Laser communication assembly

Abstract

The present application relates to the technical field of optical information, and in particular to a laser communication assembly and an intelligent vehicle communication system. The laser communication assembly comprises: a central unit and a node unit group connected to the central unit, wherein the node unit group comprises at least one node unit, and each node unit comprises a silicon-based Mach-Zehnder modulator, which is used for modulating an unmodulated optical signal to obtain an uplink signal so as to send same to the central unit; and an optical device, wherein each node unit is connected to the central unit by means of the optical device, and the optical device comprises an optical coupler or an optical switch. The present application has the effects of high-speed data transmission, high reliability, high integration and compactness, and low cost.

Description

A laser communication component Technical Field

[0001] The present application relates to the field of optical information technology, and in particular to a laser communication component and an intelligent automobile communication system. Background Art

[0002] With the development of autonomous vehicles, more and more sensors are being integrated into vehicles, including radar, lidar, and cameras. Each sensor receives and sends a large amount of data to a central unit, making autonomous driving possible. However, due to the massive amount of data, transmission rates of over 1Gbps are required between the sensors and the central unit. Technical issues

[0003] To meet the needs of the automotive industry, a specific Ethernet protocol communication based on wired cables (IEEE 802.3 PHY) was developed. However, electrical connections are susceptible to interference from electromagnetic noise, and implementing electrical connections in certain parts of the car can cause electromagnetic problems for original equipment manufacturers. Technical Solutions

[0004] The technical problem to be solved by the embodiments of the present application is to provide a laser communication component and an intelligent automobile communication system to solve the problem of electromagnetic interference in the prior art.

[0005] The present application discloses a laser communication component, comprising:

[0006] A central unit and a node unit group connected to the central unit, wherein the node unit group includes at least one node unit;

[0007] Each of the node units includes a silicon-based Mach-Zehnder modulator, which is used to modulate the unmodulated optical signal to obtain an uplink signal, so as to send the uplink signal to the central unit;

[0008] Optical device, each of the node units is connected to the central unit via an optical fiber and the optical device, and the optical device includes an optical coupler or an optical switch.

[0009] Optionally, each of the node units includes a first optical switch and a second optical switch;

[0010] The output end of the second optical switch of the previous node unit in the node unit group is connected to the input end of the first optical switch of the next node unit;

[0011] The input end of the first optical switch of the first-ranked node unit is connected to the uplink transmitting end of the central unit, and the input end of the second optical switch of the last-ranked node unit is connected to the uplink receiving end of the central unit.

[0012] Optionally, in each node unit, the first output end of the first optical switch is connected to the input end of the silicon-based Mach-Zehnder modulator, the second output end of the first optical switch is connected to the second input end of the second optical switch, and the first input end of the second optical switch is connected to the output end of the silicon-based Mach-Zehnder modulator.

[0013] Optionally, the central unit includes:

[0014] An unmodulated laser source, whose output end serves as the uplink transmitting end;

[0015] The input end of the variable optical attenuator serves as the uplink receiving end.

[0016] Optionally, the central unit includes:

[0017] A photodiode, a receiving end of which is connected to the output end of the variable optical attenuator.

[0018] Optionally, each of the node units is connected to at least one sensor for acquiring a sensing signal output by the sensor.

[0019] Optionally, the central unit includes a downlink communication transmitter, and the downlink communication transmitter is connected to the input end of the optical device;

[0020] Each of the node units includes a downlink communication receiver, and each of the downlink communication receivers is respectively connected to an output end of the optical device.

[0021] Optionally, the downlink communication transmitter and the downlink communication receiver are of any one type of a small pluggable optical module and an enhanced small pluggable optical module, and the data transmission rate of the small pluggable optical module is at least 10G.

[0022] Optionally, the central unit includes a central electronic card, which is connected to various components of the central unit to control the various components of the central unit;

[0023] Each of the node units includes a node electronic card connected to various components of the node unit to control the various components of the node unit.

[0024] The present application also discloses an intelligent automobile communication system, comprising the laser communication component described above. Beneficial effects

[0025] Compared with the prior art, the laser communication assembly provided by the embodiments of the present application has the following advantages: by using a silicon-based Mach-Zehnder modulator for signal modulation, high-order modulation technology can be implemented, which increases the data transmission rate. Using optical signal transmission, optical signals are less susceptible to electromagnetic interference. Furthermore, the silicon-based Mach-Zehnder modulator has good thermal stability and can maintain stable performance in high-temperature environments, thereby improving system reliability and reducing errors and interruptions in data transmission. The node unit group and central unit in the laser communication assembly can be connected through optical devices and optical fibers to form a compact system structure. Furthermore, the silicon-based Mach-Zehnder modulator has high integration and is compatible with CMOS (Complementary Metal-Oxide-Semiconductor) processes. It can be integrated with other photonic integrated circuit devices to realize a highly integrated optoelectronic system, resulting in a smaller system size and lower power consumption. The silicon-based Mach-Zehnder modulator can be manufactured using standard CMOS processes, which are compatible with existing semiconductor manufacturing processes. This reduces manufacturing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The technical solution of the present application will be further described in detail below with reference to the accompanying drawings and embodiments, in which:

[0027] FIG1 is a schematic structural diagram of a laser communication assembly provided in an embodiment of the present application;

[0028] FIG2 is a schematic diagram of the structure of the intelligent automobile communication system provided in an embodiment of the present application.

[0029] The reference numerals in the figures are:

[0030] 1. Laser communication component; 10. Central unit; 11. Unmodulated laser source; 12. Variable optical attenuator; 13. Photodiode; 14. Central electronic card; 15. Downlink communication transmitter; 20. Node unit group; 21. Node unit; 211. Silicon-based Mach-Zehnder modulator; 212. First optical switch; 213. Second optical switch; 214. Node electronic card; 215. Downlink communication receiver; 30. Optical device; 40. Sensor; 2. Intelligent vehicle communication system. Best Mode for Carrying Out the Invention

[0031] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present application can be combined with each other. Now, in conjunction with the accompanying drawings, the preferred embodiments of the present application are described in detail.

[0032] An embodiment of the present application provides a laser communication component. As shown in Figure 1, the laser communication component 1 includes a central unit 10 and a node unit group 20, each of which includes at least one node unit 21. The central unit 10 is an OLT (Optical Line Terminal), which is typically located in the central office or data center of the communication system 1 and is responsible for connecting optical fiber lines and providing high-speed optical fiber access. The OLT converts optical signals into electrical signals and connects to the core network of the communication system 1 to achieve data transmission. The node unit 21 is an ONU (Optical Network Unit), which is a terminal device that communicates with the OLT and is responsible for receiving and sending data. In the communication system 1, downlink (DL) transmission data is transmitted from the root (central unit 10) to the node (node ​​unit 21). Uplink (UL) transmission data is transmitted from the node (node ​​unit 21) to the root (central unit 10). In this way, two-way communication is achieved.

[0033] The laser communication assembly 1 also includes an optical device 30. Each node unit 21 is connected to the central unit 10 via the optical device 30 and an optical fiber. The optical device 30 can be an optical coupler or an optical switch. In this embodiment, an optical coupler is used as an example. The optical fiber can be a standard single-mode optical fiber. The optical device 30 has one input and N outputs, where N is an integer greater than or equal to the total number of node units 21. For example, if the number of node units 21 is 2, then N can be 2, or an integer greater than 2, such as 3 or 4, so that each node unit 21 can be connected to one output of the optical device 30. As shown in Figure 1, the node unit group 20 has two node units 21 (ONU1 and ONU2), where node unit 21 ONU1 is connected to output terminal Out1 of the optical device 30, and node unit 21 ONU2 is connected to output terminal Out2 of the optical device 30.

[0034] Each node unit 21 includes a silicon-based Mach-Zehnder modulator (MZM) 211 (MZM). A Mach-Zehnder modulator (MZM) is a modulation device used in optical and fiber-optic communication systems. The silicon-based MZM 211 in the node unit 21 modulates an unmodulated optical signal to produce an uplink signal that can be transmitted on the uplink. The uplink signal is then transmitted to the central unit 10 via the uplink.

[0035] The silicon-based Mach-Zehnder modulator 211 features efficient modulation performance and can implement high-order modulation formats such as quadrature phase-shift keying (QPSK) and octal phase-shift keying (8PSK). This high-order modulation capability allows for the transmission of more information within limited spectrum resources, improving the transmission capacity and efficiency of optical fiber communication systems. The silicon-based Mach-Zehnder modulator 211 can meet transmission rates exceeding 1 Gbps. Its efficient modulation performance and fast response speed enable high-speed data transmission. It can represent digital data by modulating the intensity or phase of an optical signal, enabling high-speed optical signal modulation and demodulation. Furthermore, the silicon-based Mach-Zehnder modulator 211 boasts a compact structure and high integration density, allowing it to be combined with other photonic integrated circuit devices to further enhance transmission rates and performance.

[0036] In vehicle communication systems, high temperatures may occur due to the internal operating environment and external conditions. Inside the vehicle, components such as the engine, transmission, and brake system generate heat, leading to elevated internal vehicle temperatures. Furthermore, vehicle communication equipment may be concentrated in areas such as the vehicle's electronic control unit (ECU) or onboard gateway, which also generate a certain amount of heat during operation. Furthermore, vehicle communication systems may be affected by high temperatures when exposed to the outside world. For example, in hot weather, when a vehicle is exposed to sunlight, or when driving in hot regions, the external temperature may rise, causing thermal stress on the vehicle communication equipment. The silicon-based Mach-Zehnder modulator 211 has a thermal stability of up to 110°C. This means it can maintain good performance at elevated temperatures and is not susceptible to thermal effects. Thermal stability is crucial for the reliability and long-term stability of the laser communication component 1, especially in high-temperature environments or when high-power transmission is required.

[0037] As can be seen from the above description, in this embodiment, a silicon-based Mach-Zehnder modulator is installed in the node unit to modulate the unmodulated laser signal to obtain the uplink signal to be sent to the central unit. By using the silicon-based Mach-Zehnder modulator for signal modulation, high-order modulation technology can be implemented, thereby improving data transmission rate. The laser communication component uses optical signal transmission, which is less susceptible to electromagnetic interference than traditional electrical signal transmission. At the same time, the silicon-based Mach-Zehnder modulator has excellent thermal stability and can maintain stable performance in high-temperature environments. These characteristics improve system reliability and reduce errors and interruptions in data transmission. The node unit group and central unit in the laser communication component can be connected via optical devices and optical fibers, forming a compact system structure. Furthermore, the silicon-based Mach-Zehnder modulator has high integration and is compatible with CMOS (Complementary Metal-Oxide-Semiconductor) processes. It can be integrated with other photonic integrated circuit devices to realize a highly integrated optoelectronic system. This high integration and compactness make the system smaller, lower power consumption, and easier to integrate into vehicle communication systems. Silicon-based Mach-Zehnder modulators can be manufactured using standard CMOS processes, making them compatible with existing semiconductor manufacturing processes. This reduces manufacturing costs, and further cost reductions can be achieved by utilizing large-scale integrated circuit manufacturing techniques.

[0038] Continuing with Figure 1 , each node unit 21 includes a first optical switch 212 and a second optical switch 213. The first optical switch 212 is a 1×2 optical switch, and the second optical switch 213 is a 2×1 switch. At least one node unit 21 in a node unit group 20 is sequentially connected via the second optical switch. The output of the second optical switch 213 of the preceding node unit 21 in the node unit group 20 is connected to the input of the first optical switch 212 of the succeeding node unit 21.

[0039] As shown in Figure 1 , node unit 21 ONU1 is the first node, and node unit 21 ONU2 is the second node. Thus, the output terminal Out of the second optical switch 213 of node unit 21 ONU1 is connected to the input terminal In of the first optical switch 212 of node unit 21 ONU2. In other implementation scenarios, when there are more node units 21, the input terminal of the first optical switch 212 of the third node unit 21 is connected to the output terminal of the second optical switch 213 of node unit 21 ONU2, and so on, to achieve sequential connection of multiple node units 21.

[0040] The input end of the first optical switch 212 of the first-ranked node unit 21 is connected to the uplink transmitting end of the central unit 10 , and the input end of the second optical switch 213 of the last-ranked node unit 21 is connected to the uplink receiving end of the central unit 10 .

[0041] As shown in FIG1 , node unit 21 ONU1 is the first-ranked node unit, and node unit 21 ONU2 is the last-ranked node unit. The input end In of the first optical switch 212 of node unit 21 ONU1 is connected to the uplink transmitting end of the central unit 10 for receiving the optical signal transmitted by the central unit 10 through the uplink transmitting end. The output end Out of the second optical switch 213 of node unit 21 ONU2 is connected to the uplink receiving end of the central unit 10 for transmitting the modulated uplink signal to the central unit 10.

[0042] In this embodiment, the node units 21 do not operate simultaneously. Each node unit 21 can only communicate within a given time slot window. Therefore, when a node unit 21 is in operation, it can obtain the optical signal provided by the uplink transmitting end of the central unit 10 through the input end of the first optical switch 212 of the first-order node unit 21, based on the sequential connection relationship of the node units 21. And, due to the sequential connection relationship of the node units 21, it can output the uplink signal to the uplink receiving end of the central unit 10 through the input end of the second optical switch 213 of the last-order node unit 21.

[0043] Continuing with Figure 1 , in each node unit 21, the first output of the first optical switch 212 is connected to the input of the silicon-based Mach-Zehnder modulator, the second output of the first optical switch 212 is connected to the second input of the second optical switch 213, and the first input of the second optical switch 213 is connected to the output of the silicon-based Mach-Zehnder modulator. As shown in Figure 1 , the first output Out1 of the first optical switch 212 of the node unit ONU 21 is connected to the input In of the silicon-based Mach-Zehnder modulator 211, the output Out of the silicon-based Mach-Zehnder modulator 211 is connected to the first input In1 of the second optical switch 213 of the node unit ONU 21, and the second output Out2 of the first optical switch 212 is connected to the second input In2 of the second optical switch 213.

[0044] The node unit 21 ONU2 has a similar structure to the node unit 21 ONU1. The first output terminal Out1 of the first optical switch 212 is connected to the input terminal In of the silicon-based Mach-Zehnder modulator 211. The output terminal Out of the silicon-based Mach-Zehnder modulator 211 is connected to the first input terminal In1 of the second optical switch 213 of the node unit 21 ONU1. The second output terminal Out2 of the first optical switch 212 is connected to the second input terminal In2 of the second optical switch 213.

[0045] In one implementation scenario, when node unit 21 ONU1 is in operation, the remaining node units 21 (node ​​unit 21 ONU2) are in non-operational states. The input terminal In of the first optical switch 212 of node unit 21 ONU1 receives an unmodulated optical signal provided by the central unit 10. At this time, the first output terminal Out1 of the first optical switch 212 is in an on state, and the second output terminal Out2 is in an off state. Therefore, the unmodulated optical signal is output through the first output terminal Out1 of the first optical switch 212 to the input terminal In of the silicon-based Mach-Zehnder modulator 211. The silicon-based Mach-Zehnder modulator 211 modulates the unmodulated optical signal to obtain a modulated uplink signal. At this time, the first input terminal In1 of the second optical switch 213 of node unit 21 ONU1 is in an on state, and the second input terminal In2 is in an off state. The uplink signal is transmitted to the first input terminal In1 of the second optical switch 213 of the node unit 21 ONU1 through the output terminal Out of the silicon-based Mach-Zehnder modulator 211, and is output from the output terminal Out of the second optical switch 213 to the input terminal In of the first optical switch 212 of the node unit 21 ONU2.

[0046] At this time, the first output terminal Out1 of the first optical switch 212 of the node unit 21 ONU2 is in the off state, and the second output terminal Out2 is in the on state. The uplink signal is transmitted through the second output terminal Out2 of the first optical switch 212 of the node unit 21 ONU2 to the second input terminal In2 of the second optical switch 213 of the node unit 21 ONU2. At this time, the first input terminal In1 of the node unit 21 ONU2 is in the off state, and the second input terminal In2 is in the on state. Therefore, the uplink signal can be input through the second input terminal In2 of the second optical switch 213 and output from the output terminal Out of the second optical switch 213 to the uplink receiving terminal of the central unit 10. As a result, the central unit 10 can receive the uplink signal.

[0047] In another implementation scenario, when node unit 21 ONU2 is in an operational state, the remaining node units 21 (node ​​unit 21 ONU1) are in an inoperative state. The input terminal In of the first optical switch 212 of node unit 21 ONU1 receives the unmodulated optical signal provided by the central unit 10. At this time, the first output terminal Out1 of the first optical switch 212 is in an OFF state, while the second output terminal Out2 is in an ON state. Therefore, the unmodulated optical signal is output via the second output terminal Out2 of the first optical switch 212 to the second input terminal In2 of the second optical switch 213. At this time, the first input terminal In1 of the second optical switch 213 is in an OFF state, while the second input terminal In2 is in an ON state. The unmodulated optical signal is input via the second input terminal In2 of the second optical switch 213 and output from the output terminal Out of the second optical switch 213 to the input terminal In of the first optical switch 212 of node unit 21 ONU2.

[0048] At this point, the first output terminal Out1 of the first optical switch 212 of the node unit 21 ONU2 is in an on state, and the second output terminal Out2 is in an off state. Therefore, the unmodulated optical signal is transmitted through the first output terminal Out1 to the input terminal In of the silicon-based Mach-Zehnder modulator 211 of the node unit 21 ONU2. The silicon-based Mach-Zehnder modulator 211 modulates the unmodulated optical signal to obtain a modulated uplink signal. The uplink signal is output from the output terminal Out of the silicon-based Mach-Zehnder modulator 211 to the first input terminal In1 of the second optical switch 213. At this point, the first input terminal In1 of the node unit 21 ONU2 is in an on state, and the second input terminal In2 is in an off state. Therefore, the uplink signal can be input through the first input terminal In1 of the second optical switch 213 and output from the output terminal Out of the second optical switch 213 to the uplink receiving terminal of the central unit 10. As a result, the central unit 10 can receive the uplink signal.

[0049] In this embodiment, polarization-maintaining optical fibers are used to connect the first output end of the first optical switch and the input end of the silicon-based Mach-Zehnder modulator, the second output end of the first optical switch and the second input end of the second optical switch, the first input end of the second optical switch and the output end of the silicon-based Mach-Zehnder modulator, the input end of the first optical switch of the first-ranked node unit and the uplink transmitting end of the central unit, and the input end of the second optical switch of the last-ranked node unit and the uplink receiving end of the central unit. This is because the silicon-based Mach-Zehnder modulator 211 requires polarization control.

[0050] In the silicon-based Mach-Zehnder modulator 211, modulation of the optical signal is achieved by controlling the polarization state of light. In the silicon-based Mach-Zehnder modulator 211, the optical signal is transmitted through two splitters and two optical waveguides of equal length. The relative optical path difference between the two optical waveguides causes interference of the optical signal, thereby causing modulation of the optical signal. However, this interference effect is very sensitive to the polarization state of the optical signal. When the polarization state of the optical signal changes, the interference effect will cause changes in the intensity and phase of the output optical signal. Therefore, in order to achieve a stable modulation effect, it is necessary to control the polarization of the optical signal to keep it in a stable state.

[0051] In this embodiment, each node unit 21 is connected to at least one sensor 40 and receives a sensing signal from the at least one sensor 40. A silicon-based Mach-Zehnder modulator 211 modulates an unmodulated optical signal based on the received sensing signal, and then adds the sensing signal to the unmodulated optical signal to obtain an uplink signal. The uplink signal is then transmitted to the central unit 10, allowing the central unit 10 to receive the sensing signal from the sensor 40.

[0052] Continuing with Figure 1 , the central unit 10 includes an unmodulated laser source 11, which is used to output an unmodulated optical signal. Its output terminal, Tx, serves as the uplink transmitter of the central unit 10. The central unit 10 also includes a variable optical attenuator 12, which is used to adjust the optical power of the received uplink signal to a level suitable for signal analysis. Its input terminal, In, serves as the uplink receiver of the central unit 10.

[0053] The reason for incorporating an unmodulated laser source 11 in the central unit 10 is to avoid the use of active light sources in the node units 21. Because the node units 21 are susceptible to temperature fluctuations, the use of active light sources would require temperature control, which would increase cost and complexity. Therefore, to simplify design and reduce costs, temperature control is typically performed only in the central unit 10.

[0054] Continuing with Figure 1 , the central unit 10 further includes a photodiode 13. The receiving end Rx of the photodiode 13 is connected to the output end Out of the variable optical attenuator 12, thereby converting the uplink signal, which has undergone optical power adjustment, from an optical signal into an electrical signal for analysis to obtain a sensing signal. In other implementation scenarios, other photoelectric conversion modules may also be used, such as a photodetector, a photomultiplier tube, a photoconductor, and the like.

[0055] Continuing with Figure 1 , the central unit 10 includes a central electronic card 14, which is connected to the unmodulated laser source 11, the variable optical attenuator 12, and the photodiode 13. The central electronic card 14 controls the operation of the unmodulated laser source 11, the variable optical attenuator 12, and the photodiode 13. For example, the central electronic card 14 drives the unmodulated laser source 11 to emit unmodulated laser light, controls the attenuation intensity of the variable optical attenuator 12, and receives and analyzes electrical signals from the photodiode 13.

[0056] The node unit 21 includes a node electronic card 214, which is connected to a silicon-based Mach-Zehnder modulator 211, a first optical switch 212, and a second optical switch 213. The node electronic card 214 is also connected to the sensor 40. The node electronic card 214 can control the operation of the silicon-based Mach-Zehnder modulator 211, the first optical switch 212, and the second optical switch 213. For example, the node electronic card 214 can control the silicon-based Mach-Zehnder modulator 211 to modulate the unmodulated optical signal based on the sensor's sensing signal, thereby adding the sensing signal to the unmodulated optical signal, and control the conduction and disconnection between the input ports and output ports of the first optical switch 212 and the second optical switch 213.

[0057] Continuing with Figure 1 , the central unit 10 further includes a downlink communication transmitter 15, which is connected to the input terminal In of the optical device 30. Each node unit 21 includes a downlink communication receiver 215, each of which is connected to an output terminal of the optical device 30. As shown in Figure 1 , the receiving terminal Rx of the downlink communication receiver 215 of node unit 21 ONU1 is connected to the first output terminal Out1 of the optical device 30, and the receiving terminal Rx of the downlink communication receiver 215 of node unit 21 ONU2 is connected to the second output terminal Out2 of the optical device 30.

[0058] Downlink communication transmitter 15 is connected to central electronic card 14 and is controlled by central electronic card 14 to transmit downlink signals. Downlink communication receiver 215 is connected to node electronic card 214 and is controlled by node electronic card 214 to receive and analyze downlink signals. Downlink communication transmitter 15 and downlink communication receiver 25 are either small form-factor pluggable (SFP) optical modules or enhanced small form-factor pluggable (ESFP) optical modules. The SFP optical module has a transmission rate of at least 10G.

[0059] Please refer to Figure 2, which is a schematic diagram of the structure of an embodiment of the intelligent vehicle communication system provided by this application. Intelligent vehicle communication system 2 includes a laser communication component 1. Because laser system 1 utilizes a silicon-based Mach-Zehnder modulator for signal modulation, intelligent vehicle communication system 2 offers advantages such as high-speed data transmission, high reliability, high integration and compactness, and low cost.

[0060] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Those skilled in the art may modify the technical solutions described in the above embodiments, or replace some of the technical features therein with equivalents; and all these modifications and replacements should fall within the scope of protection of the claims attached to this application.

Claims

1. A laser communication component, characterized in that, Comprising: A central unit and a group of node units connected to the central unit, the group of node units including at least one node unit; Each of the node units includes a silicon-based Mach-Zehnder modulator for modulating an unmodulated optical signal to obtain an upstream signal and sending the upstream signal to the central unit; Optical devices, each of the node units being connected to the central unit through an optical fiber and the optical devices; the optical devices include an optical coupler or an optical switch.

2. The laser communication component according to claim 1, characterized in that, Each of the node units includes a first optical switch and a second optical switch; The output end of the second optical switch of the previous node unit in the group of node units is connected to the input end of the first optical switch of the next node unit; The input end of the first optical switch of the node unit ranked first is connected to the upstream transmitting end of the central unit, and the input end of the second optical switch of the node unit ranked last is connected to the upstream receiving end of the central unit.

3. The laser communication component according to claim 2, wherein In each node unit, the first output end of the first optical switch is connected to the input end of the silicon-based Mach-Zehnder modulator, the second output end of the first optical switch is connected to the second input end of the second optical switch, and the first input end of the second optical switch is connected to the output end of the silicon-based Mach-Zehnder modulator.

4. The laser communication component according to claim 2, characterized in that The central unit includes: An unmodulated laser source, the output end of which serves as the upstream transmitting end; A variable optical attenuator, the input end of which serves as the upstream receiving end.

5. The laser communication component according to claim 4, wherein The central unit includes: A photodiode, the receiving end of which is connected to the output end of the variable optical attenuator.

6. The laser communication component according to claim 1, characterized in that, Each of the node units is connected to at least one sensor for obtaining a sensing signal output by the sensor.

7. The laser communication component according to claim 1, characterized in that, The central unit includes a downstream communication transmitter, and the downstream communication transmitter is connected to the input end of the optical device; Each of the node units includes a downstream communication receiver, and each of the downstream communication receivers is respectively connected to an output end of the optical device.

8. The laser communication component according to claim 7, characterized in that, The types of the downstream communication transmitter and the downstream communication receiver are any one of a small form-factor pluggable optical module and an enhanced small form-factor pluggable optical module, and the data transmission rate of the small form-factor pluggable optical module is at least 10G.

9. The laser communication component according to any one of claims 1-8, characterized in that, The central unit includes a central electronic card connected to each component of the central unit to control each component of the central unit; Each of the node units includes a node electronic card connected to each component of the node unit to control each component of the node unit.

10. An intelligent vehicle communication system, characterized in that, Including the laser communication component according to any one of claims 1-9.

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