Electronic device including conductive structure for improving performance of antenna

Abstract

An electronic device according to one embodiment may comprise: a conductive bracket including a recess portion; and a display disposed on the conductive bracket and including a conductive layer. The electronic device may comprise: a conductive gasket including a first surface in contact with the conductive layer and a second surface opposite the first surface; and a non-conductive layer attached on the recess portion. The electronic device may include a conductive plate including a first portion in contact with the second surface and the non-conductive layer, and a second portion in contact with the recess portion and including a plurality of connection portions. The conductive plate may be electrically connected to the conductive bracket through the second portion including the plurality of connection portions.

Description

An electronic device comprising a conductive structure for improving the performance of an antenna.

[0001] The present disclosure relates to an electronic device including a conductive structure for improving the performance of an antenna.

[0002] Portable electronic devices, such as smartphones or tablet personal computers, can establish communication channels with external electronic devices, such as base stations or other portable electronic devices. To reduce signal loss when receiving signals from or transmitting signals to external electronic devices, the electronic devices may require a structure that enhances the performance of the antenna for communication with the external electronic devices.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] An electronic device is disclosed. In one embodiment, the electronic device may include a conductive bracket including a recessed portion, and a display disposed on the conductive bracket and including a conductive layer. The electronic device may include a conductive gasket including a first surface contacting the conductive layer of the display and a second surface opposite the first surface, wherein a portion of the conductive gasket may be disposed within the recessed portion. The electronic device may include a non-conductive layer attached to the recessed portion. The electronic device may include a conductive plate including a first portion contacting the second surface of the conductive gasket and the non-conductive layer, and a second portion including a plurality of connecting portions contacting the recessed portion. The conductive plate may be electrically connected to the conductive bracket through the second portion including the plurality of connecting portions.

[0005] An electronic device is disclosed. In one embodiment, the electronic device may include a display including a conductive layer, and a conductive bracket including a metal layer, and a housing coupled to the display. The electronic device may include a non-conductive layer attached to one side of the metal layer facing the display. The electronic device may include a conductive gasket having a first side in contact with the conductive layer of the display and a second side opposite the first side. The electronic device may include a conductive plate including a first portion in contact with the second side of the conductive gasket and positioned between the non-conductive layer and the conductive gasket, and a second portion extending from the first portion and including a plurality of connecting portions. The plurality of connecting portions may extend from the second portion to the metal layer. The conductive plate may be electrically connected to the conductive bracket through the second portion including the plurality of connecting portions.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2A is a diagram illustrating an electronic device according to one embodiment.

[0008] FIG. 2b is an exploded perspective view of an electronic device according to one embodiment.

[0009] Figure 3a illustrates a portion of an exemplary electronic device.

[0010] FIG. 3b is a partial cross-sectional view of an exemplary electronic device taken along line A-A' of FIG. 3a.

[0011] Figure 4a illustrates a portion of an exemplary electronic device.

[0012] FIG. 4b is a top plan view of a conductive member of an exemplary electronic device.

[0013] Figure 4c illustrates a portion of an exemplary electronic device.

[0014] FIG. 5A illustrates a portion of an exemplary electronic device before the conductive member is compressed.

[0015] FIG. 5b illustrates a portion of an exemplary electronic device after the conductive member has been compressed.

[0016] Figure 6 illustrates a portion of an exemplary electronic device.

[0017] Figure 7 is a graph showing the resistance of a current path according to the compression ratio of a conductive member of an exemplary electronic device.

[0018] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0019] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0020] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0021] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0022] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0023] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0024] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0025] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0026] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0027] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0028] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0029] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0030] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0032] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0033] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0034] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0035] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0036] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0037] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0038] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0039] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0040] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0041] FIG. 2A is a diagram illustrating an electronic device according to one embodiment.

[0042] Referring to FIG. 2A, an electronic device (200) according to one embodiment may include a housing (210) forming an exterior of the electronic device (200). For example, the housing (210) may include a front surface (200A), a rear surface (200B), and a side surface (200C) surrounding a space between the front surface (200A) and the rear surface (200B). According to one embodiment, the housing (210) may also refer to a structure forming at least a portion of the front surface (200A), the rear surface (200B), and / or the side surface (200C).

[0043] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). According to one embodiment, the front plate (202) may form at least a portion of the front surface (200A). According to one embodiment, the front plate (202) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0044] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). According to one embodiment, the back plate (211) may form at least a portion of the back surface (200B). According to one embodiment, the back plate (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0045] An electronic device (200) according to one embodiment may include a side bezel structure (or side member) (218). According to one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a side surface (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire side surface (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the side surface (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0046] Unlike the illustrated embodiment, when the side surface (200C) of the electronic device (200) is partially formed by the front plate (202) and / or the rear plate (211), the front plate (202) and / or the rear plate (211) may include a region that extends seamlessly from its edge portion toward the rear plate (211) and / or the front plate (202). The extending region of the front plate (202) and / or the rear plate (211) may be located at both ends of a long edge of the electronic device (200), for example, but is not limited to the above-described example.

[0047] In one embodiment, the side bezel structure (218) may include a metal and / or a polymer. In one embodiment, the back plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the side bezel structure (218) may be formed as separate components and / or may include different materials.

[0048] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light emitting element (not shown), and / or a connector hole (208). According to one embodiment, the electronic device (200) may omit at least one of the above components (e.g., the key input device (217) or the light emitting element (not shown)) or may additionally include other components.

[0049] In one embodiment, the display (201) may be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the front surface (200A). In one embodiment, the display (201) may be disposed on the back surface of the front plate (202).

[0050] According to one embodiment, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front plate (202) adjacent to the display (201). According to one embodiment, in order to expand the area where the display (201) is visually exposed, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

[0051] According to one embodiment, the display (201) (or the front surface (200A) of the electronic device (200)) may include a screen display area (201A). According to one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the front surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the front surface (200A) and spaced apart from the outer edge of the front surface (200A), but is not limited thereto. In another embodiment, when the front surface (200A) is viewed from the front, at least a portion of an edge part of the screen display area (201A) may substantially coincide with an edge part of the front surface (200A) (or the front plate (202)).

[0052] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the screen display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0053] In one embodiment, the display (201) may include an area where a first camera (205) is positioned. In one embodiment, an opening is formed in the area of ​​the display (201), and the first camera (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the front (200A). In this case, the screen display area (201A) may surround at least a portion of an edge part of the opening. In one embodiment, the first camera (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera (205) may acquire an image corresponding to a direction facing the front (200A) through the area of ​​the display (201).

[0054] According to one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0055] According to one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0056] According to one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the side (200C) and a second microphone hole (204) formed in a portion of the rear (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include multiple microphones to detect the direction of the sound.

[0057] According to one embodiment, the second microphone hole (204) formed in a portion of the rear surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0058] According to one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the side surface (200C) of the electronic device (200). According to one embodiment, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the side surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) in the side surface (200C). For example, with reference to the illustration in FIG. 2A, the external speaker hole (207) may be formed in the side surface (200C) corresponding to the lower portion of the electronic device (200), and the call receiver hole may be formed in the side surface (200C) corresponding to the upper portion of the electronic device (200). However, this is not limited thereto, and in one embodiment, the call receiver hole may be formed at a location other than the side (200C). For example, the call receiver hole may be formed by a spaced space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0059] According to one embodiment, the electronic device (200) may include at least one speaker (not shown) configured to output sound to the outside of the housing through an external speaker hole (207) and / or a call receiver hole (not shown).

[0060] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0061] According to one embodiment, the camera module (205, 212, 213) may include a first camera (205) positioned to face the front (200A) of the electronic device (200), a second camera (212) positioned to face the rear (200B), and a flash (213).

[0062] In one embodiment, the second camera (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0063] According to one embodiment, the first camera (205) and the second camera (212) may include one or more lenses, image sensors, and / or image signal processors.

[0064] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (200).

[0065] According to one embodiment, the key input device (217) may be positioned on a side (200C) of the electronic device (200). According to one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as soft keys, on the display (201).

[0066] According to one embodiment, a connector hole (208) may be formed on a side surface (200C) of the electronic device (200) so that a connector of an external device can be accommodated. A connection terminal electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module for processing electrical signals transmitted and received through the connection terminal.

[0067] According to one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on the front surface (200A) of the housing. The light-emitting element (not shown) may provide status information of the electronic device (200) in the form of light. According to one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0068] FIG. 2b is an exploded perspective view of an electronic device according to one embodiment.

[0069] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0070] Referring to FIG. 2b, an electronic device (200) according to one embodiment may include a frame structure (240), a first printed circuit board (250), a second printed circuit board (252), a cover plate (260), and a battery (270).

[0071] According to one embodiment, the frame structure (240) may include a side bezel structure (218) forming an exterior of the electronic device (200) (e.g., side surface (200C) of FIG. 2A) and a support portion (243) extending inwardly from the side bezel structure (218). According to one embodiment, the frame structure (240) may be disposed between the display (201) and the back plate (211). According to one embodiment, the side bezel structure (218) of the frame structure (240) may surround a space between the back plate (211) and the front plate (202) (and / or the display (201)), and the support portion (243) of the frame structure (240) may extend from the side bezel structure (218) within the space.

[0072] In one embodiment, the frame structure (240) may support or accommodate other components included in the electronic device (200). For example, a display (201) may be disposed on one side of the frame structure (240) facing one direction (e.g., +z direction), and the display (201) may be supported by a support portion (243) of the frame structure (240). For example, a first printed circuit board (250), a second printed circuit board (252), a battery (270), and a second camera (212) may be disposed on the other side of the frame structure (240) facing the opposite direction (e.g., -z direction). The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera (212) may each be mounted in a recess defined by the side bezel structure (218) and / or the support portion (243) of the frame structure (240).

[0073] According to one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly disposed to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed to the frame structure (240) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0074] According to one embodiment, the cover plate (260) may be disposed between the first printed circuit board (250) and the back plate (211). According to one embodiment, the cover plate (260) may be disposed on the first printed circuit board (250). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (250) facing the -z direction.

[0075] According to one embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (250) with respect to the z-axis. According to one embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (250). Through this, the cover plate (260) may protect the first printed circuit board (250) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (250).

[0076] According to one embodiment, the cover plate (260) may be fixedly positioned on the first printed circuit board (250) via a joining member (e.g., a screw), or may be joined to the frame structure (240) together with the first printed circuit board (250) via the joining member.

[0077] According to one embodiment, the display (201) may be disposed between a frame structure (240) and a front plate (202). For example, the front plate (202) may be disposed on one side (e.g., in the +z direction) of the display (201), and the frame structure (240) may be disposed on the other side (e.g., in the -z direction).

[0078] According to one embodiment, the front plate (202) can be coupled with the display (201). For example, the front plate (202) and the display (201) can be adhered to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0079] According to one embodiment, the front plate (202) may be coupled with the frame structure (240). For example, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the frame structure (240) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (202) and the frame structure (240) (e.g., side bezel structure (218)). However, the present invention is not limited to the above-described example.

[0080] According to one embodiment, the first printed circuit board (250) and / or the second printed circuit board (252) may be equipped with a processor, a memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. According to one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0081] In one embodiment, the battery (270) may power at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (250) and / or the second printed circuit board (252).

[0082] An electronic device (200) according to one embodiment may include an antenna module (not shown). According to one embodiment, the antenna module may be disposed between the rear plate (211) and the battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with the external device.

[0083] According to one embodiment, a first camera (205) (e.g., a front camera) may be positioned on at least a portion of a frame structure (240) (e.g., a support portion (243)) such that the lens can receive external light through a portion of the front plate (202) (e.g., the camera area (237)) (e.g., the front (200A) of FIG. 1).

[0084] In one embodiment, the second camera (212) (e.g., a rear camera) may be disposed between the frame structure (240) and the rear plate (211). In one embodiment, the second camera (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). In one embodiment, the second camera (212) may be disposed such that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0085] According to one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 1). According to one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera (212). According to one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (284) may form a plane substantially coextensive with the surface of the rear plate (211).

[0086] According to one embodiment, the housing of the electronic device (200) (e.g., the housing (210) of FIG. 2A) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (200). In this respect, at least a portion of the front plate (202), the frame structure (240), and / or the rear plate (211) that form the exterior of the electronic device (200) may be referred to as the housing (210) of the electronic device (200).

[0087] Fig. 3a illustrates a portion of an exemplary electronic device. Fig. 3b is a partial cross-sectional view of the exemplary electronic device taken along line A-A' of Fig. 3a.

[0088] Referring to FIGS. 3A and 3B, the electronic device (101) may include a housing (210), a display (310) including a conductive layer (311) (e.g., the display (201) of FIG. 2A), a conductive bracket (320), and a conductive member (330). The conductive member (330) may be referred to as a conductive gasket.

[0089] In one embodiment, the display (310) may form at least a portion of the front surface (200A) of the housing (210). For example, the display (310) may form at least a portion of the exterior surface of the housing (210). For example, the display (310) may be at least partially surrounded by a side bezel structure (218) of the housing (210). For example, the display (310) may be coupled with the housing (210) by being fastened to the housing (210). For example, the display (310) may include one side (310a) facing the interior of the housing (210) (e.g., in the -z direction) and another side (310b) opposite the one side (310a). The above-mentioned other surface (310b) can form at least a part of the front surface (200A) of the housing (210) by being exposed to the outside of the electronic device (101).

[0090] In one embodiment, the conductive bracket (320) may be disposed within the housing (210). The conductive bracket (320) may include a recessed portion (325) facing the display (310). For example, the conductive bracket (320) may be an internal structure of the housing (210). The conductive bracket (320) may form at least a portion of the housing (210). For example, the conductive bracket (320) may be disposed between a front surface (200A) of the housing (210) and a rear surface (e.g., the rear surface (200B) of FIG. 2A) opposite the front surface (200A), thereby being surrounded by the housing (210). For example, the conductive bracket (320) may be referred to as, but is not limited to, a frame structure (240) of FIG. 2B or a structure forming at least a portion of the frame structure (240). For example, the conductive bracket (320) can support the display (310) by being positioned toward the display (310) inside the housing (210).

[0091] For example, the recessed portion (325) may face one side (310a) of the display (310) formed by the conductive layer (311). For example, the recessed portion (325) may accommodate at least a portion of the conductive member (330). The recessed portion (325) may support the conductive member (330) by providing a space for the conductive member (330). For example, the recessed portion (325) may include a portion where an insulating layer (e.g., an insulating layer (322) of FIG. 4A) on a metal layer (e.g., a metal layer (321) of FIG. 4A) of the conductive bracket (320) is removed, for electrical connection between the conductive bracket (320) and the conductive member (330). The recessed portion (325) may be configured to at least partially accommodate the conductive member (330) so as to bring the metal layer (321) exposed through the portion where the insulating layer (322) is removed into contact with the conductive member (330).

[0092] According to one embodiment, the housing (210) may include one or more conductive portions (not shown) that function as an antenna (e.g., the antenna module (197) of FIG. 1) for communicating with an external electronic device (e.g., the electronic device (102) of FIG. 1). The one or more conductive portions may, for example, form at least a portion of a side bezel structure (218) of the housing (210), or may be exposed to the exterior of the electronic device (101) through a side surface (e.g., side surface (200C) of FIG. 2A) of the housing (210) that is at least partially formed by the side bezel structure (218). For example, the conductive bracket (320) may be coupled to the side bezel structure (218) including the one or more conductive portions, or may be formed integrally with the side bezel structure (218). An electronic device (101) may require a conductive structure using a display (310) and a conductive bracket (320) to improve performance (e.g., increase bandwidth of signal frequency) for signals from an external electronic device (102) and / or a server (e.g., server (108) of FIG. 1) received through one or more conductive portions functioning as antennas, or for signals transmitted from the electronic device (101) to the external electronic device (102) and / or the server (108).

[0093] According to one embodiment, the conductive layer (311) of the display (310) may form a side (310a) facing the conductive bracket (320). The display (310) may include the conductive layer (311) facing the conductive bracket (320), and a plurality of layers (312) disposed on the conductive layer (311) (e.g., in the +z direction).

[0094] For example, although not shown, the plurality of layers (312) may include at least one substantially transparent window. The at least one window may be exposed to the outside of the electronic device (101) to form at least a portion of the front surface (200A) of the housing (210). For example, the plurality of layers (312) may include a polarizer. The polarizer may reduce the amount of light reflected within the display (310) after being incident from the outside of the electronic device (101). As the amount of light reflected within the display (310) is reduced by the polarizer, the visibility of the display (310) may be improved. The polarizer may be a layer attached to at least one window of the display (310). For example, the plurality of layers (312) may include a display panel for driving the display (310). For example, the plurality of layers (312) may include a plurality of adhesive layers for attaching the plurality of layers (312) to each other. However, embodiments supported by the present disclosure are not limited thereto.

[0095] For example, the conductive layer (311) may be attached to a layer facing the conductive bracket (320) among the plurality of layers (312). The conductive layer (311) may overlap the front surface (200A) of the housing (210) when the display (310) is viewed from above (e.g., when viewed in the +z direction). For example, the conductive layer (311) may be electrically connected to the conductive member (330) by being in contact with the conductive member (330). For example, the conductive layer (311) in contact with one surface of the conductive member (330) may be electrically connected to the conductive bracket (320) in contact with the other surface of the conductive member (330) opposite to the one surface of the conductive member (330) through the conductive member (330).

[0096] According to one embodiment, a conductive member (330) may be disposed between a conductive bracket (320) and a conductive layer (311) for communication with an external electronic device (e.g., an electronic device (102) of FIG. 1). The conductive member (330) may provide a current path between the conductive bracket (320) and the conductive layer (311).

[0097] For example, the conductive member (330) may include a first surface (330a) that is in contact with the conductive layer (311) and a second surface (330b) opposite to the first surface (330a). In one embodiment, the second surface (330b) may be attached to the recess portion (325) (e.g., in the +z direction).

[0098] For example, the conductive member (330) may be placed at least partially within the recessed portion (325) of the conductive bracket (320), thereby coming into contact with the inner surface of the recessed portion (325). For example, referring also to FIG. 4A, the conductive member (330) may be placed on a portion of the recessed portion (325) of the conductive bracket (320) from which the insulating layer (322) has been removed. The conductive member (330) may be attached to the portion of the conductive bracket (320) from which the insulating layer (322) has been removed, thereby coming into contact with the metal layer (321) of the conductive bracket (320). The conductive member (330) may be electrically connected to the conductive bracket (320) through surface-to-surface contacting with the metal layer (321). For example, the conductive member (330) may be placed in the internal volume of the recessed portion (325), thereby filling a portion of the internal volume. However, the embodiments supported by the present disclosure are not limited thereto. For example, unlike the illustration, the recessed portion (325) may be omitted. In this case, the conductive member (330) may be placed on a portion of the conductive bracket (320) from which the insulating layer (322) has been removed, thereby coming into contact with the metal layer (321) below the insulating layer (322) of the conductive bracket (320).

[0099] For example, the conductive member (330) may be interposed between the conductive bracket (320) and the conductive layer (311). The conductive member (330) may be in contact with the conductive bracket (320) and the conductive layer (311). For example, the conductive member (330) may be fastened between the conductive layer (311) and the recessed portion (325). The conductive member (330) may be attached to the recessed portion (325) and the conductive layer (311). For example, the conductive member (330) may have elasticity. The conductive member (330) is pressed by the conductive layer (311) and the conductive bracket (320), so that the conductive layer (311) can be pressed in a direction toward which the display (310) is directed (e.g., +z direction) or the conductive bracket (320) can be pressed in a direction opposite to the direction toward which the display (310) is directed (e.g., -z direction) by the repulsive force (or restoring force) of the conductive member (330). The conductive member (330) can be configured to maintain a contact area of ​​the conductive member (330) with the conductive bracket (320) and the conductive layer (311) by having elasticity.

[0100] For example, one side (e.g., first side (330a)) of the conductive member (330) facing the display (310) can be in contact with the conductive layer (311) (or one side (310a) of the display (310) formed by the conductive layer (311). The other side (e.g., second side (330b)) of the conductive member (330) opposite to the one side and facing the conductive bracket (320) can be in contact with the conductive bracket (320). The other side of the conductive member (330) can be in contact with the metal layer (321) of the conductive bracket (320) by being placed on a portion of the conductive bracket (320) from which the insulating layer (322) has been removed. The conductive member (330) can electrically connect the display (310) and the conductive bracket (320) by coming into contact with the conductive layer (311) and the metal layer (321).

[0101] For example, the conductive bracket (320) may be coupled to a structure of the housing (210) including one or more conductive portions functioning as an antenna (e.g., a side bezel structure (218)), or may include one or more conductive portions functioning as an antenna (e.g., a metal layer (321)). The conductive member (330) may form a current path between the conductive bracket (320) and the conductive layer (311) of the display (310) by electrically connecting the conductive bracket (320) and the conductive layer (311) for communication with an external electronic device (102). For example, referring to FIG. 3A, the conductive member (330) may relatively increase the surface current density of an area of ​​the conductive bracket (320) to which the conductive member (330) is attached by electrically connecting the conductive layer (311) to the conductive bracket (320). The conductive member (330) can increase the current density of the conductive bracket (320) that functions as an antenna, thereby increasing the bandwidth of the frequency of a signal transmitted from the electronic device (101) to the external electronic device (102) for communication with the external electronic device (102) and / or a signal received from the external electronic device (102) to the electronic device (101).

[0102] Although the electronic device (101) is described as including a conductive member (330), the embodiments supported by the present disclosure are not limited thereto. The electronic device (101) may include a plurality of conductive members that provide a current path between the conductive bracket (320) and the conductive layer (311). The plurality of conductive members may be disposed adjacent to one or more conductive portions of the conductive bracket (320) and / or the side bezel structure (218) that function as an antenna. For example, referring to FIG. 3A, the conductive bracket (320) may include a plurality of regions (300a, 300b, 300c, 300d, 300e, 300f) in which the conductive members are respectively disposed. For example, the regions (300a, 300b, 300c, 300d) may each include a conductive member (330) to form a current path for improving the frequency bandwidth of a main antenna of the electronic device (101). For example, the regions (300e, 300f) may each include a conductive member (330) to form a current path for improving the frequency bandwidth of an auxiliary antenna of the electronic device (101). However, the above-described embodiments are exemplary and are not limited thereto.

[0103] According to one embodiment, the conductive member (330) and / or the metal layer (321) may be corroded by the reaction through the face-to-face contact between the conductive member (330) and the metal layer (321) of the conductive bracket (320). In addition, due to the discontinuity (or relatively high asperity) of the contact surface (e.g., one surface (321a) of FIG. 4A) of the metal layer (321) that contacts the conductive member (330), a non-linear resistance is generated in the current path between the conductive bracket (320) and the conductive layer (311) provided from the conductive member (330), thereby causing noise (e.g., passive intermodulation (PIM)) in the signal for communication with the external electronic device (102). The electronic device (101) may require a structure for reducing corrosion of the conductive bracket (320) and / or the conductive member (330) through electrical connection through face-to-face contact between the conductive bracket (320) and the conductive member (330) and reducing noise in a signal for communication with the external electronic device (102). A structure for reducing corrosion of the conductive bracket (320) and / or the conductive member (330) and noise in the signal is disclosed through the illustration and description in FIG. 4a and below.

[0104] According to one or more of the embodiments described above, the electronic device (101) may include a conductive member (330) that provides a current path by electrically connecting the conductive layer (311) of the display (310) and the conductive bracket (320). The conductive member (330) may improve the frequency bandwidth of a signal of the electronic device (101) for communication with an external electronic device (102) by forming the current path.

[0105] Figure 4a illustrates a portion of an exemplary electronic device. Figure 4b is a top plan view of a conductive member of the exemplary electronic device. Figure 4c illustrates a portion of the exemplary electronic device.

[0106] Referring to FIGS. 4A, 4B, and 4C, an electronic device (101) may include a housing (e.g., the housing (210) of FIG. 2A), a display (310) (e.g., the display (201) of FIG. 2A) forming at least a portion of a front surface (200A) of the housing (210), and a conductive bracket (320) disposed within the housing (210) and configured to support the display (310) including a recessed portion (325) facing the display (310). The electronic device (101) may include the display (310) including a conductive layer (311) forming one surface (310a) facing the conductive bracket (320). The electronic device (101) may include a conductive member (330) providing a current path between the conductive bracket (320) and the conductive layer (311).

[0107] According to one embodiment, the electronic device (101) may include a conductive plate (410) attached to a recessed portion (325) of a conductive bracket (320), the conductive plate including a first portion (411), and a second portion (412) extending from the first portion (411) and including a plurality of connecting portions (420) for electrical connection with the conductive bracket (320).

[0108] For example, the conductive plate (410) may be at least partially interposed between the conductive bracket (320) and the conductive member (330). For example, the conductive plate (410) may be fixed on the conductive bracket (320) via a plurality of connecting portions (420). For example, the conductive plate (410) may be disposed inside the recessed portion (325). The conductive plate (410) may be attached to one side of the recessed portion (325) facing the display (310). For example, the conductive plate (410) may support the conductive member (330) to urge the conductive member (330) toward the display (310) (e.g., in the +z direction). For example, one side (410a) of the conductive plate (410) facing the display may be at least partially in contact with the conductive member (330). The other side (410b) opposite to the one side (410a) may be disposed on the conductive bracket (320). For example, the other side (410b) of the conductive plate (410) may face the conductive bracket (320). The other side (410b) of the conductive plate (410) may be attached to the conductive bracket (320) via the non-conductive layer (430).

[0109] For example, the first portion (411) may be connected to the second portion (412). For example, the first portion (411) may be surrounded by the second portion (412). The first portion (411) may be an area for mounting the conductive member (330) on the conductive plate (410). For example, the first portion (411) may overlap at least a portion of the conductive member (330) when viewed from above (e.g., when viewed in the +z direction). For example, the first portion (411) may be an area for electrical connection with the conductive member (330). For example, the first portion (411) may be fixed toward the conductive layer (311) by a plurality of connecting portions (420) disposed within the second portion (412). For example, the first portion (411) may be in surface-to-surface contact with the conductive member (330) through one surface (410a) of the conductive plate (410). For example, the area of ​​the first portion (411) may be larger than the area of ​​the second portion (412) for attachment of the conductive member (330). The conductive plate (410) may include the first portion (411) that provides a contact surface that comes into contact with the conductive member (330), thereby increasing the contact area with the conductive member (330) and providing a current path between the conductive bracket (320) and the conductive layer (311) together with the conductive member (330).

[0110] For example, the second portion (412) may be an area for electrical connection with the conductive bracket (320). For example, the second portion (412) may not overlap the conductive member (330) when viewed from above (e.g., when viewed in the +z direction). For example, the second portion (412) may be an area where the conductive member (330) is not attached. For example, the second portion (412) may be an area including an edge (415) of the conductive plate (410). The second portion (412) may be coupled to the conductive bracket (320) through a plurality of connecting portions (420), thereby fastening the conductive plate (410) to the conductive bracket (320).

[0111] For example, a plurality of connecting portions (420) may be positioned within the second portion (412). The plurality of connecting portions (420) may be arranged along an edge (415) of the conductive plate (410) within the second portion (412). For example, the plurality of connecting portions (420) may extend from the conductive plate (410) toward the conductive bracket (320) to form a current path between the conductive plate (410) and the conductive bracket (320). For example, the plurality of connecting portions (420) may be portions of the conductive plate (410) that come into contact with the metal layer (321) of the conductive bracket (320). For example, the plurality of connecting portions (420) can electrically connect the conductive plate (410) and the metal layer (321) by extending from the conductive plate (410) to the metal layer (321) of the conductive bracket (320). For example, the other side (410b) of the conductive plate (410) facing the conductive bracket (320) can be separated from the one side (321a) of the metal layer (321) facing the display (310) by a non-conductive layer (430). The conductive plate (410) can be brought into contact with the metal layer (321) through the plurality of connecting portions (420) extending to the metal layer (321) within the second portion (412). The conductive plate (410) is in contact with the metal layer (321) through the plurality of connecting portions (420) rather than through face-to-face contact, thereby reducing corrosion of the metal layer (321) and / or the conductive plate (410) due to a reaction between the metal layer (321) and the conductive plate (410) (and / or the conductive member (330)).

[0112] According to one embodiment, the conductive member (330) may be attached to a first portion (411) of the conductive plate (410) and disposed between the conductive plate (410) and the conductive layer (311), thereby providing a current path between the conductive bracket (320) and the conductive layer (311). For example, the conductive member (330) may be interposed between the conductive plate (410) and the conductive layer (311). For example, a first side (330a) of the conductive member (330) may be in contact with one side (310a) of the display (310) formed by the conductive layer (311). A second side (330b) of the conductive member (330), which is opposite to the first side (330a), may be in contact with one side (410a) of the conductive plate (410) facing the display (310). For example, the conductive member (330) may extend from the conductive plate (410) to the conductive layer (311). For example, the conductive plate (410) may be electrically connected to the conductive bracket (320) through a plurality of connecting portions (420) in the second portion (412) that are in contact with the metal layer (321). The conductive member (330) may be electrically connected to the conductive plate (410) by being in contact with the first portion (411) that extends from the second portion (412). The conductive member (330) may be electrically connected to the conductive layer (311) by being in contact with one surface (310a) of the display (310) formed by the conductive layer (311). The conductive member (330) can provide a current path from the conductive bracket (320) to the conductive layer (311) and / or a current path from the conductive layer (311) to the conductive bracket (320) together with a conductive plate (410) connected to the conductive bracket (320) through a plurality of connecting portions (420).

[0113] According to one embodiment, the conductive bracket (320) may include a metal layer (321) and an insulating layer (322) disposed on one side (321a) of the metal layer (321) facing the display (310).

[0114] Referring to FIG. 4A, the metal layer (321) may be in contact with the non-conductive layer (430). The insulating layer (322) may be removed from a portion of the conductive bracket (320) on which the non-conductive layer (430) is disposed. For example, the non-conductive layer (430) may be disposed between the first portion (411) of the conductive plate (410) and the metal layer (321). The non-conductive layer (430) may be configured to attach the conductive plate (410) to the recess portion (325). The first portion (411) of the conductive plate (410) may be separated from the metal layer (321) by the non-conductive layer (430). Since the first portion (411) is separated from the metal layer (321) by the non-conductive layer (430), the electronic device (101) can reduce corrosion of the conductive plate (410) and / or the metal layer (321) due to face-to-face contact between the first portion (411) and the metal layer (321) (or one surface (321a) of the metal layer (321)).

[0115] Referring to FIG. 4c, at least a portion of the insulating layer (322) may be disposed between the non-conductive layer (430) and the metal layer (321). For example, the insulating layer (322) may cover one side (321a) of the metal layer (321) facing the display (310). A plurality of connecting portions (420) may extend from the conductive plate (410) through the insulating layer (322) to the metal layer (321). However, the above-mentioned embodiments are exemplary and are not limited thereto. For example, either the non-conductive layer (430) or the insulating layer (322) may be omitted. The first part (411) of the conductive plate (410) is separated from the metal layer (321) by another non-omitted configuration of the non-conductive layer (430) and the insulating layer (322), thereby reducing corrosion of the conductive plate (410) and / or the metal layer (321) due to face-to-face contact between the conductive plate (410) and the metal layer (321).

[0116] For example, the metal layer (321) may be a base material of the conductive bracket (320). The metal layer (321) may be a portion of the conductive bracket (320) that is configured to allow current to flow by being electrically connected to the conductive plate (410). For example, the insulating layer (322) may partially cover one side (321a) of the metal layer (321) facing the display (310). The insulating layer (322) may be formed on the metal layer (321). For example, the reactivity of the insulating layer (322) may be lower than the reactivity of the metal layer (321). The insulating layer (322) may reduce corrosion of the metal layer (321) by at least partially covering one side (321a) of the metal layer (321). For example, at least a portion of the insulating layer (322) may be removed for the conductive plate (410) and / or the non-conductive layer (430) for attaching the conductive plate (410) to the recessed portion (325) within the recessed portion (325). For example, the insulating layer (322) may be referred to as, but is not limited to, an anodized layer formed through an anodizing process of the metal layer (321).

[0117] For example, a plurality of connecting portions (420) may extend from a second portion (412) of the conductive plate (410) to the metal layer (321). The plurality of connecting portions (420) may be connected to the metal layer (321) to provide a current path between the conductive plate (410) and the metal layer (321). For example, the non-conductive layer (430) may separate the other side (410b) of the conductive plate (410) facing the conductive bracket (320) from the one side (321a) of the metal layer (321) facing the display (310), except for the plurality of connecting portions (420).

[0118] According to one embodiment, the electronic device (101) may include a non-conductive layer (430) attached on the recessed portion (325). Each of the plurality of connecting portions (420) may include a first conductive portion (420a) protruding from the conductive plate (410) toward the conductive layer (311), a second conductive portion (420b) in contact with the metal layer (321), and a third conductive portion (420c) extending from the first conductive portion (420a) through the second portion (412) of the conductive plate (410) to the second conductive portion (420b). For example, the non-conductive layer (430) may attach the conductive plate (410) on the recessed portion (325). For example, the non-conductive layer (430) may be interposed between the conductive bracket (320) and the conductive plate (410), thereby electrically disconnecting the remaining portion of the conductive plate (410) except for the plurality of connecting portions (420) from the conductive bracket (320). The electronic device (101) may include the non-conductive layer (430) interposed between the conductive bracket (320) and the conductive plate (410), thereby reducing corrosion of the conductive plate (410) and / or the conductive bracket (320) due to a reaction between the conductive plate (410) and the conductive bracket (320).

[0119] According to one embodiment, the size of the non-conductive layer (430) may be smaller than the size of the conductive plate (410). The thickness of the non-conductive layer (430) may be in a range of 10 μm or more and 50 μm or less. For example, the non-conductive layer (430) may overlap the first portion (411) of the conductive plate (410) when viewed from above (e.g., when viewed in the -z direction). The non-conductive layer (430) may have a thickness within a specified range, thereby reducing damage to the display (310) caused by the conductive plate (410) and the conductive member (330) attached to the non-conductive layer (430).

[0120] For example, the first conductive portion (420a) may be a portion protruding from one surface (410a) of the conductive plate (410) among the plurality of connecting portions (420) toward the display (310). Since the first conductive portion (420a) is formed within the second portion (412), the conductive plate (410) may provide a space in which the conductive member (330) is seated through the first portion (411) extending from the second portion (412). For example, the second conductive portion (420b) may be a portion coupled to the metal layer (321). The second conductive portion (420b) may be electrically connected to the metal layer (321) by coming into contact with the metal layer (321). For example, the third conductive portion (420c) may provide a current path between the first conductive portion (420a) and the second conductive portion (420b) by connecting the first conductive portion (420a) and the second conductive portion (420b). The third conductive portion (420c) may extend from the second portion (412) of the conductive plate (410) toward the metal layer (321). The plurality of connecting portions (420) may be configured to electrically connect the metal layer (321) and the conductive plate (410) by including the conductive portions (420a, 420b, 420c), respectively. Since the contact area between the second conductive portion (420b) and the metal layer (321) is smaller than the area where the other surface (410b) of the conductive plate (410) and one surface (321a) of the metal layer (321) are in face-to-face contact, the structure in which the conductive plate (410) and the metal layer (321) are connected by a plurality of connecting portions (420) can reduce corrosion of the metal layer (321) and / or the conductive plate (410).

[0121] According to one embodiment, each of the plurality of connecting portions (420) may include a hole (420d) extending from the first conductive portion (420a) through the third conductive portion (420c) to the second conductive portion (420b). For example, at least a portion of the metal layer (321) may be exposed to the outside of the conductive plate (410) through the hole (420d) of each of the plurality of connecting portions (420). For example, the plurality of connecting portions (420) may be joined to the conductive bracket (320) by welding. The hole (420d) may be formed by the welding. However, the manner in which the plurality of connecting portions (420) are joined to the metal layer (321) is not limited by the embodiments supported by the present disclosure, and the plurality of connecting portions (420) may be connected to the metal layer (321) through various processes.

[0122] According to one embodiment, the conductive member (330) may include an elastic member (331), a conductive film (332) surrounding the elastic member (331), and a first conductive adhesive member (333) that attaches the conductive film (332) to the conductive plate (410) for electrical connection between the conductive film (332) and the conductive plate (410). The conductive member (330) may include a first surface (330a) that is in contact with the conductive layer (311), and a second surface (330b) opposite to the first surface (330a). The second surface (330b) may be in contact with the conductive plate (410).

[0123] For example, the elastic member (331) may be deformable. The elastic member (331) may pressurize the conductive layer (311) by a restoring force (or a repulsive force) when pressed by the conductive layer (311). The conductive member (330) may reduce noise of a signal for communication with an external electronic device (102) by maintaining a contact area between the conductive member (330) and the conductive layer (311) by the restoring force of the elastic member (331). For example, the elastic member (331) may pressurize the conductive plate (410) and / or the first conductive adhesive member (333) by a restoring force (or a repulsive force) when pressed by the conductive plate (410). The conductive member (330) can reduce noise of a signal for communication with an external electronic device (102) by maintaining a contact area between the conductive member (330) and the conductive plate (410) by the restoring force of the elastic member (331).

[0124] For example, the conductive film (332) can wrap the elastic member (331). The conductive film (332) can provide a conductive surface of the conductive member (330). For example, the conductive member (330) can further include an adhesive member (334) disposed between the elastic member (331) and the conductive film (332). The adhesive member (334) can reduce the conductive film (332) from being separated from the elastic member (331) due to deformation of the elastic member (331) by attaching the conductive film (332) to the elastic member (331). For example, a portion of the conductive film (332) can be in contact with the conductive layer (311). The conductive film (332) can electrically connect the conductive member (330) and the display (310) by, for example, coming into contact with one side (310a) of the display (310) formed by the conductive layer (311).

[0125] For example, the first conductive adhesive member (333) may be interposed between the conductive film (332) and the conductive plate (410). The first conductive adhesive member (333) may electrically connect the conductive plate (410) and the conductive film (332) by attaching the conductive film (332) to the first portion (411) of the conductive plate (410). For example, the conductive film (332) may form a first surface (330a) of the conductive member (330) that is in contact with the conductive layer (311) of the display (310). The first conductive adhesive member (333) may form a second surface (330b) of the conductive member (330) that is opposite to the first surface (330a) and that is in contact with the conductive plate (410). The second side (330b) of the conductive member (330) can form a current path between the conductive member (330) and the conductive plate (410) by coming into contact with one side (410a) of the conductive plate (410) facing the display (310).

[0126] According to one embodiment, the asperity of one side (410a) of the conductive plate (410) facing the display (310) may be smaller than the asperity of one side (321a) of the metal layer (321) facing the display (310). For example, referring also to FIG. 3B, when the conductive plate (410) is omitted, one side (321a) of the metal layer (321) may be in contact with one side (333a) of the conductive member (330) formed by the first conductive adhesive member (333). Since the one side (321a) of the metal layer (321) has a relatively large roughness, noise of a signal for communication with an external electronic device (102) may increase due to a discontinuous contact structure between the one side (321a) of the metal layer (321) and the one side (333a) of the conductive member (330). For example, unlike FIG. 3b, when a conductive plate (410) is provided, the second side (330b) of the conductive member (330) formed by the first conductive adhesive member (333) may come into contact with the one side (410a) (or the first portion (411)) of the conductive plate (410) facing the display (310). Since the one surface (410a) of the conductive plate (410) has a relatively small roughness, the surface-to-surface contact structure between the conductive plate (410) and the conductive member (330) can have an increased contact area compared to a structure in which the metal layer (321) and the conductive member (330) are in surface-to-surface contact. The conductive plate (410) can reduce a discontinuous contact structure with the conductive member (330) by having a relatively small roughness. The conductive plate (410) can reduce noise of a signal for communication with an external electronic device (102) by reducing a discontinuous contact structure with the conductive member (330).

[0127] According to one embodiment, the conductive plate (410) may include at least one of nickel and stainless steel. The conductive member (330) may include at least one of copper, nickel, and urethane. For example, although not shown, the conductive plate (410) may include a structure in which a base material including stainless steel is surrounded by a layer including nickel. The conductive plate (410) may reduce corrosion of the conductive plate (410) and / or the conductive bracket (320) connected to the conductive plate (410) by including the layer including nickel. For example, the elastic member (331) of the conductive member (330) may include urethane. The conductive film (332) surrounding the elastic member (331) may include at least one of copper and nickel. The conductive member (330) can provide a conductive surface for a current path between the conductive bracket (320) and the conductive layer (311) by including the conductive film (332) including at least one of copper and nickel.

[0128] According to one embodiment, the plurality of connecting portions (420) may include first connecting portions (421) arranged along an edge (415) of the conductive plate (410), and second connecting portions (422) facing the first connecting portions (421) and spaced apart from the first connecting portions (421). For example, the plurality of connecting portions (420) may be arranged along the edge (415) of the conductive plate (410). For example, a first edge part (415a) of the conductive plate (410) may be referred to as one end of the conductive plate (410). A second edge part (415b) may be referred to as the other end opposite the one end of the conductive plate (410). For example, the first connecting portions (421) may be arranged along the first edge part (415a). The second connecting portions (422) may be spaced apart from the first connecting portions (421) by being arranged along the second edge portion (415b) spaced apart from the first edge portion (415a). For example, the conductive member (330) may be at least partially arranged between the first connecting portions (421) and the second connecting portions (422). For example, the direction in which the first connecting portions (421) are arranged (e.g., +x direction or -x direction) may correspond to the direction in which the second connecting portions (422) are arranged, but is not limited thereto. The plurality of connecting portions (420) include first connecting portions (421) and second connecting portions (422) respectively arranged along both ends of the conductive plate (410), thereby fixing the conductive plate (410) on the conductive bracket (320) and maintaining the flatness of the conductive plate (410) for contact with the conductive member (330).

[0129] According to the above-described embodiment, the electronic device (101) can reduce corrosion of the conductive bracket (320) and / or the conductive member (330) by including a conductive plate (410) electrically connected to the conductive bracket (320) through a plurality of connecting portions (420). The conductive plate (410) can improve the frequency bandwidth of a signal for communication with the external electronic device (102) through face-to-face contact with the conductive member (330). One surface (410a) of the conductive plate (410) facing the display (310) has a roughness smaller than one surface (321a) of the metal layer (321) facing the display (310), thereby reducing noise of the signal due to face-to-face contact with the conductive member (330).

[0130] Figure 5a illustrates a portion of an exemplary electronic device before the conductive member is compressed. Figure 5b illustrates a portion of an exemplary electronic device after the conductive member is compressed.

[0131] Referring to FIGS. 5A and 5B, an electronic device (101) may include a conductive bracket (320) including a recessed portion (325), and a display (310) disposed on the conductive bracket (320) and including a conductive layer (311). The electronic device (101) may include a conductive member (330) including a first surface (330a) that contacts the conductive layer (311) of the display (310) and a second surface (330b) opposite to the first surface (330a), and the conductive member (330) may be disposed within the recessed portion (325). The electronic device (101) may include a non-conductive layer (430) attached on the recessed portion (325). The electronic device (101) may include a conductive plate (410) including a first portion (411) in contact with the second surface (330b) of the conductive member (330) and the non-conductive layer (430), and a second portion (412) including a plurality of connecting portions (420) in contact with the metal layer (321) of the recess portion (325). The conductive plate (410) may be electrically connected to the conductive bracket (320) through the second portion (412) including the plurality of connecting portions (420). According to one embodiment, the plurality of connecting portions (420) may be arranged along an edge (415) of the conductive plate (410) (e.g., a first edge portion (415a) and a second edge portion (415b)).

[0132] Hereinafter, redundant descriptions of configurations having the same reference numerals as those described in FIGS. 4a and 4b are omitted.

[0133] According to one embodiment, the conductive member (330) may have a compressibility rate (c) within a range of 40% or more and 50% or less. The compressibility rate (c) of the conductive member (330) may be expressed as a ratio of the thickness (t2) of the conductive member (330) after being compressed by the display (310) to the thickness (t1) of the conductive member (330) before being compressed by the display (310). The compressibility rate (c) of the conductive member (330) may be referred to by the following mathematical equation.

[0134]

[0135] For example, within the range of a compression ratio (c) of 40% or more and 50% or less, the repulsive force of the conductive member (330) toward the conductive layer (311) and the conductive plate (410) may nonlinearly increase due to the restoring force of the elastic member (331). The conductive member (330) may increase the contact area with the conductive layer (311) and the conductive plate (410) due to the repulsive force by having a compression ratio (c) within the range of 40% or more and 50% or less. For example, the repulsive force of the conductive member (330) toward the conductive layer (311) may be within the range of 10 gf or more and 80 gf or less at a compression ratio (c) within the range of 40% or more and 50% or less. The above conductive member (330) has a compression ratio (c) within a range of 40% or more and 50% or less, thereby reducing damage to the display (310) due to relatively high repulsive force.

[0136] According to one embodiment, the resistance of the current path between the conductive bracket (320) and the conductive layer (311) provided by the conductive member (330) (and / or the conductive plate (410)) may be in a range of 50 mΩ to 200 mΩ. For example, the conductive member (330) may provide a current path between the conductive bracket (320) and the conductive layer (311) having a resistance in a range of 50 mΩ to 200 mΩ within a compression ratio (c) range of 40% to 50%. The conductive member (330) may reduce noise for communication with an external electronic device (102) and reduce resistance deviation of the current path by providing the current path having a relatively small resistance.

[0137] In one embodiment, the distance (d) between the conductive plate (410) and the conductive layer (311) may be greater than the depth (h) of the recessed portion (325). For example, the recessed portion (325) may accommodate the conductive plate (410) and a portion of the conductive member (330). For example, the distance (d) between the conductive plate (410) and the conductive layer (311) may correspond to a sum of a thickness (t2) of the conductive member (330) and a thickness of the conductive plate (410), which provides a compression ratio (c) at which the repulsive force of the conductive member (330) non-linearly increases. Since the distance (d) is greater than the depth (h) of the recessed portion (325), the conductive member (330) and the conductive plate (410) may form a current path between the conductive bracket (320) and the conductive layer (311).

[0138] Although the above-described embodiment is based on a compression ratio (c) within a range of 40% to 50% of the conductive member (330), the embodiment supported by the present disclosure is not limited thereto. For example, the conductive member (330) may have various properties by including various conductive materials and / or elastic materials. The thickness (t2) (or the depth (h) and distance (d) of the groove) of the conductive member (330) interposed between the conductive plate (410) and the conductive layer (311) may be designed to be positioned within a range in which the repulsive force of the conductive member (330) non-linearly increases, thereby preventing damage to the display (310) while securing a relatively wide contact area with the conductive plate (410) and the conductive layer (311), thereby reducing noise for communication with the external electronic device (102). The increase in the repulsive force of the conductive member (330) and the decrease in the noise of the signal according to the compression ratio (c) of the conductive member (330) are explained with reference to the graph of FIG. 7.

[0139] Figure 6 illustrates a portion of an exemplary electronic device.

[0140] Referring to FIG. 6, an electronic device (101) may include a conductive bracket (320) including a recessed portion (325), and a display (310) disposed on the conductive bracket (320) and including a conductive layer (311). The electronic device (101) may include a conductive member (330) including a first surface (330a) that contacts the conductive layer (311) of the display (310) and a second surface (330b) opposite to the first surface (330a), and the conductive member (330) may be disposed within the recessed portion (325). The electronic device (101) may include a non-conductive layer (430) attached on the recessed portion (325). The electronic device may include a conductive plate (410) including a first portion (411) in contact with the second surface (330b) of the conductive member (330) and the non-conductive layer (430), and a second portion (412) including a plurality of connecting portions (420) in contact with the metal layer (321) of the recess portion (325). The conductive plate (410) may be electrically connected to the conductive bracket (320) through the second portion (412) including the plurality of connecting portions (420).

[0141] According to one embodiment, unlike in FIGS. 4A to 5B, the conductive member (330) may include a second conductive adhesive member (610) interposed between the conductive film (332) and the conductive layer (311) for electrical connection between the conductive film (332) and the conductive layer (311). For example, the second conductive adhesive member (610), together with the first conductive adhesive member (333), may fix the conductive member (330) between the conductive plate (410) and the conductive layer (311). For example, the second conductive adhesive member (610) may be interposed between one side (310a) of the display (310) formed by the conductive film (332) and the conductive layer (311). For example, the second conductive adhesive member (610) can form a first surface (330a) that is in contact with the conductive layer (311) of the conductive member (330). The first conductive adhesive member (333) can form a second surface (330b) that is in contact with the conductive plate (410) of the conductive member (330). The second conductive adhesive member (610) can provide a current path between the conductive layer (311) and the conductive film (332) by being in contact with the one surface (310a) of the display (310) formed by the conductive layer (311) and the conductive film (332).

[0142] According to one embodiment, the second conductive adhesive member (610) may be elastic or deformable. The roughness of the second conductive adhesive member (610) may be smaller than the roughness of the conductive film (332). By being deformable, the second conductive adhesive member (610) may reduce damage to the display (310) caused by the conductive member (330). For example, since the roughness of one surface of the second conductive adhesive member (610) that comes into contact with the conductive layer (311) is smaller than the roughness of the outer surface of the conductive film (332) (e.g., one surface (333a) of FIG. 4A), the second conductive adhesive member (610) may provide a relatively wider contact area with the conductive layer (311) than when the conductive film (332) comes into contact with the conductive layer (311). The second conductive adhesive member (610) can reduce noise of a signal for communication with an external electronic device (102) by making contact with the conductive layer (311) through face-to-face contact between the conductive member (330) and the conductive layer (311).

[0143] According to the above-described embodiment, the conductive member (330) of the electronic device (101) can improve the frequency bandwidth of a signal for communication with an external electronic device (102) by including a second conductive adhesive member (610) in contact with the conductive layer (311). The second conductive adhesive member (610) has a roughness smaller than that of the conductive film (332), thereby reducing noise of the signal due to face-to-face contact with the conductive layer (311).

[0144] Figure 7 is a graph showing the resistance of a current path according to the compression ratio of a conductive member of an exemplary electronic device.

[0145] Referring to FIG. 7, the horizontal axis of the graph (700) represents a compressibility rate of a conductive member (e.g., a conductive member (330) of FIG. 3a) of an electronic device (e.g., an electronic device (101) of FIG. 1). The first vertical axis of one side of the graph (700) represents a resistance of a current path between a support plate (e.g., a conductive bracket (320) of FIG. 3a) provided by the conductive member (330) and a conductive layer (e.g., a conductive layer (311) of FIG. 3b) of a display (e.g., a display (201) of FIG. 2a, a display (310) of FIG. 3b). The second vertical axis of the other side of the graph (700) opposite to the one side represents a repulsion force of the conductive member (330).

[0146] Graphs (711, 712, 713) related to the horizontal axis and the first vertical axis of the graph (700) are described. The graphs (711, 712, 713) represent the resistance of a current path between a conductive bracket (320) and a conductive layer (311) provided by conductive members each having different characteristics according to a compression ratio of the conductive members. Referring to the graph (711), the first conductive member can provide a current path between a conductive bracket (320) and a conductive layer (311) having a resistance in a range of 100 mΩ to 200 mΩ within a compression ratio range of 40% to 50%. Referring to graph (712), the second conductive member can provide a current path between the conductive bracket (320) and the conductive layer (311) having a resistance in the range of 100 mΩ to 200 mΩ within a range of a compression ratio of 40% to 50%. Referring to graph (713), the third conductive member can provide a current path between the conductive bracket (320) and the conductive layer (311) having a resistance in the range of 100 mΩ to 200 mΩ within a range of a compression ratio of 40% to 50%. The conductive member (330) provides a current path between the conductive bracket (320) and the conductive layer (311) having a resistance in a range of 100 mΩ to 200 mΩ within a range of a compression ratio of 40% to 50%, thereby reducing the resistance deviation of the current path for communication with an external electronic device (e.g., the electronic device (102) of FIG. 1) and reducing noise of a signal for communication with the external electronic device (102).

[0147] Graphs (721, 722, 723) related to the horizontal axis and the second vertical axis of the graph (700) are described. The graphs (721, 722, 723) represent the repulsive force of each of the conductive members according to the compression ratio of the conductive members, each having different characteristics. Referring to the graphs (721, 722, 723), the conductive members can be configured such that the repulsive force non-linearly increases as the compression ratio increases within a range of the compression ratio of 40% or more and 50% or less. By utilizing the non-linearly increasing repulsive force, the conductive member (330) can maintain or increase the contact area of ​​the conductive member (330) that is in contact with the conductive plate (e.g., the conductive plate (410) of FIG. 4A) and the conductive layer (311). Referring to graph (721), the first conductive member has a repulsive force within a range of 30 gf to 80 gf within a range of a compression ratio of 40% to 50%, thereby securing a contact area with the conductive plate (410) and the conductive layer (311) and reducing damage to the display (310). Referring to graph (722), the second conductive member has a repulsive force within a range of 30 gf to 80 gf within a range of a compression ratio of 40% to 50%, thereby securing a contact area with the conductive plate (410) and the conductive layer (311) and reducing damage to the display (310). Referring to graph (723), the third conductive member has a repulsive force within a range of 30 gf to 80 gf within a range of a compression ratio of 40% to 50%, thereby securing a contact area with the conductive plate (410) and the conductive layer (311) and reducing damage to the display (310).

[0148] According to the above-described embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include a conductive bracket (e.g., conductive bracket (320) of FIG. 3a) including a recessed portion (e.g., recessed portion (325) of FIG. 3b), and a display (e.g., display (201) of FIG. 2a, display (310) of FIG. 2b) disposed on the conductive bracket and including a conductive layer. The electronic device may include a conductive gasket (e.g., conductive member (330) of FIG. 3a) including a first surface (e.g., first surface (330a) of FIG. 3b) contacting the conductive layer of the display and a second surface (e.g., second surface (330b) of FIG. 3b) opposite to the first surface, wherein a portion of the conductive gasket may be disposed within the recessed portion. The electronic device may include a non-conductive layer (e.g., non-conductive layer (430) of FIG. 4A) attached on the recessed portion. The electronic device may include a conductive plate including a first portion (e.g., first portion (411) of FIG. 4A) in contact with the second surface of the conductive gasket and the non-conductive layer, and a second portion (e.g., second portion (412) of FIG. 4A) including a plurality of connecting portions (e.g., a plurality of connecting portions (420) of FIG. 4A) in contact with the recessed portion. The conductive plate may be electrically connected to the conductive bracket through the second portion including the plurality of connecting portions.

[0149] For example, the plurality of connecting portions may be joined to the conductive bracket by welding.

[0150] For example, the plurality of connecting portions may include first connecting portions (e.g., first connecting portions (421) of FIG. 4b) arranged along an edge of the conductive plate (e.g., edge (415) of FIG. 4a), and second connecting portions (e.g., second connecting portions (422) of FIG. 4b) facing the first connecting portions and spaced apart from the first connecting portions.

[0151] For example, the conductive bracket may further include a metal layer (e.g., metal layer (321) of FIG. 4A) and an insulating layer (e.g., insulating layer (322) of FIG. 4A) disposed on the metal layer. The plurality of connecting portions may extend from the conductive plate through the insulating layer to the metal layer.

[0152] For example, each of the plurality of connecting portions may include a first conductive portion (e.g., a first conductive portion (420a) in FIG. 4A) protruding from the conductive plate toward the conductive layer, a second conductive portion (e.g., a second conductive portion (420b) in FIG. 4A) in contact with the metal layer, and a third conductive portion (e.g., a third conductive portion (420c) in FIG. 4A) extending from the first conductive portion through the second portion to the second portion.

[0153] For example, each of the plurality of connecting portions may further include a hole (e.g., hole (420d) in FIG. 4b) extending from the first conductive portion through the third conductive portion to the second conductive portion.

[0154] For example, the above-mentioned conductive gasket may have a compressibility rate within a range of 40% or more and 50% or less.

[0155] For example, the resistance of the current path between the conductive bracket and the conductive layer may be within a range of 50 mΩ or more and 200 mΩ or less.

[0156] For example, the conductive gasket may include an elastic member (e.g., an elastic member (331) of FIG. 4A), a conductive film (e.g., a conductive film (332) of FIG. 4A) covering the elastic member, and a first conductive adhesive member (e.g., a first conductive adhesive member (333) of FIG. 4A) that attaches the conductive film to the conductive plate for electrical connection between the conductive film and the conductive plate.

[0157] For example, the conductive gasket may further include a second conductive adhesive member (e.g., the second conductive adhesive member (610) of FIG. 6) interposed between the conductive film and the conductive layer for electrical connection between the conductive film and the conductive layer.

[0158] For example, the conductive gasket may be at least partially disposed within the recessed portion. The distance between the conductive plate and the conductive layer (e.g., d in FIG. 5b) may be greater than the depth of the recessed portion (325) (e.g., h in FIG. 5a).

[0159] For example, the conductive bracket may further include a metal layer disposed under the insulating layer. The roughness of one side of the conductive plate facing the display (e.g., one side (410a) of FIG. 4A) may be less than the roughness of one side of the metal layer facing the insulating layer (e.g., one side (321a) of FIG. 4A).

[0160] For example, the size of the non-conductive layer may be smaller than the size of the conductive plate. The thickness of the non-conductive layer may be within a range of 10 μm or more and 50 μm or less.

[0161] For example, the repulsive force of the conductive gasket toward the conductive layer may be within a range of 10 gf or more and 80 gf or less.

[0162] For example, the conductive plate may include at least one of nickel and stainless steel. The conductive gasket may include at least one of copper, nickel, and urethane.

[0163] In one embodiment, an electronic device may include a display including a conductive layer, and a housing including a conductive bracket including a metal layer and coupled to the display. The electronic device may include a non-conductive layer attached to one side of the metal layer facing the display. The electronic device may include a conductive gasket including a first side in contact with the conductive layer of the display and a second side opposite the first side. The electronic device may include a conductive plate including a first portion in contact with the second side of the conductive gasket and positioned between the non-conductive layer and the conductive gasket, and a second portion extending from the first portion and including a plurality of connecting portions. The plurality of connecting portions may extend from the second portion to the metal layer. The conductive plate may be electrically connected to the conductive bracket through the second portion including the plurality of connecting portions.

[0164] For example, each of the plurality of connecting portions may include a first conductive portion protruding from the conductive plate toward the conductive layer, a second conductive portion in contact with the metal layer, and a third conductive portion extending from the first conductive portion through the second portion to the second conductive portion.

[0165] For example, the plurality of connecting portions may include first connecting portions arranged along an edge of the conductive plate and second connecting portions facing the first connecting portions and spaced apart from the first connecting portions. The direction in which the first connecting portions are arranged may correspond to the direction in which the second connecting portions are arranged.

[0166] For example, the conductive gasket may have a compressibility within a range of 40% or more and 50% or less. The resistance of the current path between the conductive bracket and the conductive layer may be within a range of 50 mΩ or more and 200 mΩ or less.

[0167] For example, the conductive member may include an elastic member, a conductive film covering the elastic member, a first conductive adhesive member that attaches the conductive film to the conductive plate for electrical connection between the conductive film and the conductive plate, and a second conductive adhesive member that is interposed between the conductive film and the conductive layer for electrical connection between the conductive film and the conductive layer.

[0168] In one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include a housing (e.g., housing (210) of FIG. 2A), a display (e.g., display (201) of FIG. 2A, display (310) of FIG. 3B) forming at least a portion of a front surface (e.g., front surface (200A) of FIG. 2A) of the housing, and a conductive bracket (e.g., conductive bracket (320) of FIG. 3A) for supporting the display, the display being disposed within the housing and including a recessed portion (e.g., recessed portion (325) of FIG. 3B) facing the display. The electronic device may include a conductive layer (e.g., conductive layer (311) of FIG. 3B) forming one surface (e.g., one surface (310a) of FIG. 3B) of the display facing the conductive bracket. The electronic device may include a conductive plate (e.g., the conductive plate (410) of FIG. 4A) attached to the recessed portion and including a first portion (e.g., the first portion (411) of FIG. 4B) and a second portion (e.g., the second portion (412) of FIG. 4A) extending from the first portion and including a plurality of connecting portions (e.g., the plurality of connecting portions (420) of FIG. 4A) for electrical connection with the conductive bracket. The electronic device may include a conductive member (e.g., the conductive member (330) of FIG. 3A) attached on the first portion and disposed between the conductive plate and the conductive layer to provide a current path between the conductive bracket and the conductive layer for communication with an external electronic device.

[0169] For example, the plurality of connecting portions may include first connecting portions (e.g., first connecting portions (421) of FIG. 4A) arranged along an edge of the conductive plate (e.g., edge (415) of FIG. 4A) and second connecting portions (e.g., second connecting portions (422) of FIG. 4A) facing the first connecting portions and spaced apart from the first connecting portions.

[0170] For example, the conductive bracket may further include a metal layer (e.g., the metal layer (321) of FIG. 4A) and an insulation layer (e.g., the insulation layer (322) of FIG. 4A) disposed on one side of the metal layer facing the display (e.g., one side (321a) of FIG. 4A). The plurality of connecting portions may extend from the conductive plate through the insulation layer to the metal layer.

[0171] For example, the electronic device may further include a non-conductive layer (e.g., the non-conductive layer (430) of FIG. 4A) interposed between the conductive plate and the insulating layer. Each of the plurality of connecting portions may include a first conductive portion (e.g., the first conductive portion (420a) of FIG. 4A) protruding from the conductive plate toward the conductive layer, a second conductive portion (e.g., the second conductive portion (420b) of FIG. 4A) in contact with the metal layer, and a third conductive portion (e.g., the third conductive portion (420c) of FIG. 4A) extending from the first conductive portion through the conductive plate, the non-conductive layer, and the insulating layer to the second conductive portion.

[0172] For example, each of the plurality of connecting portions may include a hole (e.g., hole (420d) in FIG. 4b) extending to the metal layer by penetrating the conductive plate and the insulating layer.

[0173] For example, the conductive member may have a compressibility rate within a range of 40% or more and 50% or less.

[0174] For example, the resistance of the current path between the conductive bracket and the conductive layer may be within a range of 50 mΩ or more and 200 mΩ or less.

[0175] For example, the conductive member may include an elastic member (e.g., an elastic member (331) of FIG. 4A), a conductive film (e.g., a conductive film (332) of FIG. 4A) covering the elastic member, and a first conductive adhesive member (e.g., a first conductive adhesive member (333) of FIG. 4A) that attaches the conductive film to the conductive plate for electrical connection between the conductive film and the conductive plate.

[0176] For example, the conductive member may further include a second conductive adhesive member (e.g., the second conductive adhesive member (610) of FIG. 6) interposed between the conductive film and the conductive layer for electrical connection between the conductive film and the conductive layer.

[0177] For example, the conductive member may be at least partially disposed within the recessed portion. The distance between the conductive plate and the conductive layer (e.g., d in FIG. 5b) may be greater than the depth of the recessed portion (e.g., h in FIG. 5a).

[0178] For example, the conductive bracket may further include a metal layer and an insulating layer disposed on one surface of the metal layer facing the display. The roughness of the first surface of the conductive plate facing the display may be less than the roughness of the one surface of the metal layer.

[0179] For example, the plurality of connecting portions may be joined to the conductive bracket by welding.

[0180] For example, the repulsion force of the conductive member toward the conductive layer may be within a range of 10 gf or more and 80 gf or less.

[0181] For example, the conductive plate may include at least one of nickel and stainless steel. The conductive member may include at least one of copper, nickel, and urethane.

[0182] In one embodiment, an electronic device may include a display (e.g., display (201) of FIG. 2A, display (310) of FIG. 4A). The electronic device may include a housing (e.g., housing (210) of FIG. 2A) coupled to the display, including a conductive bracket (e.g., conductive bracket (320) of FIG. 3A) including a metal layer (e.g., metal layer (321) of FIG. 4A) and an insulating layer (e.g., insulating layer (322) of FIG. 4A) disposed on one side of the metal layer facing the display (e.g., one side (321a) of FIG. 4A). The electronic device may include a conductive layer (e.g., conductive layer (311) of FIG. 3B) forming one side of the display facing the conductive bracket (e.g., one side (310b) of FIG. 3B). The electronic device may include a conductive plate (e.g., the conductive plate (410) of FIG. 4a) including a first portion (e.g., the first portion (411) of FIG. 4a) and a second portion (e.g., the second portion (412) of FIG. 4a) extending from the first portion, attached to the conductive bracket, and including a plurality of connecting portions (e.g., a plurality of connecting portions (420) of FIG. 4a) extending through the insulating layer to the metal layer for electrical connection with the conductive bracket. The electronic device may include a conductive member (e.g., the conductive member (330) of FIG. 3b) attached on the first portion and positioned between the conductive plate and the conductive layer to provide a current path between the conductive bracket and the conductive layer for communication with an external electronic device.

[0183] For example, the electronic device may further include a non-conductive layer (e.g., a non-conductive layer (430) of FIG. 4A) interposed between the conductive plate and the insulating layer. Each of the plurality of connecting portions may include a first conductive portion (e.g., a first conductive portion (420a) of FIG. 4A) protruding from the conductive plate toward the conductive layer, a second conductive portion (e.g., a second conductive portion (420b) of FIG. 4A) in contact with the metal layer, and a third conductive portion (e.g., a third conductive portion (420c) of FIG. 4A) extending from the first conductive portion through the conductive plate and the insulating layer to the second conductive portion.

[0184] For example, the plurality of connecting portions may include first connecting portions (e.g., first connecting portions (421) of FIG. 4A) arranged along an edge of the conductive plate (e.g., edge (415) of FIG. 4A), and second connecting portions (e.g., second connecting portions (422) of FIG. 4A) facing the first connecting portions and spaced apart from the first connecting portions. The direction in which the first connecting portions are arranged may correspond to the direction in which the second connecting portions are arranged.

[0185] For example, the conductive member may have a compression ratio within a range of 40% or more and 50% or less. The resistance of the current path between the conductive bracket and the conductive layer may be within a range of 50 mΩ or more and 200 mΩ or less.

[0186] For example, the conductive member may include an elastic member, a conductive film covering the elastic member, a first conductive adhesive member (e.g., the first conductive adhesive member (333) of FIG. 4a) that attaches the conductive film to the conductive plate for electrical connection between the conductive film and the conductive plate, and a second conductive adhesive member (e.g., the second conductive adhesive member (610) of FIG. 6) that is interposed between the conductive film and the conductive layer for electrical connection between the conductive film and the conductive layer.

[0187] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0188] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0189] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0190] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0191] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0192] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), A challenging bracket (320) including a recessed portion (325); A display (201; 310) positioned on the above-mentioned conductive bracket (320) and including a conductive layer (311); A conductive gasket (330) including a first surface (330a) in contact with the conductive layer (311) of the display (201; 310) and a second surface (330b) opposite to the first surface (330a), at least a portion of the conductive gasket (330) being disposed within the recessed portion (325); A non-conductive layer (430) attached to the above recessed portion; and A conductive plate (410) including a first portion (411) in contact with the second surface (330b) of the conductive gasket (330) and the non-conductive layer (430), and a second portion (412) including a plurality of connecting portions (420) in contact with the recess portion (325), The conductive plate (410) is electrically connected to the conductive bracket (320) through the second part (412) including the plurality of connecting parts (420). Electronic devices (101).

2. In paragraph 1, The above multiple connecting parts (420) are, is joined to the above-mentioned conductive bracket (320) by welding, Electronic devices (101).

3. In paragraph 1 or 2, The above multiple connecting parts (420) are, It includes first connecting portions (421) and second connecting portions (422) facing the first connecting portions (421) and spaced apart from the first connecting portions (421). The above first connecting parts (421) and the above second connecting parts (422) are, Positioned along the edge (415) of the above-mentioned challenging plate (410), Electronic devices (101).

4. In any one of paragraphs 1 to 3, The above challenge bracket (320) is metal layer (321); and It further includes an insulating layer (322) placed on the above metal layer (321), The above multiple connecting parts (420) are, Each of which extends from the conductive plate (410) to the metal layer (321) by penetrating the insulating layer (322). Electronic devices (101).

5. In paragraph 4, Each of the above multiple connecting parts (420) A first conductive portion (420a) protruding from the conductive plate (410) toward the conductive layer (311); A second conductive portion (420b) in contact with the above metal layer (321); and Including a third conductive portion (420c) extending from the first conductive portion (420a) through the second portion (412) to the second conductive portion (420b). Electronic devices (101).

6. In paragraph 5, Each of the above multiple connecting parts (420) Further including a hole (420d) extending from the first conductive portion (420a) through the third conductive portion (420c) to the second conductive portion (420b). Electronic devices (101).

7. In any one of paragraphs 1 to 6, The above challenging gasket (330) is Having a compression ratio within the range of 40% or more and 50% or less, Electronic devices (101).

8. In any one of paragraphs 1 to 7, The resistance of the current path between the above conductive bracket (320) and the above conductive layer (311) is Within the range of 50mΩ or more and 200mΩ or less, Electronic devices (101).

9. In any one of paragraphs 1 to 8, The above challenging gasket (330) is Elastic member (331); A conductive film (332) covering the elastic member (331); and In order to electrically connect the conductive film (332) and the conductive plate (410), a first conductive adhesive member (333) is included to attach the conductive film (332) to the conductive plate (410). Electronic devices (101).

10. In paragraph 9, The above challenging gasket (330) is In order to electrically connect the conductive film (332) and the conductive layer (311), a second conductive adhesive member (610) is further included between the conductive film (332) and the conductive layer (311). Electronic devices (101).

11. In any one of paragraphs 1 to 10, The distance (d) between the conductive plate (410) and the conductive layer (311) is Greater than the depth (h) of the above recessed portion (325), Electronic devices (101).

12. In any one of paragraphs 1 to 11, The above challenge bracket (320) is It further includes a metal layer (321) that is in contact with the above non-conductive layer (430), The asperity of one side (410a) of the above-mentioned conductive plate (410) facing the display (201; 310) is The roughness of one surface (321a) of the metal layer (321) that comes into contact with the non-conductive layer (430) is smaller than that of the Electronic devices (101).

13. In any one of paragraphs 1 to 12, The size of the above non-conductive layer (430) is Smaller than the size of the above challenge plate (410), The thickness of the above non-conductive layer (430) is Within the range of 10μm or more and 50μm or less, Electronic devices (101).

14. In any one of paragraphs 1 to 13, The repulsion force of the above conductive gasket (330) to the above conductive layer (311) is Within the range of 10gf or more and 80gf or less, Electronic devices (101).

15. In any one of paragraphs 1 to 14, The above-mentioned challenge plate (410) is Containing at least one of nickel and stainless steel, The above challenging gasket (330) is Containing at least one of copper, nickel, and urethane; Electronic devices (101).

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