first electrode 121 and rest on the first surface of the insulating layer 13. The wall portion 15 may be part of the protective layer 16 that covers the multiple light-emitting elements 12.

[0096] The wall 15 protrudes from the first surface (top surface) of the light-emitting element 12B, and the protruding portion of the wall 15 forms a hole 151 on the first surface of the second electrode 123 of the light-emitting element 12B. The hole 151 is a contact hole for connecting the common electrode 17 to the first surface of the second electrode 123. The hole 151 may be, for example, columnar or inverted frustum-shaped, but the shape of the hole 151 is not limited to these shapes.

[0097] The wall portion 15 has a first reflecting surface 15S １ and the second reflecting surface 15S ２ The first reflecting surface 15S １ is located on the side of one of the adjacent light emitting elements 12R and 12B, the light emitting element 12R, and is configured to be able to reflect the red light emitted from the light emitting element 12R and direct it in the front direction. １ is located on the side of one of the adjacent light emitting elements 12G and 12B, that is, the light emitting element 12G, and is configured to be able to reflect the green light emitted from the light emitting element 12G and direct it in the front direction.

[0098] Second reflective surface 15S ２ is located on the other light emitting element 12B side of the adjacent light emitting elements 12R and 12B, and is configured to be able to reflect the blue light emitted from the light emitting element 12B and direct it toward the front. ２ is located on the other light emitting element 12B side of the adjacent light emitting elements 12G and 12B, and is configured to be able to reflect the blue light emitted from the light emitting element 12B and direct it toward the front.

[0099] First reflective surface 15S １ The first reflecting surfaces 15S surround each of the light emitting elements 12R from all sides in a plan view, and also surround each of the light emitting elements 12G from all sides in a plan view. １ 3A and 3B, the first reflecting surface 15S is an inclined surface inclined with respect to the first surface (the surface on the OLED layer 122 side) of the first electrode 121. １ The first reflecting surface 15S has a tapered shape as a whole. １ The lower end of the insulating layer 13 is located on the first surface of the first electrode 121 .

[0100] Second reflective surface 15S ２ 3A and 3B, the first reflecting surface 15S is a vertical surface perpendicular to the first surface of the first electrode 121, or is an inclined surface inclined with respect to the first surface of the first electrode 121, as shown in FIG. 3D. １ The second reflecting surface 15S has a cylindrical or inversely tapered shape as a whole. ２ The lower end of the light emitting element 12B is located on the first surface of the light emitting element 12B.

[0101] The cross-sectional shape of the wall portion 15 may be, for example, a triangular shape (see FIGS. 3A, 3B, and 3C) or a trapezoidal shape, but is not limited to these shapes. The triangular shape may be a right-angled triangular shape (see FIGS. 3A and 3B). The trapezoidal shape may be a right-angled trapezoid. In the present disclosure, the triangular shape and the trapezoidal shape are not limited to triangular shapes and trapezoidal shapes in the strict mathematical sense, but include shapes that are visually recognized as being close to triangular shapes and trapezoidal shapes. For example, the triangular shape and the trapezoidal shape include triangular shapes and trapezoidal shapes that are distorted or deformed within the range of tolerances, errors, etc.

[0102] First reflective surface 15S １ and the second reflecting surface 15S ２ The at least one feature is different from the first reflecting surface 15S. １ The inclination angle θ １ However, the second reflecting surface 15S ２ The inclination angle θ ２ (2) the first reflecting surface 15S in plan view is smaller than １ Width D １ The second reflecting surface 15S in plan view ２ Width D ２ and (3) the first reflecting surface 15S in plan view is larger than １ Area S １ is the second reflecting surface 15S in plan view ２ Area S ２ and being wider than the first embodiment.

[0103] First reflective surface 15S １ The inclination angle θ １ , second reflective surface 15S ２ The inclination angle θ ２ , the first reflecting surface 15S in plan view １ Width D １ and the second reflecting surface 15S in plan view ２ Width D ２ is measured as follows: First, a cross section (a cross section parallel to the thickness direction of the display device 101) of the display device 101 is cut out by cryo-FIB (Focused Ion Beam) processing or the like, and a thin section is prepared. Next, the prepared thin section is observed by a TEM (Transmission Electron Microscope), and a cross-sectional TEM image is obtained.

[0104] Next, in the acquired cross-sectional TEM image, the bottom surface of the wall portion 15 and the first reflecting surface 15S １ The angle formed with the first reflecting surface 15S is measured, and the angle formed with the first reflecting surface 15S is １ The inclination angle θ １ Next, in the acquired cross-sectional TEM image, the first surface and the second reflecting surface 15S of the light emitting element 12B are ２ The angle formed with the second reflecting surface 15S is measured, and the angle formed with the second reflecting surface 15S is２ The inclination angle θ ２ It is considered to be.

[0105] Next, in the acquired cross-sectional TEM image, the first reflecting surface 15S in the in-plane direction of the first surface of the first electrode 121 １ The width of the first reflecting surface 15S in plan view is measured. １ Width D １ Next, in the acquired cross-sectional TEM image, the second reflecting surface 15S in the in-plane direction of the first surface of the first electrode 121 is regarded as ２ The width of the second reflecting surface 15S in plan view is measured. ２ Width D ２ It is considered to be.

[0106] First reflecting surface 15S in plan view １ Area S １ and the second reflecting surface 15S in plan view ２ Area S ２ The magnitude relationship of the first reflecting surface 15S １ The inclination angle θ １ It is determined from a cross-sectional TEM image obtained in the same manner as in the measurement method above.

[0107] The wall portion 15 is made of a low refractive index layer, and the first reflecting surface 15S １ It is preferable that the refractive index of the first reflecting surface 15S is lower than that of the protective layer 16 that covers the first reflecting surface 15S. This allows the red light emitted from the light emitting element 12R to be reflected by the first reflecting surface 15S at an angle equal to or greater than a predetermined angle. １ The first reflecting surface 15S can totally reflect the green light emitted from the light emitting element 12G at an angle of incidence equal to or greater than a predetermined angle. １ The component incident on the surface can be totally reflected.

[0108] The wall portion 15 preferably has a refractive index lower than that of the common electrode 17 that covers the second reflective surface 15S2. This allows the blue light emitted from the light emitting element 12B to be incident on the second reflective surface 15S2 at angles equal to or greater than a predetermined angle. ２ The component incident on the surface can be totally reflected.

[0109] The wall portion 15 preferably has a refractive index lower than that of the OLED layer 122B, so that the component of the blue light emitted from the OLED layer 122B that is incident on the wall portion 15 at an angle of incidence equal to or greater than a predetermined angle can be totally reflected.

[0110] Wall portion 15 preferably has a refractive index lower than that of blue organic light-emitting layer 1223B, thereby enabling total reflection of the component of blue light emitted from blue organic light-emitting layer 1223B that is incident on wall portion 15 at an angle of incidence equal to or greater than a predetermined angle.

[0111] The wall portion 15 is made of, for example, silicon oxide (SiO ｘ ), silicon oxynitride (SiO ｘ N ｙ ), magnesium fluoride (MgF ｘ ) and lithium fluoride (LiF ｘ ) and at least one selected from the group consisting of

[0112] The height of the wall portion 15 is preferably in the range of 1 μm to 3 μm. １ The inclination angle θ １ It is preferable that the angle of the second reflecting surface 15S is in the range of 60° to 80°. ２ The inclination angle θ ２ is preferably in the range of 80° or more and 90° or less.

[0113] First reflective surface 15S １ The inclination angle θ １ and the second reflecting surface 15S ２ The inclination angle θ ２ The method for measuring the height of the wall 15 is as described above. １ The inclination angle θ １ and the second reflecting surface 15S ２ The inclination angle θ ２ The measurement is carried out using a cross-sectional TEM image obtained in the same manner as in the measurement method of (1).

[0114] (Protective Layer 16) The protective layer 16 is provided on the first surface of the insulating layer 13, on the peripheral edge of the first electrode 121 of the light emitting element 12R, and on the peripheral edge of the first electrode 121 of the light emitting element 12G. １, covering the side surfaces of the light emitting element 12R and the side surfaces of the light emitting element 12G.

[0115] The protective layer 16 seals the OLED layer 122 for each subpixel 10. This improves the reliability of the display device 101. The protective layer 16 is translucent to the light of each color emitted from the light-emitting elements 12R, 12G, and 12B. The protective layer 16 preferably has low moisture permeability. The protective layer 16 can protect the plurality of light-emitting elements 12, etc. For example, the protective layer 16 can prevent moisture from penetrating from the external environment into the plurality of light-emitting elements 12, etc. Furthermore, when the second electrode 123 is formed of a metal layer, the protective layer 16 may have a function of preventing oxidation of the metal layer. The thickness of the protective layer 16 is preferably within a range of 0.5 μm to 8.0 μm.

[0116] The protective layer 16 is preferably made of a high refractive index layer having a refractive index higher than that of the wall portion 15. This allows the red light emitted from the light emitting element 12R to be reflected by the first reflecting surface 15S at an incident angle equal to or greater than a predetermined angle. １ The red light incident on the first reflecting surface 15S １ Furthermore, the green light emitted from the light emitting element 12G can be totally reflected by the first reflecting surface 15S at an incident angle equal to or greater than a predetermined angle. １ The green light incident on the first reflecting surface 15S １ can be totally reflected by

[0117] The protective layer 16 has a plurality of holes 161. Each of the plurality of holes 161 is provided on the light-emitting element 12B. The holes 161 penetrate the protective layer 16 in the thickness direction. The common electrode 17 and the second electrode 123 of the light-emitting element 12B are connected via the holes 161.

[0118] The protective layer 16 contains, for example, at least one of an inorganic material and an organic material. The protective layer 16 may have a single-layer structure or a multi-layer structure. When the thickness of the protective layer 16 is increased, a multi-layer structure is preferable. This is because the internal stress in the protective layer 16 is alleviated. From the viewpoint of increasing the refractive index of the protective layer 16, the inorganic material is preferably silicon nitride (SiN ｘ), aluminum oxide (AlO ｘ ), titanium oxide (TiO ｘ ), niobium oxide (NbO ｘ ), silicon oxide (SiO ｘ ) and silicon oxynitride (SiO ｘ N ｙ ) and the like. The organic material includes, for example, a cured product of at least one resin selected from the group consisting of a thermosetting resin composition and a photosensitive resin composition. The photosensitive resin composition includes, for example, an ultraviolet-curable resin composition. Specific examples of the organic material include at least one selected from the group consisting of an acrylic resin, a polyimide resin, a novolac resin, an epoxy resin, a norbornene resin, and a parylene resin.

[0119] The protective layer 16 preferably includes a deposition layer in which atomic layers are deposited. The deposition layer may be an ALD (Atomic Layer Deposition) layer. When the protective layer 16 includes a deposition layer, the effect of the protective layer 16 in suppressing moisture penetration can be improved. The protective layer 16 includes, for example, a metal oxide or a metal nitride. The metal oxide is, for example, aluminum oxide (AlO ｘ ) or titanium oxide (TiO ｘ Metal nitrides include, for example, titanium nitride (TiN ｘ ) is included.

[0120] (Common Electrode 17) The common electrode 17, which is a third electrode, is provided on the first surface of the protective layer 16 so as to conform to the multiple holes 151 and the multiple holes 161. The common electrode 17 is an electrode common to the multiple light-emitting elements 12 provided in the display region RE1. The common electrode 17 is translucent to the light of each color emitted from the light-emitting elements 12R, 12G, and 12B. The common electrode 17 is preferably transparent to visible light. As shown in FIG. 3C , the common electrode 17 is formed over the entire display region RE1 and extends from the display region RE1 to the peripheral region RE2. The peripheral edge of the common electrode 17 is connected to the contact electrode 14 in the peripheral region RE2. At least one layer of an electron injection layer and a buffer layer (neither of which is shown) may be provided between the peripheral edge of the common electrode 17 and the contact electrode 14.

[0121] The common electrode 17 is connected to each of the second electrodes 123 separated for each subpixel 10. Specifically, the common electrode 17 has a plurality of contact portions 171, and each of the contact portions 171 is provided in the hole 151 or the hole 161. As a result, the tips of the contact portions 171 are connected to the first surfaces of the second electrodes 123 separated for each subpixel 10. However, the connection between the contact portions 171 and the second electrodes 123 is not limited to this example. For example, the contact portions 171 may be connected to the side surfaces of the second electrodes 123. The contact portions 171 are hollow protrusions that protrude toward the second electrodes 123 of the light-emitting elements 12, and the rear surface side (first surface side) of the contact portions 171 is recessed. Although FIGS. 3A and 3B show an example in which one contact portion 171 is provided for one subpixel 10, two or more contact portions 171 may be provided for one subpixel 10.

[0122] The common electrode 17 preferably contains a material that has good light transmittance and a small work function, similar to the second electrode 123. The second electrode 123 is formed, for example, of a transparent conductive oxide layer. The transparent conductive oxide layer contains a transparent conductive oxide. Examples of the transparent conductive oxide include the same materials as the transparent conductive oxide of the first electrode 121, specifically, for example, indium zinc oxide (IZO) and indium tin oxide (ITO).

[0123] (Protective Layer 18) The protective layer 18 is provided on the first surface of the common electrode 17 so as to fill the multiple holes 151, 161, more specifically, the recesses on the back surface side of the contact portion 171. The protective layer 18 is translucent to the light of each color emitted from the light-emitting elements 12R, 12G, and 12B. The protective layer 18 preferably has low moisture permeability. The protective layer 18 can protect the common electrode 17 and the multiple light-emitting elements 12, etc. For example, the protective layer 18 can prevent moisture from entering the common electrode 17 and the multiple light-emitting elements 12, etc. from the external environment.

[0124] Protective layer 18 is preferably made of a high-refractive index layer having a refractive index higher than that of common electrode 17. This allows blue light emitted from light-emitting element 12B that is incident on contact portion 171 at an incident angle equal to or greater than a predetermined angle to be totally reflected by the interface between protective layer 18 and contact portion 171. Protective layer 18 may also be made of a high-refractive index layer having a refractive index higher than that of wall portion 15.

[0125] The protective layer 18 includes, for example, at least one of an inorganic material and an organic material. The protective layer 18 may have a single-layer structure or a multi-layer structure. When the thickness of the protective layer 18 is increased, a multi-layer structure is preferable. This is to relieve internal stress in the protective layer 18. Examples of the inorganic material and the organic material include the same materials as those of the protective layer 16.

[0126] [Method for Manufacturing Display Device 101] Hereinafter, an example of a method for manufacturing the display device 101 according to the first embodiment will be described.

[0127] (Process for forming drive circuit substrate 11) First, for example, transistors and the like are formed in wells provided on the first surface side of substrate 111, which is a semiconductor substrate. Next, by using thin film formation technology, photolithography technology, and the like, an insulating layer 112 containing therein a plurality of contact plugs 112a, a plurality of contact plugs 112aa, a plurality of wirings (not shown), a potential supply wiring 112bb, and the like is formed. In this way, the drive circuit substrate 11 is obtained.

[0128] (Process for forming first electrodes 121 and contact electrodes 14) Next, a metal layer is formed on the first surface of the drive circuit substrate 11 by, for example, sputtering, and then the metal layer is patterned by, for example, photolithography, thereby forming a plurality of first electrodes 121 and contact electrodes 14 on the first surface of the drive circuit substrate 11 (see FIG. 6A ).

[0129] (Step of forming insulating layer 13) Next, by, for example, CVD (Chemical Vapor Deposition), the insulating layer 13 is formed on the first surface of the drive circuit substrate 11 so as to cover the plurality of first electrodes 121 and the contact electrodes 14. Next, by, for example, photolithography, the insulating layer 13 is processed to form openings 13a on the first surface of each first electrode 121 and openings 13b on the first surface of the contact electrodes 14.

[0130] (Process for forming light-emitting element 12B) Next, by, for example, vapor deposition, hole injection layer 1221, hole transport layer 1222, blue organic light-emitting layer 1223B, electron transport layer 1224, and electron injection layer 1225 are laminated in this order on the first surfaces of the plurality of first electrodes 121 and on the first surface of insulating layer 13. This forms OLED layer 122B having a single-layer light-emitting unit.

[0131] Next, the second electrode 123 is formed on the first surface of the OLED layer 122B by, for example, sputtering, and then the protective layer 152 is formed on the first surface of the second electrode 123 by, for example, CVD (see FIG. 6B).

[0132] Next, the protective layer 152, the second electrode 123, and the OLED layer 122 are patterned by, for example, dry etching, thereby forming a plurality of light-emitting elements 12B on the first surface of the drive circuit board 11 (see FIG. 6C).

[0133] (Wall portion 15 formation process) Next, a low refractive index layer 153 is formed over the first surfaces of the plurality of first electrodes 121 and the first surface of the insulating layer 13, for example by CVD, so as to fill the plurality of stacked bodies each including the OLED layer 122B, the second electrode 123, and the protective layer 152 (see FIG. 6D ). The low refractive index layer 153 has a refractive index lower than that of the protective layer 16 formed in the protective layer 16 formation process described below. The low refractive index layer 153 also has a refractive index lower than that of the protective layer 18 formed in the protective layer 18 formation process described below.

[0134] Next, the low refractive index layer 153 is processed by, for example, dry etching to form a plurality of structures 154 including the light emitting element 12B, and the first electrode 121 for forming the light emitting element 12R and the first electrode 121 for forming the light emitting element 12G are exposed (see FIG. 6E). At this time, the structures 154 are processed into a forward tapered shape in which the width of the structures 154 narrows from the bottom, which is on the drive circuit board 11 side, toward the top, which is on the display surface side. The tapered inclined surfaces of the structures 154 are inclined relative to the first reflecting surface 15S of the wall portion 15. １ becomes.

[0135] (Process for forming light-emitting elements 12R and 12G) Next, OLED layer 122R, second electrode 123, and protective layer 152 are formed in this order so as to cover the plurality of light-emitting elements 12B, and these layers are then patterned to form the plurality of light-emitting elements 12R on the first surface of drive circuit substrate 11. Next, OLED layer 122G, second electrode 123, and protective layer 152 are formed in this order so as to cover the plurality of light-emitting elements 12R and the plurality of light-emitting elements 12B, and these layers are then patterned to form the plurality of light-emitting elements 12G on the first surface of drive circuit substrate 11 (see FIG. 6F ).

[0136] (Step of forming protective layer 16) Next, protective layer 16 is formed by, for example, a CVD method so as to bury the plurality of structures 154, the plurality of light emitting elements 12R, and the plurality of light emitting elements 12R (see FIG. 6G). Protective layer 16 is formed of a high refractive index layer having a refractive index higher than the refractive index of structures 154, i.e., the refractive index of low refractive index layer 153.

[0137] (Process for forming holes 151, 161) Next, the protective layer 16 and the structure 154 are processed by, for example, dry etching, to form a plurality of holes 151 on the second electrode 123 of the light-emitting element 12B, and a plurality of holes 161 on the second electrode 123 of the light-emitting elements 12R, 12B. By forming the plurality of holes 151, a plurality of wall portions 15 are formed on the periphery of the first surface of the first electrode 121 (see FIG. 6H). At this time, the holes 151, 161 are processed so that the side surfaces of the holes 151, 161 are vertical surfaces parallel to the central axis of the light-emitting element 12, or inclined surfaces inclined with respect to the central axis of the light-emitting element 12. The side surfaces of the holes 151 are formed on the second reflective surfaces 15S of the wall portions 15. ２ becomes.

[0138] (Process for forming common electrode 17) Next, the common electrode 17 is formed on the first surface of the protective layer 16 and in the plurality of holes 151, 161, for example, by sputtering (see FIG. 6I). As a result, the plurality of contact portions 171 of the common electrode 17 are connected to the second electrode 123 of the light-emitting element 12B through each hole 151, and are connected to the second electrodes 123 of the light-emitting elements 12G and 12B through each hole 161.

[0139] (Process for forming protective layer 18) Next, the protective layer 18 is formed on the first surface of the common electrode 17 by, for example, CVD so as to fill the holes 151, 161, more specifically, the recesses on the back surface side of the contact portions 171 (see FIG. 6J). The protective layer 18 is formed of a high refractive index layer having a refractive index higher than that of the wall portions 15. In this manner, the display device 101 according to the first embodiment is obtained.

[0140] [Operation and Effect] As described above, the display device 101 according to the first embodiment has the first reflective surface 15S located on the side of the light emitting element 12R or the light emitting element 12G.１ and a second reflecting surface 15S located on the light emitting element 12B side. ２ As a result, the red light emitted from the light emitting element 12R and the green light emitted from the light emitting element 12G are reflected by the first reflecting surface 15S. １ The blue light emitted from the light emitting element 12B can be reflected by the second reflecting surface 15S and directed upward. ２ Therefore, the light extraction efficiency of the display device 101 can be improved.

[0141] In the display device 101 according to the first embodiment, the first reflecting surface 15S １ and the second reflecting surface 15S ２ This allows the light extraction efficiency of the light emitting element 12B to be adjusted separately from that of the light emitting elements 12R and 12G.

[0142] In the display device 101 according to the first embodiment, the light-emitting element 12B, which is surrounded by the wall portion 15, is disposed so as to surround the light-emitting elements 12R and 12G. As a result, the light-emitting elements 12R and 12G are respectively provided with a first reflecting surface 15S. １ Therefore, the brightness of the light emitting elements 12R and 12G can be improved.

[0143] In the display device 101 according to the first embodiment, adjacent light-emitting elements 12 are separated from each other. This makes it possible to suppress carrier leakage between adjacent sub-pixels 10. Furthermore, each light-emitting element 12 is covered with a wall portion 15, a protective layer 16, and a protective layer 18. This makes it possible to improve the reliability of the display device 101.

[0144] In conventional display devices (see, for example, Patent Document 1), a reflector (reflecting portion) is provided between adjacent light-emitting elements, making it difficult to narrow the distance between adjacent light-emitting elements. Therefore, while conventional display devices can improve light extraction efficiency, it is difficult to achieve high definition. Therefore, it is possible to achieve both high definition and high brightness. On the other hand, in the display device 101 according to the first embodiment, the wall portion 15 is provided around the light-emitting element 12B, making it possible to narrow the distance between adjacent light-emitting elements 12B. Therefore, it is possible to improve the light extraction efficiency of the display device 101 while suppressing the effect of the formation of the wall portion 15 on the definition of the subpixel 10. Therefore, it is possible to achieve both high definition and high brightness.

[0145] 7 is a cross-sectional view of a display device 102 according to a second embodiment. The display device 102 according to the second embodiment differs from the display device 101 according to the first embodiment in that it includes a plurality of wall portions 19 instead of the plurality of wall portions 15 (see FIG. 3A ). The wall portions 19 include protective wall portions 191 and a portion of the OLED layer 122. In the second embodiment, an example will be described in which a portion of the OLED layer 122 is the hole injection layer 1221, but the portion of the OLED layer 122 may be a layer other than the hole injection layer 1221.

[0146] The light emitting element 12R and the wall portion 19 adjacent to the light emitting element 12R share the hole injection layer 1221. The light emitting element 12G and the wall portion 19 adjacent to the light emitting element 12G share the hole injection layer 1221.

[0147] The hole injection layer 1221 of the light emitting element 12R also serves as a low refractive index layer of the wall portion 19 adjacent to the light emitting element 12R. More specifically, the hole injection layer 1221 of the light emitting element 12R extends to the inclined surface of the wall portion 19 adjacent to the light emitting element 12R, and is formed on the first reflecting surface 15S of the wall portion 15. １ It is composed of:

[0148] The hole injection layer 1221 of the light emitting element 12G also serves as a low refractive index layer of the wall portion 19 adjacent to the light emitting element 12G. More specifically, the hole injection layer 1221 of the light emitting element 12G extends to the inclined surface of the wall portion 19 adjacent to the light emitting element 12G, and is formed on the first reflecting surface 15S of the wall portion 15. １ It is composed of:

[0149] As described above, the hole injection layer 1221, which also serves as a low refractive index layer, has a refractive index lower than that of the protective layer 16. As a result, the red light emitted from the light emitting element 12R is reflected by the first reflecting surface 15S at an incident angle equal to or greater than a predetermined angle. １ The first reflecting surface 15S can totally reflect the green light emitted from the light emitting element 12G at an angle of incidence equal to or greater than a predetermined angle. １ The component incident on the surface can be totally reflected.

[0150] The hole injection layer 1221, which also serves as the low refractive index layer of the wall portion 15, contains at least one selected from the group consisting of, for example, magnesium fluoride (MgFx), calcium fluoride (CaFx), lithium fluoride (LiFx), etc. The hole injection layer 1221, which also serves as the low refractive index layer, may be a mixed film containing an inorganic material and an organic material, or a mixed film containing an inorganic film and an organic film.

[0151] The protective wall 191 is provided below the extended portion of the hole injection layer 1221, and covers the side surfaces of the OLED layer 122B, the second electrode 123, and the contact portion 171. The protective wall 191 can provide insulation between the OLED layer 122B and the extended portion of the hole injection layer 1221, between the second electrode 123 and the extended portion of the hole injection layer 1221, and between the contact portion 171 and the extended portion of the hole injection layer 1221. In other respects, the protective wall 191 may be similar to the wall 15 in the first embodiment.

[0152] [Operation and Effect] As described above, the display device 102 according to the second embodiment has the first reflective surface 15S similarly to the display device 101 according to the first embodiment. １ and the second reflecting surface 15S ２Therefore, the same effects as those of the display device 101 according to the first embodiment can be obtained.

[0153] 4 Third Embodiment [Configuration of Display Device 103] FIG. 8 is a cross-sectional view of a display device 103 according to a third embodiment. The display device 103 according to the third embodiment differs from the display device 101 according to the first embodiment in that it includes a plurality of wall portions 20 instead of the plurality of wall portions 15 (see FIG. 3A ). The wall portions 20 include a protective wall portion 201 and a first electrode 121. When the first electrode 121 is configured with a multilayer film including a metal layer as a reflective layer, the wall portions 20 may include only the metal layer included in the multilayer film, or may include all layers of the multilayer film. More specifically, for example, when the first electrode 121 is configured with a metal layer and a transparent conductive oxide layer, the wall portions 20 may include only the metal layer of the metal layer and the transparent conductive oxide layer, or may include both the metal layer and the transparent conductive oxide layer.

[0154] The light emitting element 12R and the wall portion 20 adjacent to the light emitting element 12R share the first electrode 121. The light emitting element 12G and the wall portion 20 adjacent to the light emitting element 12G share the first electrode 121.

[0155] The first electrode 121 of the light emitting element 12R also serves as the metal layer of the wall portion 15 adjacent to the light emitting element 12R. More specifically, the first electrode 121 of the light emitting element 12R extends to the inclined surface of the wall portion 20 adjacent to the light emitting element 12R, and is in contact with the first reflecting surface 15S of the wall portion 15. １ It is composed of:

[0156] The first electrode 121 of the light emitting element 12G also serves as the metal layer of the wall portion 15 adjacent to the light emitting element 12G. More specifically, the first electrode 121 of the light emitting element 12G extends to the inclined surface of the wall portion 20 adjacent to the light emitting element 12G, and is in contact with the first reflecting surface 15S of the wall portion 15. １ It is composed of:

[0157] The protective wall portion 201 is similar to the protective wall portion 191 in the second embodiment, and therefore a description of the protective wall portion 201 will be omitted.

[0158] The first electrode 121, which also serves as the metal layer of the wall portion 15, preferably contains at least one selected from the group consisting of aluminum (Al), silver (Ag), and titanium (Ti). The first electrode 121, which also serves as the metal layer of the wall portion 15, may contain at least one of the above metal elements as a constituent element of an alloy. Specific examples of the alloy include an aluminum alloy, a silver alloy, and a titanium alloy.

[0159] [Operation and Effect] As described above, the display device 103 according to the third embodiment has the first reflective surface 15S similarly to the display device 101 according to the first embodiment. １ and the second reflecting surface 15S ２ Therefore, the same effects as those of the display device 101 according to the first embodiment can be obtained.

[0160] 9 is a cross-sectional view of a display device 104 according to a fourth embodiment. The display device 104 according to the fourth embodiment differs from the display device 101 according to the first embodiment in that the display device 104 includes a plurality of light-emitting elements 21B instead of the plurality of light-emitting elements 12B.

[0161] In the fourth embodiment, an example will be described in which the light-emitting elements 12R and 12G are OLED elements (organic LED elements) and the light-emitting element 21B is an LED element (inorganic LED element), but the configurations of the light-emitting elements 12R, 12G, and 21B are not limited to this. Any one of the light-emitting elements 12R, 12G, and 21B may be an OLED element and the remaining two may be inorganic LED elements, or any two of the light-emitting elements 12R, 12G, and 21B may be OLED elements and the remaining one may be an inorganic LED element.

[0162] (Light-emitting element 21B) Light-emitting element 21B is an inorganic LED element capable of emitting blue light. Light-emitting element 21B has a first electrode 211, an inorganic layer 212B, and a second electrode 213, which are arranged in this order on the first surface of drive circuit board 11. Light-emitting element 21B may have a substrate between first electrode 211 and inorganic layer 212B, or between inorganic layer 212B and second electrode 213, as necessary.

[0163] The light-emitting element 21B is formed, for example, by forming a plurality of inorganic LED elements on a semiconductor substrate, bonding the semiconductor substrate to the drive circuit substrate 11 by bonding electrodes of the same metal, such as gold (Au) or copper (Cu), and then removing the semiconductor substrate (LED substrate). The light-emitting elements 12R and 12G are formed, for example, by a method similar to that of the first embodiment.

[0164] (Inorganic Layer 212B) The inorganic layer 212B includes an inorganic light-emitting layer. The inorganic layer 212B is provided individually for each sub-pixel 10 in the display region RE1. The inorganic layer 212B is, for example, a compound semiconductor stack, and includes a first compound semiconductor layer, an inorganic light-emitting layer (inorganic active layer), and a second compound semiconductor layer, which are arranged in this order on the first surface of the first electrode 211.

[0165] (First Compound Semiconductor Layer, Second Compound Semiconductor Layer) The first compound semiconductor layer has p-type conductivity, and the second compound semiconductor layer has n-type conductivity. The first compound semiconductor layer and the second compound semiconductor layer include compound semiconductors. The compound semiconductors include, for example, AlInGaN-based compound semiconductors, InGaN-based compound semiconductors, GaN-based compound semiconductors, AlGaN-based compound semiconductors, ZnSe-based compound semiconductors, ZnO-based compound semiconductors, and perovskite semiconductors.

[0166] The first compound semiconductor layer is doped with p-type impurities, such as at least one selected from the group consisting of zinc (Zn), magnesium (Mg), beryllium (Be), cadmium (Cd), calcium (Ca), barium (Ba), and oxygen (O).

[0167] The second compound semiconductor layer is doped with n-type impurities, such as at least one selected from the group consisting of silicon (Si), selenium (Se), germanium (Ge), tin (Sn), carbon (C), and titanium (Ti).

[0168] (Inorganic Light-Emitting Layer) The inorganic light-emitting layer is capable of emitting blue light and is provided between the second compound semiconductor layer and the first compound semiconductor layer.

[0169] The inorganic light-emitting layer includes a compound semiconductor. The compound semiconductor includes, for example, the materials exemplified above as the materials for the second compound semiconductor layer and the first compound semiconductor layer. The inorganic light-emitting layer may be composed of a single compound semiconductor layer, or may have a single quantum well structure (SQW structure) or a multiple quantum well structure (MQW structure).

[0170] (First Electrode 211) The first electrode 211 is provided on the second surface side of the inorganic layer 212B. Although Fig. 9 shows an example in which the first electrode 211 is in contact with the entire second surface of the inorganic layer 212B, the first electrode 211 may be in contact with only a portion (e.g., the center) of the second surface of the inorganic layer 212B. The first electrode 211 is an anode.

[0171] The first electrode 211 contains at least one metal (including an alloy) selected from the group consisting of, for example, gold (Au), silver (Ag), palladium (Pd), platinum (Pt), nickel (Ni), aluminum (Al), titanium (Ti), tungsten (W), vanadium (V), chromium (Cr), copper (Cu), zinc (Zn), tin (Sn), and indium (In).

[0172] The first electrode 211 has, for example, a single-layer structure or a multi-layer structure. Examples of multi-layer structures include Ti / Au, Ti / Al, Ti / Pt / Au, Ti / Al / Au, Ni / Au, AuGe / Ni / Au, Ni / Au / Pt, Ni / Pt, Pd / Pt, and Ag / Pd. When the first electrode 211 has a multi-layer structure, the layer before the " / " in the multi-layer structure is located closer to the inorganic light-emitting layer. This is also true in the case where the second electrode 213 has a multi-layer structure.

[0173] (Second electrode 213) The second electrode 213 is provided on the first surface side of the inorganic layer 212B. While Fig. 9 shows an example in which the second electrode 213 is in contact with substantially the entire first surface of the inorganic layer 212B, the second electrode 213 may be in contact with only a portion (e.g., the center) of the first surface of the inorganic layer 212B. The second electrode 213 is a cathode.

[0174] The second electrode 213 is preferably a transparent electrode. The second electrode 213 preferably contains, for example, a transparent conductive material. Examples of the transparent conductive material include indium oxide, indium tin oxide (ITO), and Sn-doped In ２ O ３ , including crystalline ITO and amorphous ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium-doped gallium zinc oxide (IGZO, In-GaZnO ４ ), IFO (F-doped In ２ O ３ ), tin oxide (SnO ２ ), ATO (Sb-doped SnO ２ ), FTO (F-doped SnO ２ ), zinc oxide (including ZnO, Al-doped ZnO, B-doped ZnO, and Ga-doped ZnO), antimony oxide, spinel-type oxide, or YbFe ２ O ４ The second electrode 213 may be a transparent conductive layer having a base layer of gallium oxide, titanium oxide, niobium oxide, nickel oxide, or the like.

[0175] The second electrode 213 may contain an opaque conductive material (metal), such as at least one metal selected from the group consisting of palladium (Pd), platinum (Pt), nickel (Ni), aluminum (Al), titanium (Ti), gold (Au), and silver (Ag).

[0176] The second electrode 213 may have a single layer structure or a multi-layer structure (for example, Ti / Pt / Au).

[0177] (Insulating Layer 112) The insulating layer 112 includes a plurality of bonding electrodes 114. The plurality of bonding electrodes 114 are embedded on the first surface side of the insulating layer 112 so that first surfaces of the bonding electrodes 114 are exposed from the first surface of the insulating layer 112. The plurality of bonding electrodes 114 are bonded to the first electrode 121 of the light-emitting element 12R, the first electrode 121 of the light-emitting element 12G, and the first electrode 211 of the light-emitting element 21B, respectively.

[0178] [Operation and Effect] As described above, the display device 104 according to the fourth embodiment has the first reflective surface 15S similarly to the display device 101 according to the first embodiment. １ and the second reflecting surface 15S ２ Therefore, it is possible to obtain the same effects as the display device 101 according to the first embodiment. Furthermore, since the light emitting efficiency of blue inorganic LED elements is higher than that of blue OLED elements, the use of blue inorganic LED elements as the light emitting elements 21B can also compensate for the luminance.

[0179] 6. Fifth Embodiment In the first embodiment, the display device 101 employing the RGB color-coding method as a colorization method has been described, but the colorization method is not limited to the RGB color-coding method. In the fifth embodiment, a display device 105 employing a color filter method as a colorization method will be described.

[0180] Figures 10A and 10B are cross-sectional views of a display device 105 according to a fifth embodiment. Figure 10A is a cross-sectional view taken along a position corresponding to line IIIA-IIIA in Figure 2, and Figure 10B is a cross-sectional view taken along a position corresponding to line IIIB-IIIB in Figure 2. The display device 105 according to the fifth embodiment includes a plurality of light-emitting elements 12W and a color filter 22 instead of the plurality of light-emitting elements 12R, 12G, and 12B.

[0181] (Light-emitting element 12W) The light-emitting element 12W can emit white light under the control of a drive circuit, etc. In the fifth embodiment, the light-emitting element 12W is an OLED element (organic LED element). The light-emitting element 12W is included in each of the sub-pixels 10R, 10G, and 10B of each color.

[0182] The plurality of light-emitting elements 12W are two-dimensionally arranged in a specified arrangement pattern on the first surface of the drive circuit substrate 11. The specified arrangement pattern is the same as that described in the first embodiment as the specified arrangement pattern of the plurality of sub-pixels 10. The light-emitting element 12W has a first electrode 121, an OLED layer 122W, and a second electrode 123, which are arranged in this order on the first surface of the drive circuit substrate 11.

[0183] (First Electrode 121) The first electrode 121 is the same as that in the first embodiment, and therefore a description of the first electrode 121 will be omitted.

[0184] (OLED Layer 122W) The OLED layer 122W can emit white light. The OLED layer 122W is an example of an organic-material-containing layer including an organic light-emitting layer. The OLED layer 122W is provided between a plurality of first electrodes 121 and one second electrode 123. The OLED layer 122W is connected between adjacent light-emitting elements 12W in the in-plane direction and is a layer common to the plurality of light-emitting elements 12W.

[0185] The OLED layer 122W may be configured as a laminate including an organic light-emitting layer, in which case some layers of the laminate (e.g., an electron injection layer) may be inorganic. The OLED layer 122W may be an OLED layer having a single light-emitting unit U as shown in FIG. 11A , an OLED layer having two light-emitting units U1 and U2 (tandem structure) as shown in FIG. 11B , or an OLED layer having a structure other than these. The OLED layer 122W having a single light-emitting unit U has a configuration in which, for example, from the first electrode 121 toward the second electrode 123, a hole injection layer 1221, a hole transport layer 1222, a red organic light-emitting layer 1223R, an emission separation layer 1226, a blue organic light-emitting layer 1223B, a green organic light-emitting layer 1223G, an electron transport layer 1224, and an electron injection layer 1225 are stacked in this order. The OLED layer 122W having two light-emitting units U1 and U2 has a configuration in which, for example, a hole injection layer 1221, a hole transport layer 1222, a blue organic light-emitting layer 1223B, an electron transport layer 1227, a charge generation layer 1228, a hole transport layer 1229, a yellow organic light-emitting layer 1223Y, an electron transport layer 1224, and an electron injection layer 1225 are laminated in this order from the first electrode 121 to the second electrode 123.

[0186] 12 , the OLED layer 122 having a single-layer light-emitting unit U may have a structure in which a red organic light-emitting layer 1223R, a green organic light-emitting layer 1223G, and a blue organic light-emitting layer 1223B are applied separately for each subpixel 10, and the subpixels 10 are separated from each other. In this case, a plurality of light-emitting elements 12R, 12G, and 12B are configured instead of a plurality of light-emitting elements 12W. The red organic light-emitting layer 1223R, the green organic light-emitting layer 1223G, and the blue organic light-emitting layer 1223B are disposed at the positions of the subpixels 10R, 10G, and 10B, respectively. The hole injection layer 1221, the hole transport layer 1222, the electron transport layer 1224, and the electron injection layer 1225 are connected between light-emitting elements 12 adjacent to each other in the in-plane direction and are common layers for a plurality of light-emitting elements 12.

[0187] The hole injection layer 1221 can increase the efficiency of hole injection into the organic light-emitting layers 1223R, 1223G, and 1223B and suppress leakage. The hole transport layers 1222 and 1229 can increase the efficiency of hole transport into the organic light-emitting layers 1223R, 1223B, and 1223Y. The electron injection layer 1225 can increase the efficiency of electron injection into the organic light-emitting layers 1223G and 1223Y. The electron transport layers 1224 and 1227 can increase the efficiency of electron transport into the organic light-emitting layers 1223G, 1223B, and 1223Y. The emission separation layer 1226 is a layer for adjusting the injection of carriers into the organic light-emitting layers 1223R, 1223G, and 1223B. The balance of light emission of each color is adjusted by injecting electrons and holes into the organic light-emitting layers 1223R, 1223G, and 1223B via the emission separation layer 1226. The charge generating layer 1228 can supply electrons and holes to the blue organic light emitting layer 1223B and the yellow organic light emitting layer 1223Y, which are disposed so as to sandwich the charge generating layer 1228, respectively.

[0188] The red organic light-emitting layer 1223R, the green organic light-emitting layer 1223G, the blue organic light-emitting layer 1223B and the yellow organic light-emitting layer 1223Y can emit red light, green light, blue light and yellow light, respectively, by recombination of holes injected from the first electrode 121 or the charge generation layer 1228 and electrons injected from the second electrode 123 or the charge generation layer 1228.

[0189] (Second Electrode 123) The second electrode 123 is connected between adjacent light-emitting elements 12W in the in-plane direction and is a common electrode for multiple light-emitting elements 12W. The second electrode 123 is formed as a common electrode across the entire display region RE1, and the peripheral portion of the second surface of the second electrode 123 is connected to the first surface of the contact electrode 14 provided in the peripheral region RE2. At least one layer of an electron injection layer or a buffer layer (neither of which is shown) may be provided between the peripheral portion of the second surface of the second electrode 123 and the first surface of the contact electrode 14. The second electrode 123 may be similar to that of the first embodiment in other respects.

[0190] (Color Filter 22) The color filter 22 is a so-called on-chip color filter (OCCF). The color filter 22 is provided above the plurality of light-emitting elements 12W. More specifically, the color filter 22 is provided on the first surface of the protective layer 16. The color filter 22 includes, for example, a plurality of colored layers 221R, a plurality of colored layers 221G, and a plurality of colored layers 221B. In the following description, when the colored layers 221R, 221G, and 221B are referred to collectively without any particular distinction, the colored layers 221R, 221G, and 221B may be simply referred to as colored layers 221.

[0191] The plurality of colored layers 221 are two-dimensionally arranged in a specified arrangement pattern on the first surface of the protective layer 16. The specified arrangement pattern is the same as that described for the plurality of sub-pixels 10 in the first embodiment. Each colored layer 221 is provided above the light-emitting element 12W. The sub-pixel 10R is composed of the light-emitting element 12W and a colored layer 221R provided above the light-emitting element 12W. The sub-pixel 10G is composed of the light-emitting element 12W and a colored layer 221G provided above the light-emitting element 12W. The sub-pixel 10B is composed of the light-emitting element 12W and a colored layer 221B provided above the light-emitting element 12W.

[0192] The coloring layer 221R has a red color. The coloring layer 221R transmits the red light component of the white light emitted from the light-emitting element 12W, but can absorb visible light components other than red light. The coloring layer 221G has a green color. The coloring layer 221G transmits the green light component of the white light emitted from the light-emitting element 12W, but can absorb visible light components other than green light. The coloring layer 221B has a blue color. The coloring layer 221B transmits the blue light component of the white light emitted from the light-emitting element 12W, but can absorb visible light components other than blue light.

[0193] The colored layer 221R includes, for example, a red color resist, the colored layer 221G includes, for example, a green color resist, and the colored layer 221B includes, for example, a blue color resist.

[0194] (Walls 15) In the fifth embodiment, the plurality of walls 15 are provided at a position higher than the light-emitting element 12, more specifically, on the second electrode 123. A planarization layer (not shown) may be provided between the plurality of walls 15 and the second electrode 123. The plurality of walls 15 are buried in the protective layer 16. In the fifth embodiment, the tops of the walls 15 are provided at a position lower than the second surface of the color filter 22 and are spaced apart from the second surface of the color filter 22.

[0195] (Protective Layer 16) The protective layer 16 is provided on the first surface of the second electrode 123. The protective layer 16 includes the wall portion 15 therein. In the fifth embodiment, the thickness of the protective layer 16 is greater than the height of the wall portion 15. Therefore, the first surface of the protective layer 16 is located higher than the top of the wall portion 15.

[0196] [Operation and Effect] As described above, the display device 105 according to the fifth embodiment has the first reflective surface 15S １ and the second reflecting surface 15S ２ The first electrode 123 has a plurality of wall portions 15 on the first surface thereof. This allows the white light emitted from the light-emitting elements 12W of the sub-pixels 10R and 10G to be reflected by the first reflective surface 15S. １ The white light emitted from the light-emitting element 12W of the sub-pixel 10B can be reflected by the second reflecting surface 15S and directed upward.２ Therefore, the light extraction efficiency of the display device 105 can be improved.

[0197] Furthermore, in the display device 105 according to the fifth embodiment, the sub-pixels 10R, 10G, and 10B share the OLED layer 122W and the second electrode 123. Therefore, the display device 105 according to the fifth embodiment has higher productivity and is easier to achieve higher definition than the display device 101 according to the first embodiment, in which the sub-pixels 10R, 10G, and 10B each have their own OLED layer 122W and second electrode 123.

[0198] Furthermore, since the OLED layer 122W and the second electrode 123 are shared by a plurality of sub-pixels 10, there is no need to rewire the second electrode 123 using the common electrode 17 or the like. This makes it possible to improve the productivity of the display device 105.

[0199] <7 Modifications> [Modification 1] The shape, configuration, etc. of the wall portion 15 are not limited to the shape, configuration, etc. described in the first embodiment. For example, the wall portion 15 may have the following shape, configuration, etc.

[0200] As shown in FIG. 13A, the wall portion 15 may be divided at one or more positions in the height direction of the wall portion 15.

[0201] As shown in Fig. 13B, the wall 15 may have a multi-layer structure. Here, "multi-layer" refers to two or more layers. Each layer constituting the wall 15 is a first reflecting surface 15S. １ However, the stacking direction of the layers constituting the wall portion 15 is not limited to this example, and the layers constituting the wall portion 15 may be stacked in the height direction of the wall portion 15.

[0202] The first reflecting surface 15S of the multilayer that constitutes the wall portion 15 １ The layer located on the side of the first reflecting surface 15S １ It is preferable that the second reflecting surface 15S is made of a low refractive index layer having a refractive index lower than that of the protective layer 16 that covers the wall portion 15. ２The layer located on the side is the second reflecting surface 15S. ２ The second reflecting surface 15S is preferably made of a low refractive index layer having a refractive index lower than that of the common electrode 17 that covers the wall portion 15. ２ The layer located on the side may be composed of a low refractive index layer having a refractive index lower than that of the protective layer 18 covering the common electrode 17 .

[0203] As shown in FIG. 13C, the first reflecting surface 15S １ However, the first reflecting surface 15S may be configured by a plurality of surfaces. The plurality of surfaces are provided in order from the bottom to the top of the wall portion 15, and the plurality of surfaces have different inclination angles. For example, as shown in FIG. 13C, the first reflecting surface 15S １ However, the wall portion 15 may have an inclined surface and a vertical surface in this order from the bottom to the top. Here, the inclined surface refers to a surface inclined with respect to the first surface of the first electrode 121, and the vertical surface refers to a surface perpendicular to the first surface of the first electrode 121. Although not shown in the drawings, the first reflecting surface 15S １ may have a stepped shape.

[0204] As shown in FIG. 13D, the first reflecting surface 15S １ However, the second reflecting surface 15S may be a curved surface whose slope gradually becomes steeper from the bottom to the top of the wall portion 15. ２ is substantially perpendicular to the first surface of the light emitting element 12B, ２ However, the wall portion 15 may have a curved surface whose inclination gradually becomes steeper from the bottom to the top.

[0205] 13E , the lower end of the first reflective surface 15S1 (one end on the drive circuit board 11 side) may be located lower than the first surface of the first electrode 121. More specifically, a groove 11Gv may be provided between adjacent first electrodes 121, and the lower end of the first reflective surface 15S1 may be located in the groove 11Gv. The groove 11Gv may penetrate the insulating layer 13, and the bottom of the groove 11Gv may be located lower than the first surface of the drive circuit board 11. By providing the lower end of the first reflective surface 15S1 at a position lower than the first surface of the first electrode 121, light incident between adjacent first electrodes 121 can be reflected and directed upward.

[0206] [Variation 2] The protective layer 18 may be a multilayer film as shown in Fig. 14. More specifically, for example, the protective layer 18 may have a first inorganic protective layer 181, an organic protective layer 182, and a second inorganic protective layer 183, which are arranged in this order on the first surface of the common electrode 17.

[0207] The first inorganic protective layer 181 is provided on the first surface of the common electrode 17 so as to follow the shape of the common electrode 17. The first inorganic protective layer 181 includes an inorganic material. Examples of the inorganic material include the materials exemplified as the inorganic material of the protective layer 16 in the first embodiment, specifically, silicon nitride (SiN ｘ ) are listed.

[0208] The organic protective layer 182 is provided on the first surface of the first inorganic protective layer 181 so as to fill the holes 151 and the holes 161. The organic protective layer 182 may be a planarizing layer that fills the holes 151 and the holes 161 and planarizes the irregularities of the common electrode 17. The organic protective layer 182 includes an organic material. Examples of the organic material include the materials exemplified as the organic material of the protective layer 16 in the first embodiment, specifically, acrylic resins.

[0209] The second inorganic protective layer 183 is provided on the first surface of the organic protective layer 182. The second inorganic protective layer 183 includes an inorganic material. Examples of the inorganic material include the materials exemplified as the inorganic material of the protective layer 16 in the first embodiment, specifically, silicon nitride (SiN ｘThe first inorganic protective layer 181 and the second inorganic protective layer 183 may be made of the same material or different materials. The first inorganic protective layer 181 and the second inorganic protective layer 183 are preferably connected to each other in the peripheral region RE2 as shown in FIG. 15 .

[0210] The refractive index of first inorganic protective layer 181 is preferably higher than the refractive index of common electrode 17. This allows blue light emitted from light emitting element 12B to be reflected at the interface between first inorganic protective layer 181 and common electrode 17 and directed upward. The refractive index of organic protective layer 182 is preferably higher than the refractive index of first inorganic protective layer 181. This allows blue light emitted from light emitting element 12B to be reflected at the interface between organic protective layer 182 and first inorganic protective layer 181 and directed upward.

[0211] The protective layer 18 having the above configuration is formed, for example, as follows. First, a first inorganic protective layer 181 is formed on the first surface of the common electrode 17, for example, by a CVD method, so as to conform to the plurality of holes 151 and the plurality of holes 161. Next, an organic protective layer 182 is formed on the first surface of the first inorganic protective layer 181, for example, by a screen printing method, so as to fill the plurality of holes 151 and the plurality of holes 161. Next, a second inorganic protective layer 183 is formed on the first surface of the organic protective layer 182, for example, by a CVD method. In this way, the protective layer 18 having a multilayer structure is formed on the first surface of the common electrode 17.

[0212] Since the protective layer 18 is a multilayer film having the above-described configuration, even if the base layer of the protective layer 18 has large steps due to multiple holes 151 and multiple holes 161, etc., it is possible to mitigate moisture penetration due to foreign matter and defects, etc., and improve the reliability of the display device 101.

[0213] 16 , the display device 101 according to the first embodiment may further include a color filter 22 on the first surface of the protective layer 18. The color filter 22 is a so-called on-chip color filter (OCCF), as described in the fifth embodiment. The colored layer 221 may be provided in all the sub-pixels 10 in the display region RE1, or may be provided only in some of the sub-pixels 10 in the display region RE1, for example, in only the sub-pixels 10 of a predetermined color.

[0214] As described above, the display device 101 according to the third modification includes the color filter 22. This allows the color purity of the display device 101 to be improved. Furthermore, the display device 101 according to the third modification includes the light-emitting elements 12R, 12G, and 12B that emit light of each color, and uses the color filter 22 to improve the color purity. Therefore, the thickness of the color filter 22 can be made thinner than in the display device 105 that includes the light-emitting element 12W that emits white light and uses the color filter 22 to colorize the display. This allows the light extraction efficiency to be improved.

[0215] 17A , the display device 101 may further include a plurality of wall portions 24 on the first surface of the protective layer 18. The wall portions 24 are provided between adjacent colored layers 221. The wall portions 24 are preferably configured to be able to reflect at least a portion of the light incident through the colored layers 221. This makes it possible to suppress color mixing between adjacent subpixels 10. The wall portions 24 are preferably configured to be able to reflect at least a portion of the light incident through the protective layer 18. This makes it possible to suppress color mixing between adjacent subpixels 10.

[0216] The refractive index of the wall portion 24 is preferably lower than the refractive index of the colored layer 221. This allows light that is incident on the side surface of the wall portion 24 through the colored layer 221 at an incident angle equal to or greater than a predetermined angle to be totally reflected by the side surface of the wall portion 24.

[0217] The refractive index of the wall portion 24 is preferably lower than the refractive index of the protective layer 18. This allows light that is incident on the bottom surface of the wall portion 24 through the protective layer 18 at an incident angle equal to or greater than a predetermined angle to be totally reflected by the bottom surface of the wall portion 24.

[0218] The thickness of each of the colored layers 221R, 221G, and 221B may be thicker than the height of the wall portion 24, as shown in FIG. 17A , or a predetermined colored layer 221 among the colored layers 221R, 221G, and 221B may be thinner than the height of the wall portion 24, as shown in FIG. 17B . While FIG. 17B illustrates an example in which the colored layer 221R among the colored layers 221R, 221G, and 221B is thinner than the height of the wall portion 24, the colored layer 221 that is thinner than the height of the wall portion 24 is not limited to the colored layer 221R, but may be the colored layer 221G or the colored layer 221B. Furthermore, the colored layer 221 that is thinner than the height of the wall portion 24 is not limited to one of the colored layers 221R, 221G, and 221B, but may be two or more layers. The wall portion 24 may be made of a material that is translucent to visible light.

[0219] [Variation 5] As shown in FIG. 18 , three layers, namely, colored layers 221R, 221G, and 221B, may be stacked in the peripheral region RE2 to form a light-shielding layer 22BK. The light-shielding layer 22BK is preferably located above the contact electrode 14. The light-shielding layer 22BK can absorb and block external light (visible light) incident on the peripheral region RE2. This can suppress reflection of external light on the contact electrode 14, the potential supply wiring 112bb, and the like. The light-shielding layer 22BK may have a loop shape similar to that of the contact electrode 14.

[0220] The light-shielding layer 22BK is not limited to a three-layer laminate structure of the colored layers 221R, 221G, and 221B, but may also be a two-layer laminate structure of the colored layers 221R, 221G, and 221B, for example, a two-layer laminate structure of the colored layers 221R and 221B.

[0221] Since the light-shielding layer 22BK is composed of the same colored layers 221R, 221G, and 221B as the color filter 222, the color filter 222 and the light-shielding layer 22BK can be formed simultaneously in the process of forming the color filter 222. Therefore, the light-shielding layer 22BK can be formed without increasing the number of manufacturing steps for the display device 105 or the like.

[0222] [Modification 6] As shown in FIG. 19A, the display device 101 according to the first embodiment may further include a lens array 23 on the first surface of the protective layer 18.

[0223] The lens array 23 includes a plurality of lenses 231. Each of the lenses 231 is provided above each light-emitting element 12. The lenses 231 can focus light incident from the light-emitting elements 12 in a forward direction. The lenses 231 are convex lenses having a convex focusing surface on the side opposite to the light-emitting elements 12. The focusing surface of the lens 231 preferably has a convex curved surface shape. The lenses 231 are so-called on-chip microlenses (OCLs), and are two-dimensionally arranged on the first surface of the protective layer 18 in a predetermined arrangement pattern. The predetermined arrangement pattern is the same as that of the plurality of subpixels 10 described in the first embodiment. The center of the lens 231 may substantially coincide with the center of the light-emitting region of the light-emitting element 12 in a planar view.

[0224] The lens 231 includes, for example, an organic material or an inorganic material that is transparent to visible light. The organic material includes, for example, a cured product of a photosensitive resin composition such as an ultraviolet curable resin composition. The inorganic material includes, for example, silicon nitride (SiN ｘ ) and silicon oxynitride (SiO ｘ N ｙ The lens 231 may contain a filler. By adjusting the content of the filler contained in the lens 231, the refractive index n １ The filler may be an inorganic filler. The inorganic filler may be, for example, aluminum oxide (AlO ｘ ), titanium oxide (TiO ｘ) and zirconium oxide (ZrO ｘ The filler may be a hollow filler.

[0225] As described above, the display device 105 includes the lens array 23 on the first surface of the color filter 22, so that the light emitted from the color filter 22 can be condensed by the lens array 23. Therefore, the light extraction efficiency of the display device 105 can be improved.

[0226] The lenses 231 may be provided in all the sub-pixels 10 in the display region RE1, or may be provided in only some of the sub-pixels 10 of all the sub-pixels 10 in the display region RE1, for example, only the sub-pixels 10 in a certain region.

[0227] As shown in FIG. 19B , the height and / or width of the lens 231 may differ for each of the subpixels 10R, 10G, and 10B depending on the sizes of the subpixels 10R, 10G, and 10B, i.e., the sizes of the light-emitting elements 12R, 12B, and 12G. More specifically, for example, the larger the size of the subpixels 10R, 10G, and 10B, the higher and / or wider the lens 231 may be. FIG. 19B shows an example in which the size of the subpixel 10B is larger than the size of the subpixel 10R, and therefore the height of the lens 231 of the subpixel 10B is higher than the height of the lens 231 of the subpixel 10R and the width of the lens 231 of the subpixel 10B is wider than the width of the lens 231 of the subpixel 10R. In this specification, "and / or" means at least one of the two. For example, "X and / or Y" means X only, Y only, or both X and Y.

[0228] 20 , the display device 101 may include a color filter 22 and a lens array 23 in this order on the first surface of the protective layer 18. The stacking order of the color filter 22 and the lens array 23 is not limited to the above order, and the color filter 22 may be provided above the lens array 23. A planarization layer (not shown) may be provided between the color filter 22 and the lens array 23.

[0229] [Variation 8] In the entire display region RE1, the centers of the colored layer 221 and the lenses 231 may be approximately aligned in the in-plane direction with the centers of the light-emitting regions of the light-emitting elements 12. However, the positional relationship between the centers of the colored layer 221, the lenses 231, and the light-emitting regions of the light-emitting elements 12 is not limited to this example, and in part or all of the display region RE1, at least one of the centers of the colored layer 221 and the lenses 231 may be shifted in the in-plane direction with respect to the centers of the light-emitting regions of the light-emitting elements 12. For example, the colored layer 221 and the lenses 231 may be arranged as shown in the following first, second, and third arrangement examples.

[0230] (First Arrangement Example) In the central part of the display region RE1, the center of the colored layer 221 and the center of the lens 231 are substantially aligned in the in-plane direction with the center of the light-emitting region of the light-emitting element 12. In contrast, in the peripheral part of the display region RE1, as shown in Fig. 21 , the center of the colored layer 221 and the center of the lens 231 are shifted in the in-plane direction and toward the outer periphery of the display region RE1 with respect to the center of the light-emitting region of the light-emitting element 12.

[0231] The offset of the center of the colored layer 221 and the center of the lens 231 from the center of the light-emitting region of the light-emitting element 12 may increase from the center of the display region RE1 toward the periphery. The amount of offset of the center of the colored layer 221 and the center of the lens 231 from the center of the light-emitting region of the light-emitting element 12 may vary from the center of the display region RE1 toward the periphery, for each sub-pixel 10, for each predetermined number of sub-pixels 10, or for each region. The display region RE1 may have multiple regions in order from the center of the display region RE1 toward the periphery, and the amount of offset of the center of the colored layer 221 and the center of the lens 231 may vary for each of these regions. Here, the center of the colored layer 221, the center of the lens 231, and the center of the light-emitting region of the light-emitting element 12 respectively refer to the geometric center of the colored layer 221, the geometric center of the lens 231, and the geometric center of the light-emitting region of the light-emitting element 12 in a planar view.

[0232] In the display device 101 to which the first arrangement example is applied, the chief ray axis of the peripheral portion of the display region RE1 can be tilted to the outside of the display region RE1 with respect to the normal (Z axis) of the display surface. This improves the viewing angle characteristics of the display device 101. In other words, the display device 101 can have a wide FOV (Field Of View).

[0233] (Second arrangement example) The second arrangement example differs from the first arrangement example in that, at the peripheral portion of the display area RE1, the center of the colored layer 221 and the center of the lens 231 are shifted in the in-plane direction and toward the center of the display area RE1 with respect to the center of the light-emitting area of ​​the light-emitting element 12.

[0234] In the display device 101 to which the second arrangement example is applied, the principal ray axis at the periphery of the display region RE1 can be tilted toward the inside of the display region RE1 with respect to the normal (Z axis) to the display surface.

[0235] (Optical System) The display device 101 to which the above-described first and second arrangement examples are applied is preferably provided in an optical system such as an eyewear device (for example, a VR device, an MR device, or an AR device) or an EVF.

[0236] FIG. 22 is a schematic diagram of an optical system 30a. The optical system 30a includes a display device 101 to which the first arrangement example is applied and an imaging lens 31. The display device 101 is disposed opposite the imaging lens 31. The optical system 30a has an optical axis 30Ax that passes through the center of the display region RE1 of the display device 101 and is perpendicular to the display surface of the display device 101. Here, the center of the display region RE1 refers to the geometric center of the display region RE1 in a planar view. In the display device 101 to which the first arrangement example is applied, light emitted from the light-emitting elements 12 included in the peripheral portion of the display region RE1 is spread with respect to the optical axis 30Ax of the optical system 30a. As a result, light emitted from the peripheral portion of the display region RE1 can be incident on the peripheral portion of the imaging lens 31.

[0237] 23 is a schematic diagram of the optical system 30b. The optical system 30b includes a display device 101 to which the second arrangement example is applied and an imaging lens 31. In the display device 101 to which the second arrangement example is applied, light emitted from the light-emitting elements 12 included in the peripheral portion of the display region RE1 is concentrated toward the optical axis 30Ax of the optical system 30b. This allows the light emitted from the peripheral portion of the display region RE1 to be incident on the peripheral portion of the imaging lens 31.

[0238] In the above example, the display device 101 includes the color filter 22 and the lens array 23. However, the present disclosure is not limited to this example, and the display device 101 may include either the color filter 22 or the lens array 23.

[0239] [Modification 9] In the fifth embodiment, an example has been described in which the tops of the wall portions 15 are spaced apart from the second surfaces of the color filters 22 (see FIGS. 10A and 10B ), but the positions of the tops of the wall portions 15 are not limited to this example. For example, as shown in FIG. 24A , the tops of the wall portions 15 may be located within the color filters 22. In this case, the tops of the wall portions 15 may be located at the boundaries between adjacent colored layers 221.

[0240] 24B , the display device 105 according to the fifth embodiment may further include a lens array 23 on the first surface of the color filter 22, or may include a planarization layer (not shown) and the lens array 23 in this order on the first surface of the color filter 22. The lens array 23 is as described in the sixth modification.

[0241] As described above, when the display device 105 further includes a lens array 23 on the first surface of the color filter 22, the tops of the wall portions 15 may be spaced apart from the second surface of the color filter 22, as shown in Fig. 24B. Alternatively, the tops of the wall portions 15 may protrude from between adjacent lenses 231, as shown in Fig. 24C. In this case, the wall portions 15 may be provided between adjacent colored layers 221 in the in-plane direction and between adjacent lenses 231 in the in-plane direction.

[0242] When the tops of the walls 15 protrude from between the adjacent lenses 231, the display device 105 may further include a protective layer 25 that covers the lens array 23. The refractive index n １ is the refractive index n of the protective layer 25 ２ is preferably higher than (n ２ <n １ The refractive index n of the lens array 23 １ is the refractive index n of the protective layer 25 ２ Since the refractive index is higher than that of the protective layer 25, the light can be refracted and focused at the interface between the lens array 23 and the protective layer 25. Therefore, the light extraction function can be improved.

[0243] In the above example, the display device 105 is described as having the lens array 23 on the first surface of the color filter 22. However, the arrangement position of the lens array 23 is not limited to on the first surface of the color filter 22, and the lens array 23 may be provided below the second surface of the lens array 23. More specifically, for example, as shown in Fig. 24D, the lens array 23 may be provided between the protective layer 16 and the color filter 22. In this case, a planarization layer 26 may be provided between the lens array 23 and the color filter 22.

[0244] When the lens array 23 is provided between the protective layer 16 and the color filter 22, the tops of the walls 15 may be spaced apart from the second surface of the lens array 23, as shown in Fig. 24D. Alternatively, the walls 15 may penetrate the lens array 23, the planarizing layer 26, and the color filter 22, with the tops of the walls 15 protruding from the first surface of the color filter 22, as shown in Fig. 24E. In this case, the walls 15 may be provided between the colored layers 221 adjacent in the in-plane direction and between the lenses 231 adjacent in the in-plane direction. Also, a protective layer 27 may be provided on the first surface of the color filter 22.

[0245] Also, although not shown in the figure, the wall portion 15 may penetrate the lens array 23 and the planarization layer 26, and the top of the wall portion 15 may be located inside the color filter 22 or near the first surface of the color filter 22, or the wall portion 15 may penetrate the lens array 23, and the top of the wall portion 15 may be located inside the planarization layer 26.

[0246] As described above, by providing the display device 105 with the wall portion 15, the color filter 22, and the lens array 23, it is possible to suppress color mixing between adjacent sub-pixels 10, improve color purity, and also improve light extraction efficiency.

[0247] [Modification 11] In the first embodiment, an example was described in which the subpixels 10R, 10G, and 10B have a square shape in a plan view and are two-dimensionally arranged in a grid (matrix) pattern (see FIG. 2 ). However, the shapes and arrangement patterns of the subpixels 10R, 10G, and 10B are not limited to this example. Hereinafter, first to seventh examples of the shapes and arrangement patterns of the subpixels R, 10G, and 10B will be described in order with reference to FIGS. 25A to 25G . Note that in FIGS. 25A to 25G , the wall portions 15 are colored gray to make the positions of the wall portions 15 easy to understand. Furthermore, in FIGS. 25A to 25G , the regions labeled "R," "G," and "B" represent the subpixels 10R, 10G, and 10B, respectively. However, in FIGS. 25B to 25F, since the area of ​​the subpixel 10B is small, the area of ​​the subpixel 10B is indicated by diagonal lines instead of the letter "B."

[0248] 25A is a plan view of a first example of the shapes and arrangement patterns of sub-pixels 10R, 10G, and 10B. The sub-pixels 10R and 10G have a circular shape, and are two-dimensionally arranged in a lattice (matrix) pattern so that the sub-pixels 10R and 10G are alternately arranged in the X-axis direction and the Y-axis direction. The sub-pixel 10B has a diamond shape with each side curved toward the center of the diamond, and is located at the center of the four sub-pixels 10R, 10R, 10G, and 10G that are arranged in a square pattern.

[0249] (Second Example) Figure 25B is a plan view of a second example of the shapes and arrangement patterns of sub-pixels 10R, 10G, and 10B. Sub-pixels 10R and 10G have a square shape. Sub-pixel 10B has a cross shape, and one of the two intersecting linear portions that make up the cross shape extends in the X-axis direction, and the other extends in the Y-axis direction. The second example of the shapes and arrangement patterns of sub-pixels 10 is similar to the first example of the shapes and arrangement patterns of sub-pixels 10 in all other respects.

[0250] 25C is a plan view of a third example of the shapes and arrangement patterns of the sub-pixels 10R, 10G, and 10B. The sub-pixels 10B are divided into two types of sub-pixels 10B. １ , 10B ２ Subpixel 10B １ has a linear shape and extends in the X-axis direction. ２ has a linear shape and extends in the Y-axis direction. １ The example in which the length of the subpixel 10B is approximately equal to the sum of the sizes of the subpixels 10R and 10G in the X-axis direction is shown. １ The length of the subpixel 10B is not limited to this example and can be set arbitrarily. ２ The example in which the length of the subpixel 10B is approximately equal to the sum of the sizes of the subpixels 10R and 10G in the Y-axis direction is shown. ２ The length of the subpixel 10B is not limited to this example and can be set arbitrarily. １ and the length of the subpixel 10B ２ In the example shown, the lengths of the first and second sub-pixels 10 and the second sub-pixels 10 are substantially the same, but the lengths are not limited to this example and may be different. The third example of the shape and arrangement pattern of the sub-pixels 10 is otherwise similar to the second example of the shape and arrangement pattern of the sub-pixels 10.

[0251] (Fourth Example) FIG. 25D is a plan view of a fourth example of the shape and arrangement pattern of the subpixels 10R, 10G, and 10B. The subpixel 10B has an L-shape. The subpixel 10B is arranged along two sides of the subpixel 10R or 10G. The first linear portion constituting the L-shape extends in the X-axis direction along one side of the subpixel 10B or 10G. The length of the first linear portion is approximately equal to the size of the subpixel 10B in the X-axis direction. The second linear portion constituting the L-shape extends in the Y-axis direction along the other side of the subpixel 10B or 10G. The length of the second linear portion is approximately equal to the size of the subpixel 10B in the Y-axis direction. The fourth example of the shape and arrangement pattern of the subpixels 10 is otherwise similar to the second example of the shape and arrangement pattern of the subpixels 10.

[0252] 25E is a plan view of a fifth example of the shapes and arrangement patterns of the sub-pixels 10R, 10G, and 10B. The sub-pixels 10B are composed of two types of sub-pixels 10B. ３ , 10B ４ Subpixel 10B ３ , 10B ４ Both of the subpixels 10A and 10B have a T-shape. ３ The first linear portion forming the T-shape of the subpixel 10B extends in the X-axis direction. ３ In the example shown, the first linear portion forming the T-shape of the subpixel 10B is approximately equal to the sum of the sizes of the subpixels 10R and 10G in the X-axis direction, but the length of the first linear portion is not limited to this example and can be set arbitrarily. ３ The second linear portion forming the T-shape extends in the Y-axis direction from a position that bisects the first linear portion. ３ An example is shown in which the length of the second linear portion forming the T-shape is approximately equal to the size of the subpixel 10R or the subpixel 10G in the Y-axis direction, but the length of the second linear portion is not limited to this example and can be set arbitrarily.

[0253] Subpixel 10B ４ The first linear portion forming the T-shape of the subpixel 10B extends in the Y-axis direction. ４Although an example is shown in which the first linear portion forming the T-shape of the subpixel 10B is approximately equal to the sum of the sizes of the subpixels 10R and 10G in the Y-axis direction, the length of the first linear portion is not limited to this example and can be set arbitrarily. ３ The second linear portion forming the T-shape extends in the X-axis direction from a position that bisects the first linear portion. ４ In the example shown, the length of the second linear portion constituting the T-shape is approximately equal to the size of the subpixel 10R or the subpixel 10G in the X-axis direction, but the length of the second linear portion is not limited to this example and can be set arbitrarily. The fourth example of the shape and arrangement pattern of the subpixels 10 is similar to the second example of the shape and arrangement pattern of the subpixels 10 in all other respects.

[0254] Sixth Example FIG. 25F is a plan view of a sixth example of the shapes and arrangement patterns of subpixels 10R, 10G, and 10B. Subpixel 10B has a ring-shaped configuration surrounding subpixel 10R in a plan view. The ring-shaped configuration is selected according to the shape of subpixel 10R. In the sixth example, since subpixel 10R has a square shape, a square ring-shaped configuration is selected for subpixel 10B. If subpixel 10R has a circular shape, a circular ring-shaped configuration is selected for subpixel 10B. If subpixel 10R has an elliptical shape, an elliptical ring-shaped configuration is selected for subpixel 10B. Subpixel 10B may surround subpixel 10G instead of subpixel 10R, or may surround both subpixels 10R and 10G. The sixth example of the shapes and arrangement patterns of subpixels 10 is similar to the second example of the shapes and arrangement patterns of subpixels 10 except for the points mentioned above.

[0255] Seventh Example FIG. 25G is a plan view of a seventh example of the shape and arrangement pattern of the subpixels 10. The subpixels 10R, 10G, and 10B have an equilateral triangular shape. The subpixels 10R, 10G, and 10B are arranged in a packed arrangement. The subpixels 10R, 10G, and 10B are repeatedly arranged in the X-axis direction in the order of subpixel 10R, subpixel 10B, subpixel 10G, and subpixel 10B, with the sides of adjacent subpixels 10R and 10B facing each other and the sides of adjacent subpixels 10G and 10B facing each other, thereby forming a column of subpixels. Note that the shapes of the subpixels 10R, 10G, and 10B are not limited to equilateral triangles and may be triangles other than equilateral triangles, such as isosceles triangles. In the seventh example, since the subpixel 10R has an equilateral triangular shape, an equilateral triangular ring shape is selected as the shape of the subpixels 10B.

[0256] [Modification 12] In the first embodiment, the reflective surface of the wall portion 15 (first reflective surface 15S １ and the second reflecting surface 15S ２ In the above description, an example has been described in which a reflective surface of the wall portion 15 (either of the reflective surfaces of the wall portion 15 or the reflective surface of the wall portion 15) surrounds each of the light-emitting elements 12R, 12B, and 12G in a planar view (see FIG. 2 ). However, the reflective surface of the wall portion 15 may surround a portion of the light-emitting elements 12R, 12B, and 12G. Eighth to eleventh examples of the shapes and arrangement patterns of the sub-pixels 10 will be described below with reference to FIGS. 26A to 26D . Note that in FIGS. 26A to 26D , the wall portion 15 is colored gray to make it easy to identify its position. Furthermore, in FIGS. 26A to 26D , the regions labeled "R," "G," and "B" represent the sub-pixels 10R, 10G, and 10B, respectively.

[0257] 26A is a plan view of an eighth example of the shapes and arrangement patterns of the sub-pixels 10R, 10G, and 10B. The light-emitting elements 12R, 12G, and 12B, i.e., the sub-pixels 10R, 10G, and 10B, are arranged in a delta arrangement. The light-emitting elements 12R, 12G, and 12B have a circular shape in plan view. The wall portion 15 surrounds the periphery of the light-emitting element 12R among the light-emitting elements 12R, 12G, and 12B in plan view. This allows the second reflective surface 15S of the wall portion 15 to be aligned. ２In plan view, the wall portion 15 surrounds the periphery of the light-emitting element 12R among the light-emitting elements 12R, 12G, and 12B. The light-emitting element 12 surrounded by the wall portion 15 is not limited to the light-emitting element 12R, but may be any one type of light-emitting element 12 or any two types of light-emitting elements 12 among the light-emitting elements 12R, 12G, and 12B. The wall portion 15 has an annular shape in plan view.

[0258] 26B is a plan view of a ninth example of the shapes and arrangement patterns of the sub-pixels 10R, 10G, and 10B. The light-emitting elements 12R, 12G, and 12B have a regular hexagonal shape. The wall portions 15 have a regular hexagonal ring shape in plan view. In other respects, the ninth example of the shapes and arrangement patterns of the sub-pixels 10 may be similar to the eighth example of the shapes and arrangement patterns of the sub-pixels 10.

[0259] 26C is a plan view of a tenth example of the shapes and arrangement patterns of the sub-pixels 10R, 10G, and 10B. The sub-pixels 10R and 10G have a square shape in a plan view. The sub-pixel 10B has a rectangular shape in a plan view. The wall portion 15 has a rectangular ring shape in a plan view. The pair of sub-pixels 10R and 10G aligned in the Y-axis direction and the sub-pixels 10B are alternately arranged in the X-axis direction. The pair of sub-pixels 10R and 10G aligned in the Y-axis direction and the sub-pixels 10B are alternately arranged in the Y-axis direction. The pair of sub-pixels 10R and 10G aligned in the Y-axis direction is surrounded on all sides by the sub-pixels 10B. As a result, the pair of sub-pixels 10R and 10G aligned in the Y-axis direction are in contact with the first reflective surface 15S. １ It is surrounded on all sides by

[0260] The area of ​​the light-emitting region of subpixel 10B in a planar view is larger than the areas of the light-emitting regions of subpixels 10R and 10G in a planar view. More specifically, for example, the size of subpixel 10B in the X-axis direction is the same as the sizes of subpixels 10R and 10G in the X-axis direction, whereas the size of subpixel 10B in the Y-axis direction is approximately twice the size of subpixels 10R and 10G in the X-axis direction. As described above, because the area of ​​the light-emitting region of subpixel 10B is larger than the areas of the light-emitting regions of subpixels 10R and 10G, the current density of subpixel 10B can be kept low while maintaining the luminance of subpixel 10B. Therefore, the driving life of subpixel 10B can be improved.

[0261] 26D is a plan view of an eleventh example of the shapes and arrangement patterns of subpixels 10R, 10G, and 10B. Light-emitting elements 12R, 12G, and 12B, i.e., subpixels 10R, 10G, and 10B, are arranged in a pentile array. More specifically, light-emitting elements 12G are arranged in the Y-axis direction to form a first column. Light-emitting elements 12R and 12B are arranged alternately in the Y-axis direction to form a second column. The first and second columns are arranged alternately in the X-axis direction. The light-emitting elements 12G that make up the first column are shifted by a half pitch in the Y-axis direction with respect to the light-emitting elements 12R or 12B that make up the second column. In the pentile array, two adjacent color subpixels 10G and 10R or two adjacent color subpixels 10G and 10B form one pixel, and the subpixels 10R and 10B are shared between the adjacent pixels. Therefore, the pentile arrangement can improve the apparent definition with a smaller number of pixels than the stripe arrangement or delta arrangement. The wall portion 15 surrounds the periphery of the light emitting element 12R in a plan view.

[0262] [Modification 13] In the first to fourth embodiments, the first reflecting surface 14S that reflects the red light from the light emitting element 12R １ and a first reflecting surface 14S that reflects green light from the light emitting element 12G. １The first reflecting surface 14S that reflects the red light from the light emitting element 12R may have the same characteristics (specifically, the same inclination angle, the same width, the same area, etc.). However, the present disclosure is not limited to this example. １ and a first reflecting surface 14S that reflects green light from the light emitting element 12G. １ may have different characteristics.

[0263] A first reflecting surface 14S that reflects red light from the light emitting element 12R １ and a first reflecting surface 14S that reflects green light from the light emitting element 12G. １ and a second reflective layer 14S that reflects blue light from the light emitting element 12B. ２ may have different characteristics.

[0264] [Modification 14] In the fifth embodiment, the first reflecting surface 14S that reflects white light from the light-emitting element 12W of the sub-pixel 10R １ and a first reflecting surface 14S that reflects white light from the light-emitting element 12W of the sub-pixel 10G. １ The first reflective surface 14S that reflects white light from the light-emitting element 12W of the sub-pixel 10R has the same characteristics (specifically, the same inclination angle, the same width, the same area, etc.). However, the present disclosure is not limited to this example. １ and a first reflecting surface 14S that reflects white light from the light-emitting element 12W of the sub-pixel 10G. １ may have different characteristics.

[0265] A first reflecting surface 14S that reflects white light from the light-emitting element 12W of the sub-pixel 10R １ and a first reflecting surface 14S that reflects white light from the light-emitting element 12W of the sub-pixel 10G. １ and a second reflective layer 14S that reflects white light from the light-emitting element 12B of the sub-pixel 10B. ２ may have different characteristics.

[0266] [Modification 15] The display device 101 according to the first embodiment may include an encapsulating material layer and an opposing substrate, in this order, on the first surface of the protective layer 18. The encapsulating material layer is provided between the protective layer 18 and the opposing substrate. The encapsulating material layer is translucent to the light of each color emitted from the light emitting elements 12R, 12G, and 12B. The encapsulating material layer is preferably transparent to visible light. The encapsulating material layer may also function as an adhesive layer that bonds the protective layer 18 and the opposing substrate.

[0267] The encapsulating material layer includes, for example, a curable resin. The curable resin includes, for example, at least one selected from the group consisting of a thermosetting resin, an ultraviolet curing resin, etc. Note that the encapsulating material layer is not limited to a thermosetting resin or an ultraviolet curing resin, and may include a type of curable resin other than a thermosetting resin or an ultraviolet curing resin.

[0268] The counter substrate seals the plurality of light-emitting elements 12R, 12G, 12B, etc. The counter substrate is made of a material, such as a glass material, that is transparent to the colored light emitted from the light-emitting elements 12R, 12G, 12B. A light-shielding layer serving as a color filter and a black matrix may be provided on the second surface of the counter substrate (the surface facing the drive circuit board 11). This allows the color purity of the light generated by the light-emitting elements 12R, 12G, 12B to be increased and extracted, and also absorbs external light reflected by the wiring between the light-emitting elements 12, improving contrast.

[0269] The display device 102 according to the second embodiment, the display device 103 according to the third embodiment, and the display device 104 according to the fourth embodiment may each include the above-described sealing material layer and counter substrate.

[0270] [Variation 16] In the first embodiment, an example in which the wall portion 15 is formed of a low-refractive index layer has been described, but the configuration of the wall portion 15 is not limited to this example. For example, the wall portion 15 may include a metal layer, and the first reflective surface 15S1 may be formed by the metal layer. In this case, it is preferable that the wall portion 15 includes an insulating layer below the metal layer, i.e., between the metal layer and the first electrode 121, the OLED layer 122, the second electrode 123, and the contact portion 171.

[0271] When the wall portion 15 includes a metal layer, the red light emitted from the light emitting element 12R is reflected by the first reflecting surface 15S regardless of the incident angle. １ The green light emitted from the light emitting element 12G can be reflected by the first reflecting surface 15S regardless of the angle of incidence. １ Furthermore, the blue light emitted from the light emitting element 12B can be reflected by the second reflecting surface 15S regardless of the angle of incidence. ２ can be reflected by

[0272] The metal layer may contain at least one metal element selected from the group consisting of aluminum (Al), silver (Ag), indium (In), and zinc (Zn). The metal layer may contain the at least one metal element as a constituent element of an alloy. Specific examples of the alloy include an aluminum alloy and a silver alloy. Specific examples of the silver alloy include a magnesium-silver alloy (MgAg alloy).

[0273] [Variation 17] Each of the light-emitting elements 12R, 12G, and 12B may have a resonator structure, or a specific light-emitting element 12 among the light-emitting elements 12R, 12G, and 12B may have a resonator structure. The resonator structure of the light-emitting element 12R can resonate and emphasize red light emitted from the OLED layer 122R. The resonator structure of the light-emitting element 12G can resonate and emphasize green light emitted from the OLED layer 122G. The resonator structure of the light-emitting element 12B can resonate and emphasize blue light emitted from the OLED layer 122B.

[0274] When the first electrode 121 is a reflective electrode that functions as a reflective layer, a resonator structure may be formed by the first electrode 121 and the second electrode 123. In this case, the optical distance between the first electrode 121 and the second electrode 123 may be set by the thickness of the OLED layer 122, the selection of the material of the first electrode 121, or a combination thereof.

[0275] When the first electrode 121 is a reflective electrode that functions as a reflective layer, a resonator structure may be formed by the first electrode 121 and the common electrode 17. In this case, the optical distance between the first electrode 121 and the common electrode 17 may be set by the thickness of the second electrode 123, the thickness of the OLED layer 122, the selection of the material of the first electrode 121, or a combination of two or more of these.

[0276] When the first electrode 121 is a transparent electrode (transparent conductive oxide layer), a reflective layer may be provided below the transparent electrode, and a resonator structure may be formed by the reflective layer and the second electrode 123. In this case, the optical distance between the reflective layer and the second electrode 123 may be set by the thickness of the first electrode (transparent electrode) 121, the thickness of the OLED layer 122, the selection of the material of the reflective layer, the thickness of an insulating layer provided between the first electrode (transparent electrode) 121 and the reflective layer, or a combination of two or more of these.

[0277] When the first electrode 121 is a transparent electrode, a reflective layer may be provided below the transparent electrode, and a resonator structure may be formed by the reflective layer and the common electrode 17. In this case, the optical distance between the reflective layer and the common electrode 17 may be set by the thickness of the second electrode 123, the thickness of the first electrode (transparent electrode) 121, the thickness of the OLED layer 122, the selection of the material of the reflective layer, the thickness of an insulating layer provided between the first electrode (transparent electrode) 121 and the reflective layer, or a combination of two or more of these.

[0278] When the second electrode 123 or the common electrode 17 forms a resonator structure, the second electrode 123 or the common electrode 17 preferably includes a semi-transmissive reflective layer. The semi-transmissive reflective layer is composed of, for example, a metal layer (metal thin film) or a dielectric multilayer film. The dielectric multilayer film is composed of multiple transparent material layers (dielectric layers). From the viewpoint of improving the half-mirror function, the dielectric multilayer film preferably has a refractive index difference of 0.1 or more with respect to the second electrode 123. Each transparent material layer constituting the dielectric multilayer film includes, for example, at least one dielectric selected from the group consisting of oxides, nitrides, sulfides, carbonates, fluorides, and organic compounds.

[0279] The light emitting elements 12R, 12G, and 12B have a resonator structure, which can improve the color purity and light extraction efficiency of the display device 101. Details of the resonator structure will be described later.

[0280] In the fifth embodiment, the light-emitting element 12W of the sub-pixel 10R, the light-emitting element 12W of the sub-pixel 10G, and the light-emitting element 12W of the sub-pixel 10B may each have a resonator structure, or a specific light-emitting element 12 among the light-emitting element 12W of the sub-pixel 10R, the light-emitting element 12W of the sub-pixel 10G, and the light-emitting element 12W of the sub-pixel 10B may have a resonator structure.

[0281] [Modification 18] In the fifth embodiment, Modification 3, and the like, examples in which the color filter 22 is provided have been described, but a quantum dot layer may be provided instead of the color filter 22, or a quantum dot layer may be provided together with the color filter 22. The quantum dot layer is a color conversion layer that contains quantum dots (semiconductor particles) and can convert the color of light emitted from the plurality of light-emitting elements 12. In this case, the plurality of light-emitting elements 12 may be configured to emit blue light.

[0282] [Modification 19] In the first to fifth embodiments and their modifications, examples have been described in which the light-emitting element 12 is an OLED element, but the light-emitting element 12 is not limited to this example and may be, for example, a self-luminous light-emitting element such as an inorganic LED element, an inorganic electroluminescence (IEL) element, a quantum dot light-emitting diode (QLED) element, or a semiconductor laser element. Two or more types of light-emitting elements selected from these light-emitting elements may be provided in the display devices 101 and 102.

[0283] [Other Modifications] The first to fifth embodiments of the present disclosure and their modifications (hereinafter referred to as "first embodiment, etc.") have been specifically described above, but the present disclosure is not limited to the first embodiment, etc., and various modifications based on the technical ideas of the present disclosure are possible.

[0284] For example, the configurations, methods, processes, shapes, materials, and numerical values, etc., given in the first embodiment, etc., are merely examples, and different configurations, methods, processes, shapes, materials, and numerical values, etc., may be used as necessary.

[0285] The configurations, methods, steps, shapes, materials, numerical values, etc. of the first embodiment etc. can be combined with each other as long as they do not deviate from the gist of this disclosure.

[0286] Unless otherwise specified, the materials exemplified in the first embodiment and the like can be used singly or in combination of two or more.

[0287] The present disclosure may also employ the following configurations. (1) A display device comprising: a plurality of light-emitting elements arranged two-dimensionally; and a wall portion having a first reflecting surface that reflects light from one of the adjacent light-emitting elements and a second reflecting surface that reflects light from the other of the adjacent light-emitting elements, wherein at least one characteristic of the first reflecting surface and the second reflecting surface is different. (2) The display device according to (1), wherein the wall portion is provided around the other light-emitting element in a planar view. (3) The display device according to (1) or (2), wherein the second reflecting surface is provided on the other light-emitting element. (4) The display device according to any one of (1) to (3), wherein the at least one characteristic includes at least one of: an inclination angle of the first reflecting surface being smaller than an inclination angle of the second reflecting surface; a width of the first reflecting surface in a planar view being larger than a width of the second reflecting surface in a planar view; and an area of ​​the first reflecting surface in a planar view being larger than an area of ​​the second reflecting surface in a planar view. (5) The display device according to any one of (1) to (4), wherein the plurality of light-emitting elements include a plurality of first light-emitting elements, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, and the one light-emitting element is the first light-emitting element or the second light-emitting element, and the other light-emitting element is the third light-emitting element. (6) The display device according to (5), wherein the third light-emitting element is arranged to surround the first light-emitting element and the second light-emitting element, respectively, in a planar view. (7) The display device according to (5) or (6), wherein an area of ​​a light-emitting region of the third light-emitting element in a planar view is larger than an area of ​​a light-emitting region of the first light-emitting element and an area of ​​a light-emitting region of the second light-emitting element in the planar view. (8) The display device according to any one of (5) to (7), wherein the first light-emitting element is an organic LED element configured to be capable of emitting red light, the second light-emitting element is an organic LED element configured to be capable of emitting green light, and the third light-emitting element is an inorganic LED element configured to be capable of emitting blue light.(9) The display device according to any one of (1) to (8), wherein the plurality of light-emitting elements include at least one of inorganic LED elements and organic LED elements. (10) The display device according to any one of (1) to (9), wherein the one light-emitting element includes a hole injection layer, and the hole injection layer extends to the wall portion and constitutes the first reflective surface. (11) The display device according to any one of (1) to (9), wherein the one light-emitting element includes an electrode, and the electrode extends to the wall portion and constitutes the first reflective surface. (12) The display device according to any one of (1) to (9), further comprising a first protective layer covering the first reflective surface, and wherein the wall portion includes a low-refractive index layer having the first reflective surface, the refractive index of the low-refractive index layer being lower than the refractive index of the first protective layer. (13) The display device according to any one of (1) to (9), wherein the wall portion includes a metal layer having the first reflective surface. (14) The display device according to any one of (1) to (9), wherein the wall portion is a part of a first protective layer that covers the plurality of light-emitting elements. (15) The display device according to any one of (1) to (14), further comprising: a third electrode that covers the second reflective surface and is connected to the plurality of light-emitting elements; and a second protective layer that is provided on the third electrode, wherein the refractive index of the second protective layer is higher than the refractive index of the third electrode. (16) The display device according to any one of (1) to (15), wherein the light-emitting element includes a first electrode, a light-emitting layer, and a second electrode, in that order, and wherein a bottom of the wall portion is provided on the first electrode. (17) The display device according to any one of (1) to (16), wherein a lower end of the first reflective surface is provided at a position lower than the one light-emitting element. (18) The display device according to any one of (1) to (9), wherein the light-emitting elements include a first electrode, a light-emitting layer, and a second electrode, the light-emitting layer and the second electrode are connected between adjacent light-emitting elements, and the wall portion is provided at a position higher than the light-emitting elements. (19) An electronic device including the display device according to any one of (1) to (18).(20) A method for manufacturing a display device, comprising: a step of forming a first reflecting surface on one of adjacent light-emitting element formation regions; and a step of forming a second reflecting surface on the other of the adjacent light-emitting element formation regions, wherein at least one characteristic of the first reflecting surface and the second reflecting surface is different.

[0288] <8 Examples of Leakage Suppression Structure> The OLED layer 122W of the display device 105 according to the fifth embodiment and the display device 105 according to its modified example is connected between adjacent light-emitting elements 12W in the in-plane direction of the first surface of the drive circuit board 11, and is a layer common to multiple light-emitting elements 12W. For this reason, in the display device 105 according to the fifth embodiment and the display device 105 according to its modified example, there is a risk of current leakage occurring between adjacent light-emitting elements 12W. Below, examples of leakage suppression structures for suppressing such current leakage between light-emitting elements 12W will be described. Note that in the following first to seventh examples, examples will be described in which the OLED layer 122 has two light-emitting units U1 and U2.

[0289] (Leakage Suppression Structure: First Example) Fig. 27 is a cross-sectional view of a first example of the leakage suppression structure. Note that in Fig. 27, layers above the second electrode 123 are not shown. Similarly, in the cross-sectional views for explaining the leakage suppression structures of the second to ninth examples, layers above the second electrode 123 are not shown.

[0290] The insulating layer 13 has openings 13a above each first electrode 121 and covers the periphery of the first surface of the first electrode 121 to the side surface (end surface) of the first electrode 121. Specifically, the insulating layer 13 has side wall portions 13bb and extension portions 13c. The side wall portions 13bb are erected perpendicular to the first surface of the drive circuit board 11 and cover the side surfaces of the first electrodes 121. The extension portions 13c extend from the upper end of the inner circumferential surface of the side wall portions 13bb toward the center of the first surface of the first electrodes 121 and cover the periphery of the first surfaces of the first electrodes 121.

[0291] The inner periphery of the opening 13a in the insulating layer 13 has a canopy-like protruding portion 132b that protrudes toward the center of the opening 13a. The protruding portion 132b is spaced apart from the first surface of the first electrode 121. The protruding portion 132b is preferably provided around the entire periphery of the opening 13a, but may be provided on a portion of the entire periphery of the opening 13a.

[0292] The light-emitting unit U1 and the charge generation layer 1228 included in the OLED layer 122W are disconnected or made highly resistant by the overhanging portion 132b (region A shown in FIG. 27 ). This makes it possible to suppress current leakage between adjacent light-emitting elements 12W. Here, "high resistance" refers to the light-emitting unit U1 and the charge generation layer 1228 becoming extremely thin at the overhanging portion 132b, resulting in high resistance. The disconnection or high resistance of the light-emitting unit U1 and the charge generation layer 1228 caused by the overhanging portion 132b can occur due to the shadowing effect of the overhanging portion 132b during film formation of the OLED layer 122W. A gap 132c may be formed between the overhanging portion 132b and the first electrode 121.

[0293] The insulating layer 13 has a first insulating layer 131 and a second insulating layer 132, which are arranged in this order on the first surface of the drive circuit board 11 and the first surface of the first electrode 121. The first insulating layer 131 has a plurality of first openings 131a. The second insulating layer 132 has a plurality of second openings 132a. The openings 13a are formed by overlapping first openings 131a and second openings 132a. The inner periphery of the second opening 132a in the second insulating layer 132 protrudes further inward from the opening 13a than the inner periphery of the first opening 131a in the first insulating layer 131, forming a protruding portion 132b.

[0294] 28 is a cross-sectional view of a second example of the leakage suppression structure. The second example differs from the first example in that the insulating layer 13 includes a third insulating layer 133 in addition to the first insulating layer 131 and the second insulating layer 132.

[0295] The third insulating layer 133 is provided between the drive circuit board 11 and the first insulating layer 131, and between the first electrode 121 and the first insulating layer 131. The third insulating layer 133 has a third opening 133a on the first surface of the first electrode 121. In the second example, the opening 13a is composed of a first opening 131a, a second opening 132a, and a third opening 133a that are overlapped with each other. The inner periphery of the third opening 133a protrudes further inward than the inner periphery of the first opening 131a. A gap 132c may be formed between the protruding portion 132b and the third insulating layer 133.

[0296] (Leakage Suppression Structure: Third and Fourth Examples) In the first and second examples, examples have been described in which the inner periphery of the opening 13a in the insulating layer 13 has one protruding portion 132b. However, the number of protruding portions that the inner periphery of the opening 13a in the insulating layer 13 has is not limited to these examples, and the inner periphery of the opening 13a in the insulating layer 13 may have two or more protruding portions. Below, an example (third example) in which the inner periphery of the opening 13a in the insulating layer 13 has two protruding portions and an example (fourth example) in which the inner periphery of the opening 13a in the insulating layer 13 has three protruding portions will be described.

[0297] 29 is a cross-sectional view of a third example of the leakage suppression structure. The third example differs from the second example in that insulating layer 13 has fourth insulating layer 134 and fifth insulating layer 135, in that order, on the first surface of second insulating layer 132, and that the inner periphery of opening 13a in insulating layer 13 has two eave-shaped protrusions 132b and 135b.

[0298] The light-emitting unit U1 and the charge generation layer 1228 included in the OLED layer 122W are cut or made highly resistant by the overhanging portion 132b and the overhanging portion 135b. The overhanging portion 135b is provided at a higher position than the overhanging portion 132b with respect to the first surface of the first electrode 121, and is spaced apart from the first surface of the second insulating layer 132. The overhanging portion 135b is set back more away from the center of the opening 13a than the overhanging portion 132b.

[0299] The fourth insulating layer 134 has a fourth opening 134a. The fifth insulating layer 135 has a fifth opening 135a. In the third example, the opening 13a is composed of a first opening 131a, a second opening 132a, a third opening 133a, a fourth opening 134a, and a fifth opening 135a that are overlapping each other. The inner periphery of the fourth opening 134a is recessed in a direction away from the center of the opening 13a relative to the inner peripheries of the second opening 132a and the fifth opening 135a. The inner periphery of the fifth opening 135a protrudes more inward from the opening 13a than the fourth opening 134a, forming a protruding portion 135b.

[0300] 30 is a cross-sectional view of a fourth example of the leakage suppression structure. The fourth example differs from the third example in that insulating layer 13 has sixth insulating layer 136 and seventh insulating layer 137 in this order on the first surface of fifth insulating layer 135, and the inner periphery of opening 13a in insulating layer 13 has three eave-shaped protrusions 132b, 135b, and 137b.

[0301] The light-emitting unit U1 and the charge generation layer 1228 included in the OLED layer 122W are cut or made highly resistant by the overhanging portion 132b, the overhanging portion 135b, and the overhanging portion 137b. The overhanging portion 137b is provided at a higher position than the overhanging portion 135b with respect to the first surface of the first electrode 121, and is spaced apart from the first surface of the fifth insulating layer 135. The overhanging portion 137b is set back more away from the center of the opening 13a than the overhanging portion 135b.

[0302] The sixth insulating layer 136 has a sixth opening 136a. The seventh insulating layer 137 has a seventh opening 137a. In the fourth example, the opening 13a is composed of a first opening 131a, a second opening 132a, a third opening 133a, a fourth opening 134a, a fifth opening 135a, a sixth opening 136a, and a seventh opening 137a, which are all overlapping each other. The inner periphery of the sixth opening 136a is recessed in a direction away from the center of the opening 13a from the inner peripheries of the fifth opening 135a and the seventh opening 137a. The inner periphery of the seventh opening 137a protrudes inward from the sixth opening 136a, forming a protruding portion 137b.

[0303] 31 is a cross-sectional view of a fifth example of a leakage suppression structure. The fifth example differs from the second example in that insulating layer 13 includes first insulating layer 131, second insulating layer 132, and third insulating layer 133, as well as eighth insulating layer 138, and that the inner periphery of opening 13a in insulating layer 13 includes two eave-shaped protrusions 132b and 133b.

[0304] The light-emitting unit U1 and the charge generation layer 1228 included in the OLED layer 122W are cut or made highly resistant by the overhanging portion 132b and the overhanging portion 133b. The overhanging portion 133b overhangs more inwardly of the opening 13a than the overhanging portion 132b. The overhanging portion 133b is located at a lower position than the overhanging portion 132b with respect to the first surface of the first electrode 121. The overhanging portion 133b is spaced apart from the first surface of the first electrode 121.

[0305] The eighth insulating layer 138 is provided between the drive circuit board 11 and the third insulating layer 133, and between the first electrode 121 and the third insulating layer 133. The eighth insulating layer 138 has an eighth opening 138a. In the fifth example, the opening 13a is composed of a first opening 131a, a second opening 132a, a third opening 133a, and an eighth opening 138a, which are overlapped with each other. The inner periphery of the third opening 133a in the third insulating layer 133 protrudes further inward from the opening 13a than the inner periphery of the eighth opening 138a in the eighth insulating layer 138, thereby forming a protruding portion 133b.

[0306] (Leakage Suppression Structure: Sixth Example) Figure 32 is a cross-sectional view of a sixth example of a leakage suppression structure. The sixth example differs from the first example in that the insulating layer 13 has a protruding portion 13b1 on the outer periphery of the side wall portion 13bb instead of having a protruding portion 132b on the inner periphery of the opening 13a. Although Figure 32 shows an example in which the insulating layer 13 has a single-layer structure, it may also have a laminated structure of two or more layers.

[0307] The protruding portion 13b1 protrudes outward from the outer periphery of the side wall portion 13bb. A recess 13b2 is provided at a position a predetermined distance below the upper end of the outer periphery of the side wall portion 13bb. By providing the recess 13b2 on the outer periphery of the side wall portion 13bb in this manner, the protruding portion 13b1 is configured at the upper end of the outer periphery of the side wall portion 13bb. The protruding portion 13b1 and the recess 13b2 are preferably provided around the entire periphery of the side wall portion 13bb, but may be provided on a portion of the entire periphery of the side wall portion 13bb.

[0308] The light-emitting unit U1 and the charge generating layer 1228 included in the OLED layer 122W are cut off or made highly resistant by the protruding portion 132b (area A shown in FIG. 32), which makes it possible to suppress current leakage between adjacent light-emitting elements 12W.

[0309] In the sixth example, the outer periphery of the side wall portion 13bb has one protrusion 13b1 and one recess 13b2. However, the number of protrusions 13b1 and recesses 13b2 on the outer periphery of the side wall portion 13bb is not limited to this example, and the outer periphery of the side wall portion 13bb may have two or more protrusions 13b1 and two or more recesses 13b2. In this case, the two or more recesses 13b2 may be arranged sequentially at a predetermined distance from the top end to the bottom end of the outer periphery of the side wall portion 13bb.

[0310] (Leakage Suppression Structure: Seventh Example) Fig. 33 is a cross-sectional view of a seventh example of the leakage suppression structure. A groove 13Gv is provided between adjacent light-emitting elements 12W. The groove 13Gv may be provided between light-emitting elements 12W adjacent in a predetermined direction (e.g., the Y-axis direction), or may be provided so as to surround the light-emitting element 12W. The groove 13Gv is formed across the insulating layer 13 and the insulating layer 112.

[0311] The light-emitting unit U1 and the charge generation layer 1228 included in the OLED layer 122W are cut or made highly resistive by the groove 13Gv. This makes it possible to suppress current leakage between adjacent light-emitting elements 12W. Here, "high resistance" refers to the light-emitting unit U1 and the charge generation layer 1228 being made extremely thin within the groove 13Gv, as shown in FIG. 34 . Of the layers included in the OLED layer 122W, the light-emitting unit U2 located above the charge generation layer 1228 straddles the groove 13Gv.

[0312] (Leakage Suppression Structure: Eighth Example) FIG. 35 is a cross-sectional view of an eighth example of the leakage suppression structure. A plurality of contact plugs 112a, a plurality of wirings 112b, and a plurality of contact electrodes 112c are provided in the insulating layer 112. Each contact plug 112a electrically connects the first electrode 121 and the wiring 112b. A groove 13Gv is provided between adjacent light-emitting elements 12W. The bottom surface of the groove 13Gv is formed by the first surface of the contact electrode 112c. An auxiliary electrode 112d is provided on the side surface of each groove 13Gv. The auxiliary electrode 112d is in contact with the first surface of the contact electrode 112c.

[0313] The OLED layer 122W is cut by the grooves 13Gv. While Fig. 35 shows an example in which the second electrode 123 is also cut by the grooves 13Gv, the second electrode 123 may not be cut by the grooves 13Gv and may be connected between adjacent light-emitting elements 12W. The second electrode 123 is in contact with the auxiliary electrode 112d on the side surface of the groove 13Gv. The second electrode 123 is in contact with the contact electrode 112c on the bottom surface of the groove 13Gv.

[0314] In the eighth example, the leakage current between adjacent light emitting elements 12W can be drawn into the auxiliary electrode 112d and the contact electrode 112c, thereby suppressing current leakage between adjacent light emitting elements 12W.

[0315] (Leakage Suppression Structure: Ninth Example) Fig. 36 is a cross-sectional view of a ninth example of the leakage suppression structure. In the ninth example, the display device 105 includes a plurality of third electrodes 125. The plurality of third electrodes 125 are provided on the second surface side of the OLED layer 122W, similar to the plurality of first electrodes 121. Each third electrode 125 is disposed between adjacent first electrodes 121.

[0316] 37 is a plan view illustrating the arrangement of the first electrodes 121 and the third electrodes 125. The multiple third electrodes 125 are a group of island-shaped electrodes having a smaller area than the first electrodes 121. The multiple third electrodes 125 are regularly arranged so as to be equally spaced from adjacent first electrodes 121 in a plan view. From another perspective, the multiple third electrodes 125 are arranged at a predetermined distance from each first electrode 121 and so as to surround it in a plan view.

[0317] A plurality of wirings 112b, a plurality of wirings 112e, a plurality of contact plugs 112a, and a plurality of contact plugs 112f are provided in the insulating layer 112. Each contact plug 112a electrically connects the first electrode 121 to the wiring 112b. Each contact plug 112f electrically connects the third electrode 125 to the wiring 112e.

[0318] The plurality of third electrodes 125 are connected to the internal circuitry of the display device 105 via contact plugs 112f, wiring 112e, etc., and are set to a common constant potential. Specifically, when a voltage is applied to the OLED layer 122W, the potential of the third electrodes 125 is set to be smaller than the sum of the potential of the second electrodes 123 and the threshold voltage for the OLED layer 122W. As a result, even if a voltage is applied to the OLED layer 122W by the first electrodes 121 and the second electrodes 123, causing a leakage current from the first electrodes 121, the leakage current flows preferentially to the third electrodes 125. This prevents the leakage current from flowing from the first electrodes 121 to adjacent first electrodes 121.

[0319] (Leakage Suppression Structure: Other Examples) In the first to seventh examples, the OLED layer 122W has two light-emitting units U1 and U2. However, the configuration of the OLED layer 122W is not limited to these examples, and the OLED layer 122W may have a single light-emitting unit U, or may have three or more light-emitting units U.

[0320] In the first to seventh examples, the light-emitting unit U1 and the charge generation layer 1228 included in the OLED layer 122W are cut or made highly resistant by the overhanging portions 132b, 133b, 135b, 137b, and 13b1 and the grooves 13Gv (hereinafter referred to as "overhanging portions 132b and grooves 13Gv, etc."). However, the layers that are cut or made highly resistant by the overhanging portions 132b and grooves 13Gv, etc. are not limited to these examples. For example, the hole injection layer 1221 or the hole transport layer 1222 included in the OLED layer 122W may be cut or made highly resistant by the overhanging portions 132b and grooves 13Gv, etc., or both the hole injection layer 1221 and the hole transport layer 1222 included in the OLED layer 122W may be cut or made highly resistant by the overhanging portions 132b and grooves 13Gv, etc. When the OLED layer 122W has three or more light-emitting units U, two or more light-emitting units U and two or more charge generating layers 1228 included in the OLED layer 122W may be cut or made highly resistant by the protrusion 132b and the groove 13Gv, etc.

[0321] <9 Relationship between Normals Passing Through the Centers of the Light-Emitting Unit, the Lens Element, and the Wavelength Selecting Unit> Below, the relationship between the normal LN passing through the center of the light-emitting unit, the normal LN' passing through the center of the lens element, and the normal LN" passing through the center of the wavelength selecting unit will be described. Here, the light-emitting unit is, for example, the light-emitting element 12 (see FIG. 21 for example). The lens element is, for example, the lens 231 (see FIG. 21 for example). The wavelength selecting unit is, for example, the colored layer 221 (see FIG. 21 for example).

[0322] The size of the wavelength selecting section may be changed as appropriate in accordance with the light emitted by the light emitting section, or in the case where a light absorbing section (e.g., a black matrix section) is provided between the wavelength selecting sections of adjacent light emitting sections, the size of the light absorbing section may be changed as appropriate in accordance with the light emitted by the light emitting section. Also, the size of the wavelength selecting section may be determined by the distance (offset amount) d between the normal line passing through the center of the light emitting section and the normal line passing through the center of the wavelength selecting section. ０ The planar shape of the wavelength selection section may be the same as, similar to, or different from the planar shape of the lens member.

[0323] Below, with reference to Figures 38A, 38B, 38C, and 39, we will explain the relationship between the normals passing through the centers of the light-emitting unit 51, wavelength selection unit 52, and lens member 53 when they are arranged in this order.

[0324] As shown in FIG. 38A, the normal line LN passing through the center of the light emitting unit 51, the normal line LN″ passing through the center of the wavelength selecting unit 52, and the normal line LN′ passing through the center of the lens member 53 may coincide with each other. That is, D ０ = 0, d ０ = 0. However, D ０ represents the distance (offset amount) between the normal line LN passing through the center of the light-emitting portion 51 and the normal line LN′ passing through the center of the lens member 53, and d ０ represents the distance (offset amount) between the normal line LN passing through the center of the light emitting section 51 and the normal line LN″ passing through the center of the wavelength selecting section 52.

[0325] As shown in FIG. 38B, the normal line LN passing through the center of the light-emitting unit 51 and the normal line LN" passing through the center of the wavelength selecting unit 52 are aligned, but the normal line LN passing through the center of the light-emitting unit 51 and the normal line LN" passing through the center of the wavelength selecting unit 52 may not be aligned with the normal line LN' passing through the center of the lens member 53. That is, D ０ >0, d ０ = 0.

[0326] As shown in FIG. 38C, the normal line LN passing through the center of the light emitting unit 51, the normal line LN" passing through the center of the wavelength selecting unit 52, and the normal line LN' passing through the center of the lens member 53 do not coincide with each other, and the normal line LN" passing through the center of the wavelength selecting unit 52 and the normal line LN' passing through the center of the lens member 53 may coincide with each other. That is, D ０ >0, d ０ >0, D ０ = d ０ may be.

[0327] As shown in FIG. 39, a configuration may be adopted in which the normal line LN passing through the center of the light-emitting unit 51, the normal line LN″ passing through the center of the wavelength selecting unit 52, and the normal line LN′ passing through the center of the lens member 53 do not coincide with each other. That is, D ０ >0, d ０ >0, D ０ ≠d ０ Here, it is preferable that the center of the wavelength selection unit 52 (position indicated by a black square in FIG. 39 ) is located on a straight line LL connecting the center of the light emitting unit 51 and the center of the lens member 53 (position indicated by a black circle in FIG. 39 ). Specifically, the distance between the center of the light emitting unit 51 and the center of the wavelength selection unit 52 in the thickness direction (vertical direction in FIG. 39 ) is LL. １ , the distance in the thickness direction between the center of the wavelength selection unit 52 and the center of the lens member 53 is LL ２ When this is done, D ０ >d ０ >0, and taking into account manufacturing variations, d ０ :D ０ =LL １ : (LL １ +LL ２ Here, the thickness direction refers to the thickness direction of the light emitting section 51, the wavelength selecting section 52, and the lens member 53.

[0328] Below, with reference to Figures 40A, 40B, and 41, we will explain the relationship between the normals passing through the centers of the light-emitting unit 51, lens member 53, and wavelength selection unit 52 when they are arranged in this order.

[0329] As shown in FIG. 40A, a normal line LN passing through the center of the light emitting unit 51, a normal line LN″ passing through the center of the wavelength selecting unit 52, and a normal line LN′ passing through the center of the lens member 53 may be configured to coincide with each other. That is, D ０ >0, d ０ = 0.

[0330] As shown in FIG. 40B, the normal line LN passing through the center of the light emitting unit 51, the normal line LN" passing through the center of the wavelength selecting unit 52, and the normal line LN' passing through the center of the lens member 53 do not coincide with each other, and the normal line LN" passing through the center of the wavelength selecting unit 52 and the normal line LN' passing through the center of the lens member 53 may coincide with each other. That is, D ０ >0, d ０ >0, D ０ = d ０ may be.

[0331] As shown in FIG. 41 , a configuration may be adopted in which the normal line LN passing through the center of the light-emitting section 51, the normal line LN″ passing through the center of the wavelength selecting section 52, and the normal line LN′ passing through the center of the lens member 53 do not all coincide. Here, it is preferable that the center of the lens member 53 (the position indicated by the black circle in FIG. 41 ) is located on a straight line LL connecting the center of the light-emitting section 51 and the center of the wavelength selecting section 52 (the position indicated by the black square in FIG. 41 ). Specifically, the distance between the center of the light-emitting section 51 and the center of the lens member 53 in the thickness direction (the vertical direction in FIG. 41 ) is defined as LL. ２ , the distance in the thickness direction between the center of the lens member 53 and the center of the wavelength selection unit 52 is LL １ When this is the case, d ０ >D ０ >0, and taking into account manufacturing variations, D ０ :d ０ =LL ２ : (LL １ +LL ２ Here, the thickness direction refers to the thickness direction of the light emitting section 51, the wavelength selecting section 52, and the lens member 53.

[0332] <10. Examples of Resonator Structure> The subpixels 10 included in the display devices 101 to 105 according to the first to fifth embodiments and the display devices 101 to 105 according to their modifications (hereinafter referred to as the "display device 101 according to the first embodiment, etc.") can be configured to have a resonator structure that resonates light generated by the light-emitting element 12. The resonator structure will be described below with reference to the drawings. In the following description, the first surface of each layer may be referred to as the upper surface.

[0333] (Resonator Structure: First Example) Fig. 42A is a schematic cross-sectional view illustrating a first example of a resonator structure. In the following description, when the light-emitting elements provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to collectively without any particular distinction, these light-emitting elements may be referred to as light-emitting elements 12. When the light-emitting elements provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to separately, these light-emitting elements may be referred to as light-emitting elements 12. Ｒ , 12 Ｇ , 12 Ｂ The portions of the OLED layer 122 corresponding to the sub-pixels 10R, 10G, and 10B are called the OLED layer 122 Ｒ , OLED layer 122 Ｇ , OLED layer 122 Ｂ This is what happens.

[0334] In the first example, the first electrode 121 is formed to have a common film thickness in each light emitting element 12. The same is true for the second electrode 123.

[0335] A reflector 71 is disposed below the first electrode 121 of the light-emitting element 12, with an optical adjustment layer 72 sandwiched therebetween. A resonator structure that resonates the light generated by the OLED layer 122 is formed between the reflector 71 and the second electrode 123. In the following description, the optical adjustment layers 72 provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to as the optical adjustment layers 72. Ｒ , 72 Ｇ , 72 Ｂ This is what happens.

[0336] The reflector 71 is formed to have a common film thickness for each light-emitting element 12. The film thickness of the optical adjustment layer 72 varies depending on the color to be displayed by the sub-pixel. Ｒ , 72 Ｇ , 72 Ｂ By having different film thicknesses, it is possible to set the optical distance that produces the optimum resonance for the wavelength of light corresponding to the color to be displayed.

[0337] In the example shown in FIG. 42A, the light emitting element 12 Ｒ , 12 Ｇ , 12 Ｂ As described above, the film thickness of the optical adjustment layer 72 differs depending on the color to be displayed by the sub-pixel, so the position of the upper surface of the second electrode 123 is aligned with the light emitting element 12. Ｒ , 12 Ｇ , 12 Ｂ It varies depending on the type of

[0338] The reflector 71 can be made of a metal such as aluminum (Al), silver (Ag), or copper (Cu), or an alloy containing any of these as its main component.

[0339] The optical adjustment layer 72 is made of silicon nitride (SiN ｘ ), silicon oxide (SiO ｘ ), silicon oxynitride (SiO ｘ N ｙ The optical adjustment layer 72 may be formed using an inorganic insulating material such as acrylic resin or polyimide resin, or an organic resin material such as acrylic resin or polyimide resin. The optical adjustment layer 72 may be a single layer or a laminated film made of a plurality of these materials. The number of laminated layers may vary depending on the type of light-emitting element 12.

[0340] The first electrode 121 can be formed using a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or zinc oxide (ZnO).

[0341] The second electrode 123 needs to function as a semi-transmissive reflective film. The second electrode 123 can be formed using magnesium (Mg) or silver (Ag), a magnesium-silver alloy (MgAg) containing these as main components, or an alloy containing an alkali metal or an alkaline earth metal.

[0342] (Resonator Structure: Second Example) FIG. 42B is a schematic cross-sectional view for explaining a second example of the resonator structure.

[0343] In the second example, the first electrode 121 and the second electrode 123 are also formed to have the same film thickness in each light emitting element 12 .

[0344] Also in the second example, a reflector 71 is disposed below the first electrode 121 of the light-emitting element 12, with an optical adjustment layer 72 sandwiched therebetween. A resonator structure that resonates the light generated by the OLED layer 122 is formed between the reflector 71 and the second electrode 123. As in the first example, the reflector 71 is formed to have the same film thickness for each light-emitting element 12, and the film thickness of the optical adjustment layer 72 differs depending on the color to be displayed by the sub-pixel.

[0345] In the first example shown in FIG. 42A, the light emitting element 12 Ｒ , 12 Ｇ , 12 Ｂ The upper surfaces of the reflectors 71 are aligned, and the upper surface of the second electrode 123 is positioned so that the light emitting element 12 Ｒ , 12 Ｇ , 12 Ｂ It differed depending on the type of

[0346] In contrast, in the second example shown in FIG. 42B, the upper surface of the second electrode 123 is Ｒ , 12 Ｇ , 12 Ｂ In order to align the upper surfaces of the second electrodes 123, the light emitting elements 12 Ｒ , 12 Ｇ , 12 Ｂ The upper surface of the reflector 71 is Ｒ , 12 Ｇ , 12 ＢTherefore, the lower surface of the reflector 71 (in other words, the upper surface of the base layer (insulating layer) 73) has a stepped shape according to the type of the light emitting element 12.

[0347] The materials constituting the reflector 71, the optical adjustment layer 72, the first electrode 121 and the second electrode 123 are the same as those described in the first example, and therefore description thereof will be omitted.

[0348] (Cavity Resonator Structure: Third Example) Fig. 43A is a schematic cross-sectional view illustrating a third example of the cavity resonator structure. In the following description, the reflectors 71 provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to as "reflectors 71" Ｒ , 71 Ｇ , 71 Ｂ This is what happens.

[0349] In the third example, the first electrode 121 and the second electrode 123 are also formed to have the same film thickness in each light emitting element 12 .

[0350] Also in the third example, a reflector 71 is disposed below the first electrode 121 of the light-emitting element 12, with an optical adjustment layer 72 sandwiched therebetween. A resonator structure that resonates the light generated by the OLED layer 122 is formed between the reflector 71 and the second electrode 123. As in the first and second examples, the film thickness of the optical adjustment layer 72 varies depending on the color to be displayed by the sub-pixel. As in the second example, the position of the upper surface of the second electrode 123 is located above the first electrode 121 of the light-emitting element 12. Ｒ , 12 Ｇ , 12 Ｂ are arranged to align.

[0351] In the second example shown in FIG. 43B, the lower surface of the reflector 71 has a stepped shape according to the type of light emitting element 12 in order to align the upper surface of the second electrode 123 .

[0352] In contrast, in the third example shown in FIG. 43A, the film thickness of the reflector 71 is Ｒ , 12 Ｇ , 12 Ｂ More specifically, the reflector 71 is set to have a different reflecting surface depending on the type of the reflector. Ｒ , 71 Ｇ , 71 ＢThe film thickness is set so that the bottom surfaces of the

[0353] The materials constituting the reflector 71, the optical adjustment layer 72, the first electrode 121 and the second electrode 123 are the same as those described in the first example, and therefore description thereof will be omitted.

[0354] (Fourth Example of Resonator Structure) Fig. 43B is a schematic cross-sectional view illustrating a fourth example of the resonator structure. In the following description, the first electrodes 121 provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to as first electrodes 121 Ｒ , 121 Ｇ , 121 Ｂ This is what happens.

[0355] 43A , the first electrodes 121 and second electrodes 123 of each light-emitting element 12 are formed to have the same film thickness. A reflector 71 is disposed below the first electrodes 121 of the light-emitting elements 12 with an optical adjustment layer 72 sandwiched therebetween.

[0356] In contrast, in the fourth example shown in FIG. 43B, the optical adjustment layer 72 is omitted, and the film thickness of the first electrode 121 is set to the same as that of the light emitting element 12 Ｒ , 12 Ｇ , 12 Ｂ The settings were different depending on the type of

[0357] The reflector 71 is formed to have a common thickness for each light-emitting element 12. The thickness of the first electrode 121 varies depending on the color to be displayed by the sub-pixel. Ｒ , 121 Ｇ , 121 Ｂ By having different film thicknesses, it is possible to set the optical distance that produces the optimum resonance for the wavelength of light corresponding to the color to be displayed.

[0358] The materials constituting the reflector 71, the optical adjustment layer 72, the first electrode 121 and the second electrode 123 are the same as those described in the first example, and therefore description thereof will be omitted.

[0359] (Resonator Structure: Fifth Example) FIG. 44A is a schematic cross-sectional view for explaining a fifth example of the resonator structure.

[0360] 42A , the first electrode 121 and the second electrode 123 are formed to have the same film thickness in each light-emitting element 12. A reflector 71 is disposed below the first electrode 121 of the light-emitting element 12 with an optical adjustment layer 72 sandwiched therebetween.

[0361] 44A, the optical adjustment layer 72 is omitted, and instead, an oxide film 74 is formed on the surface of the reflector 71. The thickness of the oxide film 74 is Ｒ , 12 Ｇ , 12 Ｂ In the following description, the oxide films 74 provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to as oxide films 74 Ｒ , 74 Ｇ , 74 Ｂ This is what happens.

[0362] The thickness of the oxide film 74 varies depending on the color to be displayed by the sub-pixel. Ｒ , 74 Ｇ , 74 Ｂ By having different film thicknesses, it is possible to set the optical distance that produces the optimum resonance for the wavelength of light corresponding to the color to be displayed.

[0363] The oxide film 74 is a film obtained by oxidizing the surface of the reflector 71, and is made of, for example, aluminum oxide, tantalum oxide, titanium oxide, magnesium oxide, zirconium oxide, etc. The oxide film 74 functions as an insulating film for adjusting the optical path length (optical distance) between the reflector 71 and the second electrode 123.

[0364] Light-emitting element 12 Ｒ , 12 Ｇ , 12 Ｂ The oxide film 74, which has a different thickness depending on the type of material, can be formed, for example, as follows.

[0365] First, a container is filled with an electrolyte, and the substrate on which the reflector 71 is formed is immersed in the electrolyte. An electrode is disposed so as to face the reflector 71.

[0366] Then, a positive voltage is applied to the reflector 71 with the electrode as a reference, and the reflector 71 is anodized. The thickness of the oxide film formed by anodization is proportional to the voltage value applied to the electrode. Ｒ , 71 Ｇ , 71 Ｂ Anodic oxidation is performed while a voltage according to the type of light emitting element 12 is applied to each of the layers 71 and 72. This allows oxide films 74 with different thicknesses to be formed all at once.

[0367] The materials constituting the reflector 71, the first electrode 121 and the second electrode 123 are the same as those described in the first example, and therefore will not be described again.

[0368] (Resonator Structure: Sixth Example) FIG. 44B is a schematic cross-sectional view for explaining a sixth example of the resonator structure.

[0369] In the sixth example, the light emitting element 12 is configured by laminating a first electrode 121, an OLED layer 122, and a second electrode 123. However, in the sixth example, the first electrode 121 is formed so as to function both as an electrode and a reflector. The first electrode (also serving as a reflector) 121 is formed so as to function as a light emitting element 12. Ｒ , 12 Ｇ , 12 Ｂ The first electrode (also serving as a reflector) 121 is formed of a material having an optical constant selected according to the type of color to be displayed. By varying the phase shift due to the first electrode (also serving as a reflector) 121, it is possible to set the optical distance that produces the optimum resonance for the wavelength of light according to the color to be displayed.

[0370] The first electrode (also serving as a reflector) 121 can be made of a single metal such as aluminum (Al), silver (Ag), gold (Au), or copper (Cu), or an alloy containing these as a main component. Ｒ First electrode (also serving as a reflector) 121 Ｒ is formed of copper (Cu), and the light emitting element 12 Ｇ First electrode (also serving as a reflector) 121 Ｇ and light-emitting element 12 Ｂ First electrode (also serving as a reflector) 121 Ｂ The insulating film 11 may be made of aluminum.

[0371] The material constituting the second electrode 123 is the same as that described in the first example, and therefore a description thereof will be omitted.

[0372] (Resonator Structure: Seventh Example) FIG. 45 is a schematic cross-sectional view for explaining a seventh example of the resonator structure.

[0373] The seventh example is basically the same as the light emitting element 12 Ｒ , 12 Ｇ The sixth example is applied to the light emitting element 12 Ｂ In this configuration, the optical distance that generates the optimum resonance for the wavelength of light corresponding to the color to be displayed can also be set.

[0374] Light-emitting element 12 Ｒ , 12 Ｇ First electrode (also serving as a reflector) 121 used in Ｒ , 121 Ｇ The electrode can be made of a single metal such as aluminum (Al), silver (Ag), gold (Au), or copper (Cu), or an alloy containing any of these as a main component.

[0375] Light-emitting element 12 Ｂ Reflector 71 used in Ｂ , optical adjustment layer 72 Ｂ and the first electrode 121 Ｂ The materials constituting the second embodiment are the same as those described in the first embodiment, and therefore will not be described here.

[0376] <11 Application Examples> (Electronic Devices) The display device 101 etc. according to the first embodiment may be provided in various electronic devices. The display device 101 etc. according to the first embodiment is particularly suitable for eyewear devices such as head-mounted displays, or electronic viewfinders for video cameras or single-lens reflex cameras that require high resolution and are used in close proximity to the eyes with magnification.

[0377] 46A and 46B show an example of the appearance of a digital still camera 310. This digital still camera 310 is an interchangeable lens single-lens reflex type, and has an interchangeable taking lens unit (interchangeable lens) 312 located approximately in the center of the front of a camera main body 311, and a grip part 313 for the photographer to hold on the left side of the front.

[0378] A monitor 314 is provided at a position shifted to the left from the center on the back of the camera body 311. An electronic viewfinder (eyepiece window) 315 is provided above the monitor 314. By looking through the electronic viewfinder 315, the photographer can visually confirm the optical image of the subject guided by the photographing lens unit 312 and determine the composition. The electronic viewfinder 315 includes any of the display devices 101 according to the first embodiment.

[0379] 47 shows an example of the appearance of a head-mounted display 320. The head-mounted display 320 is an example of an eyewear device. The head-mounted display 320 has, for example, ear hooks 322 on both sides of a glasses-shaped display unit 321 for wearing on the user's head. The display unit 321 includes any one of the display devices 101 according to the first embodiment, etc.

[0380] 48 shows an example of the appearance of a television device 330. This television device 330 has, for example, an image display screen unit 331 including a front panel 332 and a filter glass 333, and this image display screen unit 331 includes any one of the display devices 101 according to the first embodiment, etc.

[0381] 49 shows an example of the appearance of a see-through head mounted display 340. The see-through head mounted display 340 is an example of an eyewear device. The see-through head mounted display 340 includes a main body 341, an arm 342, and a lens barrel 343.

[0382] The main body 341 is connected to the arm 342 and the glasses 350. Specifically, an end of the long side of the main body 341 is coupled to the arm 342, and one side of the main body 341 is connected to the glasses 350 via a connecting member. The main body 341 may also be worn directly on the head of a human body.

[0383] The main body 341 incorporates a control board for controlling the operation of the see-through head mounted display 340 and a display unit. The arm 342 connects the main body 341 to the lens barrel 343 and supports the lens barrel 343. Specifically, the arm 342 is coupled to an end of the main body 341 and an end of the lens barrel 343, respectively, and fixes the lens barrel 343. The arm 342 also incorporates a signal line for communicating data related to images provided from the main body 341 to the lens barrel 343.

[0384] The lens barrel 343 projects image light provided from the main body 341 via the arm 342, through an eyepiece 351, toward the eyes of a user wearing the see-through head mounted display 340. In this see-through head mounted display 340, the display unit of the main body 341 includes any one of the display devices 101 according to the first embodiment.

[0385] 50 shows an example of the appearance of a smartphone 360. The smartphone 360 ​​includes a display unit 361 that displays various information, an operation unit 362 that includes buttons and the like that accept operation inputs from the user, and the like. The display unit 361 includes any of the display devices 101 and the like according to the first embodiment.

[0386] (Specific Example 6) The display device 101 according to the first embodiment and the like may be provided in various displays provided in vehicles.

[0387] 51A and 51B are diagrams showing an example of the internal configuration of a vehicle 500 equipped with various displays. Specifically, Fig. 51A is a diagram showing an example of the internal appearance of the vehicle 500 from the rear to the front of the vehicle 500, and Fig. 51B is a diagram showing an example of the internal appearance of the vehicle 500 from diagonally rear to diagonally front of the vehicle 500.

[0388] The vehicle 500 includes a center display 501, a console display 502, a head-up display 503, a digital rearview mirror 504, a steering wheel display 505, and a rear entertainment display 506. At least one of these displays includes any of the display devices 101, etc. according to the first embodiment. For example, all of these displays may include any of the display devices 101, etc. according to the first embodiment.

[0389] The center display 501 is disposed in a portion of the dashboard facing the driver's seat 508 and the passenger's seat 509. While FIGS. 51A and 51B show an example of a horizontally elongated center display 501 extending from the driver's seat 508 side to the passenger's seat 509 side, the screen size and location of the center display 501 are arbitrary. The center display 501 can display information detected by various sensors. As a specific example, the center display 501 can display an image captured by an image sensor, a distance image to obstacles in front of or to the side of the vehicle 500 measured by a ToF sensor, the body temperature of a passenger detected by an infrared sensor, etc. The center display 501 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information.

[0390] The safety-related information includes information such as detection of drowsiness, distraction, child mischief, whether a seatbelt is fastened, and whether a passenger has been abandoned. This information is detected, for example, by a sensor placed on the rear side of the center display 501. The operation-related information is obtained by detecting gestures related to passenger operations using a sensor. The detected gestures may include operations of various equipment within the vehicle 500. For example, operations of the air conditioning system, navigation system, AV system, lighting system, etc. are detected. The life log includes life logs of all passengers. For example, the life log includes a record of each passenger's actions while on board. By acquiring and saving the life log, the condition of the passenger at the time of the accident can be confirmed. The health-related information is obtained by detecting the passenger's body temperature using a sensor such as a temperature sensor, and inferring the passenger's health condition based on the detected body temperature. Alternatively, an image sensor may be used to capture an image of the passenger's face, and the passenger's health condition may be inferred from the facial expression in the image. Furthermore, the system may have an automated voice conversation with the occupant and estimate the occupant's health condition based on the occupant's responses. The authentication / identification-related information includes a keyless entry function that uses a sensor to perform facial authentication, a function that automatically adjusts seat height and position using facial recognition, etc. The entertainment-related information includes a function that uses a sensor to detect operation information of an AV device by the occupant, a function that recognizes the occupant's face using a sensor and provides content suitable for the occupant via the AV device, etc.

[0391] The console display 502 can be used to display, for example, life log information. The console display 502 is disposed near a shift lever 511 on a center console 510 between a driver's seat 508 and a passenger seat 509. Information detected by various sensors can also be displayed on the console display 502. Furthermore, the console display 502 may display an image of the vehicle's surroundings captured by an image sensor, or an image showing the distance to an obstacle around the vehicle.

[0392] The head-up display 503 is virtually displayed behind the windshield 512 in front of the driver's seat 508. The head-up display 503 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. Because the head-up display 503 is often virtually located in front of the driver's seat 508, it is suitable for displaying information directly related to the operation of the vehicle 500, such as the speed of the vehicle 500 and the remaining fuel (battery) level.

[0393] The digital rearview mirror 504 can not only display the rear of the vehicle 500 but also the status of passengers in the rear seats. Therefore, by placing a sensor on the back side of the digital rearview mirror 504, it can be used to display life log information, for example.

[0394] The steering wheel display 505 is disposed near the center of the steering wheel 513 of the vehicle 500. The steering wheel display 505 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. In particular, because the steering wheel display 505 is located near the driver's hands, it is suitable for displaying life log information such as the driver's body temperature, and for displaying information related to the operation of AV equipment, air conditioning equipment, etc.

[0395] The rear entertainment display 506 is attached to the back side of the driver's seat 508 and the passenger seat 509 and is intended for viewing by rear seat passengers. The rear entertainment display 506 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. In particular, since the rear entertainment display 506 is located directly in front of the rear seat passengers, information related to the rear seat passengers is displayed on the rear entertainment display 506. For example, the rear entertainment display 506 may display information related to the operation of an AV device or an air conditioning system, or may display the results of measuring the body temperature of the rear seat passengers using a temperature sensor.

[0396] A sensor may be arranged on the rear surface of the display device 101 or the like, so that the distance to a surrounding object can be measured. Optical distance measurement methods are broadly divided into passive and active types. Passive types measure distance by receiving light from an object without projecting light from the sensor onto the object. Passive types include the lens focusing method, the stereo method, and the monocular vision method. Active types measure distance by projecting light onto an object and receiving reflected light from the object with a sensor. Active types include the optical radar method, the active stereo method, the photometric stereo method, the moire topography method, and the interferometry method. The display device 101 or the like according to the first embodiment can be applied to any of these distance measurement methods. The above-mentioned passive or active distance measurement can be performed by using a sensor arranged on the rear surface of the display device 101 or the like according to the first embodiment.

[0397] 10R, 10G, 10B Subpixel 11 Drive circuit substrate 11Gv Groove 111 Substrate 112 Insulating layer 112a, 112aa Contact plug 112bb Potential supply wiring 113 Pad portion 114 Bonding electrode 12R, 12G, 12B, 12W Light-emitting element 121 First electrode 122R, 122G, 122B, 122W OLED layer 123 Second electrode 13 Insulating layer 13a, 13b Opening 14 Contact electrode 15 Wall portion 15S １ First reflective surface 15S ２Second reflecting surface 151 Hole 152 Protective layer 153 Low refractive index layer 154 Structure 16 Protective layer (first protective layer) 161 Hole 17 Common electrode 171 Contact portion 18 Protective layer (second protective layer) 19, 20 Wall portion 191, 201 Protective wall 21B Light-emitting element 211 First electrode 212B Inorganic layer 213 Second electrode 22 Color filter 22BK Light-shielding layer 221R, 221G, 221B Colored layer 23 Lens array 231 Lens 24 Wall portion 25 Protective layer 26 Planarizing layer 27 Protective layer 30a, 30b Optical system 30Ax Optical axis 31 Imaging lens 101, 102, 103, 104, 105 Display device 310 Digital still camera 320 Head-mounted display 330 Television device 340 See-through head-mounted display 360 Smartphone 500 Vehicle U1, U2 Light-emitting unit RE1 Display area RE2 Peripheral area

Claims

1. A display device comprising: a plurality of light-emitting elements arranged two-dimensionally; a first reflective surface that reflects light from one of the adjacent light-emitting elements; and a wall portion having a second reflective surface that reflects light from the other of the adjacent light-emitting elements, wherein at least one characteristic of the first reflective surface and the second reflective surface is different.

2. The display device according to claim 1, wherein the wall portion is provided around the other light-emitting element in a plan view.

3. The display device according to claim 1, wherein the second reflecting surface is provided on the other light-emitting element.

4. The display device of claim 1, wherein the at least one characteristic includes at least one of the following: an inclination angle of the first reflecting surface is smaller than an inclination angle of the second reflecting surface; a width of the first reflecting surface in a planar view is larger than a width of the second reflecting surface in the planar view; and an area of ​​the first reflecting surface in the planar view is larger than an area of ​​the second reflecting surface in the planar view.

5. The display device according to claim 1, wherein the plurality of light-emitting elements include a plurality of first light-emitting elements, a plurality of second light-emitting elements and a plurality of third light-emitting elements, and the one light-emitting element is the first light-emitting element or the second light-emitting element, and the other light-emitting element is the third light-emitting element.

6. The display device according to claim 5, wherein the third light-emitting element is disposed so as to surround each of the first light-emitting element and the second light-emitting element in a plan view.

7. The display device according to claim 5, wherein an area of ​​the light-emitting region of the third light-emitting element in a planar view is larger than an area of ​​the light-emitting region of the first light-emitting element and an area of ​​the light-emitting region of the second light-emitting element in the planar view.

8. The display device according to claim 5, wherein the first light-emitting element is an organic LED element configured to be capable of emitting red light, the second light-emitting element is an organic LED element configured to be capable of emitting green light, and the third light-emitting element is an inorganic LED element configured to be capable of emitting blue light.

9. The display device according to claim 1, wherein the plurality of light-emitting elements include at least one of inorganic LED elements and organic LED elements.

10. The display device according to claim 1, wherein the one light-emitting element includes a hole injection layer, the hole injection layer extending to the wall portion and constituting the first reflecting surface.

11. The display device according to claim 1, wherein the one light-emitting element includes an electrode, the electrode extending to the wall portion and constituting the first reflecting surface.

12. The display device of claim 1, further comprising a first protective layer covering the first reflective surface, the wall portion including a low refractive index layer having the first reflective surface, the refractive index of the low refractive index layer being lower than the refractive index of the first protective layer.

13. The display device according to claim 1, wherein the wall portion includes a metal layer having the first reflective surface.

14. The display device according to claim 1, wherein the wall portion is a part of a first protective layer that covers the plurality of light-emitting elements.

15. The display device of claim 1, further comprising: a third electrode covering the second reflective surface and connected to the plurality of light-emitting elements; and a second protective layer provided on the third electrode, wherein the refractive index of the second protective layer is higher than the refractive index of the third electrode.

16. The display device according to claim 1, wherein the light-emitting element includes a first electrode, a light-emitting layer, and a second electrode in that order, and the bottom of the wall portion is provided on the first electrode.

17. The display device according to claim 1, wherein a lower end of the first reflecting surface is provided at a position lower than the one of the light-emitting elements.

18. The display device according to claim 1, wherein the light-emitting element includes a first electrode, a light-emitting layer, and a second electrode, the light-emitting layer and the second electrode are connected between adjacent light-emitting elements, and the wall portion is provided at a position higher than the light-emitting elements.

19. An electronic device comprising the display device according to claim 1.

20. A method for manufacturing a display device, comprising: a step of forming a first reflective surface on one of adjacent light-emitting element formation regions; and a step of forming a second reflective surface on the other of the adjacent light-emitting element formation regions, wherein at least one characteristic of the first reflective surface and the second reflective surface is different.

Images