Electronic device comprising coil

Abstract

An electronic device according to various embodiments of the present invention comprises: a circuit board; and a first coil and a second coil which are formed on the circuit board. The first coil includes a plurality of first windings, and the second coil includes a plurality of second windings substantially surrounded by an innermost winding among the plurality of first windings of the first coil and configured to provide power to an external electronic device, wherein the inductance of the second coil may be configured to be greater than the inductance of the first coil.

Description

Electronic devices containing coils

[0001] Various embodiments of the present invention disclose an electronic device comprising at least one coil.

[0002] The use of electronic devices such as portable terminals (e.g., smartphones) and wearable devices (e.g., watches) is increasing, and various functions are being provided to electronic devices.

[0003] The electronic device may include a battery to supply the power necessary to perform various functions. The electronic device may charge the battery via a wired or wireless charging method.

[0004] For example, the wireless charging method can charge the battery of an electronic device by supplying power to a power receiving coil disposed inside the electronic device through a power transmitting coil disposed inside the wireless charging device when the electronic device is disposed on a wireless charging device.

[0005] For example, the wireless charging method can supply power to a power receiving coil disposed inside the external electronic device (e.g., a wearable device) through a power transmitting coil disposed inside the electronic device when an external electronic device (e.g., a wearable device) is disposed on the electronic device.

[0006] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0007] Methods for wirelessly charging electronic devices or external electronic devices may include electromagnetic induction using coils, resonance using resonance, or radio wave radiation using electrical energy converted into microwaves and transmitted.

[0008] For example, the electromagnetic induction method can wirelessly transfer power from a wireless charging device (e.g., a wireless charging transmitter) to an electronic device (e.g., a wireless charging receiver) by using a magnetic field induced through a coil to charge a battery included in the electronic device.

[0009] The electronic device includes at least one coil and can provide wireless charging power to an external electronic device (e.g., a wearable device such as a watch or wireless earphone) using electromagnetic induction.

[0010] For example, if the electronic device includes a coil in which two or more conductors (e.g., conductive wires) are spirally wound to provide wireless charging power to an external electronic device, the lengths of the inner and outer conductors may be different. For example, if current flows through a coil in which the inner and outer conductors have different lengths, a difference in impedance may occur between the inner and outer conductors, resulting in a high current density or an uneven current density distribution in the coil.

[0011] For example, if a high current density is formed or an uneven current density is distributed in a coil for an electronic device to provide wireless charging power to an external electronic device, high temperature heat may be generated in the coil and the wireless charging efficiency may be reduced.

[0012] Various embodiments of the present invention can provide an electronic device capable of distributing a uniform current density to a coil for providing wireless charging power to an external electronic device.

[0013] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0014] An electronic device according to one embodiment of the present invention may include a circuit board, and a first coil and a second coil formed on the circuit board. According to one embodiment, the first coil may include a first plurality of windings. According to one embodiment, the second coil may include a second plurality of windings substantially surrounded by an innermost winding among the first plurality of windings of the first coil and configured to provide power to an external electronic device. According to one embodiment, an inductance of the second coil may be configured to be greater than an inductance of the first coil.

[0015] An electronic device according to one embodiment of the present invention may include a circuit board, a first coil including a plurality of windings formed on the circuit board, and a second coil substantially surrounded by an innermost winding of the first coil formed on the circuit board, the second coil including a 2-1 winding formed on a first layer of the circuit board and a 2-2 winding formed on a second layer overlapping the first layer of the circuit board. In one embodiment, the 2-1 winding may include a first sub-line and a second sub-line, wherein the first sub-line of the 2-1 winding may be disposed on an outer side of the second sub-line. In one embodiment, the 2-2 winding may include a first sub-line and a second sub-line, wherein the first sub-line of the 2-2 winding may be disposed on an inner side of the second sub-line. According to one embodiment, at least one crossing region may be located in the innermost windings of the 2-1 winding and the 2-2 winding. According to one embodiment, in the crossing region, the first sub-line of the 2-1 winding and the first sub-line of the 2-2 winding may be connected, and the second sub-line of the 2-1 winding and the second sub-line of the 2-2 winding may be connected.

[0016] According to various embodiments of the present invention, by uniformly distributing current density in a coil of an electronic device for providing wireless charging power to an external electronic device, heat generated in the coil can be reduced and wireless charging efficiency can be improved.

[0017] In addition, various effects may be provided, either directly or indirectly, through this document.

[0018] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0019] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present invention.

[0020] FIG. 2 is a block diagram of a power circuit and a battery of an electronic device for receiving power from outside the electronic device and / or transmitting power to the outside of the electronic device according to one embodiment of the present invention.

[0021] FIG. 3A is a perspective view of the front of an electronic device according to various embodiments of the present invention.

[0022] FIG. 3b is a perspective view of the rear surface of an electronic device according to various embodiments of the present invention.

[0023] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present invention.

[0024] FIG. 5 is a schematic diagram illustrating a first coil, a second coil, and a circuit board included in an electronic device according to one embodiment of the present invention.

[0025] FIG. 6 is a schematic diagram illustrating the first coil disclosed in FIG. 5 according to one embodiment of the present invention.

[0026] FIG. 7 is a schematic drawing of a first coil in which one conductor is wound in a spiral shape according to one embodiment of the present invention.

[0027] FIG. 8 is a schematic drawing of a first coil in which three conductors are wound in a spiral shape according to one embodiment of the present invention.

[0028] FIG. 9 is a drawing schematically showing the configuration of a second coil according to one embodiment of the present invention.

[0029] FIG. 10 is a schematic diagram showing a second-first winding of a second coil formed on a first layer of a circuit board according to one embodiment of the present invention.

[0030] FIG. 11 is a schematic diagram illustrating a second-second winding of a second coil formed on a second layer of a circuit board according to one embodiment of the present invention.

[0031] FIG. 12 is a schematic diagram showing a configuration in which the 2-1 winding and the 2-2 winding of the 2nd coil are connected in a cross region according to one embodiment of the present invention.

[0032] FIG. 13 is a schematic diagram showing a configuration in which the 2-1 winding and the 2-2 winding of the 2nd coil are connected through at least one via according to one embodiment of the present invention.

[0033] Fig. 14 is a diagram schematically showing the current distribution of a second coil according to one embodiment of the present invention.

[0034] FIG. 15 is a drawing schematically showing the configuration of a second coil according to various embodiments of the present invention.

[0035] FIG. 16 is a schematic diagram illustrating a second-first winding of a second coil formed on a first layer of a circuit board and a second-second winding of a second coil formed on a second layer of a circuit board according to various embodiments of the present invention.

[0036] FIG. 17 is a diagram schematically showing the current distribution of the second coil according to various embodiments of the present invention.

[0037] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments of the present invention.

[0038] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0039] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0040] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0041] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0042] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0043] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0044] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0045] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0046] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0047] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0048] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0049] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0051] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0052] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0053] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0055] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0056] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0057] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0058] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0059] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0060] FIG. 2 is a block diagram (200) of a power circuit (210) and a battery (189) of an electronic device (101) for receiving power from outside the electronic device (101) and / or transmitting power to outside the electronic device (101), according to one embodiment of the present invention.

[0061] Referring to FIG. 2, an electronic device (101) according to one embodiment may include at least one of a battery (189), a power circuit (210), a communication circuit (220), a control circuit (230), and / or a wired interface (240).

[0062] The battery (189) may include, for example, a battery protection circuit module. The battery protection circuit may perform various functions (e.g., a pre-cutting function) to prevent performance degradation or damage of the battery (189). The battery protection circuit may additionally or alternatively be implemented as at least a part of a battery management system (battery management system) for performing cell balancing, measuring the remaining capacity of the battery (189), measuring the number of charge / discharge cycles, measuring temperature, or measuring voltage. According to one embodiment, at least a part of the usage status information or the charging status information of the battery (189) may be checked using a fuel gauge integrated circuit (IC), a power circuit (210), or a sensor module (e.g., a temperature sensor).

[0063] According to one embodiment, the power circuit (210) may include at least one circuit that supports wired charging, which charges the battery (189) using power input from an external electronic device (e.g., a travel adapter (TA)) via a wired interface (240), and / or at least one circuit that supports wireless charging, which charges the battery (189) using power input from an external electronic device (e.g., a wireless charging pad) via a conductive pattern (e.g., a coil) (219).

[0064] According to one embodiment, at least one circuit supporting wired charging may include a circuit configured to charge a battery (189) using power input from an external electronic device (e.g., TA) and / or a circuit configured to generate a specified voltage using a voltage of the battery (189) and transmit transmission power based on the specified voltage to the external electronic device through a wired interface (240) (e.g., USB interface).

[0065] According to one embodiment, at least one circuit supporting wireless charging may include a circuit configured to receive power from an external electronic device through a conductive pattern (219) and charge a battery (189) using the received power (or rectified, converted, and / or regulated power) and / or a circuit configured to convert a voltage of the power received from the battery (189) or the external electronic device (e.g., TA) to have a designated voltage value and convert a current characteristic of the power having the designated voltage value from direct current (DC) to alternating current (AC) and wirelessly transmit the converted current characteristic through the conductive pattern (219).

[0066] According to one embodiment, the power circuit (210) can simultaneously perform an operation of charging the battery (189) and an operation of transmitting power to an external electronic device. For example, the charging circuit (218) can include a plurality of charging circuits. At least one of the plurality of charging circuits can receive power from an external electronic device (e.g., TA) through a wired interface (240) and charge the battery (189) using the received power. At least one of the plurality of charging circuits can transfer the power charged in the battery (189) to the transceiver circuit (213). The transceiver circuit (213) can transmit the power of the battery (189) received from the charging circuit (218) to the external electronic device (e.g., a smart phone, a wireless earphone cradle) through the conductive pattern (219). According to one embodiment, a wireless power transmission method such as a magnetic field inductive coupling method, a resonant coupling method, or a hybrid method thereof can be used for wireless charging.

[0067] According to one embodiment, the power circuit (210) may include a conductive pattern (219), a matching circuit (211), a transceiver circuit (213), a tuning circuit (215), a switching circuit (217), and a charging circuit (218).

[0068] According to one embodiment, the matching circuit (211) may be configured to minimize return loss of power when transmitting power to or receiving power from an external electronic device through the conductive pattern (219). For example, the matching circuit (211) may be inserted into a line between the conductive pattern (219) and the transceiver circuit (213) for impedance matching.

[0069] According to one embodiment, the transceiver circuit (213) may be configured to convert the current of the power signal from alternating current to direct current when receiving power through the conductive pattern (219). For example, the transceiver circuit (213) may include a rectifier circuit. The transceiver circuit (213) may be configured to convert the current of the power signal from direct current to alternating current when transmitting power through the conductive pattern (219). For example, the transceiver circuit (213) may include an inverter circuit. The adjustment circuit (215) is configured to adjust the charging voltage and may include, for example, a linear regulator (e.g., a low dropout (LDO)).

[0070] In one embodiment, the switching circuit (217) may include at least one switch (e.g., including at least one switching circuit) for controlling power output to a device (e.g., an on-the-go (OTG) device) or a wired power receiving device connected via the wired interface (240) and power input from a wired charging device. In one embodiment, the switching circuit (217) may further include at least one switch (e.g., including at least one switching circuit) for controlling a receiving function for wirelessly receiving power from an external electronic device via the conductive pattern (219) and / or a transmitting function for wirelessly transmitting transmission power based on the voltage of the battery (189) or power input from an external electronic device (e.g., a TA) via the conductive pattern (219). In one embodiment, the transceiver circuit (213) may be implemented as a full-bridge inverter or a half-bridge inverter, but the present disclosure is not limited thereto and may be modified in various forms.

[0071] In one embodiment, the charging circuit (218) is electrically connected to the switching circuit (217) and can adjust the voltage and / or current of the power input through wired charging or wireless charging. For example, the charging circuit (218) can charge the battery (189) by adjusting the voltage and / or current of the power input through the switching circuit (217). In one embodiment, the charging circuit (218) may include a switching charger (e.g., a DC / DC converter) including a buck-boost converter (not shown) and a charge controller (not shown). In one embodiment, the charging circuit (218) may include a direct charger that supports direct charging (e.g., “DC charging”) in the form of a switched cap (capacitor) divider. A direct charger may include an N:1 voltage divider that reduces the input voltage by a factor of 1 / N (where N is a positive integer) and increases the input current by a factor of N.

[0072] According to one embodiment, the communication circuit (220) is a circuit for communication between a transmitter and a receiver during wireless charging, and may include at least one of a first communication circuit (221) or a second communication circuit (223). The first communication circuit (221) may, for example, perform communication by loading information onto the power itself transmitted through the conductive pattern (219) (in-band communication). The first communication circuit (221) may communicate with an external electronic device using at least one modulation technique among a frequency shift keying (FSK) modulation technique that loads information onto the frequency of power during wireless power transmission, and an amplitude shift keying (ASK) technique that loads information onto the amplitude of power during wireless power reception. The first communication circuit (221) may be electrically connected between the conductive pattern (219) and the transmission / reception circuit (213) to perform FSK or ASK communication. The second communication circuit (223) can communicate with an external electronic device using a frequency of a different band from the frequency of the wireless power through the conductive pattern (219) (out-of-band communication). For example, the second communication circuit (223) can communicate with the external electronic device using any one of various short-range communication methods such as Bluetooth, BLE (Bluetooth low energy), Wi-Fi, and / or NFC (near field communication). Data transmitted and received with the external electronic device through the communication circuit (220) can include information related to charging (e.g., rectified voltage, information on current flowing in the conductive pattern (219) or the transmission / reception circuit (213) (e.g., current value of a power signal transmitted to the outside through the coil (219) or current value of a power signal received from the outside through the coil (219), various packets, and / or messages for settings.For example, according to the Wireless Power Consortium (WPC) standard, a wireless charging operation may include a ping operation, an identification & configuration operation, and a power transfer operation. The ping operation may include an operation in which the electronic device (101) determines whether an object near the power supply device (e.g., an object placed on a wireless charging pad) is an electronic device capable of communicating for power delivery (PD). As an example of the ping operation, the electronic device (101) (e.g., the control circuit (230)) may receive a data signal (e.g., a digital ping signal or a wakeup signal) from the power supply device through the communication circuit (220) (e.g., the first communication circuit (221)). In response to receiving the data signal, the control circuit (230) may transmit a response signal (e.g., a signal strength packet (SSP)) to the power supply device through the communication circuit (220). The power supply device may recognize that the nearby object is the electronic device (101) based on the reception of the response signal. The confirmation & configuration operation may include an operation in which the electronic device (101) sets a power value of a power signal to be transmitted by the power supply device through data communication with the power supply device using the communication circuit (220). The power transmission operation may include an operation in which the power supply device transmits a power signal having a power value set in the confirmation & configuration operation to the electronic device (101). The wireless charging operation may further include an operation in which the source to transmit power and the sink to receive power are determined through data communication between two electronic devices.

[0073] According to one embodiment, the control circuit (230) may perform overall control of the power circuit (210) and generate various messages required for wireless charging and transmit them to the communication circuit (220). The control circuit (230) may manage power supplied to the electronic device (101) and power transmitted from the electronic device (101) via wireless charging. The control circuit (230) may be implemented, for example, as a power management integrated circuit (PMIC) or at least a part of an application processor.

[0074] According to one embodiment, the control circuit (230) can check charging status information (e.g., charge / discharge voltage / current, battery life, overvoltage, undervoltage, overcurrent, overcharge, overdischarge, overheat, short circuit, or swelling) related to charging of the battery (189). For example, the control circuit (230) can check a signal (voltage or current) of a conductive pattern (219) of the power circuit (210), a matching circuit (211), or an input or output terminal of a transceiver circuit (213). The control circuit (230) can determine the status of the battery (189) based at least in part on the checked charging status information. If the status information of the battery (189) is determined to be abnormal, the control circuit (230) can adjust charging of the battery (189) (e.g., adjust charging current, adjust charging voltage, or stop charging). According to one embodiment, the electronic device (101) may include at least one sensor (e.g., a temperature sensor) for checking the charging state of the battery (189). The control circuit (230) may check the charging state of the battery (189) based on data received from the at least one sensor. For example, if the temperature of the battery (189) being charged is above a certain temperature, the control circuit (230) may determine that the battery (189) is in an overheated state and adjust the charging of the battery (189) (e.g., adjust the charging current, adjust the charging voltage, or stop charging).

[0075] According to one embodiment, the wired interface (240) can connect an external electronic device (e.g., TA) and the electronic device (101) through a connector. The wired interface (240) can include a USB communication module that is connected to a control circuit (230) or a processor (e.g., processor (120) of FIG. 1) through a designated system interface (e.g., inter-integrated circuit (I2C) or mobile industry processor interface (MIPI)). For example, the TA can communicate with the USB communication module of the electronic device (101) through a USB terminal. According to one embodiment, the USB communication module can include a communication module for USB power delivery (PD) communication. According to one embodiment, the external electronic device connected to the electronic device (101) through the wired interface (240) can be a device that supports a programmable power supply (PPS) function or a device that does not support PPS. For example, a PPS-supporting device can adjust the voltage of power output from an external electronic device to the electronic device (101) based on the control of the control circuit (230) of the electronic device (101). A device that does not support PPS can fix the voltage of a power signal output from the external electronic device to the electronic device (101).

[0076] FIG. 3A is a perspective view of the front of an electronic device according to various embodiments of the present invention. FIG. 3B is a perspective view of the rear of an electronic device according to various embodiments of the present invention.

[0077] Referring to FIGS. 3A and 3B , an electronic device (300) according to one embodiment may include a housing (310) that includes a first side (or front side) (310A), a second side (or back side) (310B), and a side surface (310C) that surrounds a space between the first side (310A) and the second side (310B). In another embodiment (not shown), the housing may refer to a structure that forms a portion of the first side (310A), the second side (310B), and the side surface (310C) of FIGS. 3A and 3B . According to one embodiment, the first side (310A) may be formed by a front plate (302) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (310B) may be formed by a substantially opaque back plate (311). The rear plate (311) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (310C) may be formed by a side bezel structure (318) (or “side member”) that is coupled to the front plate (302) and the rear plate (311) and comprises a metal and / or polymer. In some embodiments, the rear plate (311) and the side bezel structure (318) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0078] In the illustrated embodiment, the front plate (302) may include a first region (310D) that extends seamlessly from the first surface (310A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 3B), the rear plate (311) may include a second region (310E) that extends seamlessly from the second surface (310B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (302) or the rear plate (311) may include only one of the first region (310D) or the second region (310E). In some embodiments, the front plate (302) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device (300), the side bezel structure (318) may have a first thickness (or width) on the side that does not include the first region (310D) or the second region (310E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0079] According to one embodiment, an electronic device (300) (e.g., electronic device (101) of FIG. 1) may include at least one of a display (301), an input module (303) (e.g., input module (150) of FIG. 1), an audio output module (307, 314) (e.g., audio output module (155) of FIG. 1), a sensor module (304, 319), a camera module (305, 312, 313) (e.g., camera module (180) of FIG. 1), a key input device (317), an indicator (not shown), and a connector (308). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., key input device (317) or indicator) or may additionally include other components.

[0080] The display (301) may be exposed, for example, through a substantial portion of the front plate (302). In some embodiments, at least a portion of the display (301) may be exposed through the front plate (302), which forms the first surface (310A) and the first region (310D) of the side surface (310C). The display (301) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (304, 319), and / or at least a portion of the key input device (317), may be disposed in the first region (310D), and / or the second region (310E).

[0081] The input module (303) may include a microphone. In some embodiments, the input module (303) may include a plurality of microphones (303) arranged to detect the direction of sound. The audio output module (307, 314) may include speakers (307, 314). The speakers (307, 314) may include an external speaker (307) and a call receiver (314). In some embodiments, the microphone (303), the speakers (307, 314), and the connector (308) may be arranged in the space of the electronic device (300) and may be exposed to the external environment through at least one hole formed in the housing (310). In some embodiments, the hole formed in the housing (310) may be used jointly for the microphone (303) and the speakers (307, 314). In some embodiments, the audio output module (307, 314) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (310).

[0082] The sensor module (304, 319) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (300) or an external environmental state. The sensor module (304, 319) can include, for example, a first sensor module (304) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (310A) of the housing (310), and / or a third sensor module (319) (e.g., an HRM sensor) disposed on a second surface (310B) of the housing (310). The fingerprint sensor may be disposed on the first side (310A) of the housing (310) (e.g., the display (301) as well as the second side (310B). The electronic device (300) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (304).

[0083] The camera modules (305, 312, 313) may include a first camera module (305) disposed on a first side (310A) of the electronic device (300), a second camera module (312) disposed on a second side (310B), and / or a flash (313). The camera modules (305, 312) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (313) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (300).

[0084] The key input device (317) may be disposed on a side surface (310C) of the housing (310). In other embodiments, the electronic device (300) may not include some or all of the above-mentioned key input devices (317), and the key input devices (317) that are not included may be implemented in other forms, such as soft keys, on the display (301). In some embodiments, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0085] The indicator may be disposed, for example, on the first side (310A) of the housing (310). The indicator may provide, for example, status information of the electronic device (300) in the form of light. In another embodiment, the indicator may provide a light source that is linked to the operation of, for example, the camera module (305). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0086] The connector hole (308) may include a first connector hole (308) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0087] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present invention.

[0088] Referring to FIG. 4, the electronic device (400) may include a side bezel structure (410), a first support member (411) (e.g., a bracket), a front plate (420), a display (430), a printed circuit board (440), a battery (450), a second support member (460) (e.g., a rear case), an antenna (470), and a rear plate (480). In some embodiments, the electronic device (400) may omit at least one of the components (e.g., the first support member (411) or the second support member (460)) or may additionally include other components. At least one of the components of the electronic device (400) may be the same as or similar to at least one of the components of the electronic device (101) of FIGS. 1 and 2, or the electronic device (300) of FIGS. 3A and / or 3B, and any overlapping descriptions will be omitted below.

[0089] The first support member (411) may be disposed inside the electronic device (400) and connected to the side bezel structure (410), or may be formed integrally with the side bezel structure (410). The first support member (411) may be formed of, for example, a metal material and / or a non-metallic (e.g., polymer) material. The first support member (411) may have a display (430) coupled to one surface and a printed circuit board (440) coupled to the other surface.

[0090] A printed circuit board (440) may be equipped with, for example, a processor (120), memory (130), and / or an interface (177) as disclosed in FIG. 1. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0091] In one embodiment, the printed circuit board (440) may include a first PCB (440a) and / or a second PCB (440b). For example, the first PCB (440a) and the second PCB (440b) may be spaced apart from each other and may be electrically connected using a connecting member (445) (e.g., a coaxial cable and / or an FPCB). In one embodiment, the printed circuit board (440) may include a structure in which a plurality of printed circuit boards (PCBs) are stacked. For example, the printed circuit board (440) may include an interposer structure. In one embodiment, the printed circuit board (440) may be implemented in the form of a flexible printed circuit board (FPCB) and / or a rigid printed circuit board (PCB).

[0092] The memory may include, for example, volatile memory or non-volatile memory.

[0093] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0094] The battery (450) is a device for supplying power to at least one component of the electronic device (400), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (450) may be disposed substantially on the same plane as, for example, the printed circuit board (440). The battery (450) may be integrally disposed within the electronic device (400). In another embodiment, the battery (450) may be disposed so as to be detachable from the electronic device (400).

[0095] The antenna (470) may be positioned between the rear plate (480) and the battery (450). The antenna (470) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (470) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (310) and / or the first support member (411).

[0096] FIG. 5 is a schematic diagram illustrating a first coil, a second coil, and a circuit board included in an electronic device according to an embodiment of the present invention. FIG. 6 is a schematic diagram illustrating the first coil disclosed in FIG. 5 according to an embodiment of the present invention. FIG. 7 is a schematic diagram illustrating a first coil in which one conductor wire is wound in a spiral shape according to an embodiment of the present invention. FIG. 8 is a schematic diagram illustrating a first coil in which three conductor wires are wound in a spiral shape according to an embodiment of the present invention. FIG. 9 is a schematic diagram illustrating a configuration of a second coil according to an embodiment of the present invention. FIG. 10 is a schematic diagram illustrating a 2-1 winding of a second coil formed in a first layer of a circuit board according to an embodiment of the present invention. FIG. 11 is a schematic diagram illustrating a 2-2 winding of a second coil formed in a second layer of a circuit board according to an embodiment of the present invention.

[0097] According to various embodiments, the electronic device (500) of FIG. 5 may include the electronic device (101) disclosed in FIGS. 1 and 2, the electronic device (300) disclosed in FIGS. 3A and 3B, and / or the electronic device (400) disclosed in FIG. 4. The electronic device (500) of FIG. 5 may include substantially the same components of the electronic device (101) disclosed in FIGS. 1 and 2, the components of the electronic device (300) disclosed in FIGS. 3A and 3B, and / or the components of the electronic device (400) disclosed in FIG. 4.

[0098] According to various embodiments, the battery disclosed below may include the battery (189) disclosed in FIGS. 1 and 2 and / or the battery (450) disclosed in FIG. 4. The first coil (510) and the second coil (520) disclosed below may include the conductive pattern (219) disclosed in FIG. 2. The first coil (510) and the second coil (520) disclosed below may perform substantially the same functions and operations as the conductive pattern (219) disclosed in FIG. 2.

[0099] According to various embodiments, the conductors or sub-lines disclosed below are substantially the same elements, with only different expressions, and may be conductive wires (e.g., copper or aluminum) forming the first coil (510) and the second coil (520).

[0100] Referring to FIG. 5, an electronic device (500) according to one embodiment of the present invention may include a circuit board (530), a first coil (510), and a second coil (520).

[0101] According to one embodiment, the circuit board (530) may include a first coil (510) and a second coil (520). For example, the circuit board (530) may be disposed on the antenna (470) disclosed in FIG. 4. For example, the circuit board (530) may be disposed on a first side (e.g., in the z-axis direction or the top side) or a second side (e.g., in the -z-axis direction or the bottom side) of the antenna (470) illustrated in FIG. 4.

[0102] According to various embodiments, the circuit board (530) may include a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid flexible PCB (RFPCB). The circuit board (530) may include a structure in which multiple circuit boards are stacked. For example, the circuit board (530) may include multiple layers.

[0103] According to one embodiment, the first coil (510) and the second coil (520) may be formed on a circuit board (530). The first coil (510) and the second coil (520) may be disposed on the circuit board (530). For example, the first coil (510) and the second coil (520) may be disposed on the same layer of the circuit board (530). For example, the first coil (510) and the second coil (520) may be disposed on different layers of the circuit board (530). For example, the first coil (510) may be disposed on a designated location (e.g., on the outside) of the circuit board (530), and the second coil (520) may be disposed on the inside of the first coil (510).

[0104] According to various embodiments, the first coil (510) and / or the second coil (510) may supply power to a battery included in the electronic device (500) (e.g., battery (189) of FIGS. 1 and 2 and / or battery (450) of FIG. 4). According to various embodiments, the first coil (510) and / or the second coil (510) may provide power to an external electronic device (e.g., a watch or wireless earphones).

[0105] According to one embodiment, the first coil (510) may include a first plurality of windings. The first coil (510) may be configured in a form in which at least one conductor (e.g., a conductive wire or a sub-line) is wound in a spiral shape. For example, the first coil (510) may include a form in which at least one conductor is wound in a first direction (e.g., counterclockwise) by a plurality of turns (e.g., number of turns) based on a starting point (511) (e.g., a first end) of an outermost winding (515) among the first plurality of windings. For example, an end point (512) (e.g., a second end) of the first coil (510) may be located at an end of an innermost winding (516) among the first plurality of windings of the first coil (510).

[0106] Referring to FIGS. 5 and 6, a starting point (511) of a first coil (510) (e.g., a first end of two conductors (510-1, 510-2) disclosed in FIG. 6) may be electrically connected to a first feed terminal (501). An ending point (512) of the first coil (510) (e.g., a second end of two conductors (510-1, 510-2) disclosed in FIG. 6) may be electrically connected to a second feed terminal (502). For example, the first coil (510) may include a form in which a first conductor (510-1) (e.g., a first sub-line (510-1)) and a second conductor (510-2) (e.g., a second sub-line (510-2)) are wound in a spiral shape. For example, the first conductor (510-1) may be formed on the outside of the second conductor (510-2), and the second conductor (510-2) may be formed on the inside of the first conductor (510-1).

[0107] Referring to FIG. 7, the first coil (510) may include a form in which one conductor (510-1) (e.g., a sub-line) is wound in a spiral shape. For example, the first coil (510) may include a form in which one conductor (510-1) is wound in a first direction (e.g., counterclockwise) with a plurality of turns (e.g., a number of times) based on a starting point (511) (e.g., a first end) of the outermost winding (515). For example, an end point (512) (e.g., a second end) of the first coil (510) may be located at an end of an innermost winding (516) of the first coil (510). A starting point (511) (e.g., a first end) of a first coil (510) in which one conductor (510-1) (e.g., a sub-line) is wound in a spiral shape may be electrically connected to a first feed terminal (501) disclosed in FIG. 5. An ending point (512) (e.g., a second end) of the first coil (510) may be electrically connected to a second feed terminal (502) disclosed in FIG. 5. For example, FIG. 7 is a schematic diagram of a first coil (510) in which one conductor (510-1) is wound in a spiral shape, and may be a drawing in which the first feed terminal (501) and the second feed terminal (502) disclosed in FIG. 5 are omitted.

[0108] Referring to FIG. 8, the first coil (510) may include a first conductor (510-1) (e.g., a first sub-line (510-1)), a second conductor (510-2) (e.g., a second sub-line (510-2)), and a third conductor (510-3) (e.g., a third sub-line) wound in a spiral shape. For example, the first conductor (510-1) may be formed on the outside of the second conductor (510-2), and the third conductor (510-3) may be formed on the inside of the second conductor (510-2). The second conductor (510-2) may be positioned between the first conductor (510-1) and the third conductor (510-3). For example, the first coil (510) may include three conductors (510-1, 510-2, 510-3) wound in a first direction (e.g., counterclockwise) with a plurality of turns (e.g., number of turns) based on the starting point (511) of the outermost winding (515) (e.g., the first end of the three conductors (510-1, 510-2, 510-3)). For example, the end point (512) of the first coil (510) (e.g., the second end of the three conductors (510-1, 510-2, 510-3)) may be located at the end of the innermost winding (516) of the first coil (510). A starting point (511) (e.g., a first end) of a first coil (510) in which three conductors (510-1, 510-2, 510-3) are wound in a spiral shape may be electrically connected to a first power supply terminal (501). An ending point (512) (e.g., a second end) of the first coil (510) may be electrically connected to a second power supply terminal (502) disclosed in FIG. 5. For example, FIG. 8 may be a schematic drawing of a first coil (510) in which three conductors (510-1, 510-2, 510-3) are wound in a spiral shape.

[0109] According to various embodiments, the first coil (510) is not limited to one conductor (510-1) disclosed in FIG. 7, two conductors (510-1, 510-2) disclosed in FIG. 6, and three conductors (510-1, 510-2, 510-3) disclosed in FIG. 8, and may include at least one conductor (e.g., the first conductor (510-1) to the Nth conductor (510-N)) wound in a spiral shape.

[0110] According to various embodiments, the first coil (510) is not limited to the above-described spiral-wound shape, and may include shapes wound in various shapes such as an oval or a polygon (e.g., a square or a hexagon). For example, one conductor (510-1) (e.g., a sub-line) disclosed in FIG. 7 may be divided into a first conductor (510-1) and a second conductor (510-2) as disclosed in FIG. 6. For example, when one conductor (510-1) is divided into a first conductor (510-1) and a second conductor (510-2), the width of one conductor (510-1) may be formed to be substantially the same as the combined width of the first conductor (510-1) and the second conductor (510-2) divided into two. For example, one conductor (510-1) disclosed in FIG. 7 can be divided into a first conductor (510-1), a second conductor (510-2), and a third conductor (510-3) as disclosed in FIG. 8. For example, when one conductor (510-1) is divided into a first conductor (510-1), a second conductor (510-2), and a third conductor (510-3), the width of one conductor (510-1) can be formed to be substantially the same as the combined width of the first conductor (510-1), the second conductor (510-2), and the third conductor (510-3) divided into three.

[0111] According to various embodiments, the first coil (510) may be formed in multiple layers (e.g., a first layer and a second layer) of the circuit board (530). For example, the first plurality of windings of the first coil (510) may be formed in the first layer and the second layer overlapping each other.

[0112] According to one embodiment, the circuit board (530) may include a structure in which a plurality of layers are stacked. The first coil (510) may be disposed on at least one layer (not shown) of the circuit board (530). The circuit board (530) may include a base substrate (not shown). For example, a portion of the first coil (510) may be disposed on a first layer (not shown) positioned in a first direction of the base substrate (e.g., a lower portion of the base substrate). For example, another portion of the first coil (510) may be disposed on a second layer (not shown) positioned in a second direction of the base substrate (e.g., an upper portion of the base substrate). For example, the first layer and / or the second layer may include a spirally wound shape.

[0113] According to one embodiment, the first coil (510) may include at least one conductive wire. The conductive wire may include a plurality of turns (e.g., times) of at least one conductor wound in a first direction (e.g., counterclockwise). For example, at least a portion of the first feed terminal (501) or the second feed terminal (502) may be arranged to overlap an area around which the first coil (510) is wound. For example, an end of the first feed terminal (501) or the second feed terminal (502) may be arranged to face the outside or the inside of the first coil (510).

[0114] In one embodiment, the second coil (520) may be disposed inside the first coil (510). For example, the second coil (520) may be substantially surrounded by the innermost winding (516) of the first plurality of windings of the first coil (510). The second coil (520) may include a second plurality of windings configured to provide power to an external electronic device (e.g., the external electronic device (102, 104) of FIG. 1). For example, the external electronic device (102, 104) may include a wearable electronic device (e.g., a watch and / or wireless earphones). The second coil (520) may be configured with at least two or more conductive wires (e.g., conductive wires or sub-lines) wound in a spiral shape.

[0115] In one embodiment, the second number of the second plurality of windings (e.g., wires) of the second coil (520) may be greater than the first number of the first plurality of windings (e.g., wires) of the first coil (510). For example, the number of turns (e.g., number of turns) of the second plurality of windings of the second coil (520) may be greater than the number of turns (e.g., number of turns) of the first plurality of windings of the first coil (510). For example, the number of turns (e.g., number of turns) of the wires (e.g., windings) of the second coil (520) may be greater than the number of turns (e.g., number of turns) of the wires (e.g., windings) of the first coil (510).

[0116] According to one embodiment, the inductance of the second coil (520) may be greater than the inductance of the first coil (510). For example, the inductance of the second coil (520) may be formed to be about 1.5 to 2 times the inductance of the first coil (510). For example, the inductance of the first coil (510) may be about 10 μF to 12 μF, and the inductance of the second coil (520) may be about 15 μF to 24 μF.

[0117] Referring to FIGS. 5 and 9 to 11, the second plurality of windings of the second coil (520) may include a 2-1 winding (521) and a 2-2 winding (522). For example, the 2-1 winding (521) of the second coil (520) may be formed on a first layer (531) of a circuit board (530). For example, the 2-2 winding (522) of the second coil (520) may be formed on a second layer (532) of a circuit board (530). According to one embodiment, the first layer (531) on which the 2-1 winding (521) is formed and the second layer (532) on which the 2-2 winding (522) is formed may overlap each other. For example, in the embodiment disclosed in FIG. 9, the first layer (531) in which the 2-1 winding (521) is formed and the second layer (532) in which the 2-2 winding (522) is formed are shown as being aligned and overlapping each other, but this is not limited to the first layer (531) in which the 2-1 winding (521) is formed and the second layer (532) in which the 2-2 winding (522) is formed may overlap at least partly.

[0118] In one embodiment, the second coil (520) may include a second-first winding (521) and a second-second winding (522). For example, the second-first winding (521) may include a first conductor (521-1) (e.g., a first sub-line (521-1)) and a second conductor (521-2) (e.g., a second sub-line (521-2)) wound in a spiral shape. For example, the second-first winding (521) of the second coil (520) may be disposed in the first layer (531). For example, the second-second winding (522) of the second coil (520) may be disposed in the second layer (532). The first conductor (521-1) and the second conductor (521-2) of the second-first winding (521) arranged in the first layer (531) and the first conductor (522-1) and the second conductor (522-2) of the second-second winding (522) arranged in the second layer (532) can be connected to each other at an intersection area (525) (e.g., an intersection point).

[0119] According to one embodiment, the circuit board (530) may include a structure in which a plurality of layers are stacked. The second coil (520) may be disposed on at least one layer of the circuit board (530) (e.g., the first layer (531) and / or the second layer (532) of FIG. 9). The circuit board (530) may include a base substrate (not shown). For example, the second-first winding (521) of the second coil (520) may be disposed on the first layer (531) positioned in the first direction of the base substrate. For example, the second-second winding (522) of the second coil (520) may be disposed on the second layer (532) positioned in the second direction of the base substrate. For example, the first layer (531) and / or the second layer (532) may include a spirally wound shape.

[0120] According to one embodiment, among the second plurality of windings of the second coil (520), the second-first winding (521) formed on the first layer (531) of the circuit board (530) may include a first conductor (521-1) (e.g., a first sub-line (521-1)) and a second conductor (521-2) (e.g., a second sub-line (521-2)). For example, the first conductor (521-1) (e.g., a first sub-line or an outer conductor) of the second-first winding (521) may be formed on the outside of the second conductor (521-2) (e.g., a second sub-line or an inner conductor) in the first layer (531).

[0121] According to one embodiment, among the second plurality of windings of the second coil (520), the second-second winding (522) formed on the second layer (532) of the circuit board (530) may include a first conductor (522-1) (e.g., a first sub-line (522-1)) and a second conductor (522-2) (e.g., a second sub-line (522-2)). For example, the first conductor (522-1) (e.g., a first sub-line or an inner conductor) of the second-second winding (522) may be formed on the inner side of the second conductor (522-2) (e.g., a second sub-line or an outer conductor) in the second layer (532).

[0122] According to one embodiment, among the second plurality of windings (e.g., the 2-1 winding (521) and the 2-2 winding (522)) of the second coil (520), at least one intersection area (525) (e.g., intersection point) may be located in the innermost winding (520b). For example, in the intersection area (525), the first conductor (521-1) (e.g., the first sub-line (521-1)) of the 2-1 winding (521) formed in the first layer (531) and the first conductor (522-1) (e.g., the first sub-line (522-1)) of the 2-2 winding (522) formed in the second layer (532) may be connected. For example, in the above-mentioned intersection area (525), the second conductor (521-2) (e.g., the second sub-line (521-2)) of the 2-1 winding (521) formed in the 1st layer (531) and the second conductor (522-2) (e.g., the second sub-line (522-2)) of the 2-2 winding (522) formed in the 2nd layer (532) can be connected. For example, in the above-mentioned intersection area (525), when the first conductor (521-1) (e.g., the first sub-line) of the 2-1 winding (521) formed in the 1st layer (531) and the first conductor (522-1) (e.g., the first sub-line) of the 2-2 winding (522) formed in the 2nd layer (532) are connected, and the second conductor (521-2) (e.g., the second sub-line) of the 2-1 winding (521) formed in the 1st layer (531) and the second conductor (522-2) (e.g., the second sub-line) of the 2-2 winding (522) formed in the 2nd layer (532) are connected, the lengths of the inner conductor and the outer conductor of the 2nd coil (520) can be formed to be substantially the same. For example, when the inner and outer conductors of the second coil (520) are formed to have substantially the same length and current flows through the second coil (520), no impedance difference occurs between the inner and outer conductors, and a uniform current density can be formed and distributed in the second coil (520).

[0123] According to one embodiment, the starting point (526) (e.g., the first end) of the second coil (520) may be located at the outermost winding (520a) of the second-first winding (521) formed in the first layer (531) among the second plurality of windings. For example, the starting point (526) (e.g., the first end) of the second coil (520) may be located at the outermost winding (520a) among the second plurality of windings in the first layer (531).

[0124] According to one embodiment, the end point (527) (e.g., the second end) of the second coil (520) may be located at the outermost winding (520c) of the second-second winding (522) formed in the second layer (532) among the second plurality of windings. For example, the end point (527) (e.g., the second end) of the second coil (520) may be located at the outermost winding (520c) among the second plurality of windings in the second layer (532).

[0125] In one embodiment, a starting point (526) (e.g., a first end) of the second coil (520) may be electrically connected to a third feed terminal (503). An ending point (527) (e.g., a second end) of the second coil (520) may be electrically connected to a fourth feed terminal (504). For example, the third feed terminal (503) may be electrically connected to the first feed terminal (501) disclosed in FIG. 5. For example, the fourth feed terminal (504) may be electrically connected to the second feed terminal (502) disclosed in FIG. 5.

[0126] According to various embodiments, the third feed terminal (503) connected to the starting point (526) of the second coil (520) and the fourth feed terminal (504) connected to the ending point (527) may be omitted. For example, when the third feed terminal (503) and the fourth feed terminal (504) of the second coil (520) are omitted, the first feed terminal (501) and the second feed terminal (502) disclosed in FIG. 5 may be used in common. For example, when the third feed terminal (503) and the fourth feed terminal (504) of the second coil (520) are omitted, the starting point (526) of the second coil (520) may be electrically connected to the first feed terminal (501) of the first coil (510) disclosed in FIG. 5. For example, the end point (527) of the second coil (520) may be electrically connected to the second feed terminal (502) of the first coil (510) disclosed in FIG. 5. For example, the first feed terminal (501) and the second feed terminal (502) may be disposed on the same layer and / or different layers of the circuit board (530). For example, the first feed terminal (501), the second feed terminal (502), the third feed terminal (503), and the fourth feed terminal (504) may be disposed on the same layer and / or different layers of the circuit board (530).

[0127] According to one embodiment, the 2-1 winding (521) formed in the first layer (531) and the 2-2 winding (522) formed in the second layer (522) may overlap each other. The 2-1 winding (521) formed in the first layer (531) and the 2-2 winding (522) formed in the second layer (522) may have symmetrical shapes when the first layer (531) and the second layer (532) overlap each other. For example, the 2-1 winding (521) and the 2-2 winding (522) may have symmetrical shapes with respect to the imaginary center line between the first layer (531) and the second layer (532). According to various embodiments, the 2-1 winding (521) formed on the 1st layer (531) and the 2-2 winding (522) formed on the 2nd layer (522) may have an asymmetrical shape with respect to each other when the 1st layer (531) and the 2nd layer (532) overlap. For example, the 2-1 winding (521) and the 2-2 winding (522) may have an asymmetrical shape with respect to the imaginary center line between the 1st layer (531) and the 2nd layer (532).

[0128] Referring to FIG. 10, among the second plurality of windings of the second coil (520), the second-first winding (521) formed on the first layer (531) of the circuit board (530) may be configured in a form in which the first conductor (521-1) (e.g., the first sub-line or outer conductor) and the second conductor (521-2) (e.g., the second sub-line or inner conductor) are wound in a spiral shape. For example, the 2-1 winding (521) of the 2nd coil (520) may include a form in which the first conductor (521-1) (e.g., the first sub-line or outer conductor) and the second conductor (521-2) (e.g., the second sub-line or inner conductor) are wound in a first direction (e.g., counterclockwise) with a plurality of turns (e.g., times) based on the starting point (526) of the outermost winding (520a) of the 2-1 winding (521). For example, the first conductor (521-1) (e.g., the first sub-line or outer conductor) may be formed on the outside of the second conductor (521-2) (e.g., the second sub-line or inner conductor) in the first layer (531) of the circuit board (530).

[0129] Referring to FIG. 11, among the second plurality of windings of the second coil (520), the second-second winding (522) formed on the second layer (532) of the circuit board (530) may be configured in a form in which the first conductor (522-1) (e.g., the first sub-line or inner conductor) and the second conductor (522-2) (e.g., the second sub-line or outer conductor) are wound in a spiral shape. For example, the second-second winding (522) of the second coil (520) may include a form in which the first conductor (522-1) (e.g., the first sub-line or inner conductor) and the second conductor (522-2) (e.g., the second sub-line or outer conductor) are wound in a second direction (e.g., clockwise) with a plurality of turns (e.g., times) based on the end point (527) of the outermost winding (520c) of the second-second winding (521). For example, the first conductor (522-1) (e.g., the first sub-line or inner conductor) may be formed on the inner side of the second conductor (522-2) (e.g., the second sub-line or outer conductor) in the second layer (531) of the circuit board (530).

[0130] FIG. 12 is a schematic diagram showing a configuration in which the 2-1 winding and the 2-2 winding of the 2nd coil are connected in a cross region according to one embodiment of the present invention.

[0131] According to one embodiment, the second coil (520) may be connected to a first conductor (521-1) (e.g., a first sub-line (521-1)) of a second-first winding (521) formed on a first layer (531) of a circuit board (530) and a first conductor (522-1) (e.g., a first sub-line (522-1)) of a second-second winding (522) formed on a second layer (532) of the circuit board (530) at an intersection area (525) (e.g., an intersection point) as disclosed in FIGS. 5 and 9. For example, in the above-described cross section (525), the second coil (520) may be connected to the second conductor (521-2) (e.g., the second sub-line (521-2)) of the second-first winding (521) formed on the first layer (531) of the circuit board (530) and the second conductor (522-2) (e.g., the second sub-line (522-2)) of the second-second winding (522) formed on the second layer (532) of the circuit board (530).

[0132] FIG. 13 is a schematic diagram showing a configuration in which the 2-1 winding and the 2-2 winding of the 2nd coil are connected through at least one via according to one embodiment of the present invention.

[0133] For example, FIG. 13 may include an embodiment of the cross section (525) disclosed in FIGS. 5, 9, and 14.

[0134] According to one embodiment, the second coil (520) may be connected, at the intersection area (525), to a first conductor (521-1) of the second-first winding (521) (e.g., a first sub-line (521-1)) via a first via (V1) to a first conductor (522-1) of the second-second winding (522) (e.g., a first sub-line (522-1)). For example, the second coil (520) may be connected, at the intersection area (525), to the second conductor (521-2) (e.g., the second sub-line (521-2)) of the second-first winding (521) via the second via (V2) and to the second conductor (522-2) (e.g., the second sub-line (522-2)) of the second-second winding (522). For example, the first via (V1) and the second via (V2) may be formed on the circuit board (530).

[0135] Fig. 14 is a diagram schematically showing the current distribution of a second coil according to one embodiment of the present invention.

[0136] According to one embodiment, in the cross section (525) disclosed in the above-described FIG. 12 or FIG. 13, the first conductor (521-1) (e.g., the first sub-line (521-1)) of the 2-1 winding (521) formed in the 1st layer (531) and the first conductor (522-1) (e.g., the first sub-line (522-1)) of the 2-2 winding (522) formed in the 2nd layer (532) are connected, and the second conductor (521-2) (e.g., the second sub-line (521-2)) of the 2-1 winding (521) formed in the 1st layer (531) and the second conductor (522-2) (e.g., the second sub-line (522-2)) of the 2-2 winding (522) formed in the 2nd layer (532) are connected. When connected, the length of the wire connected between the first conductor (521-1) (e.g., the first sub-line) in the first layer (531) and the first conductor (522-1) (e.g., the first sub-line) in the second layer (532) is formed to be substantially the same as the length of the wire connected between the second conductor (521-2) (e.g., the second sub-line) in the first layer (531) and the second conductor (522-2) (e.g., the second sub-line) in the second layer (532), so that it can be confirmed that a uniform current density is distributed in the second coil (520).

[0137] Fig. 15 is a drawing schematically showing the configuration of a second coil according to various embodiments of the present invention. Fig. 16 is a drawing schematically showing a 2-1 winding of a second coil formed on a first layer of a circuit board and a 2-2 winding of a second coil formed on a second layer of a circuit board according to various embodiments of the present invention.

[0138] In the description disclosed below, the same reference numbers are given to components that are substantially the same as those disclosed in the embodiments disclosed in FIGS. 5 to 11 described above, and redundant descriptions may be omitted.

[0139] Referring to FIGS. 5, 15, and 16, the second plurality of windings of the second coil (520) may include a second-first winding (521) and a second-second winding (522). For example, the second-first winding (521) of the second coil (520) may be formed on a first layer (531) of a circuit board (530). For example, the second-second winding (522) of the second coil (520) may be formed on a second layer (532) of a circuit board (530). For example, the first layer (531) on which the second-first winding (521) is formed and the second layer (532) on which the second-second winding (522) is formed may overlap each other.

[0140] According to various embodiments, the 2-1 winding (521) formed on the 1st layer (531) and the 2-2 winding (522) formed on the 2nd layer (522) may have an asymmetrical shape with respect to each other when the 1st layer (531) and the 2nd layer (532) overlap. For example, the 2-1 winding (521) and the 2-2 winding (522) may have an asymmetrical shape with respect to the imaginary center line between the 1st layer (531) and the 2nd layer (532).

[0141] According to one embodiment, among the second plurality of windings of the second coil (520), the second-first winding (521) formed on the first layer (531) of the circuit board (530) may include a first conducting line (521-1) (e.g., a first sub-line (521-1)) and a second conducting line (521-2) (e.g., a second sub-line (521-2)). For example, the first conducting line (521-1) (e.g., the first sub-line) may be formed on the outside of the second conducting line (521-2) (e.g., the second sub-line) in the first layer (531).

[0142] According to one embodiment, among the 2-1 windings (521), the number of turns of the first conductor (521-1) (e.g., the first sub-line or outer conductor) and the second conductor (521-2) (e.g., the second sub-line or inner conductor) may be different. For example, among the 2-1 windings (521), the number of turns of the first conductor (521-1) (e.g., the first sub-line or outer conductor) may be 13 turns, and the number of turns of the second conductor (521-2) (e.g., the second sub-line or inner conductor) may be 14 turns. For example, among the 2-1 windings (521), the number of turns of the first conductor (521-1) (e.g., the first sub-line or outer conductor) may be 14 turns, and the number of turns of the second conductor (521-2) (e.g., the second sub-line or inner conductor) may be 13 turns.

[0143] According to one embodiment, among the second plurality of windings of the second coil (520), the second-second winding (522) formed on the second layer (532) of the circuit board (530) may include a first conducting line (522-1) (e.g., a first sub-line) and a second conducting line (522-2) (e.g., a second sub-line). For example, the first conducting line (522-1) (e.g., the first sub-line) may be formed on the inner side of the second conducting line (522-2) (e.g., the second sub-line) in the second layer (532).

[0144] According to one embodiment, among the 2-2 windings (522), the number of turns of the first conductor (522-1) (e.g., the first sub-line or inner conductor) and the second conductor (522-2) (e.g., the second sub-line or outer conductor) may be substantially the same. For example, among the 2-2 windings (522), the number of turns of the first conductor (522-1) (e.g., the first sub-line or inner conductor) may be 13 turns, and the number of turns of the second conductor (522-2) (e.g., the second sub-line or outer conductor) may be 13 turns. For example, among the 2-2 windings (522), the number of turns of the first conductor (522-1) (e.g., the first sub-line or inner conductor) may be 14 turns, and the number of turns of the second conductor (522-2) (e.g., the second sub-line or outer conductor) may be 14 turns. For example, when the number of turns of the first conductor (522-1) (e.g., the first sub-line or inner conductor) and the second conductor (522-2) (e.g., the second sub-line or outer conductor) of the 2-2 winding (522) are the same (e.g., 13 turns or 14 turns), the second conductor (522-2) (e.g., the second sub-line or outer conductor) may be formed to have a longer length than the first conductor (522-1) (e.g., the first sub-line or inner conductor). According to various embodiments, the number of turns (e.g., the number of turns) of the 2-1 winding (521) and the 2-2 winding (522) described above is one example, and other various number of turns (e.g., the number of turns) may be applied.

[0145] According to one embodiment, among the second plurality of windings (e.g., the 2-1 winding (521) and the 2-2 winding (522)) of the second coil (520), at least one connection area (625) (e.g., a connection point) may be located in the innermost winding (520b). For example, in the connection area (625), the first conductor (521-1) (e.g., the first sub-line or outer conductor) of the 2-1 winding (521) formed in the first layer (531) and the second conductor (522-2) (e.g., the second sub-line or outer conductor) of the 2-2 winding (522) formed in the second layer (532) may be connected. For example, in the above connection area (625), the second conductor (521-2) (e.g., the second sub-line or inner conductor) of the second-1 winding (521) formed in the first layer (531) and the first conductor (522-1) (e.g., the second sub-line or inner conductor) of the second-2 winding (522) formed in the second layer (532) can be connected. For example, in the above connection area (625), when the first conductor (521-1) (e.g., the first sub-line or outer conductor) of the 2-1 winding (521) formed in the 1st layer (531) and the second conductor (522-2) (e.g., the second sub-line or outer conductor) of the 2-2 winding (522) formed in the 2nd layer (532) are connected, and the second conductor (521-2) (e.g., the second sub-line or inner conductor) of the 2-1 winding (521) formed in the 1st layer (531) and the first conductor (522-1) (e.g., the first sub-line or inner conductor) of the 2-2 winding (522) formed in the 2nd layer (532) are connected, the lengths of the inner and outer conductors of the 2nd coil (520) It can be formed practically identically.For example, when the inner and outer conductors of the second coil (520) are formed to have substantially the same length and current flows through the second coil (520), no impedance difference occurs between the inner and outer conductors, and a uniform current density can be formed and distributed in the second coil (520).

[0146] According to one embodiment, the starting point (526) (e.g., the first end) of the second coil (520) may be located at the outermost winding (520a) of the second-first winding (521) formed in the first layer (531) among the second plurality of windings. For example, the starting point (526) (e.g., the first end) of the second coil (520) may be located at the outermost winding (520a) among the second plurality of windings in the first layer (531).

[0147] According to one embodiment, the end point (527) (e.g., the second end) of the second coil (520) may be located at the outermost winding (520c) of the second-second winding (522) formed in the second layer (532) among the second plurality of windings. For example, the end point (527) (e.g., the second end) of the second coil (520) may be located at the outermost winding (520c) among the second plurality of windings in the second layer (532).

[0148] In one embodiment, a starting point (526) (e.g., a first end) of the second coil (520) may be electrically connected to a third feed terminal (503). An ending point (527) (e.g., a second end) of the second coil (520) may be electrically connected to a fourth feed terminal (504). For example, the third feed terminal (503) may be electrically connected to the first feed terminal (501) disclosed in FIG. 5. For example, the fourth feed terminal (504) may be electrically connected to the second feed terminal (502) disclosed in FIG. 5.

[0149] According to various embodiments, the third feed terminal (503) connected to the starting point (526) of the second coil (520) and the fourth feed terminal (504) connected to the ending point (527) may be omitted. For example, when the third feed terminal (503) and the fourth feed terminal (504) of the second coil (520) are omitted, the first feed terminal (501) and the second feed terminal (502) disclosed in FIG. 5 may be used in common. For example, when the third feed terminal (503) and the fourth feed terminal (504) of the second coil (520) are omitted, the starting point (526) of the second coil (520) may be electrically connected to the first feed terminal (501) of the first coil (510) disclosed in FIG. 5. For example, the end point (527) of the second coil (520) may be electrically connected to the second feed terminal (502) of the first coil (510) disclosed in FIG. 5. For example, the first feed terminal (501) and the second feed terminal (502) may be disposed on the same layer and / or different layers of the circuit board (530). For example, the first feed terminal (501), the second feed terminal (502), the third feed terminal (503), and the fourth feed terminal (504) may be disposed on the same layer and / or different layers of the circuit board (530).

[0150] According to one embodiment, among the second plurality of windings of the second coil (520), the second-first winding (521) formed on the first layer (531) of the circuit board (530) may be configured in a form in which the first conductor (521-1) (e.g., the first sub-line or outer conductor) and the second conductor (521-2) (e.g., the second sub-line or inner conductor) are wound in a spiral shape. For example, the 2-1 winding (521) of the 2nd coil (520) may include a form in which the first conductor (521-1) (e.g., the first sub-line or outer conductor) and the second conductor (521-2) (e.g., the second sub-line or inner conductor) are wound in a first direction (e.g., counterclockwise) with a plurality of turns (e.g., number of turns) based on the starting point (526) of the outermost winding (520a) of the 2-1 winding (521).

[0151] According to one embodiment, among the 2-1 windings (521), the number of turns of the first conductor (521-1) (e.g., the first sub-line or outer conductor) and the second conductor (521-2) (e.g., the second sub-line or inner conductor) may be different. For example, among the 2-1 windings (521), the number of turns of the first conductor (521-1) (e.g., the first sub-line or outer conductor) may be 13 turns, and the number of turns of the second conductor (521-2) (e.g., the second sub-line or inner conductor) may be 14 turns. For example, among the 2-1 windings (521), the number of turns of the first conductor (521-1) (e.g., the first sub-line or outer conductor) may be 14 turns, and the number of turns of the second conductor (521-2) (e.g., the second sub-line or inner conductor) may be 13 turns.

[0152] According to one embodiment, among the second plurality of windings of the second coil (520), the second-second winding (522) formed on the second layer (532) of the circuit board (530) may be configured in a form in which the first conductor (522-1) (e.g., the first sub-line or inner conductor) and the second conductor (522-2) (e.g., the second sub-line or outer conductor) are wound in a spiral shape. For example, the second-second winding (522) of the second coil (520) may include a form in which the first conductor (522-1) (e.g., the first sub-line or inner conductor) and the second conductor (522-2) (e.g., the second sub-line or outer conductor) are wound in a second direction (e.g., clockwise) with a plurality of turns (e.g., number of turns) based on the end point (527) of the outermost winding (520c) of the second-second winding (521).

[0153] According to one embodiment, among the 2-2 windings (522), the number of turns of the first conductor (522-1) (e.g., the first sub-line or inner conductor) and the second conductor (522-2) (e.g., the second sub-line or outer conductor) may be substantially the same. For example, among the 2-2 windings (522), the number of turns of the first conductor (522-1) (e.g., the first sub-line or inner conductor) may be 13 turns, and the number of turns of the second conductor (522-2) (e.g., the second sub-line or outer conductor) may be 13 turns. For example, among the 2-2 windings (522), the number of turns of the first conductor (522-1) (e.g., the first sub-line or inner conductor) may be 14 turns, and the number of turns of the second conductor (522-2) (e.g., the second sub-line or outer conductor) may be 14 turns.

[0154] According to various embodiments, the number of turns (e.g., number of turns) of the above-described 2-1 winding (521) and 2-2 winding (522) is one embodiment, and other various numbers of turns (e.g., number of turns) may be applied.

[0155] FIG. 17 is a diagram schematically showing the current distribution of the second coil according to various embodiments of the present invention.

[0156] According to various embodiments, in the above-described connection area (625) (e.g., connection point), when the first conductor (521-1) (e.g., the first sub-line or outer conductor) of the 2-1 winding (521) formed in the first layer (531) and the second conductor (522-2) (e.g., the second sub-line or outer conductor) of the 2-2 winding (522) formed in the second layer (532) are connected, and the second conductor (521-2) (e.g., the second sub-line or inner conductor) of the 2-1 winding (521) formed in the first layer (531) and the first conductor (522-1) (e.g., the first sub-line or inner conductor) of the 2-2 winding (522) formed in the second layer (532) are connected, the first Since the length of the conductor connected between the first conductor (521-1) (e.g., the first sub-line or outer conductor) and the second conductor (522-2) (e.g., the second sub-line or outer conductor) in the second layer (532) is formed to be substantially the same as the length of the conductor connected between the second conductor (521-2) (e.g., the second sub-line or inner conductor) in the first layer (531) and the first conductor (522-1) (e.g., the first sub-line or inner conductor) in the second layer (532), it can be confirmed that a uniform current density is distributed in the second coil (520).

[0157] An electronic device (101, 300, 400, 500) according to one embodiment of the present invention may include a circuit board (530), and a first coil (510) and a second coil (520) formed on the circuit board (530). According to one embodiment, the first coil (510) may include a first plurality of windings. According to one embodiment, the second coil (520) may include a second plurality of windings that are substantially surrounded by an innermost winding (516) among the first plurality of windings of the first coil (510) and configured to provide power to an external electronic device (102, 104). According to one embodiment, an inductance of the second coil (520) may be configured to be greater than an inductance of the first coil (510).

[0158] According to one embodiment, the second plurality of windings of the second coil (520) are formed on a first layer (531) and a second layer (532) that overlap each other of the circuit board (530), and each winding of the second plurality of windings includes a first sub-line (521-1, 522-1) and a second sub-line (521-2, 522-2), and in the first layer (531), the first sub-line (521-1) can be formed on the outside of the second sub-line (521-2).

[0159] According to one embodiment, the second number of the second plurality of windings of the second coil (520) may be configured to be greater than the first number of the first plurality of windings of the first coil (510).

[0160] According to one embodiment, the inductance of the second coil (520) may be 1.5 to 2 times the inductance of the first coil (510).

[0161] According to one embodiment, the starting point (511) of the first coil (510) may be located at the outermost winding (515) among the first plurality of windings, the ending point (512) of the first coil (510) may be located at the innermost winding (516) among the first plurality of windings, and the starting point (511) of the first coil (510) may be connected to the first power supply terminal (501), and the ending point (512) of the first coil (510) may be connected to the second power supply terminal (502).

[0162] According to one embodiment, in the second layer (532), the first sub-line (522-1) may be formed on the inner side of the second sub-line (522-2).

[0163] According to one embodiment, at least one intersection area (525) is located in the innermost winding (520b) among the second plurality of windings of the second coil (520), and in the intersection area (525), the first sub-line (521-1) in the first layer (531) and the first sub-line (522-1) in the second layer (532) can be connected, and the second sub-line (521-2) in the first layer (531) and the second sub-line (522-2) in the second layer (532) can be connected.

[0164] According to one embodiment, the starting point (526) of the second coil (520) may be located at the outermost winding (520a) among the second plurality of windings in the first layer (531), and the ending point (527) of the second coil (520) may be located at the outermost winding (520c) among the second plurality of windings in the second layer (532).

[0165] According to one embodiment, the second plurality of windings of the second coil (520) may include a 2-1 winding (521) formed in the first layer (531) and a 2-2 winding (522) formed in the second layer (532).

[0166] According to one embodiment, the 2-1 winding (521) formed on the first layer (531) and the 2-2 winding (522) formed on the second layer (532) may be configured to have a symmetrical shape when the first layer (531) and the second layer (532) overlap each other.

[0167] According to one embodiment, the 2-1 winding (521) formed on the first layer (531) and the 2-2 winding (522) formed on the second layer (532) may be configured to have an asymmetrical shape with respect to each other when the first layer (531) and the second layer (532) overlap.

[0168] According to one embodiment, the length of the conductor connecting the first sub-line (521-1) in the first layer (531) and the first sub-line (522-1) in the second layer (532) may be substantially the same as the length of the conductor connecting the second sub-line (521-2) in the first layer (531) and the second sub-line (522-2) in the second layer (532).

[0169] According to one embodiment, when current flows in the second coil (520), the current density of the conductor connected between the first sub-line (521-1) in the first layer (531) and the first sub-line (522-1) in the second layer (532) can be formed to be substantially the same as the current density of the conductor connected between the second sub-line (521-2) in the first layer (531) and the second sub-line (522-2) in the second layer (532).

[0170] According to one embodiment, the first sub-line (521-1) in the first layer (531) and the first sub-line (522-1) in the second layer (532) may be connected through a first via formed in the circuit board (530), and the second sub-line (521-2) in the first layer (531) and the second sub-line (522-2) in the second layer (532) may be connected through a second via formed in the circuit board (530).

[0171] According to one embodiment, at least one connection area (625) is located in the innermost winding (520b) among the second plurality of windings of the second coil (520), and in the connection area (625), the first sub-line (521-1) in the first layer (531) and the second sub-line (522-2) in the second layer (532) can be connected, and the second sub-line (521-2) in the first layer (531) and the first sub-line (522-1) in the second layer (532) can be connected.

[0172] An electronic device (101, 300, 400, 500) according to one embodiment of the present invention may include a circuit board (530), a first coil (510) including a plurality of windings formed on the circuit board (530), and a second coil (520) substantially surrounded by an innermost winding (516) of the first coil (510) formed on the circuit board (530), and including a 2-1 winding (521) formed on a first layer (531) of the circuit board (530) and a 2-2 winding (522) formed on a second layer (532) overlapping the first layer (531) of the circuit board (530). According to one embodiment, the 2-1 winding (521) includes a first sub-line (521-1) and a second sub-line (521-2), wherein the first sub-line (521-1) of the 2-1 winding (521) may be disposed on the outside of the second sub-line (521-2). According to one embodiment, the 2-2 winding (522) includes a first sub-line (522-1) and a second sub-line (522-2), wherein the first sub-line (522-1) of the 2-2 winding (522) may be disposed on the inside of the second sub-line (522-2). According to one embodiment, at least one intersection area (525) may be located in the innermost winding (520b) of the 2-1 winding (521) and the 2-2 winding (522). According to one embodiment, in the intersection area (525), the first sub-line (521-1) of the 2-1 winding (521) and the first sub-line (522-1) of the 2-2 winding (522) may be connected, and the second sub-line (521-2) of the 2-1 winding (521) and the second sub-line (522-2) of the 2-2 winding (522) may be connected.

[0173] According to one embodiment, the inductance of the second coil (520) may be configured to be greater than the inductance of the first coil (510).

[0174] According to one embodiment, the starting point (526) of the second coil (520) may be located at the outermost winding (520a) of the 2-1 winding (521) in the first layer (531), and the ending point (527) of the second coil (520) may be located at the outermost winding (520c) of the 2-2 winding (522) in the second layer (532).

[0175] According to one embodiment, the 2-1 winding (521) formed on the first layer (531) and the 2-2 winding (522) formed on the second layer (532) may be configured to have a symmetrical shape when the first layer (531) and the second layer (532) overlap each other.

[0176] According to one embodiment, the length of the conductor connecting the first sub-line (521-1) of the 2-1 winding (521) and the first sub-line (522-1) of the 2-2 winding (522) may be configured to be substantially the same as the length of the conductor connecting the second sub-line (521-2) of the 2-1 winding (521) and the second sub-line (522-2) of the 2-2 winding (522).

[0177] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0178] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0179] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0180] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0181] Although the present invention has been described above according to various embodiments of the present invention, it is obvious that changes and modifications made by a person having ordinary skill in the art to which the present invention pertains within a scope that does not depart from the technical characteristics of the present invention also belong to the present invention.

Claims

1. In electronic devices (101, 300, 400, 500), Circuit board (530); and It includes a first coil (510) and a second coil (520) formed on the circuit board (530), The above first coil (510) includes a first plurality of windings, The second coil (520) comprises a second plurality of windings substantially surrounded by the innermost winding (516) of the first plurality of windings of the first coil (510) and configured to provide power to an external electronic device (102, 104), and An electronic device wherein the inductance of the second coil (520) is greater than the inductance of the first coil (510).

2. In paragraph 1, The second plurality of windings of the second coil (520) are formed on the first layer (531) and the second layer (532) that overlap each other of the circuit board (530), Each of the second plurality of windings includes a first sub-line (521-1, 522-1) and a second sub-line (521-2, 522-2), and An electronic device in which the first sub-line (521-1) in the first layer (531) is formed on the outside of the second sub-line (521-2).

3. In paragraph 1, An electronic device wherein the second number of the second plurality of windings of the second coil (520) is greater than the first number of the first plurality of windings of the first coil (510).

4. In paragraph 1, An electronic device wherein the inductance of the second coil (520) is 1.5 to 2 times the inductance of the first coil (510).

5. In paragraph 1, The starting point (511) of the first coil (510) is located at the outermost winding (515) among the first plurality of windings, The end point (512) of the first coil (510) is located at the innermost winding (516) among the first plurality of windings, An electronic device wherein the starting point (511) of the first coil (510) is connected to the first power supply terminal (501), and the ending point (512) of the first coil (510) is connected to the second power supply terminal (502).

6. In paragraph 2, An electronic device in which the first sub-line (522-1) in the second layer (532) is formed on the inner side of the second sub-line (522-2).

7. In paragraph 6, At least one intersection area (525) is located in the innermost winding (520b) among the second plurality of windings of the second coil (520), An electronic device in which, in the above intersection area (525), the first sub-line (521-1) in the first layer (531) and the first sub-line (522-1) in the second layer (532) are connected, and the second sub-line (521-2) in the first layer (531) and the second sub-line (522-2) in the second layer (532) are connected.

8. In paragraph 7, The starting point (526) of the second coil (520) is located at the outermost winding (520a) among the second plurality of windings in the first layer (531), An electronic device in which the end point (527) of the second coil (520) is located at the outermost winding (520c) among the second plurality of windings in the second layer (532).

9. In paragraph 6, An electronic device in which the second plurality of windings of the second coil (520) include a 2-1 winding (521) formed on the first layer (531) and a 2-2 winding (522) formed on the second layer (532).

10. In paragraph 9, An electronic device in which the 2-1 winding (521) formed on the first layer (531) and the 2-2 winding (522) formed on the second layer (532) have a symmetrical shape when the first layer (531) and the second layer (532) overlap each other.

11. In paragraph 9, An electronic device in which the 2-1 winding (521) formed on the first layer (531) and the 2-2 winding (522) formed on the second layer (532) have an asymmetrical shape with respect to each other when the first layer (531) and the second layer (532) overlap.

12. In paragraph 7, An electronic device in which the length of the conductor connecting the first sub-line (521-1) in the first layer (531) and the first sub-line (522-1) in the second layer (532) is substantially the same as the length of the conductor connecting the second sub-line (521-2) in the first layer (531) and the second sub-line (522-2) in the second layer (532).

13. In paragraph 7 or paragraph 12, An electronic device in which, when current flows through the second coil (520), the current density of the conductor connected between the first sub-line (521-1) in the first layer (531) and the first sub-line (522-1) in the second layer (532) is formed to be substantially the same as the current density of the conductor connected between the second sub-line (521-2) in the first layer (531) and the second sub-line (522-2) in the second layer (532).

14. In paragraph 7, The first sub-line (521-1) in the first layer (531) and the first sub-line (522-1) in the second layer (532) are connected through the first via formed in the circuit board (530), An electronic device in which the second sub-line (521-2) in the first layer (531) and the second sub-line (522-2) in the second layer (532) are connected through a second via formed in the circuit board (530).

15. In paragraph 6, At least one connection area (625) is located on the innermost winding (520b) among the second plurality of windings of the second coil (520), An electronic device in which, in the above connection area (625), the first sub-line (521-1) in the first layer (531) and the second sub-line (522-2) in the second layer (532) are connected, and the second sub-line (521-2) in the first layer (531) and the first sub-line (522-1) in the second layer (532) are connected.

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