Transmitting module, receiving module, charging connector and electronic device
By integrating magnetic field and millimeter wave communication components on the printed circuit board of the charging connector and electronic devices, the problem that the wireless charging interface cannot interact with data is solved, and the combination of wireless charging and data transmission is realized, improving the user experience and replacing the traditional wired interface.
Patent Information
- Application Number
- PCT/CN2024/138107
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-28
- Filing Date
- 2024-12-10
- Publication Date
- 2025-07-03
AI Technical Summary
The existing wireless charging interface only has charging functions and cannot meet the data interaction requirements between devices.
Combining wireless charging and millimeter wave communication, wireless charging and data transmission are achieved by providing a magnetic field transmitting/receiving unit and a millimeter wave signal transceiver and a printed circuit board of the charging connector and electronic device.
It realizes millimeter wave communication while wireless charging, meets the data transmission needs between devices, improves user experience, and miniaturizes the interface design, replacing traditional wired cables.
Smart Images

Figure CN2024138107_03072025_PF_FP_ABST
Abstract
Description
Transmitter module, receiver module, charging connector, electronic equipment
[0001] This application claims priority to the Chinese patent application filed on December 28, 2023, with application number 2023118399778 and invention name “Transmitting module, receiving module and charging connector, electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field
[0002] The present application relates to the field of wireless charging technology, and specifically to a transmitting module, a receiving module, a charging connector, and an electronic device. Background Art
[0003] Existing wired charging ports are large, so small electronic devices such as mobile phones, smart watches, smart glasses, and wireless headphones generally use wireless charging ports to charge. However, existing wireless charging ports only provide wireless charging capabilities and cannot meet the data exchange requirements between devices. Summary of the Invention
[0004] In a first aspect, the transmitting module provided in an embodiment of the present application is applied to a charging connector, comprising: a first printed circuit board PCB, a first charging component, and a first communication component, wherein the first charging component and the first communication component are both arranged on the first PCB, wherein:
[0005] The first charging component includes a magnetic field transmitting unit, which is used to convert the received current signal into an electromagnetic signal; the first communication component includes a first signal transceiver unit, which is used to transmit and receive millimeter wave signals;
[0006] The magnetic field transmitting unit and the first signal transceiver unit are both arranged on the side of the first PCB. When the distance between the side of the first PCB and the electronic device is less than a distance threshold, the electronic device is wirelessly charged and millimeter wave communication is performed with the electronic device.
[0007] In a second aspect, the receiving module provided in an embodiment of the present application is applied to an electronic device, comprising: a second printed circuit board PCB, a second charging component and a second communication component, wherein the second charging component and the second communication component are both arranged on the second PCB, wherein:
[0008] The second charging component includes a magnetic field receiving unit, which is used to convert the induced electromagnetic signal into a current signal; the second communication component includes a second signal transceiver unit, which is used to transmit and receive millimeter wave signals;
[0009] The magnetic field receiving unit and the second signal transceiver unit are both arranged on the side of the second PCB. When the distance between the charging connector and the side of the second PCB is less than a distance threshold, the electronic device is wirelessly charged and millimeter wave communication is performed with the charging connector.
[0010] In a third aspect, the charging connector provided in an embodiment of the present application includes the transmitting module provided in the first aspect of the embodiment of the present application.
[0011] In a fourth aspect, the electronic device provided in an embodiment of the present application includes the receiving module provided in the second aspect of the embodiment of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The drawings herein are incorporated into and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and, together with the specification, are used to illustrate the technical solutions of the present application.
[0013] FIG1 is a wireless charging communication system provided by an embodiment of the present application;
[0014] FIG2 is a schematic structural diagram of two charging connectors provided in an embodiment of the present application;
[0015] FIG3 is a schematic structural diagram of a transmitting module provided in an embodiment of the present application;
[0016] FIG4 is a schematic structural diagram of another transmitting module provided in an embodiment of the present application;
[0017] FIG5 is a side view of a PCB end-fire antenna provided in an embodiment of the present application;
[0018] FIG6 is a top view of a PCB end-fire antenna provided in an embodiment of the present application;
[0019] FIG7 is a schematic structural diagram of a first communication component provided in an embodiment of the present application;
[0020] FIG8 is a schematic structural diagram of another first communication component provided in an embodiment of the present application;
[0021] FIG9 is a schematic structural diagram of a first charging assembly provided in an embodiment of the present application;
[0022] FIG10 is a schematic structural diagram of a transmitting module provided in this application;
[0023] FIG11 is a schematic structural diagram of a transmitting module provided in an embodiment of the present application;
[0024] FIG12 is a schematic diagram of a transmitting module provided in an embodiment of the present application;
[0025] FIG13 is a schematic diagram of another transmitting module provided in an embodiment of the present application;
[0026] FIG14 is a schematic structural diagram of another transmitting module provided in an embodiment of the present application;
[0027] FIG15 is a schematic diagram of an interface of a transmitting module provided in an embodiment of the present application;
[0028] FIG16 is a schematic structural diagram of a receiving module provided in an embodiment of the present application;
[0029] FIG17 is a schematic structural diagram of another receiving module provided in an embodiment of the present application;
[0030] FIG18 is a schematic structural diagram of a second communication component provided in an embodiment of the present application;
[0031] FIG19 is a schematic structural diagram of another second communication component provided in an embodiment of the present application;
[0032] FIG20 is a schematic structural diagram of a second charging assembly provided in an embodiment of the present application;
[0033] FIG21 is a schematic structural diagram of a receiving module provided in an embodiment of the present application;
[0034] FIG22 is a schematic structural diagram of a receiving module provided in an embodiment of the present application;
[0035] FIG23 is a schematic structural diagram of another receiving module provided in an embodiment of the present application;
[0036] FIG24 is a schematic diagram of an interface of a receiving module provided in an embodiment of the present application;
[0037] FIG25 is a schematic structural diagram of a charging connector provided in an embodiment of the present application;
[0038] FIG26 is a schematic diagram of the operation of a wireless charging communication system provided in an embodiment of the present application. DETAILED DESCRIPTION
[0039] To make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the specific technical solutions of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application but are not intended to limit the scope of the present application.
[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing the embodiments of this application only and are not intended to limit this application.
[0041] In the following description, reference is made to “some embodiments”, which describes a subset of all possible embodiments, but it will be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.
[0042] It should be pointed out that the terms "first\second\third" involved in the embodiments of the present application are used to distinguish similar or different objects, and do not represent a specific ordering of the objects. It can be understood that "first\second\third" can be interchanged with a specific order or sequence where permitted, so that the embodiments of the present application described here can be implemented in an order other than that illustrated or described here.
[0043] Existing wired charging interfaces are large in size, and small electronic devices such as mobile phones, smart watches, smart glasses, and wireless headphones generally use wireless charging interfaces for charging.
[0044] However, the existing wireless charging interface only has wireless charging function and cannot meet the data interaction requirements between devices.
[0045] In view of this, an embodiment of the present application provides a wireless charging communication system that performs wireless communication while performing wireless charging.
[0046] FIG1 illustrates a wireless charging communication system provided by an embodiment of the present application. As shown in FIG1 , the wireless charging communication system includes a charging connector 10, an electronic device 20, and a power supply device 30. The charging connector 10 includes a transmitting module 11, and the electronic device includes a receiving module 21. When the power supply device 30 is connected to the charging connector 10 and the distance between the transmitting module 11 of the charging connector 10 and the receiving module 21 of the electronic device 20 is less than a distance threshold, the power supply device 30 can wirelessly charge the electronic device 20 through the charging connector 10 and wirelessly communicate with the electronic device 20. The transmitting module 11 and the receiving module 21 are provided with corresponding functional components to meet the requirements of wireless charging and millimeter wave communication.
[0047] This wireless charging communication system uses millimeter waves to achieve USB 2.0 wireless data transmission. Millimeter wave communication refers to a communication method that uses millimeter waves as a communication carrier. The radio frequency band has a wavelength between 1 and 10 mm, corresponding to a frequency range of 30 to 300 GHz. Compared with traditional communication frequency bands, millimeter waves offer the following advantages: greater bandwidth: enabling ultra-high data transmission rates of tens of Gbps; strong interference resistance: the millimeter wave band has many unused frequency bands, which can avoid competition for spectrum resources and channel interference; small antenna size: the millimeter wave band requires small antenna size, facilitating the miniaturization of communication ports; low power consumption: due to the short transmission range of the millimeter wave band, it requires less transmission power.
[0048] Figure 2 is a schematic diagram of the structures of two charging connectors provided in embodiments of the present application. As shown in Figure 2, the charging connector 10 can be a charging cable or a charging connector. The charging cable and the charging connector have exactly the same functions, except that the charging cable includes a connecting cable, while the charging connector does not, or the connecting cable is shorter.
[0049] The left side of the charging connector is connected to the adapter or the interface of a personal computer PC, and the other end adopts a contactless design to connect to the electronic device / smart device to realize charging and data transmission functions.
[0050] An embodiment of the present application provides a transmitting module for use with a charging connector, comprising: a first printed circuit board (PCB), a first charging component, and a first communication component, wherein the first charging component and the first communication component are both disposed on the first PCB, wherein the first charging component includes a magnetic field transmitting unit for converting a received current signal into an electromagnetic signal; the first communication component includes a first signal transceiver unit for transmitting and receiving millimeter wave signals; and the magnetic field transmitting unit and the first signal transceiver unit are both disposed on a side of the first PCB. The transmitting module can wirelessly charge an electronic device and wirelessly communicate with the electronic device when the distance between the side of the first PCB and the electronic device is less than a distance threshold, thereby meeting the data transmission requirements between devices during wireless charging and improving the user experience.
[0051] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.
[0052] Figure 3 is a schematic diagram of the structure of a transmitter module provided in an embodiment of the present application. The transmitter module can be applied to a charging connector, which can be various types of connectors, connectors, or cables with information processing capabilities. For example, the charging connector can be a connector capable of connecting to an adapter or a personal computer, or a cable capable of connecting to an adapter or a personal computer.
[0053] As shown in Figure 3, the transmitting module includes: a first printed circuit board PCB101, a first charging component 102 and a first communication component 103, wherein the first charging component 102 and the first communication component 103 are both arranged on the PCB101, wherein the first charging component 102 includes a magnetic field transmitting unit 1021, and the magnetic field transmitting unit 1021 is used to convert the received current signal into an electromagnetic signal; the first communication component 103 includes a first signal transceiver unit 1031, and the first signal transceiver unit 1031 is used to transmit and receive millimeter wave signals; the magnetic field transmitting unit 1021 and the first signal transceiver unit 1031 are both arranged on the side 1011 of the first PCB. When the distance between the side 1011 of the first PCB and the electronic device is less than the distance threshold, the electronic device can be wirelessly charged and wireless communication with the electronic device can be performed.
[0054] The PCB provides connection, support, and fixation for electronic components. The PCB here can be an existing PCB type, and the present embodiment of the application does not limit the type of PCB. The first charging component can be a component of an existing wireless charging transmitter, and the first communication component can be a component of an existing millimeter wave communication. The present embodiment of the application does not limit the type and structure of the first charging component and the first communication component.
[0055] It should be noted that the first charging component and the first communication component are both arranged on the PCB, which means that the first charging component and the first communication component are arranged on the PCB by welding or circuit connection. The magnetic field transmitting unit and the first signal transceiver unit are both arranged on the side of the first PCB, which means that the first PCB includes four sides, and the magnetic field transmitting unit and the first signal transceiver unit are arranged on any side of the first PCB. Since the magnetic field transmitting unit and the first signal transceiver unit of the charging connector need to maintain a small distance with the functional components corresponding to the electronic device end in order to perform wireless charging and wireless communication, the magnetic field transmitting unit and the first signal transceiver unit are arranged on the side of the first PCB, which can facilitate contactless contact with the corresponding components on the electronic device end to achieve wireless charging and wireless communication.
[0056] The embodiment of the present application proposes a transmitting module that uses wireless charging to realize charging function and millimeter wave communication to realize data transmission function, and the interface is arranged on the side of the first PCB, which is convenient for contactless interface design and can replace wired cables, making it convenient for users to use.
[0057] In some embodiments, the first signal transceiver unit includes at least one set of PCB end-fire antennas. When the first signal transceiver unit includes two sets of PCB end-fire antennas, the magnetic field transmitting unit is disposed between the two sets of PCB end-fire antennas.
[0058] Figure 4 is a schematic diagram of the structure of another transmitting module provided in an embodiment of the present application. As shown in Figure 4, the first signal transceiver unit 1031 includes two sets of PCB end-fire antennas, and the magnetic field transmitting unit 1021 is disposed between the two sets of PCB end-fire antennas. The magnetic field transmitting unit 1021 and the two sets of PCB end-fire antennas are both disposed on the sides of the first PCB 101.
[0059] It should be noted that the use of two sets of PCB end-fire antennas allows for parallel transmission with the corresponding PCB end-fire antennas on the electronic device, automatically negotiating and achieving full-duplex millimeter-wave data communication. Furthermore, the symmetrical arrangement of the first signal transceiver unit 1031 can meet the user's needs in both forward and reverse usage scenarios.
[0060] In some embodiments, the PCB end-fire antenna includes a horizontally polarized dipole antenna and a vertically polarized monopole antenna, and the first signal transceiver unit includes a radio frequency chip, which is respectively connected to the horizontally polarized dipole antenna and the vertically polarized monopole antenna through a transmission line.
[0061] It should be noted that the embodiment of the present application adopts an external PCB end-fire antenna solution and an end-fire dual-polarization antenna solution, including a horizontally polarized dipole antenna and a vertically polarized monopole antenna. The horizontally polarized dipole antenna adopts a trapezoidal floor structure to increase the antenna impedance bandwidth; the vertically polarized monopole antenna adopts a quasi-Yagi-Uda antenna form, introducing a reflector arm oscillator to improve the end-fire gain. The RF chip is connected to the two antennas respectively through a 50-ohm transmission line, exciting a 1 / 2 wavelength dipole mode to generate horizontally polarized radiation, and a 1 / 4 wavelength mode monopole mode to generate vertically polarized radiation.
[0062] FIG5 is a side view of a PCB end-fire antenna provided in an embodiment of the present application. As shown in FIG5 , the PCB end-fire antenna includes a PCB 301, a vertically polarized monopole antenna 302, a horizontally polarized dipole antenna 303, and a reflector assembly 304. In the embodiment of the present application, the PCB 301 has a first panel 3011 and a second panel 3012 that are arranged opposite and spaced apart. The PCB 301 can be a multi-layer printed circuit board (PCB), in which the first panel 3011 and the second panel 3012 are provided. A dielectric material can be filled between the two panels to support the two panels of the PCB 301. The PCB 301 can be used to mount the vertically polarized monopole antenna 302, the horizontally polarized dipole antenna 303, and the reflector assembly 304.
[0063] In this embodiment, the vertically polarized monopole antenna 302 is arranged on a side of the first panel 3011 away from the second panel 3012, and extends into the cavity between the first panel 3011 and the second panel 3012, and is used to connect to the first feeding structure 305 provided inside the cavity to receive the first feeding signal, and generate vertically polarized radiation under the excitation of the first feeding signal.
[0064] The vertically polarized monopole antenna 302 is connected to a first feed structure 305 located within the cavity to receive a first excitation signal fed by the first feed structure 305. The first excitation signal excites a 1 / 4 wavelength monopole mode, generating vertically polarized radiation. Optionally, a first feed port is provided at the end of the vertically polarized monopole antenna 302 near the second panel 3012. The first feed port of the vertically polarized monopole antenna 302 is connected to the first feed structure 305 to receive the first feed signal. As shown in FIG. 5 , the first feed structure 305 is connected to a feed source at a first port 307.
[0065] In this embodiment, the horizontally polarized dipole antenna 303 is arranged on the side of the second panel 3012 close to the vertically polarized monopole antenna 302 and extends away from the PCB 301, and is used to connect to the second feeding structure provided on the second panel 3012 to receive the second feeding signal, and generate horizontally polarized radiation under the excitation of the second feeding signal.
[0066] The horizontally polarized dipole antenna 303 is connected to a second feed structure (not shown in the figure, only the second feed structure is shown connected to the feed source via the second port 306) provided on the second panel 3012 to receive a second excitation signal fed by the second feed structure. The second excitation signal excites a 1 / 2 wavelength dipole mode, generating horizontally polarized radiation. By generating horizontally polarized radiation through the horizontally polarized dipole antenna 303 and vertically polarized radiation through the vertically polarized monopole antenna 302, the antenna unit can achieve dual-polarized radiation.
[0067] In this embodiment, the reflective component 304 is disposed on a side of the first panel 3011 facing away from the second panel 3012, and is located on a side of the vertically polarized monopole antenna 302 facing away from the horizontally polarized dipole antenna 303, and is used to guide the vertically polarized monopole antenna 302 to radiate in a direction away from the reflective component 304 when the vertically polarized monopole antenna 302 generates vertically polarized radiation.
[0068] Among them, the reflecting component 304 is arranged on the side of the first panel 3011 away from the second panel 3012, and is located on the side of the vertically polarized monopole antenna 302 away from the horizontally polarized dipole antenna 303. When the vertically polarized monopole antenna 302 generates vertically polarized radiation, the reflecting component 304 can generate surface current under the action of the vertically polarized monopole antenna 302 and form a reflector of the vertically polarized monopole antenna 302 to guide the vertically polarized monopole antenna 302 to radiate electromagnetic waves in a direction away from the reflecting component 304, thereby improving the gain of the vertically polarized monopole antenna 302 and further improving the end-fire performance of the vertically polarized monopole antenna 302.
[0069] The PCB end-fire antenna provided in this embodiment includes a PCB 301, a vertically polarized monopole antenna 302, a horizontally polarized dipole antenna 303, and a reflector assembly 304. The vertically polarized monopole antenna 302 is arranged on a side of the first panel 3011 facing away from the second panel 3012 and extends into a cavity between the first panel 3011 and the second panel 3012. The horizontally polarized dipole antenna 303 is arranged on a side of the second panel 3012 close to the vertically polarized monopole antenna 302 and extends away from the PCB 301. The reflector assembly 304 is arranged on a side of the first panel 3011 facing away from the second panel 3012 and is located on the side of the vertically polarized monopole antenna 302 facing away from the horizontally polarized dipole antenna 303. The vertically polarized monopole antenna 302 generates vertically polarized radiation under the excitation of the first feed signal, and the horizontally polarized dipole antenna 303 generates horizontally polarized radiation under the excitation of the second feed signal. When the vertically polarized monopole antenna 302 generates vertically polarized radiation, the reflective component 304 guides the vertically polarized monopole antenna 302 to radiate in a direction away from the reflective component 304, so that the antenna unit has a lower cross-section and effective isolation performance. In addition, the connector can be omitted, the stacking difficulty is small, and the occupied volume is small, further reducing the occupied area and stacking cost of the antenna unit, meeting the end-fire dual-polarization in an extremely small size, and being suitable for wireless terminal equipment.
[0070] In some embodiments, the first communication component includes at least one signal shielding unit. When the first communication component includes multiple PCB end-fire antennas and is arranged in an antenna stacking manner, the signal shielding unit is arranged between every two PCB end-fire antennas.
[0071] Figure 6 is a top view of a PCB end-fire antenna provided in an embodiment of the present application. As shown in Figure 6, the PCB end-fire antenna in this embodiment includes a reflector assembly 304 consisting of eight reflector arms 3041 arranged in a linear array; a vertically polarized monopole antenna 302 located on the symmetry axis of the reflector assembly 304; a horizontally polarized dipole antenna 303 consisting of a first radiating arm 3031, a second radiating arm 3032, and a trapezoidal impedance matching layer 3033 arranged in different layers; and a grounding assembly 3013 consisting of multiple metallized vias. Both the first panel 3011 and the second panel 3012 are metal plates. The impedance matching layer here serves as a signal shielding element.
[0072] It is understood that embodiments of the present application can expand the antenna stacking method of the transmitter module, adding shielding films internally to enable more antennas to operate within a limited space. New antenna forms can also be developed, including smaller antennas with better self-shielding properties, to achieve the same or even higher data transmission rates as conventional antennas.
[0073] The embodiment of the present application proposes a millimeter wave transceiver + external PCB antenna solution to replace the traditional millimeter wave transceiver chip integrated antenna solution. The advantage is that the antenna interface can be miniaturized and the layout and stacking on the product are more flexible.
[0074] FIG7 is a schematic structural diagram of a first communication component provided in an embodiment of the present application. As shown in FIG7 , the first communication component 103 includes a first signal transceiver unit 1031, a signal switching unit 1032, and a first communication control unit 1033. The first communication control unit 1033 is connected to the signal switching unit 1032 and the first signal transceiver unit 1031, respectively, and the signal switching unit 1032 is also connected to the first signal transceiver unit 1031. The signal switching unit 1032 is used to output the input data signal to the first communication control unit 1033 or to the first signal transceiver unit 1031 according to the control signal sent by the first communication control unit; the first communication control unit 1033 is used to determine the type of the power supply device according to the input digital signal, and when the type of the power supply device is a preset type, send a control signal to the signal switching unit 1032 so that the signal switching unit outputs the data signal to the first signal transceiver unit.
[0075] Figure 8 is a structural diagram of another first communication component provided in an embodiment of the present application. As shown in Figure 8, on the basis of the embodiment shown in Figure 7, the first communication component 103 also includes a first signal amplifying unit 1034, wherein the first signal amplifying unit 1034 is respectively connected to the signal switching unit 1032, the first signal transceiver unit 1031 and the first communication control unit 1033, and is used to amplify the received data signal and output it to the first signal transceiver unit.
[0076] FIG9 is a schematic structural diagram of a first charging component provided in an embodiment of the present application. As shown in FIG9 , the first charging component 102 includes a magnetic field transmitting unit 1021, a voltage regulating unit 1022, an inverter unit 1023, a resonance compensation unit 1024, and a first charging control unit 1025. The voltage regulating unit 1022, the inverter unit 1023, the resonance compensation unit 1024, and the magnetic field transmitting unit 1021 are connected in sequence, and the first charging control unit 1025 is connected to the inverter unit 1023. The voltage regulating unit 1022 is configured to adjust the input DC voltage source to a target inverter bus voltage; the inverter unit 1023 is configured to convert the target inverter bus voltage into an AC power source; the resonance compensation unit 1024 is configured to perform resonance compensation on the magnetic field transmitting unit so that the magnetic field transmitting unit converts the received current signal into an electromagnetic signal; and the first charging control unit 1025 is configured to control and drive wireless charging.
[0077] Figure 10 is a schematic diagram of the structure of a transmitting module provided by this application. As shown in Figure 10, the first charging control unit 1025 in the first charging component 102 and the first communication control unit 1033 in the first communication component 103 can be a main control unit, that is, the wireless charging function and wireless communication function of the wireless charging communication module are controlled by a main control unit.
[0078] In some embodiments, the first PCB includes two sub-PCBs, the voltage regulating unit of the first charging component is arranged on one sub-PCB, and the inverter unit, resonance compensation unit, magnetic field transmitting unit and first charging control unit of the first charging component, as well as the first communication component are all arranged on another sub-PCB.
[0079] Figure 11 is a structural schematic diagram of a transmitting module provided in an embodiment of the present application. As shown in Figure 11, the first PCB includes two sub-PCBs, namely, a sub-PCB 1012 and another sub-PCB 1013. The voltage regulating unit 1022 of the first charging component 102 is set on the sub-PCB 1012, and the inverter unit 1023, resonance compensation unit 1024, magnetic field transmitting unit 1021 and first charging control unit 1025 of the first charging component 102, as well as the various units included in the first communication component 103 are all set on PCB 1013.
[0080] It can be understood that placing the DC-DC voltage regulation circuit in the transmitting module at the other end of the charging connector, separated from other circuits, is equivalent to moving part of the heat source to the other end of the port that contacts the electronic device, which can reduce the temperature rise at the end that contacts the electronic device.
[0081] Figure 12 is a schematic diagram of a transmitting module provided in an embodiment of the present application. As shown in Figure 12, the transmitting module includes a first charging component 102 and a first communication component 103. The first charging component 102 and the first communication component 103 are arranged on a PCB.
[0082] The first charging component 102 includes a magnetic field transmitting unit 1021, a voltage regulating unit 1022, an inverter unit 1023, a resonance compensation unit 1024, and a first charging control unit 1025. As shown in Figure 12, the magnetic field transmitting unit 1021 is a transmitting coil (Tx coil), the voltage regulating unit 1022 is a boost chip (Boost) and a DC-DC converter circuit (DC-DC), the inverter unit 1023 is a transmitting end control chip (Tx control), a bridge GaN driver (Bridge GaN Driver), and an inverting rectifier bridge, the resonance compensation unit 1024 is a resonance compensation network, and the first charging control unit 1025 is a microcontroller (MCU).
[0083] In Figure 12, the first charging component 102 mainly includes a DC-DC voltage regulation circuit, an inverter circuit, a resonant compensation network, a rectifier and filter circuit, and a transmitting coil. The basic working principle is as follows: the system control unit MCU controls the DC-DC (Boost in Figure 12) converter to boost or step down the input DC voltage source to the target inverter bus voltage, and then converts it into an AC square wave power supply through the inverter circuit (the inverse rectifier bridge in Figure 12), thereby stimulating the subsequent resonant compensation network and the transmitting coil (Tx coil in Figure 12), converting electrical energy into a magnetic field for outward radiation.
[0084] The first communication component 103 includes a first signal transceiver unit 1031, a signal switching unit 1032, a first communication control unit 1033, and a first signal amplification unit 1034. As shown in Figure 12, the first signal transceiver unit 1031 is a millimeter wave transceiver, the signal switching unit 1032 is a D+ / D- switch, the first communication control unit 1033 is a microcontroller unit (MCU), and the first signal amplification unit 1034 is a USB 2.0 repeater. The first communication control unit 1033 and the first charging control unit 1025 are the same MCU.
[0085] In Figure 12, the left end of the charging connector uses a conventional wired interface to connect to the PC. The USB 2.0 data signals DP and DM from the PC are connected to the DP and DM signal lines of the charging connector. An internal D+ / D- switch can switch the DP / DM signal pins to the MCU and the USB 2.0 repeater. The USB 2.0 repeater can enhance the strength and quality of the USB 2.0 signal. Initially, it defaults to the MCU for BC1.2 identification to identify the charging type (power supply device type). If the Session Description Protocol (SDP) type is used (i.e., connected to a PC), the D+ / D- switch switches the DP / DM signal pins to the USB 2.0 repeater. The USB 2.0 data signal is then transmitted via millimeter waves through the millimeter wave transceiver.
[0086] Figure 13 is a schematic diagram of another transmitting module provided in an embodiment of the present application. As shown in Figure 13, the transmitting module includes a first charging component 102 and a first communication component 103. The structure is exactly the same as that shown in Figure 12, but the PCB includes two PCBs. The voltage regulator unit 1022 of the first charging component 102 is provided on the sub-PCB 1012, and the inverter unit 1023, resonance compensation unit 1024, magnetic field transmitting unit 1021 and first charging control unit 1025 of the first charging component 102, as well as the various units included in the first communication component 103, are all provided on PCB 1013.
[0087] In some embodiments, this solution can expand the functions of the charging connector MCU, that is, integrate the functions of the MCU, USB2.0 repeater, switch, and Tx control to achieve the same functions and realize cost optimization and size optimization.
[0088] Figure 14 is a structural schematic diagram of another transmitting module provided in an embodiment of the present application. As shown in Figure 14, the transmitting module also includes a first positioning component 104, which is arranged on the side of the first PCB. The first positioning component 104 is used to fix the contact position between the transmitting module and the electronic device.
[0089] Exemplarily, the first positioning assembly may include two magnets with opposite polarities, disposed at opposite ends of a side edge of the first PCB. The first positioning assembly magnetically aligns the side edges of the first PCB of the charging connector with the side edges of the second PCB of the electronic device to form a one-to-one correspondence between the channels.
[0090] Figure 15 is an interface diagram of a transmitting module provided in an embodiment of the present application. As shown in Figure 15, the first positioning component 104 can be two semicircular magnets, the two semicircular magnets have opposite magnetic poles, and each semicircular magnet has opposite polarity to the magnet corresponding to the electronic device end, which can perform magnetic attraction positioning. The magnetic field transmitting unit 1021 adopts a rod-shaped wireless charging coil TX, which is horizontally opposite to the coil RX corresponding to the electronic device end, replacing the wired charging interface with wireless charging. The first signal transceiver unit 1031 is two sets of PCB end-fire antennas, which are horizontally opposite to the PCB end-fire antennas at the electronic device end, and can realize parallel relative transmission, automatic negotiation, and form full-duplex millimeter wave data communication.
[0091] The solution provided in the embodiment of the present application combines wireless charging and millimeter wave communication. Through integrated design, it realizes a system solution that replaces the function of contact interface cables (such as Type-C interface cables). It not only meets the data transmission requirements between devices during wireless charging and improves the user experience, but also has the same structural size as the Type-C interface cable, which solves the problems of large size of the Type-C interface on the device side and easy corrosion of the interface contact position.
[0092] FIG16 is a schematic diagram of the structure of a receiving module provided in an embodiment of the present application. The receiving module can be applied to electronic devices, which can be various types of devices with information processing capabilities during implementation. For example, the electronic devices can include mobile phones, smart watches, smart glasses, wireless headphones, etc.
[0093] As shown in Figure 16, the receiving module includes a second printed circuit board PCB201, a second charging component 202 and a second communication component 203. The second charging component 202 and the second communication component 203 are both arranged on the second PCB201, wherein the second charging component 202 includes a magnetic field receiving unit 2021, and the magnetic field receiving unit 2021 is used to convert the induced electromagnetic signal into a current signal; the second communication component 203 includes a second signal transceiver unit 2031, and the second signal transceiver unit 2031 is used to transmit and receive millimeter wave signals; the magnetic field receiving unit 2021 and the second signal transceiver unit 2031 are both arranged on the side 2011 of the second PCB. When the distance between the charging connector and the side 2011 of the second PCB is less than the distance threshold, the electronic device can be wirelessly charged and millimeter wave communication can be performed with the charging connector.
[0094] It should be noted that the second charging component and the second communication component are both arranged on the second PCB, which means that the second charging component and the second communication component are arranged on the second PCB by welding or circuit connection. The magnetic field receiving unit and the second signal transceiver unit are both arranged on the side of the second PCB, which means that the second PCB includes four sides, and the magnetic field transmitting unit and the second signal transceiver unit are arranged on any side of the second PCB. Since the magnetic field receiving unit and the second signal transceiver unit of the electronic device need to maintain a small distance with the functional components corresponding to the charging connector end in order to perform wireless charging and wireless communication, the magnetic field receiving unit and the second signal transceiver unit are arranged on the side of the second PCB, which can facilitate contactless contact with the corresponding components at the charging connector end to achieve wireless charging and wireless communication.
[0095] An embodiment of the present application proposes a receiving module that uses wireless charging to implement a charging function and millimeter wave communication to implement a data transmission function, and the interface is arranged on the side of the second PCB, which facilitates a contactless interface design and can replace wired cables, making it easier for users to use.
[0096] In some embodiments, the second signal transceiver unit includes at least one set of PCB end-fire antennas. When the second signal transceiver unit includes two sets of PCB end-fire antennas, the magnetic field transmitting unit is disposed between the two sets of PCB end-fire antennas.
[0097] Figure 17 is a schematic diagram of the structure of another receiving module provided in an embodiment of the present application. As shown in Figure 17, the second signal transceiver unit 2031 includes two sets of PCB end-fire antennas, and the magnetic field receiving unit 2021 is disposed between the two sets of PCB end-fire antennas. The magnetic field receiving unit 2021 and the two sets of PCB end-fire antennas are both disposed on the sides of the second PCB 201.
[0098] It should be noted that the two PCB end-fire antennas are arranged in parallel with the corresponding PCB end-fire antennas on the charging connector, automatically negotiating and achieving full-duplex millimeter-wave data communication. Furthermore, the symmetrical arrangement of the second signal transceiver unit 2031 can meet the user's needs in both forward and reverse usage scenarios.
[0099] In some embodiments, the PCB end-fire antenna includes a horizontally polarized dipole antenna and a vertically polarized monopole antenna, and the second signal transceiver unit includes a radio frequency chip, which is respectively connected to the horizontally polarized dipole antenna and the vertically polarized monopole antenna through a transmission line.
[0100] In some embodiments, the second communication component includes at least one signal shielding unit. When the second communication component includes multiple PCB end-fire antennas and is arranged in an antenna stacking manner, the signal shielding unit is arranged between every two PCB end-fire antennas.
[0101] It should be noted that the embodiment of the present application adopts an external PCB end-fire antenna solution and an end-fire dual-polarization antenna solution, including a horizontally polarized dipole antenna and a vertically polarized monopole antenna. The horizontally polarized dipole antenna adopts a trapezoidal floor structure to increase the antenna impedance bandwidth; the vertically polarized monopole antenna adopts a quasi-Yagi-Uda antenna form, introducing a reflector arm oscillator to improve the end-fire gain. The RF chip is connected to the two antennas respectively through a 50-ohm transmission line, exciting a 1 / 2 wavelength dipole mode to generate horizontally polarized radiation, and a 1 / 4 wavelength mode monopole mode to generate vertically polarized radiation.
[0102] For an introduction to the PCB end-fire antenna, please refer to the description of the embodiments corresponding to Figures 5 and 6 above, and will not be repeated here. This embodiment of the application proposes a millimeter-wave transceiver + external PCB antenna solution to replace the traditional millimeter-wave transceiver chip integrated antenna solution. The advantage is that the antenna interface can be miniaturized and the layout and stacking on the product are more flexible.
[0103] It is understood that embodiments of the present application can expand the antenna stacking method of the transmitter module, adding shielding films internally to enable more antennas to operate within a limited space. New antenna forms can also be expanded, and smaller antennas with better self-shielding properties can be developed to achieve the same or even exceed conventional data transmission rates.
[0104] Figure 18 is a structural schematic diagram of a second communication component provided in an embodiment of the present application. As shown in Figure 18, the second communication component 203 includes a second signal transceiver unit 2031 and a second communication control unit 2032, wherein the second communication control unit 2032 is used to control the millimeter wave signal transmission and reception between the second signal transceiver unit 2031 and the charging connector, and convert the millimeter wave signal into a data signal.
[0105] Figure 19 is a schematic structural diagram of another second communication component provided in an embodiment of the present application. As shown in Figure 19, based on the structure shown in Figure 18, the second communication component 203 also includes a second signal amplifying unit 2033, and the second signal amplifying unit 2033 is respectively connected to the second signal transceiver unit 2031 and the second communication control unit 2032, and is used to amplify the data signal and output it to the corresponding wireless access point.
[0106] Figure 20 is a structural schematic diagram of a second charging component provided in an embodiment of the present application. As shown in Figure 20, the second charging component 202 includes a magnetic field receiving unit 2021, and also includes a secondary resonance compensation unit 2022, a rectification and filtering unit 2023 and a second charging control unit 2024. The secondary resonance compensation unit 2022, the rectification and filtering unit 2023 and the second charging control unit 2024 are connected in sequence, wherein the secondary resonance compensation unit 2022 is used to perform resonance compensation on the magnetic field receiving unit so that the magnetic field receiving unit converts the electromagnetic signal into an AC power supply; the rectification and filtering unit 2023 is used to convert the AC power supply into a DC power supply; the second charging control unit 2024 is used to output the DC power supply to the corresponding load to charge the load.
[0107] Figure 21 is a schematic diagram of the structure of a receiving module provided in an embodiment of the present application. As shown in Figure 21, the second charging control unit 2024 in the second charging component 202 and the second communication control unit 2032 in the second communication component can be a main control unit, that is, the wireless charging function and the wireless communication function of the receiving module are controlled by a main control unit.
[0108] Figure 22 is a schematic diagram of the structure of a receiving module provided in an embodiment of the present application. As shown in Figure 22, the receiving module includes a second charging component 202 and a second communication component 203. The second charging component 202 and the second communication component 203 are arranged on a PCB.
[0109] The second communication component 203 includes a second signal transceiver unit 2031, a second communication control unit 2032, and a second signal amplification unit 2033. The second signal transceiver unit 2031 is a millimeter wave transceiver, the second communication control unit 2032 is a microprocessor MCU, and the second signal amplification unit 2033 is a USB2.0 repeater.
[0110] The working principle can be referred to in Figure 22. After the electronic device receives the millimeter wave signal, it selects a millimeter wave transceiver for handshake connection, and then converts the received millimeter wave signal into a USB2.0 signal and gives it to the USB2.0 repeater in Figure 22 (the repeater can realize two-to-one selection), and then gives it to the wireless access point AP on the electronic device side to realize USB2.0 data communication transmission.
[0111] The second charging component 202 includes a magnetic field receiving unit 2021, a secondary resonance compensation unit 2022, a rectifier and filter unit 2023, and a second charging control unit 2024. The magnetic field receiving unit 2021 is a receiving coil, the secondary resonance compensation unit 2022 is a resonance compensation network, the rectifier and filter unit 2023 is an RX IC receiving chip, and the second charging control unit 2024 is a microcontroller MCU, which may also include a charging switch.
[0112] The working principle is that the receiving coil (Rx coil in Figure 22) converts magnetic energy into electrical energy through magnetic coupling induction, resonates with the secondary resonant compensation network to generate AC power, and then passes through the rectifier and filter circuit (integrated in the Rx IC in Figure 22) to output a stable DC voltage to charge the subsequent load.
[0113] The second communication control unit 2032 and the second charging control unit 2024 are the MCUs in FIG. 22 .
[0114] Among them, in this solution, the AP function of the electronic device side can be further expanded, and the functions of the MCU and USB2.0 repeater modules in the figure can be further integrated to achieve the same functions and realize cost optimization and size optimization.
[0115] Figure 23 is a schematic diagram of the structure of another receiving module provided in an embodiment of the present application. As shown in Figure 23, the receiving module also includes a second positioning assembly 204, which is disposed on a side edge 2011 of the second PCB. The second positioning assembly 204 is used to fix the contact position between the receiving module and the charging connector. Exemplarily, the second positioning assembly includes two magnets with opposite polarity, which are disposed at opposite ends of the side edge of the second PCB.
[0116] Figure 24 is a schematic diagram of the interface of a receiving module provided in an embodiment of the present application. As shown in Figure 24, the interface of the receiving module is set at the middle frame position of the electronic device, and the second positioning component 204 can be two semicircular magnets, the two semicircular magnets have opposite magnetic poles, and each semicircular magnet has opposite polarity to the magnet corresponding to the electronic device end, which can perform magnetic attraction positioning. The magnetic field receiving unit 2021 adopts a rod-shaped wireless charging coil RX, which is horizontally opposite to the coil TX corresponding to the charging connector end, replacing the wired charging interface with wireless charging. The second signal transceiver unit 2031 is two sets of PCB end-fire antennas, which are horizontally opposite to the PCB end-fire antennas at the charging connector end, and can realize parallel relative transmission, automatic negotiation, and form full-duplex millimeter wave data communication.
[0117] In some embodiments, a limiting structure is provided on the housing of the electronic device, and the receiving module maintains a non-contact contact position with the charging connector unchanged through the limiting structure.
[0118] As shown in Figure 24, the housing of the electronic device is provided with a limiting structure 205. This limiting structure 205 can be a groove, the size of which corresponds to the interface size of the charging connector. The limiting structure designed in the housing, i.e., the fitting structure, can ensure that the magnetic attraction force has only the Z-axis degree of freedom.
[0119] The solution provided in the embodiment of the present application combines wireless charging and millimeter wave communication. Through integrated design, it realizes a system solution that replaces the function of contact interface cables (such as Type-C interface cables). It not only meets the data transmission requirements between devices during wireless charging and improves the user experience, but also has the same structural size as the Type-C interface cable, which solves the problems of large size of the Type-C interface on the device side and easy corrosion of the interface contact position.
[0120] An embodiment of the present application further provides a charging connector, which includes the transmitting module provided above.
[0121] Figure 25 is a schematic diagram of the structure of a charging connector provided in an embodiment of the present application. The charging connector is a charging cable. The interface of the cable adopts the interface shown in Figure 15. One end of the charging cable is connected to an adapter or personal computer, and the other end is connected to an electronic device to charge the electronic device and communicate wirelessly with the electronic device. The interface of the charging cable connecting to the electronic device can be a conventional interface.
[0122] An embodiment of the present application also provides an electronic device, which includes the receiving module provided above.
[0123] FIG26 is a schematic diagram of the operation of a wireless charging communication system provided in an embodiment of the present application. As shown in FIG26 , the wireless charging communication system includes an electronic device and a charging connection cable. When the electronic device is not charging, the electronic device and the charging connection cable are not connected. When the electronic device is charging, the electronic device and the charging connection cable are in contactless contact, thereby performing wireless charging and wireless communication.
[0124] The embodiments of this application enable direct wireless charging and data transmission for small electronic products such as mobile phones without the need for traditional contact charging interfaces, providing convenience for users. Specifically, this solution designs, develops, and implements a compact and portable contactless interface with reliable wireless data transmission and wireless charging capabilities. The cable size is consistent with existing cable dimensions, making it adaptable to the interface functional requirements of small electronic devices such as watches, smart glasses, mobile phones, and smart headphones.
[0125] It should be understood that "one embodiment" or "an embodiment" or "some embodiments" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" or "in some embodiments" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. The above-mentioned serial numbers of the embodiments of the present application are for description only and do not represent the advantages and disadvantages of the embodiments. The above description of the various embodiments tends to emphasize the differences between the various embodiments. The same or similar aspects can be referenced to each other. For the sake of brevity, they will not be repeated here.
[0126] The term "and / or" in this article is only a description of the association relationship between associated objects, indicating that there can be three relationships. For example, object A and / or object B can mean: object A exists alone, object A and object B exist at the same time, and object B exists alone.
[0127] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.
[0128] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The embodiments described above are merely illustrative. For example, the division of the modules is merely a logical function division. In actual implementation, there may be other division methods, such as: multiple modules or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or modules can be electrical, mechanical or other forms.
[0129] The modules described above as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules; they may be located in one place or distributed across multiple network units; some or all of the modules may be selected according to actual needs to achieve the purpose of this embodiment.
[0130] In addition, all functional modules in the embodiments of the present application can be integrated into one processing unit, or each module can be a separate unit, or two or more modules can be integrated into one unit; the above-mentioned integrated modules can be implemented in the form of hardware or in the form of hardware plus software functional units.
[0131] Those skilled in the art will understand that all or part of the steps of implementing the above-mentioned method embodiment can be completed by hardware related to program instructions, and the aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps of the above-mentioned method embodiment; and the aforementioned storage medium includes: mobile storage devices, read-only memories (ROM), magnetic disks or optical disks, and other media that can store program codes.
[0132] Alternatively, if the above-mentioned integrated unit of the present application is implemented in the form of a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application, or the part that contributes to the relevant technology, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a number of instructions for enabling an electronic device to execute all or part of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as mobile storage devices, ROMs, magnetic disks or optical disks.
[0133] The methods disclosed in the several method embodiments provided in this application can be arbitrarily combined, if they do not conflict, to obtain new method embodiments. The features disclosed in the several product embodiments provided in this application can be arbitrarily combined, if they do not conflict, to obtain new product embodiments. The features disclosed in the several method or device embodiments provided in this application can be arbitrarily combined, if they do not conflict, to obtain new method embodiments or device embodiments.
[0134] The above is merely an embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.
Claims
1. A transmitting module, characterized in that Applied to a charging connector, including a first printed circuit board (PCB), a first charging component, and a first communication component. The first charging component and the first communication component are both disposed on the first PCB. Among them, The first charging component includes a magnetic field emission unit for converting a received current signal into an electromagnetic signal; the first communication component includes a first signal transceiver unit for transceiving millimeter-wave signals. Both the magnetic field emission unit and the first signal transceiver unit are disposed on the side of the first PCB. When the distance between the side of the first PCB and the electronic device is less than a distance threshold, wireless charging is performed on the electronic device and millimeter-wave communication is carried out with the electronic device.
2. The module according to claim 1, wherein The first signal transceiver unit includes at least one group of PCB end-fire antennas. When the first signal transceiver unit includes two groups of PCB end-fire antennas, the magnetic field emission unit is disposed between the two groups of PCB end-fire antennas.
3. The module according to claim 2, wherein The PCB end-fire antenna includes a horizontally polarized dipole antenna and a vertically polarized monopole antenna. The first signal transceiver unit includes a radio frequency chip, and the radio frequency chip is respectively connected to the horizontally polarized dipole antenna and the vertically polarized monopole antenna through transmission lines.
4. The module according to claim 2, wherein The first communication component includes at least one signal shielding unit. When the first communication component includes a plurality of the PCB end-fire antennas and is arranged in an antenna stacking manner, the signal shielding unit is disposed between every two of the PCB end-fire antennas.
5. The module according to claim 1, wherein The first communication component further includes a signal switching unit and a first communication control unit. The first communication control unit is respectively connected to the signal switching unit and the first signal transceiver unit, and the signal switching unit is also connected to the first signal transceiver unit. Among them, The signal switching unit is configured to output an input data signal to the first communication control unit or to the first signal transceiver unit according to a control signal sent by the first communication control unit. The first communication control unit is configured to determine the type of the power supply device according to the input digital signal. When the type of the power supply device is a preset type, a control signal is sent to the signal switching unit to enable the signal switching unit to output the data signal to the first signal transceiver unit.
6. The module according to claim 5, wherein The first communication component further includes a first signal amplification unit. The first signal amplification unit is respectively connected to the signal switching unit, the first signal transceiver unit, and the first communication control unit, and is configured to amplify the received data signal and then output it to the first signal transceiver unit.
7. The module according to claim 1, wherein The first charging component further includes a voltage regulation unit, an inverter unit, a resonance compensation unit, and a first charging control unit. Among them, The voltage regulation unit is configured to adjust an input DC voltage source to a target inverter bus voltage. The inverter unit is configured to convert the target inverter bus voltage into an AC power source. The resonance compensation unit is configured to perform resonance compensation on the magnetic field emission unit to enable the magnetic field emission unit to convert a received current signal into an electromagnetic signal. The first charging control unit is used to control and drive wireless charging.
8. The module according to claim 7, wherein, The first PCB includes two sub-PCBs. The voltage regulating unit of the first charging component is arranged on one sub-PCB, and the inverter unit, resonance compensation unit, magnetic field emission unit and first charging control unit of the first charging component, as well as the first communication component are all arranged on the other sub-PCB.
9. The module according to claim 1, wherein It further includes a first positioning component which is arranged on the side of the first PCB and is used to fix the contact position where the transmitting module contacts the electronic device.
10. The module according to claim 9, characterized in that, The first positioning component includes two magnets with opposite polarities, and the two magnets are arranged at both ends of the side of the first PCB.
11. A receiving module, characterized in that, Applied to an electronic device, it includes a second printed circuit board (PCB), a second charging component and a second communication component. The second charging component and the second communication component are both arranged on the second PCB. Among them, The second charging component includes a magnetic field receiving unit which is used to convert the induced electromagnetic signal into a current signal; the second communication component includes a second signal transceiver unit which is used to transmit and receive millimeter-wave signals. The magnetic field receiving unit and the second signal transceiver unit are both arranged on the side of the second PCB. When the distance between the side of the second PCB and the charging connector is less than the distance threshold, wireless charging is performed on the electronic device and millimeter-wave communication is carried out with the charging connector.
12. The module according to claim 11, wherein The second signal transceiver unit includes at least one group of PCB end-fire antennas. When the second signal transceiver unit includes two groups of PCB end-fire antennas, the magnetic field receiving unit is arranged between the two groups of PCB end-fire antennas.
13. The module according to claim 12, characterized in that, The PCB end-fire antenna includes a horizontally polarized dipole antenna and a vertically polarized monopole antenna. The signal transceiver unit includes a radio frequency chip, and the radio frequency chip is respectively connected to the horizontally polarized dipole antenna and the vertically polarized monopole antenna through transmission lines.
14. The module according to claim 12, wherein The second communication component includes a signal shielding unit. When the second communication component includes a plurality of the PCB end-fire antennas and is arranged in an antenna stacking manner, the signal shielding unit is arranged between every two of the PCB end-fire antennas.
15. The module according to claim 11, wherein The second communication component further includes a second communication control unit. Among them, The second communication control unit is used to control the second signal transceiver unit to perform millimeter-wave signal transmission and reception and convert the millimeter-wave signal into a data signal.
16. The module according to claim 15, characterized in that, The second communication component further includes a second signal amplification unit which is respectively connected to the second signal transceiver unit and the second communication control unit and is used to amplify the data signal and output it to the corresponding wireless access point.
17. The module according to claim 11, wherein, The second charging component further includes a secondary resonance compensation unit, a rectification and filtering unit and a second charging control unit. Among them, The secondary resonance compensation unit is used to perform resonance compensation on the magnetic field receiving unit so that the magnetic field receiving unit converts the electromagnetic signal into an alternating current power supply. The rectification and filtering unit is used to convert the alternating current power supply into a direct current power supply. The second charging control unit is configured to output the DC power supply to a corresponding load to charge the load.
18. The module according to claim 11, wherein, It further includes a second positioning component, which is arranged on the side of the second PCB, and is configured to fix the contact position where the receiving module contacts the charging connector.
19. The module according to claim 18, wherein The second positioning component includes two magnets with opposite polarities, and the two magnets are arranged at both ends of the side of the second PCB.
20. The module according to claim 11, wherein, A limiting structure is arranged on the housing of the electronic device, and the receiving module maintains the contact position of non-contact with the charging connector unchanged through the limiting structure.
21. A charging connector, characterized in that, It includes the transmitting module according to any one of claims 1 to 10.
22. An electronic device, characterized in that, It includes the receiving module according to any one of claims 11 to 20.
Citation Information
Patent Citations
Wireless charging receiving device, transmitting device, system and mobile terminal
CN112448489A
Electronic equipment and control method
CN113852705A
Wireless electric energy data hybrid transmission rotary connector
CN114122846A
Connector, electronic equipment and connecting line
CN114665319A
Composite power supply
CN114844151A